JP5864430B2 - Moisture curable reactive hot melt adhesive composition - Google Patents

Description

  The present invention relates to a moisture curable reactive hot melt adhesive useful as a moisture curable reactive hot melt adhesive, and more specifically, useful as a moisture curable reactive hot melt adhesive having excellent thermal stability at high temperatures. The present invention relates to a moisture curable reactive hot melt adhesive.

  In general, hot melt adhesives have a high bonding speed, can automate production lines and can be omitted, and are widely used from the viewpoint of environmental compatibility because they are solvent-free. However, since the hot melt adhesive melts by heat and solidifies by cooling and develops an adhesive force, the adhesiveness at a high temperature is particularly limited, and the range of use is limited.

  Therefore, in recent years, as a means for improving the problems of hot melt adhesives, development of reactive hot melt adhesives using a crosslinking reaction after bonding has been actively conducted. A typical example is a urethane-based reactive hot melt adhesive that has a prepolymer having an isocyanate group in the molecule as a main component and has improved heat resistance using a crosslinking reaction of the isocyanate group after bonding. Are known. However, urethane-based reactive hot melt adhesives use highly toxic isocyanate compounds, and there is a problem that they volatilize during the manufacturing process and use of the adhesive. Accordingly, a reactive hot melt adhesive using a polymer having a reactive silicon group has been developed as a reactive hot melt adhesive excluding an isocyanate compound.

 For example, Patent Documents 1 and 2 disclose reactive hot-melt adhesives using such a polymer having a reactive silicon group. Patent Document 1 describes that a reactive hot-melt adhesive having excellent heat-resistant adhesion can be obtained from an oxyalkylene polymer having a reactive silicon group and a (meth) acrylic acid alkyl ester (co) polymer. ing. Patent Document 2 describes that a reactive hot-melt adhesive excellent in general-purpose adhesive and heat-resistant adhesiveness can be obtained from a polymer having a reactive silicon group and a room temperature solidifying resin.

 On the other hand, as described in Patent Document 3, a reactive hot-melt adhesive is required to have a balance between stability upon heating (not increasing viscosity and further not curing) and curability at room temperature. However, each of the compositions described in Patent Documents 1 and 2 has a defect that the stability during heating is not sufficient. That is, the reactive hot melt adhesive needs to be heated and melted before coating, but at that time, the silyl group reacts to increase the viscosity of the composition or gel. In particular, when coating is performed with a die coater, a gelled component is formed at the coated portion, which may cause defective coating or clogging of the line. In addition, when heating is performed in the atmosphere (in the presence of moisture) such as roll coating, the tendency is particularly remarkable, and gelation may occur on the roll. As a method for solving such a problem, for example, means such as reducing the amount of the curing catalyst, but in that case, the curing reaction after coating becomes slow, and it takes time until practical strength is obtained, Or there existed a problem that hardening reaction itself stopped on the way and sufficient adhesive strength was not acquired.

 As described above, a reactive hot melt adhesive using a polymer having a reactive silicon group with low toxicity, and a composition that has both thermal stability at the time of heat melting and curability at room temperature after coating, The current situation has not been obtained so far.

JP-A-4-335080 JP-A-6-271834 JP 7-258620 A

 An object of the present invention is a moisture-curable reactive hot melt adhesive using a polymer having a reactive silicon group with low toxicity, and has sufficient thermal stability at the time of heating and melting, and after coating, It is an object of the present invention to provide a moisture curing type reactive hot melt adhesive useful as a reactive hot melt adhesive that rapidly cures even at room temperature. Another object of the present invention is to provide a moisture-curable reactive hot melt adhesive that has sufficient thermal stability when heated and melted and can be applied with a die coater or a roll coater.

  As a result of intensive studies to solve the above problems, the present inventor has sufficient thermal stability at the time of heating and melting by combining a polymer having a reactive silicon group and a specific silane coupling agent. In addition, the present inventors have found that a moisture-curable reactive hot melt adhesive useful as a reactive hot melt adhesive that rapidly cures even at room temperature after coating can be obtained, thereby completing the present invention.

That is, the present invention
(1). (A) an organic polymer having a reactive silicon group represented by the following general formula (1), (B) a solid resin at room temperature, and (C) a reactive silicon group represented by the following general formula (2). A moisture curable reactive hot melt adhesive composition, comprising a silane coupling agent, (D) a curing catalyst,
-SiR ¹ _3-a X _a (1)
(In the formula, each R ¹ is independently at least one selected from the group consisting of an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms. X Is a hydroxyl group or a hydrolyzable group, a is 1, 2 or 3.)
-SiR ¹ X ₂ (2)
(Wherein R ¹ and X are the same as above)
(2). (B) The solid resin at normal temperature is (B-1) (meth) acrylic acid alkyl ester-based (co) polymer and / or (B-2) a tackifying resin. The moisture curable reactive hot melt adhesive composition according to the description,
(3). (C) The moisture curable reactive hot melt adhesive composition according to any one of (1) and (2), wherein the silane coupling agent having a reactive silicon group further has an amino group,
(4). (C) The moisture-curable reactive hot melt according to any one of (1) to (3), wherein the reactive silicon group of the silane coupling agent having a reactive silicon group is an alkyldimethoxysilyl group Adhesive composition,
(5). The reactive silicon group of the organic polymer (A) having a reactive silicon group is represented by the general formula (1), and a is 1 or 2, wherein (1) to (4) Moisture curable reactive hot melt adhesive composition according to any of the above,
(6). (B) The moisture-curable reactive hot melt according to any one of (1) to (5), wherein the resin solid at normal temperature has a reactive silicon group represented by the following general formula (1): Adhesive composition,
-SiR ¹ _3-a X _a (1)
(Wherein R ¹ and X are the same as above)
(7). (B) Any of (1) to (6), wherein the resin solid at normal temperature has a reactive silicon group represented by the general formula (1), and a is 1 or 2 Moisture curable reactive hot melt adhesive composition according to
(8). Furthermore, it contains a silane coupling agent having a reactive silicon group represented by the following general formula (3) as component (E), and the content thereof is a total amount of component (A) and component (B-1) 100. The moisture-curable reactive hot melt adhesive composition according to any one of (2) to (7), wherein the moisture-curable reactive hot melt adhesive composition is less than 5 parts by weight with respect to parts by weight,
-SiX ₃ (3)
(X is a hydroxyl group or a hydrolyzable group.)
(9). The moisture-curable reactive hot melt adhesive composition according to any one of (1) to (8), wherein the pot life at 120 ° C. is 30 minutes or more,
(10). The moisture curable reactive hot melt adhesive composition according to any one of (1) to (9) is used for a die coater or a roll coater. Hot melt adhesive composition,
(11). The moisture-curable reactive hot melt adhesive composition according to any one of (1) to (9) is applied to a substrate after being heated at 90 ° C to 140 ° C for 30 minutes or more. Application method of the composition,
About.

  According to the present invention, a moisture curable reactive hot melt adhesive that is compatible as a heat curable reactive hot melt adhesive that has both thermal stability during heating and melting at room temperature after coating and is less toxic Can be provided.

  The moisture-curable reactive hot melt adhesive of the present invention contains an organic polymer (A) having a reactive silicon group as an essential component. Here, the reactive silicon group is an organic group having a hydroxyl group or a hydrolyzable group bonded to a silicon atom.

  The organic polymer (A) having a reactive silicon group has a characteristic that a siloxane bond is formed by a reaction accelerated by a silanol condensation catalyst and is crosslinked.

  The main chain skeleton of the organic polymer (A) having a reactive silicon group is not particularly limited, and a conventionally known main chain skeleton can be used.

 As an example thereof, an oxyalkylene polymer having a repeating unit represented by —R—O— (R represents a divalent alkylene group having 2 to 4 carbon atoms) will be described below.

The R is not particularly limited as long as it is a divalent alkylene group having 2 to 4 carbon atoms, and for example, —CH ₂ —, —CH ₂ CH ₂ —, —CH (CH ₃ ) CH ₂ —, —CH ( C ₂ H ₅ ) CH ₂ —, —CH ₂ CH ₂ CH ₂ CH ₂ —, —C (CH ₃ ) ₂ CH ₂ — and the like. Among these, —CH (CH ₃ ) CH ₂ — is preferable because it is easily available. The oxyalkylene polymer may be composed of only one type of repeating unit or may be composed of a plurality of types of repeating units.

