JP5998047B2 - Mold detection device, bending device, mold - Google Patents

Description

  The present invention relates to a mold detection device for detecting identification information and position of a mold mounted on a mold mounting portion such as a mold holder, a bending apparatus for bending a metal plate using the mold, and a bending apparatus. It relates to the mold used for the.

  There is a bending apparatus that bends a metal plate material by a punch die and a die die. The bending apparatus is also called a press brake. The bending apparatus includes an upper table to which an upper mold holder is attached and a lower table to which a lower mold holder is attached. When bending a plate material, a punch die is attached to the upper die holder, a die die is attached to the lower die holder, and the upper table is lowered toward the lower table to punch the plate material. And bend it with a die. The punch mold and the die mold are collectively referred to as a mold, and the upper mold holder and the lower mold holder are collectively referred to as a mold holder.

  The operator attaches the mold to the mold holder based on the bending setup information. Specifically, in the setup information, information indicating which mold of a plurality of molds is used (selected mold information), and in which position in the longitudinal direction of the mold holder the mold is to be mounted Is included (mounting position information). The operator mounts the mold indicated by the selected mold information at the position in the width direction of the mold holder indicated by the mounting position information.

JP 2005-334773 A Japanese Patent No. 4987249

  Conventionally, which of the plurality of molds is to be mounted on the mold holder depends on the skill of the operator. Also, the position where the mold is mounted on the mold mounting portion such as the mold holder depends on the skill of the operator. Therefore, there is a possibility that the operator should make a mistake in the mold to be mounted and the mounting position. Therefore, when a type of mold other than the type of mold indicated by the selected mold information is mounted on the mold holder, it is desirable to detect erroneous mounting. Further, when the mold is mounted on the mold holder according to the mounting position information, it is desired that the position of the mold mounted on the mold holder is accurately detected.

  These requests should be met even if the selection of the mold and the mounting on the mold mounting part are not performed manually by the operator but are automated using a robot or a dedicated tool changer (ATC: Automatic Tool Changer). It is.

  In order to meet such a demand, an object of the present invention is to provide a mold detection apparatus and a bending apparatus capable of detecting identification information of a mold mounted on a mold mounting portion. It is another object of the present invention to provide a mold detection device and a bending device that can accurately detect the position of a mold mounted on the mold mounting portion. Furthermore, an object of this invention is to provide the metal mold | die which can detect the identification information of a metal mold | die with a metal mold | die detection apparatus.

  In order to solve the above-described problems of the related art, the present invention is provided between a power receiving electrode (T31), a displacement electrode (T32), and between the power receiving electrode and the displacement electrode, and for identifying a mold. A longitudinal direction of the mold mounting part on the inner wall of a mold mounting part (5, 6, 55, 60) for mounting a mold (TP, TD) having an identification information transmission circuit (45) for transmitting the identification information of A power supply electrode (31) provided to face the power receiving electrode in a non-contact state in a direction; and a power supply electrode (31) provided to face the displacement electrode in a non-contact state with respect to the power supply electrode. The plurality of detection electrodes (32) that are insulated and arranged in the longitudinal direction of the mold mounting portion, the first AC waveform section having the first frequency in the feeding electrode, and the first frequency are different A second AC waveform section having a second frequency A power supply signal supply section (11) for supplying a power supply signal, and when the mold is mounted on the mold mounting section, the pair of the power feeding electrode and the power receiving electrode facing each other face each other When the pair of the detection electrode and the displacement electrode forms a capacitor circuit (C31, C32) and the power supply signal is supplied to the power supply electrode by the power supply signal supply unit, the identification information transmission circuit is the first information transmission circuit. The voltage information extraction unit (330) that extracts the identification information of the mold transmitted corresponding to the AC waveform section of the first voltage information from the detection electrode, and the first voltage extracted by the voltage information extraction unit There is provided a mold detection apparatus further comprising an information detection calculation unit (111) for detecting identification information of the mold based on information.

  In the above mold detection apparatus, the capacitance of the capacitor circuit is configured to change according to the position of the mold with respect to the longitudinal direction of the mold mounting portion, and the voltage information extraction unit includes the second Corresponding to the AC waveform section, second voltage information whose voltage value changes according to the capacitance of the capacitor circuit is extracted from the detection electrode, and based on the second voltage information extracted by the voltage information extraction unit. It is preferable that the apparatus further comprises a position detection calculation unit (111) for detecting at which position in the longitudinal direction of the mold mounting part the mold is mounted.

  In the above-described mold detection apparatus, the voltage information extraction unit includes an electrode switching circuit (SR) that selectively selects a detection electrode from which voltage information is to be extracted from the plurality of detection electrodes and sequentially switches the detection electrode. It is preferable to have.

  The present invention is also a bending apparatus (100, 200) for bending a plate material using a punch die (TP) and a die die (TD) in order to solve the above-described problems of the prior art. , Having a first recess (51) for storing the end of the punch mold, and storing the first mold mounting portion (5) for mounting the punch mold and the end of the die mold. And a second mold mounting portion (6) for mounting the die mold, and the punch mold and the die mold are disposed at the respective end portions. Provided, receiving electrode (T31), displacement electrode (T32), provided between the receiving electrode and the displacement electrode, and transmitting identification information for identifying the punch die and the die die. An identification information transmission circuit (45), and the first and second mold mounting portions are the first and second mold mounting portions. 2 is provided in the longitudinal direction of the side wall of the recess, and faces the power receiving electrode in a non-contact state when the punch die and the die die are attached to the first and second die attachment portions, respectively. And the power supply electrode (31) and the power supply electrode are arranged side by side in a state of being insulated from each other in the longitudinal direction of the side walls of the first and second recesses. When the punch die and the die die are mounted, the plurality of detection electrodes (32) that face the displacement electrode in a non-contact state are provided, and the punch die or the die die is the first die. Alternatively, when mounted in the second recess, the pair of the feeding electrode and the receiving electrode facing each other and the pair of the detection electrode and the displacement electrode facing each other form a capacitor circuit (C31, C32). Forming and bending apparatus In addition, a power supply signal that supplies a power supply signal in which a first AC waveform section having a first frequency and a second AC waveform section having a second frequency different from the first frequency are mixed to the power supply electrode The identification information of the mold transmitted by the identification information transmission circuit in correspondence with the first AC waveform section when the power supply signal is supplied to the power supply electrode by the supply unit (11) and the power supply signal supply unit. Voltage information extraction unit (330) that extracts the first voltage information from the detection electrode, and information detection that detects identification information of the mold based on the first voltage information extracted by the voltage information extraction unit Provided is a bending apparatus comprising a calculation unit (111).

  In the bending apparatus, the capacitance of the capacitor circuit is configured to change according to a position of the punch die or the die die in the longitudinal direction of the first or second recess, and the voltage information The extraction unit extracts the second voltage information whose voltage value changes according to the capacitance of the capacitor circuit in correspondence with the second AC waveform section from the detection electrode, and the voltage information extraction unit extracts the second voltage information. A position detection calculation unit (111) for detecting at which position in the longitudinal direction of the first or second concave portion the punch die or the die die is mounted based on second voltage information; It is preferable to further provide.

  Furthermore, in order to solve the above-described problems of the prior art, the present invention is a mold for bending a plate material by mounting it on a mold mounting part (5, 6, 55) of a bending apparatus (100, 200). (TP, TD), and when the mold is mounted on the mold mounting part, the power supply electrode (31) is provided in the longitudinal direction of the inner wall of the mold mounting part and supplied with an AC power supply signal The power receiving electrode (T31) that is opposed to the power supply electrode and arranged in the longitudinal direction of the inner wall while being insulated from the power feeding electrode when the mold is mounted on the mold mounting portion. A displacement electrode (T32) opposed to any of the plurality of detection electrodes (32) in a non-contact state, and an identification information transmission circuit (45) provided between the power reception electrode and the displacement electrode, The identification information transmission circuit is equivalent to the power supply signal An AC waveform signal is input via the power receiving electrode, and the identification information transmission circuit shapes the AC waveform signal by identifying an identification information holding unit (4512) that holds identification information for identifying the mold. An identification information waveform generation unit (4513) that generates an identification information waveform signal indicating identification information of the mold, and outputs the identification information waveform signal via the displacement electrode and the detection electrode, Provide a mold to do.

  In the above mold, the power supply signal is an AC waveform in which a first AC waveform section having a first frequency and a second AC waveform section having a second frequency different from the first frequency are mixed. And the identification information transmission circuit further includes a frequency discriminating unit (4511) for discriminating the frequency of the AC waveform signal, and the identification information waveform generating unit is associated with the first AC waveform section. It is preferable to generate the identification information waveform signal.

  In the above mold, the identification information transmission circuit preferably uses a voltage obtained by rectifying and smoothing the power supply signal as a power supply voltage.

  In the above mold, the power receiving electrode and the displacement electrode are provided on a first surface of a substrate (TS), and the identification information transmission circuit is disposed on a second surface that is the back surface of the substrate relative to the first surface. It is preferable that the substrate is mounted and mounted on the mold so that the first surface is on the outer surface side.

  According to the mold detection apparatus and the bending apparatus of the present invention, it is possible to detect the identification information of the mold mounted on the mold mounting portion. Further, according to the mold detecting device and the bending apparatus of the present invention, the position of the mold mounted on the mold mounting portion can be accurately detected. According to the mold of the present invention, the identification information of the mold can be detected by the mold detection device.

