JP6181952B2 - Architectural board and method for producing architectural board - Google Patents
Architectural board and method for producing architectural board Download PDFInfo
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- JP6181952B2 JP6181952B2 JP2013056834A JP2013056834A JP6181952B2 JP 6181952 B2 JP6181952 B2 JP 6181952B2 JP 2013056834 A JP2013056834 A JP 2013056834A JP 2013056834 A JP2013056834 A JP 2013056834A JP 6181952 B2 JP6181952 B2 JP 6181952B2
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本発明は、壁材、屋根材等に好適な建築板、及び建築板の製造方法に関するものである。 The present invention relates to a building board suitable for wall materials, roofing materials, and the like, and a method for manufacturing the building board.
従来から、セメント等の水硬性無機粉体と、木質パルプ繊維等の木質補強材とを主成分とする無機質板がある。このような無機質板は、曲げ強度などの物性に優れるので、塗装を施し、住宅の内壁材、外壁材、屋根材等の建築板として使用されている。 Conventionally, there are inorganic boards mainly composed of hydraulic inorganic powder such as cement and wood reinforcing material such as wood pulp fiber. Since such an inorganic board is excellent in physical properties such as bending strength, it is coated and used as a building board for housing inner wall materials, outer wall materials, roofing materials, and the like.
しかし、近年、省エネ等の環境問題の観点から、住宅への断熱効果の向上が求められている。そのために、建築板の表面に断熱塗膜を形成し、住宅の断熱効果を高めることが検討されている。例えば、特許文献１には、断熱効果を備えたセラミック微粉末を塗膜形成材中に分散混合した断熱塗膜を、基材の表面に形成してなる、断熱性壁材が開示されている。 However, in recent years, from the viewpoint of environmental problems such as energy saving, there has been a demand for improvement of the heat insulation effect on the house. For this purpose, it has been studied to form a heat insulating coating on the surface of the building board to enhance the heat insulating effect of the house. For example, Patent Document 1 discloses a heat insulating wall material formed on a surface of a base material by a heat insulating coating film in which ceramic fine powder having a heat insulating effect is dispersed and mixed in a film forming material. .
しかし、特許文献１のようにセラミック微粉末を分散混合した断熱塗膜を形成した建築板は、実際にはその断熱効果が小さいことが、発明者らの実験によって分かった（後述する比較例を参照）。そして、発明者らが鋭意研究した結果、その要因の一つとして、セラミック微粉末はその中空率が低くなりやすく、断熱効果が得られにくいことがわかった。また、建築板の表面に汚れが付着すると外観が悪くなると共に、該汚れが吸熱し、断熱効果が低下することもわかった。そのため、断熱効果を持続することは難しい現状である。 However, it has been found by experiments by the inventors that a building board on which a heat insulating coating film in which ceramic fine powder is dispersed and mixed as in Patent Document 1 has a small heat insulating effect (comparative examples described later). reference). And as a result of the inventors' diligent research, it was found that as one of the factors, the ceramic fine powder tends to have a low hollowness and it is difficult to obtain a heat insulating effect. It was also found that when dirt is attached to the surface of the building board, the appearance deteriorates and the dirt absorbs heat and the heat insulating effect is lowered. Therefore, it is difficult to maintain the heat insulation effect.
したがって、本発明の課題は、経年しても優れた断熱性を維持できる建築板及びその製造方法を提供するものである。 Therefore, the subject of this invention is providing the building board which can maintain the heat insulation outstanding also over time, and its manufacturing method.
本発明は、無機質板の表面に、断熱塗膜と親水性粒子とを有する建築板を提供する。本発明において、断熱塗膜は、塗膜形成材と、有機系中空粒子とを含有することを特徴とする。塗膜形成材としては、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等を用いることができる。有機系中空粒子の材質としては有機化合物であれば良いが、アクリロニトリル、メタクリロニトリル、塩化ビニリデン、アクリル酸エステル、スチレンの少なくとも１種以上により構成されていると、中空率が高い状態を保持できるので好ましい。親水性粒子としては、シリカ、コロイダルシリカ、フュームドシリカの少なくとも１種以上により構成されていると、建築板に汚れが付着しにくいとともに、汚れが付着したとしても水により汚れを除去できるので、好ましい。また、断熱塗膜の形成工程において、断熱塗膜を形成する塗料が水溶性溶剤を含有していると形成される塗膜が均質となりやすいので、断熱塗膜は水溶性溶剤を含有していることが好ましい。その場合、水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、均質化により貢献するので好ましい。無機質板としては、木繊維補強セメント板、繊維補強セメント板、繊維補強セメント・ケイ酸カルシウム板、スラグ石膏板などの窯業系サイディングボードや、金属系サイディングボード、ＡＬＣボードなどあるが、窯業系サイディングボードであると、断熱効果が顕著に向上するので好ましい。更に、本発明において、親水性粒子は、断熱塗膜よりも表側に付着しているのだが、建築板の最表側に付着していると、建築板に汚れが付着しにくいとともに、汚れが付着したとしても水により汚れを除去できるので好ましい。断熱塗膜の表面にはクリヤー塗膜が形成されており、該クリヤー塗膜の表面に親水性粒子が付着していると、建築板は耐候性に優れるので、より好ましい。
また、本発明は、無機質板の表面に、塗膜形成材と有機系中空粒子とを含有する断熱塗料を塗布し、断熱塗膜を形成する工程と、該断熱塗膜の上に親水性塗料を塗布し、親水性粒子を付着させる工程とを備える建築板の製造方法も提供する。塗膜形成材としては、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等を用いることができる。有機系中空粒子の材質としては有機化合物であれば良いが、アクリロニトリル、メタクリロニトリル、塩化ビニリデン、アクリル酸エステル、スチレンの少なくとも１種以上により構成されていると、中空率が高い状態を保持できるので好ましい。親水性粒子としては、シリカ、コロイダルシリカ、フュームドシリカの少なくとも１種以上により構成されていると、建築板に汚れが付着しにくいとともに、汚れが付着したとしても水により汚れを除去できるので、好ましい。また、断熱塗料が水溶性溶剤を含有していると、形成される断熱塗膜が均質となりやすいので好ましい。その場合、水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、均質化により貢献するので好ましい。無機質板としては、木繊維補強セメント板、繊維補強セメント板、繊維補強セメント・ケイ酸カルシウム板、スラグ石膏板などの窯業系サイディングボードや、金属系サイディングボード、ＡＬＣボードなどあるが、窯業系サイディングボードに本発明の製造方法を行うと、断熱効果が顕著に向上するので好ましい。更に、本発明において、親水性粒子は建築板の最表側に付着させると、建築板に汚れが付着しにくいとともに、汚れが付着したとしても水により汚れを除去できるので好ましい。親水性粒子を付着させる工程は、断熱塗膜を形成した後、クリヤー塗料を塗布してクリヤー塗膜を形成し、該クリヤー塗膜の表面に親水性粒子を塗布して該クリヤー塗膜に該親水性粒子を付着させると、該建築板は耐候性に優れるので、好ましい。
