JP6331934B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

Conventionally, a light-emitting device in which a phosphor-containing layer (wavelength conversion member) that converts the wavelength of light from the light-emitting element is formed on the upper surface of the light-emitting element is known. With such a configuration, a light-emitting device that expresses a desired emission color can be obtained.
However, depending on the method of forming the wavelength conversion member, there is a problem in that the film thickness of the wavelength conversion member is non-uniform, and the color unevenness of the emission color due to this occurs.
Therefore, a light emitting device is proposed in which a non-radiating portion that does not emit light from the light emitting element is formed at a corner portion of the light emitting element where the film thickness of the wavelength conversion member is reduced (Patent Document 1).

JP 2010-92897 A

However, when a non-radiating portion is formed in the light emitting element, the light output of the light emitting element may be reduced.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a light-emitting device that can more reliably improve color unevenness without causing a decrease in light output.

  In the present disclosure, after the phosphor-containing resin is disposed on the upper surface of the light emitting element, the normal direction of the upper surface of the light emitting element is set as an axis inclined from the vertical direction, and the light emitting element is tilted and rotated around the axis. The manufacturing method of the light-emitting device containing.

  According to the method for manufacturing a light emitting device according to an embodiment of the present invention, it is possible to more reliably improve color unevenness without causing a decrease in light output.

It is a schematic cross-sectional schematic diagram of the light emitting element for demonstrating rotation of the light emitting element of one Embodiment of this invention. It is a schematic cross-sectional schematic diagram of the light emitting element for demonstrating another rotation of the light emitting element of one Embodiment of this invention. It is a schematic perspective view which shows the inclination rotation apparatus used by rotation of the light emitting element of one Embodiment of this invention. It is a schematic cross-sectional schematic diagram of the light emitting element for demonstrating the movement of the fluorescent substance in rotation of the light emitting element of one Embodiment of this invention.

  The present inventor is responsible for the occurrence of uneven color in the light-emitting element, in particular, the type, particle size, and amount of the phosphor applied to the light-emitting element, the type of resin that fixes the phosphor to the light-emitting element, the viscosity, Intensive research was conducted on the content ratio with the resin, the form in which the phosphor was applied to the light emitting element / the method of application (the orientation and state of the upper surface of the light emitting element when the phosphor was applied to the light emitting element), and the like. As a result, by controlling the sedimentation direction of the phosphor in the phosphor-containing resin on the upper surface of the light-emitting element, it becomes possible to arrange the phosphor while improving the uniformity of the phosphor on the entire upper surface of the light-emitting element. As a result, the present invention has been completed.

  Therefore, in the method for manufacturing a light emitting device according to the embodiment of the present invention, first, a phosphor-containing resin is disposed on the upper surface of the light emitting element. Thereafter, the normal direction of the upper surface of the light emitting element is set as an axis inclined from the vertical direction, and the light emitting element is tilted and rotated about this axis.

(Light emitting element)
The light emitting element used in the present invention means an element called a so-called light emitting diode. Among them, a laminated structure of semiconductor layers including various light emitting layers such as nitride semiconductors such as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN, III-V group compound semiconductors, II-VI group compound semiconductors on the substrate. Are formed.

  The light emitting element may be one in which positive and negative electrodes are respectively formed on the upper surface and the lower surface facing each other, and both positive and negative electrodes may be formed on the same surface side. One positive electrode and one negative electrode may be formed, or two or more of each may be formed.

  The material, film thickness, and structure of the electrode are not particularly limited, and may be any of a single layer structure or a laminated structure including gold, copper, lead, aluminum, or an alloy thereof. Further, a single layer film or a multilayer film of a metal or an alloy such as Ni, Ti, Au, Pt, Pd, or W may be formed on the surface of each electrode as a pad electrode. Although the film thickness of an electrode is not specifically limited, It is preferable that Au is arrange | positioned at the last layer (most surface side) especially, and the film thickness is about 100 nm or more.

  In the case of a light-emitting element having positive and negative electrodes on opposite surfaces, the light-emitting element is placed on a wiring provided on a support, and one electrode (hereinafter sometimes referred to as a first electrode) is provided. The formed lower surface can be mounted using a joining member such as a conductive paste containing silver, gold, palladium, or the like.