It is a perspective view which shows 1st Embodiment of a bending process apparatus. It is a perspective view which shows an example of a punch metal mold | die and a die metal mold | die. It is a block diagram which shows the system configuration | structure of the bending apparatus of 1st Embodiment. It is a block diagram which shows the metal mold | die information and position detection apparatus which is a metal mold | die detection apparatus of one Embodiment. It is a wave form diagram for demonstrating the production | generation process of the identification information of the metal mold | die by the metal mold | die detection apparatus of one Embodiment and the metal mold | die of one Embodiment. It is a wave form diagram for demonstrating the detection processing of the identification information of a metal mold | die by the metal mold | die detection apparatus of one Embodiment. It is a fragmentary perspective view shown in the state where the upper mold holder and the lower mold holder which constitute a part of a bending device and a mold position detection device were fractured. FIG. 8 is an exploded perspective view of FIG. 7. It is a top view which shows schematic structure of the punch metal mold | die and die metal mold | die used with a bending processing apparatus and a metal mold | die position detection apparatus. It is a schematic perspective view showing three types of punch dies and die dies having different widths. It is a figure which shows the structural example of the identification information transmission circuit which the metal mold | die of one Embodiment has. It is a figure which shows the conceptual structural example inside the identification information transmission circuit in FIG. It is a perspective view which shows the board | substrate with which the metal power receiving electrode and the metal displacement electrode were provided in one surface, and the identification information transmission circuit was mounted in the other surface. It is a fragmentary sectional view which shows the state before and behind mounting | wearing a punch die with an upper die holder. It is a fragmentary perspective view which shows the example of the positional relationship which a holder electric power feeding electrode and holder detection electrode, a metal power receiving electrode, and a metal displacement electrode oppose when a some punch metal mold | die is mounted | worn with an upper metal mold | die holder. It is a figure for demonstrating that a capacitor circuit is formed by the holder electric power feeding electrode and metal mold | die receiving electrode which mutually oppose, and the holder detection electrode and metal mold | die displacement electrode which mutually oppose. It is a figure for demonstrating that the voltage information taken out from a holder detection electrode changes according to the relative positional relationship of a holder detection electrode and a metal mold | die displacement electrode. It is a characteristic view of the 1st example which voltage information which changes according to a shift of a position of a holder detection electrode and metallic mold displacement electrode which counter mutually is shown. It is a figure for demonstrating the deviation | shift amount of the position of the holder detection electrode and metal mold | die displacement electrode which mutually oppose. It is a figure which shows the example of the voltage value obtained from a holder detection electrode according to the deviation | shift amount of the position of the holder detection electrode and metal mold | die displacement electrode which mutually oppose. It is a characteristic view of the 2nd example which voltage information which changes according to a shift of a position of a holder detection electrode and metallic mold displacement electrode which counter mutually is shown. It is a figure which shows the example of the table which a characteristic information holding part hold | maintains. It is a figure which shows the setup information notionally. It is a flowchart for demonstrating the 1st operation example of the bending apparatus of 1st Embodiment. It is a top view which shows the 1st example in which the punch die instruct | indicated by the setup information and the punch die actually mounted | worn are equivalent. It is a top view which shows the 2nd example in which the punch metal mold | die instruct | indicated by setup information and the punch metal mold | die actually mounted | worn are equivalent. It is a flowchart for demonstrating the 2nd operation example of the bending apparatus of 1st Embodiment. It is a bending apparatus of 2nd Embodiment, and is a partial top view of the bending apparatus using an intermediate | middle board. It is a fragmentary perspective view which shows an example of a rack apparatus.

  Hereinafter, a mold detection apparatus according to an embodiment, a bending apparatus according to each embodiment, and a mold according to an embodiment will be described with reference to the accompanying drawings. In the configuration example described in detail below, a mold information / position detection device capable of detecting identification information of a mold mounted on a mold mounting portion and detecting a position of the mold is a mold detection according to an embodiment. It is a device. The configuration of the bending apparatus according to each embodiment in which the mold information / position detection apparatus is mounted and the configuration of the rack apparatus in which the mold information / position detection apparatus is mounted will be described.

<First embodiment of bending apparatus>
A bending apparatus 100 according to the first embodiment shown in FIG. 1 is equipped with a mold information / position detecting device as will be described in detail later. In conjunction with the description of the bending apparatus 100, the specific configuration of the mold will be described.

  In FIG. 1, an upper table 2 and a lower table 3 are attached to the left and right side frames 1L, 1R. The upper table 2 moves up and down by hydraulic cylinders 4 provided on the left and right. The upper table 2 moves in the direction of the lower table 3 with the position shown in FIG. Instead of moving the upper table 2 up and down, the lower table 3 may be moved up and down.

  An upper mold holder 5 for mounting the punch mold TP is attached to the lower end portion of the upper table 2. A lower mold holder 6 for mounting the die mold TD is attached to the upper end portion of the lower table 3. The upper mold holder 5 and the lower mold holder 6 are an example of a mold mounting portion for mounting the punch mold TP or the die mold TD.

  In the upper mold holder 5, a groove-shaped recess 51 is formed along the longitudinal direction of the upper mold holder 5 to accommodate an end that is a part of the punch mold TP. A scale 52 is formed on the upper mold holder 5 along the longitudinal direction of the upper mold holder 5. The operator can use the scale 52 as a guideline at which position in the longitudinal direction of the upper mold holder 5 to mount the punch mold TP.

  In the lower mold holder 6, a groove-shaped recess 61 is formed along the longitudinal direction of the lower mold holder 6 to accommodate an end that is a part of the die mold TD. A scale 62 is formed in the lower mold holder 6 along the longitudinal direction of the lower mold holder 6. The operator can use the scale 62 as a guideline at which position in the longitudinal direction of the lower mold holder 6 to mount the die mold TD.

  The scales 52 and 62 are, for example, the center in the longitudinal direction of the upper mold holder 5 and the lower mold holder 6 is set to 0, the right direction when viewed from the front is a plus (+) distance, and the left direction is minus (−). The distance in the direction. The left end portions of the upper mold holder 5 and the lower mold holder 6 may be zero.

  On the back side of the upper table 2 and the lower table 3, a back gauge 7 is provided for abutting the plate material when the plate material is bent. The back gauge 7 has abutting members 71 and 72 mounted in a direction orthogonal to the longitudinal direction of the upper table 2 and the lower table 3.

  The back gauge 7 is movable in a direction toward and away from the upper table 2 and the lower table 3. The abutting members 71 and 72 are movable in the longitudinal direction of the upper table 2 and the lower table 3. When the plate material is bent, the back gauge 7 is moved by the NC device 10 described later so that the plate material can be abutted against the abutting members 71 and 72.

  The back gauge 7 has a punch mold TP in the longitudinal direction of the upper table 2 and the lower table 3 when the punch mold TP is mounted on the upper mold holder 5 and the die mold TD is mounted on the lower mold holder 6. It is also used to determine the position of the die mold TD. That is, the back gauge 7 which is a plate member abutting member is also used as a positioning mechanism for the punch mold TP and the die mold TD. The back gauge 7 is an example of a positioning mechanism for the punch mold TP and the die mold TD.

  FIG. 1 shows an example in which three punch molds TP and three die molds TD are mounted on both the upper mold holder 5 and the lower mold holder 6 so as to face each other. There are multiple types of punch molds TP and die molds TD with different widths and shapes. Select the type of punch mold TP and die mold TD according to the length of the part to be bent and the method of processing. Used.

  The number of punch dies TP and die dies TD to be mounted on the upper die holder 5 and the lower die holder 6 and the punch dies TP and dies in the longitudinal direction of the upper die holder 5 and the lower die holder 6 are also shown. The position of the mold TD is appropriately set according to the plate material to be bent and the method of processing.

  The bending apparatus 100 includes an NC apparatus 10 that controls the entire bending apparatus 100. The NC apparatus 10 has an operation / display panel 8 for displaying various information and operating the bending apparatus 100. The operation / display panel 8 has a touch panel, and an operator can perform various operation inputs using the touch panel. The NC device 10 is connected to various databases installed at a location separated from the location where the bending apparatus 100 is installed, for example, by a network.

  A specific configuration of the punch die TP and the die die TD will be described with reference to FIG. The punch mold TP and the die mold TD are one embodiment of the mold. In FIG. 2, one of a plurality of shapes is taken as an example, and the narrowest punch die TP and die die TD are shown.

  As shown in FIG. 2A, the tip P00 of the punch die TP has a sharp shape at a predetermined angle. In the punch die TP, a V-shaped recess P01 is formed in the vicinity of the end on the side to be mounted on the upper die holder 5. The recess P01 is formed on two opposing surfaces.

  If one of the two opposing surfaces is the front surface and the other is the back surface, the recess P01 is formed on both the front surface and the back surface. The upper mold holder has the front surface of the punch mold TP in front of FIG. This is because there are a case where it is attached to the upper die holder 5 and a case where it is attached to the upper die holder 5.

  The punch die TP includes a fall prevention pin P02 for preventing the fall when the punch die TP is mounted on the upper die holder 5, and an operation portion P03 for retracting the fall prevention pin P02. The side on which the fall prevention pin P02 is provided is the surface.

  The fall prevention pin P02 and the operation part P03 are urged in a direction that always protrudes from the punch die TP. The end of the punch mold TP can be engaged with the recess 51 of the upper mold holder 5, and the fall prevention pin P <b> 02 can be locked in a groove provided in the entire length in the longitudinal direction of the recess 51 of the upper mold holder 5. In this state, the punch die TP can be moved in the longitudinal direction along the recess 51.

  When the punch mold TP is mounted on the upper mold holder 5, the clamper provided in the upper mold holder 5 is engaged with the recess P 01 to fix the punch mold TP to the upper mold holder 5. It has become.

  In a state where the engagement between the clamper and the concave portion P01 is released, the operation portion P03 is pressed and moved against the urging force, and the locking state between the fall prevention pin P02 and the groove of the concave portion 51 can be released. Then, the punch die TP can be removed from the recess 51 and can be replaced with another punch die TP.

  In the punch die TP, an electrode to be described later is formed at an end portion on the side attached to the upper die holder 5, and the insulating film Tins covers the electrode. The electrode and the insulating film Tins are formed on both the front surface and the back surface of the punch die TP. The electrode is provided on a substrate described later. Here, the insulating film Tins covers the entire surface of the substrate on which the electrodes are formed.

  In FIG. 2A, although hidden behind the electrode substrate covered with the insulating film Tins, it is not visible on the back side of the substrate of the punch mold TP, the identification information for identifying each punch mold TP ( An identification information transmission circuit for transmitting so-called mold information) is mounted. Details of the identification information transmission circuit will be described later.

  The identification information provided in the punch dies TP may be assigned one identification information for each punch dies so that the identification information is different even for the same type of punch dies TP, One piece of identification information may be assigned for each type of punch die TP. When one piece of identification information is assigned to each punch die TP, it is possible to manage the usage period of each punch die TP.

  As shown in FIG. 2B, the tip D00 of the die mold TD is a V-shaped recess corresponding to the shape of the tip P00 of the punch mold TP. In the die mold TD, a recess D01 is formed in the vicinity of the end portion on the side attached to the lower mold holder 6. The recess D01 is also formed on both the front surface and the back surface.

  When the die mold TD is mounted on the lower mold holder 6, the clamper provided in the lower mold holder 6 is engaged with the recess D 01 so that the die mold TD is fixed to the lower mold holder 6. It has become.

  In the die mold TD, an electrode to be described later is formed at an end of the die mold TD that is attached to the lower mold holder 6, and an insulating film Tins covers the electrode. The electrode and the insulating film Tins are formed on both the front surface and the back surface of the die mold TD. Similarly, the electrode is formed on a substrate described later, and the insulating film Tins covers the entire surface of the substrate on which the electrode is formed.

  In FIG. 2B, although hidden behind the electrode substrate covered with the insulating film Tins, the identification information for identifying each die mold TD is provided on the back side of the substrate of the die mold TD. An identification information transmission circuit for transmission is mounted. Details of the identification information transmission circuit will be described later.

  The identification information provided in the die mold TD may be assigned one identification information to each die mold TD so that the identification information is different even for the same type of die mold TD. One piece of identification information may be assigned for each type of die mold TD. When one piece of identification information is assigned to each die die TD, it is possible to manage the usage period of each die die TD.

  The overall system configuration of the bending apparatus 100 will be described with reference to FIG. In FIG. 3, the NC apparatus 10 controls the entire bending apparatus 100. The NC device 10 displays various information such as setup information described later on the operation / display panel 8. The NC apparatus 10 controls the bending apparatus 100 so as to perform an operation in accordance with an operation input to the operation / display panel 8 made by an operator.

