JP6190708B2 - Laser processing method and apparatus - Google Patents

Description

  The present invention relates to a laser processing method and apparatus for drilling holes in a plate-like workpiece, and more specifically, a state in which a cut piece (cutout piece) generated when drilling a hole by laser processing is caught in a hole. The present invention relates to a laser processing method and apparatus capable of preventing the occurrence of the problem.

  Conventionally, holes having various shapes such as a round shape and a square shape have been formed on a plate-like workpiece by laser processing. As described above, when drilling a workpiece by laser processing, the kerf width is narrow, and thus a cut piece cut inside the hole may be caught in the hole. Furthermore, in laser processing using a fiber laser, the kerf width is narrower than that in the case of a CO2 laser, and the above-mentioned catching is likely to occur.

  As described above, when the cut piece is caught on the work, the cut piece may enter between the work table and the work when the work moves relative to the work table, and the work may be scratched. In view of this, it has been proposed to provide a cutting / separating device for forcibly dropping the cut piece from the hole after the workpiece has been drilled (see, for example, Patent Document 1).

JP-A-4-367391

  The configuration described in Patent Document 1 is a configuration in which a laser processing head in a laser processing machine is provided so as to be movable up and down, and a cutting and separating device is provided separately from the laser processing head. Then, after drilling the workpiece, the laser processing head is raised, the cutting / separating device is positioned below the raised laser processing head, and the cut piece is forcibly dropped. Therefore, there is a problem that the overall configuration is complicated, and, for example, when hole processing is continuously performed at a plurality of locations, it is inefficient.

  The present invention has been made in view of the above-described problems, and is a laser processing method for drilling a plate-like workpiece, and after performing hole processing by laser processing in accordance with a pre-made hole processing program. In order to drop the cutting piece in the processing hole, the laser processing head according to a pre-programmed cutting piece dropping program in which the relative movement path of the laser processing head with respect to the processing hole and the injection of the assist gas on the movement path are programmed. It is characterized by controlling the operation of.

  In addition, a laser processing method for drilling a plate-like workpiece, the hole processing by laser processing according to a pre-prepared hole processing program, in order to drop the cut piece in the processing hole, the hole A cutting piece dropping program including a relative movement path of the laser processing head with respect to the machining hole and injection of assist gas on the movement path is created with reference to the machining program, and the cutting piece dropping program is created according to the created cutting piece dropping program. The operation of the laser processing head is controlled.

  Also, a laser processing method for drilling holes in a plate-shaped workpiece, in order to drop a cut piece in a processed hole after performing hole processing by laser processing according to a hole processing program created in advance, the processing When the hole diameter, short axis, or short side length is shorter than a preset set length, the relative movement path of the laser machining head with respect to the machining hole and the movement with reference to the hole machining program A cutting piece dropping program including injection of assist gas on the path is created, and the operation of the laser processing head is controlled according to the created cutting piece dropping program.

  A laser processing apparatus that performs laser processing on a plate-shaped workpiece, the first program storing means storing a plurality of hole processing programs for performing hole-shaped cutting processing by laser processing, and each of the holes In order to drop the cut piece in the machining hole laser-machined according to the machining program, the relative movement path of the laser machining head with respect to the machining hole and the injection of the assist gas on the movement path are set in each of the hole machining programs. Corresponding preprogrammed second program storage means storing a plurality of cutting piece dropping programs, and hole processing retrieved from the first program storage means for performing laser processing on a plate-like workpiece A program selection means for selecting from the second program storage means a program for dropping the cut piece corresponding to the program for use in the selection; In accordance with the drilling program and cut pieces drop out program, and is characterized in that it comprises a machining head operation control means for controlling the operations of the laser machining head.

