JP5707277B2 - headphone - Google Patents

Description

  The present invention relates to a headphone that is used by being applied to the temporal region so as to cover an ear, and more specifically, relates to a headphone that has a large-diameter headphone unit but is downsized.

  When classified according to the wearing method, the headphones include a headband type, an ear-hanging type, an inner-ear type, and the like. A cross section of a headphone 1B as a first conventional example used by being applied is shown, and the configuration thereof will be described.

  A headphone 1B shown in FIG. 4 includes a headphone unit 10, a baffle plate 20, an ear pad 30, and a headphone housing 40 as a basic configuration.

  Usually, an electrodynamic (dynamic) electroacoustic transducer is used for the headphone unit 10, but an electrostatic (capacitor) electroacoustic transducer may be used.

  The baffle plate 20 is formed of a disk body having sound insulation properties and is attached around the headphone unit 10. In other words, the headphone unit 10 is mounted in an opening formed in the center of the baffle plate 20.

  The ear pad 30 is a pad member that comes into contact with the temporal region HS of the human body so as to cover the ear E. The ear pad 30 has a donut shape in which an elastic body 31 such as a sponge material is wrapped with an outer skin 32 having a good touch feeling. 20 is mounted on one surface 20a side.

  The headphone housing 40 is provided on the other surface 20 b side of the baffle plate 20 so as to form a predetermined volume of air chamber (rear air chamber A <b> 2) on the back side of the headphone unit 10. Usually, the headphone housing 40 is supported on the end of a headband (both not shown) via a universal joint-shaped hanger member.

  By the way, when listening to the sound with headphones attached to the left and right ears, the sound is localized in the middle of each headphone, that is, in the head. However, it is known that the sound is localized in the head and becomes stressed when this is continued for a long time.

  Acoustically connect the front air chamber (the space surrounded by the ear pad 30) A1 and the rear air chamber A2 of the diaphragm 11 in order to reduce this localization and improve sound quality and frequency response. Has been done.

  In acoustically connecting the front air chamber A1 and the rear air chamber A2, an acoustic passage (opening) 21 is formed in the baffle plate 20 as shown in FIG. A method of attaching the resistance material 22 is generally employed (see, for example, FIG. 4 of Patent Document 1).

  As for the headphone unit 10, a headphone with good sound quality is generally equipped with a large-diameter headphone unit, so that the headphone becomes inevitably large and portability is sacrificed.

  FIG. 5 shows a headphone as a second conventional example in which a large-diameter headphone unit is mounted on a small headphone in order to achieve both sound quality and portability. According to the headphone 1 </ b> C, the headphone housing 40 is designed to be small, so that the baffle plate 20 acoustic passage 21 is disposed in a portion overlapping the ear pad 30.

  In this case, as illustrated in FIG. 5, an inclination for preventing the acoustic passage 21 from being blocked is attached to the mounting surface 30 a side of the ear pad 30 with respect to the baffle plate 20.

  However, since the side pressure applied to the headphones depends on the shape of the user's head and varies from person to person, when the side pressure is large, the mounting surface 30a of the ear pad 30 comes into close contact with the baffle plate 20 and the acoustic path 21 May be blocked.

JP 2010-93482 A (FIG. 4)

  Accordingly, an object of the present invention is to provide a headphone in which an acoustic passage that acoustically connects the air chambers before and after the diaphragm is formed on the baffle plate in order to reduce the localization in the head. Even if it arrange | positions, it exists in preventing an acoustic path from being blocked by an ear pad.

  In order to solve the above-described problems, the present invention provides an electrodynamic headphone unit, a baffle plate attached around the headphone unit, and one side of the baffle plate that is applied to the side of the human body. An ear pad to be contacted, and a headphone housing provided on the other surface side of the baffle plate so as to surround the back side of the headphone unit, and at a position covered by the ear pad on the peripheral side of the baffle plate, In the headphone in which an acoustic passage that acoustically connects the air chambers before and after the diaphragm provided in the headphone unit is formed, one surface side of the baffle plate communicates with one end side of the acoustic passage, and the baffle It extends to a position that is not covered by the ear pad toward the inside in the radial direction of the plate, and is blocked by the ear pad. Is characterized by communication grooves having had depth are formed.

