JP6168234B2 - Terminal joining method and terminal joining structure - Google Patents

Terminal joining method and terminal joining structure Download PDF

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JP6168234B2
JP6168234B2 JP2016519198A JP2016519198A JP6168234B2 JP 6168234 B2 JP6168234 B2 JP 6168234B2 JP 2016519198 A JP2016519198 A JP 2016519198A JP 2016519198 A JP2016519198 A JP 2016519198A JP 6168234 B2 JP6168234 B2 JP 6168234B2
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terminal
metal
resin
powder
bulk
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JPWO2015174258A1 (en
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義博 川口
義博 川口
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Murata Manufacturing Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

Description

本発明は、端子を接合する端子接合方法および端子接合構造に関する。   The present invention relates to a terminal joining method and a terminal joining structure for joining terminals.

近年、自動車の電装化が進んでおり、例えば、先端部にアーシング端子を取り付けた導線等をエンジンルーム内へ設置することが増えている。導線とアーシング端子とは、通常、圧着（例えばカシメ）を利用した機械的な接合形態により接合されているが、このままでは、特にエンジンルーム内のような高温高湿の環境下において、その接合部分の腐食が進みやすい。   2. Description of the Related Art In recent years, automobiles are becoming more and more electrical. For example, a lead wire having an earthing terminal attached to a tip portion is installed in an engine room. The conducting wire and the earthing terminal are usually joined by a mechanical joining form using crimping (for example, caulking). However, in this state, the joining portion particularly in an environment of high temperature and high humidity such as in an engine room. It is easy for corrosion to progress.

そこで、特許文献１や特許文献２に記載されているように、止水性を有する接合構造が利用されることがある。特許文献１に記載の構造では、溶接等により接続された平板状端子が絶縁ケース内に収容されている。収容された平板状端子は、絶縁ケース内に充填された樹脂材で封止されている。特許文献２に記載の構造では、導線被覆部で導線を被覆してなる被覆電線と端子とが接合されている。導線被覆部から露出する導線および導線被覆部の端部は、圧着部により端子に圧着され、樹脂材により被覆されている。   Therefore, as described in Patent Document 1 and Patent Document 2, a joint structure having water-stopping properties may be used. In the structure described in Patent Document 1, flat terminals connected by welding or the like are accommodated in an insulating case. The accommodated flat terminal is sealed with a resin material filled in an insulating case. In the structure described in Patent Document 2, a covered electric wire formed by covering a conductive wire with a conductive wire covering portion and a terminal are joined. The conducting wire exposed from the conducting wire covering portion and the end portion of the conducting wire covering portion are crimped to the terminal by the crimping portion and covered with a resin material.

特開２００６−１５６０５２号公報JP 2006-156052 A 特開２０１２−１９０６３５号公報JP 2012-190635 A

特許文献１や特許文献２に記載の構造では、端子同士を接合した後に樹脂材を設けているため、樹脂と接合部分との密着性が低い。このため、樹脂で被覆された接合部分が高温高湿下に晒されると、樹脂と接合部分との間に隙間が生じ、その隙間から内部に水分が浸入し、接合部分が腐食してしまうことがある。   In the structures described in Patent Literature 1 and Patent Literature 2, since the resin material is provided after the terminals are joined together, the adhesion between the resin and the joined portion is low. For this reason, if the joint part covered with resin is exposed to high temperature and high humidity, a gap will be formed between the resin and the joint part, and moisture will infiltrate from the gap and the joint part will corrode. There is.

本発明の目的は、高い止水性を確保して端子を接合できる端子接合方法および端子接合構造を提供することにある。   An object of the present invention is to provide a terminal bonding method and a terminal bonding structure capable of bonding terminals while ensuring high water-stopping properties.

