JP6323067B2 - Cover glass and method of forming through hole of cover glass - Google Patents

Description

  The present invention relates to a cover glass for a display device.

In recent years, electronic devices using a display device such as a liquid crystal display device or an organic EL display device as a flat display panel have been widely used, and in particular, mobile terminal devices such as mobile phones, smartphones, tablets, etc. have been particularly popular.
As shown in FIG. 8A, such a mobile terminal device is usually a touch panel in which a first electrode part 132 and a second electrode part 133 for forming a touch sensor are arranged on a base material 131 made of a film. A touch panel device (also referred to as a touch panel) 120 configured by bonding a sensor unit 130 and a protective cover glass (hereinafter referred to as a cover glass) 140 is bonded to a display device of a mobile terminal device. It has a structure in which the surface is protected by a cover glass.
Recently, in terms of productivity, cost, bonding position accuracy, etc., instead of the touch panel device (touch panel) 120 shown in FIG. The first electrode portion (corresponding to 132 in FIG. 8) and the second electrode portion (corresponding to 133 in FIG. 8) are arranged, and the touch sensor is formed integrally with the cover glass and integrated as a touch panel. As a method, OGS (one glass solution) has been adopted.

The cover glass 140 for the protective cover used in the touch panel device 120 is conventionally supplied by a glass manufacturer with a large-sized tempered glass whose surface has been chemically strengthened. The glass substrate is singulated and molded.
As shown in FIG. 9, each cover glass that has been singulated and molded in this way has a through-hole portion having a quadrangular through-hole when viewed from a direction orthogonal to the surface direction of the cover glass 200. 221 and through-hole portions 222 and 223 having round through-holes, and a recessed portion 230 that is partially recessed toward the glass substrate 210 is provided.
The chemical strengthening treatment is performed, for example, by replacing the alkali ions contained in the glass with other alkali ions having a larger ion radius at a temperature below the strain point, so that the ions are exchanged near the surface. It is strengthened by forming a compressive stress layer that generates a compressive stress.
Aluminosilicate glass is usually used as a glass material to be chemically strengthened for portable terminal devices such as smartphones and tablets.
The thickness of the compressive stress layer is in the range of 10 to 100 μm.
Even after chemical strengthening treatment, it can be processed and molded with an etching solution, and mechanical processing such as cutting and drilling is possible.
Here, the glass whose surface has been reinforced by chemical strengthening treatment is also referred to as tempered glass or tempered glass substrate.

However, the individual cover glass singulated and molded in this way is an unstrengthened portion that is a portion where the outer side surface portion of the glass substrate and the side surface portion of the through hole portion are not subjected to chemical strengthening treatment. May be exposed, and due to the exposure of the unstrengthened portion, the glass base material may be microcracked or cracked due to chipping, etc., which may cause a reduction in strength or damage of the entire display device used.
For this reason, conventionally, a protective resin is further formed on the outer side surface of each individual cover glass and the side surface of the through hole.

