JP5878400B2 - Connection structure between rigid board and flexible board - Google Patents

Description

  The present invention relates to a connection structure between a rigid board such as a printed wiring board and a flexible board, and relates to a connection structure between a rigid board and a flexible board arranged in an electronic device such as a mobile phone device.

  Conventionally, a connection hole is provided in the first connection pattern formed on the upper surface of the soldering connection terminal of the flexible substrate, and the flexible substrate is arranged so that the first connection pattern corresponds to the second connection pattern on the rigid substrate. And the structure which connects a rigid board | substrate and a flexible substrate by solder-connecting a 1st connection pattern and a 2nd connection pattern via the said connection hole is proposed (for example, refer patent document 1). According to this connection structure, since the operator can visually recognize the first and second connection patterns from one direction, it is easy to align the rigid board and the flexible board and to confirm the soldered state of the solder connection portion.

Japanese Patent Laid-Open No. 10-173335, FIG.

  However, in the connection structure between the rigid board and the flexible board described above, it is necessary to align the flexible board so that the first connection pattern on the flexible board corresponds to the second connection pattern on the rigid board. There is a problem that the process until the two are connected is complicated. In addition, since the connection strength between the rigid board and the flexible board depends on the soldering state disposed through the connection hole, when an excessive load is applied as in the case of holding the flexible board and hanging the rigid board There is a problem that the solder and the connection pattern in the connection part are peeled off.

  The present invention has been made in view of such problems, and the connection process between the rigid board and the flexible board that can prevent the situation where the connection process is simple and the connection part is separated and the connection is cut off is achieved. The purpose is to provide a structure.

The connection structure between the rigid substrate and the flexible substrate according to the present invention includes a rigid substrate provided with a plurality of first connection portions that are electrically connected to a plurality of conductive patterns, a plurality of second connection portions corresponding to the first connection portions, and A connection structure for connecting a flexible substrate provided with a lead pattern extending from the second connection portion, a plurality of first through holes individually formed in the plurality of first connection portions; A plurality of second through holes formed corresponding to the first through holes in the plurality of second connection portions, and a plurality of and individually corresponding to the plurality of sets of the first and second connection portions. and a joint member made of a metal material provided, each of said joint member, have a first, plate-like portion cylindrical portion is inserted into the second through hole and the tubular portion are formed on one surface And the first connection portion and the second connection portion are in contact with each other The tubular portion is inserted through the second through-hole and the first through hole from the second through-hole side, the tip of the tube portion, characterized in that the caulked on the rigid substrate.

  According to the connection structure between the rigid substrate and the flexible substrate, the rigid substrate and the flexible substrate are connected by caulking the cylindrical portion made of a metal material inserted through the first and second through holes, respectively, to the rigid substrate. As a result, the connection strength can be strengthened, and a situation where the connection part is separated even when an excessive load is applied can be prevented. Further, the first connection part of the rigid board and the second connection part of the flexible board can be made to face each other with certainty only by inserting the cylindrical part of the joining member into the first and second through holes. Therefore, operations such as alignment of the flexible substrate with respect to the rigid substrate can be facilitated, and the process up to the completion of connection between the rigid substrate and the flexible substrate can be simplified. As a result, the connection process is simple, and it is possible to prevent a situation where the connection part is separated and the connection is cut off.

  Particularly, in the connection structure between the rigid substrate and the flexible substrate, the joining member has a pressing portion in a part of the plate-like portion, and the lead pattern extends from the second connecting portion by the pressing portion. It is preferable to hold a part of the flexible substrate on the direction side. In this case, since the separation of the flexible substrate from the rigid substrate can be restricted at a position away from the cylindrical portion inserted through the first and second through holes, the connection reliability at the connection portion is improved. Is possible.

  In the connection structure between the rigid substrate and the flexible substrate, it is preferable that a case in which the rigid substrate is integrated is provided, and a protective plate portion positioned on the plate-like portion is provided in a part of the case. In this case, since the protective plate portion that constitutes a part of the case is disposed on the plate-like portion of the joining member, the connection portion between the first connection portion and the second connection portion can be prevented from an external impact or the like. Since it can protect, it can maintain the conduction | electrical_connection state of a 1st connection part and a 2nd connection part, and it becomes possible to provide a highly reliable board | substrate connection structure.

