JP5703453B1 - Information processing device - Google Patents

Abstract

An information processing apparatus that is small in size and has a high degree of design freedom and high tamper resistance. A settlement processing apparatus as an information processing apparatus includes a first substrate, a second substrate provided opposite to the first substrate, a first substrate, and a second substrate. A frame member 9 that supports the first substrate 6 and the second substrate 7 on the inner surface side of the wall portion that surrounds the outer shape of the frame 7, and a secure surrounded by the first substrate 6, the second substrate 7, and the frame member 9 A tamper detection circuit 20 that is disposed inside the area S and detects that the block of the secure area S has been released. [Selection] Figure 4

Description

  The present invention relates to an information processing apparatus used for performing settlement or commercial transactions. In particular, the present invention relates to information processing apparatuses such as credit cards, debit cards, and electronic money.

  2. Description of the Related Art In recent years, due to remarkable technological development, payment processing devices used for performing payments or commercial transactions have been reduced in size and power consumption, and portable payment processing devices have been increasingly used. Despite the convenience of being portable, the chances of being accessed by anyone other than legitimate device users increases, and confidential information such as encryption keys and personal information stored in the payment processing device is stolen. The risk is increasing. Proposals have been made to protect information to be protected from fraud (see, for example, Patent Documents 1 and 2).

  Patent Document 1 discloses first and second circuit boards disposed in a state of being opposed to each other in the apparatus main body, electronic components disposed on opposing surfaces of the first and second circuit boards, An information processing apparatus including a shielding member that surrounds outer peripheral portions of the first and second circuit boards. In addition, a tamper detection means is provided, and when a hole is drilled in the shielding member on which the detection line is formed, the detection circuit works to prevent illegal actions by erasing the stored data in the memory. It is disclosed.

  In Patent Document 2, a memory is provided in a housing, and the length of the surface of the housing, which is wired so as to cover almost the entire surface of the housing at a sufficiently narrow interval with respect to the length or width of the housing surface, The data storage device includes an electric wire that is sufficiently thin with respect to the width, a detecting unit that detects disconnection of the electric wire, and a control unit that erases data stored in the memory when the disconnection of the electric wire is detected. It is disclosed that tampering such as destruction or opening of a housing is monitored and data is erased in response to the tampering.

JP2013-3979A JP 2008-33593 A

  The information processing apparatus of Patent Document 1 has poor workability because it is necessary to assemble the shielding members surrounding the outer peripheral portions of the first and second circuit boards from a plurality of separated states. Further, since the data storage device of Patent Document 2 has a structure in which the six sides of the main substrate are surrounded by a protective substrate, the volume of the secure area is large and it is difficult to reduce the size. Reducing the size of the secure part is one element useful for improving the security, but the above-described configurations described in Patent Literature 1 and Patent Literature 2 constitute a secure region. There is a problem that it is difficult to cope with further miniaturization of parts and improvement of workability for assembly.

  An object of the present invention is to provide an information processing apparatus that is small and has high tamper resistance, and that is excellent in assembly workability.

An information processing apparatus according to the present invention includes a first substrate, a second substrate provided to face the first substrate, and a wall surface portion that surrounds the outer shapes of the first substrate and the second substrate. A frame member that supports the first substrate and the second substrate on the inner surface side of the wall surface portion , and a secure region surrounded by the first substrate, the second substrate, and the frame member. A tamper detection circuit that is disposed and detects that the block of the secure area has been released;
A flexible substrate including a connection end surface between the outer side of the wall surface part and the inner surface side and a wiring pattern that covers the entire outer periphery of the wall surface part and is electrically connected to the tamper detection circuit;
One end of the flexible substrate on the long side is disposed between the inner surface of the wall surface and the outer end surface of the first substrate and inside the secure area,
The other end portion on the long side of the flexible substrate is disposed between the inner surface of the wall surface portion and the outer end surface of the second substrate and inside the secure area.
Is provided.

The information processing apparatus according to the present invention includes a first substrate, a second substrate provided to face the first substrate, and a wall surface portion that surrounds the outer shapes of the first substrate and the second substrate. A through-hole is defined inside the wall portion, and the first substrate and the second substrate are disposed in the through-hole, and the first member is disposed in the through-hole. A tamper detection circuit which is disposed in a secure region sandwiched between the substrate and the second substrate and detects that the block of the secure region has been released ; a connection end surface between the outside and the inside of the wall portion; and the wall surface A flexible substrate having a wiring pattern that covers the entire outer periphery of the portion and is electrically connected to the tamper detection circuit, wherein one end on the long side of the flexible substrate is connected to the inner surface of the wall surface and the first The outer edge of the board And the other end portion on the long side of the flexible substrate is disposed between the inner surface of the wall surface portion and the outer end surface of the second substrate and inside the secure region. .

