JP5724065B2 - Electromagnetic relay - Google Patents

Electromagnetic relay Download PDF

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Publication number
JP5724065B2
JP5724065B2 JP2011038519A JP2011038519A JP5724065B2 JP 5724065 B2 JP5724065 B2 JP 5724065B2 JP 2011038519 A JP2011038519 A JP 2011038519A JP 2011038519 A JP2011038519 A JP 2011038519A JP 5724065 B2 JP5724065 B2 JP 5724065B2
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contact
movable
spring
electromagnetic relay
fixed
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JP2012174648A (en
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加藤　芳正
芳正 加藤
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H3/00—Mechanisms for operating contacts
    • H01H3/22—Power arrangements internal to the switch for operating the driving mechanism
    • H01H3/30—Power arrangements internal to the switch for operating the driving mechanism using spring motor
    • H01H3/3005—Charging means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/64—Driving arrangements between movable part of magnetic circuit and contact
    • H01H50/641—Driving arrangements between movable part of magnetic circuit and contact intermediate part performing a rectilinear movement
    • H01H50/642—Driving arrangements between movable part of magnetic circuit and contact intermediate part performing a rectilinear movement intermediate part being generally a slide plate, e.g. a card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/12—Ventilating; Cooling; Heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/16—Magnetic circuit arrangements
    • H01H50/18—Movable parts of magnetic circuits, e.g. armature
    • H01H50/24—Parts rotatable or rockable outside coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/02—Non-polarised relays
    • H01H51/04—Non-polarised relays with single armature; with single set of ganged armatures
    • H01H51/06—Armature is movable between two limit positions of rest and is moved in one direction due to energisation of an electromagnet and after the electromagnet is de-energised is returned by energy stored during the movement in the first direction, e.g. by using a spring, by using a permanent magnet, by gravity

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Contacts (AREA)

Description

本発明は、電磁リレーに関する。   The present invention relates to an electromagnetic relay.

従来、電磁リレーとして、駆動部を駆動させることで移動するカードと、カードに橋架された可動ばねと、可動ばねの一端に固着された可動接点と、可動接点に対向して配置された固定接点と、を備えるものが知られている（例えば、特許文献１参照）。   Conventionally, as an electromagnetic relay, a card that moves by driving a drive unit, a movable spring bridged by the card, a movable contact fixed to one end of the movable spring, and a fixed contact arranged to face the movable contact (For example, refer to Patent Document 1).

この特許文献１では、駆動部の駆動によりカードを移動させ、当該カードの移動により可動ばねを変位させることで、可動接点と固定接点との接離を切り換えている。   In Patent Document 1, the card is moved by driving the drive unit, and the movable spring is displaced by the movement of the card, thereby switching the contact between the movable contact and the fixed contact.

特開２０１１−００９００２号公報JP 2011-009002 A

ところで、可動接点と固定接点とを接触させた状態で電流を流すと可動接点と固定接点とが溶着する場合があるが、上記従来技術では、可動ばねは可撓性を有している。そのため、可動接点と固定接点とが接触時に溶着した際に、可動接点と固定接点とが離隔するようにカードを移動させると、可動ばねが撓むだけで可動接点と固定接点とを離隔させることができなくなるおそれがあった。   By the way, when a current is passed in a state where the movable contact and the fixed contact are in contact with each other, the movable contact and the fixed contact may be welded. However, in the above prior art, the movable spring has flexibility. Therefore, when the movable contact and the fixed contact are welded at the time of contact, if the card is moved so that the movable contact and the fixed contact are separated from each other, the movable contact and the fixed contact are separated only by bending the movable spring. There was a risk that it would be impossible.

そこで、本発明は、より確実に可動接点と固定接点とを離隔させることのできる電磁リレーを得ることを目的とする。   Therefore, an object of the present invention is to obtain an electromagnetic relay capable of separating a movable contact and a fixed contact more reliably.

本発明にあっては、駆動部と、当該駆動部を駆動させることで移動する移動体と、前記移動体に取り付けられた可動ばねと、前記可動ばねに固着された可動接点と、前記可動接点に対向して配置された固定接点と、を備える電磁リレーであって、前記移動体と前記可動ばねのうち少なくともいずれか一方に、前記可動接点と前記固定接点とが溶着した際に、前記可動接点と前記固定接点とを引き剥がす引き剥がし機構を設け、前記引き剥がし機構は、前記可動接点と前記固定接点とを引き剥がす際に、前記可動ばねの前記移動体による力点と前記可動接点との間に当接して当該可動ばねを前記可動接点が前記固定接点から離隔する方向に押圧することを主要な特徴とする。
In the present invention, a drive unit, a movable body that moves by driving the drive unit, a movable spring attached to the movable body, a movable contact fixed to the movable spring, and the movable contact An electromagnetic relay comprising a fixed contact disposed opposite to the movable body, wherein the movable contact and the fixed contact are welded to at least one of the movable body and the movable spring. A peeling mechanism for peeling the contact and the fixed contact is provided , and the peeling mechanism is configured to remove a force point by the moving body of the movable spring and the movable contact when peeling the movable contact and the fixed contact. The main feature is that the movable contact is pressed against the movable spring in a direction in which the movable contact is separated from the fixed contact .

本発明によれば、移動体と可動ばねのうち少なくともいずれか一方に、可動接点と固定接点とが溶着した際に、可動接点と固定接点とを引き剥がす引き剥がし機構を設けている。その結果、引き剥がし機構によって互いに溶着した可動接点と固定接点とを引き剥がすことが可能となり、より確実に可動接点と固定接点とを離隔させることができる。   According to the present invention, at least one of the moving body and the movable spring is provided with a peeling mechanism for peeling the movable contact and the fixed contact when the movable contact and the fixed contact are welded. As a result, the movable contact and the fixed contact which are welded to each other by the peeling mechanism can be peeled off, and the movable contact and the fixed contact can be separated more reliably.

