JP6048634B2 - Welding method and welded structure - Google Patents
Welding method and welded structure Download PDFInfo
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Description
本発明は、溶接方法及び溶接構造に関するものである。 The present invention relates to a welding method and a welded structure.
金属部品同士を固定する手法として、広くスポット溶接が用いられている（例えば、特許文献１参照）。このスポット溶接を行う際に、金属部品同士の必要な精度を確保するために、クランプ等の仮保持手段により、あるいは人手によって、金属部品同士を確実に位置決めする必要がある（例えば、特許文献２参照）。 Spot welding is widely used as a technique for fixing metal parts to each other (for example, see Patent Document 1). When performing this spot welding, in order to ensure the required accuracy of metal parts, it is necessary to position metal parts reliably by temporary holding means such as a clamp or manually (for example, Patent Document 2). reference).
さて、金属部品同士をスポット溶接するためには、溶接に係る金属部品間に通電を行う必要がある。特許文献１記載の発明は、溶接に係る金属部品間に絶縁物が介在している場合に、主電極と主電極近傍に配置された副電極とによって、各金属部品に独立して電流を流す。その結果、各金属部品に生じるジュール熱により、金属部品間の絶縁物を溶融させて、金属部品同士を接触させ、溶接に係る金属部品間の通電を確保するものである。しかしながら、主電極と副電極とを用いることによる、溶接装置の複雑化を来たすものである。
一方、特許文献２記載の発明は、スポット溶接用仮止め接着剤組成物に関するものであり、合成樹脂接着剤基体に金属粉末を混入することで導電機能を与え、スポット溶接に必要な溶接に係る金属部品同士の、導通を確保することを目的としたものである。
Now, in order to spot weld metal parts, it is necessary to conduct electricity between the metal parts involved in welding. In the invention described in Patent Document 1, when an insulator is interposed between metal parts related to welding, current flows independently to each metal part by the main electrode and the sub-electrode disposed in the vicinity of the main electrode. . As a result, the insulator between the metal parts is melted by Joule heat generated in each metal part, the metal parts are brought into contact with each other, and energization between the metal parts related to welding is ensured. However, the use of the main electrode and the sub electrode complicates the welding apparatus.
On the other hand, the invention described in Patent Document 2 relates to a temporary fixing adhesive composition for spot welding and relates to welding necessary for spot welding by providing a conductive function by mixing metal powder into a synthetic resin adhesive substrate. The purpose is to ensure conduction between metal parts.
なお、金属部品同士を仮保持するためには、一般的には仮保持治具が用いられるが、この場合には、仮保持治具の設置場所を溶接工程内に確保する必要があり、工程の設置面積がその分だけ大きくなるといったスペース効率の問題が生じる。又、仮保持治具によって保持された金属部品は、その仮保持治具を設置した工程内で溶接を完了する必要があるといった、製造上の制約も受けるものである。
本発明は、金属部品同士の仮保持と溶接とを、設備の肥大化を生じることなく実現することを目的とするものである。
In order to temporarily hold metal parts together, a temporary holding jig is generally used. In this case, it is necessary to secure the installation location of the temporary holding jig in the welding process. The problem of space efficiency arises that the installation area becomes larger by that amount. In addition, the metal part held by the temporary holding jig is also subject to manufacturing restrictions such that it is necessary to complete welding within the process in which the temporary holding jig is installed.
An object of this invention is to implement | achieve temporary holding and welding of metal components, without producing the enlargement of an installation.
（発明の態様）
以下の発明の態様は、本発明の構成を例示するものであり、本発明の多様な構成の理解を容易にするために、項別けして説明するものである。各項は、本発明の技術的範囲を限定するものではなく、発明を実施するための最良の形態を参酌しつつ、各項の構成要素の一部を置換し、削除し、又は、更に他の構成要素を付加したものについても、本願発明の技術的範囲に含まれ得るものである。
(Aspect of the Invention)
The following aspects of the present invention exemplify the configuration of the present invention, and will be described separately for easy understanding of various configurations of the present invention. Each section does not limit the technical scope of the present invention, and some of the components of each section are replaced, deleted, or further while referring to the best mode for carrying out the invention. Those to which the above components are added can also be included in the technical scope of the present invention.
（１）親部品と子部品とを溶接する方法であって、親部品と子部品との接触面の一部の範囲に接着剤を塗布して親部品と子部品とを仮固定する接着工程を含む溶接方法。
本項に記載の溶接方法は、親部品と子部品との接触面の一部の範囲に接着剤を塗布して親部品と子部品とを接着することで、親部品と子部品との位置決めを正確に行った状態で、両者を仮固定するものである。親部品と子部品とを接着する際の位置決めには、適宜、位置決め治具を用いる。又、ここで用いられる接着剤は、例えば、ホットメルト接着剤、熱可塑性接着剤、シーラー材、アスファルト等の高粘度の液体又はペースト、天然ゴム等の粘着材、半田等の低温溶融合金が挙げられる。更に、これらの接着剤に、適宜、導電フィラーを混入させることとしても良い。
なお、本説明において、「親部品」、「子部品」とは、説明の便宜上、部品を区別したものであって、一例として、自動車用パネルとその付属部品とが挙げられるが、必ずしも親部品と子部品とに、大小関係や主従関係があるものではない。
(1) A method of welding a parent part and a child part, wherein an adhesive is applied to a part of a contact surface between the parent part and the child part to temporarily fix the parent part and the child part. Including welding method.