  Furthermore, in the connection structure between the rigid substrate and the flexible substrate, the first connection portion has a film configuration in which a carbon pattern is laminated on a silver pattern, and the silver pattern is exposed around the first through hole. It is preferable that a portion to be provided is provided. Since the silver pattern is exposed at a part of the first connection part connected to the second connection part of the flexible substrate in this way, the conduction resistance with the second connection part in the first connection part can be reduced, so the first connection It is possible to improve the contact stability between the part and the second connection part.

  For example, in the connection structure between the rigid substrate and the flexible substrate, it is preferable that the silver pattern is exposed at a portion where the first connection portion is located on a tip portion side of a predetermined position of the first through hole. In this case, since the silver pattern is exposed only on the tip side from the predetermined position of the first through hole, the metal component (silver) constituting the silver pattern can be restricted from moving on the rigid substrate. Therefore, it is possible to suppress the occurrence of a short circuit due to migration between adjacent silver patterns while reducing the conduction resistance between the first connection portion and the second connection portion.

  Further, in the connection structure between the rigid substrate and the flexible substrate, the silver pattern is exposed at a portion of the first connection portion located on the tip side of the predetermined position of the first through hole, and at least adjacent to the first connection portion. A portion located on the side of the matching first connection portion may be covered with the carbon pattern. In this case, since the silver pattern is exposed only on the tip side than the predetermined position of the first through hole, and the portion located on the adjacent first connection part side is covered with the carbon pattern, the silver pattern Since it is possible to prevent the metal component (silver) constituting the metal from moving on the rigid substrate, it is possible to reliably prevent occurrence of a short circuit due to migration between silver patterns.

  Furthermore, in the connection structure between the rigid substrate and the flexible substrate, a plate-like member made of a flexible material having a thickness larger than that of the flexible substrate is disposed between the flexible substrate and the plate-like portion of the joining member. Is preferred. In this case, it is possible to prevent the joining member made of a metal material from directly contacting the surface of the flexible substrate, and it is possible to prevent a situation where the lead pattern or the like provided on the flexible substrate is damaged.

  According to the present invention, the connection process is simple, and it is possible to prevent a situation where the connection part is separated and the connection is cut off.

1 is an exploded perspective view of a multidirectional input device to which a connection structure between a rigid substrate and a flexible substrate according to an embodiment of the present invention is applied. It is a perspective view of the multidirectional input device which concerns on the said embodiment. It is a sectional side view of the multidirectional input device which concerns on the said embodiment. It is a disassembled perspective view for demonstrating the connection structure of the rigid board | substrate and flexible substrate which concerns on the said embodiment. It is a perspective view for demonstrating the connection structure of the rigid board | substrate and flexible substrate which concerns on the said embodiment. It is sectional drawing of the connection part vicinity of the connection structure of the rigid board | substrate and flexible substrate which concerns on the said embodiment. It is explanatory drawing of the connection part on the rigid board | substrate which concerns on the said embodiment. It is explanatory drawing of the connection part on the rigid board | substrate which concerns on the modification of the said embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The connection structure between the rigid substrate and the flexible substrate according to the present embodiment (hereinafter referred to as “substrate connection structure” as appropriate) is, for example, a connection between a rigid substrate and a flexible substrate disposed in an electronic device such as a mobile phone device. Applies to In the following, the case where the board connection structure according to the present embodiment is applied to a multidirectional input device mounted on a mobile phone device or the like will be described, but the use of the board connection structure according to the present embodiment will be described. However, the present invention is not limited to these and can be appropriately changed.

  FIG. 1 is an exploded perspective view of a multidirectional input device 1 to which a board connection structure according to an embodiment of the present invention is applied. 2 and 3 are a perspective view and a side sectional view, respectively, of the multidirectional input device 1 according to the present embodiment. In the following, for convenience of explanation, the upper side shown in FIG. 1 is referred to as the upper side of the multidirectional input device 1, and the lower side shown in FIG. 1 is referred to as the lower side of the multidirectional input device 1.

  As shown in FIG. 1, the multidirectional input device 1 according to the present embodiment includes an upper case 2, a lower case 3, and a cover member 4, and various components are formed in a space formed inside by combining these. Contained and stored. When the upper case 2, the lower case 3 and the cover member 4 are overlapped, the columnar engagement pieces 22 a of the upper case 2 are inserted into the through holes 31 c and 43 of the lower case 3 and the cover member 4, and their tips The parts are integrated by deforming them by hot caulking or cold caulking. For convenience of explanation, FIG. 1 shows a state in which the engagement piece 22a of the upper case 2 is deformed by heat caulking or the like.