With the above configuration, the secure area can be modularized without including any other non-secure area other than the secure area in the information processing apparatus, so that the optimum shape is not affected by the circuit arrangement of the non-secure area. And a circuit in the secure area is arranged. The modules constituting the secure area can be arranged in a location different from the substrate constituting the non-secure area inside the housing of the information processing apparatus. Therefore, the entire information processing apparatus can be designed to set the secure area at the optimum position. Furthermore, the present invention can provide an information processing apparatus that is small and has high tamper resistance while being excellent in assembly workability. That is, the present invention can make maximum use of the mounting surfaces of the first substrate and the second substrate. Nevertheless, even if a knife is inserted between the first board or the second board and the frame member to make an illegal contact with the internal electronic components, the wiring pattern of the flexible board is cut or short-circuited, The information to be protected stored in the part is made unreadable. Thus, safety can be improved against an attack that attempts to make unauthorized contact with an electronic component.

  As one aspect of the information processing apparatus of the present invention, for example, the outer shape in plan view of the first substrate and the second substrate is smaller than the outer shape in plan view of the frame member. With such a configuration, the mounting surfaces of the first substrate and the second substrate are utilized to the maximum in order to arrange the circuits in the secure area.

  As one aspect of the information processing apparatus of the present invention, for example, on the inner surface side of the wall surface portion, an elastic member mounting portion that is integrally formed with the wall surface portion and to which an elastic member is mounted is formed. Is constituted by a wall portion that secures a space in which the elastic member is mounted, and upper and lower surfaces of the wall portion support the first substrate and the second substrate. Such a simple structure improves the assemblability of the information processing apparatus.

  As one aspect of the information processing apparatus of the present invention, for example, a flexible substrate provided with a wiring pattern electrically connected to the tamper detection circuit is provided so as to cover at least the entire outer periphery of the wall surface portion. With such a configuration, it is possible to detect a physical fraud from the side of the module constituting the secure area, and to disable or erase information in the secure area.

  As one aspect of the information processing apparatus of the present invention, for example, a first tamper detection pattern provided on the first substrate and electrically connected to the tamper detection circuit, and provided on the second substrate, A second tamper detection pattern electrically connected to the tamper detection circuit, wherein the wiring pattern of the flexible substrate is independent of the first tamper detection pattern and the second tamper detection pattern. The tamper detection circuit is electrically connected. With such a configuration, even if some trouble occurs in the tamper detection pattern for detecting that the first board or the second board is removed from the frame member, the tamper detection pattern is secured without being affected by the trouble. It is possible to detect physical fraud from the side of the modules that make up the region. Therefore, information stored in a memory or the like in the secure area cannot be read or erased.

  As one aspect of the information processing apparatus of the present invention, for example, an electronic component as a protection target that is mounted on a surface facing the other substrate on the first substrate or the second substrate and stores information to be protected is stored. Further prepare. Such a configuration makes it impossible to read or erase information in the secure area.

  The information processing apparatus obtained by the present invention forms a secure area in which electronic components storing protection information are formed by the first substrate, the second substrate, and the frame member, and can be downsized with a simple structure. It has a simple structure. The modules constituting the secure area can be arranged in a location different from the substrate constituting the non-secure area inside the housing of the information processing apparatus. Therefore, the entire information processing apparatus can be designed to set the secure area at the optimum position.

The front view which shows an example of the payment processing apparatus as an information processing apparatus which concerns on this invention. The disassembled perspective view which shows an example of the payment processing apparatus which concerns on this invention. The disassembled perspective view which shows an example of the operation part of the payment processing apparatus which concerns on this invention. The disassembled perspective view which shows an example of the secure area | region of the payment processing apparatus which concerns on this invention. (A) AA sectional drawing of FIG. 4, (b) BB sectional drawing of FIG. The schematic diagram which shows an example of 1st Embodiment of the secure area | region of the payment processing apparatus which concerns on this invention. The wiring diagram explaining the electrical connection of the wiring pattern of 1st Embodiment. The schematic diagram which shows an example of 2nd Embodiment of the secure area | region of the payment processing apparatus which concerns on this invention. The wiring diagram explaining the electrical connection of the wiring pattern of 2nd Embodiment. 5 shows another embodiment of FIG. 5, (a) AA sectional view of another embodiment based on FIG. 4, (b) BB sectional view of another embodiment based on FIG. 4. The block diagram which shows an example of a structure of the payment processing apparatus which concerns on this invention.

  Hereinafter, a preferred embodiment of a settlement processing apparatus as an information processing apparatus according to the present invention will be described in detail with reference to FIGS.

  The appearance of the settlement processing apparatus will be described with reference to FIGS.

  The settlement processing apparatus 1 includes a housing 2, an input / display unit 3 provided in the housing 2, and an operation unit 4, and the housing 2 includes a first case 2 a and a second case 2 b, Parts necessary for the settlement processing apparatus 1 are accommodated in the accommodation chamber defined by the case 2a and the second case 2b. The input / display unit 3 includes a display (display unit) such as a liquid crystal panel or an organic EL panel, and a UI (user interface) type touch panel (input unit) that performs various processes by touching a finger or a stylus pen. Then, input / display of settlement amount and payment method, etc. and input / display of various operations are performed. The operation unit 4 includes a keyboard unit 5 on which keys necessary for settlement processing are arranged, a first substrate 6, a second substrate 7, an electronic component 8, and a frame member 9.

