JP6067988B2 - Light emitting diode mounting board - Google Patents

Description

  The present invention relates to a substrate for mounting a light emitting diode.

  In an LED package using a light emitting diode (LED) as a light source, the forward voltage due to the LED is substantially fixed. For example, when a white LED or a blue LED is used as a light source, an InGaN-based LED often used for these LEDs has a forward voltage of one element of about 3 [V].

  In the LED package, when a forward voltage is 3 [V] and a light emitting diode of 100 [Lm / W] is used, if only one element of the light emitting diode is used, the forward voltage of the LED package is about 3 [V]. (Hereinafter referred to as “first package”). At this time, a light flux of 100 [Lm] can be obtained by applying a current of about 0.33 [A] to the first package.

  Further, when two light emitting diodes are connected in series in the LED package, the forward voltage of the LED package is about 6 [V] (hereinafter referred to as “second package”). At this time, a light flux of 100 [Lm] can be obtained by applying a current of about 0.17 [A] to the LED package.

  As described above, the forward voltage of the LED package is determined depending on the number of light emitting diodes arranged in series in the LED package.

  On the other hand, in a device using an LED package, the voltage of the power source of the LED package is substantially fixed depending on the use of the device. For example, the voltage of the power supply is 5 [V] for a mobile phone and 12 [V] or 24 [V] for a car.

  When an LED package with a forward voltage of 3 [V] is used in a device with a power supply voltage of 12 [V], the remaining 9 [V] must be consumed by another load, but the forward voltage is 6 [V ] Or 9 [V] LED package, the voltage consumed by other loads is reduced to 6 [V] or 3 [V].

  For example, when the first package is used in a device with a power supply voltage of 12 [V], the light emitting diode consumes about 1 [W] (0.33 [A] x 3 [V]), Since the load consumes approximately 3 [W] (0.33 [A] × 9 [V]), the power consumption of the first package is approximately 4 [W].

  In addition, when the second package is used with this power supply voltage device, the power consumption of about 1 [W] (0.17 [A] x 3 [V] x 2) is consumed by two light emitting diodes. Since the load consumes approximately 1 [W] (0.17 [A] × 6 [V]), the power consumption of the second package is approximately 2 [W].

  Thus, when obtaining a predetermined light flux, it is possible to reduce power consumption by using an LED package having a plurality of light emitting diodes, rather than using an LED package having only one light emitting diode.

  However, when a device with a power supply voltage of 5 [V] (for example, a mobile phone) is used, the second package with a forward voltage of 6 [V] cannot be used. For this reason, it is necessary to use the first package. Thus, it is necessary to use an LED package with an appropriate forward voltage according to the power supply voltage of the device.

  In view of such circumstances, a mounting substrate that can be set to a plurality of forward voltages with one LED package is known (Patent Document 1). The mounting board is configured to be cut at a plurality of predetermined positions. By cutting at any one of these predetermined positions, when a plurality of light emitting diodes are mounted, the connection of the plurality of light emitting diodes, that is, the circuit configuration is changed.

  For example, by cutting at a first predetermined position, a plurality of light emitting diodes are connected in series, by cutting at a second predetermined position, a plurality of light emitting diodes are connected in parallel, and by cutting at a third predetermined position, The plurality of light emitting diodes are electrically independent from each other.

JP 2010-225757 A

  However, in the mounting substrate as disclosed in Patent Document 1, when changing the circuit configuration of a plurality of light emitting diodes, it is necessary to change the cutting position. That is, the size of the mounting board changes in a mounting board having a different circuit configuration.

  For this reason, the user of such a mounting board needs to design considering the size for each circuit configuration. This increases the manufacturing cost.

  An object of the present invention is to provide a light-emitting diode mounting substrate that can change the circuit configuration of the light-emitting diode without changing the size of the substrate.

[1] The present invention is a substrate for mounting one large light emitting diode or two small light emitting diodes, on which the first small light emitting diode and the second small light emitting diode as the two small light emitting diodes are mounted. One of a first circuit configuration in which the first small light emitting diode and the second small light emitting diode are connected in series, and a second circuit configuration including only the one large light emitting diode. One circuit configuration is feasible, and the substrate has an upper layer and a lower layer that are arranged one above the other, an anode arranged on a lower surface of the lower layer, and the lower layer A cathode disposed on the lower surface of the upper layer, an intermediate electrode disposed on the lower surface of the upper layer and not electrically connected to the anode and the cathode, and a via for the first electrode disposed on the upper surface of the upper layer. Through A first electrode electrically connected to the anode of the light emitting diode via a wire when the first small light emitting diode is mounted, and an upper surface of the upper layer. Disposed and electrically connected to the intermediate electrode via the second electrode via, and electrically connected to the anode of the light emitting diode via a wire when the second small light emitting diode is mounted. The second electrode is disposed on the upper surface of the upper layer and is electrically connected to the anode via a third electrode via. When the large light emitting diode is mounted, the light emitting diode is connected to the anode via a wire. A third electrode electrically connected to the anode, disposed on the upper surface of the upper layer, electrically connected to the intermediate electrode through a fourth electrode via, and When a small light emitting diode is mounted, a fourth electrode electrically connected to the cathode of the light emitting diode is disposed on the upper surface of the upper layer, and is electrically connected to the cathode through a fifth electrode via. together is, when the second small light-emitting diodes or the large light-emitting diode is mounted is characterized in that it comprises a fifth electrode which is a cathode electrically connected to the light-emitting diode by bonding (first invention) .

According to the first invention, when the first circuit configuration is realized, the current flow of the circuit is “anode → first electrode → one light-emitting diode → fourth electrode → intermediate electrode → second electrode → the other. Light emitting diode → 5th electrode → cathode ”. Thus, the first circuit configuration is a circuit configuration in which two light emitting diodes are connected in series.

  When realizing the second circuit configuration, the current flow of the circuit is “anode → third electrode → one light emitting diode → fifth electrode → cathode”. Thus, the second circuit configuration is a circuit configuration in which only one light emitting diode is connected.

  As described above, without changing the size of the mounting substrate, the anode or cathode of the light-emitting diode to be mounted is “electrically connected to the first electrode, the second electrode, or the fourth electrode” or “ The circuit configuration can be changed to either the first circuit configuration or the second circuit configuration simply by selecting “whether it is electrically connected to the third electrode or the fifth electrode”.

[2] In the first invention, the upper surface of said upper layer, the junction area of the large light-emitting diode is set so as to overlap both partially region of the area of the fourth electrode and the fifth electrode, the in the upper surface of the upper layer, the edge region of the fourth electrode has a portion along the part of the edge of the junction region before Symbol first small light emitting diodes, along part of the edge of the junction area of the large light-emitting diode and a portion on the upper surface of said upper layer, said edge region of the fifth electrode, and the portion along the part of the edge of the junction region before Symbol second small light emitting diodes, the junction area of the large light-emitting diode It is preferable to have a portion along a part of the edge ( second invention).

According to the second invention, when the two light emitting diodes are soldered, one light emitting diode is positioned according to the shape of the fourth electrode and the other light emitting according to the shape of the fifth electrode by the self-alignment effect. The diode is positioned. Further, when soldering one light emitting diode, a portion overlapping with the fourth electrode of one light emitting diode is positioned according to the shape of the fourth electrode due to the self-alignment effect, and 1 according to the shape of the fifth electrode. A portion overlapping the fifth electrode of the two light emitting diodes is positioned.

  Thereby, since the position of the light emitting diode is determined by the predetermined shape of the electrode, it is possible to suppress variations in the light distribution characteristics and the like of the light emitting diode.

[3] The present invention is a substrate for mounting the two large light-emitting diode or four small light emitting diodes, the four first small light emitting diode as a small light-emitting diode, the second small-sized light emitting diode, the third A small light emitting diode and a fourth small light emitting diode are mounted , and the first small light emitting diode and the second small light emitting diode are connected in parallel, and the third small light emitting diode and the fourth small light emitting diode are connected. any of the parallel connection and the first circuit configuration of which is connected in series, a second circuit configuration in which the two first large light emitting diode and a second large light emitting diode as a large light-emitting diode is connected in series with one of the circuit structure is feasible, the substrate has an upper layer and a lower layer disposed stacked vertically, the lower layer An anode disposed on the surface, a cathode disposed on the lower surface of the lower layer is disposed on the lower surface of the upper layer, and the intermediate electrode which is not electrically connected to the anode and the cathode, the upper disposed on the upper surface of the layer is electrically connected with the anode through the first electrode via, the emission through the wire when the said first small light emitting diode second small light-emitting diodes are mounted a first electrode anode electrically connected to the diode, is arranged on an upper surface of said upper layer, which is connected the the intermediate electrode electrically via the second electrode via the third small light-emitting diodes wherein a second electrode connected anode and electrically in the light-emitting diode through a wire when the fourth small light emitting diodes are mounted, is arranged on an upper surface of said upper layer, via a third electrode via the Is connected to the anode and the electrical Te, a third electrode connected anode and electrically in the light-emitting diode via the wires when the first large-emitting diode is mounted on the upper surface of said upper layer Disposed and electrically connected to the intermediate electrode via a fourth electrode via and electrically connected to the anode of the light emitting diode via a wire when the second large light emitting diode is mounted. a fourth electrode disposed on the upper surface of the upper layer, which is connected the the intermediate electrode electrically via the fifth electrode via the first small light emitting diode and the second small light-emitting diode or the first 1 When a large light emitting diode is mounted, a fifth electrode electrically connected to the cathode of the light emitting diode is disposed on the upper surface of the upper layer, and a sixth electrode via is provided. Is a cathode electrically connected to the light-emitting diode when said cathode and is electrically connected, the third small light-emitting diode and the fourth small light emitting diode or the second large light emitting diodes are mounted via A sixth electrode is provided ( third invention).

