JP6227977B2 - Communication device - Google Patents

Description

  The present invention relates to a communication device used in the field of telemetering such as collection of sales information of vending machines and the field of telematics such as distribution of traffic information to a mobile body, and more particularly to the structure of the communication device.

  In recent years, telemetering and telematics for collecting and distributing information via a wireless packet communication network have become widespread. Telemetering means device operation monitoring and remote control. Typical examples include sales management systems for vending machines, usage management systems for gas and water, and management systems for unmanned parking lots. (For example, refer to Patent Document 1 and Patent Document 2 for the sales management system of the vending machine).

  Telematics means providing information services in real time by combining a communication system with a mobile body such as an automobile. A typical example of telematics is an in-vehicle information system that provides traffic information and navigation information in real time to a terminal installed in a car.

  In such a field, a data communication apparatus (DCE) for connecting to a wireless packet communication network in a remote place, and a data terminal apparatus (DTE: Data Terminal Equipment) using the data communication apparatus, Is placed. For example, in a sales management system of a vending machine, a control device that performs sales control and temperature control in a product storage corresponds to a data terminal device. Each data terminal device is connected to a predetermined network via a data communication device periodically or arbitrarily, and is connected to a predetermined management computer via this network. Then, the data terminal device connected to the management computer transmits various management target data.

JP 2003-51056 A Japanese Patent No. 4241775

  By the way, for example, in telemetering of vending machines, it is necessary to change carriers and services after system construction due to radio wave conditions at the installation location. In particular, a network connection service that assigns a fixed IP address to a connection terminal may be changed to a network connection service that dynamically assigns an IP address.

  In order to make it easy to change the data communication device to another model based on such a situation, conventionally, a communication device has been proposed in which a data terminal device and a data communication device are connected to each other to mediate communication between them. This communication device incorporates a data communication device and a circuit board in a case, and operates from the data terminal device so as to look like a data communication device. However, the communication device is adapted to various types of data communication devices. Therefore, it is necessary to develop and manufacture each circuit board corresponding to each data communication device, which increases costs.

  Therefore, in Patent Document 2, a common circuit that does not depend on each data communication device is formed on the main circuit board, a circuit that depends on each data communication device is formed on the auxiliary circuit board, and a substrate case is provided to provide the auxiliary circuit. By accommodating the substrate therein, the substrate case accommodating the auxiliary circuit substrate is overlapped with the main circuit substrate and arranged to reduce the size of the main body case.

  However, when the data communication device is changed, the arrangement of circuit elements on the auxiliary circuit board must be changed. If the circuit elements of the main circuit board and the auxiliary circuit board are overlapped with each other due to such changes, physical interference between the circuit elements of the main circuit board and the main body case, and deterioration of heat dissipation of the circuit elements of the main circuit board Because of this, there was a problem that the main body case had to be enlarged.

  The present invention has been made to solve the conventional technical problems, and provides a communication device capable of avoiding an increase in the size of the main body case while avoiding physical interference between circuit elements. To do.

  The communication device of the present invention comprises a data communication device for connection to a communication network, and a circuit for connecting the data terminal device and the data communication device to each other in a main body case, A main circuit board including a first interface circuit for connecting to the data terminal apparatus, a communication control circuit for mediating communication between the data terminal apparatus and the data communication apparatus, and the data communication apparatus and the main circuit board. An auxiliary circuit board including a second interface circuit for connection, on which the data communication device is mounted, and an auxiliary circuit arranged on the main circuit board so as to overlap the auxiliary circuit board on the side opposite to the side facing the main circuit board And a data communication device is mounted on a surface of the auxiliary circuit board opposite to the main circuit board, and the second interface circuit is the main circuit board of the auxiliary circuit board. And at least a part of the circuit elements constituting the second interface circuit is arranged at a position where it does not overlap with the circuit elements mounted on the board case side surface of the main circuit board. The board case is provided with a relief portion that is recessed corresponding to the circuit elements constituting the interface circuit and protrudes toward the main circuit board.

  A communication device according to a second aspect of the present invention is characterized in that, in the above invention, the thickness dimension of the relief portion of the substrate case is made thinner than the thickness dimension of the other portions.

  According to a third aspect of the present invention, there is provided a communication device according to the first aspect, wherein the circuit elements constituting the second interface circuit are arranged at positions where they do not overlap with the circuit elements mounted on the surface of the main circuit board on the board case side. In addition, the relief portion is formed at a position where it does not overlap with the circuit element mounted on the surface of the main circuit board on the board case side.

