JP5839503B2 - Semiconductor device, LSI (Large Scale Integration) and electronic device - Google Patents

Description

  The present invention relates to a semiconductor device, an LSI, and an electronic device.

  A semiconductor device described in Patent Document 1 includes a flexible circuit board, a first device (eg, a plurality of memory devices and passive components) mounted on a first surface of the flexible circuit board, A second device (for example, an arithmetic processor device) mounted on the second surface of the flexible circuit board in a front-back relationship with the first surface. The flexible circuit board is bent and encloses the first device. Hereinafter, such a semiconductor device is referred to as a three-dimensional mounting type semiconductor device. In the three-dimensional mounting type semiconductor device described in Patent Document 1, the flexible circuit board further includes a support.

International Publication No. 2009/119904

  In the case of the technique described in Patent Document 1, there is a problem that signal wiring for mounting an electronic component (for example, a bare chip) having a wiring density higher than that of the flexible circuit board cannot be formed on the flexible circuit board.

  It is an object of the present invention to provide a technique for mounting an electronic component having a wiring density higher than that of a flexible circuit board on the flexible circuit board in a three-dimensional mounting type semiconductor device.

According to the present invention,
A flexible circuit board having a through hole;
A silicon interposer embedded in the through hole;
A first device located on a first surface of the flexible circuit board and electrically connected to both the flexible circuit board and the silicon interposer;
A second device located on a second surface of the flexible circuit board in a front-back relationship with the first surface and electrically connected to both the flexible circuit board and the silicon interposer And having
An end portion of the flexible circuit board is bent to one surface side, and a semiconductor device in which the second device is enclosed by the flexible circuit board is provided.

  In addition, according to the present invention, an LSI including the semiconductor device is provided.

  In addition, according to the present invention, an electronic apparatus equipped with the semiconductor device is provided.

  According to the present invention, in a three-dimensional mounting type semiconductor device, an electronic component having a wiring density higher than that of a flexible circuit board can be mounted on the flexible circuit board.

It is an example of sectional drawing of the semiconductor device of this embodiment. It is an example of the top view of the 1st device of this embodiment. It is an example of the top view of the 2nd device of this embodiment. It is an example of the top view of the silicon interposer of this embodiment. It is an example of a sectional view of a part of the flexible circuit board of this embodiment. It is an example of the top view which shows the state which inserted the silicon interposer in the through hole of the flexible circuit board of this embodiment. It is an example of sectional drawing explaining the manufacturing process of the semiconductor device of this embodiment. It is an example of sectional drawing explaining the manufacturing process of the semiconductor device of this embodiment. It is an example of sectional drawing which shows the state which mounted the semiconductor device of this embodiment on the mounting board | substrate. It is a figure which shows an example of the bending method of the flexible circuit board of this embodiment. It is a figure which shows an example of the bending method of the flexible circuit board of this embodiment. It is an example of sectional drawing of the semiconductor device of this embodiment. It is an example of sectional drawing of the semiconductor device of this embodiment. It is an example of sectional drawing of the semiconductor device of this embodiment. It is an example of sectional drawing of the semiconductor device of this embodiment. It is an example of sectional drawing of the semiconductor device of this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, about the component which appears in common in several drawing, a common code | symbol is attached | subjected and description is abbreviate | omitted suitably.

<First Embodiment>
The semiconductor device according to the present embodiment includes a flexible circuit board having a through hole, a silicon interposer embedded in the through hole, a first surface side of the flexible circuit board, a flexible circuit board, A first circuit electrically connected to both the silicon interposer and a second circuit side of the flexible circuit board in a front-back relationship with the first surface, the flexible circuit board and the silicon interposer A second device in electrical connection with both. The end portion of the flexible circuit board is bent toward one surface, and the second device is enclosed by the flexible circuit board. The flexible circuit board further includes a support body, and the shape is supported by the support body.

  FIG. 1 shows an example of a cross-sectional view of the semiconductor device of this embodiment.