The welding method described in this section applies the adhesive to a part of the contact surface between the parent part and the child part to bond the parent part and the child part, thereby positioning the parent part and the child part. Both are temporarily fixed in a state where the above is performed accurately. A positioning jig is appropriately used for positioning when bonding the parent part and the child part. Examples of the adhesive used here include hot-melt adhesives, thermoplastic adhesives, sealers, asphalt and other highly viscous liquids or pastes, natural rubber and other adhesives, and solder and other low-temperature melting alloys. It is done. Furthermore, a conductive filler may be appropriately mixed with these adhesives.
In this description, “parent part” and “child part” are parts for convenience of explanation, and examples include an automotive panel and its accessory parts. There is no size or master-slave relationship between the child parts.
（２）上記（１）項において、前記接着剤を塗布した範囲を外した位置において、親部品と子部品との間の導通を確保する導通経路形成工程を含む溶接方法。
本項に記載の溶接方法は、親部品と子部品との接触面の、接着剤を塗布した範囲を外した位置において、親部品と子部品との導通経路を形成することで、親部品と子部品との間の導通を確保するものである。
(2) A welding method including a conduction path forming step of ensuring conduction between a parent part and a child part at a position outside the range where the adhesive is applied in the above item (1).
The welding method described in this section forms a conduction path between the parent part and the child part at a position outside the area where the adhesive is applied on the contact surface between the parent part and the child part. This ensures electrical connection with the child parts.
（３）上記（２）項において、前記接着工程にて接着剤を塗布した部分をスポット溶接する溶接工程を含む溶接方法（請求項１）。
本項に記載の溶接方法は、スポット溶接機の電極を親部品と子部品と当接させて、導通経路を介して親部品と子部品とに電流を流し、親部品と子部品とに生じるジュール熱により、接着剤を加熱、溶融させる。そして、接着剤を塗布した範囲から接着剤を排除し、親部品と子部品とを接触可能とするものである。そして、接着剤を塗布した部分をスポット溶接することで、親部品と子部品とを固定するものである。
(3) A welding method according to item (2), including a welding step of spot welding the portion to which the adhesive has been applied in the bonding step (claim 1).
In the welding method described in this section, the electrode of the spot welder is brought into contact with the parent part and the child part, and a current is caused to flow between the parent part and the child part through the conduction path, and the current occurs in the parent part and the child part. The adhesive is heated and melted by Joule heat. Then, the adhesive is excluded from the range where the adhesive is applied, and the parent part and the child part can be brought into contact with each other. Then, the parent part and the child part are fixed by spot welding the portion where the adhesive is applied.
（４）上記（３）項の溶接工程において、前記接着剤を塗布した部分をスポット溶接機の電極で挟持し、前記接着剤を塗布した範囲の周辺部に前記接着剤を押し退け、親部品と子部品とを接触させる溶接方法（請求項２）。
本項に記載の溶接方法は、溶接工程において、接着剤を塗布した部分をスポット溶接機の電極で挟持する。そして、導通経路を介して親部品と子部品とに電流を流し、親部品と子部品とに生じるジュール熱により、接着剤を加熱、溶融させる。すると、スポット溶接機の電極からの加圧力により、接着剤を、スポット溶接機の電極の接触点から排除され、接着剤を塗布した部分の周辺部へと広がる。そして、接着剤が排除された位置で、親部品と子部品とを接触させ、スポット溶接するものである。
(4) In the welding step of (3) above, the part to which the adhesive is applied is sandwiched between the electrodes of a spot welder, and the adhesive is pushed out to the periphery of the area where the adhesive is applied, A welding method for contacting a child part (claim 2).
In the welding method described in this section, the portion where the adhesive is applied is sandwiched between the electrodes of the spot welder in the welding process. Then, current is passed through the parent part and the child part via the conduction path, and the adhesive is heated and melted by Joule heat generated in the parent part and the child part. Then, due to the pressure applied from the electrode of the spot welder, the adhesive is removed from the contact point of the electrode of the spot welder and spreads to the periphery of the portion where the adhesive is applied. Then, at the position where the adhesive is removed, the parent part and the child part are brought into contact and spot welding is performed.
（５）上記（１）から（４）項の導通経路形成工程において、親部品と子部品とをスポット溶接する溶接方法（請求項３）。
本項に記載の溶接方法は、導通経路形成工程において、親部品と子部品とをスポット溶接して生成されるナゲットを、親部品と子部品との導通経路として用いるものである。
(5) A welding method in which the parent part and the child part are spot-welded in the conduction path forming step of (1) to (4) above (claim 3).
The welding method described in this section uses a nugget generated by spot welding a parent part and a child part as a conduction path between the parent part and the child part in the conduction path forming step.
