JP6351424B2 - Electronic components - Google Patents

Electronic components Download PDF

Info

Publication number
JP6351424B2
JP6351424B2 JP2014156978A JP2014156978A JP6351424B2 JP 6351424 B2 JP6351424 B2 JP 6351424B2 JP 2014156978 A JP2014156978 A JP 2014156978A JP 2014156978 A JP2014156978 A JP 2014156978A JP 6351424 B2 JP6351424 B2 JP 6351424B2
Authority
JP
Japan
Prior art keywords
base
circuit board
flexible circuit
electronic component
rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014156978A
Other languages
Japanese (ja)
Other versions
JP2016033995A (en
Inventor
雲 趙
雲 趙
木下 茂明
茂明 木下
義之 川嶌
義之 川嶌
Original Assignee
帝国通信工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 帝国通信工業株式会社 filed Critical 帝国通信工業株式会社
Priority to JP2014156978A priority Critical patent/JP6351424B2/en
Publication of JP2016033995A publication Critical patent/JP2016033995A/en
Application granted granted Critical
Publication of JP6351424B2 publication Critical patent/JP6351424B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

本発明は、摺動子を取り付けた移動体を円弧状に移動させることで検出出力を変化させる電子部品に関するものである。   The present invention relates to an electronic component that changes a detection output by moving a moving body to which a slider is attached in an arc shape.

従来、例えば一眼レフカメラの絞り、ズーム、ピント等の調整のための操作手段として、スライド式の電子部品が利用されている。この種の電子部品は、例えば特許文献1の図16に示すように、フレキシブル回路基板(40)を、金型(10),(30)の円弧状に湾曲するキャビティー(C)内に収納し、キャビティー(C)内のフレキシブル回路基板(40)の下面側から溶融成形樹脂を充填することで、図12に示すような基台付き基板(1−2)を作成し、この基台付き基板(1−2)の前記フレキシブル回路基板(40)を露出した側に、摺動子(150)を取り付けた移動体(130)を取り付けて構成される。   Conventionally, slide-type electronic components have been used as operation means for adjusting, for example, the aperture, zoom, and focus of a single-lens reflex camera. In this type of electronic component, for example, as shown in FIG. 16 of Patent Document 1, the flexible circuit board (40) is accommodated in a cavity (C) that is curved in an arc shape of the molds (10) and (30). Then, by filling the molding resin from the lower surface side of the flexible circuit board (40) in the cavity (C), a base board (1-2) as shown in FIG. A movable body (130) with a slider (150) attached is attached to the side of the attached board (1-2) where the flexible circuit board (40) is exposed.

そしてこの電子部品(100)の移動体(130)は、そのレール係合部(131)を基台(60)のレール部(61)に係合することで、円弧状にスライド移動可能となっており、これによってフレキシブル回路基板(40)に形成した摺接パターン(43),(45)上を摺動子(150)が摺動してその検出出力を変化させる。この種のスライド式の電子部品(100)は、例えば、一眼レフカメラの望遠ズームレンズの外筒に取り付けられ、前述のように、絞り、ズーム、ピント等の調整のために使用される。   The moving body (130) of the electronic component (100) can be slid in an arc shape by engaging the rail engaging portion (131) with the rail portion (61) of the base (60). As a result, the slider (150) slides on the sliding contact patterns (43) and (45) formed on the flexible circuit board (40) to change the detection output. This type of slide-type electronic component (100) is attached to, for example, an outer cylinder of a telephoto zoom lens of a single-lens reflex camera, and is used for adjusting a diaphragm, zoom, focus, and the like as described above.

特開2011−135005号公報JP 2011-135005 A

しかしながら、上記従来の電子部品(100)に用いる基台付き基板(1−2)においては、以下のような問題点があった。
(1)上記電子部品(100)の製造方法は、図16に示すように、キャビティー(C)を形成する円弧の外周面側と内周面側に金型(10),(30)を配置してその中にフレキシブル回路基板(40)を設置し、その際フレキシブル回路基板(40)の両端を金型(10),(30)のキャビティーCの両外側部分で挟持する構造なので、円弧の範囲が180°以下に限られてしまい、180°以上の円弧を有する基台付き基板を製造することは困難であった。従って、上記基台付き基板(1−2)においては、移動体(130)(即ち摺動子(150))の移動範囲が180°以内に限られてしまう。これらのことから、180°以上の移動範囲で移動体(摺動子)を移動できる、構造の簡単な電子部品が望まれていた。
However, the substrate with base (1-2) used for the conventional electronic component (100) has the following problems.
(1) As shown in FIG. 16, the manufacturing method of the electronic component (100) includes molds (10) and (30) on the outer peripheral surface side and the inner peripheral surface side of the arc forming the cavity (C). Since the flexible circuit board (40) is disposed and the flexible circuit board (40) is placed between the outer sides of the cavities C of the molds (10) and (30), The range of the arc is limited to 180 ° or less, and it has been difficult to manufacture a substrate with a base having an arc of 180 ° or more. Therefore, in the substrate with base (1-2), the moving range of the moving body (130) (that is, the slider (150)) is limited to 180 ° or less. For these reasons, there has been a demand for an electronic component with a simple structure that can move a moving body (slider) within a moving range of 180 ° or more.

(2)上記電子部品(100)の場合、移動体(130)は円弧状に形成した基台付き基板(1−2)の外周面側を移動する構成である。しかしながら、この種の電子部品を組み込む電子機器の構造によっては、基台付き基板の内周面側に設置した移動体を前記内周面に沿って移動させることでその電気的出力を変化できる、構造が簡単で組み立てが容易な電子部品が望まれていた。 (2) In the case of the electronic component (100), the moving body (130) is configured to move on the outer peripheral surface side of the base-equipped substrate (1-2) formed in an arc shape. However, depending on the structure of the electronic device incorporating this type of electronic component, the electrical output can be changed by moving the movable body installed on the inner peripheral surface side of the base-equipped substrate along the inner peripheral surface. An electronic component having a simple structure and easy to assemble has been desired.

本発明は上述の点に鑑みてなされたものでありその目的は、円弧状に設置したフレキシブル回路基板の内周面側を移動体が移動することができ、且つ移動体の移動範囲(摺動子の摺動範囲)を容易に180°以上にすることができる、構造が簡単で組み立ての容易な電子部品を提供することにある。   The present invention has been made in view of the above-described points, and an object of the present invention is to allow the moving body to move on the inner peripheral surface side of the flexible circuit board installed in an arc shape, and to move the moving body (sliding). It is an object of the present invention to provide an electronic component with a simple structure and easy assembly that allows the sliding range of the child to be easily 180 ° or more.

