JP5724923B2 - Socket for semiconductor element or contact for connector, and manufacturing method thereof - Google Patents

Description

The present invention, contact of socket or connector for semiconductor devices, and a process for the preparation of it.

  Conventionally, as a method of manufacturing contacts used for semiconductor element sockets and connectors, wire discharge machining that molds the shape of a contact from a metal plate by wire discharge, laser machining that molds the shape of a contact from a metal plate by a laser, There are press processing using a mold, etching processing using a plate making mask, and the like.

  Patent Document 1 discloses a method of manufacturing a contact pin using etching.

Japanese Patent Laid-Open No. 10-270140

  By the way, since a metal mold used for press working and a plate making mask used for etching work are expensive, it is not preferable in terms of manufacturing cost when manufacturing a wide variety of parts in a small amount. However, wire electric discharge machining and laser machining have a large variation in dimensional accuracy compared to press machining and etching, and the surface of the processed contact becomes rough.

  If the surface of the portion where the contact contacts the semiconductor element is rough, the electrical contact will be poor. Further, if the portion where the contact is positioned on the substrate is rough, the positioning accuracy is lowered.

The present invention has good electrical contact with a semiconductor element or the like, or has high positioning accuracy.
Semiconductor device socket or contacts for the connector, and aims to provide a method for producing it.

The method of manufacturing a contact for a semiconductor element socket or connector according to the present invention, which can solve the above-described problems, includes a positioning fixing portion fixed to a metal element socket or connector by pressing or etching. A contact piece connected to the semiconductor element socket or the terminal of the semiconductor element housed in the connector connected to the positioning fixing part, and an operation piece connected to the contact piece and operated by the cam surface of the semiconductor element socket or connector vertical positioning sides of the positioning and fixing unit in contact with the part, the horizontal positioning side portions, the operating portion of the operating piece, and a step of forming a portion corresponding to one of the contact portions of the contact piece , Vertical positioning side part of the positioning fixing part in the contact, horizontal positioning side part, operation part of the operation piece part, And, a metal plate portion is formed corresponding to the contact portion of the contact piece portions, the wire electrical discharge machining or laser machining to form a portion corresponding to the spring portion for connecting the positioning fixed portion contact piece of the contact And a process.

  In the method for manufacturing a contact for a semiconductor element socket or connector according to the present invention, the contact has a contact portion that is in electrical contact with another component, and a part of the shape includes the contact portion. preferable.

  In the method for manufacturing a contact for a semiconductor element socket or connector according to the present invention, the contact has an operation part that moves the position of the contact part by contacting with another component, and a part of the shape is It is preferable that the operation unit is included.

  In the method for manufacturing a contact for a semiconductor element socket or a connector according to the present invention, the contact has a positioning part that is fixed and positioned to another component, and a part of the shape includes the positioning part. Is preferred.

In the method for manufacturing a contact for a semiconductor element socket or a connector according to the present invention, it is preferable that the contact has a body part that is elastically deformed, and the remaining shape includes the body part.
The semiconductor element socket or connector contact of the present invention is manufactured by the above-described method for manufacturing a semiconductor element socket or connector contact. Further, the contact for the semiconductor element socket or connector of the present invention is a contact piece contact that makes electrical contact with the terminal of the semiconductor element formed on the metal plate with the first dimensional accuracy by pressing or etching. A positioning and fixing portion that is fixed and positioned on a member that accommodates a semiconductor element, and a metal plate that has been pressed or etched, and is connected to the positioning and fixing portion and the contact piece by wire electric discharge machining or laser machining. a bus Ne portion formed in a different second dimensional accuracy is one of the dimensional accuracy, and comprises a spring portion for connecting the positioning fixed portion contact piece portion.

According to the semiconductor element socket or connector contact of the present invention, and the manufacturing method thereof, the positioning fixing portion fixed to the semiconductor element socket or connector on the metal plate by pressing or etching , and positioning fixing A contact piece part connected to and separated from a terminal of a semiconductor element accommodated in a socket or connector for a semiconductor element connected to a part, an operation piece part connected to a contact piece part and operated by a cam surface of the socket for a semiconductor element or connector; vertical positioning sides of the positioning and fixing unit in contact with the horizontal positioning side portions, the operating portion of the operating piece, and, to form the corresponding part to one of the contact portions of the contact piece, positioned and fixed in the contact Vertical positioning side, horizontal positioning side, operating piece operating part, and contact piece connecting part A metal plate portion is formed corresponding to the section, the wire electrical discharge machining or laser machining to form a portion corresponding to the spring portion for connecting the positioning fixed portion contact piece of the contact. As a result, it is possible to manufacture at low cost a contact with high positioning accuracy with little dimensional variation and good electrical contact with the terminal of the semiconductor element.