Under such circumstances, since the cover glass can be singulated and molded together, an etching-resistant protective film is formed on both surfaces of the glass substrate in accordance with the molded shape, and hydrofluoric acid is used. Etching processing methods have been adopted in which exposed portions of a glass substrate are etched with an etching solution that contains.
Conventionally, the formation of through-holes in such an etching method has been performed on both surfaces of the glass substrate 50 with the same shape and size of the openings of the etching-resistant resin films 51 and 52 being aligned from both sides. The through-hole part 55 which has the target through-hole part 55c was formed by etching with the etching liquid which consists of an acid solution. (FIGS. 5A to 5C)
Here, since it is carried out by dipping (dipping), spraying, etc. from both sides of the glass substrate 50, the etching amount from both sides is made similar, so the first recess 55a formed by etching from one side and the other side The second recess 55b formed by etching from the surface side has substantially the same shape and size.
Thereafter, a protective resin is disposed on the side surface of the through hole portion in order to protect the unstrengthened portion on the side surface of the through hole portion. Conventionally, there are various resin arrangement methods.
First, the first method is given.
In the first method, after the etching process (FIG. 5C), the surface direction of the glass substrate 50 is set to the horizontal direction, and the through hole 55c of the through hole portion 55 is closed with the resin film 56 on the lower surface side. The unreinforced portion is filled with a protective resin 57 with a dispenser or the like and cured (FIG. 5D), and further drilled with a drill or the like, and the protective resin 57A is formed on the side surface of the through hole portion. And the through hole 58 was formed. (Fig. 5 (e))
Then, the resin films 51, 52, and 56 are peeled off to form the through-hole portion 59 having the target through-hole 59a. (Fig. 5 (f))
Here, as the resin films 51, 52, and 56, those having a structure in which an adhesive is provided on one surface of the resin film are usually used in a predetermined shape with the adhesive side attached to a glass substrate.
Moreover, as resin 57 with which a through-hole part is filled, UV curing is normally performed using UV curable resin.
However, in the case of this first method, when filling the protective resin, it is necessary to close the through-hole 55c on the lower surface side of the glass base material. It is necessary to remove an unnecessary resin, which takes time and effort.
In the second method, after the etching process in the first method (FIG. 5 (c)), the surface direction of the cover glass is set to the horizontal direction, and the unstrengthened treatment part is passed through the protective resin with a dispenser or the like. In this method, the side surface of the hole is coated and cured, and a protective resin is disposed on the side surface of the through hole.
Again, as a protective resin (corresponding to 67 in FIG. 6) that coats the side surface of the through hole, a UV curable resin is used and UV cured.
In the case of the second method, since the protective resin is directly applied to the side surface of the through hole portion after the etching process, it does not take time and effort as in the first method, but the through hole portion that needs protection. Therefore, it is necessary to select a high viscosity material as a protective resin to be applied.
However, even if a high-viscosity material is selected, it tends to sag due to gravity as shown in FIGS. 6 (a) and 6 (b), and it is difficult to obtain a desired shape.
In the third method, after the etching process in the first method (FIG. 5C), as shown in FIG. 7, the portion of the through hole to which the protective resin is applied is horizontal or close to it. In this direction, the film is coated with a dispenser or the like and cured, and a protective resin 77 is disposed on the side surface of the through hole and cured.
In the case of the third method, by making the side surface of the through-hole portion to be painted (corresponding to 55 in FIG. 5) in the horizontal direction or the substantially horizontal direction, the side surface to be painted can be easily formed into a flat shape or a shape close to a flat shape. In either case of the rectangular shape or the round through-hole, it is necessary to divide the portion to be coated into a plurality of times and repeat the coating and curing operations, and the surface direction of the glass substrate (corresponding to 50 in FIG. 5) It is premised that the glass substrate is rotated in a state where is in the vertical direction, and it is difficult to make an apparatus.

JP 2012-111688 A JP 2012-88946 A

As mentioned above, while mobile terminal devices such as mobile phones, smartphones, tablets, etc. are spreading widely, as a cover glass for the protective cover of the display part of these mobile terminal devices, strengthening with chemical strengthening treatment on the surface from the strength aspect Processed glass is used, and furthermore, it is required to protect the unstrengthened part of the side surface of the through hole formed in the cover glass. Conventionally, a resin is coated on the side surface of the through hole of the cover glass. As a method for protecting the unstrengthened portion on the side surface of the through hole, the above-described first to third methods have been employed.
However, in the case of the first method, when filling the protective resin, it is necessary to close the through-hole on the lower surface side of the glass substrate, and the extra resin is filled after the protective resin is filled. In the case of the second method, it does not take time and effort like the first method, but as a protective resin to be applied. It is necessary to select a high-viscosity material, and even if a high-viscosity material is selected, there is a problem that it is difficult to obtain a desired shape due to gravity. In the case of the third method, the portion to be coated is divided into multiple times. It is necessary to repeat the coating and curing operations, and it is premised that the cover glass is rotated in a state where the surface direction of the cover glass is set to the vertical direction.
The present invention corresponds to these, and in particular, in a cover glass for a protective cover of a display unit of a mobile terminal device such as a mobile phone, a smartphone, and a tablet, a strengthening process of a through-hole formed by external processing is performed. An object of the present invention is to provide a cover glass and a method for forming such a cover glass, in which the formation of the protective resin portion covering the unstrengthened treatment portion can be performed with good quality, simply and efficiently.

The cover glass according to the first aspect of the present invention uses a tempered glass whose surface is tempered as a base material, and has a through hole portion formed by perforating the base material, and the through hole portion. A cover glass in which a protective resin portion is disposed on a side surface of the through-hole portion in a state where the through-hole portion is penetrated, and the through-hole portion is formed by double-sided etching. In the surface direction of the material, the first region of the large size formed by etching and recessed from one surface of the base material, the same as the central position of the outer shape and the same region position of the recess, the other of the base material A second recess having a small size formed by etching and recessed from the surface of the first recess, and is penetrated by the first recess and the second recess . Resin is disposed on the side surface of the first recess and the side surface of the second recess, Cover glass in which the resin on the entire surface is characterized in that it is film form.
Here, the large size and the small size mean the regions of the first concave portion and the second concave portion formed by etching. Here, the first concave portion is simply a large hole, The second recess is a small hole, and the large hole and the small hole are formed at the same position in the surface direction (XY plane) of the substrate. Furthermore, in this case, in the surface direction (XY plane) of the base material, the outer shape of the second recess at the other surface position is the outer shape of the first recess at the one surface position. The center position of the outer shape at the one surface position of the first recess and the center position of the outer shape at the other surface position of the second recess are the same position. And the cover glass which concerns on invention of Claim 2 is the cover glass of invention of Claim 1, Comprising: In cross-sectional shape of the direction orthogonal to the said through-hole part, the side surface of a said 1st recessed part And an angle θt formed between the tangent line of the curve indicating the side surface of the first recess and the one surface of the base material is 0 degree at a portion where the side surface of the second recess intersects. It is what.
Here, even if the angle θt is not strictly 0 °, the resin is applied to the side surface portion of the through hole at an angle close to 0 ° with the surface direction of the base material being horizontal and the first concave portion side facing up. In this case, as in the case of 0 degree, the angle at which the resin can be prevented from drooping due to gravity is defined as an angle corresponding to 0 degree, and such an angle close to 0 degree is also treated as “angle θt is 0 degree”.
Moreover, the direction orthogonal to the through-hole part here is a direction orthogonal to the outer periphery of the through-hole part, and is a direction substantially orthogonal to the outer periphery of the through-hole.

