JP5869399B2 - Channel member, heat exchanger using the same, and semiconductor device - Google Patents

Description

  The present invention relates to a flow path member, a heat exchanger using the same, and a semiconductor device.

  In recent years, with the rapid spread of hybrid vehicles and electric vehicles, semiconductor devices called power modules such as inverter devices and AC-DC power converters have come to be frequently used.

  Such semiconductor devices are not limited to in-vehicle use, and many of them repeatedly switch large currents to a high temperature. Therefore, forced cooling is required in order not to deteriorate the function of the semiconductor element.

  Patent Document 1 discloses that in a ceramic circuit board having a circuit board on which a semiconductor component is mounted, a void portion serving as a refrigerant flow path is formed in the circuit board on which the semiconductor component is mounted.

Japanese Patent Laid-Open No. 2002-329938

  However, since the circuit board of Patent Document 1 is entirely made of the same ceramic, it is easily affected by heat at a place where a semiconductor component is mounted. For this reason, there is a problem that the temperature of the entire circuit board is likely to rise, and the heat exchange efficiency between the heat and fluid generated by the electronic component is likely to be lowered.

  The present invention has been devised in order to solve the above-mentioned problems, a flow path member that suppresses a decrease in heat exchange efficiency and suppresses the influence of heat of the flow path member, a heat exchanger using the same, and An object of the present invention is to provide a semiconductor device.

The flow path member of the present invention includes a lid portion, a side wall portion made of an inflexible material, and a bottom plate portion made of a resin material that is a flexible material, and the lid portion, the side wall portion, and the bottom plate portion. And a flow path through which fluid flows, and the thermal conductivity of the lid and the side wall is higher than the thermal conductivity of the bottom plate.
In addition, a side wall portion and a bottom plate portion comprising a lid body and a laminate of ceramics,
The lid body part, the side wall part, and the bottom plate part constitute a flow path through which fluid flows, and the thermal conductivity of the lid body part and the side wall part is higher than the thermal conductivity of the bottom plate part. It is characterized by being high.

  Moreover, the heat exchanger of this invention is equipped with the flow-path member of the said structure, and the metal member provided on the said cover body part of the said flow-path member, It is characterized by the above-mentioned.

  The semiconductor device of the present invention is characterized in that a semiconductor element is provided on the metal member of the heat exchanger having the above-described configuration.

According to the flow path member of the present invention, when an electronic component is mounted on the lid portion of the flow path member, heat lid portion has received heat is transferred efficiently side wall, the lid portion and the side wall portion Since heat exchange with the fluid can be performed, reduction in heat exchange efficiency with the fluid can be suppressed.

  Moreover, since the heat exchanger of this invention is equipped with the flow path member of the said structure and the metal member provided on the said cover body part of the said flow path member, it is a metal member by a cover body part and a side wall part. The heat exchange with can be performed efficiently, and a heat exchanger with high heat exchange efficiency can be obtained.

  In addition, the semiconductor device of the present invention is a semiconductor device capable of suppressing the temperature rise of the semiconductor element with a simple structure because the semiconductor element is provided on the metal member of the heat exchanger having the above-described configuration. Can do.

An example of the flow path member of this embodiment is shown, (a) is a perspective view of the flow path member, and (b) is a partial cross-sectional view taken along line XX shown in (a). Another example of the flow path member of the present embodiment is shown, and (a) to (c) are partial cross-sectional views in which a portion corresponding to a C portion surrounded by a broken line in FIG. Another example of the flow path member of the present embodiment is shown, (a) is a perspective view of the flow path member, and (b) is a plan view in which the side wall portion of the laminate is disassembled. FIG. 4 shows still another example of the flow path member of the present embodiment, and (a) is a side view of a state in which the lid part, the side wall part, and the bottom plate part constituting the flow path member are fastened with screws, b) is a side view of a state where it is fastened by a caulking member. It is a perspective view of the heat exchanger which provides an example of the heat exchanger of this embodiment, and provides a metal member on the cover part of a flow-path member. It is a perspective view of the semiconductor device which provides an example of the semiconductor device of this embodiment, and provides a semiconductor element on the metal member of a heat exchanger.

  Embodiments of the present invention will be described below.

  An example of an embodiment of the flow path member of the present invention will be described with reference to FIG.

  1A and 1B show an example of a flow path member of the present embodiment. FIG. 1A is a perspective view of the flow path member, and FIG. 1B is a partial cross-sectional view taken along line XX shown in FIG. FIG. 1 shows a flow path member having a plurality of flow paths inside.

