JP6302201B2 - Resin composition and use thereof - Google Patents
Resin composition and use thereof Download PDFInfo
- Publication number
- JP6302201B2 JP6302201B2 JP2013203941A JP2013203941A JP6302201B2 JP 6302201 B2 JP6302201 B2 JP 6302201B2 JP 2013203941 A JP2013203941 A JP 2013203941A JP 2013203941 A JP2013203941 A JP 2013203941A JP 6302201 B2 JP6302201 B2 JP 6302201B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin composition
- hollow particles
- molded product
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 39
- 239000002245 particle Substances 0.000 claims description 102
- 229920005992 thermoplastic resin Polymers 0.000 claims description 64
- 239000000843 powder Substances 0.000 claims description 63
- 230000005484 gravity Effects 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 28
- 239000010419 fine particle Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 12
- -1 ethylene, propylene, 1-butene Chemical class 0.000 description 41
- 239000000178 monomer Substances 0.000 description 33
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 23
- 238000000034 method Methods 0.000 description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 229940048053 acrylate Drugs 0.000 description 19
- 229920000103 Expandable microsphere Polymers 0.000 description 17
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- 238000002156 mixing Methods 0.000 description 13
- 229920001778 nylon Polymers 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 11
- 239000004677 Nylon Substances 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 10
- 239000004088 foaming agent Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 239000004005 microsphere Substances 0.000 description 8
- 239000008188 pellet Substances 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 6
- 239000003208 petroleum Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 229940114077 acrylic acid Drugs 0.000 description 5
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 229920005990 polystyrene resin Polymers 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 3
- 239000000920 calcium hydroxide Substances 0.000 description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 3
- 235000011116 calcium hydroxide Nutrition 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000001530 fumaric acid Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 3
- 239000001095 magnesium carbonate Substances 0.000 description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- GWHJZXXIDMPWGX-UHFFFAOYSA-N 1,2,4-trimethylbenzene Chemical compound CC1=CC=C(C)C(C)=C1 GWHJZXXIDMPWGX-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 2
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
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- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
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Images
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- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、樹脂組成物およびそれを用いて成形してなる成形物に関する。 The present invention relates to a resin composition and a molded product formed by using the resin composition.
インスツルメントパネル、ドアパネル、シートバック、ピラー、ステアリングホイール等の自動車用内装材や、大型で複雑な形状を有するシート状の樹脂成形物を製造する際、加熱した金型の成形面に熱可塑性樹脂粉体を付着させ溶融させた後に冷却して樹脂成形物を取り出す成形法、いわゆるパウダースラッシュ成形法が広く実施されている。
パウダースラッシュ成形法において、得られる熱可塑性樹脂成形物の軽量化を図るには、熱可塑性樹脂に熱分解型発泡剤を配合して成形する方法がある(特許文献1参照)。しかし、発泡剤が分解して生成する発泡ガスにより微細な孔(いわゆる、ピンホール)が表面に多数発生する。このため、意匠性の高い製品に使用することが困難であった。また、発泡ガスによる気泡の大きさを制御することは難しく、その結果、得られる成形物の物性にも影響を与え、問題であった。
When manufacturing automotive interior materials such as instrument panels, door panels, seat backs, pillars, steering wheels, and large, complex sheet-shaped resin moldings, the molding surface of the heated mold is thermoplastic. A so-called powder slush molding method is widely practiced in which resin powder is adhered and melted and then cooled to take out a resin molded product.
In the powder slush molding method, in order to reduce the weight of the obtained thermoplastic resin molding, there is a method in which a thermoplastic resin is blended with a pyrolytic foaming agent (see Patent Document 1). However, many fine holes (so-called pinholes) are generated on the surface by the foaming gas generated by the decomposition of the foaming agent. For this reason, it was difficult to use for a product with high designability. Also, it is difficult to control the size of the bubbles due to the foaming gas. As a result, the physical properties of the obtained molded product are affected, which is a problem.
一方、熱分解型発泡剤に代えて熱膨張性微小球を発泡成分として用いると、得られる成形物に独立気泡を導入することができる。さらに、成形時の加熱温度を調整すると、気泡の大きさや成形物の比重を容易に制御することが可能であるので、パウダースラッシュ成形法への応用が提案されている(特許文献2参照)。しかし、得られた成形物は表面性に劣っていた。すなわち、金型と接する成形物の表面だけではなく、成形物の裏面も表面性に劣るものであった。そのため、成形物の表面の外観が良くないばかりか、裏面も表面性が劣るために、他の部材を裏面と十分に接着させることも困難であるという問題があり、成形物の表面および裏面の表面性の改良が望まれていた。 On the other hand, if thermally expandable microspheres are used as the foaming component instead of the pyrolytic foaming agent, closed cells can be introduced into the resulting molded product. Furthermore, by adjusting the heating temperature at the time of molding, it is possible to easily control the size of bubbles and the specific gravity of the molded product, and therefore, application to a powder slush molding method has been proposed (see Patent Document 2). However, the obtained molded product was inferior in surface properties. That is, not only the surface of the molded product in contact with the mold but also the back surface of the molded product was inferior in surface properties. Therefore, not only the appearance of the surface of the molded product is not good, but also the back surface is inferior in surface properties, so there is a problem that it is difficult to sufficiently bond other members to the back surface. Improvement in surface properties has been desired.
本発明の目的は、パウダースラッシュ成形することによって表面および裏面の両方で表面性に優れ、軽量な成形物が得ることができる樹脂組成物を提供することである。 An object of the present invention is to provide a resin composition that is excellent in surface properties on both the front and back surfaces by powder slush molding, and can obtain a lightweight molded product.
本発明者らは、上記問題解決のために鋭意検討した結果、たとえば、特定の真比重を有する中空粒子等を用いれば、上記課題を解決することができるという知見を得て、本発明に到達した。
本発明の樹脂組成物は、パウダースラッシュ成形で用いられる樹脂組成物であって、熱可塑性樹脂粉体および外殻部が熱可塑性樹脂からなる中空粒子を含み、前記中空粒子の真比重が0.02〜0.30g/ccであり、平均粒子径が0.8〜60μmであり、前記熱可塑性樹脂粉体100重量部に対して前記中空粒子が1〜20重量部である。
As a result of intensive studies for solving the above problems, the present inventors have obtained the knowledge that the above problems can be solved by using, for example, hollow particles having a specific true specific gravity, and reached the present invention. did.
The resin composition of the present invention is a resin composition used in powder slush molding, and includes thermoplastic resin powder and hollow particles whose outer shell portion is made of a thermoplastic resin, and the true specific gravity of the hollow particles is 0.00. The average particle size is 0.8 to 60 μm, and the hollow particles are 1 to 20 parts by weight with respect to 100 parts by weight of the thermoplastic resin powder.
前記中空粒子の真比重は0.02〜0.15g/ccであると好ましい。前記外殻部の外表面に微粒子が付着してなると好ましい。
本発明の成形物の製造方法は、上記樹脂組成物をパウダースラッシュ成形してなる。この成形物は、真比重が1.1g/cc以下であるとよい。
The true specific gravity of the hollow particles is preferably 0.02 to 0.15 g / cc. It is preferable that fine particles adhere to the outer surface of the outer shell portion.
The method for producing a molded product of the present invention is obtained by powder slush molding the above resin composition. This molded article may have a true specific gravity of 1.1 g / cc or less.
本発明の樹脂組成物は、パウダースラッシュ成形することによって表面および裏面の両方で表面性に優れる成形物を得ることができる。
本発明の成形物は、その表面および裏面の両方で表面性に優れる。
The resin composition of the present invention can obtain a molded product having excellent surface properties on both the front and back surfaces by powder slush molding.
The molded product of the present invention is excellent in surface properties on both the front surface and the back surface.
〔樹脂組成物〕
本発明の樹脂組成物は、パウダースラッシュ成形で用いられる樹脂組成物であり、熱可塑性樹脂粉体および中空粒子を必須とする。この樹脂組成物は、熱可塑性樹脂粉体および中空粒子以外のその他の成分をさらに含有してもよい。
以下、樹脂組成物を構成する各成分を説明する。
(Resin composition)
The resin composition of the present invention is a resin composition used in powder slush molding, and essentially comprises a thermoplastic resin powder and hollow particles. This resin composition may further contain other components other than the thermoplastic resin powder and the hollow particles.
Hereinafter, each component which comprises a resin composition is demonstrated.
(熱可塑性樹脂粉体)
熱可塑性樹脂粉体は、加熱により成形できる程度の熱可塑性、すなわち、加熱すると塑性変形を起こし、冷却すると可逆的に硬化する性質を有する熱可塑性樹脂よりなる粉体である。
熱可塑性樹脂粉体を構成する熱可塑性樹脂については特に限定はないが、たとえば、ポリオレフィン系樹脂(PO)、ポリ塩化ビニル系樹脂(PVC)、ポリスチレン系樹脂(PS)、ポリウレンタン系樹脂(PU)、アクリル系樹脂、ポリアミド樹脂、ポリエステル系樹脂、熱可塑性エラストマー(TPE)や、その他の樹脂等を挙げることができる。これらの熱可塑性樹脂は1種または2種以上を併用してもよい。
(Thermoplastic resin powder)
The thermoplastic resin powder is a powder made of a thermoplastic resin having such a property that it can be molded by heating, that is, has a property of causing plastic deformation when heated and reversibly curing when cooled.
The thermoplastic resin constituting the thermoplastic resin powder is not particularly limited. For example, polyolefin resin (PO), polyvinyl chloride resin (PVC), polystyrene resin (PS), polyurethane resin (PU). , Acrylic resins, polyamide resins, polyester resins, thermoplastic elastomers (TPE), and other resins. These thermoplastic resins may be used alone or in combination of two or more.
