JP5974497B2 - Bus bar bushing - Google Patents

Bus bar bushing Download PDF

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JP5974497B2
JP5974497B2 JP2012011564A JP2012011564A JP5974497B2 JP 5974497 B2 JP5974497 B2 JP 5974497B2 JP 2012011564 A JP2012011564 A JP 2012011564A JP 2012011564 A JP2012011564 A JP 2012011564A JP 5974497 B2 JP5974497 B2 JP 5974497B2
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bus
inter
conductor
bushing
board
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JP2013150527A (en
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航 東浦
航 東浦
治 多賀谷
治 多賀谷
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Toshiba Corp
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Description

本発明の実施形態は、主回路導体を絶縁材料でモールド(注型)した母線ブッシングに関する。   Embodiments of the present invention relate to a bus bushing in which a main circuit conductor is molded with an insulating material.

従来、固体絶縁スイッチギヤでは、主回路導体などの電気部材をエポキシ樹脂のような絶縁材料でモールドし、全体形状の縮小化が図られている。そして、大容量化を図る場合には、主回路導体の断面積を増大させるものが知られている(例えば、特許文献1参照)。   Conventionally, in a solid-insulated switchgear, an electrical member such as a main circuit conductor is molded with an insulating material such as an epoxy resin to reduce the overall shape. In order to increase the capacity, one that increases the cross-sectional area of the main circuit conductor is known (for example, see Patent Document 1).

絶縁材料に埋め込まれる主回路導体の断面積を増大させると、絶縁皮膜に主回路導体の重量が加算され、母線ブッシング自体が重量物となり、組立作業を困難とさせることになる。特に、列盤された盤間を接続する盤間母線は収納機器の上部に配置されることが多く、高所作業が伴うので、この盤間母線を接続する母線ブッシングの軽量化を図ることが望まれていた。   When the cross-sectional area of the main circuit conductor embedded in the insulating material is increased, the weight of the main circuit conductor is added to the insulating film, and the bus bushing itself becomes a heavy object, which makes assembly work difficult. In particular, the inter-board busbars connecting the panels placed in a row are often arranged at the top of the storage equipment, and work is required at high places, so the bus bushings connecting the inter-board busbars can be reduced in weight. It was desired.

特開2006−197730号公報JP 2006-197730 A

本発明が解決しようとする課題は、盤間母線を接続する母線ブッシングの軽量化と大容量化を可能とすることにある。当然のことながら、母線ブッシングは、主回路導体を絶縁材料でモールドする構成とする。   The problem to be solved by the present invention is to make it possible to reduce the weight and increase the capacity of a bus bushing that connects buses between boards. As a matter of course, the bus bushing is configured such that the main circuit conductor is molded with an insulating material.

上記課題を解決するために、実施形態の母線ブッシングは、T字状の柄部が収納機器に接続される第1の中心導体と、前記第1の中心導体のT字状の頭部に接続固定されるとともに、盤間母線を界面接続するための界面接続部を有する複数の第2の中心導体と、前記第1の中心導体と前記第2の中心導体との周りに設けられた絶縁層とを備えことを特徴とする。 In order to solve the above-described problems, the bus bushing according to the embodiment is configured such that a T-shaped handle is connected to a first central conductor connected to a storage device and a T-shaped head of the first central conductor. A plurality of second center conductors that are fixed and have interface connection portions for interface-connecting the inter-board bus bars , and an insulating layer provided around the first center conductor and the second center conductor characterized by comprising and.

本発明の実施例1に係る列盤された固体絶縁スイッチギヤの構成を示す側面図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 本発明の実施例1に係る母線ブッシングの構成を示す正面図。The front view which shows the structure of the bus-line bushing which concerns on Example 1 of this invention. 本発明の実施例1に係る母線ブッシングの構成を示す上面から見た断面図。Sectional drawing seen from the upper surface which shows the structure of the bus-line bushing which concerns on Example 1 of this invention. 本発明の実施例2に係る母線ブッシングの構成を示す正面図。The front view which shows the structure of the bus-line bushing which concerns on Example 2 of this invention.

以下、図面を参照して本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

先ず、本発明の実施例1に係る母線ブッシングを図1〜図3を参照して説明する。図1は、本発明の実施例1に係る列盤された固体絶縁スイッチギヤの構成を示す側面図、図2は、本発明の実施例1に係る母線ブッシングの構成を示す正面図、図3は、本発明の実施例1に係る母線ブッシングの構成を示す上面から見た断面図である。   First, the bus bushing according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a side view showing the configuration of a lined solid-insulated switchgear according to Embodiment 1 of the present invention, FIG. 2 is a front view showing the configuration of a bus bushing according to Embodiment 1 of the present invention, and FIG. These are sectional drawings seen from the upper surface which show the composition of the bus bar bushing concerning Example 1 of the present invention.

