JP6277651B2 - Winding type electronic component manufacturing method and winding type electronic component manufacturing apparatus - Google Patents

Winding type electronic component manufacturing method and winding type electronic component manufacturing apparatus Download PDF

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JP6277651B2
JP6277651B2 JP2013204264A JP2013204264A JP6277651B2 JP 6277651 B2 JP6277651 B2 JP 6277651B2 JP 2013204264 A JP2013204264 A JP 2013204264A JP 2013204264 A JP2013204264 A JP 2013204264A JP 6277651 B2 JP6277651 B2 JP 6277651B2
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長谷川　信
信 長谷川
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Description

本発明は、巻線型電子部品の製造方法及び巻線型電子部品の製造装置に関する。   The present invention relates to a method for manufacturing a wound electronic component and an apparatus for manufacturing a wound electronic component.

従来の巻線型電子部品の製造方法として、特許文献１に記載の巻線型電子部品の製造方法が知られている。この種の製造方法では、図１１に示すように、中心基軸５２２を取り囲む４本の巻芯軸５３１〜５３４に対して巻線５２０を巻回する。このとき、図１２に示すように、巻芯軸５３１〜５３４が、中心基軸５２２から離間又は接近を繰り返すことにより、巻線５２０によって構成されるコイル５６０（図１３参照）のコイル径を部分々々で変える。その後、コイル５６０を巻芯軸５３１〜５３４から取り外し、図１３に示すように、該コイル５６０の内周に巻線型電子部品のコア５８７を挿入する。   As a conventional method for manufacturing a wire wound electronic component, a method for manufacturing a wire wound electronic component described in Patent Document 1 is known. In this type of manufacturing method, as shown in FIG. 11, the winding 520 is wound around the four core shafts 531 to 534 surrounding the central base shaft 522. At this time, as shown in FIG. 12, the core diameters 531 to 534 are repeatedly separated or approached from the central base shaft 522, so that the coil diameter of the coil 560 formed by the winding 520 (see FIG. 13) is partially increased. Change at different times. Thereafter, the coil 560 is removed from the core shafts 531 to 534, and a core 587 of a wound electronic component is inserted into the inner periphery of the coil 560 as shown in FIG.

ところで、上記の巻線型電子部品の製造方法では、巻芯部５３１〜５３４からコイル５６０を取り外し、コア５８７を挿入するという工程を含むため、巻線５２０とコア５８７との間に生じる隙間の大きさが変化する可能性がある。これにより、上記の巻線型電子部品の製造方法では、巻線型電子部品のＬ値及びＱ値の管理が困難となる可能性がある。   By the way, the above-described method for manufacturing a wound electronic component includes the steps of removing the coil 560 from the core portions 531 to 534 and inserting the core 587, and therefore, the size of the gap generated between the winding 520 and the core 587. May change. As a result, in the above-described method for manufacturing a wound electronic component, it may be difficult to manage the L value and the Q value of the wound electronic component.

特開２０１２−１９９２８１号公報JP 2012-199281 A

本発明の目的は、巻線型電子部品における、巻線とコアとの間に生じる隙間を制御することができる巻線型電子部品の製造方法及びその製造装置を提供することである。   An object of the present invention is to provide a method for manufacturing a wire wound electronic component and a manufacturing apparatus for the wire wound electronic component capable of controlling a gap generated between a winding and a core in the wire wound electronic component.

本発明の第１の形態に係る巻線型電子部品の製造方法は、
巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造方法であって、
前記コアに対して前記巻線を巻回する巻回工程と、
前記コアに巻回された前記巻線を切断する巻線切断工程と、
前記コアを切断するコア切断工程と、
を備え、
前記巻回工程において、前記巻線の巻回中に、前記コアと該巻線との間に挿入部材を挿入し、抜去し、
前記巻線切断工程において、前記巻線の、前記巻回工程において前記コアと該巻線との間に挿入部材が挿入された部分を切断し、
前記コア切断工程において、前記コアの、前記巻回工程において前記コアと該巻線との間に挿入部材が挿入された部分を切断すること、
を特徴とする。
本発明の第２の形態に係る巻線型電子部品の製造方法は、
巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造方法であって、
前記コアに対して前記巻線を巻回する巻回工程であって、前記巻線の巻回中に、前記コアと該巻線との間に挿入部材を挿入し、抜去する巻回工程と、
前記巻線において前記挿入部材が挿入されたことによってコイル径が大きくなった部分が、樹脂の外部に飛び出すようにモールディングするモールディング工程と、
を備えること、
を特徴とする。 A method for manufacturing a wire wound electronic component according to the first aspect of the present invention includes:
A method of manufacturing a wound electronic component having a winding and a core around which the winding is wound,
A winding step of winding the winding around the core ;
A winding cutting step of cutting the winding wound around the core;
A core cutting step of cutting the core;
With
In the winding step, during winding of the winding, an insertion member is inserted between the core and the winding, and is removed .
In the winding cutting step, cutting the portion of the winding where the insertion member is inserted between the core and the winding in the winding step,
In the core cutting step, cutting the portion of the core where the insertion member is inserted between the core and the winding in the winding step;
It is characterized by.
A method for manufacturing a wound electronic component according to the second aspect of the present invention includes:
A method of manufacturing a wound electronic component having a winding and a core around which the winding is wound,
A winding step of winding the winding around the core, the winding step of inserting and removing an insertion member between the core and the winding during winding of the winding; and ,
A molding step in which a portion having a larger coil diameter due to insertion of the insertion member in the winding is molded so as to jump out of the resin,
Providing
It is characterized by.

