JP6239380B2 - Heat sink mounting structure and socket for electrical parts - Google Patents

Description

  The present invention relates to a heat sink mounting structure in an electrical component socket used for performance testing of electrical components such as an IC package, and more specifically, stabilizes the posture of the heat sink that abuts against the surface of the electrical component and radiates heat, The present invention relates to a heat sink mounting structure and an electrical component socket that improve the abutting contact property.

  A conventional heat sink mounting structure for an electrical component socket is such that an electrical component socket (LGA socket) in which an electrical component (LSI) is accommodated is mounted on a wiring board, and the electrical component socket is disposed above the wiring board. A heat sink is attached via a plurality of bolts arranged on the outer sides of the four corners, and elasticity that exerts an elastic force in the extension direction between the head of the bolt embedded in the heat sink and the base plate of the heat sink The base plate of the heat sink is pressed against the wiring board through a member (string winding spring). At this time, the bolt secures a posture orthogonal to the surface of the wiring board. As a result, the base plate of the heat sink is pressed against the surface of the electrical component housed in the electrical component socket, and the generated electrical component is radiated (see, for example, Patent Document 1).

Republished WO2009 / 054053 (particularly FIG. 2)

  However, in the heat sink mounting structure described in Patent Document 1, the elastic member interposed between the bolts presses the base plate of the heat sink toward the wiring board only in one direction. There is no problem when the socket is used in a horizontal state, but when the wiring board is inclined from the horizontal state, for example, it is arranged in a vertical state, the weight of the heat sink itself wobbles and its posture is not stable, There was a case where the contact contact property to the electrical component was lowered. Also, even when the electrical component socket is used in a horizontal state, when a heavy component such as a cooling fan is attached to one side of the heat sink, the right and left weights of the heat sink are different from each other. It is not stable and leans to either side. Therefore, also in this case, the abutting contact property to the electrical component may be lowered. For these reasons, there is a case where the heat generation of the heated electrical parts cannot be sufficiently performed.

  Therefore, the problem to be solved by the present invention that addresses such problems is to attach a heat sink that stabilizes the posture of the heat sink that abuts on the surface of the electrical component and radiates heat, and improves the contact contact property. It is to provide a socket for structure and electrical parts.

  In order to solve the above-described problems, the heat sink mounting structure according to the present invention is attached to a socket cover that covers the housing portion side of a socket body having an electrical component housing portion, and the surface of the electrical component housed in the housing portion. A heat sink mounting structure that dissipates heat by abutting on a pressing portion that protrudes in a rod shape at a lower portion of a heat dissipating member provided on the heat sink and contacts the surface of the electrical component in a central hole portion of the socket cover A pusher for inserting and pressing the electrical component to the lower part of the pressing part is movably combined with the pressing part, and the heat radiator is pressed against the socket body between the pusher and the pressing part. A pressing spring and a pressing spring for peeling the heat radiating body from the socket main body are provided.

  An electrical component socket according to the present invention includes a socket body having an electrical component housing portion that is electrically connected to the wiring board, a socket cover that is detachable from the socket body and covers the housing portion side, A heat sink that is attached to the socket cover and that dissipates heat by contacting the surface of the electric component housed in the housing portion, and mounting the heat sink to the socket cover, It is attached by the heat sink attachment structure of the means.

  According to the heat sink mounting structure and the electrical component socket according to the present invention, it protrudes in the form of a rod at the lower part of the heat radiating body provided in the heat sink that contacts the surface of the electrical component accommodated in the accommodating portion of the socket body and radiates heat. A pressing portion that contacts the surface of the electrical component is inserted into the center hole of the socket cover, and a pusher that presses the electrical component is movably combined with the pressing portion at a lower portion of the pressing portion. A pressing spring for pressing the radiator to the socket body side and a return spring for peeling the radiator from the socket body side are provided between the pressing portion and the heat sink. While pressing the heat radiating body against the socket main body side, a force for peeling the heat radiating body from the socket main body side can be applied by a return spring. Therefore, even when the heat sink is used in an inclined state, it is possible to support the wobbling of the heat sink by its own weight by the peeling force of the push spring. Further, even when a heavy component is attached to one side of the heat sink in a horizontal use state, it can similarly support the wobbling of the heat sink. From these things, the attitude | position of the heat sink which is contact | abutted on the surface of an electrical component and thermally radiates can be stabilized, and the contact contact property can be improved. Therefore, it is possible to reliably radiate the heat generated electrical components.

