JP5930513B2 - Through board socket and manufacturing method thereof - Google Patents

Through board socket and manufacturing method thereof Download PDF

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JP5930513B2
JP5930513B2 JP2013075602A JP2013075602A JP5930513B2 JP 5930513 B2 JP5930513 B2 JP 5930513B2 JP 2013075602 A JP2013075602 A JP 2013075602A JP 2013075602 A JP2013075602 A JP 2013075602A JP 5930513 B2 JP5930513 B2 JP 5930513B2
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shield plate
electronic component
contacts
plate
side shield
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JP2014203510A (en
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文雄 大澤
文雄 大澤
修一 宇留鷲
修一 宇留鷲
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SMK Corp
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Description

本発明は、カメラモジュール等の直方体状の電子部品をプリント配線基板へ接続するスルーボードソケットとその製造方法に関し、更に詳しくは、プリント配線基板を貫通する取付孔に装着されるスルーボードソケットとその製造方法に関する。   The present invention relates to a through-board socket for connecting a rectangular parallelepiped electronic component such as a camera module to a printed wiring board and a manufacturing method thereof, and more particularly, a through-board socket to be attached to a mounting hole penetrating the printed wiring board and its It relates to a manufacturing method.

携帯電話機などの薄型の電子機器に、カメラモジュールなど直方体状で一定の高さのある電子部品を組み込む際には、電子機器のプリント配線基板を貫通する取付孔内にスルーボードソケットの下方の一部を落とし込み、スルーボードソケットの上方に開口する電子部品収容部へ電子部品を収容し、プリント配線基板へ接続させている(特許文献1)。   When incorporating a rectangular parallelepiped electronic component such as a camera module into a thin electronic device such as a cellular phone, a part below the through board socket is inserted into the mounting hole that penetrates the printed wiring board of the electronic device. The electronic component is accommodated in the electronic component accommodating portion that opens above the through board socket, and is connected to the printed wiring board (Patent Document 1).

以下、この従来のスルーボードソケット100を、図11乃至図14を用いて説明する。図12に示すように、スルーボードソケット100は、絶縁性合成樹脂により方形状の底板部101aとその周囲4辺から上方に立設された側壁部101bとを一体にモールド成形することにより枡形の電子部品収容凹部102が形成された絶縁ハウジング101と、絶縁ハウジング101の左右(図13の左右方向)の側壁部101bを貫通する複数のコンタクト103と、側壁部101bの周囲を覆う一対のサイドシールド板104、104と、底壁部101aを下方から覆うボトムシールド板105とからなっている。   Hereinafter, the conventional through board socket 100 will be described with reference to FIGS. As shown in FIG. 12, the through-board socket 100 has a bowl shape by integrally molding a rectangular bottom plate portion 101a and a side wall portion 101b erected upward from its four sides with an insulating synthetic resin. An insulating housing 101 in which an electronic component housing recess 102 is formed, a plurality of contacts 103 penetrating through the left and right side walls 101b of the insulating housing 101, and a pair of side shields covering the periphery of the side wall 101b It consists of plates 104 and 104 and a bottom shield plate 105 that covers the bottom wall 101a from below.

図14に示すように、各コンタクト103は、左右の側壁部101bの下方に上下方向に形成された取り付け溝101cに圧入して側壁部101bに固定される固定部103aと、固定部103aから逆U字状に折り曲げられて底壁部101aに沿って片持ち支持される接触片部103bと、固定部103aからU字状に折り曲げられた先が水平に折り返される接地脚部103cとが、細長帯状に一体に形成されている。   As shown in FIG. 14, each contact 103 is press-fitted into a mounting groove 101c formed in the vertical direction below the left and right side wall portions 101b and fixed to the side wall portion 101b, and reversely from the fixed portion 103a. A contact piece 103b that is bent in a U shape and cantilevered along the bottom wall 101a, and a grounding leg portion 103c in which a tip bent in a U shape from the fixed portion 103a is folded horizontally are elongated. It is integrally formed in a band shape.

一対のサイドシールド板104、104とボトムシールド板105は、上方を除く電子部品収容凹部102の周囲を囲い、電子部品収容凹部102に収容される電子部品とコンタクト103との接触部を外部からシールドするもので、一対のサイドシールド板104、104は、導電性金属板により左右方向で互いに向き合うコの字状に形成され、それぞれ、側壁部101bの外側面を覆う側板部104aと、側板部104aの上端から側壁部101bを跨いで電子部品収容凹部102の内方に向かって折り返される複数の折り曲げバネ片104bとを備え、側板部104aの下端から外方に接地脚部104cが水平に折り曲げられている。複数の折り曲げバネ片104bのうち、左右の側壁部101bで折り返される折り曲げバネ片104bは、電子部品収容凹部102に収容される電子部品の外側面に係止し、電子部品を上方へ抜け止めするように作用し、前後(図13において上下)の側壁部101bで折り返される折り曲げバネ片104bは、電子部品収容凹部102に収容される電子部品の外側面に弾性接触し、電子部品の接続端子が各コンタクト103の接触片部103bと位置ずれすることなく接触するように電子部品を位置決めする。   The pair of side shield plates 104 and 104 and the bottom shield plate 105 surround the periphery of the electronic component receiving recess 102 except for the top, and shield the contact portion between the electronic component stored in the electronic component receiving recess 102 and the contact 103 from the outside. The pair of side shield plates 104, 104 are formed in a U-shape facing each other in the left-right direction by a conductive metal plate, and respectively, a side plate portion 104a that covers the outer surface of the side wall portion 101b, and a side plate portion 104a. A plurality of bending spring pieces 104b folded back inward of the electronic component housing recess 102 across the side wall 101b from the upper end of the side plate, and the grounding leg 104c is horizontally bent outward from the lower end of the side plate 104a. ing. Of the plurality of bending spring pieces 104b, the bending spring pieces 104b folded back at the left and right side wall portions 101b are engaged with the outer surface of the electronic component accommodated in the electronic component accommodating recess 102 to prevent the electronic component from coming off upward. The bending spring pieces 104b that are folded back at the front and rear (upper and lower in FIG. 13) side wall portions 101b elastically contact the outer surface of the electronic component accommodated in the electronic component accommodating recess 102, and the connection terminal of the electronic component is The electronic component is positioned so as to contact the contact piece 103b of each contact 103 without being displaced.

サイドシールド板104は、折り曲げバネ片104bの間に下向きに形成された圧入片104dを側壁部101bの平面の圧入溝へ圧入するとともに、左右の側壁部101bに突設された係合突起へ係合孔104eを係合させて、側壁部101bに固定される。図11、図14に示すように、サイドシールド板104を側壁部101bへ固定させた状態で、側壁部101bに固定された複数のコンタクト103がサイドシールド板104に接触しないように、左右の側壁部101bの外側面を覆う側板部104aの下方には、その下端から長方形の切り欠きを形成することによる開口106が形成されている。   The side shield plate 104 press-fits a press-fitting piece 104d formed downward between the bending spring pieces 104b into a flat press-fitting groove of the side wall 101b, and engages with engaging protrusions protruding from the left and right side walls 101b. The joint hole 104e is engaged and fixed to the side wall portion 101b. As shown in FIGS. 11 and 14, the left and right side walls are arranged so that the plurality of contacts 103 fixed to the side wall portion 101 b do not contact the side shield plate 104 in a state where the side shield plate 104 is fixed to the side wall portion 101 b. An opening 106 is formed below the side plate portion 104a covering the outer surface of the portion 101b by forming a rectangular cutout from the lower end thereof.