  On the upper surface of the cover member 4, the rigid substrate 5 provided with the resistor patterns 52 (52a, 52b) and the current collector patterns 53 (53a, 53b) is placed. The rigid substrate 5 is disposed in a state of being sandwiched between the lower case 3 and the cover member 4. A pair of slide members 6, 7 and a regulating member 8 are accommodated in a space formed between the rigid substrate 5 stacked on the cover member 4 and the lower case 3, and the lower case 3 and the upper case 2 An operating body 9 and an annular coil spring 10 are accommodated in a space formed therebetween.

  The upper case 2, the lower case 3, and the cover member 4 are formed by molding an insulating resin material, for example. The upper case 2 has a top plate portion 21 that constitutes the upper surface of the multidirectional input device 1 and a side wall portion 22 that is provided to hang from the side edge portion of the top plate portion 21, and has a shape that opens downward. have. A circular opening 21 a is provided at the center of the top plate 21. Moreover, the annular protrusion part 21b is provided in the lower surface of the top-plate part 21 along the periphery of the opening part 21a (refer FIG. 3). The projecting portion 21b is provided with a dimension capable of locking the inner peripheral portion of the annular coil spring 10. Four engaging pieces 22 a extending downward are provided at the lower end portion of the side wall portion 22.

  The lower case 3 has a top plate portion 31 that is formed in a generally rectangular shape, and a side wall portion 32 that is provided to hang from the side edge portion of the top plate portion 31, and has a shape that opens downward. ing. A circular opening 31 a is provided at the center of the top plate portion 31. In addition, an annular protrusion 31b is provided on the top surface of the top plate 31 along the periphery of the opening 31a. The projecting portion 31b is provided with a dimension capable of locking the inner peripheral portion of the annular coil spring 10.

  Near the corner portion of the top plate portion 31, four through holes 31 c into which the engagement pieces 22 a of the upper case 2 are inserted are provided. Further, a pair of mounting holes 31 d for mounting to a device on which the multidirectional input device 1 is mounted is provided in a pair of opposite corners of the top plate portion 31. In addition, a protection plate portion 32 a is provided on one side of the side wall portion 32 so as to extend laterally. The protection plate portion 32 a is overlaid on a part of a flexible substrate (hereinafter referred to as “FPC (Flexible Printed Circuits)”) 11 connected to the rigid substrate 5 to protect it.

  The cover member 4 constitutes the lower surface of the multidirectional input device 1 and is generally composed of an octagonal plate member. An annular groove 42 is provided at the center of the upper surface portion 41 of the cover member 4. A part of the upper surface portion 41 inside the groove portion 42 constitutes a facing surface 41a that is disposed to face a driving portion 94 of the operating body 9 described later. Further, four through holes 43 through which the engaging pieces 22 a of the upper case 2 are inserted are provided in the vicinity of the corners of the upper surface portion 41.

  The housing of the multidirectional input device 1 is configured with the upper case 2, the lower case 3, and the cover member 4 being combined. In this case, the top plate portion 31 of the lower case 3 constitutes a partition portion that divides a space formed inside the housing into an upper space US and a lower space DS (see FIG. 3).

  The rigid substrate 5 is made of, for example, a glass epoxy substrate, and has an octagonal shape that is substantially the same shape as the cover member 4. A circular opening 51 is provided at the center of the rigid substrate 5. A pair of resistor patterns 52 (52a, 52b) and a current collector pattern 53 (53a, 53b) are provided on the upper surface of the rigid substrate 5, respectively. At the ends of the resistor pattern 52 and the current collector pattern 53, a connection portion 54 connected to a connection portion 1103 of the FPC 11 described later is provided. The resistor pattern 52 and the current collector pattern 53 constitute a conductive pattern, and the connection portion 54 constitutes a first connection portion that conducts with these conductive patterns. The configuration of the connection portion 54 as the first connection portion will be described later.

  Further, an FPC connection portion 55 to which the FPC 11 is connected is provided on one side of the rigid substrate 5 so as to protrude. As will be described in detail later, the FPC 11 is connected to the FPC connecting portion 55 by a plurality of (four in the present embodiment) joining members 12 made of, for example, a metal material. Further, four through holes 56 through which the engaging pieces 22 a of the upper case 2 are inserted are provided in the vicinity of the corners of the rigid substrate 5.