（６）上記（５）項の導通経路形成工程にて行うスポット溶接と、前記溶接工程にて行うスポット溶接とを、異なる溶接条件で行う溶接方法（請求項４）。
本項に記載の溶接方法は、導通経路形成工程にて行うスポット溶接と、前記溶接工程にて行うスポット溶接とを、各々、最適の溶接条件で行うものである。例えば、導通経路形成工程では、スポット溶接機の電極による加圧力、電流、通電時間等の溶接条件を、ナゲット生成に最適の条件に調整するものである。一方、溶接工程では、接着剤を溶融させるまでは、ナゲット生成に不適切な低い電流に抑えて導通を行い、接着剤が排除された後にナゲット生成に最適の電流へと高める。この際、スポット溶接機の電極による加圧力、通電時間等についても、適宜変化を与えることとする。これにより、溶接部の不適切な溶着、スパッタを抑える。なお、接着剤の溶融及びナゲット生成のいずれにも適する溶接条件を見出して、溶接工程における接着剤の溶融とスポット溶接とを行うこととしても良い。
更には、溶接工程において、電流の変位量を監視し、又は、親部品、子部品間の抵抗値等をスポット溶接機の電極に微弱電流を流すことによって監視し、接着剤の溶融や、親部品と子部品との接触等、状態の変化を把握して、それに基づき溶接条件を変更して、スポット溶接を行うこととしてもよい。
(6) A welding method in which spot welding performed in the conduction path forming step of the above item (5) and spot welding performed in the welding step are performed under different welding conditions (claim 4).
In the welding method described in this section, spot welding performed in the conduction path forming step and spot welding performed in the welding step are each performed under optimum welding conditions. For example, in the conduction path forming step, the welding conditions such as the pressurizing force, current, and energizing time by the electrodes of the spot welder are adjusted to the optimum conditions for nugget generation. On the other hand, in the welding process, until the adhesive is melted, conduction is performed with a low current inappropriate for nugget generation, and after the adhesive is removed, the current is increased to an optimum current for nugget generation. At this time, the pressure applied by the electrodes of the spot welder, the energization time, and the like are appropriately changed. This suppresses inappropriate welding and spattering of the weld. It is also possible to find welding conditions suitable for both melting of the adhesive and nugget generation, and performing melting of the adhesive and spot welding in the welding process.
Furthermore, in the welding process, the amount of displacement of the current is monitored, or the resistance value between the parent part and the child part is monitored by passing a weak current through the electrode of the spot welder to melt the adhesive, Spot welding may be performed by grasping a change in state such as contact between a component and a child component, and changing welding conditions based on the change.
（７）上記（１）から（４）項の導通経路形成工程において、親部品と子部品とに予め又は本工程において形成した、互いの接触を促す形状部分で、親部品と子部品とを接触させる溶接方法。
本項に記載に記載の溶接方法は、突形状等の、互いの接触を促す形状部分を、親部品及び子部品の少なくとも一方に、予めプレス成形により、又は、本工程においてポンチ等により形成する。そして、当該形状部分により得られる親部品と子部品との接触部分を、親部品と子部品との導通経路として用いるものである。
（８）上記（１）から（４）項の導通経路形成工程において、親部品と子部品とをクランプにより密着させる溶接方法。
本項に記載に記載の溶接方法は、クリップ、万力等のクランプにより、親部品と子部品とを挟持することで得られる親部品と子部品との接触部分を、親部品と子部品との導通経路として用いるものである。
（９）上記（１）から（４）項の導通経路形成工程において、親部品と子部品とを締結部材により密着させる溶接方法。
本項に記載に記載の溶接方法は、ボルト、ナット等の締結部材により、親部品と子部品とを締結することで得られる親部品と子部品との接触部分を、親部品と子部品との導通経路として用いるものである。
(7) In the conduction path forming step of the above (1) to (4), the parent part and the child part are formed in the shape part that promotes mutual contact formed in advance in the parent part and the child part or in this step. Welding method to contact.
In the welding method described in this section, a shape portion that promotes mutual contact, such as a protruding shape, is formed on at least one of a parent part and a child part by press molding in advance or by a punch or the like in this step. . Then, the contact portion between the parent part and the child part obtained by the shape part is used as a conduction path between the parent part and the child part.
(8) A welding method in which the parent part and the child part are brought into close contact with each other in the conduction path forming step according to the above items (1) to (4).
In the welding method described in this section, the contact part between the parent part and the child part obtained by sandwiching the parent part and the child part with a clamp such as a clip or a vise, This is used as a conduction path.
(9) A welding method in which the parent part and the child part are brought into close contact with the fastening member in the conduction path forming step of (1) to (4) above.
In the welding method described in this section, the contact part between the parent part and the child part obtained by fastening the parent part and the child part with a fastening member such as a bolt or a nut is divided into the parent part and the child part. This is used as a conduction path.
（１０）上記（１）から（９）項の接着工程に先立ち、親部品及び子部品の少なくとも一方の温度を、接着剤の接着力が向上する温度に調整する、温度調整工程を含む溶接方法。
本項に記載に記載の溶接方法は、親部品及び子部品の少なくとも一方の温度を、接着剤の接着力が向上する温度に調整してから接着剤を塗布し、親部品と子部品とを密着させる。それにより、親部品と子部品との接着強度を高めるものである。
例えば、接着剤にホットメルトを用いる場合には、親部品と子部品との接触面の、接着剤を塗布する範囲とその周辺部とを、雰囲気温度以上、３００度以下の範囲に加温することで、ホットメルトの接着強度を十分に引き出すものである。
なお、親部品と子部品とを密着させた後に、適宜、自然冷却又は強制冷却により、接着剤を融点以下に冷却し、後工程へと移行することとする。
(10) A welding method including a temperature adjustment step, wherein the temperature of at least one of the parent part and the child part is adjusted to a temperature at which the adhesive force of the adhesive is improved prior to the bonding step of (1) to (9) above. .