  A laser processing apparatus that performs laser processing on a plate-shaped workpiece, the first program storing means storing a plurality of hole processing programs for performing hole-shaped cutting processing by laser processing, and each of the holes In order to drop the cut piece in the machining hole laser-machined according to the machining program, the relative movement path of the laser machining head with respect to the machining hole, the relative speed condition of the laser machining head in the movement path, and the injection of assist gas In order to perform laser processing on the plate-like workpiece, the second program storage means storing a plurality of cutting piece dropping programs whose conditions can be set in correspondence with the respective hole drilling programs, A cutting piece dropping program corresponding to the hole machining program selected from the program storage means is selected from the second program storage means. Program selection means, and input means for setting the speed condition on the moving path of the cutting piece dropping program and the assist gas injection condition for each cutting piece dropping program or the thickness of the workpiece to be processed and the material. Then, the selected hole drilling program and the selected cutting piece dropping program or the workpiece thickness to be machined, the speed condition on the moving path set in accordance with the material, and the assist gas injection condition are input. And machining head operation control means for controlling the operation of the laser machining head in accordance with the cutting piece dropping program.

  A laser processing apparatus that performs laser processing on a plate-shaped workpiece, wherein a program storage means that stores a plurality of hole processing programs for performing hole processing by laser processing, and each of the hole processing programs In order to drop the cut piece in the machining hole laser-machined according to the above, the relative movement path of the laser machining head with respect to the machining hole and the relative position of the laser machining head on the movement path with reference to each hole machining program Creating means for creating a cutting piece dropping program including specific speed conditions and assist gas injection conditions, and machining head operation control for controlling the operation of the laser machining head in accordance with the hole machining program and the cutting piece dropping program And means.

  A laser processing apparatus that performs laser processing on a plate-shaped workpiece, wherein a program storage means that stores a plurality of hole processing programs for performing hole processing by laser processing, and each of the hole processing programs The comparison means for comparing whether the diameter or the short axis or the length of the short side of the processed hole is shorter than a preset set length in order to drop the cut piece in the processed hole laser processed according to As a result of the comparison of the means, when the diameter or the length of the short axis or the short side is equal to or shorter than the set length, the laser machining head relative to the machining hole is referred to with reference to each hole machining program. Creating means for creating a cutting piece dropping program including a general moving path, a relative speed condition of the laser processing head on the moving path, and an assist gas injection condition; And it is characterized in that it comprises a and a machining head operation control means for controlling the operation of the laser processing head in accordance with the drilling program and the cut pieces fall program.

  According to the present invention, after performing hole machining by laser machining on a plate-like workpiece in accordance with the hole machining program, the laser machining head is operated in accordance with the cutting piece dropping program. In order to drop the cut piece in the processing hole, the assist gas is injected. Therefore, the cut piece in the processed hole is strongly pressed downward by blowing the assist gas, and the cut piece can be dropped from the processed hole, and the problems as described above can be solved.

It is explanatory drawing of the laser processing method of the hole by embodiment of this invention. It is operation | movement explanatory drawing of the laser processing head for dropping a cut piece from the hole which performed laser processing. It is explanatory drawing which showed notionally and schematically the structure of the control apparatus which concerns on 1st Embodiment in a laser processing apparatus. It is explanatory drawing which showed notionally and schematically the structure of the control apparatus which concerns on 2nd Embodiment in a laser processing apparatus.

  When a hole is drilled in a plate-shaped workpiece by a laser processing machine, holes having various shapes such as a round shape and a square shape can be cut. However, as a hole processing, when a circular or square hole is processed, a cut piece is often caught in the hole. The same applies to a round hole or a long hole that a cut piece is caught in a processed hole subjected to laser processing. In the case of a round hole, the diameter is often about 30 mm or less, and in the case of a long hole, the diameter is often about 30 mm or less. Since the laser processing machine has a well-known configuration, a detailed description of the overall configuration of the laser processing machine is omitted.

  Referring to FIG. 1, when laser processing is performed on a small rectangular (square) hole 1 having a side of about 30 mm or less on a plate-like workpiece W, laser processing is started from the inside of the hole 1. In this case, piercing is performed at an appropriate position such as the center position or near the center of gravity of the hole 1, and laser processing is performed from the piercing position P in the direction of the contour line 3 of the hole 1. When the laser processing reaches the position of the contour line 3, the laser processing is performed along the contour line 3 from the intersection position 5 between the contour line 3 and the laser processing position.

