JP6069943B2 - Fine convex structure correcting method and manufacturing method, and fine convex structure manufacturing system - Google Patents

Description

  The present invention relates to a method for correcting and manufacturing a fine convex structure, and a system for manufacturing the fine convex structure.

  In recent years, nanoimprint technology, photolithography technology, and the like have attracted attention as fine processing technology. The nanoimprint technology is a pattern formation technology that uses a mold member (mold) having a fine concavo-convex structure formed on the surface of a substrate, and transfers the fine concavo-convex structure to a workpiece by transferring the fine concavo-convex structure at the same magnification. Yes (Patent Document 1). In addition, the photolithography technique is a pattern forming technique for forming a resist pattern having a fine concavo-convex structure corresponding to the fine pattern by exposing and developing the photosensitive resist using a photomask having a fine pattern. It is.

  In nanoimprint, generally, a fine concavo-convex structure having a fine concavo-convex structure is obtained by curing the resin in a state where the mold is pressed against a resin having fluidity and then peeling the mold from the cured resin. (Resin pattern) is formed. In photolithography, generally, a photosensitive resist is exposed to UV, EUV, electron beam, X-ray, etc. through a photomask and the like, developed with a developer, and then rinsed with a rinse. Thus, a fine uneven structure (resist pattern) having a fine uneven structure is formed.

  The fine convex structure having a fine convex structure formed by nanoimprint or photolithography described above (for example, a resin pattern or a resist pattern such as a pillar shape and a line and space shape) is used as a cell culture sheet or the like as it is, Since it is used as an etching mask or the like for forming a fine concave structure on a substrate or the like by etching, in the resin pattern or resist pattern, the fine convex structure stands substantially perpendicular to the resin pattern surface or resist pattern surface. It is required to be installed.

  However, in nanoimprint, when the cured resin and the mold are peeled off, not only the force (tensile force) in the vertical direction to the resin pattern surface but also the force in the in-plane direction (tensile force) is applied to the fine convex structure. The fine convex structure may collapse. In particular, when the resin as a mold or a transfer object is made of a flexible material, or while rotating a mold having a micro-concave structure formed on the surface of a belt-like imprint mold or a rotating body, in a predetermined direction. By pressing against the long material to be transferred, the force in the in-plane direction applied to the fine convex structure becomes large when trying to form a fine convex structure on the long material to be transferred. The collapse of the fine convex structure becomes more serious.

  In the photolithography technique, adjacent fine convex structures may fall down due to the influence of surface tension generated during the drying of the developer or rinse liquid used in the development step or the rinse step. In addition to photolithography technology, for example, after forming a thin film layer called a spacer on the side wall of a previously formed convex structure, the convex structure is dissolved and removed using a predetermined solvent or the like while leaving the thin film layer. Thus, even when a fine convex structure constructed by a thin film layer is formed, the fine convex structure may fall down.

Further, the collapse of the fine convex structure may also occur when charges are released from the charged fine convex structure. For example, after forming a fine convex structure made of resin on a substrate by nanoimprinting, a metal thin film is formed only on the top of the fine convex structure (fine convex pattern) in the fine convex structure, and etching is performed using the metal thin film as a mask. Is considered to selectively remove the resin film (resin remaining film) remaining in the concave portion of the fine convex structure and expose the surface of the substrate (see Patent Document 2). At this time, if the RIE method using CHF ₃ is used as a method for selectively removing the resin residual film, if there is a pattern isolated from the surrounding pattern among the fine convex patterns, the metal thin film on the isolated pattern In this case, charge is accumulated during dry etching. When the surrounding pattern is in a grounded state, the isolated pattern may bend and the isolated pattern may be brought into contact with the surrounding pattern in an attempt to release charges from the metal thin film on the isolated pattern. At this time, the isolated pattern in contact with the surrounding pattern remains in a collapsed state even after the charge is released.

  If such a collapse of the fine convex structure occurs, the desired product cannot be obtained and the yield of the product is reduced. However, in the field of fine processing technology as described above, further miniaturization and high aspect ratio are required. In the present situation where the demand is increasing, the problem of collapse of the fine convex structure becomes particularly prominent.

  Therefore, conventionally, when trying to form a fine convex structure of a predetermined shape (line shape, cross shape, etc.) by nanoimprint, the direction (peeling direction) for separating the imprint mold from the cured resin is the shape of the fine convex structure, etc. The technology prevents the collapse of the fine convex structure formed by photolithography by using the technology to prevent the collapse of the fine convex structure (defects such as bending) by controlling according to the condition and the rinse liquid with reduced surface tension. The technique etc. which do are proposed (refer patent document 3, 4 grade | etc.,).

US Pat. No. 5,772,905 JP 2009-194170 A JP 2007-296683 A Japanese Patent Laid-Open No. 2007-213013

  The inventions described in Patent Documents 3 and 4 focus on preventing the fine convex structure from collapsing during the formation of the fine convex structure. It is difficult to completely prevent the collapse, and in particular, there is a problem that it is extremely difficult to completely prevent the collapse of the fine convex structure while further miniaturization of the fine convex structure and the demand for a high aspect ratio are increasing. .

  In the invention described in Patent Document 3, since the collapse of the fine convex structure can be prevented by controlling the peeling operation of the imprint mold, equipment (such as an imprint apparatus) that can realize such a peeling operation is necessary. There is a problem that there is. Moreover, even if such a facility is used, only a fine convex structure having a fine convex structure having a shape (line shape, cross shape, etc.) that can be prevented from falling by the peeling operation can be produced. There exists a problem that it is not suitable for manufacture of the fine convex structure which has a shape. That is, the invention described in Patent Document 2 has a problem that it lacks versatility.

  In addition, although the invention described in Patent Document 4 is certainly a method that can prevent the collapse of the fine convex structure, it is impossible to make the surface tension completely zero. There is a problem that it may be difficult to prevent collapse of the fine convex structure depending on conditions such as an increase in size and dimensions and pitch.

  In view of the above problems, the present invention corrects a fine convex structure that can easily correct a fine convex structure that has collapsed unintentionally when forming a fine convex structure having a fine convex structure. It is an object of the present invention to provide a method, a manufacturing method of a fine convex structure using the correction method, and a manufacturing system of the fine convex structure.

In order to solve the above-described problems, the present invention provides a fine convex structure having a flat portion and a fine convex structure portion protruding from the flat portion, and the fine convex structure portion is perpendicular to the plane portion. A method of correcting the inclination of the fine convex structure portion when the fine convex structure portion is inclined, the surface of the planar portion and the fine convex structure portion of the fine convex structure body having the inclined fine convex structure portion. Provided is a method for correcting a fine convex structure, wherein the inclination of the fine convex structure portion is corrected by generating electric charges having the same polarity on the surface (Invention 1).