本発明にかかる電子部品は、内周面が円弧状の基板取付面となっている基台と、前記基台の基板取付面に取り付けられるフレキシブル回路基板と、前記フレキシブル回路基板の内周面に沿うように移動する移動体と、前記移動体に取り付けられて前記フレキシブル回路基板の内周面に設けた摺接パターンに摺接する摺動子と、を具備し、前記基台の円周方向に沿う一方の端辺側に、前記移動体の一方の端辺側に設けた係止部をスライド自在に係止する第1レール部を設け、さらに前記基台の円周方向に沿う他方の端辺側に、前記移動体の他方の端辺側に設けた係止部をスライド自在に係止する第2レール部を形成してなるカバーを取り付けたことを特徴とする。
本発明によれば、円弧状に設置したフレキシブル回路基板の内周面側を移動体が移動する構成の電子部品を容易に構成することができる。移動体をフレキシブル回路基板の内周面側に配置するので、移動体をフレキシブル回路基板の外周面側に配置する構造に比べて、電子部品の外径寸法の小型化が図れる。また本発明によれば、移動体の両端辺側にそれぞれ設けた係止部を係止するために必要な一対の第1,第2レール部の内、一方の第1レール部のみを、基台の一方の端辺側に設け、他方の第2レール部は別部材であるカバーに設けたので、180°以上の円弧からなる基板取付面を有する基台を容易に製造することが可能になる(仮に、基板取付面からその円弧の中心方向に向かって突出する上記第1,第2レール部を、基台の両端辺側に一体成型で設け、且つ基台を円弧状に成形する場合は、円弧が180°を超えると、その成形が金型上困難になる)。これによって移動体の移動範囲(摺動子の摺動範囲)を容易に180°以上とすることができる。またこの電子部品はその構造が簡単で、容易に組み立てができる。
An electronic component according to the present invention includes a base having an arcuate board mounting surface on an inner peripheral surface, a flexible circuit board attached to the board mounting surface of the base, and an inner peripheral surface of the flexible circuit board. A movable body that moves along the sliding body, and a slider that is attached to the movable body and that slides on a sliding contact pattern provided on the inner peripheral surface of the flexible circuit board, and in the circumferential direction of the base A first rail portion is provided on one end side along which the locking portion provided on one end side of the movable body is slidably locked, and the other end along the circumferential direction of the base is further provided. A cover formed by forming a second rail portion for slidably locking a locking portion provided on the other end side of the movable body is attached to the side.
ADVANTAGE OF THE INVENTION According to this invention, the electronic component of the structure to which a mobile body moves the inner peripheral surface side of the flexible circuit board installed in circular arc shape can be comprised easily. Since the movable body is disposed on the inner peripheral surface side of the flexible circuit board, the outer diameter of the electronic component can be reduced as compared with the structure in which the movable body is disposed on the outer peripheral surface side of the flexible circuit board. Further, according to the present invention, only one of the pair of first and second rail portions necessary for locking the locking portions provided on both ends of the movable body is used as a base. Since it is provided on one end side of the base and the other second rail part is provided on a cover which is a separate member, it is possible to easily manufacture a base having a substrate mounting surface made of an arc of 180 ° or more. (If the first and second rail portions projecting from the board mounting surface toward the center of the arc are integrally formed on both ends of the base, and the base is formed in an arc shape. If the arc exceeds 180 °, the molding becomes difficult on the mold). Thereby, the moving range of the moving body (sliding range of the slider) can be easily set to 180 ° or more. This electronic component has a simple structure and can be easily assembled.

また本発明は、前記基台が、略円筒状に形成されて、その内周面を前記基板取付面とし、この基台の一方の端辺には、前記基台の内周面に対して中心方向に向かって突出する第1レール形成部を設け、一方前記カバーには、このカバーを前記基台の他方の端辺に取り付けた際に、前記基台の内周面に対して中心方向に向かって突出する第2レール形成部を設け、前記第1,第2レール形成部にそれぞれ前記第1,第2レール部を形成したことを特徴としている。
これによって、移動体(摺動子)を略360°(更には360°以上)回転することができる。また基台の内周面に対して中心方向に向かって突出する第1,第2レール形成部を基台とカバーの両者に1つずつ形成したので、略円筒状に形成される基台とカバーの両者の製造が何れも容易に行える。また第1,第2レール形成部を基台の内周面に対して中心方向に向かって突出して設け、これら第1,第2レール形成部に第1,第2レール部を形成したので、移動体全体をフレキシブル回路基板の内周側露出面よりも半径方向内側に位置させることができ、略360°にわたって回転する移動体にフレキシブル回路基板(特にフレキシブル回路基板の外部への引出部の部分)が干渉することを容易に避けることができる。
Further, in the present invention, the base is formed in a substantially cylindrical shape, and the inner peripheral surface thereof is the substrate mounting surface, and one end side of the base is on the inner peripheral surface of the base. A first rail forming portion projecting toward the central direction is provided, while the cover has a central direction with respect to the inner peripheral surface of the base when the cover is attached to the other end of the base. A second rail forming portion that protrudes toward the center is provided, and the first and second rail portions are formed on the first and second rail forming portions, respectively.
As a result, the moving body (slider) can be rotated approximately 360 ° (further 360 ° or more). In addition, since the first and second rail forming portions projecting toward the central direction with respect to the inner peripheral surface of the base are formed on each of the base and the cover, the base formed in a substantially cylindrical shape, Both covers can be easily manufactured. In addition, the first and second rail forming portions are provided so as to protrude toward the central direction with respect to the inner peripheral surface of the base, and the first and second rail forming portions are formed on the first and second rail forming portions. The entire movable body can be positioned radially inward of the inner peripheral side exposed surface of the flexible circuit board, and the movable body rotates approximately 360 ° to the flexible circuit board (particularly, the portion of the lead-out portion to the outside of the flexible circuit board). ) Can easily be avoided.

また本発明は、前記フレキシブル回路基板の一方の端辺に設けた係合部を、前記第1レール形成部に設けた被係合部に係合することによって、このフレキシブル回路基板を前記基台の基板取付面に取り付けることを特徴としている。
このように構成すれば、簡単にフレキシブル回路基板を基台の基板取付面に取り付けることができる。
According to the present invention, an engaging portion provided on one end of the flexible circuit board is engaged with an engaged portion provided on the first rail forming portion, whereby the flexible circuit board is attached to the base. It is characterized by being attached to the board mounting surface.
If comprised in this way, a flexible circuit board can be easily attached to the board | substrate mounting surface of a base.

また本発明は、前記フレキシブル回路基板の一方の端辺を、前記基台内に埋設するようにインサート成形することによって、このフレキシブル回路基板を前記基台の基板取付面に取り付けることを特徴としている。
このように構成すれば、インサート成形によって、容易且つ確実にフレキシブル回路基板の一方の端辺を基台内に埋設して固定することができ、フレキシブル回路基板を基台の基板取付面に取り付けることができる。
Further, the present invention is characterized in that one end side of the flexible circuit board is insert-molded so as to be embedded in the base, thereby attaching the flexible circuit board to the board mounting surface of the base. .
If comprised in this way, one end side of a flexible circuit board can be embedded and fixed in a base easily and reliably by insert molding, and a flexible circuit board is attached to the board mounting surface of a base. Can do.

また本発明は、前記移動体の係止部が、この移動体の外周辺の移動方向の前後において前記第1,第2レール部に挿入される突起によって形成されていることを特徴としている。
移動体の係止部を、この移動体の前後左右の4箇所に設けてこれら4箇所において第1,第2レール部に係合する構造なので、例え第1,第2レール部が円弧状に湾曲していても、移動体の円弧状の移動をスムーズにガイドすることができる。
Further, the present invention is characterized in that the locking portion of the moving body is formed by a protrusion inserted into the first and second rail portions before and after the moving direction of the outer periphery of the moving body.
Since the movable body is provided with four locking portions on the front, rear, left, and right sides of the movable body and engages with the first and second rail portions at these four locations, the first and second rail portions are arcuate, for example. Even if it is curved, the circular movement of the moving body can be smoothly guided.