According to the third invention, when the first circuit configuration is realized, the current flow of the circuit is “anode → first electrode → first light emitting diode and second light emitting diode → fifth electrode → intermediate electrode → second 2 electrodes → third light emitting diode and fourth light emitting diode → sixth electrode → cathode ”. Thus, the first circuit configuration is a circuit configuration in which two parallel-connected circuits are connected in series with a circuit in which two light-emitting diodes are connected in parallel as one unit.

  When realizing the second circuit configuration, the current flow of the circuit is “anode → third electrode → one light emitting diode → fifth electrode → intermediate electrode → fourth electrode → the other light emitting diode → the sixth electrode → "Cathode". Thus, the second circuit configuration is a circuit configuration in which two light emitting diodes are connected in series.

  As described above, without changing the size of the mounting substrate, the anode or cathode of the light-emitting diode to be mounted is “electrically connected to the first electrode, the second electrode, or the fifth electrode” or “ The circuit configuration can be changed to either the first circuit configuration or the second circuit configuration simply by selecting “whether it is electrically connected to the third electrode, the fourth electrode, or the sixth electrode”.

[ 4 ] In the third invention, on the upper surface of the upper layer, an edge of the region of the fifth electrode is a portion along an edge of a part of a junction region of the first small light emitting diode , and the second small light emitting diode. And a portion along the edge of a part of the junction region of the first large-sized light emitting diode , and the edge of the region of the sixth electrode is the third small light emission. a portion along part of the edge of the junction area of the diode, and a portion along part of the edge of the bonding region of the fourth small light emitting diodes, a portion along part of the edge of the junction area of the second large light emitting diode preferably it has bets (fourth invention).

According to the fourth invention, when the four light emitting diodes are soldered, the first light emitting diode is positioned according to the shape of one end of the fifth electrode by the self-alignment effect, and the other end of the fifth electrode is arranged. The second light emitting diode is positioned according to the shape of the sixth electrode, the third light emitting diode is positioned according to the shape of one end of the sixth electrode, and the fourth light emitting diode is aligned with the shape of the other end of the sixth electrode. Positioned. Also, when soldering the two light emitting diodes, one light emitting diode is positioned according to the shape of the fifth electrode and the other light emitting diode is positioned according to the shape of the sixth electrode due to the self-alignment effect. .

  Thereby, since the position of the light emitting diode is determined by the predetermined shape of the electrode, it is possible to suppress variations in the light distribution characteristics and the like of the light emitting diode.

[5] The present invention is a substrate for mounting a single large light-emitting diodes or three small light emitting diodes, the three small light emitting diodes as the first small-sized light emitting diode, the second small-sized light emitting diode and a third small is achieved by the light emitting diode is mounted, the first small light emitting diodes, a first circuit configuration of the second small light emitting diode and the third small light-emitting diodes are connected in series, only the one large light-emitting diode any one of the circuit configuration of the second circuit arrangement consisting of is feasible, the substrate has an upper layer and a lower layer disposed stacked vertically, the lower surface of the lower layer an anode disposed on the cathode are disposed on the lower surface of the lower layer is disposed on the lower surface of said upper layer, said anode and said cathode and during the first which is not electrically connected And electrodes disposed on the lower surface of the upper layer, the second intermediate electrode which is not electrically connected to the anode and the cathode, is arranged on an upper surface of said upper layer, via said first electrode via It is connected to the anode and electrically, a first electrode anode electrically connected to the light-emitting diode when said first small light emitting diodes are mounted, is arranged on an upper surface of the upper layer, the second electrode together through the use vias are connected to the first intermediate electrode and electrically, a second electrode which is an anode electrically connected to the light-emitting diode when said second small-sized light emitting diodes are mounted, said upper layer disposed in the upper surface, the anode and the collector of the light-emitting diode when the while being electrically connected to the second intermediate electrode through the third electrode via the third small light-emitting diodes are mounted A third electrode is connected, is disposed on an upper surface of said upper layer, together with the anodically electrically connected via the fourth electrode via, the light-emitting diode when the large light-emitting diode is mounted a fourth electrode that is the anode and electrically connected, is arranged on an upper surface of said upper layer, while being electrically connected to the first intermediate electrode through the fifth electrode via the first small light emitting When the diode is mounted, the fifth electrode is electrically connected to the cathode of the light emitting diode, and is disposed on the upper surface of the upper layer, and is electrically connected to the second intermediate electrode via the sixth electrode via. In addition, when the second small light emitting diode is mounted, the sixth electrode is electrically connected to the cathode of the light emitting diode, and is disposed on the upper surface of the upper layer. And a seventh electrode that is electrically connected to the cathode and electrically connected to the cathode of the light emitting diode when the third small light emitting diode or the large light emitting diode is mounted. ( 5th invention).

According to the fifth aspect of the invention, when the first circuit configuration is realized, the current flow of the circuit is “anode → first electrode → first light emitting diode → fifth electrode → first intermediate electrode → second electrode → The second light emitting diode → the sixth electrode → the second intermediate electrode → the third electrode → the third light emitting diode → the seventh electrode → the cathode ”. Thus, the first circuit configuration is a circuit configuration in which three light emitting diodes are connected in series.

  When the second circuit configuration is realized, the current flow of the circuit is “anode → fourth electrode → one light emitting diode → seventh electrode → cathode”. Thus, the second circuit configuration is a circuit configuration in which only one light emitting diode is connected.

  As described above, without changing the size of the mounting substrate, the anode or cathode of the light-emitting diode to be mounted is designated as “first electrode, second electrode, third electrode or fifth electrode, sixth electrode, first electrode”. The circuit configuration can be either the first circuit configuration or the second circuit configuration simply by selecting “electrically connected to 7 electrodes” or “electrically connected to 4th electrode or 7th electrode”. Can be changed.

[ 6 ] In the fifth invention, on the upper surface of the upper layer, the junction region of the large light-emitting diode is partially in any of the fifth electrode region , the sixth electrode region, and the seventh electrode region. is set to overlap the edge area of the fifth electrode, and the portion along the part of the edge of the bonding region of the first small light emitting diodes, along part of the edge of the junction area of the large light-emitting diode And the edge of the region of the sixth electrode is a portion along the edge of a part of the junction region of the second small light emitting diode and a portion of the edge of the junction region of the large light emitting diode And the edge of the region of the seventh electrode has a portion along a part of the edge of the junction region of the third small light emitting diode , and a portion along a part of the edge of the junction region of the large light emitting diode. It is preferable to have ( 6th invention).

According to the sixth aspect of the invention, when the three light emitting diodes are soldered, one light emitting diode is positioned according to the shape of the fifth electrode and the other light emission according to the shape of the sixth electrode due to the self-alignment effect. The diode is positioned, and the other light emitting diode is positioned in accordance with the shape of the seventh electrode. Further, when soldering one light emitting diode, a portion overlapping with the fifth electrode of one light emitting diode is positioned according to the shape of the fifth electrode due to the self-alignment effect, and 1 according to the shape of the sixth electrode. A portion overlapping the sixth electrode of the two light emitting diodes is positioned. A portion overlapping with the seventh electrode of one light emitting diode is positioned in accordance with the shape of the seventh electrode.

  Thereby, since the position of the light emitting diode is determined by the predetermined shape of the electrode, it is possible to suppress variations in the light distribution characteristics and the like of the light emitting diode.

(A) is a figure which shows the 1st circuit structure realizable using the mounting board | substrate of 1st Embodiment of this invention, (b) is a figure which shows the 2nd circuit structure realizable using the said mounting board | substrate. . The figure which shows the structure of the mounting board of 1st Embodiment of this invention for implement | achieving the circuit structure of FIG. 2A is a diagram showing an electrode pattern on the lowermost layer of the mounting substrate in FIG. 2, FIG. 2B is a diagram showing an electrode pattern on the back surface of the intermediate layer of the mounting substrate, and FIG. The figure which shows the electrode pattern of the surface of a layer. (A) is a figure which shows when LED is mounted so that it may become a 1st circuit structure on the mounting board of FIG. 2, (b) is when LED is mounted so that it may become a 2nd circuit structure on the said mounting board. FIG. (A) is a figure which shows the 1st circuit structure realizable using the mounting board of 2nd Embodiment of this invention, (b) is a figure which shows the 2nd circuit structure realizable using the said mounting board. . (A) is a figure which shows the electrode pattern of the lowest layer of the mounting substrate of 2nd Embodiment of this invention, (b) is a figure which shows the electrode pattern of the back surface of the intermediate | middle layer of the said mounting board, (c) is The figure which shows the electrode pattern of the surface of the intermediate | middle layer of the said mounting board | substrate. (A) is a figure which shows when LED is mounted so that it may become a 1st circuit structure on the mounting board of FIG. 5, (b) is when LED is mounted so that it may become a 2nd circuit structure on the said mounting board. FIG. (A) is a figure which shows the 1st circuit structure realizable using the mounting board of 3rd Embodiment of this invention, (b) is a figure which shows the 2nd circuit structure realizable using the said mounting board. . (A) is a figure which shows the electrode pattern of the lowest layer of the mounting substrate of 3rd Embodiment of this invention, (b) is a figure which shows the electrode pattern of the back surface of the intermediate | middle layer of the said mounting board, (c) is The figure which shows the electrode pattern of the surface of the intermediate | middle layer of the said mounting board | substrate. (A) is a figure which shows when LED is mounted so that it may become a 1st circuit structure on the mounting board of FIG. 8, (b) is when LED is mounted so that it may become a 2nd circuit structure on the said mounting board. FIG.

