JP6301178B2 - Manufacturing method of insert bus bar plate - Google Patents

Description

  The present invention relates to a method for manufacturing an insert bus bar plate.

  2. Description of the Related Art Conventionally, an insert bus bar plate configured by embedding a plurality of metal bus bars in an insulating resin material by insert molding is known. As such an insert bus bar plate, for example, in Patent Document 1, terminal portions of each bus bar exposed from one main surface (mounting surface) of the plate are gathered in the center portion of the plate and The structure which mounts the electronic component connected with a bus-bar is disclosed.

JP 2013-198347 A

  By the way, in the manufacturing process of the conventional insert bus bar plate, when an electronic component placed on the plate is connected to the bus bar, local flow soldering (hereinafter also referred to as “local flow soldering”) is performed. It is common. In the local flow soldering, the terminal of the electronic component is inserted into the through hole from the mounting surface (upper surface) of the insert bus bar plate on which the electronic component is placed to the opposite surface (lower surface), and the lower surface of the plate The molten solder is sprayed from below from the solder nozzle. As a result, the solder is sucked into the through hole (hereinafter also referred to as “soldering up”), and the electronic component is soldered.

  However, in local flow soldering, the pressure of the solder received by the plate is reduced on the end side compared to the central portion. For this reason, in the insert bus bar plate in which the electronic component is placed on the end side of the main surface as described in Patent Document 1, since the electronic component is in a position where soldering is poor, further soldering of the electronic component is required. There was room for improvement.

  This invention is made in view of the above, Comprising: It aims at providing the manufacturing method of the insert bus-bar plate which can improve the solderability of the electronic component in local flow soldering.

  In order to solve the above-described problems, a method for manufacturing an insert bus bar plate according to the present invention includes a flat resin material, embedded in the resin material by insert molding, and exposed to at least one of the main surfaces of the resin material. A bus bar plate manufacturing method comprising a plurality of metal bus bars having terminal portions, wherein a pre-molding bus bar assembly in which one end portions of the plurality of bus bars different from the terminal portions are connected by a carrier is formed. And forming the insert into the pre-molding bus bar assembly and cutting the carrier from the pre-molding bus bar assembly, so that the terminal portion of the pre-molding bus bar assembly is erected on one end surface side. Substrate divided body creating step for creating a divided substrate divided body, and the two substrates created in the substrate divided body creating step A mounting step of mounting an electronic component on the split body, and the two substrate boards so that the electronic components of the two board split bodies are positioned between the terminal portions of the two substrate split bodies, respectively. An installation step of installing the divided body, a soldering step of performing local flow soldering on the two substrate divided bodies installed in the installation step, and the local flow soldering in the soldering step. A connecting step of connecting the two substrate divided bodies so that the terminal portions of the two substrate divided bodies are positioned between the electronic components of the two substrate divided bodies, respectively. , Including.

  Further, in the above-described method of manufacturing an insert bus bar plate, the substrate divided body creating step may include the two pre-molding bus bar assemblies formed in the forming step, and the two pre-molding bus bar assemblies. An opposing arrangement step of arranging the two pre-molding bus bar assemblies so that the respective terminal portions are positioned between the carriers, and the two pre-molding bus bar assemblies arranged to oppose each other in the opposing arrangement step An insert molding step for performing the insert molding on a body, and a substrate for cutting the carrier from the pre-molding bus bar assembly embedded in the resin material by the insert molding in the insert molding step to create a substrate body A main body creation step, and the board main body created in the board main body creation step. A division step, each divided into two substrates divided body comprising one of said shaped front bus bar assembly preferably comprises a.

  Further, in the above-described method of manufacturing an insert bus bar plate, the substrate divided body creating step includes an insert molding step of performing the insert molding on the one pre-molding bus bar assembly formed in the forming step, and the insert molding. Preferably, the method includes a carrier cutting step of cutting the carrier from the pre-molding bus bar assembly embedded in the resin material by the insert molding to create a substrate divided body.

  The method for manufacturing an insert bus bar plate according to the present invention has an effect of improving the solderability of an electronic component in local flow soldering.

FIG. 1 is a perspective view illustrating a schematic configuration of an electrical junction box. FIG. 2 is an exploded perspective view showing a schematic configuration of the electronic component unit in FIG. 1 to which the insert bus bar plate according to the embodiment of the present invention is applied. FIG. 3 is a perspective view illustrating a schematic configuration of the electronic component unit. FIG. 4 is a perspective view illustrating a schematic configuration of the insert bus bar plate according to the embodiment. FIG. 5 is a plan view of the base cover of the electronic component unit on the connector fitting portion side. FIG. 6 is a cross-sectional view including the connector fitting portion of the base cover of the electronic component unit. FIG. 7 is a flowchart showing up to the step of creating a substrate divided body in the method of manufacturing the insert bus bar plate according to the embodiment of the present invention. FIG. 8 is a diagram for explaining step S101 (cutout step) in the flowchart of FIG. FIG. 9 is a diagram illustrating step S102 (bending step) in the flowchart of FIG. FIG. 10 is a diagram for explaining step S103 (terminal-side carrier cutting step) in the flowchart of FIG. FIG. 11 is a diagram illustrating step S104 (opposite placement step) in the flowchart of FIG. FIG. 12 is a diagram illustrating step S105 (insert molding step) in the flowchart of FIG. FIG. 13 is a diagram for explaining step S106 (substrate body creation step) in the flowchart of FIG. FIG. 14 is a diagram for explaining step S107 (division step) in the flowchart of FIG. FIG. 15 is a flowchart showing a step after the step of creating the substrate divided body shown in FIG. 7 in the method of manufacturing the insert bus bar plate according to the embodiment of the present invention. FIG. 16 is a diagram illustrating step S201 (mounting step), step S202 (installation step), and step S203 (soldering step) in the flowchart of FIG. FIG. 17 is a flowchart illustrating a process up to a substrate dividing body manufacturing method in an insert bus bar plate manufacturing method according to a modification of the embodiment. FIG. 18 is a diagram illustrating step S304 (insert molding step) in the flowchart of FIG. FIG. 19 is a diagram illustrating step S305 (carrier cutting step) in the flowchart of FIG.