  A mold information / position detection unit 11 is connected to the NC device 10. As will be described in detail later, the mold information / position detection unit 11 includes the identification information and position of the punch mold TP mounted on the upper mold holder 5 and the die mold TD mounted on the lower mold holder 6. The identification information and the position are detected. The positions of the punch mold TP and the die mold TD are the mounting positions in the longitudinal direction with respect to the longitudinal length L of the upper mold holder 5 and the lower mold holder 6. The position information of the punch mold TP and the die mold TD detected by the mold information / position detection unit 11 is input to the NC apparatus 10.

  The NC device 10 includes a retained mold database (hereinafter referred to as retained mold DB) 21, a mold information database (hereinafter referred to as mold information DB) 22, a setup information database (hereinafter referred to as setup information DB) 23, and a machining process. An information database (hereinafter, processing information DB) 24 is connected. As described above, the retained mold DB 21, the mold information DB 22, the setup information DB 23, and the machining information DB 24 are connected to the NC apparatus 10 through a network.

  The held mold DB 21 stores information on the punch mold TP and the die mold TD held by the bending apparatus 100. Note that the punch mold TP and the die mold TD are housed in a rack apparatus separate from the bending apparatus 100 shown in FIG. 1, and the punch mold TP and the die mold necessary for each bending process are stored. The TD is taken out from the rack device and attached to the upper mold holder 5 and the lower mold holder 6.

  Therefore, the punch mold TP and the die mold TD held by the bending apparatus 100 are housed in the rack apparatus and may be used by the bending apparatus 100. That's what it means.

  The mold information DB 22 stores identification information indicating what kind of mold each punch mold TP and die mold TD is. The mold identification information includes the width of the punch mold TP and the die mold TD, the length of the punch mold TP and the die mold TD, the angle of the tips P00 and D00, and the like.

  In the setup information DB 23, when a predetermined bending process is performed on the plate material, selected die information indicating which punch die TP and die die TD are used, and the punch die TP and die die TD to be used. The setup information including at least mounting position information indicating where the upper mold holder 5 and the lower mold holder 6 are mounted in the longitudinal direction is stored. The processing information DB 24 stores information indicating what processing is performed.

  In FIG. 3, when the punch mold TP is mounted on the upper mold holder 5 or the die mold TD is mounted on the lower mold holder 6, the mold information / position detection unit 11 is the punch mold TP or The identification information and position of the die mold TD are detected. First, the identification information and position detection method of the punch die TP or the die die TD will be described with reference to FIGS.

  As shown in FIG. 4, the mold information / position detection unit 11 includes an information / position detection calculation unit 111 and an amplifier 114. The information / position detection calculation unit 111 includes a characteristic information holding unit 112 and an A / D converter 113. Here, the information / position detection calculation unit 111 includes the characteristic information holding unit 112 and the A / D converter 113, but the characteristic information holding unit 112 and the A / D converter 113 are connected to the information / position detection calculation unit 111. It may be provided outside the unit 111. The information / position detection calculation unit 111 can be configured by a microcomputer.

  The structure with which the upper mold holder 5 and the lower mold holder 6 are provided will be described with reference to FIG. The upper mold holder 5 and the lower mold holder 6 have a holder feeding electrode 31 shown in FIG. The holder feeding electrode 31 has the same length as the length L in the longitudinal direction of the upper mold holder 5 and the lower mold holder 6. Further, the upper mold holder 5 and the lower mold holder 6 have a plurality of holder detection electrodes 32 shown in FIG.

  The length L is 2 to 4 m, for example, and is assumed to be 4 m here. When the width of the narrowest punch mold TP and die mold TD is 10 mm, the upper mold holder 5 and the lower mold holder 6 are mounted with a maximum of 400 punch molds TP and die molds TD. Will be. Therefore, when the length L is 4 m and the width of the narrowest punch die TP and die die TD is 10 mm, 400 holder detection electrodes 32 are provided.

  Thus, it is preferable to provide as many holder detection electrodes 32 as possible when the narrowest mold is mounted on the mold mounting portion.

The individual holder detection electrodes 32 are referred to as holder detection electrodes 32 _{1 to} 32 _400, and the case where any of the holder detection electrodes 32 _{1 to} 32 ₄₀₀ is not specified is referred to as a holder detection electrode 32.

  As shown in FIG. 4, the holder power supply electrode 31 and the holder detection electrode 32 are separated from each other by a small distance and are insulated from each other. It is preferable to insulate the holder power supply electrode 31 and the holder detection electrode 32 by covering each of the holder power supply electrode 31 and the holder detection electrode 32 with an insulating film using, for example, a resist.

A voltage information extraction unit 330 is connected to the holder detection electrode 32. The voltage information extraction unit 330 is configured as follows. The voltage information extraction unit 330 includes a shift register SR including D flip-flops 33 _{1 to} 33 ₄₀₀ . A case where any _{one of the} D flip-flops 33 _{1 to} 33 ₄₀₀ is not specified will be referred to as a D flip-flop 33.

The voltage information extraction unit 330 further includes amplifiers 34 _{1 to} 34 ₄₀₀ connected to the holder detection electrodes 32 _{1 to} 32 ₄₀₀ , and switches 35 _{1 to} 35 ₄₀₀ connected to the amplifiers 34 _{1 to} 34 ₄₀₀ , respectively. Have The case where any _{one of the} amplifiers 34 _{1 to} 34 ₄₀₀ is not specified is referred to as an amplifier 34 _{, and the} case where any one of _the switches 35 _{1 to} 35 ₄₀₀ is not specified is referred to as a switch 35.

  In FIG. 4, an information / position detection calculation unit 111 generates an AC waveform signal, and an amplifier 114 amplifies the AC waveform signal and supplies an AC power supply signal Sfac to the holder power supply electrode 31. In the present embodiment, the power supply signal Sfac is a rectangular wave signal. The power supply signal Sfac may be a sine wave signal. The mold information / position detection unit 11 is a power supply signal supply unit that supplies an AC power supply signal Sfac to the holder power supply electrode 31.

  As shown in FIG. 5A, the power supply signal Sfac is a rectangular wave signal in which a signal section having a frequency of 10 kHz and a signal section having a frequency of 50 kHz are mixed as an example. A signal interval having a frequency of 50 kHz is defined as a first AC waveform interval having a first frequency, and a signal interval having a frequency of 10 kHz is defined as a second AC waveform interval having a second frequency.

  As will be described later, the first AC waveform section with a frequency of 50 kHz is the die mold mounted on the punch mold TP or the lower mold holder 6 mounted on the upper mold holder 5 by the mold information / position detection unit 11. Used to detect identification information of type TD. The second AC waveform section of frequency 10 kHz indicates the position of the punch die TP attached to the upper die holder 5 or the die die TD attached to the lower die holder 6 by the die information / position detection unit 11. Used to detect.

  The first AC waveform section having a frequency of 50 kHz is referred to as an ID reception section Tid, and the second AC waveform section having a frequency of 10 kHz is referred to as a position detection section Tp. As shown in FIG. 6A, the information / position detection calculation unit 111 generates a power supply signal Sfac that alternately outputs a rectangular wave signal in the ID reception section Tid and a rectangular wave signal in the position detection section Tp.

The information / position detection calculation unit 111 supplies a switching control signal Scsw that alternately switches between high (H) and low (L) to the clock (C) terminals of all D flip-flops 33. Information and the position detection calculation unit 111, to the D flip-flop 33 ₁ D terminal of the voltage information extraction unit 330 supplies the initial input signal Sini. The initial input signal Sini may be a pulse signal that is one pulse of H.

When the H switching control signal Scsw and the initial input signal Sini are input to the D flip-flop 33 ₁ , the output of the Q terminal becomes H and the switch 35 ₁ is turned on. Then, the voltage information from the holder detection electrode 32 ₁ is amplified by the amplifier 34 ₁ and input to the information / position detection calculation unit 111 as the voltage information signal Siec via the switch 35 ₁ . The reason why the voltage information is obtained from the holder detection electrode 32 will be described later.

When the output of the Q terminal of the D flip-flop 33 ₁ becomes H, H is input to the D terminal of the D flip-flop 33 ₂ . When the switching control signal Scsw next becomes H, similarly, the output of the Q terminal of the D flip-flop 33 ₂ becomes H and the switch 35 ₂ is turned on. Consequently, the voltage information from the holder detection electrode 32 ₂ is amplified by the amplifier 34 ₂ is inputted as the voltage information signal Siec via the switch 35 ₂ and to the information and position detection calculation section 111.

In this manner, the D flip-flop 33 of the shift register SR goes from the D flip-flop 33 ₁ to the D flip-flop 33 ₄₀₀ , and the output of the Q terminal sequentially becomes H every clock of the switching control signal Scsw. Since only the switch 35 to the output of the Q terminal is connected to the D flip-flop 33 becomes H are turned on, the switch 35 is successively turned on and the switches 35 ₁ to the switch 35 _400.

Accordingly, the respective voltage information from the holder detection electrode 32 ₁ to the holder detection electrode 32 ₄₀₀ is sequentially extracted and input to the information / position detection calculation unit 111 as the voltage information signal Siec.

When it the output of the Q terminal of the D flip-flop 33 ₄₀₀ and H, by supplying the initial input signal Sini to the D terminal of the D flip-flop 33 ₁ again, the same operation is repeated. The initial input signal Sini may be a pulse signal that becomes H once in one cycle when the voltage information extraction unit 330 sequentially switches all the holder detection electrodes 32.

The shift register SR operates as an electrode switching circuit that selectively selects a holder detection electrode 32 from which voltage information is to be extracted from among the holder detection electrodes 32 _{1 to} 32 ₄₀₀ and sequentially switches them.

  The voltage information signal Siec input to the information / position detection calculation unit 111 is converted into a digital signal by the A / D converter 113. The information / position detection calculation unit 111 demodulates the identification information waveform signal included in the voltage information signal Siec, so that the punch mold TP or die mold mounted on the upper mold holder 5 or the lower mold holder 6 is used. TD identification information is detected. A method for detecting the identification information will be described later.

  In addition, the information / position detection calculation unit 111 is configured so that the voltage information signal Siec is obtained from which holder detection electrode 32 is referred to, and by referring to the voltage value obtained by converting the voltage information signal Siec into a digital signal, The positions of the punch mold TP and the die mold TD attached to the mold holder 5 or the lower mold holder 6 are detected. A calculation method for position detection will be described later.

  How the holder power supply electrode 31, the holder detection electrode 32, and the voltage information extraction unit 330 are attached to the upper mold holder 5 and the lower mold holder 6 will be described with reference to FIGS.