  The invention of claim 3 is a method for forming a through hole in a cover glass, and (a) a tempered glass whose surface is tempered is used as a base material, and an etching resistant mask is used for each through hole to be formed. Then, the etching-resistant first resin film having an opening is formed on one surface of the substrate, and the etching-resistant second resin film having an opening corresponding to each through-hole to be formed is formed on the base. A resin film affixing step to be affixed to the other surface of the material, respectively, and (b) the base material portion exposed from the opening of the resin film is etched from both surfaces of the base material to form a through-hole portion that penetrates An etching step to perform, (c) a protective resin coating step for applying and curing a protective resin on the side surface of the formed through-hole portion, and (d) a resin film on both sides of the substrate, Removable resin A film peeling step, and in the resin film affixing step, the opening of the first resin film corresponding to each through-hole to be formed in the surface direction (XY plane) of the base material Is the same shape as the opening of the second resin film, provided at the same position, and the size of the opening of the first resin film is larger than the size of the opening of the second resin film, Further, in the protective resin disposing step, in a state where the base material is leveled, from the recessed side formed by etching on the side where the first resin film is attached, to the side surface of the through hole portion, A protective resin is applied and cured.

(Function)
The cover glass of the present invention has such a configuration, and in particular, in the cover glass for a protective cover of a display unit of a mobile terminal device such as a mobile phone, a smartphone, a tablet, etc. It is possible to provide a cover glass that can be formed with good quality, simply, and efficiently by forming a protective resin portion that covers an unstrengthened treatment portion that has not been tempered.
Specifically, a tempered glass whose surface is tempered is used as a base material, a through-hole portion is formed by perforating the base material, and the through-hole portion is penetrated. The cover glass is coated with a protective resin on the side surface of the through-hole portion, and the through-hole portion is formed by double-sided etching, and the surface direction (X- In the Y plane), the first region of the large recessed portion formed by etching recessed from one surface of the base material, and the small etched portion recessed from the other surface of the base material, which has the same region position of the recessed portion. This is achieved by having a second recess having a size and being penetrated by the first recess and the second recess.
According to the present invention, because of the shape of the through hole, the surface direction of the base material is set to the horizontal direction, and from the upper side, the side surface of the through hole is applied by a dispenser or the like to apply and cure the UV curable protective resin. In this case, by setting the first recess side to be the upper side, the upper recess portion (first recess portion) becomes the lower recess portion (first recess portion) compared to the conventional method of forming the through-hole portion by etching shown in FIG. Compared to the second recess), the resin has a large hole, so that the resin tends to stay in the upper first recess, and the amount flowing from the upper first recess to the lower second recess is reduced. As a result, dripping of the resin due to gravity can be suppressed, and as a result, the resin film can be formed on the entire side surface of the through-hole portion in the penetrating state.
The angle θ _t is preferably closer to 0 degrees from the viewpoint of suppressing the dripping of the resin due to gravity.
Thus, according to the present invention, by setting the first concave portion side as the upper side, because of the through-hole shape, the surface direction of the base material is set as the horizontal direction, and from the upper side, the side surface of the through-hole is dispensed with a dispenser or the like. It is possible to adopt a resin film forming system on the side surface portion of the through-hole portion, in which a protective resin is applied, cured and coated.
In addition, since the upper side is a large-sized recess (also referred to as a large hole) at the time of application, it is easier to apply a dispenser or the like than the conventional method for forming a through-hole part by etching shown in FIG. .
Further, in a cross-sectional shape orthogonal to the through-hole portion, a curved tangent line indicating a side surface of the first recess at a location where the side surface of the first recess and the side surface of the second recess intersect. In the case where the angle θ _t formed with the one surface of the base material is 0 degree, the surface direction of the base material is set to the horizontal direction, and the side surface of the through hole is dispensed with a dispenser or the like from the upper side. When the coating resin is applied and cured to form a coating film, dripping due to the gravity of the resin can be suppressed more effectively. Therefore, with the surface direction of the substrate as the horizontal direction, from the upper side, the side surface of the through hole is coated with a UV curable protective resin by applying a UV curable protective resin with a dispenser or the like. The resin film formation method is easier to adopt.

