JP5769512B2 - Gas barrier sheet, laminated sheet, and element sealing body - Google Patents

Description

  The present invention relates to a gas barrier sheet having self-adhesiveness, a laminated sheet obtained by laminating the gas barrier sheet, and an element sealing body using the gas barrier sheet.

In recent years, use of a transparent plastic film as a substrate for a display such as a liquid crystal display or an electroluminescence (EL) display has been studied in order to make the display thinner, lighter, and flexible.
However, since a plastic film generally transmits water vapor, oxygen, and the like as compared with a conventionally used glass substrate, there is a problem that an element inside the display is easily deteriorated.

As a method for solving this problem, it has been proposed to use a plurality of gas barrier films provided with a gas barrier layer on a substrate.
For example, Patent Document 1 describes a technique of laminating gas barrier films using a urethane-based adhesive composition.
Patent Document 2 describes a surface protective sheet for a solar cell module formed by laminating at least two gas barrier films.
Patent Document 3 describes a composite film having two gas barrier films and an adhesive layer provided therebetween.

However, when the gas barrier film is bonded using an adhesive or the like, if the adhesive layer is provided on the gas barrier layer side of the gas barrier film, the gas barrier property may be lowered due to the reactive functional group contained in the adhesive. there were.
On the other hand, when an adhesive layer is provided on the base material side of the gas barrier film, the gas barrier layer becomes the outermost layer, so that it is easily damaged and the gas barrier property may be lowered.

On the other hand, conventionally, in flat panel displays such as liquid crystal displays and organic EL displays, an element sealed on a glass substrate with a resin-based sealant to prevent the light emitting element from coming into contact with oxygen or water vapor. A sealing body is used. For example, Patent Document 4 describes an element sealing body that includes a glass substrate, an element placed on the glass substrate, and a protective glass that seals the element.
Also in such an element sealing body, it is preferable to use a gas barrier film instead of the glass substrate from the viewpoint of thinning, lightening, and flexibility of the display.

JP 2004-285183 A JP 2007-173449 A JP 2011-511195 A JP 2011-29169 A

  The present invention has been made in view of the above-described circumstances, and a gas barrier sheet that can be directly attached to an adherend via a gas barrier layer without using an adhesive or the like, and a plurality of the gas barrier sheets. It aims at providing the element sealing body which has the laminated sheet obtained by making it bond, and the said gas-barrier sheet | seat.

  As a result of intensive studies to solve the above problems, the present inventors have determined that the product of the Young's modulus and thickness of the base material and the surface roughness of the gas barrier layer can be used to obtain the target gas barrier sheet. The headline and the present invention were completed.

Thus, according to the first aspect of the present invention, the following gas barrier sheets (1) to (4) are provided.
(1) A base material and a gas barrier sheet having a gas barrier layer on at least one surface side of the base material, wherein the product of Young's modulus and thickness at 25 ° C. of the base material is 1.5 × 10 ⁵ N / m or less, the gas barrier layer has a surface roughness Ra of 5 nm or less, and a surface roughness Rt of 80 nm or less.
(2) The gas barrier sheet according to (1), comprising a substrate, a primer layer formed on the substrate, and a gas barrier layer formed on the primer layer.
(3) The gas barrier sheet according to (1) or (2), which is a sheet for forming a laminated sheet.
(4) The gas barrier sheet according to (1) or (2), which is an element sealing sheet.

According to the second aspect of the present invention, the following laminated sheets (5) to (9) are provided.
(5) A laminated sheet obtained by laminating at least two sheets, wherein at least one of the sheets is the gas barrier sheet according to (1) or (2), A laminated sheet in which a gas barrier layer and another sheet are bonded.
(6) The laminated sheet according to (5), wherein the other sheet is the gas barrier sheet according to (1) or (2).
(7) Laminate having a laminated structure in which at least two of a base material and a gas barrier sheet having a gas barrier layer on at least one surface side of the base material are bonded directly between the gas barrier layers of the gas barrier sheet A laminated sheet, wherein at least one of the gas barrier sheets is the gas barrier sheet according to (1) or (2)


.

(8) Any of (5) to (7), wherein the gas barrier layer of the gas barrier sheet has a shear adhesive strength of 0.5 N / 100 mm ² or more when the adhesion area is 100 mm ² (10 mm × 10 mm). The laminated sheet according to 1.
(9) The laminated sheet according to any one of (5) to (7), which is a sheet for an electronic member.

According to 3rd aspect of this invention, the element sealing body of following (10) is provided.
(9) A laminated structure formed by directly bonding a base material and at least two gas barrier sheets having a gas barrier layer on at least one surface side of the base material between the gas barrier layers; An element sealing body having a sealing structure sandwiched between at least two gas barrier sheets, wherein at least one of the gas barrier sheets is the gas barrier sheet according to (1) or (2). A certain element sealing body.

The gas barrier sheet of the present invention has excellent self-adhesiveness. That is, the gas barrier layer of the gas barrier sheet of the present invention is excellent in adhesiveness with other layers. Therefore, by using the gas barrier sheet of the present invention, it can be attached to an adherend via the gas barrier layer without using an adhesive or the like.
Since the laminated sheet of the present invention is bonded by the self-adhesiveness of the gas barrier layer, it is possible to avoid a decrease in gas barrier properties due to the influence of an adhesive or the like. In addition, since the gas barrier layer does not become the outermost layer, it is possible to avoid a decrease in gas barrier properties due to damage to the gas barrier layer.
The element sealing body of the present invention is obtained by sealing an element with a gas barrier sheet without using a sealant or an adhesive.

It is sectional drawing which shows an example of the gas barrier sheet | seat of this invention. It is sectional drawing which shows an example of the lamination sheet of this invention. It is sectional drawing which shows an example of the element sealing body of this invention. It is sectional drawing which shows an example of the element sealing body of this invention.

  Hereinafter, the present invention will be described in detail by dividing it into 1) a gas barrier sheet, 2) a laminated sheet, and 3) an element sealing body.

1) Gas barrier sheet The gas barrier sheet of the present invention is a gas barrier sheet having a base material and a gas barrier layer on at least one surface side of the base material, and the Young's modulus of the base material at 25 ° C. The product of the thickness is 1.5 × 10 ⁵ N / m or less, the surface roughness Ra of the gas barrier layer is 5 nm or less, and the surface roughness Rt is 80 nm or less.
In the present specification, the “sheet” includes not only a strip shape but also a long shape (band shape).

(Base material)
In the gas barrier sheet of the present invention, a base material having a Young's modulus and a thickness at 25 ° C. of 1.5 × 10 ⁵ N / m or less is used. When this value exceeds 1.5 × 10 ⁵ N / m, since the bending stress of the base material is large, the self-adhesiveness of the gas barrier sheet is lowered.
The lower limit value can be determined as appropriate, but if the above value is too small, it becomes difficult to carry the gas barrier layer. From this viewpoint, the product of Young's modulus and thickness at 25 ° C. is preferably 0.3 × 10 ^{5 to} 1.5 × 10 ⁵ N / m, more preferably 0.4 × 10 ^{5 to} 1.4 ×. 10 ⁵ N / m.

From the viewpoint of easily adjusting the product of Young's modulus and thickness at 25 ° C. to the above range, the Young's modulus at 25 ° C. of the base material used is usually 2.0 to 30.0 GPa, preferably 2.5 to 5.0 GPa. is there.
Moreover, the thickness of the base material to be used is 5-75 micrometers normally, Preferably it is 10-40 micrometers.

  Materials for the substrate include polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, cyclohexane Examples include olefin polymers and aromatic polymers.

  Among these, polyester, polyamide, or cycloolefin polymer is preferable, and polyester or cycloolefin polymer is more preferable because of excellent transparency and versatility.

Examples of the polyester include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyarylate.
Examples of the polyamide include wholly aromatic polyamide, nylon 6, nylon 66, nylon copolymer, and the like.

  Examples of cycloolefin polymers include norbornene polymers, monocyclic olefin polymers, cyclic conjugated diene polymers, vinyl alicyclic hydrocarbon polymers, and hydrides thereof.

Moreover, the base material is excellent in surface smoothness from the viewpoint of obtaining a gas barrier layer having a surface roughness Ra (arithmetic average roughness) and a surface roughness Rt (maximum cross-sectional height) in a specific range described later. It is preferable.
The surface roughness Ra on the surface side where the gas barrier layer of the substrate is formed is preferably 1.0 to 5.0 nm, more preferably 2.0 to 4.5 nm. The surface roughness Rt is preferably 10 to 80 nm, more preferably 20 to 70 nm.
The surface roughness Ra and Rt are values obtained for a measurement region of 10,000 μm ² (100 μm × 100 μm) using an optical interference microscope.

(Gas barrier layer)
The gas barrier layer in the gas barrier sheet of the present invention is a layer having a property of suppressing permeation of oxygen and water vapor (hereinafter referred to as “gas barrier property”).
The surface roughness Ra of the gas barrier layer in the gas barrier sheet of the present invention is 5 nm or less, and the surface roughness Rt is 80 nm or less.
When the surface roughness Ra and Rt are each equal to or less than the above values, a gas barrier sheet having an excellent surface smoothness and excellent gas barrier properties and self-adhesive properties can be obtained. From this viewpoint, the surface roughness Ra is preferably 1.0 to 5 nm, more preferably 2.0 to 4.5 nm. The surface roughness Rt is preferably 10 to 80 nm, more preferably 20 to 70 nm.
The surface roughness Ra and Rt are values obtained for a measurement region of 10,000 μm ² (100 μm × 100 μm) using an optical interference microscope.

