JP5973344B2 - Film forming apparatus and film manufacturing method - Google Patents

Description

  The present invention relates to a film forming apparatus for forming a film on a substrate and a film manufacturing method.

  As a method for forming a film on a substrate, a chemical vapor deposition (hereinafter referred to as a CVD method) is known. In a CVD apparatus for depositing a film on a substrate by a CVD method, the substrate is accommodated in a reaction chamber, a source gas that is a raw material for the film is supplied into the reaction chamber, and the source gas is reacted on the substrate. Is deposited on the substrate.

  As a prior art described in the publication, a chamber capable of adjusting the internal temperature and pressure, a susceptor in which the growth substrate is placed so that the surface of the growth substrate faces upward in the chamber, and growth on the growth substrate on the susceptor Raw material gas supply means for injecting raw material gas in the horizontal direction with respect to the surface of the substrate, and from above the growth substrate on the susceptor, at a tilt angle of 45 ° to 90 ° with respect to the surface of the growth substrate, A first press gas injection means for injecting a first press gas for pressing the raw material gas in the same in-plane direction as the injection direction, and a tertiary from the top of the growth substrate on the susceptor to the surface of the growth substrate Second pressure gas injection means for injecting a second pressure gas for removing the raw material gas at the end of the growth substrate at an inclination angle of 45 ° to 90 ° in the original direction, and exhaust gas from the chamber That a carrying-out means for unloading is present (see Patent Document 1).

JP 2011-171325 A

In a film forming apparatus that employs the CVD method, it is required to discharge the reaction gas (including the reacted one) that has passed over the substrate more reliably to the outside of the chamber. Here, for example, when the source gas that has passed over the substrate becomes difficult to be discharged from the chamber, the flow of the source gas is disturbed as it stays, or the reaction generation unit that is generated along with the generation of the source gas is The reaction product adheres on the substrate by dancing inside.
An object of this invention is to suppress the fall and adhesion of the reaction product with respect to the board | substrate used as film-forming object.

The film forming apparatus of the present invention has an internal space, a storage chamber for storing a substrate so that a film formation surface faces upward on the lower side of the internal space, and heating the substrate stored in the internal space Heating means for performing, source gas supply means for supplying a source gas serving as a raw material of the film to the internal space along a first direction from the side of the substrate toward the substrate,
A block gas that suppresses the upward movement of the raw material gas at a first speed is supplied to the internal space along a second direction from directly above the substrate from directly above the substrate. The block gas is supplied at a second speed higher than the first speed along the second direction from the downstream side and the upper side in the first direction , and further upstream from the substrate in the first direction. and from above, the in the second direction, the block gas supply means for supplying the block gases at a slower than faster the second speed than the first speed third speed, the first direction in the inner space And a discharge means for discharging the raw material gas and the block gas to the outside from the downstream side and the lower side of the internal space.

In such a film forming apparatus, the block gas supply unit further includes a fourth speed higher than the third speed along the first direction from the upstream side and the upper side of the first direction with respect to the substrate. And supplying the block gas .
Further , the raw material gas supply means supplies a silicon-containing gas containing silicon and a carbon-containing gas containing carbon as the raw material gas, and the block gas contains hydrogen gas.
Still further, the heating means may heat the substrate to a film forming temperature selected from a range of 1500 ° C. to 1800 ° C.

From another point of view, the film manufacturing method of the present invention is housed in a housing chamber that has an internal space and houses the substrate so that the film formation surface faces upward on the lower side of the internal space. The substrate is heated, and a source gas serving as a raw material for the film is supplied to the internal space along a first direction from the side of the substrate toward the substrate, and the internal space is directly above the substrate. From the upper side, a block gas that suppresses the upward movement of the source gas is supplied at a first speed along the second direction from the upper side to the lower side, and further downstream and above the first direction from the substrate. The block gas is supplied at a second speed that is higher than the first speed along the second direction, and further from the upstream side of the first direction and above the substrate in the second direction. Along the first speed Supplying said block gas at a slower than the second speed third speed, from the lower side of the first direction of the downstream side and the interior space of the inner space, discharging the material gas and the blocks gas to the outside It is characterized by that.

  ADVANTAGE OF THE INVENTION According to this invention, the fall and adhesion of a reaction product with respect to the board | substrate used as film-forming object can be suppressed.

1 is an overall configuration diagram of a CVD apparatus to which the present embodiment is applied. It is a perspective view of the loading body which loads the board | substrate used as a lamination | stacking object of a film | membrane used by CVD apparatus, and a board | substrate. It is a longitudinal cross-sectional view of the reaction container in a CVD apparatus. It is IV-IV sectional drawing in FIG. It is VV sectional drawing in FIG. It is a figure for demonstrating the structure of the 1st partition member provided in the storage chamber. It is a figure for demonstrating the various dimensions in a reaction container. It is the figure which showed typically the flow of the source gas and block gas in the reaction container.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
<Overall configuration of CVD apparatus>
FIG. 1 is an overall configuration diagram of a CVD apparatus 1 to which the present embodiment is applied.
FIG. 2 is a perspective view of the substrate S used for the CVD apparatus 1 and a stack 113 on which the substrates S are stacked.
The CVD apparatus 1 as an example of a film forming apparatus manufactures a SiC epitaxial wafer in which a 4H-SiC film is epitaxially grown on a substrate S composed of SiC (silicon carbide) single crystal by a so-called thermal CVD method. Used for.

  This CVD apparatus 1 is provided with an internal space 100a that accommodates a substrate S loaded on a loading body 113, and in a housing chamber 100 in which a gas phase reaction for growing a film on the substrate S is performed, and in the internal space 100a. A discharge space 400a that communicates is provided, and the reaction vessel 10 includes an exhaust duct 400 for discharging the gas in the internal space 100a to the outside.

  In addition to the reaction vessel 10, the CVD apparatus 1 supplies a source gas that supplies a source gas as a film source to the internal space 100 a of the storage chamber 100 through a supply space 200 a provided in the supply duct 210. A block gas supply unit 300 for supplying a block gas for assisting the conveyance of the raw material gas along the horizontal direction and blocking the upward movement of the raw material gas into the internal space 100a of the storage unit 100, the storage unit 100, and the storage chamber The working gas (raw material gas (reaction gas) carried in from the internal space 100a of the housing chamber 100 through the heating mechanism 500 for heating the substrate S and the periphery of the substrate S and the discharge space 400a provided in the exhaust duct 400 in FIG. Used gas discharge unit 600 that discharges outside (including existing gas) and block gas), and the main part (details are given later) A cooling mechanism 700 for cooling the to), further comprising a rotation drive unit 800 for rotating the substrate S through the stacked body 113 in the housing chamber 100. In addition, the use gas discharge part 600 is used also when decompressing the inside space 100a through the discharge space 400a. Further, in the present embodiment, the exhaust duct 400 and the used gas discharge unit 600 have a function as an example of the discharge means.