  Then, laser processing proceeds along the contour line 3 of the hole 1, and when the laser processing is completed and reaches the intersection position 5, the laser processing of the hole 1 is terminated, and laser light irradiation and assist gas are performed. Injection (spout) is stopped. There is no problem even if the intersection position 5 and the processing end position are identified. Therefore, the intersection position 5 and the processing end position are synonymous.

  When laser processing of the hole 1 is performed as described above, the assist gas is ejected (injected) from the laser processing head, so that the processing end position (intersection) of the cut piece (cutout piece) 7 when processing the hole 1 is performed. At the moment when the cut piece 7 is cut off from the workpiece W by the assist gas ejected to the position (5), the processing end position 5 side of the cut piece 7 is sprayed downward.

  Therefore, the cut piece 7 may be caught in the hole 1 with a slight inclination so that the processing end position 5 side is lowered as shown in FIG. 1B, for example. Further, as shown in FIG. 1C, the machining end position 5 side of the cut piece 7 may move downward in the hole 1, and the opposite side of the machining end position 5 may be caught in the hole 1. Note that the cut piece 7 dropped from the hole 1 falls into a scrap box (not shown).

  As described above, when the cut piece 7 is caught in the hole 1 processed into the work W, the cut piece 7 enters between the work table and the work W when the work W is moved, and the back surface of the work W is scratched. May occur. Further, when the cutting piece 7 is caught, the laser processing head and the cutting piece may interfere with each other during the relative movement of the laser processing head.

  Therefore, in the present embodiment, an operation for dropping the cut piece 7 from the hole 1 subjected to laser processing is performed.

  That is, as described above, laser processing is performed along the contour line 3 of the hole 1, and when the processing end position 5 is reached, the laser beam irradiation and the assist gas ejection are stopped and the laser processing ends. Thereafter, the laser processing head is relatively moved from the processing end position 5 near the center position of the hole 1 or near the center of gravity position or in the piercing processing position P direction without changing the height position of the laser processing head. When the laser processing head is moved relatively to the opposite side of the processing end position 5 with the center position or the center of gravity position (hereinafter referred to as the center position O) in between, the laser processing head is located near the center position O. The assist gas is ejected (injected) at the same or higher pressure than that during laser processing.

  At this time, when the laser processing head reaches the vicinity of the center position O of the hole 1, the relative movement of the laser processing head is temporarily stopped and the assist gas is intensively ejected. And in the state which ejected assist gas, it moves to the other side of the said process end position 5, and the position of the outline 3 of the hole 1 or the position close | similar to the outline 3 (these each position is an opposite side position hereafter) 9), the movement is temporarily stopped. Thereafter, the process returns to the processing end position 5 side. As described above, the assist gas is continuously ejected when returning to the processing end position 5 side.

  That is, assist gas is ejected from the laser processing head when the hole 1 moves from the vicinity of the center position O to the opposite position 9 and when the hole 1 returns from the opposite position 9 to the processing end position 5 side. . And when returning to the said process completion position 5, ejection of assist gas is stopped.

  As understood from the above description, when the laser processing head is relatively moved from the processing end position 5 to the opposite side position 9, the movement is temporarily stopped in the vicinity of the center position O of the cut piece 7. Then, the assist gas is ejected for a predetermined time at the stop position. Therefore, when the cut piece 7 is slightly inclined and caught in the hole 1 as shown in FIG. 1B, the assist gas is jetted in the vicinity of the center position O of the cut piece 7. First, the pressure generated by blowing the assist gas acts first. That is, the assist gas is concentrated and injected in the vicinity of the center O of the cut piece 7 for a predetermined time.

  Therefore, the vicinity of the center position O of the cut piece 7 is pressed downward by the action of the assist gas blowing, and the entire cut piece 7 is pressed so as to fall while maintaining a substantially horizontal state. . The assist gas is continuously ejected when moving from the vicinity of the center position O to the opposite position 9. Therefore, the position where the cutting piece 7 is pressed downward is changed by the ejection of the assist gas, the opposite position 9 side of the cutting piece 7 that tends to fall from the hole 1 is pressed, and the cutting piece 7 is moved vertically. There is a tendency to impart a rocking motion. Therefore, the cutting piece 7 can be more reliably dropped.

