JP6292923B2 - Shield structure and method of manufacturing shield structure - Google Patents

Description

  The present invention relates to a shield structure.

A connector or the like for electrical connection in an electric / electronic device may include a shield structure covered with a shield formed of a conductive material. Thereby, the connector is electromagnetically shielded, and the influence of noise in the surroundings can be reduced.
For example, the shield 513 disclosed in Patent Literature 1 is formed of a conductive material that covers the connector 501 fixed to the substrate 515 as shown in FIG. The shield 513 restricts the relative movement between the shield body 503 and the connector 501 by the lock portion 505 protruding outward from the shield body 503 contacting the stopper portion 511 of the connector 501. Thereby, even if a reaction force is applied to the shield body 503 by the pressing force applied between the contact portion 509 and the ground terminal 507, the connector 501 and the shield body 503 are temporarily fixed. Therefore, the shield 513 can be independently held on the substrate 515 without using a jig or the like until it is fixed on the substrate 515 after being put on the connector 501.

  Further, as shown in FIG. 11, the electrical connector 517 disclosed in Patent Document 2 is fixed to a connector main body 519 of an electrical device with a fixing screw. The electrical connector 517 insulates and holds the cylindrical base 521 disposed on the outermost periphery, the insulating portion 525 that insulates the metal-made cylindrical guide member 523 disposed on the inner side, the single contact pin 527, and the like. The insulator portion 529 is integrally formed with an insulator 531 formed of an insulator forming member. In the guide member 523, a front end of a metal shield frame 535 is screwed and electrically connected to a screw portion 533 provided on the inner peripheral surface of the rear end.

JP 2012-230857 A JP 11-31548 A

  However, the connector 501 and the electrical connector 517 disclosed in Patent Document 1 and Patent Document 2 need to be manufactured by assembling the shield body 503 and the shield frame 535 as separate parts, leading to an increase in the number of parts. Further, it is difficult to deal with the connector 501 and the electrical connector 517 even if an impedance mismatching portion is found after the shield body 503 and the shield frame 535 are once assembled. For this reason, it has become difficult to improve high-frequency performance.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a shield structure capable of obtaining a shield body by additionally shaping a desired portion after formation of an insulating housing , and a method for manufacturing the shield structure. It is in.

The above object of the present invention is achieved by the following configuration.
(1) insulating housing and, wherein is housed inwardly of the insulating housing, and the substrate mounting components mounted on a circuit board, an inner surface of the insulating housing at a distance from the substrate mounting part with surrounds the substrate mounting component And a shield body, which is a molded product by three-dimensional modeling , fixed to the shield structure.
(2) The shield structure according to (1), wherein the insulating housing has a bottomed cylindrical shape that opens upward, and the circuit board mounting component includes an opening of the insulating housing. The shield body has a bottomed cylindrical shape that opens upward, and is fixed to substantially the entire inner surface of the insulating housing. Characteristic shield structure.
(3) The method for manufacturing a shield structure according to (1) or (2), wherein the shield body and the insulating housing are simultaneously formed by the three-dimensional modeling.

According to the shield structure configured as described above in (1) to (2) and the method for manufacturing the shield structure configured as described in (3) above , the shield body is formed on the inner surface of the insulating housing by three-dimensional modeling after the insulating housing is formed. Molded directly. The molded shield body is fixed to the inner surface of the insulating housing (attached in a fixed form). Shield is spaced apart from the substrate mounting part, surrounding the substrate mounting part. For this reason, a separate shield part assembled inside the insulating housing becomes unnecessary, and the supply management and assembly process of the shield part can be reduced.
In addition, when a separate shield part is assembled to the insulating housing as in the prior art, a holding shape portion is formed in the insulating housing, and an engaging portion that engages with the holding shape portion is cut and raised in the shield part. It was necessary to form by. On the other hand, in the shield structure in which the shield body is formed by three-dimensional modeling, it is not necessary to provide these holding shape portions in the insulating housing, and it is not necessary to form the engaging portion in the shield body. As a result, compared to the conventional shield structure, the shield structure of the present invention enables simplification and miniaturization of the insulating housing and does not cause a portion of the shield body where the shield performance is degraded by the engaging portion. Thereby, higher shielding performance than the conventional structure can be obtained.

(2) an insulating housing, a shielded member housed inside the insulating housing, a shield body that surrounds the shielded member and is spaced from the shielded member and fixed to the inner surface of the insulating housing A shield structure comprising: an additional shield part formed thickly by three-dimensional modeling on a part of the shield body.

