JP6356618B2 - White resin composition, transfer material, base material, touch panel, and information display device - Google Patents

Description

  The present invention relates to a white resin composition, a transfer material, a base material, a touch panel, and an information display device.

In recent years, electronic devices such as mobile phones, car navigation systems, personal computers, ticket vending machines, bank terminals, etc. have been equipped with touch panel type input devices on the surface of liquid crystal devices and the like, and instruction images displayed in the image display area of liquid crystal devices In some cases, information corresponding to the instruction image can be input by touching a part where the instruction image is displayed with a finger or a touch pen.
Such input devices (touch panels) include a resistance film type and a capacitance type. An electrostatic capacitance type input device has an advantage that a light-transmitting conductive film is simply formed on a single substrate. In addition, the capacitive input device has an advantage that a light-transmitting conductive film is formed over a single substrate. The capacitive touch panel of the cover glass integrated type (OGS: One Glass Solution) touch panel has a front plate integrated with a capacitive input device, and thus can be reduced in thickness and weight.

In such a capacitance-type input device, an information display unit (image display) that is touched with a finger or a touch pen to prevent the user from seeing the display circuit and the like of the display device and to improve the appearance. The decorative material is formed in a frame shape surrounding the part and the light-transmitting region), and the decoration is performed. As a decorating material for such decoration, a white decorating material is required from the viewpoint of design and appearance. Moreover, a black decorating material (sometimes called a light shielding layer) or other so as to prevent a display circuit or the like from being seen through by a white decorating material (white layer) alone, and the like. It may be required to use a decorative material colored in color.
When producing a decorative material such as a white decorative material, a white resin composition is disposed on the substrate, and a light shielding layer forming composition is further disposed as necessary, followed by post-baking (heating). By this, the method of hardening an uncured layer and using it as a decorating material is known.

  Patent Document 1 includes a base material, a white colored layer, and a light shielding layer in this order, and the white colored layer and the light shielding layer both include a resin having a siloxane bond in the main chain. A substrate with a material is disclosed.

International Publication No. 2014/097803

  Depending on the composition of the white resin composition, the layer thickness of the white layer, and the post-baking conditions, there is a problem that the white layer is cracked by curing.

  The problem to be solved by the present invention is to provide a white resin composition capable of suppressing the occurrence of cracks after curing. Moreover, it is providing the information display apparatus which has the transfer material and base material using the said white resin composition, the touch panel containing the said base material, and the said touch panel.

The above-described problems of the present invention have been solved by means described in the following <1>, <6>, <8>, <9>, <12> or <13>. It is described below together with <2> to <5>, <7>, <10> and <11>, which are preferred embodiments.
<1> A white pigment and a silicone resin containing a structure represented by the following formula T and a structure represented by the following formula D, and a T-form represented by the following formula in the silicone resin: A white resin composition having a D-form ratio of 6.4 or less,
T-form / D-form ratio = (molar amount of silicon atom contained in the structure represented by formula T) / (mole amount of silicon atom contained in the structure represented by formula D)

In Formula T and Formula D, R ^T1 , R ^D1 , and R ^D2 each independently represent an alkyl group, an aryl group, an allyl group, or a hydrogen atom, and the wavy line represents a bonding site with another structure. ,
<2> The white resin composition according to <1>, wherein R ^T1 , R ^D1 , and R ^D2 are each independently a methyl group or a phenyl group,
<3> The white resin composition according to <1> or <2>, containing 30% by mass or more of the silicone resin, based on the total solid content of the white resin composition,
<4> The white resin composition according to any one of <1> to <3>, further including a graft type silicone polymer represented by the following formula 1.

In Formula 1, R ^{1 to} R ¹⁰ each independently represents a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and R ¹¹ and R ¹² each independently represent an arylene group or 1 carbon atom. Represents an alkylene group of -3, R ¹³ and R ¹⁴ each independently represent a single bond or a divalent organic linking group, A represents a group having a pigment adsorption site, and B represents the following formula 2. Represents a group having a structure, l and n each independently represents an integer of 1 or more, and m represents an integer of 0 or more.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more.
<5> The white resin composition according to <4>, wherein the graft-type silicone polymer represented by Formula 1 is a compound represented by Formula 3 below:

In Formula 3, R ¹¹ and R ¹² each independently represent an arylene group or an alkylene group having 1 to 3 carbon atoms, R ¹³ and R ¹⁴ each independently represent a single bond or a divalent organic linking group, A ¹ is an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, a heterocyclic group, an amide group, an alkoxysilyl group, Represents a group having a pigment adsorption site having at least one group selected from the group consisting of an epoxy group, an isocyanato group, a hydroxy group, and a thiol group, and B represents a group having a structure represented by the following formula 2. , L, m1 and n each independently represents an integer of 1 or more.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more.
<6> A transfer material having a white layer on a temporary support, wherein the white layer is made of the white resin composition according to any one of <1> to <5>,
<7> The transfer material according to <6>, having a light shielding layer between the temporary support and the white layer,
<8> A substrate, a white layer, and a light-shielding layer are provided in this order, and the white layer is produced from the white resin composition according to any one of <1> to <5>. Base material to be used,
<9> A base material produced by the transfer material according to <6> or <7>,
<10> The base material according to <8> or <9>, further including a conductive layer on the side opposite to the substrate of the light shielding layer,
<11> The base material according to any one of <8> to <10>, which is for decoration,
<12> A touch panel comprising the base material according to any one of <8> to <11>,
<13> An information display device comprising the touch panel according to <12>.

  According to this invention, it is providing the white resin composition in which generation | occurrence | production of the crack after hardening is suppressed. Moreover, the transfer material and base material using the said white resin composition, the touchscreen containing the said base material, and the information display apparatus which has the said touch panel can be provided.

It is a partial expanded sectional view which shows an example of a decorating material. It is a partial expanded sectional view which shows another example of a decorating material. It is a partial expanded sectional view which shows another example of a decorating material. It is a partial expanded sectional view showing the inclination-angle which an inclination part and a board | substrate make. It is a section schematic diagram showing composition of an example of a touch panel of the present invention using a substrate of the present invention. It is the cross-sectional schematic which shows the structure of the other example of the touchscreen of this invention using the base material of this invention. It is explanatory drawing which shows an example of the front board in the touchscreen of this invention. It is explanatory drawing which shows an example of the 1st transparent electrode pattern in a touch panel of this invention, and a 2nd transparent electrode pattern. It is a top view which shows an example of the tempered glass in which the opening part was formed. It is a top view which shows an example of the touchscreen of this invention in which the decorating material and the light shielding layer were formed. It is a top view which shows an example of the touchscreen of this invention in which the 1st transparent electrode pattern was formed. It is a top view which shows an example of the touchscreen of this invention in which the 1st and 2nd transparent electrode pattern was formed. It is a top view which shows an example of the touchscreen of this invention in which the electroconductive element different from the 1st and 2nd transparent electrode pattern was formed.

Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments. In the specification of the present application, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.
In the notation of groups (atomic groups) in this specification, the notation that does not indicate substitution and non-substitution includes not only those having no substituent but also those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present specification, “(meth) acrylate” represents acrylate and methacrylate, “(meth) acryl” represents acryl and methacryl, and “(meth) acryloyl” represents acryloyl and methacryloyl.
In the present invention, “mass%” and “wt%” are synonymous, and “part by mass” and “part by weight” are synonymous.
Moreover, in this invention, the combination of a preferable aspect is a more preferable aspect.
In the present invention, the molecular weight of the polymer component is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent. Specifically, it can be measured under the following conditions.
Column: GPC column TSKgelSuper HZM-H (manufactured by Tosoh Corporation)
・ Solvent: Tetrahydrofuran ・ Standard: Monodisperse polystyrene

1. White resin composition The white resin composition of the present invention includes a white pigment and a silicone resin containing a structure represented by the following formula T and a structure represented by the following formula D (hereinafter referred to as “specific silicone resin”). The T-body / D-body ratio represented by the following formula in the silicone resin is 6.4 or less.
T-form / D-form ratio = (molar amount of silicon atom contained in the structure represented by formula T) / (mole amount of silicon atom contained in the structure represented by formula D)

In Formula T and Formula D, R ^T1 , R ^D1 , and R ^D2 each independently represent an alkyl group, an aryl group, an allyl group, or a hydrogen atom, and the wavy line represents a bonding site with another structure. .

As a result of intensive studies by the present inventors, it has been found that by using the white resin composition of the present invention, the occurrence of cracks in the white layer is suppressed, and the present invention has been completed.
Although the detailed mechanism of action is not clear, by using a silicone resin having a T-form / D-form ratio of 6.4 or less, the bifunctional D-form part imparts flexibility to the cured film, It is presumed that the shrinkage stress caused by curing has been relaxed.
In general, the whiteness of the white layer can be improved by increasing the thickness of the white layer, but cracking tends to occur in the thick white layer.
The white resin composition of the present invention that can suppress the occurrence of cracks is also suitable when such a white layer is thickened.

<White pigment>
Although it does not specifically limit as a white pigment, The white pigment of Paragraph 0015 and Paragraph 0114 of Unexamined-Japanese-Patent No. 2005-7765 can be used.
Specifically, as the white pigment, titanium dioxide, zinc oxide, lithopone, light calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, and barium sulfate are preferable, and titanium dioxide and zinc oxide are more preferable. In the present invention, the white pigment is used. Is more preferably titanium dioxide, among which rutile or anatase titanium dioxide is particularly preferred, and rutile titanium dioxide is most preferred.

For the treatment of the surface of titanium dioxide, silica treatment, alumina treatment, titania treatment, zirconia treatment, organic matter treatment, and combinations thereof can be used.
Thereby, the catalytic activity of titanium dioxide can be suppressed, and heat resistance, fluorescence, etc. can be improved.
From the viewpoint of suppressing the b value after the high-temperature treatment of the coating film of the white resin composition of the present invention, the surface treatment of the titanium dioxide is preferably an alumina treatment, a zirconia treatment, or a silica treatment, and combined with alumina / zirconia, or The alumina / silica combined treatment is particularly preferred.

The content of the white pigment is preferably 5 to 75% by mass, more preferably 15 to 65% by mass, and preferably 25 to 55% by mass with respect to the total solid content of the white resin composition of the present invention. More preferably it is.
The content of the white pigment in the white layer used in the present invention is preferably 5 to 75% by mass, more preferably 15 to 65% by mass, and still more preferably 25 to 55% by mass.
The “total solid content” means a component obtained by removing a volatile component such as a solvent from the white resin composition.

  The white pigment may be added to the white resin composition as a white pigment dispersion described later, and the content of the white pigment in the white pigment dispersion is 20 to 90 mass with respect to the entire white pigment dispersion. %, And more preferably 30 to 80% by mass.

<Specific silicone resin>
The white resin composition of the present invention contains a specific silicone resin.
The specific silicone resin includes a structure represented by the following formula T and a structure represented by the following formula D, and the T body / D body ratio represented by the following formula in the silicone resin is 6.4 or less. It is.
T-form / D-form ratio = (molar amount of silicon atom contained in the structure represented by formula T) / (mole amount of silicon atom contained in the structure represented by formula D)

In formula T and formula D, R ^T1 , R ^D1 , and R ^D2 each independently represent an alkyl group, an aryl group, an allyl group, or a hydrogen atom, preferably an alkyl group or an aryl group, It is more preferably an alkyl group, a phenyl group or a naphthyl group of formulas 1 to 4, more preferably a methyl group or a phenyl group, and the wavy line portion represents a binding site with another structure.

The T-form / D-form ratio is 6.4 or less, preferably 5.0 or less, and more preferably 4.0 or less. According to the said aspect, the white resin composition by which generation | occurrence | production of the crack after hardening was suppressed is obtained. The lower limit of the T body / D body ratio is not particularly limited, but is preferably 2.0 or more from the viewpoint of peelability of the temporary support when the white resin composition of the present invention is used for a transfer film.
If the T-body / D-body ratio is 2.0 or more, a moderately flexible white layer can be obtained, and the peelability of the temporary support becomes good.

[Measurement method of T / D ratio]
The T-body / D-body ratio is measured by the following method with reference to the method described in “Silicon Handbook Chapter 20 (Kunio Ito, Nikkan Kogyo Shimbun)”.
^{Using 29} Si-NMR (ECP400 manufactured by JEOL Ltd.), the T-body / D-body ratio of the silicone resin is determined from the peak area ratio of ²⁹ Si-NMR. ²⁹ Si-NMR measurement conditions were as follows: 10 mmφ sample tube made of PTFE, probe: T10, resonance frequency 79.42 MHz, pulse width 10 μsec, waiting time 20 sec, integration time 1,500 times, relaxation reagent: Cr (acac) ₃ 0.1 wt%, external standard sample: Tetramethylsilane. The chemical shifts of ²⁹ Si-NMR derived from each structure are as follows.
Form D: -20 to -25 ppm
T-form: -60 to -70 ppm

In addition, the specific silicone resin used in the present invention may include a structure represented by the above formula T and other structures other than the structure represented by the following formula D, but the structure represented by the above formula T The total amount of the structure represented by the following formula D is preferably 80% by mass and more preferably 90% by mass or more with respect to the mass of the whole silicone resin.
Examples of the other structure include a structure represented by the following formula M and a structure represented by the following Q.

In Formula M and Formula Q, R ^M1 , R ^M2 , and R ^M3 each independently represents an alkyl group, an aryl group, an allyl group, or a hydrogen atom, and is preferably an alkyl group or an aryl group, It is more preferably an alkyl group, a phenyl group or a naphthyl group of formulas 1 to 4, more preferably a methyl group or a phenyl group, and the wavy line portion represents a binding site with another structure.

[Method for producing specific silicone resin]
The specific silicone resin used in the present invention can be produced, for example, by a method in which a silane compound having a hydrolyzable group is hydrolyzed to generate a silanol group and then condensed by heating.
As said hydrolysable group, an alkoxy group or a halogen atom is mentioned, A C1-C4 alkoxy group or a chlorine atom is preferable.
In the present invention, the specific silicone resin contains the structure represented by the above formula T and the structure represented by the above formula D, so that a hydrolyzable group capable of forming the structure represented by the above formula T after condensation. Is preferably condensed with a silane compound having two hydrolyzable groups that can form the structure represented by the above formula D after condensation.
Moreover, in order to make a specific silicone resin contain the structure represented by the said Formula M, or the structure represented by the said Formula Q, it has a silane compound which has one hydrolyzable group, and four hydrolysable groups. A silane compound may be further condensed.
Since the amount of the silane compound having three hydrolyzable groups and the silane compound having two hydrolyzable groups needs to have a T-form / D-form ratio of the specific silicone resin of 6.4 or less, 3. The molar amount of the silane compound having three hydrolyzable groups / (the molar amount of the silane compound having two hydrolyzable groups) is 6.4 or less, preferably 5.0 or less. More preferably, it is 0 or less.

  Preferable examples of the silane compound having three hydrolyzable groups include a compound represented by the following formula T1, and examples of the compound having two hydrolyzable groups include the compound represented by the following formula D1.