本発明によれば、円弧状に設置したフレキシブル回路基板の内周面側を移動体が移動する構成とすることができる。これによって電子部品の小型化も図れる。また本発明によれば、移動体の移動範囲(摺動子の摺動範囲)を容易に180°以上にすることができる。また本発明に係る電子部品は、構造が簡単で、組み立てが容易である。   According to this invention, it can be set as the structure which a mobile body moves on the internal peripheral surface side of the flexible circuit board installed in circular arc shape. As a result, the electronic component can be miniaturized. Further, according to the present invention, the moving range of the moving body (sliding range of the slider) can be easily set to 180 ° or more. The electronic component according to the present invention has a simple structure and is easy to assemble.

電子部品1−1の斜視図である。It is a perspective view of the electronic component 1-1. 電子部品1−1を下側から見た斜視図である。It is the perspective view which looked at the electronic component 1-1 from the lower side. 電子部品1−1の分解斜視図である。It is a disassembled perspective view of the electronic component 1-1. 電子部品1−1を下側から見た分解斜視図である。It is the disassembled perspective view which looked at the electronic component 1-1 from the lower side. 図1のA−A部分断面拡大図である。It is an AA partial cross-section enlarged view of FIG. 図1のB−B部分断面拡大図である。It is a BB partial cross-section enlarged view of FIG. 移動体110を拡大して示す図であり、図7(a)は上側から見た斜視図、図7(b)は下側から見た斜視図、図7(c)は側面図である。FIG. 7A is an enlarged view of the moving body 110, FIG. 7A is a perspective view seen from above, FIG. 7B is a perspective view seen from below, and FIG. 7C is a side view. 電子部品1−2の斜視図である。It is a perspective view of the electronic component 1-2. 電子部品1−2を下側から見た斜視図である。It is the perspective view which looked at the electronic component 1-2 from the lower side. フレキシブル回路基板50−2の斜視図である。It is a perspective view of flexible circuit board 50-2. 図8のC−C部分断面拡大図である。It is CC partial cross-section enlarged view of FIG. 図8のD−D部分断面拡大図である。It is DD partial sectional enlarged view of FIG.

以下、本発明の実施形態を図面を参照して詳細に説明する。図1は本発明の第1実施形態に係る電子部品1−1の斜視図、図2は電子部品1−1を下側から見た斜視図、図3は電子部品1−1の分解斜視図、図4は電子部品1−1を下側から見た分解斜視図、図5は図1のA−A部分断面拡大図、図6は図1のB−B部分断面拡大図である。これらの図に示すように、電子部品1−1は、基台10と、フレキシブル回路基板50と、カバー80と、移動体110と、摺動子130とを具備して構成されている。なお以下の説明において、「上」とは基台10からカバー80を見る方向をいい、「下」とはその反対方向をいうものとする。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a perspective view of the electronic component 1-1 according to the first embodiment of the present invention, FIG. 2 is a perspective view of the electronic component 1-1 as viewed from below, and FIG. 3 is an exploded perspective view of the electronic component 1-1. 4 is an exploded perspective view of the electronic component 1-1 as viewed from below, FIG. 5 is an enlarged partial cross-sectional view along AA in FIG. 1, and FIG. 6 is an enlarged partial cross-sectional view along BB in FIG. As shown in these drawings, the electronic component 1-1 includes a base 10, a flexible circuit board 50, a cover 80, a moving body 110, and a slider 130. In the following description, “upper” refers to the direction of viewing the cover 80 from the base 10, and “lower” refers to the opposite direction.

基台10は、合成樹脂の一体成形品であり、円形で略筒状に形成されている。基台10の内周面は、360°円弧状で帯状の基板取付面11となっている。基台10の円周方向に沿う下側の端辺(一方の端辺)13には、基台10の内周面に対して中心方向に向かって突出する(即ち、基板取付面11よりもその円弧の中心方向に向かって突出する)第1レール形成部15が設けられている。第1レール形成部15は、略リング状の平板状であって、360°にわたって形成されている。第1レール形成部15の上面中央には、リング状の凹部(凹溝)からなる第1レール部17が360°にわたって形成されている。基台10の基板取付面11下部(外周側壁下部)から第1レール形成部15にわたっては、略等間隔に複数(4つ)の被係合部19が設けられている。被係合部19は、基板取付面11から第1レール部15に至る屈曲部分に略スリット状の貫通孔を設けることで形成されており、第1レール形成部15の下面まで切り欠かれている。これによって第1レール形成部15の被係合部19を設けた側の面15aは、図5に示すように、前記基板取付面11の表面に下記するフレキシブル回路基板50の厚みを加えた面よりも少し後退した位置となっている。なお、面15aの上部には、傾斜面からなるガイド面15bが形成されている。ガイド面15bは上方向に向かって第1レール部17側に傾斜している。基台10の円周方向に沿う上側の端辺(他方の端辺)21には、略等間隔に複数(4つ)の小突起平板状の取付部23が設けられている。   The base 10 is an integrally molded product of synthetic resin and is formed in a circular and substantially cylindrical shape. The inner peripheral surface of the base 10 is a 360 ° arc-shaped belt-like substrate mounting surface 11. A lower end side (one end side) 13 along the circumferential direction of the base 10 protrudes toward the center with respect to the inner peripheral surface of the base 10 (that is, more than the board mounting surface 11). A first rail forming portion 15 that protrudes toward the center of the arc is provided. The 1st rail formation part 15 is a substantially ring-shaped flat plate shape, and is formed over 360 degrees. In the center of the upper surface of the first rail forming portion 15, a first rail portion 17 formed of a ring-shaped recess (concave groove) is formed over 360 °. A plurality (four) of engaged portions 19 are provided at substantially equal intervals from the lower portion of the substrate mounting surface 11 (lower portion of the outer peripheral side wall) of the base 10 to the first rail forming portion 15. The engaged portion 19 is formed by providing a substantially slit-like through hole in a bent portion from the board mounting surface 11 to the first rail portion 15, and is cut out to the lower surface of the first rail forming portion 15. Yes. Thereby, the surface 15a on the side where the engaged portion 19 of the first rail forming portion 15 is provided is a surface obtained by adding the thickness of the flexible circuit board 50 described below to the surface of the substrate mounting surface 11, as shown in FIG. It is in a position that is slightly retracted. In addition, the guide surface 15b which consists of an inclined surface is formed in the upper part of the surface 15a. The guide surface 15b is inclined upward toward the first rail portion 17 side. A plurality of (four) small projection flat plate mounting portions 23 are provided at substantially equal intervals on the upper end side (the other end side) 21 along the circumferential direction of the base 10.

上述のように、基台10は筒状であって、その下側の端辺13のみに、基台10の内周面(基板取付面11)に対して中心方向に突出する第1レール形成部15を設けている構成なので(即ち、筒の上下の端辺に基台10の内周面に対して中心方向に突出する部分を設ける構成ではないので)、その構造上、容易に金型を用いて一体成形することができる。   As described above, the base 10 has a cylindrical shape, and the first rail is formed only in the lower end 13 to protrude in the center direction with respect to the inner peripheral surface (substrate mounting surface 11) of the base 10. Since the portion 15 is provided (that is, it is not a configuration in which a portion protruding in the center direction with respect to the inner peripheral surface of the base 10 is provided on the upper and lower ends of the cylinder), the mold is easily formed due to its structure. Can be integrally formed using

