JP6101373B2 - Light emitting unit and flash light emitting device - Google Patents

Description

  The present invention relates to a light emitting unit and a flash light emitting device used to illuminate a subject in a portable terminal device having a camera function.

  In recent years, devices having a camera function for photographing a subject have become widespread for portable terminal devices such as smartphones. Such a portable terminal device includes a light emitting diode (abbreviated as LED) having an amount of light of about 10 W as an illumination light source when photographing in a dark place such as at night.

  A mobile terminal device that includes an LED as an illumination light source has a problem that even when the subject is illuminated by emitting the LED during shooting, the amount of light is small and the brightness is insufficient.

  On the other hand, a flash light emitting device equipped with a xenon discharge tube with a light amount of about 100 kW mounted on a digital still camera or the like needs an aluminum electrolytic capacitor with a capacitor capacity of about several tens of μF because it needs to emit a sufficient amount of light. It is said. In addition, it is comprised so that the accumulation | storage charge by this aluminum electrolytic capacitor may be discharge | released, a xenon discharge tube may be discharged, and a flash may be generated.

  Aluminum electrolytic capacitors are suitable as main capacitors for flashing xenon discharge tubes because of their high capacity and high withstand voltage characteristics, but they are large in size, so they are required to be small and thin. It is difficult to mount on a mobile terminal device.

  As a technique for solving such a problem, Patent Document 1 discloses a technique using a structure in which a plurality of chip-type capacitors are connected in parallel as a main capacitor for flashing a xenon discharge tube.

JP 2004-171820 A

  In the technique disclosed in Patent Document 1, a xenon discharge tube in which a xenon gas is sealed in a hard glass tube is used as a light emitting portion, and this xenon discharge tube is mounted on a wiring board. Such a structure in which a xenon discharge tube is mounted on a wiring board has a limit in miniaturization, and cannot satisfy the demand for miniaturization as a flash light emitting device.

  An object of the present invention is to provide a light emitting unit and a flash light emitting device that are miniaturized while maintaining a light emission amount comparable to that when a xenon discharge tube is used.

The light emitting unit according to the embodiment of the present invention includes:
A light emitting section that emits light by discharge,
The base,
A first front side frame portion standing on one main surface of the base portion;
A first electrode and a second electrode provided on the inner wall surface of the first front frame portion apart from each other;
The first electrode and the second electrode provided on the inner wall surface of the first front side frame portion and the surface of the base in the first front side concave portion defined by the first front side frame portion are mutually connected. A reflective layer that is electrically insulated, the reflective layer being applied with an excitation voltage ,
The inner wall surface of the first front side frame part is formed in a stepped shape so that the opening of the first front side frame part spreads away from the surface of the base part.

The light emitting unit according to the embodiment of the present invention includes:
The opening of the first front frame portion is rectangular.

The light emitting unit according to the embodiment of the present invention includes:
The entire circumference of the inner wall surface of the first front-side frame is formed in a step shape.

A flash light emitting device according to an embodiment of the present invention,
The light emitting part,
Xenon gas sealed in the first front side recess,
And an optical member provided on the first front-side frame so as to close an opening surrounded by the first front-side frame.

  According to the present invention, the light emitting unit and the flash light emitting device can be reduced in size while maintaining the same amount of emitted light as when using a xenon discharge tube.

It is a perspective view which shows typically the structure of the flash light-emitting device 800 which concerns on 1st Embodiment of this invention. It is the figure which planarly viewed the flash light-emitting device 800 from the side by which the light emission part 700 is arrange | positioned. It is the figure which planarly viewed the flash light-emitting device 800 from the opposite side to the side where the light emission part 700 is arrange | positioned. It is the schematic sectional drawing which looked at the flash light-emitting device 800 shown in FIG. 1 from cut surface line AA. 3 is a circuit diagram of a flash light emitting device 800. FIG. 1 is a diagram illustrating a configuration of a multilayer capacitor 100. FIG. 2 is a diagram illustrating a configuration of electrodes embedded in the multilayer body 1 in the multilayer capacitor 100. FIG. 3 is a diagram showing a state of charge distribution in the multilayer capacitor 100. FIG. It is the figure which planarly viewed the flash light-emitting device 800A which concerns on 2nd Embodiment of this invention from the side by which the light emission part 700 is arrange | positioned. It is the figure which planarly viewed the flash light-emitting device 800A from the opposite side to the side where the light emission part 700 is arrange | positioned. It is sectional drawing which shows typically the structure of 800 A of flash light-emitting devices.

  FIG. 1 is a perspective view schematically showing a configuration of a flash light emitting apparatus 800 according to the first embodiment of the present invention. FIG. 1A is a perspective view seen from the side where the light emitting unit 700 is arranged, and FIG. 1B is a perspective view seen from the side opposite to the side where the light emitting unit 700 is arranged. FIG. 2 is a plan view of the flash light emitting device 800 from the side where the light emitting unit 700 is disposed. FIG. 3 is a plan view of the flash light emitting device 800 from the side opposite to the side on which the light emitting unit 700 is disposed. FIG. 4 is a schematic cross-sectional view of the flash light emitting device 800 shown in FIG. 1 as viewed from the section line AA. FIG. 5 is a circuit diagram of the flash light emitting device 800.