In the welding method described in this section, the temperature of at least one of the parent part and the child part is adjusted to a temperature at which the adhesive strength of the adhesive is improved, and then the adhesive is applied. Adhere closely. Thereby, the adhesive strength between the parent part and the child part is increased.
For example, when a hot melt is used for the adhesive, the area where the adhesive is applied and the peripheral part of the contact surface between the parent part and the child part are heated to a range of the ambient temperature to 300 ° C. In this way, the adhesive strength of the hot melt is sufficiently extracted.
Note that after the parent part and the child part are brought into close contact with each other, the adhesive is appropriately cooled to a melting point or lower by natural cooling or forced cooling, and the process proceeds to a subsequent process.
（１１）親部品と子部品との溶接構造であって、親部品と子部品との接触面に、親部品と子部品とを仮固定する接着剤塗布部と、導通部と、スポット溶接部とを含み、前記接着剤塗布部は、親部品と子部品との接触面の一部の範囲に設けられ、前記導通部は、前記接着剤塗布部を外れた位置に設けられ、前記スポット溶接部は、前記接着剤塗布部内に形成されている溶接構造（請求項５）。 (11) A welding structure of a parent part and a child part, wherein an adhesive application part for temporarily fixing the parent part and the child part to a contact surface between the parent part and the child part, a conduction part, and a spot welding part The adhesive application part is provided in a range of a part of the contact surface between the parent part and the child part, the conduction part is provided at a position away from the adhesive application part, and the spot welding parts are welded structures are made form the adhesive coated portion (claim 5).
本項に記載の溶接構造は、親部品と子部品との接触面の一部の範囲に接着剤が塗布されて、仮固定されることで、溶接前の状態で、親部品と子部品との位置決めが正確に行われる。ここで用いられる接着剤は、例えば、ホットメルト接着剤、熱可塑性接着剤、シーラー材やアスファルト等の高粘度の液体又はペースト、天然ゴム等の粘着材、半田等の低温溶融合金が挙げられる。更に、これらの接着剤に、適宜、導電フィラーが混入されていても良い。
又、親部品と子部品との接触面の、接着剤を塗布した範囲を外した位置において、親部品と子部品との導通部が設けられることで、親部品と子部品との間の導通経路が確保されるものである。
そして、スポット溶接機の電極で接着剤を塗布した部分を挟持し、導通経路を介して親部品と子部品とに電流を流すことで、親部品と子部品とに部品に生じるジュール熱により、接着剤が加熱、溶融する。するとスポット溶接機の電極からの圧力により、接着剤は、接着剤塗布部からその周辺部に押し出され、親部品と子部品とが接触し、接着剤塗布部内にスポット溶接部が形成される。なお、スポット溶接時に溶融した接着剤は、スポット溶接により生成されるナゲットと共に冷却され、ナゲットの周囲を取囲む態様で固化した状態となる。
In the welded structure described in this section, the adhesive is applied to a partial area of the contact surface between the parent part and the child part and temporarily fixed, so that the parent part and the child part are in a state before welding. Is accurately positioned. Examples of the adhesive used here include hot melt adhesives, thermoplastic adhesives, high-viscosity liquids or pastes such as sealers and asphalts, adhesives such as natural rubber, and low-temperature melting alloys such as solder. Furthermore, a conductive filler may be appropriately mixed in these adhesives.
In addition, a conduction part between the parent part and the child part is provided at the position where the contact surface between the parent part and the child part is removed from the area where the adhesive is applied. A route is ensured.
And, by sandwiching the part where the adhesive is applied with the electrode of the spot welder, by passing a current to the parent part and the child part through the conduction path, Joule heat generated in the part to the parent part and the child part, The adhesive is heated and melted. Then, due to the pressure from the electrode of the spot welder, the adhesive is pushed out from the adhesive application part to the peripheral part thereof, the parent part and the child part come into contact, and a spot weld part is formed in the adhesive application part. In addition, the adhesive melted at the time of spot welding is cooled together with the nugget generated by spot welding, and is in a solidified state surrounding the periphery of the nugget.
（１２）上記（１１）項において、前記導通部は、前記スポット溶接部とは別の、親部品と子部品とのスポット溶接部により形成されている溶接構造（請求項６）。
本項に記載の溶接構造は、接着剤塗布部内に形成されたスポット溶接部とは別に、親部品と子部品とをスポット溶接して形成されたナゲットが、親部品と子部品との導通経路（導通部）としても機能するものである。
(12) In the above item (11), the conduction portion is a welded structure formed by a spot welded portion of a parent part and a child part, which is different from the spot welded part (claim 6).
In the welding structure described in this section, the nugget formed by spot welding the parent part and the child part separately from the spot welding part formed in the adhesive application part is a conduction path between the parent part and the child part. It also functions as a (conduction part) .
