JP5968200B2 - Wire electric discharge machining apparatus and method, thin plate manufacturing method and semiconductor wafer manufacturing method - Google Patents

Description

  The present invention relates to a wire electric discharge machining apparatus and method, a thin plate manufacturing method, and a semiconductor wafer manufacturing method.

  As a method of slicing a thin plate from a columnar workpiece, there is a technique in which a plurality of cutting wire portions are formed by winding a single wire electrode between a plurality of guide rollers in parallel to perform wire electric discharge machining. It is known (for example, refer to Patent Document 1). At this time, power is individually supplied to each cutting wire portion, and electric discharge is simultaneously generated between each cutting wire portion and the workpiece. As a result, the productivity of slicing the workpiece is improved.

  Further, in wire electric discharge machining, a technique for spraying a machining liquid onto a machining portion using a nozzle (for example, see Patent Document 2), and a technique for supplying a machining liquid containing abrasive grains to a machining groove (for example, see Patent Document 3). )It has been known. Furthermore, the central part of the prism-shaped member made of a conductive material such as brass is cut into the same shape as the ingot to be processed, and the ingot is fitted into the cut-in part to make it a prismatic shape. In addition, a technique for wire electric discharge machining of an ingot has been proposed (see, for example, Patent Document 4).

JP 2000-94221 A Japanese Patent Laid-Open No. 54-20485 Japanese Patent Laid-Open No. 5-96461 International Publication No. 2011/145390

  In the electric discharge type wire saw having the configuration described in Patent Document 1, when machining progresses and the machining groove formed in the workpiece becomes deeper, the machining waste is hardly discharged out of the machining groove and stays in the machining groove. Will come to do. When the processing waste stays in the processing groove, the frequency of discharge from the cutting wire to the processing waste increases, and the discharge in the processing direction decreases and the processing speed decreases. Further, the increase in the discharge in the groove width direction widens the processed groove width, making it difficult to reduce the slice pitch. Furthermore, disconnection of the cutting wire is likely to occur, and processing surface damage due to disconnection of the cutting wire is likely to occur. Even if the wire can be restarted by passing the wire at the disconnection point, the removal amount is large at the wire disconnection part, so the member that has been sliced must cope with the grinding process to the damaged area of the disconnection part. However, there was a problem that extra processing time and member loss occurred.

  In the technique described in Patent Document 2, since the machining liquid is sprayed onto the machining portion using the nozzle, the machining waste generated during machining is discharged out of the machining groove so that the machining waste does not stay between the electrodes. can do. However, according to the technique described in Patent Document 2, as the machining process progresses and the machining groove becomes deeper, it becomes difficult to supply the machining liquid to the tip of the slit, and the problem that the discharge capacity of the machining waste decreases. There was a point. In addition, if the ejection pressure of the machining fluid is increased to supply the machining fluid to the tip of the machining groove, the machining fluid pressure is locally applied to the cutting wire, which causes the cutting wire to bend and lower the machining accuracy. There was also the problem of doing. Furthermore, there is a problem in that the wire electrode is easily short-circuited by being pressed against the processed surface of the cutting wire due to the bending of the cutting wire.

  Moreover, although the technique described in Patent Document 3 does not solve the problem of discharge of machining waste, it can solve the above problem by supplying a machining fluid to the machining portion of the ingot along the traveling direction of the wire. It is valid. When processing a cylindrical ingot into a thin plate by cutting into a thin plate, the distance from the tip of the nozzle that ejects the processing liquid to the ingot varies depending on the cut surface shape of the wafer. In other words, the nozzle (working fluid ejection port) is in a state of being separated from the ingot machining position near the start of cutting or near the end of the ingot, while in the situation where the center of the ingot is machined, the nozzle ( The machining fluid outlet is closest. In this case, if the pressure of the machining liquid ejected from the nozzle is constant, the machining liquid is less likely to flow into a narrow slit formed in the ingot when the nozzle is away from the ingot. Therefore, in a situation where the nozzle is separated from the ingot, it is conceivable to increase the pressure of the processing liquid and flow it into the slit, but the problem is that the pressure of the processing liquid flow acts on the wafer and the wafer breaks. Occurs.

  According to the technique described in Patent Document 4, the workpiece is integrated with the rectangular parallelepiped member so that the distance from the nozzle is always constant, and the machining liquid is kept in a state in which the nozzle is always in close contact with the workpiece. Since it can be ejected, it is possible to flow (press-fit) the machining liquid into the machined machining groove (slit). That is, the machining liquid ejected from the nozzle is supplied to the machining groove of the ingot so as to be guided by the slit formed in the prismatic member, and the machining waste is discharged from the machining groove. Can be performed stably. However, in the technique described in Patent Document 4, the rectangular parallelepiped member cut simultaneously with the ingot cannot be reused, and it is necessary to prepare a brass member for each ingot. That is, there is a problem that material costs, processing costs, and production time are required in addition to thin plate cutting.

  The present invention has been made in view of the above. A wire electric discharge machining apparatus and method, a thin plate manufacturing method, and a method of manufacturing a thin plate that can suppress a decrease in machining accuracy and machining speed and can reduce costs other than the original cutting process. An object is to obtain a semiconductor wafer manufacturing method.

  In order to achieve the above object, a wire electric discharge machining apparatus according to the present invention includes a wire having a plurality of cutting wire portions respectively facing a workpiece while being spaced apart from each other in parallel, and an installation base on which the workpiece is placed. A machining power source for generating a pulsed machining voltage and electrically connected to each of the plurality of cutting wire portions, and the machining voltage is applied between the plurality of cutting wire portions and the workpiece. A plurality of supply electrons to be applied and the plurality of cutting wire portions are provided, and the processing liquid is provided on the workpiece arrangement side, and the processing liquid is directed between the electrodes along the plurality of cutting wire portions. A pair of nozzle members disposed on both sides in the cutting direction of the workpiece, and disposed on an outer periphery of the workpiece; The workpiece and the An outer peripheral constituent member that forms a sealed space with the slip member, and a moving means that moves the outer peripheral constituent member relative to the plurality of cutting wire portions, from the jet port of the nozzle member Wire electrical discharge machining using the wire is performed while the machining liquid ejected toward the gap is accumulated in the sealed space constituted by the workpiece, the nozzle member, and the outer peripheral component member. And

  According to the present invention, since the electric discharge machining is performed while the machining liquid is stored in the sealed space constituted by the workpiece, the nozzle member, and the outer peripheral member, the machining liquid is stably supplied to the discharge gap. Thus, the machining waste in the machining groove can be discharged from the discharge gap, and the discharge can be stabilized to improve the machining speed and machining accuracy of the electric discharge machining. In addition, since the workpiece is processed while being mounted on the mounting table, the material cost, the processing cost, and the production time are not required other than the cutting processing of the workpiece. .