  According to the shield structure having the configuration (2), it is possible to improve the shield performance only in a portion where the high frequency performance is not good. That is, in the shield structure in which the shielded member housed inside the insulating housing is shielded by the shield body fixed to the inner surface of the insulating housing, an impedance mismatching portion may occur. In such a case, a thick additional shield portion can be formed by three-dimensional modeling at a portion of the shield body that needs a more shielding effect. As a result, the shielding performance is enhanced, the occurrence of impedance mismatching is suppressed, and the high frequency performance is enhanced.

(3) The shield structure according to (2) above, wherein a space corresponding to the additional shield is formed in advance in the insulating housing.

  According to the shield structure having the above configuration (3), the space portion is formed in advance in the insulating housing at a site where impedance mismatching is likely to occur. Therefore, even when the shield body is fixed to the inner surface of the insulating housing, the additional shield portion can be formed in this space portion.

  According to the shield structure according to the present invention, a shield body can be obtained by additionally shaping a desired portion after forming the insulating housing.

  The present invention has been briefly described above. Further, the details of the present invention will be further clarified by reading through a mode for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings. .

It is a partial fracture perspective view of a substrate unit case provided with a shield structure concerning a 1st embodiment of the present invention. It is process drawing which represented the process in which a shield body is additionally shaped to the insulation housing shown in FIG. 1 by (a)-(c). (A) is an exploded perspective view of a substrate unit case having a conventional shield structure in which a separate shield component is attached to an insulating housing, and (b) is an assembled perspective view of (a). (A) is the whole perspective view of the separate shield component shown to Fig.3 (a), (b) is the whole perspective view of the shield body shown in FIG. It is a horizontal sectional view of the shield connector provided with the shield structure concerning a 2nd embodiment of the present invention, (a) shows the state after the additional shield part was fabricated, and (b) is the additional shield part molded. Indicates the state before It is a whole perspective view of the connector concerning a reference example. FIG. 7 is an exploded perspective view of a standard lock portion and a housing body of the connector shown in FIG. 6. It is the perspective view which represented the standard lock | rock part before the additional shaping of the connector shown in FIG. 6 with the principal part enlarged view. (A) is the perspective view which notched a part of connector shown in FIG. 6, (b) is a front view of the connector shown in FIG. 6, (c) is the principal part enlarged view of (b). It is the schematic which looked at the conventional connector which attached the shield from the side. It is sectional drawing which shows the structure of the conventional electrical connector. (A) is a disassembled perspective view of the conventional block connector, (b) is sectional drawing of the block connector shown to (a).

Embodiments according to the present invention will be described below with reference to the drawings.
A board unit case 11 having a shield structure according to the first embodiment of the present invention includes a unit case (insulating housing) 13, a board mounting component 23 which is a shielded member mounted on a circuit board 21, and a conductive metal product. The shield body 15.

The insulating housing 13 of the first embodiment is formed of a synthetic resin material having insulating properties. The insulating housing 13 is formed in a box shape whose upper surface is an opening 19 and is opened.
The board mounting component 23 that is a shielded member is conductively fixed to the lower surface of the circuit board 21. The board mounting component 23 is inserted and accommodated in the insulating housing 13 so that the circuit board 21 covers the opening 19.
The shield body 15 of the present embodiment surrounds the board mounting component 23 that is a member to be shielded, and is fixed to the inner surface of the insulating housing 13 separated from the board mounting component 23 by a three-dimensional modeling. Has been.

  Here, as the three-dimensional modeling, for example, a powder sintering layered modeling method can be used. The powder sintering additive manufacturing method is different from the powder fixed lamination method in which a binder is applied to a material powder, and then laminated, and metal / resin powder is sequentially melted and sintered by a laser heat source, and a desired shape is formed by lamination. . While most other additive manufacturing methods including stereolithography limit the molding material, the powder sintering additive manufacturing method can form various molding materials from resin materials to metals and ceramics.

  In the powder sintering additive manufacturing method, as shown in FIG. 2, the shield body 15 is laminated along the inner surface of the insulating housing 13 while melting the metal powder 25 by a laser heat source in the molding chamber. The molding chamber is provided with an IR heater for heating. In the powder sintering additive manufacturing method, when the material melted by the laser irradiation 27 is rapidly cooled immediately after fusion with the existing layer, a large internal stress is generated between the layers. Thus, by raising the molding environment temperature with an IR heater, rapid cooling can be suppressed and the generation of internal stress can be prevented. Further, the molding chamber has a nitrogen atmosphere in order to prevent combustion and oxidation.