The present invention provides a building board having a heat insulating coating film and hydrophilic particles on the surface of an inorganic board. In the present invention, the heat insulating coating film contains a coating film forming material and organic hollow particles. As the coating film forming material, acrylic resin, silicon resin, fluorine resin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, or the like can be used. Any organic compound may be used as the material for the organic hollow particles. However, when the material is composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylate ester, and styrene, a high hollow ratio can be maintained. Therefore, it is preferable. As the hydrophilic particles, when composed of at least one of silica, colloidal silica, and fumed silica, it is difficult for dirt to adhere to the building board, and even if dirt is attached, dirt can be removed with water. preferable. Moreover, in the formation process of a heat insulation coating film, since the coating film formed when the coating material which forms a heat insulation coating film contains a water-soluble solvent tends to become homogeneous, the heat insulation coating film contains a water-soluble solvent. It is preferable. In this case, it is preferable that the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent because it contributes to homogenization. Inorganic boards include wood fiber reinforced cement boards, fiber reinforced cement boards, fiber reinforced cement / calcium silicate boards, slag gypsum boards, ceramic siding boards, metal siding boards, and ALC boards. A board is preferable because the heat insulation effect is remarkably improved. Furthermore, in the present invention, the hydrophilic particles are attached to the front side of the heat-insulating coating film. However, if the hydrophilic particles are attached to the outermost side of the building board, it is difficult for the dirt to adhere to the building board. Even if it does, since dirt can be removed with water, it is preferable. A clear coating film is formed on the surface of the heat insulating coating film, and it is more preferable that hydrophilic particles adhere to the surface of the clear coating film because the building board is excellent in weather resistance.
The present invention also includes a step of applying a heat insulating paint containing a coating film forming material and organic hollow particles to the surface of an inorganic plate to form a heat insulating coating, and a hydrophilic paint on the heat insulating coating. The manufacturing method of a building board provided with the process of apply | coating and adhering a hydrophilic particle is also provided. As the coating film forming material, acrylic resin, silicon resin, fluorine resin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, or the like can be used. Any organic compound may be used as the material for the organic hollow particles. However, when the material is composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylate ester, and styrene, a high hollow ratio can be maintained. Therefore, it is preferable. As the hydrophilic particles, when composed of at least one of silica, colloidal silica, and fumed silica, it is difficult for dirt to adhere to the building board, and even if dirt is attached, dirt can be removed with water. preferable. Moreover, it is preferable that the heat-insulating paint contains a water-soluble solvent because the heat-insulating coating film to be formed tends to be homogeneous. In this case, it is preferable that the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent because it contributes to homogenization. Inorganic boards include wood fiber reinforced cement boards, fiber reinforced cement boards, fiber reinforced cement / calcium silicate boards, slag gypsum boards, ceramic siding boards, metal siding boards, and ALC boards. It is preferable to perform the production method of the present invention on a board because the heat insulation effect is remarkably improved. Furthermore, in the present invention, it is preferable that the hydrophilic particles adhere to the outermost side of the building board because the dirt hardly adheres to the building board and even if the dirt is attached, the dirt can be removed with water. In the step of attaching the hydrophilic particles, after forming a heat insulating coating, a clear coating is applied to form a clear coating, and hydrophilic particles are applied to the surface of the clear coating and the clear coating is applied to the clear coating. Adhering hydrophilic particles is preferable because the building board is excellent in weather resistance.
本発明によれば、経年しても優れた断熱性を維持できる建築板及びその製造方法を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the building board which can maintain the heat insulation excellent even if it passed over time, and its manufacturing method can be provided.
以下、本発明の実施の形態を具体的に説明する。 Hereinafter, embodiments of the present invention will be specifically described.