1 is a perspective view showing a configuration of a main part of a wire electric discharge machining apparatus according to Embodiment 1. FIG. FIG. 2 is a perspective view showing a positional relationship among the nozzle, the workpiece, and the ingot holding part in the first embodiment. FIG. 3 is a cross-sectional view of FIG. FIG. 4 is a diagram illustrating the configuration of the nozzle according to the first embodiment. FIG. 5 is a diagram illustrating a configuration of the ingot holding unit. FIG. 6 is a cross-sectional view taken along the line B-B ′ of FIG. 3 of the ingot holding part in which the workpiece is accommodated. FIG. 7 is a partially enlarged perspective view of a nozzle body included in the wire electric discharge machining apparatus according to the second embodiment. FIG. 8 is a side cross-sectional view schematically showing an example of a processing state of the nozzle body shown in FIG.

  Exemplary embodiments of a wire electric discharge machining apparatus and method, a thin plate manufacturing method, and a semiconductor wafer manufacturing method will be described below in detail with reference to the accompanying drawings. Note that the present invention is not limited to these embodiments.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a configuration of a main part of a wire electric discharge machining apparatus according to Embodiment 1, and FIG. 2 is a perspective view showing a positional relationship among a nozzle, a workpiece, and an ingot holding part in Embodiment 1. FIG. 3 is a cross-sectional view of FIG. 4A and 4B are diagrams showing the configuration of the nozzle in the first embodiment, wherein FIG. 4A is a plan view viewed from the workpiece arrangement side, FIG. 4B is a cross-sectional view of FIG. ) Is a plan view seen from the opposite side of (a). 5A and 5B are diagrams showing the configuration of the ingot holding part, in which FIG. 5A is a top view, FIG. 5B is a right side view based on the direction of FIG. 1, and FIG. FIG. FIG. 6 is a cross-sectional view taken along the line BB ′ of FIG.

  The main guide rollers 1a to 1d are main guide rollers constituting a wire traveling system. In the wire electric discharge machining apparatus 100, four main guide rollers 1a to 1d having the same diameter are arranged in parallel with each other at intervals. ing. In this example, when viewed from the axial direction of the main guide rollers 1a to 1d, the main guide rollers 1a to 1d are disposed at rectangular corners. One wire 3 fed out from the wire bobbin 2 is sequentially wound around the four main guide rollers 1a to 1d while being separated at a predetermined pitch. The wire 3 travels as the main guide rollers 1a to 1d rotate, and finally reaches the wire winding bobbin 4.

  The main guide rollers 1c and 1d are installed at positions sandwiching the ingot holding portion 30, and the wire 3 is stretched between the main guide rollers 1c and 1d with a predetermined tension, so that the shafts of the main guide rollers 1c and 1d are mutually connected. A plurality of parallel wire portions PS separated in the direction are configured. In the following embodiments, the parallel wire portion PS refers to a portion from when the wire 3 is fed from the main guide roller 1c until it is wound around the main guide roller 1d. In the parallel wire portion PS, a linearly stretched region including a portion facing the workpiece 5 becomes a cutting wire portion CL, and a region where the cutting wire portion CL faces the workpiece 5 becomes an electric discharge machining region. .

  The power supply units 6a and 6b arranged in contact with the parallel wire part PS are electrodes that individually supply voltage pulses to the cutting wire part CL. In FIG. 1, both sides of the ingot holding part 30 in the wire traveling direction are provided. Two are arranged in the. In addition, vibration suppression guide rollers 7a and 7b are arranged on the parallel wire portion PS between the power supply units 6a and 6b, and the state where the wire 3 is always hung is maintained to guide the wire 3. That is, the vibration suppression guide rollers 7a and 7b are guide rollers having a smaller diameter than the main guide rollers 1c and 1d that are provided between the pair of main guide rollers 1c and 1d and are in contact with the parallel wire portion PS. Then, a plurality of cutting wire portions CL in which the wire 3 is supported and the wire 3 is linearly extended are formed. As will be described later, in the cutting wire portion CL between the vibration suppression guide rollers 7a and 7b, the wire vibration is suppressed and the traveling position is almost stationary. A machining power supply unit 10 is connected to each of the power supply units K constituting the power supply units 6 a and 6 b via a power supply line 20.

  For each of the main guide rollers 1a to 1d, the wire 3 is wound around a part of the outer periphery of the roller (about ¼ turn), and wraps around the entire four main guide rollers 1a to 1d. The main guide rollers 1a to 1d constitute a path from the wire bobbin 2 to the wire take-up bobbin 4 so as to secure a space for the workpiece 5 to pass through the cutting wire portion CL and not interfere with other wires. It is configured. The main guide rollers 1c and 1d are driving guide rollers, and the main guide rollers 1a and 1b disposed above the main guide rollers 1c and 1d are driven guide rollers.

  The drive type guide roller is driven to rotate by connecting the shaft of the drive type guide roller to the motor, whereas the driven type guide roller does not generate a driving force and rotates as the wire travels. The vibration suppression guide rollers 7 a and 7 b are driven guide rollers arranged so as to be wound around the wire 3 in contact with the parallel wire portion PS, and rotate by being driven as the wire 3 travels. In FIG. 1, the arrows drawn around the axes of the main guide rollers 1 a to 1 d indicate the rotation direction of each main guide roller, and the arrows drawn along the wires 3 indicate the traveling direction of the wires 3.

  The wire 3 that has been vibrated before being applied to the vibration suppression guide roller 7b is reliably applied to the vibration suppression guide roller 7b, thereby blocking the vibration of the traveling wire 3 while vibrating. Similarly, vibration applied to the wire 3 fed from the vibration suppression guide roller 7a is blocked by the vibration suppression guide roller 7a. As a result, the two vibration suppression guide rollers 7a and 7b are rotated by the frictional force with the wire 3 as the wire travels, creating a state where there is almost no wire vibration in the linear region between the vibration suppression guide rollers 7a and 7b. ing. That is, the vibration guide rollers 7a and 7b suppress vibration propagation from the main guide rollers 1a to 1d to the cutting wire portion CL, and precisely guide the wire 3 so that the microscopic traveling position is constant. Is possible.

  Although the vibration suppression guide rollers 7a and 7b may bend the traveling direction of the wire connected to the cutting wire portion CL, the vibration suppression guide rollers 7a and 7b do not have a function of securing a space for the workpiece 5 to pass through the cutting wire portion CL. . On the roller surface with which the wire 3 comes into contact, a wire guiding groove having the same interval as that of the cutting wire portion CL is provided, and one wire is placed in each groove. The left and right arrows on the vibration damping guide rollers 7a and 7b in FIG. 1 indicate the moving directions of the vibration damping guide rollers 7a and 7b on the wire electric discharge machining apparatus 100.