ポリオレフィン系樹脂(PO)としては、たとえば、エチレン、プロピレン、1−ブテン、4−メチル−1−ペンテン、3−メチル−1−ブテン、1−ペンテン、1−ヘキセン、1−オクテン、1−デセン、1−ドデセン、1−ヘキサデセン、1−オクタデセン、1−エイコセン等のオレフィンや、ブタジエン、イソプレン等のジオレフィンを単独重合または共重合して得られる重合体(この重合体に不飽和結合が含まれる場合、水素添加された重合体であってもよい。);上記オレフィンおよび/またはジオレフィンと酢酸ビニル、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステル、ビニルアルコール、マレイン酸等のモノマーとの共重合体等を挙げることができる。
ポリ塩化ビニル系樹脂(PVC)としては、たとえば、ポリ塩化ビニル、塩素化ポリ塩化ビニル、ポリ塩化ビニリデン、塩化ビニル/酢酸ビニル共重合体、塩化ビニル/エチレン共重合体、塩化ビニル/エチレン/酢酸ビニル共重合体等を挙げることができる。
Examples of the polyolefin resin (PO) include ethylene, propylene, 1-butene, 4-methyl-1-pentene, 3-methyl-1-butene, 1-pentene, 1-hexene, 1-octene and 1-decene. , A polymer obtained by homopolymerization or copolymerization of olefins such as 1-dodecene, 1-hexadecene, 1-octadecene and 1-eicosene and diolefins such as butadiene and isoprene (this polymer contains an unsaturated bond) And may be a hydrogenated polymer)); monomers such as the above olefins and / or diolefins and vinyl acetate, acrylic acid, acrylic ester, methacrylic acid, methacrylic ester, vinyl alcohol, maleic acid, etc. And a copolymer thereof.
Examples of the polyvinyl chloride resin (PVC) include polyvinyl chloride, chlorinated polyvinyl chloride, polyvinylidene chloride, vinyl chloride / vinyl acetate copolymer, vinyl chloride / ethylene copolymer, vinyl chloride / ethylene / acetic acid. A vinyl copolymer etc. can be mentioned.
ポリスチレン系樹脂(PS)としては、たとえば、ポリスチレン、スチレン/エチレン共重合体、スチレン/プロピレン共重合体、スチレン/エチレン/プロピレン共重合体、スチレン/イソプレン共重合体、スチレン/ブタジエン共重合体、スチレン/イソプレン/ブタジエン共重合体、スチレン/マレイン酸誘導体共重合体、スチレン/アクリロニトリル共重合体、アクリロニトリル/ブタジエン/スチレン共重合体、アクリロニトリル/アクリル酸エステル/スチレン共重合体、メタクリル酸メチル/ブタジエン/スチレン共重合体等(この重合体に不飽和結合が含まれる場合、水素添加された重合体であってもよい。)を挙げることができる。
ポリウレンタン系樹脂(PU)は公知の方法により得ることができ、たとえば、有機ジイソシアネートとジヒドロキシ化合物とを重合させる方法がある。この重合は分散剤や溶剤等の存在下で行ってもよい。
Examples of the polystyrene resin (PS) include polystyrene, styrene / ethylene copolymer, styrene / propylene copolymer, styrene / ethylene / propylene copolymer, styrene / isoprene copolymer, styrene / butadiene copolymer, Styrene / isoprene / butadiene copolymer, styrene / maleic acid derivative copolymer, styrene / acrylonitrile copolymer, acrylonitrile / butadiene / styrene copolymer, acrylonitrile / acrylic ester / styrene copolymer, methyl methacrylate / butadiene / Styrene copolymer and the like (when this polymer contains an unsaturated bond, it may be a hydrogenated polymer).
Polyurethane resin (PU) can be obtained by a known method, for example, a method of polymerizing an organic diisocyanate and a dihydroxy compound. This polymerization may be performed in the presence of a dispersant, a solvent or the like.
有機ジイソシアネートとしては、たとえば、ヘキサメチレンジイソシアネート、リジンジイソシアネート、イソホロンジイソシアネート、キシレンジイソシアネート、シクロヘキサンジイソシアネート、トルイジンジイソシアネート、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、4,4´−ジフェニルメタンジイソシアネート、p−フェニレンジイソシアネート、m−フェニレンジイソシアネート、1,5−ナフチレンジイソシアネート等を挙げることができる。これらの有機ジイソシアネートは、1種または2種以上を組み合わせて用いてもよい。
ジヒドロキシ化合物としては、たとえば、エチレングリコール、1,2−プロピレングリコール、1,3−プロピレングリコール、2,3−ブチレングリコール、1,4−ブタンジオール、2,2´−ジメチル−1,3−プロパンジオール、ジエチレングリコール、1,5−ペンタンジオール、1,6−ヘキサンジオール、シクロヘキサン−1,4−ジオール、シクロヘキサン−1,4−ジメタノール、ポリエステルジオール、ポリエーテルジオール、ポリカーボネートジオール等が挙げられる。これらのジヒドロキシ化合物は、1種または2種以上を組み合わせて用いてもよい。
Examples of the organic diisocyanate include hexamethylene diisocyanate, lysine diisocyanate, isophorone diisocyanate, xylene diisocyanate, cyclohexane diisocyanate, toluidine diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, Examples thereof include p-phenylene diisocyanate, m-phenylene diisocyanate, 1,5-naphthylene diisocyanate and the like. These organic diisocyanates may be used alone or in combination of two or more.
Examples of the dihydroxy compound include ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 2,3-butylene glycol, 1,4-butanediol, and 2,2′-dimethyl-1,3-propane. Examples include diol, diethylene glycol, 1,5-pentanediol, 1,6-hexanediol, cyclohexane-1,4-diol, cyclohexane-1,4-dimethanol, polyester diol, polyether diol, and polycarbonate diol. These dihydroxy compounds may be used alone or in combination of two or more.
アクリル系樹脂としては特に限定はないが、たとえば、(メタ)アクリル酸や(メタ)アクリル酸エステル等のアクリル系単量体を重合して得られる(共)重合体が挙げられる。(メタ)アクリル酸エステルとしては、(メタ)アクリル酸アルキルエステルや(メタ)アクリル酸置換アルキルエステルが、加工性、柔軟性等の観点から好ましい。
(メタ)アクリル酸アルキルエステルのアルキル基としては特に限定はないが、たとえば、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、n−ペンチル基、n−ヘキシル基、シクロヘキシル基、2−エチルヘキシル基、イソボルニル基、ステアリル基等を挙げることができる。
Although it does not specifically limit as acrylic resin, For example, the (co) polymer obtained by superposing | polymerizing acrylic monomers, such as (meth) acrylic acid and (meth) acrylic acid ester, is mentioned. As the (meth) acrylic acid ester, a (meth) acrylic acid alkyl ester or a (meth) acrylic acid-substituted alkyl ester is preferable from the viewpoint of processability and flexibility.
Although there is no limitation in particular as an alkyl group of (meth) acrylic-acid alkylester, For example, a methyl group, an ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, n-hexyl Group, cyclohexyl group, 2-ethylhexyl group, isobornyl group, stearyl group and the like.
(メタ)アクリル酸置換アルキルの置換アルキル基としては特に限定はないが、たとえば、2−ヒドロキシエチル基、2−ヒドロキシプロピル基等のヒドロキシル基が置換したアルキル基;グリシジル基等のエポキシ基が置換したアルキル基;2−アミノエチル基等のアミノ基が置換したアルキル基;トリフルオロメチルメチル基、2−トリフルオロメチルエチル基、2−パーフルオロエチルエチル基、2−パーフルオロエチル−2−パーフルオロブチルエチル基、2−パーフルオロエチル基、パーフルオロメチル基、ジパーフルオロメチルメチル基、2−パーフルオロメチル−2−パーフルオロエチルメチル基、2−パーフルオロヘキシルエチル基、2−パーフルオロデシルエチル基、2−パーフルオロヘキサデシルエチル基等の等のハロゲン原子(好ましくはフッ素原子)が置換したアルキル基等を挙げることができる。
アクリル系樹脂では、上記で具体的に例示した樹脂の原料となるアクリル系単量体と、その他の単量体とを共重合させて得られる重合体でもよい(この重合体に不飽和結合が含まれる場合、水素添加された重合体であってもよい。)。このようなその他の単量体としては、スチレン、α−メチルスチレン、p−メチルスチレン、p−メトキシスチレン、アクリロニトリル、メタクリロニトリル、ブタジエン、イソプレン、塩化ビニル、塩化ビニリデン、パーフルオロエチレン、パーフルオロプロピレン、フッ化ビニリデン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、無水マレイン酸、マレイン酸、マレイン酸のモノアルキルエステルおよびジアルキルエステル、フマル酸、フマル酸のモノアルキルエステル、酢酸ビニル、プロピオン酸ビニル、ピバリン酸ビニル、安息香酸ビニル、桂皮酸ビニル、マレイミド、メチルマレイミド、エチルマレイミド、プロピルマレイミド、ブチルマレイミド、ヘキシルマレイミド、オクチルマレイミド、ドデシルマレイミド、ステアリルマレイミド、フェニルマレイミド、シクロヘキシルマレイミド等を挙げることができる。
The substituted alkyl group of (meth) acrylic acid-substituted alkyl is not particularly limited. For example, an alkyl group substituted with a hydroxyl group such as 2-hydroxyethyl group or 2-hydroxypropyl group; an epoxy group such as glycidyl group is substituted. Alkyl groups substituted with amino groups such as 2-aminoethyl group; trifluoromethylmethyl group, 2-trifluoromethylethyl group, 2-perfluoroethylethyl group, 2-perfluoroethyl-2-par Fluorobutylethyl group, 2-perfluoroethyl group, perfluoromethyl group, diperfluoromethylmethyl group, 2-perfluoromethyl-2-perfluoroethylmethyl group, 2-perfluorohexylethyl group, 2-perfluoro Halo such as decylethyl group, 2-perfluorohexadecylethyl group, etc. Emissions atom (preferably fluorine atom) can be exemplified an alkyl group which has been substituted.
The acrylic resin may be a polymer obtained by copolymerizing an acrylic monomer that is a raw material of the resin specifically exemplified above and other monomers (unsaturated bond is present in this polymer). If included, it may be a hydrogenated polymer). Such other monomers include styrene, α-methylstyrene, p-methylstyrene, p-methoxystyrene, acrylonitrile, methacrylonitrile, butadiene, isoprene, vinyl chloride, vinylidene chloride, perfluoroethylene, perfluoro. Propylene, vinylidene fluoride, vinyltrimethoxysilane, vinyltriethoxysilane, maleic anhydride, maleic acid, monoalkyl and dialkyl esters of maleic acid, fumaric acid, monoalkyl esters of fumaric acid, vinyl acetate, vinyl propionate, Vinyl pivalate, vinyl benzoate, vinyl cinnamate, maleimide, methylmaleimide, ethylmaleimide, propylmaleimide, butylmaleimide, hexylmaleimide, octylmaleimide, dodecylmaleimide, Stearyl maleimide, phenyl maleimide and cyclohexyl maleimide.
