JP5837778B2 - Pyroelectric infrared sensor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a pyroelectric infrared sensor, and more particularly to an infrared sensor having a wide infrared light receiving region, high electromagnetic shielding properties, and excellent mass productivity, and a method for manufacturing the same.

  Starting with applications such as security and automatic doors, in recent years, the application of human body detection technology has expanded in various applications such as energy saving and nursing care. However, conventional pyroelectric infrared sensors used for human detection are not suitable for mass production and have a large size limit. Along with this, the demand for miniaturization, high quality and low price has increased in the market. On the other hand, there are proposals for improving electromagnetic shielding performance, noise countermeasures, miniaturization and productivity improvement. (For example, Patent Document 1 and Patent Document 2)

  Hereinafter, a conventional pyroelectric infrared sensor in Patent Document 1 will be described. FIG. 15 is a cross-sectional view of a pyroelectric infrared sensor disclosed in Patent Document 1, in which the drawing is simplified without departing from the spirit of the invention, and the mounted FET, capacitor, circuit pattern of the substrate, etc. are omitted. . The part names are the same as those in the invention. In FIG. 15, the infrared sensor 200 forms a frame body by joining a cylindrical metallic cap 57 to a metallic stem 51. A metallic base 52 is placed and connected to the metal stem 51, and a substrate 54 is placed via a spacer 53. Necessary circuit patterns are arranged on the substrate 54, and a pyroelectric element 56 is placed via a support base 55 made of a conductive material, and is electrically connected to the substrate 54. Further, an FET (not shown) is placed and connected to the substrate 54, and a capacitor (not shown) is placed and electrically connected between the substrate 54 and the metal base 52. The GND terminal 61 is fixed to the metal base 52 via a spacer made of a conductive material (not shown) and connected to the substrate 54, and the other two terminals 60 are connected to the metal base 52 via a spacer 62 made of an insulating material. It is fixed and connected to the substrate 54. The metallic cap 57 is formed with a rectangular window, and an infrared transmission filter 58 is attached to the window. In the conventional infrared sensor with a metal cap structure, inductance is generated in the terminal portion and the pattern portion of the substrate, and there is a disadvantage that it is easily affected by external high-frequency noise and malfunctions. By devising, resistance and inductance generated in the pattern and terminal part on the board were prevented, and it was made strong against high frequency noise.

  Patent Document 2 shows an example of an infrared sensor that does not have a metal cap and is a box-shaped package that has a rectangular opening on the upper surface and that has a rectangular opening on the upper surface, and that has a rectangular plate. ing. A step was provided in the rectangular opening, a rectangular optical filter was fitted, and the periphery thereof was sealed with a conductive adhesive, thereby widening the infrared light receiving area and improving electromagnetic shielding properties.

Japanese Patent Laid-Open No. 11-108757 Republished patent WO2006-120863

  However, in the conventional example shown in Patent Document 1, the shielding effect by the combination of the cylindrical metal cap and the metal stem and the high frequency noise removal effect by the arrangement of the capacitor are excellent in electromagnetic shielding properties. In addition, the pyroelectric sensor element holding structure and the electrical connection structure of each part are complex and low in productivity, the position of the pyroelectric sensor element is difficult to obtain due to the large number of parts, and the size of the infrared transmission filter compared to the external size Can not be made large, there is a drawback that the infrared light receiving area is narrow and the size cannot be reduced. In the conventional example shown in Patent Document 2, the infrared light receiving region can be expanded by adopting a structure in which a rectangular box-shaped metal package is sealed with a rectangular optical filter. However, a resin containing a metal plate is used. However, the sealing effect is limited and the electromagnetic shielding property is insufficient. In addition, because it has a square box structure, when mounting parts such as pyroelectric sensor elements, FETs, resistors, capacitors, etc., mass productivity is poor, and it is difficult to check the bonding quality such as soldering, and the yield is reduced. Problems also arise and lead to increased costs.

(Object of invention)
The present invention is intended to solve the above-described problems, and provides an infrared sensor having excellent electromagnetic shielding performance, a wide infrared light receiving area, and a simple structure. At the same time, the infrared sensor is excellent in mass productivity, small and inexpensive. It aims at providing the manufacturing method of.

In order to achieve the above object, the present invention provides a pyroelectric infrared device comprising a pyroelectric sensor element, an optical filter that selectively transmits infrared light, and a circuit unit that processes a signal output from the pyroelectric sensor element. In the sensor, a base composed of a multilayer printed circuit board on which circuit components are mounted, and a rectangular frame composed of a first spacer and a second spacer formed by forming a metal film layer on the side surface of the multilayer printed circuit board processed into a hollow structure The first spacer is provided with a receiving portion on each of two inner surfaces of a pair of sides facing each other, and the pyroelectric sensor element is mechanically and electrically connected and fixed to the receiving portion. In addition, the second spacer has an opening shape that is slightly larger than the outer shape of the pyroelectric sensor element, and is laminated and bonded to the upper surface of the first spacer via a conductive adhesive to make mechanical and electrical contact. Is fixed, characterized in that it is joined by laminating said optical filter and the frame and the base in a state of mounting the pyroelectric sensor element to the frame body with a conductive adhesive.

