JP6112662B2 - Semi-plastic body cutting device - Google Patents

Description

  The present invention relates to an ALC semi-plastic cutting apparatus that is handled in an intermediate stage of an ALC (lightweight cellular concrete) panel manufacturing process used for building outer wall materials and the like.

  In the manufacturing process of the ALC panel, the raw material slurry is conventionally poured into a predetermined mold, and when it is solidified into a semi-plastic state with a predetermined hardness, the mold is removed and the ALC in a semi-plastic state (hereinafter also referred to as a semi-plastic body). In general, a method for obtaining an ALC panel having a predetermined size and shape by steam curing with an autoclave after cutting it into a predetermined size with a wire such as a piano wire has been performed.

  In the case of cutting the semi-plastic body with a wire, a cutting device is often used, and this is a method of cutting by moving the wire stretched between the support portions in a tension state relative to the semi-plastic body. A wire-fixed cutting type cutting device has been used in particular. Here, moving relative to the semi-plastic body means that the wire is moved toward the semi-plastic body without moving the semi-plastic body, or the semi-plastic body is directed toward the wire without moving the wire. It means to move.

  In any case, in the case of the wire fixed cutting method in which the wire stretched in a tension state is pressed against the semi-plastic body, the cut surface of the semi-plastic body is likely to be fluffed, and the smooth cut surface There was a problem that it was difficult to obtain. The reason why the flaking is likely to occur in the wire-fixed cutting method is that the cutting waste repeatedly adheres to and peels from the wire when the semi-plastic body is cut, and thus flaking occurs in the process.

  Cut off of the cut surface not only remains on the surface of the ALC panel even after steam curing, but the appearance of the panel itself is not impaired, and wind or rubbing of the cut off surface is struck when the panel is stored or moved. Or when the panel is vibrated, it may be scattered as powder, which has been a problem in the work environment at the panel storage or construction site. In addition, if the surface of the ALC panel is painted with the surface being rubbed, the rugged portion will remain as an uneven surface on the surface of the ALC panel after coating. It was necessary to prevent it.

  Therefore, in order to suppress such flaking, for example, the technique disclosed in Patent Document 1 provides support members above and below the traveling path of the semi-plastic body, and a cutting line and a gap between these support members. A plurality of wire pairs that are stretched in parallel with each other and are arranged in parallel to each other in a direction perpendicular to the direction in which they are separated. And by reciprocating up and down with the drive device which respectively provided both support members up and down, the semi-plastic body is pressed and cut | disconnected to the several wire pair which reciprocates with this reciprocation.

  In this method, at each cut portion of the semi-plastic body, the semi-plastic body is first cut by a cutting line, and then the cut surface of the cutting line is leveled by a leveling line whose phase of oscillation is shifted from that of the cutting line. It is described that it is possible to reduce periodic flaking that is likely to occur when the wire is cut while reciprocating in the direction of the wire. Further, Patent Document 2 proposes a method that enables cutting while suppressing flaking while suppressing wobbling while periodically moving the wire in one direction in the stretching direction. .

JP 2001-277233 A JP 2004-358597 A

  However, since the method of Patent Document 1 requires a plurality of wire pairs to reciprocate in the vertical direction together with the support members that support them, the apparatus becomes large and the periodic flaking once generated is the same. Even if the shape of the wire is leveled, it cannot be completely erased.

  On the other hand, the method of cutting the wire by running the wire in the stretching direction as in Patent Document 2 reduces the fluffing and obtains a smooth cut surface as the running speed of the wire is increased. In order to cut efficiently at a high speed, the length of the wire required is remarkably long, the power required to run the wire at a high speed is increased, and the equipment is also large, so it is generally used. It was difficult to apply to the ALC cutting apparatus, and as a result, it was not suitable for practical use.

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a semi-plastic cutting apparatus that can be easily introduced with a simple configuration and can obtain a smooth cut surface. And

  In order to achieve the above object, a semi-plastic body cutting device according to the present invention cuts a semi-plastic body that cuts by moving at least one pair of wires stretched in parallel to each other toward the semi-plastic body. The pair of wires are separated with respect to the relative movement direction, and the cross-sectional shape of the rear wire with respect to the relative movement is a streamline shape that extends back and forth. It is said.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to equalize more effectively when leveling the lump produced when it cut | disconnects with the wire of the front side of the relative movement direction with respect to a semiplastic body with the wire of a back side.