  As shown in FIGS. 1A and 1B, the flow path member 1 of the present embodiment includes a lid portion 2, a side wall portion 3, and a bottom plate portion 4, and the lid portion 2, the side wall portion 3 and the bottom plate. The part 4 constitutes a flow path 5 for flowing a fluid such as a gas or a liquid therein.

  And according to the flow path member 1 of this embodiment, since the heat conductivity of the cover body part 2 and the side wall part 3 is higher than the bottom plate part 4, for example, the cover body part 2 of the flow path member 1 has electrons. Even when the component is mounted and the place where the bottom plate portion 4 is placed becomes high temperature, the side plate is less affected by the heat received by the bottom plate portion 4 and the heat received by the lid portion 2 from the electronic component is efficiently 3, heat can be exchanged with the fluid between the lid 2 and the side wall 3. Thereby, the flow path member 1 which suppressed that the heat exchange efficiency with a fluid falls can be provided.

  Moreover, in the flow path member 1 of this embodiment, when there are a plurality of flow paths 5, the flow path member 1 includes partition walls 3 b that partition the flow paths 5, and the partition walls 3 b may have the same mode as the side walls 3. .

And as a material of the cover body part 2, the side wall part 3, and the baseplate part 4, it can produce with the combination of ceramics, resin, or a metal, these composites, a porous body, etc.

  Table 1 shows types of materials that can be used in the present embodiment and combinations of specific materials. 1 is that the lid 2 and the side wall 3 are ceramics, the bottom plate 4 is resin, the group No. 2 is a ceramic, group No. 2 for both the lid 2, the side wall 3 and the bottom plate 4. 3 is a resin, group No. 3 for both the lid 2, the side wall 3 and the bottom plate 4. 4, the lid 2 and the side wall 3 are metal, the bottom plate 4 is ceramic, and the group no. Reference numeral 5 denotes a combination of metals for the lid part 2, the side wall part 3 and the bottom plate part 4, and as a specific example, materials shown in Table 1 can be used.

  As shown in Table 1, in the flow path member 1 in the present embodiment, the thermal conductivity of the material constituting the lid part 2 and the side wall part 3 for each group is the thermal conductivity of the material constituting the bottom plate part 4. The ones that are higher than the rate are listed.

  As a specific example, for example, Group No. 2, both the lid part 2, the side wall part 3 and the bottom plate part 4 are made of ceramics, but as a material that can be used for the lid part 2 and the side wall part 3, aluminum nitride having a high thermal conductivity is used. Examples of zirconia / alumina with low thermal conductivity are shown, and examples of materials that can be used as the bottom plate part 4 to be combined with these are alumina (alumina content 95-99.8% by mass) to porous ceramics or resin composite ceramics. ing.

And each material of the cover part 2, the side wall part 3, and the bottom plate part 4 of the flow path member 1 of the present embodiment is such that the thermal conductivity of the material constituting the cover part 2 and the side wall part 3 is the bottom plate part 4. Can be used in appropriate combination so as to be higher than the thermal conductivity of the material constituting the. For example, the lid part 2
When zirconia / alumina is used as the material of the side wall part 3, the material of the bottom plate part 4 may be zirconia, porous ceramics, or resin composite ceramics.

  In addition, group No. The material shown in 2 is a material that has high heat resistance, mechanical strength, and corrosion resistance, and can suppress damage to the flow path even when exposed to a liquid such as an acid and an alkali in a high temperature environment.

  The lid part 2, the side wall part 3 and the bottom plate part 4 of the flow path member 1 are produced as a combination of such materials. For example, the bottom plate part 4 of the flow path member 1 is used as a heat source above the vicinity of the engine of the automobile. When disposed so as to be close to each other, the thermal conductivity of the lid body portion 2 and the side wall portion 3 is higher than the thermal conductivity of the bottom plate portion 4, so that it is not easily affected by the heat received by the bottom plate portion 4, The heat received by the lid part 2 from the electronic component is efficiently transferred to the side wall part 3, and the lid part 2 and the side wall part 3 can exchange heat with the fluid. Thereby, the flow path member 1 which suppressed that the heat exchange efficiency with a fluid falls can be provided.

