JP5928223B2 - Electronic equipment - Google Patents

Description

  The technology disclosed in the present application relates to an electronic device.

  2. Description of the Related Art Conventionally, a shield structure that shields electronic components mounted on a board by forming protrusions and ribs on a housing that houses the board is known.

JP 2005-294627 A JP 2004-140035 A

  In this type of shield structure, it is desired to improve the shielding performance against electronic components.

  Then, the technique which this application discloses aims at providing the electronic device which can improve the shielding property with respect to an electronic component as one side surface.

In order to achieve the above object, according to a technique disclosed in the present application, an electronic device including a substrate, a conductive cover, and a movable member is provided. The cover has a facing wall portion facing the substrate, and a groove portion formed by recessing a part of the facing wall portion toward the substrate side. The groove portion surrounds at least a part of the periphery of the electronic component and is connected to the ground of the substrate. The movable member is accommodated in the groove and is movable relative to the cover.

  According to the technology disclosed in the present application, it is possible to improve the shielding performance for electronic components.

It is a disassembled perspective view of an electronic device. It is a longitudinal cross-sectional view of the board | substrate of FIG. 1, a lower cover, and a stand. It is a top view of the board | substrate of FIG. 1, a lower cover, and a stand. It is a figure which shows the state which leaned the electronic device on the mounting surface. It is a figure which shows the modification of a groove part.

  Hereinafter, an embodiment of the technology disclosed in the present application will be described.

  As shown in FIG. 1, an electronic device 100 according to an embodiment of the technology disclosed in the present application includes a substrate 20 and a housing 30 that accommodates the substrate 20. An electronic component 22 such as a CPU (Central Processing Unit) is mounted on the lower surface of the substrate 20 (the surface on the lower cover 50 side described later). The electronic device 100 is one to which the shield structure 10 for shielding the electronic component 22 is applied. Specifically, the electronic device 100 is configured as follows.

  That is, the housing 30 is formed in a flat box shape, and has an upper cover 40 and a lower cover 50 that are divided in the thickness direction (arrow T direction) of the housing 30. A liquid crystal display 42 is assembled to the upper cover 40.

  The lower cover 50 is made of a magnesium alloy as an example of a conductive material. The lower cover 50 is formed by, for example, injection molding or the like, and includes a main body portion 51 and a plurality of side wall portions 52A, 52B, 52C, and 52D formed on the peripheral edge portion of the main body portion 51. Yes. The main body 51 faces the substrate 20 as shown in FIG. In FIG. 2, the positions of the lower cover 50 and the substrate 20 are shown upside down with respect to the case of FIG. The main body 51 is an example of an opposing wall, and the lower cover 50 having the main body 51 is an example of a cover. A pair of groove portions 54 are formed in the main body portion 51 by partially denting the plate-shaped main body portion 51 toward the substrate 20 side.

  As shown in FIG. 3, the pair of groove portions 54 includes a first groove portion 56 that extends in the lateral direction (arrow W direction) of the electronic device 100 and a vertical direction (arrow) of the electronic device 100 from one end of the first groove portion 56. And a second groove 58 extending in the (L direction). An end portion of the second groove portion 58 opposite to the first groove portion 56 is connected to a side wall portion 52A (upper wall portion) among the plurality of side wall portions 52A to 52D, and is opened to the side wall portion 52A.

  Further, as shown in FIGS. 2 and 3, the pair of groove portions 54 are formed on both sides of the electronic component 22 in the lateral direction (arrow W direction) of the electronic device 100. The pair of grooves 54 surrounds the electronic component 22 from both lateral sides of the electronic device 100. As shown in FIG. 2, the bottom portions 54 </ b> A of the pair of groove portions 54 are connected (contacted) to the ground 24 formed on the substrate 20. The bottom 54A of the pair of grooves 54 is thus connected to the ground 24, whereby the entire lower cover 50 is grounded.

  In addition, although the groove part 54 is formed when a part of plate-shaped main-body part 51 is dented on the board | substrate 20 side, a part of plate-shaped main-body part 51 is on the board | substrate 20 side. It can also be grasped as a ridge formed by forming a protrusion.

  As shown in FIGS. 1 and 2, a plurality of bosses 62 are formed in the main body 51 at positions away from the pair of grooves 54 described above. The plurality of bosses 62 are formed so as to protrude from the main body 51 to the substrate 20 side. Each boss 62 is formed with a screw hole 64 extending in the height direction of the boss 62. More specifically, the plurality of bosses 62 are positions on both sides with respect to the pair of grooves 54 in the lateral direction of the electronic device 100, at positions corresponding to the four corners of the substrate 20 formed in a square shape in plan view. Each is formed.