ボトムシールド板105は、導電性金属板によって底壁部101aの底面全体を覆う方形状に形成され、その四隅で上方に立設される圧入片を底板部101aの底面側から圧入して固定される。ボトムシールド板105の周囲の4辺は、それぞれ底板部101aの側面を覆うように上方に折り曲げられ、その上端から外方に接地脚部105aが水平方向に折り曲げられている。   The bottom shield plate 105 is formed in a square shape covering the entire bottom surface of the bottom wall portion 101a with a conductive metal plate, and press-fitting pieces standing upward at the four corners are press-fitted from the bottom surface side of the bottom plate portion 101a and fixed. The The four sides around the bottom shield plate 105 are bent upward so as to cover the side surface of the bottom plate portion 101a, and the ground leg portion 105a is bent in the horizontal direction outward from the upper end thereof.

このスルーボードソケット100は、ボトムシールド板105の外径よりわずかに大きい内径に形成されたプリント配線基板110の取付孔111に下方の一部を収容し、収容した状態でプリント配線基板110の平面の高さで水平に突出する各コンタクト103の接地脚部103cを、プリント配線基板110の対応部位に配線された導電パターンへ半田接続するとともに、サイドシールド板104の接地脚部104cと、ボトムシールド板105の接地脚部105aを、プリント配線基板110の接地パターンに半田接続して、スルーボードソケット100を取付孔111内に固定する。   The through board socket 100 accommodates a part of the lower portion in the mounting hole 111 of the printed wiring board 110 formed to have an inner diameter slightly larger than the outer diameter of the bottom shield plate 105, and in the accommodated state, the plane of the printed wiring board 110 is accommodated. The ground leg 103c of each contact 103 projecting horizontally at a height of 2 mm is solder-connected to the conductive pattern wired to the corresponding portion of the printed wiring board 110, and the ground leg 104c of the side shield plate 104 and the bottom shield The grounding leg 105 a of the board 105 is soldered to the grounding pattern of the printed wiring board 110 to fix the through board socket 100 in the mounting hole 111.

スルーボードソケット100の電子部品収容凹部102に上方から電子部品を収容すると、その底面に露出する各接続端子は、各コンタクト103を介してプリント配線基板110の導電パターンに電気接続し、電子部品の高さ以下のプリント配線基板110上の空間内に電子部品を実装できる。また、上方を除く電子部品収容凹部102の周囲は、接地されたサイドシールド板104とボトムシールド板105で囲まれ、電子部品の各接続端子と、その接続端子に接触する各コンタクト103がシールドされる。   When an electronic component is accommodated in the electronic component accommodating recess 102 of the through board socket 100 from above, each connection terminal exposed on the bottom surface is electrically connected to the conductive pattern of the printed wiring board 110 via each contact 103, and Electronic components can be mounted in a space on the printed wiring board 110 that is below the height. In addition, the periphery of the electronic component housing recess 102 except for the upper side is surrounded by a grounded side shield plate 104 and a bottom shield plate 105, and each connection terminal of the electronic component and each contact 103 in contact with the connection terminal are shielded. The

特開2009−110712号公報JP 2009-110712 A

スルーボードソケット100を落とし込むプリント配線基板110の取付孔111の内径は、電子部品収容凹部102に収容される電子部品の外径に、絶縁ハウジング101の側壁部101bと側壁部101bを覆うサイドシールド板104若しくはボトムシールド板105の肉厚を加えたスルーボードソケット100の外径D’によって定められる。プリント配線基板110への実装面積、すなわち、スルーボードソケット100が装着されるプリント配線基板110の取付孔111の開口面積は、スルーボードソケット100の外径D’の二乗に比例するので、わずかでもスルーボードソケット100の外径D’を縮小させることが望まれている。しかしながら、絶縁ハウジング101の側壁部101bには、コンタクト103やサイドシールド板104を固定して支持する強度が求められるので、その薄肉化に限界があり、サイドシールド板104若しくはボトムシールド板105の肉厚を加えた外径D’を縮小させることができなかった。その結果、スルーボードソケット100を落とし込む取付孔111の開口面積を縮小できず、より多くの電子部品をプリント配線基板110へ実装する高密度実装化の障害となっていた。   A side shield plate that covers the side wall portion 101b and the side wall portion 101b of the insulating housing 101 is set to have an inner diameter of the mounting hole 111 of the printed wiring board 110 into which the through board socket 100 is dropped. 104 or the outer diameter D ′ of the through board socket 100 to which the thickness of the bottom shield plate 105 is added. The mounting area on the printed wiring board 110, that is, the opening area of the mounting hole 111 of the printed wiring board 110 on which the through board socket 100 is mounted is proportional to the square of the outer diameter D ′ of the through board socket 100. It is desired to reduce the outer diameter D ′ of the through board socket 100. However, the side wall portion 101b of the insulating housing 101 is required to have a strength for fixing and supporting the contact 103 and the side shield plate 104. Therefore, the thickness of the side shield plate 104 or the bottom shield plate 105 is limited. The outer diameter D ′ added with the thickness could not be reduced. As a result, the opening area of the mounting hole 111 into which the through-board socket 100 is dropped cannot be reduced, which is an obstacle to high-density mounting in which more electronic components are mounted on the printed wiring board 110.

更に、複数のコンタクト103を側壁部101bに貫通させて固定する構造上の理由から、絶縁ハウジング101の上下方向からサイドシールド板104とボトムシールド板105を組み付けて電子部品収容凹部102の周囲をシールドする必要があり、少なくとも異なる2種類のシールド部品が必要になるとともに、複数のコンタクト103を側壁部101bへ固定した後、少なくとも2種類のシールド材であるサイドシールド板104とボトムシールド板105を絶縁ハウジング101へ組み付け、それぞれの接地脚部104c、105aをプリント配線基板110の接地パターンへ半田接続するという組み立て、製造工程上の手間がかかる。   Further, for the structural reason of fixing the plurality of contacts 103 through the side wall portion 101b, the side shield plate 104 and the bottom shield plate 105 are assembled from above and below the insulating housing 101 to shield the periphery of the electronic component housing recess 102. At least two different types of shield parts are required, and after fixing the plurality of contacts 103 to the side wall 101b, the side shield plate 104 and the bottom shield plate 105, which are at least two types of shield materials, are insulated. It takes time and effort in assembly and manufacturing processes to be assembled to the housing 101 and soldered to connect the grounding legs 104c and 105a to the grounding pattern of the printed wiring board 110.

更に、プリント配線基板110の取付孔111への落とし込み高さが異なることとなった場合には、基板110の平面若しくは底面に合わせて、脚部104c、105aの高さを変更したサイドシールド板104とボトムシールド板105をそれぞれ用意する必要があった。   Furthermore, when the drop height into the mounting hole 111 of the printed wiring board 110 is different, the side shield plate 104 in which the height of the leg portions 104c and 105a is changed in accordance with the plane or bottom surface of the board 110. And the bottom shield plate 105 must be prepared.

