JP6206278B2 - In-mold component connection structure - Google Patents

Description

  The present invention relates to an in-mold component connection structure, and is applied, for example, to the connection between internal in-mold wiring and components such as an automatic teller machine (ATM) that inserts a medium such as banknotes and performs a desired transaction. And suitable.

  Conventionally, in an automatic cash transaction apparatus or the like used in a financial institution or a store, for example, the customer is allowed to deposit cash such as banknotes and coins according to the transaction contents with the customer, and the cash is withdrawn to the customer. Has been made.

  As an automated teller machine, for example, a banknote deposit / withdrawal unit that exchanges banknotes with customers, a discrimination unit that discriminates the denomination and authenticity of inserted banknotes, and temporarily holds inserted banknotes There is a thing which has a temporary storage part which performs, a conveyance part which conveys a bill, and a bill storage which stores a bill for every denomination.

  A frame, which is a resin-molded product, is provided inside the casing of such an automatic teller machine, and various sensors, motors, substrates, etc. are attached to the frame, A number of cords for connecting the components exist in the frame.

  By the way, an in-mold component connection structure in which a wiring pattern is directly formed on a molded product such as a frame by plating has been proposed (for example, see Patent Document 1).

JP-A-5-259608

  In such an in-mold component connection structure, for example, a more useful function is desired when used inside an automatic teller machine.

  The present invention has been made in view of the above points, and intends to propose an in-mold component connection structure that can provide a useful function.

  In order to solve such a problem, the in-mold component connection structure of the present invention includes a holding portion for holding a connected component in a molded product formed by molding and having a wiring pattern formed on the surface, and a conductive elastic body. In addition, a conduction positioning portion is provided between the wiring pattern and the connected component to conduct and position the wiring pattern and the connected component.

  This in-mold component connection structure can ensure electrical connection between the connected component and the molded product while holding the connected component in the molded product with a simple structure.

Further, in the in-mold component connection structure of the present invention, there is a holding portion that is flexible and biases and holds the connected component toward the molded product having the wiring pattern formed on the surface, and is opposed to the holding portion. and providing a conductive portion for electrically connecting the provided wiring patterns and the object to be connected components, moldings that have to be connected component storage portion that is recessed from the surface of the molded article so as to surround the object to be connected components I did it.

  This in-mold component connection structure can ensure electrical connection between the connected component and the molded product while holding the connected component in the molded product with a simple structure.

  According to the present invention, the electrical connection between the connected component and the molded product can be ensured with a simple structure while the connected component is held in the molded product. Thus, the present invention can realize an in-mold component connection structure that can provide a useful function.

It is a perspective view which shows the structure of an automatic teller machine. It is a top view which shows the structure (1) of the component connection part in a shaping | molding by 1st Embodiment. The structure (2) of the in-mold component connection part by 1st Embodiment is shown, and it is AA arrow sectional drawing in FIG. The structure (3) of the in-mold component connection part by 1st Embodiment is shown, and it is BB arrow sectional drawing in FIG. It is a top view which shows the structure (1) of the wiring part in a shaping | molding by 1st Embodiment. The structure (2) of the wiring part in a shaping | molding by 1st Embodiment is shown, and it is AA arrow sectional drawing in FIG. It is a top view which shows the structure (1) of the sensor by 1st Embodiment. The structure (2) of the sensor by 1st Embodiment is shown, and it is AA arrow sectional drawing in FIG. It is a bottom view which shows the structure (3) of the sensor by 1st Embodiment. It is a perspective view which shows the structure of a wiring pattern. The structure of the component connection part in a shaping | molding by 2nd Embodiment is shown, (A) is a top view, (B) is AA arrow sectional drawing in (A), (C) is B- in (A). It is B arrow sectional drawing. It is a typical right view which shows a mode that a sensor is accommodated in a sensor accommodating part in the component connection part in a shaping | molding by 2nd Embodiment. The structure (1) of the wiring part in a shaping | molding by other embodiment is shown, (A) is a top view, (B) is AA arrow sectional drawing in (A). It is sectional drawing which shows the structure (2) of the wiring part in a shaping | molding by other embodiment. It is a top view which shows the structure (3) of the wiring part in a shaping | molding by other embodiment. It is a perspective view which shows the structure (1) of the wiring pattern by other embodiment. It is a perspective view which shows the structure (2) of the wiring pattern by other embodiment. It is a perspective view which shows the structure (3) of the wiring pattern by other embodiment. It is a perspective view which shows the structure (4) of the wiring pattern by other embodiment. It is a perspective view which shows the structure (5) of the wiring pattern by other embodiment. It is a perspective view which shows the structure (6) of the wiring pattern by other embodiment.

  Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[1. First Embodiment]
[1-1. Configuration of automatic teller machine]
As shown in FIG. 1, the automatic teller machine 1 is configured around a box-shaped housing 2, and is installed in a financial institution, for example, for a deposit transaction or a withdrawal transaction with a customer. Transactions related to cash. The case 2 has a shape in which a portion where it is easy to insert a bill or operate with a touch panel while the customer faces the front side, that is, a portion extending from the upper part of the front surface to the upper surface is obliquely cut off, The customer service part 3 is provided in this part.

  The customer service section 3 is provided with a card entry / exit port 4, a deposit / withdrawal port 5, an operation display unit 6, a numeric keypad 7 and a receipt issuance port 8. Receives information and accepts operation instructions.

  The card entry / exit 4 is a portion into which various cards such as a cash card are inserted or ejected. A card processing unit (not shown) for reading account numbers and the like magnetically recorded on various cards is provided on the back side of the card slot 4. The deposit / withdrawal port 5 is a portion where a bill to be deposited by a customer is inserted and a bill to be dispensed to the customer is discharged. The deposit / withdrawal port 5 is opened or closed by driving a shutter. The operation display unit 6 is integrated with an LCD (Liquid Crystal Display) that displays an operation screen at the time of transaction and a touch panel for selecting a transaction type, inputting a personal identification number, transaction amount, and the like. The numeric keypad 7 is a physical key that accepts input of numbers such as “0” to “9”, and is used at the time of input operation such as a password or transaction amount. The receipt issuing port 8 is a part that issues a receipt on which transaction details are printed at the end of transaction processing. Incidentally, a receipt processing unit (not shown) for printing transaction contents and the like on the receipt is provided on the back side of the receipt issuing port 8.

  In the housing 2, a main control unit 9 that performs overall control of the entire automatic cash transaction apparatus 1, a banknote depositing and dispensing machine 10 that performs various processes related to banknotes, and the like are provided. In the following, the side of the automated teller machine 1 facing the customer is the front side, the opposite is the rear side, the left and right sides are the left side and the right side as viewed from the customer facing the front side, and the upper side and the lower side. Is defined and explained.

  The housing 2 is configured such that a front door that covers the front surface and a rear door (not shown) that covers the rear surface can be opened and closed. That is, the housing | casing 2 protects the banknote, coin, etc. which are hold | maintained by obstruct | occluding a front door etc. at the time of the transaction operation | movement which performs the transaction regarding cash with a customer. On the other hand, the housing 2 facilitates work on each internal part by opening the front door, etc. as necessary during maintenance work in which a maintenance worker such as an employee of a financial institution replenishes and collects banknotes. It is made to be able to let you.

[1-2. Configuration of part connection part in molding]
A frame 20 that is a molded product made of a resin such as polyphenylene sulfide resin (PPS) is provided inside the housing 2. The frame 20 includes various sensors, motors, substrates, and the like. Is attached. Further, a wiring pattern made of, for example, copper foil is formed on the surface of the frame 20 by plating. As shown in FIGS. 2 to 9, in the in-mold component connection portion 22, a sensor 32 is fixed to the in-mold wiring portion 24 in the frame 20. Hereinafter, the state in which the sensor 32 is fixed to the in-mold wiring portion 24 is also referred to as a sensor fixed state.

  As shown in FIGS. 5 and 6, the in-mold wiring portion 24 of the frame 20 has connection pads 28 at the tips of the wiring patterns 26 that are arranged in parallel on the frame wall surface 21 that is a flat surface of the frame 20. Is formed. From both the left and right sides of the wiring pattern 26, holding portions 30 that are claws integrally formed with the frame wall surface 21 protrude upward. The holding unit 30 has a plate-like portion 30A that is plate-shaped and contacts the frame wall surface 21, and a hook-shaped portion 30B that is claw-shaped and formed at the tip of the plate-like portion 30A.