As a laser mounted on the head 29, a CO ₂ laser or a YAG laser is used. In addition, the head 29 is provided with a material supply nozzle 31. The operation of the head 29 is controlled based on 3D CAD data. This head 29 is simultaneously multi-axis controlled like the main axis of the machine tool. Further, in the powder sintering additive manufacturing method, the laser irradiation amount, the material supply amount, and the like are controlled while being constantly monitored, so that a metal layer with a precise pitch that is not affected by the shape of the modeling surface can be generated. .

  In the powder sintering additive manufacturing method, not only metal powder but also hybrid modeling using resin powder is possible. Not only can the shield body 15 be modeled, but also the insulating housing 13 can be modeled simultaneously.

  In the powder sintering additive manufacturing method, for example, metals such as titanium, stainless steel, nickel alloy, Inconel (registered trademark), aluminum, copper, and tin can be used. In addition, materials such as engineering plastics, ceramics, and sand can be selected according to the application.

  Further, as a three-dimensional modeling for manufacturing a metal model using metal particles, for example, a step of depositing a particle mixture containing a plurality of metal or metal alloy particles and peroxide in a limited region, and an unprocessed part A method of manufacturing a three-dimensional metal object including a step of selectively ejecting a binder system to a predetermined area of the particle mixture by an ink jet method (see JP 2005-120475 A, etc.) You can also.

Next, the operation of the substrate unit case 11 provided with the shield structure according to the first embodiment of the present invention will be described.
In the board unit case 11 according to the first embodiment, after the insulating housing 13 is formed, the shield body 15 is directly formed on the inner surface of the insulating housing 13 by three-dimensional modeling as shown in FIG. The molded shield body 15 is fixed to the inner surface of the insulating housing 13 (attached in a fixed form). The shield body 15 is separated from the board mounting component 23 which is a shielded member, and surrounds the board mounting component 23.

  For this reason, the separate shield component 17 assembled inside the insulating housing 33 such as the conventional substrate unit case 11A shown in FIG. 3 becomes unnecessary, and the supply management and assembly process of the shield component 17 can be reduced.

  Further, the substrate unit case 11 </ b> A in which the separate shield component 17 shown in FIG. 4A is assembled to the insulating housing 33 needs to form the holding shape portion 35 in the insulating housing 33. On the other hand, the substrate unit case 11 in which the shield body 15 is formed by the three-dimensional modeling shown in FIG. 4B does not need to provide these holding shape portions 35 in the insulating housing 13. As a result, the insulating housing 13 can be simplified and downsized as compared with the conventional structure.

Furthermore, it is necessary to form the engaging portion 37 engaged with the holding shape portion 35 of the insulating housing 33 by cutting and raising the separate shielding component 17. For this reason, the shielding performance of the shield component 17 may be reduced. On the other hand, the shield body 15 formed by three-dimensional modeling can be deposited on the entire surface without a gap following the inner surface of the insulating housing 13, and there is no portion where the shield performance is lowered. Thereby, higher shield performance than the conventional shield structure can be obtained.
Therefore, according to the board unit case 11 provided with the shield structure according to the first embodiment, the shield body 15 can be obtained by additionally shaping the desired portion after the formation of the insulating housing 13.

Next, a shield connector 39 provided with a shield structure according to a second embodiment of the present invention will be described.
As shown in FIG. 5A, the shield connector 39 according to the second embodiment includes an insulating housing 41, a terminal fitting 49 that is a shielded member, a shield body 43, and an additional shield portion 45. .

The insulating housing 41 is made of a synthetic resin material having insulating properties.
A terminal fitting 49 which is a shielded member accommodated inside the insulating housing 41 is connected to a conductor at the end of the electric wire 47.
The shield body 43 surrounds the terminal fitting 49 and is fixed to the inner surface of the insulating housing 41 so as to be separated from the terminal fitting 49. The shield body 43 formed separately is fitted and attached to the insulating housing 41. The shield body 43 may be integrally fixed by insert molding in the insulating housing 41.

  The additional shield part 45 is made of a conductive metal material, and is formed to be thick on a part of the shield body 43 by three-dimensional modeling. As shown in FIG. 5B, the shield body 43 is formed in a cylindrical shape so as to surround the entire terminal fitting 49 including the crimping portion 51 connected to the terminal of the electric wire 47. Here, for example, it is assumed that impedance mismatch occurs in a portion of the shield body 43 facing the position of the crimping portion 51. As shown in FIG. 5A, the additional shield part 45 is formed on a part of the shield body 43 facing the position of the crimping part 51. The additional shield part 45 is formed in an annular shape around the axis on the outer peripheral side of the cylindrical shield body 43.