本発明はこのような問題点に鑑みてなされたもので、プリント配線基板へ装着する実装面積を減縮し、プリント配線基板への高密度実装化が可能なスルーボードソケットとその製造方法を提供することを目的とする。   The present invention has been made in view of such problems, and provides a through board socket capable of reducing the mounting area to be mounted on a printed wiring board and enabling high-density mounting on the printed wiring board, and a method for manufacturing the same. For the purpose.

また、電子部品収容凹部の周囲をシールドするシールド部品やコンタクトを、絶縁ハウジングへ組み付ける組み立て工程を要しないスルーボードソケットとその製造方法を提供することを目的とする。   It is another object of the present invention to provide a through board socket that does not require an assembling process for assembling a shield part and a contact for shielding the periphery of the electronic part housing recess to the insulating housing, and a manufacturing method thereof.

上述の目的を達成するため、請求項1のスルーボードソケットは、矩形状の底板部と底板部の周囲で上方に起立する側壁部とにより、底面に接続端子を臨ませた電子部品を収容する升形の電子部品収容凹部が形成され、下部がプリント配線基板の表裏に貫通する取付孔内に装着されるケースと、側壁部を挿通し、内側の接触片部が電子部品収容凹部に収容される電子部品の接続端子に弾性接触し、外側の脚部が側壁部の側方のプリント配線基板の導電パターンに接続する複数のコンタクトとを有し、電子部品収容凹部が導電性のシールド材で囲われ、電子部品収容凹部に収容された電子部品の上方を除く周囲がシールドされるスルーボードソケットであって、
導電性金属板からケースの底板部を構成するボトムシールド板と、導電性金属板からケースの側壁部を構成し、複数のコンタクトが挿通する部位に開口が穿設されたサイドシールド板と、開口の少なくとも一部を覆い、サイドシールド板の開口の周囲に固定されて前記取付孔内に装着される絶縁ハウジングとを備え、サイドシールド板と複数のコンタクトは、絶縁ハウジングに一体成形され、サイドシールド板の開口を挿通する複数のコンタクトがサイドシールド板から絶縁して絶縁ハウジングに支持されることを特徴とする。
In order to achieve the above-described object, the through board socket according to claim 1 accommodates an electronic component having a connection terminal on the bottom surface by a rectangular bottom plate portion and a side wall portion standing upward around the bottom plate portion. A bowl-shaped electronic component housing recess is formed, the lower part is inserted into a mounting hole penetrating the front and back of the printed circuit board, and the side wall portion is inserted, and the inner contact piece is received in the electronic component housing recess. The electronic component connection terminal is elastically contacted, the outer leg has a plurality of contacts connected to the conductive pattern of the printed circuit board on the side of the side wall, and the electronic component receiving recess is surrounded by a conductive shield material. A through-board socket in which the periphery except the upper part of the electronic component housed in the electronic component housing recess is shielded,
A bottom shield plate that constitutes the bottom plate portion of the case from the conductive metal plate, a side shield plate that constitutes the side wall portion of the case from the conductive metal plate, and an opening is formed in a portion through which a plurality of contacts are inserted, and an opening And an insulating housing fixed around the opening of the side shield plate and fitted in the mounting hole . The side shield plate and the plurality of contacts are integrally formed in the insulating housing, and the side shield A plurality of contacts inserted through the openings of the plate are insulated from the side shield plate and supported by the insulating housing.

電子部品収容凹部の周囲を覆うサイドシールド板と、サイドシールド板と絶縁してサイドシールド板の開口を挿通する複数のコンタクトとが、絶縁ハウジングの成形工程で一体に絶縁ハウジングに対して固定される。   The side shield plate that covers the periphery of the electronic component housing recess and the plurality of contacts that are insulated from the side shield plate and inserted through the openings of the side shield plate are fixed to the insulating housing integrally in the molding process of the insulating housing. .

複数のコンタクトは、絶縁ハウジングのサイドシールド板の開口を覆う絶縁ハウジングの部位を挿通して一体に支持される。   The plurality of contacts are integrally supported by being inserted through a portion of the insulating housing that covers the opening of the side shield plate of the insulating housing.

請求項のスルーボードソケットは、ボトムシールド板が、サイドシールド板と複数のコンタクトと共に、絶縁ハウジングに一体成形され、ボトムシールド板の表面が、絶縁ハウジングにより覆われることを特徴とする。 The through board socket according to claim 2 is characterized in that the bottom shield plate is formed integrally with the insulating housing together with the side shield plate and the plurality of contacts, and the surface of the bottom shield plate is covered with the insulating housing.

電子部品収容凹部の底板部を構成するボトムシールド板と、電子部品収容凹部内に臨むがコンタクトの接触片部との間に絶縁ハウジングが介在する。   An insulating housing is interposed between the bottom shield plate constituting the bottom plate portion of the electronic component housing recess and the contact piece portion of the contact that faces the electronic component housing recess.

請求項のスルーボードソケットの製造方法は、矩形状の底板部と底板部の周囲で上方に起立する側壁部とにより、底面に接続端子を臨ませた電子部品を収容する升形の電子部品収容凹部が形成され、下部がプリント配線基板の表裏に貫通する取付孔内に装着されるケースと、側壁部を挿通し、内側の接触片部が電子部品収容凹部に収容される電子部品の接続端子に弾性接触し、外側の脚部が側壁部の側方のプリント配線基板の導電パターンに接続する複数のコンタクトとを有し、電子部品収容凹部が導電性のシールド材で囲われ、電子部品収容凹部に収容された電子部品の上方を除く周囲がシールドされるスルーボードソケットを製造するスルーボードソケットの製造方法であって、
(a)一枚の導電性金属板から、底板部を構成するボトムシールド板と側壁部を構成するサイドシールド板を打ち抜き、少なくともいずれかのサイドシールド板に複数のコンタクトを挿通させる開口を穿設する第1工程と、
(b)ボトムシールド板の周囲の上方にサイドシールド板を起立させ、ケースを形成する第2工程と、
(c)開口の少なくとも一部を覆い、前記取付孔内に装着される絶縁ハウジングを成形する成形金型に、開口に複数のコンタクトを挿通させた状態で、ケースと複数のコンタクトを位置決めする第3工程と、
(d)成形金型によりサイドシールド板と複数のコンタクトを絶縁ハウジングに一体成形する第4工程とを備え、
サイドシールド板の開口を挿通する複数のコンタクトがサイドシールド板から絶縁して絶縁ハウジングに支持されることを特徴とする。
According to a third aspect of the present invention, there is provided a method for manufacturing a through board socket, comprising: a rectangular bottom plate portion and a side wall portion that stands upward around the bottom plate portion; A connection terminal for an electronic component in which a concave portion is formed and a lower portion is inserted into a mounting hole penetrating the front and back of the printed wiring board, and a side wall portion is inserted, and an inner contact piece portion is accommodated in the electronic component accommodation concave portion A plurality of contacts connected to the conductive pattern of the printed wiring board on the side of the side wall portion, and the electronic component housing recess is surrounded by a conductive shield material, A manufacturing method of a through board socket for manufacturing a through board socket in which a periphery except for an upper part of an electronic component accommodated in a recess is shielded,
(A) From one conductive metal plate, a bottom shield plate constituting the bottom plate portion and a side shield plate constituting the side wall portion are punched, and an opening through which a plurality of contacts are inserted into at least one of the side shield plates is formed. A first step of
(B) a second step of standing the side shield plate above the periphery of the bottom shield plate to form a case;
(C) First positioning the case and the plurality of contacts in a state where the plurality of contacts are inserted through the opening in a molding die that covers at least a part of the opening and molds the insulating housing mounted in the mounting hole. 3 steps,
(D) including a fourth step of integrally molding the side shield plate and the plurality of contacts into the insulating housing by a molding die;
A plurality of contacts inserted through the openings of the side shield plates are insulated from the side shield plates and supported by the insulating housing.