  The method for forming a through-hole in the cover glass of the invention of claim 3 is such that, particularly in the cover glass for a protective cover of a display unit of a mobile terminal device such as a mobile phone, a smartphone, a tablet, etc. Through-holes in the cover glass that can produce a cover glass that can be formed with good quality, easily, and efficiently, without forming the through-holes that have been reinforced by the external processing, and that can easily and efficiently form a protective resin part that covers the unreinforced part. It was possible to provide a method for forming holes.

  As described above, according to the present invention, in particular, a cover glass for a protective cover of a display unit of a mobile terminal device such as a mobile phone, a smartphone, or a tablet is not subjected to a strengthening process for a through hole formed by external processing. Providing a cover glass that can easily and efficiently form a protective resin part that covers an unreinforced portion, and a method for forming a through hole in the cover glass that can produce such a cover glass It was possible.

1 (a) to 1 (f) are process cross-sectional views of a first example of an embodiment of a method for forming a through hole in a cover glass of the present invention, and FIG. 1 (e) and FIG. 1 (f). These are the figures which showed one example of the cross section of the through-hole part in the cover glass of this invention, respectively. 2 (a) to 2 (f) are process cross-sectional views of a second example of the embodiment of the method for forming a through hole in the cover glass of the present invention. FIG. 2 (e) and FIG. 2 (f) These are the figures which showed one example of the cross section of the through-hole part in the cover glass of this invention, respectively. FIG. 3A is a cross-sectional view showing a cross-sectional shape of an example of the through-hole portion in the cover glass of the present invention, and FIG. 3B shows a state where the resin 17 is deleted in FIG. 3A. FIG. FIG. 4A is a cross-sectional view showing a cross-sectional shape of another example of the through hole portion in the cover glass of the present invention, and FIG. 4B is a state in which the resin 27 is deleted in FIG. It is sectional drawing of the shown glass substrate. FIG. 5A to FIG. 5F are process cross-sectional views illustrating an example of a method for forming a through hole in a conventional cover glass. 6 (a) and 6 (b) are cross-sectional views for explaining the dripping of the protective resin in one example of the conventional method of arranging the protective resin on the side surface of the through-hole portion of the cover glass. It is. It is sectional drawing which showed one example of the resin arrangement | positioning for protection to the side surface of the through-hole part of the conventional cover glass. FIG. 8A is a cross-sectional view showing a part of a cross section in which a touch panel device using a cover glass is used for a display device, and FIG. 8B is a perspective view of an electrode portion of the touch sensor from the direction of an arrow. It is the figure which tried. It is the figure which showed one example of the shape of a cover glass.

The 1st example of embodiment of the cover glass of this invention is demonstrated based on Fig.3 (a).
In addition, in order to explain the shape of the through-hole part 15 of the glass substrate 10 in an easy-to-understand manner, FIG. 3B shows a cross-sectional view in a state where the resin 17 is deleted in FIG.
The direction of the cross section here is a direction orthogonal to the outer periphery of the through hole portion 15 as in the A1-A2 direction shown in FIG. 9, and FIG. 3A is a direction substantially orthogonal to the outer periphery of the through hole. The cross section in is shown.
The cover glass of the first example uses a tempered glass whose surface has been tempered as a base material, and has a through-hole portion that is perforated by drilling the base material, and penetrates the through-hole portion. In this state, it is a cover glass in which a protective resin is coated on the side surface of the through-hole portion, and the outer shape includes, for example, a shape as shown in FIG. The outer shape and size are not limited.
And it is used as a glass for a protective cover that is used by being attached to a display device of a portable terminal device to protect the surface.
In the cover glass of the first example, the through-hole portion 15 of the glass base material 10 is formed by double-sided etching, and in the surface direction of the glass base material 10, the glass has the same concave region position. A large-sized first recessed portion 15a formed by etching recessed from one surface of the substrate 10 and a small-sized second recessed portion 15b formed by etching recessed from the other surface of the glass substrate 10, A through hole 15c is formed by the first recess 15a and the second recess 15b.
In the first example, as shown in FIG. 3B, in the cross-sectional shape of the glass substrate 10, a portion 31 where the side surface 15aA of the first recess 15a and the side surface 15bA of the second recess intersect. , The angle θ _t formed between the tangent line of the curve indicating the side surface 15aA of the first recess 15a and the one surface (base material surface) of the base material is not 0 degrees.
Such an angle θ _t is obtained by applying a UV curable protective resin to the side surface portion of the through-hole with a dispenser or the like with the surface direction of the glass substrate 10 being horizontal, the first concave portion 15aA side being up. In the conventional method of forming the through-hole portion by etching shown in FIG. 5, the resin is applied with the first recess side as an upper side, although the angle is not enough to suppress dripping due to the gravity of the resin when cured. Compared to the above, the upper concave portion (first concave portion) becomes a larger-sized concave portion (also referred to as a large hole) than the lower concave portion (second concave portion). The resin tends to stay in the recesses), and the amount of resin flowing from the upper recess side to the lower recess side can be reduced, thereby suppressing the drooping of the resin due to gravity. The resin on the entire side surface of the through-hole portion 15 Film formation is possible.
The angle θ _t is preferably closer to 0 degrees from the viewpoint of suppressing the dripping of the resin due to gravity.
Thereby, in formation of the through-hole part of this example, by setting the 1st recessed part 15a side as an upper side, because of the through-hole shape, the surface direction of the base material is set as the horizontal direction, and the side surface of the through-hole is changed from the upper side. It is possible to apply a UV curable protective resin by a dispenser or the like, cure and coat the resin film on the side surface of the through hole.
Further, when the protective resin is applied, since the upper side has a large hole, it becomes easier to apply a dispenser or the like than the conventional method of forming a through-hole portion by etching shown in FIG.