  Below, an embodiment of a manufacturing method of an insert bus bar plate concerning the present invention is described based on a drawing. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

[Embodiment]
FIG. 1 is a perspective view illustrating a schematic configuration of an electrical junction box. FIG. 2 is an exploded perspective view showing a schematic configuration of the electronic component unit in FIG. 1 to which the insert bus bar plate according to the embodiment of the present invention is applied. FIG. 3 is a perspective view illustrating a schematic configuration of the electronic component unit. FIG. 4 is a perspective view illustrating a schematic configuration of the insert bus bar plate according to the embodiment. FIG. 5 is a plan view of the base cover of the electronic component unit on the connector fitting portion side. FIG. 6 is a cross-sectional view including the connector fitting portion of the base cover of the electronic component unit. In addition, FIG. 1 has shown the upper cover of the electrical junction box with the dashed-two dotted line.

  The insert bus bar plate 2 according to the present embodiment is applied to the electronic component unit 1 shown in FIGS. As shown in FIG. 1, the electronic component unit 1 constitutes an electronic component module that is detachably assembled to an electrical connection box 100 mounted on a vehicle such as an automobile. Here, the electrical connection box 100 collects and accommodates electrical components such as connectors, fuses, relays, branching units, and electronic control units that constitute connection processing parts such as wire harnesses and electric wires. The electrical connection box 100 is installed, for example, in an engine room of a vehicle or a lower part of a vehicle body, and is connected between a power source such as a battery and various electronic devices mounted in the vehicle. The electrical junction box 100 distributes the electric power supplied from the power source to various electronic devices in the vehicle. The electrical connection box 100 may be called a junction box, a fuse box, a relay box, or the like. In the present embodiment, these are collectively called an electrical connection box.

  In the electrical junction box 100 illustrated in FIG. 1, various electronic components 102 are accommodated in an accommodating space inside the box body 101. The box body 101 includes, for example, a body 103, an upper cover 104, a lower cover 105, and the like. The box body 101 has a three-layer divided structure in which the body 103, the upper cover 104, and the lower cover 105 are divided. The body 103, the upper cover 104, and the lower cover 105 are formed of an insulating synthetic resin. The body 103 is a main member that forms a housing space in which the electronic component 102 is assembled. The body 103 is formed in a substantially square cylindrical shape, and the opening is located on the upper side in the vertical direction and the lower side in the vertical direction in a state where the electric connection box 100 is connected to the engine room or the like. The upper cover 104 is a lid-like member that closes the opening on the upper side in the vertical direction of the body 103. The lower cover 105 is a dish-shaped (tray-shaped) member that closes the opening on the lower side in the vertical direction of the body 103. The box body 101 has an upper cover 104 in which the opening on the upper side in the vertical direction of the body 103 faces the opening on the upper cover 104 and the opening on the lower side in the vertical direction of the body 103 faces the opening in the lower cover 105. The lower cover 105 is assembled to the lower side of the body 103 in the vertical direction. In the box body 101, the upper cover 104 and the lower cover 105 are locked to the body 103 via various types of locking mechanisms 106. The direction in which the body 103, the upper cover 104, and the lower cover 105 are stacked is typically along the vertical direction in a state where the electrical connection box 100 is connected to an engine room or the like. Depending on the installation state of the junction box 100, the stacking direction may be installed with a predetermined angle with respect to the vertical direction.

  And as various electronic components 102 assembled | attached to the accommodation space part inside this box main body 101, as above-mentioned, with electronic components, such as a connector, a fuse, a relay, a branch part, and an electronic control unit, the electronic component unit 1 Is included. The electric junction box 100 has various cavities formed by a plurality of cavities formed by partition walls 107 having various shapes integrally formed with the body 103, blocks 108 having various shapes removably assembled to the body 103, and the like. The electronic component 102 is assembled. In this case, the partition wall 107, the block 108, and the like are also formed of an insulating synthetic resin like the body 103 and the like. The electrical connection box 100 is electrically connected to a cavity in which various electronic components 102 are assembled by fitting a terminal of an electric wire routed through the opening 109 or the like from the lower side in the vertical direction. Is done.

  As shown in FIGS. 2 to 6, the electronic component unit 1 includes the insert bus bar plate 2 of the present embodiment, the housing 3, and the connector 4 as a connection portion with the electric wire. The insert bus bar plate 2 is assembled to the.

  As shown in FIGS. 2 and 4, the insert bus bar plate 2 is a board in which a metal bus bar 24 (see FIG. 12 and the like) is built in a resin material 23 and an electronic component 22 is mounted. The insert bus bar plate 2 includes a substrate body 21 and an electronic component 22.

  The substrate main body 21 has a plurality of conductive bus bars 24 built in a resin material 23. In other words, the plurality of bus bars 24 are covered with an insulating resin material 23 and insulated from each other. The substrate body 21 is formed, for example, by insert molding in which an insulating resin is injected around a bus bar 24 formed of a conductive metal and disposed in a mold, and the metal and the resin are integrated.

  Prior to insert molding, the set of bus bars 24 is configured as an aggregate in which one ends thereof are connected to each other by a carrier 24b (see FIG. 10 and the like). In the present embodiment, this aggregate is expressed as “pre-molding busbar aggregate 24a”. The pre-molding bus bar assembly 24a is formed of a conductive metal, and is formed in a substantially plate shape as a whole by, for example, pressing. The pre-molding bus bar assembly 24a is inserted into a mold for insert molding in a state in which the terminal portion 24c composed of a plurality of terminals of each bus bar 24 is bent. The board body 21 is formed by injecting an insulating resin around the pre-molding bus bar assembly 24a inserted into the mold and integrally molding the bus bars 24 and the resin material 23. The substrate body 21 is formed by integrally molding the bus bars 24 and the resin material 23, and then the carrier 24b is cut. The substrate body 21 is formed in a rectangular plate shape as a whole. In particular, in the present embodiment, two pre-molding bus bar assemblies 24a having the same shape are disposed between the two carriers 24b of each pre-molding bus bar assembly 24a in the single substrate body 21 of the insert bus bar plate 2. The two pre-molding bus bar assemblies 24a are arranged to face each other so that the two terminal portions 24c are positioned (see FIG. 11 and the like). The details of the insert molding procedure for the insert bus bar plate 2 will be described later with reference to FIGS.