  Here, the loading body 113 has a disk-like shape, and a recess 113a for installing the substrate S is provided at the center of the upper surface thereof. The loading body 113 is made of graphite (carbon). This graphite may be coated with SiC, TaC, or the like.

  As the substrate S, any polytype of SiC single crystals having a large number of polytypes may be used. If the film formed on the substrate S is 4H—SiC, the substrate S It is desirable to use 4H—SiC as S as well. Here, any off-angle may be used as the off-angle applied to the crystal growth surface of the substrate S, but the cost for manufacturing the substrate S is reduced while securing the step flow growth of the SiC film. From the point of view, it is preferable to use one having an off angle set to about 0.4 ° to 8 °.

  The substrate diameter Ds which is the outer diameter of the substrate S can be selected from various sizes such as 2 inches, 3 inches, 4 inches or 6 inches. At this time, the loading body inner diameter Di that is the inner diameter of the recess 113a in the loading body 113 is set to a value slightly larger than the substrate diameter Ds, and the loading body outer diameter Do that is the outer diameter of the loading body 113 is set to the loading body inner diameter Di. Is set to a larger value (Ds <Di <Do).

In addition, as a source gas supplied to the storage chamber 100 using the source gas supply unit 200 as an example of the source gas supply means, a gas capable of forming SiC on the substrate S along with a gas phase reaction in the storage chamber 100 In general, a silicon-containing gas containing Si and a carbon-containing gas containing C are used. In this example, monosilane (SiH ₄ ) gas is used as the silicon-containing gas, and propane (C ₃ H ₈ ) gas is used as the carbon-containing gas. In addition to the monosilane gas and propane gas, the source gas of the present embodiment further contains hydrogen (H ₂ ) gas as a carrier gas. The source gas supply unit 200 can also supply only the carrier gas.

  Further, as the block gas supplied to the storage chamber 100 using the block gas supply unit 300, it is desirable to use a gas having a poor reactivity with the source gas (a gas inert to the source gas). In this example, hydrogen gas is used as the block gas.

In addition, when controlling the SiC epitaxial film laminated | stacked on the board | substrate S to a hole conduction type (p type) or an electron conduction type (n type), doping of a different element is performed at the time of lamination | stacking of a SiC epitaxial film. Here, when the SiC epitaxial film is controlled to be p-type, it is desirable that the SiC epitaxial film is doped with aluminum (Al) as an acceptor. In this case, trimethylaluminum (TMA) gas may be further contained in the above-described source gas. Further, when the SiC epitaxial film is controlled to be n-type, it is desirable to dope nitrogen into the SiC epitaxial film as a donor. In this case, nitrogen (N ₂ ) gas may be further contained in the above-described source gas or block gas.

[Composition of reaction vessel]
FIG. 3 is a longitudinal sectional view of the reaction vessel 10 in the CVD apparatus 1. 4 is a sectional view taken along line IV-IV in FIG. 3, and FIG. 5 is a sectional view taken along line VV in FIG.
In the following description, in FIG. 3, the direction from the right side to the left side in the drawing is the X direction, the direction from the front side to the back side in the drawing is the Y direction, and the lower side in the drawing is going upward. Let the direction be the Z direction. In this example, the Z direction corresponds to the vertical direction, and the X direction and the Y direction correspond to the horizontal direction. In the present embodiment, the X direction corresponds to the first direction, and the -Z direction corresponds to the second direction.

  The reaction vessel 10 is provided along the XY plane on the upstream side (downward) in the Z direction when viewed from the internal space 100a, and the downstream side (upward) in the Z direction as viewed from the internal space 100a and the floor portion 110 on which the loading body 113 is disposed. The first side wall 130 provided along the XZ plane on the upstream side in the Y direction as viewed from the internal space 100a, and the downstream in the Y direction as viewed from the internal space 100a. A second side wall 140 provided along the XZ plane on the side and facing the first side wall 130; a third side wall 150 provided along the YZ plane on the upstream side in the X direction as viewed from the internal space 100a; and the internal space 100a. The fourth side wall 160 is provided on the downstream side in the X direction along the YZ plane and faces the third side wall 150.

  Here, a supply duct 210 that connects the source gas supply unit 200 and the reaction vessel 10 (accommodating chamber 100) is attached to the upstream side (downward) end of the third side wall 150 in the Z direction. Is provided with a supply space 200a for communicating with the internal space 100a and supplying the raw material gas from the raw material gas supply unit 200 to the internal space 100a in a diffused state. The communicating portion between the supply space 200a and the internal space 100a, that is, the outlet of the supply space 200a has a rectangular shape with the side along the Y direction as the long side and the side along the Z direction as the short side.

  Further, the floor portion 110 extends along the X direction from the third side wall 150, then, inclines obliquely downward along the X direction and the −Z direction corresponding to the discharge space 400a, and further along the −Z direction. Are formed to extend downward. On the other hand, the fourth side wall 160 extends along the −Z direction from the ceiling 120, and then tilts obliquely downward along the X direction and the −Z direction corresponding to the discharge space 400 a, and further along the −Z direction. Are formed to extend downward. The first side wall 130 and the second side wall 140 also correspond to the discharge space 400 a and extend along the floor 110 and the fourth side wall 160.

  The floor portion 110 is integrated with the first side wall 130, the second side wall 140, and the third side wall 150, and is provided in the fixing portion 111 and a fixing portion 111 having a circular opening formed in the center thereof. A loading body 113 on which the substrate S is placed is attached, and a turntable 112 that is rotated in the direction of arrow A by a rotation drive unit 800 (see FIG. 1) is provided.

  The fixed portion 111 constituting the floor portion 110 includes a first inner wall 1111 that is exposed to the inner space 100a and a first outer wall 1112 that is provided on the back side of the first inner wall 1111 when viewed from the inner space 100a. doing. Here, the first inner wall 1111 is made of TaC-coated graphite in which a coating layer made of TaC (tantalum carbide) is provided on the surface (side facing the internal space 100a) of a base material made of graphite (carbon), The first outer wall 1112 is made of stainless steel (SUS316 in this example: the same applies hereinafter). In the floor portion 110, the first outer wall 1112 is covered with the first inner wall 1111 so that the first outer wall 1112 is not exposed to the inner space 100a and the discharge space 400a.

  Further, the turntable 112 constituting the floor portion 110 is also disposed so as to be exposed to the internal space 100a, and is made of graphite with TaC coating, like the first inner wall 1111. A receiving portion 112 a (concave portion) for attaching the stack 113 is formed on the upper surface and the center of the turntable 112.

  The ceiling 120 is made of a stainless steel plate, and stainless steel is exposed in the internal space 100a. The ceiling 120 is provided with a rectifying unit 170 that is composed of a plurality of plate-like members and regulates the flow of various gases in the internal space 100a. Details of the rectifying unit 170 will be described later.