It is a perspective view which shows embodiment of the socket for electrical components by this invention. It is a disassembled perspective view which shows the state which removed the socket cover from the socket main body in the said socket for electrical components. It is a front view which shows the said socket main body. It is a disassembled perspective view which shows the attachment structure which combines a heat sink with the said socket cover. It is a top view which shows the state which cut off the left half part above the operation handle of an open position in the said socket for electrical components. FIG. 6 is a cross-sectional view taken along line AA in a state where a left half portion above the operation handle exists in FIG. 5. It is a top view which shows the state which cut off the left half part above the operation handle of a closed position in the said socket for electrical components. FIG. 8 is a cross-sectional view taken along line B-B in a state where the left half portion above the operation handle exists in FIG. 7. FIG. 9 is a cross-sectional view taken along the line C-C in a state in which the left half portion above the operation handle is present in FIG. 7, and simultaneously showing the state of the pressing spring and the pressing spring interposed on the lower surface side or the upper surface side of the pusher. is there. FIG. 10 is an enlarged cross-sectional view of a main part in which the socket body is omitted in FIG. 9 in order to explain the elastic action of the pressing spring and the pressing spring.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view showing an embodiment of an electrical component socket according to the present invention, and FIG. 2 is an exploded perspective view showing a state where a socket cover is removed from a socket body in the electrical component socket. FIG. 3 is a front view showing the socket body. The electrical component socket 1 is used for a test such as a burn-in test for electrical components such as an IC package, and includes a socket body 2, a socket cover 3, and a heat sink 4.

  The socket body 2 accommodates the electrical component to be tested, and is arranged on the wiring board P as shown in FIG. And as shown in FIG. 2, it has the rectangular block-shaped frame 5, and the accommodating part 6 of an electrical component is formed in the upper surface center part of this frame 5, for example, what is called an open top type. is there. The accommodating part 6 accommodates and fixes an IC package 7 as an electrical component electrically connected to the wiring board P shown in FIG. 3, and positions the four corners of the IC package 7 with a corner guide or the like. It has become.

  A socket cover 3 is detachably attached to the upper surface of the socket body 2. The socket cover 3 covers the IC package 7 accommodated in the accommodating portion 6 on the upper surface of the socket body 2, and can be attached and detached by lowering or lifting from above the socket body 2, as shown in FIG. ing. A latch 8 for holding the socket cover 3 in the closed state with respect to the socket body 2 is provided on the opposite side of the socket cover 3. The latch 8 is rotatably attached to a support shaft 9 at both end portions of the socket cover 3, and a hook at a lower end portion thereof is hooked on a hooking portion on the opposite side of the socket body 2.

  A heat sink 4 is attached to the upper surface side of the socket cover 3. The heat sink 4 is in contact with the surface of the IC package 7 accommodated in the accommodating portion 6 of the socket body 2 to dissipate heat. As shown in FIGS. 1 and 2, the entire heat sink 4 is formed in a rectangular parallelepiped shape, A large number of radiating fins (a part of the radiating body) 10 are arranged in parallel, and a cooling fan 11 is provided at the upper end so as to flow the wind downward. 1 and 2, reference numeral 11 a indicates a fan connector in which signal lines for supplying power to the cooling fan 11, detecting temperature, and controlling operations are collected.

  FIG. 4 is an exploded perspective view showing a mounting structure in which the heat sink 4 is combined with the socket cover 3, and FIG. 5 shows a state in which the left half above the operation handle 12 in the open position is cut away in the electrical component socket 1. 6 is a plan view, and FIG. 6 is a cross-sectional view taken along line AA in FIG. 5 in a state where the left half above the operation handle 12 exists.