本発明の建築板は、無機質板の表面が、断熱塗膜と親水性粒子とを有することを特徴とする。 The building board of the present invention is characterized in that the surface of the inorganic board has a heat insulating coating film and hydrophilic particles.
無機質板としては、木繊維補強セメント板、繊維補強セメント板、繊維補強セメント・ケイ酸カルシウム板、スラグ石膏板などの窯業系サイディングボードや、金属系サイディングボード、ＡＬＣボードなどある。本発明においては、無機質板が窯業系サイディングボードであると、断熱塗膜による断熱効果が顕著に向上するので好ましい。なお、断熱塗膜は、無機質板の表面に直接形成されていていても良いが、無機質板の上にシーラー塗膜を形成させ、その上に断熱塗膜が形成されていても良い。シーラー塗膜は、例えば、アクリルエマルション、アクリルウレタン樹脂系塗料、エポキシ樹脂系塗料、溶剤型湿硬ウレタン、水分散型イソシアネート等によって構成することができ、１層でもよいが、２層以上とすることもできる。なお、無機質板としては、表面が平らな板でも、表面に凹凸模様を有する板でも良い。 Examples of the inorganic board include ceramic siding boards such as wood fiber reinforced cement boards, fiber reinforced cement boards, fiber reinforced cement / calcium silicate boards, and slag gypsum boards, metal siding boards, and ALC boards. In the present invention, it is preferable that the inorganic board is a ceramic siding board because the heat insulating effect by the heat insulating coating is remarkably improved. In addition, although the heat insulation coating film may be formed directly on the surface of an inorganic board, a sealer coating film may be formed on an inorganic board and the heat insulation coating film may be formed on it. The sealer coating can be composed of, for example, an acrylic emulsion, an acrylic urethane resin-based paint, an epoxy resin-based paint, a solvent-type wet urethane, a water-dispersed isocyanate, or the like. You can also. The inorganic plate may be a plate having a flat surface or a plate having an uneven pattern on the surface.
そして、断熱塗膜は、塗膜形成材と、有機系中空粒子とを含有し、無機質板の表面を被覆している。塗膜形成材としては、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等がある。有機系中空粒子としては、高い中空率と小さい粒径であるために、有機化合物であれば良い。詳しくは、有機系材料は柔軟性があるので、中空粒子を形成する際に材料が伸び、平均中空率が高くなるとともに、その状態を保持することができるためである。有機系中空粒子の形状としては、平均粒径５〜５０μｍの範囲で、かつ、平均中空率８０％以上であることが好ましい。有機系中空粒子の平均粒径が５μｍ未満では断熱効果が十分に得られず、５０μｍより大きいと、形成される断熱塗膜の強度が弱くなり、該断熱塗膜が脆い、塗膜密着の不具合が発生しやすい等の懸念が生ずるためである。また、有機系中空粒子の平均中空率が８０％未満では断熱効果が十分に得られない懸念があるためである。有機系中空粒子の平均中空率の好ましい上限値は、有機系中空粒子の中空状態を保持できることを条件に、種々の要因によって異なるが、平均中空率が９０％以上であると、より断熱塗膜が断熱効果を発揮することができるので好ましい。なお、この平均中空率とは体積百分率による値である。有機系中空粒子が、アクリロニトリル、メタクリロニトリル、塩化ビニリデン、アクリル酸エステル、スチレンの少なくとも１種以上により構成されていると、耐久性、断熱性により優れるので好ましい。 And the heat insulation coating film contains the coating-film formation material and organic type hollow particle, and has coat | covered the surface of an inorganic board. Examples of the coating film forming material include acrylic resin, silicon resin, fluororesin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, and the like. As the organic hollow particles, an organic compound may be used since it has a high hollow ratio and a small particle size. Specifically, since the organic material is flexible, the material is stretched when forming the hollow particles, the average hollowness is increased, and the state can be maintained. The shape of the organic hollow particles is preferably in the range of an average particle size of 5 to 50 μm and an average hollowness of 80% or more. If the average particle size of the organic hollow particles is less than 5 μm, a sufficient heat insulation effect cannot be obtained. If the average particle size is greater than 50 μm, the strength of the heat insulating coating formed is weak, the heat insulating coating is brittle, and the coating adhesion is defective. This is because there is a concern that it is likely to occur. Moreover, it is because there exists a concern that the heat insulation effect cannot fully be acquired if the average hollowness of organic hollow particles is less than 80%. The preferable upper limit value of the average hollow ratio of the organic hollow particles varies depending on various factors on the condition that the hollow state of the organic hollow particles can be maintained, but if the average hollow ratio is 90% or more, a more heat insulating coating film Is preferable because it can exert a heat insulating effect. The average hollowness is a value by volume percentage. It is preferable that the organic hollow particles are composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic acid ester, and styrene because of excellent durability and heat insulation.
