JP6025161B2 - Electronic component mounting optimization method and optimization program - Google Patents

Electronic component mounting optimization method and optimization program Download PDF

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JP6025161B2
JP6025161B2 JP2011283574A JP2011283574A JP6025161B2 JP 6025161 B2 JP6025161 B2 JP 6025161B2 JP 2011283574 A JP2011283574 A JP 2011283574A JP 2011283574 A JP2011283574 A JP 2011283574A JP 6025161 B2 JP6025161 B2 JP 6025161B2
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満早 塚本
満早 塚本
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • G06F7/785Arrangements for rearranging, permuting or selecting data according to predetermined rules, independently of the content of the data for changing the order of data flow, e.g. matrix transposition or LIFO buffers; Overflow or underflow handling therefor having a sequence of storage locations each being individually accessible for both enqueue and dequeue operations, e.g. using a RAM
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    • HELECTRICITY
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0495Mounting of components, e.g. of leadless components having a plurality of work-stations

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Description

本発明は、電子部品実装装置により電子部品をプリント基板に実装して実装基板を生産するときの電子部品の実装順序を最適化する電子部品実装の最適化方法及び最適化プログラムに関する。なお、本明細書では、電子部品実装装置のことを単に実装装置ともいい、電子部品のことを単に部品ともいう。   The present invention relates to an electronic component mounting optimization method and an optimization program for optimizing the mounting order of electronic components when an electronic component is mounted on a printed board by an electronic component mounting apparatus to produce a mounting board. In this specification, the electronic component mounting apparatus is also simply referred to as a mounting apparatus, and the electronic component is simply referred to as a component.

電子部品をプリント基板に実装する実装装置では、より短い実装時間(タクト)を実現するために、実装基板の生産データに基づく対象部品の実装順序について、最適化が行われる。   In a mounting apparatus that mounts electronic components on a printed board, the mounting order of the target components based on the production data of the mounting board is optimized in order to achieve a shorter mounting time (tact).

この最適化においては、一般的に、遺伝的アルゴリズム、局所探索法、動的計画法などの最適化アルゴリズムを使用し、その最適化アルゴリズムに各種パラメータを設定した上で、最適化演算を実行する。そして、従来は、処理時間の関係上、ある特定の一種の最適化アルゴリズム及びパラメータを統一的に使用していた(例えば特許文献1)。ここで、本明細書では、最適化アルゴリズムの種類とパラメータとの組合せを「最適化演算条件」という。   In this optimization, generally, an optimization algorithm such as a genetic algorithm, a local search method, or a dynamic programming method is used, and an optimization operation is executed after setting various parameters in the optimization algorithm. . Conventionally, a certain kind of optimization algorithm and parameters are used in a unified manner due to processing time (for example, Patent Document 1). Here, in this specification, the combination of the optimization algorithm type and the parameter is referred to as “optimization calculation condition”.

しかし、それぞれの最適化演算条件には一長一短があり、多種多様な実装基板の生産データに対して、向き不向きが発生していた。すなわち、一種の最適化演算条件で最適化演算を行うと、特定の実装基板の生産データでは生産性の高い解が得られる一方、別の実装基板の生産データでは生産性の低い解が得られるケースが発生していた。   However, each optimization calculation condition has its pros and cons, and orientation is unsuitable for a variety of mounting board production data. In other words, when optimization calculation is performed under a kind of optimization calculation condition, a solution with high productivity can be obtained with production data of a specific mounting board, while a solution with low productivity can be obtained with production data with another mounting board. A case has occurred.

特開平10−209681号公報Japanese Patent Laid-Open No. 10-209681

本発明が解決しようとする課題は、多種多様な実装基板の生産データに対して、最適な最適化演算条件を短時間で見出すことができる電子部品実装の最適化方法及び最適化プログラムを提供することにある。   The problem to be solved by the present invention is to provide an electronic component mounting optimization method and an optimization program capable of finding an optimal optimization calculation condition in a short time with respect to production data of various mounting boards. There is.