It is sectional drawing of a part of socket for semiconductor elements provided with the contact manufactured by the manufacturing method of this invention. It is a side view of the contact provided in the socket for semiconductor elements. It is a top view of the metal plate explaining the manufacturing method of a contact. It is a top view of the metal plate in which the press processing which is a partial processing process of the manufacturing method of a contact was given. It is a top view explaining the metal mold | die used for press work. It is a perspective view of the metal plate laminated | stacked by the lamination process of the manufacturing method of a contact. It is a perspective view of the metal plate laminated | stacked by the lamination process of the manufacturing method of a contact. It is a perspective view of the state where a contact was cut out from a metal plate by wire electric discharge machining which is the remaining machining step of the contact manufacturing method. 10 is a plan view showing a contact and a mold according to Modification 1. FIG. 10 is a side view of a contact provided in a socket for a semiconductor element showing a contact according to Modification 2. FIG. 10 is a plan view showing a contact and a mold according to Modification 2. FIG. FIG. 10 is a side view of a contact provided on a semiconductor element socket showing a contact according to Modification 3; FIG. 10 is a plan view showing a contact and a mold according to Modification 3.

Hereinafter, an example of an embodiment of a method of manufacturing a socket for a semiconductor device or a contact for a connector according to the present invention will be described with reference to the drawings.
In the present embodiment, a case where a contact used for a semiconductor element socket is manufactured will be described as an example.

First, a socket for a semiconductor element and an inspection test contact used therefor will be described.
As shown in FIG. 1, the semiconductor element socket 11 is used when inspecting a semiconductor element DV mounted on an electronic device or the like. The semiconductor element DV is subjected to various tests at a stage before being mounted on an electronic device or the like, and potential defects thereof are removed. The test is performed non-destructively by voltage stress application, high temperature operation, high temperature storage, etc. corresponding to thermal and mechanical environment tests.

  The semiconductor element socket 11 subjected to such a test is disposed on a printed wiring board 12 having a conductive layer. The socket 11 for a semiconductor element includes a socket main body 14 having an accommodating portion 13 for positioning and accommodating a semiconductor element DV to be tested by being fixed on the printed wiring board 12, and an accommodating portion for the socket main body 14. A plurality of contacts 21 electrically connecting a plurality of terminals T of the semiconductor element DV disposed opposite to each other around the periphery of the semiconductor element DV to the conductive layer of the printed wiring board 12; A cover member 15 that constitutes a part of drive means for performing an operation of separating or approaching the contact portion 37 with respect to each terminal T of the semiconductor element DV is constituted as a main element.

FIG. 1 shows a state in which the terminal T of the semiconductor element DV is electrically connected by the contact 21.
The cover member 15 is supported by the socket body 14 so as to be movable up and down with respect to the socket body 14. The cover member 15 has a cam surface 16. When the cam surface 16 descends or rises, the cam surface 16 engages with the operation portion 39 of each contact 21 to separate or approach the contact portion 37 of the contact 21 with respect to the accommodating portion 13.

  The socket body 14 has a base portion 17 disposed on the printed wiring board 12, and a contact 21 is positioned and fixed on the upper surface of the base portion 17. A positioning hole 18 is formed in the base portion 17, and the fixed terminal portion 32 of the contact 21 is inserted into the positioning hole 18. The connection terminal portion 33 formed on the fixed terminal portion 32 is electrically connected to the conductive layer in the printed wiring board 12 by soldering or the like.

  The contact 21 is made of a sheet metal material. As the material of the contact 21, for example, an aging material such as beryllium copper which is hardened by heat treatment and generates spring property is preferably used. The material of the contact 21 may be phosphor bronze or titanium copper.

  As shown in FIG. 2, the contact 21 has a positioning and fixing portion 31. The positioning fixing portion 31 has a vertical positioning side portion (an example of a positioning portion) 31 a on the base portion 17 side, and the vertical positioning side portion 31 a is in contact with the upper surface of the base portion 17. Then, the vertical positioning side portion 31a is brought into contact with the upper surface of the base portion 17, whereby the contact 21 is positioned in the vertical direction.