断熱塗膜において、塗膜形成材、有機系中空粒子の含有量に特に制限は無いが、断熱塗膜が有機系中空粒子を固形分１００質量部あたり０．０１質量部未満では断熱効果が十分に得られず、５．０質量部より多いと、形成される断熱塗膜の強度が弱くなり、該断熱塗膜が脆い、塗膜密着の不具合が発生しやすい等の懸念があるので、有機系中空粒子を固形分１００質量部あたり０．０１〜５.０質量部含有することが好ましい。また、断熱塗膜の平均塗膜厚が５μｍ未満では断熱効果が十分に得られない、５００μｍを超えると、形成される断熱塗膜の強度が弱くなる、乾燥時間が長くなる、無機質板の表面が意匠柄を有している場合には柄の凹凸が埋もれて外観が変わってしまう等の懸念があるので、断熱塗膜の平均塗膜厚は５〜５００μｍであることが好ましい。 In the heat insulating coating film, the content of the coating film forming material and the organic hollow particles is not particularly limited, but the heat insulating effect is sufficient if the heat insulating coating film is less than 0.01 part by mass of the organic hollow particles per 100 parts by mass of the solid content. When the amount is more than 5.0 parts by mass, the strength of the heat-insulating coating film formed becomes weak, the heat-insulating coating film is brittle, and there is a concern that the coating film is liable to be defective. It is preferable to contain 0.01 to 5.0 parts by mass of the system hollow particles per 100 parts by mass of the solid content. Also, if the average coating thickness of the heat insulating coating is less than 5 μm, a sufficient heat insulating effect cannot be obtained, and if it exceeds 500 μm, the strength of the heat insulating coating to be formed becomes weaker and the drying time becomes longer. When there is a design pattern, there is a concern that the unevenness of the pattern is buried and the appearance is changed, so that the average coating thickness of the heat insulating coating is preferably 5 to 500 μm.
また、本発明では、断熱塗膜の形成工程において、断熱塗膜を形成する塗料が水溶性溶剤を含有していると、断熱塗膜がより均質となるので、断熱塗膜は水溶性溶剤を含有していても良い。その場合、水溶性溶剤がグリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、均質化により貢献するので好ましい。 In the present invention, in the step of forming the heat insulating coating, if the paint forming the heat insulating coating contains a water-soluble solvent, the heat insulating coating becomes more homogeneous. You may contain. In that case, it is preferable that the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent because it contributes to homogenization.
更に、本発明の建築板は親水性粒子を含有する。親水性粒子としては、例えば、シリカ、コロイダルシリカ、フュームドシリカ等によって構成することができる。親水性粒子は断熱塗膜よりも表側に付着しており、建築板の表面に汚れが付着しにくくするとともに、汚れが付着したとしても水により汚れを除去することを可能とする。 Furthermore, the building board of the present invention contains hydrophilic particles. The hydrophilic particles can be composed of, for example, silica, colloidal silica, fumed silica, or the like. The hydrophilic particles are attached to the front side of the heat insulating coating, making it difficult for dirt to adhere to the surface of the building board, and even if dirt is attached, the dirt can be removed with water.
なお、本発明においては、断熱塗膜の表面にはクリヤー塗膜が形成されており、該クリヤー塗膜の表面に親水性粒子が付着していると、建築板は耐候性に優れるので、好ましい。クリヤー塗膜は、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等によって構成することができる。 In the present invention, a clear coating film is formed on the surface of the heat insulating coating film, and if the hydrophilic particles are attached to the surface of the clear coating film, the building board is excellent in weather resistance, which is preferable. . The clear coating film can be composed of acrylic resin, silicon resin, fluororesin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, or the like.
そして、本発明の建築板の製造方法は、無機質板の表面に、塗膜形成材と有機系中空粒子とを含有する断熱塗料を塗布し、断熱塗膜を形成する工程と、該断熱塗膜の上に親水性塗料を塗布し、親水性粒子を付着させる工程とを備える。無機質板、塗膜形成材、有機系中空粒子、親水性粒子については前述したとおりである。 And the manufacturing method of the building board of this invention apply | coats the heat insulation coating material containing a coating-film formation material and an organic type hollow particle on the surface of an inorganic board, and forms the heat insulation coating film, and this heat insulation coating film And a step of applying a hydrophilic paint on the surface and attaching hydrophilic particles. The inorganic plate, the coating film forming material, the organic hollow particles, and the hydrophilic particles are as described above.