本発明の第３の形態に係る巻線型電子部品の製造装置は、
巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造装置であって、
前記コアに前記巻線を巻回する巻回機構と、
前記巻回機構の動作中に、前記コアと前記巻線との間に挿入部材を挿入、抜去する挿抜機構と、
前記巻線の、前記巻回機構が前記コアと該巻線との間に挿入部材を挿入した部分を切断する巻線切断機構と、
前記コアの、前記巻回機構が前記コアと該巻線との間に挿入部材を挿入した部分を切断するコア切断機構と、
を備えること、
を特徴とする。
本発明の第４の形態に係る巻線型電子部品の製造装置は、
巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造装置であって、
前記コアに前記巻線を巻回する巻回機構と、
前記巻回機構の動作中に、前記コアと前記巻線との間に挿入部材を挿入、抜去する挿抜機構と、
前記巻線において前記挿入部材が挿入されたことによってコイル径が大きくなった部分が、樹脂の外部に飛び出すようにモールディングするモールディング機構と、
を備えること、
を特徴とする。 An apparatus for manufacturing a wound electronic component according to a third embodiment of the present invention includes:
A winding type electronic component manufacturing apparatus having a winding and a core around which the winding is wound,
A winding mechanism for winding the winding around the core;
An insertion / extraction mechanism for inserting / extracting an insertion member between the core and the winding during operation of the winding mechanism;
A winding cutting mechanism for cutting a portion of the winding in which the winding mechanism inserts an insertion member between the core and the winding;
A core cutting mechanism for cutting a portion of the core where the winding mechanism has inserted an insertion member between the core and the winding;
Providing
It is characterized by.
An apparatus for manufacturing a wound electronic component according to the fourth aspect of the present invention includes:
A winding type electronic component manufacturing apparatus having a winding and a core around which the winding is wound,
A winding mechanism for winding the winding around the core;
An insertion / extraction mechanism for inserting / extracting an insertion member between the core and the winding during operation of the winding mechanism;
A molding mechanism that molds the portion of the winding whose coil diameter is increased by inserting the insertion member into the outside of the resin,
Providing
It is characterized by.

本発明に係る巻線型電子部品の製造方法及びその製造装置では、巻線の巻回中に、巻線型電子部品のコアと該巻線との間に挿入部材を挿入し、抜去する。これにより、前記巻線により構成されるコイルのコイル径を部分々々で変えることが可能である。これに加え、巻線を巻線型電子部品のコアに直接巻き回すため、特許文献１に記載の巻線型電子部品の製造方法のような、巻線により構成されるコイルを取り外し、コアを挿入するという工程がない。従って、本発明に係る巻線型電子部品の製造方法及びその製造装置では、前記巻線と前記コアとの間に生じる隙間を制御することができ、巻線型電子部品のＬ値及びＱ値の管理が容易である。   In the method and apparatus for manufacturing a wound electronic component according to the present invention, an insertion member is inserted and removed between the core of the wound electronic component and the winding during winding. Thereby, it is possible to change the coil diameter of the coil comprised by the said winding part by part. In addition to this, in order to wind the winding directly around the core of the wound electronic component, the coil constituted by the winding is removed and the core is inserted as in the method of manufacturing a wound electronic component described in Patent Document 1. There is no process. Therefore, in the method and apparatus for manufacturing a wound electronic component according to the present invention, the gap generated between the winding and the core can be controlled, and the L value and Q value of the wound electronic component can be managed. Is easy.

本発明によれば、巻線型電子部品における、巻線とコアとの間に生じる隙間を制御することができる。   According to the present invention, it is possible to control a gap generated between a winding and a core in a wound electronic component.

第１実施例である巻線型電子部品の製造方法により製造された巻線型電子部品の外観図である。It is an external view of the winding type electronic component manufactured by the manufacturing method of the winding type electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法により製造された巻線型電子部品の内部を示した図である。It is the figure which showed the inside of the winding type electronic component manufactured by the manufacturing method of the winding type electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type | mold electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type | mold electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type | mold electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type | mold electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法により製造される巻線型電子部品の製造途中を示す図である。It is a figure which shows the middle of manufacture of the winding type electronic component manufactured by the manufacturing method of the winding type electronic component which is 1st Example. 第１実施例である巻線型電子部品の製造方法により製造される巻線型電子部品の製造途中をあらわす図である。It is a figure showing the middle of manufacture of a winding type electronic component manufactured by a manufacturing method of a winding type electronic component which is the 1st example. 比較例である巻線型電子部品を示す図である。It is a figure which shows the winding type | mold electronic component which is a comparative example. 第２実施例である巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type | mold electronic component which is 2nd Example. 特許文献１に記載の巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type electronic component of patent document 1. FIG. 特許文献１に記載の巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type electronic component of patent document 1. FIG. 特許文献１に記載の巻線型電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the winding type electronic component of patent document 1. FIG.

（巻線型電子部品の構成、図１及び図２参照）
巻線型電子部品１は、図１に示すように、略直方体状の形状を成しており、樹脂部材１０の表面に外部電極１２，１４が設けられている。また、図２に示すように、巻線型電子部品１は、その内部に、コア１６、巻線２０を備えている。以下で、コア１６が延在している方向をｘ軸方向と定義する。また、ｘ軸方向から平面視したとき、巻線型電子部品１の２辺に沿った方向をｙ軸方向及びｚ軸方向と定義する。なお、ｘ軸、ｙ軸及びｚ軸は互いに直交している。 (Configuration of wire wound electronic component, see FIGS. 1 and 2)
As shown in FIG. 1, the wound electronic component 1 has a substantially rectangular parallelepiped shape, and external electrodes 12 and 14 are provided on the surface of the resin member 10. As shown in FIG. 2, the wound electronic component 1 includes a core 16 and a winding 20 therein. Hereinafter, the direction in which the core 16 extends is defined as the x-axis direction. Further, when viewed in plan from the x-axis direction, directions along two sides of the wound electronic component 1 are defined as a y-axis direction and a z-axis direction. Note that the x-axis, y-axis, and z-axis are orthogonal to each other.

樹脂部材１０は、エポキシ系の樹脂により構成され、図２に示すように、コア１６及び巻線２０を覆うように設けられた略直方体状の部材である。なお、樹脂部材はエポキシ系の樹脂に限らず、例えば、金属磁性粉入り樹脂を用いても同様の効果が得られる。   The resin member 10 is made of an epoxy-based resin, and is a substantially rectangular parallelepiped member provided so as to cover the core 16 and the winding 20 as shown in FIG. The resin member is not limited to an epoxy resin, and the same effect can be obtained by using, for example, a resin containing metal magnetic powder.