  An example of the configuration of the secure area S of the present invention will be described in detail with reference to FIG.

  As shown in FIG. 4, the secure region S includes a first substrate 6, a second substrate 7, an electronic component 8, a frame member 9, a conductive member 10, a flexible substrate 11, and a substrate connection circuit 12. And comprising. In this embodiment, a memory that stores information to be protected (encryption key, secret information such as personal information such as PIN (Personal Identification Number)) and tamper detection that detects whether or not a physical fraud has been performed. An electronic component 8 incorporating a circuit 20 (described later) is mounted on a first substrate 6 having a substantially square shape. The second substrate 7 having a substantially rectangular shape is provided to face the surface of the first substrate 6 on which the electronic component 8 is mounted, and is disposed so as to cover the electronic component 8.

  The first substrate 6 and the second substrate 7 are fitted into a substantially quadrangular frame member 9. The frame member 9 includes a wall surface portion 13 that determines the external shape of the frame member 9, a plurality of elastic member mounting portions 14 that are integrally formed with the wall surface portion 13, and the inside of the wall surface portion 13 and the elastic member mounting portion 14. And a defined through-hole 15. The wall surface portion 13 is provided on the entire circumference of the frame member 9 so as to surround the electronic component 8, and the frame member 9 has a shape closed in the circumferential direction by the wall surface portion 13.

  The elastic member mounting portion 14 is formed with an opening portion 14b which is defined by a wall portion 14a formed integrally with the frame member 9 and is open at both ends, and the conductive member 10 is mounted on the opening portion 14b. That is, a space for mounting the conductive member 10 is secured by the opening 14b. The conductive member 10 includes an elastic member 10a that is an electrical insulator and a conductive film 10b formed on the surface of the elastic member 10a. For forming the conductive film 10b, for example, a conductive material may be applied, a sheet made of a conductive material may be attached, a conductive elastic material may be attached, or the elastic member 10a may be integrally formed. With the simple structure described above, the assembling property of the settlement processing apparatus 1 is improved.

  The first substrate 6 and the second substrate 7 are supported by the inner side surface of the wall portion 14a and the upper and lower surfaces of the elastic member mounting portion 14, and are disposed in the through holes 15. A space including the through hole 15 is formed between the substrates 7. The outer shape of the first substrate 6 and the second substrate 7 in plan view is smaller than that of the frame member 9 in plan view. The first substrate 6 and the second substrate 7 may be supported on the upper surface and the lower surface of the wall portion 14a. The outer shape of the first substrate 6 and the second substrate 7 in plan view may be substantially the same as the outer shape of the frame member 9 in plan view. The electrical connection between the first substrate 6 and the second substrate 7 is performed by connecting the first connector 6 a provided on the first substrate 6 and the second connector 7 a provided on the second substrate 7. This is done via the connection circuit 12.

  The board connection circuit 12 is a foldable flexible board having a folded portion 12a, and has a length larger than the distance between the first board 6 and the second board 7, and the first board 6 and the second board. 7 and a through hole 15 that is a space surrounded by the frame member 9. That is, the substrate connection circuit 12 is stored in a protection area surrounded by the first substrate 6, the second substrate 7, and the frame member 9. With the above configuration, the board connection circuit 12 can be easily stored in the secure area S, and the assemblability is improved. The board connection circuit 12 includes connection portions 12b at both ends, and is electrically connected to board wiring patterns 6P and 7P (described later) of the first board 6 and the second board 7. The first substrate 6 and the second substrate 7 are provided with a plurality of sets of two adjacent electrodes 16. Each pair of two adjacent electrodes 16 is provided with a gap in a part of the substrate wiring patterns 6P and 7P, and the conductive film 10b is pressed against each pair of the electrodes 16 to thereby form the substrate wiring pattern 6P. , 7P is closed, and the conductive film 10b is separated from the electrode 16 to open the circuit patterns 6P, 7P. With the above configuration, the tamper detection circuit 20 built in the electronic component 8 can detect the release of the blockade of the secure area S due to the separation of the first substrate 6 or the second substrate 7 from the frame member 9. It becomes. The folded portion 12a is not essential as long as the substrate connection circuit 12 is stored in the protection area.

  A flexible substrate 11 that covers the outside of the wall surface portion 13 is attached to the wall surface portion 13 of the frame member 9. The flexible substrate 11 is provided with a snake-like wiring pattern 11 a and a connection tab 11 b extending from the main part of the flexible substrate 11. The connection tab 11 b is engaged with the third connector 6 b provided on the first substrate 6 and is electrically connected to the electronic component 8.

  The flexible substrate 11 is a so-called flexible printed circuit board in which a circuit is formed on a film-like sheet such as bendable polyethylene terephthalate, and the wiring pattern is formed only on the side of the flexible substrate 11 facing the frame member 9 side. Is black-treated so that the wiring pattern 11a cannot be easily seen from the outside. The black treatment is performed by, for example, covering with a black or dark resin material (for example, black PET) or attaching a black film or the like.