  As shown in FIGS. 7 to 9, the sensor 32 is, for example, a photosensor, and a hemispherical light emitting / receiving unit 36 is mounted on the center of a flat sensor substrate 34. When the sensor 32 is attached to the in-mold wiring part 24, the width slightly narrower than the width in the left-right direction of the flange portion 30 </ b> B of the holding part 30 at a position facing the holding part 30 on both the left and right sides of the light emitting / receiving part 36. Is formed from the upper surface to the lower surface of the sensor substrate 34. A plate spring pad 42, which is a rectangular circuit pattern on which the plate spring 40 is mounted, is formed at a position facing the connection pad 28 on the lower surface of the sensor substrate 34 when the sensor is fixed. A conductive plate spring 40 is mounted on the pad 42.

  The sensor 32 is pressed toward the frame wall surface 21 with the slit 38 being aligned with the holding portion 30, and the holding portion 30 penetrates the slit 38 while being deformed, so that the flange portion 30 </ b> B of the holding portion 30 is deformed. The sensor is caught on the upper surface of the sensor substrate 34 and the sensor is fixed. At this time, the leaf spring 40 is in a contracted state from the normal state.

  In the sensor fixed state, the leaf spring 40 is in a contracted state compared to the normal state, and therefore, the sensor 32 is biased in a direction away from the in-molded wiring portion 24 by a repulsive force that attempts to return to the normal state. On the other hand, since the holding portion 30 penetrates the slit 38 and the flange portion 30B is caught on the upper surface of the sensor substrate 34, the movement of the sensor 32 in the direction away from the in-mold wiring portion 24 is restricted. Thereby, even if the frame 20 vibrates by the motor etc. which were provided in the inside of the automatic teller machine 1, the sensor 32 is positioned so that it may not move with respect to the wiring part 24 in a shaping | molding. Further, the leaf spring 40 makes contact between the sensor 32 and the wiring pattern 26 by contacting the connection pad 28.

[1-3. Wiring pattern configuration]
As shown in FIG. 10, the frame 20 has a concave wiring portion 50, which is a groove having a trapezoidal cross section, provided in the frame wall surface 21. The concave wiring portion 50 is formed with a first side surface 50A, a second side surface 50B and a third side surface 50C which are flat surfaces arranged so as not to be parallel to each other, and the first side surface 50A, the second side surface 50B and the first side surface 50B. One wiring pattern 26 is disposed on each of the three side surfaces 50C. The width of the concave wiring portion 50 is formed to be slightly smaller than the thickness of a human finger, for example.

  By the way, when a cord is used for wiring inside the automatic teller machine 1 as in the past, since the cord is covered with a covering around the conductor, the conductor is in contact with the cord even if the maintenance worker touches the cord. In addition, even if a maintenance worker contacts a plurality of cords at the same time, the cords are not electrically connected.

  On the other hand, in the case of the conventional in-mold wiring, the conductor portion of the wiring pattern is exposed on the surface of the frame that is a molded product. If they are in contact with each other, there is a possibility that the wiring pattern 26 may be damaged, and if they are in contact with a plurality of wiring patterns 26 at the same time, the wiring patterns 26 are made conductive.

  On the other hand, the automatic teller machine 1 forms the wiring pattern 26 in the concave wiring portion 50 that is recessed from the frame wall surface 21. Thereby, the automatic teller machine 1 can reduce the possibility that the maintenance worker will contact the wiring pattern 26, and can prevent the wiring pattern 26 from being damaged or a plurality of wiring patterns 26 from being short-circuited. .

  By the way, inside the frame 20 of the automatic teller machine 1, a static elimination brush (not shown) which is a brush that comes into contact with a bill to be conveyed and removes static electricity is provided at a predetermined location. The static elimination brush is configured by bundling a plurality of conductive static elimination bars having a linear cylindrical shape with a diameter of about 0.5 mm. When the automatic teller machine 1 is moved, the static elimination bar may come off from the static elimination brush and fall into the frame 20 in some cases. In addition, conductive dust and parts may fall into the frame 20. Hereinafter, the charge removal bar, conductive dust, parts, and the like are collectively referred to as a conductive contact.

  Here, when a cord is used for wiring inside the automatic teller machine 1 as in the past, since the cord is covered with a coating around the conductor, the conductive contact object simultaneously contacts a plurality of cords. Even if it did, the cords were not conducted to each other, and a short circuit was not caused.

