JP5657457B2 - Chip type energy device - Google Patents

Description

  The present invention relates to a chip-type energy device. More specifically, the present invention relates to a chip-type energy device useful for a backup power source, a micro energy storage element, a coupling capacitor, a smoothing capacitor, and the like.

  A conventional chip-type energy storage device as one of the chip-type energy devices encloses and seals an electrode structure in which a separator is inserted into a pair of bulk positive and negative active material electrodes in a ceramic structure package. It had a simple structure. However, since a relatively thick (high specific surface area) active material electrode was used, there was a problem that internal resistance was high.

  In addition, as a small chip-type electricity storage device, a circular chip-type electricity storage device such as a coin-type battery or a button-type battery is known. Similarly, a pair of electrode structures (or 2 for increasing the voltage) Since the active material electrode is relatively thick (with high specific surface area), the internal resistance is also high.

  In addition, since chip-type electricity storage devices such as coin-type batteries and button-type batteries have a circular shape, the mounting area is smaller than that of a rectangular shape and there is a limit to downsizing.

Furthermore, since the conventional chip-type electricity storage device impregnates the electrode structure with the electrolytic solution first and then accommodates it in the package, the electrolyte solution is particularly useful when sealing with an organic sealant in the case of the chip type. In some cases, the characteristics may deteriorate.

  In connection with these, for example, in a circular non-aqueous electrolyte battery such as a coin type or a button type and an electric double layer capacitor, the connection terminal is integrated with the storage container, and the space on the substrate is arranged at the bottom of the container. Has been disclosed (see, for example, Patent Document 1).

  On the other hand, by forming a conductive film from the bottom surface of the recess to the opening edge, it is possible to easily and cost-effectively connect the current collector and the external electrode, and further, since no lead frame or via is used, A technique for providing an electrochemical cell capable of ensuring the hermeticity of a container has been disclosed (see, for example, Patent Document 2).

  In addition, by sufficiently removing moisture from the polarizable electrode and maintaining a strong junction with the current collector, the increase in internal resistance due to repeated charging and discharging and floating charging due to high voltage is small, and long-term reliability A technology for providing a high electric double layer capacitor is disclosed. (For example, refer to Patent Document 3).

  Furthermore, by producing a coin-type electric double layer capacitor using a thermoplastic resin and a gasket formed by heat compression molding from a material molded product at a temperature lower than the melting point of the resin, liquid leakage resistance is high and reliable in reflow soldering. A technique for providing a coin-type electric double layer capacitor is also disclosed (see, for example, Patent Document 4).

JP 2001-216852 A JP 2010-192874 A JP 2008-21111 A JP 2002-0505551 A

  An object of the present invention is to provide a chip-type energy device that can obtain a high output even in a chip-type energy device and can reduce internal resistance.

  Another object of the present invention is to provide a chip-type energy device sealed in a high-strength package, which can improve adhesion and suppress, for example, the influence on the electrolyte such as deterioration. is there.

  According to one aspect of the present invention, (a) the extraction electrode portion is formed by interposing a separator in the active material electrode portion of an electrode in which positive and negative electrode active material electrodes and positive and negative electrode extraction electrodes are integrally formed. Two or more stacked layers that are stacked so that the positive and negative electrodes of the electrode are alternately stacked; and (b) the stacked body is accommodated and connected to the lead electrode A frame member in which a through hole for leading out the terminal electrode is formed; (c) a lid that seals the upper surface of the frame member; and (d) a lower surface of the frame member and the through hole are sealed. A chip-type energy device is provided that includes a sealing portion that contains an electrolyte in a laminated portion of the laminate.

  According to another aspect, (a) the lead electrode portion is exposed while a separator is interposed in the active material electrode portion of the electrode in which the positive and negative electrode active material electrodes and the positive and negative electrode lead electrodes are integrally formed. And a laminate of two or more layers laminated so that the positive electrode and the negative electrode of the electrode are alternately laminated, and (b) a terminal electrode connected to the lead electrode is drawn out to the outside, and A base on which the stacked body is placed, which has a through-hole that also serves as an injection hole for injecting an electrolyte solution containing an electrolyte; and (c) a frame material that houses the stacked body placed on the base; (D) A chip-type energy device is provided that includes a lid that seals the upper surface of the frame member.