  The flash light emitting device 800 is a device provided as an illumination light source when photographing in a dark place such as a night in a portable terminal device such as a smartphone having a camera function for photographing a subject. The flash light emitting device 800 boosts the power supply voltage of a light emitting unit 700 that emits light by discharge, a container 801 formed of an electrically insulating material, a main capacitor 100, and a predetermined power source, and the boosted voltage. Includes a booster circuit unit that accumulates charges in the main capacitor 100, a trigger voltage generation circuit unit that generates a trigger voltage, and a light emission control circuit unit that performs light emission control of the light emitting unit 700. The step-up circuit unit includes a step-up transformer 201 and a diode 301. The light emission control circuit unit includes an insulated gate bipolar transistor (hereinafter referred to as “IGBT”) 501, which is a semiconductor switching element, an operation stabilizing capacitor 104, a diode 302, and the like. The trigger voltage generation circuit unit is configured by a trigger capacitor 103, a trigger transformer 202, and the like.

  The container 801 is made of a material having electrical insulation, and is a rectangular plate-shaped base 801A and an annular first frame portion having a rectangular opening and standing on one main surface of the base 801A. A first front frame 801B and a second front surface that is a ring-shaped second frame having a rectangular opening and standing on one main surface of the base 801A, connected to the first front frame 801B. It includes a side frame portion 801C and a back side frame portion 801D that is an annular third frame portion that has a rectangular opening and is provided on the other main surface of the base portion 801A.

  In the present embodiment, the base portion 801A, the first front side frame portion 801B, the second front side frame portion 801C, and the rear side frame portion 801D are configured by integrally laminating a plurality of ceramic insulating layers. Yes.

  In the container 801 configured as described above, the first front-side concave portion 801BB that is the first concave portion is formed by the first front-side frame portion 801B standing on the one main surface of the base portion 801A. The second front side frame portion 801C is erected on one main surface of 801A to form a second front side concave portion 801CC which is a second recess, and the back side frame portion 801D is formed on the other main surface of the base portion 801A. By being erected, a back side recess 801DD which is a third recess is formed.

  The container 801 can be manufactured using a ceramic green sheet. Specifically, a ceramic green sheet serving as a ceramic insulating layer constituting the base portion 801A, the first front side frame portion 801B, the second front side frame portion 801C, and the rear side frame portion 801D is molded into a predetermined shape, and necessary. Accordingly, wiring conductors L1 to L23, which will be described later, a first electrode 702 and a second electrode 703 of the light emitting unit 700, and a reflective layer 701 made of a conductive metal are formed on a ceramic green sheet by printing a conductor paste. Next, after stacking and pressure-bonding such ceramic green sheets, the container 801 can be manufactured by performing a firing process. In the container 801, a plurality of external connection electrode terminals 803 are provided on the back frame 801D.

  The light emitting unit 700 of the present embodiment is provided in a region surrounded by the first front side frame portion 801B on one main surface of the base 801A, that is, in the first front side concave portion 801BB, and emits light by discharge. The light emitting unit 700 includes a reflective layer 701 that has light reflectivity and conductivity and functions as a trigger electrode, a first electrode 702, a second electrode 703, and an optical member 704.

  The reflective layer 701 is formed on the inner wall surface of the first front-side frame 801B and the surface of the base 801A in the first front-side recess 801BB formed by the first front-side frame 801B. In the present embodiment, the inner wall surface of the first front side frame portion 801B is formed in a stepped shape so that the opening of the first front side frame portion 801B spreads away from the surface of the base portion 801A.

  The first electrode 702 and the second electrode 703 are formed on the inner wall surface of the first front side frame portion 801B so as to be separated from each other. Note that the first electrode 702, the second electrode 703, and the reflective layer 701 are electrically insulated from each other.

  The optical member 704 is provided on the first front side frame portion 801B so that the opening surrounded by the first front side frame portion 801B is closed. By providing the optical member 704 on the first front side frame portion 801B, the first front side concave portion 801BB formed by the first front side frame portion 801B becomes a sealed space. The optical member 704 is light transmissive, and emits light generated by light emission by discharge in the light emitting unit 700 to the outside as diffused illumination light.

  Further, in the present embodiment, the space between the base portion 801A and the optical member 704, which is enclosed by the first front frame portion 801B, which is closed by the optical member 704, that is, in the first front recess 801BB. In addition, xenon gas is enclosed.

  The light emitting unit 700 configured by sealing the xenon gas in the first front side concave portion 801BB emits light (generates flash) in the first front side concave portion 801BB by the accumulated charge by the main capacitor 100, and this first front surface The light generated in the side recess 801BB is emitted to the outside from the optical member 704, whereby the subject can be illuminated.

  The main capacitor 100 is not particularly limited, but is preferably a multilayer capacitor from the viewpoint of high capacity and high withstand voltage characteristics. Hereinafter, the main capacitor 100 is referred to as a “multilayer capacitor 100”.