Each member will be described.
<Glass base material>
As the glass substrate 10, a tempered glass obtained by subjecting an aluminosilicate glass to a chemical tempering treatment is usually used, but is not limited thereto.
A thickness of 0.10 mm to 1.0 mm is used.
The chemical strengthening treatment is performed, for example, by replacing the alkali ions contained in the glass with other alkali ions having a larger ion radius at a temperature below the strain point, so that the ions are exchanged near the surface. It is strengthened by forming a compressive stress layer that generates a compressive stress.

<Resin for protection>
As the protective resin 17, a UV curable resin having a high curing speed is preferably used from the viewpoint of applying and curing the protective resin.
Examples of such resins include acrylic, epoxy, and polyene-polythiol resins.
And the surface hardenability in the air atmosphere, the resin adhesion to the glass, the impact resistance (after curing), the moisture resistance, those with good light resistance are preferred, and further those with good surface printability are preferred. Enthiol-based resins are preferred.
Since the acrylic resin is radical polymerization, the surface that is in contact with oxygen is uncured due to reaction inhibition when the resin is applied and cured.
Epoxy systems have high hardness, but are inferior in terms of impact properties, and the resin is easily broken when given an impact.
A UV curable polyene-polythiol resin is preferably used, and has less curing shrinkage than acrylic photo-curing resins, so it has high adhesion to the base material and is not polymerized due to oxygen. Has the advantage of not.

Hereinafter, the polyene-polythiol resin will be described.
A resin containing an ene compound, a thiol compound and a photopolymerization initiator is referred to as a polyene-polythiol resin.
An ene compound is a polyfunctional compound having two or more carbon-carbon double bonds in one molecule. Vinyl ethers, vinyl esters, allyl ethers, allyl alcohol derivatives, allyl isocyanuric acid derivatives, styrenes , Acrylic acid derivatives, methacrylic acid derivatives, divinylbenzene and the like.
When a part of the above-mentioned ene compounds is arranged in the order of high reactivity with the thiol compound, the order becomes vinyl ethers, vinyl esters, allyl ethers, allyl isocyanuric acid derivatives, acrylic acid derivatives, and styrenes.
The thiol compound is a compound having two or more thiol groups in one molecule, and examples thereof include esters of mercaptocarboxylic acid and a polyhydric alcohol, aliphatic polythiols and aromatic polythiols, and other polythiols.
These 1 type (s) or 2 or more types can be used.
Examples of the mercaptocarboxylic acid in the ester of mercaptocarboxylic acid and polyhydric alcohol include thioglycolic acid, α-mercaptopropionic acid and β-mercaptopropionic acid.

The blend ratio of the ene compound (a) and the thiol compound (b) is such that the ratio of the number of unsaturated bonds of the ene compound (a) to the number of thiol groups of the thiol compound (b) is 2: 1 to 1: 2. A range is preferable.
When the amount of thiol groups exceeds 1: 2, a large amount of unreacted thiol groups remain in the composition after the curing reaction. It is not preferable from the viewpoint that there are few advantages such as high adhesion and no polymerization inhibition due to oxygen.

A photoinitiator is not specifically limited, A well-known photoinitiator can be used.
Specifically, for example, as a photopolymerization initiator, in the case of a resin system having a radical polymerizable unsaturated group, it is commercially available as acetophenones (for example, trade name Irgacure 184 (manufactured by Ciba Specialty Chemicals) 1 -Hydroxy-cyclohexyl-phenyl-ketone), benzophenones, thioxanthones, propiophenones, benzyls, acylphosphine oxides, benzoin, benzoin methyl ether and the like can be used alone or in combination.