  Nozzles 8a and 8b are arranged in the region of the cutting wire portion CL, and the nozzles 8a and 8b arranged facing each other are cut along the cutting wire portion CL to the cutting portion of the workpiece 5 in the ingot holding portion 30. The machining fluid is spouted out. The cutting wire portion CL penetrates the nozzles 8a and 8b, but does not contact the inner surfaces of the nozzles 8a and 8b. The stage 9 is a table that moves up and down by placing the ingot holding part 30, and an arrow (see FIG. 3) drawn from the stage 9 indicates the upward direction of the stage 9.

  In FIG. 1, the workpiece 5 is housed inside the ingot holding unit 30 and cannot be seen. Therefore, in FIG. 2, the ingot holding unit 30 is indicated by a broken line, and the fixed state of the workpiece 5 in the ingot holding unit 30 is shown. Show. As shown in FIGS. 2, 5, and 6, the ingot holding portion 30, which is an outer peripheral component member, has a through-hole 301 whose central portion is substantially the same shape as the workpiece 5. The workpiece 5 is fitted into the hole 301. Further, ingot fixing members 35a and 35b having substantially the same shape as the through hole 301 are inserted from both sides of the ingot (workpiece 5), and the workpiece 5 is sandwiched from both sides. In this state, the workpiece 5 integrated with the ingot fixing member 35a is slid in the through hole 301 to position the ingot at a position where the cutting wire portion CL passes.

  After the positioning is completed, the set screw 171 provided on the side surface of the ingot holding unit 30 is tightened. When the tips of the set screw 171 are pushed into the outer peripheral surfaces of the ingot fixing members 35a and 35b, the ingot fixing members 35a and 35b are pressed against the inner surface of the through hole 301. As a result, the ingot fixing members 35a and 35b are fixed to the ingot holding part 30, and the workpiece 5 is also fixed to the ingot holding part 30 without rattling.

  The fitting tolerance between the inner diameter of the through-hole 301 into which the ingot fixing members 35a and 35b are fitted in the ingot holding part 30 and the outer diameter of the ingot fixing members 35a and 35b is several μm or less, and machining fluid leaks from the fitting parts. Is suppressed. Furthermore, by adopting a method of attaching O-rings to the ingot fixing members 35a and 35b and inserting them into the through holes 301, the sealing function of the mating portion is improved, and the leakage of the processing liquid from other than the processing grooves is prevented. May be.

  The dummy base 33 is an installation base for the workpiece 5 for performing stage feeding that is equal to or greater than the thickness of the workpiece 5 in order to completely cut and separate the workpiece 5. The dummy base 33 is disposed at the bottom of the through hole 301 of the ingot holding unit 30. By fixing the workpiece 5 in a state where the workpiece 5 is placed on the dummy base 33, the ingot holding portion 30 is subjected to electric discharge machining even if the cutting wire portion CL cuts the dummy base 33 and feeds it. To prevent it.

  On both sides of the ingot holding part 30 in the wire traveling direction, nozzles 8a and 8b are disposed. As shown in FIG. 5, the cutting wire portion CL can pass through the surface of the ingot holding portion 30 that contacts the nozzles 8a and 8b, that is, the surface parallel to the through hole 301 into which the workpiece 5 is inserted. A through hole 302 with a wide width is machined, and the cutting wire portion CL is passed through the through hole 302. The through hole 302 is provided so that the lower end of the through hole 302 is located below the upper surface of the dummy base 33. Further, a groove 303 is machined on the surface of the ingot holding part 30 on the side in contact with the nozzles 8 a and 8 b so as to surround the through hole 302. An O-ring 31 is fitted in the groove 303. The nozzle 8a, 8b presses the surface of the machining fluid on the side of the jet outlet 93 against the O-ring 31, and the O-ring 31 is deformed and is in close contact with the surface of the nozzle 8a, 8b on the side of the jet outlet 93. It is installed on both sides of the wire running direction. Thereby, the nozzles 8a and 8b and the ingot holding part 30 are brought into a close contact state. A slight gap for allowing the cutting wire portion CL to pass between the workpiece 5 and the ingot holding portion 30 is provided above the workpiece 5.

  The ingot holding part 30 moves relative to the nozzles 8a and 8b while being in close contact with the surface of the nozzles 8a and 8b on the jet outlet 93 side. As the ingot holding part 30 rises from the state of FIG. 2 or FIG. 3, the cutting wire part CL through hole 302 processed into the ingot holding part 30 eventually protrudes from the upper ends of the nozzles 8a and 8b. It will be. In order for the nozzles 8 a and 8 b to maintain the close contact state with the ingot holding unit 30 until the ingot cutting is completed, the nozzle side surfaces of the nozzles 8 a and 8 b are long in the height direction according to the moving distance of the ingot holding unit 30. It is desirable to be designed. Thereby, even if the ingot holding part 30 moves up until the workpiece 5 is completely cut, the through-hole 302 for cutting wire part CL passage does not protrude from the nozzles 8a and 8b.

  Therefore, the contact state between the nozzles 8a and 8b and the ingot holding unit 30 is maintained, and the machining liquid is filled in the gap 34 which is a sealed space inside the ingot holding unit 30 from the nozzles 8a and 8b to the surface of the workpiece 5. And can be in a static pressure state. Then, the machining fluid is supplied to the inside of the machining groove formed by wire electric discharge machining of the workpiece 5, and the machining waste is swept away from the gap between the wire 3 facing the workpiece 5. A machining fluid ejection device can be configured.

  Next, the operation of the wire electric discharge machining apparatus 100 in the first embodiment will be described. In the wire electric discharge machining, the workpiece 5 is cut by causing an arc discharge in a discharge gap filled with a minute machining fluid such as deionized water between the wire 3 and the workpiece 5. . Specifically, the surface of the workpiece 5 is heated by the discharge arc to become a high temperature, and the machining liquid present in the discharge gap is explosively vaporized to cause the workpiece 5 to be in a molten state. Blow away. The part blown off becomes machining waste and floats in the machining fluid. The cutting wire portion CL and the workpiece 5 are discharge electrodes, respectively, and the length of the discharge gap is also referred to as an interelectrode distance. In this electric discharge gap, the machining waste generated by electric discharge machining is interposed, and when the machining waste concentration in the electric discharge gap becomes high, the cutting wire portion CL and the workpiece 5 are interposed between the accumulated machining waste. Short circuit is likely to occur. If short-circuiting frequently occurs, not only the processing efficiency is lowered, but also a high-energy short-circuit current flows through the wire 3, so that the temperature of the wire 3 becomes high, and the temperature exceeds the breaking strength of the wire 3, causing wire breakage. . Therefore, discharging the machining waste is essential for stable machining. In the first embodiment, the machining fluid is supplied into the discharge gap so that the machining waste does not stay in the discharge gap, and the machining waste is discharged from the gap together with the liquid flow.