  The pair of slide members 6 and 7 are arranged in the lower space DS so as to be slidable in a direction orthogonal to the slide movement of the operating body 9 (see FIG. 3). The slide members 6 and 7 are long plate-like members, and are arranged so that the long sides thereof are orthogonal to each other. Further, long holes 61 and 71 extending along the long sides are provided in the vicinity of the center of the slide members 6 and 7. A pair of guided pieces 62 are provided in the vicinity of both end portions of the long side of the slide member 6. A slider 63 is fixed to the lower surface of one end of the slide member 6. Similarly, a pair of guided pieces 72 are provided in the vicinity of both end portions of the long side of the slide member 7. A slider 73 is fixed to the lower surface of one end of the slide member 7.

  The regulating member 8 is disposed on the upper side of the slide member 6 in the lower space DS (see FIG. 3). For example, the regulating member 8 is formed by bending a long plate-like member. In the center of the regulating member 8, a long hole 81 extending along the long side is provided. The regulating member 8 is provided with a pair of engaging pieces 82 that hang down from both ends in the longitudinal direction. The length between the pair of engagement pieces 82 is substantially the same as the length between a pair of ribs (not shown) provided on the lower surface of the lower case 3. The regulating member 8 plays a role of regulating the rotation of the operating body 9 by bringing the engaging piece 82 into contact with the rib when a rotational force acts on the operating body 9.

  The operating body 9 is made of, for example, an insulating resin material, and has a disk-shaped movable portion 91, an operation portion 92 provided to project upward from the central portion of the movable portion 91, and the movable portion 91. A non-circular portion 93 (see FIG. 3) provided so as to protrude downward from the center portion, and a drive portion 94 provided so as to further protrude from the lower end portion of the non-circular shape 93. The movable portion 91 is provided so that the outer diameter of the movable portion 91 is substantially the same as the size of the top of the annular protrusion 21 b of the upper case 2 and the annular protrusion 31 b of the lower case 3. The non-circular portion 93 is provided in a shape that can be engaged with the elongated hole 81 of the restriction member 8, and is configured to be able to transmit the rotational force acting on the operating body 9 to the restriction member 8. The drive unit 94 is provided in a cylindrical shape and is configured to be able to be inserted into the long holes 61 and 71 of the slide members 6 and 7.

  The annular coil spring 10 is accommodated in the upper space US so as to be placed on the top plate portion 31 of the lower case 3 (see FIG. 3). The inner diameter of the coil spring 10 before being incorporated into the upper space US is configured to be slightly smaller than the outer dimensions of the movable portion 91 of the operating body 9 and the dimensions of the top portions of the protruding portions 21b and 31b. When incorporated in the upper space US, the coil spring 10 is slightly pushed outward by the protrusions 21 b and 31 b and the movable portion 91. The coil spring 10 serves to return the operating body 9 on which the sliding operation has been performed to the initial position (neutral position) shown in FIG.

  The FPC 11 is connected to the FPC connection portion 55 of the rigid substrate 5 by a plurality of bonding members 12. The FPC 11 is connected to the rigid substrate 5 so as to extend in the extending direction of the FPC connection portion 55. As will be described later in detail, a connector portion 1104 is provided at the tip of the FPC 11. Via this connector portion 1104, a signal from the multidirectional input device 1 according to the present embodiment can be output to an external device.

  When the multidirectional input device 1 having such a configuration is assembled, as shown in FIG. 2, the rigid substrate 5 is placed on the cover member 4 in a state where the corners are aligned. Further, the lower case 3 is placed on the rigid substrate 5 and integrated, and the upper case 2 is placed on the lower case 3. The lower case constitutes a case that is integrated with the rigid substrate 5. The FPC connection portion 55 of the rigid substrate 5 is disposed so as to extend laterally from the end surface of the cover member 4. The protection plate portion 32 a extending in the same direction as the FPC connection portion 55 is put on the FPC connection portion 55 so as to cover the entire upper surface of the FPC connection portion 55.

  In the inside of the multidirectional input device 1, as shown in FIG. 3, the lower case 3 is overlaid on the rigid substrate 5 on which the slide members 6, 7 and the regulating member 8 are placed. In this case, the slide members 6 and 7 are such that the sliders 63 and 73 are in contact with the resistor pattern 52a and the current collector pattern 53a, the resistor pattern 52b and the current collector pattern 53b on the rigid substrate 5, respectively. Placed in. Thereby, the output signal according to the slide position of the slide members 6 and 7 can be output. The regulating member 8 is superimposed on the upper side of these slide members 6 and 7.

