JP5871728B2 - Connecting member - Google Patents

Description

  The present invention relates to a connection member that mechanically contacts and electrically connects to an object to be connected.

  In Patent Document 1, as shown in FIG. 9, a base material 1, a mediator layer 2 made of an adhesive or an adhesive disposed on the base material 1, and a pattern on the mediator layer 2 are arranged. An electrical connection member having a reinforcing film 3 provided and a conductor 4 disposed on the reinforcing film 3 is disclosed. When the electrical connection member is connected to the connection object, the electric conductor 4 is pressed against the connection object by the elastic force of the mediator layer 2, thereby obtaining an electrical connection.

  In this type of connecting member, convex or concave “warping” occurs in the reinforcing film and the conductor due to the difference in internal stress between the reinforcing film and the conductor made of different materials. This “warp” affects the connection stability depending on the direction.

  When the connecting member has no reinforcing film, or when the conductor is arranged only on one side of the uniform reinforcing and reinforcing film, the direction of “warping” is structurally determined. I can't. That is, in these cases, the direction and amount of “warp” are determined by the internal stress of the reinforcing film and the conductor. For this reason, there are restrictions on the material and thickness, which are important parameters in terms of performance, such as the resistance value, connection strength, and connection stability of the connection member.

  A structure for solving this problem is proposed in Patent Document 2. That is, in Patent Document 2, as shown in FIG. 10, the conductors 4 a and 4 b are arranged on both surfaces of the reinforcing film 3, and the width of the conductor 4 a on the surface side (front side) in contact with the connection object. Is equal to the width of the reinforcing film 3, and the width of the conductor 4 b on the opposite side (back side) is made smaller than the width of the reinforcing film 3.

  According to the connecting member of FIG. 10, it can be expected that the direction of “warping” of the wiring pattern 5 including the reinforcing film 3 and the conductors 4a and 4b is uniquely determined.

JP 2006-351482 A JP 2011-171151 A

  However, in the configuration of Patent Document 2, it is necessary to dispose the conductors on both sides of the reinforcing film, so that the steps of adhesion and patterning of the conductors increase and the manufacturing cost increases.

  Therefore, an object of the present invention is to provide a connection member that can control warping of a conductor with a simple configuration and at low cost.

  According to one aspect of the present invention, a substrate, a mediator layer made of a pressure-sensitive adhesive or an adhesive disposed on the substrate, and a wiring pattern-shaped reinforcing film disposed on the mediator layer And a connecting member that is disposed on the reinforcing film and electrically connected to the connection object, the reinforcing film is formed in a part of the thickness direction from the width of the conductor. A connecting member characterized by having a portion having a small width can be obtained.

  The connection member according to one embodiment of the present invention can control the warping of the conductor with a simple configuration and at a low cost.

(A) is a perspective view of the connection member which concerns on embodiment of this invention, (b) is a principal part enlarged view of (a). (A) is the expansion perspective view of only the principal part which showed the connection member shown in FIG. 1 in the state which disregarded the internal stress, (b) is a front view of (a). FIG. 2 is an enlarged perspective view of only a main part showing a state in which “warping” has occurred in a part of the connection member shown in FIG. 1. FIG. 3B is an enlarged perspective view of only a main part showing a state where the connection member in the state of FIG. 3A is connected to a connection object. (A) is the expansion perspective view of only the principal part which showed the connection member which concerns on other embodiment of this invention in the state which disregarded internal stress, (b) is a front view of (a). The enlarged front view of only the principal part which showed the connection member which concerns on other embodiment of this invention in the state which disregarded internal stress. The enlarged front view of only the principal part which showed the connection member which concerns on other embodiment of this invention in the state which disregarded internal stress. The enlarged front view of only the principal part which showed the modification of the connection member of FIG. 1 in the state which disregarded the internal stress. The enlarged front view of only the principal part shown in the state which disregarded the internal stress about the modification of the connection member of FIG. The enlarged front view of only the principal part shown in the state which disregarded the internal stress about the modification of the connection member of FIG. 5A. The enlarged perspective view of only the principal part of the electrical-connection member currently disclosed by patent document 1 (Unexamined-Japanese-Patent No. 2006-351482). The expansion perspective view of only the principal part of the electrical-connection member currently disclosed by patent document 2 (Unexamined-Japanese-Patent No. 2011-171151).

  With reference to FIG.1 and FIG.2, the connection member which concerns on embodiment of this invention is demonstrated.