  Examples of the method for forming the gas barrier layer having the surface roughness Ra and Rt include a method using a substrate having excellent surface smoothness and a method of providing a primer layer between the substrate and the gas barrier layer.

  The thickness of the gas barrier layer is not particularly limited, but is usually 20 nm to 50 μm, preferably 30 nm to 1 μm, more preferably 40 nm to 500 nm.

The material of the gas barrier layer is not particularly limited as long as it has the above surface roughness.
For example, metals such as aluminum, magnesium, zinc and tin; inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide and tin oxide; inorganic nitrides such as silicon nitride; inorganic carbides; inorganic sulfides Inorganic oxynitrides that are composites thereof; inorganic oxide carbides; inorganic nitride carbides; inorganic oxynitride carbides; polymer compounds;

  The method for forming the gas barrier layer is not particularly limited. For example, the above-described material is formed on a substrate by a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method, or the like. Examples include a method in which a solution obtained by dissolving or dispersing a material in an organic solvent is applied onto a substrate by a known application method, and the resulting coating film is appropriately dried.

  Among these, since a target gas barrier layer can be easily formed, a polymer layer formed of a polymer compound is preferably formed by plasma treatment. The polymer layer composed of the polymer compound is modified by plasma treatment, and gas barrier properties are improved.

As the plasma treatment, a known method can be used, but an ion implantation method is preferable from the viewpoint that a gas barrier layer having excellent gas barrier properties can be formed. That is, the gas barrier layer is preferably formed by implanting ions into a polymer layer composed of a polymer compound.
By forming the gas barrier layer in this way, in addition to obtaining excellent gas barrier properties, the surface smoothness of the gas barrier layer and the gas barrier layer itself can moderately reduce the bending stress of the substrate. Thereby, self-adhesiveness can be improved more.
In this case, the “gas barrier layer” does not mean only a portion modified by ion implantation, but means “a polymer layer having a portion modified by ion implantation”.

  Examples of the polymer compound constituting the polymer layer include silicon-based polymer compounds, polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, and polyether. Examples include sulfone, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic polymer, and combinations of two or more of these polymers.

  The polymer compound may be a cured product of an energy ray curable compound. Examples of energy ray curable compounds include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, neo Pentyl glycol adipate di (meth) acrylate, dicyclopentanyl di (meth) acrylate, isocyanurate di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) ) Energy ray polymerizable monomers such as polyfunctional acrylates such as polyfunctional acrylates such as acrylate, tris (acryloxyethyl) isocyanurate, dipentaerythritol hexa (meth) acrylate Polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, polyol (meth) acrylate, multifunctional acrylate oligomer and silicone (meth) acrylate; and the like. Here, (meth) acrylate means acrylate or methacrylate.

  Among these, since a gas barrier layer excellent in gas barrier properties can be formed more easily, a silicon-based polymer compound, a polyester, or an acrylic resin is preferable, and a silicon-based polymer compound is more preferable.

  The silicon-based polymer compound may be an organic compound or an inorganic compound as long as it is a silicon-containing polymer. Examples include polyorganosiloxane compounds, polycarbosilane compounds, polysilane compounds, polysilazane compounds, and the like.

  A polyorganosiloxane compound is a compound obtained by polycondensation of a silane compound having a hydrolyzable functional group.

There is no restriction | limiting in the principal chain structure of a polyorganosiloxane type compound, Any of linear shape, ladder shape, and bowl shape may be sufficient.
For example, the linear main chain structure is a structure represented by the following formula (a), and the ladder main chain structure is a structure represented by the following formula (b): a cage main chain structure Examples of the structure include the structure represented by the following formula (c).

  In the formula, each of Rx, Ry, and Rz independently represents a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted aryl group, etc. Represents a hydrolyzable group. Note that the plurality of Rx in the formula (a), the plurality of Ry in the formula (b), and the plurality of Rz in the formula (c) may be the same or different. However, both Rx in the formula (a) are not hydrogen atoms.

  Examples of the alkyl group of the unsubstituted or substituted alkyl group include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, t-butyl group, n Examples thereof include alkyl groups having 1 to 10 carbon atoms such as a pentyl group, an isopentyl group, a neopentyl group, an n-hexyl group, an n-heptyl group, and an n-octyl group.

  As an alkenyl group, C2-C10 alkenyl groups, such as a vinyl group, 1-propenyl group, 2-propenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, are mentioned, for example.

  Examples of the substituent for the alkyl group and alkenyl group include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; hydroxyl group; thiol group; epoxy group; glycidoxy group; (meth) acryloyloxy group; An unsubstituted or substituted aryl group such as a 4-methylphenyl group and a 4-chlorophenyl group;

  Examples of the aryl group of the unsubstituted or substituted aryl group include aryl groups having 6 to 10 carbon atoms such as a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.

  Examples of the substituent of the aryl group include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; alkyl groups having 1 to 6 carbon atoms such as methyl group and ethyl group; carbon numbers such as methoxy group and ethoxy group 1-6 alkoxy groups; nitro groups; cyano groups; hydroxyl groups; thiol groups; epoxy groups; glycidoxy groups; (meth) acryloyloxy groups; unsubstituted phenyl groups, 4-methylphenyl groups, 4-chlorophenyl groups, or the like An aryl group having a substituent; and the like.

  Among these, as Rx, Ry, and Rz, a hydrogen atom, a C1-C6 alkyl group, or a phenyl group is preferable, and a C1-C6 alkyl group is especially preferable.

  As the polyorganosiloxane-based compound, a linear compound represented by the above formula (a) is preferable. From the viewpoint of easy availability and formation of a layer having excellent gas barrier properties, 2 in the above formula (a). Polydimethylsiloxane in which two Rx are both methyl group compounds is more preferable.

  The polyorganosiloxane compound can be obtained, for example, by a known production method in which a silane compound having a hydrolyzable functional group is polycondensed.

  What is necessary is just to select the silane compound to be used suitably according to the structure of the target polyorganosiloxane type compound. Preferred examples include bifunctional silane compounds such as dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, and diethyldiethoxysilane; methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, trifunctional silane compounds such as n-propyltrimethoxysilane, n-butyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyldiethoxymethoxysilane; tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, Tetraisopropoxysilane, tetra-n-butoxysilane, tetra-t-butoxysilane, tetra-s-butoxysilane, methoxytriethoxysilane, dimethoxydiethoxysilane, tri Butoxy, etc. tetrafunctional silane compounds such as tetraethoxysilane and the like.

  A polycarbosilane-based compound is a polymer compound having a (—Si—C—) bond in the main chain in the molecule. Especially, as a polycarbosilane type compound used for this invention, what contains the repeating unit represented by following formula (d) is preferable.

  In the formula, Rw and Rv each independently represent a hydrogen atom, a hydroxyl group, an alkyl group, an aryl group, an alkenyl group, or a monovalent heterocyclic group. A plurality of Rw and Rv may be the same or different.

  Examples of the alkyl group, aryl group, and alkenyl group for Rw and Rv include the same groups as those exemplified as Rx and the like.

The heterocyclic ring of the monovalent heterocyclic group is not particularly limited as long as it is a 3- to 10-membered cyclic compound containing at least one hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom in addition to a carbon atom.
Specific examples of the monovalent heterocyclic group include 2-pyridyl group, 3-pyridyl group, 4-pyridyl group, 2-thienyl group, 3-thienyl group, 2-furyl group, 3-furyl group, and 3-pyrazolyl. Group, 4-pyrazolyl group, 2-imidazolyl group, 4-imidazolyl group, 1,2,4-triazin-3-yl group, 1,2,4-triazin-5-yl group, 2-pyrimidyl group, 4- Pyrimidyl group, 5-pyrimidyl group, 3-pyridazyl group, 4-pyridazyl group, 2-pyrazyl group, 2- (1,3,5-triazyl) group, 3- (1,2,4-triazyl) group, 6 -(1,2,4-triazyl) group, 2-thiazolyl group, 5-thiazolyl group, 3-isothiazolyl group, 5-isothiazolyl group, 2- (1,3,4-thiadiazolyl) group, 3- (1, 2,4-thiadiazolyl) group, 2-oxazoly Group, 4-oxazolyl group, 3-isoxazolyl group, 5-isoxazolyl group, 2- (1,3,4-oxadiazolyl) group, 3- (1,2,4-oxadiazolyl) group, 5- (1,2, 3-oxadiazolyl) group and the like.

  These groups may have a substituent such as an alkyl group, an aryl group, an alkoxy group, or an aryloxy group at an arbitrary position.

R represents an alkylene group, an arylene group or a divalent heterocyclic group.
Examples of the alkylene group of R include alkylene groups having 1 to 10 carbon atoms such as a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, and an octamethylene group.