ポリアミド樹脂は、酸アミド結合(−CONH−)の繰り返しによって主鎖を構成する結晶性樹脂であり、たとえば、6−ナイロン、66−ナイロン、6,10−ナイロン、6,12−ナイロン、11−ナイロン、12−ナイロン、46−ナイロン、MXD−ナイロン、6−Tナイロン等の変性ナイロン等を挙げることができる。
ポリエステル系樹脂としては、たとえば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンナフタレート、ポリシクロヘキシレンジメチレンテレフタレート等を挙げることができる。
The polyamide resin is a crystalline resin that forms a main chain by repeating acid amide bonds (—CONH—). For example, 6-nylon, 66-nylon, 6,10-nylon, 6,12-nylon, 11- Examples thereof include modified nylons such as nylon, 12-nylon, 46-nylon, MXD-nylon, 6-T nylon and the like.
Examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polycyclohexylene dimethylene terephthalate, and the like.
熱可塑性エラストマー(TPE)としては、たとえば、ウレタン系(TPU)、塩ビ系、オレフィン系(TPO)、スチレン系(TPS)、フッ素系、ポリアミド系、ポリエステル系の熱可塑性エラストマー等を挙げることができる。
その他の樹脂としては、ポリオキシメチレン、ポリカーボネート、変性ポリフェニレンエーテル等を挙げることができる。
Examples of the thermoplastic elastomer (TPE) include urethane (TPU), vinyl chloride, olefin (TPO), styrene (TPS), fluorine, polyamide, and polyester thermoplastic elastomers. .
Examples of other resins include polyoxymethylene, polycarbonate, and modified polyphenylene ether.
これらの熱可塑性樹脂は、有機過酸化物等の存在下で動的に熱処理する既知の方法により、部分架橋されたものであってもよい。部分架橋を行う際に用いる有機過酸化物としては、たとえば、ベンゾイルパーオキサイド、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキシン−3、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン、ジクミルパーオキサイド、t−ブチルヒドロキシパーオキサイド等を挙げることができる。また、架橋を促進させる架橋助剤を有機過酸化物と併用してもよく、たとえば、トリアリルシアヌレート、トリアリルイソシアヌレート、トリメチロールプロパントリメタクリレート、1,2−ポリブタジエン、ジビニルベンゼン等を挙げることができる。
熱可塑性樹脂が共重合体の場合、その構造は、ランダム構造、ブロック構造、グラフト構造等のいずれでも良く、これらの混合物でもよい。
These thermoplastic resins may be partially crosslinked by a known method of dynamically heat-treating in the presence of an organic peroxide or the like. Examples of the organic peroxide used for partial crosslinking include benzoyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3, 2,5-dimethyl-2, Examples include 5-di (t-butylperoxy) hexane, dicumyl peroxide, t-butylhydroxyperoxide, and the like. Further, a crosslinking aid for promoting crosslinking may be used in combination with the organic peroxide, such as triallyl cyanurate, triallyl isocyanurate, trimethylolpropane trimethacrylate, 1,2-polybutadiene, divinylbenzene and the like. be able to.
When the thermoplastic resin is a copolymer, the structure may be any of a random structure, a block structure, a graft structure, etc., or a mixture thereof.
また、熱可塑性樹脂粉体に用いられる熱可塑性樹脂は、以下で説明する、樹脂組成物に配合されるその他の成分をさらに含有していてもよい。
熱可塑性樹脂粉体の平均粒子径については、特に限定はないが、好ましくは1〜2000μm、より好ましくは5〜1000μm、さらに好ましくは10〜700μm、特に好ましくは30〜500μm、最も好ましくは50〜300μmである。熱可塑性樹脂粉体の平均粒子径が1μm未満であると、発塵等により作業性が悪くなるばかりでなく、粉体のブロッキング等が発生しやすくなり、成形が困難になることがある。一方、熱可塑性樹脂粉体の平均粒子径が2000μmを超えると、成形で使用する金型表面に均一に付着することが困難になり、その結果、得られる成形物の表面および裏面の表面性が低下することがある。
Moreover, the thermoplastic resin used for the thermoplastic resin powder may further contain other components blended in the resin composition described below.
The average particle diameter of the thermoplastic resin powder is not particularly limited, but is preferably 1 to 2000 μm, more preferably 5 to 1000 μm, still more preferably 10 to 700 μm, particularly preferably 30 to 500 μm, and most preferably 50 to 300 μm. When the average particle size of the thermoplastic resin powder is less than 1 μm, not only the workability is deteriorated due to dust generation but also the powder is likely to be blocked, and the molding may be difficult. On the other hand, when the average particle diameter of the thermoplastic resin powder exceeds 2000 μm, it becomes difficult to uniformly adhere to the mold surface used for molding, and as a result, the surface properties of the surface and the back surface of the resulting molded product May decrease.
熱可塑性樹脂粉体を調製する方法については、特に限定はないが、たとえば、熱可塑性樹脂の製造プラントより粉体として得る方法;ペレット化された熱可塑性樹脂を粉砕して粉体として得る方法;数種の熱可塑性樹脂等を混練機により溶融混練してペレット化した後、得られた熱可塑性樹脂のペレットを粉砕して粉体とする方法等を挙げることができる。
特に、熱可塑性樹脂粉体を熱可塑性樹脂のペレットから調製する方法としては、たとえば、熱可塑性樹脂のペレットを液体窒素、ドライアイス等で−50〜−100℃に冷凍し、粉砕機により機械的に粉砕する冷凍粉砕方法;熱可塑性樹脂のペレットを、常温下で、多量の空気流で摩擦熱を除去しつつ、あるいは冷却手段を伴わないで、粉砕機により機械的に粉砕する常温粉砕方法;熱可塑性樹脂のペレットを高温で溶剤に溶かして冷却沈殿させ、温度による溶解度の差を利用して沈殿させるか、または溶液に貧溶媒を加えて沈殿させる化学粉砕方法等を挙げることができる。
The method for preparing the thermoplastic resin powder is not particularly limited. For example, a method of obtaining a powder from a thermoplastic resin production plant; a method of obtaining a powder by pulverizing a pelletized thermoplastic resin; Examples thereof include a method in which several kinds of thermoplastic resins and the like are melt-kneaded with a kneader to form pellets, and then the resulting thermoplastic resin pellets are pulverized to form powder.
In particular, as a method for preparing the thermoplastic resin powder from the pellets of the thermoplastic resin, for example, the pellets of the thermoplastic resin are frozen at −50 to −100 ° C. with liquid nitrogen, dry ice or the like and mechanically processed by a pulverizer. A freezing and pulverizing method in which the pellets of thermoplastic resin are pulverized mechanically by a pulverizer at room temperature while removing frictional heat with a large amount of air flow or without cooling means; Examples thereof include a chemical pulverization method in which a pellet of a thermoplastic resin is dissolved in a solvent at a high temperature and cooled and precipitated by using a difference in solubility depending on temperature, or precipitated by adding a poor solvent to the solution.
(中空粒子)
中空粒子は、本発明の樹脂組成物をパウダースラッシュ成形して得られる成形物を軽量化する成分である。本発明の樹脂組成物では中空粒子を含有することによって、成形物の表面および裏面の両方で表面性に優れ、シボ(表面の紋様)の転写性が良好で、成形物は意匠性に優れる。また、中空粒子は既に軽量であるので、成形物を意図する比重に容易に調整することができる。
中空粒子は、外殻部およびそれに囲まれた中空部からなる中空粒子は、(ほぼ)球状で、内部に大きな空洞に相当する中空部を有している。中空粒子の形状を身近な物品で例示するならば、軟式テニスボールを挙げることができる。
(Hollow particles)
Hollow particles are a component that reduces the weight of a molded product obtained by powder slush molding of the resin composition of the present invention. By containing hollow particles in the resin composition of the present invention, the surface property is excellent on both the front surface and the back surface of the molded product, the texture (surface pattern) transferability is good, and the molded product is excellent in design. Also, since the hollow particles are already light, they can be easily adjusted to the specific gravity intended for the molded product.
The hollow particles, which are composed of an outer shell portion and a hollow portion surrounded by the outer shell portion, are (substantially) spherical and have a hollow portion corresponding to a large cavity inside. If the shape of the hollow particles is exemplified by familiar articles, a soft tennis ball can be mentioned.
中空粒子の平均粒子径については用途に応じて自由に設計することができるために特に限定されないが、好ましくは0.01〜1000μm、より好ましくは0.1〜800μm、さらに好ましくは0.8〜200μmである。また、中空粒子の粒度分布の変動係数CVについても、特に限定はないが、30%以下が好ましく、さらに好ましくは25%以下である。
中空粒子の真比重については特に限定はないが、通常0.02〜0.3g/cc、好ましくは0.03〜0.25g/cc、より好ましくは0.04〜0.20g/cc、さらに好ましくは0.05〜0.15g/cc、特に好ましくは0.06〜0.10g/ccである。中空粒子の真比重が0.02g/cc未満であると、得られた成形物の表面および裏面の両方で表面性が低下すると共に、成形物が脆くなり、力学的物性が低下することがある。一方、中空粒子の真比重が0.3g/ccを超えると、成形物を十分に軽量化できなくなるおそれがある。そのために、樹脂組成物に配合する中空粒子の量を多くする必要があり、経済的に不利になることがある。
The average particle diameter of the hollow particles is not particularly limited because it can be designed freely according to the use, but is preferably 0.01 to 1000 μm, more preferably 0.1 to 800 μm, and still more preferably 0.8 to 200 μm. Further, the coefficient of variation CV of the particle size distribution of the hollow particles is not particularly limited, but is preferably 30% or less, and more preferably 25% or less.
The true specific gravity of the hollow particles is not particularly limited, but is usually 0.02 to 0.3 g / cc, preferably 0.03 to 0.25 g / cc, more preferably 0.04 to 0.20 g / cc, Preferably it is 0.05-0.15 g / cc, Most preferably, it is 0.06-0.10 g / cc. When the true specific gravity of the hollow particles is less than 0.02 g / cc, the surface properties of both the surface and the back surface of the obtained molded product are deteriorated, the molded product becomes brittle, and the mechanical properties may be reduced. . On the other hand, if the true specific gravity of the hollow particles exceeds 0.3 g / cc, the molded product may not be sufficiently lightened. Therefore, it is necessary to increase the amount of hollow particles blended in the resin composition, which may be disadvantageous economically.