本発明の端子接合方法は次の工程を備える。第１端子と第２端子とを位置合わせする。位置合わせした部分に、第１金属粉末と、熱処理によって第１金属粉末と反応して反応相を形成する第２金属粉末とを樹脂材中に分散してなる複合金属シートを巻きつける。位置合わせした部分を熱処理して、第１金属粉末と第２金属粉末とを反応させて、第１端子と第２端子とを包み込む多孔質の金属バルクを形成するとともに、樹脂材を流動させて、金属バルクの多孔質部分を樹脂で埋め、かつ、金属バルクの表面に層状に樹脂をコートして、多孔質部分の樹脂と表面にコートされた樹脂とを連接させる。   The terminal joining method of the present invention includes the following steps. The first terminal and the second terminal are aligned. A composite metal sheet in which a first metal powder and a second metal powder that reacts with the first metal powder by heat treatment to form a reaction phase is dispersed in a resin material is wound around the aligned portion. The aligned portion is heat-treated to cause the first metal powder and the second metal powder to react to form a porous metal bulk that encloses the first terminal and the second terminal, and to flow the resin material The porous part of the metal bulk is filled with a resin, and the resin is coated on the surface of the metal bulk in a layered manner to connect the resin of the porous part and the resin coated on the surface.

この構成では、第１端子と第２端子とを位置合わせした部分を多孔質の金属バルクで包み込むとともに、金属バルクの表面に樹脂層をコートする。また、金属バルクの多孔質部分の樹脂と樹脂層とを連接させるので、樹脂層と金属バルクとの密着性が高い。このため、上記位置合わせした部分と樹脂層との密着強度が高く、止水性が高い端子接合構造を簡易に実現することができる。   In this configuration, a portion where the first terminal and the second terminal are aligned is wrapped with a porous metal bulk, and a resin layer is coated on the surface of the metal bulk. Further, since the resin in the porous portion of the metal bulk and the resin layer are connected, the adhesion between the resin layer and the metal bulk is high. For this reason, it is possible to easily realize a terminal bonding structure in which the adhesion strength between the aligned portion and the resin layer is high and the water blocking property is high.

本発明の端子接合方法では、第１金属粉末としてSnを主成分とする金属粉末を用い、第２金属粉末としてCu-Ni合金粉末、Cu-Mn合金粉末、Cu-Al合金粉末およびCu-Cr合金粉末からなる群より選ばれる少なくとも１種の合金粉末を用いることが好ましい。これら特定の材料を用いることで、比較的低温かつ比較的短時間で、高温耐熱性に優れ、空隙率の大きな金属バルクが得られる。   In the terminal joining method of the present invention, a metal powder mainly composed of Sn is used as the first metal powder, and a Cu—Ni alloy powder, a Cu—Mn alloy powder, a Cu—Al alloy powder, and a Cu—Cr as the second metal powder. It is preferable to use at least one alloy powder selected from the group consisting of alloy powders. By using these specific materials, a metal bulk having a high porosity and a high porosity can be obtained at a relatively low temperature and in a relatively short time.

本発明の端子接合方法では、樹脂材としてエポキシ樹脂またはシリコーン樹脂を用いることが好ましい。この構成では、熱処理により上記構造を形成することができる。   In the terminal bonding method of the present invention, it is preferable to use an epoxy resin or a silicone resin as the resin material. In this configuration, the above structure can be formed by heat treatment.

本発明の端子接合方法では、第１端子は、複数の芯線が被覆材によって束ねられた導線であり、第２端子は平板状金属端子でもよい。この構成では、高い止水性を確保して導線と平板状金属端子とを接合することができる。   In the terminal joining method of the present invention, the first terminal may be a conductive wire in which a plurality of core wires are bundled with a covering material, and the second terminal may be a flat metal terminal. With this configuration, it is possible to secure a high water-stopping property and join the conducting wire and the flat metal terminal.

本発明の端子接合方法では、芯線のうち被覆材から露出した部分と被覆材との境界部分を樹脂材で覆うことが好ましい。この構成では、境界部分を樹脂材で覆うので、芯線と被覆材との間、および導線と平板状金属端子との接合部分に水分が浸入しにくい。   In the terminal joining method of the present invention, it is preferable to cover a boundary portion between a portion of the core wire exposed from the covering material and the covering material with a resin material. In this configuration, since the boundary portion is covered with the resin material, it is difficult for moisture to enter between the core wire and the covering material and between the lead wire and the flat metal terminal.

本発明の端子接合方法では、複数の芯線間に第１金属粉末の溶融体を浸入させて金属相を形成し、複数の芯線同士を金属相にて接続させることが好ましい。この構成では、芯線と平板状金属端子との接続不良を抑制することができる。   In the terminal joining method of the present invention, it is preferable that a melt of the first metal powder is infiltrated between a plurality of core wires to form a metal phase, and the plurality of core wires are connected by the metal phase. In this configuration, connection failure between the core wire and the flat metal terminal can be suppressed.