  According to the above invention (Invention 1), the direction in which the fine convex structure portion is moved away from the flat portion by the electric repulsive force only by generating charges of the same polarity in the flat portion and the fine convex structure portion in the fine convex structure, In other words, since the fine convex structure portion can be deformed so that the inclined fine convex structure portion protrudes in a direction orthogonal to the flat surface portion, the original purpose of the fine convex structure portion that is inclined (falls down) It can correct so that it may protrude in the direction.

  In the present invention, the “planar portion” means a surface that serves as a base portion of the protruding fine convex structure portion, and may be a flat surface or a non-flat surface such as a concave surface, a convex surface, or a curved surface. May be. In addition, the “direction perpendicular to the plane portion” is a side view of the fine convex structure body in which the fine convex structure portion is positioned upward and the plane portion is positioned downward. The direction perpendicular to the tangent of the plane portion passing through the intersection of the line segment (axis line) passing through the center in the width direction of the fine convex structure portion and the plane portion in any side view from other directions orthogonal to the direction of In the case where the planar portion is a non-flat surface, the “direction orthogonal to the planar portion” means the direction in each fine convex structure portion.

  In the said invention (invention 1), you may produce an electric charge in the said fine convex structure by making the said fine convex structure exist in the atmosphere which can charge the said fine convex structure ( Invention 2) The electric charge may be generated in the fine convex structure by dielectric polarization or electrostatic induction of the fine convex structure (Invention 3).

  In the above inventions (Inventions 1 to 3), it is possible to correct the inclination of the fine convex structure portion in the region where the charge is generated by generating a charge in a partial region of the fine convex structure. Good (Invention 4).

  In the said invention (invention 1-4), the said fine convex structure may be comprised with the insulating material (invention 5), and the said fine convex structure is comprised with the material containing an electroconductive material. In addition, at least a part of the region of the fine convex structure may be in an electrically floating state to generate charges in the fine convex structure (Invention 6).

  Further, the present invention is formed by a fine convex structure forming step of forming a fine convex structure having a flat portion and a fine convex structure portion protruding from the flat portion, and the fine convex structure forming step. In the fine convex structure, when the fine convex structure portion is inclined with respect to a direction orthogonal to the plane portion, the fine convex structure correcting method according to the inventions (Inventions 1 to 6) is used. A method of manufacturing a fine convex structure, comprising: a fine convex structure portion inclination correcting step of correcting the inclination of the fine convex structure portion (Invention 7).

  In the said invention (invention 7), the inclination detection process which detects whether the said fine convex structure part formed by the said fine convex structure formation process inclines with respect to the direction orthogonal to the said plane part is further provided. In addition, when it is determined that the fine convex structure portion is inclined by the inclination detection step, the fine convex structure portion inclination correction step is preferably performed (invention 8).

Furthermore, the present invention is formed by a fine convex structure forming portion that forms a fine convex structure having a flat portion and a fine convex structure portion protruding from the flat portion, and the fine convex structure forming portion. In the fine convex structure, when the fine convex structure portion is inclined with respect to a direction orthogonal to the planar portion, the surface of the planar portion of the fine convex structure and the surface of the fine convex structure portion And a tilt correcting section that corrects the tilt of the fine convex structure section by generating electric charges having the same polarity to each other (Invention 9).

  ADVANTAGE OF THE INVENTION According to this invention, the correction method of the fine convex structure which can correct | amend easily the fine convex structure which fell down unintentionally at the time of formation of the fine convex structure which has a fine convex structure, and the said correction method The manufacturing method of the fine convex structure using this, and the manufacturing system of a fine convex structure can be provided.

FIG. 1 is a flowchart showing a pattern correction method according to an embodiment of the present invention by a cut end face. FIG. 2 is a cut end view showing another example (No. 1) of a fine convex pattern forming body which is a correction object in the pattern correction method according to the embodiment of the present invention. FIG. 3A is a cut end view showing another example (part 2) of the fine convex pattern forming body which is a correction object in the pattern correction method according to the embodiment of the present invention, and FIG. ) Is a perspective view showing another example (No. 2) of the fine convex pattern forming body. FIG. 4 is a cut end view showing a step of forming a fine convex pattern forming body by a nanoimprinting method in the manufacturing method of the fine convex pattern forming body in one embodiment of the present invention. FIG. 5 is a cut end view showing a step of forming a fine convex pattern forming body by a photolithography method in the manufacturing method of the fine convex pattern forming body in one embodiment of the present invention. FIG. 6 is a block diagram showing a schematic configuration of a fine convex pattern forming body manufacturing system in one embodiment of the present invention.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a flowchart showing a pattern correction method according to an embodiment of the present invention by a cut end face, and FIG. 2 is a fine convex pattern which is a correction object in the pattern correction method according to an embodiment of the present invention. FIG. 3 is a cut end view showing another example of the formed body (part 1), and FIG. 3 is another example of the fine convex pattern formed body that is a correction object in the pattern correcting method according to the embodiment of the present invention ( It is the cut end view (Drawing 3 (a)) and perspective view (Drawing 3 (b)) which show the 2).

  In the present embodiment, a pillar-shaped fine convex pattern is described as an example of the fine convex pattern to be corrected, but the present invention is not limited to this as long as it is a convex pattern protruding from the plane portion. For example, a line-and-space fine convex pattern may be used.

  In the pattern correction method according to the present embodiment, a fine convex pattern forming body (fine convex structure) 1 having a flat portion 11 and a fine convex pattern (fine convex structure portion) 12 protruding from the flat portion 11. When the fine convex pattern 12 is inclined with respect to the direction CD perpendicular to the plane portion 11 (see FIG. 1A), an electric charge is generated in the fine convex pattern forming body 1 (FIG. 1 (b)). That is, the fine convex pattern forming body 1 is charged.

  In the pattern correction method according to this embodiment, the fine convex pattern 12 to be corrected is a resin material (thermoplastic resin, thermosetting resin) generally used for forming a fine uneven pattern by a nanoimprint method or a photolithography method. Insulating resin material such as photo-curable resin; conductive resin material, etc.). Examples of such resin materials include olefin-based, styrene-based, ethylene-based, ester-based, thiophoene-based, aniline-based, nylon-based, polyether-based, urethane-based, epoxy-based, phenol-based, acrylic-based, polyimide-based, Resin materials such as polyacetylene; silicone resins such as polydimethylsiloxane and polysiloxane; polypropylene, polycarbonate, polyamide, polyacetal, polyether ether ketone (PEEK), acrylonitrile butadiene styrene resin (ABS), polyphenylene sulfide resin (PPS), poly Examples include phenyloline oxide, polyvinylidene fluoride, polysulfone, polylactic acid, polyethylene terephthalate (PET), and vinyl chloride.

