JP6333152B2 - Generation method, information processing apparatus, imprint method, and article manufacturing method - Google Patents

Description

The present invention relates to a generation method, an information processing apparatus , an imprint method, and an article manufacturing method .

  The imprint technique is a technique that enables transfer of a nanoscale fine pattern, and has attracted attention as one of nanolithography techniques for mass production of semiconductor devices and magnetic storage media. The imprint apparatus using the imprint technique cures the resin in a state where the mold (original plate) on which the pattern is formed and the resin (imprint material) on the substrate are in contact with each other, and pulls the mold away from the cured resin. A pattern is formed on the substrate. Such an imprint apparatus generally employs a photocuring method in which a resin on a substrate is cured by irradiation with light such as ultraviolet rays. In the imprint apparatus, when resin is supplied (applied) onto a substrate, an array of resin droplets is formed on the substrate using, for example, an inkjet method.

  In the imprint apparatus, when the resin is not sufficiently filled (unfilled) in the mold pattern, a defect is generated in the pattern formed on the substrate. In order to reduce the defect of the pattern due to such insufficient filling of the resin, the time (filling time) from the contact between the mold and the resin on the substrate to the irradiation of light is lengthened, and the resin It is necessary to wait until the mold pattern is completely filled. However, if the filling time of the resin in the mold pattern becomes long, there arises a problem that the throughput is lowered.

  The pattern area of the mold is generally a normal area in which line and space (high density and fine pattern) that forms the wiring part of the device is formed, and a dummy pattern or alignment mark (pattern with low density and wide area). ) Is formed. Of the pattern areas of the mold, the resin filling time tends to be short in the normal area, and the resin filling time tends to be long in the special area. Accordingly, the resin filling time is determined based on the resin filling time in the special region. Also, since the special area has a large area and requires a relatively large amount of resin, the remaining film thickness formed on the substrate (resin formed between the convex part of the mold pattern area and the substrate) Film thickness) is difficult to be uniform compared to other regions. In order to improve the throughput, it is necessary to make the resin filling time equal to that in the normal region while preventing unfilling of the resin and uniformity of the remaining film thickness in the special region. Therefore, techniques for optimizing a map (resin coating pattern) indicating a resin droplet supply position in a mold pattern region, particularly, a region on a substrate corresponding to a special region have been proposed (Patent Documents 1 and 2). reference).

  Patent Document 1 discloses a technique for setting a map indicating a resin droplet supply position by dividing a mold pattern area into a special area and an area other than the special area based on design information of the mold pattern. Has been. In such a technique, a special region, which is a region in which a large-sized pattern (large pattern) is formed, is extracted in advance from a mold pattern region, and a resin droplet supply position in a region on the substrate corresponding to the special region. Is set within a predetermined range from the large pattern. Next, a resin droplet supply position in an area on the substrate corresponding to the remaining area excluding the special area is set.

  In Patent Document 2, based on the density and shape (dimension) of the mold pattern, the pattern area of the mold should be divided into a plurality of areas and supplied to each area on the substrate corresponding to each of the plurality of areas. A technique for determining the amount (feed amount) of resin is disclosed. In this technique, the amount of resin to be supplied is determined for each region on the substrate based on the relationship between the dimension of the mold pattern and the resin filling time. Further, it is determined whether or not the determined resin supply amount is filled in the mold pattern within a predetermined time. If it is determined that the resin pattern is not filled within the predetermined time, the resin is filled within the predetermined time. As described above, the resin supply amount is corrected.

JP 2013-197389 A Japanese Patent No. 5289006

  In Patent Document 1, it is possible to shorten the resin filling time in the special region by supplying resin droplets directly below or in the vicinity of the special region of the mold. However, when the number of resin droplets supplied to the inside of the special area of the mold is small, there is a possibility that unfilling of the resin occurs or the remaining film thickness becomes thin. In this way, even if the resin droplets are supplied just under or near the special area of the mold, the filling time can be shortened, but there is no defect and the pattern with a uniform residual film thickness (imprint result) Hard to get.

  Further, in Patent Document 2, based on the relationship between the dimension of the mold pattern and the resin filling time for each of the normal region in which the line and space is formed and the special region in which the contact hole which is a special pattern is formed. Thus, a resin coating pattern is generated. At this time, since the filling time is longer in the special area than in the normal area, correction is performed so as to increase the amount of resin supplied to the special area. However, Patent Document 2 only discloses obtaining a supply amount of a resin that can be filled in a short time, and specifically how to supply a resin droplet with respect to a special region. It is not disclosed whether it is set. Therefore, in Patent Document 2, there is a possibility that the remaining film thickness may not be uniform in a region where the arrangement of resin droplets is not taken into consideration even though the resin filling time in the mold pattern can be shortened. . Thus, even in Patent Document 2, it is difficult to obtain a pattern having no defect and a uniform remaining film thickness.

  The present invention has been made in view of such problems of the prior art, and is a map showing a resin droplet supply position advantageous in shortening the filling time of the imprint material and realizing the uniformity of the remaining film thickness. It is an exemplary object to provide a generating method for generating.

To achieve the above object, a method for generating according to one aspect of the present invention is the imprinting of forming a pattern of an imprint material on a substrate using a mold, the imprint material in the substrate the droplets A generation method for generating a map showing a supply position of the mold, wherein the imprint material in the first region on the substrate corresponding to a region where the first pattern of the first dimension is formed in the pattern region of the mold A first step of generating a first map indicating a first supply position of the liquid droplets on the substrate corresponding to an area where a second pattern having a dimension larger than the first dimension is formed in the pattern area; the imprint and a second step of generating a second map representing the second supply position of the droplets of the material synthesized by the Ma and the second map and the first map in the second region of the A third step of generating flop, said third step, when synthesizing the second map and the first map, the droplet of the imprint material in the first map the of first supply position, the supply position of the imprint material droplets outside spacing tolerance between the second feed position adjacent to the first supply position and the first supply position, the intervals the allowable An adjustment step of adjusting the first supply position so as to fall within the range is included.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide a generation method for generating a map showing a supply position of a resin droplet that is advantageous in shortening the filling time of an imprint material and realizing uniformity of a residual film thickness. Can do.

It is the schematic which shows the structure of an imprint apparatus. It is the schematic which shows the structure of a production | generation part. It is a flowchart for demonstrating an imprint process. It is a figure for demonstrating an imprint process. It is a figure for demonstrating an imprint process. It is a flowchart for demonstrating the process which produces | generates the map in 1st Embodiment. It is a figure which shows an example of supply amount distribution information. It is a figure which shows an example of special area information. It is a figure for demonstrating a special area | region. It is a figure which shows an example of an intermediate map. It is a figure which shows an example of a special map. It is a figure which shows the map obtained by synthesize | combining the intermediate map shown in FIG. 10, and the special map shown in FIG. It is a figure which shows an example of a final map. 7 is a flowchart for explaining in detail processing from S203 to S205 shown in FIG. 6. It is a figure which expands and shows a part of intermediate map shown in FIG. It is a figure which expands and shows a part of special map shown in FIG. It is a figure which shows the synthetic | combination map which synthesize | combined the intermediate | middle map shown in FIG. 15, and the special map shown in FIG. It is a figure which shows an example of a final map. It is a flowchart for demonstrating the process which produces | generates the map in 2nd Embodiment. It is a figure which shows an example of an intermediate map. It is a figure which shows an example of a reference map. It is a figure which shows an example of a final map. 20 is a flowchart for explaining in detail processing from S403 to S405 shown in FIG. It is a figure which expands and shows a part of intermediate map shown in FIG. It is a figure which expands and shows a part of special map shown in FIG. It is a figure which expands and shows a part of intermediate map shown in FIG. It is a figure which shows an example of a final map. It is a figure which shows the state of the expansion on the board | substrate of the resin discharged from the dispenser. It is a figure which shows the relationship between the volume amount of the droplet of resin, and the spreading time of a droplet. It is a flowchart for demonstrating the process which produces | generates the map in 3rd Embodiment. It is a figure which shows an example of a special map.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  FIG. 1 is a schematic diagram illustrating a configuration of the imprint apparatus 100. The imprint apparatus 100 is a lithographic apparatus used in a manufacturing process of a semiconductor device or the like. The imprint apparatus 100 performs an imprint process for forming an imprint material on a substrate with a mold. The imprint apparatus 100 cures the imprint material while the imprint material on the substrate is in contact with the mold, and forms a pattern on the substrate by separating the mold from the cured imprint material. To do. In the present embodiment, a resin is used as the imprint material, and a photocuring method in which the resin is cured by irradiation with ultraviolet rays is employed as the resin curing method. However, the present invention does not limit the resin curing method, and may employ a thermosetting method in which the resin is cured by heat.