  A communication device according to a fourth aspect of the present invention is characterized in that, in each of the above-described inventions, the substrate case is formed of a synthetic resin.

  According to the present invention, in a communication device in which a data communication device for connection to a communication network and a circuit for mutually connecting the data terminal device and the data communication device are accommodated in a main body case, the data terminal A main circuit board including a first interface circuit for connecting to the apparatus, a communication control circuit for mediating communication between the data terminal apparatus and the data communication apparatus, and connecting the data communication apparatus and the main circuit board. And an auxiliary circuit board on which the data communication device is mounted, and an auxiliary circuit board on the side opposite to the side facing the main circuit board. The data communication device is mounted on a surface of the auxiliary circuit board opposite to the main circuit board, and the second interface circuit is the main circuit board of the auxiliary circuit board. And at least a part of the circuit elements constituting the second interface circuit is arranged at a position where it does not overlap with the circuit elements mounted on the board case side surface of the main circuit board. Since the recesses corresponding to the circuit elements constituting the interface circuit and projecting toward the main circuit board are formed in the board case, the circuit elements mounted on the main circuit board and the relief parts of the board case are Even if they are overlapped, they are partially overlapped. Therefore, even if the distance between the circuit element of the main circuit board and the substrate case is narrowed, the range can be reduced.

  As a result, it is possible to suppress a decrease in heat dissipation due to a decrease in the distance between the circuit element mounted on the surface of the main circuit board on the board case side and the escape portion of the board case, so the main body case can be enlarged. This can be avoided beforehand.

  Further, since the escape portion of the board case protrudes toward the main circuit board, it is not necessary to extremely reduce the thickness dimension of the escape portion. Therefore, even when the substrate case is formed of a synthetic resin as in the invention of claim 4, it is possible to prevent or suppress the deterioration of the resin flow in the portion constituting the escape portion.

  Even in that case, the thickness dimension of the relief portion of the substrate case is made as thin as possible as much as the thickness dimension of the other portion as in the invention of claim 2 to escape the circuit element of the auxiliary circuit board. Even if the concave dimension is sufficiently secured, it is possible to effectively avoid physical interference between the circuit element of the main circuit board and the escape portion of the board case.

  On the other hand, the circuit element constituting the second interface circuit as in the invention of claim 3 is arranged at a position where it does not overlap with the circuit element mounted on the surface of the main circuit board on the board case side, and the relief portion is provided in the main circuit board. If it is formed at a position where it does not overlap with the circuit element mounted on the surface of the circuit board on the board case side, physical interference between the circuit element of the main circuit board and the escape portion of the board case does not occur reliably. Accordingly, it is not necessary to reduce the thickness dimension of the relief portion, and it is possible to more effectively avoid the inconvenience at the time of molding with synthetic resin as in claim 4 while sufficiently securing the recess dimension. .

  Further, when the substrate case is molded from a synthetic resin as in the invention of claim 4, it is necessary to form a gate reservoir in order to improve the flow of the resin at the resin injection site, but as in the invention of claim 1. By forming a recess in the escape portion and injecting resin from the escape portion, the gate reservoir can also be used as the escape portion, and it can be eliminated.

It is a perspective view of the communication apparatus of the Example to which this invention is applied. It is a disassembled perspective view of the communication apparatus of FIG. It is a front view of the main circuit board to which a board case is attached (shown in a transparent state). It is a perspective view of a substrate case. FIG. 5 is a rear perspective view of the substrate case of FIG. 4. It is a front view of the substrate case of FIG. It is a cross-sectional view of the substrate case of FIG. It is a front view of an auxiliary circuit board. FIG. 9 is a rear view of the auxiliary circuit board of FIG. 8. It is a functional block diagram of the communication apparatus of FIG. It is a front view of the main circuit board which attached the board | substrate case of the other Example (it shows by a see-through state).

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1 and 2, the communication device 1 according to the embodiment includes a substantially box-shaped main body case 2. The main body case 2 is constructed by superimposing a metal front case 3 and a rear case 4 in the thickness direction and connecting them with screws 11. A BNC connector is provided on the upper surface of the main body case 2. An antenna terminal 6 is provided. On the upper surface of the main body case 2 and on the side of the antenna terminal 6, a connector 7 for connection with the data terminal device is exposed and disposed. The power supply terminal 8 and the ground terminal 9 are exposed on the side surface of the main body case 2.

