JP5998691B2 - Inspection method, inspection apparatus, and glass plate manufacturing method - Google Patents

Description

  The present invention relates to a method for inspecting a glass plate, and particularly to a method for inspecting a colored layer formed on a glass plate.

  The glass plate attached to the window of an automobile may be provided with a black coating layer on the periphery thereof. The black coating layer is a black and belt-like layer formed by screen-printing a ceramic paste made of a low melting point glass powder and a pigment in the form of a paste on a glass surface and then baking it.

  For example, Patent Document 1 describes that a black coating layer is formed on a glass plate by screen printing.

  Further, Patent Document 2 illuminates a printed matter using scattered light, captures a plurality of images of the printed matter with a CCD camera from the side through which the scattered light is transmitted, combines the images into an inspection image, and The image is binarized into a dark part and a bright part, the bright parts are ordered in descending order of area, and a bright part whose area size is (m + 1) th or less (m is the number of non-printing parts) is printed. An inspection method is described in which dark areas are ordered in descending order of area, and dark areas having an area size of (n + 1) th or less (n is the number of printing parts) are printed as stains.

  Also, in Patent Document 3, threshold standard data created by associating a standard value of a threshold value for inspection with a type of element solder printing unit is prepared in advance, and element solder of a substrate to be subjected to print inspection is prepared. A print inspection method for setting a threshold value corresponding to the type of the element solder printing part based on threshold standard data for each printing part is described.

  Further, Patent Document 4 discloses inspection data and imaging means created by classifying unit shape / position data indicating the shape and position of a unit printing unit printed on an electrode according to a grouping condition into a data group. Describes a printing inspection method for determining a printing state by comparing the imaging results of a substrate.

JP 2004-243630 A JP 2006-105807 A JP 2004-188646 A JP 2004-58298 A

  However, the technique described in Patent Document 2 can detect pinholes and print stains, but cannot detect chipping of the edge of the black coating layer.

  Further, the technique described in Patent Document 4 is for recognizing small cream solder, and a small chip generated in a black coating layer printed on a peripheral portion of a large glass plate having a vertical and horizontal size exceeding 1 m. Cannot be determined.

  Further, since the boundary portion of the black coating layer formed by screen printing bleeds, it is necessary to detect the chipping as distinguished from the bleed.

  An object of the present invention is to accurately detect chipping in a black coating layer.

That is, the present invention is a method for inspecting defects in a colored layer formed on a glass plate, and sets a plurality of inspection points on the boundary of the colored layer using an image of the glass plate to be inspected. A first step, a second step of measuring an angle formed by two line segments connecting the set inspection point and adjacent inspection points on both sides, and the measured angle and a predetermined inspection comparing the detected angle, wherein the measured angle determined to have detected the defects in the colored layer is smaller than the test detection angle, the measured angle of the points is larger than the test detection angle wherein the color layer is a test method which comprises a third step of determining not to detect defects, the.

  In the second step, the position of the set inspection point is measured in the second step, and the measured position and the measured angle are stored in association with each other. In the third step, The inspection method outputs the information of the position of the inspection point where the defect is detected.

  In the present invention, a plurality of inspection points are set on the boundary of the colored layer on the glass plate used as a sample, and two lines connecting the set inspection points and adjacent inspection points are provided. A fourth step of measuring an angle formed in minutes and storing the measured angle as teaching data; comparing the measured angle with teaching data corresponding to the angle; And a fifth step of determining that a defect has been detected in the colored layer when the angle is smaller than the teaching data.

  Further, in the present invention, the fifth step further includes superimposing an inspection point that is a vertex of the measured angle and an inspection point that gives the teaching data at a predetermined coordinate, and a distance between the two inspection points. Is an inspection method including a step of determining that the angle and the teaching data correspond to each other when the angle is within a predetermined allowable range.

  Further, the present invention is the inspection method characterized in that, in the first step, the image is binarized before the inspection point is set.

  Further, the present invention is the inspection method characterized in that, in the first step, processing for smoothing the contour in the image is performed before setting the inspection point.

  Further, the present invention is an inspection apparatus for inspecting a defect of a colored layer on a glass plate, a camera that acquires an image of the glass plate, a light source that irradiates light to the glass plate, and the acquired A computer that analyzes an image, and the computer inspects the glass plate by any one of the inspection methods described above.

