JP6140918B2 - Terahertz detector - Google Patents
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本発明は、超伝導トンネル接合（Superconducting Tunnel Junction：ＳＴＪ）素子を用いてテラヘルツ波を検出するテラヘルツ検出器に関する。 The present invention relates to a terahertz detector that detects terahertz waves using a superconducting tunnel junction (STJ) element.
従来のテラヘルツ検出器として、例えば特許文献１に記載の単結晶固有ジョセフソン接合テラヘルツ検出器がある。この検出器は、アンテナを用いて準光学的にテラヘルツ信号と固有ジョセフソン接合とを結合させてテラヘルツ波を検出するようにしている。 As a conventional terahertz detector, for example, there is a single crystal intrinsic Josephson junction terahertz detector described in Patent Document 1. This detector detects a terahertz wave by combining a terahertz signal and an intrinsic Josephson junction quasi-optically using an antenna.
ところで、近年、テラヘルツ波は、その直進性、透過性及び吸収特性等から非破壊検査や物質の推定を含むさまざまな分野での応用が期待されており、より精度よくテラヘルツ波を検出することのできるテラヘルツ検出器が必要になると考えられる。
ここで、ＳＴＪ素子を用いたテラヘルツ検出器（テラヘルツ検出素子）の検出原理として、基板吸収型テラヘルツ検出器の場合、ＳＴＪ素子を設けた基板面と反対側の基板面にテラヘルツ帯のフォトンを照射し、基板で非平衡フォノンに変換し、この非平衡フォノンがＳＴＪ素子に入射してＳＴＪ素子の電極内のクーパー対を破壊して準粒子を生成し、この準粒子の生成に伴って発生するトンネル電流を検出信号としている。また、特許文献１に記載のようなアンテナ部をＳＴＪ素子に接合したアンテナ結合型テラヘルツ検出器の場合、アンテナ部を設けた基板面にテラヘルツ帯のフォトンを照射すると、アンテナの共振効果でアンテナ中心に電界の集中が起こり、集中した電磁波でＳＴＪ素子の電極内のクーパー対を破壊して準粒子を生成し、この準粒子の生成に伴って発生するトンネル電流を検出信号としている。
By the way, in recent years, terahertz waves are expected to be applied in various fields including non-destructive inspection and estimation of substances because of their straightness, permeability and absorption characteristics. It is thought that a terahertz detector that can be used is necessary.
Here, as a detection principle of a terahertz detector using an STJ element (terahertz detection element), in the case of a substrate absorption type terahertz detector, a substrate surface opposite to the substrate surface on which the STJ element is provided is irradiated with terahertz band photons. Then, the substrate is converted to a non-equilibrium phonon, and this non-equilibrium phonon is incident on the STJ element, destroys the Cooper pair in the electrode of the STJ element, generates a quasiparticle, and is generated along with the generation of the quasiparticle. The tunnel current is used as a detection signal. Further, in the case of an antenna coupled terahertz detector in which an antenna unit as described in Patent Document 1 is joined to an STJ element, when a terahertz band photon is irradiated on the substrate surface on which the antenna unit is provided, the antenna center is caused by the resonance effect of the antenna. The electric field is concentrated, and the cooper pair in the electrode of the STJ element is destroyed by the concentrated electromagnetic wave to generate a quasiparticle, and a tunnel current generated by the generation of the quasiparticle is used as a detection signal.
しかしながら、前者の場合、基板内で生成される非平衡フォノンは基板内を伝搬しＳＴＪ素子の電極に至るまでに時間を要するため、ＳＴＪ素子を用いたテラヘルツ検出器の特徴である高速応答性が失われるという問題がある。また、後者の場合、電磁波吸収部分となるＳＴＪ素子の接合部分の面積を大きくすることで、電磁波吸収量が増大しテラヘルツ波の検出効率を高められるが、ＳＴＪ素子の接合部分の面積の増大に比例してＳＴＪ素子の雑音の原因となるリーク電流の増大を招くという問題がある。 However, in the former case, the non-equilibrium phonons generated in the substrate require time to propagate through the substrate and reach the electrodes of the STJ element, and thus the high-speed response characteristic of the terahertz detector using the STJ element is present. There is a problem of being lost. In the latter case, by increasing the area of the junction portion of the STJ element serving as the electromagnetic wave absorption portion, the amount of electromagnetic wave absorption increases and the detection efficiency of the terahertz wave can be increased. However, the area of the junction portion of the STJ element increases. There is a problem that the leak current increases in proportion to cause noise of the STJ element in proportion.