  A hole 13 is formed in the upper portion of the front surface 12 of the front case 3 so as to enable operation of internal devices. The hole 13 is sealed with a lid 14 made of an elastic member such as rubber. Further, a lamp 16 for displaying an operation status and the like is disposed on the front surface 12 of the front case 3. A through hole 22 for screwing is formed on the side surface of the front case 3.

  At the upper and lower ends of the rear case 4, fixtures 17 are formed integrally with the rear case 4. As shown in each drawing, the fixture 17 is formed to protrude slightly from the back so that a predetermined distance is formed between the rear surface of the rear case 4 and the attachment destination. Further, the fixtures 17 are formed so as to protrude in the vertical direction of the rear case 4, and each fixture 17 is formed with a round hole 18 and a long hole 19 for screwing. On the front surface of the rear case 4, a heat conductive sheet 21 such as silicon resin is attached as shown in FIG. 2. A through hole 23 for screwing is formed on the side surface of the rear case 4.

  Next, an internal device housed in the main body case 2 and its mounting structure will be described. 2 and 3, the main body case 2 accommodates the main circuit board 26, the auxiliary circuit board 27, the data communication device 28 mounted on the auxiliary circuit board 27, and the auxiliary circuit board 27. A substrate case 29 is accommodated.

  On one surface of the main circuit board 26, a first interface circuit 32 for connecting to the data terminal device 31, and a communication control circuit 33 that mediates communication between the data terminal device 31 and the data communication device 28 (FIG. 10). The circuit elements constituting (shown in the block diagram) are mounted. On the main circuit board 26, the connector 7, the power supply terminal 8, the ground terminal 9, and the like are mounted. Furthermore, a connector 36 for connecting to the auxiliary circuit board 27 is mounted on the main circuit board 26.

  Furthermore, four through-holes 37 are formed in the lower right side (one side lower side) of the main circuit board 26 in FIG. On one surface of the main circuit board 26 in the lower part of the region surrounded by the four through holes 37, in the embodiment, circuit elements 35 (rectangular shapes) such as memories constituting the communication control circuit 33 are provided. It is mounted below the connector 36 of FIG. 3 and protrudes from one surface of the main circuit board 26 in the thickness dimension.

  The auxiliary circuit board 27 constitutes a second interface circuit 38 (shown in a block diagram in FIG. 10) for connecting the data communication device 28 and the main circuit board 26 as shown in FIGS. A circuit element is mounted. Further, a connector 39 for connecting the data communication device 28 is mounted on the lower part of one surface of the auxiliary circuit board 27 in FIG. 9, and on the other surface of the auxiliary circuit board 27 in FIG. A connector 41 for connecting to the connector 36 of the main circuit board 26 is mounted.

  Furthermore, circuit elements 42 to 51 such as diodes constituting the second interface circuit 38 are mounted on the lower part of the other surface of the auxiliary circuit board 27 in FIG. In this case, the circuit elements 42 to 50 are arranged in an inverted L shape as shown in FIG. 8, and protrude from the other surface of the auxiliary circuit board 27 in the thickness dimension. Further, the circuit element 51 is arranged with a slight clearance in the lower right of the circuit element 42 in FIG. 8, and similarly protrudes from the other surface of the auxiliary circuit board 26 in the thickness dimension.

  Next, the substrate case 29 will be described with reference to FIGS. The substrate case 29 is made of a hard synthetic resin, has a size capable of accommodating the auxiliary circuit substrate 27 as shown in FIG. 2, and one surface having a bottom wall 62 and a peripheral side wall 65 is opened. From a thin box-shaped case main body 53, leg portions 54 provided at four corners located outside the side wall 65 of the case main body 53 and projecting to the other surface side, and a side wall 65 on one short side of the case main body 53. The locking piece 56 that is formed to project and the locking piece 57 that is formed to project from the side wall 65 on one long side are integrally formed.