  The first side wall 130 includes a first inner wall 131 that is exposed to the internal space 100a, and a first outer wall 132 that is provided on the back side of the first inner wall 131 when viewed from the inner space 100a. Here, the first inner wall 131 is made of graphite with TaC coating, and the first outer wall 132 is made of stainless steel. In the first side wall 130, the first outer wall 132 is covered with the first inner wall 131 so that the first outer wall 132 is not exposed to the inner space 100 a.

  The second side wall 140 includes a second inner wall 141 disposed so as to be exposed to the inner space 100a, and a second outer wall 142 provided on the back side of the second inner wall 141 when viewed from the inner space 100a. Here, the second inner wall 141 is made of graphite with TaC coating, and the second outer wall 142 is made of stainless steel. In the second side wall 140, the second outer wall 142 is covered with the second inner wall 141, so that the second outer wall 142 is not exposed to the inner space 100a.

The third side wall 150 includes a third inner wall 151 that is exposed to the inner space 100a, a third outer wall 152 that is provided on the back side of the third inner wall 151 as viewed from the inner space 100a, and a lower end of the third inner wall 151. And a projecting member 153 disposed so as to project in the X direction from the side. Here, the third inner wall 151 and the protruding member 153 are made of graphite with TaC coating, and the third outer wall 152 is made of stainless steel. In the third side wall 150, the third outer wall 152 is covered with the third inner wall 151, so that the third outer wall 152 is not exposed to the inner space 100a.
Further, the protruding member 153 provided on the third side wall 150 has an inclined surface inclined in the lower left direction in FIG. And the front-end | tip (end part of the X direction downstream side) of the protrusion member 153 is extended to the position directly under the 1st partition member 171 mentioned later.

  The fourth side wall 160 includes a fourth inner wall 161 disposed so as to be exposed to the internal space 100a, and a fourth outer wall 162 provided on the back side of the fourth inner wall 161 when viewed from the internal space 100a. Here, the fourth inner wall 161 is made of graphite with TaC coating, and the fourth outer wall 162 is made of stainless steel. In the fourth side wall 160, the fourth outer wall 162 is covered with the fourth inner wall 161, so that the fourth outer wall 162 is not exposed to the inner space 100a and the discharge space 400a.

  In addition, in this example, the structure made of graphite with TaC coating, such as the first inner wall 131 to the fourth inner wall 161 and the protruding member 153 described above, has a heat insulating function and has a heat resistance of 600 ° C. or more. It is also possible to configure with a system material or a metal material.

  The rectifying unit 170 of the present embodiment is composed of a plate member made of stainless steel, and the first partition member 171, the second partition member 172, and the third partition member that partition the internal space 100a into a plurality of regions. 173. Here, each of the first partition member 171 to the third partition member 173 as an example of the partition member has an upper end attached to the ceiling 120 and extends along the −Z direction. The part is located in the internal space 100a. Moreover, the 1st partition member 171, the 2nd partition member 172, and the 3rd partition member 173 are arrange | positioned in this order along the X direction. The first partition member 171 is located at a position facing the third side wall 150, the third partition member 173 is located at a position facing the fourth side wall 160, and the second partition member 172 is placed between the first partition member 171 and the third partition member. 173, respectively.

  In the internal space 100 a in the storage chamber 100, the first partition member 171 to the third partition member are avoided, avoiding the stacking body 113 placed on the turntable 112 of the floor 110 and the substrate S loaded on the stacking body 113. 173 is arranged. More specifically, in the present embodiment, the loading body 113 is disposed at a position between a position immediately below the second partition member 172 and a position directly below the third partition member 173. .

  In the present embodiment, by attaching the first partition member 171 to the third partition member 173 to the internal space 100a, the internal space 100a has five regions, more specifically, the first region A1 and the first region. It is partitioned into a second area A2, a third area A3, a fourth area A4, and a fifth area A5.

Among these, 1st area | region A1 says the area | region enclosed by the ceiling 120, the 1st side wall 130, the 2nd side wall 140, the 3rd side wall 150, and the 1st partition member 171 among the internal spaces 100a.
In addition, the second region A2 refers to a region surrounded by the ceiling 120, the first side wall 130, the second side wall 140, the first partition member 171, and the second partition member 172 in the internal space 100a.
Further, the third region A3 refers to a region surrounded by the ceiling 120, the first side wall 130, the second side wall 140, the second partition member 172, and the third partition member 173 in the internal space 100a.
Furthermore, the fourth region A4 refers to a region surrounded by the ceiling 120, the first side wall 130, the second side wall 140, the third partition member 173, and the fourth side wall 160 in the internal space 100a.
And 5th area | region A5 says the area | region by the side of the floor part 110 which is not contained in said 1st area | region A1-4th area | region A4 among internal space 100a.

  In the present embodiment, the first region A1, the second region A2, the third region A3, and the fourth region A4 are arranged in this order along the X direction on the downstream side (upward) in the Z direction of the fifth region A5. Has been. The fifth area A5 communicates with each of the first area A1 to the fourth area A4 individually. The fifth area A5 communicates with the supply space 200a on the upstream side in the X direction of the fifth area A5, and communicates with the discharge space 400a on the downstream side in the X direction of the fifth area A5.

  In the following description, as shown in FIG. 5, the length in the Y direction from the first side wall 130 to the second side wall 140 in the storage chamber 100 (internal space 100 a) of the reaction vessel 10 is the room width. Call it W.

  Then, as shown in FIG. 1, the block gas supply unit 300 according to the present embodiment blocks the block gas (into the first region A <b> 1) from above through a through hole (not shown) provided in the ceiling 120. A first block gas supply unit 310 for supplying a first block gas), a second block gas supply unit 320 for supplying a block gas (second block gas) into the second region A2 from above, and a third region from above. A third block gas supply unit 330 for supplying a block gas (third block gas) into A3; a fourth block gas supply unit 340 for supplying a block gas (fourth block gas) into the fourth region A4 from above; have. The block gas supply unit 300 (first block gas supply unit 310 to fourth block gas supply unit 340) of the present embodiment performs block gas (first block gas to fourth block gas), particularly preheating. Without being performed, it is supplied to the internal space 100a as it is. Here, in the present embodiment, the first block gas supply unit 310 to the fourth block gas supply unit 340 each function as a block gas supply unit.

  Moreover, the heating mechanism 500 as an example of a heating means is provided below the turntable 112 in the floor part 110 as shown in FIG. The heating mechanism 500 includes a first heater 510 disposed below a stack 113 attached on the turntable 112, a second heater 520 disposed outside the periphery of the first heater 510, and a first heater 510. The second heater 520 is disposed below the peripheral edge of the heater 520, and is provided below the first heater 510 to the third heater 530 and emitted downward from the first heater 510 to the third heater 530. And a reflecting member 540 that reflects the heat to the turntable 112 side. The first heater 510 to the third heater 530 are made of graphite (carbon), for example, and are self-heating heaters that generate heat by a current supplied from a power source (not shown). In the present embodiment, the reflecting member 540 is also made of graphite (carbon).