第4工程で、電子部品収容凹部の周囲を覆うサイドシールド板と、サイドシールド板と絶縁してサイドシールド板の開口を挿通する複数のコンタクトとが、絶縁ハウジングの成形工程で一体に絶縁ハウジングに対して固定され、複数のコンタクトは、絶縁ハウジングのサイドシールド板の開口を覆う絶縁ハウジングの部位を挿通して一体に支持される。   In the fourth step, the side shield plate that covers the periphery of the electronic component housing recess and the plurality of contacts that are insulated from the side shield plate and inserted through the opening of the side shield plate are integrated into the insulating housing in the molding process of the insulating housing. The plurality of contacts are integrally supported by being inserted through a portion of the insulating housing that covers the opening of the side shield plate of the insulating housing.

請求項1と請求項の発明によれば、複数のコンタクトは、絶縁ハウジングに一体成形されるので、薄肉の絶縁ハウジングで支持することができるとともに、サイドプレートの肉厚と重ならないサイドプレートの開口を覆う絶縁ハウジングの部位で複数のコンタクトを支持するので、コンタクトの挿通方向のスルーボードソケットの外径Dを短縮できる。 According to the first and third aspects of the invention, since the plurality of contacts are formed integrally with the insulating housing, the contacts can be supported by a thin insulating housing and the side plate does not overlap with the wall thickness of the side plate. Since the plurality of contacts are supported by the portion of the insulating housing that covers the opening, the outer diameter D of the through board socket in the contact insertion direction can be shortened.

更に、コンタクトが挿通しない側のケースの側壁部は、サイドシールド板のみで形成できるので、コンタクトの挿通方向のスルーボードソケットの外径Dを、より短縮でき、スルーボードソケットを装着するプリント配線基板の取付孔の面積を大幅に縮小でき、プリント配線基板の高密度実装が可能となる。 Further, since the side wall portion of the case where the contact is not inserted can be formed only by the side shield plate, the outer diameter D of the through board socket in the contact insertion direction can be further shortened, and the printed wiring board on which the through board socket is mounted The mounting hole area can be greatly reduced, and high-density mounting of the printed wiring board becomes possible.

また、電子部品収容凹部の周囲を覆うサイドシールド板と、サイドシールド板と絶縁してサイドシールド板の開口を挿通する複数のコンタクトとを、組み立て工程を要せず、絶縁ハウジングの成形工程で絶縁ハウジングに固定できる。   Also, the side shield plate covering the periphery of the electronic component housing recess and the plurality of contacts that are insulated from the side shield plate and inserted through the opening of the side shield plate are insulated in the molding process of the insulating housing without requiring an assembly process. Can be fixed to the housing.

請求項の発明よれば、ボトムシールド板と、電子部品の底面に臨む接続端子に弾性接触し、上下方向に可動するコンタクトの接触片部とが確実に絶縁される。 According to the invention of claim 2 , the bottom shield plate and the contact piece portion of the contact which is elastically contacted with the connection terminal facing the bottom surface of the electronic component and is movable in the vertical direction are surely insulated.

また、サイドシールド板からボトムシールド板にかけて絶縁ハウジングが一体成形されるので、ケースの水平方向の幅Dを拡大させることなく、枡形のケースの強度を補強できる。   Further, since the insulating housing is integrally formed from the side shield plate to the bottom shield plate, the strength of the bowl-shaped case can be reinforced without increasing the horizontal width D of the case.

本発明の第1実施の形態に係るスルーボードソケット1を斜め上方からみた斜視図である。It is the perspective view which looked at the through board socket 1 which concerns on 1st Embodiment of this invention from diagonally upward. スルーボードソケット1を斜め下方からみた斜視図である。It is the perspective view which saw through board socket 1 from the slanting lower part. スルーボードソケット1の平面図である。3 is a plan view of the through board socket 1. FIG. スルーボードソケット1をプリント配線基板120へ実装した状態を、図3のA−A線で切断して示す縦断面図である。FIG. 4 is a longitudinal sectional view showing a state in which the through board socket 1 is mounted on a printed wiring board 120, cut along line AA in FIG. 3. シールド板2の展開図である。4 is a development view of the shield plate 2. FIG. シールド板2の斜視図である。3 is a perspective view of a shield plate 2. FIG. 複数のコンタクト3の斜視図である。4 is a perspective view of a plurality of contacts 3. FIG. スルーボードソケット1の製造工程の、(a)は、絶縁ハウジング4を成形する成形金型内に位置決めするシールド板2の開口21に複数のコンタクト3を挿通させる工程を、(b)は、シールド板2と、シールド板2の開口21に挿通させた複数のコンタクト3を、絶縁ハウジング4を成形する成形金型内に位置決めする工程を、(c)は、成形金型により、シールド板2と複数のコンタクト3を、絶縁ハウジング4に一体成形した工程を、 それぞれ示す縦断面図である。(A) of the manufacturing process of the through board socket 1 is a process of inserting a plurality of contacts 3 into the openings 21 of the shield plate 2 positioned in the molding die for molding the insulating housing 4, and (b) is a shield The step of positioning the plate 2 and the plurality of contacts 3 inserted through the openings 21 of the shield plate 2 in the molding die for molding the insulating housing 4 is as follows. FIG. 6 is a longitudinal sectional view showing a process in which a plurality of contacts 3 are integrally formed with an insulating housing 4. 成形金型内に位置決めされるシールド板2及び複数のコンタクト3と、成形金型で成形される絶縁ハウジング4の関係を示す斜視図である。It is a perspective view which shows the relationship between the shield board 2 and the some contact 3 which are positioned in a shaping die, and the insulation housing 4 shape | molded by a shaping die. 本発明の異なる実施の形態に係るスルーボードソケット10をプリント配線基板120へ実装した状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounted the through board socket 10 which concerns on different embodiment of this invention to the printed wiring board 120. FIG. 従来のスルーボードソケット100を示す斜視図である。It is a perspective view which shows the conventional through board socket 100. FIG. スルーボードソケット100の分解斜視図である。2 is an exploded perspective view of a through board socket 100. FIG. スルーボードソケット100の平面図である。3 is a plan view of the through board socket 100. FIG. スルーボードソケット100をプリント配線基板110へ実装した状態を、図13のB−B線で切断して示す縦断面図である。FIG. 14 is a longitudinal sectional view showing a state where the through board socket 100 is mounted on the printed wiring board 110, cut along line BB in FIG. 13.