図１は、本発明の第１実施形態にかかる電磁リレーを一部分解して示す斜視図である。FIG. 1 is a partially exploded perspective view showing the electromagnetic relay according to the first embodiment of the present invention. 図２は、本発明の第１実施形態にかかる電磁リレー本体部を一部分解して示す斜視図である。FIG. 2 is a partially exploded perspective view showing the electromagnetic relay main body according to the first embodiment of the present invention. 図３は、本発明の第１実施形態にかかる電磁リレー本体部を模式的に示す縦断面図である。FIG. 3 is a longitudinal sectional view schematically showing the electromagnetic relay main body according to the first embodiment of the present invention. 図４は、本発明の第１実施形態にかかる電磁リレー本体部を模式的に示す平面図であって、駆動部を駆動させる前の状態を示す平面図である。FIG. 4 is a plan view schematically showing the electromagnetic relay main body according to the first embodiment of the present invention, and is a plan view showing a state before driving the drive unit. 図５は、本発明の第１実施形態にかかる電磁リレー本体部を模式的に示す平面図であって、駆動部を駆動させた後の状態を示す平面図である。FIG. 5 is a plan view schematically showing the electromagnetic relay main body according to the first embodiment of the present invention, and is a plan view showing a state after driving the drive unit. 図６は、本発明の第１実施形態にかかる電磁リレー本体部を模式的に示す平面図であって、駆動部を駆動させる前の状態を示す一部破断平面図である。FIG. 6 is a plan view schematically showing the electromagnetic relay main body according to the first embodiment of the present invention, and is a partially broken plan view showing a state before driving the drive unit. 図７は、本発明の第１実施形態にかかる可動接点部を示す斜視図である。FIG. 7 is a perspective view showing the movable contact portion according to the first embodiment of the present invention. 図８は、本発明の第１実施形態にかかる移動体を示す斜視図である。FIG. 8 is a perspective view showing the moving body according to the first embodiment of the present invention. 図９は、本発明の第１実施形態にかかる移動体を示す正面図である。FIG. 9 is a front view showing the moving body according to the first embodiment of the present invention. 図１０は、本発明の比較例として示す電磁リレー本体部を一部拡大して示す平面図であって、（ａ）は、可動接点と固定接点とが接触した状態を示す平面図、（ｂ）は、可動接点と固定接点との溶着時に、移動体を可動接点と固定接点とが接離するように移動させた状態を示す平面図である。FIG. 10 is a partially enlarged plan view showing an electromagnetic relay main body shown as a comparative example of the present invention, in which (a) is a plan view showing a state where a movable contact and a fixed contact are in contact with each other; ) Is a plan view showing a state in which the movable body is moved so that the movable contact and the fixed contact come into contact with and away from each other at the time of welding the movable contact and the fixed contact. 図１１は、本発明の第１実施形態にかかる電磁リレー本体部を一部拡大して示す平面図であって、（ａ）は、可動接点と固定接点とが接触した状態を示す平面図、（ｂ）は、通常時に、移動体を可動接点と固定接点とが接離するように移動させた状態を示す平面図、（ｃ）は、可動接点と固定接点との溶着時に、移動体を可動接点と固定接点とが接離するように移動させた状態を示す平面図である。FIG. 11 is a partially enlarged plan view showing the electromagnetic relay main body according to the first embodiment of the present invention, wherein (a) is a plan view showing a state in which the movable contact and the fixed contact are in contact with each other. (B) is a plan view showing a state in which the movable body is moved so that the movable contact and the fixed contact are brought into contact with and separated from each other at normal times; It is a top view which shows the state moved so that a movable contact and a fixed contact may contact / separate. 図１２は、本発明の第２実施形態にかかる可動接点部を示す斜視図である。FIG. 12 is a perspective view showing a movable contact portion according to the second embodiment of the present invention. 図１３は、本発明の第２実施形態にかかる電磁リレー本体部を一部拡大して示す平面図であって、（ａ）は、可動接点と固定接点とが接触した状態を示す平面図、（ｂ）は、可動接点と固定接点との溶着時に、移動体を可動接点と固定接点とが接離するように移動させた状態を示す平面図である。FIG. 13: is a top view which partially expands and shows the electromagnetic relay main-body part concerning 2nd Embodiment of this invention, Comprising: (a) is a top view which shows the state which the movable contact and the fixed contact contacted, (B) is a top view which shows the state which moved the moving body so that a movable contact and a fixed contact may contact / separate at the time of welding of a movable contact and a fixed contact. 図１４は、本発明の第２実施形態の第１変形例にかかる可動接点部を示す斜視図である。FIG. 14 is a perspective view showing a movable contact portion according to a first modification of the second embodiment of the present invention. 図１５は、本発明の第２実施形態の第２変形例にかかる可動接点部を示す斜視図である。FIG. 15 is a perspective view showing a movable contact portion according to a second modification of the second embodiment of the present invention. 図１６は、本発明の第２実施形態の第３変形例にかかる可動接点部を示す斜視図である。FIG. 16 is a perspective view showing a movable contact portion according to a third modification of the second embodiment of the present invention. 図１７は、本発明の第２実施形態の第４変形例にかかる可動接点部を示す斜視図である。FIG. 17 is a perspective view showing a movable contact portion according to a fourth modification of the second embodiment of the present invention.

以下、本発明の実施形態について図面を参照しつつ詳細に説明する。なお、以下の複数の実施形態には、同様の構成要素が含まれている。よって、以下では、それら同様の構成要素には共通の符号を付与するとともに、重複する説明を省略する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that similar components are included in the following embodiments. Therefore, in the following, common reference numerals are given to those similar components, and redundant description is omitted.

（第１実施形態）
本実施形態にかかる電磁リレー１は、電磁リレー本体部１０の上方からケース２０を被せ、当該ケース２０をボディ４０に接着固定することで略箱型に形成されている。 (First embodiment)
The electromagnetic relay 1 according to the present embodiment is formed in a substantially box shape by covering the case 20 from above the electromagnetic relay main body 10 and adhesively fixing the case 20 to the body 40.

ケース２０は、下方が開口した略箱状をしており、後述する電磁石装置（駆動部）３０や複数の接点機構６０をボディ４０に組み付けた状態でそれらを上部から覆うようになっている（図１参照）。本実施形態では、ケース２０の外周部２０ａを外周溝４３に接着剤により接着することで、ケース２０をボディ４０に外嵌装着している。なお、図１の符号２３は、ケース２０を接着・硬化させる際に、内圧が高くならないようにするための空気逃がし用の穴である。   The case 20 has a substantially box-like shape with an opening at the bottom, and covers an electromagnet device (driving unit) 30 and a plurality of contact mechanisms 60, which will be described later, from the top in a state where it is assembled to the body 40 ( (See FIG. 1). In the present embodiment, the case 20 is externally attached to the body 40 by bonding the outer peripheral portion 20a of the case 20 to the outer peripheral groove 43 with an adhesive. In addition, the code | symbol 23 of FIG. 1 is a hole for the air escape for preventing internal pressure from becoming high when bonding and hardening the case 20. FIG.