In Formula T1 and Formula D1, R ^T1 , R ^D1 , and R ^D2 each independently represent an alkyl group, an aryl group, an allyl group, or a hydrogen atom, and R ^{T2 to} R ^T4 represent an alkyl group.
R ^T1 , R ^D1 and R ^D2 are each independently preferably an alkyl group or an aryl group, more preferably an alkyl group having 1 to 4 carbon atoms, a phenyl group or a naphthyl group, and a methyl group Or it is more preferable that it is a phenyl group, and a broken line part represents the coupling | bond part with another structure.
R ^{T2 to} R ^T4 are each independently preferably an alkyl group having 1 to 4 carbon atoms, preferably a methyl group, an ethyl group, a propyl group, or an isopropyl group, and more preferably a methyl group or an isopropyl group.

The specific silicone resin used in the present invention preferably has a glass transition temperature (Tg) of −10 ° C. or higher.
The Tg of the specific silicone resin is preferably 0 ° C. or higher, and more preferably 10 ° C. to 120 ° C. When Tg is within the above range, the obtained cured product is excellent in crack resistance during heating, and can be more suitably used as a transfer material or a decorating material.
As a measuring method of Tg of specific silicone resin, the method of measuring using a differential scanning calorimeter (DSC) is mentioned.

  The weight average molecular weight of the specific silicone resin is preferably 1,000 or more, more preferably 2,000 or more, and preferably 5,000,000 or less, 3,000,000. The following is more preferable.

  The content of the specific silicone resin is preferably 1 to 90% by mass, more preferably 10 to 85% by mass, and 30 to 80% by mass with respect to the total solid content of the white resin composition. Is more preferable.

The white resin composition of the present invention can contain a pigment dispersant, a solvent, other resins, a polymerization catalyst, a coating aid, an antioxidant, and other additives.
Hereinafter, each component will be described.

<Pigment dispersant>
The white resin composition used in the present invention preferably contains a pigment dispersant. By containing the pigment dispersant, the dispersibility of the white pigment in the white resin composition can be improved.
The pigment dispersant can be appropriately selected from known pigment dispersants.
The pigment dispersant is a compound having a function of improving the dispersibility of the pigment alone, and a polymer dispersant is preferably exemplified in the present invention. The polymer dispersant preferably has both a pigment adsorbing group and a steric repulsion chain.

Specific examples of the pigment dispersant that can be used in the present invention include “Disperbyk-101 (polyamidoamine phosphate), 107 (carboxylic acid ester), 110 (copolymer containing an acid group), 130 (polyamide) manufactured by BYK Chemie. ), 161, 162, 163, 164, 165, 166, 170 (polymer copolymer) ”,“ BYK-P104, P105 (high molecular weight unsaturated polycarboxylic acid) ”,“ EFKA 4047, 4050, 4010 ”manufactured by EFKA. (Polyurethane), 4165 (polyurethane), EFKA4300 (acrylic block copolymer), EFKA4330, 4340 (block copolymer), 4400, 4402 (modified polyacrylate), 5010 (polyesteramide), 5765 (high molecular weight poly) Carboxylate), 6220 (fatty acid) Polyester), 6745 (phthalocyanine derivative), 6750 (azo pigment derivative) ", Ajinomoto Fine Techno Co., Ltd." Azisper PB821, PB822 ", Kyoeisha Chemical Co., Ltd." Floren TG-710 (urethane oligomer) "," Polyflow " No. 50E, No. 300 (acrylic copolymer) ”,“ Disparon KS-860, 873SN, 874, # 2150 (aliphatic polyvalent carboxylic acid), # 7004 (polyether ester) manufactured by Enomoto Kasei Co., Ltd. , DA-703-50, DA-705, DA-725 ”,“ Demol RN, N (Naphthalenesulfonic acid formalin polycondensate), MS, C, SN-B (aromatic sulfonic acid formalin heavy) manufactured by Kao Corporation. Condensate) ”,“ homogenol L-18 (polymeric polycarboxylic acid) ”,“ Emulgen 920 ” 930, 935, 985 (polyoxyethylene nonyl phenyl ether) ”,“ acetamine 86 (stearylamine acetate) ”,“ Solsperse 5000 (phthalocyanine derivative), 22000 (azo pigment derivative), 13240 (polyesteramine) manufactured by Lubrizol, 3000, 17000, 27000 (polymer having a functional part at the end), 24000, 28000, 32000, 38500 (graft type polymer) ", Nikko Chemicals Co., Ltd." Nikkor T106 (polyoxyethylene sorbitan monooleate) ", MYS -IEX (polyoxyethylene monostearate) "," KP-541, KP-578 (acrylic silicone) "manufactured by Shin-Etsu Silicone Co., Ltd., and the like.
Among these, silicone-based pigment dispersants are preferable, and specific examples include “KP-541, KP-578 (acrylic silicone)” manufactured by Shin-Etsu Silicone Co., Ltd.

  In the present invention, the pigment dispersant is preferably exemplified by a graft type silicone polymer represented by the following formula 1.

In Formula 1, R ^{1 to} R ¹⁰ each independently represents a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and R ¹¹ and R ¹² each independently represent an arylene group or 1 carbon atom. Represents an alkylene group of -3, R ¹³ and R ¹⁴ each independently represent a single bond or a divalent organic linking group, A represents a group having a pigment adsorption site, and B represents the following formula 2. Represents a group having a structure, and l and n each independently represents an integer of 1 or more, and m represents an integer of 0 or more.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more.

In Formula 1, R ^{1 to} R ¹⁰ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and preferably an aryl group or an alkyl group having 1 to 3 carbon atoms. And more preferably an alkyl group having 1 to 3 carbon atoms.
Examples of the aryl group in R ^{1 to} R ¹⁰ include a phenyl group and a substituted phenyl group.
Examples of the alkyl group having 1 to 3 carbon atoms in R ^{1 to} R ¹⁰ include a methyl group, an ethyl group, an n-propyl group, and an i-propyl group, preferably a methyl group and an ethyl group, and more preferably a methyl group. preferable.
R ^{1 to} R ¹⁰ may further have a substituent. For example, when R < ¹ > -R < ¹⁰ > represents a hydroxy group, you may have arbitrary alkyl groups as a substituent and may form an alkoxy group. However, it is preferable that R ^{1 to} R ¹⁰ do not further have a substituent.

When l is 2 or more, l R ⁴ and R ⁵ may be the same as or different from each other.
When m is 2 or more, m R ^{6 s} may be the same as or different from each other.
When n is 2 or more, n R ^{7 s} may be the same as or different from each other.

In Formula 1, R < ¹¹ > and R < ¹² > represent an arylene group or a C1-C3 alkylene group each independently, and a C1-C3 alkylene group is preferable.
When m is 2 or more, m R ^{11 s} may be the same as or different from each other.
When n is 2 or more, n R ^{12 s} may be the same as or different from each other.

In Formula 1, R ¹³ represents a single bond or a divalent organic linking group.
When m is 2 or more, m R ^{13 s} may be the same as or different from each other.
In Formula 1, R ¹⁴ represents a single bond or a divalent organic linking group.
When n is 2 or more, n R ^{13 s} may be the same as or different from each other.
Examples of the divalent organic linking group for R ¹³ or R ¹⁴ include 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 A group consisting of ˜20 sulfur atoms is included, which may be unsubstituted or may further have a substituent.
Specific examples of the divalent organic linking group in R ¹³ or R ¹⁴ include a structural unit selected from the following structural unit group G, or a group constituted by combining these structural units. it can.

R ¹³ or R ¹⁴ is a single bond or 1 to 50 carbon atoms, 0 to 8 nitrogen atoms, 0 to 25 oxygen atoms, 1 to 100 hydrogen atoms, and 0 to 10 carbon atoms. A divalent organic linking group consisting of a sulfur atom is preferred, a single bond, or 1 to 30 carbon atoms, 0 to 6 nitrogen atoms, 0 to 15 oxygen atoms, 1 to 50 hydrogen atoms, and A divalent organic linking group consisting of 0 to 7 sulfur atoms is more preferred, and is a single bond, or 1 to 10 carbon atoms, 0 to 5 nitrogen atoms, 0 to 10 oxygen atoms, 1 to A divalent organic linking group consisting of 30 hydrogen atoms and 0 to 5 sulfur atoms is particularly preferred.

R ¹³ or R ¹⁴ is a single bond, a structural unit selected from the structural unit group G or a combination of these structural units, “1 to 10 carbon atoms, 0 to 5 carbon atoms, A divalent organic linking group comprising a nitrogen atom, 0 to 10 oxygen atoms, 1 to 30 hydrogen atoms and 0 to 5 sulfur atoms (which may have a substituent, Is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group or an ethyl group, an aryl group having 6 to 16 carbon atoms such as a phenyl group or a naphthyl group, a hydroxyl group, an amino group, a carboxyl group, a sulfonamide group, C1-C6 acyloxy groups such as N-sulfonylamido group and acetoxy group, C1-C6 alkoxy groups such as methoxy group and ethoxy group, halogen atoms such as chlorine and bromine, methoxycarbonyl group, ethoxycal Group, an alkoxycarbonyl group having 2 to 7 carbons atoms and cyclohexyl oxycarbonyl group, a cyano group, carbonate group, such as t- butyl carbonate is preferably etc. The.).
R ¹³ is preferably a divalent organic linking group represented by — (CH ₂ ) —CH (R ^13A ) —. R ^13A represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and is preferably a hydrogen atom or a methyl group. R ^13A may further have a substituent, and when it has a substituent, a carboxyl group is preferred.
R ¹⁴ is preferably a divalent organic linking group represented by — (CH ₂ ) —CH (R ^14A ) —C (═O) —O— (C _q H _2q ) —. R ^14A represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and is preferably a hydrogen atom or a methyl group. R ^14A may further have a substituent. q represents an integer of 0 or more, and is preferably an integer of 1 or more.

In Formula 1, A represents a group having a pigment adsorption site.
When m is 2 or more, m A's may be the same as or different from each other.
A may have one pigment adsorption site or may have a plurality of pigment adsorption sites. When A has a plurality of pigment adsorption sites, they may be the same as or different from each other.
A includes, for example, a pigment adsorption site, 1 to 200 carbon atoms, 0 to 20 nitrogen atoms, 0 to 100 oxygen atoms, 1 to 400 hydrogen atoms, and 0 to 40 sulfur atoms. It is preferably a monovalent organic group formed by bonding with a configured organic linking group. When the pigment adsorption site itself constitutes a monovalent organic group, the pigment adsorption site itself may of course be an organic group represented by A.

  The above-mentioned pigment adsorption sites are acidic groups, groups having basic nitrogen atoms, urea groups, urethane groups, groups having coordinating oxygen atoms, hydrocarbon groups having 4 or more carbon atoms, heterocyclic residues, amide groups, alkoxy It is preferable to include at least one site selected from the group consisting of a silyl group, an epoxy group, an isocyanate group, a hydroxy group and a thiol group, an acidic group, a group having a basic nitrogen atom, a urea group, a coordinating oxygen It is more preferable to include at least one site selected from the group consisting of an atom-containing group, a heterocyclic residue, an amide group, an alkoxysilyl group, a hydroxy group and a thiol group, and from an acid group and an alkoxysilyl group. More preferably, it contains at least one selected site, and particularly preferably a carboxylic acid group, a phosphoric acid group or a trimethoxysilyl group. There.

  Preferred examples of the acidic group at the pigment adsorption site include a carboxylic acid group, a sulfonic acid group, a monosulfate group, a phosphoric acid group (such as a phosphono group), a phosphonooxy group, a monophosphate ester group, and a boric acid group. An acid group, a sulfonic acid group, a monosulfate group, a phosphoric acid group, a phosphonooxy group, and a monophosphate group are more preferable, and a carboxylic acid group, a sulfonic acid group, and a phosphoric acid group are particularly preferable.

Examples of the group having a basic nitrogen atom in the pigment adsorption site include an amino group (—NH ₂ ) and a substituted imino group (—NHR ^C1 , —NR ^C2 R ^C3 , where R ^C1 , R ^C2 and R ^C3 are independent of each other. Represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, or an aralkyl group having 7 or more carbon atoms), a guanidyl group, or an amidinyl group.

As the urea group in the pigment adsorption site, -NR ^C4 CONR ^C5 R ^C6 (wherein R ^{C4 to} R ^C6 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, or -NR ^C4 CONHR ^C6 (wherein R ^C4 and R ^C6 are each independently a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or 6 or more carbon atoms). Are more preferable, and —NHCONHR ^C6 (wherein R ^C6 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 or more carbon atoms, or a carbon atom). Represents an aralkyl group of formula 7 or more).

As the urethane group in the pigment adsorption site, —NHCOOR ^C7 , —NR ^C8 COOR ^C9 , —OCONHRC ¹⁰ , —OCONR ^C11 R ^C12 (where R ^{C7 to} R ^C12 are each independently an alkyl group having 1 to 20 carbon atoms). , Represents an aryl group having 6 or more carbon atoms or an aralkyl group having 7 or more carbon atoms), etc., and —NHCOOR ^C7 , —OCONHR ^C10 (wherein R ^C7 and R ^C10 are each independently from 1 to 20 alkyl group, an aryl group having 6 or more carbon atoms or an aralkyl group having 7 or more carbon atoms is more preferred, and —NHCOOR ^C7 , —OCONHR ^C10 (wherein R ^C7 and R ^C10 are each independently carbon An alkyl group having 1 to 10 carbon atoms, an aryl group having 6 or more carbon atoms or an aralkyl group having 7 or more carbon atoms) is particularly preferable.

  Examples of the group having a coordinating oxygen atom at the pigment adsorption site include an acetylacetonate group and a crown ether.

  Examples of the hydrocarbon group having 4 or more carbon atoms in the pigment adsorption site include an alkyl group having 4 or more carbon atoms, an aryl group having 6 or more carbon atoms, an aralkyl group having 7 or more carbon atoms, and the like. , An aryl group having 6 to 20 carbon atoms or an aralkyl group having 7 to 20 carbon atoms is more preferable, an alkyl group having 4 to 15 carbon atoms (for example, octyl group, dodecyl group, etc.), an aryl group having 6 to 15 carbon atoms (for example, , A phenyl group, a naphthyl group, etc.) or an aralkyl group having 7 to 15 carbon atoms (such as a benzyl group) is particularly preferred.

  The heterocyclic residues at the pigment adsorption site include thiophene, furan, xanthene, pyrrole, pyrroline, pyrrolidine, dioxolane, pyrazole, pyrazoline, pyrazolidine, imidazole, oxazole, thiazole, oxadiazole, triazole, thiadiazole, pyran, pyridine, piperidine , Dioxane, morpholine, pyridazine, pyrimidine, piperazine, triazine, trithiane, isoindoline, isoindolinone, benzimidazolone, benzothiazole, succinimide, phthalimide, naphthalimide, hydantoin, indole, quinoline, carbazole, acridine, acridone, and Examples include residues having a heterocyclic ring selected from the group consisting of anthraquinones.