[First Embodiment]
A light emitting diode mounting substrate (hereinafter referred to as “mounting substrate”) according to a first embodiment of the present invention will be described. As shown in FIG. 1, the mounting substrate 1 of the present embodiment is configured to be mounted with two circuit configurations. One is a circuit configuration (hereinafter referred to as “first circuit configuration”) in which two small LEDs (hereinafter referred to as “small LEDs”) 21 and 22 are connected in series, as shown in FIG. ). The other is a circuit configuration (hereinafter referred to as “second circuit configuration”) in which only one large LED (hereinafter referred to as “large LED”) 31 is connected as shown in FIG. is there. It is assumed that the two small LEDs 21 and 22 are 0.7 mm square, and the large LED 31 is 1 mm square.

  As shown in FIG. 2, the mounting substrate 1 is composed of three layers: a lowermost layer 11, an intermediate layer 12, and an uppermost layer 13. The lowermost layer 11, the intermediate layer 12, and the uppermost layer 13 are made of a glass epoxy substrate. These are not limited to glass epoxy substrates, but may be other substrates such as ceramic substrates.

  As shown in FIG. 3A, the anode 11b1 and the cathode 11b2 are planarly separated as an electrode pattern made of a conductive member on the back surface 11b of the lowermost layer 11 (hereinafter referred to as the “lowermost layer back surface”). Are arranged. The lowermost layer 11 is provided with two electrode vias, an anode via V + and a cathode via V−, as electrode vias formed by embedding a conductive member in a through-hole penetrating the lowermost layer 11. . The anode via V + is electrically connected to the anode 11b1. The cathode via V− is electrically connected to the cathode 11b2.

  The intermediate layer 12 has a back surface (hereinafter referred to as “intermediate layer back surface”) 12 b in contact with the surface of the lowermost layer 11 (surface opposite to the back surface 11 b). As shown in FIG. 3B, on the back surface 12b of the intermediate layer, three electrode patterns of the first back electrode 12b1 to the third back electrode 12b3 are separated from each other as an electrode pattern made of a conductive member. Has been placed.

  At this time, the first back electrode 12b1 is electrically connected to the anode via V + provided in the lowermost layer 11 at the anode via contact P + on the surface. The second back electrode 12b2 is electrically connected to the cathode via V- provided in the lowermost layer 11 at the cathode via contact P- on the surface.

  Further, as shown in FIG. 3C, the surface of the intermediate layer 12 (hereinafter referred to as “intermediate layer surface”) 12a has first electrode electrodes 12a1 to 6 as electrode patterns made of conductive members. The six electrode patterns of the electrode 12a6 are disposed so as to be separated from each other in a planar manner.

  The intermediate layer 12 is provided with six electrode vias, a first via V1 to a sixth via V6, as electrode vias formed by embedding a conductive member in a through hole penetrating the intermediate layer 12. . The first via V1 electrically connects the first front electrode 12a1 and the first back electrode 12b1. The second via V2 electrically connects the second front electrode 12a2 and the third back electrode 12b3. The third via V3 electrically connects the third front electrode 12a3 and the first back electrode 12b1. The fourth via V4 electrically connects the fourth front electrode 12a4 and the first back electrode 12b1. The fifth via V5 electrically connects the fifth front electrode 12a5 and the third back electrode 12b3. The sixth via V6 electrically connects the sixth front electrode 12a6 and the second back electrode 12b2.

  The uppermost layer 13 is provided with an opening 13a. The central portion of the intermediate layer surface 12a is exposed from the opening 13a. Thereby, the electrode pattern of the 1st surface electrode 12a1-the 6th surface electrode 12a6 is exposed from the opening part 13a.

  The mounting substrate 1 mounted as described above assumes that two small LEDs 21 and 22 or one large LED 31 is mounted on the intermediate layer surface 12a exposed from the opening 13a by solder paste or the like. Yes. In addition, after LED is mounted, the resin which has translucency is filled for the purpose of protection of LED, an electrode pattern, etc., improvement of the light distribution performance of LED, etc.

  First, the first circuit configuration of the first embodiment will be described with reference to FIG. 3 and FIG. The two small LEDs 21 and 22 are configured such that the front side which is also a light emitting surface is an anode, and the opposite side to the front side is a cathode.

  The first small LED 21 is mounted on the fifth front electrode 12a5. Thereby, the cathode of the first small LED 21 is electrically connected to the fifth surface electrode 12a5. The anode of the first small LED 21 is electrically connected to the first surface electrode 12a1 by the first wire W1 that is a bonding wire.

  The second small LED 22 is mounted on the sixth front electrode 12a6. Thereby, the cathode of the second small LED 22 is electrically connected to the sixth surface electrode 12a6. The anode of the second small LED 22 is electrically connected to the second surface electrode 12a2 by a second wire W2 that is a bonding wire.

  With the electrical connection as described above, the anode of the first small LED 21 is connected to the anode 11b1 via “first wire W1 → first front electrode 12a1 → first via V1 → first back electrode 12b1 → anode via V +”. Is electrically connected. In addition, the cathode of the first small LED 21 is connected to the second small electrode via “the fifth front electrode 12a5 → the fifth via V5 → the third back electrode 12b3 → the second via V2 → the second front electrode 12a2 → the second wire W2”. It is electrically connected to the anode of the LED 22. The cathode of the second small LED 22 is electrically connected to the cathode 11b2 via “sixth front electrode 12a6 → sixth via V6 → second back electrode 12b2 → cathode via V−”.

  As described above, when two small LEDs 21 and 22 are mounted on the mounting substrate 1 as shown in FIG. 4A, the two small LEDs 21 and 22 are connected in series, and FIG. The first circuit configuration as shown in FIG.

  Next, the second circuit configuration of the first embodiment will be described with reference to FIGS. 3 and 4B. Like the two small LEDs 21 and 22, the large LED 31 is configured such that the front side which is also the light emitting surface is an anode, and the opposite side to the front side is a cathode.

  The large LED 31 is mounted on these so as to straddle the fifth front electrode 12a5 and the sixth front electrode 12a6. Thereby, the cathode of the large LED 31 is electrically connected to the fifth surface electrode 12a5 and the sixth surface electrode 12a6. The anode of the large LED 31 is electrically connected to the third surface electrode 12a3 by the third wire W3 that is a bonding wire. The anode of the large LED 31 is electrically connected to the fourth surface electrode 12a4 by a fourth wire W4 that is a bonding wire.

  With the electrical connection as described above, the anode of the large LED 31 passes through “third wire W3 → third surface electrode 12a3 → third via V3 → first back electrode 12b1 → anode via V +” and “fourth It is electrically connected to the anode 11b1 through the wire W4 → the fourth front electrode 12a4 → the fourth via V4 → the first back electrode 12b1 → the anode via V + ”. The cathode of the large LED 31 is electrically connected to the cathode 11b2 via “sixth front electrode 12a6 → sixth via V6 → second back electrode 12b2 → cathode via V−”.

  As described above, when the large LED 31 is mounted on the mounting substrate 1 as shown in FIG. 4B, the second circuit configuration shown in FIG. 1B is obtained.

  Here, since the current flowing through the LED is uniform, the luminance of the entire light emitting surface becomes uniform. When a current is supplied to only one place with respect to an LED having a large light emitting surface, the current does not flow uniformly inside the LED, and the luminance of the entire light emitting surface may vary. For this reason, two wires W3 and W4 are connected to the anode of the large LED 31 having a large light emitting surface to make the luminance of the light emitting surface of the large LED 31 uniform. Since the two small LEDs 21 and 22 have a light emitting surface smaller than that of the large LED 31, only one wire is connected to each LED.

  As described above, in the mounting substrate 1 of the first embodiment, the anode of the light emitting diode (21, 22 or 31) to be mounted is changed to “first surface electrode 12a1 without changing the size of the mounting substrate 1”. , Whether to electrically connect to the second surface electrode 12a2 "or" whether to electrically connect to the third surface electrode 12a3, fourth surface electrode 12a4 ", that is, change the location where the bonding wire is applied Only by doing this, the first circuit configuration and the second circuit configuration can be changed.