  For example, by wire electric discharge machining using a wire electrode having a diameter of 0.1 mm, for example, a slit having a width of about 0.15 mm and a length of about 100 mm is formed in a 4-inch ingot. In order to supply the machining fluid to the inside of such a slit, in addition to increasing the machining fluid pressure, it is effective to press the machining fluid into the slit with the nozzle tip as close as possible to the workpiece. It is. However, there is no problem if the workpiece is shaped like a rectangular parallelepiped so that the distance from the nozzle to the workpiece surface is always constant during processing, but the outer periphery is cut so that it becomes a semiconductor wafer by cutting into thin plates. The shaped ingot is generally cylindrical. Therefore, the distance from the nozzle to the outer periphery of the ingot changes according to the processing position. That is, there are few states that can be machined in a situation where the nozzle tip is close to the ingot, and most of the machining is in a state where the nozzle tip is away from the ingot. If the tip of the nozzle cannot be brought into close contact with the workpiece, even if the machining fluid pressure is increased, the machining fluid is immediately ejected from the nozzle and diffuses to the surroundings, causing the machining fluid to flow into the target machining groove. It becomes difficult.

  As shown in FIG. 3, in the wire electric discharge machining apparatus 100 according to the first embodiment, the inside of the ingot holding unit 30 is located between the workpiece 5 accommodated and the jets 93 of the nozzles 8 a and 8 b. Although there are gaps 34, the side surfaces of the nozzles 8 a and 8 b and the ingot holding part 30 are in close contact as described above, so that when the machining liquid is supplied to the ingot holding part 30, the machining liquid is applied to the gap 34 part. Injected. Then, after the gap 34 is filled with the machining liquid, the machining liquid is discharged from the machining liquid discharge port 32 provided on the upper surface of the ingot holding unit 30.

  As the flow path of the machining liquid to the machining liquid discharge port 32, there are a flow path that is discharged along the outer peripheral surface of the workpiece 5 and a flow path that passes through a machining groove formed in the workpiece 5. Therefore, the workpiece 5 is installed so as to narrow the flow path formed along the outer peripheral surface of the workpiece 5 formed by the inner surface of the ingot holding unit 30 and the outer periphery of the workpiece 5, or By designing the inner surface of the ingot holding unit 30, the machining fluid that has flowed into the gap 34 in the ingot holding unit 30 is in a state close to static pressure. A larger amount of machining liquid is press-fitted into the machining groove formed in the workpiece 5 by electric discharge machining, and flows out into the machining liquid discharge port 32 through the slit. As for the shape of the machining fluid discharge port 32, the length in the direction perpendicular to the wire traveling direction is substantially the same as that of the cutting wire portion CL, and the length in the wire traveling direction is the area of the machining fluid discharge port 32. It is good to set it as the length which becomes 2 times or less of the area of a nozzle jet nozzle.

  As shown in FIG. 4, the nozzles 8 a and 8 b are provided with an ejection port 93 provided on the surface facing the workpiece 5 and a clearance for the cutting wire portion CL to pass through the nozzles 8 a and 8 b in a non-contact manner. And a mouth 95. The escape port 95 is located on the opposite side of the jet port 93, and the parallel wire portion PS is passed through like the jet port 93. In order to reduce the outflow amount of the working fluid from the escape port 95 side and increase the outflow amount of the working fluid from the jet port 93 side, the length in the height direction of the jet port 93 (for example, 5 mm) is increased. It is desirable to narrow the length of the escape port 95 in the height direction (for example, about 0.5 mm).

  The machining fluid is supplied from a supply pipe (not shown) to the nozzle 8a or 8b at a predetermined flow rate, and is ejected from the ejection port 93 and the escape port 95. Therefore, the machining fluid is ejected from the ejection port 93 along the cutting wire portion CL, and a part of the machining fluid flows out from the escape port 95. Since the cutting wire portion CL and the flow of the machining liquid are parallel, the cutting wire portion CL is not bent by the machining liquid flow, and the flow rate of the machining liquid does not fluctuate and vibrate.

  The distance between the nozzles 8 a and 8 b on the side of the jet outlet 93 and the end surface (outer surface) of the ingot holding unit 30 is about several tens of μm from the end surface of the ingot holding unit 30. At this time, the O-ring 31 fitted on the surface of the ingot holding part 30 facing the nozzle 8a or 8b functions as a seal that prevents the machining fluid from flowing out by the nozzle 8a or 8b being pressed and deformed. Loss of the flow rate of the machining fluid from the 8a or 8b outlet 93 to the ingot holding unit 30 is suppressed. Note that the machining fluid is continuously supplied to the supply pipe from an external machining fluid supply device (not shown).

  The nozzles 8a and 8b are disposed so that the jet outlets 93 face each other along the cutting wire portion CL, and are accommodated in the ingot holding portion 30 and formed in the workpiece 5 (fixed). A machining fluid flow is formed in the direction of colliding with each other toward the slit. The machining fluid is supplied from both sides of the machining groove formed in the workpiece 5 by the nozzles 8a and 8b, and the gap 34 portion of the ingot holding unit 30 is filled with the machining fluid to make it close to a static pressure state. , 8b, the machining liquid filled in the ingot holding part 30 is pushed out by the machining liquid flowing into the ingot holding part 30 from the jet port 93, so that the machining liquid also flows into the deeply formed machining groove, The machining waste can be discharged from the discharge gap to supply new machining fluid.

  As shown in FIG. 3 and FIG. 5, according to such a configuration, the nozzles 93 of the nozzles 8 a and 8 b are always on the same axis as the cutting wire portion CL even if the processing progresses and the processing groove becomes deep. Yes, the machining fluid is ejected along the cutting wire portions CL so that the machining fluid moves toward the gap. Therefore, it becomes easy to make the working fluid pressure acting on the cutting wire portion CL formed of parallel wires uniform, and the bending of the wire electrode can be suppressed. In addition, since the machining liquid is ejected along the cutting wire portion CL so that the machining liquid is directed to the gap, the machining liquid is held in the ingot from the nozzles 8a and 8b with respect to the tip of the machining groove at any point in the machining process. It can flow into the part 30. Since the machining liquid is stored in the gap 34 of the ingot holding part 30 in a static pressure state, the machining liquid can be stably supplied to the gap between the machining grooves regardless of the depth of the machining groove. The processing waste can be stably discharged from the processing groove. As a result, the discharge in the machining direction increases, and a reduction in machining speed can be suppressed. At the same time, since the secondary discharge due to the processing waste is reduced for the processing groove of the workpiece 5 cut at a time by the cutting wire portion CL made of the parallel wire, it becomes easy to make the groove width narrow and uniform, Reduction in machining accuracy can be suppressed. In addition, since the cutting wire portion CL penetrates from the ejection port 93 to the escape port 95, the machining liquid ejected from the ejection port 93 is easily ejected along the cutting wire portion CL, and the machining groove is more reliably formed. The machining fluid can also be supplied to the tip of the steel.