本発明の電子部品実装の最適化方法は、電子部品実装装置により電子部品をプリント基板に実装して実装基板を生産するときの電子部品の実装順序を最適化する電子部品実装の最適化方法であって、実装基板の生産データを作成するデータ作成コンピュータが、そのデータ作成コンピュータとネットワーク通信できる他のコンピュータを検索する段階と、前記データ作成コンピュータが、前記他のコンピュータのうちから、電子部品実装の最適化演算を行える複数のコンピュータを検索する段階と、前記データ作成コンピュータが、前記最適化演算を行える複数のコンピュータのそれぞれに、複数の最適化アルゴリズムの種類と複数のパラメータとの組合せからなる異なる最適化演算条件及び同一の生産データを送信し、最適化演算を実行させる段階と、それぞれの最適化演算の結果を比較し、最適な最適化演算条件を選択する段階とを含み、前記データ作成コンピュータとネットワーク通信できる他のコンピュータを検索する段階では、前記データ作成コンピュータが他のコンピュータにPINGを送り、前記最適化演算を行える複数のコンピュータを検索する段階では、前記データ作成コンピュータが、前記PINGに対し応答ありの他のコンピュータに対して前記最適化演算条件による最適化演算を行えるか否かの応答を求めるコマンドを送り、前記他のコンピュータは、前記コマンドに対し、そのコンピュータが最適化演算を行える最適化演算条件に対してビットを立てて応答し、前記最適化演算を実行させる段階では、前記データ作成コンピュータが、前記ビットを立てて応答した複数のコンピュータのそれぞれに、そのコンピュータが行える最適化演算条件にて最適化演算を実行させるものである。 The electronic component mounting optimization method of the present invention is an electronic component mounting optimization method for optimizing the mounting order of electronic components when the electronic component is mounted on a printed board by an electronic component mounting apparatus to produce the mounting board. A data creation computer that creates production data of a mounting board searches for another computer that can communicate with the data creation computer through a network; and the data creation computer is configured to mount an electronic component from among the other computers. Searching for a plurality of computers capable of performing the optimization calculation, and the data creation computer comprising a combination of a plurality of optimization algorithm types and a plurality of parameters for each of the plurality of computers capable of performing the optimization calculation Send different optimization calculation conditions and the same production data to execute optimization calculation A step that compares the results of each optimization calculation, an optimum and a step of selecting the optimizing operation conditions, at the stage of searching for the data created computers and network communications can another computer, the data creation computer In the step of sending a PING to another computer and searching for a plurality of computers that can perform the optimization calculation, the data creation computer performs an optimization based on the optimization calculation condition with respect to the other computer that responds to the PING. A command for requesting a response as to whether or not the optimization operation can be performed, and the other computer responds to the command with a bit set to an optimization operation condition under which the computer can perform the optimization operation. in the step of executing the reduction operation, the data creation computer, make the bit In each of a plurality of computers in response, in which to execute the optimizing operation by optimizing operation condition capable of performing the computer.