  The conductive resin material is obtained by doping a resin material such as a thermosetting resin or a thermoplastic resin with an electron acceptor or an electron donor such as a conductive metal, a carbon compound, or iodine. . Examples of the resin material that can be doped with the electron acceptor or the electron donor include polyolefin, polyamide, polyimide, polyacetylene, polythiophene, polyaniline, polyester, phenol resin, epoxy resin, acrylic resin, polyurethane, and the like. .

  Further, when the fine convex pattern 12 is made of an insulating resin material, a conductive inorganic film (for example, chromium, nickel, titanium, silicon, molybdenum) is formed on the surface of the fine convex pattern 12 or on the top thereof. , Aluminum, tantalum, gold, cobalt, copper, platinum, palladium, or an alloy containing at least one of them; carbon, etc.) may be formed.

  In the present embodiment, the size (pattern width) or aspect ratio (pattern height / pattern width) of the fine convex pattern 12 in the fine convex pattern forming body 1 causes the fine convex pattern forming body 1 to generate a charge. As long as the size or aspect ratio is such that the inclination of the fine convex pattern 12 can be corrected, there is no particular limitation. However, for example, when the fine convex pattern 12 has a fine dimension (dimension of about 100 nm or less) and a high aspect ratio (aspect ratio of about 2.0 or more), the fine convex pattern is formed when the fine convex pattern forming body 1 is formed. Even if extreme care is taken so that 12 does not tilt, the fine convex pattern 12 may be tilted.

  In addition, the dimension (about 100 nm or less) of the said fine convex pattern 12 is the said fine convex pattern 12 when the cylindrical pillar-shaped fine convex pattern 12 of aspect ratio 2.0 is formed using the resin material mentioned above. The pattern correction method according to the present embodiment can be applied even to a fine convex pattern 12 having a dimension exceeding 100 nm. That is, depending on the structure of the fine convex pattern 12 (cylindrical pillar shape, polygonal pillar shape, line shape, L shape, cross shape, etc .; aspect ratio, etc.), the type of resin material, etc., for example, the dimension exceeds 100 nm. Even the fine convex pattern 12 may be inclined, and the inclination can be corrected.

  The same applies to the aspect ratio (2.0 or more). The structure of the fine convex pattern 12 (columnar pillar shape, polygonal pillar shape, line shape, L shape, cross shape, etc .; aspect ratio, etc.) Depending on the type of the resin material and the like, the fine convex pattern 12 having an aspect ratio of less than 2.0 may be inclined, and the inclination can be corrected.

  For example, when the fine convex pattern 12 is formed by photolithography, the stress applied to the fine convex pattern 12 varies depending on the surface tension of the developer and the rinsing liquid to be used. Depending on the material, tilt may occur.

  The same applies to nanoimprints. For example, when peeling in the direction perpendicular to the interface between the mold and the cured resin, the entire surface of the mold is not separated from the resin at the same time. And proceed toward the center of the contact surface. That is, when the mold is peeled, a gap is generated between the mold and the resin, and the mold and the resin (substrate) are bent. Therefore, if the contact area between the mold and the resin is small, the distance from the outer periphery of the mold that starts to move away from the resin to the fine convex pattern 12 nearest to the outer periphery is short, so that the mold or the cured resin (substrate) is bent. Although the amount is small and the stress in the in-plane direction applied to the fine convex pattern 12 can be ignored according to the amount of deflection, the stress cannot be ignored when the contact area increases, and the aspect ratio is 2 Even a fine convex pattern 12 of less than 0.0 or a fine uneven pattern 12 having a smaller aspect ratio (for example, an aspect ratio of less than 1.5) may be inclined.

  As described above, although the size and aspect ratio of the fine convex pattern 12 to which the pattern correction method according to this embodiment can be applied vary depending on the structure of the fine convex pattern 12 and the type of the resin material constituting the fine convex pattern 12, at least When the fine convex pattern 12 is configured by a self-supporting structure and a resin material, the inclination of the fine convex pattern 12 is particularly effectively corrected by using the pattern correction method according to this embodiment. be able to.

  In the present embodiment, the planar portion 11 is a residual resin film remaining on the substrate 13 as a portion corresponding to a portion other than the concave pattern of the mold when the fine convex pattern forming body 1 is formed on the substrate 13 by the nanoimprint method. (See FIG. 1A). When the fine convex pattern forming body 1 is formed by photolithography, as shown in FIG. 2, the substrate on which the fine convex pattern 12 is formed (for example, a silicon substrate, a metal substrate, a glass substrate, A quartz substrate or the like) 13 is configured as the flat portion 11. Further, when the fine convex pattern 12 is directly formed on a film-like or plate-like resin material by thermal nanoimprint, the planar portion 11 is constituted by the resin material remaining as a portion other than the fine convex pattern 12.

  When the flat part 11 is configured as a resin residual film remaining on the substrate 13, the thickness of the flat part 11 is particularly limited as long as it is a thickness capable of generating a charge on the surface of the flat part 11. It is not a thing. When the fine convex pattern forming body 1 formed on the substrate 13 by the nanoimprint method is used, for example, as a mask for etching the substrate 13, in general, ashing as a pretreatment of the etching process of the substrate 13 is performed. Although the resin residual film remaining on the substrate 13 is removed by a process or the like, the fine convex pattern 12 is deformed or the dimension of the fine convex pattern 12 is changed with the ashing of the resin residual film. As a result, the processing accuracy of the substrate 13 in the etching process may be reduced. In order to correct such an adverse effect, when the fine convex pattern formed body 1 formed by the nanoimprint method is used as a mask at the time of etching the substrate 13, it is desired to make the thickness of the resin residual film extremely thin. ing.

  Therefore, in the case where the flat portion 11 is constituted by the resin residual film on the substrate 13, the thickness of the resin residual film (planar portion 11) is the deformation or dimension of the fine convex pattern 12 accompanying the removal of the resin residual film. It is desirable that the thickness be such that an electric charge can be effectively generated on the surface of the residual resin film (planar portion 11) while taking into consideration the influence on the change and the like.