  Further, the assist gas is ejected when moving from the vicinity of the central position O to the opposite position 9 side, and the movement is temporarily stopped at the opposite position 9. In this stopped state, the assist gas is ejected in a concentrated manner for a predetermined time. Therefore, as shown in FIG. 1C, when the cut piece 7 is largely inclined in advance and the vicinity of the opposite side position 9 is caught in the hole 1, the cut piece 7 is near the upper part where it is caught. The assist gas is concentrated and ejected, so that the cut piece 7 can be more reliably dropped.

  As already understood, after the laser processing of the hole 1 is completed, the laser processing head is relatively moved from the processing end position 5 to the vicinity of the center position O, and the laser processing head is moved from the vicinity of the center position O to the opposite position 9. When the gas is moved relatively, the assist gas is continuously ejected from the laser processing head, whereby the catch of the cut piece 7 with respect to the hole 1 can be more reliably released. In this embodiment, since the assist gas is continuously ejected even in the step of returning the laser processing head from the opposite side position 9 to the processing end position 5, the release of the cutting piece 7 is further released. It can be done reliably.

  By the way, after the laser processing of the hole 1 is completed, the assist gas can be ejected when the laser processing head is relatively moved from the processing end position 5 to the center position O side of the hole 1. In this case, for example, the assist gas is jetted near the processing end position 5 of the cut piece 7 in the state shown in FIG. Therefore, the vicinity of the processing end position of the cut piece 7 may be pressed downward by the ejection of the assist gas, and may change to a state as shown in FIG.

  In this case, unlike the case shown in FIG. 1 (C) from the beginning when the hole 1 is cut, the state shown in FIG. 1 (C) is caused by the ejection of the assist gas. It is. Therefore, the force for sandwiching the cut piece 7 caught in the hole 1 is increased due to the ejection (spraying) of the assist gas. Therefore, since it becomes more difficult to release the cut piece 7, it is not desirable to eject the assist gas when moving from the processing end position 5 to the vicinity of the center position.

  As described above, when laser processing of a small hole (in the case of a square shape, one side is about 30 mm or less) is performed on the workpiece W, the cut piece 7 regardless of the presence or absence of the cut piece (cutout piece) 7 in the hole 1. In order to drop the laser beam, the movement operation of the laser processing head and the ejection operation of the assist gas are performed on the workpiece W as described above. Therefore, in this embodiment, after the laser processing of the small hole as described above is performed on the workpiece W, the above-described operation of the laser processing head for dropping the cut piece 7 is automatically performed.

  Hereinafter, a configuration in which the operation of the laser processing head for dropping the cut piece 7 after the laser processing of the small hole 1 on the workpiece W is automatically performed will be described. In the laser processing apparatus, the configuration in which the laser processing head is moved in the left-right direction (X-axis direction), the front-rear direction (Y-axis direction), and the up-down direction (Z-axis direction) is a well-known configuration. The illustration and description of the overall configuration of the laser processing apparatus are omitted, and the configuration of the control device that controls the operation of the laser processing head will be described.

  By the way, the control of the operation of the laser processing head for dropping the cut piece 7 from the hole 1 controls the following operation. That is, as shown in FIG. 2, the movement operation (A operation) from the machining end position 5 to the vicinity of the center position O, the pause operation (B operation) near the center position O, and the assist gas in the vicinity of the center position O Ejection operation (C operation), movement operation from the vicinity of the center position O to the opposite side position 9 (D operation), temporary stop operation at the opposite side position 9 (E operation), from the opposite side position 9 to the machining end position 5 These are the movement operation (F operation) and the assist gas ejection stop operation (G operation) at the machining end position 5. The above operations A to G are illustrated as shown in FIG.