  The snake-like wiring pattern 11a provided on the flexible substrate 11 is also a tamper detection line. “Tamper” refers to an attack that illegally analyzes or modifies software or hardware in the information processing apparatus, or illegally takes, modifies, or disables information in the information processing apparatus.

  5A is a cross-sectional view taken along line AA in FIG. 4, and FIG. 5B is a cross-sectional view taken along line BB. The cross-sectional view shows a cross section after the secure region S is assembled. In FIG. 5 (a) and FIG. 5 (b), the electrode 16 is omitted.

  The first substrate 6 and the second substrate 7 are respectively fitted to the frame member 9 from above and below, and the conductive member 10 and the flexible substrate 11 are fixed at predetermined positions. The first substrate 6 and the second substrate 7 and the frame member 9 are fixed by a method such as an adhesive, welding, molding, or screwing. The conductive member 10 is inserted into the opening 14 b of the elastic member mounting portion 14, and is fixed in a state where both ends thereof are pressed by the first substrate 6 and the second substrate 7. With the simple structure described above, the assembling property of the settlement processing apparatus 1 is improved.

  The flexible substrate 11 covers the wall surface portion 13 of the frame member 9 over the entire circumference, and is wound from above and below the wall surface portion 13 to cover at least a part of the inside of the wall surface portion 13. When the first substrate 6 and the second substrate 7 are fitted to the frame member 9, the first substrate 6 and the second substrate 7 are wound from above and below the wall surface portion 13. The tip portion of is closely attached to the inside of the wall surface portion 13.

  As described above, the settlement processing apparatus 1 of the present invention incorporates a memory for storing protection information in a module composed of the first substrate 6, the second substrate 7, and the frame member 9. A secure region S provided with the electronic component 8 to be formed is formed. Since the secure region S is electrically connected even when the first substrate 6 and the second substrate 7 are separated from the frame member 9, the secure region S is between the first substrate 6 and the second substrate 7. The circuit parts can be arranged freely. The flexible substrate 11 on which the wiring pattern 11a which is a tamper detection line is formed covers the entire outer periphery of the wall surface portion 13 of the frame member 9 and also covers the upper side and the lower side of the wall surface portion 13, thereby preventing physical fraud. Safety is improved. The wiring pattern 11a of the flexible substrate 11 is electrically connected to the electronic component 8 and detects physical fraud from the side of the module constituting the secure area S to detect information in the secure area S. Can be disabled or erased.

  Here, since the secure area S can be modularized without including any other non-secure area (see FIG. 11) other than the secure area S in the payment processing apparatus 1, it is affected by the circuit arrangement of the non-secure area. Instead, the circuit of the secure area S is arranged with an optimum shape. The modules constituting the secure area S can be arranged in a different location from the substrate constituting the non-secure area inside the housing 2. Therefore, the payment processing apparatus 1 as a whole can be designed to set the secure area S at an optimal position.

  In the present embodiment, the outer shape of the first substrate 6 and the second substrate 7 in plan view is smaller than that of the frame member in plan view. According to such a form, the mounting surfaces of the first substrate 6 and the second substrate 7 can be utilized to the maximum when arranging the circuits in the secure region S.

  FIG. 6 is a schematic diagram illustrating an example of the first embodiment of the secure area.

  The electronic component 8 mounted on the first substrate 6 includes a tamper detection circuit 20 constituting a part of the electronic component 8, a memory in which information to be protected is stored, and a memory built-in CPU 21 (Central Processing Unit). It has. That is, the electronic component 8 has a function of detecting tampering and is also a protection target. In addition, the first substrate 6 and the second substrate 7 are electrically connected to any one of the substrate wiring patterns 6P and 7P mounted on the first substrate 6 and the second substrate 7, respectively. A plurality of sets of two electrodes 16 provided in this manner are mounted.

  Each pair of two adjacent electrodes 16 is provided with a gap in a part of the substrate wiring patterns 6P and 7P. The conductive member 10 fixed between the first substrate 6 and the second substrate 7 includes an elastic member 10a and a conductive film 10b. The conductive film 10b is formed on both surfaces or one surface of the elastic member 10a. The conductive film 10b is pressed against a set of two adjacent electrodes 16 by the elastic force of the elastic member 10a, and electrically connects the two adjacent electrodes 16. The conductive member 10 does not electrically connect the first substrate 6 and the second substrate 7 through the conductive member 10. The conductive member 10 functions as an electrode connecting member that electrically connects two electrodes 16 provided adjacent to each other by the conductive film 10b, and the substrate wiring pattern 6P of the first substrate 6 or the second substrate wiring. This is for maintaining the electrical connection of the pattern 7P. When one of the first substrate 6 and the second substrate 7 is illegally removed, the conductive film 10b of the conductive member 10 and the two adjacent electrodes 16 connected by the conductive film 10b are connected. The pair is separated and the electrical connection of the substrate wiring pattern 6P or 7P is opened. However, even if the first substrate or the second substrate is separated from the frame member, the electrical connection between the first substrate and the second substrate is maintained. Therefore, since the tamper detection circuit 20 can detect that the substrate on which the tamper detection circuit 20 is not mounted is separated from the frame member, it is possible to detect the release of the secure area blockage. With the above configuration, it is possible to detect the destruction of the secure area S and the like, and it is possible to disable or erase the confidential information in the secure area.