  In CVD apparatus 1 of the present embodiment, purge gas made of argon (Ar) gas is supplied from below rotating table 112 and heating mechanism 500 toward internal space 100a, so that fixed portion 111 is fixed from internal space 100a. The raw material gas or the like is prevented from flowing into the heating mechanism 500 side through a gap between the rotary table 112 and the rotary table 112. The reason why argon gas is used as the purge gas is that the heating efficiency of the substrate S by the heating mechanism 500 decreases when hydrogen gas is used as the purge gas.

  Further, as shown in FIG. 1, the cooling mechanism 700 as an example of the cooling means includes a first water supply / drainage portion 710 that supplies and discharges water for cooling to the first partition member 171, and a cooling device that cools the second partition member 172. A second water supply / drainage unit 720 that supplies and discharges water for cooling, and a third water supply / drainage unit 730 that supplies and discharges water for cooling to the third partition member 173. In the present embodiment, similarly to the first partition member 171 to the third partition member 173, the ceiling 120 attached with the stainless steel exposed to the internal space 100a is cooled using the cooling mechanism 700. Absent. However, the first outer wall 132 in the first side wall 130, the second outer wall 142 in the second side wall 140, the third outer wall 152 in the third side wall 150, the fourth outer wall 162 in the fourth side wall 160, and the ceiling 120 are the first. As with the partition member 171 to the third partition member 173, cooling using the cooling mechanism 700 may be performed.

  The reaction vessel 10 is provided facing the ceiling 120 on the downstream side (upward) in the Z direction of the first region A1, and is supplied from the first block gas supply unit 310 into the first region A1 along the −Z direction. The first block gas diffusion member 181 that lowers the first block gas that has been diffused in the horizontal direction (X direction and Y direction) and the ceiling 120 on the downstream side in the Z direction of the second region A2 are provided. A second block gas diffusion member 182 that lowers the second block gas supplied from the second block gas supply unit 320 in the second region A2 along the −Z direction while diffusing in the horizontal direction; The third block gas that is provided facing the ceiling 120 on the downstream side in the Z direction of the third region A3 and is supplied from the third block gas supply unit 330 into the third region A3 along the −Z direction is the horizontal direction. Expanded The third block gas diffusion member 183 that is lowered while being lowered, and provided on the downstream side of the fourth region A4 in the Z direction so as to face the ceiling 120. The fourth region A4 extends from the fourth block gas supply unit 340 along the −Z direction. A fourth block gas diffusion member 184 is further provided for lowering the fourth block gas supplied inside while diffusing in the horizontal direction. Here, the first block gas diffusion member 181 is configured by stacking a plurality of (in this example, five) rectangular plate members along the XY plane and having a plurality of perforations formed in the Z direction. Further, the other second block gas diffusion members 182 to the fourth block gas diffusion member 184 also have the same configuration as the first block gas diffusion member 181.

[Configuration of the first partition member]
FIG. 6 is a view for explaining the configuration of the first partition member 171 provided in the storage chamber 100. Here, FIG. 6A is a view of the first partition member 171 viewed from the Y direction, and FIG. 6B is a view of the first partition member 171 viewed from the X direction. Although not described in detail, the second partition member 172 and the third partition member 173 also have the same configuration as the first partition member 171.

  The first partition member 171 has a rectangular parallelepiped appearance, and is attached to one end of the plate-like member 1711 having a hollow internal pipe 1711a formed therein and the internal pipe 1711a, and an inlet of water to the internal pipe 1711a. And a drain pipe 1713 attached to the other end of the internal pipe 1711a and serving as an outlet for water from the internal pipe 1711a. Note that the plate-like member 1711, the water supply pipe 1712 and the drain pipe 1713 constituting the first partition member 171 are each made of stainless steel. In the first partition member 171, both the water supply pipe 1712 and the drain pipe 1713 are attached to the surface of the plate-like member 1711 that faces the ceiling 120 (see FIG. 3 and the like) when the CVD apparatus 1 is configured. The water supply pipe 1712 and the drain pipe 1713 protrude outside the internal space 100a through a hole (not shown) provided in the ceiling 120, and the first water supply / drain part 710 (see FIG. 1) via an external pipe (not shown). ). The length in the Y direction of the plate-like member 1711 constituting the first partition member 171 is set to the indoor width W described above. Thereby, when the CVD apparatus 1 is configured, the upstream end surface of the plate-shaped member 1711 in the first partition member 171 in the Y direction contacts the first side wall 130, and the plate-shaped member 1711 in the first partition member 171. The end face on the downstream side in the Y direction is in contact with the second side wall 140.

[Reaction vessel dimensions]
FIG. 7 is a view for explaining various dimensions in the reaction vessel 10.
First, in the storage chamber 100 (internal space 100a) of the reaction vessel 10, the distance in the Z direction from the floor 110 to the ceiling 120 is defined as the indoor height Hr. The length of the first partition member 171 in the Z direction is the first partition height Hp1, the length of the second partition member 172 in the Z direction is the second partition height Hp2, and the third partition member 173 is in the Z direction. Is the third partition height Hp3. Further, the distance in the Z direction from the floor 110 to the lower end of the first partition member 171 is the first space height Ht1, and the distance in the Z direction from the floor 110 to the lower end of the second partition member 172 is the second space height. The distance in the Z direction from the floor 110 to the lower end of the third partition member 173 is defined as a third space height Ht3. At this time, Hr = Hp1 + Ht1 = Hp2 + Ht2 = Hp3 + Ht3.

  In addition, the distance in the Z direction at the outlet of the supply space 200a (the communication portion with the internal space 100a) is the supply port height Hi, and the distance in the Z direction at the inlet of the discharge space 400a (the communication portion with the internal space 100a) is discharged. The outlet height is Ho.

  Further, the length of the first region A1 in the X direction is defined as the first region length L1, the length of the second region A2 in the X direction is defined as the second region length L2, and the length of the third region A3 in the X direction. Is the third region length L3, and the length of the fourth region A4 in the X direction is the fourth region length L4.

  Note that the lengths of the first region A1 to the fifth region A5 in the Y direction are the common indoor width W as described above (see FIG. 5).

  In the present embodiment, the first partition height Hp1, the second partition height Hp2, and the third partition height Hp3 have a relationship of Hp1> Hp2 = Hp3. The indoor height Hr and the first partition height Hp1 to the third partition height Hp3 have a relationship of Hp1 ≧ Hr / 2, Hp2 ≧ Hr / 2, and Hp3 ≧ Hr / 2, respectively. . Here, since the indoor height Hr and the first partition height Hp1 to the third partition height Hp3 each use the ceiling 120 as a reference for the position of the upper end, the lower ends of the first partition member 171 to the third partition member 173 are These are located closer to the floor 110 than the ceiling 120.