  The multilayer capacitor 100 is provided in a region surrounded by the second front-side frame portion 801C on the one main surface of the base 801A in the housing 801, that is, in the second front-side recess 801CC, and the first The electrode 702 is electrically connected to the electrode 702 via a wiring conductor L1 formed in the container 801. The multilayer capacitor 100 provided in the second front-side recess 801CC is resin-sealed with a resin sealing material 802A.

  The multilayer capacitor 100 includes a multilayer body in which a plurality of dielectric layers and a plurality of internal electrodes are alternately stacked, and an external electrode provided on a side surface of the multilayer body and electrically connected to the plurality of internal electrodes. And a capacitor. Hereinafter, the multilayer capacitor 100 of the present embodiment will be described by taking as an example a multilayer capacitor including a capacitive electrode having a divided structure divided into a plurality of electrode portions and a floating electrode as an internal electrode.

  FIG. 6 is a diagram illustrating a configuration of the multilayer capacitor 100. FIG. 6A is a perspective view showing the appearance of the multilayer capacitor 100, and FIG. 6B is a cross-sectional view of the multilayer capacitor 100. FIG. 7 is a diagram illustrating a configuration of electrodes embedded in the laminate 1. FIG. 7A is a plan view of the capacitor electrode 3 when the laminate 1 is seen through in the laminating direction, and FIG. 7B is a plan view of the floating electrode 4 when the laminate 1 is seen through in the laminating direction. FIG. 7C is an exploded perspective view showing a stacked state of the capacitive electrode 3 and the floating electrode 4. FIG. 8 is a diagram illustrating a state of charge distribution in the multilayer capacitor 100.

  The multilayer capacitor 100 according to the present embodiment includes a multilayer body 1 in which a plurality of dielectric layers 5 are laminated, and a plurality of capacitive electrodes that are alternately arranged with the dielectric layers 5 sandwiched inside the multilayer body 1. 3 and the floating electrode 4, and the first external electrode portion 2 a and the second electrode electrode 2 provided on the side surface of the laminate 1, electrically connected to each capacitor electrode 3 and electrically insulated from each floating electrode 4. And an external electrode portion 2b. Hereinafter, the first external electrode portion 2a and the second external electrode portion 2b are collectively referred to as “external electrode 2”.

  In the stacked body 1, the dielectric layer 5 has a rectangular shape when viewed in plan in the stacking direction. The capacitive electrodes 3 and the floating electrodes 4 arranged alternately with the dielectric layers 5 sandwiched inside the multilayer body 1 have a rectangular shape when viewed in plan in the stacking direction, like the dielectric layers 5. is there. A laminated body 1 in which the capacitive electrode 3 and the floating electrode 4 are embedded and a plurality of dielectric layers 5 are laminated is formed in a rectangular parallelepiped shape as a whole. In the multilayer body 1, the number of dielectric layers 5 is 100 to 1000 in that the multilayer capacitor 100 can be increased in capacity. In the following, the direction in which the long sides of the capacitive electrode 3, the floating electrode 4, and the dielectric layer 5 extend is referred to as “long side direction X”, and the capacitive electrode 3, floating electrode 4, and dielectric that are orthogonal to the long side direction X The direction in which the short side of the body layer 5 extends is referred to as the “short side direction Y”, and the direction in which the dielectric layer 5 in the stacked body 1 is stacked perpendicular to the long side direction X and the short side direction Y is referred to as the “stacking direction Z”. ".

  In this embodiment, in the laminated body 1, the length in the long side direction X is 3 mm to 20 mm, the length in the short side direction Y is 2 mm to 20 mm, and the length in the stacking direction Z is 1 mm to 2 mm. .

  In the external electrode 2, the first external electrode portion 2 a and the second external electrode portion 2 b each have a thickness of 250 μm to 1000 μm and are formed on the side surface extending in the stacking direction Z of the stacked body 1 over the stacking direction Z. Here, the thicknesses of the first external electrode portion 2a and the second external electrode portion 2b indicate dimensions extending in the long side direction X. As a material constituting the first external electrode portion 2a and the second external electrode portion 2b, for example, a conductor material whose main component is a metal such as nickel, copper, silver, or palladium is used.

  In the present embodiment, the first external electrode portion 2 a is provided on the side surface on one side of the long side direction X of the multilayer body 1, and the second external electrode portion 2 b is on the side surface on the other side of the long side direction X of the multilayer body 1. Is provided. The first external electrode portion 2a is electrically connected to each of a plurality of first electrode portions 31a, 31b, 31c in the capacitor electrode 3 to be described later. The second external electrode portion 2b is electrically insulated from the first external electrode portion 2a, and is electrically connected to each of the plurality of second electrode portions 32a, 32b, and 32c in the capacitor electrode 3.