  ADVANTAGE OF THE INVENTION According to this invention, also in a chip | tip energy device, a high output can be obtained and the chip | tip energy device which can reduce internal resistance can be provided.

  In addition, according to the present invention, it is possible to improve the adhesion, to suppress the influence on the electrolytic solution such as deterioration, and to provide a chip type energy device sealed in a package having high strength. it can.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which illustrates the material of the active material electrode and extraction electrode which are used for the chip-type energy device which concerns on 1st Embodiment, Comprising: (a) The aluminum foil which apply | coated the active material only to the part used as an active material electrode The perspective view which shows a mode that the aluminum foil shown to (b) Fig.1 (a) was cut | disconnected in strip shape. An example of a laminate in which positive and negative layers are alternately laminated so that a portion not coated with an active material is exposed as a lead electrode while a separator is inserted into an aluminum foil partially coated with an active material shown in FIG. (A) Top view of laminated structure, (b) Cross-sectional view taken along line II in FIG. 2 (a). FIG. 3 is a cross-sectional view illustrating an internal electrode structure in which a tab electrode is welded to a lead electrode of the laminate shown in FIG. 2. 4A is a top view illustrating a ceramic frame member having a housing recess for housing the internal electrode structure shown in FIG. 3, and FIG. 4B is a cross-sectional view taken along the line II-II in FIG. Sectional drawing which shows the example which accommodated the internal electrode structure in the accommodation recessed part of the ceramic package. FIG. 5 is a cross-sectional view showing an example of a chip manufactured by covering the top surface of the chip shown in FIG. 4 with a metal lid and covering the bottom surface with a ceramic adhesive. Sectional drawing which shows the example which installed the press in the upper surface and lower surface of the chip | tip shown in FIG. Sectional drawing which shows the example which applied the pressure to the chip | tip from the upper and lower sides with the press shown in FIG. FIG. 8 is a view in which the press machine is removed from the pressure-applied chip shown in FIG. 7, (a) a perspective view illustrating the chip from which the press machine has been removed, and (b) a line III-III in FIG. FIG. Sectional drawing which shows the example which peeled the ceramic adhesive from the bottom face of the chip | tip shown in FIG. Sectional drawing which shows the example which immersed the chip | tip shown in FIG. 9 in the electrolyte bath. Sectional drawing which shows the example of the chip | tip type | mold energy device completed by sealing the bottom face of the chip | tip lifted from the electrolyte bath shown in FIG. It is a figure which illustrates the internal electrode structure used for the chip-type energy device which concerns on 2nd Embodiment, Comprising: (a) The example which made the ceramic base adhere to the bottom face of the internal electrode structure illustrated in FIG. Sectional drawing shown, (b) Sectional drawing along the IV-IV line of Fig.12 (a). The figure of the chip | tip produced by accommodating the internal electrode structure shown in FIG. 12 in the recessed part of a ceramic frame material, and covering the upper surface of a ceramic package with the metal lid | cover. Sectional drawing which shows the example which installed the press in the upper surface and lower surface of the chip | tip shown in FIG. Sectional drawing which shows the example which applied the pressure to the chip | tip from the upper and lower sides with the press shown in FIG. Sectional drawing which shows the example which removed the press from the chip | tip with which the pressure shown in FIG. 15 was applied. Sectional drawing which shows the example which immersed the chip | tip shown in FIG. 16 in the electrolyte bath. Sectional drawing which shows the example of the chip | tip type | mold energy device completed by molding the exterior of the chip | tip pulled up from the electrolyte solution bathtub shown in FIG.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness of each component and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention include the material, shape, and structure of each component. The arrangement is not specified below. Various modifications can be made to the embodiment of the present invention within the scope of the claims.