外部電極１２，１４は、Ｎｉ−Ｃｒ、Ｎｉ−Ｃｕ，Ｎｉ等のＮｉ系合金やＡｇ、Ｃｕ、Ｓｎ等により構成されている。外部電極１２は、図１に示すように、主として、樹脂部材１０のｚ軸方向の負方向側の底面Ｓ１における、ｘ軸方向の負方向側の端部近傍に設けられている。そして、外部電極１２の一部が、樹脂部材１０のｘ軸方向の負方向側の端面Ｓ２にはみ出すように設けられている。また、外部電極１４は、主として、樹脂部材１０の底面Ｓ１における、ｘ軸方向の正方向側の端部近傍に設けられている。そして、外部電極１４の一部が、樹脂部材１０のｘ軸方向の正方向側の端面Ｓ３にはみ出すように設けられている。   The external electrodes 12 and 14 are made of a Ni-based alloy such as Ni—Cr, Ni—Cu, or Ni, Ag, Cu, Sn, or the like. As shown in FIG. 1, the external electrode 12 is mainly provided in the vicinity of the end portion on the negative direction side in the x-axis direction on the bottom surface S <b> 1 on the negative direction side in the z-axis direction of the resin member 10. A part of the external electrode 12 is provided so as to protrude from the end surface S2 of the resin member 10 on the negative direction side in the x-axis direction. The external electrode 14 is mainly provided in the vicinity of the end on the positive direction side in the x-axis direction on the bottom surface S <b> 1 of the resin member 10. A part of the external electrode 14 is provided so as to protrude from the end surface S3 of the resin member 10 on the positive direction side in the x-axis direction.

コア１６は、フェライト、金属磁性体、アルミナ等の磁性材料、絶縁材料から構成され、図２に示すように、四角柱状の部材である。なお、コア１６の形状は、角柱状に限らず、円柱状であってもよい。   The core 16 is made of a magnetic material such as ferrite, a metal magnetic material, alumina, or an insulating material, and is a quadrangular columnar member as shown in FIG. The shape of the core 16 is not limited to a prismatic shape, and may be a cylindrical shape.

巻線２０は、コア１６に巻き回されている導線であり、銅や銀といった導電性材料を主成分とする芯線が、ポリウレタン等の絶縁材料により被覆され、これがポリアミド系の樹脂などの熱融着層でコーティングされることにより構成されている。また、巻線２０のｘ軸方向の負方向側の一端は、樹脂部材１０の表面（底面Ｓ１）に引き出され、底面Ｓ１において外部電極１２と接続されている。さらに、巻線２０のｘ軸方向の正方向側の他端も、樹脂部材１０の表面（底面Ｓ１）に引き出され、底面Ｓ１において外部電極１４と接続されている。   The winding 20 is a conducting wire wound around the core 16, and a core wire mainly composed of a conductive material such as copper or silver is covered with an insulating material such as polyurethane, and this is a heat melting material such as a polyamide-based resin. It is constituted by being coated with a deposition layer. Further, one end of the winding 20 on the negative side in the x-axis direction is drawn out to the surface (bottom surface S1) of the resin member 10, and is connected to the external electrode 12 at the bottom surface S1. Further, the other end of the winding 20 on the positive side in the x-axis direction is also drawn out to the surface (bottom surface S1) of the resin member 10, and is connected to the external electrode 14 at the bottom surface S1.

（第１実施例 図３〜図９参照）
以下に、第１実施例である巻線型電子部品の製造方法について説明する。 (Refer to FIG. 3 to FIG. 9 in the first embodiment)
Below, the manufacturing method of the winding type electronic component which is 1st Example is demonstrated.

まず、コア１６の材料となるフェライトを主成分とした粉末を準備する。そして、準備したフェライト粉末と結合剤とを混練機で均等に混練する。混練されたフェライト粉末と結合剤との混合材料を押し出し成型機に投入する。これにより、混練されたフェライト粉末と結合剤との混合材料は、棒状の部材に成形される。そして、棒状に成形されたフェライト粉末と結合剤との混合材料を焼成することにより、巻線型電子部１のコア１６の集合体である棒状部材Ｂが完成する。   First, a powder composed mainly of ferrite as a material of the core 16 is prepared. Then, the prepared ferrite powder and the binder are kneaded evenly with a kneader. The mixed material of the kneaded ferrite powder and the binder is put into an extrusion molding machine. Thereby, the mixed material of the kneaded ferrite powder and the binder is formed into a rod-shaped member. And the rod-shaped member B which is an aggregate | assembly of the core 16 of the coil | winding type | mold electronic part 1 is completed by baking the mixed material of the ferrite powder and binder which were shape | molded in rod shape.

次に、棒状部材Ｂに巻線２０を巻回する。巻線２０を巻きつける工程では、まず、棒状部材Ｂを製造装置２に取り付ける。製造装置２は、巻回機構２２及び挿抜機構２４から構成されている。   Next, the winding 20 is wound around the rod-shaped member B. In the step of winding the winding 20, first, the rod-shaped member B is attached to the manufacturing apparatus 2. The manufacturing apparatus 2 includes a winding mechanism 22 and an insertion / extraction mechanism 24.

図３に示すように、巻回機構２２は、棒状部材Ｂを回転させる回転軸Ａ１と、回転軸Ａ１に取り付けられた棒状部材Ｂに向かって、巻線２０を供給するワイヤノズルＮから構成されている。回転軸Ａ１に棒状部材Ｂを取り付けると、回転軸Ａ１の回転中心Ｃ１と棒状部材Ｂの中心軸Ｃ２が一致する。従って、回転軸Ａ１に取り付けられた棒状部材Ｂは、中心軸Ｃ２を回転中心として回転する。   As shown in FIG. 3, the winding mechanism 22 includes a rotating shaft A1 that rotates the rod-shaped member B, and a wire nozzle N that supplies the winding 20 toward the rod-shaped member B attached to the rotating shaft A1. ing. When the rod-shaped member B is attached to the rotation shaft A1, the rotation center C1 of the rotation shaft A1 and the center axis C2 of the rod-shaped member B coincide. Therefore, the rod-shaped member B attached to the rotation axis A1 rotates around the center axis C2.