Examples of the amide group at the pigment adsorption site include -CONHR ^C13 (wherein R ^C13 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, or an aralkyl group having 7 or more carbon atoms). Can be mentioned.

  Examples of the alkoxysilyl group at the pigment adsorption site include a trimethoxysilyl group and a triethoxysilyl group.

  Examples of other possible modes of the organic group having a pigment adsorption site include those described in paragraphs 0016 to 0046 of JP2013-43962A, and paragraphs 0016 to 0046 of JP2013-43962A. Are incorporated into the present invention.

  In Formula 1, B represents a group having a structure represented by Formula 2.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more.

R ¹⁵ and R ¹⁶ are each independently preferably an alkyl group having 1 to 3 carbon atoms, more preferably a methyl group or an ethyl group, and particularly preferably a methyl group.
k represents an integer of 1 or more, preferably an integer of 2 to 300, and more preferably an integer of 10 to 200.

B represents a group having a structure represented by Formula 2.
The structure represented by Formula 2 is preferably a structure derived from a silicone monomer. B may be a structure derived from a silicone monomer, or a combination of B and R ¹⁴ may be a structure derived from a silicone monomer. The silicone monomer may be a silicone macromer. In the present specification, “macromer (also referred to as macromonomer)” is a general term for an oligomer having a polymerizable functional group (degree of polymerization of about 2 or more and about 300 or less) or a polymer. Monomer) and both properties. The structure represented by the above formula 2 is a silicone system having a weight average molecular weight of 1,000 to 50,000 (more preferably 1,000 to 10,000, still more preferably 1,000 to 5,000). A structure derived from a macromer is preferred.

  Further, the graft type silicone polymer represented by Formula 1 is preferably soluble in an organic solvent. When the affinity with the organic solvent is high, for example, when used as a dispersant, the affinity with the dispersion medium is increased, and it is easy to secure an adsorption layer sufficient for stabilizing the dispersion.

  Examples of the group having the structure represented by Formula 2 include X-22-174ASX, X-22-174BX, KF-2012, X-22-173BX, X-22-3710 manufactured by Shin-Etsu Chemical Co., Ltd. Examples include a group derived from an origin.

In Formula 1, l represents an integer of 1 or more, preferably an integer of 1 to 100, more preferably an integer of 1 to 60, and particularly preferably an integer of 1 to 30.
In Formula 1, m represents an integer of 0 or more, and an integer of 1 or more is preferable from the viewpoint of enhancing the dispersibility of the pigment, more preferably an integer of 1 to 60, and an integer of 1 to 30. It is particularly preferred.
In Formula 1, n represents an integer of 1 or more, preferably an integer of 1 to 100, more preferably an integer of 1 to 60, and particularly preferably an integer of 1 to 30.

The ratio of the content of each partial structure in the graft type silicone polymer represented by Formula 1 is not particularly limited. That is, in Formula 1, the ratio of l, m, and n is not particularly limited.
Also, the order of each partial structure (the structure in parentheses with subscripts 1 to n attached to the lower right and the repeating unit represented by formula 3 described later) in the graft type silicone polymer represented by formula 1 There is no particular limitation, as long as they are bonded in any order, for example, they may be bonded by forming a block or may be bonded at random.
In the present invention, in Formula 1, m preferably represents an integer of 1 or more.

The graft type silicone polymer represented by Formula 1 may have other repeating units other than l, m, n, and k repeating units, but preferably has no other repeating units.
Examples of other repeating units include other repeating units having a pigment adsorption site other than A. For example, the graft type silicone polymer represented by Formula 1 may have a repeating unit having a (unreacted) thiol group represented by Formula 4 below.

In Formula 4, R ¹⁷ and R ¹⁸ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and s represents an integer of 0 or more.

Preferred embodiments of R ¹⁷ and R ¹⁸ in Formula 4 are the same as the preferred embodiments of R ⁶ and R ¹¹ in Formula 1.
s is preferably 0.
Examples of the polymer containing a repeating unit having a thiol group represented by Formula 4 include KF-2001 and KF-2004 manufactured by Shin-Etsu Chemical Co., Ltd.

  In the present invention, the graft type silicone polymer represented by Formula 1 is more preferably a compound represented by Formula 3 below.

In Formula 3, R ¹¹ and R ¹² each independently represent an arylene group or an alkylene group having 1 to 3 carbon atoms, R ¹³ and R ¹⁴ each independently represent a single bond or a divalent organic linking group, A ¹ is an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, a heterocyclic group, an amide group, an alkoxysilyl group, Represents a group having a pigment adsorption site having at least one group selected from the group consisting of an epoxy group, an isocyanato group, a hydroxy group, and a thiol group, and B represents a group having a structure represented by the following formula 2. , L, m1 and n each independently represents an integer of 1 or more.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more.

The definitions and preferred ranges of R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , B, l and n in Formula 3 are those of R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , B, l and n in Formula 1. The definition and the preferred range are the same.
The preferred ranges of A ¹ and m1 in Formula 3 are the same as the preferred ranges of A and m in Formula 1, respectively.

[Method for producing graft-type silicone polymer]
There is no restriction | limiting in particular as a manufacturing method of the graft type silicone polymer represented by the above-mentioned Formula 1.
For example, it can be synthesized by a combination of the following compound A, which is a mercapto-modified silicone, compound B, which is a silicone macromonomer, and compound C, which is a macromonomer having a pigment adsorption site. . In the following scheme 1, an example using a compound B and a compound C which are macromonomers (specifically, radically polymerizable monomers, more specifically (meth) acrylic monomers) is shown. The manufacturing method of the graft type silicone polymer represented is not limited to such a manufacturing method.
Compound A, B, in C and Scheme ^{1, R 1 ~R 11, l} , m and,, n is, R ¹ to R ¹¹ in Formula 1, l, m, and, n and have the same meanings, p is an integer of 0 or more, k is an integer of 1 or more, R ^B is an optional substituent, a substituent in Table 1 supra after R and X are each, PGMEA is the ester solvents An example is propylene glycol monomethyl ether acetate, and V-601 is dimethyl-2,2′-azobis (2-methylpropionate), which is an example of a polymerization initiator.

  For the method for producing the pigment dispersant, reference may be made to the descriptions of [0110] to [0134] of JP2013-43962A, and [0110] to [0134] of JP2013-43962A are the present. Incorporated into the invention. However, the present invention is not limited to these.

  The weight average molecular weight of the graft type silicone polymer is preferably 1,000 to 100,000, more preferably 2,000 to 70,000, and still more preferably 3,000 to 50,000. . When the weight average molecular weight is 1,000 or more, the pigment dispersibility is good.

In this invention, a pigment dispersant may be used individually by 1 type, or may use 2 or more types together.
The content of the pigment dispersant is preferably 1 to 40 parts by mass, more preferably 2 to 30 parts by mass, and still more preferably 2 to 15 parts by mass with respect to 100 parts by mass of the white pigment. .

(Pigment dispersion)
The white pigment may be added to the white resin composition as a white pigment dispersion. Moreover, you may add the black pigment mentioned later to the composition for light shielding layer formation mentioned later as a black pigment dispersion liquid.
Hereinafter, the white pigment dispersion and the black pigment dispersion are collectively described as a pigment dispersion. The following description applies to both the white pigment dispersion and the black pigment dispersion.
The pigment dispersion includes the white pigment or the black pigment described later, the pigment dispersant, and at least one solvent selected from the group consisting of hydrocarbon solvents, ketone solvents, ester solvents, and alcohol solvents. It is preferable to contain.
As the pigment dispersant, the graft type silicone polymer is preferable.
The method for preparing the pigment dispersion is not particularly limited, but it is preferable to use only a white pigment, a graft type silicone polymer, a solvent, and optionally a small amount of a dispersion binder when dispersing the pigment. Further, at the time of dispersing the white pigment or black pigment, the above-mentioned specific silicone resin that functions as a dispersion aid and additives such as a polymerization catalyst described later may be added as a material for the pigment dispersion.

As the solvent used in the pigment dispersion, it is preferable to use at least one solvent selected from the group consisting of hydrocarbon solvents, ketone solvents, ester solvents and alcohol solvents.
As the hydrocarbon solvent, xylene, toluene, benzene, ethylbenzene, hexane and the like are preferable.
As the ketone solvent, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, acetone, diethyl ketone and the like are preferable.
As the ester solvent, propylene glycol monomethyl ether acetate, ethyl acetate, butyl acetate, ethyl cellosolve acetate, butyl cellosolve acetate and the like are preferable.
As the alcohol solvent, propylene glycol monomethyl ether, ethyl cellosolve, butyl cellosolve, normal propyl alcohol, butanol and the like are preferable.
Among them, at least one solvent selected from the group consisting of hydrocarbon solvents, ester solvents and ketone solvents is preferable, and selected from the group consisting of xylene, methyl ethyl ketone, methyl isobutyl ketone, propylene glycol monomethyl ether acetate and ethyl acetate. Particularly preferred are at least one solvent.
As content of the solvent with respect to a pigment dispersion liquid (total of total solid content and a solvent), 5-98 mass% is preferable and 10-95 mass% is more preferable.

  The dispersing machine used when dispersing the white pigment or the black pigment is not particularly limited, and is described in, for example, Kazuzo Asakura, “Encyclopedia of Pigments”, First Edition, Asakura Shoten, 2000, page 438. Well-known dispersers such as kneaders, roll mills, atriders, super mills, dissolvers, homomixers, sand mills, bead mills and the like can be mentioned. Further, the material may be finely pulverized using frictional force by mechanical grinding described on page 310 of the document.

In order to suppress sedimentation and aggregation of white pigment particles or black pigment particles, a binder may be added to the pigment dispersion. Examples of the binder include modified silicone compounds from the viewpoint of thermal coloring. As the modified silicone compound, a compound having a siloxane bond in the main chain and having a hydroxy group or a carboxy group at the main chain terminal and / or side chain terminal is preferably used. In particular, the black pigment dispersion preferably contains a modified silicone compound.
As content of the binder with respect to the total solid in a pigment dispersion liquid, 0.1-30 mass% is preferable, 0.2-20 mass% is more preferable, 0.5-10 mass% is especially preferable.
Further, the content of the graft type silicone polymer in the pigment dispersion is preferably 1 to 40 parts by mass, more preferably 3 to 30 parts by mass with respect to 100 parts by mass of the white pigment or black pigment. More preferably, it is -20 mass parts.

<Other resins>
In the present invention, the white resin composition may contain other resins.
The other resin contained in the white resin composition is not particularly limited, but is preferably a heat crosslinkable resin. Examples of the thermally crosslinkable resin include a silicone resin having a siloxane bond in the main chain, an epoxy resin, a melamine resin, etc. Among them, other silicone resins having a siloxane bond in the main chain are preferable. The other silicone resin is a silicone resin other than the specific silicone resin and the graft type silicone polymer.

Other known silicone resins can be used, such as methyl straight silicone resin (polydimethylsiloxane), methylphenyl straight silicone resin (polydimethylsiloxane in which part of the methyl group is substituted with phenyl group), acrylic resin Modified silicone resins, polyester resin-modified silicone resins, epoxy resin-modified silicone resins, alkyd resin-modified silicone resins, rubber-based silicone resins, silicone alkoxy oligomers, and the like can be preferably used. Among them, methyl straight silicone resin, methylphenyl straight silicone resin, acrylic resin-modified silicone resin, and silicone alkoxy oligomer are more preferable, and methyl straight silicone resin, methylphenyl straight silicone resin, and silicone alkoxy oligomer are more preferable. It is done.
Especially, as a silicone resin, it is preferable that it is a silicone resin which has a silanol group and Tg is 10 degreeC or more. In the above embodiment, the cured product to be obtained is excellent in cracking resistance when heated, the cured product is less colored by heat, and the cured product is more excellent in wear resistance.
The silicone resin may be used alone or in combination of two or more. The film physical properties can be controlled by mixing these at an arbitrary ratio.
As the silicone resin, a resin dissolved in an organic solvent or the like may be used. For example, a resin dissolved in a xylene solution or a toluene solution may be used.

As the silicone resin, a commercially available silicone resin may be used. For example, KR251, KR255, KR300, KR311, KR216, ES-1001N, ES-1002T, ES-1023 and the like manufactured by Shin-Etsu Chemical Co., Ltd. are preferably mentioned. .
Moreover, as a silicone alkoxy oligomer, you may use a commercially available silicone oligomer, for example, Shin-Etsu Chemical Co., Ltd. KC-89S, KR-500, X-40-9225, X-40-9246, X-40 Preferred examples include -9250, KR-510, KR-9218, X-40-9227, and KR-213.

  The weight average molecular weight of the silicone resin is preferably 1,000 or more, more preferably 5,000,000 or less, more preferably 3,000,000 or less, and 2,000,000 More preferably, it is 000 or less.

  The content of the silicone resin is preferably 30% by mass or less, more preferably 20% by mass or less, and still more preferably 15% by mass with respect to the total solid content of the white resin composition.

<Solvent>
The white resin composition of the present invention may contain a solvent.
There is no restriction | limiting in particular as a solvent, A well-known solvent can be used. Among these, at least one solvent selected from the group consisting of the hydrocarbon solvents, ketone solvents, ester solvents, and alcohol solvents mentioned above is preferred, and from the group consisting of hydrocarbon solvents and ketone solvents. More preferable examples include at least one selected solvent, and more preferable examples include at least one solvent selected from the group consisting of an aromatic hydrocarbon solvent and a ketone solvent.
A solvent may be used individually by 1 type, or may use 2 or more types together.
Although there is no restriction | limiting in particular in content of the solvent in the white resin composition of this invention, It is preferable that it is 10-90 mass% with respect to the total mass of a white resin composition, and it is 20-85 mass%. More preferred.

<Curing catalyst>
In the present invention, when the white resin composition contains a silicone resin, a condensation reaction curing catalyst (also referred to as a condensation catalyst or a polymerization catalyst) is used to accelerate the crosslinking reaction and form a cured film. Also good. The condensation reaction curing catalyst is preferably a metal salt, and more preferably a condensation catalyst containing an organic acid metal salt.

  The condensation catalyst composed of metal salts (excluding alkali metal salts and alkaline earth metal salts), more preferably organic acid metal salts (excluding alkali metal salts and alkaline earth metal salts), is a conventionally known condensation catalyst. Preferably used. That is, examples of the curing catalyst include an aluminum salt, tin salt, lead salt, or transition metal salt of an organic acid, and the organic acid and the above metal ion may form a complex salt typified by a chelate structure. . Such a curing catalyst is particularly preferably a condensation catalyst containing one or more metals selected from aluminum, titanium, iron, cobalt, nickel, zinc, zirconium, cobalt, palladium, tin, mercury or lead. Of these, organic acid zirconium salts, organic acid tin salts, and organic acid aluminum salts are most preferably used.