以下、本発明の一実施の形態に係るスルーボードソケット1とその製造方法を図1乃至図9を用いて説明する。スルーボードソケット1は、携帯電話機のケース内に配設された図4に示すプリント配線基板120の取付孔121内に装着され、図中上方から収容されるカメラモジュール(図示せず)をプリント配線基板120へ接続する用途で用いられるもので、以下、スルーボードソケット1の各部の説明は、図4で図示する各方向を上下左右方向と、図4の紙面に対して奥行き方向を後方と、手前方向を前方として説明する。   Hereinafter, a through board socket 1 and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to FIGS. The through board socket 1 is mounted in a mounting hole 121 of the printed wiring board 120 shown in FIG. 4 disposed in the case of the mobile phone, and a camera module (not shown) accommodated from above in the drawing is printed wiring. In the following description of each part of the through board socket 1, the directions shown in FIG. 4 are the vertical and horizontal directions, and the depth direction with respect to the paper surface of FIG. The front direction will be described as the front.

各図に示すように、スルーボードソケット1は、ボトムシールド板22とサイドシールド板20とが一体に連結された導電性金属板からなるシールド板2と、サイドシールド板20の横長長方形の開口21を挿通する複数のコンタクト3と、シールド板2及び複数のコンタクト3と一体成形される絶縁ハウジング4とから構成される。   As shown in each figure, the through board socket 1 includes a shield plate 2 made of a conductive metal plate in which a bottom shield plate 22 and a side shield plate 20 are integrally connected, and a horizontally elongated rectangular opening 21 of the side shield plate 20. And a plurality of contacts 3 through which the shield plate 2 and the plurality of contacts 3 are integrally molded.

シールド板2は、図5に示すように、長方形の輪郭のボトムシールド板22とボトムシールド板22の後方の一辺に帯状に連結された4枚のサイドシールド板20F、20B、20L、20Rが、1枚の導電性金属板からプレス成形で一体に打ち抜かれる。図5に示す展開形状に打ち抜かれたシールド板2は、同図の波線で直角に折り曲げることにより向かい合う3組の係合片部23A−23A、23B−23B、23C−23C間を、それぞれ互いに噛み合わせて係合し、図6に示すように、長方形状の底板部を構成するボトムシールド板22の前後左右の周囲が側板部を構成するサイドシールド板20F、20B、20L、20Rで囲われ、全体として升形の内側がモジュール収容凹部24となったケース5が形成される。   As shown in FIG. 5, the shield plate 2 includes a bottom shield plate 22 having a rectangular outline and four side shield plates 20F, 20B, 20L, and 20R connected in a strip shape to one side behind the bottom shield plate 22, A single conductive metal plate is integrally punched by press molding. The shield plate 2 punched into the unfolded shape shown in FIG. 5 is engaged with each other between the three sets of engaging piece portions 23A-23A, 23B-23B, and 23C-23C facing each other by being bent at right angles along the wavy line in FIG. As shown in FIG. 6, the front, rear, left and right peripheries of the bottom shield plate 22 constituting the rectangular bottom plate portion are surrounded by the side shield plates 20F, 20B, 20L, 20R constituting the side plate portion, As a whole, a case 5 is formed in which the inside of the bowl is the module housing recess 24.

ボトムシールド板22の左右の周囲で起立するサイドシールド板20L、20Rには、それぞれ、U字状の切り欠きの内側が内方に切り起こされ、モジュール収容凹部24に収容されるカメラモジュールを上方に対して抜け止めする2片の抜け止めバネ片25、25と、各下辺に沿って長方形に切り欠かれることによって、複数のコンタクト3を挿通させる開口21が形成されている。   The side shield plates 20L and 20R that stand up around the left and right sides of the bottom shield plate 22 are respectively cut and raised inside the U-shaped cutouts so that the camera module housed in the module housing recess 24 is positioned upward. On the other hand, there are formed two pieces of retaining spring pieces 25, 25 for retaining and an opening 21 through which the plurality of contacts 3 are inserted by being cut into a rectangle along each lower side.

サイドシールド板20Fは、係合片部23A−23A、23B−23B、23C−23C間を係合することにより、ボトムシールド板22の前方に起立している。ボトムシールド板22の後方に起立するサイドシールド板20Bは、外方に屈曲する中央の部分で、サイドシールド板20Fと非対称形状となっていて、これにより、前後で非対称形状のカメラモジュールのモジュール収容凹部24への誤挿入を防止している。   The side shield plate 20F stands up in front of the bottom shield plate 22 by engaging the engagement pieces 23A-23A, 23B-23B, and 23C-23C. The side shield plate 20B that stands up behind the bottom shield plate 22 is a central portion that bends outward, and has an asymmetric shape with the side shield plate 20F. Incorrect insertion into the recess 24 is prevented.

サイドシールド板20F、20Bには、それぞれ、U字状の切り欠きの内側が内方に切り起こされ、モジュール収容凹部24に収容されるカメラモジュールを前後方向の中立位置で位置決めする2片の位置決め片26、26が形成されている。また、サイドシールド板20F、20Bの各下方の中央は、門形の切り欠きによって切り起こされる上向き接地脚片27と、その両側で垂設される下向き接地脚片28、28が形成されている。各上向き接地脚片27と下向き接地脚片28は、ケース5の下方がプリント配線基板120の取付孔121内に落とし込まれて装着される際に、プリント配線基板120の平面に対応して配線される接地パターン上に対向するように、その中間が外方に向かって水平に折り曲げられている。   Each of the side shield plates 20F and 20B has a two-piece positioning in which the inside of the U-shaped cutout is cut and raised inward to position the camera module housed in the module housing recess 24 in the neutral position in the front-rear direction. Pieces 26, 26 are formed. In addition, at the lower center of each of the side shield plates 20F and 20B, an upward ground leg piece 27 cut and raised by a gate-shaped notch and downward ground leg pieces 28 and 28 suspended from both sides are formed. . Each of the upward grounding leg pieces 27 and the downward grounding leg pieces 28 is wired corresponding to the plane of the printed wiring board 120 when the lower part of the case 5 is dropped into the mounting hole 121 of the printed wiring board 120 and attached. The middle is bent horizontally toward the outside so as to face the ground pattern.

モジュール収容凹部24に収容されるカメラモジュールの底面には、前後方向の2列に沿って各6個の接続端子(図示せず)が露出し、モジュール収容凹部24の底面に配置されるボトムシールド板22には、各接続端子の露出位置に対応して、その下方に逃げ孔22aが穿設されている。この逃げ孔22aは、カメラモジュールの接続端子に上下方向で弾性接触する後述するコンタクト3の接触片部31との接触を避ける目的で、ボトムシールド板22に形成される。   Six connection terminals (not shown) are exposed along the two rows in the front-rear direction on the bottom surface of the camera module housed in the module housing recess 24, and the bottom shield is disposed on the bottom surface of the module housing recess 24. The plate 22 is provided with relief holes 22a below the connection terminals corresponding to the exposed positions. The escape hole 22a is formed in the bottom shield plate 22 for the purpose of avoiding contact with a contact piece portion 31 of a contact 3 to be described later that elastically contacts the connection terminal of the camera module in the vertical direction.