  Further, the present invention is a method for producing a glass plate in which a colored layer is formed on the surface, the step of applying a colored member on the glass plate, and the color formed by the applied colored member It is a manufacturing method of a glass plate including the step of inspecting the layer by any one of the methods described above, and the step of fixing the applied colored member on the glass plate.

  According to an exemplary embodiment of the present invention, it is possible to accurately detect a black coating layer chip.

It is a top view of the glass plate test | inspected with the test | inspection apparatus of embodiment of this invention. It is an enlarged view of the A section of the glass plate test | inspected with the test | inspection apparatus of embodiment of this invention. It is a block diagram which shows the structure of the test | inspection apparatus of embodiment of this invention. It is an enlarged view of the B section of the glass plate inspected by the inspection apparatus of the embodiment of the present invention. It is a figure explaining the comparison with the teaching data in the test | inspection apparatus of embodiment of this invention, and the boundary of a black coating layer. It is a flowchart of the teaching data acquisition process of embodiment of this invention. It is a flowchart of the chip | tip detection process of embodiment of this invention.

  FIG. 1A is a plan view of a glass plate 1 to be inspected by the inspection apparatus according to the embodiment of the present invention, and FIG. 1B is an enlarged view of a portion A of the glass plate 1.

  The illustrated glass plate 1 is a glass plate attached to a window of an automobile, and a black coating layer is provided on the peripheral edge thereof. The black coating layer is a usually black and belt-like layer formed by screen-printing a ceramic paste made of a low melting point glass powder and a pigment in the form of a paste on a glass surface and then baking it.

  Since this black coating layer is formed by screen printing, as shown in FIG. 1B, bleeding 11 and chipping 12 occur at the boundary portion. The inspection apparatus according to the embodiment of the present invention discriminates the black coating layer from bleeding and chipping, and accurately detects the chipping.

  FIG. 2 is a block diagram showing the configuration of the inspection apparatus according to the embodiment of the present invention.

  The inspection apparatus according to the present embodiment includes a conveyor 10 that conveys a glass plate 1 to be inspected, a camera 20 that photographs the glass plate 1 being conveyed, a lamp 30 that irradiates light on the glass plate 1 photographed by the camera 20, and a conveyor. 10 includes a sensor 40 for detecting the glass plate 1 on the top 10 and an inspection system 100 for analyzing an image taken by the camera 20.

  The camera 20 is an image pickup apparatus that captures a conveyed glass plate 1 and obtains a black and white image of the glass plate. For example, a CCD line sensor can be used. When a line sensor is used for the camera 20, a plane image of the glass plate to be inspected can be obtained by continuously acquiring images (for example, moving images) according to the conveyance of the glass plate 1. Note that a CCD camera or a CMOS sensor in which image sensors are arranged two-dimensionally (planar) may be used instead of a line sensor in which image sensors are arranged one-dimensionally.

  The inspection apparatus according to the present embodiment includes a plurality of cameras 20 in order to improve the resolution of a captured image. An image captured by the camera 20 is input to the inspection system 100.

  The lamp 30 is a light emitting element that irradiates light onto the glass plate 1 photographed by the camera 20 from the back side of the conveyor 10 (opposite side of the camera 20). For example, a fluorescent lamp can be used. When the lamp 30 irradiates light from the back side of the conveyor 10, an image with high contrast can be obtained. The lamp 30 may be a high-frequency fluorescent lamp that operates at a cycle earlier than the shooting interval of the camera 20.

  The sensor 40 is a sensor that detects that the glass plate 1 transported on the conveyor 10 has been placed on the sensor 40 (that is, has reached a position suitable for photographing by the camera 20). For example, a photoelectric switch is used. Can do. A signal output from the sensor 40 is input to the inspection system 100. The inspection system 100 captures an image acquired by the camera 20 based on a signal output from the sensor 40.

  The inspection system 100 according to the present embodiment includes a processor (CPU) 101, a memory 102, a storage device (HDD) 103, an input device 104, an output device 105, and an interface 106, and these components are connected via a bus 107. It is.

  The processor 101 is a processing device that executes a program stored in the memory 102.

  The memory 102 is a high-speed and volatile storage device such as a DRAM (Dynamic Random Access Memory), and stores an operating system (OS) and application programs. When the processor 101 executes the operating system, the basic function of the computer is realized, and when the application program is executed, the function provided by the computer is realized. Specifically, the memory 102 stores a program for executing the teaching data acquisition process shown in FIG. 5 and the chipping detection process shown in FIG.