It is preferable to add the said photoinitiator (c) in the ratio of 0.001-10 mass% with respect to the total amount of the said ene compound (a) and a thiol compound (b).
If it is less than 0.001% by mass, there may be a problem that the photopolymerization reaction cannot be sufficiently caused.
Moreover, even if it adds exceeding 10 mass%, the improvement of an effect is not seen.

Next, a method of forming the through hole portion 18A in the cover glass of the first example will be briefly described with reference to FIG.
In addition, with this, as an example of an embodiment of a method for forming a through hole portion in the cover glass of the present invention,
First, a tempered glass prepared in advance and subjected to a tempering treatment is used as a glass substrate 10, and the glass substrate 10 has an opening 11a corresponding to each through-hole to be formed as an etching-resistant mask. The etching-resistant first resin film 11 is formed on one surface of the glass substrate 10, and the etching-resistant second resin film 12 having an opening corresponding to each through hole to be formed is formed on the glass substrate 10. A resin film adhering step of adhering to the other surface of each is performed. (FIG. 1 (a) to FIG. 1 (b))
In the resin film affixing step, the opening 11 a of the first resin film 11 corresponds to each through-hole to be formed in the surface direction (XY plane) of the glass substrate 10, and the second resin film 12. The opening 12a has the same shape and is provided at the same position.
In addition, the size of the opening 11 a of the first resin film 11 is set larger than the size of the opening 12 a of the second resin film 12.
As the resin films 11 and 12, those having a structure in which an adhesive is disposed on one surface of the resin film are used in a predetermined shape with the adhesive side attached to a glass substrate.
Subsequently, the glass substrate part exposed from opening 11a, 12a of the resin films 11 and 12 is etched from both surfaces of the glass substrate 10, and the etching process which forms the through-hole part penetrated is performed. (Fig. 1 (c))
Here, etching is performed in the same manner from both sides by dipping, spraying, etc. from both surfaces of the glass substrate 10 using an etching solution made of a hydrofluoric acid solution, but the openings 11a and 12a in the resin films 11 and 12 on both sides. Therefore, the first concave portion 15a formed by etching from the one surface side is larger than the second concave portion 15b formed by etching from the other surface side.
Thereby, the through-hole part 15 which has the 1st recessed part 15a and the 2nd recessed part 15b, and forms the through-hole 15c by both recessed parts is formed by etching.
Here, since the difference between the opening 11a of the resin film 11 and the opening 12a of the resin film 12 is reduced corresponding to each through-hole to be formed, as shown in FIG. At the location where the side surface portion 15aA of 15a and the side surface portion 15bA of the second opening 15b intersect, the tangent line of the curve representing the side surface portion 15aA of the first recess 15a in the cross section shown in FIG. The angle θ _t formed with the base material surface which is the surface of the material 10 does not become 0 degree.
Next, the protective resin 17 is applied to the side surface 15aA of the formed through-hole portion 15 with a dispenser or the like, and a protective resin is disposed to be cured. (Fig. 1 (d))
The protective resin disposing step is a state where the glass substrate 10 is horizontal and penetrated from the side of the first concave portion 15a of the large size formed by etching on the side where the first resin film 11 is attached. A protective resin 17 is applied to the side surface of the hole and cured.
As the protective resin 17, a UV curable resin having a high curing speed is preferably used in view of the work of applying and curing the protective resin 17.
Examples of the UV curable resin include acrylic, epoxy, and enethiol resins, and enethiol resins are particularly preferable.
After the resin 17 is UV-cured, a resin film peeling step for peeling the resin films 11 and 12 on both surfaces of the glass substrate 10 is performed. (Fig. 1 (e))
Furthermore, if necessary, the end of the cured resin 17A is rounded so that the end of the resin has a round shape. (Fig. 1 (f))
As round processing, it processes with the grindstone which can make a round shape with respect to the side surface side of a through-hole part, for example.
The material of the resin films 11 and 12 is not particularly limited as long as the above processing can be performed.
As the resin films 11 and 12, biaxially stretched polypropylene or unstretched polypropylene having a thickness of about 50 to 100 μm can be used.

In addition, the cover glass which has the through-hole part 18 which has the cross-sectional shape shown in FIG.1 (e) can also be mentioned as a modification of a 1st example.
This modified example is the same as the first example except that the shape of the cured resin 17 is partly different from the first example.