図1に示すように、列盤された箱体1a、1b、1cには、遮断器などの収納機器2a、2b、2cがそれぞれ収納されている。収納機器2a、2b、2cの上部には、それぞれ母線ブッシング3a、3bが設けられ、盤間母線4a、4bが界面接続されている。端部の母線ブッシング3aには、絶縁栓5が設けられている。母線ブッシング3a、3bは、同様の構成であり、以下、一方を用いて説明する。   As shown in FIG. 1, storage devices 2a, 2b, and 2c such as circuit breakers are respectively stored in the box bodies 1a, 1b, and 1c arranged in a row. Bus bushings 3a and 3b are respectively provided on the upper portions of the storage devices 2a, 2b and 2c, and the inter-board buses 4a and 4b are interface-connected. An insulating plug 5 is provided on the bus bushing 3a at the end. The bus bushings 3a and 3b have the same configuration and will be described below using one of them.

母線ブッシング3aには、図2、図3に示すように、主回路導体となるT字状の第1の中心導体6の周りにエポキシ樹脂をモールドした絶縁層7が設けられている。T字状の柄部には、第1の中心導体6端を露出させ突出したテーパ状の第1の界面接続部8が設けられており、収納機器2a、2b、2cと接続されるようになっている。   As shown in FIGS. 2 and 3, the bus bushing 3 a is provided with an insulating layer 7 in which an epoxy resin is molded around a T-shaped first central conductor 6 that becomes a main circuit conductor. The T-shaped handle portion is provided with a tapered first interface connection portion 8 that protrudes with the end of the first center conductor 6 exposed, and is connected to the storage devices 2a, 2b, and 2c. It has become.

T字状の頭部両端には、筒状の第2の中心導体9a、9bがそれぞれ接続固定されている。第2の中心導体9a、9bの軸方向両端には、この筒状内面を露出させ窪んだテーパ状の第2の界面接続部10a、10bが設けられている。第2の界面接続部10a、10bには、盤間母線4a、4bが接続されるようになっている。   Cylindrical second center conductors 9a and 9b are connected and fixed to both ends of the T-shaped head. At both ends in the axial direction of the second central conductors 9a and 9b, tapered second interface connecting portions 10a and 10b are provided which expose the cylindrical inner surface and are recessed. The inter-board buses 4a and 4b are connected to the second interface connecting portions 10a and 10b.

絶縁層7には、電圧検出用の検出電極11が埋め込まれている。なお、絶縁層7の外周には、第1の界面接続部8と第2の界面接続部10a、10bを除き、導電性塗料を塗布した接地層が設けられている。12a、12bは、盤間母線4a、4bや絶縁栓5を固定するための埋め金である。   A detection electrode 11 for voltage detection is embedded in the insulating layer 7. A ground layer coated with a conductive paint is provided on the outer periphery of the insulating layer 7 except for the first interface connection portion 8 and the second interface connection portions 10a and 10b. 12a and 12b are paddings for fixing the inter-board buses 4a and 4b and the insulating plug 5.

このような構成により、盤間母線4a、4bを二本、接続することができるので、この部分の電流容量を例えば1250Aから2500Aに増大させることができる。盤間母線4a、4b自体は、従来と同様の構成である。母線ブッシング3a、3bとしては、盤間母線4a、4bを単独で接続する従来のものと比べて、おおよそ第2の中心導体9a、9b部分の重量が増すものになるが、重量化したと考えるべきではない。即ち、母線ブッシング3a、3bと盤間母線4a、4bをそれぞれ単独で導体の断面積を増大させて大容量化を図るよりも、盤間母線4a、4bを二本として分流させた方が軽量化を図ることができる。また、盤間母線4a、4bでの放熱が促進され、温度上昇を抑制することができる。なお、第2の中心導体9a、9bにアルミニウムを用いれば、更に軽量化を図ることができる。   With this configuration, two inter-board buses 4a and 4b can be connected, so that the current capacity of this portion can be increased from 1250A to 2500A, for example. The inter-board buses 4a and 4b themselves have the same configuration as the conventional one. As for the bus bushings 3a and 3b, the weight of the second center conductors 9a and 9b is increased compared to the conventional one in which the inter-board buses 4a and 4b are connected alone, but it is considered that the weight has increased. Should not. That is, it is lighter to split the bus buses 4a and 4b between the bus bushings 3a and 3b and the inter-board buses 4a and 4b, respectively, rather than increasing the cross-sectional area of the conductor to increase the capacity. Can be achieved. Further, heat dissipation at the inter-board buses 4a and 4b is promoted, and a temperature rise can be suppressed. If aluminum is used for the second central conductors 9a and 9b, the weight can be further reduced.