  Even if the flat portion 11 constituted by the resin residual film has a thickness that can only be charged to such an extent that it is difficult to correct the inclination of the fine convex pattern 12, as shown in FIG. When the fine convex pattern forming body 1 is manufactured on the top, if the substrate 13 is an insulating substrate or a conductive substrate that is not grounded, it is significantly more than the flat portion 11. Since the thick substrate 13 is charged, the inclination of the fine convex pattern 12 can be corrected using the electric repulsive force between the charged substrate 13 and the fine convex pattern 12.

  On the other hand, if the substrate 13 is a conductive substrate and is grounded when generating charges in the fine convex pattern forming body 1, the plane portion 11 is flat when the plane portion 11 is extremely thin. Part of the charge generated in the portion 11 may escape to the substrate 13 side. In such a case, it is preferable that the fine convex pattern 12 and the flat portion 11 are in a state that can sufficiently hold the charge even if the charge that escapes to the conductive substrate 13 is subtracted. Specifically, it is preferable that the resin material constituting the flat portion 11 has a high dielectric constant, and the thickness and area of the flat portion 11 (area on the contact surface with the substrate 13) is as large as possible. preferable.

  In the pattern correction method according to the present embodiment, by charging the fine convex pattern forming body 1, not only between the fine convex pattern 12 and the plane portion 11 but also the adjacent fine convex pattern 12, An electric repulsive force acts between the two, and as a result, the inclination of the fine convex pattern 12 is corrected. Therefore, if the distance between the adjacent fine convex patterns 12 and 12 in the fine convex pattern forming body 1 is too large, it may be difficult to effectively apply an electric repulsive force between them. . Therefore, in the present embodiment, the interval between the adjacent fine convex patterns 12 and 12 is such that the electric repulsive force that can correct the inclination of the fine convex pattern 12 is between the adjacent fine convex patterns 12 and 12. In particular, when the height of the fine convex pattern 12 is smaller than the interval between the adjacent fine convex patterns 12, 12, the distance is the fine convex pattern 12. It is preferable that it is about twice or less of the dimension (width). In addition, when the said space | interval is less than twice the dimension of the fine convex pattern 12, the inclination of the said fine convex pattern 12 is only by the electric repulsive force which acts between the fine convex pattern 12 and the plane part 11. FIG. Will be corrected.

  The method for generating a charge in the fine convex pattern forming body 1 is not particularly limited as long as it is a method capable of generating a charge having the same polarity on the surface of the flat portion 11 and the surface of the fine convex pattern 12. For example, by using a plasma generating apparatus, a dry etching apparatus, or the like, the fine convex pattern forming body 1 exists in an atmosphere capable of charging the fine convex pattern forming body 1 such as a plasma atmosphere. A method of applying charges of the same polarity (for example, negative charges) to the surfaces of the portion 11 and the fine convex pattern 12; the fine convex pattern forming body 1 is present in the electric field generated by the electric field generator or the like to form the fine convex pattern Charges of the same polarity (negative charge or positive charge) are unevenly distributed on the surfaces of the flat surface portion 11 and the fine convex pattern 12 by dielectric polarization or electrostatic induction of the body 1. Law, and the like. The selection of these methods may be appropriately set according to the thickness of the fine convex pattern 12, the type of resin material, and the like as already described. In addition, when the method of making the fine convex pattern formation body 1 exist in the plasma atmosphere formed using the dry etching apparatus as a method for generating the electric charge in the fine convex pattern formation body 1, the fine convex pattern formation is selected. An output with which the body 1 (particularly the resin residual film, the substrate 13 and the like) is not substantially etched (for example, plasma capable of obtaining a desired etching rate of the substrate 13 when dry etching is performed using a dry etching apparatus). A plasma atmosphere is formed at an output of about 80% or less, preferably about 50 to 70% of the output), so that a high frequency current is not applied to the electrode on which the fine convex pattern forming body 1 is mounted if desired. It is preferable that the positive ions in the plasma are not easily drawn into the fine convex pattern forming body 1 side. Thereby, an electric charge can be produced in the said fine convex pattern formation body 1 without etching a fine convex pattern formation body in a plasma atmosphere.

  Further, if the purpose is to generate charges in the fine convex pattern forming body 1, it is also effective to temporarily generate a high density charge in the atmosphere where the fine convex pattern forming body 1 exists. is there. However, the conditions for generating high-density charges are equivalent to or close to the conditions in which the substrate 13 and the like are easily etched, such as temporarily increasing the plasma output, for example. Alternatively, the bias voltage for drawing ions to the substrate 13 side is lowered (for example, the output of the drawing electrode electrically connected to the substrate 13 is lowered), and the type is different from the etchant used for etching the substrate 13 or the like. It is necessary to set conditions for generating a high-density charge such that the etching amount of the substrate 13 or the like is negligible, such as using an etchant having a lower etching rate such as the substrate 13.

  When a charge is generated in the fine convex pattern forming body 1, the amount of charge is such that the inclination of the fine convex pattern 12 can be corrected by the electric repulsive force on the surfaces of the fine convex pattern 12 and the flat portion 11. Generate charge. The amount of charge that can correct the inclination of the fine convex pattern 12 includes the size and aspect ratio of the fine convex pattern 12, the physical properties of the material constituting the fine convex pattern 12, such as the elastic modulus, and the fine convex shape. It can be appropriately set according to the degree of inclination of the pattern 12 (inclination angle), the interval between the adjacent fine convex patterns 12, 12, and the like.

  In addition, when the fine convex pattern 12 and the flat part 11 are comprised by the conductor (for example, conductive polymer, a metal material, etc.), or the fine convex pattern 12 is comprised by the insulator, 11 is composed of a conductor, for example, if the fine convex pattern 12 or the flat surface portion 11 composed of a conductor is grounded, the fine convex pattern forming body 1 is caused to generate a charge. Even if the pattern forming body 1 is present in a plasma atmosphere, it is not possible to generate (charge) charges on the surface of the fine convex pattern 12 or the flat portion 11. Therefore, in such a case, a part of the fine convex pattern forming body 1 (for example, a region to be corrected for the inclination of the fine convex pattern 12 (correction target region)) or a fine convex pattern formation. The entire body 1 needs to be in an electrically floating state (a state where it is not electrically connected or a state where it is not grounded).

  As a method for bringing a partial region of the fine convex pattern forming body 1 into an electrically floating state, for example, the fine convex pattern forming body 1 (the fine convex pattern 12 and the planar portion 11) is made of a conductive polymer. In the case where the fine convex pattern forming body 1 is provided on an insulating substrate 13 such as a glass substrate, as shown in FIGS. And a method of dividing the region OA through the slit 14. In this way, by setting the other area OA to the grounded state, the charge is generated only in the correction target area TA, and the inclination of only the fine convex pattern 12 in the correction target area TA can be corrected.