[First Embodiment]
(Basic structure of chip-type energy device)
As shown in FIGS. 1 to 11, the chip-type energy device according to the first embodiment is an electrode in which positive and negative electrode active material electrodes 10 and 12 and positive and negative electrode lead electrodes 32 a and 32 b are integrally formed. Two or more layers laminated so that the extraction electrodes 32a and 32b are exposed and the positive and negative electrodes of the electrode are alternately laminated while the separator 30 is interposed in the active material electrode portions 10 and 12 The laminated body 80, the frame member 60 in which the laminated body 80 is accommodated and through-holes 63 and 64 for leading out terminal electrodes connected to the lead electrodes 32a and 32b are formed, and the upper surface of the frame member 60 is sealed. A lid 70 to be stopped, and a sealing portion 72 that seals the lower surface of the frame member 60 and the through holes 63 and 64 and causes the laminated portion of the laminated body 80 to contain an electrolyte.

  The chip-type energy device according to the first embodiment is provided with through holes 63 and 64 for allowing the terminal electrodes 50 and 52 to pass therethrough and storage recesses for storing the internal electrode structures 80 (for example, made of ceramic). The internal electrode structure 80 is housed in the frame member 60).

  As illustrated in FIG. 2, the internal electrode structure (e.g., a storage element) 80 includes at least two or more layers of active material electrodes 10 and 12 with a separator 30 through which only ions of the electrolytic solution are interposed, as lead electrodes. 32 (32a, 32b) is composed of a laminated body in which the positive electrode 10 and the negative electrode 12 are alternately laminated. As illustrated in FIG. 1A, the active material electrodes 10, 12 and the extraction electrode are, as illustrated in FIG. 1A, portions of the upper surface of the electrode plate (for example, aluminum foil) coated with an active material made of, for example, activated carbon. The positive electrode side active material electrode 12 and the negative electrode side active material electrode 12 are used as the lead electrode 32 (positive electrode side lead electrode 32b, negative electrode) on the electrode plate upper surface where the active material (activated carbon) is not applied. Side extraction electrode 32a). Furthermore, as illustrated in FIG. 1B, the aluminum foil is cut into strips. Each electrode plate cut into strips is used as an electrode including the active material electrodes 10 and 12 and the extraction electrode 32. By using a high-power aluminum electrode sheet as a material for the electrode plate, high output can be obtained even in a chip-type energy device.

  As illustrated in FIG. 2A, the separator 30 is larger than the active material electrodes 10 and 12 (having a large area) so as to cover the entire active material electrodes 10 and 12. As illustrated in (b), the separator 30 is laminated on the uppermost part (and the lowermost part) of the laminate so that the separator 30 is laminated. The separator 30 does not depend on the type of energy device in principle, but heat resistance is required particularly when reflow treatment is required. When heat resistance is not required, polypropylene or the like can be used, and when heat resistance is required, a cellulosic material can be used.

The extraction electrodes 32a and 32b exposed from the multilayer body are directly welded to the tab electrodes 34a and 34b as illustrated in FIG. As illustrated in FIG. 4, the terminal electrodes 50 and 52 extending from the tab electrodes 34 a and 34 b can be drawn out of the frame member 60 through the through holes 63 and 64. The terminal electrodes 50 and 52 can be directly connected. This facilitates reducing the internal resistance of the electrode structure 80 in the chip. The frame member 60, it is necessary to provide an injection hole for impregnating the electrolytic solution 42, the injection hole for impregnating the electrolytic solution 42, the through-holes 63, 64 for passing the terminal electrodes 50 and 52 It can also be combined. Between the through-holes 63 and 64 and the extracted terminal electrodes 50 and 52, there are provided at least gaps necessary to pass at least the electrolyte solution 42, respectively. Further, the frame member 60 includes a storage recess for storing the internal electrode structure 80.

As illustrated in FIG. 5, a metal lid 70 is bonded and mounted on the upper surface of the frame member 60 with an adhesive 68 (for example, a chemical-resistant ceramic). 6 to 9, the metal lid 70 installed on the upper surface of the frame member 60 is mechanically pressed by the press machines 74a and 74b in order to achieve the close contact of the internal electrode structure 80. Then, the metal lid 70 is recessed inwardly by being dried. The concave metal lid 70a prevents the internal electrode structure 80 and the like from being destroyed even when the chip internal pressure is increased by a gas (gas) generated when an overvoltage is applied. Furthermore, this concave structure holds down the internal electrode structure 80 accommodated in the chip, thereby realizing a reduction in internal resistance of the internal electrode structure 80.