電磁リレー本体部１０は、図１および図２に示すように、電磁石装置（駆動部）３０および複数の接点機構６０をボディ４０に組み付けることで形成されている。   As shown in FIGS. 1 and 2, the electromagnetic relay main body 10 is formed by assembling an electromagnet device (driving unit) 30 and a plurality of contact mechanisms 60 to the body 40.

そして、通電のオン・オフ切換により電磁石装置（駆動部）３０を駆動させ、当該電磁石装置（駆動部）３０の駆動をカード５０に伝達することで、複数の接点機構６０の開状態・閉状態を切り換えられるようにしている。   Then, the electromagnet device (driving unit) 30 is driven by energization on / off switching, and the drive of the electromagnet device (driving unit) 30 is transmitted to the card 50, whereby the contact mechanisms 60 are opened and closed. Can be switched.

この電磁石装置（駆動部）３０としては、公知のものを用いることができる。本実施形態では、鉄心３１、可動ブロック３２、コイル（図示せず）で電磁石装置３０を構成している。そして、コイル（図示せず）に通電することで可動ブロック３２を移動させ、当該可動ブロック３２の移動に伴い、可動ブロック３２に取り付けられたカード５０がボディ４０の長手方向に移動するようにしている。   As this electromagnet device (drive unit) 30, a known device can be used. In this embodiment, the electromagnet apparatus 30 is comprised with the iron core 31, the movable block 32, and the coil (not shown). The movable block 32 is moved by energizing a coil (not shown), and the card 50 attached to the movable block 32 moves in the longitudinal direction of the body 40 as the movable block 32 moves. Yes.

また、電磁石装置３０には、図示せぬ基板に接続するための基板接続用端子３０ａが設けられている。この基板接続用端子３０ａは、ボディ４０の電磁石装置（駆動部）載置用の凹部４４に形成された端子挿通孔（図示せず）に挿通される。そして、基板接続用端子３０ａを端子挿通孔（図示せず）に挿通して、ボディ４０の下面側に端子３０ａが突出するように電磁石装置３０を圧入することで、電磁石装置３０がボディ４０の長手方向中央部に組み付けられる。   The electromagnet device 30 is provided with a board connection terminal 30a for connection to a board (not shown). The board connection terminal 30 a is inserted into a terminal insertion hole (not shown) formed in the recess 44 for mounting the electromagnet device (drive unit) of the body 40. Then, the board connecting terminal 30 a is inserted into a terminal insertion hole (not shown), and the electromagnet apparatus 30 is press-fitted so that the terminal 30 a protrudes from the lower surface side of the body 40. It is assembled at the longitudinal center.

また、略長方形状のボディ４０の長手方向両端部には、短手方向に延在する接点機構固定用のスリット穴４１が複数形成されている。   A plurality of slit holes 41 for fixing the contact mechanism extending in the short direction are formed at both ends in the longitudinal direction of the substantially rectangular body 40.

そして、ボディ４０の外周部には、ケース２０接着用の外周溝４３が形成されており、この外周溝４３にケース２０の外周部２０ａを外嵌接着することで、ケース２０がボディ４０に外嵌装着されるようになっている。   An outer peripheral groove 43 for adhering the case 20 is formed on the outer peripheral portion of the body 40, and the outer peripheral portion 20 a of the case 20 is fitted and adhered to the outer peripheral groove 43 so that the case 20 is attached to the body 40. It is designed to be fitted.

さらに、電磁石装置（駆動部）載置用の凹部４４の両側のボディ４０の短手方向中央部には、ボディ４０の長手方向に延在するガイド凹部４５が形成されており、カード５０の先端が当該ガイド凹部４５内でガイドされながら移動できるようになっている。   Further, a guide recess 45 extending in the longitudinal direction of the body 40 is formed at the center portion in the short direction of the body 40 on both sides of the recess 44 for mounting the electromagnet device (drive unit). Can move while being guided in the guide recess 45.

また、複数の接点機構６０は、それぞれ、可動接点部６１および固定接点部６２を備えている。   Each of the plurality of contact mechanisms 60 includes a movable contact portion 61 and a fixed contact portion 62.

可動接点部６１は、カード５０に挟持される薄板状の板ばね（可動ばね）６１ａと、当該板ばね６１ａの根元部分に取り付けられた固定板６１ｂと、を備えている。さらに、可動接点部６１は、固定板６１ｂに設けられた基板接続用の端子６１ｃと、板ばね６１ａの先端部分に設けられた可動接点６１ｄと、を備えている。   The movable contact portion 61 includes a thin plate-like plate spring (movable spring) 61a sandwiched between the cards 50, and a fixed plate 61b attached to a root portion of the plate spring 61a. Furthermore, the movable contact portion 61 includes a board connection terminal 61c provided on the fixed plate 61b, and a movable contact 61d provided on the tip of the leaf spring 61a.

一方、固定接点部６２は、上側固定板６２ａと、下側固定板６２ｂと、下側固定板６２ｂに設けられた基板接続用の端子６２ｃと、上側固定板６２ａに設けられ、可動接点６１ｄと接離可能な固定接点６２ｄと、を備えている。   On the other hand, the fixed contact portion 62 is provided on the upper fixed plate 62a, the lower fixed plate 62b, the board connection terminal 62c provided on the lower fixed plate 62b, the upper fixed plate 62a, and the movable contact 61d. A fixed contact 62d capable of contacting and separating.

そして、各端子６１ｃ，６２ｃをそれぞれボディ４０の下面側に突出するようにスリット穴４１に挿通し、可動接点部６１および固定接点部６２をスリット穴４１に圧入することで、可動接点部６１および固定接点部６２がボディ４０に組み付けられている。   Then, each of the terminals 61c and 62c is inserted into the slit hole 41 so as to protrude to the lower surface side of the body 40, and the movable contact portion 61 and the fixed contact portion 62 are press-fitted into the slit hole 41, whereby the movable contact portion 61 and The fixed contact 62 is assembled to the body 40.

なお、本実施形態では、接点機構６０の可動接点部６１および固定接点部６２には、それぞれ１つの接点６１ｄ，６２ｄが設けられている。   In the present embodiment, the movable contact 61 and the fixed contact 62 of the contact mechanism 60 are provided with one contact 61d and 62d, respectively.

また、本実施形態では、図４における右側の３つの接点機構６０のうち電磁石装置（駆動部）３０に近い側の２つの接点機構６０を常閉接点としている。すなわち、常閉接点としての接点機構６０は、電磁石装置（駆動部）３０が無励磁の状態では、接点６１ｄ，６２ｄが接触しており、電磁石装置（駆動部）３０を励磁させると、接点６１ｄ，６２ｄが離間するようになっている。   In the present embodiment, two contact mechanisms 60 on the side close to the electromagnet device (drive unit) 30 among the three contact mechanisms 60 on the right side in FIG. 4 are normally closed contacts. That is, the contact mechanism 60 serving as a normally closed contact is in contact with the contacts 61d and 62d when the electromagnet device (drive unit) 30 is not excited, and when the electromagnet device (drive unit) 30 is excited, the contact 61d. 62d are separated from each other.