  The storage device 103 is a large-capacity non-volatile storage device such as a magnetic storage device or a flash memory, and stores a program executed by the processor 101 and data used when the program is executed. The program is read from the storage device 103, loaded into the memory 102, and executed by the processor 101.

  A user interface such as a keyboard 107 and a mouse 108 is connected to the input device 104. A user interface such as a display device 109 and a printer is connected to the output device 105. Note that the input device 104 and the output device 105 may be interfaces such as a USB and an optical disk drive that can input and output data.

  The interface 106 connects the inspection system 100 to the camera 20 and the sensor 40. The interface 106 may include a communication interface that controls communication with other devices.

  The inspection system 100 may be physically constructed on a single computer, or may be physically constructed on a logical partition configured on one or a plurality of computers.

  The program executed by the processor 101 is provided to the computer via a nonvolatile storage medium or a network. For this reason, the computer may include an interface for reading a storage medium (CD-ROM, flash memory, etc.).

  FIG. 5 is a flowchart of the teaching data acquisition process according to the embodiment of the present invention. This teaching data acquisition process is executed by the processor 101 of the inspection system 100.

  First, a manufactured glass plate is visually inspected, and image data (teaching data) of the glass plate that can be determined to be good is acquired (S101). In addition, when the chip | tip of a black coating layer is found in the glass plate for teaching data acquisition, teaching data is acquired using another glass plate.

  Thereafter, an enlargement / reduction process is performed to smooth the boundary line of the black coating layer (S102). The enlargement / reduction process may be performed a plurality of times. This is because if the number of enlargement / reduction processes is small, the unevenness of the boundary of the black coating layer due to bleeding becomes rough, and the possibility of erroneous detection in the chipping detection process increases. Moreover, you may perform the smoothing process which smooths a line which is not an expansion / contraction process. By performing the smoothing process, it is possible to smooth the unevenness of the boundary due to the bleeding of the black coating layer, to acquire accurate teaching data, and to reduce the misdetection of the chip.

  Note that before the enlargement / reduction processing, the acquired image data may be binarized to clarify the boundary of the black coating layer. By performing the binarization process before the enlargement / reduction process, the subsequent processes can be speeded up. Further, instead of the binarization process, it may be determined that a portion where the luminance change in the image is large is a boundary. In this way, the boundary can be accurately defined even when the boundary line of the black coating layer is thin.

  Thereafter, a plurality of inspection points (points A to E in FIG. 3) are set on the boundary of the black coating layer, and formed by line segments connecting the coordinates of the inspection points and the inspection points adjacent to the inspection points. The angle (angle θ formed by line segment BC and line segment CD in FIG. 3) is measured (S103). In addition, a predetermined algorithm such as a Douglas-Poiker algorithm or a cone intersection method can be used for setting the inspection point.

  Thereafter, the preset teaching detection angle is compared with the measured angle of the inspection point (S104).

  As a result, when the inspection point angle is smaller than the teaching detection angle, it is determined that the measured inspection point angle is the shape of the boundary of the normal black coating layer, and the coordinates of the inspection point and the measured angle are taught. The data is stored in the memory 102 (S105). On the other hand, if the angle of the inspection point is equal to or greater than the teaching detection angle, it is determined that the measured inspection point angle is an abnormal value, and the process returns to step S103 to measure the angle of the next inspection point.

  Thereafter, it is determined whether the measurement of the angles of all the inspection points has been completed (S106). If the measurement of the angles of all the inspection points has been completed, the teaching data acquisition process is terminated. On the other hand, if there is an inspection point for which the angle measurement has not been completed, the process returns to step S103, and the angle of the next inspection point is measured.

Next, the manufacturing process of the glass plate including the chip | tip detection process of embodiment of this invention is demonstrated.
(1) The manufactured glass plate is cut into a desired shape.
(2) Screen-printing a ceramic paste in which a low melting glass powder and a pigment are pasted on a glass surface.
(3) Bake the printed ceramic paste on a glass plate.
(4) The black coating layer is inspected (see FIG. 6).
(5) If necessary, a silver paste is printed and baked to form a defogger hot wire or an antenna.
(6) The glass plate is bent to a predetermined curvature.
(7) Combine the glass plate and the interlayer film.
(8) Pre-adhesion for deaeration between glass plates is performed.
(9) Heat and press in an autoclave and finish bonding is performed by pressing the intermediate film.
(10) The intermediate film protruding from the glass plate is cut.