  Further, when a plurality of flow paths are configured by providing the partition walls 3 b that partition the flow path 5, the side wall portions 3 and the partition walls 3 b preferably have higher thermal conductivity than the lid body portion 2. With such a configuration, when a heat exchange object such as an electronic component is mounted on the lid 2, the heat received by the lid 2 is transferred by the partition 3 b and the side wall 3. Therefore, heat exchange with the fluid flowing through the flow path 5 can be performed efficiently. Further, as the configuration of the flow path member 1, the thermal conductivity of the side wall 3 and the partition wall 3b is such that the thermal conductivity of the partition wall 3b is less affected by the heat from the surroundings. It is preferable that the thermal conductivity is higher.

In particular, when the temperature of the use environment or the heat exchange target is high temperature (300 ° C. or higher), the material of the side wall 3 and the bottom plate 4 is preferably ceramic or metal. If the temperature is lower (less than 300 ° C.), it is preferable to use a resin in addition to ceramics and metals.

  In addition, when it is required to reduce the weight of the flow path member 1, a porous ceramic or resin may be used. For example, as a flow path member of an in-vehicle IGBT, conventionally, a metal is mainly used. However, considering heat resistance, corrosion resistance, and weight reduction, it is preferable to use porous ceramics, resin composite ceramics, resin, or porous resin for at least a part of the flow path member.

  Further, when a heat exchange object such as a semiconductor element is mounted directly on the lid part 2, if the material constituting the lid part 2 is a ceramic that can directly form a wiring layer, it is a metal. In comparison, since there is no need to interpose an insulator, a simple structure can be achieved.

  FIG. 2 shows another example of the flow path member of the present embodiment, and (a) to (c) are partial cross-sectional views in which a portion corresponding to a C portion surrounded by a broken line in FIG. 1 (b) is enlarged. is there.

  In the flow path member 1 of the present embodiment, it is preferable that the side wall portion 3 is made of an inflexible material and the bottom plate portion 4 is made of a flexible material. By adopting such a configuration, in the assembly process of the flow path member 1, when the lid body portion 2, the side wall portion 3, and the bottom plate portion 4 are joined, pressurization is performed by screw tightening or the like, so that FIG. As shown, the non-flexible side wall 3 bites into and joins the bottom plate 4 that is more flexible than the side wall 3.

That is, the side wall portion 3 bites into the bottom plate portion 4 by pressure bonding without forming a concave or convex shape in advance in the joint portion 8 between the side wall portion 3 and the bottom plate portion 4, and enters the flow path 5. A part of the inner surface 3 a of the side wall portion 3 that comes into contact with the bottom plate portion 4 becomes the joint portion 8. The flow path member 1 produced in this way
Even if thermal stress is generated by repeated use, it is possible to suppress the occurrence of a gap in the joint portion 8 between the side wall portion 3 and the bottom plate portion 4. Thereby, even if a high-pressure fluid is allowed to flow through the flow path 5, the flow path member 1 is not easily destroyed, and the flow path member 1 with high sealing performance can be obtained.

  Further, as shown in (b), the bottom plate part 4 is partially convex adjacent to the joint 8 between the bottom plate part 4 and the side wall part 3 so as to be in contact with the inner surface 3a. As shown, the bottom plate portion 4 side of the joint portion 8 between the bottom plate portion 4 and the side wall portion 3 has a concave shape, or the tip on the side wall portion 3 side has a convex shape, and these side wall portions 3, bottom plate portion 4, and lid When the part 2 is pressed and joined, the amount of biting in the joint part 8 with the bottom plate part 4 of the side wall part 3 increases. As a result, the flow path member 1 having higher sealing properties and less risk of breakage can be obtained.

  Here, the flexible material of the bottom plate portion 4 includes a resin material or a metal material, and the non-flexible material of the side wall portion 3 includes a highly rigid ceramic or resin when the bottom plate portion 4 is a resin material. Composite ceramics or metal materials can be used. Further, when the bottom plate portion 4 is made of an aluminum-based metal material, a metal material such as copper or a copper alloy or ceramics can be used for the side wall portion 3.

  Moreover, in the flow path member 1 of this embodiment, when there are a plurality of flow paths 5, the partition walls 3b constituting each flow path 5 are the same as the side wall portions 3, and part of the inner surface of the partition walls 3b It is preferable to be in contact with the bottom plate part 4. Thereby, in the flow path member having the plurality of flow paths 5, it is possible to suppress the breakage of the joint portion 8 between the partition wall 3 b and the bottom plate portion 4 between the adjacent flow paths 5. In addition, the thickness (width) of the partition wall 3b of the flow path 5 can be reduced, and the flow path member 1 having high heat exchange efficiency can be obtained.