  On the other hand, in the case of the in-mold wiring as in the present embodiment, the conductor portion of the wiring pattern 26 is exposed on the surface of the frame that is a molded product. When the conductive contact object contacts the plurality of wiring patterns 26 at the same time, the wiring patterns 26 are short-circuited.

  On the other hand, the automatic teller machine 1 forms the wiring pattern 26 in the concave wiring portion 50 that is recessed from the frame wall surface 21. Thereby, even if the conductive contact object falls, the automatic teller machine 1 reduces the possibility that the recessed wiring portion 50 does not enter and contacts the wiring pattern 26, and shorts the wiring patterns 26 to each other. Can be prevented.

  Moreover, the automatic teller machine 1 arrange | positions the wiring pattern 26 one each in each of the 1st side surface 50A which is a flat surface arrange | positioned so that it may not mutually parallel, the 2nd side surface 50B, and the 3rd side surface 50C, and is the same. A plurality of wiring patterns 26 are not arranged on the plane. That is, in the automatic teller machine 1, the wiring patterns 26 running substantially in parallel are not positioned on the same plane, and are divided into at least two or more planes. Thereby, even if the static elimination bar | burr which is a substantially linear cylindrical shape falls, the automatic teller machine 1 can prevent contacting simultaneously with the adjacent wiring pattern 26, and can prevent a short circuit.

  Further, in order not to arrange the wiring patterns 26 on the same plane, it is also conceivable that wiring portions having flat surfaces arranged so as not to be parallel to each other are projected on the frame wall surface 21. However, in the present embodiment, the concave wiring portion 50 is recessed from the frame wall surface 21, so that the maintenance worker contacts the wiring pattern 26 as compared with the case where the wiring portion is convex from the frame wall surface 21. It is possible to further reduce the possibility of doing so.

  Thus, the automatic teller machine 1 arrange | positions the wiring pattern 26 in the side surface of the concave wiring part 50 provided concavely from the planar frame wall surface 21 which is a molded product. Moreover, the automatic teller machine 1 arrange | positions the wiring pattern 26 which runs substantially parallel, dividing | segmenting into at least 2 or more planes. Thereby, the automatic teller machine 1 can suppress the contact from the outside with respect to the said wiring pattern 26 also in the wiring in shaping | molding in which the conductor part of the wiring pattern 26 was exposed.

[1-4. effect]
Conventionally, there are many cords for connecting various parts such as various sensors, motors, boards, etc. inside the automated teller machine, so it takes time and man-hours to route the cords and process wiring in the manufacturing process. It was. Conventionally, when a component such as a sensor is connected to a frame, the sensor is fixed to a metal fitting provided on the frame or the like, and a cord is extended from a connector of the sensor and connected to a predetermined substrate.

  On the other hand, the automatic teller machine 1 directly forms the wiring pattern 26 on the frame 20 which is a molded product by plating. Thus, the automatic teller machine 1 can be wired so as not to interfere with the code, various mechanisms, etc., and the wiring process can be simplified.

  Here, in the case of in-mold wiring as in the case of the automatic teller machine 1, the frame 20 is a molded product that is difficult to apply high heat, and a flow furnace or a reflow furnace cannot be used. Can be considered, but it takes time.

  On the other hand, the automatic teller machine 1 simply presses the sensor 32 toward the frame wall surface 21 so that the holding unit 30 holds the sensor 32 and the leaf spring 40 makes the sensor 32 and the wiring pattern 26 conductive. did. Thereby, the automatic teller machine 1 does not need to solder the sensor 32 to the frame 20 and can fix and conduct the sensor 32 with respect to the frame 20 very easily, thereby reducing the man-hour at the time of product assembly. it can.

  By the way, it is also conceivable to use a predetermined metal piece having almost no elastic force instead of the leaf spring 40. However, in that case, since the frame 20 of the automatic teller machine 1 is vibrated by a motor or the like, the contact between the sensor 32 and the connection pad 28 may not be ensured.

  In contrast, in the automatic teller machine 1, the sensor 32 and the connection pad 28 are brought into contact with each other by a leaf spring 40 which is a conductive elastic body. As a result, the automatic teller machine 1 absorbs the vibration of the frame 20 by the leaf spring 40, keeps the contact between the sensor 32 and the connection pad 28, and the position of the sensor 32 with respect to the in-mold wiring portion 24 does not shift. Can continue to do so.