中空粒子の種類については、特に限定はないが、その外殻部が無機成分から構成される粒子や、その外殻部が熱可塑性樹脂から構成される粒子等を挙げることができる。以下では、上記で説明した熱可塑性樹脂粉体の「熱可塑性樹脂」と混同を避けるために、外殻部を構成する熱可塑性樹脂を「熱可塑性樹脂A」ということがある。
無機成分から構成される粒子としては、たとえば、ガラスバルーン、シラスバルーン、フライアッシュ、シリカバルーン等を挙げることができる。一方、熱可塑性樹脂Aから構成される粒子としては、熱可塑性樹脂Aからなる外殻と、それに内包され且つ加熱することによって気化する発泡剤とから構成される熱膨張性微小球を加熱膨張させて得られる粒子等を挙げることができる。
Although there is no limitation in particular about the kind of hollow particle, The particle | grains in which the outer shell part is comprised from an inorganic component, the particle | grains in which the outer shell part is comprised from a thermoplastic resin, etc. can be mentioned. Hereinafter, in order to avoid confusion with the “thermoplastic resin” of the thermoplastic resin powder described above, the thermoplastic resin constituting the outer shell portion may be referred to as “thermoplastic resin A”.
Examples of the particles composed of inorganic components include glass balloons, shirasu balloons, fly ash, silica balloons and the like. On the other hand, as the particles composed of the thermoplastic resin A, heat-expandable microspheres composed of an outer shell composed of the thermoplastic resin A and a foaming agent encapsulated therein and vaporized by heating are expanded. And particles obtained from the above.
後者に挙げた熱膨張性微小球を加熱膨張させて得られる中空粒子について、その製造方法については、特に限定はないが、以下で説明する熱膨張性微小球を加熱膨張させる方法がある。加熱膨張の方法としては、乾式加熱膨張法、湿式加熱膨張法等が挙げられる。加熱膨張させる温度は、好ましくは80〜350℃である。
中空粒子(1)は、図1に示すように、その外殻(2)の外表面に付着した微粒子(4や5)から構成されていてもよく、以下では、微粒子付着中空粒子(1)ということがある。
The hollow particles obtained by heating and expanding the heat-expandable microspheres mentioned in the latter are not particularly limited, and there are methods for heating and expanding the heat-expandable microspheres described below. Examples of the heating expansion method include a dry heating expansion method and a wet heating expansion method. The temperature for heat expansion is preferably 80 to 350 ° C.
As shown in FIG. 1, the hollow particles (1) may be composed of fine particles (4 and 5) attached to the outer surface of the outer shell (2). There is.
ここでいう付着とは、単に微粒子付着中空粒子(1)の外殻(2)の外表面に微粒子充填剤(4および5)が、吸着された状態(4)であってもよく、外表面近傍の外殻を構成する熱可塑性樹脂が加熱によって融解し、微粒子付着中空粒子の外殻の外表面に微粒子充填剤がめり込み、固定された状態(5)であってもよいという意味である。微粒子充填剤の粒子形状は不定形であっても球状であってもよい。微粒子付着中空粒子では、使用時の作業性(ハンドリング)が向上する。
外表面に付着した微粒子の平均粒子径は、中空粒子の平均粒子径の1/4〜1/10であると好ましい。
The term “adhesion” as used herein may be simply the state (4) in which the fine particle fillers (4 and 5) are adsorbed on the outer surface of the outer shell (2) of the fine particle-adhered hollow particles (1). This means that the thermoplastic resin constituting the outer shell in the vicinity may be melted by heating, and the fine particle filler may sink into the outer surface of the outer shell of the fine particle-attached hollow particle and be fixed (5). The particle shape of the fine particle filler may be indefinite or spherical. In the fine particle-adhered hollow particles, workability (handling) during use is improved.
The average particle diameter of the fine particles adhering to the outer surface is preferably 1/4 to 1/10 of the average particle diameter of the hollow particles.
微粒子の平均粒子径は、好ましくは0.001〜30μm、さらに好ましくは0.005〜25μm、特に好ましくは0.01〜20μmである。この範囲内であると、中空粒子を製造する際に熱膨張性微小球との混合性が良好となる。なお、ここで言う微粒子の平均粒子径とは、レーザー回折法により測定された粒子の粒子径である。微粒子の粒子径がミクロンオーダーであれば一次粒子を指すが、ナノオーダーの微粒子等は凝集している場合が多く、実質ミクロンオーダーの集合体として作用するため、凝集した二次粒子を1単位として平均粒子径を算出した。
微粒子としては、種々のものを使用することができ、無機物、有機物のいずれの素材であってもよい。微粒子の形状としては、球状、針状や板状等が挙げられる。
The average particle diameter of the fine particles is preferably 0.001 to 30 μm, more preferably 0.005 to 25 μm, and particularly preferably 0.01 to 20 μm. Within this range, the mixability with the thermally expandable microspheres is good when producing hollow particles. The average particle diameter of the fine particles referred to here is the particle diameter of the particles measured by a laser diffraction method. If the particle size of the fine particles is on the order of micron, it indicates primary particles, but nano-order fine particles are often agglomerated and act as aggregates in the order of micron, so the aggregated secondary particles are regarded as one unit. The average particle size was calculated.
Various particles can be used as the fine particles, and any of inorganic materials and organic materials may be used. Examples of the shape of the fine particles include a spherical shape, a needle shape, and a plate shape.
微粒子としては特に限定はないが、微粒子が有機物の場合は、例えばステアリン酸マグネシウム、ステアリン酸カルシウム、ステアリン酸亜鉛、ステアリン酸バリウム、ステアリン酸リチウム等の金属セッケン類;ポリエチレンワックス、ラウリン酸アミド、ミリスチン酸アミド、パルミチン酸アミド、ステアリン酸アミド、硬化ひまし油等の合成ワックス類;ポリアクリルアミド、ポリイミド、ナイロン、ポリメタクリル酸メチル、ポリエチレン、ポリテトラフルオロエチレン等の有機系充填剤が挙げられる。微粒子が無機物の場合には、例えばタルク、マイカ、ベントナイト、セリサイト、カーボンブラック、二硫化モリブデン、二硫化タングステン、弗化黒鉛、弗化カルシウム、窒化ホウ素等;その他、シリカ、アルミナ、雲母、コロイダル炭酸カルシウム、重質炭酸カルシウム、表面処理炭酸カルシウム、水酸化カルシウム、リン酸カルシウム、水酸化マグネシウム、リン酸マグネシウム、硫酸バリウム、二酸化チタン、酸化亜鉛、セラミックビーズ、ガラスビーズ、水晶ビーズ等の無機系充填剤が挙げられる。
微粒子付着中空粒子の真比重については、特に限定はないが、通常0.02〜0.3g/cc、好ましくは0.03〜0.25g/cc、より好ましくは0.04〜0.20g/cc、さらに好ましくは0.05〜0.15g/cc、特に好ましくは0.06〜0.10g/ccである。微粒子付着中空粒子の真比重が0.02g/ccより小さい場合は、耐久性が不足することがある。一方、微粒子付着中空粒子の真比重が0.3g/ccより大きい場合は、低比重化効果が小さくなるため、微粒子付着中空粒子を用いて組成物を調製する際、その添加量が大きくなり、非経済的であることがある。
The fine particles are not particularly limited, but when the fine particles are organic, for example, metal soaps such as magnesium stearate, calcium stearate, zinc stearate, barium stearate, lithium stearate; polyethylene wax, lauric acid amide, myristic acid Synthetic waxes such as amide, palmitic acid amide, stearic acid amide, and hardened castor oil; and organic fillers such as polyacrylamide, polyimide, nylon, polymethyl methacrylate, polyethylene, and polytetrafluoroethylene. When the fine particles are inorganic, for example, talc, mica, bentonite, sericite, carbon black, molybdenum disulfide, tungsten disulfide, fluorinated graphite, calcium fluoride, boron nitride, etc .; others, silica, alumina, mica, colloidal Inorganic fillers such as calcium carbonate, heavy calcium carbonate, surface-treated calcium carbonate, calcium hydroxide, calcium phosphate, magnesium hydroxide, magnesium phosphate, barium sulfate, titanium dioxide, zinc oxide, ceramic beads, glass beads, crystal beads Is mentioned.
The true specific gravity of the fine particle-attached hollow particles is not particularly limited, but is usually 0.02 to 0.3 g / cc, preferably 0.03 to 0.25 g / cc, more preferably 0.04 to 0.20 g / cc. cc, more preferably 0.05 to 0.15 g / cc, particularly preferably 0.06 to 0.10 g / cc. When the true specific gravity of the fine particle-attached hollow particles is less than 0.02 g / cc, the durability may be insufficient. On the other hand, if the true specific gravity of the fine particle-adhered hollow particles is greater than 0.3 g / cc, the effect of lowering the specific gravity is reduced, so when preparing the composition using the fine particle-adhered hollow particles, the amount added is increased, May be uneconomical.
微粒子付着中空粒子は、たとえば、微粒子付着熱膨張性微小球を加熱膨張させることによって得ることができる。微粒子付着中空粒子の製造方法としては、熱膨張性微小球と微粒子とを混合する工程(混合工程)と、前記混合工程で得られた混合物を前記軟化点超の温度に加熱して、前記熱膨張性微小球を膨張させるとともに、得られる中空粒子の外表面に微粒子を付着させる工程(付着工程)を含む製造方法が好ましい。
熱膨張性微小球は、熱可塑性樹脂Aからなる外殻と、それに内包され且つ加熱することによって気化する発泡剤とから構成されており、熱膨張性微小球は微小球全体として熱膨張性(微小球全体が加熱により膨らむ性質)を示す。以下の説明において、内包物質と発泡剤とを同義に用いることがある。
The fine particle-attached hollow particles can be obtained, for example, by heating and expanding fine particle-attached thermally expandable microspheres. As a method for producing fine particle-attached hollow particles, a step of mixing thermally expandable microspheres and fine particles (mixing step), and heating the mixture obtained in the mixing step to a temperature above the softening point, the heat A production method including a step (attachment step) of inflating the expandable microspheres and attaching fine particles to the outer surface of the obtained hollow particles is preferable.
The thermally expandable microsphere is composed of an outer shell made of the thermoplastic resin A and a foaming agent that is encapsulated in the shell and vaporizes when heated, and the thermally expandable microsphere is thermally expandable as a whole microsphere ( The property that the whole microsphere expands by heating). In the following description, the inclusion substance and the foaming agent may be used synonymously.
