JP6188237B2 - Pressure detecting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a pressure detection device, and more particularly, to a pressure detection device having a pressure sensor installed in a housing and a lead frame connected to the pressure sensor, and a method for manufacturing the pressure detection device.

  Patent Document 1 listed below discloses an invention related to a pressure detection device (described as a pressure sensor package in Patent Document 1) having high lead frame positional accuracy and waterproof performance. 13A is a bottom view of a conventional pressure detection device described in Patent Document 1, and FIG. 13B is a cross-sectional view taken along line XIII-XIII in FIG. 13A. It is sectional drawing of a pressure detection apparatus when it sees from.

  As shown in FIG. 13B, the pressure detection device 110 of the conventional example includes a pressure sensor 115 that detects pressure, a housing 121 that houses the pressure sensor 115, and a lead frame that is electrically connected to the pressure sensor 115. 131. A cavity 123 is formed in the housing 121, and a pressure sensor 115 is installed in the cavity 123.

  The lead frame 131 is exposed to the cavity 123 at the inner end 131 a and is electrically connected to the pressure sensor 115 via the bonding wire 117. The lead frame 131 is bent from the inner end 131a to the bottom surface 121b side of the housing 121 and is provided so as to protrude from the bottom surface 121b. As shown in FIG. 13A, the outer end portion 131b of the lead frame 131 protruding from the bottom surface 121b is bent in the outer peripheral direction of the bottom surface 121b to form an extending portion 131c.

  In the pressure detection device 110 of the conventional example, the housing 121 is formed integrally with the lead frame 131 using a resin material. Thereafter, the extending portion 131c of the housing 121 is cut outside the side surface 121a of the housing 121, and the extending portion 131c is outside the side surface 121a of the housing 121 as shown in FIGS. 13 (a) and 13 (b). It is formed to extend.

  The pressure detection device 110 of the conventional example is used by being incorporated in an electronic device such as a smartphone, a camera, a wristwatch, etc., and a support member or a housing (not shown) is brought into contact with the bottom surface 121b of the housing 121, so that the pressure detection device 110 is used. Is fixed.

Republished patent WO2010 / 016439

  However, as shown in FIGS. 13A and 13B, since the extending portion 131c extends outward from the side surface 121a of the housing 121, when the pressure detection device 110 is incorporated into an electronic device or the like, the extending portion It is necessary to provide a space between the housing 121 and the support member, housing, or the like as much as 131c. Thus, the extension part 131c is formed to extend outward from the side surface 121a of the housing 121, thereby causing a problem that it is difficult to reduce the size of the pressure detection device 110.

  Further, as shown in FIGS. 13A and 13B, the conventional pressure detection device 110 has a configuration in which a boundary 135 between the housing 121 and the lead frame 131 is exposed to the side surface 121 a of the housing 121. . For this reason, when the housing 121 and the lead frame 131 are integrally molded, the resin enters a slight gap between the mold and the lead frame 131, and a burr is generated from the side surface of the housing 121 to the outside. This burr hinders downsizing of the pressure detection device 110 and also causes a defect in appearance, and thus a step of removing the burr is necessary.

  Patent Document 1 discloses a method for removing burrs by cutting with respect to the pressure detection device 110 of the conventional example. FIG. 14 is a perspective view when the pressure detection device 110 after cutting is viewed from the bottom surface 121b side. As shown in FIG. 14, the pressure detection device 110 of the conventional example cuts the extending portion 131c of the lead frame 131 together with the burr using a cutting tool such as a router. At this time, a cutting recess 210 is formed on the bottom surface 121b.

  When the pressure detection device 110 is incorporated into an electronic device, a support member, a housing, or the like is brought into contact with the bottom surface 121b, and the pressure detection device 110 is secured and secured. However, since the cutting recess 210 is recessed from the bottom surface 121b, the cutting recess 210 has a structure in which a support member and a housing are not in contact. For this reason, stress distribution is generated in the housing 121, and the housing 121 is likely to be deformed at a location where the cutting recess 121 is provided, and thus it may be difficult to ensure airtightness.

  An object of the present invention is to solve the above-mentioned problems, and to provide a pressure detection device capable of ensuring good airtightness and realizing downsizing and a manufacturing method thereof.

The pressure detection device according to the present invention includes a housing in which a cavity is formed, a pressure sensor installed in the cavity, and a lead frame embedded in the housing, and the lead frame is exposed inside the cavity. An upper lead frame electrically connected to the pressure sensor, a connection portion extending in a thickness direction of the housing, and an exposed portion exposed from the bottom surface of the housing, wherein the exposed portion is the housing The bottom surface of the exposed portion extends from the center of the bottom surface to the outer periphery, and the extended end of the exposed portion is formed on the inner side of the side surface of the housing. relief portion recessed in the thickness direction of which is formed, the extended end portion of the exposed portions be characterized by being positioned at the escape portion .

  According to this, since the lead frame constitutes the same plane as the bottom surface of the housing, when the pressure detection device is incorporated into an external electronic device, the support member is applied to the bottom surface of the housing and the lead frame constituting the same plane. It can be supported by contact. Therefore, since the nonuniformity of the stress distribution generated in the housing can be suppressed and the distortion of the housing can be suppressed, the airtightness between the housing of the external electronic device and the housing can be ensured. In addition, since the extended end of the exposed part of the lead frame is formed on the inner side of the side surface of the housing, the pressure detection device can be made smaller than when the exposed part extends to the outer side of the side surface. It is. Therefore, according to the pressure detection device of the present invention, it is possible to secure good airtightness and realize downsizing.