  The upper case 2 is overlaid on the lower case 3 in a state where the operating body 9 and the coil spring 10 are placed. The operation body 9 is exposed at the upper end portion of the operation portion 92 through the opening portion 21 a of the upper case 2, while the non-circular portion 93 and the drive portion 94 are placed in the lower space DS through the opening portion 31 a of the lower case 3. Arranged in the upper space US in an approached state. The movable portion 91 of the operating body 9 is arranged in a state where the outer peripheral end portion is placed on the protruding portion 31 b of the lower case 3. The protruding portion 21b of the upper case 2 is disposed so as to face the protruding portion 31b of the lower case 3, and the movable portion 91 is disposed so as to be slidable through these gaps.

  The coil spring 10 is disposed in the upper space US so as to surround the outer peripheral portion of the movable portion 91 of the operating body 9 at the inner peripheral portion thereof. Moreover, the coil spring 10 is arrange | positioned in the state in which the inner peripheral part was latched by the protrusion part 21b and the protrusion part 31b. When the operating body 9 slides, the coil spring 10 is partially extended (elastically deformed) on the sliding movement side while being locked by the protruding portions 21b and 31b on the opposite side of the sliding movement direction. A force is applied to return 9 to the initial position.

  The non-circular portion 93 of the operating body 9 is inserted so as to engage with the long hole 81 of the regulating member 8 made of a metal plate. Further, the drive unit 94 is inserted into the long holes 61 and 71 of the slide members 6 and 7, and the slide members 6 and 7 are slid in the A and B directions shown in FIG. It is possible.

  Hereinafter, a substrate connection structure mounted on the multidirectional input device 1 will be described. FIG. 4 is an exploded perspective view for explaining the substrate connection structure according to the present embodiment. FIG. 5 is a perspective view for explaining the substrate connection structure according to the present embodiment. 4 and 5, only the rigid substrate 5, the FPC 11, and the joining member 12 are shown. For convenience of explanation, FIG. 4 shows a state in which a caulking portion 1203 constituting a part of the joining member 12 is caulked. FIG. 5 shows a substrate connection structure when viewed from the lower surface side of the rigid substrate 5.

  As shown in FIG. 4, a part of the connection portion 54 provided so as to be electrically connected to the end portions of the resistor pattern 52 (52a, 52b) and the current collector pattern 53 (53a, 53b) is an FPC connection portion 55. Is arranged. The connection portion 54 is configured by a portion bent in the extending direction of the FPC connection portion 55 at the end portions of the resistor pattern 52 and the current collector pattern 53. Through holes 54 a are individually formed in the plurality of (four in the present embodiment) connection portions 54. These through holes 54a constitute a first through hole, and the FPC connecting portion 55 is also formed therethrough.

  The FPC 11 includes a base film 1101 made of polyimide, for example. The base film 1101 includes a long portion 1101a and a wide portion 1101b provided at one end of the long portion 1101a. A lead pattern 1102 is provided on the lower surface of the long portion 1101a. A connection portion 1103 connected to the connection portion 54 of the rigid substrate 5 is provided at the end of the lead pattern 1102. That is, the lead pattern 1102 extends from the connecting portion 1103 in the lower left direction shown in FIG. The lead pattern 1102 and the connection portion 1103 have a film configuration in which a gold pattern is laminated on a copper pattern via a nickel pattern. The connecting portion 1103 constitutes the second connecting portion, and is provided at a position corresponding to the connecting portion 54 on the lower surface of the wide portion 1101b. Through holes 1103a are formed in a plurality (four in the present embodiment) of connecting portions 1103. These through holes 1103a constitute a second through hole corresponding to the through hole 54a, and the base film 1101 (wide portion 1101b) is also formed therethrough.

  The other end of the long portion 1101a is provided with a connector portion 1104 used for connection with an electronic device (for example, a mobile phone device) to which the multidirectional input device 1 is connected. A reinforcing plate 1105 is attached to the upper surface of the long portion 1101 a corresponding to the connector portion 1104. Similarly, a reinforcing plate 1106 is attached to the upper surface of the wide portion 1101b with an adhesive or the like. These reinforcing plates 1105 and 1106 are made of, for example, an insulating material such as polyimide, and have a thicker thickness than the base film 1101. A through hole 1106a is formed in the reinforcing plate 1106 at a position corresponding to the through hole 1103a. The reinforcing plate 1106 has flexibility and constitutes a plate-like member.