一方、その他の接点機構６０は、常開接点となるようにしている。すなわち、常開接点としての接点機構６０は、電磁石装置（駆動部）３０が無励磁の状態では、接点６１ｄ，６２ｄが離間しており、電磁石装置（駆動部）３０を励磁させると、接点６１ｄ，６２ｄが接触するようになっている。   On the other hand, the other contact mechanisms 60 are normally open contacts. That is, when the electromagnet device (drive unit) 30 is not excited, the contact mechanism 60 as a normally open contact is separated from the contacts 61d and 62d. 62d are in contact with each other.

このように、本実施形態では、図４において、電磁石装置（駆動部）３０から右側にかけて、常閉接点としての接点機構６０、常閉接点としての接点機構６０、常開接点としての接点機構６０の順に配置されている。そして、図４において、電磁石装置（駆動部）３０から左側にかけて、常開接点としての接点機構６０が３つ配置されている。   Thus, in the present embodiment, in FIG. 4, from the electromagnet device (drive unit) 30 to the right side, the contact mechanism 60 as a normally closed contact, the contact mechanism 60 as a normally closed contact, and the contact mechanism 60 as a normally open contact. Are arranged in the order. In FIG. 4, three contact mechanisms 60 as normally open contacts are arranged from the electromagnet device (drive unit) 30 to the left side.

このように、電磁リレー１を多極型の電磁リレーとすることで、１つの電磁リレーを、多様な回路に対応させることができ、信号制御用電磁リレーや高電流制御用電磁リレー等様々な用途に応じた電磁リレーとして使用することが可能となる。   Thus, by making the electromagnetic relay 1 a multi-pole type electromagnetic relay, one electromagnetic relay can be made compatible with various circuits, such as a signal control electromagnetic relay and a high current control electromagnetic relay. It can be used as an electromagnetic relay according to the application.

カード５０は、ボディ４０の長手方向に延在する本体部５１を備えている。この本体部５１は、中央部が薄く両端部が厚くなるように形成されており、中央部の厚さが薄い部位に、可動ブロック３２に取り付けられる係止突起５２が形成されている。そして、本体部５１の両端部の厚さが厚い部位には、ボディ４０の短手方向に延在し、可動接点部６１の板ばね（可動ばね）６１ａを挟持する挟持片５３が形成されている。   The card 50 includes a main body 51 that extends in the longitudinal direction of the body 40. The main body 51 is formed so that the central portion is thin and both end portions are thick, and a locking projection 52 to be attached to the movable block 32 is formed at a portion where the central portion is thin. And the pinching piece 53 which extends in the transversal direction of the body 40 and clamps the leaf spring (movable spring) 61a of the movable contact portion 61 is formed in the portion where the both end portions of the main body 51 are thick. Yes.

このように、本実施形態では、カード５０は、図９に示すように、正面視で櫛歯状に形成されており、複数の板ばね（可動ばね）６１ａを挟持できるようになっている。なお、それぞれの挟持片５３には突部５３ａが形成されており、当該突部５３ａによって板ばね（可動ばね）６１ａを挟持している。   Thus, in this embodiment, as shown in FIG. 9, the card 50 is formed in a comb shape when viewed from the front, and can hold a plurality of leaf springs (movable springs) 61a. Each of the holding pieces 53 is formed with a protrusion 53a, and a plate spring (movable spring) 61a is held by the protrusion 53a.

ここで、本実施形態では、カード（移動体）５０に、接点（可動接点）６１ｄと接点（固定接点）６２ｄとが溶着した際に、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを引き剥がす引き剥がし機構７０を設けている。   Here, in this embodiment, when the contact (movable contact) 61d and the contact (fixed contact) 62d are welded to the card (moving body) 50, the contact (movable contact) 61d and the contact (fixed contact) 62d A peeling mechanism 70 is provided to peel off.

すなわち、カード（移動体）５０と板ばね（可動ばね）６１ａのうち少なくともいずれか一方に引き剥がし機構７０を設けている。   That is, a peeling mechanism 70 is provided on at least one of the card (moving body) 50 and the leaf spring (movable spring) 61a.

具体的には、カード（移動体）５０に、引き剥がし機構７０としての突出部５４を設けている。そして、この突出部５４が、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを離隔させる際に、板ばね（可動ばね）６１ａのカード（移動体）５０による力点Ｆと接点（可動接点）６１ｄとの間に当接するようにしている。すなわち、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを離隔させる際に、突出部５４が力点Ｆと接点（可動接点）６１ｄとの間に当接して板ばね６１ａを接点（可動接点）６１ｄが接点（固定接点）６２ｄから離隔する方向に押圧するようにしている。   Specifically, the card (moving body) 50 is provided with a protruding portion 54 as a peeling mechanism 70. When the protrusion 54 separates the contact (movable contact) 61d and the contact (fixed contact) 62d, the force point F and the contact (movable contact) by the card (moving body) 50 of the leaf spring (movable spring) 61a are separated. ) 61d. That is, when the contact (movable contact) 61d and the contact (fixed contact) 62d are separated from each other, the projecting portion 54 comes into contact between the force point F and the contact (movable contact) 61d so that the leaf spring 61a is contacted (movable contact). ) 61d is pressed away from the contact (fixed contact) 62d.

本実施形態では、板ばね（可動ばね）６１ａの接点（当該板ばね６１ａに設けられた可動接点６１ｄと接触する固定接点）６２ｄ側の挟持片５３を当該接点６２ｄに向けて延設することで、カード（移動体）５０に突出部５４を設けている。   In the present embodiment, the holding piece 53 on the side of the contact point (fixed contact point that contacts the movable contact point 61d provided on the leaf spring 61a) 62d of the leaf spring (movable spring) 61a extends toward the contact point 62d. The card (moving body) 50 is provided with a protruding portion 54.

かかる構成の電磁リレー本体部１０は、例えば、以下のようにして形成される。   The electromagnetic relay main body 10 having such a configuration is formed as follows, for example.