  The imprint apparatus 100 includes a head 102 that holds a mold 101, an irradiation unit 103, a stage 105 that holds a substrate 104, a dispenser 110, a resin supply unit 111, a control unit 130, a storage unit 131, and a generation unit. Part 132.

  The mold 101 has a pattern region 101 a in which a pattern to be transferred to the resin 120 supplied to the substrate 104 is formed on the surface facing the substrate 104. The mold 101 has, for example, a rectangular outer shape. The mold 101 is made of a material that transmits ultraviolet light for curing the resin 120 on the substrate, such as quartz.

  The head 102 holds (fixes) the mold 101 by vacuum suction or electrostatic force. The head 102 includes a drive mechanism that drives (moves) the mold 101 in the z-axis direction. The head 102 has a function of impressing the mold 101 on the uncured resin 120 supplied onto the substrate and a function of pulling the mold 101 away from the cured resin 120 on the substrate.

  The irradiation unit 103 has a function of curing the resin 120 on the substrate. The irradiation unit 103 includes, for example, a halogen lamp or LDE, and irradiates the resin 120 on the substrate with ultraviolet rays via the mold 101.

  The substrate 104 is a substrate onto which the pattern of the mold 101 is transferred, and includes, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate.

  The stage 105 includes a substrate chuck that holds the substrate 104 and a drive mechanism for performing alignment (alignment) between the mold 101 and the substrate 104. Such a drive mechanism includes, for example, a coarse drive system and a fine drive system, and drives (moves) the substrate 104 in the x-axis direction and the y-axis direction. In addition, the driving mechanism has a function of driving the substrate 104 not only in the x-axis direction and the y-axis direction but also in the z-axis direction and θ (rotation around the z-axis) direction and a tilt function for correcting the tilt of the substrate 104. May be provided.

  The resin supply unit 111 includes a tank that stores the uncured resin 120. The resin supply unit 111 supplies uncured resin 120 to the dispenser 110 via a supply pipe.

  For example, the dispenser 110 includes a plurality of nozzles that discharge droplets of the resin 120 to the substrate 104 and supplies (applies) the resin 120 onto the substrate. The unit of the supply amount of the resin 120 in the dispenser 110 is “droplet”, and the amount per drop of the resin 120 is several picoliters. The position on the substrate where the resin 120 can be dropped from the dispenser 110 is determined every several μm.

  While supplying the resin 120 from the resin supply unit 111 to the dispenser 110, the stage 105 is driven (scan driving or step driving), and the droplet of the resin 120 is discharged from the dispenser 110, whereby the droplet of the resin 120 is applied onto the substrate. Is formed.

  The control unit 130 includes a CPU, a memory, and the like, and controls the entire (operation) of the imprint apparatus 100. The control unit 130 controls each unit of the imprint apparatus 100 to perform imprint processing. Further, the control unit 130 controls the generation unit 132 to generate a map used for imprint processing, and stores the map in the storage unit 131. Here, the map indicates a supply position of the droplets of the resin 120 on the substrate, and is also called a resin application pattern, an imprint recipe, a drop recipe, or the like.

  FIG. 2 is a schematic diagram illustrating a configuration of the generation unit 132 that generates a map. The generation unit 132 includes an information processing apparatus including a processing unit that processes a map, and includes a design information setting unit 150, a parameter setting unit 151, an extraction unit 152, a droplet number calculation unit 153, and a determination unit 154. And an output unit 155.

  The design information setting unit 150 sets (inputs) the design information of the pattern formed on the mold 101. The parameter setting unit 151 sets (inputs) setting information such as the area of the mold 101 (pattern region 101a), the depth of the uneven shape of the pattern unit, the remaining film thickness (RLT), and the spread of the resin 120. Further, the parameter setting unit 151 sets constraints such as the filling time of the resin 120 into the concave portions of the pattern of the mold 101 and the interval between the droplets of the resin 120 necessary on the substrate.

  The extraction unit 152 extracts a special region from the pattern region 101a of the mold 101 based on the design information set by the design information setting unit 150. In this embodiment, the extraction unit 152 determines the position, size, and shape of the special region. Extract as The special region is a region where a pattern with a large size such as a dummy pattern or an alignment mark or a pattern with a long pattern peripheral length is formed, and is a region that requires a long time to fill the resin 120.

  The droplet number calculation unit 153 calculates the supply amount of the resin 120 to be supplied to the imprint region on the substrate on which the imprint process is performed, that is, the number of droplets of the resin 120. The droplet number calculation unit 153 includes, for example, the design information set by the design information setting unit 150, the special region information extracted by the extraction unit 152, the area and unevenness depth of the mold 101, the remaining film thickness, The number of droplets is calculated based on the volume of the droplets of the resin 120 and the like.

  The determination unit 154 determines the arrangement of the droplets of the resin 120 on the substrate, that is, the supply position of the droplets of the resin 120. The determination unit 154 includes, for example, design information set by the design information setting unit 150, special region information extracted by the extraction unit 152, the number of droplets of the resin 120 calculated by the droplet number calculation unit 153, and parameters Based on the constraint information set by the setting unit 151, the supply position is determined.

  The output unit 155 outputs a map in the indicated format based on the supply position of the droplets of the resin 120 on the substrate determined by the determination unit 154. The map output by the output unit 155 is stored in the storage unit 131.

  In the imprint apparatus 100, a map generated by the generation unit 132 and stored in the storage unit 131 is set in the dispenser 110, and ejection of droplets of each nozzle in the dispenser 110 is controlled according to the map.

  The imprint process in the imprint apparatus 100 will be described in detail. FIG. 3 is a flowchart for explaining imprint processing in the imprint apparatus 100. As described above, the imprint process is performed by the control unit 130 controlling the respective units of the imprint apparatus 100 in an integrated manner.

  In S <b> 100, a mold 101 capable of forming a pattern to be formed on the substrate 104 is carried into the imprint apparatus 100, and the mold 101 is held by the head 102. For example, the mold 101 is formed by forming an uneven pattern corresponding to design information on a transparent quartz substrate used for a photomask. The mold 101 is generally set with an ID for identifying the pattern.

  In S101, the ID of the mold 101 held by the head 102 is read, and the pattern information of the mold 101, specifically, the pattern arrangement, line width and density, or pattern shape measurement result based on the ID. Get etc.

  In S102, dispenser information related to the dispenser 110 mounted on the imprint apparatus 100 is acquired. Here, the dispenser information includes, for example, the type and the number of nozzles of the dispenser 110, the average discharge amount that is discharge performance, the discharge amount variation for each nozzle, the landing position variation on the substrate, and the like. Since the dispenser 110 is generally set with an ID for identifying the dispenser information, the dispenser information related to the dispenser 110 mounted on the imprint apparatus 100 can be acquired by reading the ID. .

  In step S103, the substrate 104 is carried into the imprint apparatus 100, and the substrate 104 is held on the stage 105 as shown in FIG.

  In S104, based on the pattern information of the mold 101 acquired in S101 and the dispenser information of the dispenser 110 acquired in S102, an optimal map is selected from the maps stored in the storage unit 131, and the map is stored in the dispenser 110. Set. As described above, the map indicates the supply position of the droplet of the resin 120 on the substrate. The map is generated based on pattern information such as the pattern arrangement, line width, and density of the mold 101. The map is optimized so that imprint processing can be performed with respect to the target filling time without any defect or abnormality in the remaining film thickness.