本発明は、このような実情に鑑みてなされたものであり、アンテナ結合型において、ＳＴＪ素子接合部分の面積を大きくすることなく、テラヘルツ波の検出効率を高めることができるテラヘルツ検出器を提供することを目的とする。 The present invention has been made in view of such circumstances, and provides a terahertz detector capable of increasing the detection efficiency of terahertz waves without increasing the area of the STJ element junction portion in the antenna coupling type. For the purpose.
本発明の一側面によるテラヘルツ検出器は、基板上に形成され、テラヘルツ帯における周波数を共振周波数として有するアンテナ部と、前記基板上の前記アンテナ部の中心に配置された超伝導トンネル接合素子と、を備え、前記アンテナ部は、リーク電流の増大を防止しつつ前記超伝導トンネル接合素子の電磁波吸収量を増大させるように、それぞれが同一の共振周波数を有した同形状の複数のアンテナで構成され、前記基板の裏面からテラヘルツ光が入射されることを特徴とする。 A terahertz detector according to one aspect of the present invention includes an antenna unit formed on a substrate and having a frequency in the terahertz band as a resonance frequency, and a superconducting tunnel junction element disposed at the center of the antenna unit on the substrate. The antenna unit is composed of a plurality of antennas of the same shape each having the same resonance frequency so as to increase the electromagnetic wave absorption amount of the superconducting tunnel junction element while preventing an increase in leakage current. The terahertz light is incident from the back surface of the substrate.
本発明のテラヘルツ検出器によれば、テラヘルツ帯における周波数を共振周波数として有するアンテナ部と、このアンテナ部に対応して設けられたＳＴＪ素子とを備え、アンテナ部を複数のアンテナで構成するようにしたので、アンテナ面積の増大によって、ＳＴＪ素子に入射する非平衡フォノンを増大でき、また、ＳＴＪ素子の接合部分の面積を大きくせずに電磁波吸収量を増大できる。これにより、テラヘルツ波の検出効率が高いテラヘルツ検出器を実現できる。 According to the terahertz detector of the present invention, an antenna unit having a frequency in the terahertz band as a resonance frequency and an STJ element provided corresponding to the antenna unit are configured, and the antenna unit is configured by a plurality of antennas. Therefore, by increasing the antenna area, the unbalanced phonons incident on the STJ element can be increased, and the electromagnetic wave absorption can be increased without increasing the area of the junction portion of the STJ element. Thereby, a terahertz detector with high terahertz wave detection efficiency can be realized.
以下、添付図面を参照して本発明の実施形態ついて説明する。
図１及び図２は、本発明の一実施形態によるテラヘルツ検出器に使用されるテラヘルツ検出素子の概略構成を示している。図１はテラヘルツ検出素子の平面図、図２は図１のＡ−Ａ断面図である。
本実施形態におけるテラヘルツ検出素子１０は、図１に示すように、基板１１と、基板１１上に形成されたアンテナ部１３と、基板１１上に形成された超伝導トンネル接合素子（ＳＴＪ素子）１５と、を備え、前記アンテナ部１３は、複数（本実施形態では２つ）のアンテナ１３Ａ，１３Ｂを有する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.
1 and 2 show a schematic configuration of a terahertz detector used in a terahertz detector according to an embodiment of the present invention. FIG. 1 is a plan view of a terahertz detection element, and FIG. 2 is a cross-sectional view taken along line AA of FIG.
As shown in FIG. 1, the terahertz detection element 10 in the present embodiment includes a substrate 11, an antenna unit 13 formed on the substrate 11, and a superconducting tunnel junction element (STJ element) 15 formed on the substrate 11. The antenna unit 13 includes a plurality (two in the present embodiment) of antennas 13A and 13B.
本実施形態において、アンテナ部１３の２つのアンテナ１３Ａ，１３ＢとＳＴＪ素子１５は、基板１１上に一体形成されており、換言すれば、テラヘルツ検出素子１０は、基板１１上に、複数のアンテナを備えたアンテナ部とＳＴＪ素子１５を有している。 In the present embodiment, the two antennas 13A and 13B and the STJ element 15 of the antenna unit 13 are integrally formed on the substrate 11. In other words, the terahertz detection element 10 has a plurality of antennas on the substrate 11. The antenna section and the STJ element 15 provided are provided.