図４に示すように、回転軸Ａ１によって棒状部材Ｂが回転すると同時に、ワイヤノズルＮから棒状部材Ｂに向かって巻線２０が供給される。これに加え、棒状部材Ｂは、回転軸Ａ１から中心軸Ｃ２と平行な方向に一定の速度Ｖで押し出される。これにより、棒状部材Ｂに巻線２０が巻回される。   As shown in FIG. 4, the winding member 20 is supplied from the wire nozzle N toward the rod-like member B at the same time as the rod-like member B is rotated by the rotation axis A <b> 1. In addition to this, the rod-shaped member B is pushed out at a constant speed V in a direction parallel to the central axis C2 from the rotation axis A1. As a result, the winding 20 is wound around the rod-shaped member B.

また、棒状部材Ｂに巻線２０が巻回される際、つまり、巻回機構２２の動作中に、挿抜機構２４が動作する。挿抜機構２４は、棒状の部材であるからげ軸（挿入部材）３０、及び該からげ軸３０を駆動する図示しない駆動部から構成されている。   Further, when the winding 20 is wound around the rod-shaped member B, that is, during the operation of the winding mechanism 22, the insertion / extraction mechanism 24 operates. The insertion / extraction mechanism 24 includes a barb shaft (insertion member) 30 that is a rod-shaped member and a drive unit (not shown) that drives the barb shaft 30.

からげ軸３０は、回転軸Ａ１において中心軸Ｃ２から離れた位置に設けられた中心軸Ｃ２に平行な棒であり、回転軸Ａ１とともに中心軸Ｃ２を回転中心として、棒状部材Ｂの周囲を回転する。また、からげ軸３０は、図示しない駆動部によって、図５に示すように、中心軸Ｃ２と平行な方向に回転軸Ａ１から突出させることが可能である。また、からげ軸３０の先端は、からげ軸３０が突出した状態において、ワイヤノズルＮよりも棒状部材Ｂの押し出し方向の下流側に位置している。さらに、図６に示すように、図示しない駆動部によって、突出したからげ軸３０を回転軸Ａ１内に引っ込めることも可能である。からげ軸３０の先端は、からげ軸３０が引っ込んだ状態において、ワイヤノズルＮよりも棒状部材Ｂの押し出し方向の上流側に位置している。   The lashing shaft 30 is a bar parallel to the central axis C2 provided at a position away from the central axis C2 on the rotational axis A1, and rotates around the rod-shaped member B around the central axis C2 together with the rotational axis A1. To do. Further, as shown in FIG. 5, the lashing shaft 30 can be protruded from the rotation axis A1 in a direction parallel to the central axis C2, by a drive unit (not shown). Further, the tip of the lashing shaft 30 is located downstream of the wire nozzle N in the pushing direction of the rod-shaped member B in a state where the lashing shaft 30 protrudes. Furthermore, as shown in FIG. 6, it is also possible to retract the protruding bald shaft 30 into the rotation axis A1 by a drive unit (not shown). The tip of the lashing shaft 30 is located upstream of the wire nozzle N in the pushing direction of the rod-shaped member B when the lashing shaft 30 is retracted.

以上のように構成された挿抜機構２４では、巻回機構２２の動作中に、からげ軸３０が、所定のタイミングで中心軸Ｃ２と平行な方向に突出し、巻線２０と棒状部材Ｂとの間に挿入される。このとき、巻線２０は棒状部材Ｂ及びからげ軸３０に巻き回されるため、巻線２０によって構成されるコイルのコイル径は、からげ軸３０が突出する前と比較して大きくなる。その後、所定のタイミングでからげ軸３０が引っ込められることにより、巻線２０と棒状部材Ｂとの間から、からげ棒３０が抜去され、巻線２０によって構成されるコイルのコイル径は元に戻る。巻回機構２２の動作中に、挿抜機構２４が上述のような動作を繰り返すことによって、巻線２０により構成されるコイルのコイル径を部分々々で変えることが可能である。例えば、からげ軸３０を抜去した状態で巻線２０を所定回数（本実施形態では、４回）だけ巻き付ける工程と、からげ軸３０を挿入した状態で巻線２０を少なくとも１回（本実施形態では、１回）だけ巻き付ける工程とを交互に繰り返す。   In the insertion / extraction mechanism 24 configured as described above, during the operation of the winding mechanism 22, the lashing shaft 30 projects in a direction parallel to the central axis C2 at a predetermined timing, and the winding 20 and the rod-shaped member B Inserted between. At this time, since the winding 20 is wound around the rod-shaped member B and the lash shaft 30, the coil diameter of the coil constituted by the winding 20 is larger than before the lash shaft 30 protrudes. After that, by pulling the bald shaft 30 at a predetermined timing, the bald rod 30 is removed from between the winding 20 and the rod-shaped member B, and the coil diameter of the coil constituted by the winding 20 is originally Return. During the operation of the winding mechanism 22, the insertion / extraction mechanism 24 repeats the above-described operation, whereby the coil diameter of the coil constituted by the winding 20 can be changed in parts. For example, a step of winding the winding 20 a predetermined number of times (in this embodiment, four times) with the curled shaft 30 removed, and at least once with the winding shaft 30 inserted (this embodiment) In the embodiment, the step of winding only once is alternately repeated.

また、巻回機構２２の動作中に、ヒーターによって、棒状部材Ｂ及び該棒状部材Ｂに巻回された巻線２０に対して、熱風が当てられる。これにより、熱融着層でコーティングされた巻線２０が、棒状部材Ｂに巻回されると略同時に、棒状部材Ｂに固定される。   Further, during the operation of the winding mechanism 22, hot air is applied to the rod-shaped member B and the winding 20 wound around the rod-shaped member B by a heater. Thereby, when the winding wire 20 coated with the heat sealing layer is wound around the rod-shaped member B, it is fixed to the rod-shaped member B substantially simultaneously.