  Moreover, it is preferable that the flow path member of this embodiment uses a resin material as a flexible material of the bottom plate part 4. Thus, when the lid part 2, the side wall part 3, and the bottom plate part 4 are pressure-bonded using the side wall part 3 made of ceramics or metal material, the side wall part 3 is a flexible resin material. Therefore, a part of the inner surface 3 a of the side wall portion 3 is covered with the bottom plate portion 4. Thereby, even if a thermal stress is repeatedly applied to the flow path member 1, it is possible to suppress the formation of a gap in the joint portion 8. 1 can be used.

Further, if the bottom plate portion 4 is formed of a resin material, the thermal conductivity of the resin material is 1/2000 to 1 compared to the thermal conductivity of a metal such as copper or a ceramic such as silicon carbide or aluminum nitride. For example, when the flow path member 1 is provided so as to come into contact with the upper surface of the heating element, the bottom plate portion 4 picks up the heat of the heating element. Can be suppressed. Thereby, it can suppress that the heat of a heat generating body is transmitted to the baseplate part 4, affects a fluid, and heat exchange with the heat received from the electronic component and a fluid falls, and it is set as the flow path member 1 with high heat exchange efficiency. be able to.

  Here, as a resin material used for the baseplate part 4, POM (polyoxymethylene), ABS (acrylonitrile butadiene styrene), nylon, PP (polypropylene), PE (polyethylene), PMMA (polymethyl methacrylate), PET (polyethylene terephthalate), polyetherimide resin, polybutylene terephthalate resin, polyamide resin, polyphenylene sulfide (PPS) resin, polyphenylene ether resin, PEEK (polyether ether ketone), polyphenylene ether resin-styrene There are resin-polyamide resin mixed resin, fluorine resin, polycarbonate (PC) resin, etc., but PPS resin and PEEK having high heat resistance and corrosion resistance are preferable, more preferably high heat resistance. It is a C-based resin.

  3A and 3B show still another example of the flow path member of the present embodiment, in which FIG. 3A is a perspective view of the flow path member, and FIG. 3B is a plan view in which a side wall portion of the laminate is exploded.

  As shown in FIG. 3A, the flow path member 21 of the present embodiment includes a plurality of plate-like bodies 7 (here, the side wall part 3 interposed between the lid part 2 and the bottom plate part 4 is made of ceramic green sheets). Then, the example which consists of the plate-shaped body 7 of 3 layers is shown.) It consists of the laminated body which was laminated | stacked and baked.

  By forming the side wall portion 3 in such a laminated structure, the complicated flow path 5 can be easily formed, and the flow path member 21 having high heat resistance, corrosion resistance, and pressure resistance is provided. can do.

  For example, if the channel 5 has a simple shape, it can be easily processed by extrusion molding or the like, but the shape when the channel 5 is viewed in plan is a complicated shape such as a wavy line shown in FIG. In this case, it cannot be processed by extrusion, and it may be difficult to ensure heat resistance, corrosion resistance and pressure resistance even when the width between the flow paths 5 is narrow. Therefore, when the flow channel 5 having such a shape is to be provided, a plate-like body 7 in which a through hole 5a to be a desired flow channel 5 is formed is laminated on a flat plate of an unfired ceramic green sheet. And then firing.

  FIG. 4 shows still another example of the flow path member of the present embodiment, and (a) is a side view of the state in which the lid portion, the side wall portion, and the bottom plate portion constituting the flow path member are fastened with screws. b) is a side view of a state where it is fastened by a caulking member.

  The flow path member 31 shown in FIG. 4A is formed by sandwiching a packing 11 between the lid body part 2, the side wall part 3 and the bottom plate part 4, opening a screw hole 9 in these parts, and laminating with screws 10 The lid portion 2, the side wall portion 3, and the bottom plate portion 4 are screwed together. In the flow path member 41 shown in FIG. 4B, both end portions in the longitudinal direction of the lid portion 2, the side wall portion 3, and the bottom plate portion 4 are joined by the caulking material 12.