  According to the above configuration, the automatic teller machine 1 is formed by molding, and the holding unit 30 that holds the sensor 32 as a connected component on the frame 20 that is a molded product having the wiring pattern 26 formed on the surface thereof, A plate spring 40 made of a conductive elastic body and provided between the wiring pattern 26 and the sensor 32 and conducting the wiring pattern 26 and the sensor 32 is provided. Thereby, the automatic teller machine 1 can ensure electrical connection between the sensor 32 and the frame 20 while holding the sensor 32 on the frame 20 with a simple structure.

[2. Second Embodiment]
[2-1. Configuration of part connection part in molding]
As shown in FIG. 1, the automatic teller machine 101 according to the second embodiment is different from the automatic teller machine 1 according to the first embodiment in that the frame 120 is different from the frame 20, but otherwise. Are structured similarly. As shown in FIG. 11, the in-mold component connecting portion 122 of the frame 120 is different from the in-mold component connecting portion 22 of the frame 20. In the in-mold component connection part 122, the sensor 132 is fixed to the in-mold wiring part 124 in the frame 120. Hereinafter, the state in which the sensor 132 is fixed to the in-mold wiring portion 124 is also referred to as a sensor fixed state.

  The sensor 132 is, for example, a photo sensor, and a hemispherical light emitting / receiving unit 64 is mounted on the left side of the upper surface of the rectangular parallelepiped sensor box 62. The sensor box 62 is provided with a position restricting concave portion 70 having a substantially trapezoidal shape in cross section on the left side of the lower surface, and a conductive concave portion 72 having a substantially trapezoidal shape in cross section on the right side of the lower surface. A conductive pad (not shown) is formed in the conductive recess 72.

  The in-mold wiring portion 124 of the frame 120 is recessed from the frame wall surface 121, which is a flat surface of the frame 120, and includes a sensor storage portion 66 that stores the sensor 132 and opens on the right side, and the sensor storage portion 66 and the frame wall surface 121. It has a sensor guide part 68 that is provided in between and guides the sensor 132 to the sensor storage part 66.

  The sensor storage section 66 has an inner space that is slightly larger than the outer shape of the sensor 132 and is a planar inner wall surface that is opposed to the outer shape in the front-rear direction of the sensor 132 with a slightly wider space therebetween. A storage portion front side wall surface 66 </ b> F and a storage portion rear side wall surface 66 </ b> B that are in contact with the front side surface and the rear side surface of 62 are formed. The sensor storage portion 66 is formed with a storage portion left wall surface 66 </ b> L that is a planar inner wall surface that contacts the left side surface of the sensor box 62. Further, the sensor storage portion 66 is formed with a storage portion lower side wall surface 66 </ b> D which is a substantially planar inner wall surface that contacts the lower surface of the sensor box portion 62. In order to avoid the light emitting / receiving unit 64 of the sensor 132 from the upper end of the storage unit left wall surface 66L in the sensor storage unit 66, a gap is formed between the storage unit front side wall surface 66F and the storage unit rear side wall surface 66B. A book storage holder 74 extends toward the right side. The storage unit upper wall surface 66U that contacts the upper side surface of the sensor box unit 62 in the storage holding unit 74 and the storage unit lower wall surface 66D are opposed to each other with a slightly wider gap than the vertical profile of the sensor 132. . The storage holding part 74 has flexibility and regulates the upward movement of the sensor 132 by urging the sensor box part 62 downward.

  A position restricting convex portion 76 having a substantially trapezoidal shape in cross section is provided at a location facing the position restricting concave portion 70 of the sensor box portion 62 on the lower wall surface 66D of the storage portion, and the position restricting concave portion 70 is formed in the sensor fixed state. It is inserted. Thereby, the position restricting convex portion 76 restricts the movement of the sensor 132 in the right direction (that is, the direction away from the sensor storage portion 66). Further, a conductive convex portion 78 having a substantially trapezoidal shape in cross section is provided at a location facing the conductive concave portion 72 of the sensor box 62 on the lower wall surface 66D of the storage portion, and the conductive concave portion 72 is fitted in the sensor fixed state. It is out. Thereby, the conduction convex part 78 restricts the movement of the sensor 132 in the right direction (that is, the direction away from the sensor storage part 66). Further, a wiring pattern 126 extending from the frame wall surface 121 is disposed on the surface of the conductive convex portion 78, and a conductive portion 80 is formed. In the sensor fixed state, the conductive part 80 makes the sensor 132 and the wiring pattern 126 conductive by contacting the wiring pattern 126 with a conductive pad (not shown) of the conductive recess 72.