巻線２０の巻回が終了した棒状部材Ｂは、図７に示すように、樹脂１００によってモールディングされる。このとき、巻線２０の巻回された棒状部材Ｂは、巻線２０における、からげ軸３０が挿入されたことによってコイル径が大きくなった部分αが、樹脂の外部に飛び出すようにモールディングされる。   The rod-like member B after the winding of the winding 20 is molded by the resin 100 as shown in FIG. At this time, the rod-shaped member B around which the winding 20 is wound is molded so that a portion α of the winding 20 whose coil diameter is increased by inserting the lash shaft 30 jumps out of the resin. The

樹脂モールディングが終了すると、樹脂に覆われた棒状部材Ｂ及び巻線２０を切断し、図８に示すような、外部電極が未形成の巻線型電子部品１を得る。具体的には、まず、樹脂の外部に飛び出した巻線２０の部分αを２つに切断する。さらに、２つに切断された部分αにおける樹脂１００の外部にはみ出している余剰部分を切断する。そして、樹脂１００に覆われた棒状部材Ｂを、図７に示される中心軸Ｃ２と直交する面に平行な面Ｓ４で切断する。なお、切断したことにより現れる切断面は、巻線型電子部品１における樹脂部材１０のｘ軸方向に位置する端面Ｓ２，Ｓ３である。   When the resin molding is completed, the rod-shaped member B and the winding 20 covered with the resin are cut, and the wound electronic component 1 with no external electrodes as shown in FIG. 8 is obtained. Specifically, first, the portion α of the winding 20 protruding to the outside of the resin is cut into two. Furthermore, the surplus part which protrudes outside the resin 100 in the part α cut in two is cut. And the rod-shaped member B covered with the resin 100 is cut | disconnected by the surface S4 parallel to the surface orthogonal to the central axis C2 shown by FIG. In addition, the cut surface which appears by cutting | disconnection is end surface S2, S3 located in the x-axis direction of the resin member 10 in the winding type electronic component 1. FIG.

最後に、外部電極１２，１４を形成する。具体的には、外部電極が未形成の巻線型電子部品１における巻線２０の端面が露出している面、つまり、樹脂部材１０の底面Ｓ１にＡｇペーストを塗布する。次に、付着したＡｇペーストを乾燥させ、焼成することによって、底面Ｓ１に下地電極であるＡｇ膜を形成する。さらに、電気めっきなどにより、Ｎｉ系合金の金属膜をＡｇ膜上に形成する。以上により、外部電極１２，１４が形成され、巻線型電子部品１が完成する。   Finally, the external electrodes 12 and 14 are formed. Specifically, Ag paste is applied to the surface where the end face of the winding 20 in the wound electronic component 1 in which the external electrode is not formed, that is, the bottom surface S1 of the resin member 10 is exposed. Next, the attached Ag paste is dried and baked to form an Ag film as a base electrode on the bottom surface S1. Furthermore, a Ni-based alloy metal film is formed on the Ag film by electroplating or the like. As a result, the external electrodes 12 and 14 are formed, and the wound electronic component 1 is completed.

（効果）
第１実施例である巻線型電子部品１の製造方法及び製造装置２では、コア（棒状部材Ｂ）１６に巻線２０を巻回している最中に、該コア１６と該巻線２０との間にからげ軸３０を挿入し、抜去する。これにより、巻線２０により構成されるコイルのコイル径を部分々々で変えることが可能である。これに加え、巻線２０を巻線型電子部品１のコア１６に直接巻回するため、特許文献１に記載の巻線型電子部品の製造方法のような、巻線により構成されるコイルを取り外し、コアを挿入するという工程がない。従って、巻線型電子部品１の製造方法及び製造装置１では、巻線２０とコア１６との間に生じる隙間を制御することができ、巻線型電子部品１のＬ値及びＱ値の管理が容易である。 (effect)
In the manufacturing method and the manufacturing apparatus 2 of the wound electronic component 1 according to the first embodiment, the winding of the core 16 and the winding 20 is performed while the winding 20 is being wound around the core (rod-like member B) 16. The bald shaft 30 is inserted in between and removed. Thereby, the coil diameter of the coil comprised by the coil | winding 20 can be changed in parts. In addition to this, in order to directly wind the winding 20 around the core 16 of the wound electronic component 1, the coil constituted by the winding is removed as in the method for manufacturing a wound electronic component described in Patent Document 1, There is no process of inserting the core. Therefore, in the manufacturing method and the manufacturing apparatus 1 of the wound electronic component 1, the gap generated between the winding 20 and the core 16 can be controlled, and the L value and Q value of the wound electronic component 1 can be easily managed. It is.

また、巻線型電子部品１の製造方法では、コア１６の集合体である１本の棒状部材Ｂに対して巻線２０を巻回して、これを切断することにより、複数の巻線型電子部品１を得ることができる。従って、巻線型電子部品１の製造方法は、複数の個別のコア１６に対して巻線２０を巻回する場合と比較して、巻線２０の巻回工程を簡素にすることができる。   In the method for manufacturing the wound electronic component 1, the winding 20 is wound around one rod-like member B that is an assembly of the cores 16, and this is cut, whereby a plurality of the wound electronic components 1. Can be obtained. Therefore, the method for manufacturing the wound electronic component 1 can simplify the winding process of the winding 20 as compared with the case where the winding 20 is wound around a plurality of individual cores 16.

