JP6068913B2 - Deposition equipment - Google Patents

Description

The present invention relates to a film forming apparatus. In particular, the present invention relates to an apparatus that can continuously form a layer containing an organic compound on a substrate that can be wound.

There is known an organic EL element manufacturing apparatus including an organic light emitting layer forming step in which a vaporized material is ejected toward a substrate from a nozzle disposed at a position where the distance to the substrate is 15 mm or less. Patent Document 1).

The film forming apparatus described in Patent Document 1 includes a plurality of nozzles, and each nozzle is disposed along the outer periphery of the film forming drum so that the distance to the substrate is constant. Then, the vaporized material ejected from the nozzle is deposited on the substrate wound around the outer periphery of the deposition drum.

In addition, a film forming apparatus is described in which one nozzle and another nozzle immediately thereafter are arranged in the direction in which the substrate is wound along the outer periphery of the film forming drum. With this configuration, another nozzle can form another film on top of the film formed by one nozzle. As a result, the same number of layers as the number of nozzles can be stacked on the substrate.

JP 2008-287996 A

In order to continuously eject the vaporized material from the nozzle, the temperature of the nozzle needs to be higher than the temperature at which the material vaporizes. When the temperature of the nozzle is low, the material may deposit or adhere to the nozzle holes, and the nozzles may be clogged. In addition, although the vaporization temperature of an organic compound changes with materials, the vaporization temperature of the material used for an organic EL element is about 300 degreeC, for example.

The nozzle of the film forming apparatus described in Patent Document 1 is arranged so that the distance between the nozzle and the substrate is 15 mm or less. This causes the nozzle to provide not only material but also heat to the substrate.

If the rollable substrate does not have sufficient heat resistance, the substrate may be heated and damaged by the heat radiated from the nozzle, for example, the flatness may be impaired.

One embodiment of the present invention has been made under such a technical background. Therefore, an object is to provide a film formation apparatus that can form a film on a substrate. Another object is to provide a film formation method capable of continuously forming a film on a substrate.

In order to solve the above-described problem, according to one embodiment of the present invention, the radiant heat received by the substrate facing the portion where the nozzle is not provided is smaller than the radiant heat received by the substrate facing the portion where the nozzle is provided. Focused on. Then, the inventors have arrived at the configuration of the film forming apparatus exemplified in this specification and the film forming method using the same.

A film formation apparatus of one embodiment of the present invention includes a support member that supports a flexible substrate, and a plurality of nozzles that are provided close to the support member and spaced from each other. The plurality of nozzles is a film forming apparatus that ejects vaporized material to form a portion where the material is deposited and a portion where the material is not deposited.

That is, according to one embodiment of the present invention, a first deposition drum that circumscribes a long flexible substrate and feeds the flexible substrate in a rotation direction and a predetermined interval in the longitudinal direction of the first deposition drum are provided. Is a film forming apparatus having a nozzle arranged with the. The first evaporation source disposed opposite to the flexible substrate, and an intermediate roll that circumscribes the film formation surface of the flexible substrate and bends the flexible substrate. A concave groove is provided so that the material supplied from the nozzle does not come into contact with the region attached to the flexible substrate.

This is a film forming method for reducing the radiant heat received by the substrate, and is a film forming apparatus to which this film forming method can be applied. As a result, a film forming apparatus capable of forming a film on a substrate can be provided.

Another embodiment of the present invention is a first film formation drum that circumscribes a long flexible substrate and feeds the flexible substrate in a rotation direction, and a predetermined interval in the longitudinal direction of the first film formation drum. A first evaporation source disposed opposite to the flexible substrate, and an intermediate roll that circumscribes the film formation surface of the flexible substrate and bends the flexible substrate. A film forming apparatus having a second film forming drum that circumscribes a flexible substrate and feeds the flexible substrate in a rotation direction, and nozzles arranged at predetermined intervals in the longitudinal direction of the second film forming drum. . And a first evaporation source disposed opposite to the flexible substrate, and the intermediate roll is made of a material supplied from a nozzle disposed at a predetermined interval in the longitudinal direction of the first film-forming drum. A concave groove is provided so as not to contact the region attached to the flexible substrate.

Further, according to one embodiment of the present invention, a substrate supply device that can be wound up, a first film formation drum in contact with one surface of the substrate supplied by the supply device, and a first film formation drum are supplied. An intermediate roll in contact with the other surface of the substrate, a second film forming drum in contact with one surface of the substrate supplied by the intermediate roll, and a plurality of nozzles facing the outer periphery of the first film forming drum. A film forming apparatus including a 1A vapor deposition source and a 2A vapor deposition source including a plurality of nozzles facing the outer periphery of the second film formation drum. The plurality of nozzles of the 1A vapor deposition source are arranged at intervals so as to form a film in the stripe region on the other surface of the substrate, and the intermediate roll has a recess so as not to contact the stripe region. The plurality of nozzles of the 2A vapor deposition source are arranged at intervals so as to form a film in a striped region where the 1A vapor deposition source of the substrate does not form a film.

The film formation apparatus of one embodiment of the present invention includes a first film formation drum and a second film formation drum in which an evaporation source including a plurality of nozzles provided with cooling intervals is provided. The plurality of nozzles provided in the vapor deposition source of the second film formation drum are arranged so as to form a film in a striped region where the vapor deposition source of the first film formation drum does not vaporize. Then, an intermediate roll provided with a recess is provided between the first film formation drum and the second film formation drum so as not to come into contact with the stripe-shaped region formed on the vapor deposition source of the first film formation drum. Have.