  The control device 11 for controlling the operation of the laser processing head in the laser processing apparatus for controlling the A operation to the G operation is conceptually and schematically shown in FIG. That is, the control device 11 is configured by a computer and includes a CPU 13, a RAM 15, a ROM 17, an input unit 19, and a display unit 21. Furthermore, the control device 11 includes first program storage means 23.

  The first program storage means 23 stores a plurality of hole drilling programs for performing laser-machining cutting processing of a hole shape such as a rectangular shape, a round hole, or a long hole defined in advance. The hole drilling program is provided every time the hole shape is different or the workpiece material and the plate thickness are different. For example, the hole shape code and the hole drilling program are stored in association with each other.

  In addition, the control device 11 is provided with second program storage means 25. The second program storage means 25 stores a program for dropping a cut piece in association with the program code of each hole machining program stored in the first program storage means 23 or the hole shape code. In the cutting piece dropping program, the operations A to G corresponding to the hole shape are programmed in advance. That is, when the shape of the hole 1 is square as shown in FIG. 1, the operations A to G shown in FIG. 2 are performed corresponding to the shape of the hole.

  As the shape of the hole 1, there are various shapes such as a rectangle, a long hole, an ellipse, and a round hole, and the A operation to the G operation corresponding to each hole processing program for performing laser processing of each hole shape. Are pre-programmed.

  Therefore, in the above configuration, an NC machining program including a plurality of hole shapes or hole shape codes created by an automatic program device or the like from the input means 19 is supplied to the control device 11 via a storage medium or transfer means as appropriate. Alternatively, the NC machining program can be directly input from the input means using a keyboard or the like. When the NC machining program including the hole shape code is input, the program selection means 27 provided in the control device 11 causes the hole machining program corresponding to the hole shape code in the NC machining program to be the first program storage means 23. Selected from. Then, according to the selected hole machining program, the operation of the laser machining head 31 is controlled under the control of the machining head operation control means 29, and the hole 1 is laser machined.

  Further, the program code of the selected hole machining program or the cutting piece dropping program corresponding to the hole shape code is selected from the second program storage means 25. When the hole laser machining by the hole machining program is completed, the laser machining is performed under the control of the machining head operation control means 29 according to the cutting piece dropping program selected corresponding to the hole machining program. The operations A to G of the head 31 are controlled, and an operation for dropping the cut piece 7 from the machining hole is performed.

  According to the above configuration, when an NC machining program including a desired hole shape (hole shape code) for performing laser machining on the workpiece W is input to the control device 11, a hole machining program for performing laser machining on the hole. And the program for cutting piece dropping corresponding to the said hole is selected, and the said A operation | movement-G operation | movement for dropping the cutting piece in a hole and the laser processing of a hole is performed automatically. By repeating this for a plurality of holes sequentially, desired laser processing and dropping of the cut piece can be performed on the workpiece W. Therefore, the operation is easy, and when laser processing of a plurality of holes is repeated, laser processing of the holes can be performed efficiently.

  In the above description, it has been described that the second program storage means 25 stores a cutting piece dropping program in which the operations A to G are programmed in advance corresponding to each hole machining program. However, the following configuration is also possible.

  That is, the movement operation in the A operation, the D operation, and the F operation is selected from the speed parameters stored in advance in the speed parameter memory 33, and an appropriate speed is set. Further, the stop time in the pause operation in the B operation and the E operation is selected from the time parameters stored in advance in the time parameter memory 35, and an appropriate stop time is set. Further, the ejection pressure of the assist gas in the ejection operation that is the C operation is selected from the ejection pressure parameters stored in advance in the ejection pressure parameter memory 37 and set to an appropriate ejection pressure.

  The above parameters are set by displaying the cutting piece dropping program retrieved from the second program storage means 25 on the display means 21, and in the portions corresponding to the speed parameter, time parameter, and ejection pressure parameter in the A operation to G operation. The parameters stored in the speed parameter memory 33, the time parameter memory 35, and the ejection pressure parameter memory 37 may be input by the input means 19.