また、本発明の電子部品実装の最適化プログラムは、電子部品実装装置により電子部品をプリント基板に実装して実装基板を生産するときの電子部品の実装順序を最適化するために、実装基板の生産データを作成するデータ作成コンピュータに、当該データ作成コンピュータとネットワーク通信できる他のコンピュータを検索する手順と、前記他のコンピュータのうちから、電子部品実装の最適化演算を行える複数のコンピュータを検索する手順と、前記最適化演算を行える複数のコンピュータのそれぞれに、複数の最適化アルゴリズムの種類と複数のパラメータとの組合せからなる異なる最適化演算条件及び同一の生産データを送信し、最適化演算を実行させる手順と、それぞれの最適化演算の結果を比較し、最適な最適化演算条件を選択する手順と、を実行させるための電子部品実装の最適化プログラムであって、前記データ作成コンピュータとネットワーク通信できる他のコンピュータを検索する手順では、前記データ作成コンピュータから他のコンピュータにPINGを送らせ、前記最適化演算を行える複数のコンピュータを検索する手順では、前記PINGに対し応答ありの他のコンピュータに対して、前記最適化演算条件による最適化演算を行えるか否かの応答を求めるコマンドを送らせるとともに、前記他のコンピュータが、前記コマンドに対し、そのコンピュータが最適化演算を行える最適化演算条件に対してビットを立てて応答するようにし、前記最適化演算を実行させる手順では、前記ビットを立てて応答した複数のコンピュータのそれぞれに、そのコンピュータが行える最適化演算条件にて最適化演算を実行させるものである。 Also, the electronic component mounting optimization program of the present invention is designed to optimize the mounting order of electronic components when the electronic components are mounted on a printed board by an electronic component mounting apparatus to produce the mounting board. A procedure for searching for a data creation computer for creating production data for another computer capable of network communication with the data creation computer and a plurality of computers capable of performing an optimization operation for electronic component mounting are searched from among the other computers. Sending different optimization calculation conditions and the same production data consisting of a combination of a plurality of optimization algorithm types and a plurality of parameters to each of the plurality of computers capable of performing the optimization calculation, and the optimization calculation Compare the procedure to be executed and the result of each optimization calculation, and select the optimal optimization calculation condition. An electronic component mounting optimization program for executing a procedure that, the, in the procedure for searching the data creation computers and network communications can other computer to send a PING from the data created computer to another computer In the procedure for searching for a plurality of computers that can perform the optimization operation, a command for requesting a response as to whether or not the optimization operation can be performed based on the optimization operation condition is issued to another computer that responds to the PING. sent was Rutotomoni, the other computer, with respect to the command, the procedure that computer so as to respond make a bit for optimization operation condition capable of performing optimization calculation, to execute the optimization operation, in each of a plurality of computers in response upright the bit, the computer It is intended to execute the optimizing operation by optimizing operation condition data is performed.

本発明において、最適な最適化演算条件としては、典型的には最短の実装時間を実現できる最適化演算条件を選択する。   In the present invention, as the optimum optimization calculation condition, an optimization calculation condition capable of realizing the shortest mounting time is typically selected.

本発明によれば、実装基板の生産データを作成するデータ作成コンピュータとネットワーク通信できる他の複数のコンピュータを利用し、それぞれに異なる最適化演算条件による最適化演算を実行させ、最適な最適化演算条件を選択するので、多種多様な実装基板の生産データに対して、最適な最適化演算条件を短時間で見出すことができる。   According to the present invention, by using a plurality of other computers capable of network communication with a data creation computer that creates production data of a mounting board, an optimization calculation under different optimization calculation conditions is executed for each, and an optimal optimization calculation is performed. Since the conditions are selected, the optimum optimization calculation conditions can be found in a short time with respect to the production data of various mounting boards.

本発明の電子部品実装の最適化方法を適用する電子部品実装ラインのライン構成図である。It is a line block diagram of the electronic component mounting line to which the optimization method of the electronic component mounting of this invention is applied. 本発明の電子部品実装の最適化方法の手順を示すフロー図である。It is a flowchart which shows the procedure of the optimization method of the electronic component mounting of this invention.

以下、図面を参照して本発明の実施の形態を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1は、本発明の電子部品実装の最適化方法を適用する電子部品実装ラインのライン構成図である。図1において、電子部品実装ラインには4台の実装装置1〜4が配置されている。各実装装置1〜4は、複数の実装ステージ1a〜1n、2a〜2n、3a〜3n、4a〜4nが直列に連結されて構成されており、実装ステージに沿って移動するプリント基板に、各実装ステージで電子部品が順次実装され、実装基板が完成する。   FIG. 1 is a line configuration diagram of an electronic component mounting line to which an electronic component mounting optimization method of the present invention is applied. In FIG. 1, four mounting apparatuses 1 to 4 are arranged on the electronic component mounting line. Each of the mounting apparatuses 1 to 4 includes a plurality of mounting stages 1a to 1n, 2a to 2n, 3a to 3n, and 4a to 4n that are connected in series. Electronic components are sequentially mounted on the mounting stage to complete the mounting substrate.