まず、ボディ４０の長手方向両側（電磁石装置３０の両端側）に、複数（本実施形態では、３つずつ）の接点機構６０を組み付ける。このとき、自由状態における板ばね（可動ばね）６１ａがボディ４０の短手方向と交差する方向に斜めに配置されるように接点機構６０を組み付ける。すなわち、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを接触させた状態において、板ばね（可動ばね）６１ａが接点（固定接点）６２ｄから離隔する方向に付勢されるようにする。なお、板ばね６１ａに設けられた可動接点６１ｄと接触する固定接点６２ｄの反対側の挟持片５３には切り欠き５３ｂが設けられている。この切り欠き５３ｂは、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを離隔させる際に、挟持片５３が板ばね（可動ばね）６１ａと干渉しないようにするために設けたものである。   First, a plurality (three in this embodiment) of contact mechanisms 60 are assembled on both sides in the longitudinal direction of the body 40 (both ends of the electromagnet device 30). At this time, the contact mechanism 60 is assembled so that the leaf spring (movable spring) 61a in the free state is disposed obliquely in a direction intersecting the short direction of the body 40. That is, in a state where the contact (movable contact) 61d and the contact (fixed contact) 62d are in contact with each other, the leaf spring (movable spring) 61a is urged away from the contact (fixed contact) 62d. In addition, the notch 53b is provided in the clamping piece 53 on the opposite side of the fixed contact 62d which contacts the movable contact 61d provided in the leaf spring 61a. The notch 53b is provided to prevent the clamping piece 53 from interfering with the leaf spring (movable spring) 61a when the contact (movable contact) 61d and the contact (fixed contact) 62d are separated from each other. .

そして、電磁石装置３０の可動ブロック３２以外の部品（鉄心３１等）をボディ４０の長手方向中央部に組み付ける。なお、接点機構６０の組み付けと鉄心３１等の組み付けは、いずれを先に行ってもよいし、同時に行ってもよい。   Then, components (such as the iron core 31) other than the movable block 32 of the electromagnet device 30 are assembled to the central portion in the longitudinal direction of the body 40. Either the contact mechanism 60 and the iron core 31 or the like may be assembled first or simultaneously.

そして、各接点機構６０の板ばね（可動ばね）６１ａをカード（移動体）５０で挟持し、可動ブロック３２をカード（移動体）５０の係止突起５２に取り付けることで、電磁リレー本体部１０が形成される。   Then, the leaf spring (movable spring) 61a of each contact mechanism 60 is sandwiched by the card (moving body) 50, and the movable block 32 is attached to the locking projection 52 of the card (moving body) 50, whereby the electromagnetic relay main body 10. Is formed.

次に、電磁リレー１の動作を図３〜図６に基づき説明する。   Next, the operation of the electromagnetic relay 1 will be described with reference to FIGS.

まず、電磁石装置（駆動部）３０が無励磁の状態では、図３、図４および図６に示すように、常閉接点としての接点機構６０が閉じた状態（接点６１ｄ，６２ｄが接触した状態）となっている。一方、常開接点としての接点機構６０は、開いた状態（接点６１ｄ，６２ｄが離隔した状態）となっている。   First, when the electromagnet device (driving unit) 30 is in a non-excited state, as shown in FIGS. 3, 4 and 6, the contact mechanism 60 as a normally closed contact is closed (contacts 61d and 62d are in contact). ). On the other hand, the contact mechanism 60 as a normally open contact is in an open state (a state where the contacts 61d and 62d are separated).

そして、電磁石装置（駆動部）３０を励磁させると、可動ブロック３２が、図４において反時計回りに回動する。そして、可動ブロック３２の回動に伴い、可動ブロック３２に取り付けられたカード５０がボディ４０の長手方向右側に移動する。その結果、カード５０に挟持された板ばね（可動ばね）６１ａがボディ４０の長手方向右側に移動し、常閉接点としての接点機構６０が開いた状態（接点６１ｄ，６２ｄが離隔した状態）となる。一方、常開接点としての接点機構６０は、閉じた状態（接点６１ｄ，６２ｄが接触した状態）となる。   When the electromagnet device (driving unit) 30 is excited, the movable block 32 rotates counterclockwise in FIG. Then, as the movable block 32 rotates, the card 50 attached to the movable block 32 moves to the right in the longitudinal direction of the body 40. As a result, the leaf spring (movable spring) 61a sandwiched between the cards 50 moves to the right in the longitudinal direction of the body 40, and the contact mechanism 60 as a normally closed contact is opened (the contacts 61d and 62d are separated). Become. On the other hand, the contact mechanism 60 as a normally open contact is in a closed state (a state in which the contacts 61d and 62d are in contact).

そして、電磁石装置（駆動部）３０の励磁を解除すると、可動ブロック３２が、図４において時計回りに回動し、可動ブロック３２の回動に伴い、可動ブロック３２に取り付けられたカード５０がボディ４０の長手方向右側に移動する。その結果、カード５０に挟持された板ばね（可動ばね）６１ａがボディ４０の長手方向右側に移動し、常閉接点としての接点機構６０が閉じた状態（接点６１ｄ，６２ｄが接触した状態）となる。一方、常開接点としての接点機構６０は、開いた状態（接点６１ｄ，６２ｄが離隔した状態）となる。このとき、通常の状態（接点６１ｄと接点６２ｄとが溶着していない状態）では、板ばね（可動ばね）６１ａは、図１１（ａ）から図１１（ｂ）のように移動する。すなわち、接点６１ｄと接点６２ｄとが溶着していない場合には、突出部５４が板ばね（可動ばね）６１ａに干渉することなく、当該板ばね（可動ばね）６１ａ自身の復元力により、接点６１ｄ，６２ｄを離隔させることとなる。   When the excitation of the electromagnet device (drive unit) 30 is released, the movable block 32 rotates clockwise in FIG. 4, and the card 50 attached to the movable block 32 moves to the body as the movable block 32 rotates. 40 moves to the right in the longitudinal direction. As a result, the leaf spring (movable spring) 61a sandwiched between the cards 50 moves to the right in the longitudinal direction of the body 40, and the contact mechanism 60 as a normally closed contact is closed (contacts 61d and 62d are in contact). Become. On the other hand, the contact mechanism 60 as a normally open contact is in an open state (a state where the contacts 61d and 62d are separated). At this time, in a normal state (a state where the contact point 61d and the contact point 62d are not welded), the leaf spring (movable spring) 61a moves from FIG. 11 (a) to FIG. 11 (b). That is, when the contact 61d and the contact 62d are not welded, the protrusion 54 does not interfere with the leaf spring (movable spring) 61a, and the contact force 61d is caused by the restoring force of the leaf spring (movable spring) 61a itself. , 62d are separated from each other.