As illustrated in FIG. 10, the chip in which the lid 70 a is recessed is immersed in the electrolytic solution bath 40 containing the electrolytic solution 42 in order to impregnate the electrolytic solution 42. As illustrated in FIG. 11 (for example, a chemical-resistant material), the sealing portion that is in contact with the electrolytic solution 42 impregnated in the chip (that is, the sealing portion for preventing the electrolytic solution 42 from leaking) is used. A ceramic (adhesive) 72 is used, thereby reducing the effects of degradation of the electrolyte 42 and the like. The through holes 63 and 64 impregnated with the electrolytic solution 42 are again sealed with a chemical-resistant ceramic adhesive 72. Further, since the sealing portion by the adhesive 72 (and the adhesive 68) has a mechanically weak characteristic, the resin mold 82 wraps the chip to reinforce the sealing portion as illustrated in FIG. And a package having a two-layer sealing structure of an adhesive 72 and a resin mold 82.

  In addition, when the exterior of the chip is covered with the resin mold 82, the predetermined space portion 71 illustrated in FIG. 11 is formed between the recess of the lid 70 a recessed inside and the resin mold 82. The sealing structure is as follows. That is, the exterior of the chip is covered so that the space 71 of the recess of the lid 70 a is not filled with the resin mold 82. Thereby, even when the internal pressure of the chip rises due to the gas (gas) generated when an overvoltage is applied, there is room for the concave lid 70a to bulge upward (that is, the state before the concave portion of the lid 70a is dented). Therefore, the internal electrode structure 80 and the like can be prevented from being destroyed.

(Chip type energy device manufacturing method)
With reference to FIGS. 1-11, the manufacturing method of the chip-type energy device which concerns on 1st Embodiment is demonstrated.

(A) First, as illustrated in FIG. 1A, an electrode plate made of, for example, aluminum foil is prepared. As a material for the electrode plate, for example, a high-power aluminum electrode sheet is used. The portion of the upper surface of the electrode plate (for example, aluminum foil) to which the active material (activated carbon) is applied becomes the active material electrodes 10 and 12 (positive electrode 10, negative electrode 12), and the active material (activated carbon) is applied to the upper surface of the electrode plate. The part which is not formed becomes the extraction electrode 32. Further, as illustrated in FIG. 1B, the electrode plate is cut into strips. Each electrode plate cut into strips is used as an electrode including active material electrodes 10 and 12 (positive electrode 10 and negative electrode 12) and extraction electrode 32, respectively.

(B) Next, as illustrated in FIG. 2, an internal electrode structure which is a laminate in which at least two layers of active material electrodes 10 and 12 are laminated so that the positive electrodes 10 and the negative electrodes 12 are alternately arranged. (For example, a storage element) 80 is configured. At this time, the extraction electrodes 32 a and 32 b not coated with the active material are laminated so as to be exposed from the internal electrode structure 80. In addition, the separators 30 are stacked between the active material electrodes 10 and 12 with the separators 30 interposed therebetween. In order to prevent a short circuit, as illustrated in FIG. 2A, the separator 30 is larger than the active material electrodes 10 and 12 (one having a large area) so as to cover the entire active material electrodes 10 and 12. Further, as illustrated in FIG. 2B, at least the uppermost part of the laminate is laminated so that the separator 30 is laminated instead of the electrode.

(C) Next, as illustrated in FIG. 3, the lead electrodes 32 a and 32 b and the tab electrodes 34 a and 34 b exposed from the laminated body are connected to the weld holes 20 a and 20 b using the sealing materials 36 a and 36 b. Perform electrode attachment. For welding with such electrodes, for example, ultrasonic welding, soldering, or the like is used. The tab electrodes 34a and 34b can be formed of, for example, Al or Ni.