As a result, the high temperature nozzles that radiate heat are arranged in a distributed manner, and damage to the substrate that can be wound can be reduced. Further, the intermediate roll can supply the substrate to the second film formation drum without touching the region of the substrate where the film is formed on the 1A vapor deposition source of the first film formation drum. As a result, a film forming apparatus capable of continuously forming a film on a rollable substrate can be provided.

Another embodiment of the present invention includes a second vapor deposition source that has nozzles arranged at predetermined intervals in the longitudinal direction of the first film formation drum and is opposed to the flexible substrate; A second evaporation source having a nozzle disposed at a predetermined interval in the longitudinal direction of the film formation drum and disposed opposite to the flexible substrate. The second vapor deposition source nozzle of the first film formation drum overlaps the region where the material supplied from the first vapor deposition source nozzle of the first film formation drum is attached to the flexible substrate. The second vapor deposition source nozzle of the second film formation drum is arranged so that the material supplied from the nozzle of the first vapor deposition source of the second film formation drum is applied to the flexible substrate. It is said film-forming apparatus arrange | positioned so that it may overlap and adhere | attach on the area | region which adhered.

One embodiment of the present invention includes a 1B vapor deposition source including a plurality of nozzles facing the outer periphery of the first film formation drum, and a 2B vapor deposition source including a plurality of nozzles facing the outer periphery of the second film formation drum. The film forming apparatus having the above. Then, the nozzle of the 1B vapor deposition source is arranged so as to overlap the stripe-shaped region where the 1A vapor deposition source forms a film, and the nozzle of the 2B vapor deposition source is disposed in the stripe-shaped region where the 2A vapor deposition source forms a film. It arrange | positions so that it may form into a film so that it may overlap.

The film formation apparatus of one embodiment of the present invention is arranged to form a film so as to overlap with a 1A vapor deposition source including a plurality of nozzles provided with cooling intervals and a stripe-shaped region formed by the 1A vapor deposition source. A 1B deposition source having a plurality of nozzles. Thereby, the high temperature nozzle which radiates | emits heat is disperse | distributed and a several layer can be laminated | stacked on one area | region, reducing the damage which the board | substrate which can be wound up receives.

In one embodiment of the present invention, the first step of supplying a long flexible substrate to the first film formation drum using the film formation apparatus described above, vaporizing the material, A second step of ejecting from a plurality of nozzles of the first vapor deposition source of the film formation drum to form a film on the flexible substrate, and the intermediate roll is in contact with the region where the material of the flexible substrate is formed The third step of circumventing the film formation surface of the flexible substrate, bending the flexible substrate, and transferring it to the second film formation drum, and vaporizing the material, A film forming method comprising: a fourth step of forming a film in a region where the material of the flexible substrate is not formed by ejecting from a plurality of nozzles of the first vapor deposition source of the film drum.

One embodiment of the present invention includes a first step of supplying a rollable substrate to a first film formation drum using the above-described film formation apparatus supply apparatus, and vaporizing the material to perform 1A vapor deposition. A second step of ejecting from a plurality of nozzles of the source to form a film in a striped region on the other surface of the substrate; and a step of forming the substrate so that the intermediate roll does not contact the striped region. A third step of transferring from the film drum to the second film forming drum, and a stripe where the material is vaporized and ejected from a plurality of nozzles of the 2A vapor deposition source so that the 1A vapor deposition source on the other surface of the substrate does not form a film A film forming method comprising: a fourth step of forming a film in the shape region.

In the film formation method of one embodiment of the present invention, the first film formation drum and the second film formation apparatus each include a plurality of nozzles provided with cooling intervals, and are provided with vapor deposition sources for forming the same material. A film formation drum is used.

As a result, the high temperature nozzles that radiate heat are arranged in a distributed manner, and damage to the substrate that can be wound can be reduced. Further, the intermediate roll can supply the substrate to the second film formation drum without touching the region of the substrate where the film is formed on the 1A vapor deposition source of the first film formation drum. As a result, it is possible to provide a film formation method capable of continuously forming a film on a rollable substrate.

In one embodiment of the present invention, the first step of supplying a long flexible substrate to the first film formation drum using the film formation apparatus described above, and vaporizing the first material, A plurality of nozzles of the first vapor deposition source of the first film formation drum are ejected to form a film on the flexible substrate, the second material is vaporized, and the second vapor deposition of the first film formation drum. A second step of ejecting from a plurality of nozzles of the source and overlapping the region where the first material of the flexible substrate is deposited; and an intermediate roll comprising the first material of the flexible substrate The third material is circumscribed on the film formation surface of the flexible substrate so as not to contact the region where the second material is deposited, and the flexible substrate is bent and transferred to the second film formation drum. And evaporating the third material and ejecting the third material from the plurality of nozzles of the first vapor deposition source of the second film formation drum, so that the first material and the second material of the flexible substrate are A region in which the third material is formed by forming a film in an unfilmed region, evaporating the fourth material, and ejecting from the plurality of nozzles of the second vapor deposition source of the second film forming drum And a fourth step of forming a film overlying the film.