  Specific examples of the condensation catalyst include dibutyltin diacetate, dibutyltin dioctate, dibutyltin dilaurate, dibutyltin dimaleate, dioctyltin dilaurate, dioctyltin dimaleate, tin octylate and the like; tetra (i-propyl) ) Organic acid titanium salts such as titanate, tetra (n-butyl) titanate, dibutoxybis (acetylacetonate) titanium, isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate, bis (dioctylpyrophosphate) oxyacetate titanate; Tetrabutyl zirconate, tetrakis (acetylacetonate) zirconium, tetraisobutyl zirconate, butoxytris (acetylacetonate) zirconi Organic acid zirconium salts such as sodium naphthenate and zirconium octylate; organic acid aluminum salts such as tris (ethylacetoacetate) aluminum and tris (acetylacetonato) aluminum; zinc naphthenate, zinc formate, zinc acetylacetonate, Examples thereof include organic acid metal salts such as iron acetylacetonate, cobalt naphthenate, and cobalt octylate. Moreover, you may use CAT-AC, D-15, D-20, D-25 (above, the Shin-Etsu Chemical Co., Ltd. product) as a commercial item.

  The catalyst may be used in a catalytic amount, but it is preferably used in an amount of 0.1 to 20% by mass as the metal content with respect to the pigment dispersant, the dispersed binder and the additional binder resin, and can be arbitrarily selected depending on the curing conditions.

<Other additives>
In the present invention, the white resin composition may contain additives other than those described above.
There is no restriction | limiting in particular as another additive, A well-known additive can be used, for example, a coating adjuvant, antioxidant, a polymerization inhibitor, etc. can be used.

2. Transfer Material The transfer material of the present invention has a white layer on a temporary support, and the white layer is made of the white resin composition of the present invention.
The transfer material of the present invention preferably has a light shielding layer between the temporary support and the white layer.
The white layer or the light shielding layer is preferably an uncured white layer (hereinafter also referred to as “uncured white layer”) or an uncured light shielding layer (hereinafter also referred to as “uncured light shielding layer”).
The transfer material of the present invention more preferably has a light shielding layer and a white layer in this order on the temporary support. In the following description, the transfer material having the light shielding layer and the white layer in this order on the temporary support will be mainly described. However, the transfer material of the present invention is not limited to this, and the light shielding layer is provided. It may not be necessary, and may have a layer having another hue instead of the light shielding layer, and is not particularly limited.
In the present invention, the transfer material is preferably a transfer material for forming a decorative material.

<Film transfer material>
In the present invention, the transfer material is preferably a transfer material for forming a decorative material, and a layer made of a white resin composition or a layer obtained by drying a white resin composition on a temporary support (an uncured white layer) Furthermore, it is preferable to have a layer (uncured light-shielding layer) obtained by drying a layer made of the light-shielding layer-forming composition or the light-shielding layer-forming composition between the temporary support and the white layer. .
The composition for forming a light shielding layer will be described later.
The transfer material of the present invention is preferably a film transfer material.
In the capacitance-type input device having the opening 8 having the configuration shown in FIG. 7, the uncured white layer (decorative material 2a before heating), the uncured light-shielding layer 2b and the like shown in FIG. When used, the substrate (front plate) having an opening does not have any resist component leakage from the opening, and particularly in the decorating material 2a and the light shielding layer 2b that need to form a light shielding pattern up to the boundary of the front plate. Since there is no protrusion of the resist component from the edge of the glass, it is possible to manufacture a touch panel having a merit of thin layer / light weight by a simple process without contaminating the back side of the substrate.

  The film transfer material preferably has a temporary support, an uncured light-shielding layer, and an uncured white layer.

<Temporary support>
The transfer material preferably has a temporary support.
The temporary support is preferably flexible and does not cause significant deformation, shrinkage or elongation under pressure, or even under pressure and heating. Examples of such a temporary support include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film, and among them, a biaxially stretched polyethylene terephthalate film is particularly preferable.
Although the thickness of a temporary support body does not have limitation in particular, 5-300 micrometers is preferable and 20-200 micrometers is more preferable.
Moreover, the temporary support may be transparent or may contain dyed silicon, alumina sol, chromium salt, zirconium salt, or the like.
Further, the temporary support can be provided with conductivity by a method described in JP-A-2005-221726.

<Thermoplastic resin layer>
The transfer material may have at least one thermoplastic resin layer.
The thermoplastic resin layer is preferably provided between the temporary support and the uncured white layer. That is, the transfer material preferably includes a temporary support, a thermoplastic resin layer, an uncured light-shielding layer, and an uncured white layer in this order.
As a component used for the thermoplastic resin layer, an organic polymer substance described in JP-A-5-72724 is preferable, and polymer softening by the Viker Vicat method (specifically, American Material Testing Method ASTM ASTMD 1235). It is particularly preferred that the softening point by point measuring method is selected from organic polymer substances having a temperature of about 80 ° C. or less.

  Specific examples of the thermoplastic resin layer used for the thermoplastic resin layer include polyolefins such as polyethylene and polypropylene, copolymers of ethylene and vinyl acetate or saponified products thereof, and copolymers of ethylene and acrylate esters or saponified products thereof. Ethylene copolymers such as polymers, vinyl chloride copolymers such as polyvinyl chloride, copolymers of vinyl chloride and vinyl acetate and saponified products thereof, polyvinylidene chloride, vinylidene chloride copolymers, polystyrene, styrene ( Styrene copolymers such as copolymers with (meth) acrylic acid esters or saponified products thereof, polyvinyltoluene copolymers such as polyvinyltoluene, copolymers of vinyltoluene and (meth) acrylic acid esters or saponified products thereof, poly (Meth) acrylic ester, butyl (meth) acrylate and vinyl acetate Organic polymers such as polyamide resins such as (meth) acrylic acid ester copolymers such as polymers, vinyl acetate copolymer nylon, copolymer nylon, N-alkoxymethylated nylon, N-dimethylaminated nylon, etc. .

  The thickness of the thermoplastic resin layer is preferably 6 to 100 μm, and more preferably 6 to 50 μm. Within the above range, even if there are irregularities on the substrate, the irregularities can be absorbed sufficiently and the smoothness is excellent.

<Intermediate layer>
The transfer material may have at least one intermediate layer for the purpose of preventing mixing of components during application of a plurality of application layers and during storage after application.
The intermediate layer is preferably provided between the temporary support and the uncured white layer, and between the thermoplastic resin layer and the uncured light-shielding layer when it has a thermoplastic resin layer. That is, the transfer material preferably includes a temporary support, a thermoplastic resin layer, an intermediate layer, an uncured light shielding layer, and an uncured white layer in this order.
As the intermediate layer, it is preferable to use an oxygen-blocking film having an oxygen-blocking function, which is described as “separation layer” in JP-A-5-72724. Time load is reduced and productivity is improved.
The oxygen barrier film is preferably one that exhibits low oxygen permeability and is dispersed or dissolved in water or an aqueous alkali solution, and can be appropriately selected from known ones. Among these, a layer containing polyvinyl alcohol and polyvinyl pyrrolidone is particularly preferable.

  The thickness of the intermediate layer is preferably 0.1 to 5.0 μm, and more preferably 0.5 to 2.0 μm. Within the above range, the oxygen barrier function is not lowered, and it does not take too much time during development or intermediate layer removal.

<Protective release layer>
The transfer material is preferably provided with a protective release layer (also referred to as a cover film) so as to cover the uncured white layer in order to protect it from contamination and damage during storage. The protective release layer may be made of the same or similar material as the temporary support, but must be easily separated from the uncured white layer. As a material for the protective release layer, for example, silicone paper, polyolefin, or polytetrafluoroethylene sheet is suitable.
The thickness of the protective release layer is preferably 1 to 100 μm, more preferably 5 to 50 μm, and particularly preferably 10 to 30 μm. If the thickness is 1 μm or more, the strength of the protective release layer is sufficient and is not easily broken, and if it is 100 μm or less, the price of the protective release layer does not increase, and when the protective release layer is laminated, Wrinkles are less likely to occur.

  The protective release layer is commercially available, for example, polypropylene films such as Alfan MA-410, E-200C, E-501, Shin-Etsu Film Co., Ltd. manufactured by Oji Paper Co., Ltd., PS- manufactured by Teijin Limited. PS series of 25, etc., manufactured by Tamapoli Co., Ltd., GF-1, GF-3, GF-8, and the like, are not limited thereto. Moreover, it can be easily manufactured by sandblasting a commercially available film.

  As the protective release layer, a polyolefin film such as a polyethylene film can be used. Moreover, the polyolefin film used as a protective peeling layer is suitably manufactured by heat-melting raw materials, kneading, extruding, biaxial stretching, casting, or inflation.

<Method for producing film transfer material>
Although there is no limitation in particular as a method of manufacturing a film transfer material, For example, it can manufacture by the process as described in Paragraph 0064-0066 of Unexamined-Japanese-Patent No. 2005-3861. Moreover, a film transfer material can also be produced by a method described in, for example, Japanese Patent Application Laid-Open No. 2009-116078.
As an example of a method for producing a film transfer material, a step of applying a composition for forming a light-shielding layer or a white resin composition on a temporary support and drying to form a layer, and forming the layer as a protective release layer And the step of covering with

Here, the film transfer material that can be used in the present invention may form at least two layers of an uncured white layer and an uncured light-shielding layer, while having a temporary support and an uncured white layer. In the case of transferring the film transfer material including at least the temporary support and the uncured light-shielding layer onto the uncured white layer, the uncured white layer and the uncured light-shielding layer are removed. You may use what formed at least 1 layer. In the former case, the transfer material of the present invention may be obtained by laminating an uncured white layer and an uncured light-shielding layer in this order on a temporary support. In this case, on the substrate, preferably glass. A white layer and a light shielding layer can be provided at a time, which is preferable in terms of process.
In the film transfer material that can be used in the present invention, other layers may be further formed as long as it is not contrary to the gist of the present invention. Further, before the formation of the uncured white layer, a thermoplastic resin layer and / or an intermediate layer (oxygen barrier layer) may be applied and formed.
As a method for applying a white resin composition, a composition for forming a light shielding layer, a coating solution for forming a thermoplastic resin layer, a coating solution for forming an intermediate layer, etc. on a temporary support, a known coating method may be used. it can. For example, it can be formed by applying and drying these coating liquids using a coating machine such as a spinner, a wheeler, a roller coater, a curtain coater, a knife coater, a wire bar coater, or an extruder.

〔solvent〕
Each layer of the film transfer material can be suitably prepared using a solvent together with each component.
Solvents include esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, alkyl esters, methyl lactate, lactic acid Ethyl, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, and methyl 3-oxypropionate and ethyl 3-oxypropionate 3-oxypropionic acid alkyl esters (for example, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate), and 2-oxypropionic acid 2-oxypropionic acid alkyl esters such as til, ethyl 2-oxypropionate and propyl 2-oxypropionate (for example, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, 2 -Methyl ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, 2-ethoxy- Ethyl 2-methylpropionate), and methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate and the like;
Ethers such as diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol mono Ethyl ether acetate, propylene glycol propyl ether acetate, etc .;
Ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone, 3-heptanone and the like;
Aromatic hydrocarbons such as toluene and xylene;
Of these, methyl ethyl ketone, methyl isobutyl ketone, xylene, cyclohexanone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate and the like are preferable.
A solvent may be used individually by 1 type and may be used in combination of 2 or more type.

The method for covering the white layer or the uncured white layer with the protective release layer is not particularly limited, but a method of overlaying the protective release layer on the white layer or the uncured white layer on the temporary support and press-bonding can be used.
For the pressure bonding, a known laminator such as a laminator, a vacuum laminator, and an auto-cut laminator capable of further improving productivity can be used.
As conditions for pressure bonding, an atmospheric temperature of 20 to 45 ° C. and a linear pressure of 1,000 to 10,000 N / m are preferable.

<Light shielding layer forming composition>
The light shielding layer forming composition used in the present invention preferably contains a black pigment, a pigment dispersant, a solvent, and a resin.
Regarding the pigment dispersant, the solvent, and the resin, the pigment dispersant, the solvent, and other resins used in the white resin composition of the present invention are used, and preferred embodiments are also the same.
Moreover, the resin composition for light shielding layer formation may contain the curing catalyst and other additive which are used for the white resin composition of this invention, and its preferable aspect is also the same.
Hereinafter, the black pigment will be described.

[Black pigment]
Examples of the black pigment used in the composition for forming a light shielding layer in the present invention include carbon black, titanium black, titanium carbon, iron oxide, titanium oxide, graphite and the like, and at least one of titanium oxide and carbon black. It is preferable that carbon black is included, and it is more preferable that carbon black is included.
The content of the black pigment is preferably 3 to 60% by mass, more preferably 5 to 45% by mass, and 10 to 40% by mass with respect to the total solid content of the light shielding layer forming composition. More preferably it is.

The black pigment used in the present invention preferably has an average primary particle diameter of 5 to 100 nm, more preferably 10 to 50 nm, from the viewpoints of dispersion stability and hiding power. When the average particle size of the primary particles is 5 nm or more, the hiding power is high, the base of the light shielding layer is difficult to see, and the viscosity of the light shielding layer forming composition is unlikely to increase. On the other hand, when the thickness is 100 nm or less, the chromaticity is sufficiently high, the hiding power is high at the same time, and the surface shape when applied is good.
The “average particle size of the primary particles” as used herein refers to the diameter when the electron micrograph image of the particles is a circle of the same area, and the “number average particle size” is the above-mentioned particle size for a large number of particles. The diameter is obtained and the 100 arithmetic average values are referred to.

3. Base material The base material of the present invention has a substrate, a white layer, and a light shielding layer in this order, and the white layer is a base material made of the white resin composition of the present invention, or It is the base material produced with the transfer material of invention.
The substrate of the present invention is preferably used for decoration.
In the present invention, the base material for decoration is also referred to as “base material with decorating material”, and the white layer that the base material with decorating material has on the substrate is also referred to as “decorating material”.
In the base material which has a white layer, it became a problem that a white layer discolors (colors) by heat processing. In the present invention, it is preferable to use the graft type silicone polymer represented by the above-described formula 1 as a pigment dispersant in the white layer or the light shielding layer, because discoloration (coloring) of the white layer is suppressed.
Further, the light shielding layer preferably contains the graft type silicone polymer.
Although the light-shielding layer contains the graft type silicone polymer, the detailed action mechanism that suppresses the discoloration of the white layer is not clear, but is estimated as follows. That is, when a conventional polymer dispersant is used as a black pigment dispersant in the light-shielding layer adjacent to the white layer, it is considered that a part of the polymer dispersant moves to the white layer. When the base material with a decorating material is heat-treated, the polymer dispersant that has moved to the white layer is colored, and as a result, discoloration of the white layer occurs. By using the graft type silicone polymer represented by the above-described formula 1 as a black pigment dispersant, the light-shielding layer suppresses coloring even when a part of the dispersant moves to the white layer, As a result, it is considered that discoloration of the white layer was suppressed.

Moreover, it is preferable that the base material of this invention and the base material with a decorating material in this invention further have a conductive layer in the light-shielding layer on the opposite side to a board | substrate.
It is preferable that the base material of this invention and the base material with a decorating material in this invention have a board | substrate, a white layer, a light shielding layer, and an electroconductive layer in this order.