さらに、巻線型電子部品１の製造方法では、巻線２０における、からげ軸３０が挿入されたことによってコイル径が大きくなった部分αが、樹脂１００の外部に飛び出すように、巻線２０及び棒状部材Ｂをモールディングしている。そして、巻線２０におけるコイル径が大きくなった部分αを切断することで、底面Ｓ１に巻線２０の端部を引き出している。これにより、巻線型電子部品１の製造方法では、外部電極１２，１４を底面Ｓ１に設けることができる。つまり、外部電極１２，１４が設けられる位置は端面Ｓ２，Ｓ３でないため、巻線２０によって構成されるコイルから発生する磁束を、外部電極１２，１４が遮蔽することがない。   Further, in the method of manufacturing the wound electronic component 1, the winding 20 and the winding 20 are arranged such that a portion α of the winding 20 whose coil diameter is increased due to the insertion of the curled shaft 30 jumps out of the resin 100. The rod-shaped member B is molded. And the edge part of the coil | winding 20 is pulled out to the bottom face S1 by cut | disconnecting the part (alpha) in which the coil diameter in the coil | winding 20 became large. Thereby, in the manufacturing method of the winding type electronic component 1, the external electrodes 12 and 14 can be provided in the bottom face S1. That is, since the positions where the external electrodes 12 and 14 are provided are not the end faces S2 and S3, the external electrodes 12 and 14 do not shield the magnetic flux generated from the coil constituted by the windings 20.

ところで、仮に、巻回機構２２の動作中にからげ軸３０を挿抜せずに、棒状部材Ｂに巻線２０を巻回し、コイル径が一定のコイルを作製したとする。この場合、樹脂モールディング後に、樹脂に覆われた棒状部材Ｂ及び巻線２０を切断すると、図９に示すように、巻線２０は、底面Ｓ１に引き出されないため、端面Ｓ２，Ｓ３に露出することになる。そうすると、巻線２０における端面Ｓ２，Ｓ３に露出した部分βが、巻線２０によって構成されるコイルから発生する磁束を遮蔽し、巻線型電子部品１の磁気特性を低下させることになる。一方、第１実施例に係る製造方法では、底面Ｓ１に巻線２０の端部を引き出しているため、巻線２０の端部が、端面Ｓ２，Ｓ３に露出することがなく、巻線２０によって構成されるコイルから発生する磁束を遮蔽しない。従って、第１実施例に係る製造方法では、巻線型電子部品１における磁気特性の低下を抑制することができる。   By the way, it is assumed that the winding 20 is wound around the rod-shaped member B without inserting and removing the curled shaft 30 during the operation of the winding mechanism 22 to produce a coil having a constant coil diameter. In this case, when the rod-shaped member B and the winding 20 covered with the resin are cut after the resin molding, as shown in FIG. 9, the winding 20 is not pulled out to the bottom surface S1, and thus is exposed to the end surfaces S2 and S3. It will be. If it does so, the part (beta) exposed to end surface S2, S3 in the coil | winding 20 will shield the magnetic flux which generate | occur | produces from the coil comprised by the coil | winding 20, and will reduce the magnetic characteristic of the winding type electronic component 1. FIG. On the other hand, in the manufacturing method according to the first embodiment, since the end of the winding 20 is drawn out to the bottom surface S1, the end of the winding 20 is not exposed to the end surfaces S2 and S3. It does not shield magnetic flux generated from the configured coil. Therefore, in the manufacturing method according to the first embodiment, it is possible to suppress a decrease in magnetic characteristics in the wound electronic component 1.

また、巻線型電子部品１の製造方法では、巻線２０における、からげ軸３０が挿入されたことによってコイル径が大きくなった部分αは、からげ軸３０が引っ込むと支えを失った状態となる。この状態で、巻線２０の巻回による引張力が、コイル径が大きくなった部分αに加わると、該部分αの形状は崩れてしまう。しかし、巻線型電子部品１の製造方法では、巻線２０の巻回中に、熱融着層でコーティングされた巻線２０に対して、ヒーターで熱風を当てている。これにより、棒状部材Ｂに巻回されると略同時に、棒状部材Ｂに固定される。結果として、巻線２０は、巻線２０の巻回による引張力が、コイル径が大きくなった部分αに伝わることを防止できるため、該部分αの形状を保持することができる。   In addition, in the method for manufacturing the wound electronic component 1, the portion α of the winding 20 in which the coil diameter is increased due to the insertion of the lash shaft 30 has lost support when the lash shaft 30 is retracted. Become. In this state, when a tensile force due to the winding of the winding 20 is applied to the portion α where the coil diameter is increased, the shape of the portion α is broken. However, in the method for manufacturing the wound electronic component 1, during the winding of the winding 20, hot air is applied to the winding 20 coated with the heat fusion layer with a heater. Thereby, when wound around the rod-shaped member B, it is fixed to the rod-shaped member B substantially simultaneously. As a result, the winding 20 can prevent the tensile force due to winding of the winding 20 from being transmitted to the portion α where the coil diameter is increased, so that the shape of the portion α can be maintained.

（第２実施例 図１０参照）
第２実施例である巻線型電子部品１の製造方法では、棒状部材Ｂに巻線２０を巻回する際に、図１０に示すように、棒状部材Ｂを巻回機構２２の回転軸Ａ１で支持するだけでなく、棒状部材Ｂの一端を回転軸Ａ１と同期して回転する回転軸Ａ２を有する支持機構２３で支持する。また、支持機構２３は、棒状部材Ｂが、回転軸Ａ１から中心軸Ｃ２と平行な方向に一定の速度で押し出される動きと同期して、棒状部材Ｂの一端を支持しつつ、中心軸Ｃ２と平行な方向に一定の速度で移動する。第２実施例に係る製造方法における他の構成は、第１実施例に係る製造方法と同様である。従って、第２実施例に係る製造方法において支持機構２３以外の説明は第１実施例に係る製造方法での説明のとおりである。 (Refer to FIG. 10 in the second embodiment)
In the method of manufacturing the wound electronic component 1 according to the second embodiment, when the winding 20 is wound around the rod-shaped member B, the rod-shaped member B is rotated by the rotation axis A1 of the winding mechanism 22 as shown in FIG. In addition to supporting, one end of the rod-like member B is supported by a support mechanism 23 having a rotation axis A2 that rotates in synchronization with the rotation axis A1. In addition, the support mechanism 23 supports the one end of the rod-shaped member B in synchronization with the movement of the rod-shaped member B being pushed at a constant speed in a direction parallel to the rotation axis A1 and the center axis C2. Move in a parallel direction at a constant speed. Other configurations in the manufacturing method according to the second embodiment are the same as those of the manufacturing method according to the first embodiment. Therefore, in the manufacturing method according to the second embodiment, descriptions other than the support mechanism 23 are as described in the manufacturing method according to the first embodiment.