  According to the above configuration, the outer side surface or the inner side surface of the frame made of the first spacer and the second spacer processed into the hollow structure is covered with the metal film layer, and the metal film layer is laminated with the base and the optical filter. Because it is bonded, it has excellent electromagnetic shielding properties. Further, since the optical filter is larger than the opening of the second spacer, a sufficient infrared light receiving region can be obtained. Further, since the circuit component can be mounted on the base made of the multilayer printed board without the first spacer and the second spacer being joined, the productivity is high. Moreover, since the size of the pyroelectric sensor element can be made close to the opening of the second spacer, which is a frame, the size can be reduced.

Further , according to the above configuration, since the pyroelectric sensor element is connected and fixed to the upper side surface of the first spacer and the second spacer is connected and fixed to the same surface, the distance between the pyroelectric sensor element and the optical filter becomes accurate. In addition, since no inclination occurs, the infrared light receiving region is stabilized, and the light receiving accuracy is improved.

  The metal film layers formed on the side surfaces of the first spacer and the second spacer are preferably electrically connected to the electrodes of the multilayer printed board and connected to GND.

  According to the above configuration, the metal film layers formed on the side surfaces of the first spacer and the second spacer are directly connected and connected to the GND by the conductive adhesive, so there is no interposition of terminals and the like, and the generation of inductance is small. Strong against external high frequency noise.

  In the base, at least one intermediate layer of the multilayer printed board may be connected to GND.

  Since the intermediate layer of the base made of a multilayer printed board is a metal film layer over the entire area and is connected to GND, the bottom surface and the frame of the infrared sensor have the same effect as a single metal cap, and have excellent electromagnetic shielding properties.

2. A pyroelectric infrared sensor manufacturing method according to claim 1, wherein a base assembly mounting step of mounting circuit components on the base forming the aggregate substrate structure, and an aggregate substrate structure are provided. The step of joining the second spacer and the pyroelectric sensor element forming the collective substrate structure with the first spacer and joining the frame shape of the second spacer to the upper surface of the frame shape of the first spacer A frame assembly joining step of mounting the pyroelectric sensor element on a receiving portion provided by a convex portion formed on each of two inner surfaces of a pair of sides facing each other of the first spacer ; An infrared sensor assembly joining step in which a base assembly, the frame assembly, and the optical filter are stacked and joined with a conductive adhesive; and the infrared sensor assembly is diced. And having a singulation process to separate, the.

  According to the above configuration, the base, the first spacer, and the second spacer can adopt a manufacturing method using an aggregate, and can be separated into individual pieces by dicing after all the parts are joined and bonded.

The metal film layer on the side of each of the frame-shaped multi-layer printed circuit board that is processed into a hollow structure is formed in the second spacer form a first spacer or aggregate substrate structure, forming a collective substrate structure, and two pairs of orthogonal One side of the side may have a metal layer formed on the outer side surface of the frame shape, and the other side may have a metal layer formed on the inner side surface of the frame shape.

  According to the above configuration, the metal film layer is formed on the inner side surface corresponding to the pair of outer side surfaces of the first spacer or the second spacer that are cut when the first spacer or the second spacer is cut. Therefore, the shield structure is maintained.

Supporting the respective frame inner side surface and a a pair of sides the metal film layer is not formed by a pyroelectric sensor elements in the form of a multilayer printed circuit board which is processed into a hollow structure in the first spacer constituting the aggregate substrate structure For this purpose, a receiving portion and an electrode may be provided.

  According to the above configuration, when dicing into individual pieces, the pyroelectric sensor is formed on the inner side surface of the hollow structure of the first spacer forming the collective substrate structure or the second spacer forming the collective substrate structure and having no metal film layer. By providing a receiving portion and an electrode for supporting and connecting the element, a metal film layer is formed on the outer side surface. Therefore, the shield structure is maintained.

  As described above, according to the present invention, the side surfaces of the hollow first spacer and the second spacer are covered with the metal film layer, and the metal film layer, the base, and the optical filter are bonded and fixed via the conductive adhesive. Since it is electrically connected, it has excellent electromagnetic shielding properties, and since the optical filter can be made larger than the opening of the second spacer, it can provide a small infrared sensor with a wide infrared light receiving area and a structure in which circuit components can be easily mounted. In addition, by enabling the manufacturing method using the aggregate, it is possible to provide an inexpensive infrared sensor manufacturing method that is excellent in mass productivity.

