JP5761123B2 - Thermoelectric converter - Google Patents

Thermoelectric converter Download PDF

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JP5761123B2
JP5761123B2 JP2012117321A JP2012117321A JP5761123B2 JP 5761123 B2 JP5761123 B2 JP 5761123B2 JP 2012117321 A JP2012117321 A JP 2012117321A JP 2012117321 A JP2012117321 A JP 2012117321A JP 5761123 B2 JP5761123 B2 JP 5761123B2
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thermoelectric conversion
heat exchanger
conversion element
temperature side
casing
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JP2013247123A (en
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平岡 基記
基記 平岡
洋一郎 河合
洋一郎 河合
盾哉 村井
盾哉 村井
木太 拓志
拓志 木太
慎介 広納
慎介 広納
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Toyota Motor Corp
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本発明は、電機エネルギーと熱エネルギーを変換する熱電変換素子を用いた熱電変換装置に関する。     The present invention relates to a thermoelectric conversion device using a thermoelectric conversion element that converts electrical energy and thermal energy.

図1に、従来の熱電変換装置の構成を示す。この熱電変換装置1は、対向して配置された絶縁基板2及び3を備え、基板上には、所定形状にパターニングされた電極4及び5が配置されている。この電極の間に、半田等の接合材料によって接合された第一の熱電変換素子6と第二の熱電変換素子7が配置され、両電極4及び5を導通させている。   FIG. 1 shows a configuration of a conventional thermoelectric conversion device. The thermoelectric conversion device 1 includes insulating substrates 2 and 3 disposed to face each other, and electrodes 4 and 5 patterned in a predetermined shape are disposed on the substrate. Between the electrodes, a first thermoelectric conversion element 6 and a second thermoelectric conversion element 7 bonded by a bonding material such as solder are disposed, and both electrodes 4 and 5 are made conductive.

通常、第一の熱電変換素子6としてはP型熱電変換素子が用いられ、第二の熱電変換素子7としてはN型熱電変換素子が用いられ、P型とN型の熱電変換素子が交互に直列に接続されている。外部端子に直流電圧を印加すると、電流がP型熱電変換素子6中では絶縁基板2から絶縁基板3に向かって流れ、N型熱電変換素子7中では、絶縁基板3から絶縁基板2に向かって流れる。ここで、P型の熱電変換素子6内では正孔が多数キャリアであり、一方、N型の熱電変換素子7内では電子が多数キャリアである。この電流を担う粒子の移動はともに絶縁基板2から3に向かう方向に起こる。一方、この電流を担う正孔及び電子のキャリアは熱の移動を伴うものである。そのため、P型熱電変換素子6中とN型熱電変換素子7中とにおいて、電流は互いに反対方向に向かって流れるのに対し、熱の流れは常に一方向に向かって生ずることになる。このため、熱電変換装置の一方の基板側では冷却が、他方の基板側では放熱が生ずることになる。   Usually, a P-type thermoelectric conversion element is used as the first thermoelectric conversion element 6, an N-type thermoelectric conversion element is used as the second thermoelectric conversion element 7, and P-type and N-type thermoelectric conversion elements are alternately arranged. Connected in series. When a DC voltage is applied to the external terminal, current flows from the insulating substrate 2 toward the insulating substrate 3 in the P-type thermoelectric conversion element 6, and from the insulating substrate 3 toward the insulating substrate 2 in the N-type thermoelectric conversion element 7. Flowing. Here, holes are majority carriers in the P-type thermoelectric conversion element 6, while electrons are majority carriers in the N-type thermoelectric conversion element 7. The movement of the particles carrying the current occurs in the direction from the insulating substrates 2 to 3. On the other hand, the hole and electron carriers that carry this current are accompanied by the movement of heat. Therefore, in the P-type thermoelectric conversion element 6 and the N-type thermoelectric conversion element 7, currents flow in opposite directions, whereas heat flows always in one direction. For this reason, cooling occurs on one substrate side of the thermoelectric conversion device, and heat radiation occurs on the other substrate side.