  7 and 8 are cut partial perspective views in which the upper mold holder 5 and the lower mold holder 6 are cut at the front end of the recesses 51 and 61 in FIG. As shown in FIG. 7, a metal plate 36 is attached to the side walls of the recesses 51 and 61, and a circuit board 37 is attached to the metal plate 36. The circuit board 37 includes a holder power supply electrode 31, a holder detection electrode 32, and a voltage information extraction unit 330 as an internal configuration. On the surface of the circuit board 37, an insulating film 31ins that covers the holder feeding electrode 31 and an insulating film 32ins that covers the holder detection electrode 32 are formed.

  As shown in FIG. 8, a recess 40 for receiving the metal plate 36 is formed on the side walls of the recesses 51 and 61. The side walls of the recesses 51 and 61 are inner walls of the upper mold holder 5 and the lower mold holder 6. In the recess 40, two metal pins 41 are embedded in a range where one metal plate 36 is attached. A hole 36 a corresponding to the metal pin 41 is formed in the metal plate 36. When the metal plate 36 is accommodated in the recess 40 so that the metal pin 41 is inserted into the hole 36 a, the metal plate 36 is positioned in the recess 40.

  In the recess 40, three holes 42 having internal threads are formed in a range where one metal plate 36 is attached. The metal plate 36 has three holes 42 and corresponding holes 36b. If the male screw 43 is fastened to the hole 42 through the hole 36 b in a state where the metal plate 36 is positioned in the recess 40, the metal plate 36 is firmly fixed to the recess 40. The fixing method of the metal plate 36 with respect to the recess 40 shown in FIG. 8 is merely an example, and is not limited to the fixing method shown in FIG.

  In the example shown in FIGS. 7 and 8, two circuit boards 37 are mounted on one metal plate 36. The metal plate 36 has eight protrusions 36c at the ends in the vertical direction of FIGS. A semicircular cutout 37c is formed at the vertical end of the circuit board 37 in FIGS. The circuit board 37 is fixed to the metal plate 36 by engaging the notch 37c with the protrusion 36c. The fixing method of the circuit board 37 to the metal plate 36 shown in FIG. 8 is merely an example, and is not limited to the fixing method shown in FIG.

  Next, further detailed configurations of the punch die TP and the die die TD will be described with reference to FIGS. As described with reference to FIG. 2, although the punch mold TP and the die mold TD have different shapes, FIGS. 9 and 10 show schematic shapes of the punch mold TP and the die mold TD.

  As shown in FIG. 9, the punch mold TP and the die mold TD have a mold power receiving electrode T31 and a mold displacement electrode T32. The mold power receiving electrode T31 and the mold displacement electrode T32 are separated by a predetermined distance. The mold power receiving electrode T31 and the mold displacement electrode T32 are provided on the substrate TS shown in FIG. 13A, and the entire surface of the substrate TS is covered with, for example, an insulating film Tins using a resist. It is not essential to provide the insulating film Tins, but it is preferable to provide the insulating film Tins.

  The length of the mold power receiving electrode T31 in the vertical direction in FIG. 9 is substantially the same as the length in the short direction of the holder power feeding electrode 31 described in FIG. The short direction of the holder feeding electrode 31 is the depth direction of the recesses 51 and 61 of the upper mold holder 5 and the lower mold holder 6. The length of the mold displacement electrode T32 in the vertical direction in FIG. 9 is substantially the same as the length in the depth direction of the recesses 51 and 61 in the holder detection electrode 32 described in FIG.

  The width of the holder detection electrode 32 is preferably substantially the same as the width of the mold displacement electrode T32. It is more preferable that the width of the holder detection electrode 32 and the width of the mold displacement electrode T32 are completely matched. As a matter of course, since the dimension includes an error, it is assumed that the same includes substantially the same state.

  In the example shown in FIG. 9, the widths of the mold power receiving electrode T31 and the mold displacement electrode T32 are the same, but the width of the mold power reception electrode T31 may be wider than the width of the mold displacement electrode T32.

  (A), (b), and (c) of FIG. 10 show three types of punch molds TP and die molds TD having different widths. FIG. 10A shows a punch die TP and a die die TD having a narrowest width of 10 mm. The die power receiving electrode T31 and the die displacement electrode T32 have a fixed width regardless of the width of the punch die TP and the die die TD, and the width of the punch die TP and the die die TD. It is preferable to provide in the center of the direction. Since the narrowest punch mold TP and die mold TD have a width of 10 mm, the width of the mold power receiving electrode T31 and the mold displacement electrode T32 is, for example, 5 mm.

  As shown in FIG. 11, an identification information transmission circuit 45 is provided between the mold power receiving electrode T31 and the mold displacement electrode T32. The mold power receiving electrode T31 and the mold displacement electrode T32 are indirectly connected via the identification information transmission circuit 45. The identification information transmission circuit 45 includes a diode D45, a capacitor C45, and a one-chip microcomputer (hereinafter referred to as a one-chip microcomputer) 451.

  As will be described later, a rectangular wave signal Ssqw equivalent to the power supply signal Sfac shown in FIG. 5A is output from the mold power receiving electrode T31. The one-chip microcomputer 451 is supplied with a voltage generated by rectifying the rectangular signal Ssqw output from the mold power receiving electrode T31 by the diode D45 and smoothing it by the capacitor C45 as the power supply voltage Vin.

  FIG. 12 shows a conceptual configuration inside the one-chip microcomputer 451. In FIG. 12, illustration of the power supply voltage Vin input to the one-chip microcomputer 451 is omitted. The one-chip microcomputer 451 includes a frequency discriminating unit 4511, an identification information holding unit 4512, and an identification information waveform generating unit 4513. The identification information holding unit 4512 holds identification information of the punch die TP or the die die TD. In this embodiment, the identification information is, for example, 20 bits.

  The frequency discriminating unit 4511 discriminates the frequency of the input rectangular wave signal Ssqw and discriminates between the ID receiving section Tid having a frequency of 50 kHz and the position detecting section Tp having a frequency of 10 kHz. The identification information waveform generation unit 4513 includes the identification information waveform signal Sid including the identification information waveform based on the identification information held in the identification information holding unit 4512 in the period determined by the frequency determination unit 4511 as the ID reception section Tid. Is generated and output.

  The identification information transmission circuit 45 can be realized at low cost by using the one-chip microcomputer 451. According to the configuration of the identification information transmission circuit 45 shown in FIG. 11, it is not necessary to separately provide a power supply circuit that supplies a power supply voltage to the one-chip microcomputer 451. Also in this respect, the identification information transmission circuit 45 can be realized at low cost.

  13A shows the front side of the substrate TS, and FIG. 13B shows the back side of the substrate TS. As shown in FIG. 13B, the identification information transmission circuit 45 is mounted on the back surface of the substrate TS. The substrate TS provided with the mold power receiving electrode T31 and the mold displacement electrode T32 on the front surface and the identification information transmission circuit 45 mounted on the back surface is arranged such that the metal power receiving electrode T31 and the mold displacement electrode T32 are on the outer surface side. The punch die TP and the die die TD are mounted.

  Since the identification information transmission circuit 45 is mounted on the back surface of the substrate TS, oil does not adhere to the identification information transmission circuit 45, and the impact applied to the punch mold TP or the die mold TD is not directly transmitted. . Therefore, the punch mold TP or the die mold TD of one embodiment has a structure that can withstand a harsh environment.

  As shown in FIG. 14 (a), the punch die TP is inserted into the recess 51 of the upper die holder 5 from the side where the die power receiving electrode T31 and the die displacement electrode T32 are formed. When the TP is mounted on the upper mold holder 5, as shown in FIG. 14B, the mold power receiving electrode T31 faces the holder power feeding electrode 31, and the mold displacement electrode T32 faces the holder detection electrode 32.

  Similarly, when the die mold TD is mounted in the recess 61 of the lower mold holder 6 from the side where the mold power receiving electrode T31 and the mold displacement electrode T32 are formed, the mold power receiving electrode T31 faces the holder power feeding electrode 31. The mold displacement electrode T32 faces the holder detection electrode 32.

  In FIG. 14, for simplification, as the configuration of the upper mold holder 5, the illustration of the metal plate 36 described in FIG. 8 is omitted, and only the holder feeding electrode 31 and the holder detection electrode 32 are shown. In FIG. 14, the illustration of the insulating film Tins covering the mold power receiving electrode T31 and the mold displacement electrode T32 is omitted.

  As shown in FIG. 14B, if the holder power supply electrode 31 and the mold power receiving electrode T31 are clearly separated, the holder detection electrode 32 and the mold displacement electrode T32 are clearly separated. As a result, the holder power supply electrode 31 and the mold power receiving electrode T31 do not come into contact with each other, and the holder detection electrode 32 and the mold displacement electrode T32 do not come into contact with each other. Therefore, the insulating films 31ins, 32ins, and Tins are not necessarily required.

  However, when the distance between the holder feeding electrode 31 and the mold receiving electrode T31 and the distance between the holder detection electrode 32 and the mold displacement electrode T32 are relatively short, it is necessary to provide insulating films 31ins, 32ins, and Tins. Become.

  The holder power feeding electrode 31 and the mold power receiving electrode T31 may be close to each other without contacting each other. The holder detection electrode 32 and the mold displacement electrode T32 may be close to each other without contacting each other. When the insulating films 31ins, 32ins, and Tins are provided, the insulating films 31ins, 32ins and the insulating film Tins may be in contact with each other. Even in this case, the holder feeding electrode 31 and the mold receiving electrode T31 face each other without contacting each other, and the holder detection electrode 32 and the mold displacement electrode T32 face each other without contacting each other. Will be.

  FIG. 15 illustrates only the holder feeding electrode 31 and the holder detection electrode 32, the mold receiving electrode T31, and the mold displacement electrode T32 when the three punch dies TP are mounted on the upper mold holder 5. . When the die mold TD is mounted on the lower mold holder 6, the vertical relationship is reversed from that in FIG. The punch mold TP and the die mold TD are attached to the upper mold holder 5 and the lower mold holder 6 at positions in the longitudinal direction according to the setup information.

  Accordingly, the mold displacement electrode T32 may face the holder detection electrode 32 so as to coincide with the holder detection electrode 32, or may face the two holder detection electrodes 32.

  In FIG. 15, the mold displacement electrode T <b> 32 that faces the holder detection electrode 32 just to coincide with the mold, the mold displacement electrode T <b> 32 that faces the two holder detection electrodes 32 evenly, and the two holder detection electrodes 32. An example is shown in which there is a mold displacement electrode T32 that is opposed to one side of the mold.

  The operation of the holder feeding electrode 31, the mold receiving electrode T31, the holder detection electrode 32, and the mold displacement electrode T32 facing each other will be described with reference to FIG. In FIG. 16, for easy understanding, it is assumed that the mold displacement electrode T <b> 32 coincides with and faces one holder detection electrode 32.

  As shown in FIG. 16, since the holder feeding electrode 31 and the mold power receiving electrode T31 face each other in close proximity without contacting each other, the pair of the holder power feeding electrode 31 and the mold power receiving electrode T31 is parallel. A plate capacitor C31 is formed. The parallel plate capacitor C31 is a first capacitor.