  A fixed terminal portion 32 extending downward is formed in the positioning fixing portion 31 of the contact 21. The fixed terminal portion 32 has a horizontal positioning side portion (an example of a positioning portion) 32 a opposite to the housing portion 13 of the socket body portion 14, and the horizontal positioning side portion 32 a is in contact with the inner surface of the positioning hole 18. The Then, the contact 21 is positioned in the horizontal direction by the horizontal positioning side portion 32 a being brought into contact with the inner surface of the positioning hole 18 of the base portion 17. Further, the fixed terminal portion 32 is formed with a locking projection 32 b on the housing portion 13 side of the socket main body portion 14, and the locking projection 32 b bites into the inner surface of the positioning hole 18 of the base portion 17. The contact 21 is fixed to the base portion 17 of the socket main body portion 14.

The fixed terminal portion 32 is formed with a connection terminal portion 33 that extends further downward. The connection terminal portion 33 is inserted into the through hole 12a of the printed wiring board 12, and is electrically connected to the conductive layer of the printed wiring board 12 by soldering or the like (see FIG. 1).
Further, the contact 21 has a spring portion (an example of a main body portion) 34 extending upward from the positioning fixing portion 31. The spring portion 34 is formed in a shape in which a plurality of curved portions 34a that are curved in an arc shape are connected. Thus, the spring portion 34 can be elastically deformed.

  A movable portion 35 is formed at the end of the spring portion 34. The movable portion 35 has a contact piece portion 36 formed on the side of the accommodating portion 13 of the socket body portion 14. The contact piece portion 36 has a contact portion 37 protruding downward, and the contact portion 37 is brought into contact with and separated from the terminal T of the semiconductor element DV accommodated in the accommodation portion 13. The movable portion 35 has an operation piece portion 38 extending upward, and an operation portion 39 is formed at the upper end of the operation piece portion 38. When the cover member 15 is lowered or raised, the cam surface 16 of the cover member 15 is engaged with the operation portion 39. Thereby, in the contact 21, the spring portion 34 is elastically deformed to move the movable portion 35, and the contact portion 37 is brought into contact with and separated from the terminal T of the semiconductor element DV of the housing portion 13.

  Thus, in the contact 21 in which the contact portion 37 contacts and separates from the terminal T of the semiconductor element DV by the cam surface 16 of the cover member 15 engaging the operation portion 39, the contact portion 37 is in contact with the terminal T of the semiconductor element DV. In order to bring the contact portion 37 into and out of contact with high accuracy, the vertical and horizontal positions of the contact portion 37 and the operation portion 39 need to be positioned with high accuracy. Therefore, in the contact 21, the height dimension Ha from the vertical positioning side part 31 a to the contact part 37, the horizontal dimension Wa from the horizontal positioning side part 32 a to the contact part 37, and the height from the vertical positioning side part 31 a to the operation part 39. The dimension Hb and the horizontal dimension Wb from the horizontal positioning side part 32a to the operation part 39 are formed with high accuracy. In particular, the surface roughness of the contact portion 37 that is in electrical contact with the terminal T of the semiconductor element DV is minimized.

Next, a manufacturing method according to this embodiment for manufacturing the contact 21 will be described.
(Some processing steps)
As shown in FIG. 3, a metal plate 41 for forming the contact 21 is prepared, and the metal plate 41 is pressed. As a result, as shown in FIG. 4, a vertical positioning side portion 31 a, a horizontal positioning side portion 32 a, a contact portion 37, and an operation portion 39 that require machining accuracy are formed on the metal plate 41. Further, a positioning hole 42 and a bolt insertion hole 43 are also formed.
As shown in FIG. 5, the vertical positioning side part 31a, the horizontal positioning side part 32a, the contact part 37, and the operation part 39 use molds 45a, 45b, 45c, 45d, and these molds 45a, 45b, 45c, It is formed by pressing the metal plate 41 with 45d and making holes.

  As described above, the vertical positioning side portion 31a, the horizontal positioning side portion 32a, the contact portion 37, and the operation portion 39, which are a part of the shape of the contact 21, are formed by pressing with the molds 45a, 45b, 45c, and 45d. It is formed with high accuracy, and the height dimension Ha from the vertical positioning side part 31a to the contact part 37, the horizontal dimension Wa from the horizontal positioning side part 32a to the contact part 37, and from the vertical positioning side part 31a to the operation part 39 The height dimension Hb and the horizontal dimension Wb from the horizontal positioning side part 32a to the operation part 39 are accurately formed.