  In the insert-molded substrate body 21, as shown in FIG. 4 and the like, the terminal portion 24c of each pre-molding bus bar assembly 24a is such that the terminal of each bus bar 24 is substantially at the center in the short side direction (first width direction). Are aligned along the long side direction (second width direction orthogonal to the first width direction). Here, the terminals of the bus bars 24 are arranged in two rows along the long side direction. Each terminal of the terminal portion 24c is erected substantially perpendicularly to a mounting surface 25 that is a surface on which the electronic component 22 is mounted in the board body 21. That is, each terminal of the terminal portion 24c protrudes and extends from the mounting surface 25 along the short side direction and the direction orthogonal to the long side direction. In other words, each terminal of the terminal portion 24c is exposed to extend in the same direction from the mounting surface 25 which is one main surface of the substrate body 21 (resin material 23). Each of the terminals is located between a plurality of electronic components 22 described later with respect to the short side direction. In other words, the plurality of terminals of the terminal portion 24 c are collected at the central portion of the mounting surface 25. Further, the end of the substrate main body 21 on the side connected to the carrier 24b cut after the insert molding in each bus bar 24 becomes an exposed end 24h exposed from the resin material 23 on the end surface of the substrate main body 21. Yes. That is, the insert bus bar plate 2 has a plurality of exposed end portions 24 h of the bus bar 24 exposed at the end surface. The exposed end portions 24h are formed on end surfaces of a pair of long sides facing each other in the substrate main body 21, respectively. A plurality of exposed end portions 24h are exposed side by side in the long side direction on the end surfaces of the long sides.

  In particular, in the present embodiment, the insert bus bar plate 2 once forms the substrate body 21 as two substrate divided bodies 21a (see FIG. 14 and the like), and causes the electronic components 22 placed on the individual substrate divided bodies 21a to flow locally. After joining to the bus bar 24 by soldering, the two substrate divided bodies 21a are integrally connected. As shown in FIG. 4 etc., the board | substrate division body 21a embeds said 1 bus bar aggregate | assembly 24a before shaping | molding inside, and each terminal of the terminal part 24c follows a long side direction at the end surface side of a short side direction. Standing in a row. The two substrate divided bodies 21a are integrally formed as one insert bus bar plate 2 by arranging and connecting them so that the terminal portions 24c are located closest to each other. The details of the process of creating the board divided body 21a, the soldering process of the electronic component 22, and the connecting process of the two board divided bodies 21a will be described later with reference to FIGS.

  The electronic component 22 is mounted on the mounting surface 25 of the board body 21 and is an element that exhibits various functions here. In the electronic component 22, each terminal of the terminal portion 24c is electrically connected to a predetermined bus bar 24, and is fixed by soldering or the like on the back surface 25a of the mounting surface 25 (see FIG. 16 and the like). The electronic component 22 of this embodiment is a relay, for example. That is, the electronic component unit 1 is a relay unit module. The insert bus bar plate 2 of the present embodiment is provided with a total of six relays as electronic components 22, three in a row along the long side direction on both sides in the short side direction of each terminal of the terminal portion 24 c. In other words, in the insert bus bar plate 2, the electronic components 22 are arranged in two rows, and a plurality of terminals of the terminal portion 24 c are arranged in two rows between the two rows of electronic components 22. The insert bus bar plate 2 of the present embodiment basically has a substantially line-symmetric shape with respect to the center line along the long side direction of the substrate body 21 (that is, the center line in the short side direction), and the terminal portion 24c. The arrangement of the electronic components 22 is also substantially line symmetric. The insert bus bar plate 2 is mounted with elements such as a relay resistor in addition to the six relays as the electronic component 22.

  As shown in FIGS. 2, 3, 5 and 6, the housing 3 includes a base cover 31 as a base portion, a top cover 32 as a lid portion, and a connector fitting portion 33 as a connection portion fitting portion. Have. The base cover 31 is one to which the insert bus bar plate 2 is assembled. The top cover 32 covers the insert bus bar plate 2 assembled to the base cover 31 from the side opposite to the base cover 31. The connector fitting portion 33 is a portion into which the connector 4 that is a connection portion with the electric wire is fitted, and is formed integrally with the base cover 31. The base cover 31, the top cover 32, and the connector fitting part 33 are formed of an insulating synthetic resin.

  Specifically, the base cover 31 is a dish-shaped (tray-shaped) member as shown in FIG. The base cover 31 includes a rectangular frame portion 31a formed in a substantially square shape and a bottom portion 31b that closes the rectangular frame portion 31a. The bottom 31b is formed in a rectangular plate shape similar to the substrate body 21 of the insert bus bar plate 2. The rectangular frame portion 31a is formed so as to surround the edge portion of the bottom portion 31b. The bottom 31b is formed integrally with the rectangular frame 31a on the middle of the rectangular frame 31a (see FIG. 6 and the like). In the rectangular frame-shaped part 31a, notches 31d are formed in the pair of long side wall surfaces 31c along the long side direction of the bottom part 31b, and engaging claws 31e for engaging with the top cover 32 are formed. Is done. Further, in the rectangular frame-shaped portion 31a, engaging claws 31g for engaging with the box body 101 of the electrical junction box 100 are formed on the pair of short side wall surfaces 31f along the short side direction of the bottom portion 31b. . The base cover 31 is formed in a rectangular cylinder shape (a part of which is cut out by the cutout 31d) in which the middle of the rectangular frame-shaped portion 31a is closed by the bottom portion 31b. In the base cover 31, a space portion surrounded by the rectangular frame portion 31 a and the bottom portion 31 b is partitioned as an accommodation space portion 31 h that accommodates the electronic component 22 of the insert bus bar plate 2.