この各々の基板には熱交換器8及び9が配置され、各熱交換器は筐体10及び11によって囲われている。このような構成の従来の熱電変換装置においては、筐体10及び11は熱交換器9及び10に固定的に封止され(例えば特許文献1参照)、また高温側の熱交換器と低温側の熱交換器も固定的に接合されている(例えば特許文献2参照)。   Heat exchangers 8 and 9 are disposed on each of the substrates, and each heat exchanger is surrounded by housings 10 and 11. In the conventional thermoelectric conversion device having such a configuration, the casings 10 and 11 are fixedly sealed to the heat exchangers 9 and 10 (see, for example, Patent Document 1), and the high-temperature side heat exchanger and the low-temperature side These heat exchangers are also fixedly joined (see, for example, Patent Document 2).

特開2002−139264号公報JP 2002-139264 A 特開平8−321637号公報JP-A-8-321637

ところで、この熱電変換装置の熱交換器においては、高温側では熱により筐体全体が膨張し、低温側では冷却によって筐体全体が収縮し、この膨張、収縮に追従できない熱電変換素子の端部に熱応力が集中することになる。また筐体上部から圧力が加わると、熱電変換素子に圧力が加わることになる。一般に、熱電変換素子はその材質(例えばビスマステルル)が外力に対して極めて弱いため、従来の熱電変換装置におけるように、熱交換機を囲う筐体を熱交換器に固定的に封止したり、高温側の熱交換器と低温側の熱交換器も固定的に接合すると、熱電変換素子に熱応力もしくは圧力が集中することによって熱電変換素子が破壊してしまうおそれがある。   By the way, in the heat exchanger of this thermoelectric conversion device, the entire casing expands due to heat on the high temperature side, and the entire casing contracts due to cooling on the low temperature side, and the end of the thermoelectric conversion element that cannot follow this expansion and contraction Thermal stress concentrates on the surface. Further, when pressure is applied from the upper part of the casing, pressure is applied to the thermoelectric conversion element. In general, since the material (for example, bismuth tellurium) of the thermoelectric conversion element is extremely weak against external force, the housing surrounding the heat exchanger is fixedly sealed to the heat exchanger as in the conventional thermoelectric conversion device, If the high-temperature side heat exchanger and the low-temperature side heat exchanger are also fixedly joined, the thermoelectric conversion element may be destroyed due to concentration of thermal stress or pressure on the thermoelectric conversion element.

本発明はこのような課題を解決するためになされたものであり、熱電変換装置において熱電変換素子への熱応力もしくは圧力が集中することによる熱電変換素子の破壊を抑制することを目的としている。   The present invention has been made to solve such problems, and an object of the present invention is to suppress destruction of the thermoelectric conversion element due to concentration of thermal stress or pressure on the thermoelectric conversion element in the thermoelectric conversion device.

上記課題を解決するため、本発明によれば、一対の絶縁基板間に複数個の熱電変換素子を並置配設するとともに、各基板に設けた接合電極に熱電変換素子を接合した熱電変換モジュールと、この熱電変換モジュールの低温側及び高温側に配置された熱交換器と、この熱交換器を囲う筐体とから構成される熱電変換装置において、前記筐体が前記熱交換器に弾性封止体を介して封止されていることを特徴としている。   In order to solve the above problems, according to the present invention, a thermoelectric conversion module in which a plurality of thermoelectric conversion elements are arranged in parallel between a pair of insulating substrates, and the thermoelectric conversion elements are bonded to the bonding electrodes provided on each substrate; In the thermoelectric conversion device comprising a heat exchanger disposed on the low temperature side and the high temperature side of the thermoelectric conversion module and a housing surrounding the heat exchanger, the housing is elastically sealed to the heat exchanger. It is characterized by being sealed through the body.

好ましくは、上記熱電変換装置において、前記高温側の熱交換器を囲む筐体と前記低温側の熱交換器を囲む筐体が弾性封止体を介して保持されている。   Preferably, in the thermoelectric conversion device, a casing surrounding the high temperature side heat exchanger and a casing surrounding the low temperature side heat exchanger are held via an elastic sealing body.