Next, the 2nd example of embodiment of the cover glass of this invention is demonstrated based on Fig.4 (a).
Here, in order to explain the shape of the through-hole portion 25 of the glass substrate 20 in an easy-to-understand manner, FIG. 4B shows a cross-sectional view of the state in which the resin 27 is deleted in FIG.
The direction of the cross section here is also a direction orthogonal to the outer periphery of the through hole portion 25 as in the A1-A2 direction shown in FIG. 9, and FIG. 4A is a direction substantially orthogonal to the outer periphery of the through hole. The cross section in is shown.
The cover glass of the second example also uses a tempered glass whose surface has been tempered as a base material, and has a through-hole portion that is perforated by drilling the base material, and penetrates the through-hole portion. In this state, it is a cover glass in which a protective resin is coated on the side surface of the through-hole portion.
And it is used as a glass for a protective cover that is used by being attached to a display device of a portable terminal device to protect the surface.
In the second example, as in the case of the first example, the through-hole portion 25 of the glass substrate 20 is formed by double-sided etching, and the region position of the recess in the surface direction of the glass substrate 20 , The first large recess 25a formed by etching recessed from one surface of the glass substrate 20, and the second small recess formed by etching recessed from the other surface of the glass substrate 20. And a through hole 25c is formed by the first recess 25a and the second recess 25b.
In the second example, as shown in FIG. 4B, in the cross-sectional shape of the glass substrate 20, the side surface 25aA of the first concave portion 25a and the side surface 25bA of the second concave portion 25b intersect with each other 31A. The angle θ _t formed between the tangent line of the curve indicating the side surface 25aA of the first recess 25a and the one surface of the glass substrate 20 is set to 0 degree.
In the through hole 25 in the second example, the angle theta _t has a side surface portion of 0 degree, as compared with the through hole 15 in the first example, the surface direction of the glass substrate 10 and the horizontal With the first concave portion 25aA side up, when a UV curable protective resin is applied to the side surface portion of the through hole with a dispenser or the like and cured, the dripping due to the gravity of the resin can be further suppressed. .
Note that the length of the side surface portion where the angle θ _t is 0 degrees is preferably longer from the surface that suppresses dripping of the resin due to gravity, but the second concave portion 25b on the lower side from the first concave portion 25a on the upper side. It is necessary not to disturb the flow of resin to the side.
Of course, in the case of the second example as well, as in the case of the first example, by applying the resin with the second recess 25a side as the upper side, the conventional method for forming a through hole by etching shown in FIG. Compared to the case, since the upper concave portion (first concave portion) is larger than the lower concave portion (second concave portion), the resin tends to stay in the upper concave portion (first concave portion). Thus, it is possible to reduce the amount drooping in the lower concave portion, and as a result, it is possible to form a resin film on the side surface of the through-hole portion in a penetrating state.

About formation of the through-hole part 25 of a 2nd example, as shown to Fig.2 (a)-FIG.2 (f), the process same as formation of the through-hole part 15 of a 1st example is fundamentally performed. However, in the shape of the through-hole portion formed in the glass substrate, the angle θ _t formed between the tangent line of the curve indicating the side surface 25aA of the first recess 25a and the one surface of the glass substrate 20 is 0 degree. In order to do this, in the resin film affixing step, the same etching is performed from both sides by dipping, spraying, etc. from both sides of the glass substrate 10, but in the second through hole forming method, each formation is performed. The difference in the size of the opening of the resin film to be attached to both surfaces of the glass substrate for each through-hole portion to be made is made larger than in the case of the through-hole portion forming method in the first example.
Accordingly, the angle θ _t formed between the tangent line of the curve indicating the side surface 25aA of the first recess 25a and the one surface of the glass substrate 20 can be set to 0 degree.
Other than that, it is basically the same as the method of forming the through hole portion of the first example, and the description is omitted here.
Here, even if the angle θ _t is not strictly 0 °, the surface direction of the base material is horizontal, the first concave portion side is up, and the resin is applied to the side surface portion of the through hole. As in the case of 0 degree, the angle at which the resin can be prevented from dripping due to gravity is set to an angle corresponding to 0 degree, and such an angle close to 0 degree is also set as “angle θ _t is 0 degree”. deal with.

In addition, the cover glass which has the through-hole part 28 which has the cross-sectional shape shown in FIG.2 (e) can also be mentioned as a modification of a 2nd example.
This modified example is the same as the second example except that the shape of the cured resin 27 is partly different from the second example.

Embodiments of the cover glass of the present invention are not limited to the first example, the modified example of the first example, the second example, and the modified example of the second example.
For example, the form which formed the decoration part which is the area | region which gave decoration by the printing method, the photolitho method, etc. on the one surface side of the said cover glass is also mentioned.
Further, the resin (corresponding to 17 in FIG. 1 and 27 in FIG. 2) may contain a color pigment having the same color as that of the color pigment contained in the decorative portion.
In the first example and the modified example of the first example, in the upper side shown in FIG. 1 (e), the W1 width is a region where the decorative portion cannot be formed, but the resin 17 includes the decorative portion. In the case where the same color pigment as that of the colored pigment is included, this region can be made to be the same as the decorative portion in appearance.
Similarly, in the second example and the modified example of the second example, in the upper side shown in FIG. 2 (e), the W2 width is a region where the decoration portion cannot be formed, but the resin 27 is decorated. When a color pigment having the same color as the color pigment contained in the part is included, this region can be made to be the same as the decorative part in appearance.