  The supply of the wire and the power supply to the wire will be described. During processing, the wire 3 is continuously drawn out from the wire bobbin 2, conveyed by the rotation of the main guide rollers 1 a to 1 d, and discharged to the wire take-up bobbin 4. By adjusting the respective rotational speeds of the wire bobbin 2 and the wire take-up bobbin 4, the tension during traveling of the wires 3 arranged in parallel is controlled. When the traveling state of the wire 3 is stable, the tension of the traveling wire 3 is kept constant.

  When electric discharge machining is performed, after the main guide rollers 1c and 1d are rotated to run the wire 3, the workpiece 5 is disposed facing the cutting wire portion CL with a predetermined distance between the electrodes. Then, a voltage pulse is applied to the cutting wire portion CL, and the stage 9 is raised in accordance with the cutting speed. With the distance between the electrodes kept constant, the cutting wire portion CL (parallel cutting portion) and the workpiece 5 are moved relative to each other to continue arc discharge, and the cutting wire portion CL of the workpiece 5 passes. A processing groove is formed corresponding to the route. Therefore, the thickness of the wafer to be cut out is a length obtained by subtracting the width of the processed groove (processed width CW) that becomes the cutting allowance of the workpiece 5 from the winding pitch. As can be understood from FIG. 2, the machining width CW is a value obtained by adding twice the inter-electrode distance d to the wire diameter DW. In order to reduce the processing width CW, it is desirable that the wire 3 has a smaller wire diameter, and a steel wire of about 0.1 mm is suitable for practical use, and a further thinned wire such as 0.07 mm can be used. . Furthermore, in order to make the discharge starting voltage appropriate, a coating such as brass may be applied to the surface of the steel wire.

  At this time, if some vibration is transmitted to the cutting wire portion CL, the cutting wire portion CL contacts the bottom surface of the processing groove in the processing groove of the workpiece 5 to cause a short circuit. Or, it is too far away from the processed surface and causes an open state where no discharge occurs. When these occur repeatedly, electric discharge machining becomes unstable. On the other hand, if the wire travel can be stabilized and the accuracy of the wire position can be increased, the pitch between the cutting wire portions CL can be reduced, and a thinner wafer can be cut out from the ingot-like workpiece 5. .

  In the first embodiment, the power supply units 6a and 6b are installed outside the vibration suppression guide rollers 7a and 7b with the workpiece 5 interposed therebetween, and each of the power supplies K applies a voltage to the cutting wire portion CL. it can. The wire 3 is wound along the power supply surface of the power supply K, contacts the power supply K while traveling, forms a sliding contact, and supplies power to the cutting wire portion CL. When the cutting wire part CL is lifted from the supply electron K during processing, an arc discharge occurs between the two and the supply electron K is seriously damaged. Therefore, the sliding contact must be reliably maintained.

  In order to adjust the amount by which the power supply units 6 a and 6 b are pressed against the wires 3, a mechanism (not shown) for moving the power supply units 6 a and 6 b in the direction perpendicular to the wires 3 is provided. The contact length between the wire 3 and the power supply K is the sliding length, and the sliding length can be managed by the pressing amount of the power supply units 6a and 6b against the parallel wire portion PS. That is, when the pressing amount is small, the sliding length is small, and when the pressing amount is large, the sliding length is large. The pressing amount may be defined by a pushing distance with respect to the wire 3 or may be defined by a pressing force. The contact resistance can be adjusted by adjusting the sliding length, and the discharge current value per voltage pulse can be finely adjusted. Therefore, even when consumable parts such as the wire 3 and the power supply units 6a and 6b are replaced, it is easy to reproduce the processing state before replacement, and reproducibility for each processing batch can be ensured.

  In the wire electric discharge machining, for example, the wire 3 travels at a speed of about 30 to 200 m / min. Therefore, when the wire 3 comes into contact with the inner wall surface of the nozzle, the inner wall surface is scraped off, and the wire 3 is caught, causing wire breakage. Therefore, it is necessary to always maintain the distance between the wire periphery and the nozzle inner wall surface, in particular, the escape port 95 even during wire travel. That is, the nozzles 8a and 8b do not have a die-shaped guide inside, and the wire 3 travels without being in contact therewith. Therefore, the positions of the vibration suppression guide rollers 7a and 7b that determine the feeding position of the cutting wire portion CL are carefully adjusted so that the cutting wire portion CL does not contact the inner wall surface of the nozzle.

  The diameter of the semiconductor ingot is, for example, 2 inches (about 50 mm) or more, and in many cases, it is 4 inches (about 100 mm) or more. For this reason, when the semiconductor wafer is cut by wire electric discharge machining, it is desirable to immerse the entire workpiece 5 in the machining liquid so that the machining liquid is surely filled in the discharge gap. Accordingly, the nozzles 8 a and 8 b are also immersed in the machining liquid together with the workpiece 5. By immersing the workpiece 5, the nozzles 8a and 8b, the peripheral guide rollers, and the like in the machining liquid, the entire machining groove is filled with the machining liquid, so that the machining waste flows above the machining groove and flows from the discharge gap. Processing waste can be efficiently discharged.

  Next, the relationship between the vibration suppression guide rollers 7a and 7b, the power supply units 6a and 6b, and the nozzles 8a and 8b with respect to the wire 3 wound around the main guide rollers 1a to 1d will be described with reference to FIGS.

  The nozzles 8a and 8b are disposed close to the workpiece 5 at symmetrical positions with the workpiece 5 interposed therebetween. That is, the vibration suppression guide roller 7a is disposed between the drive type main guide roller 1d and the nozzle 8a, and the vibration suppression guide roller 7b is disposed between the drive type main guide roller 1c and the nozzle 8b. . Furthermore, the arrangement of the power supply units 6a and 6b with respect to the wire 3 is arranged between the main guide rollers 1d and 1c and on the opposite sides to the outside of the vibration control guide rollers 7a and 7b with the cutting wire portion CL interposed therebetween. Yes.

