JP6209737B2 - Inverter device - Google Patents

Description

  The present invention relates to an inverter device.

Conventionally, there has been provided an inverter device that converts DC power, such as a solar cell, a storage battery, or a fuel cell, into AC power and supplies the AC power to a load. The inverter device includes a booster circuit that boosts the voltage of DC power, an inverter circuit that converts DC power output from the booster circuit into AC power, and a high-frequency component of AC power converted by the inverter circuit that is provided at the subsequent stage of the inverter circuit. It has a filter circuit and the like.

The booster circuit and the filter circuit have a reactor and a capacitor to which these DC power and AC power are supplied, and these reactors and capacitors depend on the current that flows when DC power or AC power is supplied. Fever.

In order to cool such a heat generating component, in Patent Document 1, a hole through which the heat generating component (a capacitor in Patent Document 1) passes is formed in a die-cast housing, and a part of the capacitor is exposed to the outside through the capacitor. doing. By doing so, the heat generating component directly touches the outside air, and the heat generating component can be cooled. Japanese Patent Application Laid-Open No. H10-228561 describes a content in which an externally exposed capacitor may be covered with a cover having good thermal conductivity.

Japanese Patent Laid-Open No. 10-295087

However, when the heat generating component is a reactor, many of the exposed coils are dangerous. Further, as shown in Patent Document 1, the heat generating component may be sealed from the outside, but heat generated by the heat generating component may not escape to the outside.

This invention is made | formed in view of such a problem, and it aims at providing the inverter apparatus which can heighten the cooling effect of the housing of an inverter apparatus, arrange | positioning a reactor safely.

The inverter device of the present invention is an inverter device that converts DC power into AC power.
A reactor through which the current of the converted AC power flows is provided. A fin is integrally formed on the outer side of the recess, and a wall surrounding the reactor is integrally formed on the housing around the recess. It is characterized in that a resin member having a property is placed and cured to such an extent that it covers the wall.

ADVANTAGE OF THE INVENTION According to this invention, the cooling effect of the housing of an inverter apparatus can be heightened, arrange | positioning a reactor safely.

It is a figure which shows the connection of an inverter apparatus. It is a front view of an inverter apparatus. It is a rear view of an inverter apparatus. It is sectional drawing of an inverter apparatus.

In this embodiment, a hollow in which the reactor is arranged is formed in the housing, and fins are formed on the outside of the hollow, and a wall is integrally formed on the housing so as to surround the reactor around the hollow. Thereby, the cooling effect of the housing of an inverter apparatus can be heightened, arrange | positioning safely.

As shown in FIG. 1, the inverter device 1 includes boost circuits 4 a to 4 d connected to a plurality of solar cells 2 a to 2 d (here, four) via switches S 1 to S 4, respectively. The booster circuit boosts the voltage of each input DC power and supplies the boosted DC power to the inverter circuit 5.

The booster circuits 4a to 4d are connected to a DC reactor D through which a current of DC power output from the solar cell flows.
It is constituted by a non-insulated chopper circuit composed of CL, a switch element, a diode, and a capacitor.

The inverter circuit 5 converts the DC power supplied from the booster circuits 4a to 4d into AC power. The inverter circuit 5 is composed of a circuit in which a plurality of switch elements are connected by a full bridge. A filter circuit 6 that attenuates the high-frequency component of the AC power is connected to the output side of the inverter circuit 5. The configuration of the inverter circuit is not limited to the bridge connection, and a neutral point clamping method or the like can be used.

The filter circuit 6 is provided with an AC reactor through which a current of AC power output from the inverter circuit flows. The AC power that has passed through the filter circuit 6 is superimposed on the commercial power system via, for example, an interconnection relay. Note that the control circuit 7 controls the operations of the booster circuits 4 a to 4 d and the inverter circuit 5 described above.

In this way, the inverter device 1 converts the DC power output from the solar cell into AC power and superimposes the converted AC power on the commercial power system. Thereby, the inverter apparatus can supply alternating current power to the load connected to the commercial power system. When the inverter device 1 operates, a current flows through the direct current reactor DCL and the alternating current reactor ACL to generate heat, leading to a temperature rise of the inverter device 1.

As shown in FIG. 2, the electronic components constituting these inverter devices 1 are accommodated in a housing 10. The switch module IPM including the DC reactor DCL, the AC reactor ACL, the plurality of switch elements of the inverter circuit 5 and the like are directly attached to the casing, and other electronic components are mounted and attached to the boards 16a to 16b.