10 Glass substrate (also called unit substrate)
10a Unstrengthened processing part 10b Reinforced processing part 11 Resin film 11a Opening 12 Resin film 12a Opening 15 Through-hole part 15a 1st recessed part (large-sized recessed part)
15b Second recess (small size recess)
15c Through hole 15aA Side surface portion 15bA (of the first concave portion) Side surface portion 17 (for protection before curing) Resin 17A (for protection after curing) Resins 17a, 17b Through hole 18, 18A Through-hole 20 Glass substrate (also referred to as unit substrate)
20a Unstrengthened processing portion 20b Reinforced processing portion 21 Resin film 21a Opening 22 Resin film 22a Opening 25 Through-hole portion 25a First concave portion (large size concave portion)
25b Second recess (small size recess)
25c Through hole 25aA Side surface portion 25bA (of the first recess) Side surface portion 27 (of the second recess) Resin 27A (for protection before curing) Resin 27a, 27b (for protection after curing) Through hole 28, 28A Through-hole part 50 Glass base material (it is also called a unit base material)
50a Unstrengthened processing section 50b Reinforced processing section 51 Resin film 51a Opening 52 Resin film 52a Opening 55 Through hole 55a First recess (large recess)
55b Second recess (small size recess)
55c Through hole 55aA Side surface part 56 Resin film 57 Resin 57A (for protection before curing) Resin 58, 59 Through hole part 58a, 59a Through hole 60 Glass substrate (also referred to as unit substrate) )
60a Unstrengthened processing section 60b Reinforced processing sections 61, 62 Resin film 67 Resin 69, 69A Through hole 69a, 69Aa Through hole 120 Touch panel device 130 Touch sensor 131 Base film 132 (Transparent) First electrode part (X electrode part)
132a (transparent) conductor layer 132b (transparent) conductor layer 133 (transparent) second electrode part (Y electrode part)
133a (transparent) conductor layer 133b (transparent) conductor layer 140 Protective cover (cover glass)
151 Adhesive layer (insulating layer)
152 Adhesive layer (insulating layer)
160 Display device 200 Cover glass
210 Glass substrate 221 to 223 Through hole 230 Recess

Claims (3)

In the state where a tempered glass whose surface has been tempered is used as a base material, a through-hole portion is formed by drilling the base material and penetrated, and the through-hole portion is penetrated, the through-hole portion A cover glass having a protective resin portion disposed on the side surface thereof,
The through-hole portion is formed by double-sided etching, and is recessed from one surface of the base material in the surface direction of the base material with the same concave region position and the same center position of the outer shape. A first recess having a large size formed by etching, and a second recess having a small size formed by etching and recessed from the other surface of the substrate; and the first recess and the second recess and of being pierced with,
The protective resin portion is characterized in that a resin is disposed on a side surface of the first recess and a side surface of the second recess, and a resin film is formed on the entire side surface of the through-hole portion. cover glass.   2. The cover glass according to claim 1, wherein, in a cross-sectional shape in a direction perpendicular to the through-hole portion, the first side surface of the first concave portion and the side surface of the second concave portion intersect each other. An angle θt formed between a tangent line of a curve indicating a side surface of the concave portion and the one surface of the base material is 0 degrees. A method of forming a through hole in a cover glass, wherein (a) a tempered glass having a tempered surface is used as a base material, and an etching resistant mask having an opening corresponding to each through hole to be formed is used. An etching-resistant second resin film having an opening corresponding to each through hole to be formed on one surface of the base material on the one surface of the base material, on the other surface of the base material, A resin film attaching step to be attached; and (b) an etching step in which the base material portion exposed from the opening of the resin film is etched from both surfaces of the base material to form a penetrating through hole portion; and (c) formation. A protective resin coating step for applying and curing a protective resin on the side surface of the through-hole portion, and (d) a resin film peeling step for peeling the resin films on both sides of the substrate, respectively. , Have In the resin film attaching step, in the surface direction (XY plane) of the base material, the opening of the first resin film corresponds to each through-hole to be formed, and the second resin film And the opening size of the first resin film is larger than the opening size of the second resin film, and the protective resin In the disposing step, in a state where the base material is leveled, from the recessed side formed by etching on the side where the first resin film is attached, a protective resin is applied to the side surface of the through hole portion, A method for forming a through-hole in a cover glass, characterized by curing.

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