本発明はこのように構成したので、金属部品同士の仮保持と溶接とが、設備の肥大化を生じることなく実現されるものである。 Since this invention was comprised in this way, the temporary holding | maintenance and welding of metal components are implement | achieved, without producing the enlargement of an installation.
以下、本発明を実施するための最良の形態を添付図に基づいて説明する。
本発明は、図１、図２に示されるように、親部品１２と子部品１４とを溶接する際に、親部品１２と子部品１４との接触面の一部の範囲に接着剤１６を塗布して親部品１２と子部品１４とを固定する接着工程と、接着剤１６を塗布した範囲を外した位置において、親部品１２と子部品１４との間の導通を確保する導通経路形成工程と、接着工程にて接着剤１６を塗布した部分をスポット溶接し、ナゲット１８を生成する溶接工程とを含むものである。
又、必要に応じ、接着工程に先立ち、親部品１２及び子部品１４の少なくとも一方の温度を、接着剤１６の接着力が向上する温度に調整する温度調整工程を含むものである。
The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.
In the present invention, as shown in FIGS. 1 and 2, when the parent part 12 and the child part 14 are welded, the adhesive 16 is applied to a part of the contact surface between the parent part 12 and the child part 14. A bonding process for applying and fixing the parent part 12 and the child part 14 and a conduction path forming process for ensuring conduction between the parent part 12 and the child part 14 at a position outside the range where the adhesive 16 is applied. And a welding step of spot welding the portion where the adhesive 16 is applied in the bonding step to generate the nugget 18.
In addition, if necessary, a temperature adjusting step of adjusting the temperature of at least one of the parent component 12 and the child component 14 to a temperature at which the adhesive force of the adhesive 16 is improved is included prior to the bonding step.
より具体的には、次の手順の通りである。
＜接着工程＞
接着工程では、接着剤１６にはホットメルト接着剤が用いられ、図２（ａ）に示されるように、塗布ガン２２が用いられる。そして、図示の例では、子部品１４側の、親部品１２との接触面の一部に、接着剤１６を塗布し、適宜、位置決め治具を用いて、親部品１２に対し正確に位置決めを行いつつ、親部品１２に子部品１４を載置する。そして、図２（ｂ）に示されるように、接着剤１６が固化して親部品１２と子部品１４とが、接着固定される。なお、図２（ｂ）には、後述の溶接工程においてスポット溶接により生成されるナゲット１８が、模式的に示されている。
More specifically, the procedure is as follows.
<Adhesion process>
In the bonding step, a hot melt adhesive is used as the adhesive 16, and an application gun 22 is used as shown in FIG. In the illustrated example, the adhesive 16 is applied to a part of the contact surface with the parent component 12 on the child component 14 side, and the positioning with respect to the parent component 12 is appropriately performed using a positioning jig as appropriate. While performing, the child component 14 is placed on the parent component 12. Then, as shown in FIG. 2B, the adhesive 16 is solidified and the parent part 12 and the child part 14 are bonded and fixed. FIG. 2B schematically shows a nugget 18 generated by spot welding in a welding process described later.
＜導通経路形成工程＞
導通経路形成工程では、図１（ａ）に示されるように、接着剤１６によって固定された親部品１２及び子部品１４の、接着剤１６を塗布した範囲を外した位置を、スポット溶接機の電極２４で挟持し、ナゲット２０を生成するものである。「接着剤１６を塗布した範囲を外した位置」は、接着剤１６を塗布した範囲の近傍で、親部品１２と子部品１４との導通経路に適した位置であれば良い。
<Conduction path formation process>
In the conduction path forming step, as shown in FIG. 1 (a), the positions of the parent part 12 and the child part 14 fixed by the adhesive 16 are removed from the range where the adhesive 16 is applied. The nugget 20 is generated by being sandwiched between the electrodes 24. The “position excluding the range where the adhesive 16 is applied” may be a position suitable for the conduction path between the parent component 12 and the child component 14 in the vicinity of the range where the adhesive 16 is applied.
なお、本工程では、図示の如くナゲット２０を親部品１２と子部品１４との導通経路としているが、これに限定されるものではない。例えば、突形状等、親部品１２と子部品１４と互いの接触を促す形状部分を、親部品１２又は子部品１４の少なくとも一方に、予めプレス成形により形成し、又は、本工程において、ポンチ等により互いの接触を促す形状部分を形成する。そして、この形状部分により得られる親部品１２と子部品１４との接触部分を、親部品１２と子部品１４との導通経路として用いることとしても良い。
又、クリップ、万力等のクランプにより、親部品１２と子部品１４とを挟持し、それによって得られる親部品１２と子部品１４との接触部分を、親部品１２と子部品１４との導通経路として用いることとしても良い。
更に、ボルト、ナット等の締結部材により親部品１２と子部品１４とを締結することで得られる、親部品１２と子部１４品との接触部分を、親部品１２と子部品１４との導通経路として用いることも可能である。
In this step, the nugget 20 is used as a conduction path between the parent part 12 and the child part 14 as shown in the figure, but the present invention is not limited to this. For example, a projecting shape or the like, a shape portion that promotes mutual contact between the parent part 12 and the child part 14 is formed in advance on at least one of the parent part 12 or the child part 14 or a punch or the like in this step. To form a shape portion that facilitates mutual contact. Then, the contact portion between the parent part 12 and the child part 14 obtained by this shape part may be used as a conduction path between the parent part 12 and the child part 14.