  The semiconductor device shown in FIG. 1 includes a first device 1, a second device 2, a flexible circuit board 3, a silicon interposer 4, and a support 5. The flexible circuit board 3 has a through hole penetrating from the first surface 6 to the second surface 7, and the silicon interposer 4 is embedded in the through hole. The first device 1 is located on the first surface 6 side of the flexible circuit board 3 and is electrically connected to both the flexible circuit board 3 and the silicon interposer 4. The second device 2 is located on the second surface 7 side of the flexible circuit board 3 and is electrically connected to both the flexible circuit board 3 and the silicon interposer 4. The end of the flexible circuit board 3 is bent toward the second surface 7, and the second device 2 is enclosed by the flexible circuit board 3. The flexible circuit board 3 further includes a support body 5 and is supported by the support body 5 in shape.

  The first device 1 and the second device 2 may be opposed to each other with the flexible circuit board 3 and the silicon interposer 4 interposed therebetween. That is, the first device 1 and the second device 2 may have a positional relationship in which at least a part thereof overlaps with each other in a plan view (observed in the vertical direction in FIG. 1). At least a part of each of the flexible circuit board 3 and the silicon interposer 4 can be in a positional relationship overlapping the first device 1 and the second device 2 in plan view (observed in the vertical direction in FIG. 1). .

  Hereinafter, each component will be described.

  The flexible circuit board 3 has at least one wiring layer. On the second surface 7 of the flexible circuit board 3, at least one first external electrode 9 (only one example of the position is shown in the figure) is provided. The first surface 6 of the flexible circuit board 3 is provided with at least one second external electrode 8 (only one example of the position is shown in the drawing) and the third external electrode 14.

  Here, the end of the flexible circuit board 3 is bent toward the second surface 7 so as to enclose the second device 2. The first surface 6 of such a flexible circuit board 3 has a first region having a through hole and a direction approximately 180 ° opposite to the direction in which the first region faces (upward in the drawing) ( And a second region facing downward in the drawing. The second external electrode 8 is located in the first region, and the third external electrode 14 is located in the second region. An external terminal 15 is formed on the third external electrode 14 and can be electrically connected to another device (third device).

  The flexible circuit board 3 may have a layer structure that can realize, for example, a signal wiring / ground (microstrip line) structure. The flexible circuit board 3 is a printed circuit board, for example.

  The external terminal 15 is not particularly limited and can adopt any configuration. For example, a so-called solder ball made of a metal material containing Sn is conceivable.

  The silicon interposer 4 is inserted into the through hole of the flexible circuit board 3. The first surface 10 of the silicon interposer 4 is provided with at least one first external electrode 11 (only one example of the position is shown in the figure). The second surface 12 of the silicon interposer 4 is provided with at least one second external electrode 13 (only one example of the position is shown in the figure).

  The silicon interposer 4 preferably has a higher wiring density than the flexible circuit board 3. The minimum land pitch interval on the silicon interposer 4 is preferably smaller than the minimum land pitch interval on the flexible circuit board 3.

  Here, the second external electrode 8 included in the flexible circuit board 3 and the first external electrode 11 included in the silicon interposer 4 are both electrically connected to the first device 1. That is, the second external electrode 8 included in the flexible circuit board 3 and the first external electrode 11 included in the silicon interposer 4 are electrically connected to the same device. From the viewpoint of facilitating such connection, the first surface 10 of the silicon interposer 4 and the first surface 6 of the flexible circuit board 3 are preferably flush with each other. For the same reason, the second surface 12 of the silicon interposer 4 and the second surface 7 of the flexible circuit board 3 are preferably flush with each other. That is, it is preferable that the thickness of the silicon interposer 4 and the thickness of the flexible circuit board 3 match. However, the silicon interposer 4 is not necessarily inserted so as to be flush with the flexible circuit board 3. The surface on which the second external electrode 8 of the flexible circuit board 3 is located, the silicon interposer It suffices if it is inserted so that the surface on which the first external electrode 4 is positioned faces in substantially the same direction. If it becomes such a structure, the device (design matter) is given to the 1st device 1 side, for example, or the 2nd external electrode 8 and silicon interposer 4 which the flexible circuit board 3 has have By devising the first external electrode 11 (design matters), the electrical connection between the silicon interposer 4 and the flexible circuit board 3 and the first device 1, and the silicon interposer 4 and the flexible circuit. Electrical connection between the substrate 3 and the second device 2 can be realized.