基板１１は、絶縁性基板であり、例えばシリコン基板やサファイア基板、酸化マグネシウム（ＭｇＯ）基板等を用いることができる。アンテナ結合型テラヘルツ検出器の場合は、アンテナとインピーダンスを近づけ伝搬効率を上げるために基板裏面からテラヘルツ光を入射する。よって、テラヘルツ光の透過率が比較的良いサファイア基板、酸化マグネシウム（ＭｇＯ）基板等を用いる。 The substrate 11 is an insulating substrate, and for example, a silicon substrate, a sapphire substrate, a magnesium oxide (MgO) substrate, or the like can be used. In the case of an antenna-coupled terahertz detector, terahertz light is incident from the back surface of the substrate in order to bring the impedance close to the antenna and increase the propagation efficiency. Therefore, a sapphire substrate, a magnesium oxide (MgO) substrate, or the like having a relatively high transmittance for terahertz light is used.
アンテナ部１３の２つのアンテナ１３Ａ，１３Ｂは、テラヘルツ帯における周波数をその共振周波数として形成され、基板１１上に配置されている。本実施形態におけるテラヘルツ帯とは、０．１〜１０ＴＨｚ（好ましくは０．１〜５ＴＨｚ）程度の周波数帯域のことをいい、アンテナ部１３の周波数は、テラヘルツ検出器の仕様等に応じて任意に設定することができる。ここで、図１に示すように、本実施形態におけるアンテナ部１３の２つのアンテナ１３Ａ，１３Ｂは、所謂ボウタイアンテナとして形成されている。 The two antennas 13 </ b> A and 13 </ b> B of the antenna unit 13 are formed on the substrate 11 with the frequency in the terahertz band as the resonance frequency. The terahertz band in the present embodiment refers to a frequency band of about 0.1 to 10 THz (preferably 0.1 to 5 THz), and the frequency of the antenna unit 13 is arbitrarily set according to the specifications of the terahertz detector and the like. Can be set. Here, as shown in FIG. 1, the two antennas 13A and 13B of the antenna unit 13 in the present embodiment are formed as so-called bow tie antennas.
ＳＴＪ素子１５は、超伝導膜層−絶縁膜層−超伝導膜層からなる積層構造を有する素子である。具体的には、ＳＴＪ素子１５は、基板１１上に、超伝導電極材料の単層又は超伝導エネルギーギャップの異なる二層の膜からなる下部電極５１、絶縁膜からなるトンネル障壁（トンネルバリア）５３、及び、超伝導電極材料の単層又は超伝導エネルギーギャップの異なる二層の膜からなる上部電極５５が順に積層されて形成されている（図２参照）。そして、ＳＴＪ素子１５は、アンテナ部１３の２つのアンテナ１３Ａ，１３Ｂの中心に配置されている。 The STJ element 15 is an element having a laminated structure composed of a superconducting film layer-insulating film layer-superconducting film layer. Specifically, the STJ element 15 includes a lower electrode 51 made of a single layer of a superconducting electrode material or a two-layer film having different superconducting energy gaps, and a tunnel barrier (tunnel barrier) 53 made of an insulating film on the substrate 11. And the upper electrode 55 which consists of a single layer of the superconducting electrode material or two layers of films having different superconducting energy gaps is laminated in order (see FIG. 2). The STJ element 15 is arranged at the center of the two antennas 13A and 13B of the antenna unit 13.
上述したように、本実施形態においてはアンテナ部１３が所謂ボウタイアンテナとして形成されており、アンテナ部１３の共振周波数と一致する周波数のテラヘルツ波が基板１１上に照射されるとアンテナ部１３の中心部に電界の集中が起きる。従って、ＳＴＪ素子１５をアンテナ部１３の中心に配置することで、集中した電磁波が超伝導電極内のクーパー対を破壊することとなり、アンテナ部１３の共振周波数及びその近傍の周波数を有するテラヘルツ波を効率的に検出できる。尚、ＳＴＪ素子によるテラヘルツ波の検出については後述する。 As described above, in the present embodiment, the antenna unit 13 is formed as a so-called bow-tie antenna, and when a terahertz wave having a frequency that matches the resonance frequency of the antenna unit 13 is irradiated onto the substrate 11, the center of the antenna unit 13 is obtained. Electric field concentration occurs in the area. Therefore, by arranging the STJ element 15 at the center of the antenna unit 13, the concentrated electromagnetic wave destroys the Cooper pair in the superconducting electrode, and the terahertz wave having the resonance frequency of the antenna unit 13 and a frequency in the vicinity thereof is generated. It can be detected efficiently. The detection of the terahertz wave by the STJ element will be described later.