In addition, since the extended end portion of the lead frame is disposed in the escape portion, the boundary between the lead frame and the housing is provided inside the side surface of the housing. For this reason, even if a burr is generated when the housing and the lead frame are integrally formed, the burr is formed in the escape portion, and the burr can be prevented from being formed outside the outer periphery of the housing. Accordingly, it is possible to reduce the size of the pressure detection device, and it is not necessary to add a step for removing burrs, and thus an increase in manufacturing cost can be suppressed.

  It is preferable that an inclined surface that is inclined with respect to the bottom surface is formed at the extended end portion, and the housing is in close contact with the inclined surface. According to this, since the lead frame is thinly formed at the portion where the inclined surface is formed, the lead frame can be cut with a small load. Therefore, it becomes possible to ensure the airtightness by suppressing the deformation of the housing.

  The outer periphery of the bottom surface of the housing is an abutting surface that abuts against an external support member, and the bottom surface and the exposed portion constitute the same plane on the abutting surface, and the extended end portion Is preferably located on the contact surface. According to this, since the bottom surface and the exposed portion constitute the same plane on the abutting surface, when the pressure detection device is incorporated in an external electronic device, the support member is provided on the bottom surface and the exposed portion of the housing constituting the same plane. It can be supported by contacting. Therefore, the nonuniformity of the stress distribution generated in the housing can be reliably suppressed, and the distortion of the housing can be suppressed, so that the airtightness between the housing of the external electronic device and the housing can be ensured.

  Preferably, the exposed portion includes a protruding portion that protrudes from the bottom surface, and a flat portion that forms the same plane as the bottom surface on the outer peripheral side of the bottom surface with respect to the protruding portion. According to this, since the bottom surface of the housing and the flat portion of the lead frame constitute the same plane and come into contact with the external support member, unevenness in the stress distribution of the housing is suppressed. Further, when solder joining the lead frame and the external wiring board, a solder fillet is easily formed over the side surface of the protruding portion, and the joining strength is increased.

The manufacturing method of the pressure detection device of the present invention includes a housing in which a cavity is formed, a pressure sensor installed in the cavity, and a lead frame embedded in the housing,
The lead frame includes an upper lead frame exposed inside the cavity and electrically connected to the pressure sensor, a connection portion extending in a thickness direction of the housing, and an exposed portion exposed from the bottom surface of the housing. (A) preparing a lead frame having the exposed portion extending outward from the side surface of the housing;
Forming the housing and the lead frame integrally to form the exposed portion and the bottom surface of the housing in the same plane; and (b) after the step (a), Cutting at a position overlapping the bottom surface;
In the step (a), a relief portion is formed on the outer periphery of the bottom surface, and the exposed portion extends outside the side surface of the housing through the relief portion, and in the step (b), The exposed portion is cut at a location where the escape portion is formed .

  According to this, since the exposed portion of the lead frame and the bottom surface of the housing are formed in the same plane in the step (a), the same plane is formed when the pressure detection device is incorporated into an external electronic device. A support member can be brought into contact with and supported by the bottom surface of the housing and the lead frame. Therefore, since the nonuniformity of the stress distribution generated in the housing can be suppressed and the distortion of the housing can be suppressed, the airtightness between the housing of the external electronic device and the housing can be ensured. In the step (b), the exposed portion of the lead frame is cut at a position where it overlaps the bottom surface, so that the extended end portion of the exposed portion is formed inside the side surface of the housing. Therefore, the pressure detection device can be downsized as compared with the case where the exposed portion extends to the outside of the side surface of the housing. Therefore, according to the manufacturing method of the pressure detection device of the present invention, it is possible to ensure good airtightness and achieve miniaturization.

Further , since the exposed portion is cut at the place where the escape portion is formed, it is possible to easily cut the exposed portion while suppressing a load applied to the housing to be small. In addition, since the boundary between the lead frame and the housing is formed in the relief portion, in the step (a), when the burr is generated at the boundary between the lead frame and the housing when the housing and the lead frame are integrally formed, Even if it exists, a burr | flash is formed in an escape part and it can prevent that a burr | flash is formed outside the side surface of a housing. Therefore, the manufacturing cost can be reduced by omitting the step of removing burrs.

that's all

  It is preferable that a groove is formed in the exposed portion, and in the step (b), the exposed portion is cut at a location where the groove is formed. According to this, since the lead frame is thinly formed at the location where the groove is formed, the lead frame can be cut with a small load. Therefore, it becomes possible to ensure the airtightness by suppressing the deformation of the housing.

  The groove is preferably formed in a V-shaped cross section. According to this, since stress concentrates on the top of the groove having a V-shaped cross section, the lead frame can be cut with a smaller load.

  The housing is preferably molded using a thermoplastic resin. According to this, by arranging the lead frame in the molding die and resin molding, the lead frame and the bottom surface of the housing can surely form the same plane.

  According to the pressure detection device and the manufacturing method thereof of the present invention, it is possible to ensure good airtightness and to achieve downsizing.