熱膨張性微小球の平均粒子径については特に限定されないが、好ましくは1〜100μm、より好ましくは3〜80μm、さらに好ましくは7〜60μm、特に好ましくは10〜50μmである。平均粒子径が1μmより小さい場合、熱膨張性微小球の膨張性能が低くなり、軽量化効果が低くなることがある。一方、平均粒子径が100μmより大きい場合、中空粒子による独立気泡の平均径が大きくなり、成形物の表面および裏面の両方で表面性が低下することがある。
熱膨張性微小球を構成する発泡剤は、加熱することによって気化する物質であれば特に限定はない。発泡剤としては、たとえば、プロパン、(イソ)ブタン、(イソ)ペンタン、(イソ)ヘキサン、(イソ)ヘプタン、(イソ)オクタン、(イソ)ノナン、(イソ)デカン、(イソ)ウンデカン、(イソ)ドデカン、(イソ)トリデカン等の炭素数3〜13の炭化水素;(イソ)ヘキサデカン、(イソ)エイコサン等の炭素数13超で20以下の炭化水素;プソイドクメン、石油エーテル、初留点150〜260℃および/または蒸留範囲70〜360℃であるノルマルパラフィンやイソパラフィン等の石油分留物等の炭化水素;それらのハロゲン化物;ハイドロフルオロエーテル等の含弗素化合物;テトラアルキルシラン;加熱により熱分解してガスを生成する化合物等を挙げることができる。これらの発泡剤は、1種または2種以上を併用してもよい。上記発泡剤は、直鎖状、分岐状、脂環状のいずれでもよく、脂肪族であるものが好ましい。
The average particle size of the heat-expandable microspheres is not particularly limited, but is preferably 1 to 100 μm, more preferably 3 to 80 μm, still more preferably 7 to 60 μm, and particularly preferably 10 to 50 μm. When the average particle diameter is smaller than 1 μm, the expansion performance of the thermally expandable microspheres is lowered, and the weight reduction effect may be lowered. On the other hand, when the average particle diameter is larger than 100 μm, the average diameter of closed cells due to the hollow particles is increased, and the surface property may be deteriorated on both the front surface and the back surface of the molded product.
The foaming agent constituting the thermally expandable microsphere is not particularly limited as long as it is a substance that is vaporized by heating. Examples of the blowing agent include propane, (iso) butane, (iso) pentane, (iso) hexane, (iso) heptane, (iso) octane, (iso) nonane, (iso) decane, (iso) undecane, ( Hydrocarbons having 3 to 13 carbon atoms such as iso) dodecane and (iso) tridecane; hydrocarbons having 13 to 20 carbon atoms such as (iso) hexadecane and (iso) eicosane; pseudocumene, petroleum ether, initial boiling point 150 Hydrocarbons such as petroleum fractions such as normal paraffin and isoparaffin having a distillation range of ˜260 ° C. and / or a distillation range of 70 to 360 ° C .; their halides; fluorine-containing compounds such as hydrofluoroethers; tetraalkylsilanes; The compound etc. which decompose | disassemble and produce | generate a gas can be mentioned. These foaming agents may be used alone or in combination of two or more. The foaming agent may be linear, branched or alicyclic, and is preferably aliphatic.
熱膨張性微小球に封入された発泡剤の内包率については特に限定されないが、熱膨張性微小球の重量に対して、好ましくは1〜60重量%、より好ましくは3〜50重量%、さらに好ましくは8〜40重量%、特に好ましくは10〜30重量%である。
熱膨張性微小球の外殻を構成する熱可塑性樹脂Aは、重合性二重結合を1個有する(ラジカル)重合性単量体である単量体成分を含む重合性成分を(懸濁)重合して得られる共重合体である。
The encapsulating rate of the foaming agent encapsulated in the heat-expandable microspheres is not particularly limited, but is preferably 1 to 60% by weight, more preferably 3 to 50% by weight, based on the weight of the heat-expandable microspheres. Preferably it is 8 to 40 weight%, Most preferably, it is 10 to 30 weight%.
The thermoplastic resin A constituting the outer shell of the thermally expandable microsphere is a (suspension) polymerizable component including a monomer component which is a (radical) polymerizable monomer having one polymerizable double bond. It is a copolymer obtained by polymerization.
重合性成分は、重合することによって外殻を形成する熱可塑性樹脂Aである共重合体となる成分である。重合性成分は、単量体成分を必須とし架橋剤を含むことがある成分である。
単量体成分としては、特に限定はないが、たとえば、アクリロニトリル、メタクリロニトリル、フマロニトリル、マレオニトリル等のニトリル系単量体;塩化ビニル等のハロゲン化ビニル系単量体;塩化ビニリデン等のハロゲン化ビニリデン系単量体;酢酸ビニル、プロピオン酸ビニル、酪酸ビニル等のビニルエステル系単量体;アクリル酸、メタクリル酸、エタクリル酸、クロトン酸、ケイ皮酸等の不飽和モノカルボン酸や、マレイン酸、イタコン酸、フマル酸、シトラコン酸、クロロマレイン酸等の不飽和ジカルボン酸や、不飽和ジカルボン酸の無水物や、マレイン酸モノメチル、マレイン酸モノエチル、マレイン酸モノブチル、フマル酸モノメチル、フマル酸モノエチル、イタコン酸モノメチル、イタコン酸モノエチル、イタコン酸モノブチル等の不飽和ジカルボン酸モノエステル等のカルボキシル基含有単量体;メチル(メタ)アクリレート、エチル(メタ)アクリレート、n−ブチル(メタ)アクリレート、t−ブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、ステアリル(メタ)アクリレート、フェニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート等の(メタ)アクリル酸エステル系単量体;アクリルアミド、置換アクリルアミド、メタクリルアミド、置換メタクリルアミド等の(メタ)アクリルアミド系単量体;N−フェニルマレイミド、N−シクロヘキシルマレイミド等のマレイミド系単量体;スチレン、α−メチルスチレン等のスチレン系単量体;エチレン、プロピレン、イソブチレン等のエチレン不飽和モノオレフイン系単量体;ビニルメチルエーテル、ビニルエチルエーテル、ビニルイソブチルエーテル等のビニルエーテル系単量体;ビニルメチルケトン等のビニルケトン系単量体;N−ビニルカルバゾール、N−ビニルピロリドン等のN−ビニル系単量体;ビニルナフタリン塩等を挙げることができる。カルボキシル基含有単量体は、一部または全部のカルボキシル基が重合時や重合後に中和されていてもよい。アクリル酸またはメタクリル酸を合わせて(メタ)アクリル酸ということもあり、(メタ)アクリルは、アクリルまたはメタクリルを意味するものとする。
The polymerizable component is a component that becomes a copolymer that is the thermoplastic resin A that forms an outer shell by polymerization. The polymerizable component is a component which essentially includes a monomer component and may contain a crosslinking agent.
The monomer component is not particularly limited. For example, nitrile monomers such as acrylonitrile, methacrylonitrile, fumaronitrile, and maleonitrile; vinyl halide monomers such as vinyl chloride; halogenated compounds such as vinylidene chloride Vinylidene monomers; vinyl ester monomers such as vinyl acetate, vinyl propionate and vinyl butyrate; unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, ethacrylic acid, crotonic acid and cinnamic acid, and maleic acid Unsaturated dicarboxylic acids such as itaconic acid, fumaric acid, citraconic acid, chloromaleic acid, anhydrides of unsaturated dicarboxylic acids, monomethyl maleate, monoethyl maleate, monobutyl maleate, monomethyl fumarate, monoethyl fumarate, Monomethyl itaconate, monoethyl itaconate, itaconate Carboxyl group-containing monomers such as unsaturated dicarboxylic acid monoesters such as butyl; methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl ( (Meth) acrylates such as (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate and 2-hydroxyethyl (meth) acrylate (Meth) acrylamide monomers such as acrylamide, substituted acrylamide, methacrylamide and substituted methacrylamide; maleimide monomers such as N-phenylmaleimide and N-cyclohexylmaleimide; Styrene monomers such as α-methylstyrene; ethylene unsaturated monoolefin monomers such as ethylene, propylene and isobutylene; vinyl ether monomers such as vinyl methyl ether, vinyl ethyl ether and vinyl isobutyl ether; vinyl Examples thereof include vinyl ketone monomers such as methyl ketone; N-vinyl monomers such as N-vinyl carbazole and N-vinyl pyrrolidone; vinyl naphthalene salts and the like. In the carboxyl group-containing monomer, some or all of the carboxyl groups may be neutralized during polymerization or after polymerization. Acrylic acid or methacrylic acid may be collectively referred to as (meth) acrylic acid, and (meth) acryl means acrylic or methacrylic.
上記ニトリル系単量体のうちでも、アクリロニトリルおよび/またはメタクリロニトリルが好ましい。
上記カルボキシル基含有単量体のうち、アクリル酸、メタクリル酸、マレイン酸、無水マレイン酸およびイタコン酸が好ましく、アクリル酸およびメタクリル酸がさらに好ましく、耐熱性が高いためメタクリル酸が特に好ましい。
Among the nitrile monomers, acrylonitrile and / or methacrylonitrile are preferable.
Among the carboxyl group-containing monomers, acrylic acid, methacrylic acid, maleic acid, maleic anhydride and itaconic acid are preferable, acrylic acid and methacrylic acid are more preferable, and methacrylic acid is particularly preferable because of high heat resistance.
単量体成分は、ニトリル系単量体、カルボキシル基含有単量体、(メタ)アクリル酸エステル系単量体、スチレン系単量体、ビニルエステル系単量体、アクリルアミド系単量体およびハロゲン化ビニリデン系単量体から選ばれる少なくとも1種をさらに含むと好ましい。
架橋剤としては、特に限定はないが、たとえば、ジビニルベンゼン等の芳香族ジビニル化合物;メタクリル酸アリル、トリアクリルホルマール、トリアリルイソシアネート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,9−ノナンジオールジ(メタ)アクリレート、PEG#200ジ(メタ)アクリレート、PEG#600ジ(メタ)アクリレート、トリメチロールプロパントリメタクリレート、ペンタエリスルトールトリ(メタ)アクリレート、ジペンタエリスルトールヘキサアクリレート、2−ブチル−2−エチル−1,3−プロパンジオールジアクリレート等のジ(メタ)アクリレート化合物等を挙げることができる。これらの架橋剤は、1種または2種以上を併用してもよい。
架橋剤の量については、特に限定はないが、単量体成分100重量部に対して、好ましくは0.01〜5重量部、さらに好ましくは0.1〜1重量部、特に好ましくは0.2重量部超1重量部未満である。架橋剤の量は、単量体成分100重量部に対して0.01重量部未満でもよい。
The monomer components include nitrile monomers, carboxyl group-containing monomers, (meth) acrylic acid ester monomers, styrene monomers, vinyl ester monomers, acrylamide monomers, and halogens. It is preferable to further include at least one selected from vinylidene chloride monomers.