前記超伝導電極材料としては、例えばＡｌ（アルミニウム）／Ｎｂ（ニオブ）の二層膜を用いることができ、トンネル障壁となる絶縁膜としては、例えばＡｌＯｘ（酸化アルミニウム）等を用いることができる。ここで、前記超伝導電極材料を超伝導エネルギーギャップの異なる二層の膜とすれば、超伝導エネルギーギャップの値が小さい材料の層が大きい材料の層で発生した準粒子を集める層（トラップ層）として作用し、トンネルバリア付近のクーパー対の崩壊による準粒子数の増加が期待できる。 As the superconductive electrode material, for example, a two-layer film of Al (aluminum) / Nb (niobium) can be used, and as the insulating film serving as a tunnel barrier, for example, AlOx (aluminum oxide) can be used. Here, if the superconducting electrode material is a two-layer film having different superconducting energy gaps, a layer of a material having a small superconducting energy gap value collects quasiparticles generated in a layer of a material (trap layer). The number of quasiparticles can be expected to increase due to the decay of the Cooper pair near the tunnel barrier.
また、ＳＴＪ素子１５の下部電極５１は、基板１１上に形成された下部配線１７を介してグランドＰＡＤ１９に接続されている。更に、ＳＴＪ素子１５は、ＳｉＯ２（二酸化ケイ素）等からなる層間絶縁膜２１によって覆われており、この層間絶縁膜２１上に上部配線２３が形成されている。そして、上部配線２３の一端は層間絶縁膜２１に形成されたコンタクトホール２５を介して上部電極５５に接続しており、上部配線２３の他端には信号検出用のＰＡＤ２７が設けられている。 The lower electrode 51 of the STJ element 15 is connected to the ground PAD 19 via the lower wiring 17 formed on the substrate 11. Further, the STJ element 15 is covered with an interlayer insulating film 21 made of SiO 2 (silicon dioxide) or the like, and an upper wiring 23 is formed on the interlayer insulating film 21. One end of the upper wiring 23 is connected to the upper electrode 55 through a contact hole 25 formed in the interlayer insulating film 21, and a PAD 27 for signal detection is provided at the other end of the upper wiring 23.
次に、図３〜図５によりテラヘルツ検出素子１０の作製プロセスを説明する。
図３（ａ）に示す第１工程では、スパッタリングによって、超伝導体で薄い絶縁体を挟んだＳＩＳ（Superconducting-Insulator-Superconducting）構造の薄膜、ここではＮｂ／Ａｌ−ＡｌＯｘ−Ａｌ／Ｎｂ構造の薄膜７１を基板１１上に堆積させる。尚、トンネルバリア層（ＡｌＯｘ）は、Ａｌ膜を酸素雰囲気中に長時間放置して酸化させることで得られる。ここで、薄膜７１の上層側のＮｂ／ＡｌがＳＴＪ素子１５の上部電極層となり、中間層のＡｌＯｘがＳＴＪ素子１５のトンネルバリア層となり、下層のＡｌ／ＮｂがＳＴＪ素子１５の下部電極層となる。
Next, a manufacturing process of the terahertz detection element 10 will be described with reference to FIGS.
In the first step shown in FIG. 3A, a thin film having a superconducting-insulator-superconducting (SIS) structure in which a thin insulator is sandwiched between superconductors by sputtering, in this case, an Nb / Al-AlOx-Al / Nb structure. A thin film 71 is deposited on the substrate 11. The tunnel barrier layer (AlOx) can be obtained by oxidizing the Al film by leaving it in an oxygen atmosphere for a long time. Here, Nb / Al on the upper layer side of the thin film 71 becomes the upper electrode layer of the STJ element 15, AlOx in the intermediate layer becomes the tunnel barrier layer of the STJ element 15, and Al / Nb in the lower layer becomes the lower electrode layer of the STJ element 15. Become.