One embodiment of the present invention includes a first step of supplying a rollable substrate to a first film formation drum using the above-described film formation apparatus supply device, and vaporizing the first material. Spout from a plurality of nozzles of the 1A vapor deposition source, form a film in a striped region on the other surface of the substrate, vaporize the second material, and eject from a plurality of nozzles of the 1B vapor deposition source to A second step of forming a film overlying the film-shaped region, and a third step of transferring the substrate from the first film-forming drum to the second film-forming drum so that the intermediate roll does not contact the stripe-shaped region. And vaporizing the third material, ejecting it from a plurality of nozzles of the 2A vapor deposition source, and depositing the film on the stripe-shaped region where the 1A vapor deposition source on the other surface of the substrate is not deposited. Was vaporized and ejected from a plurality of nozzles of the 2B deposition source to form a film of the 2A deposition source. A fourth step of depositing superimposed on stripe-shaped regions, a film formation method with.

In the film formation method of one embodiment of the present invention, the first film formation drum and the second structure are provided with a plurality of nozzles provided with cooling intervals and provided with vapor deposition sources for forming different materials. Use a membrane drum. Thereby, the high temperature nozzle which radiates | emits heat is disperse | distributed, and a several layer can be laminated | stacked, reducing the damage which the board | substrate which can be wound up receives. As a result, it is possible to provide a film formation method capable of continuously forming a film on a rollable substrate.

Note that in this specification, a light-emitting device refers to an image display device, a light-emitting device, or a light source (including a lighting device). In addition, a connector in which a connector such as an FPC (Flexible Printed Circuit) or TCP (Tape Carrier Package) is attached to the light emitting device, a module in which a printed wiring board is provided at the end of TCP, or a substrate on which a light emitting element is formed is COG It is assumed that the light emitting device also includes all modules on which IC (integrated circuit) is directly mounted by the (Chip On Glass) method.

According to one embodiment of the present invention, a film formation apparatus capable of continuously forming a film on a rollable substrate can be provided. Alternatively, a film formation method capable of continuously forming a film on a rollable substrate can be provided.

4A and 4B illustrate a film formation apparatus according to an embodiment. The figure explaining the arrangement | positioning of the vapor deposition source of the film-forming apparatus which concerns on embodiment, a nozzle, and the recessed part of an intermediate | middle roll. The figure explaining the arrangement | positioning of the vapor deposition source of the film-forming apparatus which concerns on embodiment, a nozzle, and the recessed part of an intermediate | middle roll. 4A and 4B illustrate a film formation method according to an embodiment. 4A and 4B illustrate a film formation method according to an embodiment. 4A and 4B illustrate structures of a film formation device and a light-emitting device according to an embodiment. 4A and 4B illustrate a method for manufacturing a light-emitting device according to an embodiment. 4A and 4B illustrate a film formation apparatus according to an embodiment.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated.

(Embodiment 1)
In this embodiment, the structure of the film formation apparatus of one embodiment of the present invention is described with reference to FIGS.

1A is a side view of the structure of the film formation apparatus of one embodiment of the present invention, and FIG. 1B is a bottom view of the film formation apparatus illustrated in FIG.

FIG. 2A illustrates an arrangement of nozzles of a vapor deposition source (specifically, a 1A vapor deposition source, a 2A vapor deposition source, and a 3A vapor deposition source) included in the film formation apparatus of one embodiment of the present invention, and a recess provided in the intermediate roll. FIG. 2B is a bottom view for explaining the arrangement, FIG. 2B is a bottom view for explaining the arrangement of nozzles of a plurality of vapor deposition sources facing the outer periphery of the first film formation drum, and FIG. It is a bottom view explaining arrangement | positioning of the nozzle of the some vapor deposition source facing the outer periphery of the film-forming drum.

FIG. 3 is also a diagram illustrating the arrangement of the nozzles of the vapor deposition source included in the film formation apparatus of one embodiment of the present invention and the arrangement of the concave portions provided in the intermediate roll.

The film formation apparatus 100 illustrated and described in this embodiment includes a supply apparatus 140 for a substrate 10 that can be wound, and a first film formation drum in which one surface of the substrate 10 supplied by the supply apparatus 140 is in contact with the outer periphery. 110, an intermediate roll 130 in contact with the other surface of the substrate 10 supplied by the first film formation drum 110, and a second film formation drum 120 in contact with the outer surface of one surface of the substrate 10 supplied by the intermediate roll 130 A first deposition source (also referred to as a 1A deposition source) 1A of the first deposition drum having a plurality of nozzles facing the outer circumference of the first deposition drum 110 and an outer circumference of the second deposition drum 120 And a second vapor deposition source (also referred to as a 2A vapor deposition source) 2A of a second film formation drum including a plurality of nozzles facing each other (see FIGS. 1A and 1B).

In addition, a plurality of nozzles (for example, nozzles 1A_1 to 1A_7) of the 1A vapor deposition source 1A are arranged at intervals so as to form a film in the striped region 11 on the other surface of the substrate 10. Further, the intermediate roll 130 includes a recess 131 so as not to contact the stripe-shaped region 11 (see FIG. 2A).

Further, a plurality of nozzles (for example, nozzles 2A_1 to 2A_7) of the first vapor deposition source (also referred to as 2A vapor deposition source) 2A of the second film formation drum are formed in stripes that are not formed by the 1A vapor deposition source 1A of the substrate 10. They are arranged at intervals so as to form a film in the region 12 (see FIG. 2A).