1 is a perspective view of a pressure detection device according to a first embodiment of the present invention. It is a top view of the pressure detection apparatus of this embodiment. It is a bottom view of the pressure detection apparatus of this embodiment. It is sectional drawing of a pressure detection apparatus when it cut | disconnects by the IV-IV line | wire of FIG. 3, and it sees from the arrow direction. It is sectional drawing of a pressure detection apparatus when it cut | disconnects by the VV line | wire of FIG. 3, and it sees from the arrow direction. It is a partial expansion perspective view when the pressure detection apparatus of this embodiment is seen from the bottom face side. It is sectional drawing when the pressure detection apparatus of this embodiment is integrated in an electronic device. It is a partial expanded sectional view when a wiring board is connected to a pressure detection apparatus. The pressure detection apparatus in 2nd Embodiment is shown, (a) It is sectional drawing when cut | disconnecting in the same location as the IV-IV line of FIG. 3, (b) It cut | disconnects in the same location as the VV line of FIG. It is sectional drawing when doing. It is sectional drawing of the pressure detection apparatus in 3rd Embodiment. It is process drawing for demonstrating the manufacturing method of the pressure detection apparatus of this invention, (a) The process of installing a lead frame in a shaping | molding die, (b) The process of resin-molding a housing integrally with a lead frame. Show. FIG. 12 is a process diagram showing a continuation of FIG. 11, showing (a) a process of cutting the lead frame and (b) a process of installing a pressure sensor in the housing. FIG. 14A is a bottom view of a conventional pressure detection device, and FIG. 13B is a cross-sectional view taken along line XIII-XIII in FIG. It is a perspective view when the pressure detection apparatus of the prior art example after a cutting process is seen from the bottom face side.

  Hereinafter, a pressure detection device and a manufacturing method thereof according to a specific embodiment will be described with reference to the drawings. In addition, the dimension of each drawing is changed and shown suitably.

<First Embodiment>
FIG. 1 is a perspective view of a pressure detection device according to the first embodiment. FIG. 2 is a top view of the pressure detection device, and FIG. 3 is a bottom view of the pressure detection device. FIG. 4 is a cross-sectional view of the pressure detection device as viewed from the direction of the arrow cut along the line IV-IV in FIG. FIG. 5 is a cross-sectional view seen from a direction different from FIG. 4, and is a cross-sectional view of the pressure detection device as seen from the direction of the arrow cut along line VV in FIG.

  As shown in FIG. 1, the pressure detection device 10 according to the present embodiment includes a housing 21 in which a cavity 23 is formed, a pressure sensor 15 installed in the cavity 23, and is embedded in the housing 21 and exposed in the cavity 23. A lead frame 31.

  In the present embodiment, the housing 21 is formed by resin molding using a thermoplastic resin. As the thermoplastic resin, for example, a liquid crystal polymer (Liquid Crystal Polymer, LCP), polyphenylene sulfide (PPS), polypropylene (PP), polybutylene terephthalate (PBT), polycarbonate (PC), or the like can be used.

  As shown in FIGS. 4 and 5, the cavity 23 formed in the housing 21 includes a pressure introduction recess 24 and a pressure sensor storage recess 25 in order in the depth direction. A pressure sensor 15 is installed on the bottom surface of the pressure sensor housing recess 25, and a potting resin 16 is provided in the pressure introduction recess 24 so as to cover the pressure sensor 15. The potting resin 16 is a gel-like viscoelastic body, and for example, a silicone resin or a fluororesin is used.

  As shown in FIG. 2, the pressure sensor housing recess 25 has a substantially rectangular planar shape corresponding to the outer shape of the pressure sensor 15. Further, the pressure introducing recess 24 has a substantially rectangular planar shape with a diagonal length of the pressure sensor housing recess 25 as one side. The pressure introducing recess 24 and the pressure sensor housing recess 25 are formed with a phase difference of 45 °. Thereby, an external pressure can be introduced from the pressure introducing recess 24, and the bonding wire 17 and the pressure sensor 15 are connected to the potting resin 16 by making the space of the pressure sensor receiving recess 25 smaller than the pressure introducing recess 24. Can be reliably covered.

  The pressure sensor 15 has a MEMS (Micro Electro Mechanical System) structure, and includes a diaphragm portion that receives pressure and a strain detection element that detects deformation of the diaphragm portion. For example, a piezoresistive element can be used as the strain sensing element, and the strain sensing element is provided around the diaphragm portion. The diaphragm portion is deformed according to the pressure applied to the potting resin 16 in the pressure introducing recess 24, and the resistance of the piezoresistive element changes. Based on this resistance change, the pressure applied to the pressure detection device 10 can be detected.

  As shown in FIG. 4, the lead frame 31 includes an upper lead frame 31a exposed inside the cavity 23 and electrically connected to the pressure sensor 15, a connection portion 31d extending in the thickness direction of the housing 21, and a housing. And an exposed portion 31e exposed from the bottom surface 21b of the structure 21. A detection signal from the pressure sensor 15 is transmitted to an external circuit via the lead frame 31.

  As shown in FIG. 4, the upper lead frame 31 a is bent from the outer peripheral side of the housing 21 toward the pressure sensor housing recess 25. The upper lead frame 31 a is provided to be exposed in the pressure introducing recess 24, and the exposed upper lead frame 31 a and the pressure sensor 15 are connected by the bonding wire 17. As shown in FIG. 2, the upper lead frame 31 a is exposed at each corner of the pressure introducing recess 24.