  In FIG. 6, a pressing portion 13 protrudes in a rod shape at the lower portion of the center portion where a large number of radiating fins 10 of the heat sink 4 are arranged. The pressing portion 13 is a part of the heat radiating member with its lower end abutting against the surface of the IC package 7. The pressing portion 13 is formed in, for example, a cylindrical shape and is opened in the center portion of the socket cover 3 shown in FIG. 4. It is inserted into the center hole 14. A female screw is cut on the inner peripheral surface of the center hole portion 14. Further, the radiating fin 10 and the pressing portion 13 constitute a radiating body.

  The operation handle 12 and the screw member 15 shown in FIG. 4 are fitted around the pressing portion 13 by a hole formed in the center thereof, and both are combined to form the operation member 16. . A male screw is cut on the outer peripheral surface of the screw member 15 and is screwed with a female screw cut on the inner peripheral surface of the center hole portion 14 of the socket cover 3. The operation handle 12 includes a lever 12a extending outward from a part of the ring-shaped disk member, and the operation handle 12 and the screw member 15 are coupled by tightening a plurality of screws 17 or the like into the ring-shaped disk member. Has been. Note that a heat shrinkable tube 18 is placed on the tip of the lever 12a of the operation handle 12.

  In FIG. 6, a pusher 19 shown in FIG. 4 is combined with a ring-shaped thrust bearing 20 interposed between the pusher 19 and the screw member 15 below the pressing portion 13. The pusher 19 presses the IC package 7 and is thermally connected to the pressing portion 13, and is combined with the pressing portion 13 so as to be movable. 6 is inserted into the pin hole drilled upward from the lower surface side of the pusher 19 in FIG. 6 and the pressing spring 21 and the guide pin 22 shown in FIG. 4 are inserted, and the male screw at the tip of the guide pin 22 is pressed. It is screwed into a female screw cut on the lower surface of the portion 13. The upper end portion of the pin hole has a small hole diameter, and a pressing spring 21 is interposed between the thinned portion and the head of the guide pin 22. The pressing spring 21 is interposed in an extended state in the pin hole, and acts to press the heat radiating body composed of the heat radiating fins 10 and the pressing portion 13 toward the socket body 2 side.

  Further, in FIG. 4, on the upper surface side of the pusher 19, a pushing spring 24 is inserted into a pin hole drilled downward in the rising step portion 23 fitted into the hole in the central portion of the thrust bearing 20, and FIG. As shown, the upper end portion of the pressing spring 24 is pressed against the lower surface of the pressing portion 13. The pressing spring 24 is compressed and interposed between the bottom of the pin hole and the lower surface of the pressing portion 13, and peels off the heat radiating body composed of the radiating fin 10 and the pressing portion 13 from the socket body 2 side. Works.

  Here, the pressing spring 21 and the pressing spring 24 are coil springs. As shown in FIG. 4, for example, four pieces are provided on the upper side and the lower side of the pusher 19, and their installation positions are deviated from each other by 45 degrees on the upper and lower sides. The elastic force of the pressing spring 21 is larger than the elastic force of the pressing spring 24, and the above-described heat radiator is moved toward the IC package 7 due to the difference between the elastic force of the pressing spring 21 and the elastic force of the pressing spring 24. It is designed to be pressed. Since the pressure that can be applied to the IC package 7 side is limited, the elastic force of the pressing spring 21 is larger than that of the conventional one, and the pressing spring 24 acts so as to be peeled off by the elastic force of the pressing spring 24. The pressure within the limit is applied to the IC package 7 due to the difference in elastic force between the spring 21 and the return spring 24.

  In this state, the operation member 16 including the operation handle 12 and the screw member 15 shown in FIG. 4 is provided between the lower portion of the heat radiating fin 10 and the pusher 19 as shown in FIG. It has been. Since the screw member 15 of the operation member 16 is screwed with the female screw cut in the central hole portion 14 of the socket cover 3, the screw member 15 is rotated by rotating the lever 12a of the operation handle 12. Thus, the pusher 19 can be moved up and down with respect to the pressing portion 13. At this time, the thrust bearing 20 converts the rotational operation of the screw member 15 into a vertical force on the upper surface of the pusher 19 and transmits it.