  In S105, a shot area that has not been subjected to imprint processing among the shot areas of the substrate is designated as a target shot area. Here, the shot area means an area where a pattern is formed by one imprint process. Further, the target shot area means a shot area where imprint processing will be performed from now on. In this embodiment, for example, as shown in FIG. 4B, imprint processing is performed in the order of shot areas S1, S2, S3, S4,. However, the order of the imprint processing is not limited to the order shown in FIG. 4B, and may be a houndstooth order or a random order.

  In S <b> 106, the dispenser 110 supplies the resin 120 onto the substrate. At this time, as shown in FIG. 4C, the dispenser 110 sequentially discharges the droplets of the resin 120 on the substrate according to the movement of the stage 105 according to the map set in S104. Alternatively, the droplets of the resin 120 may be discharged onto the substrate while the dispenser 110 moves relative to the substrate 104.

  In S107, a stamping process is performed. Specifically, first, as shown in FIG. 5A, the mold 101 is brought close to the substrate 104 to which the resin 120 is supplied. Next, as shown in FIG. 5B, the mold 101 and the resin 120 on the substrate are brought into contact with each other while aligning the mold 101 and the substrate 104. Then, this state is maintained until the pattern of the mold 101 is filled with the resin 120. At the initial stage when the mold 101 and the resin 120 on the substrate are brought into contact with each other, the resin 120 is insufficiently filled into the pattern of the mold 101, and thus a filling defect is generated at the corner of the pattern. However, as time passes, the resin 120 is filled into every corner of the pattern of the mold 101, and the filling defects are reduced. The filling time is shorter for fine patterns such as line and space, and is longer for special patterns such as dummy patterns and alignment marks.

  In S108, a curing process is performed. Specifically, after sufficiently filling the pattern of the mold 101 with the resin 120, as shown in FIG. 5C, the irradiation unit 103 irradiates the resin 120 with ultraviolet rays from the back surface of the mold 101 for a predetermined time, The resin 120 on the substrate is cured.

  In S109, a mold release process is performed. Specifically, as shown in FIG. 5D, the mold 101 is separated from the cured resin 120 on the substrate by widening the interval between the mold 101 and the substrate 104. Thereby, the resin pattern 121 corresponding to the pattern of the mold 101 is formed on the substrate.

  In S110, it is determined whether imprint processing has been performed on all shot regions of the substrate 104. If the imprint process has not been performed on all the shot areas of the substrate 104, the process proceeds to S105 in order to designate a shot area on which the imprint process has not been performed as the target shot area. By repeating the processing from S105 to S110, the resin pattern 121 is formed in all shot regions of the substrate 104. On the other hand, when the imprint process has been performed on all shot areas of the substrate 104, the process proceeds to S111.

  In step S <b> 111, the substrate 104 that has been subjected to the imprint process on all shot areas is unloaded from the imprint apparatus 100. The lower layer side of the substrate 104 carried out from the imprint apparatus 100 is processed (for example, etched) using the resin pattern 121 as a mask. When manufacturing a semiconductor device, these processes are repeated for each layer of the process.

  Hereinafter, in each embodiment, a process (generation method) for generating a map indicating the supply position and supply amount of the droplets of the resin 120 on the substrate will be described in detail.

<First Embodiment>
In the first embodiment, a process of generating a map based on the pattern information of the mold 101 will be described. FIG. 6 is a flowchart for explaining a process of generating a map.

  In S200, a supply amount distribution obtained by calculating the supply amount (application amount) of the resin 120 necessary for each region on the substrate from the pattern design information of the mold 101 is acquired. The supply amount distribution is the position of the pattern (unevenness) in the normal region (for example, a region in which line and space is mainly formed) and a special region (for example, a region in which dummy patterns and alignment marks are mainly formed). , Based on the shape and depth.

  In the present embodiment, as the supply amount distribution information, as shown in FIG. 7, image data obtained by converting the supply amount distribution of the resin 120 on the substrate into light and shade multi-value information is used. Referring to FIG. 7, regions 301 a to 301 c indicate shades calculated based on the pattern position, shape, depth, and the like in the normal region and special region of the mold 101. A region 301a indicates a region where the pattern is deep and the required volume of the resin 120 is large. The region 301b indicates a region where the pattern depth is shallow and the required volume of the resin 120 is smaller than the region 301a. The region 301c has no pattern and indicates a region where the required volume of the resin 120 is smaller than that of the region 301b.

  In S <b> 201, a special area is extracted from the pattern area 101 a of the mold 101 based on the pattern design information of the mold 101. In the present embodiment, the position, size, and shape of the special area of the mold 101 are extracted as special area information. FIG. 8 is a diagram illustrating an example of the special area information. Referring to FIG. 8, areas 302 a and 302 b indicate shades calculated based on the position, shape, depth, and the like of the special area in the pattern area 101 a of the mold 101. The region 302a indicates a region where the pattern area is large, the pattern depth is shallow, and the required volume of the resin 120 is small, and the region 302b indicates that the pattern area is large, the pattern depth is deep, and the required volume of the resin 120 Indicates an area larger than the area 302a. Specifically, a special area in which a special pattern having a dimension larger than a preset reference dimension is extracted from the pattern area 101a of the mold 101, and is converted into light and shade multi-value information.

In the present embodiment, the dimension of the pattern of the mold 101 is calculated using the pattern area (area of the area) and the pattern peripheral length (perimeter of the area), as shown in the following equation (1): The pattern area is divided by the pattern perimeter.
Pattern dimension = (Pattern area) / (Pattern perimeter) (1)
Each of FIG. 9A and FIG. 9B is an enlarged view of regions 302a and 302b shown in FIG. As shown in FIG. 9A, a measurement pattern for measuring the remaining film thickness formed on the substrate 104 on which the imprint process has been performed is formed in the region 302a. The region 302a has a square shape with one side length L1. In the region 302b, an alignment mark for aligning the mold 101 and the substrate 104 in the imprint process is formed, and the alignment mark is configured by a cross pattern having a line width L3. The region 302b has a square shape whose one side is L2. Each of the patterns formed in the regions 302a and 302b has a dimension ((pattern area) / (pattern peripheral length)) larger than the reference dimension.

  In S202, it is necessary in the imprint area on the substrate based on the supply amount distribution information acquired in S200, the special area information extracted in S201, and the size of the droplet of the resin 120 discharged from the dispenser 110. The number of droplets of resin 120 is calculated. Here, the imprint area corresponds to an area where a pattern is formed by one imprint process, that is, one shot area.

  In step S203, based on the supply amount distribution information and the special region information, the position of the droplet of the resin 120 supplied to the first region on the substrate corresponding to the normal region of the pattern region 101a of the mold 101 is determined to be intermediate. Generate a map. In other words, a first map indicating the first supply position of the droplet in the first region on the substrate corresponding to the normal region where the first pattern of the first dimension such as line and space is formed is generated as the intermediate map. To do.

  Specifically, first, multi-value distribution data is generated by removing the special area information extracted in S201 from the supply amount distribution information acquired in S200. A number equal to the number of droplets of the resin 120 to be supplied to the second region on the substrate corresponding to the special region of the mold 101 by generating multi-value distribution data excluding the special region information from the supply amount distribution information. Is removed from the number of droplets calculated in S202. Next, the multi-value distribution data is binarized by halftone processing, and converted into information designating ejection and non-ejection of the droplets of the resin 120 in the dispenser 110, thereby generating an intermediate map. As the halftone process, a known error diffusion method can be used. FIG. 10 is a diagram illustrating an example of the intermediate map generated in S203. In FIG. 10, the supply position (droplet discharge) of the resin 120 on the substrate is indicated by a black dot 304a, and the non-supply position (droplet non-discharge) of the resin 120 on the substrate is indicated by a white point 304b. Is shown.

  In S204, the position of the droplet of the resin 120 supplied to the second region on the substrate corresponding to the special region of the pattern region 101a of the mold 101 based on the special region information and the restriction condition in which the special region is set. To generate a special map. In other words, as the special map, the second supply position of the droplet in the second region on the substrate corresponding to the special region in which the second pattern having the second dimension larger than the first dimension such as the dummy pattern is formed is shown. A second map is generated.