  Screw holes 58 and 59 are formed in the respective locking pieces 56 and 57. Each leg 54 is formed with a through hole 61. Further, a through hole 63 for allowing the connector 41 of the auxiliary circuit board 27 to pass therethrough is formed on one side of the bottom wall 62 of the case main body 53 in the longitudinal direction (upper part in FIG. 6). Further, screw holes 64 for fixing the auxiliary circuit board 27 are formed on both ends of the case main body 53 on substantially diagonal lines, and the auxiliary circuit board 27 is fixed on the other side in the longitudinal direction (lower part in FIG. 6). A locking portion 66 is integrally formed upright from the inner surface (one surface) of the bottom wall 62. The locking portion 66 has a hook-like tip, and engages with the other surface of the lower edge (FIG. 8) of the auxiliary circuit board 27.

  Further, the circuit element 42 mounted on the other surface of the auxiliary circuit board 27 is mounted on the bottom wall 62 of the case main body 53 when the auxiliary circuit board 27 is accommodated on one surface side of the substrate case 29. A relief portion 67 is recessed at a position corresponding to ˜50, and another relief portion 68 is similarly recessed at a position corresponding to the circuit element 51.

  The relief portions 67 and 68 are recessed with dimensions capable of absorbing their protruding dimensions so that the circuit elements 42 to 51 do not hit the board case 29 when the auxiliary circuit board 27 is accommodated in the board case 29. However, the escape portions 67 and 68 are formed so as to protrude to the other surface side as shown in FIG. Thus, the thickness dimension of the portion 62A corresponding to the relief portions 67 and 68 of the bottom wall 62 is prevented from becoming extremely thin.

  However, the projecting dimension is made smaller than the recessed dimensions of the relief portions 67 and 68, and the thickness dimension of the portion 62A of the bottom wall 62 is slightly smaller than the thickness dimension of the other portions (bottom wall 62). This prevents the substrate case 29 from hitting the circuit elements 35 of the main circuit board 26 when the substrate case 29 is attached to the main circuit board 26 as will be described later, but it is not extremely thinned. Therefore, the periphery (flow) of the synthetic resin does not deteriorate.

  Further, as described above, the substrate case 29 is formed of a hard synthetic resin. At that time, the resin is injected into a predetermined mold, and the resin is injected from a position corresponding to the escape portion 67.

  Next, the assembly procedure of the communication device 1 will be described. The auxiliary circuit board 27 having the data communication device 28 mounted on one surface by the connector 39 is opposed to the inner surface of the bottom wall 62 of the substrate case 29 and the connector 41 is inserted through the through hole 63. The engaging portion 66 is engaged with the other surface of the auxiliary circuit board 27, and a screw (not shown) is inserted into the screw hole 71 of the auxiliary circuit board 27 and screwed into the screw hole 64 of the board case 29. Attached to the substrate case 29 and accommodated.

  At this time, the circuit elements 42 to 50 mounted on the other surface of the auxiliary circuit board 27 enter the escape portion 67 formed in the bottom wall 62 of the board case 29 so that the circuit element 51 is also in the escape portion 68. Therefore, the circuit elements 42 to 51 of the auxiliary circuit board 27 do not hit the bottom wall 62 of the board case 29 (physical interference).

  Then, in a state where the auxiliary circuit board 27 is accommodated in the board case 29, the board case 29 is superposed on one surface of the main circuit board 26, and the connector 41 is connected to the connector 36 of the main circuit board 26. Further, a screw 72 is inserted into the through hole 61 of the leg portion 54 of the board case 29 and the through hole 37 of the main circuit board 26, and the screw 72 is screwed into a screw receiver 73 formed inside the front case 3. As a result, the internal devices are integrally mounted in the main body case 2.

  At this time, the main circuit board 26 is attached so that the other surface faces the inside of the front case 3 and the auxiliary circuit board 27 is on the rear case 4 side. Then, the through holes 22 and 23 of the front case 3 and the rear case 4 are matched, and the screw 11 is screwed into them to join the front case 3 and the rear case 4. At this time, one surface of the data communication device 28 on the auxiliary circuit board 27 (the surface opposite to the auxiliary circuit board 27) is in close contact with the heat conductive sheet 21 of the rear case 4.

  In this assembled state, the auxiliary circuit board 27 is accommodated on the side opposite to the side facing the main circuit board 26 of the board case 29, and the data communication device 28 is different from the main circuit board 26 of the auxiliary circuit board 27. Mounted on the opposite side. The circuit elements 42 to 51 constituting the second interface circuit 38 are mounted on the surface of the auxiliary circuit board 27 on the main circuit board 26 side, and the relief portions 67 and 68 correspond to the main circuit board 26 respectively. The shape protrudes to the side.