When using a light-emitting element having positive and negative electrodes on the same surface on the upper surface, place the lower surface, which is the side on which no electrode is formed, on a support described later, and use a bonding member such as epoxy resin or silicone. It can be mounted on a support.
In any electrode structure, in consideration of deterioration by light and heat from the light emitting element, reflection of light from the light emitting element, etc., a bonding metal layer, a base material, a metallized layer, Al, Ag, etc. One or more of a metal plating layer, a solder such as Au—Sn eutectic, a brazing material such as a low melting point metal, and a bonding layer such as a conductive paste may be arbitrarily combined.

  A protective film is preferably formed on the surface of the semiconductor layer of the light-emitting element, part or all of the semiconductor layer and the electrode, and any of the various layers described above. Examples of the protective film include an insulating material, for example, a single layer or a laminated film such as an oxide such as Si, Al, Zr, Ti, Nb, and Ta, a nitride, or an oxynitride. Of these, silicon oxide, niobium oxide, titanium oxide, aluminum oxide, zirconium oxide, tantalum oxide, and the like are preferable.

The upper surface on which the phosphor-containing resin of the light emitting element is disposed is preferably flat, but may have irregularities caused by lower layers such as electrodes and protective films. In particular, it is preferable that the area on which the phosphor-containing resin is disposed on the upper surface of the light emitting element is 0.25 mm ² or more, 0.5 mm ² or more, 1 mm ² or more.

  It is preferable that most of the light emitted from the light emitting element has a structure that can enter the phosphor-containing resin layer. As a specific structure, a structure having a reflective layer or an opaque substrate on the opposite side of the phosphor-containing resin layer with a semiconductor layer in between, and a structure in which both positive and negative electrodes are formed on the same surface side And what has only a semiconductor layer without having a translucent board | substrate, and what has the surface of a board | substrate coat | covered with the light-shielding material in the case of having a translucent board | substrate are mentioned.

(Phosphor)
The phosphor used in the present invention may be in the form of particles, and any of those known in the art can be used. For example, yttrium aluminum garnet (YAG) activated with cerium, lutetium aluminum garnet (LAG) activated with cerium, nitrogen-containing calcium aluminosilicate (CaO-Al ₂ O activated with europium and / or chromium) _3- SiO ₂ ), europium activated silicate ((Sr, Ba) ₂ SiO ₄ ), and the like. Accordingly, a light emitting device that emits mixed light (for example, white light) of primary light and secondary light having a visible wavelength, and a light emitting device that emits secondary light having a visible wavelength when excited by the primary light of ultraviolet light. it can.

In particular, as a phosphor that emits white light in combination with a blue light-emitting element, it is preferable to use a phosphor that is excited by blue and exhibits yellow broad light emission. For example, YAG (Yttrium Aluminum Garnet) system, BOS (Barium ortho-Silicate) system and the like are preferable. _{Further, Si 6-Z Al Z O} Z N 8-Z: Eu, Lu 3 Al 5 O 12: Ce, BaMgAl 10 O 17: Eu, BaMgAl 10 O 17: Eu, Mn, (Zn, Cd) Zn: Cu (Sr, Ca) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu, Mn, (Sr, Ca) ₂ Si ₅ N ₈ : Eu, CaAlSiB _x N _{3 + x} : Eu, K ₂ SiF ₆ : Mn and CaAlSiN ₃ : Eu Color rendering properties and / or color reproducibility can also be adjusted using phosphors such as

  The average particle diameter of the phosphor is preferably about 1 to 15 μm, and more preferably about 5 to 13 μm. Moreover, it is preferable that a center particle size is about 2-20, and it is more preferable that it is about 7-13. These particle size distributions can be measured by a laser diffraction method. By setting the average particle diameter and the center particle diameter of the phosphor within this range, the phosphor can be easily and reliably moved to the corner of the light emitting element without reducing the luminous flux of the wavelength converted by the phosphor. Can be made.

(resin)
The resin containing the phosphor may be any resin that can transmit light emitted from the light emitting element and light converted in wavelength by the phosphor. Especially, what transmits 60% or more of the light radiate | emitted from a light emitting element, Furthermore, what transmits 70%, 80%, or 90% or more is preferable. Examples of such resins include silicone resins, silicone modified resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, trimethylpentene resins, polynorbornene resins, or hybrid resins containing one or more of these resins. Can be mentioned.