  Here, the first circuit configuration of the first embodiment corresponds to the first circuit configuration or the second circuit configuration of the first invention, and also corresponds to the first circuit configuration of the second invention. The second circuit configuration of the first embodiment corresponds to the second circuit configuration or the first circuit configuration of the first invention, and also corresponds to the second circuit configuration of the second invention.

  The two small LEDs 21 and 22 correspond to one or a plurality of light emitting diodes of the first invention, and also correspond to two light emitting diodes of the second invention. The first small LED 21 corresponds to one light emitting diode of the second invention. The second small LED 22 corresponds to the other light emitting diode of the second invention. The large LED 31 corresponds to one or a plurality of light emitting diodes of the first invention, and also corresponds to one light emitting diode of the second invention.

  The anode 11b1 and the first back electrode 12b1 correspond to the anode of the first invention and also correspond to the anode of the second invention. The cathode 11b2 and the second back electrode 12b2 correspond to the cathode of the first invention and to the cathode of the second invention. The third back electrode 12b3 corresponds to the intermediate electrode group of the first invention and also corresponds to the intermediate electrode of the second invention.

  The first surface electrode 12a1 corresponds to “an electrode electrically connected to the anode among the electrodes of the first electrode group (or second electrode group)” of the first invention, and the first electrode of the second invention. It corresponds to an electrode. The second surface electrode 12a2 corresponds to the “electrode not electrically connected to the anode among the electrodes of the first electrode group (or second electrode group)” of the first invention, and the second electrode of the second invention. It corresponds to. The third surface electrode 12a3 and the fourth surface electrode 12a4 correspond to the “electrodes electrically connected to the anode among the electrodes of the second electrode group (or the first electrode group)” of the first invention, and the second This corresponds to the third electrode of the invention.

  The fifth surface electrode 12a5 corresponds to the “electrode not electrically connected to the cathode among the electrodes of the third electrode group (or the fourth electrode group)” of the first invention, and the second electrode of the second invention. It corresponds to 4 electrodes. The sixth surface electrode 12a6 corresponds to “an electrode electrically connected to the cathode among the electrodes of the third electrode group and the fourth electrode group” of the first invention and also corresponds to the fifth electrode of the second invention. .

  The fifth surface electrode 12a5 is formed in a shape along the four corners of the LED 21 when the first small LED 21 is mounted and along the four corners of the LED 31 when the large LED 31 is mounted. Similarly, the sixth surface electrode 12a6 is formed in a shape along the four corners of the LED 22 when the second small LED 22 is mounted and along the four corners of the LED 31 when the large LED 31 is mounted. . Thereby, the two small LEDs 21 and 22 or the large LED 31 are soldered to a predetermined position by the self-alignment effect, and variations in light distribution characteristics and the like due to individual products can be reduced.

  Further, when the large LED 31 is mounted, the light emitting surface of the large LED 31 is formed to include a light emitting surface of each of the LEDs 21 and 22 when the two small LEDs 21 and 22 are mounted. Thereby, it is possible to make the regions where light is emitted substantially the same in both the first circuit configuration and the second circuit configuration.

  The shapes of the fifth surface electrode 12a5 and the sixth surface electrode 12a6 are set in this way. In the third invention, "when the fourth electrode is viewed in the normal direction with respect to the surface of the substrate" The edge of the one light emitting diode and the edge of the one light emitting diode are aligned with the edge of the region overlapping the fourth electrode, and the fifth electrode is in a normal direction with respect to the surface of the substrate , The shape of the edge of the other light emitting diode and the edge of the region of the one light emitting diode that overlaps with the fifth electrode ”.

  Further, when mounting the large LED 31, "the large LED 31 is mounted across the fifth table electrode 12a5 and the sixth table electrode 12a6", in the third invention "the one light emitting diode, It is mounted so as to cover both the fourth electrode and the fifth electrode ”.

  In the present embodiment, each of the two small LEDs 21 and 22 and the large LED 31 includes a plurality of light emitting diodes connected in parallel to each other (for example, in the large LED 31, the inside thereof) A plurality of light emitting diodes may be connected in parallel, or may be composed of only one light emitting diode (the same applies to the first small LED 21 and the second small LED 22).

  When these LEDs are connected in parallel with a plurality of light emitting diodes, the electrodes (12a1 to 12a6, 12b3) electrically connected to each of the plurality of light emitting diodes are one electrode. It may be a plurality of electrodes. At this time, it is only necessary that the plurality of electrodes have the same potential, that is, are electrically connected.

[Second Embodiment]
Next, a mounting substrate according to a second embodiment of the present invention will be described. As shown in FIG. 5, the mounting substrate 201 of the present embodiment is configured to be mounted with two circuit configurations. First, as shown in FIG. 5 (a), using four small LEDs 221 to 224, a circuit in which two light emitting diodes are connected in parallel is taken as one unit, and the circuit of the parallel connection is A circuit configuration in which two are connected in series (hereinafter referred to as “first circuit configuration”).

Thus, the first circuit configuration is a circuit configuration in which two parallel-connected circuits are connected in series with a circuit in which two light-emitting diodes are connected in parallel as one unit.
The other is, as shown in FIG. 5B, a circuit configuration in which two large LEDs (hereinafter referred to as “large LEDs”) 231 and 232 are connected in series (hereinafter referred to as “second circuit configuration”). It is said).

  Similarly to the mounting substrate 1 of the first embodiment, the mounting substrate 201 of the second embodiment includes three layers of the lowermost layer 11, the intermediate layer 12, and the uppermost layer 13. The lowermost layer 11, the intermediate layer 12, and the uppermost layer 13 are made of a glass epoxy substrate. These are not limited to glass epoxy substrates, but may be other substrates such as ceramic substrates.

  As shown in FIG. 6A, in the mounting substrate 201 of the second embodiment, as in the mounting substrate 1 of the first embodiment, on the lowermost layer back surface 11b, as an electrode pattern made of a conductive member, The anode 11b1 and the cathode 11b2 are arranged separately in a plane. The lowermost layer 11 includes an anode via V + electrically connected to the anode 11b1 as an electrode via formed by embedding a conductive member in a through-hole penetrating the lowermost layer 11, and an electrical connection to the cathode 11b2. There are two electrode vias connected to the cathode via V-.

  In the intermediate layer 12, the intermediate layer back surface 12b is in contact with the surface of the lowermost layer 11 (the surface opposite to the back surface 11b). As shown in FIG. 6B, on the intermediate layer back surface 12b, three electrode patterns of the first back electrode 12b21 to the third back electrode 12b23 are separated from each other in a plane as an electrode pattern made of a conductive member. Has been placed.

  At this time, the first back electrode 12b21 is electrically connected to the anode via V + provided in the lowermost layer 11 at the anode via contact P + on the surface thereof. The second back electrode 12b22 is electrically connected to the cathode via V- provided in the lowermost layer 11 at the cathode via contact P- on the surface.

  Further, as shown in FIG. 6C, on the intermediate layer surface 12a, six electrode patterns of the first surface electrode 12a21 to the sixth surface electrode 12a26 are planar with respect to each other as electrode patterns made of a conductive member. Are arranged separately.

  The intermediate layer 12 is provided with six electrode vias, a first via V21 to a sixth via V26, as electrode vias formed by embedding a conductive member in a through hole penetrating the intermediate layer 12. . The first via V21 electrically connects the first front electrode 12a21 and the first back electrode 12b21. The second via V22 electrically connects the second front electrode 12a22 and the third back electrode 12b23. The third via V23 electrically connects the third front electrode 12a23 and the first back electrode 12b21. The fourth via V24 electrically connects the fourth front electrode 12a24 and the third back electrode 12b23. The fifth via V25 electrically connects the fifth front electrode 12a25 and the third back electrode 12b23. The sixth via V26 electrically connects the sixth front electrode 12a26 and the second back electrode 12b22.

  As shown in FIG. 6C, in the mounting substrate 201 of the second embodiment, the uppermost layer 13 is provided with an opening 13a as in the mounting substrate 1 of the first embodiment. The central portion of the intermediate layer surface 12a is exposed from the opening 13a. Thereby, the electrode patterns of the first surface electrode 12a21 to the sixth surface electrode 12a26 are exposed from the opening 13a.

  The mounting substrate 201 mounted as described above assumes that the four small LEDs 221 to 224 or the two large LEDs 231 and 232 are mounted on the intermediate layer surface 12a exposed from the opening 13a by solder paste or the like. doing. Also in the mounting substrate 201 of the present embodiment, after the LED is mounted, a resin having translucency is filled for the purpose of protecting the LED and the electrode pattern, and improving the light distribution performance of the LED. .

  First, the first circuit configuration of the second embodiment will be described with reference to FIGS. 6 and 7A. The four small LEDs 221 to 224 are configured such that the front side which is also a light emitting surface is an anode, and the opposite side to the front side is a cathode.