  In the above description, the example in which the side wall portion 3 is obtained by laminating and firing the ceramic green sheet plate bodies 7 is shown. However, the individual plate bodies 7 are fired and the ceramic plates are overlapped, and the lid body. These may be sandwiched between the portion 2 and the bottom plate portion 4 and joined and fixed together by screwing or caulking members. However, in this case, it is necessary to sandwich the packing 11 between the plate-like bodies 7. In addition, a brazing material may be used for joining the metal material and the ceramic. When the lid portion 2 and the side wall portion 3 are made of ceramic, each joint portion 8 is joined by an unfired molded body. It is more preferable to apply the same slurry as that used when producing the ceramic green sheet as an adhesion liquid, laminate, pressurize, and fire at a predetermined temperature for integration.

  Further, the green body of the lid portion 2 and the side wall portion 3 may be made of different ceramics. In this case, the sintering temperature of the adhesion liquid is intermediate between the sintering temperatures of the ceramics. If it becomes, it can reduce problems, such as a fall of joint strength.

  Here, the packing 11 is preferably made of fluorine rubber, silicone rubber, acrylic rubber, butyl rubber, or the like that has high heat resistance and corrosion resistance.

  Next, the heat exchanger of this embodiment is demonstrated using FIG.

  FIG. 5 is a perspective view of a heat exchanger in which a metal member is provided on the lid portion of the flow path member, showing an example of the heat exchanger of the present embodiment.

The heat exchanger 101 of the present embodiment has a metal member 102 on the upper surface of the lid portion 2 of the flow path member 1 of the present embodiment.
Is provided. Thereby, heat exchange between the lid 2 and the metal member 102 can be performed efficiently, and the heat exchanger 101 with high heat exchange efficiency can be obtained.

  Next, the semiconductor device of this embodiment will be described with reference to FIG.

  FIG. 6 is a perspective view of a semiconductor device in which a semiconductor element is provided on a metal member of a heat exchanger, showing an example of the semiconductor device of this embodiment.

Since the semiconductor device 201 of the present embodiment has the semiconductor element 202 mounted on the heat exchanger 101 of the present embodiment, the heat received by the bottom plate portion 4 even when the place where the bottom plate portion 4 is placed becomes high temperature. The heat received by the lid part 2 from the electronic component through the metal member 102 is efficiently transferred to the side wall part 3, and the lid part 2 and the side wall part 3 can exchange heat with the fluid. Thereby, it is possible to suppress the heat exchange efficiency with the fluid from being lowered, and to obtain the semiconductor device 201 capable of efficiently reducing the temperature of the semiconductor element 202.

Moreover, even when the thermal stress is repeatedly applied from the semiconductor element 202 itself or from the outside, the heat exchanger that can absorb and reduce the thermal stress is used. Therefore, it is possible to suppress deterioration of the function of the semiconductor element 202.

Further, in the examples of the heat exchanger 101 and the semiconductor device 201 in FIGS. 5 and 6, an example in which the metal member 102 is directly provided on the upper surface of the lid body portion 2 is described, but the lid body portion 2 is insulated. If it is made of a material having low properties, it is highly heat-resistant, such as polyimide (such as a ceramic thin plate or an aluminum thin plate in which an aluminum oxide film is formed by electrolytic treatment of aluminum). A metal member coated with a high resin, glass coating, or the like) may be used by interposing between the lid part 2 and the metal member 102.

1, 21, 31, 41: Channel member 2: Cover part 3: Side wall part, 3a: Inner surface, 3b: Partition wall 4: Bottom plate part 5: Channel, 5a: Through hole 7: Plate body 8: Joint part 9: Screw hole
10: Screw
11: Packing
12: Caulking material
101: Heat exchanger
102: Metal parts
201: Semiconductor device
202: Semiconductor element

Claims (4)

A lid portion, a side wall portion made of an inflexible material, and a bottom plate portion made of a resin material that is a flexible material ;
The lid body part, the side wall part, and the bottom plate part constitute a flow path through which fluid flows, and the thermal conductivity of the lid body part and the side wall part is higher than the thermal conductivity of the bottom plate part. A channel member characterized by being high. A side wall portion and a bottom plate portion comprising a lid body and a laminate of ceramics are provided,
The lid body part, the side wall part, and the bottom plate part constitute a flow path through which fluid flows, and the thermal conductivity of the lid body part and the side wall part is higher than the thermal conductivity of the bottom plate part. A channel member characterized by being high. A heat exchanger comprising the flow path member according to claim 1 or 2 and a metal member provided on the lid portion of the flow path member. A semiconductor device, wherein a semiconductor element is provided on the metal member of the heat exchanger according to claim 3 .

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