本発明の端子接合構造は、第１端子、第２端子、多孔質の金属バルク、金属バルクの多孔質部分に入り込んだ樹脂、および樹脂層を備える。第１端子および第２端子は近接配置されている。金属バルクは、第１端子および第２端子の近接部分を包み込み、第１金属粉末と第２金属粉末とが反応してなる反応相を含む。樹脂層は、金属バルクの表面にコートされていて、多孔質部分に入り込んだ樹脂と連接している。この構成では、樹脂層の密着強度が高く、止水性が高い端子接合構造を実現することができる。   The terminal junction structure of the present invention includes a first terminal, a second terminal, a porous metal bulk, a resin that has entered a porous portion of the metal bulk, and a resin layer. The first terminal and the second terminal are arranged close to each other. The metal bulk includes a reaction phase that wraps in the vicinity of the first terminal and the second terminal and is a reaction between the first metal powder and the second metal powder. The resin layer is coated on the surface of the metal bulk and is connected to the resin that has entered the porous portion. With this configuration, it is possible to realize a terminal bonding structure in which the adhesive strength of the resin layer is high and the waterstop is high.

本発明によれば、止水性が高い端子接合構造を実現することができる。   According to the present invention, it is possible to realize a terminal bonding structure with high water blocking.

本実施形態に係る端子接合方法を示す模式的断面図である。It is typical sectional drawing which shows the terminal joining method which concerns on this embodiment. 本実施形態に係る端子接合方法を示す外観斜視図である。It is an external appearance perspective view which shows the terminal joining method which concerns on this embodiment. 本実施形態に係る端子接合方法を示す断面図である。It is sectional drawing which shows the terminal joining method which concerns on this embodiment. 複合金属シート３１の部分拡大断面図である。3 is a partially enlarged cross-sectional view of a composite metal sheet 31. FIG. 図５（Ａ）は、テープ状の複合金属シート３１を示す外観斜視図、図５（Ｂ）はその正面図、図５（Ｃ）はその部分拡大断面図である。5A is an external perspective view showing the tape-like composite metal sheet 31, FIG. 5B is a front view thereof, and FIG. 5C is a partially enlarged sectional view thereof.

本発明の実施形態に係る端子接合方法について説明する。図１は、本実施形態に係る端子接合方法の各工程での模式的断面図である。図１中の各図は、導線１１の延伸方向に平行な断面での断面図である。図２は、本実施形態に係る端子接合方法を示す外観斜視図である。図３は、本実施形態に係る端子接合方法を示す断面図である。図３は、導線１１の延伸方向に垂直な断面での断面図である。   A terminal joining method according to an embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view at each step of the terminal bonding method according to the present embodiment. Each drawing in FIG. 1 is a sectional view in a section parallel to the extending direction of the conducting wire 11. FIG. 2 is an external perspective view showing a terminal joining method according to the present embodiment. FIG. 3 is a cross-sectional view showing the terminal joining method according to the present embodiment. FIG. 3 is a cross-sectional view in a cross section perpendicular to the extending direction of the conducting wire 11.

図１（Ａ）に示すように、導線１１およびアーシング端子２１を用意する。導線１１は本発明の「第１端子」の一例である。アーシング端子２１は本発明の「第２端子」の一例である。導線１１は、いわゆるリード線であって、図２（Ａ）に示すように、撚られた７本の芯線１２が被覆材１３で被覆されてなる。被覆材１３は、芯線１２の端部が露出するように芯線１２を被覆している。芯線１２は例えば銅線等であり、被覆材１３は例えばビニル樹脂やフッ素樹脂等の樹脂材である。なお、図１では、各芯線１２を区別できるように示しておらず、細部を省略している。   As shown in FIG. 1A, a conducting wire 11 and an earthing terminal 21 are prepared. The conducting wire 11 is an example of the “first terminal” in the present invention. The earthing terminal 21 is an example of the “second terminal” in the present invention. The conducting wire 11 is a so-called lead wire, and is formed by covering seven twisted core wires 12 with a covering material 13 as shown in FIG. The covering material 13 covers the core wire 12 so that the end of the core wire 12 is exposed. The core wire 12 is, for example, a copper wire or the like, and the covering material 13 is, for example, a resin material such as vinyl resin or fluorine resin. In addition, in FIG. 1, it does not show so that each core wire 12 can be distinguished, and the detail is abbreviate | omitted.