In addition, the film formation apparatus 100 illustrated and described in this embodiment includes an intermediate roll 170 in contact with the other surface of the substrate 10 supplied by the second film formation drum 120, and the substrate 10 supplied by the intermediate roll 170. A third film formation drum 160 in contact with one surface and the outer periphery, a winding device 150 for winding the substrate 10 supplied by the third film formation drum 160, and a plurality facing the outer periphery of the third film formation drum 160 And a first deposition source (also referred to as a 3A deposition source) 3A of a third film-forming drum provided with the nozzle (see FIGS. 1A and 2B).

Further, the intermediate roll 170 includes a concave portion 171 so as not to contact the stripe-shaped region 11 and the region 12 (see FIG. 2A).

In addition, a plurality of nozzles (for example, the nozzles 3A_1 to 3A_7) of the 3A vapor deposition source 3A are arranged at intervals so as to form a film in the stripe-shaped region 13 on the other surface of the substrate 10.

In the film formation apparatus 100 exemplified in this embodiment, a deposition source (for example, a 1A deposition source 1A) including a plurality of nozzles (for example, the nozzles 1A_1 to 1A_7) provided with cooling intervals is disposed. The film forming drum 110 includes a second film forming drum 120 in which a vapor deposition source (for example, 2A vapor deposition source 2A) including a plurality of nozzles (for example, nozzles 2A_1 to 2A_7) provided with cooling intervals is disposed.

The plurality of nozzles (for example, the nozzles 2A_1 to 2A_7) provided in the vapor deposition source (for example, 2A vapor deposition source 2A) of the second film formation drum 120 are in a stripe shape where the 1A vapor deposition source 1A of the first film formation drum 110 is not vapor-deposited. It arrange | positions so that it may form into a film | membrane in the area | region 12. FIG. A recess 131 is provided between the first film formation drum 110 and the second film formation drum 120 so as not to contact the stripe-shaped region 11 formed on the 1A vapor deposition source 1A of the first film formation drum 110. Is provided with an intermediate roll 130.

As a result, the high temperature nozzles that radiate heat are arranged in a distributed manner, and damage to the substrate that can be wound can be reduced. The intermediate roll can supply the substrate to the second film formation drum without touching the region of the substrate formed on the 1A deposition source of the first film formation drum. Damage to the deposited film can be avoided. As a result, a film forming apparatus capable of continuously forming a film on a rollable substrate can be provided.

Hereinafter, individual elements included in the film formation apparatus 100 of one embodiment of the present invention will be described.

<Supply device>
The supply device 140 is a device that supplies the rollable substrate 10 to the first film formation drum 110.

The substrate 10 that can be wound is preferably one that is flexible and can be continuously produced. For example, a plastic film, a metal foil, and a glass plate having a thickness of several tens to several tens of μm can be given.

In the case where the light emitting element is formed over the substrate 10, the substrate 10 is preferably a substrate having a gas barrier property in order to prevent diffusion of impurities into the light emitting element. Examples of the substrate having a gas barrier property and flexibility include a plastic film on which an inorganic film having a gas barrier property is formed in addition to the above glass plate and metal foil.

An example of a method for forming an inorganic film having gas barrier properties on a plastic film will be described. First, a dense film having a gas barrier property is formed over the peelable layer of the manufacturing substrate having heat resistance on which the peelable layer is formed. Next, the dense film having gas barrier properties is transferred onto a plastic film. Here, a dense film having gas barrier properties is peeled off from the peelable layer, and is transferred onto the plastic film using an adhesive. By using a manufacturing substrate having heat resistance in this manner, a dense film having gas barrier properties can be formed by using a process at a high temperature that a plastic film cannot withstand. By transferring the film, a dense film having gas barrier properties can be formed on the plastic film.

Further, a gas barrier property may be imparted by bonding a glass plate having a thickness of several tens to several hundreds of μm to a plastic film.

<< Film Drum >>
The film formation drum has a substantially cylindrical shape and is rotatably supported. For example, the first film formation drum 110 is supplied with the substrate 10 from the supply device 140, and one surface of the substrate 10 is in contact with the outer periphery. The first film formation drum 110 is rotated by a driving mechanism (not shown) to supply the substrate 10 to the intermediate roll 130.

The film formation drum is preferably provided with a cooling mechanism. It is possible to prevent a phenomenon in which the temperature of the outer periphery of the film formation drum gradually increases due to heat received from the vapor deposition source. As a method for cooling the film formation drum, for example, a method of circulating a refrigerant in the film formation drum can be used.

《Deposition source》
The evaporation source vaporizes the material and ejects the vaporized material from the nozzle. The vapor deposition source includes a plurality of nozzles. For example, the 1A vapor deposition source 1A includes seven nozzles (nozzles 1A_1 to 1A_7) (see FIG. 3A). Similarly, the 2A vapor deposition source 2A and the 3A vapor deposition source 3A include a plurality of nozzles (see FIGS. 3C and 3E).

The nozzles (nozzles 1A_1 to 1A_7) of the 1A vapor deposition source 1A are provided to face the outer periphery of the film formation drum 110 with which one surface of the substrate 10 is in contact (see FIG. 2B). The nozzle ejects the vaporized material 11 </ b> A toward the outer periphery of the film formation drum 110, and a film containing the material is formed on the other surface of the substrate 10.