It is typical sectional drawing when a semiplastic body is cut | disconnected using only the conventional piano wire. 2 is a cross-sectional view of a wire pair used in Example 1. FIG. 6 is a cross-sectional view of a wire pair used in Example 2. FIG.

  Hereinafter, an embodiment of a semi-plastic body cutting device according to the present invention will be described. The cutting device according to the embodiment of the present invention cuts a semi-plastic body with at least one pair of wires stretched in the vertical direction. For example, the rectangle has a size that allows the semi-plastic body to pass inside. It has a structure in which a pair of two wires stretched in the vertical direction from the upper horizontal bar to the lower horizontal bar of the frame body are arranged at equal intervals from end to end in the rectangular frame body. Yes. The two wires constituting each wire pair are parallel to each other and are preferably separated by about 50 to 100 mm in a direction perpendicular to the rectangular surface of the rectangular frame.

  With this configuration, the rectangular frame body of the cutting device is moved toward the semi-plastic body in the stationary state, or the semi-plastic body is moved toward the rectangular frame body in the stationary state, so that the rectangular frame body is moved. By passing the semi-plastic body in the direction perpendicular to the rectangular surface inside, the front wire is pressed against the semi-plastic body first with respect to the relative movement of the two wires constituting each wire pair. When the semi-plastic body is cut and the rear wire passes with respect to the relative movement between the cutting surfaces facing each other formed by cutting the front wire, unevenness such as flaking of the cutting surface Is leveled. When a plurality of wire pairs are stretched on the rectangular frame body, cutting and leveling similar to the above are performed in each wire pair.

  In the present invention, different wires are used for the front side wire and the rear side wire, and the flaking of the cut surface is significantly reduced. Specifically, for the front wire, a wire such as a piano wire having a circular cross section in a plane orthogonal to the stretching direction, for example, a wire diameter of 0.6 to 1.2 mm is used, and the rear wire is used. Uses a streamlined wire with a cross-sectional shape extending in the front-rear direction on a plane orthogonal to the stretching direction. Examples of the streamline shape extending in the front-rear direction include an elliptical shape, a spindle shape, or a drop shape having a pointed portion facing rearward. By making the rear wire into a streamline shape extending in the front-rear direction in this way, the longitudinal direction of the cross-sectional shape substantially coincides with the relative movement direction of the wire, and the portion cut by the front wire is rearward. When the side wire is leveled, the lapping and cutting powder generated by cutting the front side wire are less likely to repeat adhesion and peeling on the back side wire, and the leveling effect of the cut surface is increased.

  In particular, when the cross-sectional shape of the rear wire is elliptical or spindle-shaped, it is preferable that the minor axis is substantially the same as the diameter of the cross-sectional circle of the front wire. The ratio of the length of the short side to the long side is preferably such that the long side length is 1.1 or more and less than 10 with respect to the short side length 1. If this ratio is less than 1.1, the leveling effect may be insufficient, and even if it is 10 or more, no additional effect can be expected.

  On the other hand, when the cross-sectional shape of the rear wire is a drop shape with the tip portion facing backward, the maximum width in the width direction perpendicular to the center line passing through the tip portion is the circular shape of the cross-section of the front wire. Preferably it is approximately the same as the diameter. The ratio of the maximum width in the width direction to the length in the center line direction is preferably such that the length in the center line direction is 1.1 or more and less than 10 with respect to the length 1 in the width direction. . If this ratio is less than 1.1, the leveling effect may be insufficient, and even if it is 10 or more, no additional effect can be expected.

  As explained above, by cutting the semi-plastic body by making the cross-sectional shape of the rear wire out of the pair of wires into a streamline shape different from the cross-sectional shape of the front side, the relative movement of the rear wire is reduced. In the latter half of the case, it is possible to gradually move away from the cut surface due to the gentle inclination, and thus leveling the lump generated when cutting with the front wire without reattaching to the rear wire it can.