  In the fine convex pattern forming body 1 formed by the photolithography method, when the substrate 13 as the plane portion 11 is a conductor such as a metal substrate, the substrate 13 is placed on an insulating sheet or the like. By setting the target floating state, the metal substrate 13 which is a conductor can also be charged.

  By generating charges of the same polarity (for example, negative charges) on the surfaces of the flat surface portion 11 and the fine convex pattern 12 as described above, the fine convex portions between the fine convex pattern 12 and the flat portion 11 or adjacent to each other. The fine convex pattern 12 is deformed in a direction away from the plane portion 11 by the electric repulsive force between the pattern patterns 12 and 12 (see FIG. 1C). That is, the inclined fine convex pattern 12 is deformed so as to rise in a direction perpendicular to the plane portion 11. Thereby, the inclination of the fine convex pattern 12 is corrected.

  Finally, the charge generated in the fine convex pattern forming body 1 is released (FIG. 1 (d)). If the fine convex pattern forming body 1 remains in a charged state, various adverse effects may occur. For example, if it remains in a charged state, fine foreign substances existing in the surrounding environment are likely to be attracted, and they adhere to the fine convex pattern forming body 1, and are later formed into fine convex shapes on the substrate 13. When the substrate 13 is etched using the pattern forming body 1 as a mask, the etching accuracy may be reduced. In addition, the fine convex pattern forming body 1 having the flat portion 11 and the fine convex pattern 12 formed by nanoimprint and made of a predetermined resin material or the like is used as it is as a final product (for example, cell culture sheet, metamaterial, hydrophilicity). In the case of a film, a water-repellent film, etc., there is a possibility that a predetermined function may not be achieved due to the characteristics of the foreign matter attached to the fine convex pattern forming body 1. Furthermore, there is a possibility that the fine convex pattern 12 may be damaged due to electric charges (static electricity). Therefore, by discharging the charges from the fine convex pattern forming body 1, it is possible to suppress the adverse effects caused by the charging of the fine convex pattern forming body 1 as described above.

  The method for discharging charges from the fine convex pattern forming body 1 is not particularly limited. For example, in the step shown in FIG. 1B, when the fine convex pattern forming body 1 is caused to exist in a plasma atmosphere to generate charges on the surface thereof, the surface of the fine convex pattern forming body 1 is formed. A method of discharging charges by bringing a conductor into contact with each other, and by applying a charge having a polarity opposite to the charge generated on the surface of the fine convex pattern forming body 1, the charge on the surface of the fine convex pattern forming body 1 is moderated. The method of summing etc. is mentioned. Further, in the step shown in FIG. 1B, when a charge is generated on the surface of the fine convex pattern forming body 1 by dielectric polarization or electrostatic induction, the fine pattern placed in the electric field For example, there is a method of eliminating the uneven distribution of electric charges in the fine convex pattern forming body 1 by taking out the convex pattern forming body 1 from the electric field.

  In addition, when the electric charges are released from the fine convex pattern forming body 1, the fine convex pattern 12 whose inclination is corrected by generating the electric charge is inclined again (returns to the original state). In such a case, the above-described discharge step (FIG. 1D) may be omitted. In particular, the fine convex pattern forming body 1 remains charged in an environment where the above-mentioned adverse effects due to the discharge of the electric charges from the fine convex pattern forming body 1 do not occur or the possibility of the adverse effects occurring is extremely low. If the next process can be carried out even in this state, it is not necessary to discharge the charges from the fine convex pattern forming body 1, and the above-described discharge process (FIG. 1 (d)) may be omitted. For example, in the case where the dry etching process is performed after the inclined fine convex pattern 12 is corrected, a dry etching apparatus is used in the process shown in FIG. The plasma output is adjusted to such an extent that it can be performed or is not etched, and if desired, the fine convex pattern forming body 1 can be put into a plasma atmosphere without applying a high-frequency current to the electrode on which the fine convex pattern forming body 1 is placed. By making it exist below, electric charges are generated in the fine convex pattern forming body 1, thereby correcting the fine convex pattern 12 inclined (see FIG. 1C). Then, without discharging electric charges from the fine convex pattern forming body 1 existing in the plasma atmosphere, the output of the plasma is increased as it is, and if desired, the electrode on which the fine convex pattern forming body 1 is placed is placed. A dry etching process may be performed by applying a high-frequency current. Such a method is preferable because the next dry etching process can be performed as it is while correcting the inclination of the fine convex pattern 12, and the throughput can be improved. In other words, according to the dry etching method including the pattern correction method according to the present embodiment as one step, the throughput of substrate processing by the dry etching method can be improved / improved.

  According to the pattern correction method according to the present embodiment described above, the inclination of the fine convex pattern 12 can be easily corrected simply by generating a charge in the fine convex pattern forming body 1. A product (for example, a cell culture sheet, a metamaterial, a hydrophilic film, a water repellent film, etc.) comprising the formed body 1 can be obtained with high accuracy, and an etching process using the fine convex pattern formed body 1 as a mask. The yield of the product obtained by this can be improved.

[Method for producing fine convex pattern forming body]
The manufacturing method of the fine convex pattern formation body in this embodiment uses the process (formation process) which forms the fine convex pattern formation body 1, and the pattern correction method (refer FIG. 1) which concerns on this embodiment mentioned above. A step of correcting the inclination of the fine convex pattern 12 (correction step).

  In the process of forming the fine convex pattern forming body 1, when the fine convex pattern forming body 1 is manufactured by the nanoimprint method, a predetermined substrate 13 on which the imprinting resin film 15 is formed is prepared (FIG. 4 ( a)), a transfer step of pressing the imprint mold 21 having a fine concave pattern against the imprint resin film 15 on the substrate 13 and curing the imprint resin film 15 in this state (FIG. 4). (B)) and a mold release step (see FIG. 4C) for peeling the imprint mold 21 from the cured imprint resin film 15. In addition, when manufacturing the fine convex pattern formation body 1 by the thermal nanoimprint method, the imprint mold 21 is pressed directly on a film-like or plate-like resin material without using the substrate 13, and the resin material is cured. Also good.

  On the other hand, when the fine convex pattern forming body 1 is manufactured by the photolithography method, the step of forming the fine convex pattern forming body 1 prepares a predetermined substrate 13 on which a photoresist film 16 is formed (FIG. 5 (a)), an exposure process (see FIG. 5 (b)) for exposing the photoresist film 16 on the substrate 13 through a photomask 22 having a predetermined opening pattern 22a and a light shielding pattern 22b, and exposure. In addition, a development step (see FIG. 5C) for developing the photoresist film 16 using a desired developer and a rinse step for rinsing with a rinse solution such as pure water are included.