本発明の熱電変換装置では、熱交換器を囲う筐体が熱交換器に弾性封止体を介して封止されていることにより、筐体の熱膨張等による熱応力が熱電変換素子に集中することを抑制している。また、高温側の熱交換器を囲む筐体と低温側の熱交換器を囲む筐体が弾性封止体を介して保持されていることにより、筐体上部からの圧力が直接熱電変換素子に加わることを抑制している。   In the thermoelectric conversion device of the present invention, the casing surrounding the heat exchanger is sealed to the heat exchanger via an elastic sealing body, so that thermal stress due to thermal expansion of the casing is concentrated on the thermoelectric conversion element. To suppress. In addition, since the casing surrounding the high-temperature side heat exchanger and the casing surrounding the low-temperature side heat exchanger are held via the elastic sealing body, the pressure from the top of the casing is directly applied to the thermoelectric conversion element. Suppressing participation.

従来の熱電変換装置の構成を示す略断面図である。It is a schematic sectional drawing which shows the structure of the conventional thermoelectric conversion apparatus. 本発明の熱電変換装置の構成を示す略断面図である。It is a schematic sectional drawing which shows the structure of the thermoelectric conversion apparatus of this invention.

本発明に係る熱電変換装置を図面に基づいて説明する。図2は、本発明の熱電変換装置の断面図である。本発明の熱電変換装置の基本構成は、図1に示す従来の熱電変換装置の構成と同じである。すなわち、本発明の熱電変換装置20は、対向して配置された絶縁基板2及び3を備え、基板上には、所定形状にパターニングされた電極4及び5が配置されている。絶縁基板2及び3としては、主にセラミックス製(例えばアルミナ、窒化アルミニウム)の基板が用いられる。電極4及び5は、銅、アルミニウム等の導電性材料より形成されている。電極4と電極5は部分的に対向しており、この対向部分に第一の熱電変換素子6及び第二の熱電変換素子7が配置され、接合材料、例えば半田によって電極4及び5と接合されている。   A thermoelectric conversion device according to the present invention will be described with reference to the drawings. FIG. 2 is a cross-sectional view of the thermoelectric conversion device of the present invention. The basic configuration of the thermoelectric conversion device of the present invention is the same as the configuration of the conventional thermoelectric conversion device shown in FIG. That is, the thermoelectric conversion device 20 of the present invention includes the insulating substrates 2 and 3 disposed to face each other, and the electrodes 4 and 5 patterned in a predetermined shape are disposed on the substrate. As the insulating substrates 2 and 3, substrates made of ceramics (for example, alumina, aluminum nitride) are mainly used. The electrodes 4 and 5 are made of a conductive material such as copper or aluminum. The electrode 4 and the electrode 5 are partially opposed to each other, and the first thermoelectric conversion element 6 and the second thermoelectric conversion element 7 are arranged in the facing part, and are bonded to the electrodes 4 and 5 by a bonding material, for example, solder. ing.

熱電変換素子6及び7は、熱電変換材料(例えばBi−Te系合金)の焼結体を板状、ウェハー状、棒状等の形状に加工したものが用いられ、そのサイズは適宜選択することができる。第一の熱電変換素子にはP型半導体(例えばBi−Te−Sb系)が用いられ、第二の熱電変換素子にはN型半導体(例えばBi−Te−Se系)が用いられ、この両者の熱電変換素子が交互に配列され、電極において直列に電気的に接続されている。   The thermoelectric conversion elements 6 and 7 are obtained by processing a sintered body of a thermoelectric conversion material (for example, a Bi—Te alloy) into a plate shape, a wafer shape, a rod shape, or the like, and the size can be appropriately selected. it can. A P-type semiconductor (for example, Bi-Te-Sb system) is used for the first thermoelectric conversion element, and an N-type semiconductor (for example, Bi-Te-Se system) is used for the second thermoelectric conversion element. The thermoelectric conversion elements are alternately arranged and electrically connected in series at the electrodes.

この各々の基板には熱交換器8及び9が配置され、各熱交換器は筐体10及び11によって囲われている。本発明の熱電変換装置においては、前記筐体10及び11が前記熱交換器8及び9に弾性封止体12を介して封止されている。また好ましくは、前記高温側の熱交換器8を囲む筐体10と前記低温側の熱交換器9を囲む筐体11が弾性封止体13を介して保持されている。   Heat exchangers 8 and 9 are disposed on each of the substrates, and each heat exchanger is surrounded by housings 10 and 11. In the thermoelectric conversion device of the present invention, the casings 10 and 11 are sealed to the heat exchangers 8 and 9 via an elastic sealing body 12. Preferably, a casing 10 surrounding the high temperature side heat exchanger 8 and a casing 11 surrounding the low temperature side heat exchanger 9 are held via an elastic sealing body 13.