第２実施例に係る製造方法によれば、棒状部材Ｂを支持する箇所が増加するため、巻線２０を巻回する際の棒状部材Ｂのたわみが抑制される。従って、巻線２０を巻回する際に、第１実施例に係る製造方法と比較して、より長い棒状部材Ｂを使用できる。つまり、第２実施例に係る製造方法は、第１実施例に係る製造方法と比較して、生産効率が良い。   According to the manufacturing method according to the second embodiment, the number of portions that support the rod-shaped member B is increased, so that the deflection of the rod-shaped member B when the winding 20 is wound is suppressed. Therefore, when winding the winding 20, a longer rod-like member B can be used as compared with the manufacturing method according to the first embodiment. That is, the manufacturing method according to the second embodiment has higher production efficiency than the manufacturing method according to the first embodiment.

また、第１実施例に係る製造方法では、支持されていない棒状部材Ｂの一端が、巻線２０を巻回する際に、回転の遠心力によって、中心軸Ｃ２と直交する方向にたわむ。しかし、第２実施例に係る製造方法では、棒状部材Ｂの一端が支持されているため、回転の遠心力による棒状部材Ｂの端部のたわみが抑制され、巻回時の棒状部材Ｂの変形が抑制される。結果として、第２実施例に係る製造方法では、第１実施例に係る製造方法と比較して、より正確に巻線２０を巻回することが可能である。つまり、第２実施例に係る製造方法で製造された巻線型電子部品は、第１実施例に係る製造方法で製造された巻線型電子部品よりも、Ｌ値及びＱ値の管理が容易である。   Further, in the manufacturing method according to the first embodiment, one end of the unsupported rod-like member B bends in a direction perpendicular to the central axis C2 due to the centrifugal force of rotation when the winding 20 is wound. However, in the manufacturing method according to the second embodiment, since one end of the rod-like member B is supported, the deflection of the end of the rod-like member B due to the centrifugal force of rotation is suppressed, and the rod-like member B is deformed during winding. Is suppressed. As a result, in the manufacturing method according to the second embodiment, the winding 20 can be wound more accurately as compared with the manufacturing method according to the first embodiment. That is, the winding type electronic component manufactured by the manufacturing method according to the second embodiment is easier to manage the L value and the Q value than the winding type electronic component manufactured by the manufacturing method according to the first embodiment. .

（第３実施例）
第３実施例である巻線型電子部品１の製造方法では、巻線２０が融着層でコーティングされていない。また、巻回機構２２の動作中において、棒状部材Ｂ及び該棒状部材Ｂに巻回された巻線２０に対して、熱風を当てない。ただし、第３実施例に係る製造方法では、棒状部材Ｂに接着剤を塗布しつつ、巻線２０を棒状部材Ｂに巻回する。これにより、巻線２０が、棒状部材Ｂに巻回されると略同時に、棒状部材Ｂに固定される。結果として、巻線２０は、巻線２０の巻回による引張力が、コイル径が大きくなった部分αに伝わることを防止できるため、該部分αの形状を保持することができる。第３実施例に係る製造方法における他の構成は、第１実施例に係る製造方法と同様である。従って、第３実施例に係る製造方法における他の構成の説明は、第１実施例に係る製造方法での説明のとおりである。 (Third embodiment)
In the method of manufacturing the wound electronic component 1 according to the third embodiment, the winding 20 is not coated with a fusion layer. Further, during operation of the winding mechanism 22, hot air is not applied to the rod-shaped member B and the winding 20 wound around the rod-shaped member B. However, in the manufacturing method according to the third embodiment, the winding 20 is wound around the rod-shaped member B while an adhesive is applied to the rod-shaped member B. Thus, when the winding 20 is wound around the rod-shaped member B, the winding 20 is fixed to the rod-shaped member B substantially simultaneously. As a result, the winding 20 can prevent the tensile force due to winding of the winding 20 from being transmitted to the portion α where the coil diameter is increased, so that the shape of the portion α can be maintained. Other configurations in the manufacturing method according to the third embodiment are the same as those of the manufacturing method according to the first embodiment. Therefore, the description of the other configuration in the manufacturing method according to the third embodiment is the same as the description of the manufacturing method according to the first embodiment.

（他の実施例）
本発明に係る巻線型部品の製造方法及び巻線型電子部品の製造装置は前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。例えば、回転軸Ａ１と棒状部材Ｂを固定して、その周囲をワイヤノズルＮが回転し、中心軸Ｃ２と平行な方向に移動することにより、巻線２０を巻回してもよい。また、巻線２０を棒状部材Ｂに巻回した後の工程は、樹脂モールドでなくてもよい。さらに、各実施例の構成を組み合わせてもよい。 (Other examples)
The method for manufacturing a wire-wound component and the apparatus for manufacturing a wire-wound electronic component according to the present invention are not limited to the above embodiments, and can be variously modified within the scope of the gist thereof. For example, the winding shaft 20 may be wound by fixing the rotation shaft A1 and the rod-shaped member B, the wire nozzle N rotating around the rotation shaft A1, and moving in a direction parallel to the central shaft C2. Moreover, the process after winding the coil | winding 20 to the rod-shaped member B does not need to be resin mold. Furthermore, you may combine the structure of each Example.

以上のように、本発明は、巻線型電子部品の製造方法及び巻線型電子部品の製造装置に有用であり、巻線型電子部品における、巻線とコアとの間に生じる隙間を制御することができる点で優れている。   As described above, the present invention is useful for a method for manufacturing a wire wound electronic component and a device for manufacturing a wire wound electronic component, and is capable of controlling a gap generated between a winding and a core in the wire wound electronic component. It is excellent in that it can be done.