断熱塗膜を形成する工程において、断熱塗料は、塗膜形成材と有機系中空粒子とを含有した塗料によって形成されている。この塗料としては、例えば、アクリルシリコンエマルション、アクリルエマルション、シリコン樹脂系塗料、アクリルウレタン系塗料、フッ素樹脂系塗料、ポリウレタン樹脂系塗料等によって構成することができる。
断熱塗料において、塗膜形成材、有機系中空粒子の含有量に特に制限は無いが、有機系中空粒子の含有量が塗料固形分１００質量部あたり０．０１質量部未満では形成された断熱塗膜の断熱効果が十分ではない懸念があり、５．０質量部より多いと、形成される断熱塗膜の強度が弱くなり、該断熱塗膜が脆い、塗膜密着が発生しやすい等の懸念があるため、有機系中空粒子を固形分１００質量部あたり０．０１〜５.０質量部含有することが好ましい。なお、有機系中空粒子の含有量は、断熱塗料を構成する固形分１００質量部に対する、有機系中空粒子の膜を形成する有機固形分の割合を表すものである。
また、断熱塗料が水溶性溶剤を含有していると、形成される断熱塗膜が均質となりやすいので好ましい。詳しくは、前述した断熱効果の高い有機系中空粒子が混合されていると、断熱塗料を無機質板に塗布し、乾燥する際に、形成中の塗膜全体に熱が均等に伝わり難いという問題がある。そこで、水溶性溶剤が含有されている断熱塗料を用いることにより、乾燥時に熱が形成中の塗膜全体に伝わりやすくなる。その結果、均質な断熱塗膜を形成することができ、建築板全体にわたって、断熱塗膜によって均質な断熱効果を得ることができ、全体として建築板の断熱性が向上する。水溶性溶剤として、例えば、エチレングリコール、プロピレングリコール、ジエチレングリコール、ジプロピレングリコールＮ−ブチルエーテル、トリプロピレングリコールモノメチルエーテル等、又はこれらの混合物を用いることができる。その場合には、断熱塗料の塗布及び乾燥における塗膜温度は、水溶性溶剤の沸点よりも低くする。それゆえ、乾燥を経た後にも、水溶性溶剤は、充分に残存して、断熱塗膜の均質な成膜に寄与することができる。水溶性溶剤が、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、沸点が高いので、断熱塗膜の形成工程において最後まで残存しやすく、断熱塗膜の均質化に貢献しやすいので好ましい。なお、水溶性溶剤は、断熱塗料の固形分を１００質量部としたとき、０．１〜１０質量部含有されていると、断熱塗膜全体の均質な成膜を確実に行うことができるので、好ましい。
また、断熱塗料の色調は顔料を用いて調整することができる。すなわち、断熱塗料として顔料が含有されている塗料を用いても良いし、顔料を含有しない塗料を用いても良い。
塗料の塗布方法としては、スプレー塗布、ロールコーター塗布、カーテンコーター塗布、浸漬塗布など様々有るが、いずれでも良い。平均塗膜厚に特に制限はないが、５μｍ未満では、形成される断熱塗膜は断熱効果が十分ではなく、５００μｍを超えると、形成される断熱塗膜の強度が弱くなる、乾燥時間が長くなる、無機質板の表面が意匠柄を有している場合には柄の凹凸が埋もれて外観が変わってしまう等の懸念があるので、断熱塗膜の平均塗膜厚を５〜５００μｍとすることが好ましい。
乾燥は、特に制限は無く、断熱塗膜を形成できれば良いが、有機系中空粒子の中空構造を確実に保持しつつ、断熱塗膜を形成することを考慮すると、乾燥時の塗膜温度を１３０℃以下とすることが好ましい。有機系中空粒子の耐熱性を考慮すると、４０〜１１０℃とすることがより好ましい。
In the step of forming the heat insulating coating, the heat insulating coating is formed of a coating containing a coating film forming material and organic hollow particles. As this paint, for example, an acrylic silicon emulsion, an acrylic emulsion, a silicone resin paint, an acrylic urethane paint, a fluororesin paint, a polyurethane resin paint, and the like can be used.
In the heat insulating paint, the content of the coating film forming material and the organic hollow particles is not particularly limited, but the heat insulating coating formed when the content of the organic hollow particles is less than 0.01 parts by weight per 100 parts by weight of the solid content of the paint. There is a concern that the heat insulating effect of the film is not sufficient, and if it is more than 5.0 parts by mass, the strength of the heat insulating coating film to be formed becomes weak, the heat insulating coating film is brittle, and the film adhesion is likely to occur. Therefore, it is preferable to contain 0.01 to 5.0 parts by mass of organic hollow particles per 100 parts by mass of the solid content. In addition, content of an organic type hollow particle represents the ratio of the organic solid content which forms the film | membrane of an organic type hollow particle with respect to 100 mass parts of solid content which comprises a heat insulation coating material.
Moreover, it is preferable that the heat-insulating paint contains a water-soluble solvent because the heat-insulating coating film to be formed tends to be homogeneous. Specifically, when organic hollow particles having a high heat insulating effect described above are mixed, there is a problem that when the heat insulating coating is applied to the inorganic plate and dried, heat is not easily transmitted to the entire coating film being formed. is there. Therefore, by using a heat insulating paint containing a water-soluble solvent, heat is easily transmitted to the entire coating film being formed during drying. As a result, a uniform heat insulating coating can be formed, and a uniform heat insulating effect can be obtained by the heat insulating coating over the entire building board, so that the heat insulating property of the building board as a whole is improved. As the water-soluble solvent, for example, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol N-butyl ether, tripropylene glycol monomethyl ether, or a mixture thereof can be used. In that case, the coating film temperature in application and drying of the heat insulating paint is set lower than the boiling point of the water-soluble solvent. Therefore, even after drying, the water-soluble solvent remains sufficiently and can contribute to the uniform film formation of the heat insulating coating film. If the water-soluble solvent is composed of at least one of a glycol-based solvent and a glycol ether-based solvent, the boiling point is high. preferable. In addition, when the solid content of the heat-insulating paint is 100 parts by mass and the water-soluble solvent is contained in an amount of 0.1 to 10 parts by mass, uniform film formation of the entire heat-insulating coating film can be reliably performed. ,preferable.
The color tone of the heat insulating paint can be adjusted using a pigment. That is, a paint containing a pigment may be used as the heat insulating paint, or a paint containing no pigment may be used.
There are various coating methods such as spray coating, roll coater coating, curtain coater coating, and dip coating. Any method may be used. There is no particular limitation on the average coating thickness, but if it is less than 5 μm, the heat insulating coating formed does not have a sufficient heat insulating effect, and if it exceeds 500 μm, the strength of the heat insulating coating formed becomes weak, and the drying time is long. When the surface of the inorganic plate has a design pattern, there is a concern that the unevenness of the pattern is buried and the appearance changes, so the average coating thickness of the heat insulating coating should be 5 to 500 μm. Is preferred.
