JP5945730B2 - Electronic component mounting system and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting system and an electronic component mounting method for mounting electronic components on a substrate.

  2. Description of the Related Art An electronic component mounting system that manufactures a mounting substrate by mounting electronic components on a substrate by solder bonding is configured by connecting a plurality of electronic component mounting devices such as a solder printing device, an electronic component mounting device, and a reflow device. In the electronic component mounting system, as a form of electronic components to be mounted and fixed to the board, not only the joining parts soldered to the electrodes of the board, but also the positioning fitting inserted into the insertion holes formed in the board such as connector parts A plurality of types of electronic components having different mounting forms are mounted, including an insertion component having a portion, a lead, and the like (see Patent Document 1).

  When mounting these electronic components, various mounting forms in which a position detection method using image recognition is applied according to the types and characteristics of the electronic components are adopted. For example, a method of correcting the component mounting position in accordance with the position recognition result of the recognition mark formed on the board or the solder position deviation detection result on the board after solder printing is a well-known technique for ensuring good mounting position accuracy. Are known.

JP 2010-027661 A

  By the way, in recent years, a paper phenol substrate in which paper is impregnated with a phenol resin has been adopted as a material for a consumer substrate such as a home appliance due to a demand for reducing the manufacturing cost of electronic devices. Although this paper phenol substrate is low-cost, when multiple types of electronic components with different mounting forms are to be mounted as described above, there are the following difficulties in securing good mounting position accuracy. .

  First of all, paper phenolic substrates have material characteristics that it is easy to expand and contract and it is difficult to maintain dimensional accuracy stably, and the punching process using a press die is used for forming the outer shape and forming the insertion hole. The relative positional relationship between the recognition mark for position recognition or the insertion hole and the outer shape of the substrate is not necessarily ensured, and in many cases already varies from one production lot to another at the time after punching. In the manufacturing process after the punching process, when the substrate is deformed due to thermal influence, the position error of the recognition mark or the insertion hole is further increased.

  However, in the prior art, although the relative position accuracy of the recognition mark and the insertion hole is not guaranteed, the component mounting position is corrected based on the recognition result of the recognition mark. The position correction accuracy was not ensured, resulting in a mounting failure due to a position shift at the time of component mounting. As described above, in the conventional component mounting, when mounting multiple types of electronic components with different mounting forms, such as insertion components, on a board with characteristics that make it difficult to ensure dimensional accuracy, mounting defects due to misalignment may occur. There was a problem that it was likely to occur.

  Therefore, the present invention secures sufficient position correction accuracy and reduces mounting defects even when mounting multiple types of electronic components with different mounting forms targeting a board with characteristics that make it difficult to ensure dimensional accuracy. It is an object of the present invention to provide an electronic component mounting system and an electronic component mounting method.

An electronic component mounting system of the present invention is an electronic component mounting system that is configured by connecting a plurality of electronic component mounting apparatuses, and mounting the electronic component on a substrate to manufacture a mounting substrate. And printing a solder mark as a recognition target portion at a predetermined position on the substrate, and a recognition target portion including the solder mark by imaging the substrate on which the solder is printed. Recognizing means for recognizing and positioning the board on which the solder is printed, picking up an electronic component from a component supply unit by a mounting head, and mounting the component on the board on which the solder is printed based on the recognition result of the recognizing means Electronic component mounting apparatus to be transported and mounted, recognition execution information for defining the execution form of recognition processing by the recognition means, and transport mounting by the electronic component mounting apparatus And a mounting information storage unit that stores mounting information preset for each electronic component, and the recognition means refers to the mounting information. A recognition target part is recognized according to the recognition execution information set in advance for each electronic component, and the electronic component mounting apparatus refers to the mounting information and performs electronic processing according to the mounting operation information set in advance for each electronic component. A component is transferred and mounted on a substrate, and the electronic component includes a bonding component that is solder-bonded to the component bonding electrode and an insertion component that is inserted into an insertion hole formed in a mounting surface of the substrate, and the recognition target The part includes a recognition mark formed for recognizing the entire position of the substrate, the solder mark, and the insertion hole, and the mounting information is corrected based on a recognition result of the recognition mark. A first mounting mode for transporting and mounting a joining component at a position, a second mounting mode for transporting and mounting a joining component to the component mounting position corrected based on the recognition result of the solder mark, and a recognition result of the insertion hole. One of the third mounting modes in which the insertion component is transferred and mounted on the component mounting position corrected based on the mounting mode information includes preset mounting mode information for each electronic component as a mounting mode for execution .