  The connecting member 10 in FIGS. 1 and 2 is a flexible electric connecting member for electrically connecting to a connection object (indicated by reference numeral 30 in FIG. 3B). The mediator layer 12 provided over the entire surface of the material 11, the multiple reinforcing films 13 arranged in a pattern spaced apart from each other on the mediator layer 12, and the reinforcing films 13 respectively disposed on the reinforcing films 13. And a large number of conductors 14 provided. As will be described in detail later, the conductor 14 is pressed against the connection object by the elastic restoring force of the mediator layer 12, whereby the connection member 10 is electrically connected to the connection object. In the following description, the reinforcing film 13 and the conductor 14 are collectively referred to as a “wiring pattern 15”, and the dimension in the direction (width direction) A1 in which these wiring patterns 15 are separated from each other is simply “width”. Call it.

  As the base material 11, a resin film which is a flexible material having a thickness of 1 OO μm or less having flexibility and insulation, such as polyimide, PET (polyethylene terephthalate), and PEN (polyethylene naphthalate) can be used.

  The mediator layer 12 has a thickness of 20 μm or more, and is formed from a pressure-sensitive adhesive or an adhesive. As an adhesive, what adheres to a connection target object by normal temperature pressurization can be used. As the adhesive, an adhesive that adheres to a connection object using light such as ultraviolet rays or heat, or an adhesive that also applies pressure can be used. Here, “adhesion” represents adhesion that can be repeatedly applied, and “adhesion” represents adhesion that cannot be repeatedly applied as a general concept.

  As the reinforcing film 13, a resin film having a thickness of 25 μm or less having flexibility and insulating properties such as polyimide and aramid can be used.

  The conductor 14 is a metal thin film formed on the reinforcing film 13 by sputtering, electroless plating, vapor deposition, electrolytic plating, pasting copper foil, or the like. The metal thin film may be a thin film made of a single metal or a multilayer film in which a plurality of metals are stacked.

  The conductor 14 is disposed only on one side of the reinforcing film 13. That is, the reinforcing film 13 is directly interposed between the mediator layer 12 and the conductor 14.

  The reinforcing film 13 has a processed surface at both ends that define the width. Here, the processing surface is configured as a tapered surface 13a. Specifically, the reinforcing film 13 is provided with a taper in the thickness direction A2 such that the width w1 of the surface 13b facing the mediator layer 12 is smaller than the width w2 of the surface 13c facing the conductor 14. It has a configuration. The taper angle α of the taper surface 13a is preferably 70 ° or less, and desirably about 30 °. The width w2 on the conductor 14 side of the reinforcing film 13 is the same as the width of the conductor 14 in FIG. 2B, but may be smaller than the width of the conductor 14 as will be described later. it can.

  The wiring pitch of the wiring pattern 15 is set to about 0.1 to 0.5 mm, generally called a fine pitch, and the width of the conductor 14 is set to about 1/4 to 1/2 of the wiring pitch of the wiring pattern 15.

  Although FIG. 2 shows the state in which the internal stress of the wiring pattern 15 is ignored, the wiring pattern 15 is actually shown in FIG. 3A due to the difference in internal stress between the reinforcing film 13 and the conductor 14 made of different materials. "Warp" occurs. That is, the wiring pattern 15 warps in the direction of forming a downwardly convex curved surface. As a result, the taper surface 13a provided on the reinforcing film 13 comes into contact with the mediator layer 12 and is attached thereto.

  In this way, it is possible to warp the wiring pattern 15 so as to always form a downwardly curved surface regardless of the material or thickness. Further, the direction and amount of “warping” of the wiring pattern 15 can be controlled by structural parameters such as the width of the reinforcing film 13 and the angle of the tapered surface 13a. Therefore, the degree of freedom of the material and thickness, which are important parameters in terms of performance of the connection member 10, is increased.

  Furthermore, since the conductor 14 should just be arrange | positioned only on the single side | surface of the reinforcement film 13, it is possible to suppress manufacturing cost.

  Further, since the taper surfaces 13a at both ends defining the width of the reinforcing film 13 are attached to the mediator layer 12 and become the state of FIG. 3A, the surface of the mediator layer 12 and the surface of the conductor 14 at the edge portion of the wiring pattern 15 And the step becomes smaller. As a result, when connecting the connection member 10 to the connection object, the mediator layer 12 is easily brought into contact with the connection object. Specifically, when the mediator layer 12 is formed of an adhesive, it is easy to stick to the connection object, and when the mediator layer 12 is formed of an adhesive, the connection object is It becomes easy to adhere.

  With reference to FIG. 3B, the connection of the connection member 10 in the state of FIG. 3A and the connection target 30 will be described.