アーシング端子２１は、アーシングに用いられる平板状金属端子である。アーシング端子２１は、例えば銅めっきされた黄銅やステンレス鋼（SUS）等である。アーシング端子２１は、図２（Ａ）に示すように、円形状部分と、円形状部分から延伸する矩形状部分とを有する。アーシング端子２１の円形状部分には、ボルトを通すための開口部２３が形成されている。アーシング端子２１の矩形状部分には、その延伸方向に平行な各端面から平板面に垂直な方向に延伸する延伸部２２ａ，２２ｂが形成されている。延伸部２２ａ，２２ｂは、導線１１とアーシング端子２１との位置合わせをガイドするために用いられる。なお、図１および図３では、延伸部２２ａ，２２ｂの図示を省略している。   The earthing terminal 21 is a flat metal terminal used for earthing. The earthing terminal 21 is, for example, brass plated with copper or stainless steel (SUS). As shown in FIG. 2A, the earthing terminal 21 has a circular portion and a rectangular portion extending from the circular portion. An opening 23 for passing a bolt is formed in the circular portion of the earthing terminal 21. The rectangular portion of the earthing terminal 21 is formed with extending portions 22a and 22b extending from respective end faces parallel to the extending direction in a direction perpendicular to the flat plate surface. The extending portions 22 a and 22 b are used for guiding the alignment between the conductive wire 11 and the earthing terminal 21. In FIGS. 1 and 3, the extending portions 22a and 22b are not shown.

次に、図１（Ｂ）および図２（Ａ）に示すように、アーシング端子２１の矩形状部分の平板面上に芯線１２の端部が接触するように、導線１１とアーシング端子２１とを位置合わせする。具体的には、アーシング端子２１の矩形状部分における円形状部分側の反対側から円形状部分側に向けて、アーシング端子２１の延伸部２２ａ，２２ｂに挟まれた領域に芯線１２の端部を挿入する。また、底面が芯線１２の側面に合うように凹んだブロック状部材２４と、アーシング端子２１の矩形状部分の平板面とにより、芯線１２の端部を挟む。なお、図１および図３では、ブロック状部材２４の図示を省略している。   Next, as shown in FIG. 1 (B) and FIG. 2 (A), the conducting wire 11 and the earthing terminal 21 are placed so that the end portion of the core wire 12 contacts the flat surface of the rectangular portion of the earthing terminal 21. Align. Specifically, the end portion of the core wire 12 is placed in a region sandwiched between the extending portions 22a and 22b of the earthing terminal 21 from the opposite side of the circular portion side of the rectangular portion of the earthing terminal 21 toward the circular portion side. insert. Further, the end portion of the core wire 12 is sandwiched between the block-shaped member 24 that is recessed so that the bottom surface thereof matches the side surface of the core wire 12 and the flat plate surface of the rectangular portion of the earthing terminal 21. 1 and 3, the block-like member 24 is not shown.

次に、図１（Ｃ）および図３（Ａ）に示すように、導線１１とアーシング端子２１とを位置合わせした部分に、複合金属シート３１を巻きつける。複合金属シート３１は、図４に示すように、Sn粉末３２およびCu-Ni合金粉末３３がエポキシ樹脂やシリコーン樹脂等の樹脂材３４に分散されてなる。さらに、複合金属シート３１には、フラックス成分や分散剤等が含まれてもよい。なお、Sn粉末の代わりに、Sn系合金粉末（例えばSn-Ag-Cu合金粉末）を用いてもよい。また、Cu-Ni合金粉末の代わりに、Cu-Mn合金粉末を用いてもよい。   Next, as shown in FIGS. 1C and 3A, the composite metal sheet 31 is wound around the portion where the conducting wire 11 and the earthing terminal 21 are aligned. As shown in FIG. 4, the composite metal sheet 31 includes an Sn powder 32 and a Cu—Ni alloy powder 33 dispersed in a resin material 34 such as an epoxy resin or a silicone resin. Furthermore, the composite metal sheet 31 may include a flux component, a dispersant, and the like. Instead of Sn powder, Sn-based alloy powder (for example, Sn—Ag—Cu alloy powder) may be used. Further, Cu—Mn alloy powder may be used instead of Cu—Ni alloy powder.