  Further, since the holder detection electrode 32 and the mold displacement electrode T32 face each other without contacting each other, the pair of the holder detection electrode 32 and the mold displacement electrode T32 forms a parallel plate capacitor C32. Will do. The parallel plate capacitor C32 is a second capacitor.

  As described above, when the power supply signal Sfac that is a rectangular wave signal is supplied to the holder power supply electrode 31, the power supply signal Sfac is transmitted to the mold power reception electrode T31 via the parallel plate capacitor C31, and is identified as the rectangular wave signal Ssqw. It is supplied to the information transmission circuit 45. As shown in FIG. 5B, the identification information transmission circuit 45 shapes the rectangular wave signal in the ID reception section Tid having a frequency of 50 kHz based on the identification information held in the identification information holding unit 4512 to An identification information waveform signal Sid including a bit identification information waveform is generated.

  The identification information waveform generation unit 4513 can generate an identification information waveform signal Sid as shown in FIG. 5B depending on whether or not to gate the rectangular wave signal in the ID reception section Tid. FIG. 5B shows partial bits out of 20 bits.

In FIG. 5B, the two period sections of the rectangular wave signal in the ID reception section Tid are set to 1 bit. However, what period section is set to 1 bit may be appropriately set. For example, if the 10 period section is 1 bit, the time for 1 bit is 0.2 ms from 10 / (50 × 10 ³ ). Therefore, 20-bit identification information can be expressed in 4 mS. When the position detection section Tp is 10 cycles, the position detection section Tp is 1 mS.

  The identification information transmission circuit 45 (identification information waveform generation unit 4513) outputs a rectangular wave signal of the position detection section Tp having a frequency of 10 kHz as it is. Therefore, the identification information waveform signal Sid output from the identification information transmission circuit 45 is a rectangular wave signal having a frequency of 10 kHz in the position detection section Tp and a rectangle indicating identification information of 20 bits, as shown in FIG. Waveform with mixed wave signal. Since the rectangular wave signal in the position detection section Tp is not used as identification information, the identification information waveform signal Sid shown in (b) of FIG. 5 is substantially equivalent to the waveform shown in (c) of FIG.

  The identification information waveform signal Sid shown in FIG. 5B is output from the holder detection electrode 32 via the parallel plate capacitor C32. From the holder detection electrode 32, voltage information of a rectangular wave signal equivalent to the identification information waveform signal Sid shown in FIG. The rectangular wave signal extracted from the holder detection electrode 32 is amplified by the amplifier 34 and becomes a voltage information signal Siec.

It is assumed that the punch die TP or the die die TD is at the position of the holder detection electrode 32 _n . 6B shows a D flip-flop 33 _(n-1) corresponding to the holder detection electrode 32 _(n-1) , a D flip-flop 33 _n corresponding to the holder detection electrode 32 _n, and the holder detection electrode 32. _{(n + 1)} and the corresponding D flip-flop 33 _{(n + 1)} shows a pulse switching control signal Scsw supplied to each.

From the holder detection electrode 32 _n is a square wave signal including a rectangular wave signal of a frequency 10kHz position detection section Tp shown in FIG. 6 (c), and 20-bit identification information ID received section Tid retrieved. This rectangular wave signal is amplified by the amplifier 34 and supplied to the information / position detection calculation unit 111 as the voltage information signal Siec.

  The information / position detection calculation unit 111 demodulates the identification information waveform signal included in the voltage information signal Siec, and is attached to the punch die TP attached to the upper die holder 5 or the lower die holder 6. The type of die mold TD that is present is detected. The information / position detection calculation unit 111 may discriminate the frequency of the rectangular wave signal of the voltage information signal Siec and recognize the part excluding the part having the frequency of 10 kHz as the identification information waveform.

  Next, a method for detecting the position of the punch mold TP mounted on the upper mold holder 5 and the position of the die mold TD mounted on the lower mold holder 6 by the mold information / position detection unit 11 will be described. .

  The capacitor capacity of the capacitor C31 constituted by the holder power supply electrode 31 and the mold power receiving electrode T31 does not change even if the position of the mold changes, because the facing area does not increase or decrease. On the other hand, the capacitor capacity of the capacitor C32 composed of the holder detection electrode 32 and the mold displacement electrode T32 changes greatly as the position of the mold changes.

  The capacitor C31 constituted by the holder feeding electrode 31 and the mold receiving electrode T31 and the capacitor C32 constituted by the holder detection electrode 32 and the mold displacement electrode T32 form a series capacitor circuit. The capacitor capacity of this capacitor circuit increases or decreases according to the relative positional relationship between the holder detection electrode 32 and the mold displacement electrode T32.

  With reference to FIG. 17, how the voltage information signal Siec is obtained by the difference in relative positional relationship between the holder detection electrode 32 and the mold displacement electrode T32 will be described.

17A corresponds to the plan view of FIG. The leftmost mold displacement electrode T32 is opposed to exactly match the holder detection electrode 32 _2. The second mold displacement electrode T32 from the left is opposed to the holder detection electrode 32 ₄ and the holder detection electrode 32 ₅ evenly. The third mold displacement electrode T32 from the left is opposed to the holder detection electrodes 32 ₇ and 32 ₈ while being shifted to the holder detection electrode 32 ₇ side.

  17B shows voltage information detected by each holder detection electrode 32 when the mold displacement electrode T32 exists as shown in FIG. 17A. The horizontal axis in FIG. 17B indicates the position. In each of the positions p1, p2, p3..., Voltage information is obtained from the holder detection electrodes 32 that are sequentially selected. The vertical axis in FIG. 17B represents voltage information, which is a digital value obtained by converting the voltage information signal Siec in the position detection section Tp into a digital signal by the A / D converter 113. The information / position detection calculation unit 111 stores sequentially obtained voltage information.

  As shown in FIG. 17B, the voltage information obtained from the holder detection electrode 32 not facing the mold displacement electrode T32 has a very small level because the capacitor capacitor C31 and the capacitor C32 described above are not formed. It becomes. That is, voltage information of a predetermined level or higher is not output from the holder detection electrode 32 that is not opposed to the mold displacement electrode T32. In the position detection of the punch mold TP and the die mold TD by the information / position detection calculation unit 111 described below, voltage information of a very small level obtained from the holder detection electrode 32 not facing the mold displacement electrode T32 Is assumed to be 0.

In the holder detection electrodes 32 _4, 32 _5, since the die displacement electrode T32 are partially equally opposed respectively, connected to the amplifier 34 ₄ connected to the holder detection electrodes 32 _4, the holder detection electrode 32 ₅ so that the voltage information signal Siec of the same value smaller than the maximum voltage information signal Siec is obtained from the amplifier 34 _5, which is. Therefore, the voltage information obtained corresponding to the holder detection electrode 32 ₄ at the position p4 and the voltage information obtained corresponding to the holder detection electrode 32 ₅ at the position p5 have the same value.

In the holder detection electrode 32 _7, 32 _8, most mold displacement electrode T32 is the holder detection electrode 32 _7, since the uneven opposing with less relative to the holder the detecting electrode 32 _8, the holder detection electrodes It becomes the value is larger voltage information signal Siec obtained from the amplifier 34 ₇ connected to 32 _7, towards the voltage information signal Siec obtained from the amplifier 34 ₈ connected to the holder the detecting electrode 32 ₈ is a small value. The voltage information signal Siec obtained from the amplifiers 34 ₇ and 34 ₈ is a value smaller than the maximum voltage information signal Siec.

Therefore, the voltage information obtained corresponding to the holder detection electrode 32 ₇ at the position p7 and the voltage information obtained corresponding to the holder detection electrode 32 ₈ at the position p8 have the relationship as shown in FIG. Become.

  The information / position detection calculation unit 111 uses the punch die TP and the die die based on the voltage information value as shown in FIG. 17B or based on the change in the voltage information value corresponding to the position. It is detected at which position in the longitudinal direction of the upper mold holder 5 and the lower mold holder 6 the mold TD is mounted.

  The information / position detection calculation unit 111 can roughly grasp the position of the punch die TP or the die die TD based on the magnitude of the voltage information shown in FIG. Then, a fine and precise position of the punch mold TP or the die mold TD can be obtained by calculation of position detection described below. For example, in the case of calipers, the former corresponds to the caliper main scale, and the latter corresponds to the caliper vernier scale.

  First, an example of a position detection method when the distance between the holder power supply electrode 31 and the mold power receiving electrode T31 and the distance between the holder detection electrode 32 and the mold displacement electrode T32 are constant will be described. When there is little difference between the distance between the recesses 51 and 61 and the thickness of the punch mold TP and the die mold TD, and the distance between the circuit board 37 and the punch mold TP or the die mold TD is substantially constant, the holder The distance between the feeding electrode 31 and the mold receiving electrode T31 and the distance between the holder detection electrode 32 and the mold displacement electrode T32 can be regarded as constant.

  As shown in FIG. 18, the voltage information, which is a digital value obtained by converting the voltage information signal Siec into a digital signal, has a maximum value Vmax when the holder detection electrode 32 and the mold displacement electrode T32 are exactly coincident with each other. Thus, it has a characteristic that it gradually decreases in accordance with the amount of deviation between the holder detection electrode 32 and the mold displacement electrode T32. When the mold displacement electrode T32 is displaced to the left in FIG. 12A with respect to the holder detection electrode 32, the displacement is minus (−), and when it is displaced to the right is plus (+). To do.

  If the distance between the holder feeding electrode 31 and the mold receiving electrode T31 and the distance between the holder detection electrode 32 and the mold displacement electrode T32 are constant, the value of the voltage information is the value of the holder detection electrode 32 and the mold displacement electrode. It is absolutely determined according to the amount of deviation from T32.

  The characteristic information holding unit 112 holds the characteristic indicating the relationship between the deviation amount and the voltage information shown in FIG. 18 as characteristic information. For example, when the maximum value Vmax of a predetermined voltage value is obtained as voltage information, the information / position detection calculation unit 111 may detect that the mold displacement electrode T32 is at a position that exactly matches the holder detection electrode 32. it can.

The case where the mold displacement electrode T32 is opposed to the holder detection electrode 32 _7, 32 ₈ with a shift in the holder detection electrode 32 ₇ side as an example. Information and the position detection calculation unit 111, based on the voltage value V1, V2 obtained as voltage information, the shift amount L1 of the width direction of the center in the width direction of the center and the holder detection electrode 32 ₇ of the mold displacement electrode T32 , it can be obtained and the deviation amount L2 of the width direction of the center in the width direction of the center and the holder detection electrodes 32 ₈ of the mold displacement electrode T32.

  The information / position detection calculation unit 111 can detect the position of the mold displacement electrode T32 (that is, the position of the punch mold TP or the die mold TD) based on the shift amounts L1 and L2.

  Next, an example of a position detection method when the distance between the holder power supply electrode 31 and the mold power receiving electrode T31 and the distance between the holder detection electrode 32 and the mold displacement electrode T32 are not always constant will be described. When the distance between the circuit board 37 and the punch mold TP or the die mold TD is not constant, the characteristics shown in FIG. 18 change according to the distance. In this case, the value of voltage information is not absolutely determined.