  Examples of the arylene group include arylene groups having 6 to 20 carbon atoms such as a phenylene group, a 1,4-naphthylene group, and a 2,5-naphthylene group.

  As the divalent heterocyclic group, a divalent group derived from a 3 to 10-membered heterocyclic compound containing at least one hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom in addition to a carbon atom is particularly preferable. There are no restrictions.

  Specific examples of the divalent heterocyclic group include thiophenediyl groups such as 2,5-thiophenediyl group; flangedyl groups such as 2,5-furandiyl group; and selenophene such as 2,5-selenophenediyl group. Diyl group; pyrrole diyl group such as 2,5-pyrrole diyl group; pyridinediyl group such as 2,5-pyridinediyl group and 2,6-pyridinediyl group; 2,5-thieno [3,2-b] thiophenediyl group , 2,5-thieno [2,3-b] thiophenediyl groups, etc .; quinolinediyl groups, such as 2,6-quinolinediyl groups; 1,4-isoquinolinediyl groups, 1,5-isoquinolinediyl groups, etc. Isoquinolinediyl group of quinoxalinediyl group such as 5,8-quinoxalinediyl group; benzo [4,7-benzo [1,2,5] thiadiazolediyl group , 2,5] thiadiazole diyl group; benzothiazole diyl group such as 4,7-benzothiazole diyl group; carbazole diyl group such as 2,7-carbazole diyl group and 3,6-carbazole diyl group; 3,7-phenoxy A phenoxazinediyl group such as a sazinediyl group; a phenothiazinediyl group such as a 3,7-phenothiazinediyl group; a dibenzosiloldiyl group such as a 2,7-dibenzosiloldiyl group; 2,6-benzo [1,2-b: 4,5-b ′] dithiophenediyl group, 2,6-benzo [1,2-b: 5,4-b ′] dithiophenediyl group, 2,6-benzo [2,1-b: 3, Benzodithiophene diyl groups such as 4-b ′] dithiophene diyl group and 2,6-benzo [1,2-b: 3,4-b ′] dithiophene diyl group.

  The alkylene group, arylene group, and divalent heterocyclic group represented by R may have a substituent such as an alkyl group, an aryl group, an alkoxy group, or a halogen atom at an arbitrary position.

  Among these, in formula (1), Rw and Rv are each independently a hydrogen atom, an alkyl group or an aryl group, and more preferably include a repeating unit in which R is an alkylene group or an arylene group, Rw, More preferably, each Rv independently represents a hydrogen atom or an alkyl group, and R includes an alkylene group.

  The weight average molecular weight of the polycarbosilane compound having a repeating unit represented by the formula (d) is usually 400 to 12,000.

  It does not specifically limit as a manufacturing method of a polycarbosilane type compound, A conventionally well-known method is employable. For example, a method for producing by thermal decomposition polymerization of polysilane (Japanese Patent Laid-Open No. 51-126300), a method for producing by thermal rearrangement of poly (dimethylsilane) (Journal of Materials Science, 2569-2576, Vol. 13, 1978). , A method for obtaining a polycarbosilane-based compound by Grignard reaction of chloromethyltrichlorosilane (Organometallics, 1336-1344, Vol. 10, 1991), a method for producing by ring-opening polymerization of disilacyclobutanes (Journal of Organometallic Chemistry, 1 -10, Vol. 521, 1996), a raw material polymer having a structural unit of dimethylcarbosilane and SiH group-containing silane, water and / or in the presence of a basic catalyst. A method of producing by reacting rucol (Japanese Patent Laid-Open No. 2006-117717), carbosilane having an organometallic group such as trimethyltin at the terminal is polymerized with an organic typical metal compound such as n-butyllithium as an initiator. And a manufacturing method (Japanese Patent Laid-Open No. 2001-328991).

  The polysilane-based compound is a polymer compound having a (—Si—Si—) bond in the molecule. Examples of such polysilane compounds include compounds having at least one repeating unit selected from structural units represented by the following formula (e).

  In the formula (e), Rq and Rr are the same or different and are a hydrogen atom, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, a hydroxyl group, an alkoxy group, a cycloalkyloxy group, an aryloxy group, an aralkyloxy group. A group, an amino group optionally having a substituent, a silyl group, or a halogen atom is represented.

  Examples of the alkyl group, alkenyl group, and aryl group of Rq and Rr include the same as those exemplified for Rx and the like.

Examples of the cycloalkyl group include cycloalkenyl groups having 3 to 10 carbon atoms such as a cyclopentyl group, a cyclohexyl group, and a methylcyclohexyl group.
As a cycloalkenyl group, C4-C10 cycloalkenyl groups, such as a cyclopentenyl group and a cyclohexenyl group, are mentioned.

As an alkoxy group, C1-C10 alkoxy groups, such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, t-butoxy group, a pentyloxy group, are mentioned.
Examples of the cycloalkyloxy group include cycloalkyloxy groups having 3 to 10 carbon atoms such as a cyclopentyloxy group and a cyclohexyloxy group.

Examples of the aryloxy group include aryloxy groups having 6 to 20 carbon atoms such as a phenoxy group and a naphthyloxy group.
Examples of the aralkyloxy group include aralkyloxy groups having 7 to 20 carbon atoms such as benzyloxy group, phenethyloxy group, and phenylpropyloxy group.
The amino group which may have a substituent is an amino group; an N-mono or N, N-disubstituted amino group substituted with an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an acyl group, or the like. Is mentioned.

Examples of the silyl group include Si1-10 silanyl groups (preferably Si1-6 silanyl groups) such as silyl group, disilanyl group, and trisilanyl group, substituted silyl groups (for example, alkyl groups, cycloalkyl groups, aryl groups, aralkyl groups, alkoxy groups). A substituted silyl group substituted with a group, etc.).
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

  The cycloalkyl group, cycloalkenyl group, alkoxy group, cycloalkyloxy group, aryloxy group, aralkyloxy group, silyl group may have a substituent such as a halogen atom, an alkyl group, an aryl group, or an alkoxy group. Good.

  Among these, since the more excellent effect of the present invention is obtained, a compound containing a repeating unit represented by the formula (e) is preferable. In the formula (e), Rq and Rr are each independently A compound containing a repeating unit which is a hydrogen atom, a hydroxyl group, an alkyl group, an aryl group, an alkoxy group, an amino group or a silyl group is more preferable. In the formula (e), Rq and Rr are each independently a hydrogen atom, More preferred are compounds containing a repeating unit which is an alkyl group or an aryl group.

The form of the polysilane compound is not particularly limited, and may be a random copolymer, a block even if it is a homopolymer such as acyclic polysilane (linear polysilane, branched polysilane, network polysilane, etc.) or cyclic polysilane. Copolymers such as copolymers, alternating copolymers, and comb copolymers may also be used.
When the polysilane compound is an acyclic polysilane, the terminal group (terminal substituent) of the polysilane compound is a hydrogen atom, a halogen atom (chlorine atom, etc.), an alkyl group, a hydroxyl group, an alkoxy group, silyl It may be a group or the like.

  Specific examples of the polysilane compound include polydialkylsilanes such as polydimethylsilane, poly (methylpropylsilane), poly (methylbutylsilane), poly (methylpentylsilane), poly (dibutylsilane), and poly (dihexylsilane). , Homopolymers such as poly (diarylsilanes) such as poly (diphenylsilane), poly (alkylarylsilanes) such as poly (methylphenylsilane); dialkylsilanes such as dimethylsilane-methylhexylsilane copolymers and other dialkylsilanes Copolymer, arylsilane-alkylarylsilane copolymer such as phenylsilane-methylphenylsilane copolymer, dimethylsilane-methylphenylsilane copolymer, dimethylsilane-phenylhexylsilane copolymer, dimethylsilane-methylnaphthy And the like; silane copolymer, methyl propyl silane - copolymers of alkyl aryl silane copolymer - dialkyl silane and methyl phenyl silane copolymer.

  For details on the polysilane compound, see, for example, R.I. D. Miller, J.M. Michl; Chemical Review, 89, 1359 (1989); Matsumoto; Japan Journal of Physics, Vol. 37, p. 5425 (1998). In the present invention, polysilane compounds described in these documents can be used.

The average degree of polymerization (for example, the number average degree of polymerization) of the polysilane compound is generally about 5 to 400, preferably about 10 to 350, and more preferably about 20 to 300.
The weight average molecular weight of the polysilane compound is about 300 to 100,000, preferably about 400 to 50,000, and more preferably about 500 to 30,000.

  Many of the polysilane compounds are known substances and can be produced using known methods. For example, a method of dehalogenating polycondensation of halosilanes using magnesium as a reducing agent (“magnesium reduction method”, WO 98/29476, etc.), a method of dehalogenating polycondensation of halosilanes in the presence of an alkali metal (“kipping method”). J. Am. Chem. Soc., 110, 124 (1988), Macromolecules, 23, 3423 (1990), etc.], a method of dehalogenating polycondensation of halosilanes by electrode reduction (J. Chem. Soc., Chem.). Commun., 1161 (1990), J. Chem. Soc., Chem. Commun. 897 (1992), etc.), a method of dehydrocondensing hydrosilanes in the presence of a specific polymerization metal catalyst (Japanese Patent Laid-Open No. Hei 4-). No. 334551, etc.), and disilee crosslinked with biphenyl or the like The method according to anionic polymerization (Macromolecules, 23,4494 (1990), etc.), methods and the like by the ring-opening polymerization of cyclic silanes.