Cu-Ni合金粉末の配合量は、Sn粉末量に対して１０〜１００重量％である。樹脂材の配合量は、Sn粉末およびCu-Ni合金粉末の合計量に対して２〜１０重量％である。樹脂材の配合量が２重量％より低くなると、複合金属シート３１の可撓性が失われる。樹脂材の配合量が１０重量％より高くなると、後述の熱処理で、Sn粉末とCu-Ni合金粉末との反応が阻害される。Sn粉末の平均粒径（「平均粒径」はレーザ回折法による平均粒径D50である。）は２〜５０μｍであり、Cu-Ni合金粉末の平均粒径は１〜３０μｍである。   The compounding quantity of Cu-Ni alloy powder is 10 to 100 weight% with respect to Sn powder quantity. The blending amount of the resin material is 2 to 10% by weight with respect to the total amount of Sn powder and Cu—Ni alloy powder. When the blending amount of the resin material is lower than 2% by weight, the flexibility of the composite metal sheet 31 is lost. When the blending amount of the resin material is higher than 10% by weight, the reaction between the Sn powder and the Cu—Ni alloy powder is inhibited by the heat treatment described later. The average particle diameter of the Sn powder (“average particle diameter” is the average particle diameter D50 by laser diffraction method) is 2 to 50 μm, and the average particle diameter of the Cu—Ni alloy powder is 1 to 30 μm.

なお、複合金属シート３１をテープ状に構成してもよい。図５（Ａ）は、テープ状の複合金属シート３１を示す外観斜視図、図５（Ｂ）はその正面図、図５（Ｃ）はその部分拡大断面図である。図５（Ｃ）に示すように、複合金属シート３１の両面に粘着剤層３５が形成され、一方の粘着剤層３５に支持材（剥離紙）３６が貼付されている。支持材３６が貼付された複合金属シート３１は、図５（Ａ）および図５（Ｂ）に示すように、ロール状に巻き取られる。   Note that the composite metal sheet 31 may be configured in a tape shape. 5A is an external perspective view showing the tape-like composite metal sheet 31, FIG. 5B is a front view thereof, and FIG. 5C is a partially enlarged sectional view thereof. As shown in FIG. 5C, the pressure-sensitive adhesive layer 35 is formed on both surfaces of the composite metal sheet 31, and a support material (release paper) 36 is attached to one pressure-sensitive adhesive layer 35. The composite metal sheet 31 to which the support material 36 is affixed is wound up in a roll shape as shown in FIGS. 5 (A) and 5 (B).

次に、導線１１とアーシング端子２１とを位置合わせした部分を熱処理する。熱処理条件については、ピーク温度が２５０〜３５０℃であり、加熱時間が数分以内であることが好ましい。熱処理によって、上記位置合わせした部分を層状に包み込むように、複合金属シート３１が縮む。これによって、導線１１の芯線１２とアーシング端子２１とが物理的に強固に接続される。なお、複合金属シート３１の代わりに単なるはんだシートを用いると、はんだが溶融した際、はんだが特定箇所に凝集し、層状にならない（玉化する）。   Next, the portion where the conducting wire 11 and the earthing terminal 21 are aligned is heat-treated. About heat processing conditions, it is preferable that peak temperature is 250-350 degreeC and heating time is less than several minutes. By the heat treatment, the composite metal sheet 31 is shrunk so as to wrap the aligned portion in layers. Thereby, the core wire 12 of the conducting wire 11 and the earthing terminal 21 are physically and firmly connected. In addition, when a simple solder sheet is used instead of the composite metal sheet 31, when the solder is melted, the solder aggregates at a specific portion and does not form a layer (becomes a ball).

