JP5797917B2 - IC tag mounting structure before grinding and rolling bearing with IC tag using the same - Google Patents

Description

This invention includes a grinding prior to mounting structure of the IC tag capable of communicating information by non-contact communication, about the IC-tagged rolling bearings mounted an IC tag by the mounting structure.

  In recent years, IC tags capable of exchanging information by non-contact communication have been reduced in size and cost, and are already widely used mainly in the field of physical distribution, and are also being used in the field of machinery.

  For example, when an IC tag is attached to a component of a mechanical device such as a rolling bearing, the IC tag can store various types of identification information such as the type, manufacturing time, manufacturing lot, and manufacturing history of the component. Then, when the information stored in the IC tag is read at an appropriate time such as storage, distribution, before use, in use, after use, etc., the identification information of the part can be immediately grasped. . Therefore, it is not necessary to check the stamped on the parts as in the past and check the identification information of the parts with a computer or book of the manufacturer, etc., in the case of maintenance or failure etc. Maintenance work and repair can be performed efficiently.

  By the way, if the attachment structure of the IC tag to the component parts of the mechanical device is only the IC tag attached to the surface of the attachment object, the IC tag may be peeled off. Therefore, it has been proposed that an IC tag is disposed inside a mounting hole that opens on the surface of an object to be mounted, and that the mounting hole is covered with a lid so that the IC tag does not fall off (for example, (See Patent Document 1).

JP 2006-226498 A

  In the IC tag mounting structure in which the non-contact communication type IC tag is placed in the mounting hole of the mounting object and the mounting hole is covered with the lid as described above, the IC tag is not firmly fixed in the mounting hole. There is a possibility that the position of the IC tag is shifted due to an impact or the like applied to the object and proper communication cannot be performed between the IC tag and the external reader / writer device.

  On the other hand, if the IC tag is placed in the mounting hole and the adhesive layer that seals the IC tag is formed with the adhesive injected into the mounting hole, the IC tag is fixed at a position where proper communication can be performed. can do.

  However, in the IC tag mounting structure in which the IC tag is sealed in the adhesive layer, foreign matter adheres to the surface of the adhesive layer after the adhesive layer is formed, so that the appearance quality deteriorates and the inspection standard at the time of shipment is satisfied. You may not be satisfied.

  For example, as shown in FIG. 5, when the attachment surface 52a is ground after the IC tag 51 is attached to the attachment object 52, the entire attachment hole 52b is usually filled with an adhesive for enclosing the IC tag 51. Therefore, a concave portion 54 having the surface of the adhesive layer 53 as a bottom surface is formed on the mounting surface 52a, and foreign matter such as dust and grinding powder on the mounting surface 52a is likely to accumulate in the concave portion 54. Since the surface layer removal amount g by grinding is determined by the dimensional accuracy of the attachment object 52, when the surface layer removal amount g is small, the surface of the adhesive layer 53 to which foreign matter has adhered remains unground. Become.

  On the other hand, if the entire mounting hole is filled with adhesive, the adhesive or IC tag may be partially removed during the grinding process of the mounting surface. The adhesive may entrap grinding dust, and the IC tag is the worst If it is damaged, it may become unreadable. This is due to the fact that the required amount of surface layer removal by grinding varies depending on the degree of heat treatment deformation of the attachment object.

  Accordingly, the present invention provides an IC tag mounting structure before grinding that prevents foreign matter from adhering to the surface of an adhesive layer that encloses an IC tag in a mounting hole of a mounting target, and a rolling bearing with an IC tag using the same. The issue is to provide.

  In order to solve the above-mentioned problems, the IC tag mounting structure before grinding according to the present invention has a non-contact communication type IC tag disposed in a mounting hole that opens on the surface of an object to be mounted, and an adhesive that is injected into the mounting hole. In the IC tag mounting structure in which an adhesive layer for encapsulating the IC tag is formed with an agent before surface grinding is performed around the mounting hole, the surface of the adhesive layer is formed from the opening edge of the mounting hole. Was also formed on the bottom side, and a configuration was adopted in which a lid covering the surface of the adhesive layer was inserted in the vicinity of the opening of the mounting hole.

  That is, the surface of the adhesive layer that encloses the IC tag in the mounting hole of the mounting object is formed on the bottom side of the opening edge of the mounting hole, and a lid is inserted in the vicinity of the opening of the mounting hole so that the surface of the adhesive layer This prevents the foreign matter from adhering to the surface of the adhesive layer.

  Here, it is desirable that the lid is formed of a synthetic resin that hardly affects the communication with the reader / writer device of the IC tag. In addition, it is desirable to provide a protrusion to be inserted into the adhesive layer on the inner surface or to press the lid itself into the mounting hole so that the lid does not easily fall out of the mounting hole. .