There is no particular limitation on the drying, and it is sufficient that a heat insulating coating film can be formed. However, considering that the heat insulating coating film is formed while securely holding the hollow structure of the organic hollow particles, the coating film temperature during drying is set to 130. It is preferable to set it as below ℃. Considering the heat resistance of the organic hollow particles, the temperature is more preferably 40 to 110 ° C.
親水性粒子を付着させる工程において、親水性塗料としては、シリカ、コロイダルシリカ、フュームドシリカ等によって構成された親水性粒子を分散させてなる溶液を用いることができる。親水性塗料は、断熱塗膜に直接塗布しても良いが、先にクリヤー塗料を塗布し、断熱塗膜の上にクリヤー塗膜を形成させた後、該クリヤー塗膜の上に親水性塗料を塗布し、該クリヤー塗膜の上に親水性粒子を塗布させても良い。クリヤー塗膜に親水性粒子を付着させると、建築板は耐候性に優れるので、好ましい。 In the step of attaching the hydrophilic particles, as the hydrophilic paint, a solution in which hydrophilic particles composed of silica, colloidal silica, fumed silica, or the like is dispersed can be used. The hydrophilic coating may be applied directly to the heat insulating coating. However, after applying the clear coating first to form the clear coating on the heat insulating coating, the hydrophilic coating is applied on the clear coating. And hydrophilic particles may be applied on the clear coating film. It is preferable to attach hydrophilic particles to the clear coating film because the building board is excellent in weather resistance.
次に、本発明の実施例をあげる。 Next, examples of the present invention will be given.
厚さ１６mmで、無機質板（木繊維補強セメント板）の表面に、アクリル樹脂を主成分とする白色水性塗料を塗布し、約８０℃のドライヤーで約５分乾燥してシーラー層を形成した。次いで、その表面に表１に示す断熱塗料を塗布し、約８０℃のドライヤーで約５分乾燥し、実施例１〜５、比較例１〜４の建築板を製造した。なお、いずれも表面がフラット柄の無機質板を用いた。また、クリヤー塗料を塗布したものについては、約８０℃のドライヤーで約１５分乾燥してクリヤー塗膜を形成した。 A white aqueous paint mainly composed of acrylic resin was applied to the surface of an inorganic board (wood fiber reinforced cement board) with a thickness of 16 mm, and dried for about 5 minutes with a dryer at about 80 ° C. to form a sealer layer. Subsequently, the heat insulation paint shown in Table 1 was applied to the surface, and it dried for about 5 minutes with the dryer of about 80 degreeC, and the building board of Examples 1-5 and Comparative Examples 1-4 was manufactured. In each case, an inorganic plate having a flat pattern on the surface was used. Moreover, about what apply | coated the clear coating material, it dried with about 80 degreeC dryer for about 15 minutes, and formed the clear coating film.
各建築板の詳細は、表１に記載した通りである。
すなわち、実施例１では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、親水性粒子としてコロイダルシリカを分散してなる溶液を塗布し、クリヤー塗膜にコロイダルシリカを付着させた。
実施例２では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子として塩化ビニリデンとアクリロニトリルからなり、平均粒径が２０μｍ、平均中空率９８％の粒子を５．０質量部、水溶性溶剤としてプロピレングリコールを０．２質量部含有する塗料を用いて、膜厚が３０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、親水性粒子としてコロイダルシリカを分散してなる溶液を塗布し、クリヤー塗膜にコロイダルシリカを付着させた。
実施例３では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてメタクリロニトリルとアクリル酸メチルからなり、平均粒径が４０μｍ、平均中空率９８％の粒子を０．５質量部、水溶性溶剤としてジエチレングリコールを１０質量部含有する塗料を用いて、膜厚が５００μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、親水性粒子としてコロイダルシリカを分散してなる溶液を塗布し、クリヤー塗膜にコロイダルシリカを付着させた。
実施例４では、断熱塗料に、塗膜形成材としてアクリルエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、親水性粒子としてコロイダルシリカを分散してなる溶液を塗布し、クリヤー塗膜にコロイダルシリカを付着させた。
実施例５では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、その上に、親水性粒子としてコロイダルシリカを分散してなる溶液を塗布し、断熱塗膜にコロイダルシリカを付着させた。
一方、比較例１では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成した。しかし、比較例１では、親水性粒子を付着させなかった。
比較例２では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを含有する塗料を用いて、膜厚が２０μｍの断熱塗膜を形成した。すなわち、比較例２では、中空粒子と水溶性溶剤を含有しない塗料を用いて塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、親水性粒子としてコロイダルシリカを分散してなる溶液を塗布し、クリヤー塗膜にコロイダルシリカを付着させた。
比較例３では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションと、中空粒子としてセラミックからなり、平均粒径１５０μｍで、平均中空率３０％の粒子を５．０質量部と、水溶性溶剤としてプロピレングリコールを２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、比較例３では、クリヤー塗料と親水性粒子を分散させた溶液は塗布しなかった。
比較例４では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションと、アクリル酸メチルからなり、平均粒径２０μｍで、平均中空率０％（中実）の粒子を２．０質量部と、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が１００μｍの断熱塗膜を形成した。そして、比較例４では、クリヤー塗料と親水性粒子を分散させた溶液は塗布しなかった。
Details of each building board are as described in Table 1.