  The connection member 10 in the state of FIG. 3A is pressed against the connection object 30 while the conductor 14 of the wiring pattern 15 is superimposed on the wiring (not shown) of the connection object 30. Then, the mediator layer 12 between the wiring patterns 15 adheres or adheres between the wirings of the connection object 30. Specifically, when connecting the connection member 10 to the connection object 30, the mediator agent layers 12 on both sides of the wiring pattern 15 adhere or adhere to the connection object 30. At this time, the mediator layer 12 made of an adhesive or an adhesive is elastically deformed, and the wiring pattern 15 is pressed against the connection object 30 by the elastic restoring force. As a result, the conductor 14 on the surface of the wiring pattern 15 is pressed and electrically connected to the wiring of the connection object 30. Thus, the connection member 10 is electrically and mechanically connected to the connection object 30.

  At this time, since the wiring pattern 15 is warped in a direction in which a convex curved surface is formed toward the connection target 30, the conductor 14 of the wiring pattern 15 contacts the wiring of the connection target 30 at the center, and the mediator When the wiring pattern 15 is pressed against the connection object 30 by the elastic restoring force of the layer 12, the wiring pattern is deformed in the direction in which the contact area of the contact portion increases. Therefore, a stable electrical connection can be obtained.

  In addition, the exposed portion of the mediator layer 12 of the connection member 10 adheres or adheres to a portion of the connection target 30 other than the wiring, so that the connection member 10 and the connection target 30 are physically fixed.

  Furthermore, the conductor 14 formed on the base material 11 also serves as a wiring for electrically connecting the two connection objects 30 connected to both ends of the connection member 10.

  In any of the manufacturing methods, it goes without saying that the parameters of the width of the reinforcing film 13 and the taper angle α can be controlled.

  A connection member according to another embodiment of the present invention will be described with reference to FIG. Similar parts are denoted by the same reference numerals and description thereof is omitted.

  The connecting member 10 in FIG. 4 is also an electric connecting member having flexibility for electrically connecting to the connection object, and the conductor 14 is caused to move by the elastic restoring force of the mediator layer 12 when connecting to the connection object. It is pressed against the connection object, and is thereby electrically and mechanically connected to the connection object.

  In the connecting member 10 of FIG. 4, the reinforcing film 13 has a narrower width than the conductor 14 not only on the surface 13 b facing the mediator layer 12 but also on the surface 13 c in contact with the conductor 14. As a result, the surface 14 a of the conductor 14 facing the reinforcing film 13 is exposed on both sides of the reinforcing film 13. Since the width w4 of the surface 13c in contact with the conductor 14 is larger than the width w3 of the surface 13b facing the mediator layer 12 of the reinforcing film 13, the processed surface that defines the width of the reinforcing film 13 is a tapered surface 13a. ing.

  Also with the connecting member 10 of FIG. 4, the same effect as the connecting member of FIGS. 1 and 2 can be obtained.

  With reference to FIG. 5A, the connection member which concerns on further another embodiment of this invention is demonstrated. Similar parts are denoted by the same reference numerals and description thereof is omitted.

  The connection member 10 in FIG. 5A is also a flexible electrical connection member for electrically connecting to the connection object, and the conductor 14 is caused to move by the elastic restoring force of the mediator layer 12 when connecting to the connection object. It is pressed against the connection object, and is thereby electrically and mechanically connected to the connection object.

  In FIG. 5A, the reinforcing film 13 has a narrower width than the conductor 14 not only on the surface 13 b facing the mediator layer 12 but also on the surface 13 c in contact with the conductor 14. As a result, the surface 14a of the conductor 14 facing the reinforcing film 13 is exposed on both sides of the reinforcing film 13 in the width direction A1. However, the width of the surface 13b facing the mediator layer 12 and the width of the surface 13c in contact with the conductor 14 are designed to be the same. Specifically, the processed surface that defines the width of the reinforcing film 13 is not a tapered surface but a surface perpendicular to the conductor 14.

  With reference to FIG. 5B, the connection member which concerns on further another embodiment of this invention is demonstrated. Similar parts are denoted by the same reference numerals and description thereof is omitted.

  The connection member 10 of FIG. 5B is also an electric connection member having flexibility for electrically connecting to the connection object, and the conductor 14 is caused to move by the elastic restoring force of the mediator layer 12 when connecting to the connection object. It is pressed against the connection object, and is thereby electrically and mechanically connected to the connection object.

  In FIG. 5B, the reinforcing film 13 has a narrower width than the conductor 14 not only on the surface 13 b facing the mediator layer 12 but also on the surface 13 c in contact with the conductor 14. As a result, the surface 14 a of the conductor 14 facing the reinforcing film 13 is exposed on both sides of the reinforcing film 13. In addition, the width w5 of the surface 13b facing the mediator layer 12 is designed to be larger than the width w6 of the surface 13c in contact with the conductor 14. As a result, the processed surface that defines the width of the reinforcing film 13 is a tapered surface 13 d that is inclined with respect to the conductor 14. It will be understood that the direction of the tapered surface 13d is different from the direction of the tapered surface 13a of the connecting member 10 of FIG.