Therefore, the information / position detection calculation unit 111 detects the position of the mold displacement electrode T32 as follows. The information / position detection calculation unit 111 can detect the rough position of the mold displacement electrode T32 based on the change in the value of the voltage information shown in FIG. As the position pi to p3, voltage information is 0, if the change to the maximum value Vmax, 0, information and position detection calculation unit 111, so that the mold displacement electrode T32 just coincides with the holder detection electrode 32 ₂ Can be detected.

  When a predetermined voltage value exceeding 0 is obtained at two adjacent holder detection electrodes 32 as in positions p4 and p5 and positions p7 and p8, the information / position detection calculation unit 111 determines that the mold displacement electrode T32 is It can be detected that it straddles the two holder detection electrodes 32. Then, the information / position detection calculation unit 111 specifies the position of the mold displacement electrode T32 based on the relative relationship between the voltage values V1 and V2 corresponding to the two adjacent holder detection electrodes 32.

The information / position detection calculation unit 111 is, for example, the following equation (1):
(V1-V2) / (V1 + V2) (1)
Is calculated, the position when the mold displacement electrode T32 straddles two adjacent holder detection electrodes 32 can be obtained. The molecule of formula (1) may be (V2-V1).

Assume that the maximum value Vmax is 10 mV, the voltage value obtained at positions p4 and p5 is 5 mV, the voltage value obtained at position p7 is 8 mV, and the voltage value obtained at position p8 is 2 mV. These numbers are just examples. In the case where the mold displacement electrode T32 is evenly spread over the holder detection electrodes 32 ₄ and 32 ₅ , it becomes 0 from (5-5) / (5 + 5) using the equation (1). That is, if the value calculated by the formula (1) is 0, it means that the mold displacement electrode T32 is located evenly across the two adjacent holder detection electrodes 32.

When the mold displacement electrode T32 is shifted to the holder detection electrode 32 ₇ side and straddles the holder detection electrodes 32 ₇ and 32 ₈ , 0 is obtained from (8-2) / (8 + 2) using the equation (1). .6. In the calculation formula of Formula (1), the larger the calculated value is, the larger the value is than 0, the more the two adjacent holder detection electrodes 32 are shifted in the left direction in FIG. In addition, the larger negative value the calculated value is than 0 is that the two adjacent holder detection electrodes 32 are shifted to the right in FIG.

  In this way, when a predetermined voltage value exceeding 0 is obtained in the two adjacent holder detection electrodes 32, the information / position detection calculation unit 111 uses the calculation formula (1), It is possible to detect the position of the mold displacement electrode T32 relative to the two adjacent holder detection electrodes 32.

  The method of detecting where the mold displacement electrode T32 is located with respect to the two adjacent holder detection electrodes 32 is not limited to the method of detecting using the above-described calculation. The position may be detected as follows.

  FIG. 19 shows the positional relationship between two adjacent holder detection electrodes 32 and the mold displacement electrode T32. In FIG. 19, in order to facilitate understanding, the holder detection electrode 32 and the mold displacement electrode T32 are illustrated as being shifted in the vertical direction. Of the two holder detection electrodes 32, the left holder detection electrode 32 is referred to as a holder detection electrode 32a, and the right holder detection electrode 32 is referred to as a holder detection electrode 32b.

  When the holder detection electrode 32a and the mold displacement electrode T32 are just facing each other, the deviation amount between them is zero. As the mold displacement electrode T32 sequentially shifts toward the holder detection electrode 32b, the shift amount increases to L1, L2, L3, L4,... Lx.

  FIG. 20 shows an example of voltage values obtained from the holder detection electrodes 32a and 32b in accordance with the deviation amount of the mold displacement electrode T32 with respect to the holder detection electrode 32a. The numerical values of the voltage values shown in FIG. 20 are merely examples. As shown in FIG. 20, the total voltage obtained by totaling the voltage values obtained from the holder detection electrodes 32a and 32b is constant regardless of the amount of deviation, and the total voltage is the same as the maximum value Vmax. FIG. 15 shows a Vmax ratio obtained by dividing the voltage value from the holder detection electrode 32a by the maximum value Vmax.

  FIG. 21 shows characteristics when the horizontal axis is the amount of deviation and the vertical axis is the Vmax ratio. As shown in FIG. 21, when the Vmax ratio is obtained, the amount of deviation from the reference holder detection electrode 32 (holder detection electrode 32a in FIG. 19) can be obtained.

  If the distance between the circuit board 37 and the punch mold TP or the die mold TD is not constant, the characteristics shown in FIG. 21 change. In each bending apparatus, the relative relationship between the upper die holder 5 and the punch die TP and the relative relationship between the lower die holder 6 and the die die TD are determined substantially constant. The relationship between the Vmax ratio and the deviation amount is measured in advance with each bending apparatus.

  The characteristic information holding unit 112 holds a table showing the relationship between the Vmax ratio and the deviation amount as characteristic information as shown in FIG. The information / position detection calculation unit 111 obtains the Vmax ratio based on the voltage value obtained by converting the voltage information signal Siec from the two adjacent holder detection electrodes 32 into a digital signal. The information / position detection calculation unit 111 obtains the shift amount by referring to a table as shown in FIG.

  In this way, the information / position detection calculation unit 111 is relative to the two holder detection electrodes 32 in which the mold displacement electrode T32 (that is, the position of the punch mold TP or the die mold TD) is adjacent. It is possible to detect precisely and precisely where it is.

  The characteristic information holding unit 112 may hold an approximate expression representing the relationship between the Vmax ratio and the shift amount shown in FIG. 21 instead of the table shown in FIG. The information / position detection calculation unit 111 may obtain the deviation amount based on the approximate expression.

  As described above, the identification information of the punch mold TP and the die mold TD detected by the mold information / position detection unit 11 and the punch mold in the longitudinal direction of the upper mold holder 5 and the lower mold holder 6 are detected. The position information of the TP and the die mold TD is input to the NC device 10. The NC apparatus 10 can determine whether the correct punch die TP and die die TD indicated by the setup information are mounted at the correct positions indicated by the setup information.

  The setup information displayed on the operation / display panel 8 will be conceptually described with reference to FIG. 24, the punch mold TP and the die mold TD are mounted on the upper mold holder 5 and the lower mold holder 6 based on the setup information shown in FIG. 23, and the plate material is bent. An example of the operation of the bending apparatus 100 will be described.

  When the bending device 100 performs a predetermined bending process on the plate material, when the operator operates the operation / display panel 8 to read the setup information, the NC device 10 reads the setup information from the setup information DB 23. The NC device 10 displays setup information on the screen of the operation / display panel 8 as shown in FIG.

  As shown in FIG. 23, the setup information includes an image Im0 indicating where the punch mold TP and the die mold TD are mounted on the punch mold TP and the die mold TD. The image Im0 shows an upper mold holder image Im5 showing the upper mold holder 5, a lower mold holder image Im6 showing the lower mold holder 6, a punch mold image ImTP showing the punch mold TP, and a die mold TD. Includes die mold image ImTD.

  FIG. 23 shows a state where one die mold image ImTD with hatching is selected. The selected die mold image ImTD is set as a die mold image ImTDs. The setup information includes a model number display image Im1 indicating the model number “D-0001” of the die mold image ImTDs. The model number “D-0001” is merely an example. The model number only needs to identify each of the plurality of punch dies TP and die dies TD.

  The setup information includes a mold information display image Im2 indicating mold information of the die mold image ImTDs and a position information display image Im3 indicating where the die mold image ImTDs is mounted. In the position information display image Im3, the leftmost die die TD displayed as the die die image ImTDs is positioned at a position of −450.00 (millimeters), that is, 450 from the center in the longitudinal direction of the lower die holder 6 to the left. It shows that it is installed at the millimeter position. The position “-450.00” is merely an example.

  If a punch mold image ImTP or a die mold image ImTD showing each punch mold TP or die mold TD is selected, a model number display image Im1 and a mold corresponding to each punch mold TP or die mold TD are selected. An information display image Im2 and a position information display image Im3 are displayed.

  FIG. 23 conceptually shows the setup information displayed on the screen of the operation / display panel 8, and the model number display image Im1, the mold information display image Im2, and the position information display image Im3 are simultaneously displayed on one screen. It does not have to be. When an operation for displaying each image is performed, one or more of the model number display image Im1, the mold information display image Im2, and the position information display image Im3 may be selectively displayed.

  An operator or a robot (including ATC) controlled by the NC device 10 mounts the punch mold TP and the die mold TD on the upper mold holder 5 and the lower mold holder 6 based on the setup information.

  The flowchart shown in FIG. 24 basically shows processing by the NC apparatus 10, and may include work performed by an operator partially. In FIG. 24, when the process for bending the plate material is started, the NC apparatus 10 displays setup information on the screen of the operation / display panel 8 in step S101.

  When the operator takes out the punch die TP and the die die TD from the rack device, the worker takes out the punch die TP or the die die TD designated by the setup information from the rack device in step S102. . When using a robot, the NC apparatus 10 takes out the punch mold TP or the die mold TD instructed by the setup information by the robot from the rack apparatus in step S102.

  In step S103, the operator attaches the punch die TP or the die die TD taken out from the rack device to the upper die holder 5 or the lower die holder 6. When using a robot, the NC apparatus 10 attaches the punch mold TP or the die mold TD taken out from the rack apparatus to the upper mold holder 5 or the lower mold holder 6 by the robot in step S103.

  In step S104, the NC apparatus 10 uses the above-described mold information / position detection apparatus to identify the punch mold TP or die mold TD identification information and the longitudinal direction in which the punch mold TP or die mold TD is mounted. Let the position be detected. The mold information / position detection device always performs a detection operation in a state where the power of the bending apparatus 100 is turned on. Therefore, if the voltage information from the holder detection electrode 32 at the position where the punch mold TP or the die mold TD is mounted is input from the voltage information extraction unit 330 to the mold information / position detection unit 11, the mounting position and identification are performed. Information will be detected.

  In step S105, the NC device 10 collates the die information indicated by the detected identification information with the die information of the punch die TP or die die TD indicated by the setup information, and determines whether or not they match. Determine. When the mold information matches (YES in step S105), the NC device 10 determines whether the punch mold TP or die detected by the mold information / position detection unit 11 (information / position detection calculation unit 111) in step S106. It is determined whether the position of the mold TD matches the position indicated by the setup information.

  If the positions match (YES in step S106), the NC apparatus 10 determines in step S107 whether or not all the punch dies TP and die dies TD designated by the setup information have been mounted. If not all punch dies TP and die dies TD are mounted (NO in step S107), the process returns to step S102.

  If all punch dies TP and die dies TD are mounted in the order instructed by the setup information, it is determined that all punch dies TP and die dies TD have been mounted (YES in step S107).

  In step S108, the NC apparatus 10 clamps the punch mold TP and the die mold TD with a clamper.

  When the operator operates the operation / display panel 8 and gives an instruction to start the bending process, the NC apparatus 10 executes the bending process in step S109 and ends.