Further, the parent part 12 and the child part 14 are clamped by a clamp such as a clip or a vise, and the contact portion between the parent part 12 and the child part 14 obtained thereby is connected to the parent part 12 and the child part 14. It may be used as a route.
Furthermore, a contact portion between the parent part 12 and the child part 14 obtained by fastening the parent part 12 and the child part 14 with a fastening member such as a bolt or a nut is connected to the parent part 12 and the child part 14. It can also be used as a route.
＜溶接工程＞
溶接工程では、図１（ｂ）に示されるように、接着剤１６を塗布した部分をスポット溶接機の電極２４で挟持し、加圧力Ｐを付与して、接着剤１６を塗布した部分を加圧する。そして、図１（ｃ）に示されるように、スポット溶接機の電極２４による通電を行う。このとき、ナゲット２０を介して親部品１２と子部１４品とに電流Ｉが流れ、それにより親部品１２と子部品１４とに生じるジュール熱により、スポット溶接機の電極２４との接触部分が発熱部２６となる。すると、発熱部２６の接着剤１６が加熱、溶融され、スポット溶接機の電極２４からの加圧力Ｐを受けて、当初接着剤１６を塗布した範囲の周囲に接着剤１６が排除される。そして、図１（ｄ）に示されるように、親部品１２と子部品１４との接触部位２８が形成される。その結果、図１（ｅ）に示されるように、接触部位２８にはナゲット１８が生成される。
<Welding process>
In the welding process, as shown in FIG. 1 (b), the portion to which the adhesive 16 has been applied is sandwiched between the electrodes 24 of the spot welder, a pressure P is applied, and the portion to which the adhesive 16 has been applied is applied. Press. And as FIG.1 (c) shows, electricity supply with the electrode 24 of a spot welder is performed. At this time, a current I flows through the nugget 20 to the parent part 12 and the child part 14, thereby causing Joule heat generated in the parent part 12 and the child part 14 to cause a contact portion with the electrode 24 of the spot welder to It becomes the heat generating part 26. Then, the adhesive 16 of the heat generating portion 26 is heated and melted, receives the pressure P from the electrode 24 of the spot welder, and the adhesive 16 is excluded around the area where the initial adhesive 16 is applied. Then, as shown in FIG. 1D, a contact portion 28 between the parent part 12 and the child part 14 is formed. As a result, as shown in FIG. 1E, the nugget 18 is generated at the contact portion 28.
そして、ナゲット１８が、図１（ｆ）に示されるように成長し、接着剤塗布部内に形成されたナゲット１８により、親部品１２と子部品１４とが、確実に固定される。よって、親部品１２と子部品１４とは、図２（ｃ）にも示されるように、二つのナゲット１８、２０によって結合された製品１０となる。なお、当初接着剤１６を塗布した範囲から排除された接着剤１６は、ナゲット１８の周囲を取囲む態様で、ナゲット１８と共に冷却され固化する。 Then, the nugget 18 grows as shown in FIG. 1 (f), and the parent part 12 and the child part 14 are securely fixed by the nugget 18 formed in the adhesive application portion. Therefore, the parent part 12 and the child part 14 become the product 10 joined by the two nuggets 18 and 20, as shown in FIG. In addition, the adhesive 16 excluded from the range where the adhesive 16 was initially applied is cooled and solidified together with the nugget 18 so as to surround the nugget 18.
又、適宜、導通経路形成工程にて行うスポット溶接と、溶接工程にて行うスポット溶接とを、異なる溶接条件で行うこととする。例えば、導通経路形成工程では、スポット溶接機の電極２４による加圧力Ｐ、電流Ｉ、通電時間等の溶接条件を、ナゲット２０の生成に最適の条件にてスポット溶接を行うものである。一方、溶接工程では、接着剤１６を溶融させるまではナゲット１８の生成には不適切な低い電流Ｉａに抑えて導通を行い（図１（ｃ））、接着剤１６が押し退けられた後に、ナゲット１８の生成に最適の電流Ｉｂ（図１（ｅ））へと電流値を高める。この際、適宜、スポット溶接機の電極２４による加圧力Ｐ、通電時間等についても、変化を与えることとする。このような、溶接条件の制御を行うことで、溶接部の不適切な溶着、スパッタを抑えることができる。 In addition, the spot welding performed in the conduction path forming step and the spot welding performed in the welding step are appropriately performed under different welding conditions. For example, in the conduction path forming step, spot welding is performed under the optimum conditions for generating the nugget 20 such as the welding pressure P, the current I, and the energization time by the electrode 24 of the spot welder. On the other hand, in the welding process, until the adhesive 16 is melted, conduction is performed while suppressing the current Ia inappropriate for generation of the nugget 18 (FIG. 1 (c)), and the nugget is pushed away. The current value is increased to the current Ib (FIG. 1 (e)) that is optimal for the generation of. At this time, the pressure P applied by the electrode 24 of the spot welder, the energization time, and the like are appropriately changed. By controlling the welding conditions as described above, inappropriate welding and spatter of the welded portion can be suppressed.