  Specifically, based on the special area information and the constraint conditions, the droplets of the resin 120 are supplied to a position immediately below the center position (center position) in each special area, that is, a position on the substrate corresponding to the center position. Set the position. Here, when the center position of the special region does not coincide with the position where the placement (supply position) of the resin 120 is permitted, the position closest to the center position at the position where the placement of the droplet is allowed is set. Set as supply position. In the present embodiment, the center position of the special region is set as the droplet supply position, but the present invention is not limited to this. For example, the position of the center of gravity of the special area or the position where the depth of the pattern in the special area is the deepest may be set as the droplet supply position. FIG. 11 is a diagram illustrating an example of the special map generated in S204. In FIG. 11, the supply position (droplet discharge) of the resin 120 on the substrate is indicated by a black dot 305a, and the non-supply position (droplet non-discharge) of the resin 120 on the substrate is indicated by a white point 305b. Is shown.

  In S205, a final map is generated based on the intermediate map generated in S203, the special map generated in S204, and the interval of droplets set as the arrangement constraint of the droplets of the resin 120 on the substrate. To do. In other words, the final map is generated by combining the intermediate map and the special map.

  More specifically, the resin 120 droplet supply position in the special map is added to the resin 120 droplet supply position in the intermediate map, and the resin 120 droplet supply position in the intermediate map is set as necessary. adjust. In particular, the droplets of the resin 120 in the intermediate map are arranged so that the interval between the droplet 120 supply position in the special map and the resin 120 droplet supply position in the intermediate map approaches the interval set as the constraint condition. Adjust the supply position. For example, if the supply position of the droplets of the resin 120 in the special map and the supply position of the droplets of the resin 120 in the intermediate map are close to each other, if the imprint process is performed as it is, the remaining film thickness in that region Becomes thicker than the set value. Therefore, it is necessary to adjust (change) the supply position of the droplets of the resin 120 on the substrate so as to approach the interval set as the constraint condition. This means that in the second region on the substrate corresponding to the special region of the mold 101, both the supply position and supply amount of the droplets of the resin 120 are optimized. The relationship between the filling time of the resin 120 into the pattern of the mold 101 and the interval between the droplets of the resin 120 on the substrate is obtained in advance through experiments or the like and set as a constraint condition. In the present embodiment, the interval between the supply position of the droplets of the resin 120 in the special map and the supply position of the droplets of the resin 120 in the intermediate map is adjusted. However, the present invention is not limited to this. Any condition for shortening can be applied.

  12 is a diagram showing a map obtained by combining the intermediate map shown in FIG. 10 and the special map shown in FIG. Referring to FIG. 12, a point 305a corresponding to the supply position of the droplet of resin 120 in the special map is added to a point 304a corresponding to the supply position of the droplet of resin 120 in the intermediate map. FIG. 13 is a diagram illustrating an example of a final map. In FIG. 13, the supply position (droplet discharge) of the resin 120 droplets on the substrate is indicated by black dots 306a, and the non-supply position (droplet non-discharge) of the resin 120 droplets on the substrate is indicated by white dots 306b. Is shown. Referring to FIG. 13, compared with FIG. 12, in the portion where the droplet supply position of the resin 120 is close, in the intermediate map, away from the droplet 120 supply position 305 a in the special map. The droplet supply position 304a of the resin 120 is adjusted. In addition, in the portion where the supply position of the droplet of the resin 120 is remote, the supply position 304a of the droplet of the resin 120 in the intermediate map is adjusted so as to approach the supply position 305a of the droplet of the resin 120 in the special map. Yes.

  In S <b> 206, the map generated in S <b> 205, that is, the final map indicating the supply position of the droplet of the resin 120 on the substrate is stored in the storage unit 131.

  In the present embodiment, the error diffusion method is used as the halftone processing in the process of generating the map. However, the present invention is not limited to this, and other methods such as a dither method can be applied. Also, a technique other than the halftone process can be applied as long as it can arrange a necessary amount of droplets in a necessary area on the substrate. For example, a lattice pattern in which the calculated number of droplets of the resin 120 is arranged at a regular lattice position is also applicable. As the lattice pattern (lattice shape), a lattice using a polygon such as a square lattice, a rectangular lattice, a triangular lattice, a rhombus lattice, or a hexagonal lattice is applicable.

  In this embodiment, data converted into binary information designating ejection and non-ejection of droplets of the resin 120 is used as the map, but the data format is not particularly limited. For example, as the map, it is also possible to use numerical data representing the supply position of the droplets of the resin 120 on the substrate with relative position coordinates on the substrate. In addition, it is possible to add information related to the amount (droplet amount) of each droplet of the resin 120 on the substrate to the map.

  In the present embodiment, when the multi-value distribution data is generated in S203, the special region information is excluded from the supply amount distribution information. However, the present invention is not limited to this. For example, depending on the shape of the special pattern, the filling time may be shortened by increasing the droplets of the resin 120 supplied to the special region. In such a case, it is possible to use the supply amount distribution information as it is or data obtained by increasing the special area information.

  The droplet of resin 120 in the second region on the substrate corresponding to the special region of the mold 101 so that the filling time for the pattern of the mold 101 is shortened and the remaining film thickness formed on the substrate is uniform. It is effective to determine the supply position.

  Here, the processing from S203 to S205 will be described in detail with a specific example. FIG. 14 is a flowchart for explaining in detail the processing from S203 to S205.

  In S300, as described in S203, an intermediate map indicating the supply position of the droplets of the resin 120 in the first region on the substrate corresponding to the normal region of the pattern region 101a of the mold 101 is generated. FIG. 15 is an enlarged view showing a part of the intermediate map shown in FIG. In FIG. 15, the supply position (droplet discharge) of the resin 120 droplets on the substrate is indicated by black dots, and the non-supply position (droplet non-discharge) of the resin 120 droplets on the substrate is indicated by white dots. ing.

  In S301, as described in S204, a special map indicating the supply position of the droplet of the resin 120 in the second region on the substrate corresponding to the special region in the pattern region 101a of the mold 101 is generated. FIG. 16 is an enlarged view showing a part of the special map shown in FIG. In FIG. 16, the supply position (droplet discharge) of the resin 120 on the substrate is indicated by black dots 401a, 401b, and 401c, and among the three black spots 401a to 401c, the black spot 401a and the black spot 401b are close. Exist. This means that the special patterns corresponding to the black spots 401a and 401b in the pattern area 101a of the mold 101 are close to each other. In the pattern region 101a of the mold 101, a plurality of special patterns are generally close to the scribe line region provided in the shot region in order to separate the peripheral portion of the shot region of the substrate 104 and each device. Known to.

  In S302, the intermediate map and the special map are combined, that is, the combined map is generated by adding the supply position of the droplet of the resin 120 in the special map to the supply position of the droplet of the resin 120 in the intermediate map. FIG. 17A is a diagram showing a composite map obtained by combining the intermediate map shown in FIG. 15 and the special map shown in FIG. In FIG. 17A, the supply position (droplet discharge) of the droplets of the resin 120 on the substrate is indicated by black dots. Referring to FIG. 17A, the resin 120 droplet supply position in the special map shown in FIG. 16 is added to the resin 120 droplet supply position in the intermediate map shown in FIG.

  In S303, the supply position of the droplets of the resin 120 in the intermediate map is adjusted in the composite map generated in S302. First, based on the constraint conditions that set the constraints on the placement of the droplets of the intermediate map and the resin 120, the supply position of the droplets of the resin 120 corresponding to the special pattern, that is, the normal pattern existing in the vicinity of the black spots 401a to 401c. The supply position of the droplet of the resin 120 corresponding to is selected. Here, as the constraint condition, a distance from the droplet 120 supply position corresponding to the special pattern is set as a condition for selecting the droplet 120 supply position corresponding to the normal pattern. In the present embodiment, the distance is set to 500 μm, and the droplet 120 supply position of the resin 120 corresponding to the normal pattern within a range of 500 μm or less from the droplet supply position of the resin 120 corresponding to the special pattern. Select. However, among the supply positions of the droplets of the resin 120 corresponding to the special pattern, there is no supply position of the droplets of the resin 120 corresponding to the normal pattern in a range within 500 μm from the supply position corresponding to the black spot 401c. In such a case, the droplet supply position of the resin 120 corresponding to the normal pattern existing at the shortest distance (that is, the closest) from the droplet supply position of the resin 120 corresponding to the black spot 401c is selected. do it.