  Then, screws 66 are inserted into the through holes 26 formed at the four corners of the substrate 20, and the screws 66 are screwed into the screw holes 64, whereby the substrate 20 is screwed to the main body 51. Yes. As described above, the height of the boss 62 is set so that the bottom 54 </ b> A of the groove 54 is pressed against the ground 24 when the substrate 20 is screwed to the main body 51.

  Further, the electronic device 100 includes a stand 70 for leaning the electronic device 100. The stand 70 includes a pair of bearings 75, a pair of shaft portions 76, a leg portion 77, and a pair of connecting portions 78.

  The bearing 75 is accommodated in the first groove portion 56 and is fixed to the bottom portion of the first groove portion 56 with a screw 79 (see FIG. 3). The shaft portion 76 extends in the lateral direction of the electronic device 100 and is accommodated in the first groove portion 56. The shaft portion 76 is rotatably supported by the bearing 75. The leg portion 77 extends in the horizontal direction of the electronic device 100, and the connecting portion 78 extends in the vertical direction of the electronic device 100 to connect the shaft portion 76 and the leg portion 77.

  The stand 70 is an example of a movable member that is movable with respect to the cover, and rotates with the shaft portion 76 as a rotation shaft. In a state where the stand 70 is folded to the lower cover 50 side, the leg portion 77 is disposed along the side wall portion 52 </ b> A (upper wall portion) outside the lower cover 50, and the connecting portion 78 is accommodated in the second groove portion 58. On the other hand, as shown in FIG. 4, the leg portion 77 and the side wall portion 52 </ b> B are placed on the placement surface 110 in a state where the stand 70 is rotated to the side wall portion 52 </ b> B (lower wall portion) side. Thus, the electronic device 100 is put on the placement surface 110.

  Next, the operation and effect of this embodiment will be described.

  As described above in detail, according to the present embodiment, as shown in FIG. 2, a pair of groove portions 54 are formed in the main body portion 51 of the conductive lower cover 50, and the pair of groove portions 54. Is connected to the ground 24 of the substrate 20. Therefore, even when there is noise entering the electronic component 22 or noise generated from the electronic component 22, this noise can be released to the ground 24 of the substrate 20 through the main body 51 and the pair of grooves 54. Thereby, the electronic component 22 can be shielded (shielded). In particular, as shown in FIG. 3, the pair of groove portions 54 are formed so as to surround the electronic component 22 from both sides, so that the shielding performance against the electronic component 22 can be improved.

  In addition, since the main body 51 and the pair of grooves 54 formed on the lower cover 50 are used to shield the electronic component 22, it is necessary to provide a shield plate inside the housing 30 separately from the lower cover 50. It can be lost. As a result, the electronic device 100 can be thinned and the cost can be reduced.

  Moreover, the stand 70 (the bearing 75, the shaft portion 76, and the connecting portion 78) is accommodated in the pair of groove portions 54. Therefore, since the pair of groove portions 54 are used to accommodate the stand 70, the electronic device 100 can be further reduced in thickness.

  The substrate 20 is screwed to the main body 51 at a position away from the groove 54. Therefore, it is possible to avoid the stand 70 accommodated in the groove 54 and the screw 66 for fixing the substrate 20 and the lower cover 50 from overlapping in the thickness direction of the electronic device 100. Thereby, the electronic device 100 can be further reduced in thickness.

  Further, the bottom portions 54 </ b> A of the pair of groove portions 54 are connected to the ground 24 of the substrate 20, and the substrate 20 is screwed to the main body portion 51 at positions on both sides of the pair of groove portions 54. Therefore, the bottom 54A of the pair of grooves 54 can be stably connected to the ground 24.

  Further, the height of the boss 62 is set so that the bottom 54 </ b> A of the groove 54 is pressed against the ground 24 when the substrate 20 is screwed to the main body 51. Therefore, the bottom portion 54A of the groove portion 54 can be brought into stable contact with the ground 24.

  Next, a modification of this embodiment will be described.

  In the present embodiment, the pair of grooves 54 are formed in the main body 51 so as to surround the electronic component 22 from both sides. However, as shown in FIG. 5, the grooves 54 surround the periphery of the electronic component 22. Thus, it may be formed in a ring shape. If comprised in this way, the shielding property with respect to the electronic component 22 can be improved further.

  Further, the bearing 54, the shaft portion 76, and the connecting portion 78 of the stand 70 are accommodated in the groove portion 54, but the entire stand 70 may be accommodated in the groove portion 54 as shown in FIG. .

  Further, the stand 70 has the pair of shaft portions 76, the leg portions 77, and the pair of connecting portions 78, but may have other shapes.

  Moreover, although the groove part 54 was formed in the lower cover 50 which is an example of a cover, as long as the upper cover 40 has electroconductivity, for example, you may form in the upper cover 40. Moreover, the housing | casing 30 has a cover which has electroconductivity other than the upper cover 40 and the lower cover 50, and the groove part 54 may be formed in this cover.