  As described above, the fine convex pattern forming body 1 having the fine convex pattern 12 can be formed. For example, in the mold release step in the nanoimprint method, the concave pattern inner wall of the imprint mold 21 and the imprint pattern The fine convex pattern 12 is pulled due to adhesion to the resin film 15 (fine convex pattern 12), or the imprint mold 21 is pulled up in a direction inclined with respect to the orthogonal direction to the imprint resin film 15. By doing so, an inclined fine convex pattern 12 may be formed (see FIG. 4C). Further, after the development step (see FIG. 5C) or the rinsing step in the photolithography method, the adjacent fine convex pattern 12 may fall down due to the influence of the surface tension generated when the developer or the rinsing liquid is dried. is there. In particular, in the formed fine convex pattern forming body 1, when the fine convex pattern 12 has the dimensions and aspect ratio as described above, the fine convex pattern 12 may be significantly tilted. .

  In such a case, the inclination of the fine convex pattern 12 is corrected using the pattern correction method (see FIG. 1) according to the present embodiment described above. Thereby, since the inclined fine convex pattern 12 can be corrected so as to stand upright in the direction orthogonal to the plane part 11, the fine pattern having the fine convex pattern 12 protruding in the direction substantially orthogonal to the plane part 11 is obtained. The convex pattern forming body 1 can be manufactured with high accuracy.

  Note that the fine convex pattern 12 protrudes in a direction substantially orthogonal to the flat portion 11 from one direction of the fine convex pattern forming body 1 in which the fine convex pattern 12 is positioned upward and the flat portion 11 is positioned downward. In both the side view and the side view from another direction orthogonal to the one direction, the center in the width direction of the bottom of the fine convex pattern 12 (the part in contact with the flat portion 11) and the fine convex pattern 12 This means that the angle formed by the line segment passing through the center in the width direction of the top portion (the axis of the fine convex pattern 12) with respect to the plane portion 11 is substantially 90 °. It suffices to be within an allowable range depending on the application of the convex pattern forming body 1 (application of a lithography mask, etc.), specifically 90 ° ± 10 ° or less.

  In addition, in the manufacturing method of the fine convex pattern formation body in this embodiment, when the fine convex pattern 12 of the formed fine convex pattern formation body 1 inclines unintentionally, it concerns on this embodiment. In view of correcting the inclination of the fine convex pattern 12 using the pattern correction method (see FIG. 1), the step of forming the fine convex pattern forming body 1, particularly in FIGS. 4 (a) to (c). As shown, when the fine convex pattern forming body 1 is formed by the nanoimprint method, the interval between the adjacent fine convex patterns 12, 12 is within a predetermined range (not more than twice the height of the fine convex pattern 12). In addition, the fine convex pattern forming body 1 is formed so that the thickness of the resin residual film as the plane portion 11 becomes a predetermined thickness (a level that can effectively generate charges on the surface of the plane portion 11). Preferably

  In the manufacturing method of the fine convex pattern formation body in this embodiment, after formation of the fine convex pattern formation body 1, the process (detection process) which detects whether the fine convex pattern 12 inclines is further included. The pattern correction method according to the present embodiment may be applied only to the fine convex pattern formation 1 that is detected in the detection step as the fine convex pattern 12 is inclined. By doing in this way, the manufacturing efficiency of the fine convex pattern formation body 1 can be improved.

  In this case, as a method for detecting whether or not the fine convex pattern 12 is inclined, for example, a method for observing and evaluating the shape, a method for determining the presence or absence of inclination from information obtained by a change in the shape, and the like. Can be mentioned.

  Specifically, the fine convex pattern forming body 1 is imaged from its upper surface or side surface using a laser microscope, SEM, or the like, and the presence or absence of the inclination of the fine convex pattern 12 is determined, or the fine convex pattern forming body 1 is The probe can be brought close to or in contact with the convex pattern forming body 1 to determine whether the fine convex pattern 12 is inclined. On the other hand, when an optical microscope is used, the resolution in response to the fine convex pattern 12 is not sufficient, and it is difficult to identify each fine convex pattern 12, but the fine convex pattern 12 is normally formed (inclined). The contrast or color of the image by comparing it with an image of an area whose slope is known to have been corrected, or comparing such an area with an image captured at the same resolution. The presence or absence of the inclination of the fine convex pattern 12 can be determined based on the difference in optical characteristics such as taste, and the presence or absence of the inclination of the fine convex pattern 12 can be determined based on measurement data such as transmittance, refractive index, and reflectance. It may be judged, and further, these methods may be used in combination.

  According to the manufacturing method of the fine convex pattern forming body in the present embodiment described above, the fine convex pattern 12 that is inclined unintentionally in the manufacturing process of the fine convex pattern forming body 1 is easily corrected. Therefore, the fine convex pattern forming body 1 having the fine convex pattern 12 erected in a direction substantially orthogonal to the plane portion 11 can be manufactured with high accuracy. As a result, a product (for example, a cell culture sheet, metamaterial, hydrophilic film, water-repellent film, etc.) comprising the fine convex pattern forming body 1 can be obtained with high accuracy, and the fine convex pattern forming body can be obtained. The yield of products obtained by an etching process or the like using 1 as a mask can be improved.

[Fine convex pattern production system]
Then, the system which can implement the manufacturing method of the fine convex pattern formation body mentioned above is demonstrated. FIG. 6 is a block diagram showing a schematic configuration of a fine convex pattern forming body manufacturing system in the present embodiment.

  As shown in FIG. 6, the fine convex pattern forming body manufacturing system 30 in the present embodiment includes a manufacturing unit 31 that manufactures the fine convex pattern forming body 1, and a fine convex pattern forming body manufactured in the manufacturing unit 31. The detection unit 32 that detects whether or not one fine convex pattern 12 is inclined, and the inclination of the fine convex pattern 12 of the fine convex pattern forming body 1 that is detected as being inclined by the detection unit 32. And a correction unit 33 for correction.