  According to the above configuration, the condition (speed condition) of the relative movement speed of the laser processing head with respect to the cut piece 7 in the hole 1, the condition of the assist gas ejection pressure, and the condition of the assist gas ejection time (cut piece 7). The condition of the assist gas injection time) can be set appropriately. Therefore, for example, the cutting piece 7 can be more reliably dropped in accordance with the cutting accuracy of the laser cutting surface. In other words, even when the workpiece W has the same hole shape for laser processing, it corresponds to the accuracy of the cut surface caused by the material of the workpiece W, and the state of catching due to the difference in the plate thickness of the workpiece W The A operation to G operation can be individually set corresponding to the above.

These speed parameters, time parameters, and ejection pressure parameters are set in advance and stored for each plate thickness and material, and for example, the plate thickness written in the NC machining program supplied from the input means 19 Based on the material information, it is possible to select an appropriate speed parameter, time parameter, and ejection pressure parameter corresponding to the material information.

  FIG. 4 shows a second embodiment of the control device 11. In the control device 11A according to the second embodiment, the same reference numerals are given to components having the same functions as the components in the control device 11 described above, and redundant description is omitted. This control device 11A is largely different from the control device 11 described above in that the second program storage means 25 is omitted and a program creation means 39 is provided instead.

  The program creation means 39 refers to the hole machining program selected from the program storage means 23 by the program selection means 27, and cuts to drop the cut piece in the machined hole laser machined according to the hole machining program. Creates a single drop program.

  In the above configuration, when an NC machining program including a hole shape code to be machined created by an automatic program device or the like is input from the input means 19, a hole machining program associated with the hole shape code is stored in the program storage means 23. Are sequentially selected, and laser processing of holes is performed on the workpiece in accordance with the selected drilling program. As described above, when a drilling program is selected, the program prefetching means 41 prefetches the drilling program.

  Then, referring to various data in the hole machining program read by the program prefetching means 41, the dimension of the short side is read when the hole shape is square, and the diameter when the hole shape is round. If the dimension is a long hole, the short axis dimension is read. Further, with reference to the machining end position 5 and the center position O read from the hole drilling program, the opposite side position 9 is obtained by the calculation means 43.

  Therefore, in the program creation means 39, the operations A to G are set with reference to the machining end position 5, the center position O, and the opposite position 9 obtained by pre-reading the hole machining program. . At this time, appropriate parameters are selected from the speed parameter memory 33, the time parameter memory 35, and the ejection pressure parameter memory 37, and the above-described A operation to G operation are set, thereby corresponding to the selected hole machining program. The cut piece dropping program is created, and an operation for dropping the cut piece 7 from the machining hole is performed according to the created cut piece dropping program.

Note that the cutting piece dropping program is created every time the hole machining program during laser machining is selected, and all the hole machining programs in the NC machining program are read by the program pre-reading means 41 before laser machining. Read and create cutting piece dropping programs corresponding to all hole machining programs in advance and store them. When laser machining is performed according to this NC machining program, the stored cutting piece dropping program corresponding to the hole machining program is stored. It is also possible to perform the dropping operation of the cut piece by selecting.

  That is, in this embodiment, laser processing of holes is performed according to the hole processing program selected from the program storage means 23. Then, the operations A to G are performed in accordance with the cutting piece dropping program created by referring to various data of the hole drilling program. Therefore, according to the present embodiment, it is not necessary to previously create a cutting piece dropping program corresponding to the hole machining program. Therefore, the cutting piece dropping program can be easily implemented retrospectively after the laser processing of holes by the conventionally provided hole machining program. When creating a program for dropping a cut piece as described above, it is also possible to prepare a program for dropping a cut piece only when the hole drilling program is provided with a flag indicating whether it is necessary or not.

  By the way, when the hole 1 is processed by laser processing on the plate-like workpiece W, for example, in the case of a square, when the side is a small hole of about 30 mm or less, the cut piece 7 is easily caught in the processed hole. . Even if the processed hole 1 is a round hole, as shown in FIG. 1 (B), if it is slightly inclined with respect to the horizontal, the cut piece 7 may be caught. Also in this case, it is likely to be caught when the diameter is about 30 mm or less. Therefore, the above-described operations A to G by the cutting piece dropping program may be performed when the cutting piece 7 is a small hole that is easily caught in the hole 1.