  As the first device 1 and the second device 2, for example, a semiconductor bare chip, a packaged electronic component, a passive component (capacitor, resistor, inductor) or the like can be used. Although not limited in particular, for example, using a packaged semiconductor device that has been inspected (operation guaranteed), compared to the case of using a semiconductor bare chip, the inspection cost (capital investment cost of inspection apparatus, inspection) Software development costs, etc.) can be significantly reduced, and manufacturing costs can be reduced.

  Note that the first device 1 and the second device 2 may have the same configuration or different configurations. That is, they may be the same device or different devices. Further, the configuration such as the shape and size may be the same or different.

  The material of the support 5 is not particularly limited. For example, a metal (Fe, an alloy containing Ni and Fe, an alloy containing Al, Al, an alloy containing Cu, Ni and Cr, or Cr) is used. Alloy, etc.), silicon, resin material (nylon, PP (polypropylene), epoxy resin, carbon, aramid resin, etc.), mica (mica), and the like can be used.

  The support 5 has a function of supporting the shape of a space (a space containing the second device 2) formed by the flexible circuit board 3 whose end is bent in one direction. If such a function can be realized, the configuration (shape, size, installation position in the semiconductor device, etc.) of the support 5 is not particularly limited.

  For example, the support 5 may have a shape having a bottom surface and a side surface extending from the bottom surface, and an open ceiling. The planar shape of the bottom surface is not particularly limited, and any shape such as a quadrangle, other polygons, a circle, and other shapes can be employed. The bottom surface may or may not have an opening locally. The side surface preferably extends from the outer peripheral portion (contour) of the bottom surface. The direction in which the film is stretched is not particularly limited, and the film may be stretched in a direction perpendicular to the bottom surface, or may be stretched so that the angle formed by the bottom surface and the side surface is another angle (an angle other than 90 °). The side surface may or may not have an opening locally.

  At least a part of the second surface 7 of the flexible circuit board 3 is in contact with the support 5. At least a part of the second surface 7 of the flexible circuit board 3 is in contact with the surface of the support 5. With this configuration, the shape of the flexible circuit board 3 is supported by the support 5.

  Such a semiconductor device of the present embodiment can be mounted on an LSI or various types of electronic devices. Examples of the electronic device include a workstation, a server, a personal computer, and a robot.

  Next, an example of a method for manufacturing the semiconductor device of this embodiment will be described with a detailed example. In addition, the manufacturing method demonstrated here is an example to the last, and is not limited to this.

  First, for example, a first device 1 as shown in FIG. 2 (example: semiconductor device, external size: about 10 mm × about 10 mm × thickness about 0.3 mm) and a second device 2 as shown in FIG. 3 ( Example: semiconductor device, outer size: about 10 mm × about 10 mm × thickness about 0.3 mm) and silicon interposer 4 as shown in FIG. 4 (example: outer size: about 8 mm × about 8 mm × thickness about 0.14 mm) And a plain (plate-like) flexible circuit board 3 having a through hole into which the silicon interposer 4 can be inserted. Furthermore, solder balls (eg, about 100 SnAgCu solder balls having a diameter of about 0.6 mm) used as external terminals of the semiconductor device, and a support 5 (eg, external size: about 20 mm × about 20 mm × thickness about 0.1 mm). 3 mm).

  Here, FIG. 5 shows an example of a cross-sectional view of the flexible circuit board 3. The said figure is the figure which extracted the part which does not have a through-hole. The flexible circuit board 3 includes a first insulating layer 16, a second insulating layer 17, and a third insulating layer 18, and the number of wiring layers is two. The external size of the flexible circuit board 3 can be, for example, about 20 mm × about 20 mm × thickness about 0.14 mm.