各実装装置1〜4には、それぞれ装置制御用のコンピュータPC1〜4が設置されている。PC1〜4は、実装基板の生産データを作成するデータ作成コンピュータ(データ作成PC)にネットワークで接続されており、データ作成PCから受信した生産データ等に基づき実装装置1〜4の実装動作を制御する。   Each of the mounting apparatuses 1 to 4 is provided with a computer PC1 to PC4 for controlling the apparatus. The PCs 1 to 4 are connected to a data creation computer (data creation PC) for creating production data of the mounting board via a network, and control the mounting operation of the mounting apparatuses 1 to 4 based on the production data received from the data creation PC. To do.

電子部品実装ラインには、上述のデータ作成PCと装置制御用のPC1〜4のほかに、部品情報登録、フィーダ情報管理、装置管理者情報管理などのためにコンピュータPC5〜9が存在する。   In the electronic component mounting line, there are computers PC5 to PC9 for component information registration, feeder information management, device manager information management, etc., in addition to the above-described data creation PC and device control PC1 to PC4.

本発明では、データ作成PCが、当該データ作成PCとネットワーク通信でき、かつ、最適化演算を行える他のコンピュータ(PC)を検索し、検索された複数のPCにそれぞれ異なる最適化演算条件にて最適化演算を実行させる。その具体的な手順を図2に示す。以下、図1及び図2を参照して、本発明の最適化方法の手順を説明する。なお、以下の手順は、データ作成PCにインストールしたプログラムにより実行できる。   In the present invention, the data creation PC searches for another computer (PC) that can perform network communication with the data creation PC and can perform the optimization calculation, and each of the searched PCs has different optimization calculation conditions. Run optimization operations. The specific procedure is shown in FIG. Hereinafter, the procedure of the optimization method of the present invention will be described with reference to FIGS. 1 and 2. The following procedure can be executed by a program installed on the data creation PC.

まず、データ作成PCは、他のPC1〜9にPINGを送ることにより、現在、データ作成PCとネットワーク通信(TCP/IP通信)できるPCを検索する。次いで、データ作成PCは、PING応答ありのPCに対してコマンドを送ることにより、最適化演算を行える複数のPCを検索する。具体的には、最適化演算を行えるPCは、データ作成PCからのコマンドに対し、最適化演算条件No.(後述の表1、2参照)内の項目のうち、処理可能な項目に対して、ビットを立てて応答する。そして、データ作成PCは、コマンド応答ありの最適化演算を行える複数のPCのそれぞれに、異なる最適化演算条件及び同一の生産データを送信し、最適化演算を実行させる。   First, the data creation PC sends a PING to the other PCs 1 to 9 to search for a PC that can currently perform network communication (TCP / IP communication) with the data creation PC. Next, the data creation PC searches for a plurality of PCs that can perform the optimization operation by sending a command to the PC with the PING response. Specifically, the PC that can perform the optimization calculation receives the optimization calculation condition No. in response to the command from the data creation PC. Among the items in (see Tables 1 and 2 to be described later), a response is made with a bit set to the items that can be processed. Then, the data creation PC transmits different optimization calculation conditions and the same production data to each of the plurality of PCs that can perform the optimization calculation with a command response, and executes the optimization calculation.