  FIG. 7B is a diagram showing a droplet supply position of the resin 120 corresponding to the special pattern, that is, a range 402 of 500 μm from each of the black spots 401a to 401c in the composite map shown in FIG. . In FIG. 7B, among the supply positions of the droplets of the resin 120 corresponding to the normal pattern, supply positions selected as supply position adjustment targets are indicated by points 403a, 403b, 403c, and 403d. The supply positions corresponding to the points 403a, 403b, and 403c are within the range of 500 μm from the supply position corresponding to the black points 401a and 401b among the supply positions of the droplets of the resin 120 corresponding to the special pattern. , Has been selected for adjustment. On the other hand, the supply position corresponding to the point 403d is selected as the adjustment target because the distance from the supply position corresponding to the black point 401c is the shortest among the droplet 120 supply positions corresponding to the special pattern. .

  Next, the supply position of the droplet of the resin 120 selected as the adjustment target is adjusted (moved) in consideration of the supply position of the droplet of the resin 120 corresponding to the special pattern. In this embodiment, the resin 120 corresponding to the normal pattern selected as the adjustment target by applying a repulsive force or an attractive force to each of the three black dots 401a to 401c in the droplet 120 supply position of the resin 120 corresponding to the special pattern. The droplet supply position is determined. Here, as another constraint, the maximum distance that can be separated because adjacent droplets contact each other on the substrate after the droplets of the resin 120 are supplied onto the substrate until the droplets are formed by the mold 101. Set the interval. In this embodiment, the interval is set to 300 μm. When the droplet 120 supply position corresponding to the normal pattern selected as the adjustment target exists within the range of 300 μm from the droplet 120 supply position corresponding to the special pattern. , Use repulsion. The reason why the force acting on the droplet supply position within the range of 300 μm from the droplet supply position of the resin 120 corresponding to the special pattern is a repulsive force will be described. For example, when the supply position of the droplets of the resin 120 corresponding to the special pattern and the supply position of the droplets of the resin 120 corresponding to the normal pattern are close to each other, the imprint process is performed on the substrate as it is. The remaining film thickness is thicker than the set value. This is because the volume of the droplet of the resin 120 becomes larger than necessary in the special region of the mold 101. Therefore, when the supply position of the droplets of the resin 120 on the substrate is too close, the supply position is set so that the droplets of the resin 120 on the substrate are separated from each other by bringing the interval between the supply positions closer to the set interval. Adjust (change). In other words, the resin 120 droplet supply position is adjusted so that the resin 120 droplet supply position and supply amount in the second region on the substrate corresponding to the special region of the mold 101 are optimized.

  As described above, in the present embodiment, when combining the intermediate map and the special map, among the droplets in the intermediate map, a certain droplet supply position and a droplet supply position in the special map adjacent to the supply position. A droplet whose interval is outside the allowable range is selected. Then, for the selected droplet, the droplet supply position in the intermediate map is adjusted so that the interval falls within the allowable range. Specifically, among the droplets in the intermediate map, the droplets that exceed the upper limit of the allowable range are adjusted so that the droplet supply position approaches the droplet supply position in the special map. The upper limit of the allowable range is that, as described above, adjacent droplets on the substrate come in contact between the time when the droplets of the resin 120 are supplied onto the substrate and the time when the droplets are formed by the mold 101. Set the maximum distance that can be separated. Further, among the droplets in the intermediate map, the supply position of the droplet exceeding the lower limit of the allowable range is adjusted so that the supply position of the droplet is away from the supply position of the droplet in the special map. Note that the lower limit of the allowable range is determined based on the remaining film thickness (set value) to be formed on the substrate when the resin 120 on the substrate is molded by the mold 101 as described above.

  In S304, a final map is generated based on the supply position of the droplets of the resin 120 in the composite map generated in S302 and the intermediate map adjusted in S303.

  FIG. 18 shows a droplet supply position (points 403a to 403d) of the resin 120 corresponding to the normal pattern by applying a repulsive force or an attractive force to the supply position (black dots 401a to 401c) of the resin 120 corresponding to the special pattern. It is a figure which shows the final map obtained by adjusting this. In FIG. 18, the supply positions of the droplets of the resin 120 corresponding to the normal pattern in the intermediate map, that is, the supply positions after adjusting each of the points 403a to 403d are indicated by points 405a to 405d. FIG. 18 also shows a droplet supply position of the resin 120 corresponding to the special pattern, that is, a range 404 of 300 μm from each of the black dots 401a to 401c. Referring to FIG. 18, the supply position of the droplet of resin 120 corresponding to the normal pattern, that is, each of the points 405 a to 405 d is adjusted to approach the range 404. Specifically, the points 405 a to 405 c are adjusted so as to be away from the black points 401 a and 401 b that are the supply positions of the droplets of the resin 120 corresponding to the special pattern and to approach the range 404. On the other hand, the point 405d is adjusted so as to approach the black point 401c, which is the supply position of the droplet of the resin 120 corresponding to the special pattern, and to approach the range 404. Therefore, the droplet supplied to the black spot 401a and the droplet supplied to the spot 405a are in contact between the time when the droplet of the resin 120 is supplied onto the substrate and the time when the droplet is formed by the mold 101. become. In other words, the droplet supplied to the black point 401a and the droplet supplied to the point 405a are in contact until the resin 120 supplied on the substrate comes into contact with the mold 101. The droplets supplied to the black dots 401b and the droplets supplied to the points 405b and 405c are in contact between the time when the droplets of the resin 120 are supplied onto the substrate and the time when the droplets are formed by the mold 101. Will do. In other words, the droplets supplied to the black dots 401b and the droplets supplied to the points 405b and 405c are in contact until the resin 120 supplied on the substrate comes into contact with the mold 101. Become. Similarly, the droplet supplied to the black point 401c and the droplet supplied to the point 405d are from the time when the droplet of the resin 120 is supplied onto the substrate until the droplet is formed by the mold 101 (on the substrate). Until the resin 120 supplied to the mold 101 comes into contact with the mold 101). Since the filling of the resin 120 into the special region of the mold 101 is equal to the time required for filling in the depth direction, the filling is performed in a very short time.

  In this embodiment, two types of distances or intervals from the droplet supply position of the resin 120 corresponding to the special pattern are set as the constraint conditions, but the present invention is not limited to this. A condition in which a range is set based on data obtained by measuring the filling time of the resin 120 in the special region of the mold 101 in advance can also be applied. For example, in the present embodiment, the maximum distance that can be separated because adjacent droplets contact each other on the substrate after the droplets of the resin 120 are supplied onto the substrate until the droplets are formed by the mold 101. Is set. However, even when adjacent droplets do not contact on the substrate, it is possible to obtain an effect by keeping them as close as possible.

  Furthermore, in this embodiment, all the droplet 120 supply positions corresponding to the normal pattern that are within the specified range from the droplet 120 supply position corresponding to the special pattern are selected as adjustment targets. However, the present invention is not limited to this. For example, a part of supply positions of the droplets of the resin 120 corresponding to the normal pattern may be selected as an adjustment target based on experimental data.

  In this embodiment, repulsive force or attractive force is applied only to the droplet supply position of the resin 120 corresponding to the special pattern, but the same force is also applied to the droplet 120 supply position corresponding to the normal pattern. It is also possible to work. Even in such a case, it is necessary to appropriately determine whether to set repulsive force or attractive force.

  In the present embodiment, the supply position of the droplets of the resin 120 corresponding to the normal pattern is adjusted according to the distance from the supply position of the droplets of the resin 120 corresponding to the special pattern. Is not to be done. For example, according to the distance from the droplet supply position of the resin 120 corresponding to the special pattern, the droplet supply position of the resin 120 corresponding to the normal pattern is simply moved away from the center position of the special area. You may let them. In other words, the droplet supply position is adjusted in consideration of the relationship between the droplet supply position of the resin 120 corresponding to the special pattern and the droplet supply position of the resin 120 corresponding to the normal pattern. It is only necessary that the filling time of the resin 120 in the region can be shortened.