  Further, the supply port height Hi, the first space height Ht1 to the third space height Ht3, and the discharge port height Ho have a relationship of Hi <Ht1 <Ht2 = Ht3 = Ho. Here, the supply port height Hi, the first space height Ht1 to the third space height Ht3, and the discharge port height Ho are based on the floor portion 110 as the position of the lower end, respectively. Thus, the upper end of the discharge port is present at a higher position.

  Further, the first region length L1 to the fourth region length L4 have a relationship of L1 <L4 <L2 <L3. The first region length L1 is set to a size that is, for example, one-fourth or less as compared to the other second region length L2 to the fourth region length L4.

  Furthermore, the load body outer diameter Do of the load body 113 on which the substrate S is loaded and the third area length L3 of the third area A3 located immediately above the load body 113 have a relationship of Do <L3. . Here, since the load body outer diameter Do and the substrate diameter Ds of the substrate S have a relationship of Ds <Do (see FIG. 2), the third region length L3 and the substrate diameter Ds are Ds < It has a relationship of L3.

<Film forming operation using CVD apparatus>
Next, a film forming operation using the CVD apparatus 1 of the present embodiment will be described.
First, the substrate S with the film formation surface facing outward is stacked in the recess 113 a of the stack 113. Next, the loading body 113 on which the substrate S is loaded is set on the turntable 112 (receiving portion 112 a) of the floor portion 110 in the CVD apparatus 1.

  Subsequently, the internal space 100a, the supply space 200a, and the discharge space 400a are degassed using the use gas discharge unit 600, and the carrier gas is supplied from the supply space 200a to the internal space 100a using the source gas supply unit 200. The block gas is supplied to the internal space 100a using the block gas supply unit 300. As a result, the atmosphere in the internal space 100a, the supply space 200a, and the discharge space 400a is replaced with hydrogen gas (block gas and carrier gas), and the pressure is reduced from normal pressure to a predetermined pressure (200 hPa in this example). At this time, the first block gas and the second block gas supply unit 310, the second block gas supply unit 320, the third block gas supply unit 330, and the fourth block gas supply unit 340 constituting the block gas supply unit 300 Each supply amount of block gas, 3rd block gas, and 4th block gas is selected from the range of 10L (liter)-30L / min, for example. Moreover, the supply amount of the carrier gas by the source gas supply part 200 is selected from the range of 1-100 L / min, for example.

  Then, the rotary table 112 of the floor portion 110 is driven using the rotation drive unit 800. Along with this, the loading body 113 set on the turntable 112 and the substrate S loaded on the loading body 113 rotate in the direction of arrow A. At this time, the rotation speed of the turntable 112 (substrate S) is 10 to 20 rpm.

  In addition, cooling of the rectifying unit 170 using the cooling mechanism 700 is started. More specifically, the water supply / drainage to the first partition member 171 by the first water supply / drainage unit 710, the water supply / drainage to the second partition member 172 by the second water supply / drainage unit 720, and the third partition member 173 by the third water supply / drainage unit 730. Start water supply / drainage.

  After cooling of the rectifying unit 170 using the cooling mechanism 700 is started, power supply to the first heater 510 to the third heater 530 constituting the heating mechanism 500 is started, and the first heater 510 to the third heater 530 are respectively turned on. By generating heat, the substrate S is heated via the turntable 112 and the loading body 113. Here, the power supply to the first heater 510 to the third heater 530 is individually controlled, and the temperature of the substrate S is selected from 1500 ° C. to 1800 ° C. (in this example, 1600 ° C.). The heating control is performed so that As the heating operation by the heating mechanism 500 is started, supply of argon gas as a purge gas is started. Then, after the substrate S is heated to the film formation temperature, the heating mechanism 500 changes the heating control so that the substrate S is maintained at the film formation temperature.

  After the substrate S is heated to the film formation temperature by the heating mechanism 500, the supply of the block gas to the internal space 100 a by the block gas supply unit 300 is continued under the above-described conditions, while the supply duct 210 is supplied from the source gas supply unit 200. The supply of the source gas to the internal space 100a via the (supply space 200a) is started. That is, the source gas supply unit 200 starts to supply a silicon-containing gas (monosilane gas in this example) and a carbon-containing gas (propane gas in this example) in addition to the carrier gas. At this time, it is preferable to start supplying the silicon-containing gas and the carbon-containing gas simultaneously. Here, “supplied at the same time” means that it is not necessary to be completely at the same time, but within several seconds.

  At this time, the supply amount of the silane gas is selected from a range of 50 sccm to 300 sccm, for example, and the supply amount of the propane gas is selected from a range of 12 sccm to 200 sccm, for example. However, the supply amount of the silane gas and the propane gas is determined so that the concentration ratio C / Si of carbon and silicon is within the range of 0.8 to 2.0. Further, the supply amount of the carrier gas at this time is selected from the range of 1 to 100 L / min, for example, as described above.

  Then, the source gas supplied from the source gas supply unit 200 along the X direction is expanded in the Y direction in the supply duct 210 and then carried into the internal space 100a along the X direction.

In this example, monosilane gas is used as the silicon-containing gas and propane gas is used as the carbon-containing gas. However, the present invention is not limited to this. For example, disilane (Si ₂ H ₆ ) gas may be used as the silicon-containing gas. Further, as the carbon-containing gas, ethylene _(C 2 _{H 4)} gas or ethane _(C 2 _{H 6)} can also be used gas or the like. Furthermore, as a silicon-containing gas, it is possible to use Cl-containing dichlorosilane gas, trichlorosilane gas, or the like. Furthermore, in this example, hydrogen (H ₂ ) gas is used alone as the carrier gas, but hydrogen (H ₂ ) gas containing hydrochloric acid (HCl) gas may be used.

  The source gas that has been carried into the internal space 100a along the X direction by the source gas supply unit 200 is guided in the X direction by the block gas and is prevented from rising in the Z direction (upward). It reaches the periphery of the substrate S rotating in the direction. Of the source gases that have reached the periphery of the substrate S, the monosilane gas is decomposed into silicon and hydrogen by the heat transmitted through the substrate S and the like, and the propane gas is carbonized by the heat transmitted through the substrate S and the like. And hydrogen. Then, silicon and carbon obtained by thermal decomposition are sequentially deposited on the surface of the substrate S while maintaining regularity, whereby a 4H—SiC film is epitaxially grown on the substrate S.

  The source gas (including the reacted gas) and the block gas that move in the X direction in the internal space 100a further move in the X direction by the degassing operation by the use gas discharge unit 600, and are exhausted from the internal space 100a. It is carried into a discharge space 400 a provided in 400 and further discharged to the outside of the reaction vessel 10.