  In the shield connector 39 of the second embodiment, a space 53 corresponding to the additional shield 45 is formed in the insulating housing 41 in advance. Therefore, the additional shield part 45 is formed in a filled state in the space part 53.

Next, the operation of the shield connector 39 provided with the shield structure according to the second embodiment of the present invention will be described.
In the shield connector 39 according to the second embodiment, it is possible to improve the shield performance only in a portion where the high frequency performance is not good. That is, in the shield structure in which the terminal fitting 49 which is a shielded member accommodated inside the insulating housing 41 is shielded by the shield body 43 fixed to the inner surface of the insulating housing 41, an impedance mismatching portion may occur. Yes (see FIG. 5B). In such a case, the thick additional shield part 45 can be formed by three-dimensional modeling at a part of the shield body 43 that needs a more shielding effect. As a result, the shield connector 39 has improved shielding performance, suppressed impedance mismatching, and improved high-frequency performance.

  Conventionally, after the formation of the insulating housing, the impedance mismatching part unique to the shield connector discovered by the measurement after the assembly is completed is difficult to deal with and becomes an NG product. On the other hand, according to the configuration in which the thick additional shield portion 45 is additionally formed by the three-dimensional modeling after the formation of the insulating housing, the NG product resulting from the impedance mismatched portion is not generated. can do.

Further, in the shield connector 39 of the second embodiment, the space 53 is formed in advance in the insulating housing 41 where the impedance mismatch is likely to occur. Therefore, even when the shield body 43 is fixed to the inner surface of the insulating housing 41, the additional shield portion 45 can be formed in the space portion 53.
Note that the additional shield part 45 may be formed so as to protrude toward the inside of the insulating housing 41 when a sufficient distance is secured between the additional shield part 45 and the terminal fitting 49 that is a shielded member.

Further, when the additional shield part 45 is formed in the space part 53 by the powder sintering additive manufacturing method, an irradiation path for performing the laser irradiation 27 may be secured in the insulating housing 41 in advance. This irradiation path is blocked by the same material as the insulating housing 41 by three-dimensional modeling or the like if unnecessary after forming the additional shield part 45 by the laser irradiation 27.
Therefore, according to the shield connector 39 provided with the shield structure according to the second embodiment, the additional shield portion 45 can be obtained by additionally shaping the desired portion after the formation of the insulating housing 41.

Next, the connector 55 according to the reference example will be described.
The connector 55 according to this reference example includes a housing main body 59, a standard lock portion 57, and a three-dimensional modeling portion 61.

  As shown in FIGS. 6 and 7, the housing main body 59 has a plurality of terminal accommodating chambers 63 arranged side by side in the vertical and horizontal directions. A spacer insertion port 65 is formed on the lower surface of the housing main body 59. A spacer (not shown) in which a terminal insertion hole is formed in accordance with the terminal accommodating chamber 63 is attached to the spacer insertion port 65. The spacer restricts the rear removal of the terminal fitting attached to the terminal accommodating chamber 63.

  As shown in FIG. 7, a groove portion 67 in which the standard lock portion 57 is mounted is formed on the upper surface of the housing main body 59. The groove portion 67 is formed in a horizontally long rectangular hole in a front view (see FIG. 9C). The groove 67 is open above the rectangular hole, whereby the locking pieces 69 protrude from the left and right of the rectangular hole toward the center. Therefore, an engagement groove 71 is formed between the locking piece 69 and the bottom surface of the rectangular hole.

  The standard lock part 57 includes an engagement base 73 and a lock arm part 75 extending from the engagement base 73 and having a free end at the tip. On the surface of the lock arm portion 75, a lock protrusion 77 that is engaged with the mating connector protrudes. On the lower surface of the engagement base portion 73, a locking wing portion 79 protruding from both sides of the engagement base portion 73 and inserted into the engagement groove 71 is projected. Therefore, the locking portion 79 of the standard lock portion 57 is inserted into the engagement groove 71 and attached to the housing main body 59.

  Here, the locking wing portion 79 is formed so as to be arranged behind the distal end surface of the engagement base portion 73 by a slight distance (upwardly diagonally to the right in FIG. 7). Therefore, as shown in FIG. 8, when the front end surface of the engagement base 73 coincides with the housing front end surface 81 of the housing body 59, a part of the engagement groove 71 is opened as a cavity 83 in the groove 67.