図１（Ｄ）、図２（Ｂ）および図３（Ｂ）に示すように、Snの溶融温度以上での熱処理によって、Snの溶融や樹脂の流動、SnとCu-Ni合金との反応等が起こることで、接合部材４１が形成される。接合部材４１は多孔質の金属バルク４２および樹脂層４４を有する。樹脂層４４は本発明の「表面にコートされた樹脂」の一例である。金属バルク４２は、導線１１とアーシング端子２１とを位置合わせした部分を層状に包み込む。金属バルク４２は、Sn相中にグレイン状のCu-Ni相が分散した構造を有する。Sn相とグレイン状のCu-Ni相との間には、Sn-Cu相、Sn-Ni相、Sn-Cu-Ni相等の反応相（金属間化合物）が形成される。また、Snは、Cuからなる芯線１２との濡れ性が良いため、複数の芯線１２間に浸入して、複数の芯線１２を溶融接合する。すなわち、Sn粉末の溶融体は、複数の芯線１２間に浸入して金属相を形成し、複数の芯線１２同士を金属相にて接続する。つまり、複数の芯線１２および複数の芯線１２間のSn固溶体を含む第１領域と、第１領域の周囲に形成されたSn固溶体中に複数のグレイン状のCu-Ni相を有した第２領域とが形成される。   As shown in FIGS. 1 (D), 2 (B) and 3 (B), by heat treatment above the melting temperature of Sn, melting of Sn, resin flow, reaction between Sn and Cu-Ni alloy, etc. As a result, the joining member 41 is formed. The joining member 41 has a porous metal bulk 42 and a resin layer 44. The resin layer 44 is an example of the “resin coated on the surface” of the present invention. The metal bulk 42 wraps the portion where the conducting wire 11 and the earthing terminal 21 are aligned in layers. The metal bulk 42 has a structure in which grain-like Cu—Ni phases are dispersed in the Sn phase. A reaction phase (intermetallic compound) such as a Sn—Cu phase, a Sn—Ni phase, or a Sn—Cu—Ni phase is formed between the Sn phase and the grain-like Cu—Ni phase. Further, Sn has good wettability with the core wire 12 made of Cu, so that it penetrates between the plurality of core wires 12 and melt-bonds the plurality of core wires 12. That is, the melt of Sn powder penetrates between the plurality of core wires 12 to form a metal phase, and the plurality of core wires 12 are connected to each other by the metal phase. That is, a first region including a plurality of core wires 12 and a Sn solid solution between the plurality of core wires 12, and a second region having a plurality of grain-like Cu—Ni phases in the Sn solid solution formed around the first region. And are formed.

金属バルク４２の第２領域には、SnとCu-Ni合金との反応により多数のポア（孔）４３が形成されるが、樹脂が金属バルク４２のポア４３を埋める。樹脂層４４は、金属バルク４２の表面に樹脂が染み出すことにより、金属バルク４２の表面全体に形成される。ポア４３はオープンポアであり、金属バルク４２の表面にコートされた樹脂層４４と、金属バルク４２のポア４３を埋める樹脂とは、互いに連接している。芯線１２の端部と被覆材１３との境界部分１４は、金属バルク４２および樹脂層４４により覆われている。特に、複合金属シート３１の樹脂材３４は、導線１１の樹脂性の被覆材１３に対する濡れ性が良好であるため、金属バルク４２と導線１１との境界部分を覆うように、被覆材１３の方向に濡れ広がる。なお、導線１１の芯線１２とアーシング端子２１とは単に物理的に接触しているだけでもよいが、芯線１２とアーシング端子２１との間にSn固溶体やSnの拡散接合層が形成されていてもよい。   A large number of pores (holes) 43 are formed in the second region of the metal bulk 42 by the reaction between Sn and the Cu—Ni alloy, but the resin fills the pores 43 of the metal bulk 42. The resin layer 44 is formed on the entire surface of the metal bulk 42 by the resin oozing out on the surface of the metal bulk 42. The pore 43 is an open pore, and the resin layer 44 coated on the surface of the metal bulk 42 and the resin filling the pore 43 of the metal bulk 42 are connected to each other. A boundary portion 14 between the end portion of the core wire 12 and the covering material 13 is covered with a metal bulk 42 and a resin layer 44. In particular, since the resin material 34 of the composite metal sheet 31 has good wettability with respect to the resinous coating material 13 of the conductive wire 11, the direction of the coating material 13 so as to cover the boundary portion between the metal bulk 42 and the conductive wire 11. Spread out wet. The core wire 12 and the earthing terminal 21 of the conducting wire 11 may be merely in physical contact, but an Sn solid solution or a Sn diffusion bonding layer is formed between the core wire 12 and the earthing terminal 21. Good.