The electronic component mounting method of the present invention is an electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate by an electronic component mounting system configured by connecting a plurality of electronic component mounting apparatuses. A printing process in which solder is printed on an electrode for component bonding on the board, and a solder mark as a recognition target portion is solder printed at a predetermined position on the board, and the solder mark is imaged after the printing process. A recognition step of recognizing a recognition target part including a recognition unit, positioning the substrate after the recognition step, picking up an electronic component from a component supply unit by a mounting head, and based on a recognition result in the recognition step A component mounting step of transferring and mounting the printed circuit board on the component mounting position of the printed circuit board, and in the recognition step, a preset mounting for each electronic component Information is recognized, the recognition target part is recognized according to the recognition execution information included in the mounting information and defining the execution mode of the recognition process, and the mounting information set in advance for each electronic component in the component mounting step The electronic component is transferred and mounted on the substrate in accordance with the mounting operation information included in the mounting information that defines the execution mode of the transfer mounting operation, and the electronic component is bonded to the electrode for bonding the component by soldering Including a component and an insertion part to be inserted into an insertion hole formed on the mounting surface of the board, and the recognition target portion includes a recognition mark, solder mark, and insertion hole formed for recognizing the entire position of the board. And the mounting information includes a first mounting mode for transferring and mounting the joint component to the component mounting position corrected based on the recognition result of the recognition mark, and the recognition result of the solder mark. A second mounting mode for transferring and mounting the joining component to the component mounting position corrected based on the third mounting mode, and a third mounting for transferring and mounting the insertion component to the component mounting position corrected based on the recognition result of the insertion hole. One of the modes is included as mounting mode for execution, and mounting mode information preset for each electronic component is included .

  According to the present invention, in the recognition process of imaging the board and recognizing the recognition target part including the solder mark after the printing process of printing the solder for component joining and the solder mark as the recognition target part, for each electronic component in advance Refers to the set mounting information, recognizes the recognition target part in accordance with the recognition execution information included in the mounting information and defines the execution mode of the recognition process, and transfers the electronic component to the component mounting position on the board based on the recognition result In the component mounting process to be mounted, by mounting and mounting electronic components on the board according to the mounting operation information included in the mounting information and defining the execution mode of the transfer mounting operation, mounting on a board with characteristics that make it difficult to ensure dimensional accuracy Even when mounting multiple types of electronic components with different forms, it is possible to apply an appropriate mounting form according to the type of electronic component, and provide sufficient position compensation. It is possible to reduce the mounting failure to ensure accuracy.

The block diagram which shows the structure of the electronic component mounting system of one embodiment of this invention The block diagram which shows the structure of the printing apparatus in the electronic component mounting system of one embodiment of this invention Explanatory drawing of the board | substrate and mask plate in the electronic component mounting system of one embodiment of this invention Structure explanatory drawing of the board | substrate used as the work object of the electronic component mounting system of one embodiment of this invention The block diagram which shows the structure of the electronic component mounting apparatus in the electronic component mounting system of one embodiment of this invention Explanatory drawing of the recognition object site | part in the electronic component mounting system of one embodiment of this invention Explanatory drawing of the position shift detection of the recognition object site | part in the electronic component mounting system of one embodiment of this invention Structure explanatory drawing of the mounting information in the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the mounting information in the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the mounting information in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the 1st mounting mode in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the 2nd mounting mode in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the 3rd mounting mode in the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting system of one embodiment of this invention Flowchart of electronic component mounting processing by electronic component mounting system of one embodiment of the present invention Process explanatory drawing of the electronic component mounting process by the electronic component mounting system of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, an electronic component mounting system will be described with reference to FIG. The electronic component mounting system 1 has a function of mounting an electronic component on a substrate to manufacture a mounting substrate. Each of the printing device M1 and the electronic component mounting devices M2 to M4 that are a plurality of electronic component mounting devices. Are connected by a communication network 2 and are controlled by a management computer 3 as a whole. The electronic components to be mounted by the electronic component mounting system 1 include a bonded component that is solder-bonded to a component bonding electrode and an inserted component that is inserted into an insertion hole formed on the mounting surface of the substrate.

  The printing device M1 screen-prints paste-like solder on the component bonding electrodes formed on the substrate, and at the predetermined position on the substrate, the recognition target parts to be recognized by the following electronic component mounting devices M2 to M4 The solder mark (see the solder mark 5m shown in FIG. 4) is printed. In the present embodiment, in addition to the above-described solder mark, the recognition target portion includes a recognition mark formed for recognizing the entire position of the substrate and an insertion hole formed for an insertion part.

  The electronic component mounting apparatuses M2 to M4 position the board on which the solder is printed, pick up the electronic components from the component supply unit by the mounting head, and based on the recognition result of the recognition means provided in each of the electronic component mounting apparatuses M2 to M4. Then, it is transferred and mounted on the component mounting position of the printed board with the solder. Thereafter, the substrate after component mounting is sent to a reflow process, and the mounting substrate is manufactured by soldering the electronic component mounted on the substrate to the substrate.

  Next, the configuration of each device will be described. First, the configuration and functions of the printing apparatus M1 will be described with reference to FIGS. In FIG. 2, a substrate holder 11 is disposed on the positioning table 10. The substrate holding unit 11 holds the substrate 4 sandwiched from both sides by the clamper 11a. By driving the positioning table 10 by the table driving unit 14, the substrate 4 moves relative to the mask plate 12 in the horizontal direction and the vertical direction, and is positioned at the printing position.