  Further, the base cover 31 has a central wall portion 31i formed at the center of the bottom 31b. The central wall portion 31i is formed so that the bottom 31b protrudes toward the accommodation space 31h. The central wall-shaped part 31i is formed along the long side direction at a substantially central part in the short side direction of the bottom part 31b. The central wall portion 31i extends from one short side wall surface 31f to the other short side wall surface 31f along the long side direction. The central wall-shaped portion 31i has a plurality of terminal fitting holes 31j and a pair of screw holes 31k formed on the tip surface. The terminal fitting hole 31j is a hole into which the terminal of each bus bar 24 described above is fitted when the insert bus bar plate 2 is assembled to the base cover 31, and the number and position according to the plurality of terminals of the terminal portion 24c. Formed with. Here, the terminal fitting holes 31j are arranged in two rows along the long side direction. The screw hole 31k is a hole for screwing a screw 26 for fastening the insert bus bar plate 2 to the base cover 31 when the insert bus bar plate 2 is assembled to the base cover 31.

  Further, as shown in FIGS. 5 and 6, the base cover 31 is hollow on the back side of the central wall portion 31i, that is, on the side opposite to the housing space portion 31h, and this hollow portion is connected to the electric wire. It is formed as a connector fitting portion 33 into which the connector 4 which is a portion is fitted. Each terminal of the terminal portion 24c of each bus bar 24 described above is exposed in the connector fitting portion 33 through each terminal fitting hole 31j in a state where the insert bus bar plate 2 is assembled to the base cover 31. Here, the connector fitting part 33 is formed in two places, and the two connectors 4 in total are each fitted to the two connector fitting parts 33 one by one. That is, in the electronic component unit 1 of the present embodiment, the two connectors 4 are connected to the terminal portions 24 c formed by the terminals of the plurality of bus bars 24.

  As shown in FIG. 2, the top cover 32 is a lid-shaped member. The top cover 32 includes a rectangular frame-shaped portion 32a formed in a substantially square shape and a ceiling portion 32b that closes one opening of the rectangular frame-shaped portion 32a. The ceiling portion 32 b is formed in a rectangular plate shape having the same shape as the substrate body 21 of the insert bus bar plate 2 and the bottom portion 31 b of the base cover 31. The rectangular frame-shaped portion 32a is formed so as to stand on the edge of the ceiling portion 32b. In the rectangular frame-shaped portion 32a, an engagement concave portion 32d for engaging with the base cover 31 is formed on a pair of long side wall surfaces 32c along the long side direction of the ceiling portion 32b. Moreover, the rectangular frame-shaped part 32a has a notch 32f formed on each of the pair of short side wall surfaces 32e along the short side direction of the ceiling part 32b. The top cover 32 is formed in a rectangular cylindrical shape (one part is notched by the notch 32f) having one end opened by the rectangular frame-shaped part 32a and the ceiling part 32b and the other end closed.

  As shown in FIGS. 2 and 3, the electronic component unit 1 configured as described above has the insert bus bar plate 2 assembled to the base cover 31, and the top cover 32 on the opposite side of the insert bus bar plate 2 from the base cover 31. The connector 4 is fitted into the connector fitting portion 33 in a state covered by the above, thereby constituting one module.

  More specifically, the electronic component unit 1 is in a positional relationship such that the electronic component 22 of the insert bus bar plate 2 is accommodated in the accommodating space 31h of the base cover 31, that is, the mounting surface 25 on which the electronic component 22 is mounted. The insert bus bar plate 2 is assembled to the base cover 31 in a positional relationship such that (see FIG. 4 and the like) faces the bottom 31b of the base cover 31. In the electronic component unit 1, in a state where the insert bus bar plate 2 is assembled to the base cover 31, the terminal portions 24 c of the plurality of bus bars 24 of the insert bus bar plate 2 are fitted in the terminal fitting holes 31 j of the base cover 31. Each terminal of the terminal portion 24c is exposed in the connector fitting portion 33 along a direction perpendicular to the short side direction and the long side direction. In the electronic component unit 1, the screw 26 is inserted into the screw hole 27 of the insert bus bar plate 2 and screwed into the screw hole 31 k of the base cover 31, whereby the insert bus bar plate 2 and the base cover 31 are fastened. In the electronic component unit 1, three electronic components 22 are located on both sides in the short side direction of the central wall portion 31 i in a state where the insert bus bar plate 2 is assembled to the base cover 31.

  In the electronic component unit 1, the top cover 32 is attached to the base cover 31 or the like in such a positional relationship that the insert bus bar plate 2 assembled to the base cover 31 is covered with the top cover 32 from the side opposite to the base cover 31. Is done. In the electronic component unit 1, the top cover 32 is engaged with the engagement recesses 32 d on the top cover 32 side with the engagement claws 31 e on the base cover 31 side with the top cover 32 mounted at an appropriate position. 32 is assembled to the base cover 31. As shown in FIG. 3 and the like, the electronic component unit 1 has the rectangular frame-shaped portion 32a of the top cover 32 on the outside of the rectangular frame-shaped portion 31a of the base cover 31 with the top cover 32 assembled to the base cover 31. The engaging claws 31g are exposed from the notches 32f of the top cover 32 while being positioned so as to overlap. And the electronic component unit 1 is a terminal part which consists of each terminal of the several bus-bar 24 by the connector 4 being fitted to the said connector fitting part 33 along the direction orthogonal to a short side direction and a long side direction. The connector 4 is connected to 24c, and is assembled to a predetermined location inside the box body 101 of the electrical junction box 100 via each engaging claw 31g.

  The direction in which the base cover 31, the insert bus bar plate 2 and the top cover 32 are stacked is the same as the above-described electrical connection box 100 in the state where the electrical connection box 100 is connected to the engine room or the like. However, depending on the installation state of the electrical junction box 100, the stacked direction may be installed with a predetermined angle with respect to the vertical direction.

  Next, with reference to FIGS. 7-16, the manufacturing method of the insert bus-bar plate 2 which concerns on this embodiment is demonstrated. First, with reference to FIGS. 7 to 14, the procedure up to the creation of the substrate divided body 21 a will be described. FIG. 7 is a flowchart showing up to the step of creating a substrate divided body in the method of manufacturing the insert bus bar plate according to the embodiment of the present invention. FIG. 8 is a diagram for explaining step S101 (cutout step) in the flowchart of FIG. FIG. 9 is a diagram illustrating step S102 (bending step) in the flowchart of FIG. FIG. 10 is a diagram for explaining step S103 (terminal-side carrier cutting step) in the flowchart of FIG. FIG. 11 is a diagram for explaining step S <b> 104 facing arrangement step in the flowchart of FIG. 7. FIG. 12 is a diagram illustrating step S105 (insert molding step) in the flowchart of FIG. FIG. 13 is a diagram for explaining step S106 (substrate body creation step) in the flowchart of FIG. FIG. 14 is a diagram for explaining step S107 (division step) in the flowchart of FIG. Hereinafter, according to the flowchart of FIG. 7, the manufacturing method of the insert bus-bar plate 2 is demonstrated, referring FIGS.