スルーボードソケット1に用いられるコンタクト3の数は、ここでは、カメラモジュールの接続端子数に応じた12本であり、図7に示すように、前後方向の2列に沿った各6個の接続端子に応じて、6本毎のコンタクト3がサイドシールド板20L、20Rの左右方向から開口21を挿通して配置される。各コンタクト3は、図4、図7に示すように、細長帯状の導電性金属板を折り曲げ、先端側から、U字状に折り返された接触片部31と、後述する底板絶縁部41上に一体に支持される平板状の底板固定部32と、位置決め部33と、後述する側板絶縁部42に一体に支持される逆L字状に外方に折り曲げられた側板固定部34と、プリント配線基板120の平面の高さに一致するようにクランク状に折り曲げられた接続脚片35とが、ケース5内に挿入される先端側からケース5外に突出する基端側まで一体に形成されている。   Here, the number of contacts 3 used in the through-board socket 1 is 12 according to the number of connection terminals of the camera module, and as shown in FIG. 7, each of 6 connections along two rows in the front-rear direction. Depending on the terminal, every six contacts 3 are arranged through the openings 21 from the left and right directions of the side shield plates 20L, 20R. As shown in FIGS. 4 and 7, each contact 3 is formed by bending a strip-shaped conductive metal plate and folding it from the tip side into a U-shaped contact piece portion 31 and a bottom plate insulating portion 41 to be described later. A flat plate bottom plate fixing portion 32 that is integrally supported, a positioning portion 33, a side plate fixing portion 34 that is bent outward in an inverted L shape that is integrally supported by a side plate insulating portion 42 described later, and printed wiring A connecting leg piece 35 bent in a crank shape so as to coincide with the height of the plane of the substrate 120 is integrally formed from the distal end side inserted into the case 5 to the proximal end side protruding out of the case 5. Yes.

絶縁ハウジング4は、溶融させた絶縁性合成樹脂を射出成形する成形金型によって、シールド板2及び12本のコンタクト3と一体に成形され、成形後は、図9に示すように、平板状の底板絶縁部41とその左右両辺で上方に起立する側板絶縁部42とから構成される。図4に示すように、底板絶縁部41は、逃げ孔22aの上方と、後述する位置決めピン6の抜き孔6aを除くボトムシールド板22の平面全体を覆うとともに、各コンタクト3の底板固定部32の底面と側面側を覆い一体に固定している。また、側板絶縁部42は、サイドシールド板20L、20Rの外側面側で各開口21の周縁に固着して開口21の全体を覆い、開口21を挿通する各コンタクト3の側板固定部34を一体に支持している。   The insulating housing 4 is integrally formed with the shield plate 2 and the twelve contacts 3 by a molding die for injection molding a molten insulating synthetic resin. After the molding, as shown in FIG. It comprises a bottom plate insulating portion 41 and side plate insulating portions 42 that rise upward on both the left and right sides thereof. As shown in FIG. 4, the bottom plate insulating portion 41 covers the entire plane of the bottom shield plate 22 excluding the escape hole 22 a and the hole 6 a of the positioning pin 6 described later, and the bottom plate fixing portion 32 of each contact 3. Covers the bottom and side surfaces of the unit and is fixed integrally. Further, the side plate insulating portion 42 is fixed to the periphery of each opening 21 on the outer surface side of the side shield plates 20L and 20R, covers the entire opening 21, and integrally includes the side plate fixing portion 34 of each contact 3 inserted through the opening 21. I support it.

以下、上述構成のスルーボードソケット1を成形金型を用いて製造する製造方法を、図8を用いて説明する。始めに、図5に示す展開した状態で打ち抜いた金属板を枡形に折り曲げ加工した図6に示すシールド板2を成形金型内に位置決めし、図8(a)に示すように、そのサイドシールド板20L、20Rの各開口21へ左右の外方から各6本のコンタクト3を挿通する。   Hereinafter, the manufacturing method which manufactures the through board socket 1 of the above-mentioned structure using a shaping die is demonstrated using FIG. First, the shield plate 2 shown in FIG. 6 in which the metal plate punched in the unfolded state shown in FIG. 5 is bent into a bowl shape is positioned in the molding die, and as shown in FIG. The six contacts 3 are inserted into the openings 21 of the plates 20L and 20R from the left and right sides, respectively.

続いて、同図(b)に示すように、各コンタクト3のU字状の折り返えされた接触片部31の先端が逃げ孔22a上に位置し、側板固定部34の起立部が開口21内に位置する状態で、位置決め部33を上下の位置決めピン6、6で挟持し、成形金型内に全てのコンタクト3を位置決めし、成形金型で形成されるキャビティに加熱溶融させた絶縁合成樹脂を流入させた後、硬化させて、シールド板2と12本のコンタクト3が絶縁ハウジング4に一体成形された同図(c)に示すスルーボードソケット1を製造する。   Subsequently, as shown in FIG. 5B, the tip of the U-shaped folded contact piece 31 of each contact 3 is located on the escape hole 22a, and the upright portion of the side plate fixing portion 34 is opened. In the state where it is located in 21, the positioning part 33 is sandwiched by the upper and lower positioning pins 6, 6, all the contacts 3 are positioned in the molding die, and the insulation is heated and melted in the cavity formed by the molding die After the synthetic resin is introduced, the resin is cured and the through board socket 1 shown in FIG. 5C in which the shield plate 2 and the twelve contacts 3 are integrally formed with the insulating housing 4 is manufactured.

尚、成型金型内に位置決めされるシールド板2と12本のコンタクト3は、モジュール収容凹部24内に折り曲げられる抜け止めバネ片25、位置決め片26や接触片部31が鉛直方向でキャビティを形成する金型と干渉する恐れがある場合には、鉛直方向に沿って起立させた状態とし、成形後に各図に示すように折り曲げ加工してもよい。   The shield plate 2 and the twelve contacts 3 positioned in the molding die have a retaining spring piece 25, a positioning piece 26 and a contact piece 31 which are bent in the module receiving recess 24 to form a cavity in the vertical direction. When there is a possibility of interference with the mold to be made, it may be erected along the vertical direction, and may be bent as shown in each drawing after molding.

このようにして製造したスルーボードソケット1は、図4に示すように、プリント配線基板120に貫通して形成される取付孔121内にケース5が落とし込まれ、サイドシールド板20L、20Rの上向き接地脚片27及び下向き接地脚片28をプリント配線基板120の表面に形成された接地パターンに、各コンタクト3の接続脚片35を対応部位に配線された導電パターンにそれぞれ半田接続して、取付孔121に装着される。   As shown in FIG. 4, the manufactured through-board socket 1 has the case 5 dropped into a mounting hole 121 formed so as to penetrate the printed wiring board 120, and the side shield plates 20L and 20R face upward. The grounding leg piece 27 and the downward-facing grounding leg piece 28 are soldered to the grounding pattern formed on the surface of the printed wiring board 120, and the connection leg piece 35 of each contact 3 is soldered to the conductive pattern wired to the corresponding portion, and attached. The hole 121 is attached.