  The oxyalkylene polymer may be linear or branched, or a mixture thereof. Further, the main chain skeleton may contain a repeating unit other than —R—O— (R represents a divalent alkylene group having 2 to 4 carbon atoms).

  In addition, the repeating unit other than —R—O— (R represents a divalent alkylene group having 2 to 4 carbon atoms) is preferably 80% by weight or less, and 50% by weight or less in the polymer. Is more preferable. Further, the repeating unit represented by -ROO (R represents a divalent alkylene group having 2 to 4 carbon atoms) is preferably present in the polymer in an amount of 50% by weight or more, and is present in an amount of 80% by weight or more. More preferably.

The production method of the main chain skeleton of the oxyalkylene polymer is not particularly limited. For example, (a1) initiators such as dihydric alcohols, polyhydric alcohols, various oligomers having a hydroxyl group, and alkalis such as KOH and NaOH. Ring-opening polymerization of monoepoxides such as ethylene oxide and propylene oxide in the presence of known catalysts such as catalysts, acidic catalysts, composite metal cyanide complex catalysts such as aluminoporphyrin metal complexes and cobalt zinc zinc-glyme complex catalysts How to get by,
(A2) A chain extension reaction of a hydroxyl group-terminated polyether polymer with a bifunctional or higher alkyl halide such as CH ₂ Cl ₂ or CH ₂ Br _{2 in} the presence of a basic compound such as KOH, NaOH, KOCH ₃ , or NaOCH ₃ And a method obtained by subjecting a hydroxyl group-terminated polyether polymer to a chain extension reaction with a compound having two or more isocyanate groups.

  Among these, ring-opening polymerization of monoepoxide using a double metal cyanide complex catalyst in the method (a1) is preferable because a polymer having a narrow molecular weight distribution and a low viscosity can be obtained.

The organic polymer (A) having a reactive silicon group has a reactive silicon group represented by the following general formula (1).
-SiR ¹ _3-a X _a (1)
(In the formula, each R ¹ is independently at least one selected from the group consisting of an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms. X Is a hydroxyl group or a hydrolyzable group, a is 1, 2 or 3).

  The hydrolyzable group represented by the general formula (1) X is not particularly limited and includes conventionally known hydrolyzable groups such as a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group. Group, amide group, aminooxy group, mercapto group and the like. Among these, alkoxy groups such as a methoxy group, an ethoxy group, a propoxy group, and an isopropoxy group are preferable because they are mildly hydrolyzable and easy to handle. The hydroxyl group and hydrolyzable group present in the reactive silicon group may be the same or different. Further, the number of silicon atoms in the reactive silicon group may be one or two or more. In the case of a reactive silicon group in which silicon atoms are linked by a siloxane bond or the like, about 20 may be used.

  Specific examples of the reactive silicon group represented by the general formula (1) include a dimethoxymethylsilyl group, a diethoxymethylsilyl group, a diisopropoxymethylsilyl group, a trimethoxysilyl group, a triethoxysilyl group, a triethoxysilyl group, and a triethoxysilyl group. An isopropoxysilyl group etc. are mentioned. Among these, dimethoxymethylsilyl group, trimethoxysilyl group, and triethoxysilyl group are preferable because they have high activity and good curability can be obtained. Further, when melted at high temperature in the atmosphere, gelled products are hardly generated. Therefore, the dimethoxymethylsilyl group is most preferable.

  The average number of reactive silicon groups in the organic polymer (A) is at least 0.8, preferably 0.8 to 3, and more preferably 0.8 to 2.0. When the average number of reactive silicon groups contained in one molecule of the polymer is 0.8 to 2.0, the balance between curability and the crosslinked structure is good, and the resulting cured product has good adhesion, It has mechanical properties.

  The reactive silicon group may be present at the molecular chain terminal of the organic polymer (A), or may be present inside, but when the reactive silicon group is present at the molecular chain terminal, good mechanical properties are obtained. It is preferable because a cured product that is expressed is easily obtained.

The method for introducing the reactive silicon group into the organic polymer is not particularly limited, and various methods can be used.
For example, the method shown below is mentioned.
(A) A method in which an organic polymer having a functional group such as a hydroxyl group, an epoxy group, or an isocyanate group in the molecule is reacted with a compound having a reactive functional group and a reactive silicon group.
(B) An organic polymer having an unsaturated group by reacting an organic polymer having a functional group such as a hydroxyl group in the molecule with an organic compound having an active group and an unsaturated group that are reactive with the functional group. Get. Alternatively, for example, a monomer having an unsaturated group that does not participate in the polymerization reaction, such as ring-opening copolymerization of an epoxide having an unsaturated group to obtain an unsaturated group-containing organic polymer when ring-opening polymerization of epoxide is performed to obtain an organic polymer Are copolymerized to obtain an organic polymer having an unsaturated group. Next, the resulting reactive organism is reacted with hydrosilane having a reactive silicon group for hydrosilylation.
(C) A method of reacting a compound containing a mercapto group and a reactive silicon group with an organic polymer containing an unsaturated group obtained in the same manner as in the method (b).

Further, among the methods (a), a method of reacting a polymer having a hydroxyl group at a terminal with a compound having an isocyanate group and a reactive silicon group, or a polymer having an isocyanate group at a terminal, an amino group and a reactive silicon group The method of reacting a compound having a high molecular weight is preferable because a high addition rate can be obtained in a relatively short reaction time. The oxyalkylene polymer obtained by such a reaction becomes a polymer having a group represented by the following general formula (4) together with a reactive silicon group.
—NR ² —C (═O) — (4)
(In the formula, R ² is at least one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.) .

  The organic polymer (A) having the group represented by the general formula (4) can be obtained by a method other than the above, for example, an aromatic isocyanate such as toluene (tolylene) diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate, etc. Diisocyanate compounds such as isophorone diisocyanate and hexamethylene diisocyanate; and —RO— (wherein R represents a divalent alkylene group having 2 to 4 carbon atoms). Examples thereof include those obtained from a chain extension reaction with a polyol. This is a polymer having a group of the general formula (4) regardless of the method for introducing a reactive silicon group.

  As a method of reacting a polymer having a hydroxyl group at a terminal with a compound having an isocyanate group and a reactive silicon group in the synthesis method (a), for example, the method disclosed in JP-A-3-47825 can be mentioned. There is no particular limitation. Specific examples of the compound having an isocyanate group and a reactive silicon group include, for example, γ-isocyanatopropyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, and γ-isocyanatepropylmethyldiethoxy. Although silane etc. are mentioned, it is not limited to these. Moreover, it does not specifically limit as a method with which the polymer which has an isocyanate group at the terminal, and the compound which has an amino group and a reactive silicon group are made, A conventionally well-known method can be used. Specific examples of the compound having an amino group and a reactive silicon group include N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane and N- (β-aminoethyl) -γ-aminopropyltrimethyl. Ethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-phenylaminopropyltrimethoxysilane, ureidopropyltriethoxysilane, N- (β-aminoethyl) -γ-aminopropylmethyldimethoxysilane , Γ-aminopropylmethyldiethoxysilane and the like, but are not limited thereto.

In the method (b), in order to introduce a reactive silicon group at a high introduction rate, a hydrosilane compound is converted into a group 8 transition metal catalyst into an organic polymer having an unsaturated group represented by the following general formula (5). A method of reacting in the presence of is preferable. Examples of the group 8 transition metal catalyst include H ₂ PtCl ₆ · H ₂ O, a platinum-vinylsiloxane complex, a platinum-olefin complex, and the like.
—O—R ⁴ —CR ³ ═CH ₂ (5)
(Wherein R ³ is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R ⁴ is an alkylene group having 0 to 20 carbon atoms).

In addition, it is more preferable that R < ³ > as described in General formula (5) is hydrogen or a methyl group. Specific examples of the hydrosilane compound include halogenated silanes such as trichlorosilane, methyldichlorosilane, dimethylchlorosilane, and phenyldichlorosilane; trimethoxysilane, triethoxysilane, methyldimethoxysilane, methyldiethoxysilane, Alkoxysilanes such as phenyldimethoxysilane; acyloxysilanes such as methyldiacetoxysilane and phenyldiacetoxysilane; ketoximatesilanes such as bis (dimethylketoximate) methylsilane and bis (cyclohexylketoximate) methylsilane However, it is not limited to these. Among these, since the hydrolysis of the composition from which alkoxysilanes are obtained is gentle and easy to handle, it is preferable.