ところで、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを接触させた状態で電流を流すと接点（可動接点）６１ｄと接点（固定接点）６２ｄとが溶着する場合がある。そして、板ばね（可動ばね）６１ａは可撓性を有している。そのため、引き剥がし機構が設けられていないカード１００を用いた場合には、板ばね（可動ばね）６１ａが図１２（ａ）に示す状態から図１２（ｂ）に示す状態となるように動作するおそれがある。具体的には、カード１００を用いると、接点６１ｄ，６２ｄ同士が溶着した状態で、接点６１ｄと接点６２ｄとが離隔するようにカード１００を移動させた際に、板ばね６１ａが撓んでしまう。そして、板ばね６１ａが撓むと、接点６１ｄ，６２ｄの溶着部分に十分な力が加わらず、接点６１ｄと接点６２ｄとを離隔させることができなくなるおそれがある。   By the way, when a current is passed in a state where the contact (movable contact) 61d and the contact (fixed contact) 62d are in contact, the contact (movable contact) 61d and the contact (fixed contact) 62d may be welded. The leaf spring (movable spring) 61a has flexibility. Therefore, when the card 100 without the peeling mechanism is used, the leaf spring (movable spring) 61a operates from the state shown in FIG. 12A to the state shown in FIG. 12B. There is a fear. Specifically, when the card 100 is used, the leaf spring 61a bends when the card 100 is moved so that the contacts 61d and 62d are separated from each other while the contacts 61d and 62d are welded to each other. And if the leaf | plate spring 61a bends, sufficient force may not be applied to the welding part of the contacts 61d and 62d, and there exists a possibility that the contact 61d and the contact 62d cannot be separated.

このように、カード１００を用いた場合には、常開接点と常閉接点の両方が閉じた状態となり、回路が誤動作してしまうおそれがある。   As described above, when the card 100 is used, both the normally open contact and the normally closed contact are closed, and the circuit may malfunction.

しかしながら、本実施形態では、カード（移動体）５０に引き剥がし機構７０としての突出部５４を設けている。そして、この突出部５４が、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを離隔させる際に、板ばね（可動ばね）６１ａのカード（移動体）５０による力点Ｆと接点（可動接点）６１ｄとの間に当接するようにしている。そのため、接点６１ｄ，６２ｄ同士が溶着した状態で、接点６１ｄと接点６２ｄとが離隔するようにカード５０を移動させると、移動の途中で突出部５４が撓んだ板ばね（可動ばね）６１ａに当接することとなる。そして、カード５０の移動に伴い、突出部５４が力点Ｆと接点（可動接点）６１ｄとの間に当接して板ばね６１ａを接点（可動接点）６１ｄが接点（固定接点）６２ｄから離隔する方向に押圧する（図１１（ｃ）参照）。その結果、接点６１ｄ，６２ｄの溶着部分に加わる力（接点６１ｄ，６２ｄ同士を引き離す力）をより大きくすることができ、互いに溶着した接点６１ｄ，６２ｄ同士を離隔させることが可能となる。   However, in the present embodiment, the card (moving body) 50 is provided with a protruding portion 54 as the peeling mechanism 70. When the protrusion 54 separates the contact (movable contact) 61d and the contact (fixed contact) 62d, the force point F and the contact (movable contact) by the card (moving body) 50 of the leaf spring (movable spring) 61a are separated. ) 61d. Therefore, when the card 50 is moved so that the contacts 61d and 62d are separated from each other in a state where the contacts 61d and 62d are welded to each other, a plate spring (movable spring) 61a in which the projecting portion 54 is bent in the middle of the movement is obtained. It will abut. As the card 50 moves, the protruding portion 54 abuts between the force point F and the contact (movable contact) 61d, and the leaf spring 61a moves away from the contact (movable contact) 61d from the contact (fixed contact) 62d. (See FIG. 11C). As a result, the force applied to the welded portions of the contacts 61d and 62d (force that separates the contacts 61d and 62d) can be increased, and the contacts 61d and 62d that are welded to each other can be separated from each other.

以上、説明したように、本実施形態では、カード（移動体）５０に、接点（可動接点）６１ｄと接点（固定接点）６２ｄとが溶着した際に、接点（可動接点）６１ｄと接点（固定接点）６２ｄとを引き剥がす引き剥がし機構７０としての突出部５４を設けている。その結果、突出部５４によって互いに溶着した接点（可動接点）６１ｄと接点（固定接点）６２ｄとを引き剥がすことが可能となり、より確実に接点（可動接点）６１ｄと接点（固定接点）６２ｄとを離隔させることができる。   As described above, in the present embodiment, when the contact (movable contact) 61d and the contact (fixed contact) 62d are welded to the card (moving body) 50, the contact (movable contact) 61d and the contact (fixed) are fixed. The protrusion 54 as the peeling mechanism 70 which peels off the contact 62d is provided. As a result, the contact (movable contact) 61d and the contact (fixed contact) 62d welded to each other by the protrusion 54 can be peeled off, and the contact (movable contact) 61d and the contact (fixed contact) 62d can be more reliably connected. Can be separated.

また、本実施形態では、カード（移動体）５０の挟持片５３を突出させることで引き剥がし機構７０としての突出部５４を設けている。そのため、構成の簡素化を図りつつより確実に接点（可動接点）６１ｄと接点（固定接点）６２ｄとを離隔させることができる電磁リレー１を得ることができる。   Further, in the present embodiment, the protruding portion 54 as the peeling mechanism 70 is provided by causing the holding piece 53 of the card (moving body) 50 to protrude. Therefore, it is possible to obtain the electromagnetic relay 1 that can more reliably separate the contact (movable contact) 61d and the contact (fixed contact) 62d while simplifying the configuration.

（第２実施形態）
本実施形態にかかる電磁リレー１は、基本的に上記第１実施形態にかかる電磁リレー１と同様の構成をしており、本実施形態にかかる電磁リレー１も、電磁リレー本体部１０の上方からケース２０を被せ、当該ケース２０をボディ４０に接着固定することで略箱型に形成されている。 (Second Embodiment)
The electromagnetic relay 1 according to the present embodiment basically has the same configuration as the electromagnetic relay 1 according to the first embodiment, and the electromagnetic relay 1 according to the present embodiment is also viewed from above the electromagnetic relay main body 10. The case 20 is covered and the case 20 is adhered and fixed to the body 40 to form a substantially box shape.

そして、カード（移動体）５０には、引き剥がし機構７０としての突出部５４が設けられている。   The card (moving body) 50 is provided with a protruding portion 54 as a peeling mechanism 70.