  On the other hand, when the die information indicated by the detected identification information and the die information of the punch die TP or die die TD indicated by the setup information do not match (NO in step S105), the setup information indicates That is, the wrong die that is not the punch die TP or the die die TD is taken out. Therefore, the NC apparatus 10 executes a predetermined warning process in step S110.

  The warning process in step S110, for example, informs the operator that the punch die TP or die die TD indicated by the setup information is not present, and the correct punch die TP or die die TD indicated by the setup information. Is a process of notifying the user to pick up again. This is particularly effective when the operator performs step S102.

  The operator takes out the correct punch mold TP or die mold TD from the rack device as needed, removes the incorrect punch mold TP or die mold TD, and attaches the correct punch mold TP or die mold TD. do it.

  In step S111, the NC device 10 determines whether or not there is an instruction to continue the work. For example, the NC device 10 displays a button for selecting “Continue” or “Cancel” on the operation / display panel 8 and determines which is selected. When an operation continuation instruction is given by operating the “continue” button (YES in step S111), the NC apparatus 10 determines in step S112 whether bending is possible.

  If it is determined that bending is possible (YES in step S112), the NC device 10 recalculates the setup, and updates the setup information in step S113. When the setup information is updated, the worker or the NC device 10 shifts the processing to the above step S106.

  If an operation stop instruction is given by operating the “Cancel” button (NO in step S111), or if it is not determined that bending is possible (NO in step S112), the NC device 10 End the process.

  If the position of the punch mold TP or die mold TD detected by the mold information / position detection unit 11 does not match the position indicated by the setup information (NO in step S106), the punch mold TP or die This means that the mold TD is not mounted at the correct position indicated by the setup information. Therefore, the NC device 10 executes a predetermined warning process in step S114.

  The warning process in step S114 notifies the operator that, for example, the punch die TP or the die die TD is not mounted at the correct position indicated by the setup information, and becomes the correct position indicated by the setup information. This is a process for notifying that the mounting position of the punch mold TP or the die mold TD is corrected. This is particularly effective when the operator performs step S103.

  The operator corrects the position of the punch die TP or the die die TD as necessary.

  Similarly to step S111, the NC device 10 determines whether or not there is an instruction to continue the operation in step S115. When an instruction to continue the work is given (YES in step S115), the NC device 10 determines whether or not bending is possible in step S116.

  If it is determined that bending is possible (YES in step S116), the NC device 10 recalculates the setup, and updates the setup information in step S117. When the setup information is updated, the NC apparatus 10 shifts the processing to the above step S107.

  If an instruction to stop the work is given (NO in step S115), or if it is not determined that bending is possible (NO in step S116), the NC apparatus 10 ends the process.

  As can be seen from FIG. 24, in this embodiment, before clamping the punch mold TP and the die mold TD in step S108, the correct punch mold TP or die mold TD is correctly specified by the setup information. It is determined whether or not it is attached to the position. Since the punch die TP and the die die TD are not clamped by the clamper, the punch die TP or the die die can be easily replaced when the wrong punch die TP or die die TD is mounted. If the TD is not mounted at the correct position, the mounting position can be easily corrected.

  In FIG. 24, the order of steps S105 and S110 to S113, and steps S106 and S114 to S117 may be reversed.

  An example in which it is determined in step S112 that bending is possible and the setup information is updated in step S113 will be described with reference to FIGS. Here, the identification information transmitted by the identification information transmission circuit 45 is assigned one identification information for each mold, and even the same type of molds can be distinguished from each other.

  FIG. 25A shows a punch die TP designated by the setup information. In the setup information, it is instructed to mount the punch die TP having the identification number “P-0001” on the left side and the punch die TP having the identification number “P-0002” on the right side. These two punch dies TP are the same kind of punch dies TP.

  As shown in FIG. 25B, the left and right positions of the punch die TP having the identification number “P-0001” and the punch die TP having the identification number “P-0002” can be switched. It is. In such a case, it is determined in step S112 that bending can be performed.

  FIG. 26A shows a punch die TP indicated by the setup information. In the setup information, it is instructed to mount the punch die TP having the identification number “P-0020”.

  A punch die TP having an identification number “P-0015”, a punch die TP having an identification number “P-0011”, and a punch die having an identification number “P-0012” shown in FIG. In the mold TP, the shapes of the punch mold TP having the identification number “P-0020” and the tip P00 are the same, and only the width is different.

  Instead of the punch mold TP having the identification number “P-0020”, three punch molds TP having the identification numbers “P-0011”, “P-0012”, and “P-0015” may be combined. Bending is possible. In such a case, it is determined in step S112 that bending can be performed.

  In the flowchart shown in FIG. 24, when the punch mold TP or the die mold TD is attached to the upper mold holder 5 or the lower mold holder 6 one by one, the identification transmitted by the punch mold TP or the die mold TD is transmitted. Information is detected, and the mounting position of the punch mold TP or the die mold TD is detected.

  As shown in FIG. 27, the identification information and the mounting position may be detected after all the punch dies TP and the die dies TD are mounted on the upper mold holder 5 and the lower mold holder 6, respectively.

  Steps S201, S202, S203, and S204 in FIG. 27 are substantially the same as steps S101, S102, S103, and S107 in FIG. In FIG. 27, if all the punch dies TP and the die dies TD are mounted on the upper mold holder 5 and the lower mold holder 6, respectively, all the punch dies TP and the die dies TD are mounted. (YES in step S204).

  In step S205, the NC device 10 causes the above-described die information / position detection device to detect identification information and positions of all punch dies TP and die dies TD.

  In step S206, the NC apparatus 10 collates the die information indicated by the detected identification information with the die information of the punch die TP and the die die TD indicated by the setup information, and determines whether or not they match. Determine.

  If the mold information matches (YES in step S206), the NC apparatus 10 determines the position and setup information of each of the punch mold TP and die mold TD detected by the mold information / position detection unit 11 in step S207. It is determined whether or not the position indicated in (1) matches. The order of step S206 and step S207 may be reversed.

  If the positions match (YES in step S207), the NC apparatus 10 clamps the punch die TP and the die die TD with a clamper in step S208. When the operator operates the operation / display panel 8 and gives an instruction to start the bending process, the NC apparatus 10 executes the bending process in step S209 and ends.

  On the other hand, if the mold information does not match at least partially (NO in step S206), and if the position does not match at least partially (NO in step S107), the NC apparatus 10 determines in step S210 A warning process similar to steps S110 and S114 in FIG. 24 is executed.

  The operator takes out the correct punch mold TP or die mold TD from the rack device as needed, removes the incorrect punch mold TP or die mold TD, and attaches the correct punch mold TP or die mold TD. To do. Further, the operator corrects the position of the punch die TP or the die die TD as necessary.

  The NC device 10 determines whether or not there is an instruction to continue the operation in step S211. If an instruction to continue the work is given (YES in step S211), the NC apparatus 10 determines whether or not bending is possible in step S212. If it is determined that bending is possible (YES in step S212), the NC device 10 recalculates the setup, and updates the setup information in step S213.

  When the setup information is updated, the NC apparatus 10 proceeds to the above step S208.

  If an instruction to stop the work is given (NO in step S211), or if it is not determined that bending is possible (NO in step S212), the NC apparatus 10 ends the process.

  Also in FIG. 27, whether or not the correct punch die TP and die die TD are mounted at the correct positions indicated by the setup information before clamping the punch die TP and die die TD in step S208. Is determined. Since the punch die TP and the die die TD are not clamped by the clamper, the punch die TP and the die die can be easily replaced if the wrong punch die TP or die die TD is mounted. If the TD is not mounted at the correct position, the mounting position can be easily corrected.

  By the way, when the robot performs all the series of operations of taking out the punch mold TP and the die mold TD from the rack apparatus and mounting them on the upper mold holder 5 and the lower mold holder 6 and bending the plate material, respectively, Incorrect selection of the mold TP and the die mold TD and mounting of the punch mold TP and the die mold TD at the wrong position may cause a failure of the bending apparatus. The process shown in FIGS. 24 and 27 can also prevent the bending apparatus from failing.

  The mold information / position detection apparatus described above has the following advantages. As described above, the punch mold TP and the die mold TD attached to the upper mold holder 5 and the lower mold holder 6 are fixed by the clamper. In the mold information / position detection device, the holder feeding electrode 31 and the mold receiving electrode T31 are in a non-contact state, and the holder detection electrode 32 and the mold displacement electrode T32 are in a non-contact state. Detect position.

  That is, according to the mold information / position detecting device, the punch mold TP and the die mold TD are mounted on the upper mold holder 5 and the lower mold holder 6 and immediately fixed before being clamped by the clamper. The identification information and position of the TP and the die mold TD are detected. When it is necessary to replace the punch mold TP or die mold TD or to correct the mounting position, the punch mold TP or the die mold TD is not fixed by the clamper, so that the replacement and mounting position can be easily corrected.

  Further, when fixing by the clamper by comparing the positions of the punch mold TP and the die mold TD before being fixed by the clamper with the positions of the punch mold TP and the die mold TD after being fixed by the clamper. It is also possible to detect a minute positional deviation between the punch die TP and the die die TD.

  Therefore, the mold information that can detect the position of the mold in a state where the holder feeding electrode 31 and the mold receiving electrode T31 are not in contact and the holder detection electrode 32 and the mold displacement electrode T32 are not in contact. It can be said that the position detection device employs a very preferable detection method. Since the configuration is simple, it is also preferable in that the cost increase can be minimized.

<Second embodiment of bending apparatus>
The bending apparatus is a type (modular type) in which the upper mold holder 5 is integrally attached over the entire length of the lower end of the upper table 2 as in the bending apparatus 100 of the first embodiment shown in FIG. And there is a type (intermediate plate type) that is divided and attached in the longitudinal direction of the lower end portion of the upper table 2.

  A bending apparatus 200 of the second embodiment shown in FIG. 28 is a configuration example in the case of an intermediate plate type bending apparatus. FIG. 28 shows only a part of the upper table 2 side. The bending apparatus 100 according to the first embodiment and the bending apparatus 200 according to the second embodiment have substantially the same configuration except for the difference between using an intermediate plate. Therefore, illustration and description of the common parts of the bending apparatus 200 and the bending apparatus 100 are omitted.

  In FIG. 28, a plurality of intermediate plates 55 are attached to the upper table 2 via clamp jaws (not shown). The mounting position of the intermediate plate 55 with respect to the longitudinal direction of the upper table 2 (left and right direction in FIG. 23) can be adjusted. The mounting position of the intermediate plate 55 is appropriately set according to the plate material to be bent and the processing method. A punch die TP is attached to some intermediate plates 55. Which intermediate plate 55 is attached with the punch die TP and at which position of the intermediate plate 55 the punch die TP is attached is appropriately set according to the plate material to be bent and the way of processing.