  As a synthesis method of (c), for example, in the presence of a radical initiator and / or a radical generation source, a compound having a mercapto group and a reactive silicon group is introduced into an unsaturated bond site of an organic polymer by a radical addition reaction. However, it is not particularly limited. Specific examples of the compound having a mercapto group and a reactive silicon group include, for example, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, and γ-mercaptopropylmethyldiethoxysilane. However, it is not limited to these.

  Among the above methods, since the polymer obtained by the method (c) has a strong odor due to mercaptosilane, the method (a) or the method (b) is preferable. The methods (a) and (b) have advantages and disadvantages. The polyoxyalkylene polymer having a reactive silicon group obtained by the method (b) is a composition having a lower viscosity and better workability than the polymer obtained by the method (a), and a urethane bond, This is preferable in that it does not have an organic group that lowers heat resistance such as a urea bond, and further does not use a compound having an isocyanate group that is problematic in toxicity. On the other hand, the method (a) is preferable in that the introduction of a silyl group into the polymer can be prepared inexpensively and with good productivity. In addition, the oxyalkylene polymer obtained by the methods (a), (b), and (c) may be used singly or in combination of several kinds.

  The number average molecular weight of the oxyalkylene polymer (A) is preferably 10,000 to 100,000 in terms of polystyrene-reduced number average molecular weight (Mn) by gel permeation chromatography (GPC), and preferably 10,000 to 45,000. 000 is more preferable, and 15,000 to 30,000 is particularly preferable because of excellent balance between handling and physical properties such as adhesion and mechanical properties.

  Moreover, the ratio (Mw / Mn) of the weight average molecular weight (Mw) and the number average molecular weight (Mn) is not particularly limited, is preferably 2.0 or less, and more preferably 1.6 or less. Further, it is particularly preferably 1.4 or less because the viscosity becomes low and handling becomes easy.

  The molecular weight distribution can be measured by various methods, but a method by gel permeation chromatography (GPC) is generally used.

  The moisture-curable reactive hot melt adhesive of the present invention comprises (B) a resin that is a solid resin at room temperature (23 ° C.) as an essential component. The (B) resin that is solid at room temperature used in the present invention is not particularly limited as long as it is a resin that can be solidified by mixing with the component (A) that has fluidity at room temperature. You can choose. Among them, in particular, (B-1) (meth) acrylic acid alkyl ester-based (co) polymer and / or (B-2) tackifier resin is miscible with component (A) and other such as adhesiveness. It is preferable in securing the physical property balance.

(B-1) (Meth) acrylic acid alkyl ester-based (co) polymer (meth) acrylic acid alkyl ester-based (co) polymer (B-1) (hereinafter referred to as (co) polymer (B-1) Is a polymer composed of one (meth) acrylic acid alkyl ester compound as a repeating unit, and a copolymer composed of a plurality of (meth) acrylic acid alkyl ester compounds as a repeating unit. And a copolymer comprising one or a plurality of (meth) acrylic acid alkyl ester compounds as a repeating unit and a compound copolymerizable therewith. In addition, the description method “(meth) acrylic acid alkyl ester” refers to an acrylic acid alkyl ester and / or a methacrylic acid alkyl ester, and also has the same meaning in the subsequent description methods.

  The (meth) acrylic acid alkyl ester compound used as the repeating unit is not particularly limited and includes conventionally known compounds, such as methyl acrylate, ethyl acrylate, n-propyl acrylate, and n-acrylic acid. -Butyl, isobutyl acrylate, tert-butyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, decyl acrylate, undecyl acrylate, lauryl acrylate, tridecyl acrylate, myristyl acrylate, cetyl acrylate, acrylic Examples include stearyl acid, behenyl acrylate, and biphenyl acrylate.

  In addition, the methacrylic acid ester compound is not particularly limited, and examples thereof include conventionally known compounds, such as methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, methacrylic acid. Tert-butyl acid, n-hexyl methacrylate, 2-ethylhexyl methacrylate, decyl methacrylate, undecyl methacrylate, lauryl methacrylate, tridecyl methacrylate, myristyl methacrylate, cetyl methacrylate, stearyl methacrylate, behenyl methacrylate, methacryl Examples include acid biphenyl.

  The main chain skeleton of the (meth) acrylic acid alkyl ester-based (co) polymer (B-1) is substantially composed of one or two or more (meth) acrylic acid alkyl ester compounds. In particular, being composed of the above-mentioned compound means that the proportion of the repeating unit derived from the (meth) acrylic acid alkyl ester compound existing in the (co) polymer (B-1) exceeds 50%. Moreover, 70% or more of the ratio of the repeating unit derived from the (meth) acrylic-acid alkylester compound which exists in (co) polymer (B-1) is preferable.

  Further, among the (meth) acrylic acid alkyl ester compounds, from the viewpoint of compatibility and stability, the molecular chain is substantially (b-1) an alkyl (meth) acrylate having an alkyl group having 1 to 8 carbon atoms. A copolymer (hereinafter referred to as (co) polymer (B-1) -a) comprising an ester compound and (b-2) a (meth) acrylic acid alkyl ester compound having an alkyl group having 10 or more carbon atoms Are also preferred.

(B) The (meth) acrylic acid alkyl ester compound having an alkyl group having 1 to 8 carbon atoms in the (co) polymer (B-1) -a has the general formula (6):
CH ₂ = C (R ⁵ ) COOR ⁶ (6)
(Wherein R ⁵ represents a hydrogen atom or a methyl group, and R ⁶ represents an alkyl group having 1 to 8 carbon atoms).

R ⁶ in the general formula (6) is not particularly limited, and examples thereof include 1 to 1 carbon atoms such as a methyl group, an ethyl group, a propyl group, an n-butyl group, a t-butyl group, and a 2-ethylhexyl group. 8, preferably 1-4, more preferably 1-2 alkyl groups.

In addition, R < ⁶ > contained in (co) polymer (B-1) -a is not necessarily limited to one type of alkyl group.

Moreover, (b-2) the (meth) acrylic acid alkyl ester compound having an alkyl group having 10 or more carbon atoms in the (co) polymer (B-1) -a has the general formula (7):
CH ₂ = C (R ⁵ ) COOR ⁷ (7)
(Wherein R ⁵ is the same as in the general formula (6). R ⁷ represents an alkyl group having 10 or more carbon atoms.)

R ⁷ described in the general formula (7) is not particularly limited. For example, R ⁷ is a lauryl group, a tridecyl group, a cetyl group, a stearyl group, an alkyl group having 22 carbon atoms, a biphenyl group, or the like. Includes 10-30, preferably 10-20 long chain alkyl groups. In addition, R < ⁷ > contained in (co) polymer (B-1) -a is not necessarily limited to one type of alkyl group.

  The molecular chain of the (co) polymer (B-1) -a consists essentially of the compounds (b-1) and (b-2). -2) means that the proportion of the repeating unit derived from the compounds (b-1) and (b-2) present in the (co) polymer (B-1) -a exceeds 50%. Means.

  The ratio of the repeating units derived from the compounds (b-1) and (b-2) present in the (co) polymer (B-1) -a is preferably 70% or more. An organic polymer having a reactive silicon group when the proportion of repeating units derived from the compounds (b-1) and (b-2) present in the (co) polymer (B-1) -a is less than 50% The compatibility of (A) and (co) polymer (B-1) -a tends to be reduced and cloudy, and the adhesive properties of the cured product tend to be reduced.

  Moreover, the ratio of the repeating unit derived from the compounds (b-1) and (b-2) present in the (co) polymer (B-1) -a is a weight ratio (derived from (b-1) :( b-2)) is preferably 95: 5 to 40:60, more preferably 90:10 to 60:40. When the ratio is larger than 95: 5, the compatibility is lowered, and when it is smaller than 40:60, the cost tends to be disadvantageous.