  For example, the resin preferably has a pot life adjusted to about 4 to 180 hours, and more preferably 72 hours or more or 100 hours or more. Examples of a method for adjusting the time include a method of appropriately adjusting the molecular weight, composition, and type and amount of additives of the resin. Here, the pot life means the time during which the phosphor having the above-mentioned particle size contained in the resin can move within the resin by its own weight, the time until the resin can perform its performance, etc. To do. The conditions that the phosphor can easily move in the resin include, in addition to the pot life, those having a large phosphor particle diameter and those having a low resin viscosity.

Such a resin preferably contains the phosphor in an amount of 5 to 70% by weight with respect to the total weight of the phosphor-containing resin, and more preferably contains 20 to 40% by weight.
When arrange | positioning fluorescent substance containing resin on a light emitting element upper surface, it is preferable that the viscosity of fluorescent substance containing resin shall be 1-50 Pa.s, and it is more preferable to set it as 10-15 Pa.s.

  Examples of the phosphor-containing resin include titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, carbon black, various rare earth oxides (for example, yttrium oxide). , Gadolinium oxide) and the like, a light scattering material, a colorant, or the like may be included.

(Arrangement method)
As a method for arranging the phosphor-containing resin on the upper surface of the light emitting element, screen printing, dropping, or the like can be used, and dropping is particularly preferable. The dropping is preferably performed, for example, by using a dispenser or the like to scan the nozzle on the upper surface of the light emitting element within a range not exceeding the outer edge of the light emitting element or without using the nozzle. The amount of the phosphor-containing resin disposed on the upper surface of one light emitting element can be appropriately adjusted depending on the size of the light emitting element, but is preferably about 0.05 to 1 mg, and more preferably about 0.1 to 1 mg. 0.2 to 0.5 mg is more preferable. The dripping may be performed only once or once on the top surface of one light emitting element, or may be performed multiple times or multiple times.

  It is preferable that the phosphor-containing resin is disposed so as to cover only the light emitting surface (upper surface) of the light emitting element and not be disposed on the side surface of the light emitting element. Further, it is preferable that the phosphor-containing resin is not disposed on the side surface of the light emitting element even after the light emitting element is rotated. When the phosphor-containing resin is covered up to the side surface of the light emitting element, light containing a large amount of wavelength converted light by the phosphor is emitted from the peripheral portion of the light emitting element, which may cause color unevenness.

Usually, when the phosphor-containing resin is disposed on the upper surface of the light emitting element, it is necessary to strictly control the amount of dripping and the like so that the phosphor-containing resin does not leak from the upper surface of the light emitting element. However, if such leakage is controlled, the surface tension of the resin prevents the phosphor-containing resin from spreading in the corners of the light-emitting element having corners in plan view, and the thickness becomes extremely thin. A deficient area results. The light emitted from the phosphor deficient region can hardly contain wavelength-converted light by the phosphor, which causes color unevenness.
On the other hand, as described later, after the phosphor-containing resin is arranged, the phosphor-containing resin can be uniformly arranged on the upper surface of the light-emitting element by tilting and rotating the light-emitting element. In addition, it is possible to reduce the occurrence of a region deficient in phosphor.

(Rotation method)
After the phosphor-containing resin is disposed on the upper surface of the light emitting element, the light emitting element is tilted and rotated. In this case, the normal direction of the upper surface of the light emitting element is set as an axis inclined from the vertical direction, and the light emitting element is tilted and rotated about this axis. This axis may be set within the light emitting element (see FIG. 1A) or may be set outside the light emitting element (see FIG. 1B). In the former case, for example, it is preferably set at the center of the light emitting element. In the latter case, for example, the light emitting element is mounted on a plate-like body, the normal direction of the upper surface of the plate-like body is regarded as the normal direction of the upper surface of the light-emitting element, and the normal direction of the plate-like body is defined as the vertical direction. The axis may be set as a tilted axis, and this axis may be set in a plate-like body other than the mounting region of the light emitting element. That is, the light emitting element may rotate along the outer periphery of a circle having a predetermined distance as a radius around the rotation axis.
The positional relationship of the element with respect to the axis differs between when the rotation axis is set inside the light emitting element and when the rotation axis is set outside the light emitting element. Direction), and in any case, the substantial physical action is considered equivalent.