  According to this embodiment, the filling time of the resin 120 is shortened by adjusting the supply position of the droplet of the resin 120 corresponding to the normal pattern with respect to the supply position of the droplet of the resin 120 corresponding to the special pattern. In addition, filling defects can be reduced and the remaining film thickness can be made uniform. Thus, in this embodiment, it is possible to generate a map that is advantageous in reducing the filling time of the resin 120 and realizing the uniformity of the remaining film thickness.

<Second Embodiment>
In the second embodiment, a process of generating a map corresponding to the entire surface of the pattern region 101a of the mold 101 and adjusting the supply position of the droplets of the resin 120 in the map to generate a final map will be described. FIG. 19 is a flowchart for explaining a process of generating a map.

  Since the processes of S400 to S402 are the same as the processes of S200 to S202 described in the first embodiment, detailed description thereof is omitted here.

  In S403, based on the supply amount distribution information, the position of the droplet of the resin 120 supplied to the region on the substrate corresponding to the entire surface of the pattern region 101a of the mold 101 is determined, and an intermediate map is generated. In other words, as the intermediate map, a first map indicating the droplet supply position in the region on the substrate corresponding to the entire surface of the pattern region 101a of the mold 101 is generated.

  Specifically, the multi-value distribution data of the supply amount distribution information acquired in S400 is binarized by halftone processing, and converted into information designating discharge and non-discharge of the droplets of the resin 120 in the dispenser 110. Generate an intermediate map. As the halftone process, a known error diffusion method can be used as in the first embodiment. FIG. 20 is a diagram illustrating an example of the intermediate map generated in S403. In FIG. 20, the supply position (droplet discharge) of the resin 120 droplets on the substrate is indicated by black dots 501a, and the non-supply position (droplet non-discharge) of the resin 120 droplets on the substrate is indicated by white dots 501b. Is shown.

  In S404, a reference map in which a reference position for considering the position of the special area is set is generated based on the special area information and the restriction condition in which the restriction in the special area is set.

  Specifically, based on the special area information and the constraint conditions, the reference position is set at a position immediately below the center position (center position) in each special area, that is, a position on the substrate corresponding to the center position. Here, when the center position of the special region does not coincide with the position where the liquid droplet placement (supply position) of the resin 120 is allowed, the position closest to the center position at the position where the liquid drop placement is allowed is set as the reference position. Set. In the present embodiment, the center position of the special area is set as the reference position, but the present invention is not limited to this. For example, the position of the center of gravity of the special area or the position where the depth of the pattern in the special area is the deepest may be set as the reference position. FIG. 21 is a diagram illustrating an example of the reference map generated in S404. In FIG. 21, a reference position on the substrate is indicated by a black point 502a, and a position other than the reference position on the substrate is indicated by a white point 502b.

  In S405, a final map is generated based on the intermediate map generated in S403, the reference map generated in S404, and the droplet interval set as the arrangement constraint of the droplets of the resin 120 on the substrate. To do.

  Specifically, in consideration of the reference map, among the supply positions of the droplets of the resin 120 in the intermediate map, the supply position located in the area on the substrate corresponding to the vicinity of the special area is adjusted (moved). ) Generate the final map. In particular, the supply position of the droplets of the resin 120 in the intermediate map is adjusted so that the interval between the reference position in the reference map and the supply position of the droplets of the resin 120 in the intermediate map approaches the interval set as the constraint condition. Similar to the first embodiment, the interval as the constraint condition can be obtained by experiment and set to make the remaining film thickness uniform.

  FIG. 22 is a diagram illustrating an example of the final map generated in S405. In FIG. 22, the supply position (droplet discharge) of the droplet of the resin 120 on the substrate is indicated by a black dot 503a, and the non-supply position (droplet non-discharge) of the droplet of the resin 120 on the substrate is indicated by a white point 503b. Is shown. Referring to FIG. 22, the supply position of the resin 120 droplets in the intermediate map shown in FIG. 24 is adjusted so that the supply position is located in the vicinity of the black point 502a corresponding to the reference position.

  In S <b> 406, the map generated in S <b> 405, that is, the final map indicating the supply position of the droplets of the resin 120 on the substrate is stored in the storage unit 131.

  In the present embodiment, various calculations and settings used in the process of generating the map are not particularly limited as in the first embodiment, and satisfy the conditions for shortening the filling time of the resin 120. If so, it is applicable.

  Here, the processing from S403 to S405 will be described in detail with a specific example. FIG. 23 is a flowchart for explaining the processing from S403 to S405 in detail.

  In S500, as described in S403, an intermediate map indicating the supply position of the droplets of the resin 120 in the region on the substrate corresponding to the entire surface of the pattern region 101a of the mold 101 is generated. 24 is an enlarged view of a part of the intermediate map shown in FIG. In FIG. 24, the supply position (droplet discharge) of the resin 120 on the substrate is indicated by a black dot, and the non-supply position (droplet non-discharge) of the resin 120 on the substrate is indicated by a white dot. ing.

  In S501, as described in S404, a reference map in which a reference position is set is generated. FIG. 25 is an enlarged view of a part of the reference map shown in FIG. In FIG. 21, the reference positions are indicated by points 601a, 601b, and 601c, and among the three points 601a to 601c, the point 601a and the point 601b are close to each other.

  In S502, the supply position of the droplet of resin 120 in the intermediate map generated in S500 is adjusted. First, the reference position, that is, the supply position of the droplets of the resin 120 existing in the vicinity of the points 601a to 601c is selected on the basis of the constraint conditions that set the constraints on the arrangement of the droplets of the intermediate map, the reference map and the resin 120 To do. Here, as the constraint condition, a distance from the reference position is set as a condition for selecting the supply position of the droplet of the resin 120 in the intermediate map. In the present embodiment, the distance is set to 500 μm, and the supply position of the droplets of the resin 120 existing within the range of the distance from the reference position within 500 μm is selected. However, when there is no supply position of the droplet of the resin 120 within the range of 500 μm from the reference position, the supply position that is present at the shortest distance from the reference position (that is, the closest) may be selected.

  26 is a diagram in which points 601a to 601c corresponding to the reference positions in the reference map shown in FIG. 25 and a range 602 of 500 μm from the points 601a to 601c are added to the intermediate map shown in FIG. . In FIG. 26, among the supply positions of the droplets of the resin 120 in the intermediate map, supply positions selected as supply position adjustment targets are indicated by points 603a, 603b, 603c, 603d, 603e, and 603f. The supply positions corresponding to the points 603a to 603f are selected as adjustment targets because the distance from at least one of the points 601a and 601b corresponding to the reference position is within a range of 500 μm. On the other hand, the supply positions corresponding to the points 603e and 603f are selected as adjustment targets because the distance from the point 601c corresponding to the reference position is the shortest.

  Next, the supply position of the droplet of the resin 120 selected as the adjustment target is adjusted (moved) in consideration of the reference position. In the present embodiment, an attractive force is applied to each of the three reference positions, that is, the three points 601a to 601c, and the supply position of the droplet of the resin 120 selected as the adjustment target is determined. In other words, the attractive force is set to each of the points 601a to 601c so that the supply position of the droplet of the resin 120 selected as the adjustment target approaches each of the points 601a to 601c which are reference positions. At this time, with respect to the supply position (points 603e and 603f) of the droplets of the resin 120 whose distance from the reference position is outside the range of 500 μm, the points 601a and 601b are set at the point 601c so that a larger attractive force is applied. Set an attractive force greater than the attractive force to be applied. Here, as another constraint, the maximum distance that can be separated because adjacent droplets contact each other on the substrate after the droplets of the resin 120 are supplied onto the substrate until the droplets are formed by the mold 101. Set the interval. In the present embodiment, the interval is set to 300 μm, as in the first embodiment.

  In S503, a final map is generated based on the supply position of the droplets of the resin 120 in the intermediate map generated in S500 and the intermediate map adjusted in S502.