The housing 10 has a substantially rectangular parallelepiped shape, and the upper panel 11, the lower panel 12, the left panel 13, the right panel 14, and the bottom 15 are integrally formed by die-casting an aluminum alloy or the like. The inverter device 1 seals the front opening of the housing 10 with a front panel,
The outside of the bottom 15 is attached to a building wall or the like.

The casing 10 is a first for arranging an AC reactor ACL and a DC reactor DCL.
A recess 21 and a second recess 31 are formed above the bottom portion 15 (on the upper panel side). This first
The recess 21 and the second recess 31 are formed so as to protrude from the outside of the housing 10. The depths of the first recess 21 and the second recess 31 are the AC reactor ACL and the DC reactor D, respectively.
It is lower (shallow) than the height of CL.

As shown in the AA cross-sectional view of FIG. 2A in FIG. 4A, the AC reactor ACL has a first recess 21.
It is attached to the AC reactor mounting base 25 formed on the bottom of the screw by screwing. Further, the DC reactors DCL of the respective booster circuits are arranged together on the pedestal 36, and the pedestal 36 is attached to the DC reactor mounting base 35 formed on the bottom of the second recess 31 by screws.

Note that electronic components that generate a large amount of heat, such as the switch module IPM disposed between the first recess 21 and the second recess 31, are collectively disposed above the housing 10. Solar cell 2
Wiring from a to 2d and wiring to the commercial power system 3 are collectively routed to the outside from the lid 51 provided in the lower right portion of the housing 10.

As shown in FIG. 3, a plurality of fins F are formed on the outer side of the bottom portion 15 of the housing 10, and the first
Some of the plurality of fins F are integrally formed in the recess 21 and the second recess 31, respectively. In addition, there are a first wall 22 and a second wall 3 around the first recess 21 and the second recess 31 inside the housing 10, respectively.
2 is integrally molded and surrounds the AC reactor ACL and the DC reactor DCL. The first wall 22 and the second wall 32 are erected from the edges of the first recess 21 and the second recess 31, respectively.

The height of the first wall 22 and the second wall 32 is higher than the reactor when the heights of the first recess 21 and the second recess 31 are combined. That is, the AC reactor ACL is accommodated in the hole constituted by the first wall 22 and the first depression, and the DC reactor is accommodated in the hole constituted by the second wall 32 and the first depression.

As shown in the BB cross-sectional view of FIG. 2B in FIG. 4B, the first recess 21 has an AC reactor A.
The resin member 61 having thermal conductivity is put and cured in a state where the CL is disposed. 2 and 4 (a) show a state where the resin member 61 is not filled. Resin member 61
Is inserted to the extent that it covers the first wall 22 (for example, the line X shown in FIG. 4A). The second recess 31 may be similarly filled with the resin member 61.

Further, a metal plate member 24 facing the first recess 21 is provided so that a gap is formed between the plate member 24 and the first wall 22. Specifically, a plurality of first mounting bases 23 for fixing the plate member 24 are formed in the vicinity of the first wall 22 (four in this embodiment), and the plate member 24 is formed on the first mounting base 23. Is attached by screwing.

Since the height from the bottom 15 of the first mounting base 23 is formed higher than the first wall 22,
When the plate member 24 is arranged on the first mounting base 23 formed at four places, a gap is formed between the plate member 24 and the first wall 22. The wiring L of the AC reactor ACL is pulled out from the first recess 21 through this gap.

The plate member 24 is attached so as to cover the entire front side of the first recess 21.
Further, the end of the plate member 24 is bent, and the bent portion and the first member are joined by the bent portion.
It is provided so that the clearance gap between the walls 22 may be covered. The plate member 24 is attached so that the bent portion is positioned in a direction in which another electronic component is arranged (that is, the bent portion is arranged between the electronic component and the gap).

The plate member 24 can be similarly attached to the second recess 31. In this case, the first
A second mounting base 33 is provided in the same manner as the mounting base 23, and the plate member 24 is preferably attached to the second mounting base 33.

As described above, since the AC reactor ACL and the DC reactor DCL are arranged in the first recess 21 and the second recess 31 of the housing 10, respectively, the AC reactor ACL and the DC reactor DCL.
Are covered by the first recess 21 and the first recess 231, respectively, so that the risk of short circuit or the like can be reduced. In addition, the first wall 22 and the second wall provided at the edges of the first recess 21 and the second recess 31, respectively.
Since the wall 32 can conduct heat and dissipate heat from the integrally formed fins to the outside, the cooling effect of the casing 10 of the inverter device 1 can be enhanced.