  As shown in FIG. 3A, a pair of recognition marks 4 a and 4 b are formed diagonally on the substrate 4 together with a plurality of electrodes 6 for joining components, and above the substrate holding portion 11. The mask plate 12 extended on the mask frame 12a is located. As shown in FIG. 3B, a mask pattern (not shown) corresponding to the shape and arrangement of the electrodes 6 is formed in the printing range 12b corresponding to the substrate 4 in the mask plate 12, and the printing range 12b. The pattern holes 12c and 12d are formed at the diagonal positions corresponding to the positions of the recognition marks 4a and 4b on the substrate 4.

  A squeegee unit 13 is disposed above the mask plate 12. The squeegee unit 13 includes an elevating and pressing mechanism 13b that elevates and lowers the squeegee 13c with respect to the mask plate 12 and presses the mask plate 12 with a predetermined pressing force, and a squeegee moving mechanism 13a that horizontally moves the squeegee 13c. The elevation pressing mechanism 13 b and the squeegee moving mechanism 13 a are driven by the squeegee driving unit 15. With the substrate 4 in contact with the lower surface of the mask plate 12, the solder 5 is moved through the pattern hole by moving the squeegee 13c horizontally at a predetermined speed along the surface of the mask plate 12 to which the solder 5 is supplied. Printed on the upper surface of the substrate 4. By this printing operation, on the upper surface of the substrate 4 on which the recognition marks 4a and 4b are formed in advance, the electronic component bonding solder 5 is printed on the component bonding electrodes 6 and the positions corresponding to the recognition marks 4a and 4b. A solder mark 5m (see FIG. 4C) is printed through the pattern holes 12c and 12d.

  This printing operation is performed by controlling the table driving unit 14 and the squeegee driving unit 15 by the printing control unit 17. In this control, the operation of the squeegee 13 c and the alignment between the substrate 4 and the mask plate 12 are controlled based on the print data stored in the print data storage unit 16. The communication unit 18 exchanges data with the management computer 3 and other devices constituting the electronic component mounting line via the communication network 2.

  Here, with reference to FIG. 4, the board | substrate 4 used as the work object by the electronic component mounting system 1 is demonstrated. As shown in FIG. 4A, two recognition marks 4a and 4b for recognizing the entire position of the substrate are formed at diagonal positions of the substrate 4, and the recognition marks 4a and 4b are captured and recognized. Thus, the position of the substrate 4 is recognized. The substrate 4 is formed with electrodes 6 and insertion holes 4c for mounting a plurality of types of electronic components specified by the component information A, B, C, D, E (see FIGS. 9 and 10). .

  In the example shown in the present embodiment, the electronic components corresponding to the component information A, B, C, D are bonded components that are mounted by solder bonding, and as shown in FIG. A plurality of electrodes 6 for joining the components are formed at the component mounting position of the component. The electronic component corresponding to the component information E is an insertion component that is mounted by inserting a lead into the substrate 4. A plurality of insertion holes 4 c for inserting the lead are provided at the component mounting position of the component. Are formed in pairs for each part.

  By performing a printing operation on the substrate 4 by the printing apparatus M1, as shown in FIG. 4 (c), the electrode 6 is screen-printed with solder 5 for component bonding, and two recognition marks 4a, A solder mark 5m is formed on 4b by solder printing. At this time, the positions of the recognition marks 4a and 4b and the position of the printed solder 5 do not necessarily coincide with each other, and a positional shift occurs according to an alignment error between the substrate 4 and the mask plate 12.

  In the present embodiment, the substrate 4 is a paper phenol substrate in which paper is impregnated with phenol resin, and has a material characteristic that it is easy to expand and contract and it is difficult to stably maintain dimensional accuracy. For this reason, the outer shape of the substrate 4 and the relative positional relationship of the insertion holes 4c performed by punching with a press die are not necessarily ensured, and have already varied for each production lot after the punching.

  In a mounting example in which a plurality of types of electronic components having different component characteristics such as the component information A to E... Are mounted on the substrate 4 having such characteristics, the recognition result of the recognition mark is used as a reference as in the prior art. When the mounting method is employed, mounting defects due to the relative position shift of the board outer shape or the insertion hole 4c occur. In order to prevent such problems, in the present embodiment, when a plurality of types of electronic components are mounted on the same substrate 4, based on the recognition result of the recognition target portion set in advance according to the characteristics of the electronic components. Thus, different position correction methods are selectively used.

  Next, the configuration of the electronic component mounting apparatuses M2 to M4 will be described with reference to FIG. In FIG. 5, a substrate holding unit 30a is disposed on the positioning table 30, and the substrate holding unit 30a holds the substrate 4 which is conveyed and positioned from the printing apparatus M1 or the upstream electronic component mounting apparatus. A mounting head 32 that is moved by a head driving mechanism 33 is disposed above the substrate holding unit 30a. The mounting head 32 includes a nozzle 32a that sucks an electronic component, and the mounting head 32 picks up and holds the electronic component from the component supply unit (not shown) by the nozzle 32a. Then, the mounting head 32 is moved onto the substrate 4 and lowered with respect to the substrate 4, whereby the electronic component held by the nozzle 32 a is transferred and mounted on the substrate 4.