  In step S101 of the flowchart of FIG. 7, the pre-molding bus bar assembly 24a is cut out from the conductive metal plate (cutout step). At this time, as shown in FIG. 8, the pre-molding bus bar assembly 24a is formed in a substantially plate shape as a whole by, for example, pressing. In addition, as shown in FIG. 8, the pre-molding bus bar assembly 24a at this time includes a carrier 24b connected to one end of a set of a plurality of bus bars 24, and a plurality of bus bars 24 opposite to the carrier 24b. A terminal-side carrier 24d connected to each of the terminal portions 24c at the end. Both the carrier 24b and the terminal-side carrier 24d are long plate-like members extending along the arrangement direction (long side direction) of the plurality of terminals of the terminal portion 24c and having the long side direction as the longitudinal direction. Further, among the plurality of bus bars 24, one that is not connected to one of the carrier 24b or the terminal-side carrier 24d is connected to the adjacent bus bar 24 by a tie bar 24e and held on one plane together with the other bus bars 24. Yes. In the present embodiment, as shown in FIG. 8, two tie bars 24e are provided for a single pre-molding bus bar assembly 24a. When the process of step S101 is completed, the process proceeds to step S102.

  In step S102, the terminal portion 24c and the terminal-side carrier 24d of the pre-molding bus bar assembly 24a are bent (bending step). Accordingly, as shown in FIG. 9, the terminal portion 24c and the terminal-side carrier 24d are bent at a substantially right angle with respect to the bus bar 24 and the carrier 24b. When the process of step S102 is completed, the process proceeds to step S103.

  In step S103, the terminal-side carrier 24d is cut from the pre-molding bus bar assembly 24a (terminal-side carrier cutting step). The terminal-side carrier 24d can be cut using, for example, hand folding or a cutting blade. As a result, as shown in FIG. 10, only the terminal portion 24c is bent at a substantially right angle with respect to the bus bar 24 and the carrier 24b. In the present embodiment, a plurality of such pre-molding bus bar assemblies 24a having the same shape are created. Here, the “pre-molding bus bar assembly 24a having the same shape” refers to the same arrangement pattern of the plurality of bus bars 24 and the connection relationship between the bus bars 24, the carrier 24b, and the terminal portions 24c. Furthermore, a pair of positioning holes 24g provided at both ends of the carrier 24b are also in a symmetric position, and not only the plurality of bus bars 24 but also the accompanying carriers 24b have the same shape. Point to. When the process of step S103 is completed, the process proceeds to step S104.

  It should be noted that the series of processes of steps S101 to S103 described above are collectively referred to as a “formation step” in which one end of a plurality of bus bars 24 different from the terminal portion 24c is connected to the pre-molding bus bar assembly 24a by the carrier 24b. Can be expressed.

  In step S104, two pre-molding bus bar assemblies 24a having the same shape are placed so as to face each other on a mold for insert molding (not shown) (opposing placement step). At this time, as shown in FIG. 11, two pre-molding bus bar assemblies 24a in the state where the processing described in step S103 is performed are used. The carrier 24b of each pre-molding bus bar assembly 24a is arranged so that the long side direction of the substrate body 21 after molding is the longitudinal direction, whereby each terminal of each bent bus bar 24 is also in the long side direction. Are arranged along. That is, the terminal portion 24c of the pre-molding bus bar assembly 24a is configured such that a plurality of terminals are arranged in parallel along the long side direction. Each terminal of the terminal portion 24c is inserted into the inner side of the mold (downward in FIG. 11) at a substantially central position in the short side direction of the substrate body 21 after molding. In two opposing pre-molding bus bar assemblies 24a, both terminal portions 24c are arranged at the closest position along the short side direction and are arranged to extend in the same direction. Further, the bus bar 24 and the carrier 24b of the two pre-molding bus bar assemblies 24a are arranged on the same plane, and the two carriers 24b are located farthest along the short side direction as opposed to the terminal portion 24c. Is arranged.

  In other words, the “opposite arrangement” of the two pre-molding bus bar assemblies 24a having the same shape as described above is the center of the insert bus bar plate 2 (substrate body 21) after molding (the long side direction and the short side direction of the substrate body 21). It can also be expressed that the two pre-molding bus bar assemblies 24a are arranged point-symmetrically (see FIG. 12 etc.). This means that the plurality of electronic components 22 mounted on the mounting surface 25 of the molded substrate body 21 are also arranged point-symmetrically around the central portion of the mounting surface 25. In other words, for the two pre-molding bus bar assemblies 24a having the same shape, the two terminal portions 24c of each pre-molding bus bar assembly 24a are positioned between the two carriers 24b of each pre-molding bus bar assembly 24a. Can be expressed as When the process of step S104 is completed, the process proceeds to step S105.

  In step S105, insert molding is performed in which an insulating resin is injected around the two pre-molding bus bar assemblies 24a inserted into the mold (insert molding step). As a result, as shown in FIG. 12, each bus bar 24 of the pre-molding bus bar assembly 24 a and the resin material 23 are integrally molded to form the substrate body 21. Each bus bar 24 of the pre-molding bus bar assembly 24 a is embedded in the substrate body 21 (resin material 23) while being insulated from each other by the resin material 23. The insert molding is performed such that the tips of the carrier 24b and the terminal portion 24c of the pre-molding bus bar assembly 24a are exposed to the outside of the substrate body 21 (resin material 23). When the process of step S105 is completed, the process proceeds to step S106.