  The vertical positioning side part 31a, the horizontal positioning side part 32a, the contact part 37, and the operation part 39, which are a part of the shape that requires machining accuracy in the contact 21, use dies 45a, 45b, 45c, and 45d. You may form by the etching process using not only a press process but a plate-making mask. Even if the vertical positioning side portion 31a, the horizontal positioning side portion 32a, the contact portion 37, and the operation portion 39 are formed by this etching process, the vertical positioning side portion 31a, the horizontal positioning side portion 32a, the contact portion 37, and the operation portion 39 are formed. Can be machined with high accuracy, and the height dimension Ha from the vertical positioning side 31a to the contact part 37, the horizontal dimension Wa from the horizontal positioning side 32a to the contact part 37, and the operation from the vertical positioning side 31a The height dimension Hb to the part 39 and the horizontal dimension Wb from the horizontal positioning side part 32a to the operation part 39 can also be formed with high accuracy.

(Lamination process)
When the press work is performed on the plurality of metal plates 41, the plurality of metal plates 41 are stacked and the positioning pins 51 are inserted into the respective positioning holes 42 as shown in FIG. 6. If it does in this way, a plurality of metal plates 41 are laminated in the state where they were positioned in the surface direction.
Next, as shown in FIG. 7, the bolts 52 are inserted into the bolt insertion holes 43 of the laminated metal plates 41 and screwed into the nuts 53, so that the metal plates 41 are laminated by the bolts 52 and the nuts 53. Fasten and fix in the state where

(Remaining machining process)
Next, as shown in FIG. 8, the metal plate 41 laminated by wire electric discharge machining is cut, and the remaining portions other than the vertical positioning side portion 31 a, the horizontal positioning side portion 32 a, the contact portion 37, and the operation portion 39 in the contact 21. Form a shape part. As a result, the plurality of contacts 21 having the positioning fixing portion 31, the fixed terminal portion 32, the connection terminal portion 33, the spring portion 34, and the movable portion 35 are cut out from the plurality of metal plates 41. This wire electric discharge machining can be carried out at a low cost because a metal mold and a plate making mask are not required. The contact 21 can be cut out from the metal plate 41 without being limited to wire electric discharge machining and laser machining. Even when the contact 21 is cut out by this laser processing, the processing can be performed at a very low cost without using a mold or a plate making mask.

  By the way, when the contact 21 of the semiconductor element socket 11 used for inspecting the semiconductor element DV is produced in a small amount, such a contact 21 can be manufactured by press working using a dedicated mold, It is difficult to manufacture by etching using a plate-making mask in terms of manufacturing cost. Further, if the contact 21 is manufactured by wire electric discharge machining or laser machining, the manufacturing cost can be reduced, but the surface becomes rough and the electrical contact with the terminal T of the semiconductor element DV becomes insufficient, resulting in an electrical resistance. Will increase and the reliability of the test results will be reduced. Further, in wire electric discharge machining or laser machining, it is difficult to form the contact 21 with high dimensional accuracy. Therefore, the dimensional accuracy of the positioning portion of the manufactured contact 21 is also lowered, the accuracy when positioning the contact 21 on the socket body 14 of the semiconductor element socket 11 is lowered, and good inspection of the semiconductor element DV is difficult. Further, the surface roughness of the contact 21 manufactured by wire electric discharge machining or laser machining can be removed by polishing or chemical treatment, but sufficient dimensional accuracy cannot be obtained. A lot of labor is required for the work.

  On the other hand, according to the contact manufacturing method according to the above embodiment, one of the shapes of the contacts 21 such as the vertical positioning side portion 31a, the horizontal positioning side portion 32a, the contact portion 37, and the operation portion 39 that requires high dimensional accuracy. Wire discharge machining that can form parts with high precision by press working or etching, and can process the remaining shape parts such as other spring parts 34 at low cost by NC machining or the like without using a mold or a plate-making mask. It is formed by laser processing. As a result, the contact 21 with small positioning variations and good electrical contact with the terminal T of the semiconductor element DV and the like with high positioning accuracy can be manufactured at low cost.