この弾性封止体12及び13としては、筐体の熱膨張による熱応力、あるいは外部から加わる圧力を吸収・緩和することのできるサイズ、材料もしくは形状のものを用いることができる。具体的には、材料としては例えば、エポキシ樹脂、シリコーン、金属等を用い、oリング、ジャバラ、パッキン等の形状にすることができる。   As the elastic sealing bodies 12 and 13, those having a size, material, or shape capable of absorbing / relaxing thermal stress due to thermal expansion of the casing or externally applied pressure can be used. Specifically, as a material, for example, an epoxy resin, silicone, metal, or the like can be used, and an o-ring, bellows, packing, or the like can be formed.

このような構成の熱電変換装置においては、弾性封止体を介して筐体が熱交換器に封止されている構成のため、筐体の熱膨張による熱応力をこの弾性封止体が緩和し、熱電変換素子へ熱応力が加わることを抑制する。また、外部から圧力が加わった場合においても、この弾性封止体がこの圧力を緩和し、熱電変換素子へ圧力が加わることを抑制する。さらに、高温側の熱交換器を囲む筐体と低温側の熱交換器を囲む筐体が弾性封止体を介して保持されていることにより、筐体上部からの圧力が直接熱電変換素子に加わることを抑制する。   In the thermoelectric conversion device having such a configuration, since the casing is sealed by the heat exchanger via the elastic sealing body, the elastic sealing body relieves the thermal stress due to the thermal expansion of the casing. And it suppresses that a thermal stress is added to a thermoelectric conversion element. Even when pressure is applied from the outside, the elastic sealing body relaxes the pressure and suppresses the pressure from being applied to the thermoelectric conversion element. Furthermore, the casing surrounding the high temperature side heat exchanger and the casing surrounding the low temperature side heat exchanger are held via the elastic sealing body, so that the pressure from the top of the casing is directly applied to the thermoelectric conversion element. Suppresses joining.

1 熱電変換装置
2 絶縁基板
3 絶縁基板
4 電極
5 電極
6 熱電変換素子
7 熱電変換素子
8 熱交換器
9 熱交換器
10 筐体
11 筐体
12 弾性封止体
13 弾性封止体
DESCRIPTION OF SYMBOLS 1 Thermoelectric conversion apparatus 2 Insulating substrate 3 Insulating substrate 4 Electrode 5 Electrode 6 Thermoelectric conversion element 7 Thermoelectric conversion element 8 Heat exchanger 9 Heat exchanger 10 Case 11 Case 12 Elastic sealing body 13 Elastic sealing body

Claims (1)

一対の絶縁基板間に複数個の熱電変換素子を並列配設するとともに、各基板に設けた接合電極に熱電変換素子を接合した熱電変換モジュールと、この熱電変換モジュールの低温側及び高温側に配置された熱交換器と、この熱交換器を囲う筐体とから構成される熱電変換装置であって、前記筐体の開口部が弾性封止体を間にはさんで前記熱交換器によって封止されており、前記高温側の熱交換器を囲む筐体と前記低温側の熱交換器を囲む筐体が、間に弾性封止体をはさんで保持され封止されていることを特徴とする熱電変換装置。 A plurality of thermoelectric conversion elements are arranged in parallel between a pair of insulating substrates, a thermoelectric conversion module in which a thermoelectric conversion element is bonded to a bonding electrode provided on each substrate, and a low temperature side and a high temperature side of the thermoelectric conversion module And a housing surrounding the heat exchanger, wherein the opening of the housing is sealed by the heat exchanger with an elastic sealing member interposed therebetween. The casing surrounding the high temperature side heat exchanger and the casing surrounding the low temperature side heat exchanger are held and sealed with an elastic sealing body interposed therebetween. Thermoelectric conversion device.
JP2012117321A 2012-05-23 2012-05-23 Thermoelectric converter Expired - Fee Related JP5761123B2 (en)

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