  A substrate recognition camera 31 that moves integrally with the mounting head 32 is disposed in the head driving mechanism 33 with the imaging surface facing downward, and the substrate recognition camera 31 is placed on the substrate 4 as shown in FIG. The substrate 4 is imaged by moving to. Thereby, the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c which are recognition target parts on the board | substrate 4 are imaged. Then, by recognizing the imaging result by the recognition processing unit 37, as shown in FIG. 6B, the positions of the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c, which are recognition target parts, are recognized. The printing position deviation amounts (Δxa, Δya), (Δxb, Δyb) of the solder mark 5m in the recognition marks 4a, 4b are obtained.

  By this recognition processing, as shown in FIG. 7A, (ΔXa, ΔYa) and (ΔXb, ΔYb) indicating the amount of displacement of the recognition marks 4a, 4b from the normal position are obtained, and the entire position of the substrate 4 is obtained. Is detected. Further, based on the printing position deviation amounts (Δxa, Δya), (Δxb, Δyb) of the solder mark 5m in the recognition marks 4a, 4b, as shown in FIG. It is possible to obtain the position shift state of the solder 5 (i) printed for the target by estimation calculation.

  In other words, if the expansion and contraction of the mask plate 12 is ignored, the amount of printing displacement at each position on the upper surface of the substrate 4 printed in a single operation by a single squeezing operation depends on the relative displacement between the substrate 4 and the mask plate 12. It may be considered that it is uniquely determined. Specifically, a conversion formula between the orthogonal coordinate system on the substrate 4 and the orthogonal coordinate system on the mask plate 12 is derived on the basis of the printing position deviation amounts at the two points described above. As a result of this coordinate transformation, as shown in FIG. 7B, the estimated misregistration amount in each of the X, Y, and Θ directions of the solder 5 (i) printed with the electrode 6 (i) at an arbitrary position as a target ( Δx (i), Δy (i), Δθ (i)) are obtained by calculation.

  Furthermore, as shown in FIG. 7C, the center positions C1 and C2 of each pair of insertion holes 4c (1) and 4c (2) formed in the substrate 4 are detected based on the position recognition result of the insertion holes 4c. . The position of the insertion hole 4c is detected as relative position data indicating the relative position with respect to the recognition marks 4a and 4b in association with the position detection result of the recognition marks 4a and 4b shown in FIG. In the above-described configuration, the board recognition camera 31 and the recognition processing unit 37 serve as a recognition unit that recognizes a recognition target part including the solder mark 5m by imaging the board 4 on which the solder 5 is printed.

  The head driving mechanism 33 and the positioning table 30 are driven by a mounting head driving unit 35 and a table driving unit 34, respectively. The mounting head driving unit 35 and the table driving unit 34 are controlled by a mounting control unit 39. The mounting control unit 39 has a mounting position correction unit 39a as an internal processing function. The mounting position correction unit 39a performs a process of correcting the mounting position based on the recognition result obtained by recognizing the imaging results of the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c by the substrate recognition camera 31 by the recognition processing unit 37. Executed prior to component mounting.

  In the control process by the mounting control unit 39, the mounting information 40 (see FIGS. 8, 9, and 10) stored in the mounting information storage unit 36 is referred to. The mounting information 40 is information set in advance for each electronic component by defining the execution mode of the mounting operation by the electronic component mounting apparatus, and mounting information 40 (1), 40 (2) and 40 described below. (3) is a data structure including recognition execution information that defines the execution mode of the recognition process by the recognition means and mounting operation information that defines the execution mode of the transfer mounting operation by the electronic component mounting apparatuses M2 to M4. Yes.

  The mounting information 40 (1) shown in FIG. 8 is recognition execution information that defines the execution form of the recognition processing by the recognition means of the electronic component mounting apparatuses M2 to M4. Specifically, the recognition information is recognized for each recognition execution apparatus 40f. The necessity of execution of the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c, which are the parts 40g, is defined. That is, the mounting apparatus M2 positioned at the head of each mounting apparatus constituting the electronic component mounting system 1 executes recognition for any of the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c, and the downstream apparatus In the mounting apparatuses M3 and M4, the recognition is performed only on the recognition marks 4a and 4b.

  Each recognition means of the electronic component mounting apparatuses M2 to M4 recognizes the recognition target portion according to the recognition execution information set in advance with reference to the mounting information 40 (1). In the present embodiment, only the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c are illustrated as the recognition target portion 40g. However, a back mark such as a bad mark applied to indicate the inspection result in the previous process is used. Various marks associated with the process work may be listed as recognition target parts, and each apparatus may be caused to execute a recognition operation as necessary.

  The mounting information 40 (2) illustrated in FIG. 9 indicates the type of electronic component to be mounted in the electronic component mounting apparatuses M2 to M4 and the mounting coordinates on the board 4. That is, here, “component information” 40b (A, B, C,...) Indicating the component code of the target component and the component are included in each “mounting No.” 40a that individually specifies the mounting operation on the substrate. “Mounting coordinates” 40c (X1, Y1, θ1,...) Indicating coordinate values of X, Y, and θ of the mounting points to be mounted are defined for each of the electronic component mounting apparatuses M2 to M4. By reading the mounting information 40 (2), the mounting sequence on the work target board is determined.