  In step S106, as shown in FIG. 13, after insert molding, the carrier 24b is cut from the pre-molding bus bar assembly 24a embedded in the resin material 23 by insert molding, and further, the tie bar 24e is removed from the surface of the substrate body 21. The tie bar 24e is cut by drilling at the position of (2), whereby the substrate body 21 is created (substrate body creation step). The excision of the carrier 24b can be performed using, for example, a cutting blade. The tie bar 24e can be cut using, for example, a tie bar cutting punch. As described above, in this embodiment, since two tie bars 24e are provided for a single pre-molding bus bar assembly 24a, as shown in FIG. 13, the substrate in which the two pre-molding bus bar assemblies 24a are embedded. In the main body 21, a total of four places are drilled to form a hole 24f. When the process of step S106 is completed, the process proceeds to step S107.

  In step S107, the substrate body 21 created in step S106 is divided into two substrate divided bodies 21a (dividing step). As shown in FIG. 14, the substrate body 21a is divided along the long side direction at a substantially central position in the short side direction. In other words, the substrate body 21 is divided at a position between the respective terminal portions 24c of the two pre-molding bus bar assemblies 24a that are arranged to face each other. That is, the substrate divided body 21a is configured by embedding one pre-molding bus bar assembly 24a, and a plurality of terminals of the terminal portion 24c are arranged along the long side direction on one end surface side in the short side direction. It is comprised so that it may be erected. When the process of step S107 is completed, the process proceeds to step S201 described later with reference to FIG.

  The series of processes in steps S104 to S107 described above can be collectively expressed as a “substrate divided body creation step”. In the substrate divided body creation step, the pre-molding bus bar assembly 24a is embedded in the resin material 23 by insert molding, and the carrier 24b is cut from the pre-molding bus bar assembly 24a, whereby the terminal portion of the pre-molding bus bar assembly 24a. A substrate divided body 21a in which 24c is erected on one end surface side is created.

  Next, in the manufacturing method of the insert bus bar plate 2 according to the present embodiment, a procedure after the creation of the substrate divided body 21a will be described with reference to FIGS. FIG. 15 is a flowchart showing a step after the step of creating the substrate divided body shown in FIG. 7 in the method of manufacturing the insert bus bar plate according to the embodiment of the present invention. FIG. 16 is a diagram illustrating step S201 (mounting step), step S202 (installation step), and step S203 (soldering step) in the flowchart of FIG. The flowchart shown in FIG. 15 is performed after the processing shown in the flowchart of FIG. 7 is completed. Hereinafter, the manufacturing method of the insert bus bar plate 2 will be described according to the flowchart of FIG. 15 and with reference to FIG.

  In step S201, the electronic component 22 is mounted at a predetermined position on the created two substrate divided bodies 21a (mounting step). In the present embodiment, the electronic component 22 is an element such as a relay or a relay resistor. Moreover, the board | substrate division body 21a divides the board | substrate main body 21 into 2 in the center part of a short side direction as mentioned above. For this reason, in this embodiment, as shown in FIG. 4, as shown in FIG. 4, three relays and elements such as a relay resistor are arranged along the longitudinal direction on each substrate divided body 21 a. Moreover, in the board | substrate division body 21a, the terminal part 24c is arrange | positioned at the one end side of a short side direction, and the electronic component 22 is arrange | positioned at the other end side of the short side direction opposite to the terminal part 24c. As shown in FIG. 16, when the electronic component 22 is mounted on the board divided body 21a, the terminal of each electronic component for connecting to the bus bar is connected to the mounting surface from the mounting surface 25 of the board divided body 21a. 25 and the back surface 25a on the opposite side. When the process of step S201 is completed, the process proceeds to step S202.

  In step S202, two board division bodies 21a are installed so that the respective terminal portions 24c are arranged at both ends in the short side direction with respect to the two board division bodies 21a on which the electronic component 22 is mounted in step S201. Installation step). In other words, as shown in FIG. 16, the two substrate divided bodies 21a are installed so that the electronic components 22 of the two substrate divided bodies 21a are located between the terminal portions 24c of the two substrate divided bodies 21a. Is done. That is, the positions of the two substrate divisions 21a in the short side direction are changed compared to the final arrangement of the insert bus bar plate 2 shown in FIG. These board | substrate division bodies 21a are installed in the conveying apparatus (not shown) utilized for the conveyance on the solder nozzle 50 for performing the local flow soldering mentioned later, for example. When the process of step S202 is completed, the process proceeds to step S203.

  In step S203, local flow soldering is performed on the two substrate divided bodies 21a installed in step S202 (soldering step). In the local flow soldering, the terminal of the electronic component 22 is inserted by spraying molten solder from below from the solder nozzle 50 toward the back surface 25a of the substrate divided body 21a on which the electronic component 22 is placed. Solder is sucked into the through hole 21b, and the electronic component 22 is soldered.

  The local flow soldering will be described in detail. In the local flow soldering, first, flux is applied to the back surface 25a of the substrate divided body 21a to be soldered, and the oxide is removed. Secondly, the substrate divided body 21a and the electronic component 22 are preheated to increase the surface temperature in order to improve the sucking up of solder from the back surface 25a of the substrate divided body 21a into the through hole 21b (solder rising). Third, when the board divided body 21a is conveyed to the position of the solder nozzle 50, the back surface 25a of the board divided body 21a is immersed in the molten solder surface of the soldering iron. Fourth, the back surface 25a molten solder of the board divided body 21a is sprayed from the solder nozzle 50. Note that the flow of molten solder sprayed from the solder nozzle 50 is sprayed upward as indicated by an arrow 51 in FIG. 16, and then the gap between the substrate divided body 21 a and the solder nozzle 50 as indicated by an arrow 52. Then, it circulates away from the nozzle and is sprayed upward from the solder nozzle 50 again. When the process of step S203 is completed, the process proceeds to step S204.

  In step S204, the two board divided bodies 21a are connected so that the terminal portions 24c are arranged in the center in the short side direction for the two board divided bodies 21a subjected to the local flow soldering in step S203 (connection step). ). In other words, the terminal portions 24c of the two board divided bodies 21a are positioned between the electronic components 22 of the two board divided bodies 21a, that is, opposite to the installation positions in step S202, that is, FIG. In the final arrangement of the insert bus bar plate 2 shown in FIG. As used herein, the term “coupled” refers to, for example, using an adhesive or the like to join the end surfaces of the two board divided bodies 21a to each other, or to separate the two board divided bodies 21a into the housing 3. 2 and 4, as shown in FIGS. 2 and 4, the end surfaces of the substrate divided body 21a are in contact with each other, and the mounting surfaces 25 are fixed in a state of being arranged on the same plane. The insert bus bar plate 2 is manufactured through such a procedure.