A space is provided between one nozzle of the vapor deposition source and the adjacent nozzle, and radiant heat received by the film formation drum and the substrate facing the space is suppressed. In the 1A vapor deposition source 1A illustrated in FIG. 3A, a gap 1A_8 is provided between the nozzle 1A_6 and the nozzle 1A_7, and the 1A vapor deposition source 1A is separated from the film formation drum at a gap 1A_8.

For example, when a film containing a material having a vaporization temperature of about 300 ° C. is formed on the plastic substrate 10, the nozzle temperature becomes higher. If the heated nozzles are arranged without a gap, the flatness of the substrate 10 is impaired by the heat radiated from the nozzles.

However, if an interval is provided between adjacent nozzles, a part of the vapor deposition source can be moved away from the film-forming drum, the heat radiated from the nozzles is dispersed, and damage to the substrate 10 can be prevented.

Note that the 1A vapor deposition source 1A having a gap between the nozzles forms a film in the stripe-shaped region 11 (see FIG. 2A).

<< Nozzle arrangement 1 >>
The nozzle of the vapor deposition source of one film formation drum is disposed so as to form a stripe-shaped region in which the vapor deposition source facing the other film formation drum does not form a film (see FIG. 2A).

For example, the nozzles (nozzles 2A_1 to 2A_7) of the 2A vapor deposition source 2A of the second film formation drum 120 are not formed by the nozzles (nozzles 1A_1 to 1A_7) of the 1A vapor deposition source 1A of the first film formation drum 110. The films are arranged at intervals so as to form a film in a striped region (for example, the region 12).

<< Nozzle arrangement 2 >>
In addition, the nozzle of the vapor deposition source of one film formation drum is disposed so as to overlap with a stripe-shaped region where another vapor deposition source of the same film formation drum forms a film.

For example, the nozzles (nozzles 1B_1 to 1B_7) of the 1B vapor deposition source 1B of the first film formation drum 110 are formed by the nozzles (nozzles 1A_1 to 1A_7) of the 1A vapor deposition source 1A of the first film formation drum 110. They are arranged at an interval so as to be deposited over a stripe-shaped region (for example, the region 11) (see FIG. 2B).

Similarly, the nozzles (nozzles 2B_1 to 2B_7) of the 2B deposition source 2B of the second deposition drum 120 are deposited by the nozzles (nozzles 2A_1 to 2A_7) of the 2A deposition source 2A of the second deposition drum 120. The film is disposed so as to be overlapped with a stripe-shaped region (for example, the region 12) to be formed (see FIG. 2C).

《Intermediate roll》
The intermediate roll has a concave portion so that the film forming drum does not touch the stripe-shaped region formed on the film forming drum on the outer periphery of the substantially cylindrical shape, and is supported rotatably (FIG. 3B). 3 (D)).

For example, the intermediate roll 130 includes a recess 131 so as not to contact the stripe-shaped region 11, and the intermediate roll 170 includes a recess 171 so as not to contact the stripe-shaped region 11 and the region 12 (FIG. 2A). reference).

The intermediate roll 130 is supplied with the substrate 10 from the first film formation drum 110, and the other surface of the substrate 10 is in contact with the outer periphery. The intermediate roll 130 is rotated by a driving mechanism (not shown) to supply the substrate 10 to the second film formation drum 120 (see FIG. 1A).

The intermediate roll 170 is supplied with the substrate 10 from the second film formation drum 120, and the other surface of the substrate 10 is in contact with the outer periphery. The intermediate roll 170 is rotated by a driving mechanism (not shown) to supply the substrate 10 to the third film formation drum 160 (see FIG. 1A).

<Modification 1>
In addition to the above-described configuration, the film formation apparatus 100 illustrated and described in this embodiment includes a first component including a plurality of nozzles (nozzles 1B_1 to 1B_7) facing the outer periphery of the first film formation drum 110. A second deposition source including a second deposition source (also referred to as a 1B deposition source) 1B of the film drum and a plurality of nozzles (nozzles 2B_1 to 2B_7) facing the outer periphery of the second deposition drum 120. 2B of vapor deposition sources (also called 2B vapor deposition source).

The plurality of nozzles of the 1B vapor deposition source 1B are arranged so as to overlap the stripe-shaped region 11 formed by the 1A vapor deposition source 1A, and the plurality of nozzles of the 2B vapor deposition source 2B are arranged to be the 2A vapor deposition source. The film is disposed so as to overlap the stripe-shaped region 12 formed by 2A (see FIGS. 2B and 2C).

In addition, the first deposition drum 110 includes a third deposition source (also referred to as a 1C deposition source) 1C including a plurality of nozzles facing the outer periphery of the first deposition drum 110.

In addition, the second deposition drum 120 includes a third deposition source (also referred to as a 2C deposition source) 2C having a plurality of nozzles facing the outer periphery of the second deposition drum 120.

In addition, a third deposition source (also referred to as a 3C deposition source) 3C of a third deposition drum provided with a plurality of nozzles facing the outer periphery of the third deposition drum 160, and a fourth deposition drum 3rd. 1D (also referred to as 3D evaporation source) 3D and a fifth evaporation source (also referred to as 3E evaporation source) 3E of the third film-forming drum (see FIGS. 1A and 1B) ).