このスルーボードソケット1は、各コンタクト3の側板固定部34を絶縁ハウジグ4に一体成形して支持するので、薄肉とした側板絶縁部42で開口21を挿通するコンタクト3を位置決め支持することができ、しかも、この側板絶縁部42は、サイドシールド板20L、20Rと左右方向で重ならない開口21を覆う部位で各コンタクト3を支持するので、ケース5の左右方向の幅Dを、従来のスルーボードソケット100の外径D’に比べて大幅に縮小できる。また、前後方向では、従来のように絶縁ハウジング101による側壁部101bが重ねて形成されず、導電性金属板からなるサイドシールド板20F、20Bのみからケース5が形成されるので、更に縮径され、取付孔121の開口面積及びプリント配線基板120への実装面積を、例えば30%程度大幅に縮小できる。   Since the through-board socket 1 supports the side plate fixing portion 34 of each contact 3 integrally formed on the insulating housing 4, the contact 3 that passes through the opening 21 can be positioned and supported by the thin side plate insulating portion 42. Moreover, since the side plate insulating portion 42 supports each contact 3 at a portion covering the opening 21 that does not overlap the side shield plates 20L and 20R in the left-right direction, the width D in the left-right direction of the case 5 Compared to the outer diameter D ′ of the socket 100, it can be greatly reduced. Further, in the front-rear direction, the side wall portion 101b formed by the insulating housing 101 is not overlapped as in the conventional case, and the case 5 is formed only from the side shield plates 20F and 20B made of conductive metal plates. The opening area of the mounting hole 121 and the mounting area on the printed wiring board 120 can be greatly reduced by, for example, about 30%.

また、本発明に係るスルーボードソケット1によれば、プリント配線基板120上の高さを、成型金型や各部品の基本形状を変更することなく調整できる。図10は、上向き接地脚片12及び下向き接地脚片13と接続脚片11の折り曲げ形状を変えて、実装高さを低背化させたスルーボードソケット10のプリント配線基板120への実装状態を示し、他の構成は、上述実施の形態に係るスルーボードソケット1と同一であるので、同一番号を付してその説明を省略する。   Further, according to the through board socket 1 according to the present invention, the height on the printed wiring board 120 can be adjusted without changing the basic shape of the molding die and each component. FIG. 10 shows the mounting state of the through board socket 10 in which the mounting height is lowered by changing the bent shape of the upward grounding leg piece 12 and the downward grounding leg piece 13 and the connecting leg piece 11 to the printed wiring board 120. Since the other configuration is the same as that of the through board socket 1 according to the above-described embodiment, the same number is assigned and the description thereof is omitted.

このスルーボードソケット10は、ケース5をより深く取付孔121内に落とし込むために、各コンタクト3の接続脚片11を、クランク状に折り曲げずに側板固定部34の上端からそのまま折り曲げずに外方に突出させ、また、この接続脚片11の高さに一致するように、サイドシールド板20F、20Bの各下方で外方に折り曲げられる上向き接地脚片12及び下向き接地脚片13を、より高い位置で外方に向かって水平に折り曲げたものである。   In order to drop the case 5 deeper into the mounting hole 121, the through-board socket 10 is not bent from the upper end of the side plate fixing portion 34 as it is without bending the connecting leg piece 11 of each contact 3 into a crank shape. The upward grounding leg piece 12 and the downward grounding leg piece 13 that are bent outwardly below each of the side shield plates 20F and 20B so as to coincide with the height of the connection leg piece 11 are made higher. It is bent horizontally toward the outside at the position.

すなわち、図8の製造工程で製造したスルーボードソケット1の上向き接地脚片27及び下向き接地脚片28と接続脚片35の折り曲げ形状を上記のように変更しただけであるので、シールド板2、コンタクト3及び絶縁ハウジング4の基本形状は異ならず、同一の成型金型を用いて、実装高さの異なるスルーボードソケット10とすることができ、更に、上向き接地脚片12、下向き接地脚片13及び接続脚片11は鉛直方向の同一位置に突出するので、プリント配線基板120側の接地パターンや導電パターンも変更する必要がない。   That is, since the bent shape of the upward grounding leg piece 27 and the downward grounding leg piece 28 and the connecting leg piece 35 of the through board socket 1 manufactured in the manufacturing process of FIG. 8 is changed as described above, the shield plate 2, The basic shapes of the contact 3 and the insulating housing 4 are not different, and the through-board socket 10 having different mounting heights can be formed by using the same molding die. Further, the upward grounding leg piece 12 and the downward grounding leg piece 13 are provided. And since the connection leg piece 11 protrudes to the same position in the vertical direction, it is not necessary to change the ground pattern or conductive pattern on the printed wiring board 120 side.

上述の各実施の形態では、サイドシールド板20とボトムシールド板22を一枚の導電性金属板から一体に形成したが、分離してそれぞれを成型金型内に位置決めして絶縁ハウジング4に一体成形してもよい。更に、サイドシールド板20と複数のコンタクト3を絶縁ハウジング4に一体成形した後、一体成形したサイドシールド板20若しくは絶縁ハウジング4に別部品のボトムシールド板22を組み付けてスルーボードソケットを組み立ててもよい。   In each of the above-described embodiments, the side shield plate 20 and the bottom shield plate 22 are integrally formed from one conductive metal plate. However, the side shield plate 20 and the bottom shield plate 22 are integrally formed in the insulating housing 4 by separating them and positioning them in the molding die. You may shape | mold. Further, after the side shield plate 20 and the plurality of contacts 3 are integrally formed in the insulating housing 4, the through-board socket is assembled by assembling a separate bottom shield plate 22 to the integrally formed side shield plate 20 or the insulating housing 4. Good.

また、サイドシールド板20と一体成形する絶縁ハウジング4は、サイドシールド板20の開口21を挿通するコンタクト3を絶縁して支持するために、少なくとも開口21の一部を覆っていれば充分であり、ボトムシールド板22と絶縁して複数のコンタクト3を支持できれば、ボトムシールド板22上の側板絶縁部42は必ずしも形成する必要がない。一方、絶縁ハウジング4は、開口21以外の他のサイドシールド板20の部分を覆っていてもよく、ケース5の内側のサイドシールド板20の内壁面に沿って固着するものであってもよい。   Further, the insulating housing 4 formed integrally with the side shield plate 20 is sufficient if it covers at least a part of the opening 21 in order to insulate and support the contact 3 inserted through the opening 21 of the side shield plate 20. If the plurality of contacts 3 can be supported while being insulated from the bottom shield plate 22, the side plate insulating portion 42 on the bottom shield plate 22 is not necessarily formed. On the other hand, the insulating housing 4 may cover a portion of the side shield plate 20 other than the opening 21, or may be fixed along the inner wall surface of the side shield plate 20 inside the case 5.

本発明は、プリント配線基板の取付孔に周囲がシールドされたケースの下部が落とし込まれて装着されるスルーボードソケットとその製造方法に適している。   INDUSTRIAL APPLICABILITY The present invention is suitable for a through board socket in which a lower part of a case whose periphery is shielded in a mounting hole of a printed wiring board is dropped and attached, and a manufacturing method thereof.