  Furthermore, in addition to the repeating unit derived from the (meth) acrylic acid alkyl ester compound, the (co) polymer (B-1) may contain a repeating unit derived from a compound having copolymerizability with these. The compound having copolymerizability with the (meth) acrylic acid alkyl ester compound is not particularly limited. For example, acrylic acid such as acrylic acid and methacrylic acid; acrylamide, methacrylamide, N-methylol acrylamide, N-methylol methacrylamide Amide group such as, epoxy group such as glycidyl acrylate, glycidyl methacrylate, compounds containing amino group such as diethylaminoethyl acrylate, diethylaminoethyl methacrylate, aminoethyl vinyl ether; other acrylonitrile, styrene, α-methylstyrene, alkyl vinyl ether, vinyl chloride, And compounds derived from vinyl acetate, vinyl propionate, ethylene, and the like.

  Although there is no restriction | limiting in particular in the molecular weight of a (co) polymer (B-1) component, the thing of the number average molecular weight of 500-100,000 in polystyrene conversion in GPC is preferable, and the thing of 1,000-50,000 More preferably, those having a molecular weight of 2,000 to 20,000 are particularly preferred because they are easy to handle and have excellent adhesive properties.

  It does not specifically limit as a manufacturing method of (co) polymer (B-1), For example, the normal vinyl polymerization method, for example, the solution polymerization method by a radical reaction, the block polymerization method, etc. are mentioned. The reaction is usually carried out at 50 to 150 ° C. by adding the above-mentioned compound, radical initiator, chain transfer agent, solvent and the like.

  Examples of the radical initiator include azobisisobutyronitrile and benzoyl peroxide. Examples of the chain transfer agent include mercaptans such as n-dodecyl mercaptan, t-dodecyl mercaptan, and lauryl mercaptan, and halogen-containing compounds. Is mentioned. As the solvent, for example, non-reactive solvents such as ethers, hydrocarbons and esters are preferably used.

The (co) polymer (B-1) preferably has a reactive silicon group represented by the following general formula (1) because the cured product obtained has excellent adhesive strength and heat resistance.
-SiR ¹ _3-a X _a (1)
(In the formula, each R ¹ is independently at least one selected from the group consisting of an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms. X Is a hydroxyl group or a hydrolyzable group, a is 1, 2 or 3).

  Specific examples of the reactive silicon group represented by the general formula (1) include a dimethoxymethylsilyl group, a diethoxymethylsilyl group, a diisopropoxymethylsilyl group, a trimethoxysilyl group, a triethoxysilyl group, a triethoxysilyl group, and a triethoxysilyl group. An isopropoxysilyl group etc. are mentioned. Among these, dimethoxymethylsilyl group, trimethoxysilyl group, and triethoxysilyl group are preferable because they have high activity and good curability can be obtained. Further, when melted at high temperature in the atmosphere, gelled products are hardly generated. Therefore, the dimethoxymethylsilyl group is most preferable.

The method for introducing a reactive silicon group into the (co) polymer (B-1) is not particularly limited, and various methods are exemplified.
(D) a method of copolymerizing a compound having a polymerizable unsaturated bond and a reactive silicon group together with the compounds (b-1) and (b-2),
(E) After copolymerizing a compound having a polymerizable unsaturated bond and a reactive functional group (hereinafter referred to as Y ′ group) (for example, acrylic acid) together with the compounds (b-1) and (b-2), The resulting copolymer is reacted with a compound having a functional group (hereinafter referred to as Y ″ group) capable of reacting with a reactive silicon group and a Y ′ group (for example, a compound having an isocyanate group and a —Si (OCH ₃ ) group). How to
(F), a method of copolymerizing the compounds (b-1) and (b-2) in the presence of a mercaptan having a reactive silicon group as a chain transfer agent,
(G), a method of copolymerizing compounds (b-1) and (b-2) using an azobisnitrile compound or disulfide compound having a reactive silicon group as an initiator,
(H), a method in which the compounds (b-1) and (b-2) are polymerized by a living radical polymerization method, and a reactive silicon group is introduced into the molecular terminal.

  It is also possible to arbitrarily combine the methods (d) to (h). For example, as a combination of (d) and (f), a compound having a polymerizable unsaturated bond and a reactive silicon group in the presence of a mercaptan having a reactive silicon group as a chain transfer agent is added to the compound (b-1), It is also possible to take a method of copolymerizing with (b-2).

  The compound having a polymerizable unsaturated bond and a reactive silicon group described in (d) is not particularly limited, and examples thereof include γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, and γ-methacryloxy. Γ-acryloxypropylalkyl such as γ-methacryloxypropylalkyl polyalkoxysilane such as propyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, γ-acryloxypropylmethyldimethoxysilane, γ-acryloxypropyltriethoxysilane Examples thereof include vinylalkyl polyalkoxysilanes such as polyalkoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane, and vinyltriethoxysilane.

  Examples of the Y ′ group and Y ″ group described in (e) can be a combination of various groups. For example, as the Y ′ group, an amino group, a hydroxyl group, and a carboxylic acid group can be used as the Y ″ group. Mention may be made of isocyanate groups.

  As another example, as described in JP-A-62-70405, JP-A-09-272714, JP-A-59-168014, the Y ′ group is an allyl group, Y ″ Examples of the group include a silicon hydride group (H—Si). In this case, the Y ′ group and the Y ″ group can be bonded by a hydrosilylation reaction in the presence of a Group VIII transition metal.

  Examples of the mercaptan having a reactive silicon group used as the chain transfer agent described in (f) include γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, and γ-mercaptopropyltriethoxysilane. . Further, as described in JP-A-60-228516, the compounds (b-1) and (b-2) are made of a bifunctional radical polymerizable compound and a mercaptan having an alkoxysilyl group as a chain transfer agent. A method of copolymerization in the presence is also possible.

  Examples of the azobisnitrile compound or disulfide compound having a reactive silicon group described in (g) include alkoxysilyl compounds described in, for example, JP-A-60-23405 and JP-A-62-70405. Examples thereof include azobisnitrile compounds having a group and disulfide compounds having an alkoxysilyl group.

  Examples of the method described in (h) include the methods described in JP-A No. 09-272714.

  In addition, a method of using a mercaptan having a reactive silicon group and a radical polymerization initiator having a reactive silicon group as described in JP-A-59-168014, JP-A-60-228516, etc. is also mentioned. It is done.

  The number of reactive silicon groups in the (co) polymer (B-1) is not particularly limited. From the viewpoint of the effect on the adhesive force and cost, the (co) polymer (B-1) in one molecule. The average is 0.1 or more and 4.0 or less, more preferably 0.5 or more and 2.0 or less.

About tackifying resin (B-2) As tackifying resin (B-2) used for this invention, there is no restriction | limiting in particular and what is normally used can be used. Specific examples include terpene resins, aromatic modified terpene resins and hydrogenated terpene resins obtained by hydrogenation thereof, terpene-phenol resins obtained by copolymerizing terpenes with phenols, phenol resins, modified phenol resins, xylene-phenols. Resin, cyclopentadiene-phenol resin, coumarone indene resin, rosin resin, rosin ester resin, hydrogenated rosin ester resin, xylene resin, low molecular weight polystyrene resin, styrene copolymer resin, petroleum resin (for example, C5 hydrocarbon) Resin, C9 hydrocarbon resin, C5C9 hydrocarbon copolymer resin, etc.), hydrogenated petroleum resin, DCPD resin and the like. These may be used alone or in combination of two or more.

  The styrenic block copolymer and its hydrogenated product are not particularly limited. For example, styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene. Examples include butylene-styrene block copolymer (SEBS), styrene-ethylenepropylene-styrene block copolymer (SEPS), and styrene-isobutylene-styrene block copolymer (SIBS).

 The tackifier resin (B-2) not only solidifies the composition by mixing with the component (A) having fluidity at room temperature, but also lowers the melting temperature during heating to obtain good coating properties. Therefore, it is added for the purpose of ensuring the compatibility of the organic polymer (A) and the (co) polymer (B-2) or for the purpose of ensuring the adhesion to various substrates.

  The blending ratio of the organic polymer (A) having a reactive silicon group and the resin (B) solid at room temperature in the composition of the present invention is 10 parts by weight or more and 2000 parts by weight with respect to 100 parts by weight of the organic polymer (A). Part or less, preferably 50 parts by weight or more and 500 parts by weight or less, more preferably 100 parts by weight or more and 300 parts by weight or less. If the amount is less than 10 parts by weight, the effect is not sufficiently obtained. If the amount is more than 2000 parts by weight, the cured product tends to become brittle.