以上の工程により、導線１１とアーシング端子２１とが接合される端子接合構造が完成する。この端子接合構造は、図１（Ｄ）に示すように、導線１１、アーシング端子２１および接合部材４１を備える。導線１１は複数の芯線１２を被覆材１３で束ねてなる。接合部材４１は多孔質の金属バルク４２および樹脂層４４を有する。   Through the above steps, a terminal joint structure in which the conductor 11 and the earthing terminal 21 are joined is completed. As shown in FIG. 1D, this terminal joint structure includes a conductive wire 11, an earthing terminal 21, and a joining member 41. The conducting wire 11 is formed by bundling a plurality of core wires 12 with a covering material 13. The joining member 41 has a porous metal bulk 42 and a resin layer 44.

被覆材１３から露出した芯線１２の端部は、アーシング端子２１の平板面に接触している。金属バルク４２は、芯線１２とアーシング端子２１との接触部分を層状に包み込んでいる。金属バルク４２は、Sn相中にグレイン状のCu-Ni相が分散した構造を有し、Sn粉末とCu-Ni合金粉末とが反応してなる反応相を含む。金属バルク４２には、樹脂が入り込んだ多数のポア４３が形成されている。樹脂層４４は、金属バルク４２の表面にコートされていて、ポア４３に入りこんだ樹脂と連接している。   The end of the core wire 12 exposed from the covering material 13 is in contact with the flat surface of the earthing terminal 21. The metal bulk 42 wraps the contact portion between the core wire 12 and the earthing terminal 21 in layers. The metal bulk 42 has a structure in which grain-like Cu—Ni phases are dispersed in the Sn phase, and includes a reaction phase formed by reacting Sn powder and Cu—Ni alloy powder. The metal bulk 42 is formed with a large number of pores 43 in which a resin has entered. The resin layer 44 is coated on the surface of the metal bulk 42 and is connected to the resin that has entered the pores 43.

本実施形態では、芯線１２の端部と被覆材１３との境界部分１４が金属バルク４２および樹脂層４４により覆われている。このため、境界部分１４から、芯線１２と被覆材１３との間、および導線１１とアーシング端子２１との接合部分に、水分が浸入しにくい。また、樹脂層４４と、金属バルク４２のポア４３に入り込んだ樹脂とが連接しているので、樹脂層４４と、上記接合部分を覆う金属バルク４２との密着性が高い。これにより、樹脂層４４と上記接合部分との密着強度が高く、止水性が高い端子接合構造を簡易に実現することができる。   In the present embodiment, the boundary portion 14 between the end portion of the core wire 12 and the covering material 13 is covered with the metal bulk 42 and the resin layer 44. For this reason, it is difficult for moisture to enter from the boundary portion 14 to the joint portion between the core wire 12 and the covering material 13 and between the lead wire 11 and the earthing terminal 21. Further, since the resin layer 44 and the resin that has entered the pores 43 of the metal bulk 42 are connected, the adhesiveness between the resin layer 44 and the metal bulk 42 that covers the joint portion is high. Thereby, it is possible to easily realize a terminal bonding structure in which the adhesion strength between the resin layer 44 and the bonding portion is high and the water blocking property is high.

なお、本発明は、リード線のような導線と平板状のアーシング端子との接合構造に限定されるものではなく、リード線とリード線との接合構造であってもよい。   In addition, this invention is not limited to the joining structure of conducting wires like a lead wire, and a flat earthing terminal, The joining structure of a lead wire and a lead wire may be sufficient.

１１…導線（第１端子）
１２…芯線
１３…被覆材
１４…境界部分
２１…アーシング端子（第２端子）
２２ａ，２２ｂ…延伸部
２３…開口部
２４…ブロック状部材
３１…複合金属シート
３２…Sn粉末（第１金属粉末）
３３…Cu-Ni合金粉末（第２金属粉末）
３４…樹脂材
３５…粘着剤層
３６…支持材
４１…接合部材
４２…金属バルク
４３…ポア
４４…樹脂層11 ... Conductor (first terminal)
12 ... core wire 13 ... covering material 14 ... boundary portion 21 ... earthing terminal (second terminal)
22a, 22b ... stretched portion 23 ... opening 24 ... block-shaped member 31 ... composite metal sheet 32 ... Sn powder (first metal powder)
33 ... Cu-Ni alloy powder (second metal powder)
34 ... Resin material 35 ... Adhesive layer 36 ... Support material 41 ... Joining member 42 ... Metal bulk 43 ... Pore 44 ... Resin layer