Although it does not specifically limit as a crosslinking agent, For example, aromatic divinyl compounds, such as divinylbenzene; Allyl methacrylate, triacryl formal, triallyl isocyanate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, 1 , 4-butanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, PEG # 200 di (meth) acrylate, PEG # 600 di (meth) acrylate, trimethylolpropane trimethacrylate, pentaerythrul Examples include di (meth) acrylate compounds such as tall tri (meth) acrylate, dipentaerythritol hexaacrylate, and 2-butyl-2-ethyl-1,3-propanediol diacrylate. These crosslinking agents may be used alone or in combination of two or more.
The amount of the crosslinking agent is not particularly limited, but is preferably 0.01 to 5 parts by weight, more preferably 0.1 to 1 part by weight, and particularly preferably 0. More than 2 parts by weight and less than 1 part by weight. The amount of the crosslinking agent may be less than 0.01 parts by weight with respect to 100 parts by weight of the monomer component.
(その他の成分)
その他の成分は、熱可塑性樹脂粉体および中空粒子とともに、樹脂組成物に適宜配合される成分である。その他の成分としては、たとえば、可塑剤(軟化剤)、難燃剤、酸化防止剤、着色剤、充填剤、離型剤、帯電防止剤、結晶核剤等が挙げられる。
可塑剤(軟化剤)としては、たとえば、プロセスオイル、潤滑油、パラフィン、流動パラフィン、石油アスファルト、ワセリン等の石油系物質;コールタール、コールタールピッチ等のコールタール類;ヒマシ油、アマニ油、ナタネ油、大豆油、椰子油等の脂肪油;トール油、蜜ロウ、カルナウバロウ、ラノリン等のロウ類、リシノール酸、パルミチン酸、ステアリン酸等の脂肪酸またはその金属塩;石油樹脂、クマロンインデン樹脂、アタクチックポリプロピレン等の合成高分子;フタル酸ジアリル、アクリル酸アリル、シアタール酸トリアリル、マレイン酸ジアリル、マレイン酸ジクロルアリル、イタコン酸ジアリル、セバシン酸ジアリル、アジピン酸ジアリル、マロン酸ジアリル、グリコール酸ジアリル、アコニット酸トリアリル、リン酸トリアリル、クエン酸トリアリル、アリルメタクリレート、ジアリルフマレート、トリエチレングリコールジメタクリレート、エチレングリコールジメタクリレート、シクロヘキシルメタクリレート、テトラエチレングリコールジメタクリレート、ポリエチレングリコールジメタクリレート、ポリプロピレングリコールジメタクリレート、ブタン1,4 ジオールジメタクリレート、トリメチロールプロパントリメタクリレート、トリメチロールプロパントリアクリレート、トリメチロールプロパンプロピレンオキサイド付加物トリアクリレート、ジメチルアミノエチルメタクリレート、1,3−ブチレングリコールジメタクリレート等のエステル系可塑剤;その他の可塑剤として、低分子量ポリエチレン、低分子量ポリプロピレン、低分子量ポリスチレン、オリゴエステルアクリレート、液状ゴム、ジシクロペンタジエン樹脂、石油樹脂、ポリヒドロキシポリオレフィン、ポリブテン−1、マイクロクリスタリンワックス、液状ポリブタジエンまたはその変性物や水添物、液状チオコール等が挙げられる。
(Other ingredients)
The other components are components that are appropriately blended in the resin composition together with the thermoplastic resin powder and the hollow particles. Examples of other components include plasticizers (softeners), flame retardants, antioxidants, colorants, fillers, mold release agents, antistatic agents, crystal nucleating agents, and the like.
Examples of plasticizers (softeners) include petroleum oils such as process oil, lubricating oil, paraffin, liquid paraffin, petroleum asphalt, and petroleum jelly; coal tars such as coal tar and coal tar pitch; castor oil, linseed oil, Fatty oils such as rapeseed oil, soybean oil, coconut oil; waxes such as tall oil, beeswax, carnauba wax, lanolin, fatty acids such as ricinoleic acid, palmitic acid, stearic acid or metal salts thereof; petroleum resin, coumarone indene resin Synthetic polymers such as atactic polypropylene; diallyl phthalate, allyl acrylate, triallyl theaterate, diallyl maleate, dichloroallyl maleate, diallyl itaconate, diallyl sebacate, diallyl adipate, diallyl malonate, diallyl glycolate , Triallylic aconitic acid, Triaryl acid, triallyl citrate, allyl methacrylate, diallyl fumarate, triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, cyclohexyl methacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, butane 1,4 diol di Ester plasticizers such as methacrylate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, trimethylolpropane propylene oxide adduct triacrylate, dimethylaminoethyl methacrylate, 1,3-butylene glycol dimethacrylate; as other plasticizers, Low molecular weight polyethylene, low molecular weight polypropylene, low molecular weight Polystyrene, oligoester acrylate, liquid rubber, dicyclopentadiene resins, petroleum resins, polyhydroxy polyolefin, polybutene-1, microcrystalline wax, liquid polybutadiene or its modified product or hydrogenated product, liquid Thiokol, and the like.
難燃剤としては、たとえば、テトラブロモエタン、オクタブロモジフェニルオキサイド、デカブロモジフェニルオキサイド、ヘキサブロモシクロドデカン、トリブロモネオペンチルアルコール、ヘキサブロモベンゼン、デカブロモジフェニルエタン、トリス(トリブロモフェノキシ)Sトリアジン、トリス(2,3−ジブロモプロピル)イソシアヌレート、ビス(トリブロモフェノキシ)エタン、エチレンビス(テトラブロモフタルイミド)、テトラブロモビスフェノールAハロゲン化物、テトラブロモビスフェノールAカーボネートオリゴマー、テトラブロモビスフェノールS、トリス−(2,3−ジブロモプロピル−1−)イソシアヌレート、ハロゲン化エポキシ樹脂、アンチモニー・シリコ・オキシド、トリス(クロロエチル)ホスフェート、トリス(ジブロモフェニル)ホスフェート、トリス(トリブロモネオペンチル)ホスフェート、ジエチル−N,N−ビス(2−ヒドロキシエチル)アミノメチルホスフェート、ハロゲン化燐酸エステル、塩素化パラフィン、塩素化ポリエチレン、パークロロシクロペンタデカノン、テトラブロモビスフェノールA、テトラブロム無水フタル酸、ジブロモネオペンチルアルコール、トリブロモフェノール、ペンタブロモベンジルポリアクリレート、クロレンド酸、ジブロモクレジルグリシジルエーテル、ジブロモフェニルグリシジルエーテル、無水クロレンド酸、テトラクロロ無水フタル酸等のハロゲン系難燃剤;トリフェニルホスフェート、トリクレジルホスフェート、トリキシレニルホスフェート、クレジルジフェニルホスフェート、キシレニルジフェニルホスフェート、レゾルシノール−ビス−(ジフェニルホスフェート)、2−エチルヘキシルジフェニルホスフェート、ジメチルメチルホスフェート、トリアリルホスフェート等及びその縮合体、リン酸アンモニウム及びその縮合体、ジエチルN,N−ビス(2−ヒドロキシエチル)アミノメチルホスホネート等のリン系難燃剤;水酸化マグネシウム、水酸化アルミニウム、硼酸亜鉛、硼酸バリウム、カオリン・クレー、炭酸カルシウム、明ばん石、塩基性炭酸マグネシウム、水酸化カルシウム、ハイドロタルサイト、赤リン、グアニジン化合物、メラミン化合物、3酸化アンチモン、5酸化アンチモン、アンチモン酸ナトリウム、シリコーン樹脂等の無機系難燃剤等が挙げられる。
充填剤としては、たとえば、シリカ、アルミナ、酸化亜鉛、酸化カルシウム、酸化マグネシウム、酸化鉄、酸化スズ、酸化アンチモン、フェライト類等の酸化物、水酸化カルシウム、水酸化アルミニウム、塩基性炭酸マグネシウム等の水酸化物、炭酸カルシウム、炭酸マグネシウム、炭酸亜鉛、炭酸バリウム、ドーソナイト、ハイドロタルサイト等の炭酸塩、硫酸カルシウム、硫酸バリウム、石膏繊維等の硫酸塩、ケイ酸カルシウム、タルク、クレー、マイカ、モンモリロナイト、活性白土、セピオライト、イモゴライト、セリサイト、ガラス繊維、ガラスビーズ、ケイ酸塩、窒化アルミ、窒化ホウ素、窒化ケイ素等の窒化物、カーボンブラック、グラファイト、炭素繊維、炭化バルーン、木炭粉末等の無機系充填剤;アクリルゴム、アクリロニトリル/ブタジエンゴム、イソプレンゴム、ウレタンゴム、液状ゴム、エチレン/プロピレンゴム、エチレン/プロピレン/ジエン系ゴム、SBR系ゴム、NBR系ゴム、クロロスルフォン化ポリエチレン、クロロプレンゴム、シリコーンゴム、多硫化ゴム、ブタジエンゴム、ブチルゴム、フッ素ゴム、スチレン/ブタジエンゴム等の合成ゴム、天然ゴム、ナイロン粉、フッ素樹脂粉、木粉、皮粉、パルプ、ゴム粉等の有機系充填剤等が挙げられる。
Examples of the flame retardant include tetrabromoethane, octabromodiphenyl oxide, decabromodiphenyl oxide, hexabromocyclododecane, tribromoneopentyl alcohol, hexabromobenzene, decabromodiphenylethane, tris (tribromophenoxy) S triazine, Tris (2,3-dibromopropyl) isocyanurate, bis (tribromophenoxy) ethane, ethylenebis (tetrabromophthalimide), tetrabromobisphenol A halide, tetrabromobisphenol A carbonate oligomer, tetrabromobisphenol S, tris- ( 2,3-dibromopropyl-1-) isocyanurate, halogenated epoxy resin, antimony silico oxide, tris (chloroethyl) phosphine , Tris (dibromophenyl) phosphate, tris (tribromoneopentyl) phosphate, diethyl-N, N-bis (2-hydroxyethyl) aminomethyl phosphate, halogenated phosphate, chlorinated paraffin, chlorinated polyethylene, Chlorocyclopentadecanone, tetrabromobisphenol A, tetrabromophthalic anhydride, dibromoneopentyl alcohol, tribromophenol, pentabromobenzyl polyacrylate, chlorendic acid, dibromocresyl glycidyl ether, dibromophenyl glycidyl ether, chlorendic anhydride, tetra Halogen flame retardants such as chlorophthalic anhydride; triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate , Xylenyl diphenyl phosphate, resorcinol-bis- (diphenyl phosphate), 2-ethylhexyl diphenyl phosphate, dimethylmethyl phosphate, triallyl phosphate and the like, and its condensate, ammonium phosphate and its condensate, diethyl N, N-bis ( Phosphorus flame retardants such as 2-hydroxyethyl) aminomethylphosphonate; magnesium hydroxide, aluminum hydroxide, zinc borate, barium borate, kaolin clay, calcium carbonate, alumite, basic magnesium carbonate, calcium hydroxide, hydro Examples include inorganic flame retardants such as talcite, red phosphorus, guanidine compounds, melamine compounds, antimony trioxide, antimony pentoxide, sodium antimonate, and silicone resins.