1、10 スルーボードソケット
3 コンタクト
4 絶縁ハウジング
5 ケース
11 接続脚片(脚部)
20 サイドシールド板
21 開口
22 ボトムシールド板
24 モジュール収容凹部(電子部品収容凹部)
31 接触片部
35 接続脚片(脚部)
1, 10 Through board socket 3 Contact 4 Insulating housing 5 Case 11 Connection leg piece (leg part)
20 Side shield plate 21 Opening 22 Bottom shield plate 24 Module housing recess (electronic component housing recess)
31 Contact piece 35 Connection leg piece (leg part)

Claims (3)

矩形状の底板部と底板部の周囲で上方に起立する側壁部とにより、底面に接続端子を臨ませた電子部品を収容する升形の電子部品収容凹部が形成され、下部がプリント配線基板の表裏に貫通する取付孔内に装着されるケースと、
前記側壁部を挿通し、内側の接触片部が電子部品収容凹部に収容される前記電子部品の接続端子に弾性接触し、外側の脚部が前記側壁部の側方のプリント配線基板の導電パターンに接続する複数のコンタクトとを有し、
前記電子部品収容凹部が導電性のシールド材で囲われ、前記電子部品収容凹部に収容された電子部品の上方を除く周囲がシールドされるスルーボードソケットであって、
導電性金属板から前記ケースの底板部を構成するボトムシールド板と、
導電性金属板から前記ケースの側壁部を構成し、前記複数のコンタクトが挿通する部位に開口が穿設されたサイドシールド板と、
前記開口の少なくとも一部を覆い、前記サイドシールド板の前記開口の周囲に固定されて前記取付孔内に装着される絶縁ハウジングとを備え、
前記サイドシールド板と前記複数のコンタクトは、前記絶縁ハウジングに一体成形され、前記サイドシールド板の開口を挿通する複数のコンタクトが前記サイドシールド板から絶縁して前記絶縁ハウジングに支持されることを特徴とするスルーボードソケット。
A rectangular-shaped bottom plate portion and a side wall portion that rises upward around the bottom plate portion form a bowl-shaped electronic component housing recess for housing the electronic component with the connection terminal facing the bottom surface, and the lower portion is the front and back of the printed wiring board A case mounted in a mounting hole penetrating into
Inserting the side wall portion, the inner contact piece portion is in elastic contact with the connection terminal of the electronic component housed in the electronic component housing recess, and the outer leg portion is a conductive pattern of the printed wiring board on the side of the side wall portion. A plurality of contacts connected to the
A through board socket in which the electronic component housing recess is surrounded by a conductive shield material, and the periphery except for the top of the electronic component housed in the electronic component housing recess is shielded,
A bottom shield plate constituting a bottom plate portion of the case from a conductive metal plate;
A side shield plate that comprises a side wall portion of the case from a conductive metal plate, and an opening is formed in a portion through which the plurality of contacts are inserted;
An insulating housing that covers at least a part of the opening, is fixed around the opening of the side shield plate, and is mounted in the mounting hole;
The side shield plate and the plurality of contacts are formed integrally with the insulating housing, and the plurality of contacts that are inserted through the openings of the side shield plate are insulated from the side shield plate and supported by the insulating housing. And through board socket.
前記ボトムシールド板は、前記サイドシールド板と前記複数のコンタクトと共に、前記絶縁ハウジングに一体成形され、前記ボトムシールド板の表面が、前記絶縁ハウジングにより覆われることを特徴とする請求項1に記載のスルーボードソケット。 The bottom shield plate, together with the side shield plate and the plurality of contacts, the formed integrally with the insulating housing, the surface of the bottom shield plate, according to claim 1, characterized in that it is covered with the insulating housing Through board socket. 矩形状の底板部と底板部の周囲で上方に起立する側壁部とにより、底面に接続端子を臨ませた電子部品を収容する升形の電子部品収容凹部が形成され、下部がプリント配線基板の表裏に貫通する取付孔内に装着されるケースと、
前記側壁部を挿通し、内側の接触片部が電子部品収容凹部に収容される前記電子部品の接続端子に弾性接触し、外側の脚部が前記側壁部の側方のプリント配線基板の導電パターンに接続する複数のコンタクトとを有し、
前記電子部品収容凹部が導電性のシールド材で囲われ、前記電子部品収容凹部に収容された電子部品の上方を除く周囲がシールドされるスルーボードソケットを製造するスルーボードソケットの製造方法であって、
(a)一枚の導電性金属板から、前記底板部を構成するボトムシールド板と前記側壁部を構成するサイドシールド板を打ち抜き、少なくともいずれかのサイドシールド板に複数のコンタクトを挿通させる開口を穿設する第1工程と、
(b)前記ボトムシールド板の周囲の上方に前記サイドシールド板を起立させ、ケースを形成する第2工程と、
(c)前記開口の少なくとも一部を覆い、前記取付孔内に装着される絶縁ハウジングを成形する成形金型に、前記開口に複数のコンタクトを挿通させた状態で、前記ケースと複数のコンタクトを位置決めする第3工程と、
(d)前記成形金型により前記サイドシールド板と前記複数のコンタクトを前記絶縁ハウジングに一体成形する第4工程とを備え、
前記サイドシールド板の開口を挿通する複数のコンタクトが前記サイドシールド板から絶縁して前記絶縁ハウジングに支持されることを特徴とするスルーボードソケットの製造方法。
A rectangular-shaped bottom plate portion and a side wall portion that rises upward around the bottom plate portion form a bowl-shaped electronic component housing recess for housing the electronic component with the connection terminal facing the bottom surface, and the lower portion is the front and back of the printed wiring board A case mounted in a mounting hole penetrating into
Inserting the side wall portion, the inner contact piece portion is in elastic contact with the connection terminal of the electronic component housed in the electronic component housing recess, and the outer leg portion is a conductive pattern of the printed wiring board on the side of the side wall portion. A plurality of contacts connected to the
A through board socket manufacturing method for manufacturing a through board socket in which the electronic component housing recess is surrounded by a conductive shielding material and the periphery except for the upper side of the electronic component housed in the electronic component housing recess is shielded. ,
(A) From one conductive metal plate, a bottom shield plate that constitutes the bottom plate portion and a side shield plate that constitutes the side wall portion are punched, and an opening through which a plurality of contacts are inserted into at least one of the side shield plates is provided. A first step of drilling;
(B) a second step of standing the side shield plate above the periphery of the bottom shield plate to form a case;
(C) The case and the plurality of contacts are inserted in a state where a plurality of contacts are inserted into the opening in a molding die that covers at least a part of the opening and molds an insulating housing to be mounted in the mounting hole. A third step of positioning;
(D) comprising a fourth step of integrally molding the side shield plate and the plurality of contacts into the insulating housing by the molding die;
A method of manufacturing a through board socket, wherein a plurality of contacts inserted through the openings of the side shield plate are insulated from the side shield plate and supported by the insulating housing.
JP2013075602A 2013-04-01 2013-04-01 Through board socket and manufacturing method thereof Expired - Fee Related JP5930513B2 (en)

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