１ 巻線型電子部品
２ 製造装置（巻線型電子部品の製造装置）
１６ コア
２０ 巻線
２２ 巻回機構
２４ 挿抜機構
３０ からげ軸（挿入部材） 1 Winding type electronic component 2 Manufacturing device (Wounding type electronic component manufacturing device)
16 Core 20 Winding 22 Winding mechanism 24 Insertion / removal mechanism 30 Curled shaft (insertion member)

Claims (9)

巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造方法であって、
前記コアに対して前記巻線を巻回する巻回工程と、
前記コアに巻回された前記巻線を切断する巻線切断工程と、
前記コアを切断するコア切断工程と、
を備え、
前記巻回工程において、前記巻線の巻回中に、前記コアと該巻線との間に挿入部材を挿入し、抜去し、
前記巻線切断工程において、前記巻線の、前記巻回工程において前記コアと該巻線との間に挿入部材が挿入された部分を切断し、
前記コア切断工程において、前記コアの、前記巻回工程において前記コアと該巻線との間に挿入部材が挿入された部分を切断すること、
を特徴とする巻線型電子部品の製造方法。 A method of manufacturing a wound electronic component having a winding and a core around which the winding is wound,
A winding step of winding the winding around the core ;
A winding cutting step of cutting the winding wound around the core;
A core cutting step of cutting the core;
With
In the winding step, during winding of the winding, an insertion member is inserted between the core and the winding, and is removed .
In the winding cutting step, cutting the portion of the winding where the insertion member is inserted between the core and the winding in the winding step,
In the core cutting step, cutting the portion of the core where the insertion member is inserted between the core and the winding in the winding step;
A method for manufacturing a wound electronic component. 巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造方法であって、
前記コアに対して前記巻線を巻回する巻回工程であって、前記巻線の巻回中に、前記コアと該巻線との間に挿入部材を挿入し、抜去する巻回工程と、
前記巻線において前記挿入部材が挿入されたことによってコイル径が大きくなった部分が、樹脂の外部に飛び出すようにモールディングするモールディング工程と、
を備えること、
を特徴とする巻線型電子部品の製造方法。 A method of manufacturing a wound electronic component having a winding and a core around which the winding is wound,
A winding step of winding the winding around the core, the winding step of inserting and removing an insertion member between the core and the winding during winding of the winding; and ,
A molding step in which a portion having a larger coil diameter due to insertion of the insertion member in the winding is molded so as to jump out of the resin,
Providing
A method for manufacturing a wound electronic component. 前記巻回工程において、前記コアを所定の方向に送り出しながら、該コアに対して前記巻線を巻回すること、
を特徴とする請求項１又は請求項２のいずれかに記載の巻線型電子部品の製造方法。 Winding the winding around the core while feeding the core in a predetermined direction in the winding step;
A method for manufacturing a wire wound electronic component according to claim 1 or 2, wherein: 前記巻回工程において、前記巻線の巻回中における前記コアと該巻線との間への前記挿入部材の挿入及び抜去を繰り返し行うこと、
を特徴とする請求項１乃至請求項３のいずれかに記載の巻線型電子部品の製造方法。 In the winding step, repeating the insertion and removal of the insertion member into between the core and the windings during winding of the winding,
Method for producing a wire wound electronic component according to any of claims 1 to 3, characterized in. 前記巻回工程において、前記コアを２点以上で支持した状態で、該コアに該巻線を巻回すること、
を特徴とする請求項１乃至請求項４のいずれかに記載の巻線型電子部品の製造方法。 In the winding step, winding the winding around the core in a state where the core is supported at two or more points;
The method for manufacturing a wound electronic component according to any one of claims 1 to 4 . 前記巻線は、熱融着層付ワイヤであり、
前記巻回工程において、前記巻線を加熱すること、
を特徴とする請求項１乃至請求項５のいずれかに記載の巻線型電子部品の製造方法。 The winding is a wire with a heat-sealing layer,
Heating the winding in the winding step;
A method for manufacturing a wound electronic component according to any one of claims 1 to 5 . 前記巻回工程において、前記コアと前記巻線との間に接着剤を塗布しつつ、該コアに該巻線を巻回すること、
を特徴とする請求項１乃至請求項６のいずれかに記載の巻線型電子部品の製造方法。 In the winding step, winding the winding around the core while applying an adhesive between the core and the winding;
A method for manufacturing a wound electronic component according to any one of claims 1 to 6 . 巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造装置であって、
前記コアに前記巻線を巻回する巻回機構と、
前記巻回機構の動作中に、前記コアと前記巻線との間に挿入部材を挿入、抜去する挿抜機構と、
前記巻線の、前記巻回機構が前記コアと該巻線との間に挿入部材を挿入した部分を切断する巻線切断機構と、
前記コアの、前記巻回機構が前記コアと該巻線との間に挿入部材を挿入した部分を切断するコア切断機構と、
を備えること、
を特徴とする巻線型電子部品の製造装置。 A winding type electronic component manufacturing apparatus having a winding and a core around which the winding is wound,
A winding mechanism for winding the winding around the core;
An insertion / extraction mechanism for inserting / extracting an insertion member between the core and the winding during operation of the winding mechanism;
A winding cutting mechanism for cutting a portion of the winding in which the winding mechanism inserts an insertion member between the core and the winding;
A core cutting mechanism for cutting a portion of the core where the winding mechanism has inserted an insertion member between the core and the winding;
Providing
An apparatus for manufacturing a wound electronic component. 巻線、及び該巻線が巻回されるコアを有する巻線型電子部品の製造装置であって、A winding type electronic component manufacturing apparatus having a winding and a core around which the winding is wound,
前記コアに前記巻線を巻回する巻回機構と、A winding mechanism for winding the winding around the core;
前記巻回機構の動作中に、前記コアと前記巻線との間に挿入部材を挿入、抜去する挿抜機構と、An insertion / extraction mechanism for inserting / extracting an insertion member between the core and the winding during operation of the winding mechanism;
前記巻線において前記挿入部材が挿入されたことによってコイル径が大きくなった部分が、樹脂の外部に飛び出すようにモールディングするモールディング機構と、A molding mechanism that molds the portion of the winding whose coil diameter is increased by inserting the insertion member into the outside of the resin,
を備えること、Providing
を特徴とする巻線型電子部品の製造装置。An apparatus for manufacturing a wound electronic component.
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