  FIG. 7 is a wiring diagram for explaining the electrical connection of the wiring pattern of the first embodiment.

  A substrate wiring pattern 6P is formed as a snake-shaped wiring pattern on the first substrate 6, and a substrate wiring pattern 7P is formed as a snake-shaped wiring pattern on the second substrate 7, and a tamper detection pattern (tamper detection line). It has the function of. That is, the board wiring pattern 6P functions as a first tamper detection pattern, and the board wiring pattern 7P functions as a second tamper detection pattern. The substrate wiring pattern 6P of the first substrate 6 and the substrate wiring pattern 7P of the second substrate 7 are electrically connected by the substrate connection circuit 12. In addition, the flexible substrate 11 is electrically connected to the tamper detection circuit 20 independently of the substrate wiring pattern 6P and the substrate wiring pattern 7P via the connection tab 11b and the third connector 6b.

  In the present embodiment, two sets of two adjacent electrodes 16 mounted on the first substrate 6 or the second substrate 7 are provided at two locations. Then, each set of two adjacent electrodes 16 is electrically connected by the conductive film 10b, whereby the substrate wiring patterns 6P and 7P become conductive. The substrate wiring pattern 6P of the first substrate 6 is directly electrically connected to the tamper detection circuit 20 mounted on the first substrate 6, and the substrate wiring pattern 7P of the second substrate 7 is connected to the substrate connection circuit 12. Is electrically connected to the tamper detection circuit 20 via

  As unauthorized access to the secure area S, when the first substrate 6 or the second substrate 7 is separated from the frame member 9, a part of the wiring pattern 11a of the flexible substrate 11 is cut or other signal, power supply or ground May be short-circuited. Furthermore, part of the substrate wiring patterns 6P and 7P of the first substrate 6 or the second substrate 7 may be cut or short-circuited. When an unauthorized access to the electronic component 8 in the secure area S occurs, the wiring pattern 11a and the board wiring patterns 6P and 7P are electrically disconnected (opened) or short-circuited, and the tamper detection circuit 20 detects physical fraud. Thus, the stored information to be protected becomes unreadable or erased.

  In particular, in the configuration of the present embodiment, the wiring pattern 11a of the flexible substrate 11 does not pass through the substrate (the second substrate 7 in FIGS. 4, 6, and 7) on which the tamper detection circuit 20 is not mounted. Directly connected to the tamper detection circuit 20 (built in the electronic component 8). Therefore, even if some trouble occurs in the tamper detection pattern (substrate wiring patterns 6P and 7P) for detecting that the first board 6 or the second board 7 is removed from the frame member 9, the trouble is Without being affected, it is possible to detect a physical fraud from the side of the module constituting the secure area S. Therefore, information stored in a memory or the like in the secure area S cannot be read or erased.

  When the tamper detection circuit 20 determines that there is destruction detection, the tamper detection circuit 20 transmits the information to the CPU 21 with built-in memory, and the CPU 21 with built-in memory, for example, erases information to be protected or conceals information to be protected from being accessed. Perform predetermined encryption for

  In the payment processing apparatus 1 according to the present embodiment, a substrate connection circuit 12 is provided to electrically connect the first substrate 6 and the second substrate 7. As will be described later, such a configuration increases the degree of freedom in the layout of the memory in which the information to be protected is stored, the tamper detection circuit 20, and the control unit (CPU or the like) that controls them. Therefore, the settlement processing apparatus 1 in the present embodiment can be downsized in the secure area S while having a simple structure and easy assembly. In addition, in this embodiment, since the conductive film 10b of the conductive member 10 is electrically connected to the two electrodes 16, either the first substrate 6 or the second substrate 7 is removed. In addition, one of the substrate wiring patterns 6P and 7P is cut (opened), so that the destruction can be detected. If the tamper detection circuit 20 is mounted on both the first board 6 and the second board 7 and the like, the board connection circuit 12 is not necessarily provided if this physical fraud can be detected. Not necessary.

  In the present embodiment, the first substrate 6 and the second substrate 7 are divided into two substrates, each of the substrates 6 and 7 is configured with a circuit that requires security in the secure region S, Is covered with a flexible substrate 11 for detecting fraud. A tamper detection circuit 20 that detects destruction and a CPU 21 with built-in memory that stores secret information are mounted on a substrate (the first substrate 6 or the second substrate 7) at least in an area equal to or smaller than the frame member 9. With the above-described configuration and arrangement, the settlement processing apparatus 1 can be reduced in size and easily assembled. Instead of the flexible substrate 11, a circuit having a snake-like wiring pattern may be formed on the wall surface portion 13 by, for example, etching, adhesion, metal vapor deposition, printing, plating, or the like.