各PCによる最適化演算が終了したら、データ作成PCは、各PCによる最適化演算の結果を比較し、最適な最適化演算条件を選択する。最適な最適化演算条件としては、典型的には最短の実装時間を実現できる最適化演算条件を選択する。最後に、データ作成PCは、選択した最適化演算条件による最適化演算の結果を、上記の生産条件により実装基板を製造する実装装置1〜4の制御用のコンピュータPC1〜4にダウンロードする。これに基づき、PC1〜4は実装装置1〜4の実装動作を制御する。   When the optimization calculation by each PC is completed, the data creation PC compares the optimization calculation result by each PC and selects the optimum optimization calculation condition. As the optimum optimization calculation condition, typically, an optimization calculation condition capable of realizing the shortest mounting time is selected. Finally, the data creation PC downloads the result of the optimization calculation based on the selected optimization calculation condition to the control computers PC1 to PC4 of the mounting apparatuses 1 to 4 that manufacture the mounting board according to the above production conditions. Based on this, the PCs 1 to 4 control the mounting operations of the mounting apparatuses 1 to 4.

なお、以上の実施形態では、最適な最適化演算条件として、単純に最短の実装時間を実現できる最適化演算条件を選択するようにしたが、図1で説明した実装装置1〜4の各実装ステージ1a〜1n、2a〜2n、3a〜3n、4a〜4nにおける各実装時間のバランス等を考慮して、最適な最適化演算条件を選択することもできる。また、このような選択は、その選択条件をプログラムに組み込んでデータ作成PCに実行させることもでき、ユーザーが、データ作成PCに表示された最適化演算の結果を比較して選択するようにすることもできる。   In the above embodiment, the optimization calculation condition capable of realizing the shortest mounting time is simply selected as the optimum optimization calculation condition. However, each of the mounting apparatuses 1 to 4 described in FIG. Optimal optimization calculation conditions can be selected in consideration of the balance of the mounting times in stages 1a to 1n, 2a to 2n, 3a to 3n, and 4a to 4n. In addition, such a selection can be executed by causing the data creation PC to execute the selection conditions incorporated in the program, and the user can select the comparison result of the optimization operation displayed on the data creation PC. You can also.

表1は、最適化演算条件の例を示す。上述のとおり、最適化演算条件は、最適化アルゴリズムの種類とパラメータとの組合せからなる。   Table 1 shows examples of optimization calculation conditions. As described above, the optimization calculation condition includes a combination of the optimization algorithm type and parameters.

Figure 0006025161
Figure 0006025161

本発明の実施例として、図1の電子部品実装ラインに存在するコンピュータ(PC1〜9)のうち、最適化演算を行えるコマンド応答ありの5台のPCを使用して最適化演算を行った。実装基板の生産データとしては、携帯電話基板とPC基板の2種類の生産データを使用した。また、最適化演算条件としては、表1の最適化演算条件No.1、3、9、11、25、28の5種類の最適化演算条件を使用した。すなわち、携帯電話基板とPC基板のそれぞれの生産データに対して、5台のPCを使用し、各PCで1種類、合計5種類の最適化演算条件にて最適化演算を行った。   As an example of the present invention, the optimization calculation was performed using five PCs with command responses that can perform the optimization calculation among the computers (PC1 to PC9) existing in the electronic component mounting line of FIG. As the production data of the mounting board, two kinds of production data of the mobile phone board and the PC board were used. As the optimization calculation condition, the optimization calculation condition No. 1 in Table 1 is used. Five types of optimization calculation conditions of 1, 3, 9, 11, 25, and 28 were used. That is, for each production data of the mobile phone board and the PC board, five PCs were used, and optimization calculation was performed under five types of optimization calculation conditions, one for each PC.

その結果を表2に示す。   The results are shown in Table 2.

Figure 0006025161
Figure 0006025161

表2より、携帯電話基板の生産データに対しては最適化演算条件No.25が最適であり、PC基板の生産データに対しては最適化演算条件No.1が最適であることがわかる。   Table 2 shows that the optimization calculation condition No. 25 is optimum, and optimization calculation condition No. It can be seen that 1 is optimal.