Here, with reference to FIG. 1A schematically showing tilt rotation of one light emitting element, after arranging the phosphor-containing resin 11 on the upper surface of the light emitting element 10, the normal direction of the upper surface of the light emitting element 10 is A rotation axis 14 is set with an inclination of α ° from the vertical direction 15, and the light emitting element 10 is rotated around the rotation axis 14. The axis 14 passes through the center of the light emitting element 10, for example.
Further, with reference to FIG. 1B schematically showing rotation of a plurality of light emitting elements, for example, the plurality of light emitting elements 10 are arranged on the upper surface of a plate-like body 13 constituted by a plurality of support bodies continuously, After the phosphor-containing resin 11 is disposed on the upper surfaces of these light emitting elements 10, the normal direction of the upper surface of the plate-like body 13 is inclined by α ° from the vertical direction 15 to set the rotation axis 14. The plurality of light emitting elements 10 are rotated. For example, the rotating shaft 14 is outside the mounting region of the light emitting element 10 and passes through the center of the plate-like body 13.

  In particular, considering the production efficiency of the method for manufacturing a light emitting device, a plate-like body on which a plurality of light-emitting elements are mounted is used, and the normal direction of the upper surface of the plate-like body is regarded as the normal direction of the upper surface of the light-emitting element. Thus, it is preferable that the normal direction of the plate-like body is set as an axis inclined from the vertical direction, and the plate-like body is rotated around this axis. In this case, the distance between the light emitting element and the rotating shaft is not particularly limited, and may be about 100 mm or less.

The axis inclination angle (α in FIGS. 1A and 1B) is preferably 10 to 80 °, more preferably 20 to 80 °, and still more preferably 30 to 75 °. By setting such an inclination angle, the phosphor can be appropriately moved inside the resin, and thus the phosphor can be dispersed to the corners of the light emitting element.
The rotation speed of the shaft is preferably 0.001 to 10 rpm, more preferably 0.01 to 5 rpm, and further preferably 0.1 to 1 rpm. By setting such a rotation speed, the phosphor-containing resin and the phosphor inside thereof can be uniformly dispersed without being biased by an unintended large centrifugal force or the like, which is effective in eliminating color unevenness. .

The duration of the tilt rotation can be appropriately adjusted according to the viscosity of the phosphor-containing resin, the particle size of the phosphor, and the like, and can be performed, for example, for about 1 to 170 hours. It is preferable to carry out continuously for the time required for the phosphor to settle uniformly. For example, it can be performed for about 4 to 40 hours, about 6 to 30 hours, or about 10 to 20 hours.
Further, it is preferable that the ambient temperature is a normal temperature during the tilt rotation of the light emitting element. This is because the phosphor is smoothly settled (moved) in the resin by the rotation of the light-emitting element, and abrupt curing of the resin is prevented.

  As described above, in order to tilt and rotate the light emitting element, for example, the tilt rotating device shown in FIG. 2 can be used. This tilt rotation device is based on a rotating shaft 1, a motor 2 that rotates the rotating shaft 1, a leg 3 that supports / fixes the motor 2, a rail 4 that allows the leg 3 to move, and a rotating shaft 1. And a container 6 that can accommodate a plurality of plate-like bodies 5 in the linear direction along the rotation axis 1. The rotation direction of the rotating shaft 1 may be any, for example, it can be rotated in the direction indicated by the arrow X. The motor 2 is fixed to the leg 3 via an angle adjusting member 7 that can freely change the angle of the rotary shaft 1 attached to the motor 2 with respect to the vertical direction. The angle adjustment member 7 can freely adjust the angle (α °) of the rotary shaft 1 from the vertical direction 15.

  Thus, by rotating the light emitting element at an inclination, as shown schematically in FIG. 3A, the phosphor in the phosphor-containing resin 11 is in the resin with the upper surface of the light emitting element 10 inclined. It sinks in the vertical direction n. During this time, since the light emitting element 10 is tilted and rotated, as shown in FIG. 3B, the settling phosphor changes its direction in the horizontal direction m and further, as shown in FIG. 3C. Then, it sinks in the vertical direction n. Due to the tilt rotation of the light emitting element 10, the phosphor settles as shown in FIG. 3D while gradually changing the sedimentation direction. Note that the arrows indicating the directions in FIGS. 3A to 3D do not represent the trajectory where the phosphor actually sinks in the resin, and the phosphor does not spiral due to the tilt rotation of the light emitting element 10. It is thought that it is sinking in a circular orbit. 3A to 3D do not show the deformation of the resin due to the tilt rotation of the light emitting element 10, but part of the phosphor-containing resin 11 emits light due to the tilt rotation of the light emitting element 10. It moves to the corner of the element 10 and the phosphor-containing resin 11 is deformed so that its thickness approaches a uniform portion at the center and corner while maintaining the convex outer shape. Accordingly, it is possible to prevent the occurrence of a region in which the phosphor is deficient in the corner portion of the upper surface of the light emitting element. For example, the ratio of the central portion (maximum thickness) / corner portion (minimum thickness) is preferably about 10/3 to 10/9, and more preferably about 10/4 to 10/8.