Claims (7)

第１端子と第２端子とを位置合わせする工程と、
位置合わせした部分に、第１金属粉末と、熱処理によって前記第１金属粉末と反応して反応相を形成する第２金属粉末とを樹脂材中に分散してなる複合金属シートを巻きつける工程と、
前記位置合わせした部分を熱処理して、前記第１金属粉末と前記第２金属粉末とを反応させて、前記第１端子と前記第２端子とを包み込む多孔質の金属バルクを形成するとともに、前記樹脂材を流動させて、前記金属バルクの多孔質部分を樹脂で埋め、かつ、前記金属バルクの表面に層状に樹脂をコートして、前記多孔質部分の樹脂と表面にコートされた樹脂とを連接させる工程と、を備える、端子接合方法。Aligning the first terminal and the second terminal;
Winding a composite metal sheet formed by dispersing a first metal powder and a second metal powder that reacts with the first metal powder by heat treatment to form a reaction phase around the aligned portion; ,
The aligned portion is heat-treated to cause the first metal powder and the second metal powder to react to form a porous metal bulk that encloses the first terminal and the second terminal, and Flowing a resin material, filling the porous portion of the metal bulk with resin, and coating the surface of the metal bulk with a layer of resin, the resin of the porous portion and the resin coated on the surface And a step of connecting the terminals. 前記第１金属粉末としてSnを主成分とする粉末を用い、前記第２金属粉末としてCu-Ni合金粉末、Cu-Mn合金粉末、Cu-Al合金粉末およびCu-Cr合金粉末からなる群より選ばれる少なくとも１種の合金粉末を用いる、請求項１に記載の端子接合方法。   The first metal powder is a powder containing Sn as a main component, and the second metal powder is selected from the group consisting of a Cu—Ni alloy powder, a Cu—Mn alloy powder, a Cu—Al alloy powder, and a Cu—Cr alloy powder. The terminal joining method according to claim 1, wherein at least one kind of alloy powder is used. 前記樹脂材としてエポキシ樹脂またはシリコーン樹脂を用いる、請求項１または２に記載の端子接合方法。   The terminal bonding method according to claim 1, wherein an epoxy resin or a silicone resin is used as the resin material. 前記第１端子は、複数の芯線が被覆材によって束ねられた導線であり、前記第２端子は平板状金属端子である、請求項１から３のいずれかに記載の端子接合方法。   4. The terminal joining method according to claim 1, wherein the first terminal is a conductive wire in which a plurality of core wires are bundled with a covering material, and the second terminal is a flat metal terminal. 前記芯線のうち前記被覆材から露出した部分と前記被覆材との境界部分を前記樹脂材で覆う、請求項４に記載の端子接合方法。   The terminal bonding method according to claim 4, wherein a boundary portion between the portion exposed from the covering material and the covering material in the core wire is covered with the resin material. 前記複数の芯線間に前記第１金属粉末の溶融体を浸入させて金属相を形成し、前記複数の芯線同士を前記金属相にて接続させる、請求項４または５に記載の端子接合方法。   The terminal joining method according to claim 4 or 5, wherein the melt of the first metal powder is infiltrated between the plurality of core wires to form a metal phase, and the plurality of core wires are connected by the metal phase. 近接配置された第１端子および第２端子と、
前記第１端子および前記第２端子の近接部分を包み込み、第１金属粉末と第２金属粉末とが反応してなる反応相を含む多孔質の金属バルクと、
前記金属バルクの多孔質部分に入り込んだ樹脂と、
前記金属バルクの表面にコートされていて、前記多孔質部分に入り込んだ前記樹脂と連接した樹脂層と、を備える、端子接合構造。A first terminal and a second terminal arranged in proximity,
A porous metal bulk that encloses a proximity portion of the first terminal and the second terminal and includes a reaction phase formed by a reaction between the first metal powder and the second metal powder;
A resin that has entered the porous portion of the metal bulk;
A terminal junction structure comprising: a resin layer coated on a surface of the metal bulk and connected to the resin that has entered the porous portion.
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