  Further, as shown in FIG. 4, the connection portion 31 d bent from the upper lead frame 31 a at the first bent portion 31 p extends in the thickness direction of the housing 21 and is exposed from the bottom surface 21 b of the housing 21. The lead frame 31 exposed on the bottom surface 21b is bent at the second bent portion 31q in the same direction as the upper lead frame 31a, so that a protruding portion 31b protruding from the bottom surface 21b of the housing 21 is formed. In the present embodiment, the lead frame 31 is integrally molded with the housing 21, and the periphery of the connection portion 31d that connects the upper lead frame 31a and the protruding portion 31b and the upper lead frame 31a and the protruding portion 31b is as follows. The housing 21 is filled with a resin material. Thereby, the leak path | route which connects the cavity 23 inside and the exterior of the housing 21 can be lengthened, and airtightness can be improved.

  As shown in FIG. 5, the connection portion 31 d of the lead frame 31 is bent in a direction intersecting the thickness direction of the housing 21 at the fifth bent portion 31 t. This further increases the leak path and improves airtightness.

  Further, as shown in FIG. 4, since the protruding portion 31b is provided in the same direction as the upper lead frame 31a, the protruding portion 31b can be fixed by being sandwiched in the vertical direction during resin molding. Can be improved.

  As shown in FIG. 3, when the housing 21 is viewed from the bottom surface 21b side, the protruding portion 31b is bent by about 90 ° in the outer peripheral direction from the center side of the bottom surface 21b at the third bent portion 31r. A plurality of lead frames 31 are provided on the bottom surface 21b, and extend from the center side of the bottom surface 21b to the outer peripheral side in different directions.

  In the pressure detection device 10 of the present embodiment, as shown in FIG. 5, the exposed portion 31 e exposed on the bottom surface 21 b includes a protruding portion 31 b protruding from the bottom surface 21 b and a bottom surface on the outer peripheral side of the bottom surface 21 b relative to the protruding portion 31 b. 21b and the flat part 31c which comprises the same plane. The flat portion 31c is formed continuously with the protruding portion 31b, and is bent by forming a step with the protruding portion 31b so as to be recessed in the thickness direction of the housing 21 with respect to the protruding portion 31b at the fourth bent portion 31s. It extends in the outer peripheral direction from the center of 21b. The extended end portion 31 f of the exposed portion 31 e is formed inside the side surface 21 e of the housing 21. Thereby, for example, when an external support member, a housing, or the like is provided around the pressure detection device 10, the external support member or the housing is compared with the case where the exposed portion 31e extends outside the side surface 21e. The space between the body or the like (not shown) and the side surface 21e of the housing 21 can be reduced, and the pressure detection device 10 can be downsized.

  Further, as shown in FIG. 3, in each lead frame 31, a protruding portion 31b is formed on the center side of the bottom surface 21b, and the flat portion 31c and the bottom surface 21b are the same on the outer peripheral side of the protruding portion 31b. It constitutes a plane. Thereby, in the bottom face 21b of the housing 21, the flat surface which does not have a part which goes around the outer periphery and protrudes from the bottom face 21b is formed. Therefore, when the pressure detection device 10 is incorporated into an electronic device, the outer periphery of the bottom surface 21b of the housing 21 can be brought into contact with an external support member as the contact surface 21c. Thereby, since the nonuniformity of the stress distribution generated in the housing 21 can be suppressed and the occurrence of distortion of the housing 21 can be suppressed, the airtightness between the housing of the external electronic device and the housing 21 can be ensured. it can.

  As described above, according to the pressure detection device 10 of the present embodiment, it is possible to ensure good airtightness and achieve miniaturization.

  FIG. 6 is a partially enlarged perspective view of the pressure detection device of this embodiment when viewed from the bottom surface side. As shown in FIG. 6, a relief portion 22 that is recessed in the thickness direction of the housing 21 is formed on the outer periphery of the bottom surface 21 b. The recessed surface 22 a of the escape portion 22 is formed to be recessed from the bottom surface 21 b of the housing 21 in the thickness direction, and the side surface 22 b of the escape portion 22 is formed to be recessed inward from the side surface 21 e of the housing 21.

  As shown in FIG. 6, the exposed portion 31e extends from the center of the bottom surface 21b of the housing 21 toward the outer periphery, and the flat portion 31c and the bottom surface 21b are the same on the contact surface 21c located on the outer periphery of the bottom surface 21b. Make up surface. The extended end portion 31 f of the exposed portion 31 e protrudes from the side surface 22 b of the escape portion 22 and is positioned in the escape portion 22. That is, the end surface 31 j of the exposed portion 31 e is formed on the inner side than the side surface 21 e of the housing 21.

  The pressure detection device 10 of the present embodiment is obtained by resin-molding the housing 21 integrally with the lead frame 31, and the resin material enters a slight gap (clearance) between the molding die and the lead frame during resin molding. In some cases, burrs may remain after molding.

  In the present embodiment, as shown in FIG. 6, since the extended end portion 31 f of the lead frame 31 is located in the escape portion 22, the boundary 35 between the lead frame 31 and the housing 21 is defined by the side surface 21 e of the housing 21. Is also provided inside. For this reason, when the housing 21 and the lead frame 31 are integrally formed, even if, for example, burrs occur on the side surface 31i of the extended end portion 31f, the burrs are formed in the escape portion 22, and the housing 21 It is possible to prevent burrs from being formed outside the side surface 21e. Therefore, even if burrs occur, it does not affect the downsizing of the pressure detection device 10 and does not cause a defect in appearance. Therefore, it is not necessary to add a step of removing burrs, and an increase in manufacturing cost can be prevented. .