The base material of the present invention and the base material with a decorating material of the present invention have a substrate, a white layer, and a light shielding layer in this order, and the base material has a light-transmitting region that transmits light in the thickness direction. The white layer and the light-shielding layer are laminated on the substrate so as to surround the light-transmitting region, and are formed on the inner edge of the decorative material so that the thickness of the decorative material decreases toward the inside of the light-transmitting region. It is preferable that the inclined portion is formed, and it is more preferable that the inclination angle formed by the surface of the inclined portion and the substrate surface is 10 to 60 degrees. Between the decorating material and the location of the substrate on which the decorating material is not formed because the decorating material has a tilted portion and the tilt angle formed by the surface of the tilted portion and the substrate surface is 10 to 60 degrees. Accordingly, the step of the film thickness becomes gentle, and the conductive layer on the light shielding layer is less likely to cause problems such as disconnection.
Hereinafter, the preferable aspect of the base material of this invention is demonstrated.

In the base material of the present invention or the base material with a decorating material in the present invention, the optical density of the base material or the base material with the decorating material is preferably 3.5 to 6.0, and preferably 4.0 to 5. 5 is more preferable, and 4.5 to 5.0 is particularly preferable.
In the substrate of the present invention or the substrate with a decorating material in the present invention, the color on the substrate side is an SCI index, and the L ^* value is preferably 89 or more, more preferably 90 or more, It is especially preferable that it is 91 or more. Furthermore, the base material side of this invention or the base material with a decorating material in this invention is 280 degreeC and the L ^* value by the side of the base material of the base material with a decorating material after a high temperature process for 40 minutes is a SCI parameter | index, and is in the said range. It is preferable from the viewpoint of improving the color after the conductive layer is deposited on the light shielding layer by sputtering.
In the base material of the present invention or the base material with a decorating material in the present invention, the color of the base material is an SCI index, and the b ^* value is preferably less than 1.0, and is 0.5 or less. Is more preferable and 0.0 or less is particularly preferable. Furthermore, the substrate with the decorative material in the substrate or the invention of the present invention, 280 ° C., the substrate after the high-temperature treatment of 40 minutes or b ^* value of the substrate side of the decorative material-base material with SCI index The above range is preferable from the viewpoint of improving the color after the conductive layer is deposited on the light shielding layer by sputtering.

A preferred embodiment of the decorating material of the present invention is a frame-like pattern around a translucent area (display area) formed on the non-contact side of the front panel of the touch panel, and the purpose is to hide the lead wiring and the like. Or it is formed for the purpose of decoration. As shown in FIG. 1 to FIG. 3, on the inner edge of the laminate of the decorating material 2 a and the light shielding layer 2 b provided on the substrate 1, the thickness of the decorating material faces inward of the translucent region. It is preferable to have the inclined portion 2c formed so as to be thin. The conductive layer 6 is preferably formed on the decorating material and extends to the substrate 1 along the inclined portion 2c of the decorating material.
By providing the inclined portion, the film thickness difference between the decorating material and the portion of the substrate on which the decorating material is not formed becomes gentle, and problems such as disconnection of the conductive layer are less likely to occur.
About the formation method of an inclination part, it does not specifically limit, The method which forms the light shielding layer by shrinking by heating, the layer which consists of the white resin composition of this invention, or the layer which dried the white resin composition of this invention ( Examples include a method of forming the uncured white layer) by melting it by heating, and a method of forming the light-shielding layer by shrinking by heating is preferred. When the light shielding layer contracts by heating, the uncured white layer on the light shielding layer side contracts following the light shielding layer, while the uncured white layer on the substrate side does not follow the light shielding layer, so that an inclined portion is formed. Can do. The formation of the inclined portion by shrinking the light shielding layer by heating will be described later.

  There is no restriction | limiting in particular about the shape of the inclination part 2c in a decorating material, for example, it has a protrusion which rose as shown in an example in FIG.1 and FIG.3, or gently as shown in an example in FIG. It may have a shape connected by a simple curve. Moreover, as shown in FIGS. 1-3, as for the inclination part 2c, the thickness of the decorating material 2a should just become thin toward the inward of the translucent area | region, and the light shielding layer 2b is also thick with the decorating material 2a. The thickness may be reduced toward the inside of the translucent region. As shown in FIG. 3, the decorative material may be an embodiment in which two or more layers of the decorative material 2 a are laminated.

The inclination angle θ between the inclined portion surface and the substrate surface shown in FIG. 4 is 10 to 60 degrees, and more preferably 15 to 55 degrees. When the inclination angle θ is 10 ° or more, the number of places where the light shielding layer is not provided on the decorative material is reduced, the appearance abnormality, that is, the region having a low optical density is reduced, light leakage of the display device and circuit assistance are reduced. There are fewer cases where you can see On the other hand, when the inclination angle θ is 60 degrees or less, the conductive layer is less likely to cause problems such as disconnection.
As shown by the dotted lines in FIGS. 1 to 4, the inclination angle θ is an inclination angle formed by approximating the surface of the inclined portion to a plane and forming the plane and the substrate surface. The inclination angle θ can be obtained by cutting the substrate and measuring the angle between the substrate and the substrate using an optical microscope from the cross-sectional direction.
When the inclined portion is formed by shrinking the light shielding layer by heating, the inclined portion having a desired inclination angle is formed by changing the type and / or composition of the resin constituting the white layer and / or the light shielding layer. be able to.

In the present invention, it is preferable to provide the inclination angle θ so that the difference between the width of the decorating material on the substrate side and the width of the light shielding layer is 200 μm or less. With such a configuration, problems such as abnormal appearance and disconnection of the conductive layer can be solved.
The difference (edge difference) between the width of the decorating material on the substrate side and the width of the light shielding layer is preferably 200 μm or less, more preferably 5 to 100 μm, and even more preferably 10 to 90 μm.
The board | substrate side width | variety of a decorating material means the width | variety of the decorating material of the side which is in contact with the board | substrate among decorating materials.

<Board>
Various substrates can be used as the substrate of the present invention, but a film substrate is preferable, and a substrate that is not optically distorted or a substrate having high transparency is more preferable. The substrate in the base material with a decorating material of the present invention preferably has a total light transmittance of 80% or more.

Specific materials when the substrate is a film substrate include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate (PC), triacetyl cellulose (TAC), and cycloolefin polymer (COP).
The substrate may be glass or the like.
In the base material with a decorating material of the present invention, the substrate is glass, TAC, PET, PC, COP or silicone resin (however, the silicone resin and polyorganosiloxane in the present specification appear in the structural unit of R ₂ SiO. is not limited to a narrow sense, is preferably selected from silsesquioxane also containing acid compound.) represented by structural units of RSiO _1.5, glass, preferably made of a cycloolefin polymer or a silicone resin.
The silicone resin is preferably composed mainly of cage-type polyorganosiloxane, more preferably a cage silsesquioxane. In addition, the main component of a composition or a layer means the component which occupies 50 mass% or more of the composition or the layer.
As a substrate containing a silicone resin, Japanese Patent No. 4142385, Japanese Patent No. 44099797, Japanese Patent No. 5078269, Japanese Patent No. 4920513, Japanese Patent No. 4964748, Japanese Patent No. 5036060, Japanese Patent Application Laid-Open No. 2010-96848, Japanese Patent Application No. 2011-194647. No., JP 2012-183818, JP 2012-184371, and JP 2012-218322, and the contents described in these publications are incorporated in the present invention.

Various functions may be added to the substrate surface. Specific examples include an antireflection layer, an antiglare layer, a retardation layer, a viewing angle improving layer, a protective layer, a self-healing layer, an antistatic layer, an antifouling layer, an antimagnetic wave layer, and a conductive layer.
In the base material of the present invention, the base material preferably has a conductive layer on the surface of the base material.
Preferred examples of the conductive layer include those described in JP-T 2009-505358.
The substrate preferably further includes at least one of a scratch-resistant layer and an antiglare layer.

  The film thickness of the substrate in the base material of the present invention is preferably 35 to 200 μm, more preferably 40 to 150 μm, and particularly preferably 40 to 100 μm.

  Moreover, in order to improve the adhesiveness of a decorating material, it can surface-treat to the non-contact surface of a board | substrate (front plate) previously. As the surface treatment, it is preferable to perform a surface treatment (silane coupling treatment) using a silane compound. As the surface treatment using a silane compound, for example, a silane coupling liquid (N-β (aminoethyl) γ-aminopropyltrimethoxysilane 0.3% by mass aqueous solution, trade name: KBM603, manufactured by Shin-Etsu Chemical Co., Ltd.) ) For 20 seconds by showering, and washing with pure water. Thereafter, the reaction is carried out by heating. A heating tank may be used, and the reaction can be promoted by preheating the substrate with a laminator.

<White layer>
The base material of this invention contains the white layer formed using the white resin composition of this invention, and contains a light shielding layer on the surface on the opposite side to a base material with respect to a white layer. The white layer is preferably provided adjacent to the substrate.
The white layer includes a white pigment and a condensate obtained by condensing at least a specific silicone resin.
In the same manner as the method for measuring the T-body / D-body ratio described in the specific silicone resin, the T-body / D-body ratio of the resin contained in the white layer is measured. It can be estimated that the specific silicone resin in the present invention is used.
The T body / D body ratio can be measured in the same manner as the T body / D body ratio in the specific silicone resin.
Moreover, it is preferable that a white layer further contains each component other than the white pigment and specific silicone resin which were demonstrated in the white resin composition of this invention mentioned above.

<Light shielding layer>
The base material of the present invention includes a light shielding layer on the side opposite to the substrate with respect to the white layer. The light shielding layer is preferably provided adjacent to the white layer, but an adhesive layer or the like may be provided between the white layer and the light shielding layer.
The light shielding layer is preferably produced from the above-described composition for forming a light shielding layer.
Moreover, it is preferable that a light shielding layer contains each component demonstrated in the composition for light shielding layer formation of this invention mentioned above.

The thickness of the light shielding layer in the substrate of the present invention is preferably 1.0 to 5.0 μm and more preferably 1.0 to 4.0 μm from the viewpoint of increasing the hiding power of the light shielding layer. preferable.
The optical density (OD) of the light shielding layer is preferably 3.5 or more, particularly preferably 4.0 or more, from the viewpoint of increasing the hiding power of the light shielding layer.
The surface resistance of the light shielding layer is preferably 1.0 × 10 ¹⁰ Ω / □ or more, more preferably 1.0 × 10 ¹¹ Ω / □ or more, and 1.0 × 10 ¹² Ω / □ or more. More preferably, it is 1.0 × 10 ¹³ Ω / □ or more. Note that Ω / □ is square per Ω.

(Conductive layer)
The base material of the present invention preferably further has a conductive layer on the light shielding layer.
As the conductive layer, those described in JP-T-2009-505358 can be preferably used. The configuration and shape of the conductive layer will be described in the description of the first transparent electrode pattern, the second electrode pattern, and other conductive elements in the description of the touch panel of the present invention described later.
In the substrate of the present invention, the conductive layer preferably contains indium (including an indium-containing compound such as indium tin oxide (ITO) or an indium alloy).
Since the base material with a decorating material of the present invention has high crack resistance of the decorating material of the present invention, the film physical properties of the decorating material can be improved even when the conductive layer is deposited by sputtering, The b ^* value of the decorative material can be reduced.

(Manufacturing method of substrate)
The manufacturing method of the equipment in the present invention preferably includes a layer forming step of forming a white layer and a light shielding layer on the substrate, a post-baking step of heating the white layer and the light shielding layer, and preferably further includes other steps. .

<Layer formation process>
The layer forming step is not particularly limited, but a layer made of the white resin composition of the present invention and a layer made of the light shielding layer forming composition, or a layer obtained by drying the white resin composition of the present invention (uncured) The white layer) and the layer obtained by drying the composition for forming a light shielding layer (uncured light shielding layer) are preferably prepared by a method selected from the group consisting of film transfer, thermal transfer printing, screen printing, and ink jet printing. It is more preferable to produce by film transfer (laminating method) using the transfer material of the invention. A film transfer material is preferably used as the transfer material.
Specifically, the layer forming step includes a step of laminating an uncured white layer and an uncured light-shielding layer in this order on the substrate, and the uncured white layer and the uncured light-shielding layer are respectively provided on the temporary support at least. A method for removing a temporary support after transferring at least one of an uncured white layer and an uncured light-shielding layer from a film transfer material including one of an uncured white layer and an uncured light-shielding layer, at least an uncured white layer on the temporary support And thermal transfer printing for transferring at least one of the uncured white layer and the uncured light-shielding layer from the temporary support by heating the temporary support side of the thermal transfer material containing one of the uncured light-shielding layer and the light-shielding layer. It is preferable to prepare by a method selected from the group consisting of screen printing of the layer forming composition and ink jet printing of the white layer forming composition or the light shielding layer forming composition.
Further, the decorative material has a shape on the frame so as to surround the light-transmitting region on the substrate, and the thickness of the decorative material decreases toward the inner side of the light-transmitting region on the inner edge of the decorative material. It is preferable to include a step of forming the inclined portion.

The uncured white layer and the uncured light shielding layer may be formed by combining a plurality of film transfer, thermal transfer printing, screen printing, and inkjet printing.
Furthermore, the manufacturing method of a base material includes an uncured white layer and an uncured light shielding layer from a film transfer material including at least a temporary support, an uncured light shielding layer, and an uncured white layer in this order. Or after removing the temporary support after transferring the uncured white layer onto the substrate from the film transfer material having the temporary support and the uncured white layer, and further removing at least the temporary support. The film is preferably formed by removing the temporary support after transferring the uncured light-shielding layer onto the uncured white layer from the film transfer material including the temporary support and the uncured light-shielding layer.
Hereinafter, the details of the film transfer, thermal transfer printing, screen printing, ink jet printing, post-baking process, and other processes in the layer forming process will be described with respect to the manufacturing method of the equipment in the present invention.

<Film transfer>
In the present invention, film transfer (laminating method) is a method using the transfer material of the present invention, in which a white layer and a light shielding layer, or a layer obtained by drying a white resin composition (an uncured white layer) and a light shielding layer are formed. It is preferable that the method includes a transfer step of transferring at least the layer (uncured light-shielding layer) obtained by drying the composition for use to the substrate.
The transfer (bonding) of the uncured white layer and the uncured light-shielding layer to the substrate surface is performed by overlaying the uncured white layer on the substrate surface, pressurizing and heating. A known laminator as described above can be used for bonding.
The lamination method transfers the desired uncured white layer and uncured light-shielding layer to the substrate, so the method that does not allow air bubbles to enter between the substrate and the uncured white layer increases the yield. From the viewpoint of Specifically, the use of a vacuum laminator can be preferably mentioned.
Examples of the apparatus used for laminating (continuous type / single-wafer type) include V-SE340aaH manufactured by Climb Products Co., Ltd.
Examples of the vacuum laminator device include those manufactured by Takano Seiki Co., Ltd., FVJ-540R, FV700 manufactured by Taisei Laminator Co., Ltd., and the like.