  The mounting information 40 (3) shown in FIG. 10 is mounting mode information, and a mounting mode that prescribes a mounting mode correction mode for a substrate to be mounted in the electronic component mounting apparatuses M2 to M4 is set in advance for each electronic component. Information. In the present embodiment, any one of the three types of mounting modes described below is set in advance for each electronic component as a mounting mode for execution.

  That is, “mounting information” 40b and “size” 40d (XA, YA) indicating the size of each of the target components in the X, Y, and Z directions are included in each “mounting No” 40a that individually specifies the mounting operation on the board. , ZA,..., And “1”, “2” indicating whether the mounting mode for execution applied to the component is the first mounting mode, the second mounting mode, or the third mounting mode. "Mounting mode" 40e indicated by the flag "3" or "3" is defined correspondingly.

  The mounting coordinates 40c shown in the mounting information 40 (2) and the mounting mode 40e shown in the mounting information 40 (3) constitute mounting operation information that defines the execution mode of the transfer mounting operation by the electronic component mounting apparatuses M2 to M4. In the component mounting operation by each of the electronic component mounting apparatuses M2 to M4, the electronic component is transferred and mounted on the board in accordance with the mounting operation information preset for each electronic component with reference to the mounting information 40 (2) and 40 (3). Execute the work to be performed.

  Here, the first mounting mode is a mode in which the joining component is transferred and mounted on the component mounting position corrected based on the recognition result of the recognition marks 4a and 4b, and the solder position detected by the position recognition of the solder mark 5m. In this mode, the electronic component is transferred and mounted on the component mounting position based on the position of the electrode 6 corrected based only on the recognition result of the recognition marks 4a and 4b without considering the shift amount.

  That is, as shown in FIG. 11A, the centroid position 6 * of the pair of electrodes 6 and the centroid position 5 * of the printed solder 5 are displaced, as shown in FIG. 11B. Even when the centroid position 6 * and the centroid position 5 * are separated by the positional deviation amount D, the centroid position 6 * is set as the component mounting position PM based only on the position of the electrode 6. Then, as shown in FIG. 11C, the position control of the mounting head 32 is performed with the component mounting position PM set in this way as a target. In the present embodiment, the first mounting mode is a large electronic component 7 (electronic component 8C shown in FIG. 16) corresponding to the component information C and D that cannot be expected to be effective in the self-alignment effect described below. Applied to 8D).

  The second mounting mode is a mode in which the joining component is transferred and mounted on the component mounting position corrected based on the recognition result of the solder mark 5m, and mounted based on the positional deviation amount estimated by the recognition processing unit 37. The mounting position is corrected by the position correction unit 39a. As shown in FIG. 12A, the position on the design data indicated by the “mounting coordinates” 40c of the mounting information 40 (2), that is, the barycentric position 6 * of the pair of electrodes 6 and the printed solder 5 When the position of the center of gravity 5 * is shifted, the component mounting position PM where the electronic component 7 is actually mounted is obtained by the correction method shown in FIG.

  In the example shown here, the corrected component mounting position PM is set on a position shift line L connecting the gravity center position 6 * and the gravity center position 5 *. That is, a point that is separated from the barycentric position 6 * by the correction amount ΔD on the misalignment line L is set as the component mounting position PM. Here, the correction amount ΔD is calculated by multiplying the overall positional deviation amount D by a preset follow-up ratio R (%). The follow-up ratio R is set in advance as an appropriate value for each type of electronic component based on experience values and trial results. Here, an example is shown in which the follow-up ratio R is 50% and the component mounting position PM is set at the midpoint of the displacement line L. In the component mounting operation for the electrode 6, as shown in FIG. 12C, the position control of the mounting head 32 is performed with the component mounting position PM calculated in this way as a target.

  By setting the component mounting position PM by the correction method as described above, even when the printing position of the solder 5 does not coincide with the electrode 6 and misalignment occurs, the solder 5 is reflowed after the component is mounted. Due to the self-alignment effect in which the electronic component 7 is attracted to the electrode 6 together with the molten solder due to the surface tension of the molten solder acting on the electronic component 7 when the metal melts, the influence of printing misalignment is reduced and the incidence of mounting defects is reduced. It can be kept low. Such a self-alignment effect is particularly effective for small components that are likely to cause component movement due to the surface tension of the molten solder, such as micro-sized chip components. Therefore, in the present embodiment, when the target electronic component corresponds to a small component corresponding to the component information A and B (see the electronic components 8A and 8B shown in FIG. 16), the second mounting mode is set. I am trying to apply it.