  As shown in FIG. 9, the three-dimensional model 61 is formed by three-dimensional modeling such as a powder sintering additive manufacturing method in the cavity 83 formed in a state where the housing main body 59 and the standard lock unit 57 are assembled. . The three-dimensional modeling part 61 is formed of the same material as the housing main body 59 and the standard lock part 57. The engagement base portion 73 of the standard lock portion 57 is fixed integrally with the housing main body 59 via the three-dimensional modeling portion 61 by molding the three-dimensional modeling portion 61.

Next, the operation of the connector 55 having the above configuration will be described.
In a conventional connector, when a standardized connector part is fixed to a connector main body, it is common to perform fitting using a rib or a groove. For example, as shown in FIG. 12, a block connector 537 disclosed in Japanese Patent Application Laid-Open No. 9-17496 or the like has a main body connector 539 as a connector unit and a sub connector 541 that are parallel to an adjacent surface by a slide engagement mechanism. Slide on a flat surface to engage. Then, the mating convex portion 547 enters the concave portion 545 communicating with each terminal accommodating chamber 543 to lock the terminal fitting 549. The main body connector 539 includes a lock arm 551 that protrudes upward from the front end at the center in the width direction and extends rearward. The lock arm 551 locks the fitting with the mating connector. On the upper surface of the main body connector 539, two engaging protrusions 553 are formed in the width direction on the front end side and the rear end side. In the sub-connector 541, an engagement groove 555 corresponding to the engagement protrusion 553 is formed on the lower surface thereof.
In the structure in which the engagement ridges 553 and the engagement grooves 555 are engaged, such as the block connector 537, the assembly play is generated due to the dimensional variation of each part, or the wrap amount is conversely. There is a possibility that problems such as inability to assemble can occur.

  On the other hand, in the connector 55 having the above-described configuration, the three-dimensional structure 61 is formed in the cavity 83, so that the three-dimensional structure 61 becomes a connection fixing portion between the housing main body 59 and the engagement base 73. This connection fixing portion is formed by melting the interface between the housing main body 59 and the engagement base portion 73. Therefore, in the conventional bonding structure using an adhesive or the like, the interface may be peeled off by thermal shock, but according to the connection structure formed by the three-dimensional structure 61 described above, peeling at such an interface may be difficult to occur. it can.

Here, the features of the above-described embodiment of the shield structure according to the present invention will be briefly summarized and listed below.
[1] Insulating housing (unit case) 13;
A shielded member (substrate mounting component) 23 housed inside the insulating housing (unit case) 13;
A shield body that surrounds the shielded member (substrate mounting component) 23 and is spaced apart from the shielded member (substrate mounting component) 23 and molded and fixed to the inner surface of the insulating housing (unit case) 13 by three-dimensional modeling. 15 and
Shield structure characterized by comprising.
[2] Insulating housing 41;
A shielded member (terminal fitting) 49 housed inside the insulating housing 41;
A shield body 43 that surrounds the shielded member (terminal fitting) 49 and is fixed to the inner surface of the insulating housing 41 apart from the shielded member (terminal fitting) 49;
An additional shield part 45 formed thickly by three-dimensional modeling on a part of the shield body 43;
Shield structure characterized by comprising.
[3] The shield structure according to claim 2,
A space structure 53 corresponding to the additional shield part 45 is formed in the insulating housing 41 in advance.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

11 ... Board unit case 13 ... Unit case (insulating housing)
15 ... Shield body 21 ... Circuit board 23 ... Board mounting component (shielded member)

Claims (3)

An insulating housing;
A board-mounted component mounted on a circuit board , housed inside the insulating housing;
A shield body that is a molded article by three-dimensional modeling , surrounding the board-mounted component and being fixed to the inner surface of the insulating housing apart from the board-mounted component ;
Shield structure characterized by comprising. The shield structure according to claim 1,
The insulating housing has a bottomed cylindrical shape with an upper opening,
The board mounting component is housed inside the insulating housing so that the circuit board covers the opening of the insulating housing,
The shield structure has a bottomed cylindrical shape that opens upward, and is fixed to substantially the entire inner surface of the insulating housing . It is a manufacturing method of the shield structure according to claim 1 or 2 ,
The method for manufacturing a shield structure, wherein the shield body and the insulating housing are simultaneously modeled by the three-dimensional modeling .

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