  The first small LED 221 and the second small LED 222 are mounted side by side on the fifth front electrode 12a25. Accordingly, the cathodes of the first small LED 221 and the second small LED 222 are electrically connected to the fifth surface electrode 12a25. The anode of the first small LED 221 is electrically connected to the first surface electrode 12a21 by a first wire W21 that is a bonding wire. The anode of the second small LED 222 is electrically connected to the first surface electrode 12a21 by a second wire W22 that is a bonding wire.

  The third small LED 223 and the fourth small LED 224 are mounted on the sixth surface electrode 12a26. Accordingly, the cathodes of the third small LED 223 and the fourth small LED 224 are electrically connected to the sixth surface electrode 12a26. The anode of the third small LED 223 is electrically connected to the second surface electrode 12a22 by a third wire W23 that is a bonding wire. The anode of the fourth small LED 224 is electrically connected to the second surface electrode 12a22 by the fourth wire W24 that is a bonding wire.

  With the electrical connection as described above, the anode of each of the first small LED 221 and the second small LED 222 is “the first wire W21 or the second wire W22 → the first front electrode 12a21 → the first via V21 → the first back. It is electrically connected to the anode 11b1 via the electrode 12b21 → the anode via V + ”. The cathodes of the first small LED 221 and the second small LED 222 are “fifth surface electrode 12a25 → 5th via V25 → third back electrode 12b23 → second via V22 → second front electrode 12a22 → third wire W23”. Or it is electrically connected to the anode of each of the third small LED 223 and the fourth small LED 224 via the fourth wire W24 ". Further, the cathodes of the third small LED 223 and the fourth small LED 224 are electrically connected to the cathode 11b2 via “sixth front electrode 12a26 → sixth via V26 → second back electrode 12b22 → cathode via V−”. Is done.

  As described above, when the four small LEDs 221 to 224 are mounted on the mounting board 201 of the present embodiment as shown in FIG. 7A, the second implementation as shown in FIG. Form of the first circuit configuration.

  Next, the second circuit configuration of the second embodiment will be described with reference to FIGS. 6 and 7B. Like the four small LEDs 221 to 224, the two large LEDs 231 and 232 are configured such that the front side which is also the light emitting surface is an anode, and the opposite side to the front side is a cathode.

  The first large LED 231 is mounted on the fifth front electrode 12a25. Thereby, the cathode of the first large LED 231 is electrically connected to the fifth surface electrode 12a25. The anode of the first large LED 231 is electrically connected to the third surface electrode 12a23 by the fifth wire W25 and the sixth wire W26 which are bonding wires.

  The second large LED 232 is mounted on the sixth surface electrode 12a26. Thereby, the cathode of the second large LED 232 is electrically connected to the sixth surface electrode 12a26. The anode of the second large LED 232 is electrically connected to the fourth surface electrode 12a24 by the seventh wire W27 and the eighth wire W28 which are bonding wires.

  With the electrical connection as described above, the anode of the first large LED 231 is “the fifth wire W25 and the sixth wire W26 → the third front electrode 12a23 → the third via V23 → the first back electrode 12b21 → the anode via V +”. Is electrically connected to the anode 11b1. The cathode of the first large LED 231 is “fifth front electrode 12a25 → fifth via V25 → third back electrode 12b23 → fourth via V24 → fourth front electrode 12a24 → seventh wire W27 and eighth wire W28”. To the anode of the second large LED 232. Further, the cathode of the second large LED 232 is electrically connected to the cathode 11b2 via “the sixth front electrode 12a26 → the sixth via V26 → the second back electrode 12b22 → the cathode via V−”.

  As described above, when two large LEDs 231 and 232 are mounted on the mounting substrate 201 of the present embodiment as shown in FIG. 7B, the two large LEDs 231 and 232 are connected in series, The second circuit configuration is as shown in FIG.

  Here, two wires (W25 and W26, W27 and W28) are connected to each of the two large LEDs 231 and 232 in the same manner as the large LED 31 of the first embodiment. This is to make the luminance of the light emitting surface 232 uniform.

  As described above, in the mounting substrate 201 of the second embodiment, the anodes of the light emitting diodes (221 to 224 or 231 and 232) to be mounted are changed without changing the size of the mounting substrate 201 as described in “Table 1”. Only by selecting “whether it is electrically connected to the electrode 12a21 and the second surface electrode 12a22” or “whether it is electrically connected to the third table electrode 12a23 and the fourth surface electrode 12a24”; It is possible to change the first circuit configuration and the second circuit configuration simply by changing.

  Here, the first circuit configuration of the second embodiment corresponds to the first circuit configuration or the second circuit configuration of the first invention, and also corresponds to the first circuit configuration of the fourth invention. The second circuit configuration of the embodiment corresponds to the second circuit configuration or the first circuit configuration of the first invention, and also corresponds to the second circuit configuration of the fourth invention.

  The four small LEDs 221 to 224 correspond to one or a plurality of light emitting diodes of the first invention and also correspond to four light emitting diodes of the fourth invention. The first small LED 221 corresponds to the first light emitting diode of the fourth invention, the second small LED 222 corresponds to the second light emitting diode of the fourth invention, and the third small LED 223 corresponds to the third light emitting diode of the fourth invention. The fourth small LED 224 corresponds to the fourth light emitting diode of the fourth invention. The two large LEDs 231 and 232 correspond to one or a plurality of light emitting diodes of the first invention and also correspond to two light emitting diodes of the fourth invention. The first large LED 231 corresponds to one light emitting diode of the fourth invention, and the second large LED 232 corresponds to the other light emitting diode of the fourth invention.

  The anode 11b1 and the first back electrode 12b21 correspond to the anode of the first invention and also correspond to the anode of the fourth invention. The cathode 11b2 and the second back electrode 12b22 correspond to the cathode of the first invention and to the cathode of the fourth invention. The third back electrode 12b23 corresponds to the intermediate electrode group of the first invention and also corresponds to the intermediate electrode of the fourth invention.

  Further, the first surface electrode 12a21 corresponds to “an electrode electrically connected to the anode in the first electrode group (or second electrode group)” of the first invention, and the first electrode of the fourth invention. Equivalent to. The second front electrode 12a22 corresponds to the “electrode not electrically connected to the anode in the first electrode group (or second electrode group)” of the first invention, and also corresponds to the second electrode of the fourth invention. To do.

  The third surface electrode 12a23 corresponds to “an electrode electrically connected to the anode in the second electrode group (or the first electrode group)” of the first invention, and the third electrode of the fourth invention. Equivalent to. The fourth surface electrode 12a24 corresponds to the “electrode that is not electrically connected to the anode in the second electrode group (or the first electrode group)” of the first invention, and corresponds to the fourth electrode of the fourth invention. To do.

  The fifth surface electrode 12a25 corresponds to the “electrode not electrically connected to the cathode in the third electrode group (or the fourth electrode group)” of the first invention, and the fifth electrode of the present invention. Equivalent to. The sixth surface electrode 12a26 corresponds to “an electrode electrically connected to the cathode of the third electrode group and the fourth electrode group” of the first invention and also corresponds to the sixth electrode of the present invention.

  The fifth front electrode 12a25 is along the four corners of a rectangle formed by the arrangement of the LEDs 221 and 222 when the first small LED 221 and the second small LED 222 are mounted side by side, and the first large LED 231 is It is formed in a shape along the four corners of the LED 231 when mounted. Similarly, the sixth front electrode 12a26 extends along the four corners of the rectangle formed by the arrangement of the LEDs 223 and 224 when the third small LED 223 and the fourth small LED 224 are mounted side by side, and the second large LED 232. Is formed in a shape along the four corners of the LED 232 when mounted. Thereby, the four small LEDs 221 to 224 or the two large LEDs 231 and 232 are soldered to predetermined positions by the self-alignment effect, and variations in light distribution characteristics and the like due to individual products can be reduced.

  When the two large LEDs 231 and 232 are mounted, the light emitting surface of the large LED 231 is formed to have a size including the respective light emitting surfaces when the first small LED 221 and the second small LED 222 are mounted. The light emitting surface of the large LED 232 is formed to have a size including each light emitting surface when the third small LED 223 and the fourth small LED 224 are mounted. Thereby, it is possible to make the regions where light is emitted substantially the same in both the first circuit configuration and the second circuit configuration.

  The shapes of the fifth surface electrode 12a25 and the sixth surface electrode 12a26 are set in this way. In the fifth invention, “when the fifth electrode is viewed in the normal direction with respect to the surface of the substrate. The first light emitting diode and the second light emitting diode are formed in parallel to each other and the edge of the one light emitting diode is formed, and the sixth electrode is formed with respect to the surface of the substrate. When viewed in the normal direction, it corresponds to “the edge formed by the juxtaposition of the third light emitting diode and the fourth light emitting diode and the edge of the other light emitting diode”. .

  When mounting the four small LEDs 221 to 224, the first small LED 221 and the second small LED 222 are arranged in parallel and mounted on the fifth surface electrode 12a25, and the third small LED 223 and the fourth small LED 224 are arranged in parallel. Then, it is mounted on the sixth front electrode 12a26. This means that in the fifth aspect of the invention, the first light emitting diode and the second light emitting diode are mounted on the fifth electrode in parallel with each other, and the third light emitting diode and the fourth light emitting diode are in parallel with each other. And mounted on the sixth electrode ”. Here, the term “parallel arrangement” may mean that some space is provided between the light emitting diodes.