Before sticking the film transfer material to the substrate, a step of laminating the support further on the opposite side of the light-shielding layer and / or the white layer of the temporary support is obtained, thereby obtaining a preferable effect of eliminating bubbles during lamination. There are things that can be done. The support used at this time is not particularly limited, and examples of the support material include polyethylene terephthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.
Moreover, it is preferable that the film thickness of the said support body is the range of 50-200 micrometers.

[Step of removing the temporary support]
In the method for manufacturing equipment according to the present invention, when the layer forming step is performed by film transfer, the method for manufacturing equipment according to the present invention preferably further includes a step of removing the temporary support from the transfer material attached to the substrate.

[Step of removing the thermoplastic resin layer, step of removing the intermediate layer]
In the manufacturing method of the equipment in the present invention, when the layer forming step is performed by film transfer, and the film transfer material includes a thermoplastic resin layer or an intermediate layer, the manufacturing method of the equipment in the present invention includes the thermoplastic resin layer and / or It is preferable to further include a step of removing the intermediate layer.
The step of removing the thermoplastic resin layer and / or the intermediate layer can be performed using an alkaline developer generally used in a photolithography method.
There is no restriction | limiting in particular as an alkali developing solution, Well-known developing solutions, such as what is described in Unexamined-Japanese-Patent No. 5-72724, can be used. The developer preferably has a development behavior in which the decorating material is dissolved. For example, a developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 to 5 mol / L is preferable, but further mixed with water. A small amount of organic solvent may be added.
Examples of organic solvents miscible with water include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, and benzyl alcohol. , Acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam, N-methylpyrrolidone and the like. The concentration of the organic solvent is preferably 0.1 to 30% by mass.
Further, a known surfactant can be further added to the alkaline developer. The concentration of the surfactant is preferably 0.01 to 10% by mass.

  The method of removing the thermoplastic resin layer and / or the intermediate layer may be any of paddle, shower, shower & spin, dip and the like. Here, the shower will be described. The thermoplastic resin layer and the intermediate layer can be removed by spraying a developer with a shower. Further, after the development, it is preferable to remove the residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like. The liquid temperature is preferably 20 ° C. to 40 ° C., and the pH is preferably 8 to 13.

<Thermal transfer printing>
In thermal transfer printing, an uncured white layer and an uncured light-shielding layer are heated on the temporary support side of the thermal transfer material including at least one of the uncured white layer and the uncured light-shielding layer on the temporary support, respectively. It is preferable to prepare by thermal transfer printing that transfers at least one of the uncured white layer and the uncured light-shielding layer. The thermal transfer is preferably performed at a heating temperature and a heating time such that the uncured white layer and the uncured light shielding layer are not completely cured.
As a thermal transfer printing method, ink ribbon printing is preferable. As a method of ink ribbon printing used in the method for producing a substrate of the present invention, the method described in “Non-impact printing—Technology and materials— (published by CMC Co., Ltd., December 1, 1986)” is used. Can be mentioned.

<Screen printing>
In the screen printing, an uncured white layer and / or an uncured light shielding layer is produced by screen printing of the white resin composition and / or the composition for forming a light shielding layer of the present invention.
There is no restriction | limiting in particular as a method of screen printing, A well-known method can be used, For example, the method of patent 4021925 etc. can be used. Further, by performing screen printing a plurality of times, the film thickness can be increased even by screen printing.

<Inkjet printing>
In the inkjet printing, an uncured white layer and / or an uncured light-shielding layer is prepared by inkjet printing of the white resin composition and / or the composition for forming a light-shielding layer of the present invention. Examples of the ink-jet printing method used in the substrate production method of the present invention include a method described in “Application of Inkjet Technology to Electronics (published by Realize Science and Technology Center Co., Ltd., September 29, 2006)”. it can.

<Post-bake process>
In the present invention, it is preferable to include a post-baking step after the layer forming step, and when performing the layer forming step by film transfer, it includes a step of performing post-baking after the step of removing the thermoplastic resin layer and / or the intermediate layer. Is more preferable. By performing post-baking, it is preferable to cure the uncured white layer and the uncured light-shielding layer to obtain a decorative material.
In the post-baking process, the uncured white layer and the uncured light-shielding layer of the transfer material are formed by heating to 50 ° C. to 300 ° C. in an environment of 0.08 to 1.2 atm. It is preferable from the viewpoint of compatibility. Note that 1 atmosphere = 0.101325 MPa.
Moreover, it is preferable that the inner edge of the decorating material in the present invention has an inclined portion formed so that the thickness of the decorating material decreases toward the inside of the translucent region. It is preferable to form by shrinking by heating. For example, in the post-bake process, the shading layer can be contracted by heating the decorating material at 50 ° C. to 300 ° C., thereby forming the inclined portion.

The post-baking is more preferably performed in an environment of 0.5 atm or higher. On the other hand, it is more preferable to carry out in an environment of 1.1 atmospheres or less, and it is particularly preferred to carry out in an environment of 1.0 atmospheres or less. Furthermore, it is more particularly preferable to carry out in an environment of about 1 atmosphere (atmospheric pressure) from the viewpoint of reducing the manufacturing cost without using a special decompression device. Here, conventionally, when the uncured white layer and the uncured light-shielding layer are cured by heating, the strength after baking is maintained by reducing the oxygen concentration in a reduced pressure environment at a very low pressure. However, by using a film transfer material, the color tone on the base material side of the white layer and the light shielding layer can be improved (b ^* value is reduced) and the whiteness can be increased even after baking in the above pressure range. it can.
The post-baking temperature is preferably 50 ° C to 300 ° C, more preferably 100 ° C to 300 ° C, and more preferably 120 ° C to 300 ° C.
Further, the post-baking may be performed for a predetermined time at two or more different temperatures. For example, first, it is preferably heated at 50 ° C to 200 ° C, more preferably 100 ° C to 200 ° C, and then preferably 200 ° C to 280 ° C, more preferably 220 ° C to 260 ° C.
The post-baking time is more preferably 20 to 150 minutes, and particularly preferably 30 to 100 minutes. When it is performed at a temperature of two or more stages, it is preferable that the total temperature of each stage is 20 to 150 minutes.
The post-baking may be performed in an air environment or a nitrogen-substituted environment, but it is particularly preferable to perform the post-bake from the viewpoint of reducing the manufacturing cost without using a special decompression device.

<Other processes>
In the present invention, the equipment manufacturing method may have other steps other than those described above.
As examples of the step of removing the thermoplastic resin layer and / or the intermediate layer and other steps, the method described in paragraphs 0035 to 0051 of JP-A-2006-23696 is also preferably used in the present invention. be able to.

5. Touch Panel The touch panel of the present invention includes the base material (base material with a decorating material) of the present invention.
Such a touch panel is preferably a capacitive input device.

<Capacitive Input Device and Image Display Device Comprising Capacitive Input Device as Components>
The capacitance-type input device includes a front plate (also referred to as a substrate) and at least the following elements (1) to (4) on the non-contact side of the front plate. It is preferable that the base material with a decorating material of this invention is included as a laminated body of a decorating material.
(1) Decorative material (2) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction via connecting portions (3) A first transparent electrode pattern and electricity A plurality of second electrode patterns comprising a plurality of pad portions that are electrically insulated and extend in a direction intersecting the first direction. (4) a first transparent electrode pattern and a second electrode pattern; In addition, in the capacitive input device, the second electrode pattern may be a transparent electrode pattern.
Furthermore, the capacitive input device may further include the following (5).
(5) A conductive element that is electrically connected to at least one of the first transparent electrode pattern and the second transparent electrode pattern and is different from the first transparent electrode pattern and the second transparent electrode pattern. The capacitive input device includes a front plate (substrate), (1) a decorative material, and a laminate having at least one electrode pattern among the above-described (2), (3), and (5) as a conductive layer, More preferably, the substrate of the present invention is included.
(1) It is preferable that the decorating material further has a light shielding layer.

<Configuration of capacitance type input device>
First, the configuration of a capacitive input device formed by the manufacturing method of the present invention will be described.
5 and 6 are cross-sectional views showing a preferred configuration of the capacitive input device of the present invention.
5, the capacitive input device 10 includes a front plate 1G (cover glass), a decorating material 2a, a light shielding layer 2b, a first transparent electrode pattern 3, a second transparent electrode pattern 4, The insulating layer 5, the conductive element 6, and the transparent protective layer 7 are configured. The decorating material 2 a is provided with an inclined portion 2 c, and the decorating material 2 a is formed so as to become thinner toward the inside of the capacitive input device 10.

The front plate 1 and / or 1G is preferably composed of a translucent substrate. The translucent base material may be any of the cover glass 1G provided with the following decorating material, or the cover glass 1G and the film base material 1 provided with the following decorating material on the film base material. it can.
When providing a decorating material on a cover glass, when providing a decorating material on a film base material and sticking it on a cover glass for thinning a touch panel, it is preferable for touch panel productivity.
Moreover, the cover glass 1G can be further provided on the opposite side of the electrode of the film substrate.
As the glass substrate, tempered glass typified by gorilla glass manufactured by Corning Inc. can be used.
5 and 6, the side on which the front plate 1 and / or 1G elements are provided is referred to as a non-contact surface 1a. In the capacitive input device 10 of the present invention, input is performed by bringing a finger or the like into contact with the contact surface of the front plate 1 and / or 1G (the surface opposite to the non-contact surface 1a). Hereinafter, the front plate may be referred to as a “base material”.

Moreover, the decorating material 2a and the light shielding layer 2b are provided on the non-contact surface of the front plate 1 and / or 1G. The decorating material 2a and the light shielding layer 2b are frame-like patterns around a translucent area (display area) formed on the non-contact side of the front panel of the touch panel as a decorating material, so that routing wiring and the like cannot be seen. It is formed for the purpose of making and decoration.
The capacitive input device 10 of the present invention can be provided with a wiring outlet (not shown). When forming a base material with a decorating material of a capacitance type input device having a wiring extraction part, the decorating material 2a may be formed using a decorating material forming liquid resist or screen printing ink. From the viewpoint of easily preventing contamination on the back side of the material, it is preferable to use a base material with a decorating material having a wiring extraction portion.

On the non-contact surface of the front plate 1 and / or 1G, a plurality of first transparent electrode patterns 3 formed with a plurality of pad portions extending in the first direction via connection portions, A plurality of second transparent electrode patterns 4 comprising a plurality of pad portions that are electrically insulated from the transparent electrode pattern 3 and extend in a direction intersecting the first direction; and a first transparent electrode pattern 3 and an insulating layer 5 that electrically insulates the second transparent electrode pattern 4 are formed. The first transparent electrode pattern 3, the second transparent electrode pattern 4, and the conductive element 6 described later are, for example, translucent conductive materials such as ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide). It can be made of a metal oxide film. Examples of such metal films include ITO films; metal films such as Al, Zn, Cu, Fe, Ni, Cr, and Mo; metal oxide films such as SiO ₂ . At this time, the film thickness of each element can be 10 to 200 nm. Further, since the amorphous ITO film is made into a polycrystalline ITO film by firing, the electrical resistance can be reduced. Moreover, the 1st transparent electrode pattern 3, the 2nd transparent electrode pattern 4, and the electroconductive element 6 mentioned later are manufactured using the transfer film which has the decorating material using the above-mentioned conductive fiber. You can also. In addition, when the first conductive pattern or the like is formed of ITO or the like, paragraphs 0014 to 0016 of Japanese Patent No. 4506785 can be referred to.

  Further, at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 is a non-contact surface of the front plate 1 and / or 1G and the front plate 1 and / or 1G of the light shielding layer 2b. It can be installed across both areas of the surface. 5 and 6, the second transparent electrode pattern 4 is a region on both the non-contact surface of the front plate 1 and / or 1G and the surface opposite to the front plate 1 and / or 1G of the light shielding layer 2b. A figure is shown in which the second transparent electrode pattern 4 covers the side surface of the decorating material 2a. However, the width of the decorating material 2a can also be made narrower than the width of the light shielding layer 2b. In that case, at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 is the front plate 1 and It can be installed across the region of the surface on the side opposite to the front plate 1 and / or 1G of the non-contact surface of 1G or the decorative material 2a and the light shielding layer 2b. Thus, even when the transfer film is laminated across the decorative material including the decorative material 2a and the light-shielding layer 2b that require a certain thickness and the back surface of the front plate, the film transfer material (particularly, having a thermoplastic resin layer). By using the film transfer material), it is possible to perform lamination without generating bubbles at the partial boundary of the decorating material 2a by a simple process without using expensive equipment such as a vacuum laminator.

The first transparent electrode pattern 3 and the second transparent electrode pattern 4 will be described with reference to FIG.
FIG. 8 is an explanatory diagram showing an example of the first transparent electrode pattern and the second transparent electrode pattern in the present invention.
As shown in FIG. 8, the first transparent electrode pattern 3 is formed such that the pad portion 3a extends in the first direction via the connection portion 3b. The second transparent electrode pattern 4 is electrically insulated by the first transparent electrode pattern 3 and the insulating layer 5 and extends in a direction intersecting the first direction (second direction in FIG. 8). It is constituted by a plurality of pad portions that are formed. Here, when the first transparent electrode pattern 3 is formed, the pad portion 3a and the connection portion 3b may be integrally formed, or only the connection portion 3b is formed, and the pad portion 3a and the second transparent electrode pattern 3 are formed. The electrode pattern 4 may be integrally formed (patterned). When the pad portion 3a and the second transparent electrode pattern 4 are produced (patterned) as a single body (patterning), as shown in FIG. Each layer is formed so that the first transparent electrode pattern 3 and the second transparent electrode pattern 4 are electrically insulated by 5.

  5 and 6, the conductive element 6 is provided on the surface of the light shielding layer 2b opposite to the front plate 1 and / or 1G. The conductive element 6 is electrically connected to at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4, and is different from the first transparent electrode pattern 3 and the second transparent electrode pattern 4. Is another element. 5 and 6, the conductive element 6 is connected to the second transparent electrode pattern 4.

  5 and 6, a transparent protective layer 7 is provided so as to cover all the components. The transparent protective layer 7 may be configured to cover only a part of each component. The insulating layer 5 and the transparent protective layer 7 may be made of the same material or different materials. The material constituting the insulating layer 5 and the transparent protective layer 7 is preferably a material having high surface hardness and high heat resistance, and a known photosensitive siloxane resin material, acrylic resin material, or the like is used.

Examples of embodiments formed in the course of the manufacturing method of the present invention include the embodiments shown in FIGS.
FIG. 9 is a top view showing an example of the tempered glass 11 in which the opening 8 is formed. FIG. 10 is a top view showing an example of the front plate on which the decorating material 2a is formed. FIG. 11 is a top view showing an example of a front plate on which the first transparent electrode pattern 3 is formed. FIG. 12 is a top view showing an example of the front plate on which the second transparent electrode pattern 4 is formed. FIG. 13 is a top view showing an example of a front plate on which conductive elements 6 different from the first and second transparent electrode patterns are formed. These show examples embodying the above description, and the scope of the present invention is not limitedly interpreted by these drawings.