Examples of the filler include silica, alumina, zinc oxide, calcium oxide, magnesium oxide, iron oxide, tin oxide, antimony oxide, ferrite oxides, calcium hydroxide, aluminum hydroxide, basic magnesium carbonate, etc. Hydroxides, calcium carbonate, magnesium carbonate, zinc carbonate, barium carbonate, dosonite, hydrotalcite and other carbonates, calcium sulfate, barium sulfate, gypsum fiber sulfates, calcium silicate, talc, clay, mica, montmorillonite , Activated clay, sepiolite, imogolite, sericite, glass fiber, glass beads, silicates, nitrides such as aluminum nitride, boron nitride, silicon nitride, carbon black, graphite, carbon fiber, carbonized balloon, charcoal powder, etc. Fillers: acrylic rubber, acrylic Nitrile / butadiene rubber, isoprene rubber, urethane rubber, liquid rubber, ethylene / propylene rubber, ethylene / propylene / diene rubber, SBR rubber, NBR rubber, chlorosulfonated polyethylene, chloroprene rubber, silicone rubber, polysulfide rubber, Examples thereof include synthetic rubbers such as butadiene rubber, butyl rubber, fluororubber, styrene / butadiene rubber, natural rubber, nylon powder, fluororesin powder, wood filler, leather powder, pulp, rubber powder, and other organic fillers.
酸化防止剤としては、たとえば、フェノール系、リン系、アミン系、イオウ系等の酸化防止剤や耐候安定剤等が挙げられる。
これらその他の成分は熱可塑性樹脂粉体および中空粒子とともに、樹脂組成物に適宜配合されても良く、また予め熱可塑性樹脂粉体に含まれていても良い。
(樹脂組成物の各成分の配合割合)
Examples of the antioxidant include phenol-based, phosphorus-based, amine-based, sulfur-based antioxidants, weathering stabilizers, and the like.
These other components may be appropriately blended in the resin composition together with the thermoplastic resin powder and the hollow particles, or may be contained in the thermoplastic resin powder in advance.
(Combination ratio of each component of the resin composition)
中空粒子の配合割合は、熱可塑性樹脂粉体100重量部に対して、通常1〜20重量部、好ましくは3〜18重量部、より好ましくは5〜16重量部、さらに好ましくは7〜14重量部、特に好ましくは9〜12重量部である。中空粒子の配合割合が、熱可塑性樹脂粉体100重量部に対して1重量部未満であると、成形物を十分に軽量化できない。一方、中空粒子の配合割合が、熱可塑性樹脂粉体100重量部に対して20重量部を超えると、得られた成形物の表面および裏面の両方で表面性が低下するだけでなく、成形物が脆くなり、力学的物性が低下する。
その他の成分の配合割合については、特に限定はないが、好ましくは0.1〜200重量部、より好ましくは1〜150重量部、さらに好ましくは3〜100重量部、特に好ましくは5〜50重量部、最も好ましくは10〜30重量部である。その他の成分の配合割合が、熱可塑性樹脂粉体100重量部に対して0.1重量部未満であると、その他の成分を配合することによる効果が十分に得られない。一方、その他の成分の配合割合が熱可塑性樹脂粉体100重量部に対して200重量部を超えると、表面および裏面の両方で表面性が低下し、熱可塑性樹脂本来の特性が失われ、成形物の物性が低下することがある。
The mixing ratio of the hollow particles is usually 1 to 20 parts by weight, preferably 3 to 18 parts by weight, more preferably 5 to 16 parts by weight, and further preferably 7 to 14 parts by weight with respect to 100 parts by weight of the thermoplastic resin powder. Parts, particularly preferably 9 to 12 parts by weight. When the mixing ratio of the hollow particles is less than 1 part by weight with respect to 100 parts by weight of the thermoplastic resin powder, the molded product cannot be sufficiently reduced in weight. On the other hand, when the blending ratio of the hollow particles exceeds 20 parts by weight with respect to 100 parts by weight of the thermoplastic resin powder, not only the surface properties of both the front and back surfaces of the obtained molded product are deteriorated, but also the molded product. Becomes brittle and mechanical properties deteriorate.
The mixing ratio of other components is not particularly limited, but is preferably 0.1 to 200 parts by weight, more preferably 1 to 150 parts by weight, still more preferably 3 to 100 parts by weight, and particularly preferably 5 to 50 parts by weight. Parts, most preferably 10 to 30 parts by weight. When the blending ratio of the other components is less than 0.1 parts by weight with respect to 100 parts by weight of the thermoplastic resin powder, the effect of blending the other components cannot be sufficiently obtained. On the other hand, when the blending ratio of the other components exceeds 200 parts by weight with respect to 100 parts by weight of the thermoplastic resin powder, the surface properties are deteriorated on both the front surface and the back surface, the original properties of the thermoplastic resin are lost, and molding is performed. The physical properties of the physical properties may deteriorate.
樹脂組成物の製造方法は、熱可塑性樹脂粉体および中空粒子とともに、適宜、その他の成分を混合するものであれば特に限定はない。
樹脂組成物の製造方法としては、たとえば、熱可塑性樹脂粉体および中空粒子を空気等の気体を媒体にして混合させる方法(ドライブレンド法)がある。この方法では、たとえば、タンブラーミキサー、ヘンシェルミキサー、V型ブレンダー等の攪拌機を用いて、熱可塑性樹脂粉体および中空粒子が混合される。
樹脂組成物の別の製造方法としては、まず、熱可塑性樹脂粉体を調製する過程において、熱可塑性樹脂ペレットとともに中空粒子を粉砕機に供給し、ペレットの粉砕して熱可塑性樹脂粉体を製造すると同時に、中空粒子とドライブレンドする方法等を挙げることができる。その他の成分を配合する場合は、ドライブレンドを行う際に同時に添加しても良い。その他の成分が液状物のときは、噴霧により添加してもよい。
The method for producing the resin composition is not particularly limited as long as other components are appropriately mixed together with the thermoplastic resin powder and the hollow particles.
As a method for producing the resin composition, for example, there is a method (dry blend method) in which a thermoplastic resin powder and hollow particles are mixed using a gas such as air as a medium. In this method, for example, the thermoplastic resin powder and the hollow particles are mixed using a stirrer such as a tumbler mixer, a Henschel mixer, or a V-type blender.
As another method for producing the resin composition, first, in the process of preparing the thermoplastic resin powder, the hollow particles are supplied to the pulverizer together with the thermoplastic resin pellets, and the pellets are pulverized to produce the thermoplastic resin powder. At the same time, a method of dry blending with hollow particles can be exemplified. When other components are blended, they may be added simultaneously with dry blending. When the other components are liquid, they may be added by spraying.
〔成形物〕
本発明の成形物は、上記で説明した樹脂組成物をパウダースラッシュ成形して得られる。
成形物の真比重については、特に限定はないが、好ましくは1.1g/cc以下、より好ましくは0.4〜1.0g/cc、さらに好ましくは0.5〜0.95g/cc、特に好ましくは0.6〜0.90g/cc、最も好ましくは0.7〜0.85g/ccである。成形物の真比重が1.1g/ccを超えると軽量効果が十分でないことがある。一方、成形物の真比重が小さいと、成形物の表面および裏面の両方で表面性が低下し、力学的物性の低下も著しくなることがある。
(Molded product)
The molded product of the present invention is obtained by powder slush molding of the resin composition described above.
The true specific gravity of the molded product is not particularly limited, but is preferably 1.1 g / cc or less, more preferably 0.4 to 1.0 g / cc, still more preferably 0.5 to 0.95 g / cc, particularly Preferably it is 0.6-0.90 g / cc, Most preferably, it is 0.7-0.85 g / cc. If the true specific gravity of the molded product exceeds 1.1 g / cc, the light weight effect may not be sufficient. On the other hand, when the true specific gravity of the molded product is small, the surface properties are lowered on both the front surface and the back surface of the molded product, and the mechanical properties may be significantly lowered.
成形物の製造方法については、特に限定はないが、樹脂組成物を用いてパウダースラッシュ成形するものであれば特に限定はない。成形物の製造方法としては、まず、図2の(A)に示すように、樹脂組成物(12)を予め加熱した金型(11)の内表面に吹き付け、金型の内表面に溶融付着させる。次いで、(B)に示すように、金型を回転させる等によって成形に必要な量の樹脂組成物を金型の内表面に付着させるとともに、過剰量の樹脂組成物を金型の内表面から取り除く。次に、加熱炉等を用いて金型を熱風、赤外線、輻射熱等により加熱することにより樹脂組成物を溶融させて均一皮膜を形成させ成形し、(C)に示すように、この金型を冷却して金型から取り出すことによって成形物(13)が得られる。得られる成形物の表面は平滑であっても良いし、また、凹凸の模様があっても良い。パウダースラッシュ成形では、得られた成形物を金型から取り出さずに複数回成形を繰り返すことによって、多層構造の成形物を得ることもできる。 Although there is no limitation in particular about the manufacturing method of a molded object, if powder slush molding is performed using a resin composition, there will be no limitation in particular. As a method for producing a molded product, first, as shown in FIG. 2A, the resin composition (12) is sprayed on the inner surface of a preheated mold (11), and melted and adhered to the inner surface of the mold. Let Next, as shown in (B), an amount of the resin composition necessary for molding is adhered to the inner surface of the mold by rotating the mold or the like, and an excessive amount of the resin composition is removed from the inner surface of the mold. remove. Next, the mold is heated to form a uniform film by heating the mold with hot air, infrared rays, radiant heat, or the like using a heating furnace, and the mold is formed as shown in (C). A molded product (13) is obtained by cooling and taking out from the mold. The surface of the obtained molded product may be smooth or may have an uneven pattern. In powder slush molding, a molded product having a multilayer structure can be obtained by repeating molding several times without removing the obtained molded product from the mold.