  FIG. 8 is a schematic diagram showing an example of the second embodiment of the secure area.

  In the first embodiment, the tamper detection circuit 20 and the memory built-in CPU 21 are mounted on the first substrate 6. In the second embodiment, the memory built-in CPU 21 is mounted on the first substrate 6. The tamper detection circuit 20 is mounted on the second substrate 7. In the first embodiment, the third connector 6 b is provided on the first substrate 6. However, in the second embodiment, the third connector 6 b is provided on the second substrate 7 side.

  FIG. 9 is a wiring diagram for explaining the electrical connection of the wiring pattern of the second embodiment.

  The arrangement of the two electrodes 16 mounted on the first substrate 6 and the second substrate 7 is the same as in the first embodiment. The flexible substrate 11 is electrically connected to the tamper detection circuit 20 that is independently mounted on the second substrate 7 via the connection tab 11b and the third connector 6b. The substrate wiring pattern 6P of the first substrate 6 is electrically connected to the tamper detection circuit 20 via the substrate connection circuit 12, and the substrate wiring pattern 7P of the second substrate 7 is mounted on the second substrate 7. The tamper detection circuit 20 is electrically connected directly.

  In the substrate connection circuit 12 of the first embodiment, a pair of wirings are used. However, in the second embodiment, wirings for electrically connecting the tamper detection circuit 20 and the memory built-in CPU 21 are added. By disposing the tamper detection circuit 20 and the CPU 21 with built-in memory on separate substrates (the first substrate 6 or the second substrate 7), the layout flexibility of the tamper detection circuit 20 and the like is improved, and the secure area S is reduced in size. Can be realized. That is, instead of mounting the electronic component 8 storing the information to be protected on only one board, the board is divided into two boards, thereby reducing the board area and facilitating downsizing. Therefore, it is possible to provide the payment processing apparatus 1 with high tamper resistance that can easily detect physical fraud.

  The electronic component 8 storing the information to be protected recorded in the secure area S is surrounded by the first substrate 6, the second substrate 7 and the frame member 9, and the frame member 9 is covered with the flexible substrate 11. Thus, the wiring pattern 11a of the flexible substrate 11 and the electronic component 8 are electrically connected. If, for example, a part of the wiring pattern 11a of the flexible substrate 11 is cut or short-circuited in an attempt to make unauthorized contact with the electronic component 8, the information to be protected stored in the electronic component 8 cannot be erased or read. To be.

  On the other hand, not only the outside of the wall surface portion 13 of the frame member 9 but also the inside of the wall surface portion 13 is covered with the flexible substrate 11 so as to be wound from above and below the wall surface portion 13. For example, even if an attempt is made to improperly contact the electronic component 8 by inserting a blade between the first substrate 6 or the second substrate 7 and the frame member 9, the wiring pattern 11a of the flexible substrate 11 is cut or short-circuited, The information to be protected stored in the electronic component 8 is made unreadable. Thus, safety can be improved against an attack that attempts to make unauthorized contact with the electronic component 8.

  Moreover, in this embodiment, since the flexible substrate 11 is coat | covered with a black resin material, it becomes difficult to visually recognize the wiring pattern 11a provided in the flexible substrate 11 from the outside. Therefore, safety can be improved against an attack in which a blade is inserted between the wiring patterns 11a.

  Although the assembly state of the flexible substrate 11 to the wall surface portion 13 of the frame member 9 has been described with reference to FIG. 5, FIG. 10 shows another embodiment. As in FIGS. 5A and 5B, the electrodes 16 are omitted in FIGS. 10A and 10B.

  In the example of FIG. 5, the outer shape of the first substrate 6 and the second substrate 7 in plan view is smaller than the outer shape of the frame member 9 in plan view. In the example of FIG. 10, the outer shape in plan view of the first substrate 6 and the second substrate 7 is formed to be substantially equal to the outer shape in plan view of the frame member 9. That is, the first substrate 6 and the second substrate 7 are fixed to the upper and lower surfaces of the wall surface portion 13 of the frame member 9 via the flexible substrate 11 and sandwich the frame member 9 therebetween. The fixing method of the conductive member 10 and the flexible substrate 11 is the same as the example of FIG.

  An example of the configuration of the payment processing apparatus 1 will be described with reference to the block diagram of FIG.

  The payment processing apparatus 1 is portable and includes a secure area S and a non-secure area T. “Secure” means having tamper resistance. “Non-secure” means that tamper resistance is not provided. By having tamper resistance, for example, customer information can be protected in a settlement process, and transactions can be performed safely. In addition, although it mentioned above that the operation part 4 has the secure area | region S, it is not specifically limited.

  The secure area S includes a first IF (Interface) unit 22, a first touch input detection unit 23, a power supply unit 24, and a battery 25 in addition to the tamper detection circuit 20 and the CPU 21 with a built-in memory. . The memory built-in CPU 21 includes a first CPU 21a, a first flash ROM (Read Only Memory) 21b, and a first RAM (Random Access Memory) 21c.