フレキシブル回路基板50は、可撓性を有する細長帯状の合成樹脂フィルム51の一方の表面(内周面となる側)に、長手方向に沿うように、複数本(2本)の摺接パターン55,57と、1本の引出パターン59とを設けて構成されている。なお図3,図4では、フレキシブル回路基板50が円弧状(円筒状)に湾曲した状態を示しているが、これは基台10に取り付けたときの状態を示しており、何ら外力が加わっていない時は、平面状の状態となる(下記する図10でも同様)。合成樹脂フィルム51の材質としては、例えばポリエチレンテレフタレート樹脂(PET樹脂)等が用られ、細長帯状で直線状の基板本体部51aの下側の端辺(一方の端辺)61に舌片状で矩形状の突片からなる複数(4つ)の係合部63を設け、また基板本体部51aの上側の端辺(他方の端辺)64に帯状の引出部65を略垂直に接続して構成されている。2本の摺接パターン55、57の内の一方の摺接パターン55は抵抗値の大きい抵抗体パターンであり、他方の摺接パターン57は抵抗値の小さい導体パターンである。前記引出パターン59は摺接パターン55の一端に接続され、摺接パターン55のもう一方の端部と摺接パターン57の一端部にそれぞれ接続された図示しない2本の引出パターンと共に、前記引出部65に引き出されている。前記各係合部63は、前記基台10に設けた各被係合部19に挿入される位置・寸法に形成されている。   The flexible circuit board 50 has a plurality of (two) sliding contact patterns 55 so as to be along the longitudinal direction on one surface (side to be an inner peripheral surface) of a flexible strip-shaped synthetic resin film 51 having flexibility. , 57 and one extraction pattern 59 are provided. 3 and 4 show a state in which the flexible circuit board 50 is curved in an arc shape (cylindrical shape), this shows a state when the flexible circuit board 50 is attached to the base 10, and any external force is applied. When not, it becomes a planar state (the same applies to FIG. 10 described below). As a material of the synthetic resin film 51, for example, polyethylene terephthalate resin (PET resin) or the like is used, and a strip-like shape is formed on the lower end (one end) 61 of the elongated and straight substrate body 51a. A plurality of (four) engaging portions 63 made of rectangular protrusions are provided, and a strip-like lead portion 65 is connected substantially vertically to the upper end (the other end) 64 of the substrate body 51a. It is configured. One of the two sliding contact patterns 55, 57 is a resistor pattern having a large resistance value, and the other sliding contact pattern 57 is a conductor pattern having a small resistance value. The drawing pattern 59 is connected to one end of the sliding contact pattern 55, and the drawing portion is connected to two drawing patterns (not shown) connected to the other end of the sliding contact pattern 55 and one end of the sliding contact pattern 57. Has been drawn to 65. Each of the engaging portions 63 is formed at a position / size to be inserted into each of the engaged portions 19 provided on the base 10.

カバー80は、合成樹脂の一体成形品であり、略円形リング平板状のカバー本体部81の下面中央から、リング状の係止用突起(突条)83を突出し、さらにカバー本体部81の下面の、前記係止用突起83の内側位置に、360°リング状の凹部(凹溝)からなる第2レール部85を形成して構成されている。なお、カバー80の前記係止用突起83を設けた部分から半径方向内方の部分、即ち、図5に示すように、基台10にカバー80を取り付けた際に基台10の内周面(基板取付面11)に対して中心方向に向かって突出する部分を、第2レール形成部86としている。一方、カバー本体部81の外周辺の複数個所(4か所)からは、矩形状の突部87が突出し、各突部87中には、矩形状の小孔からなる被取付部89が設けられている。各被取付部89は、前記基台10に設けた各取付部23に対向した位置であってこれらを挿入できる寸法形状に形成されている。カバー本体部81の外周辺の所定位置には、前記フレキシブル回路基板50の引出部65を挿入できる寸法の略矩形状の凹部からなる引出部挿通部91が形成されている。一方、係止用突部83の外径寸法は、前記基台10の基板取付面11の表面にフレキシブル回路基板50の厚みを加えた面の内径寸法と略同一に形成されている(図6参照)。但し、図5に示すように、係止用突部83の外周面の一部には、前記引出部挿通部91の一部となる凹部(凹溝)83aが形成されている。また、図5,図6に示すように、第2レール部85の内周側の内側壁の下部には傾斜面からなるガイド面85aがリング状に形成されている。ガイド面85aは、下方向に向かって半径方向中心側に傾斜している。上述のように、カバー80は略円形リング平板状なので、その構造上、容易に金型を用いて一体成形することができる。   The cover 80 is an integrally molded product of synthetic resin, and projects a ring-shaped locking protrusion (projection) 83 from the center of the lower surface of the substantially circular ring flat plate-shaped cover main body 81, and further the lower surface of the cover main body 81. A second rail portion 85 formed of a 360 ° ring-shaped concave portion (concave groove) is formed at an inner position of the locking projection 83. The portion of the cover 80 that is radially inward from the portion provided with the locking projection 83, that is, the inner peripheral surface of the base 10 when the cover 80 is attached to the base 10 as shown in FIG. A portion protruding toward the center direction with respect to the (substrate mounting surface 11) is a second rail forming portion 86. On the other hand, rectangular projections 87 protrude from a plurality of locations (four locations) on the outer periphery of the cover main body 81, and attached portions 89 each having a rectangular small hole are provided in each projection 87. It has been. Each attached portion 89 is formed at a position facing each attaching portion 23 provided on the base 10 and has a size and shape into which these can be inserted. At a predetermined position on the outer periphery of the cover main body 81, a lead-out portion insertion portion 91 made of a substantially rectangular recess having a dimension capable of inserting the lead-out portion 65 of the flexible circuit board 50 is formed. On the other hand, the outer diameter of the locking projection 83 is formed to be substantially the same as the inner diameter of the surface of the base 10 plus the thickness of the flexible circuit board 50 (FIG. 6). reference). However, as shown in FIG. 5, a concave portion (concave groove) 83 a that is a part of the lead-out insertion portion 91 is formed on a part of the outer peripheral surface of the locking projection 83. Further, as shown in FIGS. 5 and 6, a guide surface 85 a made of an inclined surface is formed in a ring shape at the lower portion of the inner wall on the inner peripheral side of the second rail portion 85. The guide surface 85a is inclined downward toward the center in the radial direction. As described above, since the cover 80 has a substantially circular ring flat plate shape, it can be easily integrally formed using a mold because of its structure.

図7は移動体110を拡大して示す図であり、図7(a)は上側から見た斜視図、図7(b)は下側から見た斜視図、図7(c)は側面図である。これらの図に示すように移動体110は、合成樹脂の一体成形品であり、略矩形平板状の移動体本体部111と、移動体本体部111の上面中央から突出する柱状の操作部113とを具備して構成されている。移動体本体111はその面全体が、この移動体110の移動方向(スライド方向)Hに沿って、円弧状に湾曲している。この円弧の曲率半径は、前記基台10の基板取付面11の曲率半径と略同一となっている。移動体本体部111の下面には、平面状の摺動子取付面115が形成され、この摺動子取付面115には、一対の小突起状の摺動子取付部117が設けられている。また移動体本体部111の外周辺の移動方向Hの前後の位置(4つの角部近傍位置)には、左右一対ずつ、移動方向Hに直交する方向に向かって突出する略矩形状で小突起状の係止部119が設けられている。各係止部119は、前記基台10に設けた第1レール部17と、前記カバー80に設けた第2レール部85に挿入される形状寸法に形成されている。   7 is an enlarged view of the moving body 110, FIG. 7 (a) is a perspective view seen from the upper side, FIG. 7 (b) is a perspective view seen from the lower side, and FIG. 7 (c) is a side view. It is. As shown in these drawings, the moving body 110 is an integrally molded product of synthetic resin, and has a substantially rectangular flat plate-shaped moving body main body 111, and a columnar operation section 113 protruding from the center of the upper surface of the moving body main body 111. It comprises. The entire surface of the movable body 111 is curved in an arc along the moving direction (sliding direction) H of the movable body 110. The radius of curvature of the arc is substantially the same as the radius of curvature of the board mounting surface 11 of the base 10. A planar slider mounting surface 115 is formed on the lower surface of the movable body main body 111, and a pair of small protrusion-shaped slider mounting portions 117 are provided on the slider mounting surface 115. . In addition, the front and rear positions (positions near the four corners) in the movement direction H around the outer periphery of the movable body main body 111 are a pair of left and right pairs that are substantially rectangular and projecting in a direction perpendicular to the movement direction H. A shaped locking portion 119 is provided. Each locking portion 119 is formed in a shape and dimension that is inserted into the first rail portion 17 provided on the base 10 and the second rail portion 85 provided on the cover 80.