図３（ｂ）に示す第２工程では、感光性フォトレジストをスピンコーターやスプレーコーター等によって薄膜７１上に塗布し、フォトマスクを用いてＳＴＪ素子１５の上部電極５５の形状にパターンニングし、紫外光によって感光させた後に、ポジ型の現像液にて現像してレジスト７２を形成する。 In the second step shown in FIG. 3B, a photosensitive photoresist is applied on the thin film 71 by a spin coater, a spray coater, or the like, and patterned into the shape of the upper electrode 55 of the STJ element 15 using a photomask, After being exposed to ultraviolet light, the resist 72 is formed by developing with a positive developer.
図３（ｃ）に示す第３工程では、反応性イオンエッチング（ＲＩＥ）によって上部電極層、トンネルバリア層、及び、下部電極層の一部を削り、アセトン等の有機溶剤で超音波洗浄して残ったレジスト７２を取り除く。これにより、ＳＴＪ素子１５の上部電極５５及びトンネルバリア５３が形成される。 In the third step shown in FIG. 3C, the upper electrode layer, the tunnel barrier layer, and a part of the lower electrode layer are shaved by reactive ion etching (RIE) and ultrasonically cleaned with an organic solvent such as acetone. The remaining resist 72 is removed. Thereby, the upper electrode 55 and the tunnel barrier 53 of the STJ element 15 are formed.
図３（ｄ）に示す第４工程では、前記第２工程と同様の方法によってアンテナ部１３の２つのアンテナ１３Ａ，１３Ｂ、ＳＴＪ素子１５の下部電極５１、ＳＴＪ素子１５の下部配線１７及びグランドＰＡＤ１９の形状にパターニングされたレジスト７３を形成する。ここで、アンテナ部１３における２つのアンテナ１３Ａ，１３Ｂの形状は、該アンテナ部１３の共振周波数がテラヘルツ帯における周波数に一致するように予め設定される。 In the fourth step shown in FIG. 3D, the two antennas 13A and 13B of the antenna unit 13, the lower electrode 51 of the STJ element 15, the lower wiring 17 of the STJ element 15, and the ground PAD 19 are performed in the same manner as in the second step. A resist 73 patterned in the shape is formed. Here, the shapes of the two antennas 13A and 13B in the antenna unit 13 are set in advance so that the resonance frequency of the antenna unit 13 matches the frequency in the terahertz band.
図４（ａ）に示す第５工程では、前記第３工程と同様の方法でエッチングを行って下部電極層を削り、その後、残ったレジスト７３を取り除く。これにより、アンテナ部１３の２つのアンテナ１３Ａ，１３Ｂ、ＳＴＪ素子１５の下部電極５１、ＳＴＪ素子１５の下部配線１７及びグランドＰＡＤ１９が形成される。 In the fifth step shown in FIG. 4A, etching is performed in the same manner as in the third step to scrape the lower electrode layer, and then the remaining resist 73 is removed. Thus, the two antennas 13A and 13B of the antenna unit 13, the lower electrode 51 of the STJ element 15, the lower wiring 17 of the STJ element 15, and the ground PAD 19 are formed.
図４（ｂ）に示す第６工程では、スパッタリングによって層間絶縁層（例えばＳｉＯ２等）７４を堆積させる。 In the sixth step shown in FIG. 4B, an interlayer insulating layer (eg, SiO 2 ) 74 is deposited by sputtering.
図４（ｃ）に示す第７工程では、前記第２工程と同様の方法によって層間絶縁膜２１、コンタクトホール２５、上部配線２３及びＰＡＤ２７を形成するためのレジスト７５を形成する。 In the seventh step shown in FIG. 4C, a resist 75 for forming the interlayer insulating film 21, the contact hole 25, the upper wiring 23 and the PAD 27 is formed by the same method as in the second step.
図４（ｄ）に示す第８工程では、前記第３工程と同様の方法によって層間絶縁層７４を削り、その後、残ったレジスト７５を取り除く。これにより、層間絶縁膜２１及びコンタクトホール２５が形成される。 In the eighth step shown in FIG. 4D, the interlayer insulating layer 74 is removed by the same method as in the third step, and then the remaining resist 75 is removed. Thereby, the interlayer insulating film 21 and the contact hole 25 are formed.
図５（ａ）に示す第９工程では、スパッタリングによって上部配線層（例えばＮｂ層）７６を堆積させる。 In the ninth step shown in FIG. 5A, an upper wiring layer (for example, Nb layer) 76 is deposited by sputtering.