  In the case of a normal glass plate, only the steps (1) to (5) are necessary, and the steps after (6) are steps necessary for laminated glass. In the case of tempered glass, a heat treatment process and a chemical treatment process are added.

  The manufacturing process described above is merely an example of a normal process except for the inspection process (4), and may be different from the process described in the specification except for the inspection process (4).

  FIG. 6 is a flowchart of the chip detection process according to the embodiment of the present invention.

  First, teaching data of a glass plate having the same model number as the glass plate 1 to be inspected is acquired, and the teaching data is confirmed (S201).

  Thereafter, an enlargement / reduction process is performed to smooth the boundary line of the black coating layer (S202). The enlargement / reduction process may be performed a plurality of times. This is because if the number of times of enlargement / reduction processing is small, the unevenness at the boundary of the black coating layer becomes rough due to bleeding, and the possibility of erroneous detection increases. Moreover, you may perform the smoothing process which smooths a line which is not an expansion / contraction process. By performing the smoothing process, the unevenness of the boundary due to the blurring of the black coating layer can be smoothed, and the erroneous detection of the chip can be reduced.

  Note that before the enlargement / reduction processing, the acquired image data may be binarized to clarify the boundary of the black coating layer. By performing the binarization process before the enlargement / reduction process, the subsequent processes can be speeded up. Further, instead of the binarization process, it may be determined that a portion where the luminance change in the image is large is a boundary. In this way, the boundary can be accurately defined even when the boundary line of the black coating layer is thin.

  Thereafter, the first inspection point is defined on the boundary line of the black coating layer (S203), a plurality of inspection points (points A to E in FIG. 4) are set, and the coordinates of each inspection point and the inspection adjacent to the inspection point are set. The angle formed by the line segment connecting the points (in FIG. 4, the angle θ formed by the line segment BC and the line segment CD) is measured, and the coordinates and angles of the measured inspection points are stored in the memory 102 (S204). ). A predetermined algorithm such as a Douglas-Poker algorithm or a cone intersection method can be used for setting the inspection points and for setting the inspection points.

  After that, the set inspection point and the teaching data point obtained by the teaching data acquisition process are overlapped at the same coordinates, and the teaching data point closest to each inspection point is searched and corresponding to each inspection point Teaching data points are determined (S205). Specifically, when the distance between the inspection point and the teaching data point is smaller than the predetermined position allowable length, it is determined that the inspection point corresponds to the teaching data point. Note that if the position allowable length includes a plurality of points, the closest point is selected.

  For example, as shown in FIG. 4, when the inspection point C on the glass plate 1 to be inspected and the point C ′ of the teaching data are compared, the distance between the point C and the point C ′ is shorter than the allowable position length L. . Therefore, it can be determined that the inspection point C corresponds to the teaching data point C ′.

  When the distance between the inspection point and the teaching data point is smaller than the predetermined position allowable length (Yes in S206), the angle of the inspection point is compared with the angle of the corresponding teaching data point (S207). As a result, if the angle of the inspection point is smaller than the angle of the corresponding teaching data point, a chip is detected, and the coordinates of the point where the chip is detected are recorded in the memory 102 (S209). On the other hand, when the angle of the inspection point is equal to or larger than the angle of the corresponding point in the teaching data, it is determined that no chip is detected.

  On the other hand, if the distance between the inspection point and the teaching data point is equal to or longer than the predetermined position allowable length (No in S206), there is no teaching data corresponding to the inspection point, and the angle of the inspection point is determined in advance. The detected detection angle is compared (S208). As a result, if the angle of the inspection point is smaller than the inspection detection angle, a chip is detected, and the coordinates of the point where the chip is detected are recorded in the memory 102 (S209). On the other hand, when the angle of the inspection point is equal to or larger than the inspection detection angle, it is determined that no chip is detected.

  Thereafter, it is determined whether or not all the inspection points have been processed (S210). If there is an inspection point that has not been processed, the process returns to step S203 to process the next inspection point. On the other hand, if all the inspection points have been processed, the detection result is output (S211), and the chip inspection process is ended.

  For example, the output of the inspection result is displayed on the display device 109 by superimposing a predetermined mark on the coordinates of the location where the chipping is detected on the image of the glass plate where the chipping is detected. In addition, when a chip is detected, sound (sound, warning sound, etc.) may be output from a speaker to notify the operator. Further, a conveyor branch for collecting the glass in which chipping has been detected may be provided, and the glass in which chipping has been detected may be allowed to flow through the branched collection line.