ここで、本実施形態の電磁リレー本体部１０が上記第１実施形態と主に異なる点は、引き剥がし機構７０が、板ばね（可動ばね）６１ａのカード（移動体）５０による力点Ｆと接点（可動接点）６１ｄとの間に形成された凸部６１ｅを有することにある。   Here, the electromagnetic relay main body 10 of the present embodiment is mainly different from the first embodiment in that the peeling mechanism 70 is in contact with the force point F by the card (moving body) 50 of the leaf spring (movable spring) 61a and the contact point. (Movable contact) It has a convex part 61e formed between 61d.

本実施形態では、板ばね（可動ばね）６１ａは板状をしており、凸部６１ｅは、可動接点部６１の長手方向（ボディ４０の短手方向）に細長い四角錐台状に形成されている。   In the present embodiment, the leaf spring (movable spring) 61a has a plate shape, and the convex portion 61e is formed in a rectangular pyramid shape elongated in the longitudinal direction of the movable contact portion 61 (short direction of the body 40). Yes.

さらに、本実施形態では、板ばね（可動ばね）６１ａを一面側（当該板ばね６１ａに設けられた可動接点６１ｄと接触する固定接点６２ｄの反対側）から他面側（固定接点６２ｄ側）に向けて押し出すことで凸部６１ｅを形成している。   Furthermore, in the present embodiment, the leaf spring (movable spring) 61a is moved from one surface side (the opposite side of the fixed contact 62d that contacts the movable contact 61d provided on the leaf spring 61a) to the other surface side (the fixed contact 62d side). The convex part 61e is formed by pushing out.

そして、凸部６１ｅのカード（移動体）５０と当接する部位には、平坦面６１ｆが形成されている。   And the flat surface 61f is formed in the site | part which contact | abuts the card | curd (moving body) 50 of the convex part 61e.

以上の本実施形態によっても、上記第１実施形態と同様の作用、効果を奏することができる。   Also according to this embodiment described above, the same operations and effects as those of the first embodiment can be achieved.

また、本実施形態によれば、引き剥がし機構７０が、板ばね（可動ばね）６１ａのカード（移動体）５０による力点Ｆと接点（可動接点）６１ｄとの間に形成された凸部６１ｅを有している。そのため、接点（可動接点）６１ｄと接点（固定接点）６２ｄとが溶着した状態でカード（移動体）５０を移動させた際に、板ばね（可動ばね）６１ａが撓むのを抑制することができる。その結果、接点６１ｄ，６２ｄの溶着部分に加わる力をより大きくすることができ、互いに溶着した接点（可動接点）６１ｄと接点（固定接点）６２ｄとをより確実に引き剥がすことが可能となる。   Further, according to the present embodiment, the peeling mechanism 70 has the convex portion 61e formed between the force point F by the card (moving body) 50 of the leaf spring (movable spring) 61a and the contact (movable contact) 61d. Have. Therefore, when the card (moving body) 50 is moved in a state in which the contact (movable contact) 61d and the contact (fixed contact) 62d are welded, the leaf spring (movable spring) 61a is prevented from being bent. it can. As a result, the force applied to the welded portions of the contacts 61d and 62d can be increased, and the welded contact (movable contact) 61d and the contact (fixed contact) 62d can be more reliably peeled off.

なお、通常の状態（接点６１ｄと接点６２ｄとが溶着していない状態）では、板ばね（可動ばね）６１ａは、上記第１実施形態と同様に、図１１（ａ）から図１１（ｂ）のように移動する。   In a normal state (a state in which the contact 61d and the contact 62d are not welded), the leaf spring (movable spring) 61a is similar to that in the first embodiment described above with reference to FIGS. 11 (a) to 11 (b). Move like.

また、本実施形態によれば、板ばね（可動ばね）６１ａを一面側（当該板ばね６１ａに設けられた可動接点６１ｄと接触する固定接点６２ｄの反対側）から他面側（固定接点６２ｄ側）に向けて押し出すことで凸部６１ｅを形成している。そのため、凸部６１ｅを曲げにより形成した場合に比べて、高さ精度を安定して得やすくなり、動作特性を安定させることができる。また、微溶着時にカードと接触した場合の摩擦、摩耗が少なくなるという利点もある。また、接着によって形成した場合に比べて組立工程が少ないため、コスト削減を図ることができる。また、接着によって形成した場合のように、凸部６１ｅが滑落してしまうのを抑制することができる。   Further, according to the present embodiment, the leaf spring (movable spring) 61a is moved from the one surface side (the opposite side of the fixed contact 62d that contacts the movable contact 61d provided on the leaf spring 61a) to the other surface side (the fixed contact 62d side). The convex portion 61e is formed by extruding the head toward the head. Therefore, compared to the case where the convex portion 61e is formed by bending, it becomes easier to stably obtain the height accuracy, and the operation characteristics can be stabilized. Further, there is an advantage that friction and wear when contacting with the card at the time of fine welding are reduced. In addition, since there are fewer assembly steps than when formed by bonding, cost reduction can be achieved. Moreover, it can suppress that the convex part 61e slips down like the case where it forms by adhesion | attachment.

また、本実施形態によれば、凸部６１ｅのカード（移動体）５０と当接する部位に、平坦面６１ｆを形成している。そのため、ひねりなどの３次元的なばね変形に対しても、ばねの撓みが発生しにくく、互いに溶着した接点（可動接点）６１ｄと接点（固定接点）６２ｄとをより確実に引き剥がすことが可能となる。   Moreover, according to this embodiment, the flat surface 61f is formed in the site | part which contact | abuts the card | curd (moving body) 50 of the convex part 61e. Therefore, even for three-dimensional spring deformation such as twisting, the spring is less likely to be bent, and the contact (movable contact) 61d and the contact (fixed contact) 62d welded to each other can be more reliably peeled off. It becomes.

ところで、本実施形態では、凸部として、板ばね（可動ばね）６１ａを一面側から他面側に向けて押し出すことで形成した四角錐台状の凸部６１ｅを例示したが、凸部の形状は、これに限らず様々な形状とすることができる。   By the way, in this embodiment, although the square-pyramidal convex part 61e formed by pushing out the leaf | plate spring (movable spring) 61a toward the other side from the one surface side was illustrated as a convex part, the shape of a convex part is illustrated. However, the shape is not limited to this, and can be various shapes.

例えば、図１４に示すように、板ばね（可動ばね）６１ａを一面側から他面側に向けて押し出すことで形成した半円柱状の凸部６１ｅとしてもよい。   For example, as shown in FIG. 14, it is good also as the semi-cylindrical convex part 61e formed by pushing out the leaf | plate spring (movable spring) 61a toward the other surface side from the one surface side.