図５（ｂ）に示す第１０工程では、前記第２工程と同様の方法によって上部配線２３及びＰＡＤ２７の形状にパターニングされたレジスト７７を形成する。 In the tenth step shown in FIG. 5B, a resist 77 patterned into the shape of the upper wiring 23 and the PAD 27 is formed by the same method as in the second step.
図５（ｃ）に示す第１１工程では、前記第３工程と同様の方法によって上部配線層７６を削り、その後、残ったレジスト７７を取り除く。これにより、上部配線２３及びＰＡＤ２７が形成される。
以上の第１〜第１１工程によってテラヘルツ検出素子１０が作製される。
尚、以上ではスパッタリングによって各層を堆積させているが、これに限るものではなく、他の方法（例えば蒸着）によって各層を堆積させるようにしてもよい。
In the eleventh step shown in FIG. 5C, the upper wiring layer 76 is shaved by the same method as in the third step, and then the remaining resist 77 is removed. Thereby, the upper wiring 23 and the PAD 27 are formed.
The terahertz detecting element 10 is manufactured through the first to eleventh steps.
In the above, each layer is deposited by sputtering, but the present invention is not limited to this, and each layer may be deposited by other methods (for example, vapor deposition).
ここで、テラヘルツ検出素子１０の一連の作用を説明する。
上述したように、基板１１上には、ボウタイアンテナからなる２つのアンテナ１３Ａ，１３Ｂがアンテナ部１３として形成されており、アンテナ部１３はテラヘルツ帯における周波数をその共振周波数として有している。そして、ＳＴＪ素子１５はアンテナ部１３の中心に配置されている。
Here, a series of operations of the terahertz detection element 10 will be described.
As described above, two antennas 13A and 13B made of bow-tie antennas are formed on the substrate 11 as the antenna unit 13, and the antenna unit 13 has a frequency in the terahertz band as its resonance frequency. The STJ element 15 is disposed at the center of the antenna unit 13.
このため、基板１１上にテラヘルツ波が照射されると、アンテナ部１３の共振効果によってアンテナ部１３の中心に電界の集中が起こり、集中した電磁波（電磁場）によってＳＴＪ素子１５の下部電極５１内のクーパー対が破壊されて準粒子が生成される。そして、ＳＴＪ素子１５は、下部電極５１内で生成された準粒子がトンネルバリア５３をトンネルする際に流れるトンネル電流を検出信号として出力する。 For this reason, when the terahertz wave is irradiated onto the substrate 11, the electric field is concentrated at the center of the antenna unit 13 due to the resonance effect of the antenna unit 13, and the concentrated electromagnetic wave (electromagnetic field) causes the concentration in the lower electrode 51 of the STJ element 15. The Cooper pair is destroyed and quasiparticles are generated. The STJ element 15 outputs, as a detection signal, a tunnel current that flows when the quasiparticles generated in the lower electrode 51 tunnel through the tunnel barrier 53.
そして、図示は省略するが、本実施形態によるテラヘルツ検出器は、テラヘルツ検出素子１０の検出信号を増幅して出力するプリアンプ、このプリアンプの出力をＡ／Ｄ変換してデジタルデータとして出力するＡ／Ｄ変換器、及び、Ａ／Ｄ変換器の出力を記録する記録装置を備えており、ＳＴＪ素子の検出信号、即ち、テラヘルツ波の検出結果を記録する。 Although not shown, the terahertz detector according to the present embodiment amplifies the detection signal of the terahertz detection element 10 and outputs it, and A / D converts the output of this preamplifier and outputs it as digital data. A recording device for recording the output of the D converter and the A / D converter is provided, and the detection signal of the STJ element, that is, the detection result of the terahertz wave is recorded.
前記テラヘルツ検出器（テラヘルツ検出素子１０）は、次のような効果を有する。
基板１１上に、テラヘルツ帯域における周波数を共振周波数として有するアンテナ部１３として複数のアンテナ１３Ａ，１３Ｂを設け、ＳＴＪ素子１５が複数のアンテナ１３Ａ，１３Ｂに接続されているので、テラヘルツ光の照射されるアンテナ面積の増大により、ＳＴＪ素子１５の接合部分の面積を増大せずにＳＴＪ素子１５の電磁波吸収量を増大できる。これにより、ＳＴＪ素子１５の雑音の原因となるリーク電流の増大させずにＳＴＪ素子内で生成される準粒子の数を増加でき、テラヘルツ検出器（テラヘルツ検出素子）によるテラヘルツ波の検出効率を高めることができる。
The terahertz detector (terahertz detection element 10) has the following effects.