It is the perspective view and sectional drawing which show the infrared sensor 100 by 1st Embodiment of this invention. 1 is a circuit diagram showing an infrared sensor 100 according to a first embodiment of the present invention. It is the perspective view and sectional drawing explaining the base 10 of 1st Embodiment. It is the perspective view and sectional drawing explaining the 1st spacer 2 of 1st Embodiment. It is the perspective view and sectional drawing explaining the 2nd spacer 3 of 1st Embodiment. It is sectional drawing and the exploded perspective view explaining the joining procedure and composition of pyroelectric sensor element 5 of a 1st embodiment. It is the perspective view and sectional drawing explaining joining of the optical filter 4 of 1st Embodiment. It is a disassembled perspective view explaining the laminated structure of the whole infrared sensor of 1st Embodiment. It is the perspective view and sectional drawing which show the whole structure of the infrared sensor 100L by 2nd Embodiment of this invention. It is the whole disassembled perspective view and sectional drawing explaining the manufacturing method of 2nd Embodiment. It is the perspective view and sectional drawing explaining the manufacturing method of the base 10L of 2nd Embodiment. It is a disassembled perspective view explaining the joining procedure of the pyroelectric sensor element 5 of 2nd Embodiment. It is a disassembled perspective view explaining the whole joining procedure of 2nd Embodiment. It is a perspective view explaining the individualization process of 2nd Embodiment. It is a perspective view explaining the completed form after individualization of 2nd Embodiment. It is sectional drawing of the conventional pyroelectric infrared sensor.

(First embodiment)
Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a perspective view and a sectional view of an infrared sensor 100 according to the first embodiment. FIG. 1B is a circuit diagram of the infrared sensor 100 according to the first embodiment. 2 shows the configuration of the base 10, FIG. 3 shows the configuration of the first spacer 2, FIG. 4 shows the configuration of the second spacer 3, and FIG. 5 shows the configuration of the first spacer 2, the pyroelectric sensor element 5, and the second spacer 3. FIG. 6 shows the bonding procedure of the optical filter 4 and FIG. 7 shows the entire laminated structure of the infrared sensor 100. FIG.

(Overall configuration of infrared sensor 100)
1A is a perspective view of the assembled infrared sensor 100, FIG. 1B is a cross-sectional view taken along the line AA of FIG. 1A, and FIG. FIG. 1A shows that each component has a rectangular shape laminated and bonded. From the bottom, the first spacer 2 and the second spacer in which the base 10 and the pyroelectric sensor element 5 are electrically connected and fixed are shown. 3 and the optical filter 4 are laminated in this order. Note that the first spacer 2 and the second spacer 3 are not in a vertical positional relationship, and the one that connects and fixes the pyroelectric sensor element 5 is the first spacer 2.

  Next, the structure will be described with reference to FIG. The base 10 is formed of a multilayer printed circuit board, and a leak resistor 7 and a FET 8 (not shown) that are circuit components necessary for the infrared sensor 100 are mounted on the upper layer printed pattern. The lower layer print pattern of the base 10 is formed with a surface mountable pattern. The first spacer 2 is formed of a multilayer printed board processed into a hollow structure, and has a frame function in which a metal film layer is formed on a side surface, a receiving portion that receives the pyroelectric sensor element 5, and an electrode function. The 2nd spacer 3 consists of a multilayer printed circuit board processed by the hollow structure, and has a frame function which formed the metal film layer in the side surface. The optical filter 4 has a function of selectively transmitting infrared rays.

  The first spacer 2 is laminated and bonded to the upper surface of the base 10 via the conductive adhesive 6. A pyroelectric sensor element 5 is bonded and fixed to the convex portions 2 A and 2 B inside the first spacer 2 via a conductive adhesive 6. The height of the first spacer 2 takes into account the space for mounting the circuit element below the pyroelectric sensor element 5 and the space for holding the hollow so as not to be thermally affected by the pyroelectric sensor element 5 itself. I have decided. The detailed structure of the pyroelectric sensor element 5 will be described later. The second spacer 3 is laminated and bonded to the upper surface of the first spacer 2 via a conductive adhesive 6, and has an opening shape slightly larger than the outer shape of the pyroelectric sensor element 5. An optical filter 4 is laminated and bonded to the upper surface of the second spacer 3 via a conductive adhesive 6. With the above configuration, the base 10, the first spacer 2, the second spacer 3, and the optical filter 4 are electrically and mechanically connected and fixed to each other through the conductive adhesive 6 and have a completely sealed structure. ing. FIG. 1C shows a circuit configuration of the infrared sensor 100. The pyroelectric sensor element 5 is connected between the gate 8 a of the FET 8 and the GND terminal 9. The leak resistor 7 is connected in parallel with the pyroelectric sensor element 5 between the gate 8 a of the FET 8 and the GND terminal 9. The basic circuit of the infrared sensor 100 is known, and the present embodiment has the same configuration.