  Therefore, when the program creation means 39 creates a program for dropping a cut piece, for example, in the case of a square hole, it is determined whether or not the length of one side is equal to or less than a preset length (for example, 30 mm). However, in the case of a round hole or an ellipse, it is desirable to determine whether the diameter or the short axis is equal to or less than the set length, and to create a program for dropping a cut piece only when it is equal to or less. In this case, it can be easily implemented by providing the comparison means (determination means) 45 in the configuration.

  That is, it is possible to know the shape and dimensions of the hole to be machined by the selected hole machining program from the various data prefetched by the program prefetching means 41 from the hole machining program selected by the program storage means 23 by the program selection means 27. it can. Therefore, the hole shape and dimensions are obtained by the calculation means 43 with reference to the selected hole machining program, and in the case of a square hole, the short side dimension and the set length stored in advance in the set value memory 47 are obtained. Comparison is made by the comparison means 45. In the case of a round hole or an oval, the diameter and minor axis are compared with the set length.

  A request signal for creating a cutting piece dropping program corresponding to the selected hole drilling program only when the short side, the diameter, the short axis, etc. are equal to or smaller than the set value. Is output from the comparison means 45 to the program creation means 39. As described above, when the request signal is output from the comparison unit 45 to the program creation unit 39, the program creation unit 39 creates a cutting piece dropping program corresponding to the selected hole machining program as described above. Is.

  As already understood, in the above embodiment, the cutting piece dropping program is not created corresponding to all the hole machining programs selected from the program storage means 23, but the cutting piece 7 is formed in the hole 1. A program for dropping a piece is created only for small holes that are easily caught. Therefore, the load on the control device 11A can be suppressed, and when a plurality of holes are drilled on the workpiece W, the holes can be efficiently drilled.

The first program storage means 23 of the embodiment based on FIG. 3 and the program storage means 23 based on FIG. 4 store a drilling program, which is an NC machining created in advance by an automatic programming device or the like. If it is included in the program, it is possible to select a drilling program directly from this NC machining program or to extract a plurality of drilling programs from the NC machining program and store them in the first program storage means 23 It is.

Moreover, although the structure provided with the 1st program storage means 23 of the embodiment based on FIG. 3, the 2nd program storage means 25, and the program selection means 27 was demonstrated to the control apparatus 11, automatic programming which produces an NC machining program It can also be provided in a device. In this case, the NC machining program created by the automatic programming device includes a plurality of hole machining programs and a cutting piece dropping program in advance, and this NC machining program is supplied to the control device 11 and sequentially executed. Desired drilling and cutting of the cut piece are performed.

Similarly, in the second embodiment of FIG. 4, a configuration in which the program storage unit 23, the program selection unit 27, the program creation unit 39, the program prefetching unit 41, the calculation unit 43, and the comparison unit 45 are provided in the control device 11A will be described. However, it is also possible to provide this in an automatic programming device for creating an NC machining program.

1 hole 3 contour 5 crossing position (machining end position)
7 Cutting piece (cutout piece)
9 Reverse position 11, 11A Control device 23 First program storage means 25 Second program storage means 27 Program selection means 29 Processing head operation control means 31 Laser processing head 33 Speed parameter memory 35 Time parameter memory 37 Ejection pressure parameter memory 39 Program Creation means 41 Program prefetching means 45 Comparison means (discrimination means)

Claims (7)