The moisture curable reactive hot melt adhesive composition of the present invention contains a silane coupling agent (C) having a reactive silicon group represented by the following general formula (2) as an essential component.
-SiR ¹ X ₂ (2)
(In the formula, each R ¹ is independently at least one selected from the group consisting of an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms. X Is a hydroxyl group or a hydrolyzable group, a is 1, 2 or 3).

  Usually, when an organic polymer having a reactive silicon group is used as an adhesive or a sealing agent, a silane coupling agent is generally used as a dehydrating agent or an adhesion-imparting agent. As a result of the study by the authors this time, when an organic polymer having a reactive silicon group is used as a reactive hot melt adhesive, the silane coupling agent has not only functions such as dehydration and adhesion but also reactive hot melt adhesion. It has been found that it has a great influence on the thermal stability and curability of the agent. Further, by using a silane coupling agent having a specific structure in combination with an organic polymer having a reactive silicon group, a reactive hot melt adhesive having an excellent balance of thermal stability and curability can be provided. And led to the present invention.

 As long as the silane coupling agent (C) having a reactive silicon group used in the present invention has a reactive silicon group represented by the general formula (2), a conventionally known one can be used without particular limitation. Examples of the reactive silicon group of the general formula (2) include a methyldimethoxysilyl group, a methyldiethoxysilyl group, and an ethyldimethoxysilyl group. Specific examples of such compounds include isocyanate group-containing silanes such as γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, α-isocyanatemethyldimethoxymethylsilane; γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane, N-β-aminoethyl-γ-aminopropylmethyldiethoxysilane, N-cyclohexylaminomethyldiethoxymethylsilane, etc. Amino group-containing silanes; γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane and other mercapto group-containing silanes; γ-glycidoxypropylmethyldimethoxysilane and the like Epoxy group-containing silanes; .gamma.-methacryloyloxy propyl methyl dimethoxy silane, and vinyl type unsaturated group-containing silanes such as vinyl methyl dimethoxysilane. In addition, amino-modified silyl polymers, silylated amino polymers, unsaturated aminosilane complexes, phenylamino long-chain alkylsilanes, aminosilylated silicones, silylated polyesters, and the like, which are derivatives of these, can also be used as silane coupling agents. . Among these silane coupling agents, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, N-β-aminoethyl-γ-aminopropylmethyl are particularly preferred because they can ensure adhesion and curability. Amino group-containing silane coupling agents such as dimethoxysilane, N-β-aminoethyl-γ-aminopropylmethyldiethoxysilane, and N-cyclohexylaminomethyldiethoxymethylsilane are preferred.

  The amount of the silane coupling agent (C) used is 0.1 to 20 parts by weight, preferably 0.5 to 10 parts by weight, more preferably 100 parts by weight of the reactive silicon group-containing organic polymer (A). A range of 5 to 10 parts by weight is preferred.

  The moisture curable reactive hot melt adhesive composition of the present invention contains a curing catalyst (D) as an essential component.

 The curing catalyst (D) is not particularly limited, and examples thereof include a silanol condensation catalyst that promotes a reaction of a commonly used reactive silicon group. For example, tetrabutyl titanate, tetrapropyl titanate, titanium tetraacetylacetonate, bis Titanium compounds such as acetylacetonatodiisopropoxytitanium; dibutyltin dilaurate, dibutyltin maleate, dibutyltin phthalate, dibutyltin dioctate, dibutyltin diethylhexanolate, dibutyltin dimethylmaleate, dibutyltin diethylmaleate, dibutyltin dibutylmaleate Dibutyl tin dioctyl maleate, dibutyl tin ditridecyl maleate, dibutyl tin dibenzyl maleate, dibutyl tin diacetate, dioctyl tin diethyl maleate, dioctyl tin dioctyl maleate , Dibutyltin dimethoxide, dibutyltin dinonylphenoxide, dibutenyltin oxide, dibutyltin diacetylacetonate, dibutyltin diethylacetoacetonate, reaction product of dibutyltin oxide and silicate compound, dibutyltin oxide and phthalate ester Tetravalent organotin compounds such as reactants of the above; organoaluminum compounds such as aluminum trisacetylacetonate, aluminum trisethylacetoacetate, diisopropoxyaluminum ethylacetoacetate; zirconium compounds such as zirconium tetraacetylacetonate It is done.

 In addition to the above compounds, amine compounds, acidic phosphate esters, reaction products of acidic phosphate esters with amine compounds, saturated or unsaturated polyvalent carboxylic acids or acid anhydrides thereof, carboxylic acid compounds and amines Examples include reactants such as salts with a series compound, lead octylate and the like.

 The amine compound is not particularly limited. For example, methylamine, ethylamine, propylamine, isopropylamine, butylamine, amylamine, hexylamine, octylamine, 2-ethylhexylamine, nonylamine, decylamine, laurylamine, pentadecylamine. Aliphatic primary amines such as cetylamine, stearylamine, cyclohexylamine; dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, diamylamine, dihexylamine, dioctylamine, di (2-ethylhexyl) amine, didecylamine , Dilaurylamine, dicetylamine, distearylamine, methylstearylamine, ethylstearylamine, butylstearylamine, etc. Secondary amines; aliphatic tertiary amines such as triamylamine, trihexylamine and trioctylamine; aliphatic unsaturated amines such as triallylamine and oleylamine; aniline, laurylaniline, stearylaniline, tri Aromatic amines such as phenylamine; pyridine, 2-aminopyridine, 2- (dimethylamino) pyridine, 4- (dimethylaminopyridine), 2-hydroxypyridine, imidazole, 2-ethyl-4-methylimidazole, morpholine, N-methylmorpholine, piperidine, 2-piperidinemethanol, 2- (2-piperidino) ethanol, piperidone, 1,2-dimethyl-1,4,5,6-tetrahydropyrimidine, 1,8-diazabicyclo (5,4 0) Undecene-7 (DBU), 6- (Di Tilamino) -1,8-diazabicyclo (5,4,0) undecene-7 (DBA-DBU), 1,5-diazabicyclo (4,3,0) nonene-5 (DBN), 1,4-diazabicyclo (2 , 2, 2) Nitrogen-containing heterocyclic compounds such as octane (DABCO) and aziridine, and other amines such as monoethanolamine, diethanolamine, triethanolamine, 3-hydroxypropylamine, ethylenediamine, propylenediamine, hexa Methylenediamine, N-methyl-1,3-propanediamine, N, N′-dimethyl-1,3-propanediamine, diethylenetriamine, triethylenetetramine, 2- (2-aminoethylamino) ethanol, benzylamine, 3- Methoxypropylamine, 3-lauryloxypro Ruamine, 3-dimethylaminopropylamine, 3-diethylaminopropylamine, 3-dibutylaminopropylamine, 3-morpholinopropylamine, 2- (1-piperazinyl) ethylamine, xylylenediamine, 2,4,6-tris (dimethyl) Amines such as aminomethyl) phenol; guanidines such as guanidine, phenylguanidine and diphenylguanidine; and biguanides such as butylbiguanide, 1-o-tolylbiguanide and 1-phenylbiguanide.

  Among these, amidines such as 1,2-dimethyl-1,4,5,6-tetrahydropyrimidine, DBU, DBA-DBU and DBN; guanidines such as guanidine, phenylguanidine and diphenylguanidine; butylbiguanide, 1 Biguanides such as -o-tolyl biguanide and 1-phenyl biguanide are preferable because they exhibit high activity, and aryl group-substituted biguanides such as 1-o-tolyl biguanide and 1-phenyl biguanide can be expected to have high adhesiveness. preferable.

  An amine compound is basic, but an amine compound in which the pKa value of the conjugate acid is 11 or more is preferably high in catalytic activity. 1,2-dimethyl-1,4,5,6-tetrahydropyrimidine , DBU, DBN and the like are particularly preferable because the pKa value of the conjugate acid is 12 or more and high catalytic activity is exhibited.