  The sensor guide portion 68 is formed with a guide portion curved wall surface 68D which is a flat surface which is continuous with the storage portion lower wall surface 66D and curves toward the frame wall surface 121.

  As shown in FIG. 12, the sensor 132 is housed in the sensor housing portion 66 while being moved from the frame wall surface 121 so as to slide the sensor guide portion 68 in the left-right direction that is substantially the same direction as the frame wall surface 121. Specifically, when the sensor 132 moves from the sensor guide portion 68 toward the sensor storage portion 66 as shown in FIG. 12 (A), the storage holding portion 74 moves upward as shown in FIG. 12 (B). By bending, the left side of the sensor box 62 is guided to the sensor housing 66.

  When the sensor 132 is further pushed toward the back side (left side) of the sensor storage portion 66, the lower left end portion of the sensor box portion 62 comes into contact with the position restricting convex portion 76, but as shown in FIG. When the storage holding portion 74 is further bent, the sensor 132 gets over the position restricting convex portion 76. Thereby, the sensor 132 is accommodated in the sensor accommodating portion 66 as shown in FIG.

  At this time, the storage holding portion 74 urges the sensor 132 toward the storage portion lower wall surface 66D, and the position restricting convex portion 76 fits into the position restricting concave portion 70 and the conductive convex portion 78 fits into the conductive concave portion 72, respectively. The sensor 132 is positioned on the storage holder 74. Further, when the wiring pattern 126 comes into contact with a conductive pad (not shown) of the conductive recess 72, the conductive part 80 makes the sensor 132 and the wiring pattern 126 conductive.

  In the above-described configuration, the in-mold component connecting portion 122 accommodates the sensor 132 in the sensor housing portion 66 only by the sensor 132 being pushed into the sensor housing portion 66 along the sensor guide portion 68. As a result, the automatic teller machine 101 does not need to provide the sensor substrate 34 with the slit 38 or the in-molded wiring part 24 with the holding part 30 like the in-molded component connection part 22, and can perform a simple operation with a simple configuration. Thus, the sensor 132 can be fixed to the frame 120 and conduction can be established.

  In addition, the molded part connection portion 122 according to the first embodiment according to the second embodiment has substantially the same operational effects as the molded part connection portion 22 according to the first embodiment.

  According to the above configuration, the in-mold connection part 122 has flexibility and biases and holds the sensor 132 toward the housing lower wall surface 66D which is a molded product having the wiring pattern 126 formed on the surface. And a conductive portion 80 provided to face the storage and holding portion 74 and to conduct the wiring pattern 126 and the sensor 132. Thereby, the automatic teller machine 101 can ensure electrical connection between the sensor 132 and the frame 120 while holding the sensor 132 on the frame 120 with a simple structure.

[3. Other Embodiments]
In the above-described first embodiment, the case where the in-molded wiring portion 24 and the sensor 32 are electrically connected by the leaf spring 40 has been described. The present invention is not limited to this, and any elastic member that has conductivity, such as a conductive rubber, a compression spring, and a metal rod with a built-in compression spring, that extends from a contracted state and absorbs vibrations may be used.

  In the above-described first embodiment, the case where the sensor 32 and the wiring pattern 26 are electrically connected by the leaf spring 40 mounted on the sensor 32 side has been described. The present invention is not limited to this. For example, a shaped leaf spring portion 60 is formed on the frame 20 so as to lift the wiring pattern 26 toward the sensor 32 (not shown) as in the in-molded wiring portion 224 shown in FIG. The sensor fixed state may be set in a state in which the tip of the shaped leaf spring portion 60 is closer to the frame wall surface 21 than in the normal state. In short, a mechanism that has elasticity and conducts the sensor 32 and the wiring pattern 26 may be provided in the sensor 32 or on the frame 20 side.

  Furthermore, in the first embodiment described above, the case where the sensor is fixed by inserting the holding portion 30 into the slit 38 has been described. The present invention is not limited to this, and various holding methods may be used, such as sandwiching the side surface of the sensor substrate with a claw-shaped holding portion.