  As the polysilazane compound, the formula (f)

The compound which has a repeating unit represented by these is preferable.
The number average molecular weight of the polysilazane compound to be used is not particularly limited, but is preferably 100 to 50,000.

In formula (f), n represents an arbitrary natural number.
Rm, Rp, and Rt each independently represent a non-hydrolyzable group such as a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, or an alkylsilyl group.

Examples of the alkyl group, alkenyl group, and aryl group are the same as those exemplified for Rx and the like.
Examples of the cycloalkyl group are the same as those exemplified for Rq and the like.

  Examples of the alkylsilyl group include trimethylsilyl group, triethylsilyl group, triisopropylsilyl group, tri-t-butylsilyl group, methyldiethylsilyl group, dimethylsilyl group, diethylsilyl group, methylsilyl group, and ethylsilyl group.

  Among these, as Rm, Rp, and Rt, a hydrogen atom, a C1-C6 alkyl group, or a phenyl group is preferable, and a hydrogen atom is especially preferable.

Examples of the polysilazane compound having a repeating unit represented by the formula (h) include inorganic polysilazanes in which Rm, Rp, and Rt are all hydrogen atoms, and organic polysilazanes in which at least one of Rm, Rp, and Rt is not a hydrogen atom. It may be.
As inorganic polysilazane, the following formula

Perhydropolysilazane having a linear structure having a repeating unit represented by formula (1), a molecular weight of 690 to 2000, and 3 to 10 SiH ₃ groups in one molecule (Japanese Patent Publication No. 63-16325) , Formula (A)

[Wherein, b and c represent an arbitrary natural number, and Y ¹ represents a hydrogen atom or a formula (B)

(Wherein, d represents an arbitrary natural number, * represents a bonding position, and Y ² represents a hydrogen atom or a group represented by (B) above). A perhydropolysilazane having a linear structure and a branched structure, having a repeating unit represented by formula (C):

And perhydropolysilazane having a linear structure, a branched structure and a cyclic structure in the molecule.

As organic polysilazane,
(I) — (Rm′SiHNH) — (Rm ′ represents the same alkyl group, cycloalkyl group, alkenyl group, aryl group or alkylsilyl group as Rm. The same applies to the following Rm ′). As a unit, mainly having a cyclic structure with a degree of polymerization of 3-5,
(Ii) — (Rm′SiHNRt ′) — (Rt ′ represents the same alkyl group, cycloalkyl group, alkenyl group, aryl group or alkylsilyl group as Rt), and the degree of polymerization is mainly 3 Having a ring structure of ~ 5,
(Iii) — (Rm′Rp′SiNH) — (Rp ′ represents an alkyl group, cycloalkyl group, alkenyl group, aryl group alkylsilyl group similar to Rp) as a repeating unit, and the degree of polymerization is mainly 3 Having a ring structure of ~ 5,
(Iv) a polyorgano (hydro) silazane having a structure represented by the following formula in the molecule;

(V) The following formula

[Rm ′ and Rp ′ represent the same meaning as described above, e and f represent an arbitrary natural number, and Y ³ represents a hydrogen atom or the following formula (D)

(Wherein g represents an arbitrary natural number, * represents a bonding position, and Y ⁴ represents a hydrogen atom or a group represented by (D) above). ]
And polysilazane having a repeating structure represented by

  The organic polysilazane can be produced by a conventionally known method. For example, the following formula

(In the formula, m represents 2 or 3, X represents a halogen atom, and R ¹ represents any of the substituents of Rm, Rp, Rt, Rm ′, Rp ′, and Rt ′ described above.) It can obtain by making ammonia or a primary amine react with the reaction product of the halogenosilane compound and the secondary amine which have an unsubstituted or substituted group.
The secondary amine, ammonia, and primary amine to be used may be appropriately selected according to the structure of the target polysilazane compound.

In the present invention, a modified polysilazane compound can also be used as the polysilazane compound.
Examples of the modified polysilazane include, for example, a polymetallosilazane containing a metal atom (the metal atom may be crosslinked), and repeating units of [(SiH ₂ ) _j (NH) _h )] and [(SiH ₂ ) _i O] (wherein, j, h, i are each independently 1, 2 or 3. polysiloxazane (JP 62-195024 discloses represented by)), boron compound polysilazane Polyborosilazane produced by reacting polysilazane (JP-A-2-84437), polymetallosilazane produced by reacting polysilazane and metal alkoxide (JP-A-63-81122, etc.), high inorganic silazane polymer And modified polysilazanes (JP-A-1-138108, etc.), copolymer silazanes obtained by introducing organic components into polysilazane (JP-A-2-175726, etc.), Low temperature ceramicized polysilazanes (JP-A-5-238827, etc.), a silicon alkoxide-added polysilazane (JP-A-5-238827), a glycidol-added polysilazane (added or added with a catalytic compound for promoting ceramicization to lysilazan) JP-A-6-122852), acetylacetonato complex-added polysilazane (JP-A-6-306329), metal carboxylate-added polysilazane (JP-A-6-299118, etc.), the polysilazane or a modified product thereof, Polysilazane composition obtained by adding amines and / or acids (Japanese Patent Laid-Open No. 9-31333), modified polysilazane obtained by adding alcohol such as methanol or hexamethyldisilazane to terminal N atom to perhydropolysilazane ( JP-A-5-34 826, JP Patent Laid-Open No. 4-63833 publication), and the like.

Among these, as the polysilazane compound used in the present invention, inorganic polysilazane in which Rm, Rp, and Rt are all hydrogen atoms, and organic polysilazane in which at least one of Rm, Rp, and Rt is not a hydrogen atom are preferable and easily available. From the viewpoint of forming an injection layer having excellent gas barrier properties, inorganic polysilazane is more preferable.
In addition, the polysilazane type compound can also use the commercial item marketed as a glass coating material etc. as it is.

  The polymer layer may contain other components in addition to the above-described polymer compound as long as the object of the present invention is not impaired. Examples of other components include curing agents, other polymers, anti-aging agents, light stabilizers, and flame retardants.

  The content of the polymer compound in the polymer layer is preferably 50% by weight or more, and more preferably 70% by weight or more from the viewpoint of forming a gas barrier layer having excellent gas barrier properties.

The method for forming the polymer layer is not particularly limited, and examples thereof include the same method as the method for forming the gas barrier layer described above. For example, the polymer layer contains at least one kind of polymer compound, and optionally contains other components and a solvent. There is a method in which a layer forming solution is applied on the primer layer, and the resulting coating film is dried appropriately.
As the coating apparatus, known apparatuses such as a spin coater, a knife coater, and a gravure coater can be used.
In order to dry the obtained coating film and improve the gas barrier property of the film, it is preferable to heat the coating film. As the heating and drying methods, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be employed. The heating temperature is usually 80 to 150 ° C., and the heating time is usually several tens of seconds to several tens of minutes.

The thickness of the polymer layer to be formed is not particularly limited, but is usually 20 to 1000 nm, preferably 30 to 500 nm, more preferably 40 to 200 nm.
In the present invention, even if the thickness of the polymer layer is nano-order, a film having sufficient gas barrier performance can be obtained by implanting ions as will be described later.

  What is necessary is just to determine suitably the injection amount of the ion inject | poured into a polymer layer according to the intended purpose (necessary gas barrier property, transparency, etc.) of the film to form.

As ions to be implanted, ions of rare gases such as argon, helium, neon, krypton, and xenon; ions such as fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur;
Ions of alkane gases such as methane, ethane, propane, butane, pentane and hexane; ions of alkene gases such as ethylene, propylene, butene and pentene; ions of alkadiene gases such as pentadiene and butadiene; acetylene, Ions of alkyne gases such as methylacetylene; ions of aromatic hydrocarbon gases such as benzene, toluene, xylene, indene, naphthalene and phenanthrene; ions of cycloalkane gases such as cyclopropane and cyclohexane; cyclopentene, Ions of cycloalkene gases such as cyclohexene;
Ions of conductive metals such as gold, silver, copper, platinum, nickel, palladium, chromium, titanium, molybdenum, niobium, tantalum, tungsten, aluminum;
Silane (SiH ₄ ) or an ion of an organosilicon compound;