＜温度調整工程＞
必要に応じて、接着工程に先立ち行われる温度調整工程では、図３（ａ）に示されるように、例えば耐熱性容器３０に子部品１４を収容し、ヒータや加熱炉等の加温装置３２によって熱Ｈを与えて、少なくとも親部品１２との接触面１４ａを加熱する。又、図３（ｂ）に示されるように、親部品１２についても、少なくとも子部品１４との接触面１２ａを、加温装置３２によって熱Ｈを与えて加熱する。接着剤１６にホットメルトを用いる場合には、親部品１２と子部品１４との接触面１２ａ、１４ａの接着剤１６を塗布する範囲とその周辺部とを、雰囲気温度以上、３００度以下の範囲に加温することで、ホットメルトの接合強度を十分に引き出すことができる。
<Temperature adjustment process>
If necessary, in the temperature adjustment step performed prior to the bonding step, as shown in FIG. 3A, for example, the child component 14 is accommodated in a heat-resistant container 30, and a heating device 32 such as a heater or a heating furnace. Heat H is applied to heat at least the contact surface 14a with the parent part 12. Further, as shown in FIG. 3B, at least the contact surface 12 a with the child component 14 is also heated by the heating device 32 with respect to the parent component 12. When hot melt is used for the adhesive 16, the range in which the adhesive 16 on the contact surfaces 12 a, 14 a between the parent part 12 and the child part 14 is applied and the periphery thereof are in the range of the ambient temperature to 300 ° C. By heating to high, the bonding strength of the hot melt can be sufficiently extracted.
そして、接着剤１６の接着力が向上する温度に調整してから、図３（ｃ）の例では子部品１４に接着剤１６を塗布し、親部品１２と子部品１４とを密着させることで、親部品１２と子部品１４とを接着するものである。
更に、図３（ｄ）に示されるように、親部品１２と子部品１４とを密着させた後に、適宜、自然冷却又は冷風機等の強制冷却手段により冷風Ｃを当てて、親部品１２、子部品１４と共に接着剤１６を融点以下に冷却し、前述の導通経路形成工程へと移行するものである。
And after adjusting to the temperature which the adhesive force of the adhesive agent 16 improves, in the example of FIG.3 (c), by apply | coating the adhesive agent 16 to the subcomponent 14, and making the parent component 12 and the subcomponent 14 contact | adhere, The parent part 12 and the child part 14 are bonded together.
Further, as shown in FIG. 3D, after the parent part 12 and the child part 14 are brought into close contact with each other, the cold air C is appropriately applied by forced cooling means such as natural cooling or a cold air machine, The adhesive 16 is cooled to the melting point or lower together with the child component 14, and the process proceeds to the above-described conduction path forming step.
さて、上記構成をなす、本発明の実施の形態によれば、次のような作用効果を得ることが可能である。
まず、接着工程では、親部品１２と子部品１４との接触面の一部の範囲に接着剤１６を塗布して、親部品１２と子部品１４とを固定することで、親部品１２と子部品１４との位置決めを正確に行った状態で、両者を仮固定することができる。従って、従来の如く、仮保持治具が用いる場合のように、仮保持治具の設置場所を溶接工程内に確保する必要性から、工程の設置面積がその分だけ大きくなるといったスペース効率の問題や、仮保持治具を設置した工程内で溶接を完了する必要があるといった、製造上の制約を受けることがなくなる。
Now, according to the embodiment of the present invention configured as described above, the following operational effects can be obtained.
First, in the bonding step, the adhesive 16 is applied to a part of the contact surface between the parent part 12 and the child part 14, and the parent part 12 and the child part 14 are fixed. Both can be temporarily fixed in a state where the positioning with the component 14 is accurately performed. Therefore, as in the case where a temporary holding jig is used as in the prior art, it is necessary to secure a place for installing the temporary holding jig in the welding process, so that the process installation area is increased accordingly. In addition, it is no longer subject to manufacturing restrictions such as the need to complete welding within the process where the temporary holding jig is installed.
又、導通経路形成工程では、親部品１２と子部品１４との接触面の、接着剤１６を塗布した範囲を外した位置において、親部品１２と子部品１４との導通経路（ナゲット２０）を形成することで、親部品１２と子部品１４との間の導通を確保することができる。
更に、溶接工程において、スポット溶接機の電極２４を親部品１２と子部品１４とに当接させて、この導通経路を介して親部品１２と子部品１４とに電流Ｉを流す。そして、親部品１２と子部品１４とに生じるジュール熱により、接着剤１６を加熱、溶融させることで、接着剤１６を塗布した範囲から接着剤１６を排除し、親部品１２と子部品１４とを接触させるものである。そして、接着剤１６を塗布した部分をスポット溶接することで、親部品１２と子部品１４とを固定するものである。
In the conduction path forming step, the conduction path (nugget 20) between the parent part 12 and the child part 14 is formed at a position on the contact surface between the parent part 12 and the child part 14 outside the range where the adhesive 16 is applied. By forming, electrical connection between the parent part 12 and the child part 14 can be ensured.