A film formation apparatus 100 exemplified in this embodiment forms a film overlying a 1A vapor deposition source 1A including a plurality of nozzles provided with cooling intervals and a stripe-shaped region 11 formed by the 1A vapor deposition source. It has 1B vapor deposition source 1B provided with a plurality of nozzles arranged to do. Thereby, the high temperature nozzle which radiates | emits heat is disperse | distributed, and a several layer can be laminated | stacked, reducing the damage which the board | substrate which can be wound up receives.

<Modification 2>
In addition, a configuration of a film forming apparatus according to a modification of the present embodiment will be described with reference to FIG.

FIG. 8 is a schematic diagram illustrating a structure of a film formation apparatus of one embodiment of the present invention.

The film formation apparatus of one embodiment of the present invention is a single wafer type. A support member 210 that supports the flexible substrate 10, a transport mechanism (not shown) that transports the support member 210 in the direction of the arrow, and a plurality of nozzles that are provided close to the support member 210 and spaced apart from each other. An evaporation source A provided. The plurality of nozzles eject the vaporized material, and a portion 211 where the material is deposited and a portion where the material is not deposited are formed.

The intermediate roll 230 has a recess so as not to contact the portion 211 where the material is deposited, and guides the conveyance of the substrate 10.

This is a film forming method for reducing the radiant heat received by the flexible substrate, and is a film forming apparatus to which this film forming method can be applied. As a result, a film forming apparatus capable of forming a film on a substrate can be provided.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 2)
In this embodiment, a film formation method using the film formation apparatus of one embodiment of the present invention is described with reference to FIGS. FIG. 4 illustrates a film formation method of one embodiment of the present invention. FIG. 4 is a view of the film forming drum or the intermediate roll as viewed from the winding device side.

The film formation method exemplified in this embodiment is a film formation method using the film formation apparatus 100 exemplified in Embodiment 1.

In the first step, the substrate 10 that can be wound is supplied to the first film formation drum 110 using the supply device 140 (not shown).

In the second step, the material 11A is vaporized and ejected from a plurality of nozzles (nozzles 1A_1 to 1A_7) of the 1A vapor deposition source 1A to form a film in the stripe-shaped region 11 on the other surface of the substrate 10 ( (See FIG. 4A).

In the third step, the substrate 10 is transferred from the first film formation drum 110 to the second film formation drum 120 so that the intermediate roll 130 does not contact the stripe-shaped region 12 (see FIG. 4B). ).

In the fourth step, the material 11A is vaporized and ejected from a plurality of nozzles (nozzles 2A_1 to 2A_7) of the 2A vapor deposition source 2A so that the 1A vapor deposition source 1A on the other surface of the substrate 10 is not formed into a film. A film is formed in the region 12 (see FIG. 4C).

The film formation method exemplified in this embodiment includes a first film formation drum and a second film formation apparatus including a plurality of nozzles with cooling intervals and an evaporation source for forming the same material. A film formation drum is used. As a result, the high temperature nozzles that radiate heat are arranged in a distributed manner, and damage to the substrate that can be wound can be reduced. Further, the intermediate roll can supply the substrate to the second film formation drum without touching the region of the substrate where the film is formed on the 1A vapor deposition source of the first film formation drum. As a result, it is possible to provide a film formation method capable of continuously forming a film on a rollable substrate.

<Modification>
A film formation method of one embodiment of the present invention illustrated as a modification of this embodiment is described with reference to FIGS. FIG. 5 illustrates a film formation method of one embodiment of the present invention. FIG. 5 is a view of the film formation drum or the intermediate roll as viewed from the winding device side.

The film formation method exemplified in the modification example of this embodiment is a film formation method using the film formation apparatus 100 exemplified in Embodiment 1.

In the first step, the substrate 10 that can be wound is supplied to the first film formation drum 110 using the supply device 140 (not shown).

In the second step, the first material 11A is vaporized and ejected from a plurality of nozzles (nozzles 1A_1 to 1A_7) of the 1A vapor deposition source 1A, and one surface is in contact with the first film formation drum 110 10 is formed in a stripe-shaped region 11 on the other surface (see FIG. 5A), and then the second material 11B is vaporized, and a plurality of nozzles (nozzles 1B_1 to 1B_7) of the 1B vapor deposition source 1B are obtained. ) And is deposited on the stripe-shaped region 11 (see FIG. 5B).

In the third step, the substrate 10 is supplied from the first film formation drum 110 to the second film formation drum 120 so that the intermediate roll 130 does not contact the stripe-shaped region 11 (see FIG. 5C). ).

In the fourth step, the first material 11A is vaporized and ejected from a plurality of nozzles (nozzles 2A_1 to 2A_7) of the 2A vapor deposition source 2A, and one surface is in contact with the second film formation drum 120 10 is deposited on the stripe-shaped region 12 where the 1A deposition source 1A is not deposited, and the second material 11B is subsequently vaporized, and a plurality of nozzles (nozzles 2B_1 through nozzles) of the 2B deposition source 2B are formed. 2B_7) and is deposited on the stripe-shaped region 12 formed by the 2A vapor deposition source 2A.

The film formation method exemplified in the modification of this embodiment includes a first film formation drum and a first film formation apparatus including a plurality of nozzles provided with cooling intervals and an evaporation source for forming different materials. 2 film forming drum is used. Thereby, the high temperature nozzle which radiates | emits heat is disperse | distributed, and a several layer can be laminated | stacked, reducing the damage which the board | substrate which can be wound up receives. As a result, it is possible to provide a film formation method capable of continuously forming a film on a rollable substrate.