Examples of the organosilicon compound include tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, and tetra t-butoxysilane;
An alkylalkoxysilane having an unsubstituted or substituted group such as dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, (3,3,3-trifluoropropyl) trimethoxysilane;
Arylalkoxysilanes such as diphenyldimethoxysilane and phenyltriethoxysilane;
Disiloxanes such as hexamethyldisiloxane (HMDSO);
Aminosilanes such as bis (dimethylamino) dimethylsilane, bis (dimethylamino) methylvinylsilane, bis (ethylamino) dimethylsilane, diethylaminotrimethylsilane, dimethylaminodimethylsilane, tetrakisdimethylaminosilane, tris (dimethylamino) silane;
Silazanes such as hexamethyldisilazane, hexamethylcyclotrisilazane, heptamethyldisilazane, nonamethyltrisilazane, octamethylcyclotetrasilazane, tetramethyldisilazane;
Cyanate silanes such as tetraisocyanate silane;
Halogenosilanes such as triethoxyfluorosilane;
Alkenylsilanes such as diallyldimethylsilane and allyltrimethylsilane;
Alkyl silanes having no substituents or substituents such as di-t-butylsilane, 1,3-disilabutane, bis (trimethylsilyl) methane, tetramethylsilane, tris (trimethylsilyl) methane, tris (trimethylsilyl) silane, benzyltrimethylsilane;
Silylalkynes such as bis (trimethylsilyl) acetylene, trimethylsilylacetylene, 1- (trimethylsilyl) -1-propyne;
Silylalkenes such as 1,4-bistrimethylsilyl-1,3-butadiyne, cyclopentadienyltrimethylsilane;
Arylalkylsilanes such as phenyldimethylsilane and phenyltrimethylsilane;
Alkynylalkylsilanes such as propargyltrimethylsilane;
Alkenylalkylsilanes such as vinyltrimethylsilane;
Disilanes such as hexamethyldisilane;
Siloxanes such as octamethylcyclotetrasiloxane, tetramethylcyclotetrasiloxane, hexamethylcyclotetrasiloxane;
N, O-bis (trimethylsilyl) acetamide;
Bis (trimethylsilyl) carbodiimide;
Etc.
These ions may be used alone or in combination of two or more.

  Among these, since it can be more easily injected and a gas barrier layer having particularly excellent gas barrier properties can be obtained, it is selected from the group consisting of hydrogen, nitrogen, oxygen, argon, helium, neon, xenon, and krypton. At least one ion is preferred.

  A method for implanting ions is not particularly limited, and examples include a method of irradiating ions accelerated by an electric field (ion beam), a method of implanting ions in plasma, and the like. Among them, in the present invention, the latter method of implanting plasma ions is preferable because a gas barrier film can be easily obtained.

  As the plasma ion implantation method, (A) a method in which ions existing in plasma generated using an external electric field are implanted into the surface portion of the polymer layer, or (B) the layer without using an external electric field. A method is preferred in which ions existing in plasma generated only by an electric field generated by a negative high voltage pulse applied to are implanted into the surface portion of the polymer layer.

  In the method (A), the pressure during ion implantation (pressure during plasma ion implantation) is preferably 0.01 to 1 Pa. When the pressure during plasma ion implantation is in such a range, ions can be implanted easily and efficiently uniformly, and the target gas barrier layer can be efficiently formed.

  In the method (B), it is not necessary to increase the degree of reduced pressure, the processing operation is simple, and the processing time can be greatly shortened. Further, the entire layer can be processed uniformly, and ions in the plasma can be continuously injected into the surface portion of the layer with high energy when a negative high voltage pulse is applied. Furthermore, without applying special other means such as radio frequency (hereinafter abbreviated as “RF”) or a high-frequency power source such as a microwave, just applying a negative high voltage pulse to the layer, A high-quality ion-implanted layer can be uniformly formed on the surface of the layer.

  In both methods (A) and (B), the pulse width when applying a negative high voltage pulse, that is, when implanting ions, is preferably 1 to 15 μsec. When the pulse width is in such a range, ions can be implanted more easily and efficiently and uniformly.

  The applied voltage when generating plasma is preferably -1 to -50 kV, more preferably -1 to -30 kV, and particularly preferably -5 to -20 kV. When ion implantation is performed with an applied voltage greater than −1 kV, the ion implantation amount (dose amount) becomes insufficient, and desired performance cannot be obtained. On the other hand, if ion implantation is performed at a value smaller than −50 kV, the film is charged at the time of ion implantation, and defects such as coloring of the film are not preferable.

  Examples of ion species for plasma ion implantation include the same ions as those exemplified as the ions to be implanted.

When ions in plasma are implanted into the surface portion of the layer, a plasma ion implantation apparatus is used.
Specifically, as a plasma ion implantation apparatus, (α) a high-frequency power is superimposed on a feedthrough that applies a negative high-voltage pulse to a polymer layer (hereinafter also referred to as “ion-implanted layer”). A device for uniformly enclosing the periphery of the ion-implanted layer with plasma and attracting, implanting, colliding and depositing ions in the plasma (Japanese Patent Laid-Open No. 2001-26887), (β) An antenna is provided in the chamber, and high-frequency power After the plasma reaches the periphery of the layer to be ion-implanted by applying plasma, positive and negative pulses are alternately applied to the layer to be ion-implanted, so that the electrons in the plasma are attracted and collided with the positive pulse. An apparatus that heats a layer to be ion-implanted and controls the pulse constant to control the temperature while applying a negative pulse to attract and implant ions in the plasma (Japanese Patent Laid-Open No. 2001-1560) 13), (γ) a plasma ion implantation apparatus that generates plasma using an external electric field such as a high-frequency power source such as a microwave and applies high voltage pulses to attract and inject ions in the plasma, (δ And a plasma ion implantation apparatus that implants ions in plasma generated only by an electric field generated by applying a high voltage pulse without using an external electric field.

Among these, it is preferable to use the plasma ion implantation apparatus (γ) or (δ) because the processing operation is simple, the processing time can be greatly shortened, and it is suitable for continuous use.
Examples of the method using the plasma ion implantation apparatus (γ) and (δ) include those described in International Publication WO2010 / 021326.

  In the plasma ion implantation apparatuses (γ) and (δ), since the plasma generating means for generating plasma is also used by the high voltage pulse power source, other special means such as a high frequency power source such as RF and microwave are used. A portion that has been modified by ion implantation in the surface portion by generating a plasma simply by applying a negative high-voltage pulse without the need to inject ions in the plasma continuously into the surface portion of the polymer layer. The gas barrier sheet of the present invention having a polymer layer having a gas barrier layer, that is, a gas barrier layer, can be mass-produced.

  The thickness of the portion into which ions are implanted can be controlled by the implantation conditions such as ion type, applied voltage, treatment time, etc., and may be determined according to the thickness of the polymer layer, the purpose of use of the gas barrier sheet, etc. However, it is usually 10 to 1000 nm.

  The ion implantation can be confirmed by performing an elemental analysis measurement in the vicinity of 10 nm from the surface of the polymer layer using X-ray photoelectron spectroscopy (XPS).

(Gas barrier sheet)
The gas barrier sheet of the present invention is a gas barrier sheet having a base material and a gas barrier layer on at least one surface side of the base material, and the product of Young's modulus and thickness at 25 ° C. of the base material is The gas barrier layer has a surface roughness Ra of 5 nm or less and a surface roughness Rt of 80 nm or less at 1.5 × 10 ⁵ N / m or less.

The gas barrier layer may be formed on one side of the substrate or may be formed on both sides of the substrate. Further, the gas barrier layer may be a single layer or a plurality of layers may be laminated.
When the gas barrier sheet of the present invention is a laminate containing other layers, the type, arrangement position, and number of layers of the other layers are not particularly limited as long as the gas barrier layer is substantially the outermost layer.
Note that “the gas barrier layer is substantially the outermost layer” means that the gas barrier layer is the outermost layer when using the self-adhesive property of the gas barrier layer, and is attached to the adherend. May have a release sheet or the like on the surface of the gas barrier layer.
Examples of other layers include a primer layer, a conductor layer, and a shock absorbing layer.

The gas barrier sheet of the present invention may have one or more primer layers in addition to the base material and the gas barrier layer. In this case, the place where the primer layer is formed is not particularly limited. Especially, the gas barrier sheet | seat which has a base material, the primer layer formed in the at least one surface side on a base material, and the gas barrier layer which becomes the outermost layer substantially formed on this primer layer is preferable.
With such a configuration, a gas barrier layer excellent in surface smoothness can be easily formed, and a gas barrier sheet excellent in self-adhesiveness can be easily obtained.

  It does not specifically limit as a material which comprises a primer layer, A well-known thing can be used. For example, a photopolymerizable composition comprising a silicon-containing compound; a photopolymerizable compound comprising a photopolymerizable monomer and / or a photopolymerizable prepolymer, and a polymerization initiator that generates radicals at least in the visible light region; Resin, polyurethane resin (especially two-part curable resin of polyacryl polyol, polyester polyol, polyether polyol, etc. and isocyanate compound), acrylic resin, polycarbonate resin, vinyl chloride / vinyl acetate copolymer, polyvinyl butyral Resins such as resins and nitrocellulose resins; alkyl titanates; polyethyleneimines; These materials can be used alone or in combination of two or more.

  Among these, when the gas barrier layer is a layer containing a silicon-based polymer compound, a silicon-containing compound is preferable because better interlayer adhesion and surface smoothness can be obtained.

  Examples of the silicon-containing compound include at least one selected from the group consisting of polysilicate; silane coupling agent; polysilazane; polycarbosilane; polysilane.

Examples of the polysilicate include alkyl polysilicates such as methyl polysilicate which is a partial hydrolysis condensate of tetramethoxysilane and ethyl polysilicate which is a partial hydrolysis condensate of tetraethoxysilane; formula: M ₂ O · nSiO ₂ (formula M represents an alkali metal atom such as lithium or sodium, and n represents a positive number of 2 to 10).