  The dielectric layer 5 can use a dielectric ceramic mainly composed of barium titanate. For example, crystal particles in which barium titanate contains magnesium oxide, a rare earth element (RE) oxide, manganese oxide, or the like as a solid solution. The dielectric ceramic comprised from can be illustrated. The types of dielectric porcelain are not limited to those described above, but other dielectrics such as barium titanate in which elements such as calcium and strontium are dissolved or those dielectric materials are combined. Porcelain can also be used.

  The thickness of the dielectric layer 5 is 2 μm to 10 μm. The dielectric layer 5 has a length in the long side direction X of 2700 μm to 19500 μm and a length in the short side direction Y of 1700 μm to 19800 μm. The thickness of the dielectric layer 5 is 2 μm or more in order to have a high withstand voltage characteristic, and is 10 μm or less in order to increase the capacitance and to suppress the product thickness.

  In the multilayer capacitor 100 of the present embodiment, the dielectric layer 5 that functions as an effective layer that is sandwiched between the capacitive electrode 3 and the floating electrode 4 to obtain capacitance is sandwiched between the capacitive electrode 3 and the floating electrode 4. The dielectric layers 5 that are disposed on both main surface sides in the stacking direction Z of the stacked body 1 without functioning as a protective layer.

  The capacitive electrode 3 and the floating electrode 4 are internal electrodes formed in a thickness of 0.4 μm to 2 μm for accumulating electric charge and obtaining capacitance. The capacity electrode 3 and the floating electrode 4 have the same size as the dielectric layer 5 when viewed in plan in the stacking direction Z. Specifically, the length in the long side direction X is 2300 μm to 18900 μm. The length in the short side direction Y is 1300 μm to 6500 μm.

  As a material constituting the capacitive electrode 3 and the floating electrode 4, for example, a conductor material containing a metal such as nickel, copper, nickel-copper, silver-palladium as a main component is used.

  As shown in FIG. 8, the multilayer capacitor 100 of the present embodiment has a large electrostatic capacity and a small size by forming a plurality of capacitive electrodes 3 and floating electrodes 4 that store charges with the dielectric layer 5 interposed therebetween. It can be a capacitor that can be easily made.

  As shown in FIG. 7A, the capacitive electrode 3 is a first capacitive electrode comprising a plurality of first electrode portions 31a, 31b, 31c disposed on the same virtual plane in a state of being electrically insulated from each other. Part 31 and a plurality of second electrode portions 32a, 32b, and 32c that are electrically insulated from each other and arranged on the same virtual plane while being electrically insulated from each other. And the second capacitor electrode portion 32.

  In the capacitive electrode 3, the first capacitive electrode portion 31 and the second capacitive electrode portion 32 are provided to be separated from each other in the long side direction X, and the first capacitive electrode portion 31 is disposed on one end side in the long side direction X. The second capacitor electrode part 32 is disposed on the other side in the long side direction X. The separation distance in the long side direction X between the first capacitor electrode part 31 and the second capacitor electrode part 32 is, for example, 100 μm to 1000 μm.

  Further, each of the plurality of first electrode portions 31a, 31b, 31c constituting the first capacitance electrode portion 31 of the capacitance electrode 3 has a rectangular shape when viewed in plan in the stacking direction Z, and in the short side direction Y. Arranged at intervals. The space | interval regarding the short side direction Y between several 1st electrode part 31a, 31b, 31c is 30 micrometers-300 micrometers, for example. The plurality of second electrode portions 32a, 32b, and 32c constituting the second capacitance electrode portion 32 of the capacitance electrode 3 are each rectangular when viewed in plan in the stacking direction Z, and in the short side direction Y Arranged at intervals. The space | interval regarding the short side direction Y between several 2nd electrode part 32a, 32b, 32c is 30 micrometers-300 micrometers, for example.

  The plurality of first electrode portions 31a, 31b, and 31c formed in a rectangular shape and the plurality of second electrode portions 32a, 32b, and 32c have the same shape and size, respectively. The direction in which the long sides of the plurality of first electrode portions 31 a, 31 b, 31 c and the plurality of second electrode portions 32 a, 32 b, 32 c extend is parallel to the long side direction X of the capacitor electrode 3. The plurality of first electrode portions 31a, 31b, 31c and the plurality of second electrode portions 32a, 32b, 32c have a length in the long side direction X of 1000 μm to 10000 μm and a length in the short side direction Y. Is 500 μm to 6500 μm.

  Further, in the capacitive electrode 3, the plurality of first electrode portions 31a, 31b, 31c are each formed from the central part in the long side direction X to one end part, and the end surface on the one end part side in the long side direction X is a laminate. 1 is exposed from the side surface on one end side in the long side direction X and is electrically connected to the first external electrode portion 2a. Further, in the capacitor electrode 3, the plurality of second electrode portions 32a, 32b, and 32c are formed from the central part of the long side direction X to the other end part, respectively, and the end surface on the other side of the long side direction X is The multilayer body 1 is exposed from the side surface on the other end side in the long side direction X and is electrically connected to the second external electrode portion 2b.

  As shown in FIG. 7B, the floating electrode 4 includes a plurality of floating electrode portions 4a, 4b, and 4c disposed on the same virtual plane in a state of being electrically insulated from each other.