  Further, as shown in FIG. 14, the position restricting protrusion 82 that contacts the right side of the right side surface of the sensor box portion 62 in the sensor fixed state is provided on the lower side wall surface of the storage portion with respect to the in-mold wiring portion 24 of the second embodiment described above. You may project from 66D.

  Further, in the conductive portion 80 according to the second embodiment described above, a predetermined conductive elastic member is disposed between the conductive protrusion 78 and the conductive pad of the conductive recess 72, so that the conductive elastic member can be used as a frame. The vibration of 120 may be absorbed and conduction between the sensor 132 and the wiring pattern 126 may be secured.

  Further, in the second embodiment described above, the sensor 132 is provided with a gap between the upper end portion of the storage portion left side wall surface 66L of the sensor storage portion 66 and the storage portion front side wall surface 66F and the storage portion rear side wall surface 66B. The case where the two storage holding parts 74 are extended toward the right side so as to avoid the light receiving / emitting part 64 is described. The present invention is not limited to this, and, for example, from the upper end of the storage portion left wall surface 66L of the sensor storage portion 66, the storage portion front side wall surface 66F and the storage portion rear side wall surface 66B, as in the molded wiring portion 424 shown in FIG. One storage holding portion 474 having a light receiving / emitting hole portion 84 formed at a position facing the light receiving / emitting portion 64 of the sensor 132 may be extended toward the right side with a gap therebetween.

  Further, in the above-described second embodiment, the case where the sensor storage portion 66 is recessed from the frame wall surface 121 has been described. The present invention is not limited to this, and the sensor storage portion may be provided in a box shape from the frame wall surface 121. In this case, protrusions or depressions that engage with the sensor may be formed on the front wall surface and the rear wall surface inside the sensor storage unit.

  Further, in the above-described second embodiment, the case where the sensor storage portion 66 having the substantially rectangular parallelepiped internal space for storing the rectangular parallelepiped sensor box portion 62 is described. The present invention is not limited to this, and when the shape of the sensor box portion is other than a rectangular parallelepiped shape, a sensor storage portion having various internal spaces corresponding to the shape of the sensor box portion may be provided.

  Further, in the above-described embodiment, the case where the present invention is applied when the sensor 32 which is a photosensor is fixed to the frame 20 and is conducted is described. The present invention is not limited to this, and the present invention may be applied when various electronic components such as a motor and a substrate are fixed to the frame 20 and are electrically connected.

  Further, in the above-described first embodiment, the case where the sensor 32 is held by the in-molded wiring portion 24 by the holding portion 30 has been described. The present invention is not limited to this, and the sensor 32 may be firmly held on the in-molded wiring portion 24 by screwing or the like.

  Further, in the above-described embodiment, the case where the concave wiring portion 50 having a trapezoidal cross section is provided in the frame wall surface 21 has been described. The present invention is not limited to this. For example, as shown in FIG. 16, a concave wiring portion 150 having a rectangular cross section is provided from the frame wall surface 21, and the first side surface 150 </ b> A, the second side surface 150 </ b> B, and the third side One wiring pattern 26 is arranged on each of the side surfaces 150C, or two concave wiring portions 250 having a triangular cross section are arranged side by side from the frame wall surface 21 as shown in FIG. One wiring pattern 26 is arranged on each of the first plane 250A and the second plane 250B, or a concave wiring portion 350 having a triangular cross section is provided from the frame wall surface 21 as shown in FIG. Two or more wiring patterns 26 may be disposed on each of the first side surface 350A and the second side surface 350B. In short, the concave wiring portion may be formed in various cross-sectional shapes from the frame wall surface 21, and the wiring pattern 26 may be formed on the plane of the concave wiring portion.

  Further, as shown in FIG. 19, a convex wiring portion 452 having a quadrangular cross section is provided from the frame wall surface 21, and wiring patterns are provided on the first side surface 452A, the second side surface 452B, and the third side surface 452C of the convex wiring portion 452, respectively. 26 are arranged one by one, or as shown in FIG. 20, a convex wiring portion 552 having a triangular cross section is projected from the frame wall surface 21, and each of the first side surface 552A and the second side surface 552B of the convex wiring portion 552 is provided. The wiring patterns 26 are arranged one by one, or as shown in FIG. 21, convex wiring portions 652 having a semicircular cross section are provided so as to protrude from the frame wall surface 21, and the virtual circumscribing surfaces of the protruding wiring portions 652 are mutually connected. The wiring pattern 26 may be disposed at a location that is not parallel.