  Further, since the escape portion 22 is formed in a part of the contact surface 21c in the width direction, even if the escape portion 22 is formed, the escape portion 22 makes a round of the outer periphery of the bottom surface 21b and protrudes from the bottom surface 21b. A flat surface with no part is formed. Therefore, when the pressure detection device 10 is incorporated into an electronic device, the contact surface 21c including the flat portion 31c and the bottom surface 21b constituting the same plane comes into contact with the support member and the housing. The nonuniformity of the generated stress distribution can be suppressed, the distortion of the housing 21 can be suppressed, and the airtightness between the housing of the external electronic device and the housing 21 can be ensured. As shown in FIG. 6, since the extended end portion 31 f of the exposed portion 31 e is formed so as to protrude from the side surface 22 b of the escape portion 22, the area of the flat portion is increased, and in the vicinity of the escape portion 22. Unevenness of stress distribution can be suppressed.

  In the present embodiment, the end surface 31j of the exposed portion 31e is a cut surface formed by cutting the continuous lead frame 31 extending outward from the side surface 21e of the housing 21 in the manufacturing process of the pressure detection device 10. As shown in FIGS. 5 and 6, the extended end portion 31f is formed with an inclined surface 31h that is inclined with respect to the bottom surface 21b. The inclined surface 31h is continuous with the end surface 31j and is formed on the upper surface (surface in close contact with the housing 21) side of the extended end portion 31f.

  As shown in FIG. 6, the escape portion 22 is formed with a mounting portion 22 c that protrudes with a step from the concave surface 22 a of the escape portion 22, and the extended end portion 31 f of the exposed portion 31 e is the mounting portion. It is formed on 22c. The engaging portion 22d formed on the mounting portion 22c is formed to engage with the inclined surface 31h, and the engaging portion 22d of the housing 21 is in close contact with the inclined surface 31h.

  As shown in FIGS. 5 and 6, since the lead frame 31 is thinly formed at the portion where the inclined surface 31h is formed, the lead frame 31 can be cut with a small load in the step of cutting the lead frame 31. . Therefore, since the load applied to the housing 21 can be reduced, the deformation of the housing 21 can be suppressed and airtightness can be reliably ensured. Further, by forming the inclined surface 31h on the upper surface side of the lead frame 31, a cut is formed in the lead frame 31 at a position away from the concave surface 22a of the escape portion 22 and the mounting portion 22c in the cutting process. Therefore, deformation of the housing 21 in the cutting process can be reliably prevented.

  In the present embodiment, as shown in FIG. 6, the two exposed portions 31 e and 31 e are formed in parallel, and the extended end portions 31 f and 31 f of the exposed portions 31 e and 31 e are within one escape portion 22. Is located. In this way, in the step of cutting the lead frame 31, the two lead frames 31, 31 can be cut simultaneously.

  Note that the embodiment is not limited to the mode illustrated in FIG. 6, and the relief portion 22 may be formed in each of the plurality of lead frames 31. Further, the shapes of the end surface 31j, the inclined surface 31h, the engaging portion 22d, and the like of the extended end portion 31f can be appropriately modified.

  FIG. 7 is a cross-sectional view when the pressure detection device of the present embodiment is incorporated in an electronic apparatus. As shown in FIG. 7, the pressure detection device 10 is disposed so as to face the housing 45 of the electronic device, and the wall portion 21 d provided on the upper surface 21 a of the housing 21 and the housing 45 are in contact with each other. An O-ring 46 is provided between the upper surface 21 a and the housing 45, and the pressure detection device 10 is fixed so that a load is applied to the O-ring 46 to press it. Thereby, the airtightness between the pressure detection apparatus 10 and an electronic device can be ensured, and a pressure can be detected favorably.

  As shown in FIG. 7, a support member 41 that supports the pressure detection device 10 is provided so as to surround the bottom surface 21 b and the periphery of the housing 21. The support member 41 is formed in a hollow cylindrical shape, and a mounting surface 41 a is provided so as to protrude from the inner peripheral surface of the support member 41. An abutment surface 21 c constituted by the bottom surface 21 b of the housing 21 and the flat portion 31 c of the lead frame 31 is in contact with the mounting surface 41 a, and the protruding portion 31 b of the lead frame 31 is surrounded by the support member 41. Located in the space.

  According to the pressure detection device 10 of the present embodiment, the extended end portion 31 f of the exposed portion 31 e is formed inside the side surface 21 e of the housing 21. For this reason, as compared with the case where the lead frame 131 extends outward from the side surface 21e as in the conventional pressure detection device 110 shown in FIG. 13, the pressure detection device 10 can be downsized. Moreover, as shown in FIG. 7, the clearance gap between the side surface 21e of the housing 21 and the supporting member 41 can be made small, and the electronic device can be reduced in size.

  According to the pressure detection device 10 of the present embodiment, since the lead frame 31 is provided in the same plane as the bottom surface 21b of the housing 21, the same plane is provided when the pressure detection device 10 is incorporated in an external electronic device. The support member 41 can be brought into contact with and supported by the bottom surface 21b of the housing 21 and the lead frame 31 that constitute the structure. Therefore, the nonuniformity of the stress distribution generated in the housing 21 can be suppressed, the distortion of the housing 21 can be suppressed, and the output fluctuation of the pressure sensor 15 can be reduced.

  In addition, since unevenness of the stress distribution generated in the housing 21 can be suppressed, distortion is reduced over the entire circumference of the upper surface 21a of the housing 21, and the housing 45 of the external electronic device and the housing 21 are reduced. Airtightness can be ensured.