(D) Next, as illustrated in FIG. 4, the internal electrode structure 80 and the welded terminal electrodes 50 and 52 shown in FIG. The frame member 60 is made of, for example, ceramic. As illustrated in FIG. 4A, the frame member 60 is provided with through holes 63 and 64 for allowing the terminal electrodes 50 and 52 to pass therethrough and storage recesses for storing the internal electrode structures 80. Yes. As illustrated in FIG. 4B, the terminal electrodes 50 and 52 extending from the tab electrodes 34 a and 34 b can be drawn out of the frame member 60 through the through holes 63 and 64. The internal electrode structure 80 is bonded and placed on the base 66 in the frame member 60.

(E) Next, as illustrated in FIG. 5, a metal lid 70 is bonded and mounted on the upper surface of the frame member 60 with an adhesive 68, and the upper surface of the frame member 60 is sealed to produce a chip. As the lid 70, for example, a relatively soft metal plate such as Al is used. As the adhesive 68, for example, a ceramic adhesive is used. In addition, the bottom surface of the frame member 60 and the through holes 63 and 64 provided in the frame member 60 are also sealed with the adhesive 72. The adhesive 72 can be made of the same material as that of the adhesive 68. For example, a chemical-resistant ceramic adhesive is used.

(F) Next, as illustrated in FIG. 6, the press members 74 a and 74 b are sandwiched between the upper surface and the lower surface of the frame member 60 (chip). Specifically, one (70a) of the press is attached to the upper surface of the lid 70 of the frame member 60, and the other (70b) of the press is attached to the lower surface of the sealing portion by the adhesive 72.

(G) Next, as illustrated in FIG. 7, the chips are pressed from above and below by the press machines 74 a and 74 b and dried in that state. When drying starts, the internal pressure inside the frame member 60 decreases, and the lid 70 formed of a relatively soft metal plate is recessed inward (the state of the lid 70a illustrated in FIG. 7). Incidentally, the press 74a, prior to pressing by 74b, and allowed to warm press 74a, and 74b in advance and cooled during drying after pressing, the effect of recessed concave lid 70a becomes larger. FIG. 8 illustrates a state in which the press machines 74a and 74b are removed from the chip after the lid 70a is recessed.

(H) Next, as illustrated in FIG. 9, the adhesive 72 is peeled from the frame member 60. The reason why the adhesive 72 is peeled off is that the ceramic adhesive is weak in strength, and the electrolytic solution 42 is removed from the through holes 63 and 64 formed in the frame member 60 (chip) after the adhesive 72 is peeled off in the next step. By impregnation . It should be noted that when the adhesive 72 is peeled from the frame member 60, it should be noted that the lid 70 a bonded and mounted with the adhesive 68 is not peeled off from the frame member 60.

(I) Next, as illustrated in FIG. 10, the chip is immersed in the electrolytic solution bath 40 containing the electrolytic solution 42, and the electrolytic solution 42 is impregnated into the chip through the through holes 63 and 64. An electrolyte is contained between the material electrodes 10 and 12. At this time, energization aging is also performed at the same time, and degassing is performed.

(J) Thereafter, as illustrated in FIG. 11, the through holes 63 and 64 of the chip lifted from the electrolyte bath 40 are sealed again with the adhesive 72. For example, a chemical-resistant ceramic adhesive 72 is used for the sealing portion that is in contact with the electrolytic solution 42 impregnated in the chip (that is, the sealing portion for preventing the electrolytic solution 42 from leaking). The influence of deterioration or the like on the liquid 42 is suppressed. The through holes 63 and 64 impregnated with the electrolytic solution 42 are also sealed with a chemical-resistant ceramic adhesive 72.

(K) Further, since the sealing portion by the adhesive 72 (and the adhesive 68) has a mechanically weak characteristic, in order to reinforce the sealing portion, as illustrated in FIG. A package having a two-layer sealing structure of an adhesive 72 and a resin mold 82 is formed by covering the exterior of the chip. In addition, when the exterior of the chip is covered with the resin mold 82, the predetermined space portion 71 illustrated in FIG. 11 is formed between the recess of the lid 70 a recessed inside and the resin mold 82. The sealing structure is as follows. When dried in this state, the chip-type energy device according to the first embodiment is completed.