That is, in Example 1, the heat insulating coating material was made of acrylic silicon emulsion as a coating film forming material and acrylonitrile as hollow particles, and 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98%. Using a paint containing 2.0 parts by mass of ethylene glycol as a solvent, a heat insulating coating film having a thickness of 50 μm was formed. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and a solution in which colloidal silica is dispersed as hydrophilic particles is further applied thereon. Colloidal silica was adhered to the clear coating film.
In Example 2, the heat-insulating coating material is made of acrylic silicon emulsion as a coating film forming material, made of vinylidene chloride and acrylonitrile as hollow particles, 5.0 parts by mass of particles having an average particle diameter of 20 μm and an average hollowness ratio of 98%, water-soluble A heat-insulating coating film having a film thickness of 30 μm was formed using a paint containing 0.2 parts by mass of propylene glycol as a reactive solvent. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and a solution in which colloidal silica is dispersed as hydrophilic particles is further applied thereon. Colloidal silica was adhered to the clear coating film.
In Example 3, the heat insulating paint is made of acrylic silicon emulsion as a coating film forming material, methacrylonitrile and methyl acrylate as hollow particles, and 0.5 mass of particles having an average particle diameter of 40 μm and an average hollowness ratio of 98%. Using a paint containing 10 parts by mass of diethylene glycol as a water-soluble solvent, a heat insulating coating film having a film thickness of 500 μm was formed. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and a solution in which colloidal silica is dispersed as hydrophilic particles is further applied thereon. Colloidal silica was adhered to the clear coating film.
In Example 4, an acrylic emulsion as a coating film forming material, acrylonitrile as a hollow particle, and 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98%, and ethylene as a water-soluble solvent are used as the heat insulating paint. A heat-insulating coating film having a film thickness of 50 μm was formed using a paint containing 2.0 parts by mass of glycol. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and a solution in which colloidal silica is dispersed as hydrophilic particles is further applied thereon. Colloidal silica was adhered to the clear coating film.
In Example 5, as the heat insulating paint, a paint containing acrylic silicon emulsion as the coating film forming material and acrylonitrile as the hollow particles, and containing 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98% is used. Thus, a heat insulating coating film having a thickness of 50 μm was formed. And the solution formed by disperse | distributing colloidal silica as hydrophilic particle | grains was apply | coated on it, and colloidal silica was made to adhere to a heat insulation coating film.
On the other hand, in Comparative Example 1, the heat insulating paint was made of acrylic silicon emulsion as a coating film forming material and acrylonitrile as hollow particles, and 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98%. Using a paint containing 2.0 parts by mass of ethylene glycol as a solvent, a heat insulating coating film having a thickness of 50 μm was formed. Then, a clear paint containing an acrylic silicon emulsion was applied as a coating film forming material to form a clear paint film. However, in Comparative Example 1, hydrophilic particles were not adhered.
In Comparative Example 2, a heat insulating paint film having a thickness of 20 μm was formed using a paint containing an acrylic silicon emulsion as a paint film forming material. That is, in Comparative Example 2, a coating film was formed using a paint that did not contain hollow particles and a water-soluble solvent. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and a solution in which colloidal silica is dispersed as hydrophilic particles is further applied thereon. Colloidal silica was adhered to the clear coating film.
In Comparative Example 3, the heat insulating paint was made of acrylic silicon emulsion as a coating film forming material and ceramic as hollow particles, and 5.0 parts by mass of particles having an average particle diameter of 150 μm and an average hollowness of 30%, and a water-soluble solvent. A heat insulating coating film having a thickness of 50 μm was formed using a paint containing 2.0 parts by mass of propylene glycol. In Comparative Example 3, the solution in which the clear paint and the hydrophilic particles were dispersed was not applied.
In Comparative Example 4, the heat insulating paint was made of acrylic silicon emulsion and methyl acrylate as a coating film forming material, and 2.0 parts by mass of particles having an average particle size of 20 μm and an average hollowness of 0% (solid), A heat-insulating coating film having a film thickness of 100 μm was formed using a paint containing 2.0 parts by mass of ethylene glycol as a water-soluble solvent. In Comparative Example 4, the solution in which the clear paint and the hydrophilic particles were dispersed was not applied.
実施例１〜５、比較例１〜４の建築板に対して、断熱効果の試験を行った。試験方法としてはランプ照射法を用いた。すなわち、建築板表面から１０ｃｍ離れた位置に配置した１００Ｖ、１５０Ｗのハロゲンランプによって、建築板の表面に光を照射した。そして、１０分間連続照射した時点において、建築板表面の温度を放射温度計を用いて測定し、初期の表面温度とした。初期の表面温度を測定した後、経年使用による汚れを想定してカーボン粉を３％含むケイ砂を各建築板の表面に散布し、その後、雨水を想定して霧吹きで水を散布し、粉体を除去した後、再度、各建築板の表面の温度を測定したので、その結果も表１に示す。 The heat insulation effect was tested on the building boards of Examples 1 to 5 and Comparative Examples 1 to 4. A lamp irradiation method was used as a test method. That is, the surface of the building board was irradiated with light by a 100 V, 150 W halogen lamp placed 10 cm away from the building board surface. And at the time of continuous irradiation for 10 minutes, the temperature of the building board surface was measured using the radiation thermometer, and it was set as the initial surface temperature. After measuring the initial surface temperature, spraying silica sand containing 3% carbon powder on the surface of each building board, assuming dirt due to aging, and then spraying water with a spray sprayer assuming rainwater. Since the temperature of the surface of each building board was measured again after removing the body, the results are also shown in Table 1.