  The joining member 12 is used for connecting the FPC 11 to the FPC connecting portion 55 of the rigid substrate 5. The FPC 11 is connected to the FPC connecting portion 55 by a plurality of (four in this embodiment) joining members 12 arranged in a direction orthogonal to the extending direction of the long portion 1101 a of the base film 1101. These joining members 12 are made of, for example, a metal material (metal plate) such as iron or stainless steel, a plate-like portion 1201, a cylindrical portion 1202 provided so as to protrude from the lower surface of the plate-like portion 1201, and this cylinder And a caulking portion 1203 provided at the tip (lower end) of the portion 1202. In the present embodiment, the cylindrical cylindrical portion 1202 is formed by burring, but the cylindrical portion 1202 is not limited to a cylindrical shape, and may be a polygonal shape or other shapes.

  A part of the plate-like part 1201 is provided with a holding part 1201a for holding down the base film 1101 (more specifically, the wide part 1101b) of the FPC 11 via the reinforcing plate 1106. The two joining members 12 arranged on the inner side of the lead pattern 1102 correspond to the extending direction of the long portion 1101a at a position slightly corresponding to the outer portion (portion on the connector portion 1104 side) of the connecting portion with the connecting portion 1103. It has a holding part 1201a extending in a crossing direction (a direction orthogonal in the present embodiment). That is, the pressing portion 1202a of the bonding member 12 disposed on the inner side in the width direction of the FPC 11 (wide portion 1106) extends outward in the width direction (direction intersecting with the extending direction of the lead pattern 1102). A back surface of the FPC 11 located on the extending direction side from the connecting portion 1103 of 1102 is pressed through a reinforcing plate 1106. On the other hand, the two joining members 12 arranged on the outside extend in a direction intersecting (orthogonal to) the extending direction of the long portion 1101a at a position corresponding to the vicinity of the connection portion with the connection portion 1103 in the lead pattern 1102. It has a holding part 1201a to perform.

  When connecting the FPC 11 to the FPC connecting portion 55, first, the FPC 11 is rigidly mounted so that the through hole 1103 a of the connecting portion 1103 (the through hole 1106 a of the reinforcing plate 1106) corresponds to the through hole 54 a of the connecting portion 54. 5 is superimposed. As a result, the connection portion 54 of the rigid board 5 and the connection portion 1103 of the FPC 11 are brought into contact with each other. Then, the cylindrical portion 1202 of the joining member 12 is inserted into each through hole from the upper side (that is, the through hole 1103a (through hole 1106a) side), and the tip end (lower end) of the cylindrical portion 1202 is downward from the through hole 54a. Project to the side. Then, the protruding portion is caulked on the rigid substrate 5 (FPC connecting portion 55) by eyelet caulking or the like. Thereby, the front-end | tip of the cylinder part 1202 becomes the crimping part 1203 as shown in FIG.

  Note that the connection procedure of the FPC 11 to the FPC connection unit 55 is not limited to this, and can be changed as appropriate. For example, after the cylindrical portion 1202 of the joining member 12 is inserted into the through holes 1103a and 1106a, the cylindrical portion 1202 of the joining member 12 arranged in the through holes 1103a of the FPC 11 is inserted into the through hole 54a of the rigid board 5 and A portion protruding downward from 54a may be caulked onto the rigid substrate 5 (FPC connecting portion 55) by eyelet caulking or the like. 4 may be turned upside down so that the cylindrical portion 1202 of the joining member 12 protrudes upward from the through hole 54a of the rigid substrate 5, and the tip portion thereof may be caulked on the rigid substrate 5.

  FIG. 6 is a cross-sectional view of the vicinity of the connection portion of the substrate connection structure according to the present embodiment. Note that FIG. 6 shows a cross section passing through the cylindrical portion 1202 of the joining member 12 on the foremost side shown in FIG. As shown in FIG. 6, the rigid substrate 5 and the FPC 11 are sandwiched between the plate-like portion 1201 and the caulking portion 1203 in a state where the through-holes 54a and 1103a are inserted through the cylindrical portion 1202, respectively. Even when an excessive load is applied, it is possible to prevent a situation where the connection part is separated and the connection is cut off.