  Examples of silane coupling agents include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, and 3- (2-aminoethyl) aminopropyltriethoxysilane. , 3- (2-aminoethyl) aminopropylmethyldimethoxysilane, 3- (2-aminoethyl) aminopropylmethyldiethoxysilane, and other aminosilane coupling agents; 3-glycidoxypropyltrimethoxysilane, 3-glycid Epoxy silane coupling agents such as xyloxymethyldimethoxysilane; 3-mercaptopropyltrimethoxysilane; 3-methacryloxypropyltrimethoxysilane; JP 2000-239447 A, JP 2001-40037 A, etc. Molecular silane coupling agent; and the like.

  Examples of polysilazane, polycarbosilane, and polysilane include those similar to polysilazane, polycarbosilane, and polysilane used as a material for forming the polymer layer.

For the primer layer, a primer layer forming solution obtained by dissolving or dispersing the material constituting the primer layer in an appropriate solvent is applied to one side or both sides of the substrate, and the obtained coating film is dried. It can be formed by heating.
As the method for applying the primer layer forming solution and the method for drying and heating the obtained coating film, those described above as the method for forming the polymer layer can be used.
The thickness of the primer layer is usually 10 to 1000 nm.

  Moreover, it is preferable that the primer layer is excellent in surface smoothness from the viewpoint of easily forming a gas barrier layer excellent in surface smoothness. The surface roughness Ra of such a primer layer is preferably 1.0 nm to 5.0 nm, and the surface roughness Rt is preferably 10 nm to 80 nm, and more preferably the surface roughness Ra is 2.0 nm to 4 nm. 0.5 nm and surface roughness Rt are 20 nm to 70 nm.

The gas barrier sheet of the present invention may have one or more conductor layers in addition to the base material and the gas barrier layer. In this case, the conductor layer is preferably formed on the surface opposite to the surface on which the gas barrier layer of the substrate is formed.
Examples of the material constituting the conductor layer include metals, alloys, metal oxides, electrically conductive compounds, and mixtures thereof. Specifically, antimony-doped tin oxide (ATO); fluorine-doped tin oxide (FTO); half oxide such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), and zinc indium oxide (IZO) Conductive metal oxides; metals such as gold, silver, chromium and nickel; mixtures of these metals and conductive metal oxides; inorganic conductive materials such as copper iodide and copper sulfide; organics such as polyaniline, polythiophene and polypyrrole Conductive materials; and the like.

There is no restriction | limiting in particular as a formation method of a conductor layer. For example, vapor deposition, sputtering, ion plating, thermal CVD, plasma CVD, and the like can be given.
What is necessary is just to select the thickness of a conductor layer suitably according to the use. The thickness is usually 10 nm to 50 μm, preferably 20 nm to 20 μm.

The gas barrier sheet of the present invention may have one or more shock absorbing layers in addition to the base material and the gas barrier layer.
The material for forming the shock absorbing layer is not particularly limited, and examples thereof include acrylic resins, urethane resins, silicone resins, olefin resins, and rubber materials.

There is no restriction | limiting in particular as a formation method of a shock absorption layer. For example, a shock-absorbing layer-forming solution containing a material for forming the shock-absorbing layer and, if desired, other components such as a solvent is prepared, and this solution is applied onto the layer to be laminated. The method of drying and forming by heating etc. as needed is mentioned.
Alternatively, a shock absorbing layer may be separately formed on the release substrate, and the obtained film may be transferred and stacked on the layer to be stacked.
The thickness of the shock absorbing layer is usually 1 to 100 μm, preferably 5 to 50 μm.

  The gas barrier sheet of the present invention may have a release sheet. The release sheet is laminated on the surface of the gas barrier layer. That is, the protective sheet is peeled off before the gas barrier sheet is attached to the adherend, and has a role of protecting the gas barrier layer and the like when the gas barrier sheet is stored and transported.

  Examples of release sheets include paper substrates such as glassine paper, coated paper, and high-quality paper; laminated paper obtained by laminating a thermoplastic resin such as polyethylene or polypropylene to these paper substrates; cellulose, starch, polyvinyl Paper base material treated with alcohol, acrylic-styrene resin, etc .; or plastic films such as polyester films such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyolefin films such as polyethylene and polypropylene; and these plastics And the like in which a release agent is applied to a film obtained by subjecting the film to an easy adhesion treatment and a release agent layer is provided.

  Examples of release agents include olefin resins such as polyethylene and polypropylene; rubber elastomers such as isoprene resins and butadiene resins; long chain alkyl resins; alkyd resins; fluorine resins; silicone resins; Things.

  The thickness of the release agent layer is not particularly limited, but is preferably 0.02 to 2.0 μm, more preferably 0.05 to 1.5 μm when the release agent is applied in a solution state.

The surface roughness Ra of the surface laminated on the gas barrier layer of the release sheet is preferably 10.0 nm or less, and more preferably 8.0 nm or less. Further, the surface roughness Rt is preferably 100 nm or less, and more preferably 50 nm or less.
If the surface roughness Ra and Rt exceed 10.0 nm and 100 nm, respectively, the surface roughness of the laminated gas barrier layer may increase.
The surface roughness Ra and Rt are values obtained for a measurement region of 10000 μm ² using an optical interference microscope.

An example of the gas barrier sheet of the present invention is shown in FIGS.
A gas barrier sheet 10 shown in FIG. 1A is a gas barrier sheet including a base material 11 and a gas barrier layer 12 formed on the base material 11.
A gas barrier sheet 20 shown in FIG. 1B is a gas barrier sheet comprising a base material 21, a primer layer 23 formed on the base material 21, and a gas barrier layer 22 formed on the primer layer 23. is there.
A gas barrier sheet 30 shown in FIG. 1C is a gas barrier sheet composed of a base material 31 and gas barrier layers 32a and 32b formed on both surfaces of the base material 31, respectively.
The gas barrier sheet 40 shown in FIG. 1 (d) has a base material 41, a primer layer 43 formed on the base material 41, and a surface of the base material 41 opposite to the surface on which the primer layer 43 is formed. It is a gas barrier sheet comprising the formed gas barrier layer.

The gas barrier sheet of the present invention is excellent in gas barrier properties. It can be confirmed that the gas barrier sheet of the present invention is excellent in gas barrier property since the water vapor permeability of the gas barrier sheet of the present invention is small.
For example, the water vapor transmission rate is preferably 0.5 g / m ² / day or less in an atmosphere of 40 ° C. and a relative humidity of 90%. The water vapor permeability of the gas barrier sheet can be measured using a known gas permeability measuring device.

The gas barrier sheet of the present invention has excellent self-adhesiveness. Here, “self-adhesive” refers to the property that the gas barrier sheet adheres to the adherend via the gas barrier layer without using an adhesive or the like.
The gas barrier sheet of the present invention has excellent self-adhesive properties because the gas barrier layer of the gas barrier sheet of the present invention and other sheets (for example, the gas barrier layer or primer layer of other gas barrier sheets) It can be confirmed from the fact that the shearing adhesive strength when bonding is large. It is preferable that the shear adhesive force when the adhesion area between the gas barrier layer and the adherend of the gas barrier sheet of the present invention is 100 mm ² (10 mm × 10 mm) is 0.5 N / 100 mm ² or more.

  When the gas barrier sheet of the present invention is adhered to an adherend due to its self-adhesive property, the adherend is preferably excellent in smoothness, its surface roughness Ra is 5 nm or less, and the surface roughness The thickness Rt is preferably 80 nm or less. If the surface roughness of the adherend is within the above range, the gas barrier sheet of the present invention can be easily attached to the adherend due to its self-adhesiveness.

  As described above, since the gas barrier sheet of the present invention is excellent in gas barrier property and self-adhesiveness, it is preferably used as a gas barrier sheet for forming a laminated sheet and a gas barrier sheet for element sealing.

2) Laminated sheet The laminated sheet of the present invention is a laminated sheet obtained by laminating at least two sheets, and at least one of the sheets is the gas barrier sheet of the present invention, and the gas barrier sheet. The gas barrier layer and another sheet are bonded together.

  In the laminated sheet of the present invention, the other sheet as the adherend is not particularly limited as long as it is a sheet-like material, but is a gas barrier sheet having a base material and a gas barrier layer on at least one surface side of the base material. It is preferable that the gas barrier sheet of the present invention is more preferable.

  Moreover, as long as the self-adhesiveness of the gas barrier sheet of the present invention is sufficiently exhibited, the gas barrier layer of the gas barrier sheet of the present invention and the bonding surface of the adherend to be bonded (layer to be bonded) are sufficiently exhibited. There is no particular limitation. Examples of the bonding surface (layer to be bonded) of the adherend include a gas barrier layer and a primer layer of a gas barrier sheet.