Since a plurality of antennas 13A and 13B are provided on the substrate 11 as the antenna unit 13 having a frequency in the terahertz band as a resonance frequency, and the STJ element 15 is connected to the plurality of antennas 13A and 13B, the terahertz light is irradiated. By increasing the antenna area, the electromagnetic wave absorption amount of the STJ element 15 can be increased without increasing the area of the joint portion of the STJ element 15. As a result, the number of quasiparticles generated in the STJ element can be increased without increasing the leakage current that causes noise in the STJ element 15, and the detection efficiency of the terahertz wave by the terahertz detector (terahertz detection element) is increased. be able to.
以上、本発明の好ましい実施形態について説明したが、本発明は実施形態に限定されるものではなく、本発明の技術的思想に基づいて各種の変形及び変更が可能である。 The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the embodiments, and various modifications and changes can be made based on the technical idea of the present invention.
上記実施形態では、アンテナ部のアンテナとしてボウタイアンテナを用いた例を示したが、図６に示すように、複数（図６では２つ）のダイポールアンテナ１３′Ａ，１３′Ｂを用いてアンテナ部１３′を形成してもよい。ただ、ダイポールアンテナの場合、インピーダンスが２つのアンテナ間の角度だけでなく周波数にも依存するため、検出するテラヘルツ光の周波数に応じてアンテナの長さと角度を変更する必要があり、ボウタイアンテナと比べてインピーダンスマッチングが難しくなる。 In the above embodiment, an example in which a bow tie antenna is used as the antenna of the antenna unit has been shown. However, as shown in FIG. 6, a plurality (two in FIG. 6) of dipole antennas 13′A and 13′B are used as antennas. The portion 13 ′ may be formed. However, in the case of a dipole antenna, since the impedance depends not only on the angle between the two antennas but also on the frequency, it is necessary to change the length and angle of the antenna according to the frequency of the terahertz light to be detected. Impedance matching becomes difficult.
尚、アンテナ部が有する複数のアンテナは、ボウタイアンテナとダイポールアンテナのどちらの場合でも、２つに限るものではなく、可能であれば３つ以上設けてもよい。 Note that the number of antennas included in the antenna unit is not limited to two in either case of a bow tie antenna or a dipole antenna, and three or more antennas may be provided if possible.
１０ テラヘルツ検出素子
１１ 基板
１３ アンテナ部
１３Ａ、１３Ｂ アンテナ（ボウタイアンテナ）
１３′Ａ、１３′Ｂ アンテナ（ダイポールアンテナ）
１５ 超伝導トンネル接合素子（ＳＴＪ素子）
５１ 下部電極
５３ トンネルバリア
５５ 上部電極
10 Terahertz detection element 11 Substrate 13 Antenna portion 13A, 13B Antenna (bowtie antenna)
13'A, 13'B antenna (dipole antenna)
15 Superconducting tunnel junction element (STJ element)
51 Lower electrode 53 Tunnel barrier 55 Upper electrode
Claims (3)
前記基板上の前記アンテナ部の中心に配置された超伝導トンネル接合素子と、
を備え、
前記アンテナ部は、リーク電流の増大を防止しつつ前記超伝導トンネル接合素子の電磁波吸収量を増大させるように、それぞれが同一の共振周波数を有した同形状の複数のアンテナで構成され、
前記基板の裏面からテラヘルツ光が入射されることを特徴とするテラヘルツ検出器。 An antenna part formed on a substrate and having a frequency in the terahertz band as a resonance frequency;
A superconducting tunnel junction element disposed in the center of the antenna portion on the substrate;
With
The antenna portion is composed of a plurality of antennas having the same shape, each having the same resonance frequency, so as to increase the electromagnetic wave absorption of the superconducting tunnel junction element while preventing an increase in leakage current ,
A terahertz detector, wherein terahertz light is incident from the back surface of the substrate.
前記複数のボウタイアンテナの中心に前記超伝導トンネル接合素子が配置されている請求項１又は２に記載のテラヘルツ検出器。
The antenna unit is composed of a plurality of bowtie antennas,
The terahertz detector according to claim 1 or 2, wherein the superconducting tunnel junction element is arranged at the center of the plurality of bow tie antennas.
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