  Therefore, according to the pressure detection device 10 of the present embodiment, it is possible to ensure good airtightness and achieve miniaturization.

  Further, as shown in FIG. 6, the support member 41 is brought into contact with the contact surface 21 c on the outer periphery of the bottom surface 21 b at a position overlapping the O-ring 46. Therefore, since the mounting surface 41a of the O-ring 46 and the support member 41 is provided at a position that does not overlap with the pressure sensor 15, it is possible to prevent stress when being incorporated into an external electronic device from being directly applied to the pressure sensor 15, The output fluctuation of the pressure sensor 15 can be reduced.

  In the present embodiment, “comprising the same plane” desirably means that the lead frame 31 and the bottom surface 21b of the housing 21 are continuous in a flat state without a step, but is not limited thereto. For example, the lead frame 31 and the bottom surface 21b of the housing 21 may be formed due to an installation error of the lead frame 31 when the lead frame 31 and the housing 21 are integrally molded with resin or due to shrinkage or deformation of the resin material constituting the housing 21. Even if a slight step is formed, the same effect can be obtained.

  FIG. 8 is a partially enlarged cross-sectional view when a wiring board is connected to the pressure detection device. In the present embodiment, a wiring board 51 such as a flexible printed board is used. As shown in FIG. 8, the wiring substrate 51 includes a substrate 52, a wiring 53 formed on the substrate 52, and a protective layer 54 that protects the wiring 53. The substrate 52 is formed using, for example, polyimide resin, glass epoxy resin, or the like, and the wiring 53 is formed by stacking a plurality of layers of metal materials such as Cu, alloy materials such as CuNi, or the like. The protective layer 54 is a solder resist or a cover film, and is formed on the wiring 53 other than the connection portion.

  In the present embodiment, the wiring 53 of the wiring substrate 51 and the protruding portion 31 b of the lead frame 31 are joined using the solder 56. Thereby, as shown in FIG. 8, it becomes easy to form a solder fillet over the side surface of the protrusion 31b, and the bonding strength is increased.

  As shown in FIG. 8, the bottom surface 21 b of the housing 21 is provided with a recess 28, and the side surface of the protruding portion 31 b is exposed in the recess 28. The recess 28 is formed by holding the lead frame 31 in a molding die when the lead frame 31 and the housing 21 are integrally molded with resin, thereby positioning the lead frame 31 reliably. can do. Further, as shown in FIG. 8, the side surface of the protrusion 31 b is exposed in the recess 28, and a solder fillet can be formed in the recess 28, so that the solder joint area when connecting to the wiring board 51 is increased. As a result, the bonding strength can be improved.

<Second Embodiment>
FIG. 9 shows a pressure detection device according to the second embodiment. FIG. 9A is a cross-sectional view taken along the line IV-IV in FIG. 3, and FIG. It is sectional drawing when it cut | disconnects in the same location as the VV line | wire of 3. FIG.

  As shown in FIG. 9, the pressure detection device 11 of this embodiment is different in the structure of the lead frame 31 exposed from the bottom surface 21 b of the housing 21, and the other configuration is the same as that of the first embodiment. In the present embodiment, the lead frame 31 exposed from the bottom surface 21 b is not provided with the protruding portion 31 b, and the flat portion 31 c and the bottom surface 21 b of the lead frame 31 form the same plane on the entire bottom surface 21 b of the housing 21. ing.

  Even if it is such an aspect, when incorporating the pressure detection apparatus 11 in an electronic device, the support member 41 can be brought into contact with and supported by the bottom surface 21b of the housing 21 and the lead frame 31 that constitute the same plane. Therefore, nonuniformity of the stress distribution generated in the housing 21 can be suppressed, and the occurrence of distortion of the housing 21 can be suppressed to reduce the output fluctuation of the pressure sensor 15. Moreover, since the distortion of the housing 21 can be reduced, the airtightness between the housing 45 of the external electronic device and the housing 21 can be ensured.

  Further, as shown in FIG. 9B, the extension end portion 31 f of the lead frame 31 is formed inside the side surface 21 e of the housing 21, so that the pressure detection device 11 can be reduced in size.

<Third Embodiment>
In the pressure detection devices 10 and 11 of the first embodiment and the second embodiment, the upper lead frame 31a exposed to the cavity 23 and the protruding portion 31b protruding from the bottom surface 21b are bent in the same direction, Although it is formed in a U-shaped cross section, it is not limited to this. FIG. 10 is a cross-sectional view of the pressure detection device of the third embodiment. As shown in FIG. 10, the lead frames 31 exposed from the inside of the housing 21 to the bottom surface 21 b are bent in the outer peripheral direction of the housing 21 to form protruding portions 31 b. Furthermore, the flat part 31c which comprises the same plane as the bottom face 21b is formed in the outer peripheral side rather than the protrusion part 31b.

  Also in such an embodiment, the protruding portion 31b can be connected to the wiring board 51 (not shown), and solder fillets are easily formed on the side surface of the protruding portion 31b, thereby increasing the bonding strength. Further, since the flat portion 31c is provided on the outer periphery of the bottom surface 21b of the housing 21 so as to form the same plane as the bottom surface 21b, the support member 41 (not shown) is brought into contact with the outer periphery of the bottom surface 21b of the housing 21. Can be made. Therefore, the nonuniformity of the stress distribution generated in the housing 21 can be suppressed, the distortion of the housing 21 can be suppressed, and the output fluctuation of the pressure sensor 15 can be reduced.