  In particular, in the board connection structure according to the present embodiment, the connection part 54 of the rigid board 5 and the connection part 1103 of the FPC 11 can be securely connected by simply inserting the cylindrical part 1202 of the joining member 12 into the through holes 54a and 1103a. Since they can be brought into contact with each other, operations such as positioning of the FPC 11 with respect to the rigid substrate 5 can be facilitated, and the process up to the completion of the connection between the rigid substrate 5 and the FPC 11 can be simplified. In addition, since the contact portion 54 and the connection portion 1103 are in direct contact without disposing a member or the like constituting the adhesive layer, it is possible to reduce the number of parts constituting the board connection structure. It becomes. Further, even when a material that cannot be soldered is used as a material constituting the connection portion 54 and the connection portion 1103, both the connection portions can be electrically connected.

  In addition, the bonding member 12 is in a state where the FPC 11 (the wide portion 1101 b of the base film 1101) is pressed against the rigid substrate 5 by the plate-like portion 1201 through the reinforcing plate 1106. For this reason, it can avoid that the joining member 12 comprised with a metal plate etc. contacts the surface of FPC11 (wide part 1101b of the base film 1101) directly, and the lead pattern 1102 etc. which were provided in FPC11 etc. are damaged. Can be prevented.

  Furthermore, the pressing portion 1201 a that constitutes a part of the plate-like portion 1201 is disposed at a position corresponding to the vicinity of the tip portion of the FPC connection portion 55. In the same manner as the plate-like portion 1201, the FPC 11 (the wide portion 1101 b of the base film 1101) is pressed against the rigid substrate 5 through the reinforcing plate 1106. For this reason, it is possible to restrict the separation of the FPC 11 from the rigid board 5 (FPC connection portion 55) at a position away from the cylindrical portion 1202, and it is possible to further improve the connection reliability at the connection portion.

  Note that the protective plate portion 32a of the lower case 3 is disposed above the FPC connection portion 55 of the rigid substrate 5 (see FIG. 3). For this reason, since the connection portion provided on the FPC connection portion 55 can be protected from an external impact or the like, the conductive state between the connection portion 54 of the rigid substrate 5 and the connection portion 1103 of the FPC 11 can be maintained, and a highly reliable substrate. A connection structure can be provided.

  Here, the structure of the connection part 54 on the rigid board | substrate 5 in the board | substrate connection structure concerning this Embodiment is demonstrated. FIG. 7 is an explanatory diagram of the connection portion 54 on the rigid substrate 5 according to the present embodiment. As shown in FIG. 7, the connection portion 54 has a film configuration in which a carbon pattern 54c is laminated on a silver pattern 54b. The same applies to both ends of the resistor pattern 52 and the current collector pattern 53. The resistor pattern 52 is composed of only the carbon pattern 54c in the sliding area where the sliders 63 and 73 are in sliding contact, and the silver pattern 54b does not exist under the carbon pattern 54c. In FIG. 7, for convenience of explanation, only the carbon pattern 54c is hatched.

  In the connection portion 54, a portion where the silver pattern 54b is exposed is provided around the through hole 54a. More specifically, the silver pattern 54b is exposed at a portion located on the tip end side (the lower end side shown in FIG. 7) from a predetermined position of the through hole 54a. Thus, by exposing the silver pattern 54b at a part of the connecting portion 54 connected to the connecting portion 1103 of the FPC 11, it is possible to reduce the conduction resistance (contact resistance) with the connecting portion 1103.

  As shown in FIG. 7, the silver pattern 54b is a straight line along a direction orthogonal to the extending direction of the connecting portion 54 (the vertical direction shown in FIG. 7), and passes through the centers of the plurality of through holes 54a. The tip end side can be exposed with L as a boundary. In general, if a metal used as a wiring or an electrode is exposed, the metal component moves on an insulator (migration phenomenon), and as a result of a decrease in insulation resistance between the electrodes, a short circuit may occur. In the substrate connection structure according to the present embodiment, the silver pattern 54b on the tip end side is exposed with a straight line L passing through the centers of the plurality of through holes 54a as a boundary. For this reason, since the exposed part of the silver pattern 54b is limited to a partial region around the through hole 54a, the metal component (silver) constituting the silver pattern 54b can be restricted from moving on the rigid substrate 5. Therefore, it is possible to suppress the occurrence of a short circuit due to the migration between the silver patterns 54b while reducing the conduction resistance with the connection portion 1103.

  In addition, about the exposed part of the silver pattern 54b, it is not limited to the example shown in FIG. 7, It can change suitably. FIG. 8 is an explanatory diagram of the connecting portion 54 ′ on the rigid substrate 5 ′ according to the modification of the present embodiment. In FIG. 8, the same components as those in FIG. 7 are given the same reference numerals, and only the carbon pattern 54c is hatched.