In the film formation method exemplified in the modification of this embodiment, the first material 11A and the second material 11B are stacked one by one. As a further modification of this method, there is a method in which a vapor deposition source for ejecting the first material 11A and a vapor deposition source for ejecting the second material 11B are repeatedly arranged in order to form a laminate on the substrate 10. . According to this method, the first material 11A and the second material 11B can be repeatedly stacked, and a superlattice structure can be formed.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 3)
In this embodiment, a structure of a film formation apparatus of one embodiment of the present invention, a light-emitting device that can be manufactured using the film formation apparatus, and a manufacturing method thereof will be described with reference to FIGS.

FIG. 6A is a side view illustrating the structure of the film formation apparatus 100B of one embodiment of the present invention. FIG. 6B is a top view illustrating a structure of the light-emitting device 30 that can be manufactured using the film formation apparatus 100B of one embodiment of the present invention. FIG. 6C is a diagram for describing a cross-sectional structure of the light-emitting device 30 along the chain line XY in FIG.

FIG. 7 is a diagram for explaining a method for manufacturing the light-emitting device 30.

<Configuration of film forming apparatus 100B>
The film formation apparatus 100B described as an example in this embodiment includes the number of evaporation sources facing the third film formation drum 160 of the film formation apparatus 100 described in Embodiment 1 and the third film formation drum 160. And the winding device 150 are different.

Three vapor deposition sources are provided to face the outer periphery of the third film formation drum 160. Specifically, the 3A deposition source 3A, the third deposition source (also referred to as 3B deposition source) 3B of the third deposition drum, and the third deposition source (also referred to as 3C deposition source) of the third deposition drum. 3C is provided. The film forming apparatus 100 </ b> B includes a sealing material supply device 180 that supplies the sealing material 20.

The film forming apparatus 100 </ b> B includes a bonding roll 190 between the third film forming drum 160 and the winding device 150. The laminating roll 190 includes two opposing rolls.

The laminating roll 190 includes two opposing rolls. The bonding roll 190 sandwiches the rollable substrate 10 supplied by the third film formation drum 160 of the film formation apparatus 100B and the sealing material 20 supplied by the sealing material supply apparatus 180 between the two rolls. to paste together.

The fourth evaporation source 4 is formed on the other surface of the substrate 10 that can be wound. Note that the fourth vapor deposition source 4 is disposed at a position farther from the substrate 10 that can be wound than other vapor deposition sources (specifically, 1A vapor deposition source 1A, etc.). Therefore, the substrate 10 that can be wound is hardly heated by the heat radiated from the vapor deposition source 4. Further, the deposition source 4 can form a film in a wider range at a time than other deposition sources.

<Configuration of Light Emitting Device 30>
The light-emitting device 30 includes a rollable substrate 10 and a sealing material 20, and includes a stripe-shaped light-emitting element between them (see FIGS. 6B and 6C).

Wiring 15B, wiring 15G, wiring 15R, and terminal 16 are provided in advance on the substrate 10 that can be wound. The wiring 15B, the wiring 15G, and the wiring 15R also serve as terminals of the lower electrode of the light emitting element, and the terminal 16 is electrically connected to the upper electrode of the light emitting element.

An insulating planarizing film 17 is provided on the wiring 15B, the wiring 15G, and the wiring 15R, and the unevenness caused by the wiring is flattened.

Striped lower electrodes (specifically, lower electrode 311B, lower electrode 312G, and lower electrode 313R) are provided on planarizing film 17. Insulating partition walls 18 are provided between adjacent stripe-like lower electrodes to electrically insulate each other. The partition wall 18 covers the end of the lower electrode.

The lower electrode is electrically connected to the wiring through the opening provided in the planarizing film 17. For example, the lower electrode 311B is electrically connected to the wiring 15B through the opening 14B.

The upper electrode 320 is provided on the lower electrode, and the upper electrode 320 and the lower electrode sandwich the light emitting layer. One of the upper electrode and the lower electrode functions as an anode, and the other functions as a cathode. In addition, at least one of the upper electrode and the lower electrode has a light-transmitting property, and among the rewoundable substrate 10 or the sealing material 20, the one close to the light-transmitting electrode has a light-transmitting property.

The light emitting layer contains a light emitting organic compound. The light emitting layer 315B, the light emitting layer 315G, and the light emitting layer 315R are each formed in a stripe shape along the lower electrode.

The hole transport layer is provided in contact with the electrode functioning as the anode of the light emitting layer, and the electron transport layer is provided in contact with the electrode functioning as the cathode.

For example, when the lower electrode 311B is an anode and the upper electrode 320 is a cathode, the hole transport layer 314 is in contact with the striped lower electrode 311B, the electron transport layer 316 and the hole transport layer 314 are in contact with the upper electrode 320. A stripe-shaped light emitting layer 315 </ b> B is provided between the electron transport layers 316. As a result, a striped light emitting element is formed.

The light emitting layer 315B, the light emitting layer 315G, and the light emitting layer 315R are all formed in stripes along the lower electrode. When a current is passed between a wiring (wiring 15B, wiring 15G, or wiring 15R) electrically connected to any one of the lower electrodes and a terminal electrically connected to the upper electrode, the light emitting element emits light in a stripe shape. To do.