  When the formation of the 4H—SiC epitaxial film having a thickness required for the SiC epitaxial wafer is completed on the substrate S, the source gas supply unit 200 stops the supply of the source gas to the internal space 100a. The heating mechanism 500 stops heating the substrate S on which the 4H—SiC epitaxial film is stacked, and the rotation driving unit 800 stops driving the turntable 112 (rotation of the substrate S). Further, in a state where the substrate S is sufficiently cooled, supply of block gas using the block gas supply unit 300, supply of purge gas, and cooling of the rectifying unit 170 using the cooling mechanism 700 are stopped, and a series of film forming operations is performed. Is completed. Then, after the degassing operation by the used gas discharge unit 600 is stopped and the interior space 100a is returned to normal pressure, the substrate S on which the 4H—SiC epitaxial film is laminated, that is, the SiC epitaxial wafer is loaded from the reaction vessel 10. The whole 113 is taken out, and the SiC epitaxial wafer is removed from the loading body 113.

[Flow of source gas and block gas in the storage chamber]
FIG. 8 is a diagram schematically showing the flow of the source gas and the block gas in the storage chamber 100.

  First, the source gas Gs supplied from the source gas supply unit 200 (see FIG. 1) to the internal space 100a through the supply space 200a is carried into the fifth region A5 from a portion below the first region A1. . The source gas Gs carried into the fifth region A5 is generated by the propulsive force applied by the source gas supply unit 200 and the suction force generated by the degassing operation of the use gas discharge unit 600 (see FIG. 1). While facing 110, it moves along the X direction toward the loading body 113 (substrate S).

  Further, the first block gas Gb1 supplied from the first block gas supply unit 310 (see FIG. 1) to the first region A1 is lowered along the −Z direction by the first block gas diffusion member 181. It diffuses in the X direction and the Y direction within the first region A1. The first block gas Gb1 that has passed through the first block gas diffusion member 181 further falls in the first region A1 along the −Z direction, and is carried from the first region A1 to the fifth region A5. Here, the projecting member 153 provided on the third side wall 150 is located below the first region A1. For this reason, the first block gas Gb1 carried into the fifth region A5 is guided by the inclined surface provided in the protruding member 153 and is pulled by the suction force of the used gas discharge unit 600 (see FIG. 1). Thus, the moving direction is changed from the direction along the −Z direction to the direction along the X direction. While the moving direction is changed from the −Z direction to the X direction, the first block gas Gb1 hits the source gas Gs that moves in the fifth region A5 along the X direction. Then, the first block gas Gb1 whose movement direction has been changed to the X direction moves along the X direction toward the portion below the second region A2 in the fifth region A5 together with the source gas Gs. . At this time, the first block gas Gb1 that moves in the X direction is in a state of covering the upper part of the source gas Gs that also moves in the X direction, and upward (to the first region A1 side) above the source gas Gs that moves in the X direction. Suppresses the lifting of. As a result, it is possible to suppress the raw material gas Gs from entering the first region A1 and eventually reaching the portion of the ceiling 120 that is the upper end of the first region A1.

  Here, the source gas Gs that has moved to the portion below the first region A1 in the fifth region A5 of the internal space 100a through the supply space 200a is pressurized by the pressure in the internal space 100a in the supply space 200a. Because it is lower than the pressure, it tries to expand at once. In addition, the source gas Gs that has moved from the portion below the first region A1 to the portion below the second region A2 in the fifth region A5 is heated by the heating mechanism 500 via the turntable 112. It expands and tries to float up from below. At this time, the first block gas Gb1 that moves along the X direction together with the raw material gas Gs suppresses upward floating of the raw material gas Gs.

  Further, the second block gas Gb2 supplied from the second block gas supply unit 320 (see FIG. 1) to the second region A2 is lowered along the −Z direction by the second block gas diffusion member 182. It diffuses in the X direction and the Y direction within the range of the second region A2. The second block gas Gb2 that has passed through the second block gas diffusion member 182 further falls in the second region A2 along the −Z direction, and is carried from the second region A2 to the fifth region A5. Therefore, the second block gas Gb2 carried into the fifth region A5 from the second region A2 along the −Z direction is the source gas Gs present in a portion below the second region A2 in the fifth region A5. The first block gas Gb1 is pushed from above. Thereby, the second block gas Gb2 carried into the fifth region A5 along the −Z direction is lifted upward (to the second region A2 side) of the source gas Gs moving along the X direction. Suppressed with 1 block gas Gb1. As a result, it is possible to suppress the raw material gas Gs from entering the second region A2 and eventually reaching the portion of the ceiling 120 that is the upper end of the second region A2.

  Note that the second block gas Gb2 that has moved along the −Z direction is pulled by the suction force of the used gas discharge unit 600 (see FIG. 1), so that the movement direction is changed from the direction along the −Z direction to the X direction. Change the direction along the direction. Then, the second block gas Gb2 whose movement direction has been changed to the X direction, along with the source gas Gs and the first block gas Gb1, is directed to a portion of the fifth region A5 that is below the third region A3, and in the X direction. Move along.

  The source gas Gs that has moved from the portion below the second region A2 in the fifth region A5 to the portion below the third region A3 is heated by the heating mechanism 500 via the turntable 112, the loading body 113, and the substrate S. It expands upon receiving the heat generated by, and tries to float upward from below. At this time, the first block gas Gb1 and the second block gas Gb2 that move along the X direction together with the raw material gas Gs suppress the upward rising of the raw material gas Gs.

  Further, the third block gas Gb3 supplied from the third block gas supply unit 330 (see FIG. 1) to the third region A3 is lowered along the −Z direction by the third block gas diffusion member 183. It diffuses in the X direction and the Y direction within the range of the third region A3. The third block gas Gb3 that has passed through the third block gas diffusion member 183 further descends in the third region A3 along the −Z direction, and is carried from the third region A3 to the fifth region A5. Therefore, the third block gas Gb3 carried into the fifth region A5 from the third region A3 along the −Z direction is the source gas Gs present in the portion below the third region A3 in the fifth region A5. The first block gas Gb1 and the second block gas Gb2 are pushed from above. As a result, the third block gas Gb3 carried in along the −Z direction lifts the source gas Gs moving along the X direction upward (third region A3), and the first block gas Gb1 and the first block gas Gb1 It suppresses with 2 block gas Gb2. As a result, it is possible to suppress the raw material gas Gs from entering the third region A3 and eventually reaching the portion of the ceiling 120 that is the upper end of the third region A3.

  The third block gas Gb3 that has moved along the −Z direction is pulled by the suction force of the use gas discharge unit 600 (see FIG. 1), so that the movement direction is changed from the direction along the −Z direction to the X direction. Change the direction along the direction. And the 3rd block gas Gb3 by which the moving direction was changed to the X direction is the site | part which becomes below 4th area | region A4 among 5th area | region A5 with source gas Gs, 1st block gas Gb1, and 2nd block gas Gb2. And move along the X direction.