なお、表１において、中空粒子（中実粒子）の含有量、及び水溶性溶剤の含有量は、塗料固形分１００質量部に対する質量部にて表されている。また、中空粒子（中実粒子）の平均中空率は、中空粒子（中実粒子）に対する体積百分率により表されている。 In Table 1, the content of the hollow particles (solid particles) and the content of the water-soluble solvent are expressed in parts by mass with respect to 100 parts by mass of the solid content of the paint. In addition, the average hollowness of the hollow particles (solid particles) is represented by a volume percentage with respect to the hollow particles (solid particles).
表１から分かるように、比較例２〜４の初期表面温度は、６３〜６５℃に達したのに対し、実施例１〜５の初期表面温度は、５０〜５６℃に収まった。
また、経時変化をみると、親水性粒子を塗布していない比較例１、３、４は、５〜１０℃温度が上昇したのに対し、親水性粒子を塗布した実施例１〜５は、１℃以下に温度上昇が抑えられていた。
すなわち、実施例１〜５では、確実に建築板の温度上昇を抑制することができ、その断熱性を維持することができると言える。
As can be seen from Table 1, the initial surface temperatures of Comparative Examples 2 to 4 reached 63 to 65 ° C, whereas the initial surface temperatures of Examples 1 to 5 were within 50 to 56 ° C.
In addition, when looking at the change over time, Comparative Examples 1, 3 and 4 in which the hydrophilic particles were not applied increased the temperature of 5 to 10 ° C., whereas Examples 1 to 5 in which the hydrophilic particles were applied The temperature rise was suppressed to 1 ° C. or lower.
That is, in Examples 1-5, it can be said that the temperature rise of a building board can be suppressed reliably and the heat insulation can be maintained.
以上に本発明の一実施形態について説明したが、本発明はこれに限定されず、特許請求の範囲に記載の発明の範囲において種々の変形態を取り得る。例えば、断熱塗料として、更に、炭酸カルシウム、クレー、アクリルビーズなどの充填剤、艶消しビーズ、光安定剤、紫外線吸収剤を含む塗料を用いても良い。 Although one embodiment of the present invention has been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the invention described in the claims. For example, a paint containing a filler such as calcium carbonate, clay, acrylic beads, matte beads, a light stabilizer, and an ultraviolet absorber may be used as the heat insulating paint.
以上説明したように、本発明によれば、経年しても優れた断熱性を維持できる建築板及びその製造方法を提供することができる。 As described above, according to the present invention, it is possible to provide a building board that can maintain excellent heat insulation even after aging and a method for manufacturing the same.
Claims (6)
断熱塗膜は、塗膜形成材と、有機系中空粒子と、水溶性溶剤とを含有した、均質な塗膜であり、
親水性粒子は、断熱塗膜よりも表側で、建築板の最表側に付着している
ことを特徴とする建築板。 A building board having a heat insulating coating and hydrophilic particles on the surface of the inorganic board,
The heat insulating coating film is a homogeneous coating film containing a coating film forming material, organic hollow particles, and a water-soluble solvent ,
The building board characterized in that the hydrophilic particles are attached to the outermost surface of the building board on the front side of the heat insulating coating.
前記水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上により構成されており、
前記親水性粒子は、シリカ、コロイダルシリカ、フュームドシリカの少なくとも１種以上により構成されている
ことを特徴とする請求項１に記載の建築板。 The organic hollow particles are composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic ester, and styrene ,
The water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent,
The building board according to claim 1, wherein the hydrophilic particles are composed of at least one of silica, colloidal silica, and fumed silica .
ことを特徴とする請求項１に記載の建築板。 The building board according to claim 1 , wherein a clear coating film is formed on a surface of the heat insulating coating film , and the hydrophilic particles adhere to the surface of the clear coating film .
断熱塗膜の上に親水性塗料を塗布し、親水性粒子を付着させる工程とを備え、A step of applying a hydrophilic paint on the heat insulating coating and attaching hydrophilic particles;
親水性粒子は、最表側に付着させるHydrophilic particles are attached to the outermost side
ことを特徴とする建築板の製造方法。The manufacturing method of the building board characterized by the above-mentioned.
前記水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上により構成されており、
前記親水性粒子は、シリカ、コロイダルシリカ、フュームドシリカの少なくとも１種以上により構成されている
ことを特徴とする請求項４に記載の建築板の製造方法。 The organic hollow particles are composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic ester, and styrene,
The water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent,
The hydrophilic particles are composed of at least one of silica, colloidal silica, and fumed silica.
The manufacturing method of the building board of Claim 4 characterized by the above-mentioned .
ことを特徴とする請求項４に記載の建築板の製造方法。 In the step of attaching the hydrophilic particles, after forming a heat insulating coating, a clear coating is applied to form a clear coating, and hydrophilic particles are applied to the surface of the clear coating to form the clear coating. Adhere hydrophilic particles
The manufacturing method of the building board of Claim 4 characterized by the above-mentioned .
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