  The bending apparatus 200 according to the second embodiment is equipped with the above-described mold information / position detection apparatus. That is, each intermediate plate 55 has a power supply electrode having the same length as the length of the intermediate plate 55 in the longitudinal direction on the inner wall, like the holder power supply electrode 31 described in FIG. Similar to the holder detection electrode 32 described with reference to FIG. 4, the intermediate plate 55 has a plurality of detection electrodes that are insulated from the power supply electrode and arranged in the longitudinal direction of the power supply electrode. The intermediate plate 55 has a circuit similar to the voltage information extraction unit 330 described with reference to FIG.

  Although not shown in FIG. 28, a lower mold holder 6 is attached to the upper end portion of the lower table 3. Similarly to the intermediate plate 55, the lower mold holder 6 also has a feeding electrode and a plurality of detection electrodes.

  In the bending apparatus 200 of the second embodiment, the intermediate plate 55 mounted on the upper table 2 and the lower mold holder mounted on the lower table 3 by the above-described identification information and position detection method by the mold information / position detecting device. 6, it is detected which punch die TP and die die TD having die information are attached, and at which position the punch die TP and die die TD are attached.

  The intermediate plate 55 mounted on the upper table 2 and the lower mold holder 6 mounted on the lower table 3 are another example of a mold mounting portion for mounting the punch mold TP or the die mold TD.

<Rack device>
The rack apparatus that houses a plurality of punch dies TP and die dies TD houses a plurality of punch dies TP in an upper mold holder substantially the same as the upper mold holder 5 of the bending apparatus 100, A plurality of die molds TD are housed in a lower mold holder substantially the same as the mold holder 6. Therefore, it is possible to mount the above-described mold information / position detection device also in the rack device.

  FIG. 29 shows a rack device 300 which is a configuration example of the rack device. As shown in FIG. 29, the rack apparatus 300 includes a plurality of lower mold holders 60. Each lower mold holder 60 is equipped with a plurality of die molds TD. When the plate material is bent by the bending apparatuses 100 and 200, the operator or the robot takes out the die mold TD used for the bending process from the rack apparatus 300. Further, the operator or the robot returns the die mold TD used after the bending process to the rack apparatus 300.

  Although not shown in FIG. 29, the rack apparatus 300 includes a plurality of upper mold holders, and a plurality of punch dies TP are mounted on each upper mold holder. When the plate material is bent by the bending apparatuses 100 and 200, an operator or a robot (including ATC) takes out the punch die TP used for the bending process from the rack apparatus 300. Further, the operator or the robot returns the punch mold TP used after the bending process to the rack device 300.

  The rack device 300 is mounted with the above-described mold information / position detection device. In the rack apparatus 300, the position of the punch mold TP having which mold information is mounted at the position of the upper mold holder (not shown) by the position detection method by the mold information / position detection apparatus described above, It is detected in which position of the mold holder 60 the die mold TD having which mold information is mounted.

  The NC device that controls the rack device 300 manages the types of punch dies TP and die dies TD attached to the plurality of upper die holders and the lower die holder 60, respectively. By returning the punch mold TP and the die mold TD to the rack apparatus 300, the types of the punch mold TP and the die mold TD can be identified.

  In the rack device 300, each of the plurality of punch dies TP and die dies TD is preliminarily stored in the upper die holder or the lower die holder 60 according to the identification information and the position detecting method by the die information / position detecting device described above. It can be detected whether or not it is mounted at a predetermined correct position.

  If the rack apparatus 300 has mounted the punch mold TP and the die mold TD at predetermined correct positions of the upper mold holder and the lower mold holder 60, the bending apparatus 100 or 200 bends the plate material. In doing so, it is possible to prevent an erroneous selection of the types of the punch mold TP and the die mold TD.

  The upper mold holder and the lower mold holder 60 in the rack apparatus 300 are still another example of a mold mounting portion for mounting the punch mold TP or the die mold TD.

  The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the present invention. In the present embodiment, the identification information of the punch die TP and the die die TD is detected by one information / position detection calculation unit 111, and the positions of the punch die TP and the die die TD are detected. For example, using two microcomputers, an information detection calculation unit that detects identification information of the punch die TP and the die die TD, and a position detection calculation unit that detects the positions of the punch die TP and the die die TD. It may be divided.

2 Upper table 3 Lower table 5 Upper mold holder (mold mounting part)
6 Lower mold holder (mold mounting part)
10 NC unit 11 Mold information / position detection unit (power supply signal supply unit)
31 holder feeding electrode 31ins, 32ins, Tins insulating film 32 _{1-32 400} holder detection electrode 35 _{1-35 400} switches 100 and 200 bending device 111 information and the position detection calculation unit (information detection calculating unit, a position detection calculation unit )
112 characteristic information storage unit 113 A / D converter 114,34 _{1-34 400} amplifier 300 rack 330 voltage information extraction unit C31 parallel plate capacitor (first capacitor, the capacitor circuit)
C32 parallel plate capacitor (second capacitor, capacitor circuit)
SR shift register (electrode switching circuit)
T31 Mold receiving electrode T32 Mold displacement electrode TP Punch mold (Mounting member)
TD die mold (mounting member)

Claims (9)

A mold mounting portion for mounting a mold having a power reception electrode, a displacement electrode, and an identification information transmission circuit that is provided between the power reception electrode and the displacement electrode and transmits identification information for identifying the mold. A feeding electrode provided on the inner wall of the die mounting portion so as to face the power receiving electrode in a non-contact state in the longitudinal direction of the mold mounting portion;
A plurality of detection electrodes provided on the inner wall so as to face the displacement electrode in a non-contact state, insulated from the power feeding electrode, and arranged in the longitudinal direction of the mold mounting portion;
A power supply signal supply unit that supplies a power supply signal in which a first AC waveform section having a first frequency and a second AC waveform section having a second frequency different from the first frequency are mixed to the power supply electrode When,
With
When the mold is mounted on the mold mounting portion, the pair of the feeding electrode and the power receiving electrode facing each other and the pair of the detection electrode and the displacement electrode facing each other form a capacitor circuit And
When the power supply signal is supplied to the power supply electrode by the power supply signal supply unit, the identification information transmitting circuit transmits the identification information of the mold corresponding to the first AC waveform section from the detection electrode. A voltage information extraction unit that extracts the voltage information of
Based on the first voltage information extracted by the voltage information extraction unit, an information detection calculation unit that detects identification information of the mold,
A mold detecting apparatus further comprising: The capacitance of the capacitor circuit is configured to change according to the position of the mold with respect to the longitudinal direction of the mold mounting portion.
The voltage information extraction unit extracts, from the detection electrode, second voltage information whose voltage value changes according to the capacitance of the capacitor circuit in correspondence with the second AC waveform section.
Based on the second voltage information extracted by the voltage information extraction unit, a position detection calculation unit that detects which position in the longitudinal direction of the mold mounting unit the mold is mounted;
The mold detection apparatus according to claim 1, further comprising:   3. The voltage information extraction unit includes an electrode switching circuit that selectively selects a detection electrode from which voltage information is extracted from the plurality of detection electrodes and sequentially switches the detection electrode. The mold detection apparatus described in 1. It is a bending device that bends plate material using a punch die and a die die.
A first recess for receiving the end of the punch mold, and a first mold mounting portion for mounting the punch mold;
A second mold mounting portion for mounting the die mold, the second mold mounting portion having a second recess for storing an end portion of the die mold;
With
The punch mold and the die mold are provided at the respective end portions, and are provided between a power receiving electrode, a displacement electrode, and the power receiving electrode and the displacement electrode, and the punch mold and the die mold. An identification information transmission circuit for transmitting identification information for identifying the mold,
The first and second mold mounting portions are
Provided in the longitudinal direction of the side walls of the first and second recesses, and when the punch die and the die die are attached to the first and second die attachment portions, respectively, A feeding electrode facing in a contact state;
The punch mold and the die mold are provided in the longitudinal direction of the side walls of the first and second recesses so as to be insulated from the power supply electrode, and are respectively provided on the first and second mold mounting portions. A plurality of detection electrodes opposed to the displacement electrode in a non-contact state,
Have
When the punch mold or the die mold is mounted in the first or second recess, the pair of the feeding electrode and the receiving electrode facing each other, the detection electrode and the displacement electrode facing each other And a pair form a capacitor circuit,
The bending apparatus further includes:
A power supply signal supply unit that supplies a power supply signal in which a first AC waveform section having a first frequency and a second AC waveform section having a second frequency different from the first frequency are mixed to the power supply electrode When,
When the power supply signal is supplied to the power supply electrode by the power supply signal supply unit, the identification information transmitting circuit transmits the identification information of the mold corresponding to the first AC waveform section from the detection electrode. A voltage information extraction unit that extracts the voltage information of
Based on the first voltage information extracted by the voltage information extraction unit, an information detection calculation unit that detects identification information of the mold,
A bending apparatus comprising: The capacitance of the capacitor circuit is configured to change according to a position of the punch mold or the die mold in the longitudinal direction of the first or second recess,
The voltage information extraction unit extracts, from the detection electrode, second voltage information whose voltage value changes according to the capacitance of the capacitor circuit in correspondence with the second AC waveform section.
Based on the second voltage information taken out by the voltage information take-out portion, it is detected at which position in the longitudinal direction of the first or second recess the die or die die is attached. A position detection calculation unit;
The bending apparatus according to claim 4, further comprising: It is a mold that is mounted on the mold mounting part of the bending machine and bends the plate material.
A power receiving electrode provided in a longitudinal direction of an inner wall of the mold mounting portion when the mold is mounted on the mold mounting portion and opposed to a power feeding electrode to which an AC power feeding signal is supplied in a non-contact state; ,
When the mold is mounted on the mold mounting section, the mold is insulated from the power supply electrode and is not in contact with any of the plurality of detection electrodes arranged in the longitudinal direction of the inner wall. An opposing displacement electrode at
An identification information transmission circuit provided between the power receiving electrode and the displacement electrode;
An AC waveform signal equivalent to the power supply signal is input to the identification information transmission circuit via the power receiving electrode,
The identification information transmission circuit includes an identification information holding unit that holds identification information for identifying the mold, and an identification that shapes the AC waveform signal to generate an identification information waveform signal indicating the mold identification information. An information waveform generator,
The metal mold | die characterized by outputting the said identification information waveform signal through the said displacement electrode and the said detection electrode. The power supply signal is an AC waveform signal in which a first AC waveform section having a first frequency and a second AC waveform section having a second frequency different from the first frequency are mixed,
The identification information transmission circuit further includes a frequency determination unit that determines the frequency of the AC waveform signal,
The mold according to claim 6, wherein the identification information waveform generation unit generates the identification information waveform signal corresponding to the first AC waveform section.   The mold according to claim 6 or 7, wherein the identification information transmission circuit uses a voltage obtained by rectifying and smoothing the power supply signal as a power supply voltage. The power receiving electrode and the displacement electrode are provided on a first surface of a substrate, and the identification information transmission circuit is mounted on a second surface that is a back surface of the substrate relative to the first surface,
The mold according to any one of claims 6 to 8, wherein the substrate is mounted on the mold such that the first surface is on the outer surface side.

Images