  In the present embodiment, each of the four small LEDs 221 to 224 and the two large LEDs 231 and 232 includes a plurality of light emitting diodes connected in parallel to each other (for example, a first large LED). In the LED 231, a plurality of light emitting diodes may be connected in parallel, or may be configured by only one light emitting diode, and each of the four small LEDs 221 to 224 and the second large LED 232. The same).

  When these LEDs are connected in parallel with a plurality of light emitting diodes, the electrodes (12a21 to 12a26, 12b22) electrically connected to each of the plurality of light emitting diodes are one electrode. It may be a plurality of electrodes. At this time, it is only necessary that the plurality of electrodes have the same potential, that is, are electrically connected.

[Third Embodiment]
Next, a mounting substrate according to a third embodiment of the present invention will be described. As shown in FIG. 8, the mounting substrate 301 of the present embodiment is configured to be mounted with two circuit configurations. One is a circuit configuration (hereinafter referred to as “first circuit configuration”) in which three small LEDs 321 to 323 are connected in series as shown in FIG. The other is a circuit configuration (hereinafter referred to as “second circuit configuration”) in which only one large LED (hereinafter referred to as “large LED”) 331 is connected, as shown in FIG. 8B. is there.

  Also in the mounting substrate 301 of the third embodiment, the three layers of the lowermost layer 11, the intermediate layer 12, and the uppermost layer 13 are the same as the mounting substrate 1 of the first embodiment and the mounting substrate 201 of the second embodiment. Consists of. The lowermost layer 11, the intermediate layer 12, and the uppermost layer 13 are made of a glass epoxy substrate. These are not limited to glass epoxy substrates, but may be other substrates such as ceramic substrates.

  As shown in FIG. 9A, in the mounting substrate 301 of the third embodiment, the lowermost layer rear surface 11b has the same structure as that of the mounting substrate 1 of the first embodiment and the mounting substrate 201 of the second embodiment. As an electrode pattern made of a conductive member, an anode 11b1 and a cathode 11b2 are arranged separately in a plane. The lowermost layer 11 includes an anode via V + electrically connected to the anode 11b1 as an electrode via formed by embedding a conductive member in a through-hole penetrating the lowermost layer 11, and an electrical connection to the cathode 11b2. There are two electrode vias connected to the cathode via V-.

  In the intermediate layer 12, the intermediate layer back surface 12b is in contact with the surface of the lowermost layer 11 (the surface opposite to the back surface 11b). As shown in FIG. 9B, on the intermediate layer back surface 12b, four electrode patterns of the first back electrode 12b31 to the fourth back electrode 12b34 are separated from each other in a planar manner as electrode patterns made of a conductive member. Has been placed.

  At this time, the first back electrode 12b31 is electrically connected to the anode via V + provided in the lowermost layer 11 at the anode via contact P + on the surface thereof. The second back electrode 12b32 is electrically connected to the cathode via V- provided in the lowermost layer 11 at the cathode via contact P- on the surface.

  Further, as shown in FIG. 9C, on the intermediate layer surface 12a, seven electrode patterns of the first table electrode 12a31 to the seventh table electrode 12a37 are planar with each other as electrode patterns made of a conductive member. Are arranged separately.

  The intermediate layer 12 is provided with seven electrode vias, a first via V31 to a seventh via V37, as electrode vias formed by embedding a conductive member in a through hole penetrating the intermediate layer 12. . The first via V31 electrically connects the first front electrode 12a31 and the first back electrode 12b31. The second via V32 electrically connects the second front electrode 12a32 and the third back electrode 12b33. The third via V33 electrically connects the third front electrode 12a33 and the fourth back electrode 12b34. The fourth via V34 electrically connects the fourth front electrode 12a34 and the first back electrode 12b31. The fifth via V35 electrically connects the fifth front electrode 12a35 and the third back electrode 12b33. The sixth via V36 electrically connects the sixth front electrode 12a36 and the fourth back electrode 12b34. The seventh via V37 electrically connects the seventh front electrode 12a37 and the second back electrode 12b32.

  As shown in FIG. 9C, in the mounting substrate 301 of the third embodiment, the uppermost layer 13 has an opening as in the mounting substrate 1 of the first embodiment and the mounting substrate 201 of the second embodiment. 13a is provided. The central portion of the intermediate layer surface 12a is exposed from the opening 13a. Thereby, the electrode pattern of the 1st surface electrode 12a31-the 7th surface electrode 12a37 is exposed from the opening part 13a.

  The mounting substrate 301 mounted as described above assumes that three small LEDs 321 to 323 or one large LED 331 is mounted on the intermediate layer surface 12a exposed from the opening 13a by solder paste or the like. Yes. Also in the mounting substrate 301 of the present embodiment, after the LED is mounted, a resin having translucency is filled for the purpose of protecting the LED and the electrode pattern, and improving the light distribution performance of the LED. .

  First, the first circuit configuration of the third embodiment will be described with reference to FIG. 9 and FIG. The three small LEDs 321 to 323 are configured such that the front side which is also the light emitting surface is an anode, and the opposite side to the front side is a cathode.

  The first small LEDs 321 are mounted side by side on the fifth front electrode 12a35. Thereby, the cathode of the first small LED 321 is electrically connected to the fifth surface electrode 12a35. And the anode of 1st small LED321 is electrically connected with the 1st surface electrode 12a31 by the 1st wire W31 which is a bonding wire.

  The second small LED 322 is mounted on the sixth front electrode 12a36. Thereby, the cathode of the second small LED 322 is electrically connected to the sixth surface electrode 12a36. The anode of the second small LED 322 is electrically connected to the second surface electrode 12a32 by a second wire W32 that is a bonding wire.

  The third small LED 323 is mounted on the seventh front electrode 12a37. Thereby, the cathode of the third small LED 323 is electrically connected to the seventh surface electrode 12a37. The anode of the third small LED 323 is electrically connected to the third surface electrode 12a33 by a third wire W33 that is a bonding wire.

  With the electrical connection as described above, the anode of the first small LED 321 is connected to the anode 11b1 via “first wire W31 → first front electrode 12a31 → first via V31 → first back electrode 12b31 → anode via V +”. Is electrically connected. The cathode of the first small LED 321 is connected to the second small electrode via the “fifth front electrode 12a35 → the fifth via V35 → the third back electrode 12b33 → the second via V32 → the second front electrode 12a32 → the second wire W32”. It is electrically connected to the anode of the LED 322. In addition, the cathode of the second small LED 322 is connected to the third small electrode via “the sixth front electrode 12a36 → the sixth via V36 → the fourth back electrode 12b34 → the third via V33 → the third front electrode 12a33 → the third wire W33”. It is electrically connected to the anode of the LED 323. Further, the cathode of the third small LED 323 is electrically connected to the cathode 11b2 via “the seventh front electrode 12a37 → the seventh via V37 → the second back electrode 12b32 → the cathode via V−”.

  As described above, when the three small LEDs 321 to 323 are mounted on the mounting substrate 301 of the present embodiment as shown in FIG. 10A, the third embodiment as shown in FIG. Form of the first circuit configuration.

  Next, the second circuit configuration of the third embodiment will be described with reference to FIGS. 9 and 10B. As with the three small LEDs 321-323, one large LED 331 is configured such that the front side, which is also the light emitting surface, is an anode, and the opposite side to the front side is a cathode.

  The large LED 331 is mounted on the three electrodes 12a35, 12a36, and 12a37 so as to straddle the fifth table electrode 12a35, the sixth table electrode 12a36, and the seventh table electrode 12a37. Thereby, the cathode of the large LED 331 is electrically connected to each of the fifth table electrode 12a35, the sixth table electrode 12a36, and the seventh table electrode 12a37. The anode of the large LED 331 is electrically connected to the fourth surface electrode 12a34 by three bonding wires of the fourth wire W34 to the sixth wire W36 which are bonding wires.

  Through the electrical connection as described above, the anode of the large LED 331 passes through “the fourth wire W34 to the sixth wire W36 → the fourth front electrode 12a34 → the fourth via V34 → the first back electrode 12b31 → the anode via V +”. And electrically connected to the anode 11b1. Further, the cathode of the large LED 331 is electrically connected to the cathode 11b2 via “the seventh front electrode 12a37 → the seventh via V37 → the second back electrode 12b32 → the cathode via V−”.

  As described above, when one large LED 331 is mounted on the mounting substrate 301 of the present embodiment as shown in FIG. 10B, the second circuit configuration as shown in FIG. Become.

  Here, the three wires W34, W35, and W36 are connected to one large LED 31, like the large LED 31 in the first embodiment and the two large LEDs 231 and 232 in the second embodiment. This is to make the luminance of the light emitting surface of the LED 331 uniform.

  As described above, in the mounting substrate 301 of the third embodiment, the anode of the light emitting diode (321 to 323 or 331) to be mounted is changed to “first surface electrode 12a31 without changing the size of the mounting substrate 301. To the first surface electrode 12a33 "or" to the fourth surface electrode 12a34 "is selected, that is, only by changing the location where the bonding wire is applied, The circuit configuration and the second circuit configuration can be changed.