  Moreover, although the process in the outline inside a black coating layer was demonstrated about the chip | tip inspection method of this Embodiment, the same process can be performed also about the outline outside a black coating layer.

  Moreover, the colored film attached to the cover glass of the liquid crystal display device used for TV receivers and smart phones is formed in the same process as the formation of the black coating layer described above, and the inspection method of the present invention can be applied. .

  As described above, according to the embodiment of the present invention, when the angle of the inspection point set on the boundary of the black coating layer formed on the glass plate is smaller than the inspection detection angle, the black coating layer has a defect. Therefore, it is possible to determine whether the black coating layer is blurred or missing. Moreover, since the presence or absence of a chip | tip is discriminate | determined in each test | inspection point, even when the formation range of a black coating layer is large (for example, the black frame printed around the glass plate), a chip | tip can be detected accurately.

  Further, since the position of each inspection point is measured and the position of the inspection point where the chip is detected is output, it is possible to know where the chip is present in the black coating layer.

  Moreover, since the teaching data is acquired from the black coating layer of the glass plate used as a sample and the angle of the inspection point is compared with the teaching data to determine the presence or absence of a defect, it is possible to accurately detect the chipping.

  In addition, when the distance between the inspection point and the point giving the teaching data is within the predetermined allowable position length, the inspection point angle is compared with the teaching data to determine the presence or absence of defects. Data can be associated accurately.

  In addition, since the binarization processing of the image on the glass plate is performed before setting the inspection point, the boundary of the black coating layer can be clarified, and the subsequent processing can be speeded up.

  In addition, since the process of smoothing the contour in the image is performed before setting the inspection point, the unevenness of the boundary due to the blurring of the black coating layer can be smoothed to reduce false detection.

10 Conveyor 20 Camera 30 Lamp 40 Sensor 100 Inspection System 101 Processor (CPU)
102 Memory 103 Storage device (HDD)
104 Input device 105 Output device 106 Interface 107 Bus

Claims (8)

A method for inspecting defects in a colored layer formed on a glass plate,
A first step of setting a plurality of inspection points on the boundary of the colored layer using an image of a glass plate to be inspected;
A second step of measuring an angle formed by two line segments connecting the set inspection point and adjacent inspection points on both sides;
Comparing the measured angle and the predetermined test detection angle, the measurement angular determines that it has detected a defect in the colored layer is smaller than the test detection angle, the measured angle is the inspection inspection method characterized by comprising a third step of determining that if the detection angle greater than the colored layer of the locations does not detect defects, the. In the second step, the position of the set inspection point is measured, the measured position and the measured angle are stored in association with each other,
The inspection method according to claim 1, wherein in the third step, information on a position of an inspection point where the defect is detected is output. A plurality of inspection points are set on the boundary of the colored layer on the glass plate used as a sample, and an angle formed by two line segments connecting the set inspection points and adjacent inspection points on both sides is measured. A fourth step of storing the measured angle as teaching data;
The angle measured on the glass plate to be inspected is compared with teaching data corresponding to the angle, and when the measured angle is smaller than the teaching data, it is determined that a defect has been detected in the colored layer. The inspection method according to claim 1, further comprising: 5 steps.   In the fifth step, the inspection point that is the vertex of the measured angle and the inspection point that gives the teaching data are overlapped at a predetermined coordinate, and the distance between the two inspection points is within a predetermined allowable range. 4. The inspection method according to claim 3, further comprising a step of determining that the angle corresponds to the teaching data.   5. The inspection method according to claim 1, wherein in the first step, binarization processing of the image is performed before the inspection point is set. 6.   6. The inspection method according to claim 1, wherein in the first step, processing for smoothing an outline in the image is performed before setting the inspection point. 7. An inspection device for inspecting defects in a colored layer on a glass plate,
A camera for acquiring an image of the glass plate;
A light source for irradiating the glass plate with light;
A computer for analyzing the acquired image,
The said computer inspects the said glass plate by the inspection method any one of Claim 1 to 6, The inspection apparatus characterized by the above-mentioned. A method for producing a glass plate in which a colored layer is formed on a surface,
Applying a colored member on the glass plate;
A step of inspecting the colored layer formed by the applied colored member by the method of any one of claims 1 to 6;
Fixing the applied colored member on the glass plate.