  In the case of the embodiment, an interval is formed between the relief portions 67 and 68 and the circuit element 35 mounted on one surface of the main circuit board 26 by the protrusion of the leg portion 54 of the substrate case 29. The circuit elements 42 to 48 and the circuit element 51 of the auxiliary circuit board 27 are different from the circuit element 35 of the main circuit board 26, although the dimensions are such that they do not contact (physical interference). It arrange | positions so that it may not superpose | polymerize. As a result, the relief portions 68 of the substrate case 29 corresponding to them are in positions where they do not overlap with the circuit elements 35, and most of the escape portions 67 are positions where they do not overlap with the circuit elements 35. Only the portions corresponding to the elements 49 and 50 are superposed (the substrate case 29 and the escape portions 67 and 68 are indicated by broken lines in FIG. 3).

  As described above, at least a part (the circuit elements 42 to 48 and 51 in the embodiment) of the circuit elements 42 to 51 configuring the second interface circuit 38 is placed on the surface of the main circuit board 26 on the substrate case 29 side ( Since the circuit element 35 mounted on one surface) is arranged at a position where it does not overlap, the recess 67 corresponding to the circuit elements 42 to 51 protrudes toward the main circuit board 26 and is formed in the board case 29. , 68 overlaps with the circuit element 35 mounted on the main circuit board 26, but also partially overlaps (only 67A), the circuit element 35 and the board of the main circuit board 26 are overlapped. Even if the distance between the cases 29 becomes narrow in the region of the part 67A of the escape portion 67, the range is remarkably reduced.

  As a result, the heat dissipation of the circuit element 35 is reduced due to a decrease in the distance between the circuit element 35 mounted on the surface of the main circuit board 26 on the board case 29 side and the relief portions 67 and 68 of the board case 29. Since it can suppress, it becomes unnecessary to enlarge the main body case 2. FIG.

  Further, since the escape portions 67 and 68 of the substrate case 29 are projected to the main circuit board 26 side, it is not necessary to make the thickness dimensions of the escape portions 67 and 68 extremely thin. Therefore, when the substrate case 29 is formed of a hard synthetic resin as in the embodiment, it is possible to prevent or suppress the deterioration of the resin flow in the portions constituting the escape portions 67 and 68.

  Even in that case, the circuit elements 42 to 51 of the auxiliary circuit board 27 can be obtained by reducing the thickness dimension of the relief portions 67 and 68 of the substrate case 29 as much as possible from the thickness dimension of other parts. Even if the recessed portions 67 and 68 for escaping are sufficiently secured, physical interference between the circuit elements 35 of the main circuit board 26 and the escape portions 67 and 68 of the substrate case 29 can be effectively avoided. It becomes.

  Further, when the substrate case 29 is formed of a hard synthetic resin as in the embodiment, it is necessary to form a gate pool in order to improve the flow of the resin at the resin injection point. Since the resin is injected into the mold from the portion corresponding to the portion 67, the gate pool can be shared by the escape portion 67, and it can be eliminated.

  Next, each circuit board and function in the communication apparatus 1 according to the embodiment will be described with reference to the functional block diagram of FIG. As shown in FIG. 10, the main circuit board 26 has a connector for connection with a data terminal device (for example, a control device that controls sales of products and temperature in a product storage in a sales management system of a vending machine). 76, a first interface circuit 32 for connection to the data terminal device, a communication control circuit 33 for controlling data communication between the data terminal device and the data communication device 28, and a connection to the auxiliary circuit board 27 The connector 36 is mounted.

  Here, the communication control circuit 33 allows the data terminal device to communicate with the data communication device 28 so that the data terminal device can communicate even with the data communication device 28 that is not supposed to be connected. Conversion and relay with other communication methods. Specifically, it performs proxy processing of network connection processing and address conversion processing. Further, the communication control circuit 33 is implemented by an FPGA (Field Programmable Gate Array) which is a kind of PLD (Programmable Logic Device) so that it can easily cope with various data communication devices 28.

  The auxiliary circuit board 27 is designed and manufactured corresponding to the data communication device 28, and a connector 41 for connection to the main circuit board 26 and a second interface circuit for connection to the main circuit board 26. 38 and a data communication device 28 are mounted. Thus, in the communication device 1 of the embodiment, a common circuit that does not depend on each data communication device 28 is formed on the main circuit board 26, and a circuit that depends on each data communication device 28 is formed on the auxiliary circuit board 27. The data communication device 28 can be easily exchanged.