  The manufacturing unit 31 includes a single device or a plurality of device groups that are generally used to manufacture the fine convex pattern forming body 1. For example, as the manufacturing unit 31 for manufacturing the fine convex pattern forming body 1 by the nanoimprinting method, an optical nanoimprinting device or a thermal nanoimprinting device including a mold holding unit, a substrate stage, an imprinting chamber, etc .; for belt-like or rotating nanoimprinting The fine convex pattern forming body 1 is manufactured by pressing a belt-like or rotating body-like nanoimprint mold against the transferred body while conveying a long sheet-shaped transferred body (resin sheet) using the mold. Examples thereof include a sheet nanoimprint apparatus to be obtained. In particular, when the fine convex pattern forming body 1 is manufactured by using the sheet nanoimprint apparatus, the fine convex pattern 12 is in-plane when the belt-shaped or rotating nanoimprint mold is separated from the transfer target (resin sheet). Since a force in the direction is applied (the fine convex pattern 12 is pulled in a direction opposite to the transfer direction of the transfer object (resin sheet)), the fine convex pattern 12 is likely to fall down. In particular, when the size of the fine convex pattern 12 is reduced and the aspect ratio is increased, the fine convex pattern is likely to fall down significantly. Therefore, it can be said that the pattern correction method according to the present embodiment is a particularly preferable method as a method of correcting the inclination of the fine convex pattern 12 in the fine convex pattern forming body 1 manufactured using the sheet nanoimprint apparatus. .

  Moreover, as the manufacturing part 31 which manufactures the fine convex pattern formation body 1 by the photolithographic method, it exposed by the exposure apparatus which exposes the photoresist film on a board | substrate via a predetermined photomask, and exposure apparatus, for example Examples thereof include a photolithography apparatus including a developing device that develops a photoresist film on a substrate with a predetermined developer.

  The detection unit 32 is not particularly limited as long as it can detect the presence or absence of the inclination of the fine convex pattern 12. For example, the detection unit 32 includes an imaging device and a control device. The pattern forming body 1 may be photographed from the upper surface or side surface thereof, and the presence or absence of the inclination of the fine convex pattern 12 may be determined by the control device based on the imaging data. The optical characteristics resulting from the formed body 1 may be measured, and the presence or absence of the inclination of the fine convex pattern 12 may be determined by a control device based on the measurement value.

  The correction unit 33 is not particularly limited in the device configuration as long as it can generate charges in the fine convex pattern forming body 1 and correct the inclination of the fine convex pattern 12, and has, for example, a plasma chamber. Examples include a plasma generator, a dry etching apparatus having a plasma generator, and an electric field generator.

  In addition, when the manufacturing unit 31 includes a sheet nanoimprint apparatus, cutting that cuts the long sheet-like fine convex pattern forming body 1 manufactured by the manufacturing unit 31 upstream of the correction unit 33 into a predetermined size. You may have a device. In this case, when the detection unit 32 determines that the fine convex pattern 12 is inclined, the inclined portion in the long sheet-like fine convex pattern formed body 1 manufactured by the manufacturing unit 31 is included. Only a predetermined size portion may be cut by the cutting device, and only the cut portion may be conveyed to the correction unit 33.

  In the fine convex pattern forming body manufacturing system 30 having the above-described configuration, the fine convex pattern forming body 1 manufactured by the manufacturing unit 31 is transported to the detection unit 32, and the detection unit 32 performs the fine convex pattern. The presence or absence of the inclination of the fine convex pattern 12 in the formed body 1 is detected. At this time, when the detection unit 32 determines that the fine convex pattern 12 is inclined, the fine convex pattern formation 1 is conveyed to the correction unit 33 and the book described above in the correction unit 33. The inclination of the fine convex pattern 12 is corrected using the pattern correction method according to the embodiment. Thereby, the fine convex pattern formation body 1 which has the plane part 11 and the fine convex pattern 12 standingly arranged in the substantially orthogonal direction with respect to the plane part 11 can be manufactured.

  Thus, according to the fine convex pattern forming body manufacturing system 30 in the present embodiment, in the fine convex pattern forming body 1 manufactured by the manufacturing unit 31, the fine convex pattern 12 is inclined unintentionally. Even if it has been done, the correction portion 33 can easily correct the inclination of the fine convex pattern 12. As a result, the fine convex pattern forming body 1 having the fine convex pattern 12 erected in a direction substantially orthogonal to the flat portion 11 can be manufactured easily and with high accuracy.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  Although the fine convex pattern formation body manufacturing system in the said embodiment has the detection part 32 which detects the inclination of the fine convex pattern 12, this invention is not limited to such an aspect. The detection unit 32 may not be provided.

  Moreover, in the detection process or detection part 32 in the manufacturing method or manufacturing system of the fine convex pattern formation body of the said embodiment, the inclination angle of the fine convex pattern 12 (side view (one direction of the fine convex pattern formation body 1) And an angle formed by the axis of the fine convex pattern 12 with respect to the orthogonal direction of the flat surface portion 11), the presence or absence of the inclination of the fine convex pattern 12 is determined. You may make it specify the fine convex pattern 12 (predetermined area | region containing the said fine convex pattern 12) more than a predetermined inclination angle.

  Furthermore, in the said embodiment, the said inclination is corrected about the fine convex pattern formation body 1 in which the correction process of the inclination of the fine convex pattern 12 was performed in the correction process in the manufacturing method of a fine convex pattern formation body. It may further include a step of confirming whether or not. In this case, it can be confirmed whether or not the inclination is corrected by the same method as in the detection step. Moreover, in the fine convex pattern formation body manufacturing system 30 in the said embodiment, the fine convex pattern formation body 1 in which the correction process was performed in the correction part 33 is conveyed to the detection part 32, and fine in the detection part 32 What is necessary is just to confirm whether the inclination of the convex pattern 12 was corrected.

  In the above-described embodiment, the fine convex pattern 12 to be corrected for inclination is formed for the purpose of projecting in the orthogonal direction of the plane part 11, and is thus projected in a direction substantially orthogonal to the plane part 11. As described above, the inclined fine convex pattern 12 is corrected. However, even in the case where the fine convex pattern in the target fine convex pattern forming body is inclined at a predetermined angle, and is inclined more than the predetermined angle, the present invention is Can be applied. In other words, the protrusion angle from the flat portion of the fine convex pattern in the fine convex pattern formation body (in the side view of the fine convex pattern formation body with the fine convex pattern positioned upward and the flat portion positioned downward) When the angle formed by the axis line with respect to the tangent of the plane part passing through the intersection of the line pattern (axis) and the plane part passing through the center of the convex pattern is inclined more than the intended angle The present invention can also be applied to correct the protrusion angle of the fine convex pattern to the originally intended angle.