  Next, the effect of the manufacturing method of the insert bus bar plate 2 according to the present embodiment will be described.

  As described above, the insert bus bar plate 2 of the present embodiment collects the terminal portions 24c of the bus bars 24 erected from the mounting surface 25 of the board main body 21 at the central portion in the short side direction and joins the bus bars 24 to each other. The electronic component 22 is provided on both sides in the short side direction of the terminal portion 24c. That is, the electronic components 22 placed on the board body 21 are arranged on both end sides in the short side direction.

  Here, in the local flow soldering used to join the electronic component 22 to the bus bar 24 in the board body 21, molten solder is sprayed from the lower side of the board body 21 to the back surface 25 a of the board body 21. . As shown in FIG. 16, the molten solder sprayed from the solder nozzle 50 is sprayed upward as indicated by an arrow 51, and thereafter, the substrate divided body 21 a and the solder nozzle 50 are separated as indicated by an arrow 52. It circulates away from the gap. For this reason, the pressure of the molten solder sprayed on the back surface 25a of the substrate body 21 tends to be weaker at both end portions than at the central portion in the short side direction. In the configuration of the insert bus bar plate 2 of the present embodiment, since the through holes 21b through which the terminals of the electronic component 22 to be soldered are inserted are located on both ends in the short side direction, on the characteristics of local flow soldering, There is a possibility that the solder does not go up into the through hole 21b.

  On the other hand, in the manufacturing method of the insert bus bar plate 2 according to the present embodiment, the forming step of forming the pre-molding bus bar assembly 24a in which one end portions of the plurality of bus bars 24 different from the terminal portions 24c are connected by the carrier 24b. (Steps S101 to S103), and the pre-molding bus bar assembly 24a is embedded in the resin material 23 by insert molding, and the carrier 24b is cut from the pre-molding bus bar assembly 24a, whereby the terminal of the pre-molding bus bar assembly 24a The board divided body creating step (steps S104 to S107) for creating the board divided body 21a in which the portion 24c is erected on one end surface side, and the two board divided bodies 21a created in the board divided body creating step are electronic components. Mounting step (step S201) for mounting 22 and each of the two substrate divided bodies 21a An installation step (step S202) for installing the two board division bodies 21a so that the electronic components 22 of the two board division bodies 21a are positioned between the terminal portions 24c, and the two board divisions installed in the installation step. A soldering step (step S203) for performing local flow soldering on the body 21a, and two substrate divided bodies 21a subjected to local flow soldering in the soldering step are separated into two substrates. A connection step (step S204) for connecting the respective terminal parts 24c of the two substrate divided bodies 21a between the respective electronic components 22 of the divided bodies 21a.

  Thus, in this embodiment, the two board | substrate division bodies 21a are created with respect to one insert bus-bar plate 2, and in the case of local flow soldering, arrangement | positioning of these two board division bodies 21a is replaced. The terminal parts 24c are arranged at both ends in the short side direction, while the electronic components 22 are arranged so as to be concentrated at the central part in the short side direction. As a result, the through holes 21b through which the terminals of the electronic component 22 are inserted are concentrated in the central portion in the short side direction, so that the molten solder sprayed onto the back surface 25a of the board body 21 can be easily lifted to the through holes 21b. Thus, the electronic component 22 can be favorably soldered to the board body 21 and the bus bar 24. As a result, the solderability of the electronic component 22 in local flow soldering can be improved.

  Moreover, in the said embodiment, a board | substrate division | segmentation body preparation step is the carrier 24b of each of the two pre-molding busbar assemblies 24a formed by the two pre-molding busbar assemblies 24a formed in the forming steps (steps S101 to S103). Between the two pre-molding busbar assemblies 24a, the opposing placement step (step S104) so as to face each other so that the respective terminal portions 24c are positioned, and the two pre-molding busbar assemblies arranged opposite to each other in the opposing placement step The substrate body 21 is formed by cutting the carrier 24b from the pre-molding bus bar assembly 24a embedded in the resin material 23 by insert molding in the insert molding step (step S105) in which insert molding is performed on 24a. Substrate body creation step (step S106), and substrate body The substrate main body 21 that is created in forming step includes dividing step, each divided into two substrates divided bodies 21a comprising one pre-molding the busbar assembly 24a (step S107), the.

  With this configuration, since the two substrate divided bodies 21a can be created by a single insert molding, the manufacturing efficiency can be improved.

[Modification]
A modification of the above embodiment will be described with reference to FIGS. FIG. 17 is a flowchart illustrating a process up to a substrate dividing body manufacturing method in an insert bus bar plate manufacturing method according to a modification of the embodiment. FIG. 18 is a diagram illustrating step S304 (insert molding step) in the flowchart of FIG. FIG. 19 is a diagram illustrating step S305 (carrier cutting step) in the flowchart of FIG.

  This modification is different from the above-described embodiment in steps up to the production of the substrate divided body 21a. In the above embodiment, the method of dividing the substrate body 21 into the two substrate divided bodies 21a after creating the substrate body 21 in which the two pre-molded bus bar assemblies 24a are embedded by insert molding has been described. It is also possible to adopt a technique of creating one substrate divided body 21a by performing insert molding on the front bus bar assembly 24a. Hereinafter, a method of manufacturing the insert bus bar plate 2 will be described with reference to FIGS.

  Steps S301 to S303 are the same as the processing of steps S101 to S103 described with reference to the flowchart of FIG. That is, a series of processing of steps S301 to S303 also forms a pre-molding bus bar assembly 24a in which one end portions of a plurality of bus bars 24 different from the terminal portions 24c are connected by the carrier 24b, as in steps S101 to S103. It can also be expressed as “forming step”.

  In step S304, insert molding is performed in which an insulating resin is injected around one pre-molding bus bar assembly 24a created in step S303 (insert molding step). Thereby, as shown in FIG. 18, each bus bar 24 of one pre-molding bus bar assembly 24a and the resin material 23 are integrally molded. When the process of step S304 is completed, the process proceeds to step S305.