  According to this roller arrangement, the vibration of the wire 3 can be blocked by the two vibration suppression guide rollers 7a and 7b, and the position of the cutting wire portion CL with respect to the nozzles 8a and 8b can be kept constant. If the arrangement without the vibration damping guide rollers 7a and 7b is used, the relief openings of the nozzles 8a and 8b when the pressing amount of the power supply units 6a and 6b is changed to control the contact resistance of the power supply K. The positional relationship of the cutting wire portion CL with respect to 95 changes. Therefore, it becomes necessary to move the nozzles 8a and 8b in the same direction in accordance with the power supply units 6a and 6b, and the mechanism becomes complicated. That is, by using the vibration suppression guide rollers 7a and 7b, the wire 3 of the cutting wire portion CL is made to the escape port 95 and the jet port 93 of the nozzles 8a and 8b, respectively, regardless of the pressing amount of the power supply units 6a and 6b. Can be sent horizontally. Further, even if the power supply K is scraped off by the wire 3 and the sliding position changes, the positional relationship of the cutting wire portion CL with respect to the nozzles 8a and 8b can be stably maintained.

  The power supply unit 6a or 6b is pushed between the main guide roller 1d or 1c and the vibration suppression guide roller 7a or 7b from the opposite side of the wire 3 connected to the cutting wire portion CL. Therefore, the wire 3 is bent in a mountain shape with the power supply units 6a and 6b as apexes, and the contact state of the power supply K becomes stable. Further, when this state is maintained, the winding length of the vibration suppression guide rollers 7a and 7b and the main guide rollers 1c and 1d is increased, and the wire wound around the guide roller is increased by increasing the frictional resistance. 3 becomes difficult to slip. As a result, the traveling of the wire conveyed by the rotational driving force is stabilized, and the wound wire 3 is difficult to come off, so that the power feeding to the wire 3 traveling at a high speed and the winding stability are significantly improved. As a result, even when the wire electric discharge machining apparatus 100 performs continuous operation for a long time, troubles due to wire traveling do not occur, and a large-diameter ingot can be cut.

  Furthermore, by providing a vibration-damping guide roller 7a or 7b between the nozzle 8a or 8b and the power supply unit 6a or 6b along the extending direction of the cutting wire portion CL, the power supply is made from the escape port 95 of the nozzles 8a and 8b. There is an advantage that the machining fluid flow ejected in the direction of the units 6a and 6b does not collide with the power supply units 6a and 6b. This is because, as described above, since the power supply units 6a and 6b are pushed upward with respect to the wire 3, the sliding portions of the power supply units 6a and 6b are viewed from the escape port 95 of the nozzle 8a or 8b. This is because the shape is hidden behind the vibration suppression guide rollers 7a and 7b. Since the machining fluid flow ejected from the escape port 95 at a high speed does not reach the power supply units 6a and 6b, fluctuations in the wire contact resistance at the sliding portion, which becomes a problem when the machining fluid flows collide, may occur. No, electrical discharge machining is stabilized.

  Each cutting wire portion CL has an impedance due to the electrical resistance of the wire 3 between the adjacent cutting wire portions CL, and in order to maintain the independence of each cutting wire portion CL, other conduction paths are provided. It is not preferred that it be formed. Therefore, the part where the wire 3 of the nozzles 8a and 8b and the ingot holding part 30 travels is preferably made of an insulating material in consideration of the case where the cutting wire part CL is in contact.

  Wire electric discharge machining is particularly effective for a material having high hardness because the machining speed does not depend on the hardness of the workpiece 5. Examples of the workpiece 5 include metals such as tungsten and molybdenum serving as sputtering targets, ceramics such as polycrystalline silicon carbide (silicon carbide) used as various structural members, single crystal silicon serving as a wafer substrate for manufacturing semiconductor devices, and the like. A semiconductor material such as single crystal silicon carbide or gallium nitride (GaN, gallium nitride), single crystal or polycrystalline silicon used as a solar cell wafer can be used. In particular, since silicon carbide has high hardness, the mechanical wire saw method has low productivity and low processing accuracy. Therefore, the first embodiment achieves both high productivity and high processing accuracy. However, a silicon carbide wafer can be produced.

  In the first embodiment, an example in which one wire 3 is wound around four main guide rollers 1a to 1d is shown. However, for example, a configuration in which three main guide rollers are arranged is also possible. It is. In addition, the specific configuration is not particularly limited as long as the parallel wire portion PS is formed by repeatedly folding one wire 3 without being limited to the above example.

  As described above, the wire electric discharge machining apparatus 100 according to the first embodiment includes the ingot holding unit 30 for storing the workpiece 5 and the nozzles 8a and 8b, and the nozzles 8a and 8b are ingot holding units during machining. The ingot holding unit 30 is configured to relatively move while being in close contact with the unit 30. Thereby, even when the tip of the nozzle cannot be brought close to the workpiece 5 such that the shape of the workpiece 5 is cylindrical, the machining fluid is supplied to the inside of the slit processed into an ingot by spreading the machining fluid around The machining fluid can be stably supplied to the discharge gap without reducing the amount.

  In addition, the machining fluid can be stably supplied to the gaps during electrical discharge machining, so that machining waste can be discharged stably from the gaps, and machining is performed to supply the machining fluid to the inside of the slit. Since the machining fluid flow generated by increasing the fluid pressure does not cause the wafer to vibrate and break, the reduction in machining accuracy and machining speed of ingot machining by wire electric discharge machining can be improved. Furthermore, since the device structure can be used repeatedly, a device and a processing method that do not use a disposable member as in Patent Document 4 can be provided.

  In particular, in multi-wire electric discharge machining that cuts a workpiece that is a cylindrical ingot perpendicularly to its length direction, the supply state of the machining fluid generally deteriorates when the nozzle tip is separated. The wire is not broken. Further, since it is not necessary to increase the processing liquid pressure even when the nozzle tip is separated, the wafer is not damaged by the liquid flow, and the processing speed is not greatly reduced. For example, in a wafer cut out simultaneously from a 4-inch size semiconductor ingot, the thickness variation in the surface can be suppressed to about 10 μm.

  Further, a pair of nozzles 8a and 8b disposed between the vibration damping guide rollers 7a and 7b is provided, and the nozzles 8a and 8b are connected to the workpiece liquid from the jet port 93 so as to face the workpiece 5 along the wire 3, respectively. The wire 3 penetrates the nozzles 93 of the nozzles 8a and 8b and travels in a non-contact manner with the nozzles 8a and 8b. As a result, wire vibration due to the machining fluid flow does not occur, and wire breakage does not occur. Furthermore, since the machining waste can be efficiently discharged from the discharge gap, there is an effect that the discharge is stabilized and the machining speed and machining accuracy of the electric discharge machining are improved.

  In addition, a combination of the nozzles 8a and 8b having a devised shape and the ingot holding unit 30 enables an apparatus structure that can supply the machining liquid to the gap between the workpieces 5 at a position away from the nozzle tip. . As a result, it can be used repeatedly without using a disposable member, so that the wafer cost can be reduced.