(Configuration of base 10)
Next, the configuration of the base 10 will be described with reference to FIGS. 2 (a) and 2 (b). 2A is a perspective view of a state in which circuit components are mounted on the base 1, and FIG. 2B is a cross-sectional view taken along line BB in FIG. A printed pattern is formed on the upper layer 1a of the base 1 made of a multilayer printed board, and the leak resistor 7 and the FET 8 (field effect transistor) are mounted by soldering or the like, but work can be performed without any obstacles such as a frame. It is. Similarly, a print pattern is formed on the lower layer 1c to form a surface mountable pattern. The intermediate layer 1b uses the entire pattern surface as GND, and is connected to the upper layer 1a and the lower layer 1c by vias (not shown) at predetermined locations. As described above, the base 10 on which the circuit components are mounted has a pattern configuration capable of being mounted on the lower layer 1c, and the intermediate layer 1b has a pattern configuration dedicated to the shield.

(Configuration of the first spacer 2)
Next, the configuration of the first spacer 2 will be described with reference to FIG. 3, (a) is a perspective view of the first spacer 2, and (b) and (c) are a CC sectional view and a DD sectional view, respectively, of (a). A metal film layer is formed on the side surface of the multilayer printed board processed into a hollow structure, and convex portions 2A and 2B are formed on the two inner surfaces of a pair of sides facing each other, and the pyroelectric sensor element 5 is mechanically It is a receiving part for electrically connecting and fixing. One receiving portion 2A is covered with the upper layer pattern and lower layer pattern of the insulating layer 2a, the metal film layer 2d formed on the inner side surface, and the metal film layer 2c formed on the outer side surface. The other receiving portion 2B, the inner side surface of the insulating layer 2a is covered with the metal film layer 2b, is separated from the upper layer pattern and the lower layer pattern, and is mounted when connected and fixed to the base 10. It is connected to the gate of the FET 8 (see FIGS. 1B and 1C). In addition, the side surfaces 2e on both sides of the convex portions 2A and 2B formed on the two inner surfaces are surfaces processed to create the convex shape of the receiving portion, and the metal film layer is omitted. In addition, in a pair of sides orthogonal to the surfaces having facing convex portions, a metal film layer 2d is formed on the inner side surface of the frame shape, and a metal film layer 2c is formed on the outer side surface.

(Configuration of the second spacer 3)
Next, the configuration of the second spacer 3 will be described with reference to FIG. 4A is a perspective view of the second spacer 3, and FIG. 4B is a cross-sectional view taken along the line EE and FIG. 4C, respectively. A metal film layer is formed on the side surface of the multilayer printed board processed into the hollow structure, and a metal film layer 3d is formed on the inner side surfaces of the two pairs of orthogonal sides, and is connected to the upper layer pattern and the lower layer pattern. Further, a metal film layer 3c is formed on the outer side surfaces of the two orthogonal pairs of sides, and is connected to the upper layer pattern and the lower layer pattern.

(Configuration of pyroelectric sensor element 5)
Next, the configuration of the pyroelectric sensor element 5 will be described with reference to FIG. 5A is a cross-sectional view of the first spacer 2, the pyroelectric element 5, and the second spacer 3, and FIG. 5B is an exploded perspective view of the pyroelectric sensor element 5. FIG. In FIG. 5A, the pyroelectric sensor element 5 is placed on the receiving portions 2A and 2B formed on the first spacer 2 via the conductive adhesive 6, and is electrically connected and fixed. Next, the second spacer 3 is placed on the upper surface of the first spacer 2 through the conductive adhesive 6, and is electrically connected and fixed. Thus, the assembly 20 of the first spacer 2, the pyroelectric sensor element 5, and the second spacer 3 can be assembled in advance. Next, the configuration of the pyroelectric sensor element 5 will be described with reference to FIG. Light receiving electrodes 11 a and 12 a are disposed on the infrared light receiving side of the pyroelectric body 14 made of lead titanate zirconate or the like, and are electrically connected by a narrow connecting portion 13. Opposite electrodes 11b and 12b are opposed to the light receiving electrodes 11a and 12a with the pyroelectric substrate 14 interposed therebetween. The light receiving electrode 11a and the counter electrode 11b form the light receiving element portion 11, the light receiving electrode 12a and the counter electrode 12b compensating element portion 12, and form the pyroelectric sensor element 5. The pyroelectric sensor element 5 is provided with two electrode connection portions 11f and 12f. The pyroelectric sensor element 5 is publicly known, and this embodiment has the same configuration.