従来の最適化方法では、最適化演算条件は1種類に固定されていたため、最適化演算条件No.25を選択した場合、携帯電話基板に対しては最適であるが、PC基板に対しては最適ではなく、実装時間にロスが生じる。   In the conventional optimization method, the optimization calculation condition is fixed to one type. When 25 is selected, it is optimal for a cellular phone board, but not optimal for a PC board, and a loss occurs in mounting time.

これに対して本発明では、携帯電話基板の生産データに対しては最適化演算条件No.25、PC基板の生産データに対しては最適化演算条件No.1をそれぞれ選択できるので、実装時間を短くできる。また、最適化演算条件選択のための複数の最適化演算処理は、電子部品実装ラインに元々存在するPCによる分散処理で実行されるため、最適な最適化演算条件を短時間で見出すことができる。   On the other hand, in the present invention, the optimization calculation condition No. 25, optimization calculation condition No. for PC board production data. Since 1 can be selected, the mounting time can be shortened. In addition, since the plurality of optimization calculation processes for selecting the optimization calculation conditions are executed by distributed processing by PCs originally present in the electronic component mounting line, the optimum optimization calculation conditions can be found in a short time. .

1〜4 実装装置
1a〜1n、2a〜2n、3a〜3n、4a〜4n 実装ステージ
PC1〜9 コンピュータ
1-4 Mounting devices 1a-1n, 2a-2n, 3a-3n, 4a-4n Mounting stage PC1-9 Computer

Claims (4)