In addition, when light-emitting organic compounds having different emission colors are applied to the light-emitting layers having different structures, light-emitting devices having different emission colors in stripes can be provided.

<Method for Manufacturing Light-Emitting Device 30>
A method for manufacturing the light-emitting device 30 will be described with reference to a schematic view shown in FIG.

A rollable substrate 10 on which a lower electrode (lower electrode 311B, lower electrode 312G, lower electrode 313R) is formed in advance is prepared.

In the first step, the hole transport layer 314 is formed on the lower electrode 311B, the light-emitting layer 315B is formed on the hole transport layer 314, and the electron transport layer 316 is formed on the light-emitting layer 315B. A source is used (see FIG. 7A).

In the second step, a hole transport layer 314 is formed on the lower electrode 312G, a light emitting layer 315G is formed on the hole transport layer 314, an electron transport layer 316 is formed on the light emitting layer 315G, and vapor deposition facing the second film formation drum 120 is performed. A source is used (see FIG. 7B).

In the third step, a hole transport layer 314 is formed on the lower electrode 313R, a light emitting layer 315R is formed on the hole transport layer 314, an electron transport layer 316 is formed on the light emitting layer 315R, and vapor deposition facing the third film formation drum 160 is performed. A source is used (see FIG. 7C).

In the fourth step, the upper electrode 320 is formed over the electron transport layer 316 using the fourth evaporation source 4 to form a light-emitting element (see FIG. 7D).

In the fifth step, the sealing material 20 is attached to the rollable substrate 10, and the light emitting element is sealed therebetween, whereby the light emitting device 30 is manufactured (see FIG. 7E).

The film formation method exemplified in the modification of this embodiment includes a first film formation drum and a first film formation apparatus including a plurality of nozzles provided with cooling intervals and an evaporation source for forming different materials. 2 film forming drum is used. Thereby, the high temperature nozzle which radiates | emits heat is disperse | distributed, and a several layer can be laminated | stacked, reducing the damage which the board | substrate which can be wound up receives. As a result, it is possible to provide a film formation method capable of continuously forming a film on a rollable substrate.

Further, since the light-emitting layer of the stripe-shaped light-emitting element is manufactured in different steps in the method exemplified in this embodiment, the light emission colors of adjacent stripes can be different.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

1A 1A evaporation source 1A_1 nozzle 1A_6 nozzle 1A_7 nozzle 1A_8 interval 1B 1B evaporation source 1B_1 nozzle 1B_7 nozzle 1C 1C evaporation source 2 arrangement 2A 2A evaporation source 2A_1 nozzle 2A_7 nozzle 2B 2B evaporation source 2B_1 source 2C_3 nozzle 2C_ 3A_1 Nozzle 3A_7 Nozzle 3B 3B Evaporation Source 3C 3C Evaporation Source 3D 3D Evaporation Source 3E 3E Evaporation Source 4 Fourth Deposition Source 10 Substrate 11 Area 11A Material 11B Material 12 Area 13 Area 14B Opening 15B Wiring 15G Wiring 15R Wiring 16 Terminal 17 Flat Chemical film 18 Partition 20 Sealing material 30 Light emitting device 100 Film forming device 100B Film forming device 110 Film forming drum 120 Film forming drum 130 Intermediate roll 131 Recess 140 Feed device 150 Device 160 Film forming drum 170 Intermediate roll 171 Portion 180 Sealing material supply device 190 Roll 210 Support member 211 Material depositing portion 230 Intermediate roll 311B Lower electrode 312G Lower electrode 313R Lower electrode 314 Hole transport layer 315B Light emitting layer 315G Light emitting layer 315R Light emitting layer 316 Electron transport layer 320 Upper part electrode

Claims (2)

A first film-forming drum circumscribing a long flexible substrate and feeding the flexible substrate in a rotational direction;
A first vapor deposition source having a nozzle disposed at a predetermined interval in the longitudinal direction of the first film-forming drum and disposed opposite to the flexible substrate;
An intermediate roll that circumscribes the film formation surface of the flexible substrate and bends the flexible substrate;
A second film formation drum that circumscribes the flexible substrate and sends the flexible substrate in a rotation direction;
A second vapor deposition source that has a nozzle disposed at a predetermined interval in the longitudinal direction of the second film-forming drum and is disposed to face the flexible substrate;
The intermediate roll has a concave groove so that the first material supplied from a nozzle arranged at a predetermined interval in the longitudinal direction of the first film-forming drum does not come into contact with the region where the first material is attached to the flexible substrate. Is provided ,
The nozzle of the second vapor deposition source is arranged so that the first material supplied from the nozzle of the first vapor deposition source does not overlap an area deposited on the flexible substrate. A film forming apparatus. In claim 1 ,
A third vapor deposition source having a nozzle disposed at a predetermined interval in the longitudinal direction of the first film-forming drum and disposed opposite to the flexible substrate;
A fourth vapor deposition source that has a nozzle disposed at a predetermined interval in the longitudinal direction of the second film-forming drum and is disposed to face the flexible substrate;
The nozzle of the third vapor deposition source is disposed so as to be deposited on the region where the first material supplied from the nozzle of the first vapor deposition source is deposited on the flexible substrate,
The nozzle of the fourth vapor deposition source is disposed so that the second material supplied from the nozzle of the second vapor deposition source is deposited so as to overlap the region where the second material is deposited on the flexible substrate. A characteristic film forming apparatus.

Images