(Configuration of optical filter 4)
Next, the configuration of the optical filter 4 will be described with reference to FIG. 6A is a perspective view showing the configuration of the second spacer 3 and the optical filter 4, FIG. 6B is a GG cross section, and FIG. 6C is an HH cross section. The optical filter 4 is connected and fixed to the upper surface of the second spacer 3 via a conductive adhesive 6. The optical filter 4 is well-known and is made of single crystal silicon or the like and has a function of selectively transmitting infrared rays. The optical filter 4 is electrically connected by being bonded and fixed to the metal film layer of the second spacer 3 with the conductive adhesive 6. The In the present embodiment, the outer size of the optical filter 4 is slightly smaller than the outer size of the second spacer 3, and a slight positional deviation is allowed.

(Laminated structure)
Next, a laminated structure will be described with reference to FIG. FIG. 7 is an exploded perspective view of each component of the infrared sensor 100. The base 10, the first spacer 2 to which the pyroelectric sensor element 5 is connected and fixed, the second spacer 3, and the optical filter 4 can be bonded and assembled in this order. Each component has a structure in which an appropriate amount of the conductive adhesive 6 can be applied and positioned and bonded and fixed by a method such as screen printing.

[Operation of Infrared Sensor 100]
The operation of the infrared sensor 100 will be described with reference to FIGS. 1B, 1C, and 5B. In FIG. 5B, the infrared rays P1 and P2 that pass through the optical filter 4 and enter the light receiving element portion 11 and the compensation element portion 12 are compensated with the light receiving element portion 11 when the amount of light is biased by the operation of the human body or the like. A difference occurs in the polarization of the element part 12, and an output is obtained. In FIG. 1C, the leak resistor 7 converts this output into a voltage and applies it to the gate 8 a of the FET 8. A power supply voltage is applied to the drain terminal 8 b of the FET 8. As a result, a voltage signal corresponding to the output of the pyroelectric sensor element 5 is output to the source terminal 8c. In FIG. 1B, θ represents an angle at which light can be received, and a larger light receiving region is obtained as θ is larger.

[Effect of the embodiment]
According to the first embodiment described above, the following effects can be obtained.

  (1) The outer side surface or the inner side surface of the frame made of the first spacer 2 and the second spacer 3 processed into a hollow structure is covered with a metal film layer, and the metal film layer is formed between the base 1 and the optical filter 4. Since it is laminated and connected to GND, it has excellent electromagnetic shielding properties. In addition, a metal cap and a resin package containing metal are no longer required.

  (2) Since the optical filter 4 is larger than the opening of the second spacer 3, a wide infrared light receiving region can be obtained. Moreover, since the opening part of the 2nd spacer 3 can be closely approached with respect to the external shape of the pyroelectric sensor element 5, it can reduce in size.

  (3) Since the circuit component can be mounted on the base 1 made of the multilayer printed board without the frame body being joined, the mass productivity is excellent. In addition, it is easy to check the bonding quality of the mounted components.

  (4) Since the pyroelectric sensor element 5 and the optical filter 4 are arranged to face each other through only one part of the second spacer 3, the distance and angle thereof are stable with little variation and excellent in detection accuracy. In addition, the pyroelectric sensor element 5 is easily held and connected, and is easy to assemble. Further, by changing the height of the first spacer 2 and the second spacer 3, the position in the height direction of the pyroelectric sensor element 5 can be controlled to change the light receiving area or the lower space of the pyroelectric sensor element 5. Easy to do.

  The infrared sensor 100 according to the present invention is not limited to the above embodiment. For example, with respect to the bonding order, the first spacer 2, the pyroelectric sensor element 5, and the second spacer 3 assembly 20 are sub-assembled, but the pyroelectric process is performed after the first spacer assembly 2 is joined to the base 10. A procedure for mounting and joining the sensor element 5 may be used. In consideration of mounting stability and thermal shielding properties of the pyroelectric sensor element 5, the width and number of the receiving portions 2A and 2B of the first spacer 2 can be changed. Moreover, the width | variety of the surface 2e without the metal film layer processed on both sides of each convex part 2A, 2B can be changed according to a processing method. In addition, although the metal film layer on the side surface of the second spacer 3 is on all the surfaces, the four sides may be constituted by the metal film layer on either the inner side or the outer side surface. In the embodiment, the first spacer 2 and the second spacer 3 are each made of a multilayer printed board, but may be made by integral molding of resin and may be configured by MID. The outer size of the optical filter 4 is smaller than the outer size of the second spacer 3, but it may be the same size depending on the manufacturing method.