  Here, as described above, the loading body 113 and the substrate S loaded on the loading body 113 are disposed in a portion of the fifth area A5 located below the third area A3. In this part, the source gas Gs is pressed to the substrate S side using the first block gas Gb1 to the third block gas Gb3, and the source gas Gs seems to be present around the substrate S. It has become. At this time, the substrate S is heated to the film forming temperature by the heating mechanism 500 (see FIG. 3), and the monosilane gas and the propane gas out of the source gas Gs existing around the substrate S are passed through the substrate S and the like. 4H-SiC single crystal composed of Si and C obtained by thermal decomposition is epitaxially grown on the substrate S. However, not all of Si and C obtained by pyrolysis are used for epitaxial growth on the substrate S, and some of them move in the X direction together with the first block gas Gb1 to the third block gas Gb3. To go. Further, hydrogen gas (reacted gas) obtained by thermally decomposing monosilane gas and propane gas moves along the X direction together with the first block gas Gb1 to the third block gas Gb3. Further, a part of the monosilane gas and a part of the propane gas move along the X direction as they are without being thermally decomposed around the substrate S.

  The source gas Gs (including unreacted and reacted gas) that has moved from the portion below the third region A3 in the fifth region A5 to the portion below the fourth region A4 passes through the turntable 112. When heated by the heating mechanism 500, it expands and tries to float upward from below. At this time, the first block gas Gb1 to the third block gas Gb3 that move along the X direction together with the raw material gas Gs suppress the upward rising of the raw material gas Gs.

  Further, the fourth block gas Gb4 supplied from the fourth block gas supply unit 340 (see FIG. 1) to the fourth region A4 is lowered along the −Z direction by the fourth block gas diffusion member 184. It diffuses in the X direction and the Y direction within the range of the fourth region A4. The fourth block gas Gb4 that has passed through the fourth block gas diffusion member 184 further descends in the fourth region A4 along the −Z direction, and is carried from the fourth region A4 to the fifth region A5. Therefore, the fourth block gas Gb4 carried into the fifth region A5 from the fourth region A4 along the −Z direction is the source gas Gs present in the portion below the fourth region A4 in the fifth region A5. The first block gas Gb1 to the third block gas Gb3 are pushed from above. As a result, the fourth block gas Gb4 carried in along the −Z direction lifts the source gas Gs moving along the X direction upward (fourth region A4), from the first block gas Gb1 to the first block gas Gb1. Suppresses together with the 3-block gas Gb3. As a result, the raw material gas Gs can be prevented from entering the fourth region A4, and eventually reaching the portion of the ceiling 120 that is the upper end of the fourth region A4.

  Note that the fourth block gas Gb4 that has moved along the −Z direction is pulled by the suction force of the used gas discharge unit 600 (see FIG. 1), so that the movement direction is changed from the direction along the −Z direction to the X direction. Change the direction along the direction. Then, the fourth block gas Gb4 whose movement direction has been changed to the X direction, together with the source gas Gs and the first block gas Gb1 to the third block gas Gb3, is directed to the communication portion between the fifth region A5 and the discharge space 400a. Move along the X direction. The source gas Gs and the first block gas Gb1 to the fourth block gas Gb4 are discharged to the outside by the use gas discharge unit 600 through the discharge space 400a.

  During this time, the first water supply / drainage unit 710, the second water supply / drainage unit 720, and the third water supply / drainage unit 730 that constitute the cooling mechanism 700 are the first partition member 171, the second partition member 172, and the third partition member 173 that constitute the rectification unit 170. In contrast, the cooling water is supplied and drained. Thereby, the temperature of the 1st partition member 171, the 2nd partition member 172, and the 3rd partition member 173 is maintained at 200 degrees C or less including each lower end. Further, the ceiling 120 is kept away from the heating mechanism 500, the block gas is supplied to the fifth region A5 via the first region A1 to the fourth region A4, and the first partition member 171. -The 3rd partition member 173 is cooled, but it is maintained at the temperature of 50 degrees C or less in spite of not being cooled directly.

  Thus, in the present embodiment, the first block gas Gb1 and the second block gas Gb2 serve to guide the source gas Gs toward the substrate S along the X direction, and the third block gas Gb3 serves as the X direction. The source gas Gs that passes over the substrate S along the substrate S plays a role of pressing the substrate S toward the substrate S from above, and the fourth block gas Gb4 moves the source gas Gs that passes over the substrate S along the X direction. And plays a role of leading to the exhaust duct 400 side.

  Here, the moving speed of the first block gas Gb1 carried into the fifth area A5 from the first area A1 is set as the first block gas flow velocity Vb1, and the second block carried into the fifth area A5 from the second area A2. The moving speed of the gas Gb2 is the second block gas flow velocity Vb2, and the moving speed of the third block gas Gb3 supplied from the third region A3 to the fifth region A5 is the third block gas flow velocity Vb3, and the fourth region A4 to the fifth. A moving speed of the fourth block gas Gb4 supplied to the region A5 is set to a fourth block gas flow velocity Vb4. When the supply amounts of the first block gas Gb1 to the fourth block gas Gb4 are each 10 L (liter) / min, for example, the respective flow rates are determined by the areas of the first region A1 to the fourth region A4 in the XY plane. In the present embodiment, as described above, since the length in the Y direction of the first region A1 to the fourth region A4 is constant at the indoor width W, the size of the area is determined by the first region A1 to the first region. It is determined by the length of the four regions A4 in the X direction. In this embodiment, as described above, the first region length L1, the second region length L2, and the third region length, which are the lengths in the X direction of the first region A1 to the fourth region A4, respectively. The length L3 and the fourth region length L4 have a relationship of L1 <L4 <L2 <L3. Therefore, the area in the XY plane is A1 <A4 <A2 <A3, and the flow velocity has a relationship of Vb3 <Vb2 <Vb4 <Vb1. In the present embodiment, the third block gas flow velocity Vb3 is the first velocity, the fourth block gas flow velocity Vb4 is the second velocity, the second block gas flow velocity Vb2 is the third velocity, and the first block gas flow velocity Vb1. Corresponds to the fourth speed.

  As described above, in the present embodiment, the source gas Gs is supplied along the X direction from the side of the substrate S to the substrate S accommodated in the internal space 100a of the accommodation chamber 100, and the substrate S is directly above. The third block gas Gb3 is supplied at the third block gas flow velocity Vb3 along the −Z direction, and the third block gas flow velocity along the −Z direction from the downstream side in the X direction and above the substrate S. The fourth block gas Gb4 is supplied at a fourth block gas flow velocity Vb4 that is faster than Vb3. Thereby, the raw material gas (including the reacted gas) that has passed over the substrate S is easily guided to the discharge port disposed downstream and downward in the X direction in the internal space 100a. Therefore, it is easy to suppress the retention of the source gas Gs (including the reacted gas) that has passed over the substrate S in the internal space 100a.