As a preferable laminated sheet of the present invention,
(I) A laminated sheet having a laminated structure in which at least two gas barrier sheets are directly bonded to each other between the gas barrier layers, and at least one of the gas barrier sheets is a gas barrier property of the present invention. A laminated sheet that is a sheet,
(Ii) A laminated sheet obtained by laminating at least two sheets, wherein at least one of the sheets is the gas barrier sheet of the present invention, and at least one of the other sheets is a base material. A gas barrier sheet having a gas barrier layer on one surface side of the substrate and a primer layer on the other surface side (hereinafter sometimes referred to as “other gas barrier sheet”), and the present invention. A laminated sheet in which a gas barrier layer of the gas barrier sheet and a primer layer of another gas barrier sheet are bonded, and
(Iii) A laminated sheet obtained by further laminating one or two or more gas barrier sheets on these laminated sheets.

  In the present invention, among these, a laminated sheet having a laminated structure in which at least two gas barrier sheets are directly bonded to each other between the gas barrier layers, each of the two gas barrier sheets being The laminated sheet which is the gas barrier sheet of the present invention is more preferable. If it is such a structure, the adhesive force of gas barrier sheets can be made higher by the self-adhesiveness of the gas barrier layers of the gas barrier sheet of this invention.

In the description of the laminated sheet and the element sealing body described later, “the gas barrier sheet of the present invention” means “a gas barrier property having a base material and a gas barrier layer on at least one surface side of the base material”. The sheet has a Young's modulus and thickness product at 25 ° C. of 1.5 × 10 ⁵ N / m or less, a surface roughness Ra of the gas barrier layer is 5 nm or less, and a surface. A gas barrier sheet characterized by having a roughness Rt of 80 nm or less. Further, the sheet described simply as “gas barrier sheet” or “other gas barrier sheet” includes a gas barrier sheet that does not satisfy the above-mentioned regulations.

The laminated sheet of the present invention preferably has a shear adhesive strength of 0.5 N / 100 mm ² or more when the adhesion area of the gas barrier layer of the gas barrier sheet is 100 mm ² (10 mm × 10 mm).

An example of the laminated sheet of the present invention is shown in FIGS. 2 (a), (b), and (c).
A laminated sheet 50 shown in FIG. 2 (a) is formed by laminating a gas barrier layer 22a of a gas barrier sheet 20a of the type shown in FIG. 1 (b) and a gas barrier layer 22b of the gas barrier sheet 20b by their respective self-adhesive properties. It is a laminated sheet obtained. Therefore, no adhesive layer or the like is formed between the gas barrier layers 22a and 22b.

  A laminated sheet 60 shown in FIG. 2B includes gas barrier layers 32a and 32b on both sides of a gas barrier sheet 30 of the type shown in FIG. 1C, and gas barrier sheets 10a and 10b of the type shown in FIG. These gas barrier layers 12a and 12b are laminated sheets obtained by bonding them by their self-adhesive properties. Therefore, no adhesive layer or the like is formed between the gas barrier layers 12a and 32a and between the gas barrier layers 12b and 32b.

  A laminated sheet 70 shown in FIG. 2 (c) includes a primer layer 43a of a gas barrier sheet 40a of the type shown in FIG. 1 (d) and a gas barrier layer 42b of the gas barrier sheet 40b, by self-adhesion of the gas barrier layer 42b. , A laminated sheet obtained by bonding. Therefore, no adhesive layer or the like is formed between the gas barrier layer 42b and the primer layer 43a.

  In addition, in FIG.2 (c), although the example using two gas barrier sheets 40a and 40b was shown, the laminated sheet further laminated | stacked by using three or more gas barrier sheets 40 is obtained. You can also. For example, on the gas barrier layer 42a of the laminated sheet 70 shown in FIG. 2 (c), a gas barrier sheet (other gas barrier sheets, not shown) having the same layer configuration as the gas barrier sheet 40b is used as the gas barrier layer 42a. By laminating the primer layer of another gas barrier sheet, a more laminated sheet can be obtained.

  The method for producing the laminated sheet is not particularly limited. For example, the target laminated sheet can be obtained by overlaying and pressure-bonding the above gas barrier sheet so that the obtained laminated sheet has a desired layer configuration.

A method for pressure bonding is not particularly limited, and a pressure bonding time and a pressure bonding temperature can be appropriately selected, and can be performed using a known device such as a laminator.
By using the gas barrier sheet of the present invention which is excellent in self-adhesiveness, a laminate can be easily obtained without using an adhesive or the like.

  In the laminated sheet of the present invention, since the gas barrier layer does not come into contact with the adhesive or the like, the gas barrier property does not deteriorate due to the influence of the adhesive. Further, since the gas barrier layer does not become the outermost layer, the gas barrier property is not deteriorated due to the damage of the gas barrier layer.

The laminated sheet of the present invention having such properties is preferably used as a sheet for electronic members, a sheet for packaging materials such as foods and pharmaceuticals.
In particular, it is suitable as a sheet for an electronic member such as a display member such as a liquid crystal display or an EL display;
When the laminated sheet of the present invention is used as a sheet for an electronic member, for example, the base material surface of the laminated sheet of the present invention and the surface of the electronic member that require gas barrier properties are adhered using an adhesive or the like. The gas barrier property is imparted to the electronic member.

3) Element sealing body The element sealing body of the present invention comprises a base material and at least two gas barrier sheets having a gas barrier layer on at least one surface side of the base material. An element sealing body having a laminated structure bonded and a sealing structure in which an element is sandwiched between the at least two gas barrier sheets, wherein at least one of the gas barrier sheets is the present invention. It is an element sealing body which is a gas barrier sheet.
In the element sealing body of the present invention, it is preferable that all the gas barrier sheets used are the gas barrier sheets of the present invention.

  An example of the element sealing body of the present invention is shown in FIGS. 3 and 4, the description of the layer structure of the gas barrier sheet is omitted, but the gas barrier layer exists on the surface side where the gas barrier sheets are in contact with each other.

3A is a view of the element sealing body 80 as viewed from above, and FIG. 3B is a view of the cross section taken along line XY in FIG. 3A as viewed from the side.
The element sealing body 80 is formed by laminating a gas barrier sheet 81b so as to cover the element 82 placed on the gas barrier sheet 81a. The gas barrier sheet 81a and the gas barrier sheet 81b are bonded by the self-adhesiveness of the gas barrier layer of each gas barrier sheet.

The thicknesses of the gas barrier sheets 81a and 81b are not particularly limited, and can be appropriately determined in consideration of gas barrier properties and warpage of the element sealing body.
Moreover, you may provide a recessed part in the part which touches the element 82 of gas barrier sheet | seat 81a, 81b. By providing the recess, a flatter element sealing body can be obtained.

  The element 82 to be sealed is not particularly limited, and examples thereof include a light emitting element, a light receiving element, a composite optical element, and an optical integrated circuit.

4A is a view of the element sealing body 90 as viewed from above, and FIG. 4B is a view of the cross section taken along line XY in FIG. 4A as viewed from the side.
In the element sealing body 90, on the gas barrier sheet 91a, there is a gas barrier sheet 91b on which a base material and both surfaces of the base material are self-adhesive gas barrier layers and a hole is provided in the center thereof. Are stacked. The element 92 is placed inside the hole of the gas barrier sheet 91b, and the gas barrier sheet 91c is laminated on the gas barrier sheet 91b so as to cover the element 92. The gas barrier sheet 91a and the gas barrier sheet 91b, and the gas barrier sheet 91b and the gas barrier sheet 91c are bonded by the self-adhesiveness of the gas barrier layer of each gas barrier sheet.
The structure of the element sealing body 90 is suitably used when sealing a relatively thick element.

  In the element sealing body of the present invention, the element is sealed without using a sealant or an adhesive. Therefore, the problem that the element deteriorates due to the permeation of oxygen and water vapor through the sealant and the adhesive is solved.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples.

  Plasma ion implantation apparatus and ion implantation conditions used to form the gas barrier layer, UV light irradiation apparatus used to form the primer layer, surface smoothness evaluation method, gas barrier property evaluation (water vapor transmission rate measuring apparatus and Measurement conditions) and the method for measuring the shear adhesive strength are as follows.

(Plasma ion implantation system)
RF power source: JEOL Ltd., model number “RF” 56000
High-voltage pulse power supply: “PV-3-HSHV-0835” manufactured by Kurita Manufacturing Co., Ltd.
(Plasma ion implantation conditions)
Plasma generation gas: Ar
Gas flow rate: 100sccm
Duty ratio: 0.5%
Voltage: 5kV
RF power supply: frequency 13.56 MHz, applied power 1000 W
Chamber internal pressure: 0.2 Pa
Pulse width: 5μsec
Processing time (ion implantation time): 5 minutes Conveying speed: 0.2 m / min

(UV light irradiation device)
Conveyor type UV light irradiation device: “F600V” manufactured by Fusion, UV lamp: high pressure mercury lamp.

(Evaluation of surface smoothness)
Evaluation of surface smoothness evaluated smoothness of the surface (gas barrier layer) of the gas barrier sheet at 10000 μm ² (100 μm × 100 μm) using an optical interference microscope (Veeco, “NT1100”).

(Measurement of shear adhesive strength)
The gas barrier layers of the two gas barrier sheets were pressed together so that the adhesion area was 100 mm ² (10 mm × 10 mm) to obtain a measurement sample.
Using the above samples, the shear adhesive strength was evaluated according to JIS Z 0237: 1991.