  In the secure area S, various components are electrically and logically connected to the first CPU 21a. The first CPU 21a controls all the components in the secure area S. The first CPU 21a executes, for example, a program stored in the first flash ROM 21b, thereby performing various types of control, processing, setting, determination, determination, confirmation, authentication, verification (for example, verification of PIN, signature). I do.

  The first flash ROM 21b executes encryption information used for communication with the settlement center, confidential information such as personal information such as PIN, and other settlement information related to settlement, and the settlement processing apparatus 1 accepts and verifies settlement PIN input. For storing a program or the like. The first flash ROM 21b is an example of a storage medium that stores an information processing program.

  For example, the first RAM 21c temporarily stores processing data generated in the middle of the arithmetic processing during the arithmetic processing associated with PIN input reception and verification of the settlement of the settlement processing device 1 (for example, the secure area S). It is a memory used for storing.

  The tamper detection circuit 20 monitors the secure area S and detects entry into the secure area S, for example, decomposition, destruction, or opening. That is, the tamper detection circuit 20 detects whether there is an abnormality in the secure area S. When the above event is detected by the tamper detection circuit 20, the payment process may be stopped, or the input / display unit 3 or the like may notify that there is a physical abnormality in the secure area S.

  The first touch input detection unit 23 has a function of detecting a touch input to the input / display unit 3. For example, the first touch input detection unit 23 may detect an input to a pin pad (PINPAD) which is a physical keypad or a software keypad for inputting a PIN. The first touch input detection unit 23 may detect an input of a signature using, for example, a finger or a stylus pen. The first touch input detection unit 23 may detect the handwritten input of the PIN using, for example, a finger or a stylus pen. The first touch input detection unit 23 is an example of an input detection unit.

  The power supply unit 24 is a power supply for the secure area S, receives power from the battery 25, and supplies power to the secure area S (for example, the first CPU 21a). The first CPU 21 a can control the power supply unit 24 to supply power and stop power supply to some or all of the circuits arranged in the secure area S.

  The non-secure area T includes a second CPU 31, a second flash ROM 32, a second RAM 33, a second touch input detection unit 34, a display control unit 35, a second IF unit 36, a power source A unit 37 and a battery 38 are provided. Further, the non-secure area T includes a local radio communication unit 40, a wide area radio communication unit 41, a key input unit 42, and a magnetic card reader unit 43.

  In the non-secure area T, various components are electrically and logically connected to the second CPU 31. The second CPU 31 supervises the entire components in the non-secure area T. For example, the second CPU 31 executes various programs, processes, settings, determinations, and the like by executing a program stored in the second flash ROM 32.

  The second flash ROM 32 has a function of storing various data. The stored data may be a business application program or data related to the business, or a program for controlling the payment processing apparatus 1 (for example, the non-secure area T). Therefore, the second flash ROM 32 is an example of a storage medium that stores the information processing program.

  For example, the second RAM 33 temporarily stores processing data generated during the arithmetic processing during the arithmetic processing accompanying the operation of the payment processing apparatus 1 (for example, a component in the non-secure area T). This is the memory used.

  The second touch input detection unit 34 has a function of detecting a touch input to the input / display unit 3. The display control unit 35 has a function of controlling the display of the input / display unit 3.

  The secure area S and the non-secure area T are connected to each other via the first IF section 22 and the second IF section 36 provided in the non-secure area T, and various data and commands are exchanged. The first IF unit 22 and the second IF unit 36 can be coupled to each other.

  The power source unit 37 is a power source for the non-secure area T, and receives power from the battery 38 and supplies power to the non-secure area T (for example, the second CPU 31). The second CPU 31 can control the power supply unit 37 to supply power and stop power supply to a part or all of the circuits arranged in the non-secure area T.

  The local wireless communication unit 40 is connected to the local wireless communication antenna 40a and has a function of performing, for example, wireless LAN communication using a local wireless communication path (not shown). The local wireless communication unit 40 may perform communication other than wireless LAN communication (for example, Bluetooth (registered trademark) communication).

  The wide area wireless communication unit 41 is connected to the wide area wireless communication antenna 41a and has a function of communicating via a wide area wireless communication path (for example, WAN (Wide Area Network)) not shown. Communication in a wide area wireless communication path is performed using, for example, a wireless telephone line (a mobile telephone line such as W-CDMA (Wideband Code Division Multiple Access), CDMA (Code Division Multiple Access) 2000, LTE (Long Term Evolution)). It may be broken.

  The key input unit 42 has a function of receiving an input from the keyboard unit 5 arranged in the non-secure area, for example. The magnetic card reader unit 43 has a function of reading the magnetic stripe of the magnetic card.

  As described above, the payment processing apparatus 1 includes the secure area S and the non-secure area T. A “secure” portion that requires “tamper resistance” is localized in the secure region S.

  On the other hand, in the non-secure region T, for example, information terminals (for example, smartphones and tablet terminals) distributed in large numbers for consumer use or a part thereof may be adopted as a platform.