(Second Embodiment and Manufacturing Method)
Next, a method for manufacturing the infrared sensor 100L according to the second embodiment will be described with reference to FIGS. FIG. 8 shows the configuration of the infrared sensor assembly 100L after assembly, FIG. 9 shows the stacked configuration of the infrared sensor assembly 100L, and the configuration of the metal film layers of the first spacer assembly 2L and the second spacer assembly 3L. Is a manufacturing method of the base assembly 10L, FIG. 11 is an assembly procedure of the structure of the first spacer assembly 2L and the second spacer assembly 3L and the pyroelectric sensor element 5, and FIG. 12 is an overall assembly procedure. 13 shows an individualization process by dicing, and FIG. 14 shows a completed form of the individualized infrared sensor 100L.

(Overall configuration of infrared sensor assembly 100L)
With reference to FIG. 8, the state after the assembly of the infrared sensor assembly 100L will be described. FIG. 8A shows a state after assembly of the assembly, and FIG. 8B shows a cross section taken along line II in FIG. In FIG. 8A, the infrared sensor assembly 100L is provided with a plurality of infrared sensors 100L. In this embodiment, four infrared sensors 100L are provided. The infrared sensor assembly 100 </ b> L is provided with three grooves 30, and the infrared sensors 100 </ b> L are arranged between the grooves 30. In (b), the cross section of the infrared sensor 100L pinched | interposed into each groove | channel 30 is shown.

  Next, a laminated structure of the infrared sensor assembly 100L will be described with reference to FIG. FIG. 9A is an exploded perspective view of a laminated structure of the infrared sensor assembly 100L, FIG. 9B shows a JJ section of FIG. 9A, and FIG. 9C shows a KK section of FIG. . In FIG. 9A, the base assembly 10L, the first spacer assembly 2L joined with the pyroelectric sensor element 5, the second spacer assembly 3L, and the optical filter 4 can be stacked in this order from the bottom. In addition, each component can apply and position an appropriate amount of the conductive adhesive 6 by a method such as screen printing, position, and bond and fix. The first spacer assembly 2L and the second spacer assembly 3L are not in a vertical positional relationship, and the one that connects and fixes the pyroelectric sensor element 5 is the first spacer assembly 2L. A plurality of positioning holes (not shown) are provided in the base assembly 10L, the first spacer assembly 2L, and the second spacer assembly 3L, respectively, and positioning with a jig is possible. Alternatively, the grooves 30 provided in the base assembly 1L, the first spacer assembly 2L, and the second spacer assembly 3L may be used for positioning. Next, the configuration of the metal film layers of the first spacer assembly 2L and the second spacer assembly 3L will be described with reference to FIGS. 9B and 9C. In FIG. 9B, the second spacer aggregate 3L made of a multilayer printed board has a metal film layer 3c formed on both side surfaces of the groove 30, and a metal film layer 3d formed on both side surfaces inside the rectangular hollow structure. The upper and lower patterned surfaces are connected to cover the insulating layer 3a. The same applies to the other element portions. In addition, although the pattern is deleted for the edge part of the circumference | surroundings of the 2nd spacer aggregate 3L for convenience, the metal film layer may cover the whole surface. Next, in FIG. 9C, the first spacer assembly 2L will be described. However, the same components as those in FIG. The metal film layer of the first spacer assembly 2L shown in FIG. 9B is different from the metal film layer of the second spacer assembly 3L because the electrode 2b of the receiving portion of the pyroelectric element 5 is separated. Yes, the configuration is the same as that of the metal film layer 2b shown in FIG.

(Configuration and procedure of base aggregate 10L)
Next, mounting of circuit components of the base aggregate 10L will be described with reference to FIG. 10A is a perspective view of the base assembly 10L on which components are mounted, FIG. 10B is an enlarged view of the M portion of one sensor portion, and FIG. 10C is an NN cross section thereof. 10, the same components as those in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted. The base assembly 10L shown in FIG. 10 is different from the base 10 shown in FIG. 2 in an assembly configuration, and each element portion is disposed between the grooves 30. As for circuit component mounting, after a series of pre-processing such as cream solder printing, it is set on a mounting machine (not shown), a required quantity of leakage resistors 7 and FETs 8 are mounted, and soldering can be performed in a reflow process (not shown). . In addition, since circuit components can be mounted at a stage before joining the frame of the next process, workability is extremely good. The base assembly 10L on which components are mounted is obtained by the above procedure.