  An electrostatic capacitance type input device and an image display device including the electrostatic capacitance type input device as components are “latest touch panel technology” (issued July 6, 2009, Techno Times Co., Ltd.), Mitani. The structure disclosed in Yuji's supervision, “Touch Panel Technology and Development”, CMC Publishing (2004.12), FPD International 2009 Forum T-11 Lecture Textbook, Cypress Semiconductor Corporation Application Note AN2292, etc. can be applied. .

6). Information display device The information display device of the present invention has the touch panel of the present invention. It is effective to use the touch panel of the present invention as an OGS type touch panel.
The information display device that can use the touch panel of the present invention is preferably a mobile device, and examples thereof include the following information display devices.
iPhone4 (registered trademark), iPad (registered trademark) (manufactured by Apple Inc., USA), Xperia (SO-01B) (manufactured by Sony Ericsson Mobile Communications Co., Ltd.), Galaxy S (SC-02B), Galaxy Tab ( SC-01C (above, manufactured by Korea Samsung Electronics Co., Ltd.), BlackBerry 8707h (manufactured by Kankoku Research in Motion), Kindle (manufactured by Amazon, USA), Kobo Touch (manufactured by Rakuten, Inc.).

  The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, “part” and “%” are based on mass.

(Measuring method)
In this example, each measured value was measured by the following method.

<T body / D body ratio>
The T-body / D-body ratio is measured by the following method with reference to the method described in “Silicon Handbook Chapter 20 (Kunio Ito, Nikkan Kogyo Shimbun)”.
^{Using 29} Si-NMR (ECP400 manufactured by JEOL Ltd.), the T-body / D-body ratio of the silicone resin was determined from the peak area ratio of ²⁹ Si-NMR. ²⁹ Si-NMR measurement conditions were as follows: 10 mmφ sample tube made of PTFE, probe: T10, resonance frequency 79.42 MHz, pulse width 10 μsec, waiting time 20 sec, integration time 1,500 times, relaxation reagent: Cr (acac) ₃ 0.1 wt%, external standard sample: Tetramethylsilane. The chemical shift of ²⁹ Si-NMR derived from each structure is as follows: D-form: -20 to -25 ppm
T-form: -60 to -70 ppm

<Weight average molecular weight, number average molecular weight>
In this example, the molecular weight of the polymer component was measured as a polystyrene-reduced weight average molecular weight or number average molecular weight measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent. Specifically, the measurement was performed under the following conditions.
Column: GPC column TSKgelSuper HZM-H (manufactured by Tosoh Corporation)
・ Solvent: Tetrahydrofuran ・ Standard: Monodisperse polystyrene

(Production of silicone resins R1 to R12)
<Synthesis Example 1>
In a reaction vessel equipped with a stirrer, condenser, thermometer and jacket for heating and cooling, 477 parts of toluene, 478.5 parts of triethoxymethylsilane (manufactured by Tokyo Chemical Industry Co., Ltd.) and 34.8 parts of dichlorodimethylsilane (Tokyo Chemical Industry Co., Ltd.) was charged and stirred to be uniform.
Next, 200 parts of pure water was added dropwise for hydrolysis. Thereafter, the temperature was raised to 50 ° C. with stirring, and stirring was continued for 80 minutes while maintaining the temperature constant at a reflux state. Next, the reaction solution was allowed to stand to separate the organic layer and the aqueous layer. 200 parts of pure water was added to this and washed with water. Again, static separation was performed to obtain 500 parts of a toluene solution of a pale yellow transparent silicone resin. Further, toluene was added to obtain a solution (R1) having a silicone resin content of 30% by mass.

<Synthesis Examples 2-6>
A solution of silicone resins R2 to R6 was obtained in the same manner as in Synthesis Example 1 except that the addition amounts of triethoxymethylsilane and dichlorodimethylsilane were changed as shown in Table 1.
The numerical value in Table 1 has shown the mass part of the active ingredient of each compound added.
Moreover, the T body / D body ratio in Table 1 shows the measured value by the above measuring method.

<Synthesis Examples 7-12>
Silicone resins R7 to R12 were obtained in the same manner as in Synthesis Example 1 except that the silane compound used was changed from triethoxymethylsilane and dichlorodimethylsilane to the compounds shown in Table 2.

Details of the compounds described in Table 2 are as follows.
Methyltrimethoxysilane, Tokyo Kasei Co., Ltd. Trimethoxyphenylsilane, Tokyo Kasei Co., Ltd. dichlorodimethylsilane, Tokyo Kasei Co., Ltd. dichloro (methyl) phenylsilane, Tokyo Kasei Co., Ltd. Table 2 Indicates the part by mass of the active ingredient of each added compound, and “-” indicates that the component is not contained.
Moreover, the T body / D body ratio in Table 2 shows the measured value by the above measurement.

(Examples 1 to 21 and Comparative Examples 1 to 9)
<Preparation of white decoration material>
[White colored liquid (white resin composition) and black colored liquid for light shielding layer (preparation of light shielding layer forming composition)]
The white colored liquids (white resin composition) 1 to 26 described in Table 3 and Table 4 below and the black colored liquids (light shielding layer forming compositions) 1 and 2 described in Table 5 below are Prepared using materials. Numerical values in Tables 3 to 5 indicate parts by mass of the active ingredient relative to the total mass of each colored liquid, and “-” indicates that the component is not contained.

Details of the compounds described in Tables 3 to 5 are as follows.
White pigment dispersion 1 (FP White AD4035, manufactured by Sanyo Dye Co., Ltd.) (titanium oxide concentration 70%, solid content concentration 73%)

・ White pigment dispersion 2
The following materials were mixed.
Titanium oxide (CR-97, manufactured by Ishihara Sangyo Co., Ltd.): 60.0 parts Dispersant A (described in the synthesis method below): 6.0 parts Xylene: 34.0 parts Zirconia beads (particle size: 0. 5 mm) was added, and dispersion processing was performed at 2000 rpm for 1 hour using a bead mill (BSG-01 manufactured by Imex Co., Ltd.) to obtain a white dispersion 2.

Black pigment dispersion 1 (GC4151, Sanyo Dye Co., Ltd.)
(Carbon black concentration 15%, solid content concentration 20.7%)

・ Black pigment dispersion 2
The following materials were mixed.
Carbon black (manufactured by Mitsubishi Chemical Corporation): 15.0 parts Dispersant A (described below in the synthesis method): 4.8 parts Silicone oil (X-22-4039, manufactured by Shin-Etsu Chemical Co., Ltd.): 3.0 Part Xylene: 77.2 parts The mixture was dispersed in a bead mill for 3 hours using zirconia beads having a diameter of 0.5 mm to obtain a black pigment dispersion.
-Silicone oligomer (X-40-9246, manufactured by Shin-Etsu Silicone Co., Ltd., alkoxysilicone oligomer (100% by mass))

Polymerization catalyst 1 (tetrakis (acetylacetonato) zirconium (IV), manufactured by Wako Pure Chemical Industries, Ltd.)
Polymerization catalyst 2 (D-15, manufactured by Shin-Etsu Chemical Co., Ltd., xylene solution of zinc-containing catalyst (solid content 25% by mass))
Antioxidant (IRGAFOS 168, manufactured by BASF, the following compound)

・ Coating aid (Megafac F-780F, manufactured by DIC Corporation, surfactant methyl ethyl ketone solution (non-volatile content 30% by mass))
Silicone resin 1 (KR300, manufactured by Shin-Etsu Silicone Co., Ltd., the following composition)
Xylene solution of silicone resin (solid content 50% by mass)
Silicone resin 2 (KR311, manufactured by Shin-Etsu Silicone Co., Ltd., the following composition)
Xylene solution of silicone resin (solid content 60% by mass)

-Synthesis of Dispersant A-
In 100 parts of xylene, 45.8 parts of KF-2001 (manufactured by Shin-Etsu Chemical Co., Ltd.), 53.3 parts of KF-2012 (manufactured by Shin-Etsu Chemical Co., Ltd.) and 0.9 part of methacrylic acid are dissolved and polymerized. An initiator (dimethyl-2,2′-azobis (2-methylpropionate), V-601, manufactured by Wako Pure Chemical Industries, Ltd.) was dissolved in a ratio of 0.3 mol% with respect to the total polymerization components, and the reaction was performed in a nitrogen atmosphere. Polymerization was performed at 80 ° C. On the way, after 2 hours from the start of polymerization, 0.3 mol% of a polymerization initiator (V-601) was added in a ratio to the total polymerization components, and the polymerization was performed for a total of 4 hours. After the polymerization, purification treatment and drying were performed to obtain Dispersant A (weight average molecular weight 40,000).

KF-2001 is a structure represented by the following formula (R ^A represents an arbitrary linking group, a1 and a2 represent natural numbers), and has a functional group equivalent of 1,900 (g / mol). is there.

  KF-2012 is a structure represented by the following formula (R represents an arbitrary substituent or linking group, n represents a natural number), and KF-2012 has a functional group equivalent of 4,600 (g / mol).

[Production of transfer material for decoration material formation]
-Preparation of release film-
The following release film was prepared as a temporary support with a release layer of a transfer material.
Unipeel TR6 (manufactured by Unitika Ltd., having a olefin-based release layer in which a matting agent is raised 200 nm from the release layer on a 75 μm thick PET film.)

-Preparation of protective film-
Next, the following protective films were prepared.
Alphan-501 (manufactured by Oji F-Tex Co., Ltd., 12 μm thick polypropylene film)

[Preparation of color material layer (transfer layer comprising light-shielding layer and white layer) on temporary support]
Using an extrusion coater, dry thickness of the black colored liquid 1 or 2 for the light shielding layer described in Tables 3 to 5 above for forming the light shielding layer on the release layer of the temporary support with the release layer. It apply | coated so that it might become 3.0 micrometers, and was dried.
On the light shielding layer, any one of the white colored liquids 1 to 26 described in the above table for forming a white layer was applied to a dry thickness of 40.0 μm and dried. The above protective film was pressure-bonded on the white layer.
In this way, transfer materials 1 to 30 composed of the light shielding layer and the white layer described in Table 6 below, in which the temporary support, the light shielding layer, and the white layer were integrated, were produced. The obtained transfer materials 1 to 30 were used as transfer materials for forming decorative materials of Examples 1 to 21 and Comparative Examples 1 to 9, respectively.

(Examples 101-121 and Comparative Examples 101-109)
<Preparation of base material with decorating material (Example 101)>
A rotating brush having nylon bristles while spraying glass tempered glass (300 mm × 400 mm × 0.7 mm) with an opening (15 mmΦ) as shown in FIG. Washed with. This glass substrate was preheated at 90 ° C. for 2 minutes with a substrate preheating apparatus.
The transfer material 1 in which the light shielding layer and the white layer of Example 1 were laminated on the glass substrate was formed into a frame shape having a size corresponding to the four sides of the glass substrate, and then transferred. Thereafter, the temporary support of the transfer material 1 was peeled off. In order to cure the light-shielding layer and the white layer, the obtained film is heated together with the glass substrate (substrate) at 150 ° C. for 30 minutes, and further subjected to heat treatment three times in the order of 240 ° C. for 30 minutes and 280 ° C. for 40 minutes, The base material with a white decorating material of Example 101 which has a white decorating material formed by heating a white layer was obtained.

<Preparation of base material with decorating material (Examples 102 to 121 and Comparative Examples 101 to 109)>
In Example 101, Examples 102 to 121 in which a light-shielding layer and a white layer were formed on a glass substrate, as in Example 101, except that the transfer material used was changed as described in Table 7 below. The base material with a white decorating material of Comparative Examples 101-109 was obtained.

<Evaluation>
The evaluation method of the characteristic of the base material with a white decorating material of each Example and comparative example obtained above is shown below. The obtained results are shown in Table 7 below.

[Evaluation of heat resistance by coloring (cracking)]
About the base material with a decorating material of each Example and a comparative example, the presence or absence of the crack was observed visually.
The evaluation results were evaluated as follows by sensory evaluation.
A: No cracks can be confirmed visually.
B: Several slight cracks are recognized at the end.
(Levels that can be corrected with ink etc.)
C: Cracks are observed on the entire surface.
The crack level is practically required to be A or B evaluation, and is preferably A.
The obtained results are shown in Table 7 below.

(Peelability evaluation)
About the transfer film of each Example and a comparative example, the peelability of the temporary support body was evaluated.
A: The temporary support is peeled off smoothly, and the decorative material is not chipped.
B: Although sound is produced when the temporary support is peeled off, the decorative material is not chipped.
C: Chatter noise was generated when the temporary support was peeled off, and the decorative material was chipped.
As the level of peelability, A and B evaluations are practically necessary, and A is preferable.
The obtained results are shown in Table 7 below.

From Table 7, the base material with a white decorating material produced by Examples 101-121 is a level which the crack after a heating cannot be confirmed visually, or it can correct, and the white paneling for front plate integrated touch panels is used. It was preferable as a decoration material.
On the other hand, since the base material with a white decorating material produced by Comparative Examples 101-109 shows cracks on the entire surface after heating, it is not preferable as a white decorating material for a front panel integrated touch panel.

(Correction of base material with decorating material with cracks)
A white colored liquid 4 was applied to the cracked portion with a brush with respect to the base material with a decorating material of Example 101 in which a few slight cracks were observed at the end, and the crack was not visible. The modified base material with a decorating material was heated at 150 ° C. for 30 minutes and further heat-treated in the order of 240 ° C. for 30 minutes, and the obtained base material with a decorating material was used for the subsequent evaluation.
About the base material with a decorating material of Example 106, the correction of the crack similar to Example 101 was given using the white coloring liquid 10, and it used for subsequent evaluation.
About the base material with a decorating material in another Example or a comparative example, it did not modify in particular but was used as it was.

(Example 201: Production of touch panel)
<Formation of first transparent electrode pattern>
(Formation of transparent electrode layer)
The substrate with white decorating material of Example 101 was introduced into a vacuum chamber, and a DC magnetron was used using an ITO target (indium: tin = 95: 5 (molar ratio)) with a SnO ₂ content of 10% by mass. A 40 nm thick ITO thin film was formed by sputtering (conditions: substrate temperature 250 ° C., argon pressure 0.13 Pa, oxygen pressure 0.01 Pa) to obtain a front plate on which a transparent electrode layer was formed. The surface resistance of the ITO thin film was 80Ω / □.

[Formation of first transparent electrode pattern]
The front plate on which the white decorative material, the light shielding layer, and the transparent electrode layer were formed was washed, and the transfer film E1 for etching from which the protective film was removed was laminated (base material temperature: 130 ° C., rubber roller temperature 120 ° C., linear pressure 100 N). / Cm, conveyance speed 2.2 m / min). After peeling off the temporary support, the distance between the surface of the exposure mask (quartz exposure mask having a transparent electrode pattern) and the aforementioned photocurable resin layer for etching is set to 200 μm, and the exposure dose is 50 mJ / cm ² (i-line). ) For pattern exposure.