  Each of the plurality of floating electrode portions 4a, 4b, and 4c constituting the floating electrode 4 has a rectangular shape when viewed in plan in the stacking direction Z, and is arranged in alignment with a short interval in the short side direction Y. Yes. The space | interval regarding the short side direction Y between several floating electrode part 4a, 4b, 4c is 30 micrometers-300 micrometers, for example.

  The plurality of floating electrode portions 4a, 4b, 4c formed in a rectangular shape have the same shape and size, respectively. The direction in which the long sides of the plurality of floating electrode portions 4 a, 4 b, 4 c extend is parallel to the long side direction X of the floating electrode 4. The plurality of floating electrode portions 4a, 4b, and 4c have a length in the long side direction X of 2300 μm to 18900 μm and a length in the short side direction Y of 500 μm to 6500 μm.

  In the floating electrode 4, the plurality of floating electrode portions 4 a, 4 b, 4 c are each formed from one end to the other end in the long side direction X. However, in each of the plurality of floating electrode portions 4a, 4b, and 4c, the end surface on one end side in the long side direction X and the end surface on the other end side in the long side direction X are not exposed from the side surface of the stacked body 1. The first external electrode portion 2a and the second external electrode portion 2b are electrically insulated.

  Next, a method for manufacturing the multilayer capacitor 100 of this embodiment will be described. First, a dielectric ceramic material for forming the dielectric layer 5 is prepared. Examples of the main component of the dielectric ceramic include titania oxide and zirconate oxide. When using a sintered body mainly composed of barium titanate, for example, a predetermined amount of magnesium oxide powder, rare earth element oxide powder and manganese oxide powder are blended with barium titanate powder, Accordingly, glass powder is added as a sintering aid within a range in which desired dielectric properties can be maintained to obtain a raw material powder.

  Next, an organic vehicle is added to the above raw material powder to prepare a ceramic slurry, and then a ceramic green sheet is formed using a sheet forming method such as a doctor blade method or a die coater method. The thickness of the ceramic green sheet is preferably 2.5 μm to 15 μm from the viewpoint of reducing the thickness of the dielectric layer 5 to increase the capacity and maintaining high insulation.

  Next, a rectangular electrode pattern is printed and formed with a thickness of 0.5 μm to 3.5 μm on the main surface of the obtained ceramic green sheet. The conductor paste to be an electrode pattern is prepared by mixing nickel, copper, or an alloy powder thereof as a main component metal with ceramic powder as a co-material, and adding an organic binder, a solvent, and a dispersant. .

  Next, a desired number of ceramic green sheets on which electrode patterns are formed are stacked, and a plurality of ceramic green sheets on which no electrode patterns are formed are stacked on top and bottom so that the same number of upper and lower layers are stacked. Form. The electrode pattern in the temporary laminate is shifted by a half pattern in the longitudinal direction. By such a lamination method, the electrode pattern corresponding to the first electrode portions 31a, 31b, 31c and the second electrode portions 32a, 32b, 32c and the floating electrode 4 for forming the capacitive electrode 3 are formed after cutting. Therefore, electrode patterns corresponding to the floating electrode portions 4a, 4b, and 4c are formed.

  Next, the temporary laminate is pressed under conditions of higher temperature and higher pressure than the temperature pressure at the time of temporary lamination to form a laminated structure in which the ceramic green sheet and the electrode pattern are firmly adhered.

  Next, this laminated structure is cut along a predetermined cut line, and then fired under a predetermined atmosphere at a temperature condition to form the laminated body 1. As the firing conditions, the temperature rise rate is 5 to 300 ° C./h, degreasing is performed in a temperature range up to 500 ° C., and then the temperature rise rate is 25 to 1000 ° C./h to reduce the hydrogen-nitrogen mixed gas. Bake in the atmosphere at 1100-1300 ° C. for 0.5-4 hours. Furthermore, re-oxidation treatment is performed on the fired sample at 900 to 1100 ° C. in an oxidizing atmosphere.

  Next, an external electrode paste is applied and baked on the opposite side surfaces of the laminated body 1 in the long side direction X to form a first external electrode portion 2a and a second external electrode portion 2b. Further, a plating film is formed on the surfaces of the first external electrode portion 2a and the second external electrode portion 2b in order to improve mountability.

  In the multilayer capacitor 100 of the present embodiment, the capacitive electrode 3 and the floating electrode 4 as internal electrodes that are alternately stacked with the dielectric layer 5 interposed therebetween are formed over the entire main surface of the dielectric layer 5. Instead, it has a characteristic structure. Specifically, the capacitive electrode 3 includes a first capacitive electrode portion 31 including a plurality of first electrode portions 31a, 31b, and 31c disposed on the same virtual plane while being electrically insulated from each other, A second capacitive electrode portion comprising a plurality of second electrode portions 32a, 32b, and 32c that are electrically insulated from the first capacitive electrode portion 31 and arranged on the same virtual plane in a state of being electrically insulated from each other. 32. The floating electrode 4 is composed of a plurality of floating electrode portions 4a, 4b, and 4c disposed on the same virtual plane while being electrically insulated from each other.