  The lid may be removed after the surface grinding around the mounting hole is completed. In that case, a tab for removal may be provided on the lid. Further, if the inner surface of the lid is formed as a flat surface and the surface of the adhesive layer is formed on the inner surface of the lid, a flat adhesive layer surface will appear when the lid is removed. Above preferred.

  When the bottom surface of the mounting hole is formed as a conical surface and the surface on the bottom side of the mounting hole of the IC tag is formed as a conical surface following the bottom surface of the mounting hole, the IC tag is disposed at the bottom of the mounting hole. And the IC tag can be fixed in a more stable posture.

  And the rolling bearing with an IC tag of this invention shall attach an IC tag to at least one of the component parts by the IC tag attachment structure before grinding mentioned above.

  The IC tag mounting structure before grinding according to the present invention covers the surface of the adhesive layer that encloses the IC tag in the mounting hole by inserting a lid in the vicinity of the opening of the mounting hole of the mounting target as described above. Therefore, it is possible to prevent foreign matter from adhering to the surface of the adhesive layer and to obtain an appearance quality superior to that of the prior art.

  In addition, the rolling bearing with an IC tag of the present invention has an IC tag attached to at least one of the component parts by the above-described IC tag mounting structure before grinding, and is therefore shipped with a good appearance quality. Can do.

Front sectional drawing of the principal part of the use condition of the rolling bearing with an IC tag of 1st Embodiment 1a to 1d are front sectional views for explaining the mounting procedure of the IC tag of FIG. 1, and e is an external perspective view of the lids a to d. Front sectional view of the IC tag mounting structure before grinding according to the second embodiment a is a front cross-sectional view of the IC tag mounting structure before grinding different from the present invention, and b is a plan view of a. Front sectional view of conventional IC tag mounting structure

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a use state of a rolling bearing 1 with an IC tag according to the first embodiment. The rolling bearing 1 is a tapered roller bearing in which a plurality of tapered rollers 4 and an annular cage 5 are arranged between an inner ring 2 and an outer ring 3, and a non-contact communication type IC tag is provided on one end face of the inner ring 2 and the outer ring 3. 11 is mounted, and is incorporated between the housing H and the rotary shaft A in a double row together with the tapered roller bearing 6 without an IC tag.

  The rolling bearing 1 is preloaded by the inner ring 2 being pressed to the right by a pressing member 7 located on the left side in FIG. Therefore, when reading information stored in the IC tag 11 attached to the inner ring 2, for example, after the pressing member 7 is removed to expose the IC tag 11, the reader / writer device (illustrated) (Omitted). Further, when reading information stored in the IC tag 11 attached to the outer ring 3, after disassembling the rolling bearing 1 and its peripheral members to such an extent that the reader / writer device can approach the IC tag 11, Reading work will be performed. Of course, when the reader / writer device can be brought close to the IC tag 11 without disassembling parts, disassembly is not necessary.

  FIG. 2 shows a procedure for attaching the IC tag 11. As shown in FIG. 2 (a), first, a circular mounting hole 2b whose bottom surface is a conical surface is drilled in advance on the mounting surface (one end surface) 2a of the inner ring 2 that is the mounting target. Then, an adhesive is injected in a state where the IC tag 11 is disposed in the mounting hole 2b opened in the mounting surface 2a, thereby forming an adhesive layer 12 that encloses the IC tag 11. At this time, the adhesive is not filled in the entire attachment hole 2b, and the surface of the adhesive layer 12 is formed on the bottom side rather than the opening edge of the attachment hole 2b.

  Then, before the adhesive is completely solidified, as shown in FIG. 2B, a lid 13 is inserted in the vicinity of the opening of the mounting hole 2b, and the surface of the adhesive layer 12 is covered with the lid 13. The lid 13 is made of a synthetic resin that does not easily affect the communication of the IC tag 11 with the reader / writer device, and is formed into a disk shape. A tab 13b is provided at the center of the side surface (see FIG. 2 (e)). The protrusion 13a of the lid 13 is pierced into the adhesive layer 12, and the inner plane is pressed against the surface of the adhesive layer 12, so that the lid 13 does not easily fall off from the mounting hole 2b, and the adhesive layer 12 Can be formed flat.

  Next, the mounting surface 2a of the inner ring 2 is ground to the position of the broken line in the drawing in the state shown in FIG. That is, the state of FIG. 2B shows the IC tag mounting structure before grinding according to the first embodiment of the present invention. In addition, in this IC tag mounting structure before grinding, it is desirable that the entire lid 13 enters the mounting hole 2b with a margin so that the lid 13 is not ground when the mounting surface 2a is ground.

  Finally, after the adhesive is completely solidified, when the tab 13b of the lid 13 is pinched and the lid 13 is removed from the mounting hole 2b, the state shown in FIG. At this time, a flat surface of the adhesive layer 12 formed on the inner surface of the lid 13 appears.