摺動子130は、弾性金属板製であり、平板状の摺動子基部131の外周の1辺から突出する一対の摺動冊子133をその根元部分で約180°折り曲げて構成されている。摺動子基部131には、前記移動体110の各摺動子取付部117を挿入する小孔からなる被取付部135が設けられている。   The slider 130 is made of an elastic metal plate, and is configured by bending a pair of sliding booklets 133 protruding from one side of the outer periphery of a flat-plate-like slider base portion 131 at the base portion thereof by about 180 °. The slider base 131 is provided with a mounted portion 135 having a small hole into which each slider mounting portion 117 of the moving body 110 is inserted.

次に電子部品1−1の組立方法を説明する。まず予め、移動体110の摺動子取付面115に摺動子130の摺動子基部131を当接し、その際、移動体110の各摺動子取付部117を摺動子130の各被取付部135に挿入し、熱カシメ等によって固定しておく。そして、基台10の基板取付面11上に、摺接パターン55,57を内向きとしてリング状に湾曲させたフレキシブル回路基板50を設置する。その際、フレキシブル回路基板50に設けた各係合部63を基台10に設けた各被係合部19に挿入・係止し、これによってフレキシブル回路基板50を基台10の基板取付面11に取り付ける。各被係合部19には、図5に示すように、ガイド面15bが形成されているので、各係合部63の挿入はスムーズに行える。このようにフレキシブル回路基板50の係合部63を、基台10の被係合部19に係止することによって、簡単にこのフレキシブル回路基板50を基台10の基板取付面11に取り付けることができる。特にフレキシブル回路基板50は、基板取付面11に取り付ける際、広がろうとする方向の弾発力が働いて基板取付面11に密着しようとするので、基板取付面11への密着した取り付けが容易に行える。   Next, a method for assembling the electronic component 1-1 will be described. First, the slider base portion 131 of the slider 130 is brought into contact with the slider mounting surface 115 of the moving body 110 in advance, and at this time, each slider mounting portion 117 of the moving body 110 is connected to each cover of the slider 130. It is inserted into the attachment part 135 and fixed by heat caulking or the like. Then, the flexible circuit board 50 curved in a ring shape with the sliding contact patterns 55 and 57 facing inward is installed on the board mounting surface 11 of the base 10. At that time, each engaging portion 63 provided on the flexible circuit board 50 is inserted and locked into each engaged portion 19 provided on the base 10, whereby the flexible circuit board 50 is attached to the board mounting surface 11 of the base 10. Attach to. As shown in FIG. 5, each engaged portion 19 is formed with a guide surface 15b, so that each engaging portion 63 can be inserted smoothly. Thus, the flexible circuit board 50 can be easily attached to the board mounting surface 11 of the base 10 by locking the engaging part 63 of the flexible circuit board 50 to the engaged part 19 of the base 10. it can. In particular, when the flexible circuit board 50 is attached to the board mounting surface 11, the elastic force in the direction of spreading acts to make close contact with the board mounting surface 11. Therefore, the flexible circuit board 50 can be easily attached to the board mounting surface 11. Yes.

次に、前記摺動子130を取り付けた移動体110をフレキシブル回路基板50の内周面上に配置し、その際、摺動子130の各摺動冊子133を各摺接パターン55,57に当接する(図5参照)。このとき同時に、移動体110の下側の2つの係止部119を基台10の第1レール部17に挿入する(図5参照)。   Next, the movable body 110 to which the slider 130 is attached is disposed on the inner peripheral surface of the flexible circuit board 50. At this time, the sliding booklets 133 of the slider 130 are placed on the sliding contact patterns 55 and 57, respectively. Abut (see FIG. 5). At the same time, the two locking portions 119 on the lower side of the moving body 110 are inserted into the first rail portion 17 of the base 10 (see FIG. 5).

次に、前記基台10の上側の端辺21上に、カバー80を載置し、その際、カバー80の各被取付部89に基台10の各取付部23を挿入し、カバー80の上面から突出する各取付部23を熱カシメして固定する。このとき図6に示すように、フレキシブル回路基板50の上部の部分は、基台10の基板取付面11とカバー80の係止用突起83の間に挟持され、固定される。つまり、フレキシブル回路基板50は、その上下の端辺61,64近傍部分が固定されることで、基板取付面11への取り付けが確実になる。また同時に、移動体110の上側の2つの係止部119がカバー80の第2レール部85に挿入される(図5参照)。このとき第2レール部85にはガイド面85aが設けられているので、係止部119の第2レール部85への挿入はスムーズに行える。さらにこのとき、フレキシブル回路基板50の引出部65は、カバー80に設けた引出部挿通部91内を通って、カバー80の上方に引き出される(図5参照)。以上によって、電子部品1−1の組み立てが完了する。なお上記組立手順はその一例であり、他の各種異なる組立手順を用いて組み立てても良いことはいうまでもない。   Next, the cover 80 is placed on the upper edge 21 of the base 10, and at this time, each mounting portion 23 of the base 10 is inserted into each mounted portion 89 of the cover 80, Each mounting portion 23 protruding from the upper surface is fixed by caulking. At this time, as shown in FIG. 6, the upper portion of the flexible circuit board 50 is sandwiched and fixed between the board mounting surface 11 of the base 10 and the locking projection 83 of the cover 80. That is, the flexible circuit board 50 is securely attached to the board attachment surface 11 by fixing the vicinity of the upper and lower edges 61 and 64 thereof. At the same time, the two upper locking portions 119 of the moving body 110 are inserted into the second rail portion 85 of the cover 80 (see FIG. 5). Since the guide surface 85a is provided in the 2nd rail part 85 at this time, the insertion to the 2nd rail part 85 of the latching | locking part 119 can be performed smoothly. Further, at this time, the lead-out portion 65 of the flexible circuit board 50 passes through the lead-out portion insertion portion 91 provided in the cover 80 and is pulled out above the cover 80 (see FIG. 5). Thus, the assembly of the electronic component 1-1 is completed. The above assembling procedure is an example, and it goes without saying that the assembly may be performed using other various assembling procedures.