 The carboxylic acids are not particularly limited, for example, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, undecanoic acid, lauric acid, tridecylic acid, myristic acid, Linear saturated fatty acids such as pentadecylic acid, palmitic acid, heptadecylic acid, stearic acid, nonadecanoic acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, montanic acid, mellicic acid, and laccellic acid; undecylenic acid, lindelic acid, Zulic acid, fizeteric acid, myristoleic acid, 2-hexadecenoic acid, 6-hexadecenoic acid, 7-hexadecenoic acid, palmitoleic acid, petrothelic acid, oleic acid, elaidic acid, asclepic acid, vaccenic acid, gadoleic acid, gondoic acid, cetrein Acid, erucic acid, brassic acid, Monoene unsaturated fatty acids such as lacoleic acid, ximenoic acid, lumenic acid, acrylic acid, methacrylic acid, angelic acid, crotonic acid, isocrotonic acid, 10-undecenoic acid; linoelaidic acid, linoleic acid, 10,12-octadecadiene Acid, hiragoic acid, α-eleostearic acid, β-eleostearic acid, punicic acid, linolenic acid, 8,11,14-eicosatrienoic acid, 7,10,13-docosatrienoic acid, 4,8,11 , 14-hexadecatetraenoic acid, moloctic acid, stearidonic acid, arachidonic acid, 8,12,16,19-docosatetraenoic acid, 4,8,12,15,18-eicosapentaenoic acid, succinic acid, nisic acid , Polyene unsaturated fatty acids such as docosahexaenoic acid; 2-methylbutyric acid, isobutyric acid, 2-ethylbutyric acid, pivalic acid, 2 2-dimethylbutyric acid, 2-ethyl-2-methylbutyric acid, 2,2-diethylbutyric acid, 2-phenylbutyric acid, isovaleric acid, 2,2-dimethylvaleric acid, 2-ethyl-2-methylvaleric acid, 2, 2-diethylvaleric acid, 2-ethylhexanoic acid, 2,2-dimethylhexanoic acid, 2,2-diethylhexanoic acid, 2,2-dimethyloctanoic acid, 2-ethyl-2,5-dimethylhexanoic acid, versatic acid Branched chain fatty acids such as neodecanoic acid and tuberculostearic acid; fatty acids having triple bonds such as propiolic acid, talylic acid, stearoleic acid, crepenic acid, ximenic acid and 7-hexadecinic acid; naphthenic acid and malvalic acid , Stericuric acid, hydnocarpsic acid, shawl moulinic acid, gol phosphoric acid, 1-methylcyclopentanecarboxylic acid, 1-methylcyclohexene Cycloaliphatic carboxylic acids such as suncarboxylic acid, 1-adamantanecarboxylic acid, bicyclo [2.2.2] octane-1-carboxylic acid, bicyclo [2.2.1] heptane-1-carboxylic acid; acetoacetic acid, Ethoxyacetic acid, glyoxylic acid, glycolic acid, gluconic acid, sabinic acid, 2-hydroxytetradecanoic acid, iprolic acid, 2-hydroxyhexadecanoic acid, yarapinolic acid, uniperic acid, ambrettelic acid, alluritic acid, 2-hydroxyoctadecanoic acid , 12-hydroxyoctadecanoic acid, 18-hydroxyoctadecanoic acid, 9,10-dihydroxyoctadecanoic acid, 2,2-dimethyl-3-hydroxypropionic acid ricinoleic acid, camlorenic acid, ricanoic acid, ferronic acid, cerebronic acid, etc. Fatty acids; chloroacetic acid, 2-chloro And halogen-substituted products of monocarboxylic acids such as loacrylic acid and chlorobenzoic acid. Aliphatic dicarboxylic acids include adipic acid, azelaic acid, pimelic acid, suberic acid, sebacic acid, glutaric acid, oxalic acid, malonic acid, ethylmalonic acid, dimethylmalonic acid, ethylmethylmalonic acid, diethylmalonic acid, succinic acid 2,2-dimethylsuccinic acid, 2,2-diethylsuccinic acid, chain dicarboxylic acids such as 2,2-dimethylglutaric acid, 1,2,2-trimethyl-1,3-cyclopentanedicarboxylic acid, And saturated dicarboxylic acids such as acetic acid; unsaturated dicarboxylic acids such as maleic acid, fumaric acid, acetylenedicarboxylic acid, and itaconic acid. Examples of the aliphatic polycarboxylic acid include chain tricarboxylic acids such as aconitic acid, citric acid, isocitric acid, 3-methylisocitric acid, and 4,4-dimethylaconitic acid. Aromatic carboxylic acids include aromatic monocarboxylic acids such as benzoic acid, 9-anthracenecarboxylic acid, atrolactic acid, anisic acid, isopropylbenzoic acid, salicylic acid, toluic acid; phthalic acid, isophthalic acid, terephthalic acid, carboxyphenyl And aromatic polycarboxylic acids such as acetic acid and pyromellitic acid. In addition, amino acids such as alanine, leucine, threonine, aspartic acid, glutamic acid, arginine, cysteine, methionine, phenylalanine, tryptophan, histidine and the like can be mentioned. Moreover, the carboxylic acid derivative etc. which produce carboxylic acid by hydrolysis of carboxylic anhydride, ester, amide, nitrile, acyl chloride, etc. can also be used.

  As the carboxylic acid used as the curing catalyst, 2-ethylhexanoic acid, octylic acid, neodecanoic acid, oleic acid, naphthenic acid, etc. are easily available, inexpensive, and reactive silicon group-containing organic polymer ( It is preferable from the viewpoint of good compatibility with A).

  As the curing catalyst, two or more different types of catalysts may be used in combination. For example, it is preferable that an effect of improving curability may be obtained by using an amine compound and a carboxylic acid in combination. .

  The amount of the condensation catalyst used is 0.001 to 100 parts by weight with respect to a total of 100 parts by weight of the reactive silicon group-containing organic polymer (A) and the (meth) acrylic acid alkyl ester-based (co) polymer (B-1). It is preferably 20 parts by weight, more preferably 0.01 to 15 parts by weight, and particularly preferably 0.01 to 10 parts by weight and 0.1 to 5 parts by weight. If the amount of the condensation catalyst used is less than 0.001 part by weight, the curing rate may be insufficient, and the curing reaction may not proceed sufficiently. On the other hand, when the amount of the condensation catalyst used exceeds 20 parts by weight, the curing rate is too high, and the time that the curable composition can be used tends to be short, resulting in poor workability and poor storage stability.

The moisture curable reactive hot melt adhesive composition of the present invention desirably uses a silane coupling agent (E) having a reactive silicon group represented by the following general formula (3).
-SiX ₃ (3)
(X is a hydroxyl group or a hydrolyzable group).

 The moisture curable reactive hot melt adhesive of the present invention uses a silane coupling agent having two hydroxyl groups or hydrolyzable groups on one silicon atom, thereby achieving a balance between thermal stability at high temperatures and curability. Although it is compatible, a silane coupling agent having three hydroxyl groups or hydrolyzable groups on one silicon atom as shown in the general formula (3) can also be used in combination. However, when the content is 5 parts by weight or more with respect to 100 parts by weight of the total amount of the component (A) and the component (B), the thermal stability at high temperatures tends to be reduced (a gelled product is easily generated). Therefore, the content of the component (E) is preferably less than 5 parts by weight and less than 2 parts by weight with respect to 100 parts by weight of the total amount of the components (A) and (B). Preferably, it does not contain substantially.

 Examples of the silane coupling agent (E) having a reactive silicon group represented by the general formula (3) include γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, and α-isocyanate methyl. Isocyanate group-containing silanes such as trimethoxysilane; γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane, N-β-aminoethyl-γ -Aminopropyltriethoxysilane, γ-ureidopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-benzyl-γ-aminopropyltrimethoxysilane, N-vinylbenzyl-γ-aminopropyltriethoxy Amino groups such as silane Silanes; mercapto group-containing silanes such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- ( Epoxy group-containing silanes such as 3,4-epoxycyclohexyl) ethyltrimethoxysilane and β- (3,4-epoxycyclohexyl) ethyltriethoxysilane; β-carboxyethyltriethoxysilane, N-β- (carboxymethyl) Carboxysilanes such as aminoethyl-γ-aminopropyltrimethoxysilane; Vinyl-type unsaturated group-containing silanes such as vinyltrimethoxysilane, vinyltriethoxysilane, and γ-acryloyloxypropylmethyltriethoxysilane; γ-chloropropyl Trime Halogen-containing silanes such as Kishishiran; tris (trimethoxysilyl) can be mentioned isocyanurate silanes such as isocyanurates. In addition, amino-modified silyl polymers, silylated amino polymers, unsaturated aminosilane complexes, phenylamino long-chain alkylsilanes, aminosilylated silicones, silylated polyesters, and the like, which are derivatives of these, can also be used as silane coupling agents. .