本発明の成形物の用途としては、たとえば、インストルメントパネル、グローブインボックス、ステアリングホイールカバー、エアバッグ収納カバー等の自動車内装用の表皮材や、椅子のアームレスト、カーペット、鞄、靴等の意匠性、クッション性が求められる家具、雑貨の表皮材等を挙げることができる。 Examples of the use of the molded product of the present invention include automotive interior skin materials such as instrument panels, glove inboxes, steering wheel covers, and airbag storage covers, chair armrests, carpets, bags, shoes, and other designs. Furniture, furniture for which cushioning properties are required, and skin materials for miscellaneous goods.
以下の実施例および比較例で本発明を詳細に説明するが、本発明はこれに限定されるものではない。特に断りのない限り、「部」は「重量部」、「%」は「重量%」を意味する。
以下の実施例および比較例で製造した成形物について、次に示す要領で物性を測定、評価した。なお、実施例1、4は参考例とする。
The present invention is described in detail in the following examples and comparative examples, but the present invention is not limited thereto. Unless otherwise specified, “parts” means “parts by weight” and “%” means “% by weight”.
About the molding manufactured by the following example and the comparative example, the physical property was measured and evaluated in the way shown below. Examples 1 and 4 are used as reference examples.
〔成形物の比重の測定〕
精密比重計AX200(島津製作所社製)を用いた液侵法により、成形物の比重を測定した。
[Measurement of specific gravity of molded product]
The specific gravity of the molded product was measured by a liquid immersion method using a precision specific gravity meter AX200 (manufactured by Shimadzu Corporation).
〔成形物の表面性〕
成形物の表面(金型と接していた面;金型面)および裏面(金型と接していなかった面;裏面)の表面性を、それぞれ以下の評価基準にしたがって目視で評価した。
(金型面の表面性)
○:ピンホール等がなく、意匠性を保持している。
×:ピンホールが発生し、シボ流れ等により意匠性の低下が観察される。
(裏面の表面性)
○:ピンホール等がなく、平滑になっている。
×:ピンホールが発生し、平滑でない。
[Surface properties of molded products]
The surface properties of the surface (surface that was in contact with the mold; the surface of the mold) and the back surface (surface that was not in contact with the mold; back surface) of the molded product were visually evaluated according to the following evaluation criteria.
(Surface property of mold surface)
○: There is no pinhole or the like, and the design is maintained.
X: Pinholes are generated, and a decrease in designability is observed due to a wrinkle flow or the like.
(Surface property on the back)
○: There are no pinholes and the surface is smooth.
X: Pinhole is generated and not smooth.
(実施例1)
(樹脂組成物の調製)
ポリエチレン系熱可塑性樹脂粉体(ダウケミカル社製 PE DNDV0405Rの粉砕物、平均粒子径150μm;表1では樹脂1)100部と、ガラスバルーン1(住友スリーエム社製、商品名グラスバブルス、真比重0.2g/cc、平均粒子径60μm)5部とを、ヘンシェルミキサーでドライ混合し、樹脂組成物を作成した。
(パウダースラッシュ成形)
得られた樹脂組成物100部を予め200℃に加熱した金型に添加し、15秒間接触させ、その後左右にそれぞれ5回ずつ回転させた。金型に付着しなかった余分な樹脂組成物を払い落とし、その後、金型を270℃で30秒間加熱し、成形物を得た。得られた成形物の比重を測定し、表面性も評価した。その結果を表1に示す。
Example 1
(Preparation of resin composition)
100 parts of polyethylene-based thermoplastic resin powder (pulverized product of PE DNDV0405R manufactured by Dow Chemical Co., average particle size 150 μm;
(Powder slush molding)
100 parts of the obtained resin composition was added to a mold preheated to 200 ° C., brought into contact for 15 seconds, and then rotated left and right 5 times each. The excess resin composition that did not adhere to the mold was removed, and then the mold was heated at 270 ° C. for 30 seconds to obtain a molded product. The specific gravity of the obtained molded product was measured, and the surface property was also evaluated. The results are shown in Table 1.
〔実施例2〜8および比較例1〜4〕
実施例1で、熱可塑性樹脂粉体および中空粒子の種類、それらの配合量をそれぞれ表1に示すように変更する以外は、実施例1と同様にして樹脂組成物を調製し、パウダースラッシュ成形を行って成形物を得た。得られた成形物の物性を実施例1と同様に評価し、その結果を表1に示す。
[Examples 2 to 8 and Comparative Examples 1 to 4]
A resin composition was prepared in the same manner as in Example 1 except that the types of thermoplastic resin powder and hollow particles and the blending amounts thereof were changed as shown in Table 1 in Example 1, and powder slush molding was performed. To obtain a molded product. The physical properties of the obtained molded product were evaluated in the same manner as in Example 1, and the results are shown in Table 1.
樹脂1:ダウケミカル社製のポリエチレン系熱可塑性樹脂粉体(PE DNDV0405Rの粉砕物、平均粒子径150μm)
樹脂2:三井化学社製のポリプロピレン系熱可塑性樹脂粉体(ミラストマー6030Nの粉砕物、平均粒子径300μm)
樹脂3:DIC BAYER POLYMER社製のウレタン系熱可塑性樹脂粉体(パンデックスT1180の粉砕物、平均粒子径100μm)
ガラスバルーン1:住友スリーエム社製のガラスバルーン(K20、真比重0.2g/cc、平均粒子径60μm)
ガラスバルーン2:住友スリーエム社製のガラスバルーン(S60HS、真比重0.6g/cc、平均粒子径30μm)
微粒子付着中空粒子1:松本油脂製薬株式会社製の微粒子付着中空粒子(マツモトマイクロスフェアーMFL−81GCA、真比重0.25g/cc、平均粒子径30μm)
微粒子付着中空粒子2:松本油脂製薬株式会社製の微粒子付着中空粒子(マツモトマイクロスフェアーMFL−HD60CA、真比重0.12g/cc、平均粒子径60μm)
中空粒子1:松本油脂製薬株式会社製の中空粒子(マツモトマイクロスフェアーFK−40DEH、真比重0.045g/cc、平均粒子径40μm)
中空粒子2:松本油脂製薬株式会社製の中空粒子(マツモトマイクロスフェアーF−80DE、真比重0.024g/cc、平均粒子径60μm)
中空粒子3:松本油脂製薬株式会社製の中空粒子(マツモトマイクロスフェアーF−80SDE、真比重0.030g/cc、平均粒子径30μm)
中空粒子4:松本油脂製薬株式会社製の熱膨張性微小球(マツモトマイクロスフェアーF−82D)を発泡させたもの(真比重0.015g/cc、平均粒子径100μm)
Resin 1: Polyethylene thermoplastic resin powder manufactured by Dow Chemical Company (pulverized product of PE DNDV0405R, average particle size 150 μm)
Resin 2: Polypropylene thermoplastic resin powder manufactured by Mitsui Chemicals Co., Ltd. (milled product of Miralastomer 6030N, average particle size 300 μm)
Resin 3: Urethane thermoplastic resin powder manufactured by DIC BAYER POLYMER (Pandex T1180 pulverized product, average particle size 100 μm)
Glass balloon 1: Glass balloon made by Sumitomo 3M (K20, true specific gravity 0.2 g / cc, average particle diameter 60 μm)
Glass balloon 2: Glass balloon manufactured by Sumitomo 3M (S60HS, true specific gravity 0.6 g / cc, average particle diameter 30 μm)
Microparticle-attached hollow particles 1: Matsumoto Yushi Seiyaku Co., Ltd. microparticle-attached hollow particles (Matsumoto Microsphere MFL-81GCA, true specific gravity 0.25 g / cc, average particle diameter 30 μm)
Fine particle-attached hollow particle 2: Fine particle-attached hollow particle manufactured by Matsumoto Yushi Seiyaku Co., Ltd. (Matsumoto Microsphere MFL-HD60CA, true specific gravity 0.12 g / cc, average particle diameter 60 μm)
Hollow particles 1: Hollow particles manufactured by Matsumoto Yushi Seiyaku Co., Ltd. (Matsumoto Microsphere FK-40DEH, true specific gravity 0.045 g / cc, average particle diameter 40 μm)
Hollow particles 2: Hollow particles manufactured by Matsumoto Yushi Seiyaku Co., Ltd. (Matsumoto Microsphere F-80DE, true specific gravity 0.024 g / cc, average particle diameter 60 μm)
Hollow particles 3: Hollow particles manufactured by Matsumoto Yushi Seiyaku Co., Ltd. (Matsumoto Microsphere F-80SDE, true specific gravity 0.030 g / cc, average particle diameter 30 μm)
Hollow particles 4: those obtained by foaming thermally expandable microspheres (Matsumoto Microsphere F-82D) manufactured by Matsumoto Yushi Seiyaku Co., Ltd. (true specific gravity 0.015 g / cc, average particle diameter 100 μm)
表1から、実施例1〜8ではいずれも、パウダースラッシュ成形することによって得られた成形物の表面および裏面の両方で表面性に優れ、軽量な成形物が得ることができた。しかし、比較例1および2において、軽量な成形物が得られるものの、表面および裏面の両方の表面性を満足するものではなかった。また、比較例1では成形物が脆く、比較例3および4においては、表面性は満足するものの軽量な成形物ではなかった。 From Table 1, in Examples 1-8, the surface property was excellent in both the surface and the back surface of the molded product obtained by powder slush molding, and a lightweight molded product could be obtained. However, in Comparative Examples 1 and 2, although a lightweight molded product was obtained, the surface properties of both the front surface and the back surface were not satisfied. In Comparative Example 1, the molded product was fragile. In Comparative Examples 3 and 4, although the surface property was satisfactory, the molded product was not lightweight.
1 中空粒子
2 外殻部
3 中空部
4 微粒子(吸着された状態)
5 微粒子(めり込み、固定された状態)
11 金型
12 樹脂組成物
13 成形物
DESCRIPTION OF
5 Fine particles (indented and fixed state)
11
Claims (5)
熱可塑性樹脂粉体および外殻部が熱可塑性樹脂からなる中空粒子を含み、
前記中空粒子の真比重が0.02〜0.30g/ccであり、平均粒子径が0.8〜60μmであり、
前記熱可塑性樹脂粉体100重量部に対して前記中空粒子が1〜20重量部である、
樹脂組成物。 A resin composition used in powder slush molding,
Including hollow particles of thermoplastic resin powder and outer shell portion made of thermoplastic resin ,
The true specific gravity of the hollow particles is 0.02 to 0.30 g / cc, the average particle size is 0.8 to 60 μm,
The hollow particles are 1 to 20 parts by weight with respect to 100 parts by weight of the thermoplastic resin powder.
Resin composition.
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