  With the above configuration, in the wire electric discharge machining apparatus 100 according to the first embodiment, the discharge gap is stably maintained by suppressing the vibration of the cutting wire portion CL and the wafer being formed, and stable electric discharge machining even for long-time machining. Thus, it is possible to produce a plurality of wafers with small thickness variations at a time.

  Further, by using the wire electric discharge machining apparatus 100 according to the first embodiment, the workpiece 5 containing a hard material such as silicon carbide can be cut into a thin plate with high productivity.

  Furthermore, by the wire electric discharge machining method described above, semiconductor materials such as crystalline silicon and / or single crystal silicon carbide, solar cell materials such as single crystal or polycrystalline silicon, ceramics such as polycrystalline silicon carbide, tungsten, molybdenum, etc. When the sputtering target material is processed, the processing speed increases and the processing groove width can be narrowed, so that more members can be obtained from one ingot. Also, a plurality of thin plates can be cut out with high dimensional accuracy at a time.

Embodiment 2. FIG.
FIG. 7 is a partially enlarged perspective view of a nozzle body included in the wire electric discharge machining apparatus according to the second embodiment. FIG. 8 is a side cross-sectional view schematically showing an example of a processing state of the nozzle body shown in FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the second embodiment, the nozzle bodies 180a and 180b, the movable plates 181a to 181d provided on the upper and lower surfaces of the nozzle bodies 180a and 180b, and both the wire travel direction and the height direction of the nozzle bodies 180a and 180b are perpendicular to each other. The side plates 182a and 182b that are in close contact with the side surfaces on both sides in the appropriate direction can form the gap 34 that functions as a machining liquid pool inside the ingot holding unit 30 without using the ingot holding unit 30 of the first embodiment. A corresponding gap (sealed space) is formed.

  The nozzle main bodies 180a and 180b are penetrated by the cutting wire portion CL, and have a machining liquid jet 93 and a relief 95. The cutting wire portion CL only needs to have a size sufficient to penetrate through the cutting wire portion CL, and the size in the height direction is significantly smaller than the nozzles 8a and 8b of the first embodiment.

  Movable plates 181a to 181d are provided on the upper and lower side surfaces of the nozzle bodies 180a and 180b. The movable plates 181a to 181d are movable with the attachment portion with the nozzle bodies 180a and 180b as the rotation center. Furthermore, the free end sides of the movable plates 181a to 181d are connected to the movable plates 181a to 181d of one of the nozzle bodies 180a and 180b facing each other with the workpiece 5 by springs 183a and 183b. That is, the free end of the upper movable plate 181a and the free end of the movable plate 181c are coupled by the spring 183a, and the free end of the lower movable plate 181b and the free end of the movable plate 181d are coupled by the spring 183b. As a result, the workpiece 5 is sandwiched between the block composed of the nozzle body 180a and the movable plates 181a and 181b and the block composed of the nozzle body 180b and the movable plates 181c and 181d.

  The springs 183a and 183b are so-called tension springs, and a force in the pulling direction acts on the movable plates 181a to 181d coupled by the springs 183a and 183b, and the free ends of the movable plates 181a to 181d are likely to approach each other. And Therefore, the movable plates 181a to 181d are pressed against the outer peripheral surface in the direction parallel to the axis of the workpiece 5 sandwiched between the nozzle bodies 180a and 180b. Since the movable plates 181a to 181d are made of a flat plate member having sufficient rigidity, a gap is formed between the contact portion between the workpiece 5 and the movable plates 181a to 181d and the nozzles 93 of the nozzle bodies 180a and 180b. Is done. The side plates 182a and 182b are in close contact with the side surfaces of the nozzle bodies 180a and 180b and the movable plates 181a to 181d, and the side plates are located at any position within the movable range of the nozzle bodies 180a and 180b and the movable plates 181a to 181d. It is manufactured and installed in a size that does not protrude from 182a, 182b.

As described above, the movable plate 181a to 181d and the springs 183a and 183b provided in the nozzle main bodies 180a and 180b are configured by the combination of the nozzles 8a and 8b and the ingot holding unit 30 according to the first embodiment. An equivalent mechanism for supplying machining fluid into the machining groove is realized. Movable plate 181A～181d, springs 183a, 183b and the side plates 182a, 182b constitute an outer peripheral configuration member.

  The movable plates 181a to 181d are structured to be constantly pressed against the outer peripheral surface of the workpiece 5 by springs 183a and 183b. Therefore, when the workpiece 5 fixed on the stage 9 moves as the stage 9 moves up or down, the movable plates 181a to 181d rotate the attachment portion with the nozzle side as shown in FIG. The movable plates 181a to 181d are kept in close contact with the outer peripheral shape of the workpiece 5 in a state where the movable plates 181a to 181d are pressed against the outer peripheral surface of the workpiece 5 by being rotationally movable as the center. Thereby, although there is a change in the volume of the gap from the nozzle bodies 180a, 180b to the workpiece 5, the gap is filled with the processing liquid supplied from the nozzle outlet and the gap portion is brought into a static pressure state. Can do. As a result, it becomes possible to supply (press-fit) the machining liquid into the discharge gap of the machining groove formed in the workpiece 5 by the electric discharge machining of the cutting wire portion CL. Note that if the spring constants of the springs 183a and 183b are small, the movable plates 181a to 181d in contact with the workpiece 5 may be spread by the machining fluid pressure supplied from the nozzle bodies 180a and 180b, and the machining fluid may leak out. Occurs. Therefore, the spring constants of the springs 183a and 183b are adjusted according to the diameter of the workpiece 5.

  As described above, the opening / closing mechanism by the movable plates 181a to 181d coupled by the springs 183a and 183b and the sealing mechanism by closely contacting the side plates 182a and 182b from the side surface of the opening / closing mechanism, the ingot of the first embodiment. A machining fluid press-in function and a machining fluid discharge port 32 of the holding unit 30 are realized.

  In addition, when starting to process the workpiece 5 from its outer peripheral portion, the cutting wire portion CL comes into contact with the movable plates 181a and 181c disposed above, so that the movable range of the movable plates 181a and 181c in the closing direction is The adjustment is made so as not to contact the cutting wire portion CL. In this case, the movable plates 181 a and 181 c do not come into contact with the outer peripheral surface of the workpiece 5, but the processing liquid in the initial stage of processing of the workpiece 5 may flow along the outer peripheral surface of the workpiece 5. That's fine. Further, even when machining grooves start to be formed and the machining groove depth is about several times the diameter of the wire, the machining liquid flows along the outer peripheral surface, thereby providing machining dust discharging effect. Therefore, the movable plate 181a is pressed so that the movable plates 181a and 181c are pressed against the outer peripheral surface of the workpiece 5 around the cutting wire portion CL that enters the workpiece 5 and does not interfere with the movable plates 181a and 181c. , 181c may be adjusted in the movable range on the closing side.