In the above-described embodiment, the vertical positioning side 31a, the horizontal positioning side 32a, the contact portion 37, and the operation unit 39 that require high dimensional accuracy are formed by pressing or etching. At least one of 31a, horizontal positioning side portion 32a, contact portion 37, and operation portion 39 may be formed with high accuracy by pressing or etching.
Moreover, although the said embodiment demonstrated and demonstrated the contact 21 used for the socket 11 for semiconductor elements, the manufacturing method of this invention is applicable also when manufacturing the contact for connectors.

Next, modified examples of contacts that can be manufactured by the manufacturing method according to the present embodiment will be described.
(Modification 1)
As shown in FIG. 9, the contact 21 </ b> A includes a spring portion 34 having a shape different from that of the contact 21. Specifically, the radius of curvature of the curved portion 34a is increased, and the elastic force at the spring portion 34 is changed. Also in the case of such a contact 21A, a part of the shape of the contact 21 such as the vertical positioning side portion 31a, the horizontal positioning side portion 32a, the contact portion 37, and the operation portion 39 that requires high dimensional accuracy is formed by pressing or etching. The remaining portions of the shape such as the spring portion 34 are formed with high precision by wire electric discharge machining or laser machining which can be machined at low cost without using a mold or a plate making mask. As a result, the contact 21A having good positioning accuracy and good electrical contact with the terminal T of the semiconductor element DV can be manufactured at low cost.

  In addition, when manufacturing the contact 21A of the first modification, the molds 45a, 45b, 45c, and 45d shown in FIG. 5 are shared and used, and the vertical positioning side 31a and the horizontal positioning side that require high dimensional accuracy. A part of the shape of the contact 21 such as the contact portion 37 and the operation portion 39 is formed. That is, when manufacturing the contact 21A of the first modification in which only the shape of the spring part 34 is changed, the wire movement path of the wire electric discharge machining that forms the shape of the spring part 34 is changed without having to re-create the mold. Just do it. Therefore, since it is not necessary to recreate an expensive metal mold, it is possible to create the contact 21 </ b> A of the first modification while suppressing the manufacturing cost.

(Modification 2)
As shown in FIG. 10, the contact 21 </ b> B has a fixed terminal portion 32 extending downward from the positioning and fixing portion 31 bent and extended toward the housing portion 13 side of the socket body 14. In the contact 21 </ b> B, the positioning fixing portion 31 and the fixed terminal portion 32 are fixed to the socket body 14 by sandwiching the base portion 17 of the socket body 14.

  In this contact 21B, a portion of the fixed terminal portion 32 that vertically contacts the end surface 17a of the base portion 17 is a horizontal positioning side portion 32a, and the horizontal positioning side portion 32a contacts the end surface 17a of the base portion 17. By contact, the contact 21B is positioned in the horizontal direction. Also in the contact 21B, the horizontal dimension Wa from the horizontal positioning side part 32a to the contact part 37 and the horizontal dimension Wb from the horizontal positioning side part 32a to the operation part 39 are accurately formed.

  As shown in FIG. 11, in the contact 21B, the contact portion 37 and the operation portion 39 are formed by the dies 45c and 45d, and the gap between the positioning fixing portion 31 and the fixed terminal portion 32 is punched out by the die 45e. Thus, the vertical positioning side 31a and the horizontal positioning side 32a are formed.

  In this way, by pressing the molds 45c, 45d, and 45e, the contact portion 37, the operation portion 39, the vertical positioning side portion 31a, and the horizontal positioning side portion 32a, which are part of the shape of the contact 21B, are highly accurate. In addition, the height dimension Ha from the vertical positioning side part 31a to the contact part 37, the horizontal dimension Wa from the horizontal positioning side part 32a to the contact part 37, and from the vertical positioning side part 31a to the operation part 39 can be formed. The horizontal dimension Wb from the horizontal positioning side part 32a to the operation part 39 can be formed with high accuracy.

  Further, when manufacturing the contact 21B of the modified example 2, the shapes of the contacts 21B such as the contact portion 37 and the operation portion 39 that require high dimensional accuracy are shared by using the molds 45c and 45d shown in FIG. Forming part. Since the mold can be shared when manufacturing a small amount of various types of contacts, the manufacturing cost can be reduced.