  FIG. 27 is a diagram illustrating a final map obtained by adjusting the droplet supply position (points 603a to 603f) of the resin 120 by applying an attractive force to the reference positions (points 601a to 601c). In FIG. 27, the supply positions of the droplets of the resin 120 in the intermediate map, that is, the supply positions after adjusting the points 603a to 603f are indicated by points 605a to 605f. FIG. 27 also shows a reference position, that is, a range 604 of 300 μm from each of the points 601a to 601c.

  Referring to FIG. 27, the supply position of the droplet of resin 120 in the intermediate map, that is, each of the points 605 a to 605 f is adjusted so as to approach the range 604. Specifically, the points 605a and 605c that are the supply positions of the droplets of the resin 120 in the intermediate map are adjusted to be the same as the points 601a and 601b corresponding to the reference positions. Also, each of the points 605 b and 605 d which are the supply positions of the droplets of the resin 120 in the intermediate map is adjusted so as to approach the range 604. On the other hand, the points 605e and 605f, which are the supply positions of the droplets of the resin 120 in the intermediate map, are adjusted so as to approach the range 404 and to have the same distance from the point 601c corresponding to the reference position. Yes. This is because the points 603e and 603f, which are the supply positions before adjustment, exist at positions where the distances from the point 601c corresponding to the reference position are equal, and therefore, the attractive forces acting on them are the same. Therefore, the liquid droplet supplied to the point 605a and the liquid droplet supplied to the point 605b are from the time when the liquid droplet of the resin 120 is supplied onto the substrate to the time when the droplet is formed by the mold 101 (on the substrate). Until the supplied resin 120 and the mold 101 come into contact with each other). In addition, the droplet supplied to the point 605c and the droplet supplied to the point 605d are in contact between the time when the droplet of the resin 120 is supplied onto the substrate and the time when the droplet is formed by the mold 101. become. Similarly, the liquid droplet supplied to the point 605e and the liquid droplet supplied to the point 605f come into contact between the time when the liquid droplet of the resin 120 is supplied onto the substrate and the time when the liquid droplet is formed by the mold 101. It will be. Since the filling of the resin 120 into the special region of the mold 101 is equal to the time required for filling in the depth direction, the filling is performed in a very short time.

  As described above, in the present embodiment, the interval between the reference position on the substrate corresponding to the position of the special pattern among the patterns of the mold 101 and the supply position of the droplet of the resin 120 adjacent to the reference position is within an allowable range. The droplet supply position in the intermediate map is adjusted so as to fall within the range. As described above, the special pattern is a pattern (dummy pattern or alignment mark) having a dimension larger than the reference dimension among the patterns of the mold 101. At this time, the droplet supply position in the intermediate map may be adjusted so that the reference position is the same as the droplet supply position of the resin 120. Further, the allowable range is a maximum interval that can be separated because the adjacent droplets contact on the substrate between the time when the droplet is supplied onto the substrate and the time when the droplet is formed by the mold 101, and It is determined based on the remaining film thickness to be formed on the substrate.

  In the present embodiment, the two supply positions that are close to the reference position are adjusted to have the same distance from the reference position, but the present invention is not limited to this. Depending on the ratio of the distance from the reference position, the supply position may be adjusted to exist within the range of the constraint condition.

  According to the present embodiment, the filling position of the resin 120 is adjusted by adjusting the supply position of the droplet of the resin 120 corresponding to the entire surface of the pattern area 101a of the mold 101 in consideration of the reference position corresponding to the position of the special area. Time can be shortened, filling defects can be reduced, and the remaining film thickness can be made uniform. Thus, in this embodiment, it is possible to generate a map that is advantageous in reducing the filling time of the resin 120 and realizing the uniformity of the remaining film thickness.

<Third Embodiment>
In the third embodiment, a first size droplet is supplied to the first region on the substrate corresponding to the normal region, and the second region on the substrate corresponding to the special region is smaller than the first size. A process for generating a map when supplying droplets of two sizes will be described. In the third embodiment, when the resin 120 is supplied onto the substrate, droplets of the first size (normal droplet amount) or droplets of the second size (droplet amount smaller than normal) are supplied. The dispenser 110 is set so that it can be discharged. For example, the second size is set to be ½ of the first size. In this case, in order to obtain the same droplet amount, it is necessary to double the number of droplets in the second size with respect to one first size droplet. FIG. 28 is a diagram illustrating a state in which droplets of the resin 120 discharged from the dispenser 110 spread on the substrate. FIG. 28 shows the spread of the first size droplet 700a on the substrate and the spread of the second size droplet 700b on the substrate.

  Here, the reason why the second size droplet is supplied to the second region on the substrate corresponding to the special region of the mold 101 will be described. FIG. 29 is a diagram showing the relationship between the volume amount as the size of the droplets of the resin 120 and the spreading time of the droplets of the resin 120 in the mold 101. Referring to FIG. 29, it can be seen that the filling time of the pattern of the mold 101 is shortened by reducing the volume of the droplet of the resin 120. Therefore, when supplying the same amount of droplets of the resin 120 on the substrate, the filling time can be shortened by supplying droplets having a small volume. As described above, the special region in the pattern region 101a of the mold 101 is a region in which the filling time is longer than the normal region. Therefore, supplying the second size droplets to the second region on the substrate corresponding to the special region is very effective for shortening the filling time. On the other hand, if the size of the droplets of the resin 120 is reduced, the required number of droplets increases. Therefore, it is necessary to use the dispenser 110 that can eject the droplets of the resin 120 at high speed. However, an increase in the number of ejections of the resin 120 droplets shortens the life of the dispenser 110. Furthermore, reducing the size of the droplets of the resin 120 may cause ejection instability factors such as satellites and mist. Therefore, it is not preferable from the viewpoint of the reliability of the dispenser 110 to supply the droplets of the resin 120 with a reduced size to all regions on the substrate. Therefore, in the present embodiment, the first size droplet is supplied to the first area on the substrate corresponding to the normal area, and the second area on the substrate corresponding to the special area is smaller than the first size. Two size droplets are to be supplied.

  FIG. 30 is a flowchart for explaining a process of generating a map. Since each process of S600 to S602 is the same as the process of S200 to S202 described in the first embodiment, a detailed description thereof is omitted here.

  In step S603, based on the supply amount distribution information and the special region information, the position of the droplet of the resin 120 supplied to the first region on the substrate corresponding to the normal region in the pattern region 101a of the mold 101 is determined to be intermediate. Generate a map. In other words, as the intermediate map, the first supply position of the first size droplet in the first area on the substrate corresponding to the normal area where the first pattern of the first dimension such as line and space is formed is shown. One map is generated.

  In step S604, the position of the droplet of the resin 120 supplied to the second region on the substrate corresponding to the special region of the pattern region 101a of the mold 101 based on the special region information and the constraint condition in which the special region is set. To generate a special map. In other words, as the special map, a second size smaller than the first size in the second region on the substrate corresponding to the special region in which the second pattern having the second dimension larger than the first dimension, such as a dummy pattern, is formed. A second map indicating the second supply position of the droplets is generated.

  Specifically, based on the special area information and the constraint conditions, the droplets of the resin 120 are supplied to a position immediately below the center position (center position) in each special area, that is, a position on the substrate corresponding to the center position. Set the position. Here, when the center position of the special region does not coincide with the position where the placement (supply position) of the resin 120 is permitted, the position closest to the center position at the position where the placement of the droplet is allowed is set. Set as supply position. Adjacent droplet supply positions are set to be equal to the interval set as a constraint. As in the case of the other embodiments, the interval between the liquid droplets of the resin 120 supplied on the substrate and the time when the droplets are formed by the mold 101 is in contact with the adjacent droplets on the substrate. Set the maximum distance that can be separated. Here, between the time when the droplet of the resin 120 is supplied onto the substrate and the time when the droplet is formed by the mold 101, the resin 120 supplied on the substrate and the mold 101 come into contact as described above. Until. Further, the size (second size) of the droplet of resin 120 supplied to the second region on the substrate corresponding to the special region is the size of the droplet of resin 120 supplied to the first region on the substrate corresponding to the normal region. One half of the size (first size) is used. Therefore, it is necessary to double the number of droplet 120 supply positions on the special map. Further, at this time, it is necessary to adjust the supply position of the droplets of the resin 120 on the reference map so that the interval between the droplets of the second size adjacent to each other falls within the allowable range. Such an allowable range is the maximum distance that can be separated because the adjacent droplets contact on the substrate between the time when the droplet is supplied to the substrate and the time when the droplet is formed by the mold 101, and the substrate It is determined based on the remaining film thickness to be formed above.