  Furthermore, in embodiment mentioned above, the case where this invention was applied in the automatic teller machines 1 and 101 which trade a banknote was described. The present invention is not limited to this, and may be applied to various devices that handle thin paper-like media such as bonds, certificates, gift certificates, cash vouchers and admission tickets. In addition, for example, it is configured by a combination of a plurality of types of apparatuses that perform various processes related to transactions of banknotes and coins, such as banknote depositing and dispensing machines for depositing and unloading banknotes and sealing small bundle payment machines for sealing banknotes every predetermined number. The present invention may be applied to a cash processing apparatus.

  Furthermore, in the above-described embodiment, the case where the present invention is applied to the automatic cash transaction apparatus 1 that performs the deposit transaction and the withdrawal transaction has been described, but the present invention is applied to an apparatus that performs only one of the deposit transaction and the withdrawal transaction. The invention may be applied.

  Furthermore, in the first embodiment described above, a case where the molded part connection part 22 as the molded part connection structure is configured by the holding part 30 as the holding part and the leaf spring 40 as the conduction positioning part. Stated. The present invention is not limited to this, and the in-mold component connection structure may be configured by a holding portion having various other configurations and a conduction positioning portion.

  Furthermore, in the second embodiment described above, a case where the in-mold component connection portion 122 as the in-mold component connection structure is configured by the storage holding portion 74 as the holding portion and the conduction portion 80 as the conduction portion. Stated. The present invention is not limited to this, and the in-mold component connection structure may be constituted by a storage holding portion having various other configurations and a conduction portion.

  The present invention can also be used in various cases in which in-mold wiring and parts are connected.

  DESCRIPTION OF SYMBOLS 1,101 ... Automatic cash transaction apparatus, 2 ... Housing, 3 ... Customer service part, 4 ... Card entrance / exit, 5 ... Deposit / withdrawal port, 6 ... Operation display part, 7 ... Numeric keypad, 8 ... ··· Receipt issuing port, 9 ··· Main control unit, 10 ··· Banknote depositing / dispensing machine, 20, 120 ··· Frame, 21 ··· Frame wall surface, 22, 122, 222, 322 ··· In-mold component connection portion, 24, 124, 224, 324... In-molded wiring portion, 26... Wiring pattern, 28 .. connection pad, 30 .. holding portion, 30 A .. plate-like portion, 30 B. , 34... Sensor substrate, 36... Light emitting and receiving part, 38... Slit, 40 .. leaf spring, 42 .. leaf spring pad, 50 .. recessed wiring part, 50 A, 150 A, 250 A, 350 A, 452 A, 552A, 652A ...... first side, 50B, 150B, 50B, 350B, 452B, 552B ...... Second side, 50C, 150C, 452C ... Third side, 452, 552, 652 ... Convex wiring part, 60 ... Molded leaf spring part, 62 ... Sensor box part, 64... Light emitting / receiving section, 66... Sensor housing section, 66 U... Storage section upper wall surface, 66 D. Rear side wall surface, 68... Sensor guide portion, 68 D... Guide portion curved wall surface, 70... Position restriction recess, 72 .. conduction recess, 74 474. 78... Convex protrusion 80... Conducting portion, 82.

Claims (4)

A holding portion that has flexibility and biases and holds the connected component toward the molded product on which the wiring pattern is formed;
Wherein the wiring pattern is provided to face the holding portions have a a conductive portion to conduct and the connected parts,
The in-mold component connection structure, wherein the molded product has a connected component storage portion that is recessed from the surface of the molded product so as to surround the connected component . The in-mold component connection structure according to claim 1 , wherein the conductive portion is provided so as to protrude from a wall surface forming the connected component storage portion toward the connected component. The in-mold component connection structure according to claim 1 , further comprising a restriction portion that abuts against a side surface of the connected component and restricts movement of the connected component in a direction away from the connected component storage portion. The in-mold component connection structure according to claim 1 , wherein the connected component storage portion is formed with an opening in which the connected component is stored while being slid along substantially the same direction as the surface of the molded product.

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