  According to a preferred aspect of the present invention, the acoustic passage may be arranged at a predetermined interval along the circumferential direction of the baffle plate, and the communication groove may be formed in all or a part of the acoustic passage.

  In the present invention, the communication groove is surrounded by the rib formed on one surface side of the baffle plate in addition to the groove formed by denting one surface side of the baffle plate. It may be a groove formed in the region.

  According to the present invention, in the headphone in which the acoustic passage for acoustically connecting the air chambers before and after the diaphragm included in the headphone unit is formed at a position covered by the ear pad on the peripheral side of the baffle plate, the ear pad of the baffle plate One side of the sound path is connected to one end side of the acoustic passage, extends to the inner side in the radial direction of the baffle plate to a position not covered by the ear pad, and has a depth not blocked by the ear pad. Since the groove is formed, a large-diameter headphone unit can be mounted in a small headphone housing, and the acoustic resistance of the acoustic passage does not change even if the side pressure changes due to individual differences between users. Headphones with good sound quality and frequency response are provided.

Sectional drawing shown in the state with which the headphone which concerns on embodiment of this invention was mounted | worn with the head. The (a) front view which shows the baffle board applied to the said headphones, (b) The AA sectional view taken on the line. The (a) front view which shows the modification of the communicating groove formed in the said baffle board, (b) The BB sectional drawing. Sectional drawing shown in the state with which the headphone which concerns on a 1st prior art example was mounted | worn on the head. Sectional drawing shown in the state with which the headphone which concerns on a 2nd prior art example was mounted | worn with the head.

  Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 3, but the present invention is not limited to this. In the description of this embodiment, the same reference numerals are assigned to components that may be considered the same as or the same as the components included in the conventional example described with reference to FIGS.

  First, referring to FIG. 1, the headphone 1A according to this embodiment also includes a headphone unit 10, a baffle plate 20, an ear pad 30, and a headphone housing 40 as a basic configuration.

  The headphone unit 10 in this embodiment is an electrodynamic type (dynamic type), and includes a diaphragm 11 and a magnetic circuit unit 12. The diaphragm 11 includes a center dome 111 and a sub dome 112 continuously provided around the center dome 111, and a voice coil 113 is integrally attached to the back side of the connected portion by an adhesive or the like.

  The magnetic circuit unit 12 includes a yoke 121 having a flat U-shaped cross section whose peripheral portion is bent at a substantially right angle as a surrounding wall, and a permanent magnet magnetized in the thickness direction in a disk shape disposed on the inner bottom surface of the yoke 121. 122 and a pole piece 123 that is disposed on the permanent magnet 122 and forms a magnetic gap having a predetermined width with the surrounding wall of the yoke 121.

  The magnetic circuit unit 12 is supported in an opening of a unit frame 13 having a disk shape and having an opening in the center, and the diaphragm 11 allows the voice coil 113 to vibrate within the magnetic gap of the magnetic circuit unit 12. The peripheral edge of the sub dome 112 is supported by the peripheral edge of the unit frame 13.

  The unit frame 13 is provided with a vent hole 131 that acoustically communicates with the rear air chamber A2 described later on the back side of the diaphragm 11, and the vent hole 131 is provided with an acoustic resistance material 132 made of a nonwoven fabric or the like. It has been.

  The baffle plate 20 is made of a sound insulating material disk having an opening at the center, and is attached around the unit frame 13 of the headphone unit 10. The baffle plate 20 acoustically partitions the front side and the rear side of the diaphragm 11.

  The ear pad 30 is a pad member that is in contact with the temporal region HS of the human body so as to cover the ear E. The ear pad 30 has a donut shape in which an elastic body 31 such as a sponge material is wrapped in a skin 32 having a good touch feeling. 11 is mounted on the one surface 20a side of the baffle plate 20 which is the sound emitting surface side.

  The headphone housing 40 is provided on the other surface 20 b side of the baffle plate 20 so as to form a predetermined volume of air chamber (rear air chamber A <b> 2) on the back side of the headphone unit 10. Usually, the headphone housing 40 is supported on the end of a headband (both not shown) via a universal joint-shaped hanger member. The headphone housing 40 may be either a non-hole sealed type or an open type having a sound leak hole.