(Procedure for joining pyroelectric sensor element 5 and frame)
Next, the joining of the frame and the pyroelectric sensor element 5 will be described with reference to FIG. FIG. 11A is an exploded perspective view showing a joining procedure of the first spacer assembly 2L, the pyroelectric sensor element 5, and the second spacer assembly 3L, and FIG. 11B is an enlarged view of a P portion of FIG. , (C) shows an enlarged view of the Q part. In FIG. 11 (a), the same components as those in FIG. 5 (a) are denoted by the same reference numerals, and redundant description is omitted. The difference between the assembly 20L shown in FIG. 11A and the assembly 20 shown in FIG. 5A is that the first spacer 2 and the second spacer 3 are assembled. In addition, FIG.11 (b) P part enlarged view and (c) Q part enlarged view correspond to FIG. 3 (a) and FIG. 4 (a), respectively, About the side surface inside a hollow structure, it is the same structure. Because of this, redundant description is omitted. For joining the first spacer assembly 2L, the pyroelectric sensor element 5, and the second spacer assembly 3L, an appropriate amount of the conductive adhesive 6 is applied by a method such as screen printing, set on a mounting machine (not shown), and pyroelectric The sensor element 5 is positioned and bonded and fixed to each element portion. Thus, the assembly 20L of the first spacer assembly 2L, the pyroelectric sensor element 5, and the second spacer assembly 3L is obtained.

(Optical filter 4 and overall joining procedure)
Next, the optical filter 4 and the entire joining procedure will be described with reference to FIG. An appropriate amount of the conductive adhesive 6 is applied to the back surface of the assembly 20L in advance by a method such as screen printing, and is positioned and joined to the base assembly 10L on which the circuit components are mounted. Next, an appropriate amount of conductive adhesive 6 is applied to the upper surface of the joined assembly 20L by a method such as screen printing and set on a mounting machine (not shown), and the optical filter 4 is mounted on each sensor unit and bonded and fixed. And make electrical connections. Thereby, the infrared sensor aggregate 100L is obtained.

(Individualization by dicing)
Next, individualization by dicing will be described with reference to FIG. In FIG. 13, the infrared sensor assembly 100 </ b> L is set in a dicing apparatus (not shown), and is cut using a dicing blade 40 in the direction of the arrow. The base assembly 10L, the first spacer assembly 2L, and the second spacer assembly 3L that have already been laminated and bonded are provided with the grooves 30 described above. Therefore, it is only necessary to cut in the direction indicated by the arrow in the orthogonal direction. Can be singulated without cutting. Thereby, the infrared sensor 100L is obtained. The details of the actual dicing process are omitted.

  Next, the separated infrared sensor 100L will be described with reference to FIG. 14A is a perspective view of the separated infrared sensor 100L, FIG. 14B is a perspective view of the separated first spacer assembly 2L, and FIG. 14C is a separated piece. It is a perspective view of the 2nd spacer aggregate 3L. In FIG. 14A, metal film layers 2c and 3c are respectively formed on two surfaces (corresponding to the grooves 30) orthogonal to the two surfaces cut by dicing, and the first spacer is formed on the dicing surface. A surface 2f of the aggregate 2L without the metal film layer and a surface 3f of the second spacer aggregate 3L without the metal film layer appear. However, as shown in FIG. 14B, the metal film layer 2d is formed on the inner side surface of the first spacer assembly 2L, and as shown in FIG. 14C, the second spacer assembly 2L is formed. A metal film layer 3d is formed on all inner side surfaces of the body 3L. Thus, in the infrared sensor 100L, the metal film layer is formed on either the outer side surface or the inner side surface of the first spacer assembly 2L or the second spacer assembly 3L. As described above, in the infrared sensor 100L, the bottom surface is covered with the intermediate metal film layer of the base 1L, the side surfaces are covered with the metal film layers of the first spacer assembly 2L and the second spacer assembly 3L, and the upper surface is the optical filter. 4 to obtain a structure excellent in electromagnetic shielding.

[Effect of the embodiment]
According to the second embodiment and the manufacturing method described above, the following effects can be obtained.

  (1) The base assembly 10L, the first spacer assembly 2L to which the pyroelectric sensor element 5 is joined, the second spacer assembly 3L, and a laminated structure of the optical filter 4 are formed. Since assembly can be performed by repeating the process of laminating and joining according to a predetermined procedure, the manufacturing process is simple and the mass productivity is excellent.

  (2) In the mounting process of the circuit components of the base assembly 10L, it is possible to use a general surface mounter without any obstacles such as a frame, which is excellent in mass productivity and inexpensive. Can be realized. In addition, it is easy to check the bonding quality of the mounted components and the quality is excellent.

  (3) It is possible to adopt a manufacturing method using an assembly of the base 1, the first spacer 2, and the second spacer 3 made of a multilayer printed circuit board, which is extremely excellent in mass productivity. In addition, because of the completely sealed structure, the product has good dust resistance and high quality products.