  As described above, according to the chip-type energy device and the manufacturing method thereof according to the first embodiment, the internal electrode structure 80 includes the separator 30 on the active material electrodes 10 and 12 having at least two layers. While being interposed, it is constituted by a laminated body in which the extraction electrodes 32 (32a, 32b) are exposed and the positive electrodes 10 and the negative electrodes 12 are alternately stacked. By using a high-power aluminum electrode sheet as the material of the electrode plate for forming the active material electrodes 10 and 12 and the extraction electrodes 32 (32a and 32b), high output can be obtained even in a chip-type energy device.

Further, since the frame member 60 is provided with through holes 63 and 64 through which the terminal electrodes 50 and 52 are passed, the terminal electrodes 50 and 52 are drawn out of the frame member 60 through the through holes 63 and 64. Can do. Thereby, the terminal electrodes 50 and 52 can be directly connected to the internal electrode structure 80, and it becomes easy to reduce the internal resistance of the electrode structure 80 in the chip. The injection hole for impregnating the electrolytic solution 42 can also be used by the through holes 63 and 64 for allowing the terminal electrodes 50 and 52 to pass therethrough.

In addition, the sealing portion by the adhesive 72 (and the adhesive 68) covers the exterior of the chip with the resin mold 82, and the package has a two-layer sealing structure of the adhesive 72 and the resin mold 82. For example, a chemical-resistant ceramic adhesive is used as the adhesive 72, thereby suppressing the influence of deterioration or the like of the electrolytic solution 42. Further, the through holes 63 and 64 impregnated with the electrolytic solution 42 are again sealed with a chemical-resistant ceramic adhesive 72. Even when the internal pressure of the chip increases due to the gas (gas) generated when an overvoltage is applied due to the space portion 71 formed between the metal lid 70a and the resin mold 82 which are recessed in a concave shape, The electrode structure 80 and the like are prevented from being destroyed. Furthermore, the internal structure of the internal electrode structure 80 accommodated in the chip can be pressed down by this concave structure, and the internal resistance of the internal electrode structure 80 can be reduced.

  In addition, the two-layer sealing structure of the adhesive 72 and the resin mold 82 can maintain high airtightness and high sealing performance, so that the electrolyte contained in the chip leaks from the chip. It is possible to prevent the moisture from entering into the chip.

[Second Embodiment]
The chip type energy device according to the second embodiment differs from the chip type energy device according to the first embodiment in the following points.

  That is, in the chip-type energy device according to the first embodiment, as illustrated in FIGS. 6 and 11, the through-holes 63 and 64 of the chip are formed by, for example, a chemical-resistant ceramic adhesive 72 (and adhesion). The package is sealed with an agent 68), and further, the exterior of the chip is covered with a resin mold 82, and the package has a two-layer sealing structure of an adhesive 72 and a resin mold 82.

On the other hand, in the chip-type energy device according to the second embodiment, as illustrated in FIGS. 12 to 16, the terminal electrodes 50 and 52 are provided on the base 66 on which the internal electrode structure 80 is bonded and placed. A through-hole for drawing out is formed. The base 66 is made of, for example, a chemical resistant ceramic material. The through hole formed in the base 66 has not only the purpose of drawing out the terminal electrodes 50 and 52 to the outside of the chip but also the purpose of impregnating the electrolytic solution 42 into the chip from the through hole. Therefore, as illustrated in FIG. 12A, at least a minimum gap for passing the electrolytic solution 42 is provided between each through hole and the extracted terminal electrodes 50 and 52. Yes. The through hole may be formed in the frame member 60 in the same manner as in the first embodiment without being formed in the base 66, or may be formed in both the base 66 and the frame member 60. 66 and the frame member 60 may be combined to form the through hole.

  Further, the terminal electrodes 50 and 52 are drawn out from the through hole in the parallel direction from substantially the same height as the internal electrode structure 80.