  On the other hand, it is sufficient that the movable range on the opening side is as much as the diameter of the workpiece 5 to be cut. Further, as for the movable plates 181b and 181d that contact from the lower side of the workpiece 5, the movable range on the opening side may be equal to the diameter of the workpiece 5 to be cut at the same as the movable plates 181a and 181c, and is closed. It is sufficient that the movable range on the side is movable to a position parallel to the lower surfaces of the nozzle bodies 180a and 180b.

  With the above-described configuration, in the wire electric discharge machining apparatus 100 according to the second embodiment, even in a machining situation where the nozzle tip (machining liquid ejection port) is not in close contact with the workpiece 5, the machining liquid can be discharged stably Can be supplied to. As a result, since the machining waste is stably discharged from the discharge gap, the discharge gap is stably maintained by suppressing the vibration of the cutting wire portion CL, and stable electric discharge machining even during long-time machining or large-diameter wafer machining. It can be performed. As a result, it is possible to produce a plurality of wafers with small thickness variations at a time.

  The combination of the nozzle bodies 180a and 180b, the movable plates 181a to 181d, and the side plates 182a and 182b with a devised shape is used to process between the poles of the workpiece 5 at a position away from the tips of the nozzle bodies 180a and 180b. Since the apparatus structure is capable of supplying the liquid, it can be used repeatedly without using a disposable member, so that the wafer cost can be reduced.

  Further, by using the wire electric discharge machining apparatus 100 according to this embodiment, the workpiece 5 containing a conductive hard material such as carbide or nitride can be cut into a thin plate with high productivity.

  Furthermore, by the wire electric discharge machining method described above, semiconductor materials such as crystalline silicon and / or single crystal silicon carbide, solar cell materials such as single crystal or polycrystalline silicon, ceramics such as polycrystalline silicon carbide, tungsten, molybdenum, etc. When the sputtering target material is processed, the processing speed increases and the processing groove width can be narrowed, so that more members can be obtained from one ingot. Also, a plurality of thin plates can be cut out with high dimensional accuracy at a time.

  Furthermore, since the machining fluid flow that collides at high speed with the wafer or cutting wire portion being cut out can be reduced, vibration of the wafer or cutting wire portion can be reduced, and wafer cracking or wire misalignment can be prevented. As a result, it is possible to improve the processing accuracy of the processing groove and to prevent the thin plate, particularly a thin plate of a hard and brittle material such as a semiconductor wafer from being broken.

  As described above, the wire electric discharge machining apparatus according to the present invention is useful for manufacturing a thin plate and is particularly suitable for manufacturing a semiconductor material and a solar cell material that require high dimensional accuracy.

  1a to 1d Main guide roller, 2 wire bobbin, 3 wire, 4 wire take-up bobbin, 5 work piece, 6a, 6b Electric power feeding unit, 7a, 7b Damping guide roller, 8a, 8b nozzle, 9 stage, 30 ingot holding Part, 31 O-ring, 32 machining fluid discharge port, 33 dummy base, 35a, 35b ingot fixing member, 93 spout, 95 escape port, 100 wire electric discharge machine, 180a, 180b nozzle body, 181a-181d movable plate, 182a , 182b Side plate, 301, 302 through hole, 303 groove, CL cutting wire part, K power supply, PS parallel wire part.

Claims (8)

A wire having a plurality of cutting wire portions facing the workpiece while being spaced apart from each other in parallel;
An installation base for installing the workpiece;
A machining power source for generating a pulsed machining voltage;
A plurality of feeders electrically connected to each of the plurality of cutting wire portions and applying the processing voltage between the plurality of cutting wire portions and the workpiece;
An ejection port that passes through the plurality of cutting wire portions and is provided on a side where the workpiece is disposed, and ejects the processing liquid along the plurality of cutting wire portions so that the processing liquid is directed between the electrodes; An opening provided on the side facing the outlet, and a pair of nozzle members disposed on both sides in the cutting direction of the workpiece;
An outer peripheral component member disposed on the outer periphery of the workpiece and forming a sealed space between the workpiece and the nozzle member;
Moving means for relatively moving the outer circumferential component with respect to the plurality of cutting wire portions;
With
The working liquid ejected from the nozzle port toward the gap between the nozzles is accumulated in the sealed space constituted by the workpiece, the nozzle member, and the outer peripheral component member, and is collected by the wire. A wire electrical discharge machining apparatus that performs wire electrical discharge machining. The outer peripheral component member includes the workpiece set on the setting table, and a surface perpendicular to a traveling direction of the plurality of cutting wire portions is formed by the plurality of cutting wire portions of the workpiece. Even by cutting, the plurality of cutting wire portions are provided with openings so as not to contact the vertical surface,
The nozzle member is configured to contact the formation face of the opening of the outer circumferential configuration member, always covering even the whole of the opening by the relative movement vertical between the outer circumferential configuration member The wire electric discharge machining apparatus according to claim 1, wherein the wire electric discharge machining apparatus has a shape extending in a vertical direction.   The outer peripheral component member inserts the workpiece from an insertion direction substantially perpendicular to the wire traveling direction and the height direction, and sandwiches the workpiece by fixing members inserted from both sides of the workpiece in the insertion direction. The wire electric discharge machining apparatus according to claim 2, wherein the wire electric discharge machining apparatus is fixed by indentation. The outer circumferential component is
An upper movable plate rotatably attached to the upper end of the nozzle member;
A lower movable plate rotatably attached to the lower end of the nozzle member;
An upper connection spring connecting the two upper movable plates located on both sides of the wire traveling direction across the workpiece;
A lower connection spring connecting the two lower movable plates located on both sides of the wire travel direction across the workpiece;
A side plate disposed in close contact with a side surface of the upper movable plate, the lower movable plate, and the nozzle member in a direction substantially perpendicular to the wire traveling direction and the height direction;
The wire electric discharge machining apparatus according to claim 1, comprising:   5. The apparatus according to claim 1, further comprising: a pair of vibration suppression guide rollers that block vibrations in the plurality of cutting wire portions between the plurality of power supply units and the nozzle member. The wire electric discharge machining apparatus described.   A wire electric discharge machining method, wherein the workpiece is sliced by the wire electric discharge machining apparatus according to any one of claims 1 to 5.   A thin plate manufacturing method, wherein the workpiece is processed into a plurality of thin plates using the wire electric discharge machine according to any one of claims 1 to 5.   6. A semiconductor wafer manufacturing method, wherein a semiconductor material is processed as a workpiece into a plurality of semiconductor wafers using the wire electrical discharge machining apparatus according to claim 1.