  A laser processing method for drilling holes in a plate-shaped workpiece, and after performing hole processing by laser processing in accordance with a hole processing program created in advance, in order to drop a cut piece in the processed hole, A laser processing method for controlling the operation of the laser processing head according to a program for cutting piece dropping programmed in advance for relative movement paths of the laser processing head and injection of assist gas on the movement path.   A laser processing method for drilling holes in a plate-shaped workpiece, and after performing hole processing by laser processing in accordance with a hole processing program created in advance, in order to drop a cut piece in the processed hole, A cutting piece dropping program including a relative movement path of the laser machining head with respect to the machining hole and injection of assist gas on the movement path is created with reference to the program, and the laser is generated according to the created cutting piece dropping program. A laser processing method characterized by controlling an operation of a processing head.   A laser processing method for drilling holes in a plate-shaped workpiece, and after performing hole processing by laser processing according to a hole processing program created in advance, in order to drop a cut piece in the processing hole, When the diameter, the short axis, or the length of the short side is shorter than a preset set length, the relative machining path of the laser machining head with respect to the machining hole with reference to the hole machining program and the movement path A cutting piece dropping program including injection of assist gas is prepared, and the operation of the laser machining head is controlled according to the created cutting piece dropping program. A laser processing apparatus for performing laser processing on a plate-shaped workpiece,
A first program storage means for storing a plurality of hole drilling programs for performing hole-shaped cutting by laser machining;
In order to drop a cut piece in a machining hole laser-machined according to each hole machining program, a relative movement path of the laser machining head with respect to the machining hole and injection of assist gas on the movement path are performed. A second program storage means for storing a plurality of cutting piece dropping programs programmed in advance corresponding to the programs for use;
Program selection means for selecting a cutting piece dropping program corresponding to the hole machining program selected from the first program storage means from the second program storage means in order to perform laser processing on the plate-like workpiece. ,
Machining head operation control means for controlling the operation of the laser machining head according to the selected hole machining program and cut piece dropping program;
A laser processing apparatus comprising: A laser processing apparatus for performing laser processing on a plate-shaped workpiece,
A first program storage means for storing a plurality of hole drilling programs for performing hole-shaped cutting by laser machining;
In order to drop a cut piece in a machining hole laser-machined according to each hole machining program, a relative movement path of the laser machining head with respect to the machining hole, a relative speed condition of the laser machining head in the movement path, and an assist A second program storage means for storing a plurality of cutting piece dropping programs in which gas injection conditions can be set in correspondence with the hole drilling programs;
Program selection means for selecting a cutting piece dropping program corresponding to the hole machining program selected from the first program storage means from the second program storage means in order to perform laser processing on the plate-like workpiece. ,
Input means for setting the speed condition on the moving path of the cutting piece dropping program and the assist gas injection condition for each cutting piece dropping program or the thickness of the workpiece to be machined and the material,
The selected hole drilling program, the selected cutting piece dropping program or the plate thickness of the workpiece to be machined, the speed condition on the moving path set in accordance with the material, and the assist gas injection condition are input. Machining head operation control means for controlling the operation of the laser machining head according to the program for dropping the cut pieces;
A laser processing apparatus comprising: A laser processing apparatus for performing laser processing on a plate-shaped workpiece,
A program storage means for storing a plurality of hole drilling programs for performing hole-shaped cutting by laser machining;
In order to drop the cut piece in the machining hole laser machined according to each of the hole machining programs, the relative movement path of the laser machining head with respect to the machining hole and the movement path with reference to each of the hole machining programs A program creating means for creating a cutting piece dropping program including the relative speed condition of the laser machining head in, and the assist gas injection condition;
Machining head operation control means for controlling the operation of the laser machining head according to the hole machining program and the cutting piece dropping program;
A laser processing apparatus comprising: A laser processing apparatus for performing laser processing on a plate-shaped workpiece,
A program storage means for storing a plurality of hole drilling programs for performing hole-shaped cutting by laser machining;
In order to drop a cut piece in a laser processed hole in accordance with each hole processing program, a comparison is made as to whether the diameter or short axis or short side length of the processed hole is shorter than a preset set length. A comparison means;
When the comparison result of the comparison means shows that the diameter, the short axis, or the length of the short side is equal to or shorter than the set length, the laser machining head for the machining hole with reference to each hole machining program Program creation means for creating a cutting piece dropping program including a relative movement path of the laser beam, a relative speed condition of the laser processing head on the movement path, and an assist gas injection condition;
Machining head operation control means for controlling the operation of the laser machining head according to the hole machining program and the cutting piece dropping program;
A laser processing apparatus comprising:

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