  The third mounting mode is a mode in which the insertion component is transferred and mounted on the component mounting position corrected based on the recognition result of the insertion hole 4c, and is paired with the substrate 4 as shown in FIG. The midpoint of the center positions C1, C2 of the formed insertion holes 4c (1), 4c (2) is set as the component mounting position PM. In addition, in the application of the third mounting mode, since the misalignment tendency of the insertion holes 4c formed by the same punching process is considered to be the same, all of the plurality of insertion holes 4c formed in the substrate 4 are used. It is not necessary to perform position recognition for the target, and the position of the other insertion hole 4c is estimated and corrected based on the recognition result of the representative insertion hole formed at a specific representative position among the plurality of insertion holes 4c. May be.

  That is, as shown in FIG. 13B, among the plurality of insertion holes 4c, the two most remote insertion holes 4c * are set as representative insertion holes. Then, by using the coordinate conversion formula obtained based on the position detection result of these two insertion holes 4c *, the position of the other insertion hole 4c is estimated and corrected, and the component mounting position PM is determined for each pair of the insertion holes 4c. The inserted component is transferred and mounted at the component mounting position PM thus corrected.

  That is, in the present embodiment, the mounting is performed without correcting the mounting position in consideration of the printing position deviation, based on the position of the electrode 6 on the design data corrected based only on the recognition result of the recognition marks 4a and 4b. Based on the first mounting mode and the printing position deviation amount (Δxa, Δya), (Δxb, Δyb) of the solder mark 5m, the estimated positional deviation amount of the solder 5 in each electrode 6 is obtained, and based on these estimated positional deviation amounts. The second mounting mode for correcting the mounting position and the third mounting mode for transporting and mounting the insertion component to the component mounting position corrected based on the recognition result of the insertion hole 4c. It switches to according to.

  In the above configuration, the mounting position correcting unit 39a is a mounting position correcting unit that corrects the mounting position based on the recognition results of the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c. The mounting position correcting means is configured to recognize three types of recognition target parts, that is, the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c in accordance with a mounting mode preset for each electronic component in the mounting information 40 described below. The mounting position is corrected based on one of the recognition results.

  Next, the configuration of the control system of the electronic component mounting system 1 will be described with reference to FIG. In FIG. 14, the management computer 3 includes an overall control unit 41, a storage unit 42, and an arithmetic processing unit 43, and is connected to the communication network 2 via a communication unit 44. The overall control unit 41 has a function of supervising control in each device constituting the electronic component mounting system 1. The storage unit 42 stores mounting information 42 a in addition to production management data for managing work executed by the electronic component mounting system 1. The mounting information 42a is the same data as the mounting information 40 stored in the mounting information storage unit 36 in the electronic component mounting apparatuses M2 to M4.

  The arithmetic processing unit 43 executes various arithmetic processes necessary for executing the component mounting work. These calculation processes include the functions of the positional deviation amount calculation unit 43a and the position correction calculation unit 43b. The misregistration amount calculation unit 43a performs estimation calculation of the misregistration amount of solder shown in FIGS. The position correction calculation unit 43b refers to the mounting information 42a based on the estimated solder position deviation amount, and performs a calculation for component mounting position correction.

  The print data storage unit 16 and the print control unit 17 of the printing apparatus M1 are connected to the communication network 2 via the communication unit 18. The mounting information storage unit 36, the recognition processing unit 37, and the mounting control unit 39 of the electronic component mounting apparatuses M2 to M4 are connected to the communication network 2 via the communication unit 38. As a result, the mounting information 42 a stored in the storage unit 42 is transmitted to each mounting apparatus and stored as mounting information 40 in the mounting information storage unit 36.

  In the electronic component mounting apparatus M2, which is the leading mounting apparatus in the above configuration, as defined in the mounting information 40 (1) shown in FIG. 8, the recognition marks 4a and 4b and the solder marks 5m that are the recognition target parts 40g are inserted. All of the holes 4c become recognition execution targets of the recognition means provided in the apparatus. The recognition result is transmitted to the management computer 3 via the communication unit 38 and the communication network 2, and the management computer 3 performs calculation to obtain positional deviation data including the positional deviation amount of the recognition target portion 40 g by the arithmetic processing of the arithmetic processing unit 43. I do. The obtained positional deviation data is transferred via the communication unit 44 and the communication network 2 to the electronic component mounting apparatuses M3 and M4 which are downstream mounting apparatuses. The arithmetic processing unit 43, the communication unit 44, and the communication network 2 function as a misalignment data transfer unit that transfers misalignment data to an electronic component mounting apparatus disposed on the downstream side.

  In these downstream mounting apparatuses, as shown in the mounting information 40 (1), only the recognition marks 4a and 4b among the recognition target parts 40g are the recognition execution targets of the recognition means of the apparatus. In the apparatus, the electronic component is transferred and mounted at the component mounting position based on the positional deviation data transferred from the head mounting apparatus and the recognition results of the recognition marks 4a and 4b recognized by the apparatus. That is, since the relative positional relationship between the recognition marks 4a and 4b, the solder mark 5m, and the insertion hole 4c on the same substrate is known from the transferred positional deviation data, the downstream mounting apparatus recognizes these recognition target parts. There is no need to do this, and the time required for the recognition operation is shortened to improve productivity.