  Also by the connecting member 10 of FIG. 5A and the connecting member 10 of FIG. 5B, the same effect as the connecting member of FIG.1 and FIG.2 is acquired.

  In addition, as shown in FIGS. 6-8, you may give R to the corner | angular part of the reinforcement film 13. FIG.

  In any of the connecting members 10 described above, the reinforcing film 13 has a portion having a width smaller than the width of the conductor 14 in at least a part in the thickness direction, and therefore the wiring pattern 15 depends on the material and the thickness. It is possible to keep the direction of “warping” constant. Therefore, a stable connection can be obtained. In addition, since the direction and amount of “warp” can be controlled by structural parameters of the reinforcing film 13, the degree of freedom of material and thickness, which are important parameters in terms of performance of the connecting member 10, is increased. Further, the taper surfaces 13a and 13d can be realized by using anisotropy of etching such as a polyimide film or by cutting with laser light. In any method, it goes without saying that the parameters of the width and taper angle of the reinforcing film 13 can be controlled.

  The present invention is not limited to the above-described embodiment, and a part or all of the present invention can be described as in the following supplementary notes, but is not limited thereto.

(Appendix 1)
A base material 11, a mediator layer 12 made of an adhesive or an adhesive disposed on the base material 11, a wiring pattern-shaped reinforcing film 13 disposed on the mediator layer 12, and the reinforcement In the connecting member 10 including the conductor 14 disposed on the film 13 and electrically connected to the connection object, the reinforcing film 13 has at least part of the thickness direction A1 of the conductor 14. A connecting member having a processed surface that is smaller than the width.

(Appendix 2)
The connection member 10 according to appendix 1, wherein the processed surface is provided on both end surfaces that define the width of the reinforcing film 13.

(Appendix 3)
The connecting member 10 according to appendix 1 or 2, wherein the processed surfaces are tapered surfaces 13a and 13d.

(Appendix 4)
The connection member 10 according to any one of appendices 1 to 3, wherein the reinforcing film 13 has a shape that decreases in width as it approaches the mediator layer 12.

(Appendix 5)
The connection member 10 according to any one of appendices 1 to 3, wherein the reinforcing film 13 has a shape that increases in width as it approaches the mediator layer 12.

(Appendix 6)
The connection member 10 according to any one of appendices 1 to 5, wherein the reinforcing film 13 has at least the same width as the conductor 14 on a surface in contact with the conductor 14.

(Appendix 7)
The connection member 10 according to any one of appendices 1 to 5, wherein the reinforcing film 13 has a narrower width than the conductor 14 on a surface in contact with the conductor 14.

(Appendix 8)
The connecting member 10 according to appendix 7, wherein a surface of the conductor 14 facing the reinforcing film 13 is exposed on both sides in the width direction of the reinforcing film 13.

DESCRIPTION OF SYMBOLS 1 Base material 2 Mediator agent layer 3 Reinforcement film 4 Conductor 4a Conductor 4b Conductor 10 Connection member 11 Base material 12 Mediator agent layer 13 Reinforcement film 13a Tapered surface 13b Surface 13c Surface 14 Conductor 14a Surface 15 Wiring pattern 30 Connection object Object α Taper angle w1 to w6 Width A1 Width direction A2 Thickness direction

Claims (8)

  A substrate, a mediator layer made of an adhesive or an adhesive disposed on the substrate, a wiring pattern-shaped reinforcing film disposed on the mediator layer, and disposed on the reinforcing film In the connecting member including the conductor that is electrically connected to the connection object, the reinforcing film has a processed surface that makes at least a part of the thickness direction smaller than the width of the conductor. A connection member characterized by that.   The connection member according to claim 1, wherein the processed surface is provided on both end surfaces defining a width of the reinforcing film.   The connection member according to claim 1, wherein the processed surface is a tapered surface.   The connecting member according to claim 1, wherein the reinforcing film has a shape that decreases in width as it approaches the mediator layer.   The connecting member according to claim 1, wherein the reinforcing film has a shape that increases in width as it approaches the mediator layer.   The connection member according to claim 1, wherein the reinforcing film has at least the same width as the conductor on a surface in contact with the conductor.   The connecting member according to claim 1, wherein the reinforcing film has a width narrower than that of the conductor on a surface in contact with the conductor.   The connection member according to claim 7, wherein surfaces of the conductor facing the reinforcing film are exposed on both sides of the reinforcing film in the width direction.

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