  Further, the lower cover 50 is made of a magnesium alloy as an example of a conductive material, but may be formed of another conductive material such as an aluminum alloy. Moreover, the lower cover 50 may have conductivity by applying plating having conductivity to the surface of the resin. Further, the lower cover 50 may be formed of sheet metal other than injection molding.

  Further, the groove 54 is connected to the ground 24 at the bottom 54A, but may be connected to the ground 24 at other portions. Moreover, the groove part 54 may be directly connected to the ground 24, or may be connected to the ground 24 through another conductive member.

  Further, although the stand 70 is accommodated in the groove 54 as an example of a movable member, other members such as an antenna for receiving radio waves and a touch pen for touching the liquid crystal display 42 are accommodated. May be.

  The plurality of modified examples can be implemented in combination as appropriate.

  As mentioned above, although one embodiment of the technique disclosed in the present application has been described, the technique disclosed in the present application is not limited to the above, and various modifications may be made without departing from the spirit of the present invention. Of course, it is possible.

  In addition, regarding the embodiment of the technology disclosed in the present application, the following additional notes are disclosed.

(Appendix 1)
A board on which electronic components are mounted;
An opposing wall portion facing the substrate; and a groove portion formed by recessing a portion of the opposing wall portion toward the substrate side and surrounding at least a part of the periphery of the electronic component and connected to the ground of the substrate. A cover having electrical conductivity;
An electronic device with
(Appendix 2)
A movable member housed in the groove and movable relative to the cover;
The electronic device according to appendix 1.
(Appendix 3)
The movable member is a stand.
The electronic device according to attachment 2.
(Appendix 4)
The stand is
A shaft that rotates relative to the cover;
A leg portion placed on the placement surface;
A connecting portion for connecting the shaft portion and the leg portion;
Have
The groove portion accommodates at least the shaft portion and the connecting portion of the stand.
The electronic device according to attachment 3.
(Appendix 5)
The groove is
A first groove extending in the lateral direction of the electronic device;
A second groove extending from one end of the first groove in the longitudinal direction of the electronic device;
The first groove portion accommodates the shaft portion,
The connecting portion is accommodated in the second groove portion.
The electronic device according to attachment 4.
(Appendix 6)
The substrate is screwed to the opposing wall at a position away from the groove.
The electronic device according to any one of appendix 2 to appendix 5.
(Appendix 7)
The bottom of the groove is connected to the ground of the substrate,
The substrate is screwed to the opposing wall at positions on both sides with respect to the groove.
The electronic device according to attachment 6.
(Appendix 8)
A pair of the groove portions are formed so as to surround the electronic component from both sides.
The electronic device according to any one of appendix 1 to appendix 7.
(Appendix 9)
The groove is formed in an annular shape so as to surround the electronic component.
The electronic device according to any one of appendix 1 to appendix 8.
(Appendix 10)
The cover is a lower cover that forms a casing together with an upper cover assembled with a liquid crystal display.
The electronic device according to any one of appendices 1 to 9.
(Appendix 11)
The cover is made of magnesium alloy or aluminum alloy,
The electronic device according to any one of Supplementary Note 1 to Supplementary Note 10.

DESCRIPTION OF SYMBOLS 10 Shield structure 20 Board | substrate 22 Electronic component 24 Ground 30 Case 40 Upper cover 42 Liquid crystal display 50 Lower cover (an example of a cover)
51 Main body (example of facing wall)
54 groove 54A bottom 56 first groove 58 second groove 70 stand (an example of a movable member)
76 Shaft part 77 Leg part 78 Connection part 100 Electronic device

Claims (7)

A board on which electronic components are mounted;
An opposing wall portion facing the substrate; and a groove portion formed by recessing a portion of the opposing wall portion toward the substrate side and surrounding at least a part of the periphery of the electronic component and connected to the ground of the substrate. A cover having electrical conductivity;
A movable member housed in the groove and movable relative to the cover;
An electronic device with The movable member is a stand.
The electronic device according to claim 1. The stand is
A shaft that rotates relative to the cover;
A leg portion placed on the placement surface;
A connecting portion for connecting the shaft portion and the leg portion;
Have
The groove portion accommodates at least the shaft portion and the connecting portion of the stand.
The electronic device according to claim 2. The substrate is screwed to the opposing wall at a position away from the groove.
The electronic device as described in any one of Claims 1-3 . The bottom of the groove is connected to the ground of the substrate,
The substrate is screwed to the opposing wall at positions on both sides with respect to the groove.
The electronic device according to claim 4 . A pair of the groove portions are formed so as to surround the electronic component from both sides.
The electronic device as described in any one of Claims 1-5 . The groove is formed in an annular shape so as to surround the electronic component.
The electronic device as described in any one of Claims 1-6.

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