  For example, the position of the lever 12a of the operation handle 12 shown in FIG. 5 indicates the open position rotated in the direction of arrow D counterclockwise (the position where the pusher 19 is not in contact with the IC package 7: see FIG. 6). The position of the lever 12a shown in FIG. 7 shows the closed position (the position where the pusher 19 contacts the IC package 7: see FIG. 8) rotated clockwise from the position shown in FIG. As described above, the lever 12a of the operation handle 12 is rotated between the open position shown in FIG. 5 and the close position shown in FIG.

  Next, the mounting structure of the heat sink and the use state of the electrical component socket configured as described above will be described with reference to FIGS. First, suppose that the heat sink 4 is attached to the upper surface side of the socket cover 3 as shown in FIG. In this state, the IC package 7 is accommodated in the accommodation portion 6 of the socket body 2 shown in FIG. Next, the heat sink 4 and the socket cover 3 shown in FIG. 2 are combined by descending from above the socket body 2, and the latch 8 of the socket cover 3 is hooked on the latching portion on the opposite side of the socket body 2. Thereby, as shown in FIG. 1, the socket main body 2, the socket cover 3, and the heat sink 4 are combined.

  In this state, the position of the lever 12a of the operation handle 12 provided between the radiator (radiation fin 10) of the heat sink 4 and the pusher 19 is in the open position rotated in the direction of arrow D in FIG. As shown in FIG. 6, the lower surface of the pusher 19 is not in contact with the IC package 7.

  Next, the lever 12a of the operation handle 12 is rotated clockwise from the open position in FIG. 5 to rotate in the direction of arrow E to the close position in FIG. At this time, the screw member 15 coupled to the operation handle 12 rotates to move the pusher 19 downward relative to the pressing portion 13. Thereby, as shown in FIG. 8, the lower surface of the pusher 19 comes into contact with the IC package 7. FIG. 9 shows simultaneously the state of the pressing spring 21 and the pressing spring 24 interposed at the lower surface side or the upper surface side of the pusher 19 at this time.

  FIG. 10 is an enlarged cross-sectional view of a main part in which the socket body 2 is omitted and the IC package 7 is omitted in FIG. 9 in order to explain the elastic action of the pressing spring 21 and the pressing spring 24. As shown in FIG. 7, when the lever 12 a of the operation handle 12 is rotated to the closed position, the pusher 19 moves downward together with the pressing portion 13. As shown in FIG. 4, the pusher 19 has a rectangular opening 23 a formed at the center of the rising step portion 23, and a rectangular bar shape is formed at the lower end of the pressing portion 13 in the opening 23 a. The protruding contact portion 13a is fitted so as to be movable up and down. The opening 23a and the contact portion 13a are formed at positions corresponding to the upper surface of the IC chip 7a mounted at the center of the IC package 7 shown in FIG.

  In this state, when the pusher 19 moves downward together with the pressing portion 13, only the abutting portion 13a at the lower end portion of the pressing portion 13 comes into contact with the upper surface of the IC chip 7a mounted on the central portion of the IC package 7, The lower surface of the surrounding pusher 19 tends to come into contact with the upper surface of the peripheral portion of the IC package 7. At this time, since the IC package 7 itself is accommodated in the accommodating portion 6 of the socket body 2, it is fixed at that position. When the pusher 19 moves downward and the contact portion 13a of the pressing portion 13 contacts the upper surface of the IC chip 7a, the contact portion 13a cannot move downward. While the pressing spring 21 interposed therebetween is contracted, the contact portion 13a is lifted by the height of the IC chip 7a. Since the contracted pressing spring 21 tends to be extended by the repulsive force, the contact portion 13a of the pressing portion 13 is pressed against the upper surface of the IC chip 7a by the elastic action of the pressing spring 21, and is securely contacted. .