  In step S305, as shown in FIG. 19, after insert molding, the carrier 24b is cut from one pre-molding bus bar assembly 24a embedded in the resin material 23 by insert molding (carrier cutting step). The tie bar 24e is cut by drilling from the surface of the main body 21 to the position of the tie bar 24e. Thereby, the board | substrate division body 21a is created. When the process of step S305 is completed, the process proceeds to step S201 described with reference to the flowchart of FIG.

  It should be noted that the series of processes in steps S304 to S305 described above can be collectively expressed as a “substrate divided body creation step”. In the substrate divided body creation step, the pre-molding bus bar assembly 24a is embedded in the resin material 23 by insert molding, and the carrier 24b is cut from the pre-molding bus bar assembly 24a, whereby the terminal portion of the pre-molding bus bar assembly 24a. A substrate divided body 21a in which 24c is erected on one end surface side is created. The present modification is different from the above embodiment in the contents of the substrate divided body creating step.

  Also in the present modification, after the substrate divided body 21a is created, the steps S201 to S204 shown in the flowchart of FIG. 15 are performed in the same manner as in the above embodiment, and the insert bus bar plate 2 is manufactured. Therefore, this modification also has an effect that the solderability of the electronic component 22 in the local flow soldering can be improved, as in the above embodiment.

  Moreover, in this modification, the board | substrate division | segmentation body creation step is an insert molding step (step S304) which performs insert molding to one pre-molding bus-bar assembly 24a formed in the formation step (steps S301 to S303), A carrier cutting step (step S305) in which the carrier 24b is cut from the pre-molding bus bar assembly 24a embedded in the resin material 23 by insert molding in the molding step to create the substrate divided body 21a.

  With this configuration, since insert molding is performed on a single pre-molding bus bar assembly 24a, a mold for insert molding can be reduced in size.

  As mentioned above, although embodiment of this invention was described, the said embodiment was shown as an example and is not intending limiting the range of invention. The above-described embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. The above-described embodiments and modifications thereof are included in the invention described in the claims and equivalents thereof, as long as they are included in the scope and gist of the invention.

  In the above embodiment, the configuration in which the insert bus bar plate 2 is applied to the electronic component unit 1 is illustrated, but the present invention is not limited thereto. Moreover, in the said embodiment, although what was a relay was illustrated as the electronic component 22 mounted in the insert bus-bar plate 2, not only this but other electronic components, such as a fuse, may be sufficient.

  In the above-described embodiment, the terminal portions 24c of the two pre-molding bus bar assemblies 24a that face each other extend in the same direction from the mounting surface 25 that is one of the main surfaces of the substrate body 21 (resin material 23). However, only the terminal portion 24c of one pre-molding bus bar assembly 24a is exposed to the mounting surface 25, which is one main surface of the substrate body 21 (resin material 23), and the other before molding. The terminal 24c of the bus bar assembly 24a may be exposed to the back surface 25a that is the other main surface on the back side of the mounting surface 25.

  In the above-described embodiment, the configuration in which one insert bus bar plate 2 is created using two pre-molding bus bar assemblies 24a having the same shape is exemplified. However, the terminal portion 24c may be integrated at the center in the short side direction. The two pre-molding bus bar assemblies 24a having different shapes may be used.

2 Insert bus bar plate 21 Substrate body 21a Substrate divided body 22 Electronic component 23 Resin material 24 Bus bar 24a Bus bar assembly before molding 24b Carrier 24c Terminal portion 25 Mounting surface (main surface)
S101 to S103, S301 to S303 Formation step S104 to S107, S304 to S305 Substrate division body creation step S201 Mounting step S202 Installation step S203 Soldering step S204 Connection step S104 Opposing arrangement step (Substrate division body creation step)
S105 Insert molding step (Substrate segment creation step)
S106 Substrate body creation step (Substrate division body creation step)
S107 Division step (substrate division body creation step)
S304 Insert molding step (Substrate division body creation step)
S305 Carrier cutting step (substrate divided body creating step)

Claims (3)

A flat resin material;
A plurality of metal bus bars embedded in the resin material by insert molding and having terminal portions exposed to at least one of the main surfaces of the resin material;
An insert bus bar plate manufacturing method comprising:
A forming step of forming a pre-molding bus bar assembly in which one end portions of the plurality of bus bars different from the terminal portions are connected by a carrier;
A substrate divided body in which the terminal portion of the pre-molding bus bar assembly is erected on one end surface side by performing the insert molding on the pre-molding bus bar assembly and cutting the carrier from the pre-molding bus bar assembly. Substrate dividing body creation step for creating
A mounting step of mounting electronic components on the two substrate divided bodies created in the substrate divided body creating step;
An installation step of installing the two substrate dividers such that the electronic components of the two substrate dividers are positioned between the terminal portions of the two substrate dividers, respectively.
A soldering step of performing local flow soldering on the two substrate divided bodies installed in the installation step;
The two board divided bodies subjected to the local flow soldering in the soldering step are arranged between the electronic components of the two board divided bodies. A connecting step for connecting so that the terminal portion is positioned;
The manufacturing method of the insert bus-bar plate characterized by including. The substrate divided body creating step includes
The two pre-molding busbar assemblies formed in the forming step are connected between the respective carriers of the two pre-molding busbar assemblies, and the terminal portions of the two pre-molding busbar assemblies. An opposing placement step for opposing placement so that
An insert molding step for performing the insert molding on the two pre-molding busbar aggregates disposed to face each other in the facing placement step;
Substrate body creation step of creating a substrate body by cutting the carrier from the pre-molding busbar assembly embedded in the resin material by the insert molding in the insert molding step;
A dividing step of dividing the substrate body created in the substrate body creating step into two substrate divided bodies each including one pre-molding busbar assembly;
The manufacturing method of the insert bus-bar plate of Claim 1 characterized by the above-mentioned. The substrate divided body creating step includes
An insert molding step of performing the insert molding on the one pre-molding busbar assembly formed in the forming step;
A carrier cutting step of cutting the carrier from the pre-molding bus bar assembly embedded in the resin material by the insert molding in the insert molding step to create a substrate divided body;
The manufacturing method of the insert bus-bar plate of Claim 1 characterized by the above-mentioned.

Images