 The adhesive composition of the present invention preferably has a pot life at 120 ° C. of 30 minutes or more from the viewpoint of workability. The pot life in the present invention was left in an oven at 120 ° C. and was the time until the surface was cured. The measurement was performed by setting the time in the oven as the curing start time, and appropriately touching the surface with a spatula, and measuring the time until the moisture-curing reactive hot melt adhesive did not adhere to the spatula.

  In addition to the above, the moisture curable reactive hot melt adhesive of the present invention may contain a filler, a plasticizer, a stabilizer and the like as necessary.

  Specific examples of the filler include, for example, calcium carbonate, magnesium carbonate, titanium oxide, carbon black, fused silica, precipitated silica, diatomaceous earth, white clay, kaolin, clay, talc, wood powder, walnut shell powder, rice husk Inorganic fillers such as powder, silicic anhydride, quartz powder, aluminum powder, zinc powder, asbestos, glass fiber, carbon fiber, glass beads, alumina, glass balloon, shirasu balloon, silica balloon calcium oxide, magnesium oxide, silicon oxide And organic fillers such as wood fillers such as pulp and cotton chips, powder rubber, recycled rubber, fine powder of thermoplastic or thermosetting resin, and hollow bodies such as polyethylene. Among these, calcium carbonate, titanium oxide, silica, kaolin, clay, and talc are high in initial cohesive strength of the resulting moisture-curing reactive hot melt adhesive, and can provide high initial adhesive strength, and even better. It is preferable because excellent adhesiveness and heat resistance can be obtained.

  Only one type of filler may be added, or multiple types may be added in combination.

  When the filler is blended, the blending amount is required to be 5 to 200 parts by weight with respect to 100 parts by weight of the total amount of the oxyalkylene polymer (A) and the resin (B) solid at room temperature, 180 parts by weight is more preferable, and 80 to 160 parts by weight is most preferable. When the amount exceeds 200 parts by weight, workability tends to decrease due to an increase in viscosity, and the adhesive performance of the resulting cured product also tends to decrease. On the other hand, when the amount is less than 5 parts by weight, sufficient effects tend not to be obtained.

  Specific examples of the plasticizer include, for example, phthalic acid esters such as dioctyl phthalate and diisodecyl phthalate; aliphatic dibasic acid esters such as dioctyl adipate; and epoxy plasticizers such as epoxidized soybean oil and epoxidized linseed oil Polyethers such as polypropylene glycol and derivatives thereof; vinyl polymers obtained by polymerizing vinyl monomers by various methods, and the like. These plasticizers may be used alone or in combination of two or more.

  The amount of the plasticizer used is preferably 5 to 100 parts by weight, preferably 10 to 70 parts by weight, based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) and the resin (B) solid at room temperature. More preferably. If it is less than 5 parts by weight, the effect as a plasticizer will not be exhibited, and if it exceeds 100 parts by weight, the mechanical strength of the cured product will be insufficient, or sufficient adhesive strength will not be obtained after coating.

  Specific examples of the stabilizer include an antioxidant, a light stabilizer, and an ultraviolet absorber.

  When an antioxidant is used, the weather resistance and heat resistance of the cured product can be improved. Examples of the antioxidant include hindered phenols, monophenols, bisphenols, and polyphenols, with hindered phenols being particularly preferred.

  The amount of the antioxidant used is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) and the resin (B) solid at room temperature, It is more preferable to use ˜5 parts by weight.

  When a light stabilizer is used, photooxidation deterioration of the cured product can be prevented. Examples of the light stabilizer include benzotriazole-based, hindered amine-based, and benzoate-based compounds, and hindered amine-based compounds are particularly preferable.

  The light stabilizer is preferably used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) and the resin (B) solid at room temperature, It is more preferable to use ˜5 parts by weight.

  When the ultraviolet absorber is used, the surface weather resistance of the cured product can be enhanced. Examples of ultraviolet absorbers include benzophenone, benzotriazole, salicylate, substituted tolyl, and metal chelate compounds, with benzotriazole being particularly preferred.

  The ultraviolet absorber is preferably used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) and the resin (B) solid at room temperature, It is more preferable to use ˜5 parts by weight.

  Further, it is preferable to use a phenolic or hindered phenolic antioxidant, a hindered amine light stabilizer and a benzotriazole ultraviolet absorber in combination.

  Furthermore, various additives may be added to the moisture curable reactive hot melt adhesive of the present invention as necessary for the purpose of adjusting various physical properties of the moisture curable reactive hot melt adhesive or cured product. Good. Examples of such additives include, for example, flame retardants, curability modifiers, radical inhibitors, metal deactivators, ozone degradation inhibitors, phosphorus peroxide decomposers, lubricants, pigments, foaming agents, Examples include solvents and fungicides. These various additives may be used alone or in combination of two or more.

  The moisture-curable reactive hot melt adhesive of the present invention can be prepared as a one-component type in which all the blended components are pre-blended and sealed and cured by moisture in the air after construction. Components such as a curing catalyst, a filler, a plasticizer, and water can be blended, and the compounding material and the polymer composition can be prepared as a two-component type that is mixed before use.

  There is no particular limitation on the method of adjusting the moisture curable reactive hot melt adhesive applied by the application method of the present invention. For example, the above-described components are blended and kneaded at room temperature or under heat using a mixer, roll, kneader or the like. Or by using a small amount of a suitable solvent, and dissolving and mixing the components.

  The moisture-curable reactive hot melt adhesive of the present invention uses a low-viscosity polymer, a polymer with high temperature sensitivity, or a resin, so that it can be applied at a relatively low temperature as a hot-melt adhesive. It is. In order to ensure good workability, the coating is preferably performed by heating to 60 to 180 ° C, more preferably 70 to 160 ° C, particularly preferably 90 to 140 ° C. If the temperature is lower than 60 ° C, sufficient workability cannot be ensured. If the temperature is higher than 180 ° C, the stability of the moisture-curing reactive hot melt adhesive is reduced, or it cannot be used on substrates with low heat resistance. Is limited. When the moisture-curable reactive hot melt adhesive is heated and used, the heating method is not particularly limited, and a conventionally known method can be used.

The moisture curable reactive hot melt adhesive composition of the present invention is at least 60 ° C.
For 30 minutes or longer, typically 90 ° C. to 140 ° C. for 30 minutes or longer and 2 hours or shorter, and can be applied to a substrate even after heating for 30 minutes or longer.

  The moisture-curable reactive hot melt adhesive of the present invention is used as a reactive hot melt adhesive for various uses and for bonding substrates. The use is not particularly limited, and examples thereof include architecture, automobiles, electricity / electronics, textiles / leathers / clothing. Moreover, the coating method of the moisture hardening type reactive hot melt adhesive of this invention is not specifically limited, Conventionally well-known methods, such as a roll coater, a die coater, bead application | coating, a spray, can be used.

  The moisture-curable reactive hot melt adhesive of the present invention will be described based on examples.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to synthesis examples, production examples, and examples, but the present invention is not limited to these synthesis examples, production examples, and examples.

The synthesis example of the organic polymer (A) having a reactive silicon group is shown below.
(Synthesis Example 1)
A polyoxypropylene diol having a number average molecular weight of 2,000 is used as an initiator, and propylene oxide is polymerized using a zinc hexacyanocobaltate glyme complex catalyst to obtain a poly having a number average molecular weight of 29,000 (polystyrene conversion value obtained from GPC). Oxypropylene diol was obtained. After the obtained polyoxypropylene diol and sodium methoxide were reacted, allyl chloride was reacted to convert the terminal hydroxyl group into an unsaturated group.

  0.75 mol of methyldimethoxysilane is reacted in the presence of a platinum divinyldisiloxane complex with respect to 1 mol of the unsaturated group of this unsaturated group-terminated polyoxypropylene polymer to give 1. An oxyalkylene polymer having a reactive silicon group having a number average molecular weight of 30,000 (polystyrene conversion value determined from GPC) and a molecular weight distribution of 1.20 was obtained (A-1).

(Synthesis Example 2)
A polyoxypropylene diol having a number average molecular weight of 2,000 is used as an initiator, and propylene oxide is polymerized using a zinc hexacyanocobaltate glyme complex catalyst to obtain a poly having a number average molecular weight of 29,000 (polystyrene conversion value obtained from GPC). Oxypropylene diol was obtained. After the obtained polyoxypropylene diol and sodium methoxide were reacted, allyl chloride was reacted to convert the terminal hydroxyl group into an unsaturated group.