  The infrared sensor 100L according to the present invention is not limited to the above embodiment. Regarding the mounting of the pyroelectric sensor element 5, the assembly 20L of the first spacer assembly 2L, the pyroelectric sensor element 5, and the second spacer assembly 3L is a sub-assembly, but the first spacer is attached to the base assembly 10L. A procedure for mounting and joining the pyroelectric sensor element 5 after joining the assembly 2L may be used. Further, the metal film layer on the inner side surface of the hollow structure of the second spacer assembly 3L does not have to be on all surfaces, and may not be on the surface orthogonal to the surface cut by dicing. Moreover, although application | coating of the conductive adhesive 6 was made into the method by screen printing, the fixed_quantity | quantitative_application method by a dispenser may be sufficient and a sheet-like thing may be employ | adopted. Moreover, although the surface mountable pattern is formed on the lower layer 1c of the base assembly 1L, a lead terminal can be added. In addition, the metal film layer formed on the side surface of the multilayer printed board processed into a hollow structure can be electroless Ni-plated or MID. Although the number of infrared sensor assemblies 100L is four, the number is not limited to this, and a plurality of infrared sensor assemblies 100L may be used.

1, 1L base (multilayer printed circuit board)
10, 10L base (component mounting)
1a, 1b, 1c, 1d Upper layer, intermediate layer, lower layer, insulating layer 2, 2L First spacer (multilayer printed circuit board)
2A, 2B Pyroelectric sensor element receiving part and electrode 2a Insulating layer 2b Electrode (metal film layer)
2c Metal film layer 2d forming the outer side surface Metal film layer 2e forming the inner side surface 2f Surface 2f without the metal film layer on the inner side surface 3, 3L Second spacer (multilayer printed circuit board)
3a Insulating layer 3c Metal film layer 3d forming the outer side surface Metal film layer 3f forming the inner side surface Surface having no metal film layer on the outer side surface 4 Optical filter 5 Pyroelectric sensor element 6 Conductive adhesive 9 GND terminal 40 Dicing blade 100, 100L infrared sensor

Claims (6)

A multilayer printed circuit board on which circuit components are mounted in a pyroelectric infrared sensor comprising a pyroelectric sensor element, an optical filter that selectively transmits infrared light, and a circuit unit that processes a signal output from the pyroelectric sensor element And a pair of sides of the first spacer facing each other , the base frame comprising a first spacer and a second spacer having a metal film layer formed on a side surface of a multilayer printed board processed into a hollow structure. A receiving portion is provided by a convex portion formed on each of the two inner surfaces of the, and the pyroelectric sensor element is mechanically and electrically connected and fixed to the receiving portion, and the second spacer is a pyroelectric sensor element. has little larger opening shape than the outer shape of the first laminated bonded via a conductive adhesive to the upper surface of the spacer mechanical, are electrically connected and fixed, the pyroelectric cell to said frame body Pyroelectric infrared sensor, characterized in that said optical filter and the frame and the base in a state of mounting the support element is joined with a conductive adhesive is laminated.   2. The pyroelectric device according to claim 1, wherein the metal film layers formed on the side surfaces of the first spacer and the second spacer are electrically connected to electrodes of the multilayer printed circuit board and to GND. Type infrared sensor.   The pyroelectric infrared sensor according to claim 1, wherein at least one intermediate layer of the multilayer printed circuit board is connected to GND in the base. 2. The pyroelectric infrared sensor manufacturing method according to claim 1, wherein a base assembly mounting step of mounting circuit components on the base forming the collective substrate structure, and the first spacer and the collective substrate structure forming the collective substrate structure are provided. A step of joining the second spacer and the pyroelectric sensor element, wherein the frame shape of the second spacer is joined to the upper surface of the frame shape of the first spacer, and the pair of the first spacers facing each other; A frame assembly joining step of mounting the pyroelectric sensor element on a receiving portion provided by a convex portion formed on each of the two inner surfaces of the side, and the base assembly and the frame assembly, An infrared sensor assembly joining step in which the optical filters are stacked and joined with a conductive adhesive, and a singulation step in which the infrared sensor assembly is separated by dicing. Method for producing a pyroelectric infrared sensor according to symptoms.   A metal film layer is formed on each of the frame-shaped side surfaces of the multilayer printed circuit board processed into a hollow structure in the first spacer forming the aggregate substrate structure or the second spacer forming the aggregate substrate structure, and orthogonal to each other. 5. The metal layer is formed on the outer side surface of the frame shape on one side of the two pairs of sides, and the metal layer is formed on the inner side surface of the frame shape on the other side. The manufacturing method of the pyroelectric infrared sensor of description. The pyroelectric sensor element is formed on a pair of sides on the inner side surface of each frame shape of the multilayer printed board processed into a hollow structure in the first spacer that forms the aggregate substrate structure, on which no metal film layer is formed. method for producing a pyroelectric infrared sensor according to claim 4 or claim 5, characterized in that a receiving portion and the electrode for supporting the.

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