-Preparation of transfer film E1 for etching-
A thermoplastic resin layer and an intermediate layer were formed on the temporary support by the following method.
On a 75 μm thick polyethylene terephthalate film temporary support, a coating solution for a thermoplastic resin layer having the following formulation H1 was applied and dried using a slit nozzle. Next, an intermediate layer coating solution having the following formulation P1 was applied and dried.

-Coating liquid for thermoplastic resin layer: Formulation H1-
Methanol: 11.1 parts by mass Propylene glycol monomethyl ether acetate: 6.36 parts by mass Methyl ethyl ketone: 52.4 parts by mass Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymerization composition ratio) (Molar ratio) = 55 / 11.7 / 4.5 / 28.8, molecular weight = 100,000, Tg≈70 ° C.): 5.83 parts by mass Styrene / acrylic acid copolymer (copolymerization composition ratio (mol) Ratio) = 63/37, weight average molecular weight = 10,000, Tg≈100 ° C.): 13.6 parts by mass Monomer (trade name: BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.): 9.1 parts by mass・ Coating aid (Megafac F-780F, manufactured by DIC Corporation): 0.54 parts by mass

The viscosity at 120 ° C. after removing the solvent from the coating liquid H1 for the thermoplastic resin layer was 1,500 Pa · sec.
Next, a triethanolamine developer (containing 30% by mass of triethanolamine, a trade name: T-PD2 (manufactured by FUJIFILM Corporation) diluted 10 times with pure water) at 25 ° C. for 100 seconds, A surfactant-containing cleaning solution (trade name: T-SD3 (manufactured by FUJIFILM Corporation) diluted 10-fold with pure water) was treated at 33 ° C. for 20 seconds, using a rotating brush and an ultra-high pressure cleaning nozzle. Residue removal of the thermoplastic resin layer and intermediate layer is performed, and further post-baking treatment at 130 ° C. for 30 minutes to form a white decorating material, a light shielding layer, a transparent electrode layer, and a photocurable resin layer pattern for etching A front plate was obtained.

A front plate on which a white decorative material, a light shielding layer, a transparent electrode layer, and a photocurable resin layer pattern for etching are formed is immersed in an etching tank containing ITO etchant (hydrochloric acid, potassium chloride aqueous solution, liquid temperature 30 ° C.). , 100 seconds of treatment, dissolving and removing the exposed transparent electrode layer not covered with the photocurable resin layer for etching, transparent electrode layer with white layer, light-shielding layer, photocurable resin layer pattern for etching A front plate with a pattern was obtained.
Next, a front plate with a transparent electrode layer pattern with a photocurable resin layer pattern for etching was applied to a resist stripping solution (N-methyl-2-pyrrolidone, monoethanolamine, surfactant (trade name: Surfynol 465). Manufactured by Air Products) in a resist stripping tank containing a liquid temperature of 45 ° C.), treated for 200 seconds to remove the photo-curable resin layer for etching, the white layer, the light-shielding layer, and the front plate A front plate was obtained in which the first transparent electrode pattern placed as shown in FIG. 5 was formed across both areas of the contact surface and the surface of the light-shielding layer opposite to the front plate.

(Formation of insulating layer)
-Preparation of transfer film W1 for forming an insulating layer-
In the production of the etching transfer film E1, the temporary support and the thermoplastic resin were prepared in the same manner as in the preparation of the etching transfer film E1, except that the above-described etching resist E1 was replaced with an insulating layer forming coating solution having the following formulation W1. Layer, intermediate layer (oxygen barrier film), insulating layer photocurable resin layer and protective film were integrated to obtain an insulating layer forming transfer film W1 (film thickness of insulating layer photocurable resin layer) Is 1.4 μm).

-Coating liquid for insulating layer formation: Formula W1-
Binder 3 (cyclohexyl methacrylate (a) / methyl methacrylate (b) / methacrylic acid copolymer (c) glycidyl methacrylate adduct (d) (composition (% by mass): a / b / c / d = 46/1) / 10/43, weight average molecular weight: 36,000, acid value 66 mgKOH / g) 1-methoxy-2-propanol, methyl ethyl ketone solution (solid content: 45%)): 12.5 parts by mass DPHA (dipentaerythritol Hexaacrylate, manufactured by Nippon Kayaku Co., Ltd.) propylene glycol monomethyl ether acetate solution (non-volatile content: 76% by mass): 1.4 parts by mass / urethane monomer (trade name: NK Oligo UA-32P, Shin-Nakamura Chemical Co., Ltd. ), Non-volatile content 75% by mass, propylene glycol monomethyl ether acetate 25% by mass): 0 68 parts by mass, tripentaerythritol octaacrylate (trade name: V # 802, manufactured by Osaka Organic Chemical Industry Co., Ltd.): 1.8 parts by mass, diethylthioxanthone: 0.17 parts by mass, 2- (dimethylamino) -2 -[(4-Methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone (trade name: Irgacure 379, manufactured by BASF): 0.17 parts by mass Dispersant (trade name: Solsperse 20000, manufactured by Avicia Co., Ltd.): 0.19 parts by mass. Surfactant (trade name: Megafac F-780F, manufactured by DIC Corporation): 0.05 parts by mass. Methyl ethyl ketone: 23.3 parts by mass. Propylene glycol. Monomethyl ether acetate: 59.8 parts by mass The viscosity at 100 ° C. after removing the solvent of the coating liquid W1 for forming the insulating layer is 4,000 Pa. Was sec.

The white decorative material, the light shielding layer, and the front plate with the first transparent electrode pattern were washed and laminated with the transfer film W1 for forming the insulating layer from which the protective film was removed (base temperature: 100 ° C., rubber roller temperature) 120 ° C., linear pressure 100 N / cm, transport speed 2.3 m / min). After peeling off the temporary support, the distance between the exposure mask (quartz exposure mask having the insulating layer pattern) surface and the photocurable resin layer for etching is set to 100 μm, and the exposure dose is 30 mJ / cm ² ( Pattern exposure was performed with i-line).
Next, a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fuji Film Co., Ltd.) diluted 10 times with pure water) at 33 ° C. for 60 seconds, Sodium carbonate / sodium bicarbonate developer (trade name: T-CD1 (manufactured by FUJIFILM Corporation) diluted 5 times with pure water) at 25 ° C. for 50 seconds, surfactant-containing cleaning solution (trade name) : T-SD3 (manufactured by FUJIFILM Corporation) diluted 10 times with pure water) was treated at 33 ° C. for 20 seconds, and the residue was removed with a rotating brush and an ultra-high pressure washing nozzle. Then, a post-baking treatment for 60 minutes was performed to obtain a front plate on which a white decorative material, a light shielding layer, a first transparent electrode pattern, and an insulating layer pattern were formed.

[Formation of second transparent electrode pattern]
-Formation of transparent electrode layer-
In the same manner as the formation of the first transparent electrode pattern, the front plate on which the white decorative material, the light shielding layer, the first transparent electrode pattern, and the insulating layer pattern are formed is subjected to DC magnetron sputtering treatment (condition: substrate temperature 50 An ITO thin film having a thickness of 80 nm was formed by forming a white decorative material, a light shielding layer, a first transparent electrode pattern, an insulating layer pattern, and a transparent electrode layer. A front plate was obtained. The surface resistance of the ITO thin film was 110Ω / □.

In the same manner as the formation of the first transparent electrode pattern, using the etching transfer film E1, the white decorative material, the light shielding layer, the first transparent electrode pattern, the insulating layer pattern, the transparent electrode layer, the photocuring property for etching. A front plate on which a resin layer pattern was formed was obtained (post-bake treatment; 130 ° C., 30 minutes).
Further, in the same manner as the formation of the first transparent electrode pattern, the white decorative material is obtained by etching (30 ° C., 50 seconds) and removing the photocurable resin layer for etching (45 ° C., 200 seconds). 5 across the regions of the light shielding layer, the first transparent electrode pattern, the insulating layer pattern, the non-contact surface of the front plate and the surface of the light shielding layer opposite to the front plate. A front plate on which a second transparent electrode pattern placed on the substrate was formed was obtained.

[Formation of conductive elements different from the first and second transparent electrode patterns]
In the same manner as the formation of the first and second transparent electrode patterns, the front plate on which the white decorative material, the light shielding layer, the first transparent electrode pattern, the insulating layer pattern, and the second transparent electrode pattern are formed is DC. A front plate on which an aluminum (Al) thin film having a thickness of 200 nm was formed was obtained by magnetron sputtering.

In the same manner as the formation of the first and second transparent electrode patterns, using the etching transfer film E1, a white decorative material, a light shielding layer, a first transparent electrode pattern, an insulating layer pattern, a second transparent A front plate on which an electrode pattern, an aluminum thin film, and a photocurable resin layer pattern for etching were formed was obtained (post-bake treatment; 130 ° C., 30 minutes).
Further, in the same manner as the formation of the first transparent electrode pattern, the white decorative material is obtained by etching (30 ° C., 50 seconds) and removing the photocurable resin layer for etching (45 ° C., 200 seconds). A front plate on which a conductive element different from the light shielding layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the first and second transparent electrode patterns was formed was obtained.

(Formation of transparent protective layer)
In the same manner as the formation of the insulating layer, the insulating film forming transfer film W1 from which the protective film has been removed is laminated to the front plate formed up to the conductive element different from the first and second transparent electrode patterns, and temporarily supported. After peeling off the body, the whole surface is exposed with an exposure amount of 50 mJ / cm ² (i-line) without going through an exposure mask, and development, post-exposure (1000 mJ / cm ² ), post-baking treatment are performed, and white decorative material and light shielding are performed. Layer, first transparent electrode pattern, insulating layer pattern, second transparent electrode pattern, insulating layer (transparent protective layer) so as to cover all of the conductive elements different from the first and second transparent electrode patterns A front plate laminated as shown in FIG. 5 was obtained. The obtained front plate can be used as a capacitive input device.

<Production of image display device (touch panel)>
The liquid crystal display element manufactured by the method described in JP2009-47936A, paragraph 0097 to paragraph 0119 is bonded to the previously manufactured front plate (capacitance type input device), and the capacitance is determined by a known method. An image display device of Example 201 including a mold input device as a constituent element was produced.
It implemented by producing an image display device using the base material with a white decorating material of Examples 102-121 and comparative examples 101-109 instead of the base material with the white decorating material of Example 101. The image display devices of Examples 202 to 221 and Comparative Examples 201 to 209 were manufactured.

<Overall evaluation of front plate and image display device>
In the image display devices of Examples 201-221, in each of the above-described steps, the white decorative material, the light shielding layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, the first and second transparent The front plate (capacitive input device) on which conductive elements different from the electrode pattern are formed has no dirt on the opening and the back surface, is easy to clean, and has no problem of contamination of other members. It was.
Moreover, there was no pinhole in the white decorative material, and there was no problem with unevenness. Similarly, the light-shielding layer has no pinholes and is excellent in light shielding properties, and there is no problem in appearance.
And there is no problem in each electroconductivity of a 1st transparent electrode pattern, a 2nd transparent electrode pattern, and an electroconductive element different from these, On the other hand, a 1st transparent electrode pattern and a 2nd Between the transparent electrode patterns, there was insulation.
Furthermore, the transparent protective layer was free from defects such as bubbles, and an image display device excellent in display characteristics and operability was obtained.

On the other hand, in the image display devices of Comparative Examples 201 to 209, cracks are seen in the white decorating material, and there are problems on the appearance, and the light on the back surface leaks out from the cracks, and there is also a problem with light shielding properties. It was observed.
Further, since problems are seen in the operability of the touch panel, the image display device cannot be used.

1: Substrate (film substrate. Only the film substrate may be the front plate)
1G: Glass (cover glass. Only the cover glass may be used as a front plate, and a laminate of a base material and glass may be used as a front plate.)
2a: Decoration material 2b: Light shielding layer 2c: Inclined part 3: Conductive layer (first transparent electrode pattern)
3a: Pad portion 3b: Connection portion 4: Conductive layer (second transparent electrode pattern)
5: Insulating layer 6: Conductive layer (other conductive elements)
7: Transparent protective layer 8: Opening 10: Capacitance type input device 11: Tempered glass C: First direction D: Second direction

Claims (12)

White pigment,
A silicone resin comprising a structure represented by the following formula T and a structure represented by the following formula D; and
Containing a graft type silicone polymer represented by the following formula 1,
The white resin composition, wherein a T-form / D-form ratio represented by the following formula in the silicone resin is 6.4 or less.
T-form / D-form ratio = (molar amount of silicon atom contained in the structure represented by formula T) / (mole amount of silicon atom contained in the structure represented by formula D)

In formula T and formula D, R ^T1 , R ^D1 , and R ^D2 each independently represent an alkyl group, an aryl group, an allyl group, or a hydrogen atom, and the wavy line represents a bonding site with another structure. Represent.

In Formula 1, R ^{1 to} R ¹⁰ each independently represents a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and R ¹¹ and R ¹² each independently represent an arylene group or 1 carbon atom. Represents an alkylene group of -3, R ¹³ and R ¹⁴ each independently represent a single bond or a divalent organic linking group, A represents a group having a pigment adsorption site, and B represents the following formula 2. Represents a group having a structure, and l and n each independently represents an integer of 1 or more, and m represents an integer of 0 or more.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more. The white resin composition according to claim ¹ , wherein R ^T1 , R ^D1 , and R ^D2 are each independently a methyl group or a phenyl group.   The white resin composition of Claim 1 or 2 which contains the said silicone resin 30 mass% or more with respect to the total solid of a white resin composition. The white resin composition according to any one of claims 1 to 3, wherein the graft-type silicone polymer represented by the formula 1 is a compound represented by the following formula 3.

In Formula 3, R ¹¹ and R ¹² each independently represent an arylene group or an alkylene group having 1 to 3 carbon atoms, R ¹³ and R ¹⁴ each independently represent a single bond or a divalent organic linking group, A ¹ is an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, a heterocyclic group, an amide group, an alkoxysilyl group, Represents a group having a pigment adsorption site having at least one group selected from the group consisting of an epoxy group, an isocyanato group, a hydroxy group, and a thiol group, and B represents a group having a structure represented by the following formula 2. , L, m1 and n each independently represents an integer of 1 or more.

In Formula 2, R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a hydroxy group, an aryl group, or an alkyl group having 1 to 3 carbon atoms, and k represents an integer of 1 or more. A transfer material comprising a white layer on a temporary support, wherein the white layer is made of the white resin composition according to claim 1.   The transfer material according to claim 5, further comprising a light shielding layer between the temporary support and the white layer. It has a substrate, a white layer, and a light shielding layer in this order,
The said white layer was produced with the white resin composition of any one of Claims 1-4, The base material characterized by the above-mentioned. A substrate made of the transfer material according to claim 5 or 6.   The base material according to claim 7 or 8, further comprising a conductive layer on the side of the light shielding layer opposite to the substrate.   The substrate according to any one of claims 7 to 9, which is used for decoration. The touchscreen characterized by including the base material of any one of Claims 7-10. An information display device comprising the touch panel according to claim 11.