  In the multilayer capacitor 100 of the present embodiment configured as described above, the capacitive electrodes 3 are arranged in a balanced manner on one main surface of the dielectric layer 5 so that the capacitive electrode 3 and the dielectric layer 5 are fired. It is possible to disperse the stress generated by the difference in materials. As a result, it is possible to effectively reduce the occurrence of “warping” and “delamination” during firing when the multilayer capacitor 100 is manufactured. Therefore, the multilayer capacitor 100 has a high capacity and a high withstand voltage characteristic, and can be used as a main capacitor for causing the light emitting unit 700 in the flash light emitting device 800 to flash light.

  Next, the configuration and operation of the flash light emitting device 800 will be described with reference to the circuit diagram of FIG. The primary voltage of the step-up transformer 201 can be supplied from the outside or supplied from the control IC 601, and the secondary voltage after the boost is rectified by the diode 301. The voltage value divided by the resistors 404 and 405 at the same time that the multilayer capacitor 100 is charged is confirmed at the terminal 601f of the control IC 601.

  In the DC-DC converter, oscillation is started by controlling the terminal 601g of the control IC 601. The oscillation start signal is input from the controller 900 to the terminal 601a of the control IC 601. The oscillation start signal input to the control IC 601 is input to the DC-DC converter. When an oscillation start signal is input to the DC-DC converter, a DC current supplied from a DC power source DC such as a battery power source provided in the portable terminal device is input to the step-up transformer 201, and oscillation starts.

  The DC power supply voltage is boosted by the step-up transformer 201 by the oscillation of the DC-DC converter, and the output current is rectified by the diode 301. Therefore, the multilayer capacitor 100 is charged by the rectified current rectified by the rectifying diode 301.

  The multilayer capacitor 100 discharges the accumulated charge through the light emitting unit 700 and discharges the light emitting unit 700 to generate flashlight.

  The light emitting unit 700 is started to emit light when an excitation voltage is applied to the reflective layer 701 functioning as a trigger electrode by the trigger voltage generating circuit unit.

  The trigger voltage generation circuit unit receives a signal generated from the controller 900 at a terminal 601c of the control IC 601. The emission control signal output from the terminal 601d of the control IC 601 is input to the gate of the IGBT 501 so that the IGBT 501 is turned on, and the charge of the trigger capacitor 103 is discharged to the primary coil of the diode 302 and the trigger transformer 202. To do. As a result, a high voltage generated in the secondary coil of the trigger transformer 202 is applied to the reflective layer 701 of the light emitting unit 700, and the light emitting unit 700 receives and discharges the accumulated charge of the multilayer capacitor 100 to start light emission. The operation stabilizing capacitor 104 is for stabilizing the operation of the diode 302.

  The resistors 406 and 407 can be adjusted according to the driver output of the terminal 601d of the control IC 601 and the input specifications of the IGBT 501.

  When the multilayer capacitor 100 is charged to a predetermined voltage capable of causing the light emitting unit 700 to emit light, a ready signal is sent from the control IC 601b to the controller 900, and a light emission command is sent from the controller 900 to the terminal 601c of the control IC 601 at a desired timing. Output a signal.

  Since the flash light emitting device 800 of the present embodiment includes the multilayer capacitor 100 having a high capacity and a high withstand voltage characteristic, the accumulated charge by the multilayer capacitor 100 is discharged, and the light emitting unit 700 is discharged to generate flash light. be able to. Such a flash light emitting device 800 includes the multilayer capacitor 100 having a very small size as compared with an aluminum electrolytic capacitor as a main capacitor for causing the light emitting unit 700 to flash light, so that it is required to be reduced in size and thickness. It is suitable for a mobile terminal device such as a smartphone.

  Next, the arrangement of each electronic component in the flash light emitting device 800 and the connection state of the wiring conductor between each electronic component will be described with reference to FIGS.

  In the flash light emitting device 800 of the present embodiment, a booster circuit unit configured by a booster transformer 201 and a diode 301, a light emission control circuit unit configured by an IGBT 501, an operation stabilizing capacitor 104 and a diode 302, a trigger capacitor 103, and a trigger Each electronic component other than the light emitting unit 700 and the multilayer capacitor 100, such as a trigger voltage generation circuit unit configured by the transformer 202 or the like, is surrounded by a rear side frame unit 801D on the other main surface of the base unit 801A in the container 801. The region is provided in the recessed portion 801DD, that is, is sealed with a resin sealing material 802B.

  The housing 801 includes a plurality of wiring conductors L1 to L23 inside or on the surface (main surface) of the base 801A, the first front frame 801B, the second front frame 801C, and the back frame 801D. Is formed.