  Here, the first circuit configuration of the third embodiment corresponds to the first circuit configuration of the first invention or the second circuit configuration of the first invention, and also corresponds to the first circuit configuration of the sixth invention. The second circuit configuration of the third embodiment corresponds to the second circuit configuration or the first circuit configuration of the first invention, and also corresponds to the second circuit configuration of the sixth invention.

  The three small LEDs 321 to 323 correspond to one or a plurality of light emitting diodes of the first invention, and also correspond to three light emitting diodes of the sixth invention. The first small LED 321 corresponds to the first light emitting diode of the sixth invention, the second small LED 322 corresponds to the second light emitting diode of the sixth invention, and the third small LED 323 corresponds to the third light emitting diode of the sixth invention. It corresponds to. The large LED 331 corresponds to one or more light emitting diodes of the first invention and also corresponds to one light emitting diode of the sixth invention.

  Further, the anode 11b1 and the first back electrode 12b31 correspond to the anode of the first invention and to the anode of the sixth invention. The cathode 11b2 and the second back electrode 12b32 correspond to the cathode of the first invention and to the cathode of the sixth invention. The third back electrode 12b33 corresponds to the intermediate electrode group of the first invention and also corresponds to the first intermediate electrode of the sixth invention. The fourth back electrode 12b34 corresponds to the intermediate electrode group of the first invention and also corresponds to the second intermediate electrode of the sixth invention.

  Further, the first surface electrode 12a31 corresponds to “an electrode electrically connected to the anode in the first electrode group (or second electrode group)” of the first invention, and the first electrode of the sixth invention. The second surface electrode 12a32 corresponds to the “electrode that is not electrically connected to the anode in the first electrode group (or second electrode group)” of the first invention, and the second electrode of the sixth invention. The third surface electrode 12a33 corresponds to an electrode, and corresponds to the “electrode that is not electrically connected to the anode in the first electrode group (or second electrode group)” of the first invention. Corresponding to the third electrode, the fourth surface electrode 12a34 corresponds to the “electrode electrically connected to the anode in the second electrode group (or first electrode group)” of the first invention, and the sixth invention. Corresponds to the fourth electrode.

  The fifth surface electrode 12a35 corresponds to the “electrode of the third electrode group (or fourth electrode group) not electrically connected to the cathode” of the first invention, and the fifth electrode of the sixth invention. The sixth surface electrode 12a36 corresponds to “an electrode that is not electrically connected to the cathode of the third electrode group (or fourth electrode group)” of the first invention, and the sixth electrode of the sixth invention. The seventh surface electrode 12a37 corresponds to “electrodes electrically connected to the cathode of the third electrode group and the fourth electrode group” of the first invention, and corresponds to the sixth electrode of the sixth invention. It corresponds to an electrode.

  Further, the fifth surface electrode 12a35 is along the four corners of the LED 321 when the first small LED 321 is mounted, and the two corners on the left side of FIG. 10B of the LED 331 when the large LED 331 is mounted. It is formed in such a shape. Similarly, the sixth surface electrode 12a36 is formed in a shape along the four corners of the LED 322 when the second small LED 322 is mounted and along the central portion of the LED 331 when the large LED 331 is mounted. Yes. The seventh surface electrode 12a37 is along the four corners of the LED 323 when the third small LED 323 is mounted, and along the two corners on the right side of FIG. 10B of the LED 331 when the large LED 331 is mounted. It is formed in such a shape. Thus, the three small LEDs 321 to 323 or the large LED 331 are soldered to a predetermined position by the self-alignment effect, and variations in light distribution characteristics and the like due to individual products can be reduced.

  When the large LED 331 is mounted, the light emitting surface of the large LED 331 is formed to have a size including the light emitting surfaces of the respective LEDs 321 to 323 when the three small LEDs 321 to 323 are mounted. Thereby, it is possible to make the regions where light is emitted substantially the same in both the first circuit configuration and the second circuit configuration.

  The shapes of the fifth surface electrode 12a35 and the sixth surface electrode 12a36 are set in this way. In the seventh aspect of the invention, “when the fifth electrode is viewed in the normal direction with respect to the surface of the substrate. , The edge of the first light emitting diode and the edge of the region of the one light emitting diode overlapping with the fifth electrode, and the sixth electrode is normal to the surface of the substrate. When viewed in a direction, the second light-emitting diode and the edge of the one light-emitting diode are formed in a shape that matches the edge of the region overlapping the sixth electrode, and the seventh electrode is formed on the substrate. It is formed in a shape that matches the edge of the third light emitting diode and the edge of the one light emitting diode that overlaps the seventh electrode when viewed in the normal direction relative to the surface. To do.

  Further, when mounting the large LED 331, "the large LED 331 is mounted across the fifth table electrode 12a5, the sixth table electrode 12a6, and the seventh table electrode 12a37" in the seventh invention, One light-emitting diode is mounted so as to cover the fifth electrode, the sixth electrode, and the seventh electrode.

  In the present embodiment, each of the three small LEDs 321 to 323 and one large LED 331 includes a plurality of light emitting diodes connected in parallel to each other (for example, in the large LED 331, A plurality of light emitting diodes may be connected in parallel in the inside, or may be composed of only one light emitting diode (the same applies to each of the three small LEDs 321 to 323).

  When these LEDs are connected in parallel with a plurality of light emitting diodes, the electrodes (12a31 to 12a37, 12b32, 12b33) electrically connected to each of the plurality of light emitting diodes are one electrode. It may be a plurality of electrodes. At this time, it is only necessary that the plurality of electrodes have the same potential, that is, are electrically connected.

  Moreover, in the said 1st-3rd embodiment, the anode and the cathode may be comprised by the 1 or several electrode.

  Further, in the first to third embodiments, the mounting substrate (1, 201, 301) is arranged so that a plurality of the mounting substrates (1, 201, 301) can be attached to one substrate. The shape of the electrode is devised. Specifically, when the rectangular mounting board (1, 201, 301) is faced in the same direction, each of the four sides of the mounting board (1, 201, 301) is adjacent to each other (that is, It arrange | positions so that each electrode may be connected in the (opposite side). Thereby, the pattern of each electrode can be formed by electrolytic plating on a single substrate on which a plurality of mounting substrates (1, 201, 301) are provided.

11b1 ... anode, 11b2 ... cathode,
DESCRIPTION OF SYMBOLS 1 ... Mounting board | substrate (light emitting diode mounting board | substrate of 1st Embodiment) 21,22 ... Two small LED (two light emitting diode of 1st Embodiment), 21 ... 1st small LED (one of 1st Embodiment) Light emitting diodes), 22 ... second small LED (the other light emitting diode of the first embodiment), 31 ... large LED (one light emitting diode of the first embodiment),
12b1 ... 1st back electrode (anode of 1st Embodiment), 12b2 ... 2nd back electrode (cathode of 1st Embodiment), 12b3 ... 3rd back electrode (intermediate electrode of 1st Embodiment), 12a1 ... 1st Table electrode (first electrode of the first embodiment), 12a2 ... second table electrode (second electrode of the first embodiment), 12a3 ... third table electrode (third electrode of the first embodiment), 12a4 ... first 4 surface electrodes (3rd electrode of 1st Embodiment), 12a5 ... 5th table electrode (4th electrode of 1st Embodiment), 12a6 ... 6th table electrode (5th electrode of 1st Embodiment),
201 ... Mounting substrate (light emitting diode mounting substrate of the second embodiment), 221 to 224 ... Four small LEDs (four light emitting diodes of the second embodiment), 221 ... First small LED (second embodiment of the second embodiment) 1 light emitting diode), 222... Second small LED (second light emitting diode of the second embodiment), 223... Third small LED (third light emitting diode of the second embodiment), 224. 4th light emitting diode of embodiment), 231, 232... Two large LEDs (two light emitting diodes of the second embodiment), 231... First large LED (one light emitting diode of the second embodiment), 232. 2 large LEDs (the other light emitting diode of the second embodiment),
12b21: first back electrode (anode of the second embodiment), 12b22: second back electrode (cathode of the second embodiment), 12b23: third back electrode (intermediate electrode of the second embodiment), 12a21: first Front electrode (first electrode of the second embodiment), 12a22... Second surface electrode (second electrode of the second embodiment), 12a23... Third surface electrode (third electrode of the second embodiment), 12a24. 4 surface electrodes (4th electrode of 2nd Embodiment), 12a25 ... 5th table electrode (5th electrode of 2nd Embodiment), 12a26 ... 6th table electrode (6th electrode of 2nd Embodiment),
301 ... Mounting board (light emitting diode mounting board of the third embodiment), 321-323 ... three small LEDs (three light emitting diodes of the third embodiment), 321 ... first small LED (third of the third embodiment) 1 light emitting diode), 322... Second small LED (second light emitting diode of the third embodiment), 323... Third small LED (third light emitting diode of the third embodiment), 331. One light emitting diode),
12b31 ... 1st back electrode (anode of 3rd Embodiment), 12b32 ... 2nd back electrode (cathode of 3rd Embodiment), 12b33 ... 3rd back electrode (1st intermediate electrode of 3rd Embodiment), 12b34 ... 4th back electrode (2nd intermediate electrode of 3rd Embodiment), 12a31 ... 1st surface electrode (1st electrode of 3rd Embodiment), 12a32 ... 2nd surface electrode (2nd electrode of 3rd Embodiment), 12a33 ... 3rd surface electrode (3rd electrode of 3rd Embodiment), 12a34 ... 4th table electrode (4th electrode of 3rd Embodiment), 12a35 ... 5th surface electrode (5th electrode of 3rd Embodiment) , 12a36 ... sixth surface electrode (sixth electrode of the third embodiment), 12a37 ... seventh surface electrode (seventh electrode of the third embodiment).