Further, in the welding process, the electrode 24 of the spot welder is brought into contact with the parent part 12 and the child part 14, and a current I is passed through the parent part 12 and the child part 14 through this conduction path. Then, the adhesive 16 is heated and melted by Joule heat generated in the parent part 12 and the child part 14, thereby removing the adhesive 16 from the range where the adhesive 16 is applied. Are brought into contact with each other. And the parent component 12 and the child component 14 are fixed by spot welding the part which apply | coated the adhesive agent 16. FIG.
なお、本発明の実施の形態では、導通経路形成工程において、親部品１２と子部品１４とをスポット溶接しているが、この工程は必ずしもスポット溶接である必要はなく、アーク溶接等、他の溶接方法を適宜採用することが可能である。又、親部品１２と子部品１４とに形成した、互いの接触を促す形状部分を接触させる手法、親部品１２と子部品１４とをクランプにより密着させる手法、親部品１２と子部品１４とを、ボルト、ナット等の締結部材により密着させる手法も採用可能である。 In the embodiment of the present invention, the parent part 12 and the child part 14 are spot welded in the conduction path forming step. However, this step is not necessarily spot welding, and other processes such as arc welding are used. It is possible to adopt a welding method as appropriate. In addition, a method of bringing the parent parts 12 and the child parts 14 into contact with each other, and a method of bringing the parent parts 12 and the child parts 14 into close contact with each other, a method of bringing the parent parts 12 and the child parts 14 into contact, It is also possible to employ a method of closely contacting with a fastening member such as a bolt or a nut.
又、溶接工程において、接着剤１２を塗布した部分をスポット溶接機の電極２４で挟持し、接着剤１６をその周辺部に押し出すことで、親部品１２と子部品１４とを接触させることができる。この際、導通経路（ナゲット２０）を介して親部品１２と子部品１４とに電流Ｉを流し、親部品１２と子部品１４とに生じるジュール熱により、接着剤１６を加熱、溶融させる。そして、スポット溶接機の電極２４からの加圧力Ｐにより、スポット溶接機の電極２４の接触点から周辺部へと、接着剤１６を円滑に押出すものである。そして、接着剤１６が排除された範囲で、親部品１２と子部品１４とを直接接触させ、スポット溶接することができる。 Further, in the welding process, the parent component 12 and the child component 14 can be brought into contact with each other by sandwiching the portion to which the adhesive 12 has been applied between the electrodes 24 of the spot welder and pushing the adhesive 16 to the periphery. . At this time, the current I is passed through the parent part 12 and the child part 14 through the conduction path (nugget 20), and the adhesive 16 is heated and melted by Joule heat generated in the parent part 12 and the child part 14. Then, the adhesive 16 is smoothly extruded from the contact point of the electrode 24 of the spot welder to the peripheral portion by the pressure P from the electrode 24 of the spot welder. And in the range from which the adhesive agent 16 was excluded, the parent component 12 and the child component 14 can be directly contacted, and spot welding can be performed.
又、導通経路形成工程にて行うスポット溶接と、前記溶接工程にて行うスポット溶接とを、各々、最適の条件で行うことで、各工程で良質のナゲット２０、１８を生成し、親部品１２と子部品１４とを確実に溶接することが可能となる。
特に、溶接工程において、電流Ｉの変位量を監視する。又は、親部品１２、子部品１４間の抵抗値等をスポット溶接機の電極に微弱電流を流すことによって監視する。そして、接着剤１６の溶融や、親部品１２と子部品１４との接触等、状態の変化を把握して、それに基づき溶接条件を変更しスポット溶接を行う。これにより、導通経路形成工程にて形成される導通経路の態様の如何に関わらず、良質のナゲット１８を生成し、親部品１２と子部品１４とを確実に溶接することが可能となる。
Further, by performing spot welding performed in the conduction path forming process and spot welding performed in the welding process under optimum conditions, high quality nuggets 20 and 18 are generated in each process, and the parent part 12 is generated. And the child component 14 can be reliably welded.
In particular, the displacement amount of the current I is monitored in the welding process. Alternatively, the resistance value between the parent part 12 and the child part 14 is monitored by passing a weak current through the electrode of the spot welder. Then, a change in state such as the melting of the adhesive 16 or the contact between the parent part 12 and the child part 14 is grasped, and the welding conditions are changed based on that to perform spot welding. As a result, regardless of the mode of the conduction path formed in the conduction path formation step, it is possible to generate a high-quality nugget 18 and reliably weld the parent part 12 and the child part 14.
１２：親部品、１４：子部品、１６：接着剤、 １８、２０：ナゲット、２２：塗布ガン、２４：スポット溶接機の電極 12: Parent part, 14: Child part, 16: Adhesive, 18, 20: Nugget, 22: Application gun, 24: Electrode of spot welder
Claims (6)
前記接着剤塗布部は、親部品と子部品との接触面の一部の範囲に設けられ、
前記導通部は、前記接着剤塗布部を外れた位置に設けられ、
前記スポット溶接部は、前記接着剤塗布部内に形成されていることを特徴とする溶接構造。 A welded structure between a parent part and a child part, including an adhesive application part that temporarily fixes the parent part and the child part on a contact surface between the parent part and the child part, a conduction part, and a spot welding part. ,
The adhesive application part is provided in a range of a part of the contact surface between the parent part and the child part,
The conduction part is provided at a position off the adhesive application part,
The spot welds, welded structure, characterized in that they are made form the adhesive coating section.
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