  FIG. 31 is a diagram illustrating an example of the special map generated in S604. In FIG. 31, the supply position (droplet discharge) of the resin 120 on the substrate is indicated by a black dot 701a, and the non-supply position (droplet non-discharge) of the resin 120 on the substrate is indicated by a white point 701b. Is shown. Referring to FIG. 31, compared to the reference map shown in FIG. 11 (a special map in the case of supplying a first size droplet), the number of droplet 120 supply positions of the resin 120 is doubled. I understand that.

  In S605, a final map is generated based on the intermediate map generated in S603 and the special map generated in S604. In other words, the final map is generated by combining the intermediate map and the special map.

  In S <b> 606, the map generated in S <b> 605, that is, the final map indicating the supply position of the droplets of the resin 120 on the substrate is stored in the storage unit 131.

  In the present embodiment, the map is generated for each droplet size of the resin 120 supplied onto the substrate, but the present invention is not limited to this. For example, in the map indicating the supply position of the droplet of the resin 120 in the area on the substrate corresponding to the entire surface of the pattern area 101a of the mold 101, the dispenser 110 generates size information specifying the droplet size for each supply position. May be controlled.

  In the present embodiment, the second size is set to ½ of the first size, but the present invention is not limited to this. Any size can be applied as long as the ejection of the droplets of the resin 120 from the dispenser 110 is stable and sufficiently reliable.

  In the present embodiment, the intermediate map indicating the supply position of the first size droplet in the first region on the substrate corresponding to the normal region, and the second size liquid in the second region on the substrate corresponding to the special region. Each of the special maps indicating the drop supply position is generated. Then, by synthesizing the intermediate map and the special map to generate a final map, the filling time of the resin 120 can be shortened, filling defects can be reduced, and the remaining film thickness can be made uniform. Thus, in this embodiment, it is possible to generate a map that is advantageous in reducing the filling time of the resin 120 and realizing the uniformity of the remaining film thickness.

  The present invention supplies a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program This process can be realized. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 100: Imprint apparatus 101: Mold 104: Board | substrate 110: Dispenser 120: Resin 130: Control part 131: Storage part 132: Generation part

Claims (11)

In an imprint process for forming a pattern of an imprint material on a substrate using a mold, a generation method for generating a map indicating a supply position of droplets of the imprint material on the substrate,
Generating a first map indicating a first supply position of the imprint liquid droplets in the first region on the substrate corresponding to a region where the first pattern of the first dimension is formed in the pattern region of the mold. A first step of
Second indicating a second supply position of the droplet of the imprint material in a second region on the substrate corresponding to a region where a second pattern having a size larger than the first size is formed in the pattern region. A second step of generating a map ;
And a third step of generating the map by combining the first map and the second map ,
In the third step, when combining the first map and the second map , among the first supply positions of the droplets of the imprint material in the first map , the first supply position and the second map With respect to the supply position of the droplets of the imprint material whose interval from the second supply position adjacent to the first supply position is outside the allowable range, the first supply position is set so that the interval falls within the allowable range. A generation method comprising an adjustment step of adjusting. Wherein in the adjustment step, one of the first supply position of the liquid droplet of the imprint material in the first map, the supply position of the liquid droplet of the imprintable material exceeding the upper limit of the allowable range, of the imprint material The generation method according to claim 1, wherein the first supply position is adjusted so that the first supply position of the droplet is brought close to the second supply position. The upper limit of the allowable range, the imprint adjacent in the substrate between the supplying droplets of the imprint material on the substrate until the drop of the imprint material and the mold are in contact The generation method according to claim 2, wherein the generation method is determined based on a maximum distance at which the droplets of the material can be separated to come into contact with each other. Wherein in the adjustment step, one of the first supply position of the liquid droplet of the imprint material in the first map, the supply position of the liquid droplet of the imprintable material which exceeds the lower limit of the allowable range, of the imprint material 4. The generation method according to claim 1, wherein the first supply position is adjusted such that the first supply position of the droplet is moved away from the second supply position. 5.   The lower limit of the allowable range is determined based on the thickness of the imprint material to be formed on the substrate when the imprint material pattern is formed on the substrate using the mold. The generation method according to claim 4. In an imprint process for forming a pattern of an imprint material on a substrate using a mold, a generation method for generating a map indicating a supply position of droplets of the imprint material on the substrate,
Generating a first map indicating a first supply position of a first size droplet in a first region on the substrate corresponding to a region where a first pattern of a first dimension is formed in a pattern region of the mold; The first step;
The droplets of the second size smaller than the first size in the second region on the substrate corresponding to the region where the second pattern having a size larger than the first size is formed in the pattern region of the mold. A second step of generating a second map indicating the second supply position;
And a third step of generating the map by combining the first map and the second map ,
The generation method characterized in that the third step includes an adjustment step of adjusting the second supply position so that the interval between the droplets of the second size adjacent to each other is within an allowable range. The allowable range, the imprint material to be adjacent the substrate during the supplying droplets of the imprint material on the substrate until the drop of the imprint material and the mold are in contact The maximum distance that can be separated for the droplets to come into contact with each other, and the thickness of the imprint material to be formed on the substrate when the imprint material pattern is formed on the substrate using the mold The generation method according to claim 6, wherein the generation method is determined based on: Information processing apparatus having a processing unit for performing processing for generating a map indicating a supply position of droplets of the imprint material on the substrate in imprint processing for forming a pattern of the imprint material on the substrate using a mold Because
The processor is
Generating a first map indicating a first supply position of the imprint liquid droplets in the first region on the substrate corresponding to a region where the first pattern of the first dimension is formed in the pattern region of the mold. A first step of
Second indicating a second supply position of the droplet of the imprint material in a second region on the substrate corresponding to a region where a second pattern having a size larger than the first size is formed in the pattern region. A second step of generating a map ;
Performed, a third step of generating the map by synthesizing the second map and the first map,
In the third step, when combining the first map and the second map , among the first supply positions of the droplets of the imprint material in the first map , the first supply position and the second map With respect to the supply position of the droplets of the imprint material whose interval from the second supply position adjacent to the first supply position is outside the allowable range, the first supply position is set so that the interval falls within the allowable range. An information processing apparatus comprising an adjusting step for adjusting. Information processing apparatus having a processing unit for performing processing for generating a map indicating a supply position of droplets of the imprint material on the substrate in imprint processing for forming a pattern of the imprint material on the substrate using a mold Because
The processor is
Generating a first map indicating a first supply position of a first size droplet in a first region on the substrate corresponding to a region where a first pattern of a first dimension is formed in a pattern region of the mold; The first step;
The droplets of the second size smaller than the first size in the second region on the substrate corresponding to the region where the second pattern having a size larger than the first size is formed in the pattern region of the mold. A second step of generating a second map indicating the second supply position;
Performed, a third step of generating the map by synthesizing the second map and the first map,
The information processing apparatus according to claim 3, wherein the third step includes an adjustment step of adjusting the second supply position so that an interval between the droplets of the second size adjacent to each other is within an allowable range. An imprint method for forming a pattern of an imprint material on a substrate using a mold,
Using the generation method according to any one of claims 1 to 7 to generate a map indicating a supply position of droplets of the imprint material on the substrate;
Supplying droplets of the imprint material on the substrate according to the map ;
Forming a droplet of the imprint material supplied on the substrate with the mold;
The imprint method characterized by having. Forming an imprint material pattern on a substrate using the imprint method according to claim 10 ;
A processing step of processing the substrate on which the pattern is formed in the step,
A method for manufacturing an article, wherein the article is manufactured from the substrate processed by the processing step.

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