Claims (6)

A substrate for mounting one large light emitting diode or two small light emitting diodes,
The first small light emitting diode and the second small light emitting diode realized by mounting the first small light emitting diode and the second small light emitting diode as the two small light emitting diodes are connected in series. Any one of the circuit configuration and the second circuit configuration including only the one large light-emitting diode can be realized.
The substrate has an upper layer and a lower layer that are stacked one above the other,
An anode disposed on the lower surface of the lower layer;
A cathode disposed on a lower surface of the lower layer;
An intermediate electrode disposed on the lower surface of the upper layer and not electrically connected to the anode and the cathode;
It is disposed on the upper surface of the upper layer, and is electrically connected to the anode via a first electrode via. When the first small light emitting diode is mounted, it is electrically connected to the anode of the light emitting diode via a wire. A first electrode connected electrically,
It is disposed on the upper surface of the upper layer and is electrically connected to the intermediate electrode through a second electrode via. When the second small light emitting diode is mounted, the anode of the light emitting diode is connected to the anode through the wire. A second electrode electrically connected;
It is disposed on the upper surface of the upper layer and is electrically connected to the anode via a third electrode via. When the large light emitting diode is mounted, it is electrically connected to the anode of the light emitting diode via a wire. A third electrode to be connected;
Arranged on the upper surface of the upper layer and electrically connected to the intermediate electrode via a fourth electrode via, and electrically connected to the cathode of the light emitting diode when the first small light emitting diode is mounted. A fourth electrode,
Disposed on an upper surface of said upper layer, together with the the cathode and electrically connected through the fifth electrode vias, of the light-emitting diode by bonding when said second small-sized light emitting diodes or the large light-emitting diode is mounted A substrate for mounting a light emitting diode, comprising: a fifth electrode electrically connected to the cathode. In the light emitting diode mounting substrate according to claim 1 ,
On the upper surface of the upper layer, the junction region of the large light emitting diode is set so as to partially overlap both the region of the fourth electrode and the region of the fifth electrode,
The upper surface of said upper layer, the edge region of the fourth electrode has a portion along the part of the edge of the junction region before Symbol first small light emitting diodes, the part of the edge of the junction area of the large light-emitting diode And a portion along
The upper surface of said upper layer, the edge region of the fifth electrode, and the portion along the part of the edge of the junction region before Symbol second small light emitting diodes, the part of the edge of the junction area of the large light-emitting diode A substrate for mounting a light-emitting diode, characterized by having a portion along the line . A substrate for mounting two large light emitting diodes or four small light emitting diodes,
The four first small light emitting diode as a small light-emitting diode, the second small-sized light emitting diode is implemented by a third compact light emitting diodes and a fourth small light emitting diodes are mounted, the first small light emitting diode and the second a parallel connection of the small light-emitting diode, the third small light-emitting diode and the fourth small light emitting first and the circuit configuration of the parallel-connected and are connected in series with the diode, the first large as the two large light-emitting diode Any one circuit configuration of the second circuit configuration in which the light emitting diode and the second large light emitting diode are connected in series can be realized.
The substrate has an upper layer and a lower layer that are stacked one above the other,
An anode disposed on the lower surface of the lower layer ;
A cathode disposed on a lower surface of the lower layer ;
An intermediate electrode disposed on the lower surface of the upper layer and not electrically connected to the anode and the cathode;
Wherein disposed on the upper surface of the upper layer is electrically connected with the anode through the first electrode via, when the first small light emitting diode and the second small-sized light emitting diodes are mounted via a wire A first electrode electrically connected to the anode of the light emitting diode;
Disposed on an upper surface of said upper layer, which is connected the the intermediate electrode electrically via the second electrode via, through the wire when the third small light-emitting diode and the fourth small light emitting diodes are mounted A second electrode electrically connected to the anode of the light emitting diode;
It is disposed on the upper surface of the upper layer, and is electrically connected to the anode via a third electrode via . When the first large light emitting diode is mounted, the anode of the light emitting diode is electrically connected to the anode via a wire. A third electrode that is connected electrically,
Arranged on the upper surface of the upper layer and electrically connected to the intermediate electrode via a fourth electrode via, and when the second large light emitting diode is mounted, the anode of the light emitting diode via the wire A fourth electrode electrically connected;
Disposed on an upper surface of said upper layer, which is connected the the intermediate electrode electrically via the fifth electrode vias, said first small light emitting diode and the second small light-emitting diode or the first large light emitting diode A fifth electrode electrically connected to the cathode of the light emitting diode when mounted;
Wherein disposed on the upper surface of the upper layer, together with the the cathode and electrically connected via the sixth electrode via the third small light-emitting diode and the fourth small light emitting diode or the second large light emitting diodes mounted And a sixth electrode electrically connected to the cathode of the light emitting diode. In the light emitting diode mounting substrate according to claim 3 ,
The upper surface of said upper layer, said edge region of the fifth electrode, said a portion along part of the edge of the bonding region of the first small-sized light emitting diodes, part of the edge of the bonding region of the second small light-emitting diodes And a portion along a part of the edge of the junction region of the first large light emitting diode ,
Edge area of the sixth electrode includes a portion along the part of the edge of the junction area of the third small light-emitting diode, a portion along part of the edge of the bonding region of the fourth small light emitting diodes, said first 2. A substrate for mounting a light emitting diode , comprising a portion along a part of an edge of a junction region of the large light emitting diode. A substrate for mounting one large light emitting diode or three small light emitting diodes,
The three small light emitting diodes as the first small-sized light emitting diode is implemented by the second small-sized light emitting diode and a third small light emitting diodes are mounted, the first small light emitting diodes, the second small light emitting diode and the third Any one circuit configuration of a first circuit configuration in which small light emitting diodes are connected in series and a second circuit configuration including only the one large light emitting diode can be realized.
The substrate has an upper layer and a lower layer that are stacked one above the other,
An anode disposed on the lower surface of the lower layer ;
A cathode disposed on a lower surface of the lower layer ;
A first intermediate electrode disposed on a lower surface of the upper layer and not electrically connected to the anode and the cathode;
A second intermediate electrode disposed on the lower surface of the upper layer and not electrically connected to the anode and the cathode;
Disposed on an upper surface of said upper layer, together with the anodically electrically connected via the first electrode via is an anode electrically connected to the light-emitting diode when said first small light emitting diodes are mounted A first electrode;
Disposed on an upper surface of the upper layer is electrically connected to the first intermediate electrode through the second electrode via an electrically the anode of the light-emitting diode when said second small-sized light emitting diodes are mounted A second electrode connected to
Disposed on an upper surface of the upper layer is electrically connected with the second intermediate electrode through the third electrode via an electrical and an anode of the light-emitting diode when said third small light-emitting diodes are mounted A third electrode connected to
A first electrode disposed on the upper surface of the upper layer and electrically connected to the anode via a fourth electrode via and electrically connected to the anode of the light emitting diode when the large light emitting diode is mounted. 4 electrodes,
It is disposed on the upper surface of the upper layer, and is electrically connected to the first intermediate electrode via a fifth electrode via, and is electrically connected to the cathode of the light emitting diode when the first small light emitting diode is mounted. A fifth electrode connected to
It is disposed on the upper surface of the upper layer, and is electrically connected to the second intermediate electrode via a sixth electrode via . When the second small light emitting diode is mounted, it is electrically connected to the cathode of the light emitting diode. A sixth electrode connected to
It is disposed on the upper surface of the upper layer and is electrically connected to the cathode through a via for a seventh electrode . When the third small light emitting diode or the large light emitting diode is mounted, the cathode of the light emitting diode A light-emitting diode mounting board comprising: a seventh electrode electrically connected. In the light emitting diode mounting substrate according to claim 5 ,
On the upper surface of the upper layer, the junction region of the large light emitting diode is set so as to partially overlap any of the fifth electrode region , the sixth electrode region, and the seventh electrode region ,
The edge of the region of the fifth electrode has a portion along a part of the edge of the junction region of the first small light emitting diode and a portion along a part of the edge of the junction region of the large light emitting diode ,
The edge of the region of the sixth electrode has a portion along a part of the edge of the junction region of the second small light emitting diode and a portion along a part of the edge of the junction region of the large light emitting diode ,
The edge of the region of the seventh electrode has a portion along a part of the edge of the junction region of the third small light emitting diode and a portion along a part of the edge of the junction region of the large light emitting diode . A substrate for mounting a light-emitting diode characterized by the above.

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