  Also in the present embodiment, as shown in FIG. 9B, the extension end portion 31f of the lead frame 31 is formed on the inner side of the side surface 21e of the housing 21, so that the pressure detection device 11 can be downsized. Is possible.

  Further, the protruding portion 31 b is formed on the outer peripheral side of the housing 21 with respect to the pressure sensor housing recess 25. For this reason, it can relieve | moderate that the stress at the time of a solder connection is directly applied to the pressure sensor storage recessed part 25, and can reduce the output fluctuation | variation of the pressure sensor 15. FIG. Further, compared with the first embodiment, the number of bent portions (third bent portion 31r) of the lead frame 31 is reduced, and the lead frame 31 can be easily manufactured.

<Manufacturing method of pressure detection device>
FIG.11 and FIG.12 is process drawing for demonstrating the manufacturing method of the pressure detection apparatus of 1st Embodiment. FIG. 11A shows a process of installing the lead frame in the molding die, and FIG. 11B shows a process of resin-molding the housing integrally with the lead frame. FIG. 12A is a process subsequent to FIG. 11B, showing a process of cutting the lead frame, and FIG. 12B shows a process of installing a pressure sensor in the housing.

  In the process of FIG. 11A, an upper mold 60 and a lower mold 62 are prepared, and the lead frame 31 is fixed between the upper mold 60 and the lower mold 62. As shown in FIG. 4, in the lead frame 31, the upper lead frame 31a and the protruding portion 31b are bent in the same direction in advance, and as shown in FIG. The lead frame 31 is fixed in the mold with the upper lead frame 31a and the protrusion 31b interposed therebetween. In addition, the lead frame 31 is provided with an extending portion 31k that extends to the outside of the upper die 60 and the lower die 62 in succession to the flat portion 31c. A groove 31g is formed on the upper surface side at the boundary between the flat portion 31c and the extending portion 31k. As shown in FIG. 11A, the groove 31g is formed in a space between the upper mold 60 and the lower mold 62. The groove 31g has a V-shaped cross section.

  11 and 12 show a manufacturing process for one pressure detection device 10, but the present invention is not limited to this. It is also possible to simultaneously manufacture a plurality of pressure detection devices by using a lead frame in which a plurality of bent structures such as the upper lead frame 31a, the connecting portion 31d, and the protruding portion 31b are formed.

  Next, in the process of FIG. 11B, a thermoplastic resin is injected into the space between the upper mold 60 and the lower mold 62, and the housing 21 is molded integrally with the lead frame 31. As the thermoplastic resin, for example, the above-described materials such as a liquid crystal polymer (LCP) can be used. By this step, resin molding is performed in a state where the lower surface of the flat portion 31c is in close contact with the upper surface of the lower mold 62, so that the flat portion 31c and the bottom surface 21b of the housing 21 are formed on the same plane. Further, when the housing 21 is molded with resin, the groove 31g is also filled with the resin material and molded. Thereafter, the thermoplastic resin is cooled and solidified, and the upper mold 60 and the lower mold 62 are released.

  In the process of FIG. 12A, the lead frame 31 is cut using the cutting jig 64. The cutting jig 64 is provided with a blade 65 at a position facing the groove 31 g of the lead frame 31, and the blade 65 is pressed against the position overlapping the groove 31 g of the lead frame 31. Thus, a cut is formed in the lead frame 31 from the surface opposite to the surface on which the groove portion 31g is formed, and then the housing 21 and the lead frame 31 are lightly moved upward while the extension portion 31k of the lead frame 31 is fixed. The extension part 31k is separated by pushing up.

  In the step of FIG. 12A, the lead frame 31 is thinly formed at the location where the groove 31g is formed, so that the extended portion 31k of the lead frame 31 can be cut with a smaller load. Further, since the groove portion 31g is formed on the upper surface side of the lead frame 31, when the lead frame 31 is cut, the blade 65 is prevented from reaching the main body portion of the housing 21, and damage or deformation of the housing 21 is prevented. Can be prevented. Further, when resin molding is performed in the process of FIG. 11B, the blade 65 comes into contact with the housing 21 by forming the relief portion 22 shown in FIG. 6 (illustrated in FIGS. 11 and 12). Thus, the extended portion 31k of the lead frame 31 can be easily cut.

  12B, the pressure sensor 15 is installed in the cavity 23, and the pressure sensor 15 and the upper lead frame 31a are electrically connected by the bonding wire 17. Then, the potting resin 16 covers and protects the pressure sensor 15 and the bonding wire 17. Through the above steps, the pressure detection device 10 can be manufactured. As shown in FIG. 12B, a part of the groove 31g remains as the inclined surface 31h in the extended end 31f, and the groove 31g. The engaging portion 22d formed by filling is closely attached to the inclined surface 31h.

  According to the manufacturing method of the pressure detection device 10 of the present embodiment, the exposed portion 31e of the lead frame 31 and the bottom surface 21b of the housing 21 are formed on the same plane in the steps of FIGS. 11 (a) and 11 (b). Therefore, when the pressure detection device 10 is incorporated in an external electronic device, the support member can be brought into contact with and supported by the bottom surface 21b of the housing 21 and the lead frame 31 that constitute the same plane. Therefore, since the nonuniformity of the stress distribution generated in the housing can be suppressed and the distortion of the housing can be suppressed, the airtightness between the housing of the external electronic device and the housing 21 can be ensured.