  As shown in FIG. 5, an adhesive layer can be formed in advance on the second surface 7 of the flexible circuit board 3 at a portion corresponding to a location to be bonded to the surface of the support 5. As the adhesive layer, for example, a thermoplastic adhesive sheet 19 (eg, made of a material that can be bonded at a thickness of about 25 μm and 150 ° C. or higher) can be employed.

  After making such preparation, first, as shown in FIG. 6, the silicon interposer 4 is inserted into the through hole of the flexible circuit board 3. FIG. 6 shows a plan view of the state after the silicon interposer 4 is inserted into the through hole of the flexible circuit board 3. In the illustrated example, a gap is formed between the flexible circuit board 3 and the silicon interposer 4, and the flexible circuit board 3 and the silicon interposer 4 are not in contact with each other. Note that the gap formed between the flexible circuit board 3 and the silicon interposer 4 may be filled with an adhesive or the like without being limited to the configuration. As another example, the flexible circuit board 3 and the silicon interposer 4 may be in contact with each other.

  Thereafter, on the second external electrode 8 (see FIG. 5) and the third external electrode 14 located on the first surface 6 of the flexible circuit board 3, and on the first surface 10 of the silicon interposer 4. Flux or cream solder is applied on the first external electrode 11 positioned, and the first device 1 is temporarily mounted on the flexible circuit board 3 and the silicon interposer 4 using a mounting mounter.

  Thereafter, the second external electrode 8 of the flexible circuit board 3, the first external electrode 11 of the silicon interposer 4, and the first device 1 are solder-connected using a reflow apparatus.

  Next, similarly, the second device 2 is temporarily mounted on the second surface of the flexible circuit board 3 and on the second surface 12 of the silicon interposer 4. The first external electrode 9, the second external electrode 13 of the silicon interposer 4, and the second device 2 are solder-connected.

  Next, the support 5 is connected to the first external electrode 9 (external electrode connected to the ground) of the flexible circuit board 3 using a conductive adhesive, and the flexible circuit board 3 A part of the second surface 7 is adhered. Connection and adhesion between the support 5 and the flexible circuit board 3 can be performed using a mounting mounter. Thereby, the second device 2 is covered with the support 5.

  In addition, although the example which connects the support body 5 and the ground of the flexible circuit board 3 with the conductive adhesive was shown here, the support body 5 and the ground of the flexible circuit board 3 are not necessarily connected. Also good. It does not matter if the portion (insulating portion) other than the electrode of the flexible circuit board 3 and the support 5 are bonded together. When the support 5 is a conductor such as a metal material or silicon, or a semiconductor, it is preferable to connect the support to the ground of the flexible circuit board 3 because electrical noise of the semiconductor device can be reduced.

  FIG. 7 shows an example of a cross-sectional view of the semiconductor device after the above steps.

  Next, the semiconductor device is adsorbed and fixed on a heated (eg, 180 ° C.) heater stage. In this state, the flexible circuit board 3 is bent along the exposed surface of the support 5 using a pressure tool, and the flexible circuit board 3 is exposed to the surface (exposed surface) of the support 5 via the adhesive sheet 19. Adhere to. Through the steps so far, as shown in FIG. 8, a package is produced in which the flexible circuit board 3 covers (includes) the second device 2 and the support 5. In addition, the first surface 6 of the flexible circuit board 3 has a first region having a through hole and a direction opposite to the direction (in FIG. And a second region facing in the downward direction. The second external electrode 8 is located in the first region, and the third external electrode 14 is located in the second region. An external terminal 15 is formed on the third external electrode 14 and can be electrically connected to another device (third device).

  Next, the third external electrode 14 (the third external electrode 14 located in the second region of the first surface 6 of the flexible circuit board 3) of the package manufactured in this manner is connected to the semiconductor device. After temporarily mounting the solder balls serving as the external terminals 15 with a flux, they are put into a reflow furnace and soldered to complete the semiconductor device shown in FIG.