  For example, when trying to manufacture the fine convex pattern forming body 1 having the fine convex pattern 12 having a protrusion angle of 70 °, the protrusion angle of the fine convex pattern 12 in the obtained fine convex pattern forming body 1 is 30. If it is, the protrusion angle can be corrected to 70 ° by controlling the amount of charge generated and generated in the fine convex pattern 12. In addition, as a method of manufacturing the fine convex pattern forming body 1 in which the fine convex pattern 12 is inclined at a predetermined angle by nanoimprinting, an imprint mold having a fine concave pattern, in which the side wall of the fine concave pattern is fine A method using an imprint mold constituted by an inclined surface inclined at an angle corresponding to the protruding angle of the convex pattern 12 can be exemplified. Moreover, as a method of manufacturing the said fine convex pattern formation body by photolithography, the method of controlling the incident angle of exposure light (UV, an electron beam, etc.) with respect to a photosensitive resist can be illustrated.

  EXAMPLES Hereinafter, although an Example etc. are given and this invention is demonstrated further in detail, this invention is not limited to the following Example etc. at all.

[Example 1]
On one surface of the quartz substrate 13, pillar-shaped fine convex patterns 12 (dimensions: 30 nm, which are arranged in a three-sided and three-sided square lattice pattern by UV nanoimprinting using an ultraviolet curable resin material) (Aspect ratio: 1.5, pitch between adjacent fine convex patterns 12: 50 nm) was formed to produce a fine convex pattern forming body 1. In addition, around the fine convex pattern 12 on the quartz substrate 13, a resin film having the same height as the fine convex pattern 12 (separated from the nearest fine convex pattern 12 by 20 nm) is formed in the fine pattern. Then, a Cr film (thickness: 10 nm) was formed on the upper surface of the fine convex pattern 12 and the upper surface of the resin film M.

  As described above, five fine convex pattern forming bodies 1 were prepared and each fine convex pattern forming body 1 was confirmed by SEM. As a result, the fine convex pattern 12 in all the fine convex pattern forming bodies 1 was obtained. Was confirmed.

  The fine convex pattern forming body 1 in which the fine convex pattern 12 collapsed was subjected to a dry etching process using ICP-RIE. In such a dry etching process, first, a plasma atmosphere is formed as an ICP output (60% of the ICP output that can achieve the target quartz etching rate) such that the ultraviolet curable resin, Cr, and quartz are not etched. Without applying high-frequency current to the electrode on which the fine convex pattern forming body 1 is placed, the fine convex pattern forming body 1 is allowed to exist in the plasma atmosphere for 10 seconds, and then the target quartz etching rate is obtained. The output of the ICP was increased.

  When the quartz substrate 13 subjected to the dry etching process as described above was observed with an SEM, it was confirmed that an upstanding pillar pattern was formed without reflecting the collapse of the fine convex pattern 12. It was done.

[Comparative Example 1]
The fine convex pattern formed body 1 manufactured by the same method as in Example 1 is subjected to dry etching treatment, except that the output is such that the target quartz etching rate is obtained through the dry etching treatment. did. Observation of the quartz substrate 13 after the dry etching treatment in this way with an SEM confirmed that the quartz substrate 13 was dry-etched in a state where the collapse of the fine convex pattern 12 was reflected. .

  As is clear from the results of Example 1 and Comparative Example 1 above, as in Example 1, the output of the ICP is lowered to such an extent that the ultraviolet curable resin, Cr film, and quartz substrate 13 are not etched in the dry etching process. Because the fine convex pattern forming body 1 (fine convex pattern 12) can be charged, and the electric repulsive force generated as a result can be corrected so that the fine convex pattern 12 stands upright. It is surmised that an upright pillar pattern could be formed on the quartz substrate 13 by increasing the output of the ICP in this state and performing a dry etching process.

  INDUSTRIAL APPLICABILITY The present invention is useful for producing a fine convex structure (fine convex pattern forming body) by a nanoimprint method or a photolithography method.

1 ... Fine convex pattern formation (fine convex structure)
11 ... plane part 12 ... fine convex pattern (fine convex structure part)
30 ... Fine convex pattern forming body manufacturing system (fine convex structure manufacturing system)
31 ... Manufacturing section (microconvex structure forming section)
33 ... correction part (inclination correction part)

Claims (9)

In a fine convex structure having a flat portion and a fine convex structure portion protruding from the flat portion, the fine convex structure portion when the fine convex structure portion is inclined with respect to a direction orthogonal to the flat portion. A method of correcting the inclination of
The fine convex structure having the inclined fine convex structure is corrected by inclining the fine convex structure by generating charges of the same polarity on the surface of the flat surface and the surface of the fine convex structure. A method for correcting a fine convex structure, characterized in that:   2. The fine convex structure according to claim 1, wherein an electric charge is generated in the fine convex structure by causing the fine convex structure to exist in an atmosphere capable of charging the fine convex structure. How to correct the body.   2. The method for correcting a fine convex structure according to claim 1, wherein the fine convex structure is caused to generate electric charges by dielectric polarization or electrostatic induction.   The inclination of the fine convex structure part in the area | region where the said electric charge was produced | generated by correcting an electric charge in the one part area | region in the said fine convex structure body is characterized by the above-mentioned. Method for correcting the fine convex structure.   The method for correcting a fine convex structure according to claim 1, wherein the fine convex structure is made of an insulating material. The fine convex structure is made of a material containing a conductive material,
The correction of the fine convex structure according to any one of claims 1 to 4, wherein at least a part of the fine convex structure is in an electrically floating state, and charges are generated in the fine convex structure. Method. A fine convex structure forming step of forming a fine convex structure having a flat portion and a fine convex structure protruding from the flat portion;
In the said fine convex structure formed by the said fine convex structure formation process, when the said fine convex structure part inclines with respect to the direction orthogonal to the said plane part, It is in any one of Claims 1-6 And a fine convex structure part inclination correcting step of correcting the inclination of the fine convex structure part using the fine convex structure correction method. An inclination detecting step of detecting whether or not the fine convex structure portion formed by the fine convex structure forming step is inclined with respect to a direction orthogonal to the plane portion;
The method of manufacturing a fine convex structure according to claim 7, wherein when the fine convex structure portion is determined to be inclined by the inclination detection step, the fine convex structure portion inclination correction step is performed. . A fine convex structure forming part for forming a fine convex structure having a flat part and a fine convex structure part protruding from the flat part;
In the fine convex structure formed by the fine convex structure forming portion, the planar portion of the fine convex structure when the fine convex structure portion is inclined with respect to a direction orthogonal to the planar portion. A fine convex structure manufacturing system comprising: an inclination correction unit that corrects an inclination of the fine convex structure part by generating electric charges having the same polarity on the surface of the fine convex structure part and the surface of the fine convex structure part.

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