  12A, the exposed portion 31e of the lead frame 31 is cut at a position where it overlaps the bottom surface 21b, so that the extended end portion 31f of the exposed portion 31e is formed inside the side surface 21e of the housing 21. Is done. Therefore, compared with the case where the exposed part 31e extends outside the side surface 21e of the housing 21, the pressure detection device 10 can be downsized. Therefore, according to the manufacturing method of the pressure detection device 10 of the present embodiment, it is possible to ensure good airtightness and achieve miniaturization.

10, 11, 12 Pressure detection device 15 Pressure sensor 21 Housing 21a Upper surface, 21b Bottom surface, 21c Abutting surface, 21d Wall portion, 21e Side surface 22 Escape portion 22a Concave surface, 22b Side surface, 22c Placement portion, 22d Engaging portion 23 Cavity 24 pressure introduction recess 25 pressure sensor storage recess 28 recess 31 lead frame 31a upper lead frame, 31b protrusion, 31c flat part, 31d connection part,
31e exposed portion, 31f extending end portion, 31g groove portion, 31h inclined surface, 31i side surface,
31j end face, 31k extension part, 31p first bent part, 31q second bent part,
31r 3rd bent part, 31s 4th bent part, 31t 5th bent part 41 Support member 45 Housing 51 Wiring board 60 Upper mold 62 Lower mold 64 Cutting jig

Claims (10)

A housing in which a cavity is formed; a pressure sensor installed in the cavity; and a lead frame embedded in the housing, wherein the lead frame is exposed inside the cavity and electrically connected to the pressure sensor. An upper lead frame to be connected; a connecting portion extending in a thickness direction of the housing; and an exposed portion exposed from a bottom surface of the housing, wherein the exposed portion constitutes the same plane as the bottom surface of the housing And extending from the center of the bottom surface toward the outer periphery, and the extending end of the exposed portion is formed on the inner side of the side surface of the housing, and is recessed in the thickness direction of the housing on the outer periphery of the bottom surface An escape portion is formed, and the extended end portion of the exposed portion is located in the escape portion . The pressure detecting device according to claim 1 , wherein an inclined surface that is inclined with respect to the bottom surface is formed at the extended end portion, and the housing is in close contact with the inclined surface. The outer periphery of the bottom surface of the housing is an abutting surface that abuts against an external support member, and the bottom surface and the exposed portion constitute the same plane on the abutting surface, and the extended end portion The pressure detection device according to claim 1 , wherein the pressure detection device is located on the contact surface. The exposed portion includes a projection projecting from the bottom surface, the outer peripheral side of the bottom surface than the protrusion, claim from claim 1, characterized in that it comprises a flat portion constituting the bottom surface flush 4. The pressure detection device according to any one of items 3 . A housing in which a cavity is formed, a pressure sensor installed in the cavity, and a lead frame embedded in the housing;
The lead frame includes an upper lead frame exposed inside the cavity and electrically connected to the pressure sensor, a connection portion extending in a thickness direction of the housing, and an exposed portion exposed from the bottom surface of the housing. A method of manufacturing a pressure detection device having
(A) A lead frame having the exposed portion that extends outward from the side surface of the housing is prepared, the housing and the lead frame are integrally formed, and the exposed portion and the bottom surface of the housing And forming them on the same plane;
(B) after the step (a), cutting the exposed portion at a position overlapping the bottom surface ;
In the step (a), a relief portion is formed on the outer periphery of the bottom surface, and the exposed portion extends outside the side surface of the housing through the relief portion, and in the step (b), The method for manufacturing a pressure detecting device , wherein the exposed portion is cut at a location where the relief portion is formed . 6. The method of manufacturing a pressure detecting device according to claim 5 , wherein a groove is formed in the exposed portion, and in the step (b), the exposed portion is cut at a position where the groove is formed. . The method of manufacturing a pressure detecting device according to claim 6 , wherein the groove has a V-shaped cross section. The method for manufacturing a pressure detection device according to claim 5, wherein the housing is molded using a thermoplastic resin. A housing in which a cavity is formed; a pressure sensor installed in the cavity; and a lead frame embedded in the housing, wherein the lead frame is exposed inside the cavity and electrically connected to the pressure sensor. An upper lead frame to be connected; a connecting portion extending in a thickness direction of the housing; and an exposed portion exposed from a bottom surface of the housing, wherein the exposed portion constitutes the same plane as the bottom surface of the housing And extending from the center of the bottom surface toward the outer periphery, and the extending end of the exposed portion is formed inside the side surface of the housing, and the outer periphery of the bottom surface of the housing is an external support member The bottom surface and the exposed portion constitute the same plane, and the extended end portion A pressure detecting device located on the contact surface. A housing in which a cavity is formed; a pressure sensor installed in the cavity; and a lead frame embedded in the housing, wherein the lead frame is exposed inside the cavity and electrically connected to the pressure sensor. An upper lead frame to be connected; a connecting portion extending in a thickness direction of the housing; and an exposed portion exposed from a bottom surface of the housing, wherein the exposed portion constitutes the same plane as the bottom surface of the housing And extending from the center of the bottom surface toward the outer periphery, and the extending end of the exposed portion is formed on the inner side of the side surface of the housing, and the exposed portion is a protruding portion protruding from the bottom surface A pressure detecting device comprising: a flat portion that forms the same plane as the bottom surface on the outer peripheral side of the bottom surface with respect to the protruding portion.