  The first electrode 702 of the light emitting unit 700 and the multilayer capacitor 100 are electrically connected through a linear shortest path by a wiring conductor L1. In addition, the reflective layer 701 functioning as a trigger electrode of the light emitting unit 700 and the trigger transformer 202 constituting a part of the trigger voltage generating circuit unit are electrically connected by a wiring conductor L2 through a linear shortest path. . The second electrode 703 of the light emitting unit 700 and the operation stabilizing capacitor 104 forming a part of the light emission control circuit unit are electrically connected by a wiring conductor L3 through a linear shortest path.

  In addition, the wiring conductor L4 between the resistor 403 and the wiring conductor L5 between the diode 302, which are electrically connected to the operation stabilizing capacitor 104, are connected through a straight shortest path. Further, the wiring conductor L6 between the multilayer capacitor 100 and the diode 301, which is electrically connected, is connected through a linear shortest path. In addition, the wiring conductor L12 that is electrically connected to the diode 301 and connected to the step-up transformer 201 is also connected through a linear shortest path. Such a portion is the secondary side of the step-up transformer 201 and needs to perform a switching operation at a high voltage. Therefore, parasitic capacitance and impedance in the wiring conductor can be reduced, and energy loss can be suppressed. Can be operated satisfactorily.

  In addition, a diode 301, a resistor 401, and a capacitor 102 that form a DC-DC converter together with the step-up transformer 201 are disposed around the step-up transformer 201 in the back-side recess 801DD formed by the back-side frame 801D of the container 801. Has been. In addition, in the back-side recess 801DD, the trigger transformer 103 and the electronic components constituting the trigger voltage generation circuit unit together with the trigger transformer 202, the trigger capacitor 103, the diode 302, the charging resistor 402, the resistance, which are some electronic components constituting the light emission control circuit unit 403 and an operation stabilization capacitor 104 are arranged around the trigger transformer 202. In addition, in the rear-side recess 801DD, an IGBT 501 and resistors 406 and 407 that function as a light emission control circuit unit and constitute a ready signal generation circuit and an oscillation stop circuit are disposed adjacent to the control IC 601.

  In the flash light emitting device 800 of the present embodiment configured as described above, the light emitting portion 700 that emits light by discharge is surrounded by the first front side frame portion 801B on one main surface of the base portion 801A in the container 801. It is provided in the first front side recess 801BB which is a region. Therefore, the flash light emitting device 800 according to the present embodiment is a miniaturized flash light emitting device while maintaining the same amount of emitted light as when a xenon discharge tube is used.

  Further, in the flash light emitting device 800, the light emitting unit 700 is provided in the first front side concave portion 801BB of the electrically insulating container 801, the multilayer capacitor 100 is provided in the second front side concave portion 801CC, and the rear side concave portion is provided. Each electronic component is provided in 801DD, and further, the second front side concave portion 801CC and the back side concave portion 801DD are resin-sealed by resin sealing materials 802A and 802B. As a result, it is possible to suppress the occurrence of an electrical failure to the outside due to the flash light emitting device 800. For example, the flash light emitting device 800 is mounted at a high density on a high density mounted motherboard such as a smartphone. The mounting area itself can be minimized.

  FIG. 9 is a plan view of a flash light emitting device 800A according to the second embodiment of the present invention from the side where the light emitting unit 700 is disposed. FIG. 10 is a plan view of the flash light emitting device 800A from the side opposite to the side where the light emitting unit 700 is disposed. FIG. 11 is a cross-sectional view schematically showing the configuration of the flash light emitting device 800A.

  The flash light emitting device 800A according to this embodiment is similar to the flash light emitting device 800 according to the first embodiment described above, and corresponding portions are denoted by the same reference numerals and description thereof is omitted. The flash light emitting device 800A differs from the flash light emitting device 800 in the shape of the housing 801, and accordingly, the arrangement position of the multilayer capacitor 100 in the housing 801 is different.

  In the flash light emitting device 800A of the present embodiment, the container 801 is made of a material having electrical insulation, and has a rectangular plate-shaped base 801A and a rectangular opening erected on one main surface of the base 801A. A first front-side frame portion 801B that is an annular first frame portion having a back surface, and a rear-side frame portion that is an annular second frame portion that is erected on the other main surface of the base portion 801A and has a rectangular opening 801D.

  In the present embodiment, the base portion 801A, the first front side frame portion 801B, and the rear side frame portion 801D are configured by integrally laminating a plurality of ceramic insulating layers.

  In the container 801 configured as described above, the first front-side concave portion 801BB that is the first concave portion is formed by the first front-side frame portion 801B standing on the one main surface of the base portion 801A. A back side recess 801DD, which is a second recess, is formed by standing the back side frame 801D on the other main surface of 801A.

  And the light emission part 700 is provided in the area | region enclosed by 1st front surface side frame part 801B on the one main surface of base 801A, ie, 1st front surface side recessed part 801BB. In addition, the multilayer capacitor 100 is provided in a region surrounded by the back side frame portion 801D on the other main surface of the base portion 801A in the container 801, that is, in the back side concave portion 801DD. Further, a booster circuit unit configured by the booster transformer 201 and the diode 301, a light emission control circuit unit configured by the IGBT 501, the operation stabilizing capacitor 104 and the diode 302, a trigger configured by the trigger capacitor 103 and the trigger transformer 202, and the like. Each electronic component other than the light emitting unit 700 and the multilayer capacitor 100, such as a voltage generation circuit unit, is provided in the back side recess 801DD.