  After that, as shown in FIG. 9, the completed semiconductor device is temporarily mounted on the mounting substrate 20 via the third external electrode 14 using a mounter, and the mounting substrate 20 (third device) is used using a reflow device. And solder connection.

  Note that the bending method of bending the end portion of the flexible circuit board 3 to one surface side is not particularly limited. An example is shown in FIGS. It should be noted that the ends may be overlapped (contacted) in a state after being bent, or a gap may exist between the ends instead of this.

  Next, the effect of this embodiment is demonstrated.

  The first effect is that the silicon interposer 4 is used even for devices (first device 1 and second device 2) that require high-density wiring that cannot be wired with the flexible circuit board 3 so far. Thus, wiring becomes possible, and a miniaturized high-performance three-dimensional mounting type semiconductor device can be realized.

  The second effect is that a small semiconductor device (first device 1 and second device 2) can be mounted on a printed circuit board (flexible circuit board 3). A substrate (flexible circuit board 3) can be realized. And since an external area becomes small, a printed circuit board (flexible circuit board 3) can be made cheaper.

  The third effect is that by mounting small semiconductor devices on electronic devices such as amusement devices, home game machines, medical devices, personal computers, car navigation systems, in-vehicle modules, etc., these electronic devices can be downsized. There is an effect that weight reduction and high performance can be realized.

<Second Embodiment>
The semiconductor device of the present embodiment has a network-on-chip (hereinafter referred to as NoC) structure in which communication is performed with the first device 1 and the second device 2 facing each other. Other configurations are the same as those of the first embodiment.

  In NoC, about 10,000 signal pins are required for communication, and it is necessary to connect the second surface 7 of the flexible circuit board 3 and the first surface 6 of the flexible circuit board 3 with VIA. is there. However, the VIA land diameter of the normal flexible circuit board 3 is about 0.2 mm in diameter, and signals of 10,000 pins can be wired only at intervals of 0.25 mm between the land pitches. In the present embodiment, a silicon interposer 4 having a narrow land pitch (for example, between land pitches, 0.15 mm) is inserted into a flexible circuit board, and the first device 1 and the second device 2 are also utilized using the silicon interposer 4. By connecting the device 2, the wiring density between NoC signals can be increased and the number of wirings can be increased. The first device 1 and the second device 2 are not only devices having a large number of pins and 10,000 pins, such as NoC, but also a device having a small number of pins and a low wiring density. Even so, the same effect can be realized.

<Third Embodiment>
FIG. 12 shows an example of a cross-sectional view of the semiconductor device of this embodiment.

  The semiconductor device of this embodiment is different from the first and second embodiments in that it does not have the support 5. In such a semiconductor device of this embodiment, the flexible circuit board 3 is bent so that the second surface 7 is in contact with the exposed surface (the lower surface in the drawing) of the second device 2.

  According to the semiconductor device of the present embodiment, it is possible to realize the effects described in the first and second embodiments. In addition, the three-dimensional mounting semiconductor device can be further reduced in size.

<Fourth Embodiment>
FIG. 13 shows an example of a cross-sectional view of the semiconductor device of this embodiment.

  The semiconductor device of this embodiment is different from the first and second embodiments in that other devices such as the passive component 21 are mounted on the first surface 6 of the flexible circuit board 3. Other configurations are the same as those in the first and second embodiments.

  Here, as described in the first embodiment, the first surface 6 of the flexible circuit board 3 includes a first region having a through hole and a direction in which the first region faces (upward in the figure). Direction) and a second region facing in the opposite direction (downward in the figure). The passive component can be mounted in the first region, for example.

  The passive component 21 may include at least one of a resistor, a capacitor, and an inductor, for example. The number of passive components 21 to be mounted is a matter of design. In place of or in addition to the passive component 21, another device can be mounted on the first surface 6 of the flexible circuit board 3.