  In order to reduce the localization in the head, also in this embodiment, an acoustic passage 21 having an acoustic resistance material 22 such as a non-woven fabric is provided in the peripheral portion of the baffle plate 20. The front air chamber (space surrounded by the ear pad 30) A1 and the rear air chamber A2 are acoustically connected. As shown in FIG. 2A, a plurality of acoustic passages 21 are provided at predetermined intervals along the circumferential direction of the baffle plate 20.

  In the headphone 1A, as in the second conventional example described with reference to FIG. 5, the headphone unit 10 uses a large-diameter unit with good sound quality in order to achieve both sound quality and portability. Since the baffle plate 20 is designed to be small (small diameter), the acoustic path 21 is disposed at a position covered with the ear pad 30. If the side pressure is applied when the headphones are worn, the acoustic path 21 is applied by the ear pad 30. 21 may be blocked.

  Therefore, in the present invention, even if the ear pad 30 is pressed against the baffle plate 20 by the side pressure applied to the headphones 1A, the acoustic passage 21 is not blocked by the ear pad 30 and always communicates with the front acoustic chamber A1.

  Therefore, in this embodiment, as shown in FIGS. 2A and 2B, a communication groove 23 is formed on the one surface 20a side of the baffle plate 20 from the acoustic passage 21 to the front air chamber A1. I have to.

  That is, the communication groove 23 communicates with one end side of the acoustic passage 21 and extends to a position not covered by the ear pad 30 toward the radially inner side of the baffle plate 20, that is, to the front air chamber A 1. It has a depth that is not blocked by.

  As shown in FIGS. 2A and 2B, the communication groove 23 is preferably provided for each acoustic passage 21, but may be provided in some acoustic passages 21. In FIG. 2B, reference numeral 20c is an opening into which the unit frame 13 of the headphone unit 10 is fitted.

  As another method, as shown in FIGS. 3A and 3B, the one side 20a of the baffle plate 20 is reached from the opening 20c side of the baffle plate 20 to one end side of the acoustic passage 21, A series of ribs 24 that U-turn around and return to the opening 20 c may be provided so as to project the inside of the region surrounded by the ribs 24. Also in this case, the depth of the communication groove 23 (the protruding height of the rib 24) is set to a depth that is not blocked by the ear pad 30.

  Thus, by forming the communication groove 23 from the acoustic passage 21 to the front air chamber A1 on the one surface 20a side of the baffle plate 20, the ear pad 30 is pressed against the baffle plate 20 by the side pressure applied to the headphones 1A. However, since the acoustic passage 21 is not blocked by the ear pad 30 and always communicates with the front acoustic chamber A1, the headphone unit 10 having a large diameter can be mounted in the small headphone housing 40.

  In addition, even if the lateral pressure changes due to individual differences among users, the acoustic resistance of the acoustic passage 21 does not change, so that headphones with consistent sound quality are provided to anyone.

DESCRIPTION OF SYMBOLS 1A Headphone 10 Headphone unit 11 Diaphragm 12 Magnetic circuit part 13 Unit frame 20 Baffle board 21 Acoustic path 22 Acoustic resistance material 23 Communication groove 24 Rib 30 Ear pad 40 Headphone housing A1 Front air chamber A2 Rear air chamber

Claims (3)

An electrodynamic headphone unit, a baffle plate attached around the headphone unit, an ear pad attached to one side of the baffle plate and in contact with a temporal region of the human body, and a rear surface of the headphone unit A headphone housing provided on the other surface side of the baffle plate so as to surround the side, and air chambers before and after the diaphragm included in the headphone unit at a position covered by the ear pad on the peripheral side of the baffle plate In a headphone in which an acoustic path for acoustically connecting is formed,
One surface side of the baffle plate communicates with one end of the acoustic path, extends radially inward of the baffle plate to a position not covered by the ear pad, and is blocked by the ear pad. A headphone characterized in that a communication groove having no depth is formed.   The acoustic path is arranged at a predetermined interval along a circumferential direction of the baffle plate, and the communication groove is formed in all or a part of the acoustic path. Headphones.   The headphone according to claim 1 or 2, wherein the communication groove is formed in a region surrounded by a rib projecting on one surface side of the baffle plate.

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