(Modification 3)
As shown in FIG. 12, the contact 21 </ b> C includes a spring portion 34 having a single curved portion 34 a that is largely curved in an arc shape, and an end portion of the spring portion 34 is directed toward the housing portion 13 side of the socket body 14. It extends and is bent upward. The end portion of the spring portion 34 is a contact portion 37.

  In the contact 21 </ b> C, the housing portion 13 side of the socket body 14 in the fixed terminal portion 32 is a horizontal positioning side portion 32 a. In this contact 21 </ b> C, the horizontal positioning side portion 32 a is in contact with the inner surface of the positioning hole 18 of the base portion 17, thereby positioning in the horizontal direction, and the vertical positioning side portion 31 a is in contact with the base portion 17. Thus, the contact 21C is positioned in the vertical direction. Also in the contact 21C, the horizontal dimension Wa from the horizontal positioning side portion 32a to the contact portion 37 is formed with high accuracy, and the height dimension Ha from the vertical positioning side portion 31a to the contact portion 37 is formed with high accuracy.

Further, as shown in FIG. 13, in the contact 21C, a vertical positioning side portion 31a, a horizontal positioning side portion 32a, and a contact portion 37 are formed by dies 45f, 45g, and 45h.
In this way, the vertical positioning side portion 31a, the horizontal positioning side portion 32a, and the contact portion 37, which are part of the shape of the contact 21C, are formed with high precision by performing press working with the molds 45f, 45g, and 45h. Moreover, the height dimension Ha from the vertical positioning side part 31a to the contact part 37 and the horizontal dimension Wa from the horizontal positioning side part 32a to the contact part 37 can be accurately formed.

  The present invention is not limited to those exemplified in the above embodiment, and can be appropriately changed without departing from the gist of the present invention.

11: Socket for semiconductor element, 21, 21A, 21B, 21C: Contact, 31a: Vertical positioning side part (an example of positioning part), 32a: Horizontal positioning side part (an example of positioning part), 34: Spring part (main body part) Example), 37: contact part, 39: operation part

Claims (6)

A method for producing a socket for a semiconductor element or a contact for a connector,
Positioning and fixing portions fixed to the semiconductor element socket or connector on the metal plate by pressing or etching , and terminals of the semiconductor elements connected to the positioning fixing portion and accommodated in the semiconductor element socket or connector A vertical positioning side part of a positioning fixing part in a contact having a contact piece part to be contacted and separated, and an operation piece part connected to the contact piece part and operated by a cam surface of the socket for a semiconductor element or a connector , a horizontal positioning side part A step of forming a part corresponding to any of the operation part of the operation piece part and the contact part of the contact piece part;
Vertical positioning sides of the positioning and fixing portion in the contact, the horizontal positioning side portions, the operating portion of the operating piece, and the metal plate portion is formed corresponding to the contact portion of the contact piece portions, wire electrical discharge machining or laser Forming a portion corresponding to a spring portion for connecting the contact piece portion of the contact and the positioning fixing portion by processing, and a method for producing a contact for a socket for a semiconductor device or a connector for a connector .   When a plurality of contacts having different shapes of the spring portion are pressed, the operation portion of the operation piece portion and a mold that forms a portion corresponding to the contact portion of the contact piece portion are shared. A method for manufacturing a socket for a semiconductor element or a contact for a connector according to claim 1.   A socket for a semiconductor element or a contact for a connector manufactured by the method for manufacturing a socket for a semiconductor element or a connector for a connector according to claim 1. By pressing or etching, the contact portion of the contact piece portion that is in electrical contact with the terminal of the semiconductor element formed on the metal plate with the first dimensional accuracy and the member that accommodates the semiconductor element are fixed and positioned. Positioning fixing part
A bar formed on the pressed or etched metal plate with a second dimensional accuracy different from the first dimensional accuracy connected to the positioning and fixing portion and the contact piece by wire electric discharge machining or laser machining. a root, and a spring portion for connecting the said contact piece portion and the positioning and fixing unit,
A socket for a semiconductor device or a contact for a connector.   5. The semiconductor device according to claim 4, further comprising an operation portion of an operation piece portion that moves a position of the contact portion formed on the metal plate with the first dimensional accuracy by the pressing process or the etching process. Contact for socket or connector.   When a plurality of contacts having different shapes of the spring portion are pressed, the operation portion of the operation piece portion and a mold that forms a portion corresponding to the contact portion of the contact piece portion are shared. 5. A socket for a semiconductor element or a contact for a connector according to claim 4.

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