  In addition, the connector 36 is provided on the surface of the main circuit board 26 on the substrate case 29 side, and the connector 41 is provided on the surface of the auxiliary circuit board 27 on the main circuit board 26 side. Since the auxiliary circuit board 27 is connected, and the through-hole 63 through which the connector 41 of the auxiliary circuit board 27 (or the connector 36 of the main circuit board 26) can be passed is formed in the board case 29, the main circuit The size reduction of the main body case 2 by the layout in which the substrate 26 and the substrate case 29 are overlapped and arranged can be realized very easily.

  Next, another embodiment of the present invention will be described with reference to FIG. FIG. 11 shows the positional relationship between the circuit element 35 of the main circuit board 26 and the relief portions 67 and 68 of the board case 29 in this case. In this embodiment, all of the circuit elements 42 to 50 and the circuit element 51 of the auxiliary circuit board 27 are arranged so as not to overlap with the circuit element 35 of the main circuit board 26. As a result, the escape portions 67 and 68 of the substrate case 29 corresponding to them become positions that do not overlap with the circuit element 35 (the substrate case 29 and the escape portions 67 and 68 are indicated by broken lines in FIG. 11).

  As in this embodiment, the circuit elements 42 to 51 constituting the second interface circuit 38 are arranged at positions where they do not overlap with the circuit elements 35 mounted on the surface of the main circuit board 26 on the board case 29 side, The relief portions 67 and 68 are formed at positions where they do not overlap with the circuit elements 35 mounted on the surface of the main circuit board 26 on the substrate case 29 side, so that the relief portions of the circuit elements 35 and the board case 29 of the main circuit board 26 are formed. No contact (physical interference) with 67, 68 occurs reliably.

  With such a configuration, even if the circuit elements 35 and the escape parts 67 and 68 protrude in the thickness direction of the main body case 2 so that they overlap each other, the circuit element 35 and the escape parts 67 and 68 are projected. Will not abut. That is, since it is not necessary to reduce the thickness dimension of the portion 62A corresponding to the relief portions 67 and 68 as in the above-described embodiment (FIG. 7), the molding is performed while sufficiently securing the recess dimensions of the relief portions 67 and 68. The inconvenience that the flow of resin at the time deteriorates can be avoided more effectively.

  The arrangement of each circuit component shown in the embodiment is not limited to this, and various arrangements can be made within the scope of the present application depending on the configuration of the second interface circuit 38 corresponding to the data communication device 28. It can be changed.

DESCRIPTION OF SYMBOLS 1 Communication apparatus 2 Main body case 3 Front case 4 Rear case 26 Main circuit board 27 Auxiliary circuit board 28 Data communication apparatus 29 Board case 36, 41 Connector 35, 42-51 Circuit element 63 Through-hole 67, 68 Escape part

Claims (4)

In a communication device in which a data communication device for connection with a communication network, and a circuit for mutually connecting the data terminal device and the data communication device are housed in a main body case,
A main circuit board including a first interface circuit for connecting to the data terminal device, and a communication control circuit for mediating communication between the data terminal device and the data communication device;
A second interface circuit for connecting the data communication device and the main circuit board; an auxiliary circuit board on which the data communication device is mounted;
A board case that is arranged in a manner overlapping with the main circuit board, and that accommodates the auxiliary circuit board on the side opposite to the side facing the main circuit board;
The data communication device is mounted on a surface of the auxiliary circuit board opposite to the main circuit board, and the second interface circuit is mounted on a surface of the auxiliary circuit board on the main circuit board side. ,
Arranging at least a part of the circuit elements constituting the second interface circuit at a position not overlapping with the circuit elements mounted on the surface of the main circuit board on the substrate case side,
A communication device, wherein a recess portion corresponding to a circuit element constituting the second interface circuit is formed in the substrate case so as to protrude toward the main circuit substrate.   The communication apparatus according to claim 1, wherein a thickness dimension of the relief portion of the substrate case is made thinner than a thickness dimension of other portions. The circuit element constituting the second interface circuit is arranged at a position where it does not overlap with the circuit element mounted on the surface of the main circuit board on the substrate case side,
The communication device according to claim 1, wherein the escape portion is formed at a position where it does not overlap with a circuit element mounted on the surface of the main circuit board on the board case side.   The communication device according to claim 1, wherein the substrate case is formed of a synthetic resin.

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