  After the internal electrode structure 80 is placed on the base 66 and the terminal electrodes 50 and 52 are pulled out, the internal electrode structure 80 is housed in the frame member 60 as illustrated in FIG. Similarly to the first embodiment, a lid 70 formed of a relatively soft metal plate such as Al by an adhesive 68 (for example, a chemical-resistant ceramic adhesive) is provided on the upper surface of the frame member 60. Adhesive mounting is performed, and the upper surface of the frame member 60 is sealed.

Next, as illustrated in FIG. 14, the press machines 74 a and 74 b are attached so as to sandwich the upper surface and the lower surface of the frame member 60 (chip). Specifically, one (70a) of the press is attached to the upper surface of the lid 70 of the frame member 60, and the other (70b) of the press is attached to the lower surface of the base 66.

Next, as illustrated in FIG. 15, the chips are pressed from above and below by the press machines 74a and 74b and dried in that state. When drying begins, the internal pressure inside the frame member 60 decreases, and at the same time, the lid 70a formed of a relatively soft metal plate is recessed inward. FIG. 16 illustrates a state in which the press machines 74a and 74b are removed from the chip after the lid 70a is recessed.

  In the second embodiment, unlike the first embodiment, the ceramic adhesive 72 is not used as the sealing portion under the frame member 60. Therefore, as in the first embodiment, the step of peeling the adhesive 72 (step (h) in the first embodiment) is unnecessary while taking care that the lid 70a is not peeled off from the frame member 60. Become. Furthermore, in the second embodiment, the step of re-sealing the through holes 63 and 64 of the chip lifted from the electrolyte bath 40 with the adhesive 72 (step (j) in the first embodiment) is also unnecessary. It becomes.

Next, as in the first embodiment, as illustrated in FIG. 17, the chip is immersed in the electrolytic solution bath 40 containing the electrolytic solution 42, and the electrolytic solution 42 enters the chip from the through holes (63, 64). impregnated, is contained an electrolyte between the active material electrodes 10, 12 are stacked. At this time, energization aging is also performed at the same time, and degassing is performed.

  Finally, as illustrated in FIG. 18, the chip pulled up from the electrolyte bath 40 is covered with a resin mold 82 to form a package having a two-layer structure of the ceramic base 66 and the resin mold 82. When covering the exterior of the chip with the resin mold 82, the predetermined space portion 71 illustrated in FIG. 18 is formed between the recess of the lid 70a recessed inward and the resin mold 82. The sealing structure is as follows. When dried in this state, the chip-type energy device according to the second embodiment is completed.

  According to the second embodiment, while maintaining the same performance and airtightness as the chip-type energy device according to the first embodiment, the manufacturing process according to the first embodiment is simplified. The manufacturing method of the chip-type energy device according to the process can be realized.

  Furthermore, according to the second embodiment, the terminal electrodes 50 and 52 are drawn out from the through hole in the parallel direction from substantially the same height as the internal electrode structure 80, so that the first embodiment relates to the first embodiment. It is possible to provide a smaller (low height) chip energy device while maintaining the same performance and airtightness as the chip energy device.

  According to the chip-type energy device and the manufacturing method thereof according to the first to second embodiments, even in the chip-type energy device, a chip-type energy device capable of obtaining a high output and reducing the internal resistance, and A manufacturing method thereof can be provided.

  Moreover, according to the chip-type energy device and the manufacturing method thereof according to the first to second embodiments, the adhesion can be improved, for example, the influence on the electrolytic solution such as deterioration can be suppressed, and the high strength. It is possible to provide a chip-type energy device sealed in a package having:

[Other embodiments]
As described above, the present invention has been described according to the first to second embodiments. However, it should be understood that the descriptions and drawings constituting a part of this disclosure are exemplary and limit the present invention. should not do. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention includes various embodiments not described herein.

  The chip-type energy device according to the present invention is a power source for backup of LSIs, watches, digital still cameras, digital video cameras, personal computers, mobile phones, toys, etc., solar power generation, dynamo power generation, vibration power generation, thermoelectric elements, power generation, etc. It can be applied as a micro-energy storage element that stores low output energy from, as a coupling capacitor, or as a smoothing capacitor.