  In the connecting portion 54 ′ on the rigid substrate 5 ′ according to the modification shown in FIG. 8, the connecting portion 54 shown in FIG. 7 is covered with the carbon pattern 54c on the adjacent connecting portion 54 ′ side. Is different. Thus, by covering the portion located on the side of the adjacent connecting portion 54 ′ with the carbon pattern 54c, it is possible to reliably prevent the occurrence of a short circuit due to the migration between the silver patterns 54b.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the connection portion 54 of the rigid substrate 5 of the above-described embodiment, a case where the silver pattern 54b on the tip end side is exposed with a straight line L passing through the centers of the plurality of through holes 54a as a boundary is described. However, the position of the boundary when the silver pattern 54b is exposed is not limited to this, and can be changed as appropriate. Moreover, the boundary line at the time of exposing the silver pattern 54b needs to be arranged in a straight line, and may be a linear shape having a step or a curved shape.

  In addition, the connection portion 54 of the rigid substrate 5 according to the above embodiment has been described with respect to the case where the carbon pattern 54c is laminated on the silver pattern 54b. However, the configuration of the connection portion 54 is not limited to this, and can be changed as appropriate. For example, a configuration in which a nickel pattern is laminated on a copper pattern and a gold pattern is further laminated can be applied. However, in consideration of the cost in forming the connecting portion 54, the configuration as in the above embodiment is preferable.

DESCRIPTION OF SYMBOLS 1 Multidirectional input device 2 Upper case 3 Lower case 32a Protection board part 4 Cover member 5 Rigid board 51 Opening part 52a, 52b Resistor pattern (conductive pattern)
53a, 53b Current collector pattern (conductive pattern)
54 connecting portion 54a through hole 54b silver pattern 54c carbon pattern 55 FPC connecting portion 6, 7 slide member 8 regulating member 9 operating body 10 coil spring 11 FPC
DESCRIPTION OF SYMBOLS 1101 Base film 1102 Lead pattern 1103 Connection part 1103a Through-hole 1104 Connector 1105, 1106 Reinforcement plate 1106a Through-hole 12 Joining member 1201 Plate-like part 1201a Holding part 1202 Cylinder part 1203 Caulking part

Claims (7)

A rigid substrate provided with a plurality of first connection portions that conduct to a plurality of conductive patterns, a plurality of second connection portions corresponding to the first connection portions, and a lead pattern extending from the second connection portions are provided. A connection structure for connecting to a flexible substrate,
A plurality of individually formed in a plurality of the first connecting portion the first through hole and a plurality a plurality of the formed corresponding to the to the second connecting portion first through-holes of the second through hole And a plurality of individual joining members made of metal materials corresponding to the plurality of first and second connecting portions, wherein the joining members are the first and second penetrations, respectively. the cylindrical portion is inserted into the hole and the tubular portion have a plate-like portion formed on one surface,
With the first connection portion and the second connection portion in contact with each other, the cylindrical portion is inserted from the second through hole side into the second through hole and the first through hole, A connecting structure between a rigid board and a flexible board, wherein a tip of the cylindrical portion is caulked on the rigid board.   The joining member has a pressing part in a part of the plate-shaped part, and the pressing part presses a part of the flexible substrate on the extending direction side of the lead pattern from the second connection part. The connection structure between the rigid substrate and the flexible substrate according to claim 1.   The rigid substrate and the flexible according to claim 1, further comprising a case in which the rigid substrate is integrated, and a protective plate portion positioned on the plate-like portion is provided in a part of the case. Connection structure with substrate.   The first connecting portion has a film configuration in which a carbon pattern is laminated on a silver pattern, and a portion where the silver pattern is exposed is provided around the first through hole. The connection structure of the rigid board | substrate in any one of Claims 1-3, and a flexible substrate.   5. The connection between the rigid substrate and the flexible substrate according to claim 4, wherein the silver pattern is exposed at a portion of the first connection portion that is located closer to a tip side than a predetermined position of the first through hole. Construction.   The first connection portion is exposed at a portion located on the tip end side of the first through hole at a predetermined position, and at least a portion located on the adjacent first connection portion side is the carbon. 5. The connection structure between a rigid substrate and a flexible substrate according to claim 4, wherein the connection structure is covered with a pattern.   The plate-like member made of a flexible material having a thickness larger than that of the flexible substrate is disposed between the flexible substrate and the plate-like portion of the joining member. The connection structure of the rigid board | substrate and flexible board | substrate of description.

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