以上のようにして組み立てられた電子部品1−1において、移動体110をスライド移動させると、移動体110は湾曲するフレキシブル回路基板50の内周面に沿うように移動し、摺動子130の摺動冊子133が摺接パターン55,57上を摺動し、これによって引出部65に引き出されている引出パターン間の検出出力が変化する。移動体110はこれを360°以上、エンドレスでスライド移動させることができる。すなわち、基板取付面11を構成する360°ある内周面を全て利用して検出出力を得ることができる。   In the electronic component 1-1 assembled as described above, when the moving body 110 is slid, the moving body 110 moves along the inner peripheral surface of the flexible circuit board 50 that is curved, and the slider 130 The sliding booklet 133 slides on the sliding contact patterns 55 and 57, whereby the detection output between the drawing patterns drawn to the drawing portion 65 changes. The moving body 110 can slide the endlessly by 360 ° or more. That is, the detection output can be obtained by using all the 360 ° inner peripheral surfaces constituting the substrate mounting surface 11.

以上説明したように、上記電子部品1−1によれば、円弧状に設置したフレキシブル回路基板50の内周面側を移動体110が移動する構成の電子部品を容易に構成できる。また移動体110をフレキシブル回路基板50の内周面側に配置するので、移動体110をフレキシブル回路基板50の外周面側に配置する構造に比べて、電子部品の外径寸法の小型化が図れる。また上記電子部品1−1において、第1,第2レール部17,85の内、一方の第1レール部17のみを基台10の一方の端辺13側に設け、他方の第2レール部85は別部材であるカバー80に設けたので、上述のように、180°以上の円弧からなる基板取付面11を有する基台10を容易に製造することが可能になる。即ち、仮に、基板取付面11からその円弧の中心方向に向かって突出するように形成する第1,第2レール部17,85を基台10の両端辺13,21側に一体成型で設け、且つ基台10を円弧状に成形するとした場合は、円弧が180°を超えると、その成形が金型上困難になるが、この電子部品1−1に用いる基台10及びカバー80の場合はそのような問題は生じない。これによって移動体110の移動範囲(摺動子130の摺動範囲)を容易に180°以上とすることができる。   As described above, according to the electronic component 1-1, an electronic component having a configuration in which the moving body 110 moves on the inner peripheral surface side of the flexible circuit board 50 installed in an arc shape can be easily configured. Further, since the movable body 110 is disposed on the inner peripheral surface side of the flexible circuit board 50, the outer diameter of the electronic component can be reduced as compared with the structure in which the movable body 110 is disposed on the outer peripheral surface side of the flexible circuit board 50. . Further, in the electronic component 1-1, only one of the first and second rail portions 17 and 85 is provided on one end 13 side of the base 10, and the other second rail portion is provided. Since 85 is provided on the cover 80 which is a separate member, as described above, the base 10 having the substrate mounting surface 11 formed of an arc of 180 ° or more can be easily manufactured. That is, tentatively, the first and second rail portions 17 and 85 formed so as to protrude from the board mounting surface 11 toward the center of the arc are integrally formed on the both sides 13 and 21 side of the base 10, When the base 10 is formed in an arc shape, if the arc exceeds 180 °, the molding becomes difficult on the mold. In the case of the base 10 and the cover 80 used for the electronic component 1-1, Such a problem does not arise. Thereby, the moving range of the moving body 110 (sliding range of the slider 130) can be easily set to 180 ° or more.

また、基台10の一方の端辺13に基板取付面11よりもその円弧の中心方向に向かって突出する第1レール形成部15を設け、一方カバー80にこのカバー80を基台10の他方の端辺21に取り付けた際に基板取付面11よりもその円弧の中心方向に向かって突出する第2レール形成部86を設け、第1,第2レール形成部15,86の対向する側の面にそれぞれ第1,第2レール部17,85を形成したので、移動体110全体をフレキシブル回路基板50の内周側露出面よりも半径方向内側に位置させることができ、360°にわたって回転する移動体110にフレキシブル回路基板50(特にフレキシブル回路基板50の引出部65の部分)が干渉することを容易に避けることができる。   In addition, a first rail forming portion 15 is provided on one end side 13 of the base 10 so as to protrude from the board mounting surface 11 toward the center of the arc, and the cover 80 is attached to the other cover 80 on the other side of the base 10. A second rail forming portion 86 that protrudes toward the center of the arc from the board mounting surface 11 when attached to the end side 21 of the first and second rail forming portions 15 and 86 is provided on the opposite side of the first and second rail forming portions 15 and 86. Since the first and second rail portions 17 and 85 are formed on the surfaces, respectively, the entire moving body 110 can be positioned on the radially inner side of the inner peripheral side exposed surface of the flexible circuit board 50 and can be rotated by 360 °. It can be easily avoided that the flexible circuit board 50 (particularly, the portion of the lead-out portion 65 of the flexible circuit board 50) interferes with the moving body 110.

また上記電子部品1−1においては、移動体110の係止部119を、この移動体110の前後左右の4箇所に設けてこれら4箇所において第1,第2レール部17,85に係合する構造なので、例え第1,第2レール部17,85が円弧状に湾曲していても、移動体110の円弧状の移動をスムーズにガイドすることができる。即ち、第1,第2レール部17,85は円弧状に湾曲しているので、移動体110の両側辺全体をこれら第1,第2レール部17,85に挿入すると、これを円弧状に移動する際に摩擦抵抗が大きくなって移動体110のスムーズな移動が阻害される恐れがあるが、この電子部品1−1によれば、移動体110の移動方向の前後左右の4箇所に設けた係止部119を第1,第2レール部17,85に係合するので、移動体110を円弧状に移動する際の摩擦抵抗が少なく、移動体110をスムーズに移動させることができる。   Further, in the electronic component 1-1, the locking portions 119 of the moving body 110 are provided at four positions on the front and rear, left and right of the moving body 110, and are engaged with the first and second rail portions 17 and 85 at these four positions. Therefore, even if the first and second rail portions 17 and 85 are curved in an arc shape, the moving motion of the moving body 110 can be smoothly guided. That is, since the first and second rail portions 17 and 85 are curved in an arc shape, when the entire sides of the movable body 110 are inserted into the first and second rail portions 17 and 85, the first and second rail portions 17 and 85 are arcuately formed. When moving, there is a risk that the frictional resistance becomes large and the smooth movement of the moving body 110 may be hindered. According to this electronic component 1-1, the moving body 110 is provided at four locations on the front, rear, left and right in the moving direction. Since the engaging portion 119 is engaged with the first and second rail portions 17 and 85, there is little frictional resistance when the moving body 110 is moved in an arc shape, and the moving body 110 can be moved smoothly.

図8は本発明の第2実施形態に係る電子部品1−2の斜視図、図9は電子部品1−2を下側から見た斜視図、図10はフレキシブル回路基板50−2の斜視図、図11は図8のC−C部分断面拡大図、図12は図8のD−D部分断面拡大図である。これらの図に示す電子部品1−2において、前記図1〜図7に示す電子部品1−1と同一又は相当部分には同一符号を付す(但し、各符号には添え字「−2」を付す)。なお以下で説明する事項以外の事項については、前記図1〜図7に示す電子部品1−1と同じである。   8 is a perspective view of the electronic component 1-2 according to the second embodiment of the present invention, FIG. 9 is a perspective view of the electronic component 1-2 viewed from below, and FIG. 10 is a perspective view of the flexible circuit board 50-2. 11 is an enlarged view of the CC partial cross section of FIG. 8, and FIG. 12 is an enlarged view of the DD partial cross section of FIG. In the electronic component 1-2 shown in these drawings, the same or corresponding parts as those of the electronic component 1-1 shown in FIGS. Attached). Note that matters other than those described below are the same as those of the electronic component 1-1 shown in FIGS.