  In addition, since the rotational speed is so low that an unintended large centrifugal force is not loaded, there is no possibility that the phosphor-containing resin leaks to the side of the light emitting element, and the central part of the light emitting element is thinner than the outer peripheral part. Such a movement of the resin can also be prevented.

Hereinafter, specific examples of the method for manufacturing the light emitting device will be described in more detail with reference to the drawings.
First, a light emitting element is prepared. In the light-emitting element, the laminated structure of the back metallized layer, the substrate, and the joining metal layer is joined to the laminate of the p-side semiconductor layer, the light-emitting layer, and the n-side semiconductor layer through the p-side full surface electrode and the protective film in order from the bottom. Has been. An n-side pad electrode and a protective film are disposed on the surface of the n-side semiconductor layer. A part of the n-side pad electrode is exposed from the protective film, and the protective film has irregularities of about several tens of nm on the surface thereof.
The light emitting element has a square shape with a planar shape of about 1 mm × 1 mm.

For example, the back metallization layer is made of a laminated film of Ti / Pt / AuSn / Au, the substrate is made of light-impermeable CuW, and the bonding metal layer is Ti / Pt / PtSn / AuSn / PdSn / Pt from the semiconductor layer side. / Ti laminated structure. The p-side full surface electrode is made of a laminated film of Ni / Ag / Ni / Ti / Pt, and is made of a protective film SiO ₂ . The n-side pad electrode is made of a laminated film of Ti / Al / Ni / Au, and the protective film is Ta ₂ O ₅ .
The p-side semiconductor layer and the n-side semiconductor layer are made of an AlGaN layer, the light emitting layer is made of an ITO layer, and the light emitting element has a peak wavelength of about 450 to 455 nm.

  The light-emitting element is mounted on a support (not shown) using an Au—Sn eutectic bonding material with the substrate of the light-emitting element facing the support.

The phosphor-containing resin disposed on the upper surface of the light emitting element is made of phenyl silicone containing a YAG phosphor having an average particle diameter of 10 to 15 μm. The content of the phosphor is 40 parts by weight with respect to 100 parts by weight of the resin, about 28.8% by weight in the phosphor-containing resin, and the viscosity is 10 to 20 Pa · s.
For example, such a phosphor-containing resin is dropped on the upper surface of the light-emitting element by a nozzle of a dispenser, thereby arranging the phosphor-containing resin on the upper surface of the light-emitting element. The dripping amount with respect to one light emitting element shall be 0.3-0.4 mg, for example.

The obtained light-emitting element is placed at a tilt angle (α) of 45 ° in the container of the tilt rotation device shown in FIG. As shown in FIG. 1B, the tilt rotating device sets the normal direction of the upper surface of the light emitting element as an axis inclined from the vertical direction, and the light emitting element is rotated at a rotation speed of 1.1 rpm around the axis and the ambient temperature is 25 ° C. And tilt and rotate for 14 hours.
At the end of the tilt rotation, the phosphor-containing resin is cured with the phosphor uniformly dispersed therein, and functions as a convex wavelength conversion member and light distribution member having a maximum thickness of 500 μm and a minimum thickness of 200 μm. Can be made.

For comparison, a light-emitting device was manufactured by the same method as described above except that the tilt angle (α) during rotation of the light-emitting element was 0 ° and 90 °, and the light-emitting element was turned on together with the light-emitting device obtained above. The appearance at the time was comparatively observed.
As a result, the light-emitting device obtained above has a wavelength conversion at the corner of the light-emitting element, compared to any light-emitting device in which the tilt angle (α) during rotation of the light-emitting element is 0 ° and 90 °. It was confirmed that insufficient light leakage was remarkably reduced and color unevenness was remarkably improved.