  By adopting a general-purpose platform in the non-secure area T, reuse of development assets of application software for payment (hereinafter “payment application” and application software used for other operations (hereinafter “business application”)) In addition, the settlement application and other business applications can be flexibly operated without stress by being processed by the second CPU 31 in the non-secure area T having high calculation processing capability, for example. In addition, payment processing with various payment schemes and various business applications can be easily used, and they can be installed in a payment processing apparatus in a short period of time.

  Although the substrate fixed to the frame member 9 has been described with the first substrate 6 and the second substrate 7, the substrate need not be limited to “first” or “second”. Alternatively, the electronic component 8 may be divided into two and provided on each substrate.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimension, numerical value, form, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

  The information processing apparatus according to the present invention is applicable to the use of an information processing apparatus that requires modularization and downsizing of the secure area and improvement of tamper resistance.

1: Payment processing device (information processing device)
2: casing 3: input / display unit 4: operation unit 5: keyboard unit 6: first substrate 6P: substrate wiring pattern of the first substrate (first tamper detection pattern)
7: Second substrate 7P: Substrate wiring pattern of second substrate (second tamper detection pattern)
8: Electronic component 9: Frame member 10: Conductive member (electrode connection member)
10a: elastic member 10b: conductive film 11: flexible substrate 11a: wiring pattern 12: substrate connection circuit 12a: folded portion 13: wall surface portion 14: elastic member mounting portion 14a: wall portion 15: through hole 16: two electrodes 20: Tamper detection circuit 21: CPU with built-in memory
S: Secure area T: Non-secure area

Claims (9)

A first substrate;
A second substrate provided opposite to the first substrate;
A frame member that includes a wall portion enclosing the outer shapes of the first substrate and the second substrate, and supports the first substrate and the second substrate on the inner surface side of the wall portion;
A tamper detection circuit that is disposed inside a secure region surrounded by the first substrate, the second substrate, and the frame member, and detects that the block of the secure region is released;
A flexible substrate including a connection end surface between the outer side of the wall surface part and the inner surface side and a wiring pattern that covers the entire outer periphery of the wall surface part and is electrically connected to the tamper detection circuit;
One end of the flexible substrate on the long side is disposed between the inner surface of the wall surface and the outer end surface of the first substrate and inside the secure area,
The other end portion on the long side of the flexible substrate is disposed between the inner surface of the wall surface portion and the outer end surface of the second substrate and inside the secure area.
Information processing device. The information processing apparatus according to claim 1,
An information processing apparatus, wherein an outer shape in plan view of the first substrate and the second substrate is smaller than an outer shape in plan view of the frame member. The information processing apparatus according to claim 1,
On the inner surface side of the wall surface portion, an elastic member mounting portion that is integrally formed with the wall surface portion and on which an elastic member is mounted is formed,
The elastic member mounting portion includes a wall portion that secures a space in which the elastic member is mounted, and an upper and lower surface of the wall portion supports the first substrate and the second substrate. . A first substrate;
A second substrate provided opposite to the first substrate;
The first substrate and the second substrate have a wall surface surrounding the outer shape, a through hole is defined inside the wall surface portion, and the first substrate and the second substrate pass through the hole. A frame member disposed in the hole;
A tamper detection circuit that is disposed in a secure region sandwiched between the first substrate and the second substrate in the through hole, and detects that the secure region is unblocked ;
A flexible substrate including a wiring pattern that covers a connection end surface between the outer side and the inner side of the wall surface part and an outer periphery of the wall surface part and is electrically connected to the tamper detection circuit;
One end of the flexible substrate on the long side is disposed between the inner surface of the wall surface and the outer end surface of the first substrate and inside the secure area,
The other end portion on the long side of the flexible substrate is disposed between the inner surface of the wall surface portion and the outer end surface of the second substrate and inside the secure area.
Information processing device. The information processing apparatus according to claim 4,
An information processing apparatus, wherein an outer shape in plan view of the first substrate and the second substrate is smaller than an outer shape in plan view of the frame member. The information processing apparatus according to claim 4,
In the region where the through hole is defined, an elastic member mounting portion is formed integrally with the wall surface portion, and an elastic member is mounted,
The elastic member mounting portion includes a wall portion that secures a space in which the elastic member is mounted, and an upper and lower surface of the wall portion supports the first substrate and the second substrate. . An information processing apparatus according to claim 1, wherein:
An information processing apparatus, wherein a flexible substrate having a wiring pattern electrically connected to the tamper detection circuit is provided so as to cover at least the entire outer periphery of the wall surface portion. The information processing apparatus according to claim 7,
A first tamper detection pattern provided on the first substrate and electrically connected to the tamper detection circuit;
A second tamper detection pattern provided on the second substrate and electrically connected to the tamper detection circuit;
An information processing apparatus, wherein a wiring pattern of the flexible substrate is electrically connected to the tamper detection circuit independently of the first tamper detection pattern and the second tamper detection pattern. An information processing apparatus according to claim 1, wherein:
An information processing apparatus, further comprising: an electronic component mounted on a surface of the first substrate or the second substrate facing the other substrate and storing information to be protected.

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