この電子部品1−2において、上記電子部品1−1と相違する点は、フレキシブル回路基板50−2を基台10−2にインサート成形によって取り付けた点のみである。即ちこの電子部品1−2の場合、図10に示すように、フレキシブル回路基板50−2の基板本体部51a−2の下側の端辺(一方の端辺)61−2全体を、前記図3に示すフレキシブル回路基板50の下側の端辺61よりも下方に突出し、突出した帯状部分を埋設部73−2として構成している。なお上述のように、フレキシブル回路基板50−2は、何ら外力が加わっていない時は、湾曲しておらず、平面状の状態となっている(つまり円弧状にするためのプレフォーミングは行わない)。   The electronic component 1-2 is different from the electronic component 1-1 only in that the flexible circuit board 50-2 is attached to the base 10-2 by insert molding. That is, in the case of this electronic component 1-2, as shown in FIG. 10, the lower end side (one end side) 61-2 of the board main body 51a-2 of the flexible circuit board 50-2 is entirely shown in FIG. 3 protrudes downward from the lower edge 61 of the flexible circuit board 50 shown in FIG. 3, and the protruding belt-like portion is configured as an embedded portion 73-2. Note that, as described above, the flexible circuit board 50-2 is not curved and is in a flat state when no external force is applied (that is, pre-forming for making an arc shape is not performed). ).

そして基台10−2を成形する際に、その金型のリング状のキャビティー内部にフレキシブル回路基板50−2を湾曲させながら挿入し、その際キャビティーの内側の内周面にフレキシブル回路基板50−2の表面側(摺接パターン55−2,57−2を設けた面側)を対向させる。次に、前記フレキシブル回路基板50−2の外周面側(裏面側)に対向するキャビティーの外側の内周面に所定間隔毎に設けた複数のゲートから溶融樹脂をフレキシブル回路基板50−2の裏面(外周面)に向けて射出する。これによって、フレキシブル回路基板50−2はキャビティーの内側の内周面に押し付けられながら溶融樹脂の充填が進み、同時に、図11,図12に示すように、フレキシブル回路基板50−2の一方の端辺61−2(埋設部73−2)は、基台10−2内に埋設するようにインサート成形される。このように、ゲートはフレキシブル回路基板50−2の外周面側に対向して設けるのが好ましい。   When the base 10-2 is formed, the flexible circuit board 50-2 is inserted into the ring-shaped cavity of the mold while being bent, and the flexible circuit board is inserted into the inner peripheral surface of the cavity at that time. The surface side of 50-2 (the surface side on which the sliding contact patterns 55-2 and 57-2 are provided) is opposed. Next, molten resin is supplied to the flexible circuit board 50-2 from a plurality of gates provided at predetermined intervals on the inner peripheral face outside the cavity facing the outer peripheral face side (back face side) of the flexible circuit board 50-2. It injects toward the back (outer peripheral surface). As a result, the flexible circuit board 50-2 is filled with the molten resin while being pressed against the inner peripheral surface of the cavity, and at the same time, as shown in FIG. 11 and FIG. The end side 61-2 (embedded portion 73-2) is insert-molded so as to be embedded in the base 10-2. Thus, it is preferable that the gate is provided to face the outer peripheral surface side of the flexible circuit board 50-2.

これによって、フレキシブル回路基板50−2は基台10−2の基板取付面11−2に密着して強固に取り付けられる。このように構成すれば、インサート成形によって、容易且つ確実にフレキシブル回路基板50−2の一方の端辺61−2(埋設部73−2)を基台10−2内に埋設して固定することができ、このフレキシブル回路基板50−2を基台10−2の基板取付面11−2に取り付けることができる。同時に、基板取付面11−2のフレキシブル回路基板50−2が位置しない面は、フレキシブル回路基板50−2の表面と同一面となる(言い換えればフレキシブル回路基板50−2は基板取付面11−2内に埋設されている)。このため、リング状となっているフレキシブル回路基板50−2の両端部間の隙間部分X1(図10参照)の内周側表面とフレキシブル回路基板50−2の内周側表面とが同一面となり、摺動子110−2を360°以上回転するような場合でも前記隙間部分X1に段差(凹凸)が生じず、スムーズな移動が行え、信頼性が向上する。   As a result, the flexible circuit board 50-2 is firmly attached in close contact with the board attachment surface 11-2 of the base 10-2. If comprised in this way, one edge 61-2 (embedding part 73-2) of the flexible circuit board 50-2 will be embed | buried in the base 10-2 and fixed easily and reliably by insert molding. The flexible circuit board 50-2 can be attached to the board attachment surface 11-2 of the base 10-2. At the same time, the surface of the board mounting surface 11-2 where the flexible circuit board 50-2 is not located is the same as the surface of the flexible circuit board 50-2 (in other words, the flexible circuit board 50-2 is mounted on the board mounting surface 11-2). Embedded in). For this reason, the inner peripheral surface of the gap portion X1 (see FIG. 10) between both ends of the ring-shaped flexible circuit board 50-2 and the inner peripheral surface of the flexible circuit board 50-2 are flush with each other. Even when the slider 110-2 is rotated by 360 ° or more, no step (unevenness) is generated in the gap portion X1, smooth movement can be performed, and reliability is improved.

また上述のように、フレキシブル回路基板50−2はプレフォーミングしないまま直接撓めてキャビティー内に挿入して成形するので、フレキシブル回路基板50−2がプレフォーム時に伸びて摺接パターン55−2,57−2が引き延ばされて破断などするといった問題を防止できる。なお、場合によっては、フレキシブル回路基板50−2をプレフォーミングしても良い。   In addition, as described above, the flexible circuit board 50-2 is directly bent without being preformed and inserted into the cavity to be molded, so that the flexible circuit board 50-2 extends at the time of preforming and the sliding contact pattern 55-2. , 57-2 can be stretched and broken. In some cases, the flexible circuit board 50-2 may be preformed.

なおその他の構成、組立方法、作用効果は、何れも上記電子部品1−1と同様なので、それらの説明は省略する。   Since other configurations, assembling methods, and operational effects are all the same as those of the electronic component 1-1, description thereof will be omitted.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載がない何れの形状や構造や材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば、上記例では摺接パターンを一対設けたが、1本または3本以上設けても良い。また上記例では摺接パターンとして、抵抗体パターンと導体パターンを用いたが、スイッチパターン等、他の各種用途に用いるパターンを用いても良い。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above example, a pair of sliding contact patterns is provided, but one or more may be provided. In the above example, the resistor pattern and the conductor pattern are used as the sliding contact pattern. However, a pattern used for various other purposes such as a switch pattern may be used.

また上記例では、移動体を360°以上、エンドレスで移動できるように構成したが、何れかの位置にストッパ部などを設けることで、360°以下の所望の角度範囲で移動できるように構成しても良い。その際、移動する角度に応じてフレキシブル回路基板の長さを短くしても良い。また図11に点線で示すように、基台とカバーの第1,第2レール部の内側の壁面部分を相互に接近するように延ばして移動体の操作部のみを外部に突出するように構成すれば、摺接パターンや摺動子からなる検出手段の部分の防塵効果を向上させることができる。   In the above example, the movable body is configured to be movable endlessly at 360 ° or more. However, by providing a stopper portion or the like at any position, the movable body is configured to be movable within a desired angle range of 360 ° or less. May be. At this time, the length of the flexible circuit board may be shortened according to the moving angle. Further, as shown by a dotted line in FIG. 11, the base and the inner wall surface portions of the first and second rail portions are extended so as to approach each other, and only the operation portion of the moving body protrudes to the outside. If it does so, the dust-proof effect of the part of the detection means which consists of a sliding contact pattern or a slider can be improved.