  This electronic component mounting system is configured as described above. Hereinafter, an electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate by the electronic component mounting system 1 will be described with reference to the flowchart of FIG. Will be described with reference to FIG. First, mounting information is read prior to the start of production, and the mounting information 40 (1), 40 (2), and 40 (3) stored in the mounting information storage unit 36 are read in the electronic component mounting apparatuses M2 to M4. As a result, information necessary for the component mounting operation is captured.

  Next, solder printing is performed on the board carried into the printing apparatus M1 from the upstream side (ST1). That is, the solder 5 for component bonding is printed on the electrode 6 for component bonding of the substrate 4 in which the first recognition marks 4 a and 4 b are formed in advance, and the solder mark is used as a second recognition mark at a predetermined position on the substrate 4. 5 m is printed (printing process). Thereafter, the board 4 after the solder printing is carried into the electronic component mounting apparatus M2, which is the leading mounting apparatus, and the recognition target part is recognized (recognition process) (ST2).

  That is, as shown in FIG. 6, the recognition marks 4 a, 4 b, the solder mark 5 m and the insertion hole 4 c are imaged by the substrate recognition camera 31 as recognition means, and the recognition result is processed by the recognition processing unit 37. Next, based on the recognition result, position deviation data of the recognition target part is calculated (position deviation data transfer step) (ST3), and the calculated position deviation data is transferred to the downstream mounting apparatus (ST4).

  Then, in each of the leading mounting apparatus and the downstream mounting apparatus, the electronic component is transferred and mounted to the component mounting position based on the recognition result (ST5). That is, here, in each of the electronic component mounting apparatuses M2 to M4, the substrate 4 after the recognition process is positioned, the electronic component is picked up from the component supply unit by the mounting head 32, and the solder 5 is based on the recognition result in the recognition process. The printed board 4 is transferred and mounted on the component mounting position (component mounting process).

  In the above-described recognition step, the mounting information 40 set in advance for each electronic component is referred to, and the recognition target part is recognized according to the recognition execution information included in the mounting information 40 and defining the execution form of the recognition process. In the component mounting process, the mounting information 40 set in advance for each electronic component is referred to, and the mounting operation information (the mounting coordinates 40c and the mounting mode) included in the mounting information 40 and defining the execution mode of the transfer mounting operation. 40e), the electronic component is transferred and mounted on the substrate.

  That is, when the electronic component to be mounted is a bonded component, the electronic component 8A, 8B, 8C, 8D is held by the mounting head 32 and transferred to the component mounting position on the substrate 4 as shown in FIG. Mount. At this time, when the mounting target is the electronic component 8A or 8B, which is a small component, position correction is performed according to the second mounting mode. When the mounting target is the electronic component 8C or 8D, which is a large component, position correction is performed according to the first mounting mode. Further, when the electronic component 9 to be mounted is an insertion component having a lead 9a, the electronic component 9 is held by the insertion head 50 and transferred to the component mounting position on the substrate 4 as shown in FIG. Mount. Next, as shown in FIG. 16C, the electronic component 9 is mounted on the substrate 4 by inserting the lead 9a into the insertion hole 4c and stopping the system.

  As described above, in the electronic component mounting system 1 and the electronic component mounting method shown in the present embodiment, the substrate 4 is imaged after the printing process for printing the solder 5 for component bonding and the solder mark 5m as a recognition target portion. In the recognition process of recognizing the recognition target part including the solder mark 5m, the recognition execution for defining the execution form of the recognition process included in the mounting information 40 is referred to by referring to the mounting information 40 set in advance for each electronic component. In the component mounting step of recognizing the recognition target portion according to the information and transporting and mounting the electronic component to the component mounting position of the substrate 4 based on the recognition result, the mounting operation that is included in the mounting information 40 and defines the execution form of the transport mounting operation The electronic components are transferred and mounted on the substrate 4 in accordance with the information. As a result, even when a plurality of types of electronic components having different mounting forms are mounted on the board 4 having characteristics that make it difficult to ensure dimensional accuracy, an appropriate mounting form corresponding to each type of electronic component should be applied. Thus, sufficient position correction accuracy can be ensured and mounting defects can be reduced.

  The electronic component mounting system and the electronic component mounting method of the present invention provide sufficient position correction accuracy even when mounting multiple types of electronic components with different mounting forms on a board with characteristics that make it difficult to ensure dimensional accuracy. This has the effect of securing and reducing mounting defects, and is useful in the field of manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding using a plurality of electronic component mounting apparatuses.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 2 Communication network 3 Management computer 4 Board | substrate 4a, 4b Recognition mark 4c Insertion hole 5 Solder 5m Solder mark 6 Electrode 7, 8A, 8B, 8C, 8D, 9 Electronic component 32 Mounting head M1 Printing apparatus M2-M4 Electronic component mounting device PM Component mounting position

Claims (5)