(Measurement of water vapor permeability)
Using a water vapor permeability measuring device (manufactured by mocon, “PERAMATRAN 3/33”), the water vapor permeability of the obtained gas barrier sheet and laminated sheet under the conditions of RH 90%, 40 ° C. was measured.

Example 1
A UV curable resin (large size) is applied to a base material (hereinafter referred to as “PET base material”) made of a polyethylene terephthalate film (trade name “PET25 R-56” manufactured by Toray Industries, Inc.) having a thickness of 25 μm and a Young's modulus of 4.5 GPa at 25 ° C. Nissei Kagaku Kogyo Co., Ltd., product surface “SEICA BEAM EXF-01L (NS)”) was applied with a bar coater, and the resulting coating film was heated and dried at 60 ° C. for 1 minute, and then a conveyor type UV light irradiation device (Fusion Corporation). "F600V", UV lamp: high pressure mercury lamp, line speed: 20 m / min, integrated light quantity: 120 mJ / cm ² , illuminance 1.466 W, lamp height: 104 mm), UV light irradiation is performed twice, A primer layer having a thickness of 0.75 μm was formed.
Thereafter, perhydropolysilazane (manufactured by Clariant, trade name “AQUAMICA NL110A-20”) was applied onto the primer layer by a spin coating method, and the resulting coating film was heated at 120 ° C. for 2 minutes to form a polymer layer. Formed. Argon ions were implanted into the surface of the polymer layer by plasma ion implantation to form a gas barrier layer, whereby a gas barrier sheet 1 was obtained.

(Example 2)
A gas barrier sheet 2 was obtained in the same manner as in Example 1 except that the thickness of the primer layer was changed from 0.75 μm to 1.0 μm.
(Example 3)
A gas barrier sheet 3 was obtained by the same method as in Example 1 except that the thickness of the primer layer was changed from 0.75 μm to 1.5 μm.
Example 4
A gas barrier sheet 4 was obtained by the same method as in Example 1 except that the thickness of the primer layer was changed from 0.75 μm to 2.0 μm.

(Example 5)
A gas barrier sheet 5 was obtained by the same method as in Example 1 except that the resin for forming the primer layer was changed to an ultraviolet curable resin (trade name “Beam Set 907” manufactured by Arakawa Chemical Industries, Ltd.). .
(Example 6)
In Example 1, except that the thickness of the PET substrate was changed to 31 μm (a polyethylene terephthalate film having a Young's modulus of 4.5 GPa at 25 ° C. (trade name “PET25 R-56” manufactured by Toray Industries, Inc.)) A gas barrier sheet 6 was obtained by the same method.
(Example 7)
Implemented except that a cycloolefin copolymer film having a thickness of 16 μm and a Young's modulus of 3.0 GPa at 25 ° C. (product name “TOPAS-6017”) was used instead of the PET substrate. In the same manner as in Example 1, a gas barrier sheet 7 was obtained.
(Example 8)
Implemented except that a cycloolefin copolymer film having a thickness of 31 μm and a Young's modulus of 3.0 GPa at 25 ° C. (product name “TOPAS-6017”) was used instead of the PET substrate. In the same manner as in Example 1, a gas barrier sheet 8 was obtained.

(Comparative Example 1)
A gas barrier sheet 9 was obtained in the same manner as in Example 1 except that the resin for forming the primer layer was changed to an ultraviolet curable resin (manufactured by Taisei Fine Chemical Co., Ltd., product name “ACRIT 8KX-052C”). .
(Comparative Example 2)
A gas barrier sheet 10 was obtained by the same method as in Example 1 except that the thickness of the PET substrate was changed to 50 μm.
(Comparative Example 3)
Implemented except that a polycarbonate film (product name “Pure Ace S-148” manufactured by Teijin Kasei Co., Ltd.) having a Young's modulus of 4.0 GPa at a thickness of 50 μm and a temperature of 25 ° C. was used instead of the PET substrate. A gas barrier sheet 11 was obtained in the same manner as in Example 1.
(Comparative Example 4)
Implemented except that a cycloolefin copolymer film with a thickness of 110 μm and a Young's modulus of 3.0 GPa at 25 ° C. (product name “TOPAS-6017”) was used instead of the PET substrate. A gas barrier sheet 12 was obtained in the same manner as in Example 1.

  Table 1 shows the surface smoothness (surface roughness Ra, Rt) of the gas barrier layers of the gas barrier sheets obtained in Examples 1 to 8 and Comparative Examples 1 to 4, and the physical properties of the substrates used.

(Examples 9 to 17, Comparative Examples 5 to 8)
As shown in Table 2, two gas barrier sheets selected from the gas barrier sheets 1 to 12 were pressure-bonded to each other to obtain a laminated sheet. Table 2 shows the shear adhesive strength and water vapor permeability of the obtained laminated sheet. In Comparative Examples 5 to 8, the gas barrier layers of the two gas barrier sheets did not adhere to each other, and a laminated sheet could not be obtained.

(Example 18)
A light-emitting element was prepared, and the gas barrier layers were pressure-bonded so as to sandwich the light-emitting element between two gas barrier sheets of Example 1, thereby obtaining an element sealing body. It was confirmed that the obtained element sealing body emitted light without any problem.

Since the gas barrier sheets 1 to 8 obtained in Examples 1 to 8 have self-adhesiveness, a laminated sheet can be formed without using an adhesive.
Moreover, the laminated sheets of Examples 9 to 17 obtained using the gas barrier sheets 1 to 9 have low water vapor permeability and excellent gas barrier properties.

10, 10a, 10b, 20, 20a, 20b, 30, 40, 40a, 40b ... gas barrier sheet 11, 11a, 11b, 21, 21a, 21b, 31, 41, 41a, 41b ... base material 12 , 12a, 12b, 22, 22a, 22b, 32a, 32b, 42, 42a, 42b ... gas barrier layers 23, 23a, 23b, 43, 43a, 43b ... primer layers 50, 60, 70 ... lamination Sheets 80, 90 ... element sealing bodies 81a, 81b, 91a, 91b, 91c ... gas barrier sheets 82, 92 ... elements

Claims (8)

A laminated sheet obtained by laminating at least two sheets,
At least one of the sheets is a gas barrier sheet having a base material and a gas barrier layer on at least one surface side of the base material,
The product of Young's modulus and thickness at 25 ° C. of the base material is 1.5 × 10 ⁵ N / m or less,
A gas barrier sheet having a surface roughness Ra of 5 nm or less and a surface roughness Rt of 80 nm or less of the gas barrier layer;
A laminated sheet, wherein the gas barrier layer of the gas barrier sheet and another sheet are directly bonded. The other sheet is a gas barrier sheet having a base material and a gas barrier layer on at least one surface side of the base material,
The product of Young's modulus and thickness at 25 ° C. of the base material is 1.5 × 10 ⁵ N / m or less,
The laminated sheet according to claim 1 , wherein the gas barrier layer has a surface roughness Ra of 5 nm or less and a surface roughness Rt of 80 nm or less . A laminated sheet having a laminated structure in which at least two of a base material and a gas barrier sheet having a gas barrier layer on at least one surface side of the base material are directly bonded to each other between the gas barrier layers of the gas barrier sheet. And
At least one of the gas barrier sheets is
The product of Young's modulus and thickness at 25 ° C. of the base material is 1.5 × 10 ⁵ N / m or less,
A laminated sheet, wherein the gas barrier layer has a surface roughness Ra of 5 nm or less and a surface roughness Rt of 80 nm or less . Wherein the gas barrier sheet is, with the substrate, and has a base material a primer layer formed on the gas barrier layer formed on the primer layer, according to claim 1 Laminated sheet. The laminated sheet according to any one of claims 1 to 4 , wherein a shear adhesive force when the adhesion area of the gas barrier layer of the gas barrier sheet is 100 mm ² (10 mm × 10 mm) is 0.5 N / 100 mm ² or more. The laminated sheet according to any one of claims 1 to 5 , which is a sheet for an electronic member. A laminated structure formed by directly laminating a base material and a gas barrier sheet having a gas barrier layer on at least one surface side of the base material, and the at least two elements An element sealing body having a sealing structure sandwiched between gas barrier sheets,
At least one of the gas barrier sheets is
The product of Young's modulus and thickness at 25 ° C. of the base material is 1.5 × 10 ⁵ N / m or less,
An element sealing body, which is a gas barrier sheet, wherein the gas barrier layer has a surface roughness Ra of 5 nm or less and a surface roughness Rt of 80 nm or less .   A laminated structure formed by directly laminating a base material and a gas barrier sheet having a gas barrier layer on at least one surface side of the base material, and the at least two elements An element sealing body having a sealing structure sandwiched between gas barrier sheets,
At least one of the gas barrier sheets is
The product of Young's modulus and thickness at 25 ° C. of the substrate is 1.5 × 10 ⁵ N / m or less,
The surface roughness Ra of the gas barrier layer is 5 nm or less, and the surface roughness Rt is 80 nm or less; and
Gas barrier sheet having the substrate, a primer layer formed on the substrate, and a gas barrier layer formed on the primer layer
The element sealing body which is.

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