  According to the semiconductor device of the present embodiment, it is possible to realize the effects described in the first and second embodiments. Further, by mounting the passive component 21 on the flexible circuit board 3, a multi-functional and miniaturized three-dimensional mounting semiconductor device can be obtained.

<Fifth Embodiment>
FIG. 14 shows an example of a cross-sectional view of the semiconductor device of this embodiment.

  The semiconductor device according to the present embodiment includes the first and second external terminals 15 formed on the third external electrode 14 on the first surface 6 of the semiconductor device having the structure described in the first and second embodiments. The semiconductor device (third device) having the structure described in the second embodiment is electrically connected to the first and second embodiments. Other configurations are the same as those in the first and second embodiments.

  According to the semiconductor device of the present embodiment, it is possible to realize the effects described in the first and second embodiments. Moreover, by taking such a structure, the mounting area of a board | substrate can be reduced and it can reduce in size. Note that the number of layers to be stacked is not limited to two, and may be three or more.

<Sixth Embodiment>
FIG. 15 shows an example of a cross-sectional view of the semiconductor device of this embodiment.

  The semiconductor device of this embodiment is the same as that of the third embodiment via the external terminal 15 formed on the third external electrode 14 of the first surface 6 of the semiconductor device having the structure described in the third embodiment. It differs from the third embodiment in that the semiconductor device (third device) having the structure described is electrically connected. Other configurations are the same as those of the third embodiment.

  According to the semiconductor device of the present embodiment, it is possible to achieve the effects described in the third embodiment. Moreover, by taking such a structure, the mounting area of a board | substrate can be reduced and it can reduce in size. Note that the number of layers to be stacked is not limited to two, and may be three or more.

<Seventh Embodiment>
FIG. 16 shows an example of a cross-sectional view of the semiconductor device of this embodiment.

  The semiconductor device of this embodiment is the same as that of the fourth embodiment via the external terminal 15 formed on the third external electrode 14 of the first surface 6 of the semiconductor device having the structure described in the fourth embodiment. It differs from the fourth embodiment in that the semiconductor device (third device) having the structure described is electrically connected. Other configurations are the same as those of the fourth embodiment.

  According to the semiconductor device of the present embodiment, it is possible to achieve the effects described in the fourth embodiment. Moreover, by taking such a structure, the mounting area of a board | substrate can be reduced and it can reduce in size. Note that the number of layers to be stacked is not limited to two, and may be three or more.

<Eighth Embodiment>
In the fifth to seventh embodiments, semiconductor devices having the same structure are stacked, but in this embodiment, semiconductor devices having different structures can be stacked. For example, the semiconductor device having the structure described in the first and second embodiments and the semiconductor device having the structure described in the third or fourth embodiment may be stacked. The vertical positional relationship in this stack is not particularly limited. That is, the semiconductor device having the structure described in the first and second embodiments may be positioned on the upper side, and the semiconductor device having the structure described in the third or fourth embodiment may be positioned on the lower side. The reverse may be possible. Further, the semiconductor device described in the third embodiment and the semiconductor device having the structure described in the fourth embodiment may be stacked. The vertical positional relationship in this lamination is not particularly limited. In the case of stacking in three or more stages, any combination of semiconductor devices can be stacked in any vertical relationship.

  According to the semiconductor device of the present embodiment, it is possible to realize the effects described in the fifth to seventh embodiments.

  As mentioned above, although embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to the said embodiment, and can carry out more modification | change in the range which does not deviate from the mind of invention. .