As described above, in the method for manufacturing a light emitting device according to an embodiment of the present invention, the phosphor-containing resin can be uniformly disposed on the upper surface of the light emitting element, and in particular, the phosphor is deficient in the corner of the light emitting element. Generation | occurrence | production of an area | region can be prevented. In other words, since the resin is disposed at the corner of the light emitting element so as to be thicker than the particle size of the phosphor, the phosphor is uniformly dispersed inside the resin, and the occurrence of the phosphor-deficient region can be minimized. .
In addition, since the rotational speed is so low that an unintended large centrifugal force is not loaded, the phosphor-containing resin does not leak to the side surface of the light emitting element, and the central part of the light emitting element is thinner than the outer peripheral part. Movement of the resin can also be prevented.
Accordingly, the light emitting area can be made equal to the plane area of the light emitting element, and wavelength conversion at the corner of the light emitting element can be sufficiently performed while ensuring the maximum luminous flux. As a result, favorable wavelength conversion of light on the entire upper surface of the light emitting element can be realized, and the occurrence of color unevenness can be effectively prevented.
In addition, in order to place the phosphor-containing resin up to the corner of the light emitting element, the phosphor and the phosphor-containing resin are arranged with an appropriate thickness and distribution without increasing the amount of the phosphor or the phosphor-containing resin. Therefore, the absorption of light by these can be reduced to a negligible level, and it is effective for preventing a decrease in luminous flux.

  Further, except that the tilt angle was 70 ° and the processing time was 15 hours, a light-emitting device was produced in the same manner as the above method. As compared with the one with the tilt angle of 0 ° or 90 °, as described above, It was confirmed that the phosphor-deficient region was reduced and the color unevenness was improved at the corners of the light-emitting element.

  Furthermore, a light emitting device was manufactured in the same manner as described above except that the tilt angle was set to 70 °, the processing time was set to 63 hours, and the rotation speed was set to 0.06 rpm. In the same manner as described above, reduction of the phosphor-deficient region at the corner of the light emitting element and improvement of the color unevenness were observed.

  The method for manufacturing a light emitting device of the present invention can be used for a light emitting device in which a phosphor is disposed on the upper surface of a light emitting element.

DESCRIPTION OF SYMBOLS 1, 14 Rotating shaft 2 Motor 3 Leg part 4 Rail 5, 13 Plate-like body 6 Container 7 Angle adjustment member 10 Light emitting element 11 Phosphor containing resin 15 Vertical direction X Rotating direction α Inclination angle

Claims (12)

  An arrangement of a light emitting device comprising: arranging a phosphor-containing resin on an upper surface of a light emitting element, and setting the normal direction of the upper surface of the light emitting element as an axis inclined from a vertical direction, and tilting and rotating the light emitting element around the axis Production method.   The manufacturing method of the light-emitting device of Claim 1 which arrange | positions fluorescent substance containing resin to the said light emitting element upper surface by dripping.   The manufacturing method of the light-emitting device according to claim 1 or 2, wherein an inclination of the axis from a vertical direction is set to 10 to 80 degrees.   The manufacturing method of the light-emitting device according to claim 1, wherein a rotation speed of the shaft is 0.001 to 10 rpm.   The manufacturing method of the light-emitting device according to claim 1, wherein the phosphor-containing resin has a viscosity of 1 to 50 Pa · s.   The manufacturing method of the light-emitting device according to claim 1, wherein an average particle diameter of the phosphor in the phosphor-containing resin is 1 to 30 μm.   The manufacturing method of the light-emitting device according to any one of claims 1 to 6, wherein a center particle diameter of the phosphor in the phosphor-containing resin is 2 to 20 µm.   The method for manufacturing a light emitting device according to claim 1, wherein the light emitting element is rotated for 1 to 170 hours.   The manufacturing method of the light-emitting device according to claim 1, wherein an amount of the phosphor with respect to the phosphor-containing resin is 5 to 70% by weight. The manufacturing method of the light-emitting device as described in any one of Claims 1-9 which makes the area which arrange | positions the said fluorescent substance containing resin of the said light emitting element upper surface into 0.25 mm < ² > or more.   The method for manufacturing a light-emitting device according to claim 1, wherein a resin having a pot life of 4 to 180 hours is used as the resin.   The manufacturing method of the light-emitting device according to claim 1, wherein a thickness of the phosphor-containing resin is thinner at an outer peripheral portion than a central portion of the light-emitting element.