電子部品実装装置により電子部品をプリント基板に実装して実装基板を生産するときの電子部品の実装順序を最適化する電子部品実装の最適化方法であって、
実装基板の生産データを作成するデータ作成コンピュータが、そのデータ作成コンピュータとネットワーク通信できる他のコンピュータを検索する段階と、
前記データ作成コンピュータが、前記他のコンピュータのうちから、電子部品実装の最適化演算を行える複数のコンピュータを検索する段階と、
前記データ作成コンピュータが、前記最適化演算を行える複数のコンピュータのそれぞれに、複数の最適化アルゴリズムの種類と複数のパラメータとの組合せからなる異なる最適化演算条件及び同一の生産データを送信し、最適化演算を実行させる段階と、
それぞれの最適化演算の結果を比較し、最適な最適化演算条件を選択する段階とを含み、
前記データ作成コンピュータとネットワーク通信できる他のコンピュータを検索する段階では、前記データ作成コンピュータが他のコンピュータにPINGを送り、
前記最適化演算を行える複数のコンピュータを検索する段階では、前記データ作成コンピュータが、前記PINGに対し応答ありの他のコンピュータに対して前記最適化演算条件による最適化演算を行えるか否かの応答を求めるコマンドを送り、前記他のコンピュータは、前記コマンドに対し、そのコンピュータが最適化演算を行える最適化演算条件に対してビットを立てて応答し、
前記最適化演算を実行させる段階では、前記データ作成コンピュータが、前記ビットを立てて応答した複数のコンピュータのそれぞれに、そのコンピュータが行える最適化演算条件にて最適化演算を実行させる、電子部品実装の最適化方法。
An electronic component mounting optimization method for optimizing the mounting order of electronic components when an electronic component is mounted on a printed board by an electronic component mounting apparatus to produce a mounting board,
A stage in which a data creation computer that creates production data of a mounting board searches for another computer capable of network communication with the data creation computer;
The data creation computer searching a plurality of computers capable of performing an electronic component mounting optimization calculation from the other computers;
The data creation computer transmits different optimization calculation conditions consisting of combinations of a plurality of types of optimization algorithms and a plurality of parameters, and the same production data, to each of the plurality of computers capable of performing the optimization calculation. The step of performing the merging operation;
Comparing the results of each optimization operation and selecting the optimal optimization operation condition,
In searching for another computer capable of network communication with the data creation computer, the data creation computer sends a PING to the other computer,
In the step of searching for a plurality of computers that can perform the optimization operation, a response indicating whether the data creation computer can perform the optimization operation based on the optimization operation condition with respect to another computer that responds to the PING. The other computer responds to the command with a bit set to an optimization operation condition that allows the computer to perform an optimization operation,
In the step of executing the optimization operation, an electronic component mounting in which the data creation computer causes each of a plurality of computers responding with the bit set to execute an optimization operation under an optimization operation condition that the computer can perform Optimization method.
前記最適な最適化演算条件として、最短の実装時間を実現できる最適化演算条件を選択する、請求項1に記載の電子部品実装の最適化方法。   The electronic component mounting optimization method according to claim 1, wherein an optimization calculation condition capable of realizing a shortest mounting time is selected as the optimum optimization calculation condition. 電子部品実装装置により電子部品をプリント基板に実装して実装基板を生産するときの電子部品の実装順序を最適化するために、実装基板の生産データを作成するデータ作成コンピュータに、
当該データ作成コンピュータとネットワーク通信できる他のコンピュータを検索する手順と、
前記他のコンピュータのうちから、電子部品実装の最適化演算を行える複数のコンピュータを検索する手順と、
前記最適化演算を行える複数のコンピュータのそれぞれに、複数の最適化アルゴリズムの種類と複数のパラメータとの組合せからなる異なる最適化演算条件及び同一の生産データを送信し、最適化演算を実行させる手順と、
それぞれの最適化演算の結果を比較し、最適な最適化演算条件を選択する手順と、を実行させるための電子部品実装の最適化プログラムであって、
前記データ作成コンピュータとネットワーク通信できる他のコンピュータを検索する手順では、前記データ作成コンピュータから他のコンピュータにPINGを送らせ、
前記最適化演算を行える複数のコンピュータを検索する手順では、前記PINGに対し応答ありの他のコンピュータに対して、前記最適化演算条件による最適化演算を行えるか否かの応答を求めるコマンドを送らせるとともに、前記他のコンピュータが、前記コマンドに対し、そのコンピュータが最適化演算を行える最適化演算条件に対してビットを立てて応答するようにし、
前記最適化演算を実行させる手順では、前記ビットを立てて応答した複数のコンピュータのそれぞれに、そのコンピュータが行える最適化演算条件にて最適化演算を実行させる、電子部品実装の最適化プログラム。
In order to optimize the mounting order of electronic components when electronic components are mounted on a printed circuit board by an electronic component mounting apparatus to produce a mounting substrate, a data creation computer that creates mounting board production data,
A procedure for searching for another computer capable of network communication with the data creation computer;
A procedure for searching a plurality of computers capable of performing an optimization calculation of electronic component mounting from among the other computers,
A procedure for transmitting different optimization calculation conditions and the same production data consisting of a combination of a plurality of types of optimization algorithms and a plurality of parameters to each of a plurality of computers capable of performing the optimization calculation and executing the optimization calculation When,
An electronic component mounting optimization program for executing a procedure for comparing the results of respective optimization calculations and selecting an optimal optimization calculation condition,
In the procedure for searching for another computer capable of network communication with the data creation computer, a PING is sent from the data creation computer to the other computer.
In the procedure for searching for a plurality of computers that can perform the optimization operation, a command is sent to another computer that responds to the PING to obtain a response as to whether or not the optimization operation can be performed based on the optimization operation condition. was Rutotomoni, the other computer, with respect to the command, so as to respond make a bit for optimizing operation conditions the computer is able to optimize operations,
In the procedure for executing the optimization calculation, an electronic component mounting optimization program is executed in which each of a plurality of computers that respond with the bit set is executed under an optimization calculation condition that can be performed by the computer.
前記最適な最適化演算条件を選択する手順において、最短の実装時間を実現できる最適化演算条件を選択させる、請求項3に記載の電子部品実装の最適化プログラム。   4. The electronic component mounting optimization program according to claim 3, wherein an optimization calculation condition capable of realizing a shortest mounting time is selected in the procedure of selecting the optimum optimization calculation condition.
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