  0.75 mol of trimethoxysilane is reacted in the presence of a platinum divinyldisiloxane complex with respect to 1 mol of the unsaturated group of this unsaturated group-terminated polyoxypropylene polymer to give 1. An oxyalkylene-based polymer having a reactive silicon group having a number average molecular weight of 5,500 (polystyrene equivalent value determined from GPC) and a molecular weight distribution of 1.22 was obtained (Polymer A-2).

(Synthesis Example 3)
A polyoxypropylene diol having a number average molecular weight of 2,000 is used as an initiator, and propylene oxide is polymerized using a zinc hexacyanocobaltate glyme complex catalyst to obtain a poly having a number average molecular weight of 29,000 (polystyrene conversion value obtained from GPC). Oxypropylene diol was obtained. The number average molecular weight having 1.4 trimethoxysilyl groups per molecule by adding 0.7 mol of γ-isocyanatopropyltrimethoxysilane to 1 mol of hydroxyl groups of the obtained polyoxypropylene diol A polyoxyalkylene polymer having a reactive silicon group with a molecular weight distribution of 31,500 (polystyrene conversion value determined by GPC) and 1.40 was obtained (A-3).

  The synthesis example of a (meth) acrylic-acid alkylester type | system | group (co) polymer (B-1) is shown below.

(Synthesis Example 4)
In 40 g of toluene heated to 105 ° C., 67 g of methyl methacrylate, 5 g of butyl acrylate, 15 g of stearyl methacrylate, 5 g of 3-methacryloxypropylmethyldimethoxysilane, 8 g of γ-mercaptopropylmethyldimethoxysilane, and 2 as a polymerization initiator A solution prepared by dissolving 3 g of 2,2′-azobisisobutyronitrile in 15 g of toluene was added dropwise over 5 hours, followed by stirring for 2 hours. Furthermore, by adding a solution prepared by dissolving 0.3 g of 2,2′-azobisisobutyronitrile in 10 g of toluene and stirring for 2 hours, a solid content concentration of 60% by weight and a number average molecular weight of 3,000 (GPC (Obtained in terms of polystyrene) and an acrylic copolymer that was solid at room temperature with a molecular weight distribution of 1.62 (B-1-1).

(Synthesis Example 5)
In 40 g of toluene heated to 105 ° C., 67 g of methyl methacrylate, 5 g of butyl acrylate, 15 g of stearyl methacrylate, 5 g of 3-methacryloxypropyltrimethoxysilane, 8 g of γ-mercaptopropyltrimethoxysilane, and 2 as a polymerization initiator A solution prepared by dissolving 3 g of 2,2′-azobisisobutyronitrile in 15 g of toluene was added dropwise over 5 hours, followed by stirring for 2 hours. Furthermore, by adding a solution prepared by dissolving 0.3 g of 2,2′-azobisisobutyronitrile in 10 g of toluene and stirring for 2 hours, a solid content concentration of 60% by weight and a number average molecular weight of 3,100 (GPC (Obtained in terms of polystyrene) and an acrylic copolymer solid at room temperature with a molecular weight distribution of 1.66 was obtained (B-1-2).
Examples and comparative examples are shown below.

(Examples 1-6, Comparative Examples 1-2)
After mixing the components (A) and (B) and the antioxidant in the proportions shown in Table 1 (component (B-1) describes the amount of solids excluding toluene), heating at 120 ° C. under reduced pressure Toluene was devolatilized. Next, the components (C) and (E) shown in Table 1 were added and stirred for 5 minutes, and then the component (D) was added and stirred for 5 minutes. Finally, it was degassed under reduced pressure, and the metal container was filled with a one-component moisture-curing reactive hot melt adhesive.
The following evaluation was performed using the obtained one-component moisture-curing reactive hot melt adhesive.

● Curing time;
The moisture-curable reactive hot melt adhesive was heated to 120 ° C. and sufficiently melted, and then poured out from the metal container. The time when the liquid was poured out was set as the curing start time, the surface was appropriately touched with a spatula, and the time when the moisture-curable reactive hot melt adhesive did not adhere to the spatula was measured as the skinning time (curing time).
The curing time was measured in an atmosphere having a temperature of 23 ± 2 ° C. and a relative humidity of 50 ± 10%.

● Thermal stability at high temperatures (pot life)
The moisture-curable reactive hot melt adhesive was heated to 120 ° C. and sufficiently melted, and then poured out from the metal container. Immediately thereafter, it was left in an oven at 120 ° C., and the time until the surface was cured was defined as the pot life. The measurement was defined as the curing start time, which was set in the oven, and the surface was appropriately touched with a spatula, and the time until the moisture-curing reactive hot melt adhesive did not adhere to the spatula was defined as the pot life. The pot life is preferably 30 minutes or more from the viewpoint of workability.

  The obtained evaluation results are shown in Table 1.

  As shown in Table 1, the moisture curable reactive hot melt adhesives described in the examples are excellent in thermal stability at high temperatures, that is, they can ensure a long pot life even at high temperatures and are curable after application. It turns out that it is also favorable.

  According to the present invention, a moisture curable reactive hot melt adhesive that is compatible as a heat curable reactive hot melt adhesive that has both thermal stability during heating and melting at room temperature after coating and is less toxic Can be provided. The moisture-curable reactive hot melt adhesive of the present invention is used as a reactive hot melt adhesive for various uses and for bonding substrates. The use is not particularly limited, and examples thereof include architecture, automobiles, electricity / electronics, textiles / leathers / clothing.

Claims (11)

(A) An organic polymer having a reactive silicon group represented by the following general formula (1) and fluidity at room temperature , (B) a solid resin at room temperature, (C) represented by the following general formula (2) A moisture curable reactive hot melt adhesive composition comprising: a silane coupling agent having a reactive silicon group; and (D) a curing catalyst.
-SiR ¹ _3-a X _a (1)
(In the formula, each R ¹ is independently at least one selected from the group consisting of an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms. X Is a hydroxyl group or a hydrolyzable group, a is 1, 2 or 3.)
-SiR ¹ X ₂ (2)
(Wherein R ¹ and X are the same as above) (B) Resin that is solid at room temperature is (B-1) (meth) acrylic acid alkyl ester-based (co) polymer and / or (B-2) tackifying resin. The moisture-curable reactive hot melt adhesive composition described. (C) The moisture-curable reactive hot melt adhesive composition according to any one of claims 1 and 2, wherein the silane coupling agent having a reactive silicon group further has an amino group. (C) The moisture-curable reactive hot melt adhesive according to any one of claims 1 to 3, wherein the reactive silicon group of the silane coupling agent having a reactive silicon group is an alkyldimethoxysilyl group. Composition. The reactive silicon group of the organic polymer (A) having a reactive silicon group is represented by the general formula (1), and a is 1 or 2, The moisture-curable reactive hot-melt adhesive composition according to 1. (B) The moisture-curable reactive hot melt adhesive according to any one of claims 1 to 5, wherein the resin solid at normal temperature has a reactive silicon group represented by the following general formula (1): Composition.
-SiR ¹ _3-a X _a (1)
(Wherein R ¹ and X are the same as above) (B) Resin which is solid at normal temperature has a reactive silicon group represented by the general formula (1), and a is 1 or 2, 7. Moisture curable reactive hot melt adhesive composition. Furthermore, it contains a silane coupling agent having a reactive silicon group represented by the following general formula (3) as component (E), and the content thereof is a total amount of component (A) and component (B-1) 100. The moisture-curable reactive hot melt adhesive composition according to any one of claims 2 to 7, wherein the moisture-curable reactive hot melt adhesive composition is less than 5 parts by weight with respect to parts by weight.
-SiX ₃ (3)
(X is a hydroxyl group or a hydrolyzable group.) The moisture-curable reactive hot melt adhesive composition according to any one of claims 1 to 8, wherein a pot life at 120 ° C is 30 minutes or more. The moisture-curable reactive hot melt adhesive composition according to any one of claims 1 to 9, wherein the moisture-curable reactive hot melt adhesive composition is for a die coater or a roll coater. Adhesive composition. The moisture-curable reactive hot melt adhesive composition according to any one of claims 1 to 9 is applied to a substrate after being heated at 90 ° C to 140 ° C for 30 minutes or more. Application method.