JP5813574B2 - プラズマ処理装置及びプラズマ処理方法 - Google Patents

プラズマ処理装置及びプラズマ処理方法 Download PDF

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JP5813574B2
JP5813574B2 JP2012111617A JP2012111617A JP5813574B2 JP 5813574 B2 JP5813574 B2 JP 5813574B2 JP 2012111617 A JP2012111617 A JP 2012111617A JP 2012111617 A JP2012111617 A JP 2012111617A JP 5813574 B2 JP5813574 B2 JP 5813574B2
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gas
shower plate
plasma processing
supplied
processing chamber
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JP2013239584A5 (https=
JP2013239584A (ja
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久夫 安並
久夫 安並
森　政士
政士 森
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2012111617A 2012-05-15 2012-05-15 プラズマ処理装置及びプラズマ処理方法 Active JP5813574B2 (ja)

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JP2012111617A JP5813574B2 (ja) 2012-05-15 2012-05-15 プラズマ処理装置及びプラズマ処理方法

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JP2012111617A JP5813574B2 (ja) 2012-05-15 2012-05-15 プラズマ処理装置及びプラズマ処理方法

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JP2013239584A JP2013239584A (ja) 2013-11-28
JP2013239584A5 JP2013239584A5 (https=) 2014-10-30
JP5813574B2 true JP5813574B2 (ja) 2015-11-17

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