  Accordingly, the semi-plastic body can be cut with a simple and inexpensive structure without using a large-scale apparatus so that traces caused by movement of a wire such as a lump or a piano wire are hardly generated on the cut surface. The semi-plastic body cutting device of the present invention is applicable to any cutting method such as a wire fixing method, a wire reciprocating method, a wire one-way traveling method, etc., and in any of these cases, a smooth cut surface Can be easily obtained.

[Comparative example]
First, a conventional piano wire having a circular wire diameter of 1 mm was stretched over the upper and lower horizontal bars of the rectangular frame so as to extend in the vertical direction. Then, the semi-plastic body was passed through the rectangular frame and cut with the piano wire. As a result, the semi-plastic body 50 having a certain degree of elasticity was cut while being expanded by the penetration of the piano wire 10 having a circular cross section. As shown in FIG. 1, when the piano wire 10 travels, the pushed-up portion turns around to the rear of the piano wire 10, and once adheres to the rear side of the piano wire 10. The tip was turned in the direction of travel and was peeled off from the piano wire 10, and this became the standing 51.

[Example 1]
The two wires were stretched over the upper and lower horizontal bars of the rectangular frame with a distance of 5 cm in parallel with each other and horizontally. As shown in FIG. 2, of these two wires, the piano wire 10 having a circular cross section used in the above comparative example is used at a position on the front side with respect to the relative movement when the semi-plastic body 50 is cut. A wire 20 made of a steel wire having an elliptical cross-sectional shape was disposed at the rear side position. The oval shape of the wire 20 has a short side length equal to the diameter of the piano wire 10 (diameter of a circular cross section) and has a long side length of 3 with respect to the short side length of 1. It was used.

  The semi-plastic body 50 was moved along the separating direction of the two wires as indicated by the arrows toward the wire pair, and was cut. As a result, in the piano wire 10 on the front side, although the wraparound to the rear of the semi-plastic body 50 as shown in FIG. 1 described above has occurred temporarily, the wire 20 having an elliptical cross section passes immediately after that, It was possible to level the indented portion generated in the front wire while preventing the indentation and cutting powder from wrapping behind the rear wire 20, thereby significantly reducing the unevenness of the cut surface. .

[Example 2]
Of the two wires, the same as in Example 1 above, except that a wire 30 made of a drop-shaped steel wire having a cross-sectional shape as shown in FIG. Thus, the semi-plastic body 50 was cut. Note that the drop shape of the wire 30 has the same maximum width in the width direction perpendicular to the center line passing through the peak portion as the diameter of the piano wire 10 (diameter of a circular cross section), and in the width direction. The ratio of the maximum width to the length in the center line direction was 2 with respect to the maximum width length 1 in the width direction. As a result, in this case as well as the first embodiment, it is possible to level the fluff standing portion generated in the front wire while preventing fluff standing and cutting powder from wrapping behind the rear wire 30. The unevenness of the cut surface could be significantly reduced.

10 Piano wire (wire with a circular cross section)
20 Wire with an oval cross section 30 Wire with a cross section drop 50 Semi-plastic body 51 Standing

Claims (3)

  An apparatus for cutting a semi-plastic body that cuts by moving at least one pair of wires stretched parallel to each other relatively toward the semi-plastic body, wherein the pair of wires is related to the relative movement direction. A semi-plastic cutting apparatus characterized in that the cross-sectional shape of a rear wire is a streamline shape extending back and forth with respect to the relative movement.   The semi-plastic body cutting device according to claim 1, wherein the streamline shape is an oval shape, a spindle shape, or a drop shape with a pointed portion facing rearward.   Of the pair of wires, the cross-sectional shape of the front wire with respect to the relative movement is circular, and when the cross-sectional shape of the rear wire is elliptical or spindle-shaped, the short diameter is the diameter of the circular shape. When the cross-sectional shape of the rear wire is a drop shape, the maximum width in the direction perpendicular to the center line passing through the peak portion is substantially the same as the diameter of the circle, The semi-plastic body cutting device according to claim 2.

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