  The flash light emitting device 800A of the present embodiment is the above-described flash light emitting device having a configuration in which the multilayer capacitor 100 is provided in the second front side recess 801CC in that the multilayer capacitor 100 is provided in the back side recess 801DD. Different from 800.

  In the flash light emitting device 800A of the present embodiment, the light emitting portion 700 that emits light by discharge is formed by the first front side frame portion 801B on one main surface of the base portion 801A in the container 801, as in the above-described flash light emitting device 800. It is provided in the first front-side recess 801BB, which is an enclosed area. Therefore, the flash light emitting device 800A according to the present embodiment is a miniaturized flash light emitting device while maintaining the same amount of emitted light as when using a xenon discharge tube.

The present invention can be further implemented in the following aspects.
A flash light emitting device according to an embodiment of the present invention,
A container in which first to third recesses are formed,
A plate-like base having electrical insulation;
A first frame portion having electrical insulation provided on one main surface of the base portion to form the first recess;
A second frame portion having electrical insulation provided on the one main surface of the base portion and connected to the first frame portion to form the second recess;
A container having an electrically insulating third frame portion provided on the other main surface of the base portion to form the third recess;
A light emitting part housed in the first recess and emitting light by discharge;
A main capacitor housed in the second recess and electrically connected to the light emitting unit;
A step-up circuit unit that is housed in the third recess, electrically connected to the main capacitor, and applies a boosted voltage to the main capacitor to accumulate electric charge;
A trigger voltage generating circuit unit that is accommodated in the third recess and is electrically connected to the light emitting unit and applies a trigger voltage for the light emitting unit to start discharging;
A light emission control circuit unit housed in the third recess and electrically connected to the light emitting unit, wherein the accumulated charge of the main capacitor is applied to the light emitting unit to which a trigger voltage is applied by the trigger voltage generating circuit unit. And a light emission control circuit unit that emits light from the light emitting unit.

Moreover, the flashlight device according to the embodiment of the present invention,
A container in which first and second recesses are formed,
A plate-like base having electrical insulation;
A first frame portion having electrical insulation provided on one main surface of the base portion to form the first recess;
A container having an electrically insulating second frame portion provided on the other main surface of the base portion to form the second recess,
A light emitting part housed in the first recess and emitting light by discharge;
A main capacitor housed in the second recess and electrically connected to the light emitting unit;
A step-up circuit unit that is housed in the second recess, is electrically connected to the main capacitor, and applies a boosted voltage to the main capacitor to accumulate electric charge;
A trigger voltage generating circuit unit that is accommodated in the second recess and is electrically connected to the light emitting unit and applies a trigger voltage for the light emitting unit to start discharging;
A light emission control circuit unit housed in the second recess and electrically connected to the light emitting unit, wherein the accumulated charge of the main capacitor is applied to the light emitting unit to which a trigger voltage is applied by the trigger voltage generating circuit unit. And a light emission control circuit unit that emits light from the light emitting unit.

Moreover, the flashlight device according to the embodiment of the present invention,
A light transmissive optical member provided on the first frame so that the first recess is closed;
Xenon gas is sealed in the first recess, which is blocked by the optical member.

Moreover, the flashlight device according to the embodiment of the present invention,
The main capacitor is
A laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated;
A multilayer capacitor having an external electrode provided on a side surface of the multilayer body and electrically connected to each of the plurality of internal electrodes.

DESCRIPTION OF SYMBOLS 100 Multilayer capacitor 700 Light emission part 701 Reflection layer 702 1st electrode 703 2nd electrode 704 Optical member 800,800A Flash light-emitting device 801 Housing 801A Base part 801B 1st front side frame part 801C 2nd front side frame part 801D Back side frame part 802A, 802B Resin sealing material 803 External connection electrode terminal

Claims (4)

A light emitting section that emits light by discharge,
The base,
A first front side frame portion standing on one main surface of the base portion;
A first electrode and a second electrode provided on the inner wall surface of the first front frame portion apart from each other;
The first electrode and the second electrode provided on the inner wall surface of the first front side frame portion and the surface of the base in the first front side concave portion defined by the first front side frame portion are mutually connected. A reflective layer that is electrically insulated, the reflective layer being applied with an excitation voltage ,
The light emitting part, wherein an inner wall surface of the first front side frame part is formed in a stepped shape so that an opening of the first front side frame part spreads away from the surface of the base part.   2. The light emitting unit according to claim 1, wherein the opening of the first front side frame is rectangular.   3. The light emitting unit according to claim 1, wherein the entire circumference of the inner wall surface of the first front-side frame is formed in a stepped shape. The light emitting unit according to any one of claims 1 to 3,
Xenon gas sealed in the first front side recess,
An optical member provided on the first front-side frame portion so as to close an opening surrounded by the first front-side frame portion.

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