上記実施例1の母線ブッシングによれば、第1の中心導体6をT字状とし、頭部両端に第2の中心導体9a、9bを設け、二本の盤間母線4a、4bを接続し、分流させるようにしているので、重量を増すことなく、盤間母線4a、4bの電流容量を増大させることができる。また、盤間母線4a、4bは、従来と同様の重量であり、組立作業を容易とすることができる。   According to the bus bushing of the first embodiment, the first center conductor 6 is T-shaped, the second center conductors 9a and 9b are provided at both ends of the head, and the two inter-board bus bars 4a and 4b are connected. Therefore, the current capacity of the inter-board buses 4a and 4b can be increased without increasing the weight. Further, the inter-board buses 4a and 4b have the same weight as the conventional one, and the assembly work can be facilitated.

次に、本発明の実施例2に係る母線ブッシングを図4を参照して説明する。図4は、本発明の実施例2に係る母線ブッシングの構成を示す正面図である。なお、この実施例2が実施例1と異なる点は、盤間母線を複数本接続できるようにしたことである。図4において、実施例1と同様の構成部分においては、同一符号を付し、その詳細な説明を省略する。   Next, a bus bushing according to the second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a front view showing the configuration of the bus bushing according to the second embodiment of the present invention. The second embodiment differs from the first embodiment in that a plurality of inter-board buses can be connected. In FIG. 4, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

図4に示すように、T字状の第1の中心導体5の頭部に三個の第2の中心導体9a、9b、9cを接続固定し、第2の界面接続部10a、10b、10c、埋め金12a、12b、12cを設けている。このため、母線ブッシング3aには、三本の盤間母線を接続することができる。なお、これらは、三本以上の複数とすることができる。   As shown in FIG. 4, three second center conductors 9a, 9b, 9c are connected and fixed to the head of the T-shaped first center conductor 5, and the second interface connecting portions 10a, 10b, 10c are connected. , Paddings 12a, 12b, and 12c are provided. For this reason, three inter-board buses can be connected to the bus bushing 3a. These can be a plurality of three or more.

上記実施例2の母線ブッシングによれば、第2の中心導体9a、9b、9cを複数とすることができ、更なる大容量化と軽量化を図ることができる。   According to the bus bushing of the second embodiment, a plurality of second central conductors 9a, 9b, 9c can be provided, and further increase in capacity and weight can be achieved.

以上述べたような実施形態によれば、盤間接続の共通母線となる盤間母線を、複数本接続できるようにしているので、母線ブッシングの大容量化と軽量化を図ることができる。   According to the embodiment described above, since a plurality of inter-board buses that are common bus bars for inter-board connection can be connected, the capacity and weight of the bus bushing can be increased.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

1a、1b、1c 箱体
2a、2b、2c 収納機器
3a、3b 母線ブッシング
4a、4b 盤間母線
5 絶縁栓
6 第1の中心導体
7 絶縁層
8 第1の界面接続部
9a、9b、9c 第2の中心導体
10a、10b、10c 第2の界面接続部
11 検出電極
12a、12b、12c 埋め金
1a, 1b, 1c Box 2a, 2b, 2c Storage device 3a, 3b Bus bushing 4a, 4b Inter-board bus 5 Insulation plug 6 First central conductor 7 Insulating layer 8 First interface connection 9a, 9b, 9c 2 center conductors 10a, 10b, 10c Second interface connection part 11 Detection electrodes 12a, 12b, 12c

Claims (3)

T字状の柄部が収納機器に接続される第1の中心導体と、
前記第1の中心導体のT字状の頭部に接続固定されるとともに、盤間母線を界面接続するための界面接続部を有する複数の第2の中心導体と、
前記第1の中心導体と前記第2の中心導体との周りに設けられた絶縁層とを備えことを特徴とする母線ブッシング。
A first central conductor having a T-shaped handle connected to the storage device;
A plurality of second central conductors connected to and fixed to the T-shaped head of the first central conductor and having an interface connecting portion for interfacing the inter-board busbars;
Bus bushing is characterized in that a provided an insulating layer around said first center conductor and the second central conductor.
前記第1の中心導体T字状の頭部両端にそれぞれ前記第2の中心導体を接続固定したことを特徴とする請求項1に記載の母線ブッシング。 Bus bushing according to claim 1, characterized in that said first central conductor of the T-shaped each of the second center conductor to the head end of the connection is fixed. 前記絶縁層に電圧を検出するための検出電極を埋め込んだことを特徴とする請求項1または請求項2に記載の母線ブッシング。   The bus bushing according to claim 1 or 2, wherein a detection electrode for detecting a voltage is embedded in the insulating layer.
JP2012011564A 2012-01-23 2012-01-23 Bus bar bushing Active JP5974497B2 (en)

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JP4580767B2 (en) * 2005-01-13 2010-11-17 株式会社東芝 Solid insulated conductor
JP2007174817A (en) * 2005-12-22 2007-07-05 Toshiba Corp Insulated bus-bar device and bushing

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