Hereinafter, examples of the reference form will be added.
1. A flexible circuit board having a through hole;
A silicon interposer embedded in the through hole;
A first device located on a first surface side of the flexible circuit board and electrically connected to both the flexible circuit board and the silicon interposer;
A second device located on the second surface side of the flexible circuit board in a front-back relationship with the first surface and electrically connected to both the flexible circuit board and the silicon interposer And having
An end portion of the flexible circuit board is bent to one surface side, and the second device is included in the flexible circuit board.
2. 1. The semiconductor device according to 1, wherein
A semiconductor device in which a minimum land pitch interval on the silicon interposer is smaller than a minimum land pitch interval on the flexible circuit board.
3. In the semiconductor device according to 1 or 2,
A semiconductor device in which the flexible circuit board and the silicon interposer are flush with each other.
4). In the semiconductor device according to any one of 1 to 3,
The flexible circuit board further includes a support, and the shape is supported by the support.
5. 4. The semiconductor device according to 4,
The support is any one of Fe, an alloy containing Ni and Fe, Al, an alloy containing Al, Cu, an alloy containing Ni and Cr, an alloy containing Cr, Si, a resin material, and mica. A semiconductor device composed of one or more materials.
6). In the semiconductor device according to any one of 1 to 5,
A semiconductor device in which a passive component is mounted on the first surface of the flexible circuit board.
7). In the semiconductor device according to any one of 1 to 6,
The first surface of the flexible circuit board has a first region having the through hole and a second region facing in a direction approximately 180 ° opposite to the direction in which the first region faces. And
A semiconductor device connected to a third device through the second region.
8). In the semiconductor device described in 7,
The semiconductor device according to claim 1, wherein the third device is a semiconductor device according to claim 1.
9. An LSI on which the semiconductor device according to any one of 1 to 8 is mounted.
10. An electronic device on which the semiconductor device according to any one of 1 to 8 is mounted.

DESCRIPTION OF SYMBOLS 1 1st device 2 2nd device 3 Flexible circuit board 4 Silicon interposer 5 Support body 6 1st surface of a flexible circuit board 7 2nd surface of a flexible circuit board 8 Flexible circuit board The second external electrode 9 The first external electrode 10 of the flexible circuit board 10 The first surface of the silicon interposer 11 The first external electrode of the silicon interposer 12 The second surface of the silicon interposer 13 The second surface of the silicon interposer External electrode 14 Third external electrode of flexible circuit board 15 External terminal 16 First insulating layer 17 Second insulating layer 18 Third insulating layer 19 Adhesive sheet 20 Mounting substrate 21 Passive component

Claims (10)

A flexible circuit board having a through hole;
A silicon interposer embedded in the through hole;
A first device located on a first surface of the flexible circuit board and electrically connected to both the flexible circuit board and the silicon interposer;
A second device located on a second surface of the flexible circuit board in a front-back relationship with the first surface and electrically connected to both the flexible circuit board and the silicon interposer And having
An end portion of the flexible circuit board is bent to one surface side, and the second device is included in the flexible circuit board. The semiconductor device according to claim 1,
A semiconductor device in which a minimum land pitch interval on the silicon interposer is smaller than a minimum land pitch interval on the flexible circuit board. The semiconductor device according to claim 1 or 2,
A semiconductor device in which the flexible circuit board and the silicon interposer are flush with each other. The semiconductor device according to any one of claims 1 to 3,
The flexible circuit board further includes a support, and the shape is supported by the support. The semiconductor device according to claim 4,
The support is any one of Fe, an alloy containing Ni and Fe, Al, an alloy containing Al, Cu, an alloy containing Ni and Cr, an alloy containing Cr, Si, a resin material, and mica. A semiconductor device composed of one or more materials. The semiconductor device according to any one of claims 1 to 5,
A semiconductor device in which a passive component is mounted on the first surface of the flexible circuit board. The semiconductor device according to any one of claims 1 to 6,
The first surface of the flexible circuit board has a first region having the through hole and a second region facing in a direction approximately 180 ° opposite to the direction in which the first region faces. And
A semiconductor device connected to a third device through the second region. The semiconductor device according to claim 7,
The semiconductor device according to claim 1, wherein the third device is a semiconductor device according to claim 1.   An LSI (Large Scale Integration) on which the semiconductor device according to any one of claims 1 to 8 is mounted.   An electronic device in which the semiconductor device according to claim 1 is mounted.

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