Moreover, in Example 1, the resin member 6 with high heat conductivity is contained in the first recess 21 and the second recess 31.
1 is inserted to the height of the first wall 22 and the second wall 32, respectively. For this reason, since the heat from the AC reactor ACL and the DC reactor DCL reaches the first wall 22 and the second wall 32 through the resin member 61, respectively, more heat reaches the first wall 22 and the second wall 32. It becomes easy to be transmitted and the heat dissipation effect can be enhanced.

Further, in the first embodiment, the first wall 22 and the second wall 32 are provided at the edges of the first recess 21 and the second recess 31, respectively.
Therefore, the amount of the resin member 61 put into the first dent 21 and the second dent 31 can be reduced. Moreover, since the distance between the AC reactor ACL and the first wall 22 and the DC reactor DCL and the second wall 32 can be shortened, heat is more easily transmitted to the first wall 22 and the second wall 32, and the heat dissipation effect is enhanced. be able to.

Further, in the first embodiment, the AC reactor ACL and the DC reactor DCL are arranged by lowering the depths of the first recess 21 and the second recess 31 respectively by the amount of the first wall 22 and the second wall 32 standing upright. be able to. For this reason, the thickness (length in the bottom direction from the front panel) of the housing 10 can be shortened. Thereby, the inverter apparatus 1 can be reduced in size.

In the first embodiment, the front of the first recess 21 is covered with the metal plate member 24 and the gap between the plate member 24 in the direction in which the electronic component is arranged and the first wall 22 and the second wall 32 is formed. The bent portion of the plate member 24 is covered (the bent portion of the plate member 24 is disposed between the gap and the electronic component). For this reason, it can suppress that noise propagates to AC reactor ACL and DC reactor DCL.

As mentioned above, although one Embodiment of this invention was described, the above description is for making an understanding of this invention easy, and does not limit this invention. It goes without saying that the present invention can be changed and improved without departing from the gist thereof, and that the present invention includes equivalents thereof.

For example, the first wall 22 and the second wall 32 are provided at the edges of the first recess 21 and the second recess 31, respectively, but may be provided at positions slightly away from the edges.

For example, the height of the first wall 22 and the second wall 32 is set to be higher than the reactor when the heights of the first recess 21 and the second recess 31 are combined. good. Even in such a case, the first wall 22 and the second wall 3 can be obtained by inserting the resin member 61 into the wall.
2 can be used to dissipate heat.

For example, the height of the first wall 22 and the first mounting base 23 may be the same height, a part of the first wall 22 may be cut out, and the wiring L may be routed from the cutout.

The inverter device 1 of this embodiment can also be used as a DC power supply system including a DC power supply such as solar cells 2a to 2e.

DESCRIPTION OF SYMBOLS 1 Inverter apparatus 2a-2d Solar cell 3 Commercial power system 4a-4d Booster circuit 5 Inverter circuit 6 Filter circuit 7 Control circuit 10 Housing 11 Upper surface panel 12 Lower surface panel 13 Left side panel 14 Right side panel 15 Bottom part 16a-16b Substrate S1- S4 Switch 21 First recess 22 First wall 23 First mounting base 24 Plate member 25 AC reactor mounting base 31 Second recess 32 Second wall 33 Second mounting base 35 DC reactor mounting base 36 Base 51 Lid 61 Resin member ACL AC reactor DCL DC reactor F Fin L Wiring IPM Switch module

Claims (4)

In an inverter device that converts DC power to AC power,
A reactor through which the converted AC power flows,
In the casing of the inverter device, the reactor is arranged, and a recess having a depth smaller than the height of the reactor is formed to protrude from the outside of the casing,
A fin is integrally formed on the outside of the recess, and a wall surrounding the reactor is integrally formed on the housing around the recess.
Wherein the recess is a resin member having heat conductivity input in a state where the reactor is located
And cured
An inverter device , wherein a plate member opposite to the depression is provided so that a gap is formed between the plate member and the wall . The inverter device according to claim 1, wherein the wall is erected from an edge of the recess. Claim 1 or claim, wherein the withdrawing wiring of the reactor through the gap
Item 3. The inverter device according to Item 2 . Bending the end portion of the plate member, the inverter apparatus according to the bent portion to any one of claims 1 to 3, characterized in that disposed between the electronic components constituting the inverter device and the gap .

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