  As described above, in this IC tag mounting structure before grinding, the lid 13 is inserted in the vicinity of the opening of the mounting hole 2b of the inner ring 2 so as to cover the surface of the adhesive layer 12 enclosing the IC tag 11. Therefore, there is no possibility that foreign matters such as dust and grinding powder on the mounting surface 2a adhere to the surface of the adhesive layer 12. Further, when the lid 13 is removed from the mounting hole 2b, a flat surface of the adhesive layer 12 appears, and an appearance quality superior to the conventional one is obtained.

  FIG. 3 shows an IC tag mounting structure before grinding according to the second embodiment. This embodiment is based on the first embodiment shown in FIG. 2B, and the IC tag 11 is formed with a conical surface that follows the bottom surface of the mounting hole 2b. 11 is arranged at the bottom of the mounting hole 2b, so that the IC tag 11 can be fixed in a more stable posture. In addition, a lid 13 having no projection on the inner surface is used, and the lid 13 is press-fitted into the mounting hole 2b so that it does not easily fall out of the mounting hole 2b.

  Also in the second embodiment, as in the first embodiment, it is possible to prevent foreign matter from adhering to the surface of the adhesive layer 12, and when the lid 13 is removed, the flat surface of the adhesive layer 12 appears to ensure excellent appearance quality. can do.

  In each of the above-described embodiments, the lid 13 is removed after the mounting surface 2a of the inner ring 2 is ground, but the lid covering the adhesive layer does not necessarily have to be removed. In that case, there is no need to provide a tab on the outer surface of the lid, or to press the inner surface of the lid against the surface of the adhesive layer.

  2 and 3, the IC tag mounting structure of the inner ring 2 of the rolling bearing 1 has been described. However, the IC tag 11 can be mounted on the outer ring 3 of the rolling bearing 1 with the same mounting structure as the inner ring 2.

  And this invention is applicable not only to a tapered roller bearing like embodiment but to other types of rolling bearings, such as a cylindrical roller bearing and a ball bearing.

  On the other hand, FIGS. 4A and 4B show the surface of the IC tag 11 when the casing 22 containing the IC tag 11 is inserted and fixed in the mounting hole 21b opened in the mounting surface 21a of the mounting target 21. An example in which foreign matter is prevented from adhering to is shown. In this example, the mounting hole 21b has a counterbore portion 21c, and the casing 22 is formed in an outer shape that fits into the mounting hole 21b. And the IC tag 11 is accommodated in the recessed part of the bottom face of the hexagon hole 22a opened in the center part of the surface of the casing 22, and the annular groove 22b is provided around the hexagon hole 22a. Thereby, foreign matter such as grinding powder on the mounting surface 21a approaching the casing 22 from the periphery of the mounting hole 21b enters and stays in the annular groove 22b of the casing 22, and adheres to the surface of the IC tag 11 at the bottom of the hexagonal hole 22a. There is nothing to do.

1 Rolling bearing (tapered roller bearing)
2 Inner ring 2a Mounting surface 2b Mounting hole 3 Outer ring 4 Tapered roller 5 Cage 11 IC tag 12 Adhesive layer 13 Lid 13a Projection 13b Tab H Housing A Rotating shaft

Claims (8)

  A non-contact communication type IC tag is disposed in an attachment hole that opens on the surface of the attachment object, and an adhesive layer that encloses the IC tag is formed with an adhesive injected into the attachment hole. In the IC tag mounting structure before surface grinding is performed, the surface of the adhesive layer is formed on the bottom side of the opening edge of the mounting hole, and the surface of the adhesive layer is near the opening of the mounting hole. An IC tag mounting structure before grinding, characterized in that a lid covering the mounting hole is inserted and the lid is removed after surface grinding around the mounting hole is completed.   2. The IC tag mounting structure before grinding according to claim 1, wherein the lid is made of a synthetic resin.   The IC tag mounting structure before grinding according to claim 1 or 2, wherein a projection to be inserted into the adhesive layer is provided on an inner surface of the lid.   The IC tag attachment structure before grinding according to any one of claims 1 to 3, wherein the lid is press-fitted into the attachment hole.   The IC tag mounting structure before grinding according to any one of claims 1 to 4, wherein a tab for removal is provided on the lid.   The IC tag before grinding according to any one of claims 1 to 5, wherein an inner surface of the lid is formed as a flat surface and a surface of the adhesive layer is formed on the inner surface of the lid. Mounting structure.   The bottom surface of the mounting hole is formed as a conical surface, and the surface on the bottom side of the mounting hole of the IC tag is formed as a conical surface following the bottom surface of the mounting hole. IC tag mounting structure before grinding.   A rolling bearing with an IC tag, wherein the IC tag is attached to at least one of the component parts by the IC tag attachment structure before grinding according to any one of claims 1 to 7.

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