  In the present embodiment, the second block gas is located between the third block gas flow velocity Vb3 and the fourth block gas flow velocity Vb4 along the −Z direction from the upstream side in the X direction and above the substrate S. The second block gas Gb2 was supplied at the flow velocity Vb2. As a result, the source gas Gs that moves in the X direction toward the substrate S is less likely to float in the Z direction. Therefore, the diffusion of the source gas Gs before reaching the substrate S can be suppressed, and the use efficiency of the source gas Gs in the formation of the 4H—SiC film can be further improved.

  Further, in the present embodiment, the first block gas flow velocity Vb1 higher than the second block gas flow velocity Vb2 to the fourth block gas flow velocity Vb4 along the X direction from the upstream side in the X direction and above the substrate S. The first block gas Gb1 is supplied. As a result, the source gas Gs that moves in the X direction toward the substrate S is less likely to float in the Z direction. Therefore, the diffusion of the source gas Gs before reaching the substrate S can be further suppressed, and the use efficiency of the source gas Gs in the formation of the 4H—SiC film can be further improved.

  Further, in the present embodiment, by providing the rectifying unit 170 including the first partition member 171 to the third partition member 173 in the internal space 100a of the storage chamber 100 that stores the substrate S, the internal space 100a is It was made to partition into 1st area | region A1-5th area | region A5. The fifth region A5 in which the substrate S is arranged is supplied with the source gas Gs along the X direction from the side of the fifth region A5, and from the first region A1 to the fourth region A4 to the fifth region A5. The first block gas Gb1 to the fourth block gas Gb4 are supplied along the −Z direction toward the region A5. Thereby, it is possible to suppress the source gas Gs from moving upward in the internal space 100a and the source gas Gs from reaching the ceiling 120 positioned above the internal space 100a. Therefore, adhesion of the reaction product to the ceiling 120 due to the reaction of the source gas Gs in the vicinity of the ceiling 120 can be suppressed. Therefore, it is possible to make it difficult for the reaction product from the ceiling 120 to fall on the substrate S.

  Here, in the present embodiment, during film formation, the first partition member 171 to the third partition member 173 constituting the rectifying unit 170 are replaced with the cooling mechanism 700 (the first water supply / drainage unit 710 to the third water supply / drainage unit 730). Used to cool. Since the first partition member 171 to the third partition member 173 are arranged to extend to the side closer to the substrate S (heating mechanism 500) than the ceiling 120, they are easily heated by the heating mechanism 500, and The source gas Gs is easier to reach than the ceiling 120. For this reason, it can be said that the reaction product resulting from the source gas Gs is likely to adhere to the lower end sides of the first partition member 171 to the third partition member 173 in particular. However, in the present embodiment, by cooling the rectifying unit 170 using the cooling mechanism 700, the raw gas Gs is hardly decomposed even at the lower ends of the first partition member 171 to the third partition member 173. The environment. Therefore, it is possible to suppress the adhesion of the reaction product to the first partition member 171 to the third partition member 173 located above the substrate S, and from the first partition member 171 to the third partition member 173. It is possible to make it difficult for the reaction product to fall on the substrate S.

  As a result, the yield of the SiC epitaxial wafer manufactured using the CVD apparatus 1 of the present embodiment can be improved.

In this embodiment, the case where a 4H—SiC film is epitaxially grown on the substrate S composed of SiC single crystal has been described as an example. However, the present invention is not limited to this, and the substrate S and the substrate S are not limited thereto. The film formed on the upper surface may be appropriately changed in design.
Furthermore, in the present embodiment, a so-called single wafer type in which the substrates S are accommodated one by one in the accommodation chamber 100 is adopted, but the present invention is not limited to this, and a plurality of substrates S are accommodated together. A batch method for forming a film may be adopted.

DESCRIPTION OF SYMBOLS 1 ... CVD apparatus, 10 ... Reaction container, 100 ... Storage chamber, 100a ... Internal space, 110 ... Floor part, 111 ... Fixed part, 112 ... Turntable, 113 ... Loading body, 120 ... Ceiling, 130 ... 1st side wall, DESCRIPTION OF SYMBOLS 140 ... 2nd side wall, 150 ... 3rd side wall, 160 ... 4th side wall, 170 ... Rectification part, 171 ... 1st partition member, 172 ... 2nd partition member, 173 ... 3rd partition member, 200 ... Raw material gas supply part 200a ... supply space, 300 ... block gas supply unit, 310 ... first block gas supply unit, 320 ... second block gas supply unit, 330 ... third block gas supply unit, 340 ... fourth block gas supply unit, 400 ... exhaust duct, 400a ... discharge space, 500 ... heating mechanism, 600 ... used gas discharge part, 700 ... cooling mechanism, 710 ... first supply / drainage part, 720 ... second supply / drainage part, 730 ... third supply / drainage part, 8 0 ... rotary drive unit, A1 ... first area, A2 ... second area, A3 ... third region, A4 ... fourth region, A5 ... fifth region

Claims (5)

A storage chamber that has an internal space and stores the substrate so that the film formation surface faces upward on the lower side of the internal space;
Heating means for heating the substrate accommodated in the internal space;
Raw material gas supply means for supplying a raw material gas to be a raw material of the film along the first direction from the side of the substrate toward the substrate into the internal space,
A block gas that suppresses the upward movement of the raw material gas at a first speed is supplied to the internal space along a second direction from directly above the substrate from directly above the substrate. The block gas is supplied at a second speed higher than the first speed along the second direction from the downstream side and the upper side in the first direction , and further upstream from the substrate in the first direction. and from above, and the in the second direction, block gas supply means for supplying the block gases at a slower than faster the second speed than the first speed third speed,
A film forming apparatus including: a discharge unit configured to discharge the source gas and the block gas to the outside from the downstream side in the first direction in the internal space and the lower side of the internal space. The block gas supply means further supplies the block gas at a fourth speed higher than the third speed along the first direction from the upstream side in the first direction and above the substrate. The film forming apparatus according to claim 1 . The source gas supply means supplies a silicon-containing gas containing silicon and a carbon-containing gas containing carbon as the source gas,
The film forming apparatus according to claim 1, wherein the block gas contains hydrogen gas. The film forming apparatus according to claim 3 , wherein the heating unit heats the substrate to a film forming temperature selected from a range of 1500 ° C. to 1800 ° C. 5. Heating the substrate housed in the housing chamber containing the substrate so that the film formation surface faces upward on the lower side in the internal space,
A source gas serving as a raw material of the film is supplied to the internal space along a first direction from the side of the substrate toward the substrate,
A block gas that suppresses the upward movement of the raw material gas at a first speed is supplied to the internal space along a second direction from directly above the substrate from directly above the substrate. The block gas is supplied at a second speed higher than the first speed along the second direction from the downstream side and the upper side in the first direction , and further upstream from the substrate in the first direction. And from above, along the second direction, the block gas is supplied at a third speed that is faster than the first speed and slower than the second speed, and downstream of the first direction in the internal space and the The method for producing a film, wherein the raw material gas and the block gas are discharged to the outside from the lower side of the internal space.

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