An electronic component mounting system configured by connecting a plurality of electronic component mounting apparatuses, and manufacturing a mounting substrate by mounting electronic components on a substrate,
A printing device that prints solder on the electrodes for component bonding of the substrate and prints a solder mark as a recognition target portion at a predetermined position on the substrate;
Recognizing means for recognizing a recognition target portion including the solder mark by imaging the board on which the solder is printed;
An electronic component that positions the substrate on which the solder is printed, picks up an electronic component from a component supply unit by a mounting head, and transfers and mounts the electronic component to a component mounting position on the substrate on which the solder is printed based on the recognition result of the recognition means A mounting device;
Mounting that includes recognition execution information that defines an execution form of recognition processing by the recognition means and mounting operation information that defines an execution form of transfer mounting operation by the electronic component mounting apparatus, and is set in advance for each electronic component A mounting information storage unit for storing information;
The recognizing unit recognizes a recognition target part according to the recognition execution information set in advance for each electronic component with reference to the mounting information,
The electronic component mounting apparatus transfers and mounts an electronic component on a board according to the mounting operation information set in advance for each electronic component with reference to the mounting information ,
The electronic component includes a bonding component that is solder-bonded to the component bonding electrode and an insertion component that is inserted into an insertion hole formed in the mounting surface of the substrate.
The recognition target portion includes a recognition mark formed for recognizing the entire position of the substrate, the solder mark, and the insertion hole,
The mounting information includes a first mounting mode for transferring and mounting a joining component to the component mounting position corrected based on the recognition result of the recognition mark, and the component mounting position corrected based on the recognition result of the solder mark. The second mounting mode for transferring and mounting the joining component to the mounting position, and the third mounting mode for transferring and mounting the insertion component to the component mounting position corrected based on the recognition result of the insertion hole, An electronic component mounting system comprising mounting mode information set in advance for each electronic component as a mounting mode . A plurality of electronic component mounting apparatuses each having the recognition means are connected to each other, and based on a recognition result of recognizing the recognition target part by the recognition means provided in the first electronic component mounting apparatus located at the most upstream. A positional deviation data transfer unit for obtaining positional deviation data including the positional deviation amount of the recognition target part and transferring the positional deviation data to an electronic component mounting apparatus disposed downstream of the leading electronic component mounting apparatus; Prepared,
The electronic component mounting apparatus disposed on the downstream side is configured to electronically place the electronic component at the component mounting position based on the recognition result of the recognition unit recognizing the recognition mark and the positional deviation data transferred from the leading electronic component mounting apparatus. The electronic component mounting system according to claim 1 , wherein the component is transferred and mounted. The third mounting mode is characterized in that an insertion component is transferred and mounted at the component mounting position corrected based on a recognition result of a representative insertion hole formed at a specific representative position among the insertion holes. Item 3. The electronic component mounting system according to Item 1 or 2 . An electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate by an electronic component mounting system configured by connecting a plurality of electronic component mounting devices,
Printing the solder on the electrodes for component bonding of the substrate, and solder printing a solder mark as a recognition target portion at a predetermined position of the substrate;
A recognition step of recognizing a recognition target portion including the solder mark by imaging the substrate after the printing step;
Component mounting for positioning the substrate after the recognition step, picking up an electronic component from a component supply unit by a mounting head, and transporting and mounting the electronic component to a component mounting position on the printed board based on the recognition result in the recognition step Process,
In the recognition step, referring to the mounting information set in advance for each electronic component, recognizing the recognition target part according to the recognition execution information included in the mounting information and defining the execution mode of the recognition process,
In the component mounting step, the mounting information set in advance for each electronic component is referred to, and the electronic component is transferred and mounted on the board according to the mounting operation information included in the mounting information and defining the execution mode of the transfer mounting operation. And
The electronic component includes a bonding component that is solder-bonded to the component bonding electrode and an insertion component that is inserted into an insertion hole formed in the mounting surface of the substrate.
The recognition target portion includes a recognition mark formed for recognizing the entire position of the substrate, the solder mark, and the insertion hole,
The mounting information includes a first mounting mode for transferring and mounting a joining component to the component mounting position corrected based on the recognition result of the recognition mark, and the component mounting position corrected based on the recognition result of the solder mark. The second mounting mode for transferring and mounting the joining component to the mounting position, and the third mounting mode for transferring and mounting the insertion component to the component mounting position corrected based on the recognition result of the insertion hole, An electronic component mounting method comprising mounting mode information set in advance for each electronic component as a mounting mode . The electronic component mounting system is configured by connecting a plurality of electronic component mounting apparatuses each having the recognition means,
Based on a recognition result obtained by recognizing the recognition target part by the recognition unit provided in the leading electronic component mounting apparatus located at the most upstream, position deviation data including a positional deviation amount of the recognition target part is obtained, and A misalignment data transfer step of transferring the misalignment data to an electronic component mounting apparatus disposed downstream of the electronic component mounting apparatus;
In the component mounting step by the electronic component mounting apparatus arranged on the downstream side, the component is based on the recognition result of the recognition mark recognized by the recognition means and the positional deviation data transferred from the leading electronic component mounting apparatus. The electronic component mounting method according to claim 4 , wherein the electronic component is transferred and mounted at the mounting position.

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