また、図１５に示すように、板ばね（可動ばね）６１ａを一面側から他面側に向けて押し出すことで形成した三角錐状の凸部６１ｅとしてもよい。   Moreover, as shown in FIG. 15, it is good also as the triangular pyramid-shaped convex part 61e formed by pushing out the leaf | plate spring (movable spring) 61a toward the other surface side from the one surface side.

また、図１６に示すように、板ばね（可動ばね）６１ａを一面側から他面側に向けて押し出すことで複数（図１６では２つ）の凸部６１ｅを形成してもよい。   Further, as shown in FIG. 16, a plurality (two in FIG. 16) of convex portions 61e may be formed by extruding a leaf spring (movable spring) 61a from one surface side toward the other surface side.

また、図１７に示すように、板ばね（可動ばね）６１ａの他面側に、別部材の四角錐台状の部材を接着することで、凸部６１ｅを形成してもよい。なお、別部材の形状や個数は、適宜設定することが可能である。   Moreover, as shown in FIG. 17, you may form the convex part 61e by adhere | attaching the member of the shape of another truncated pyramid on the other surface side of the leaf | plate spring (movable spring) 61a. It should be noted that the shape and number of separate members can be set as appropriate.

このような凸部６１ｅを形成しても、上記第２実施形態とほぼ同様の作用、効果を奏することができる。   Even when such a convex portion 61e is formed, substantially the same operations and effects as in the second embodiment can be obtained.

以上、本発明の好適な実施形態について説明したが、本発明は上記実施形態には限定されず、種々の変形が可能である。   The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments, and various modifications can be made.

例えば、上記各実施形態では、複数の接点機構を駆動部の両側に並設したものを例示したが、駆動部の一側に複数の接点機構を並設させてもよい。   For example, in each of the above embodiments, a plurality of contact mechanisms are arranged side by side on both sides of the drive unit. However, a plurality of contact mechanisms may be arranged on one side of the drive unit.

また、上記第１実施形態では、カードに引き剥がし機構としての突出部を設けたものを例示し、上記第２実施形態では、カードに引き剥がし機構としての突出部を設けるとともに、板ばねに引き剥がし機構としての凸部を形成したものを例示している。しかしながら、カードに引き剥がし機構としての突出部を設けず、板ばねに引き剥がし機構としての凸部を形成するようにしてもよい。   In the first embodiment, the card is provided with a protruding portion as a peeling mechanism. In the second embodiment, the card is provided with a protruding portion as a peeling mechanism, and the leaf spring is pulled. The thing which formed the convex part as a peeling mechanism is illustrated. However, a protrusion as a peeling mechanism may not be provided on the card, and a convex portion as a peeling mechanism may be formed on the leaf spring.

また、可動ばねや接点、その他細部のスペック（形状、大きさ、レイアウト等）も適宜に変更可能である。   In addition, movable springs, contacts, and other detailed specifications (shape, size, layout, etc.) can be changed as appropriate.

１ 電磁リレー
１０ 電磁リレー本体部
２０ ケース
２１ 隔壁
３０ 電磁石装置（駆動部）
４０ ボディ
５０ カード（移動体）
５４ 突出部（離隔機構）
６１ａ 板ばね（可動ばね）
６１ｄ 接点（可動接点）
６１ｅ 凸部
６１ｆ 平坦面
６２ｄ 接点（固定接点） DESCRIPTION OF SYMBOLS 1 Electromagnetic relay 10 Electromagnetic relay main-body part 20 Case 21 Bulkhead 30 Electromagnet apparatus (drive part)
40 body 50 card (moving body)
54 Projection (separation mechanism)
61a Leaf spring (movable spring)
61d Contact (movable contact)
61e Convex part 61f Flat surface 62d Contact (fixed contact)

Claims (5)

駆動部と、当該駆動部を駆動させることで移動する移動体と、前記移動体に取り付けられた可動ばねと、前記可動ばねに固着された可動接点と、前記可動接点に対向して配置された固定接点と、を備える電磁リレーであって、
前記移動体と前記可動ばねのうち少なくともいずれか一方に、前記可動接点と前記固定接点とが溶着した際に、前記可動接点と前記固定接点とを引き剥がす引き剥がし機構を設け、
前記引き剥がし機構は、前記可動接点と前記固定接点とを引き剥がす際に、前記可動ばねの前記移動体による力点と前記可動接点との間に当接して当該可動ばねを前記可動接点が前記固定接点から離隔する方向に押圧することを特徴とする電磁リレー。 A drive unit, a movable body that moves by driving the drive unit, a movable spring attached to the movable body, a movable contact fixed to the movable spring, and the movable contact are disposed opposite to the movable contact. An electromagnetic relay comprising a fixed contact,
When the movable contact and the fixed contact are welded to at least one of the movable body and the movable spring, a peeling mechanism is provided for peeling the movable contact and the fixed contact ;
The peeling mechanism abuts between the movable contact point of the movable spring and the movable contact when the movable contact and the fixed contact are separated, and the movable contact is fixed by the movable contact. An electromagnetic relay characterized by pressing in a direction away from the contact . 前記引き剥がし機構は、前記移動体に設けられた突出部を有することを特徴とする請求項１に記載の電磁リレー。 The peeling mechanism is an electromagnetic relay according to claim 1, characterized in Rukoto which having a protruding portion provided in the movable body. 前記引き剥がし機構は、前記可動ばねの前記移動体による力点と前記可動接点との間に形成された凸部を有することを特徴とする請求項１または請求項２に記載の電磁リレー。   The electromagnetic relay according to claim 1, wherein the peeling mechanism has a convex portion formed between a force point of the movable spring by the moving body and the movable contact. 前記可動ばねは板状をしており、前記凸部は、当該可動ばねを一面側から他面側に向けて押し出すことで形成されることを特徴とする請求項３に記載の電磁リレー。   The electromagnetic relay according to claim 3, wherein the movable spring has a plate shape, and the convex portion is formed by pushing the movable spring from one surface side to the other surface side. 前記凸部は、前記移動体と当接する部位が平坦面であることを特徴とする請求項３または請求項４に記載の電磁リレー。   5. The electromagnetic relay according to claim 3, wherein the convex portion has a flat surface at a portion in contact with the moving body.
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DE10101751C1 (en) * 2001-01-16 2002-11-14 Matsushita Electric Works Europe Ag Contact system for electromagnetic relays
JP2004139750A (en) * 2002-10-15 2004-05-13 Fujitsu Component Ltd Electromagnetic relay
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