DESCRIPTION OF SYMBOLS 10, 12 ... Active material electrode 20a, 20b ... Welding hole 30 ... Separator 32 (32a, 32b) ... Extraction electrode 34a, 34b ... Tab electrode 36a, 36b ... Sealing material 40 ... Electrolyte bath 42 ... Electrolyte solution 50, 52 ... Terminal electrode 60 ... Frame members 63, 64 ... Through hole (also serving as electrolyte injection hole)
62 ... stand (first embodiment)
66 ... stand (second embodiment)
68, 72 ... Adhesive (sealing part)
70, 70a ... Lid 71 ... Space 74a, 74b ... Press 80 ... Laminated body (internal electrode structure)
82 ... Resin mold

Claims (17)

While the separator is interposed in the active material electrode part of the electrode in which the positive and negative active material electrodes and the positive and negative lead electrodes are integrally formed, the lead electrode part is exposed and the positive electrode of the electrode A laminate of two or more layers laminated such that negative electrodes are alternately laminated;
A frame material that houses the laminate and has a through hole for leading out a terminal electrode connected to the lead electrode to the outside;
A lid for sealing the upper surface of the frame member;
A chip-type energy device comprising: a sealing portion that seals the lower surface of the frame member and the through-hole and causes the laminated portion of the laminated body to contain an electrolyte.   The chip-type energy device according to claim 1, wherein the through-hole also serves as an injection hole for injecting an electrolytic solution containing the electrolyte.   The chip-type energy device according to claim 2, wherein at least a gap for allowing the electrolytic solution to pass is provided between the through hole and the terminal electrode passing through the through hole.   2. The depression according to claim 1, wherein a depression is formed in the lid by pressing the upper surface of the lid and the lower surface of the sealing portion so as to dent the lid inside the frame member. Chip type energy device.   The chip-type energy device according to claim 4, wherein the laminated body in the frame member is pressed down by the lid that is recessed in a concave shape.   6. The chip type energy device according to claim 4, wherein the lid is formed of a metal plate made of Al.   The electrode is formed by applying an active material to a part of the upper surface of the metal sheet and cutting it into a strip shape, and using the portion of the cut metal sheet to which the active material is applied as an active material electrode, The chip-type energy device according to claim 1, wherein a portion where the active material is not applied is used as the extraction electrode. 2. The chip-type energy device according to claim 1, wherein the stacked body is stacked on the top of the stacked body so that the separator is stacked instead of the electrode. The chip-type energy device according to claim 1, wherein the lid is bonded and mounted on the upper surface of the frame member with a chemical-resistant ceramic adhesive. The chip-type energy device according to claim 1, wherein the sealing portion has a lower surface of the frame member bonded and mounted with a chemical-resistant ceramic adhesive. The chip-type energy device according to claim 1, wherein an exterior of the chip-type energy device is covered with a resin mold. The chip-type energy device according to claim 2, wherein the resin mold is covered with the resin mold so that a predetermined space is formed between the resin mold and the concave portion of the lid recessed inward. While the separator is interposed in the active material electrode part of the electrode in which the positive and negative active material electrodes and the positive and negative lead electrodes are integrally formed, the lead electrode part is exposed and the positive electrode of the electrode A laminate of two or more layers laminated such that negative electrodes are alternately laminated;
  A stage on which the stacked body is mounted, wherein a terminal electrode connected to the extraction electrode is extracted to the outside, and a through hole serving as an injection hole for injecting an electrolyte solution containing the electrolyte is formed;
  A frame member that houses the laminated body placed on the table;
  A lid for sealing the upper surface of the frame member;
  A chip-type energy device comprising: The chip mold according to claim 13, wherein a concave portion is formed in the lid by pressing the upper surface of the lid and the lower surface of the base so as to sandwich the lid inside the frame member. Energy device. The chip-type energy device according to claim 13 or 14, wherein an exterior of the chip-type energy device is covered with a resin mold. The chip-type energy device according to claim 15, wherein the chip-type energy device is covered with the resin mold so that a predetermined space portion is formed between the resin mold and the concave portion of the lid recessed inward. The chip-type energy device according to claim 13, wherein the terminal electrode is pulled out from the through hole in a parallel direction from substantially the same height as the structure.

Images