  At this time, the peripheral portion outside the opening 23 a on the lower surface of the pusher 19 moves downward until it contacts the upper surface of the peripheral portion of the IC package 7, and stops there when it contacts the peripheral portion of the IC package 7. At this time, the pressing spring 24 inserted into the downward pin hole on the upper surface side of the pusher 19 is compressed and interposed between the pressing spring 13 and the lower surface of the pressing portion 13, so that the repulsive force always expands. It is said. Therefore, a force that peels the pressing portion 13 from the IC package 7 and the socket body 2 side is exerted by the elastic action of the pressing spring 24. This peeling force acts to restore the inclination when the heat sink 4 tries to incline with respect to the socket cover 3. As a result, it is possible to stabilize the posture of the heat sink 4 that abuts on the surface of the IC package 7 (electrical component) and dissipates heat, and to improve the abutting contact property.

  In FIG. 4, four pressing springs 21 and four pressing springs 24 are provided on the upper side and the lower side of the pusher 19 and are offset from each other by 45 degrees on the upper and lower sides. The number may be an appropriate number of three or more and may be shifted by an appropriate angle. The pressing spring 21 and the pressing spring 24 are coil springs, but are not limited to this, and may have, for example, a leaf spring, rubber, or other elastic structure.

  In the above description, the socket body 2 is used in a horizontal state on the horizontal wiring board P. However, the present invention is not limited to this, and the wiring board P is inclined from the horizontal state, for example, vertically. The same can be applied even when arranged in a state. Further, even when the socket body 2 is used in a horizontal state, a heavy component such as a cooling fan is attached to one side of the heat sink 4 and the same applies even when the right and left weights of the heat sink 4 are different. it can.

DESCRIPTION OF SYMBOLS 1 ... Socket for electrical components 2 ... Socket main body 3 ... Socket cover 4 ... Heat sink 6 ... Accommodating part 7 ... IC package (electrical component)
7a ... IC chip 8 ... Latch 10 ... Heat radiation fin (heat sink)
DESCRIPTION OF SYMBOLS 11 ... Cooling fan 12 ... Operation handle 12a ... Lever of operation handle 13 ... Pushing part (heat radiator)
13a ... Abutting portion of pressing portion 14 ... Center hole portion 15 ... Screw member 16 ... Operation member 19 ... Pusher 20 ... Thrust bearing 21 ... Pressing spring 22 ... Guide pin 24 ... Pushing spring P ... Wiring board

Claims (5)

A heat sink mounting structure that is attached to a socket cover that covers the housing portion side of the socket body having an electrical component housing portion, and that dissipates heat by contacting the surface of the electrical component housed in the housing portion,
A pressing portion that protrudes in a rod shape at the lower part of the heat dissipating member provided in the heat sink and contacts the surface of the electric component is inserted into the center hole of the socket cover, and the electric component is pressed to the lower portion of the pressing portion. A pusher is combined so as to be movable with respect to the pressing portion, and between the pusher and the pressing portion, a pressing spring for pressing the radiator to the socket body side, and the radiator to be peeled off from the socket body side A heat sink mounting structure, characterized in that a back spring is provided.   The heat sink mounting structure according to claim 1, wherein an operation member for moving the pusher relative to the pressing portion is provided between the lower portion of the heat radiating body and the pusher.   The heat sink mounting structure according to claim 1, wherein the pressing spring and the pressing spring are coil springs.   The elastic force of the pressing spring is larger than the elastic force of the pressing spring, and the radiator is pressed against the electric component side by the difference between the elastic force of the pressing spring and the elastic force of the pressing spring. The heat sink mounting structure according to any one of claims 1 to 3. A socket body having a housing part for electrical components to be electrically connected to the wiring board;
A socket cover that is detachably attached to the socket body, and covers the housing portion side;
A heat sink attached to the socket cover and radiating heat by contacting the surface of the electrical component housed in the housing portion, and a socket for an electrical component,
The electrical component socket, wherein the heat sink is attached to the socket cover by the heat sink attachment structure according to any one of claims 1 to 4.