1−1,1−2 電子部品
10 基台
11 基板取付面
13 一方の端辺(下側の端辺)
15 第1レール形成部
17 第1レール部(レール部)
19 被係合部
21 他方の端辺(上側の端辺)
50 フレキシブル回路基板
55,57 摺接パターン
61 一方の端辺(下側の端辺)
63 係合部
80 カバー
85 第2レール部(レール部)
86 第2レール形成部
110 移動体
130 摺動子
1-1, 1-2 Electronic component 10 Base 11 Board mounting surface 13 One side (lower side)
15 1st rail formation part 17 1st rail part (rail part)
19 engaged part 21 other side (upper side)
50 Flexible circuit board 55, 57 Sliding contact pattern 61 One side (lower side)
63 engaging portion 80 cover 85 second rail portion (rail portion)
86 2nd rail formation part 110 moving body 130 slider

Claims (5)

内周面が円弧状の基板取付面となっている基台と、
前記基台の基板取付面に取り付けられるフレキシブル回路基板と、
前記フレキシブル回路基板の内周面に沿うように移動する移動体と、
前記移動体に取り付けられて前記フレキシブル回路基板の内周面に設けた摺接パターンに摺接する摺動子と、を具備し、
前記基台の円周方向に沿う一方の端辺側に、前記移動体の一方の端辺側に設けた係止部をスライド自在に係止する第1レール部を設け、
さらに前記基台の円周方向に沿う他方の端辺側に、前記移動体の他方の端辺側に設けた係止部をスライド自在に係止する第2レール部を形成してなるカバーを取り付けたことを特徴とする電子部品。
A base whose inner peripheral surface is an arc-shaped substrate mounting surface;
A flexible circuit board attached to the board mounting surface of the base;
A moving body that moves along the inner peripheral surface of the flexible circuit board;
A slider attached to the movable body and slidably contacting a slidable contact pattern provided on an inner peripheral surface of the flexible circuit board; and
Provided on one end side along the circumferential direction of the base is a first rail portion that slidably engages an engaging portion provided on one end side of the movable body,
Further, a cover formed by forming a second rail portion that slidably engages an engaging portion provided on the other end side of the movable body on the other end side along the circumferential direction of the base. Electronic parts characterized by being installed.
請求項1に記載の電子部品であって、
前記基台は、略円筒状に形成されて、その内周面を前記基板取付面とし、
この基台の一方の端辺には、前記基台の内周面に対して中心方向に向かって突出する第1レール形成部を設け、
一方前記カバーには、このカバーを前記基台の他方の端辺に取り付けた際に、前記基台の内周面に対して中心方向に向かって突出する第2レール形成部を設け、
前記第1,第2レール形成部にそれぞれ前記第1,第2レール部を形成したことを特徴とする電子部品。
The electronic component according to claim 1,
The base is formed in a substantially cylindrical shape, and its inner peripheral surface is the substrate mounting surface,
On one end side of the base, a first rail forming portion that protrudes toward the center with respect to the inner peripheral surface of the base is provided,
On the other hand, the cover is provided with a second rail forming portion that protrudes toward the center with respect to the inner peripheral surface of the base when the cover is attached to the other end of the base.
An electronic component comprising the first and second rail forming portions formed on the first and second rail forming portions, respectively.
請求項2に記載の電子部品であって、
前記フレキシブル回路基板の一方の端辺に設けた係合部を、前記第1レール形成部に設けた被係合部に係合することによって、このフレキシブル回路基板を前記基台の基板取付面に取り付けることを特徴とする電子部品。
The electronic component according to claim 2,
By engaging an engaging part provided on one end of the flexible circuit board with an engaged part provided on the first rail forming part, the flexible circuit board is attached to the board mounting surface of the base. An electronic component characterized by being attached.
請求項2に記載の電子部品であって、
前記フレキシブル回路基板の一方の端辺を、前記基台内に埋設するようにインサート成形することによって、このフレキシブル回路基板を前記基台の基板取付面に取り付けることを特徴とする電子部品。
The electronic component according to claim 2,
An electronic component characterized in that one end of the flexible circuit board is insert-molded so as to be embedded in the base, thereby attaching the flexible circuit board to a board mounting surface of the base.
請求項1乃至4の内の何れかに記載の電子部品であって、
前記移動体の係止部は、この移動体の外周辺の移動方向の前後において前記第1,第2レール部に挿入される突起によって形成されていることを特徴とする電子部品。
An electronic component according to any one of claims 1 to 4,
The locking part of the movable body is formed by protrusions inserted into the first and second rail portions before and after the outer periphery of the movable body in the moving direction.
JP2014156978A 2014-07-31 2014-07-31 Electronic components Active JP6351424B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014156978A JP6351424B2 (en) 2014-07-31 2014-07-31 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014156978A JP6351424B2 (en) 2014-07-31 2014-07-31 Electronic components

Publications (2)

Publication Number Publication Date
JP2016033995A JP2016033995A (en) 2016-03-10
JP6351424B2 true JP6351424B2 (en) 2018-07-04

Family

ID=55452766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014156978A Active JP6351424B2 (en) 2014-07-31 2014-07-31 Electronic components

Country Status (1)

Country Link
JP (1) JP6351424B2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433082Y2 (en) * 1976-01-13 1979-10-12
JPS6020105U (en) * 1983-07-20 1985-02-12 松下電器産業株式会社 Bow-shaped sliding electrical parts
JPH02117101A (en) * 1988-10-27 1990-05-01 Matsushita Electric Ind Co Ltd Variable resistor
JPH09283309A (en) * 1996-04-19 1997-10-31 Tsubame Musen Kk Variable slide resistor
JP4303082B2 (en) * 2003-10-16 2009-07-29 株式会社フジクラ Swing type switch unit
JP2011013505A (en) * 2009-07-02 2011-01-20 Sharp Corp Display device and housing

Also Published As

Publication number Publication date
JP2016033995A (en) 2016-03-10

Similar Documents

Publication Publication Date Title
KR20140036448A (en) Camera lens module
JP5368293B2 (en) Manufacturing method of substrate with base
JP6351424B2 (en) Electronic components
US9530587B2 (en) Switch device
JP6351411B2 (en) Electronic components
JP2005310670A (en) Multidirectional input device
JP5084384B2 (en) Electronic components
JP6813752B2 (en) Rotary electronic components with press switch
JP6522468B2 (en) Electronic parts
US20150221461A1 (en) Rotary Operation Switch and Strobe Device Including Same
JP6522480B2 (en) Sliding electronic parts
JP2015031930A (en) Lens unit
JP2017097989A (en) Drip-proof structure for rotary electronic component
JP2013134067A (en) Positioning member for conductor and current sensor
JP5628659B2 (en) Rotating electronic components
JP5617019B2 (en) Manufacturing method of substrate with base
JP4813455B2 (en) Automatic return type electronic component and its assembly method
JP5214300B2 (en) Sliding electronic parts
JP2008047367A (en) Case for composite type electronic component, its manufacturing method, and composite type electronic component
JP2016201387A (en) Noise filter and positioning device for noise filter
JP2010080121A (en) Input device and electronic apparatus
JP4484906B2 (en) Sliding electronic parts
US20140111917A1 (en) Electronic device
JP6549979B2 (en) Rotary electronic parts with pressure switch
JP2009158305A (en) Electronic component

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170412

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180425

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180508

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180605

R150 Certificate of patent or registration of utility model

Ref document number: 6351424

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250