JP5653187B2 - Duplexer - Google Patents

Description

  The present invention relates to a duplexer.

  Mobile communication terminals represented by mobile phones are widely used. In recent years, terminals have become multiband, and terminals are also required to be downsized. For this reason, downsizing and the like used in terminals are also strongly required. However, when the duplexer is downsized, the isolation between the transmission terminal and the reception terminal may deteriorate. Therefore, the duplexer is required to achieve both miniaturization and good isolation.

  Patent Document 1 discloses a technique including a partition ground pattern between wirings. In Patent Document 2 and Patent Document 3, a SAW (Surface Acoustic Wave) chip is flip-chip mounted on an insulating substrate, and the SAW chip is sealed with an annular electrode formed on the insulating substrate. It is disclosed.

JP 2006-180192 A JP 2006-80921 A JP 2006-66978 A

  In the technique described in Patent Document 1, since the distance between the wiring and the partition ground pattern is increased, there is a possibility that the isolation between the transmission terminal and the reception terminal is insufficiently secured. In the technique described in Patent Document 2 and the technique described in Patent Document 3, isolation may be deteriorated by providing the annular electrode. In view of the above problems, an object of the present invention is to provide a duplexer capable of obtaining high isolation.

The present invention includes a transmission filter and a reception filter on an upper surface, an insulating substrate having a foot pad layer electrically connected to each of the transmission filter and the reception filter on a lower surface, and the transmission substrate provided on the upper surface. A transmission pad electrically connected to the filter; a reception pad provided on the upper surface and electrically connected to the reception filter; and a transmission pad and the reception pad provided on the upper surface. The annular electrode is provided in a region along a short path of the path connecting the transmitting pad and the receiving pad of the annular electrode, the grounding foot pad included in the foot pad layer, and the annular electrode. If, anda via wiring for connecting the ground to the foot pad and electrically, the via interconnection and connection areas of the annular electrode, the bi of the annular electrode Wiring than regions other than the connected region, Ru demultiplexer der, wherein the wider. According to this configuration, high isolation can be obtained more effectively.

The present invention includes an upper conductive layer on the upper surface, a foot pad layer electrically connected to each of the transmission filter and the reception filter on the lower surface, and an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface. A transmission pad included in the upper conductor layer and electrically connected to the transmission filter; a reception pad included in the upper conductor layer and electrically connected to the reception filter; and the upper conductor. An annular electrode that is included in a layer and surrounds the transmitting pad and the receiving pad, and the upper conductor layer and the foot pad layer include a plating layer formed by electrolytic plating,
Each is provided inside the insulating substrate and extends to an end portion of the insulating substrate, and is electrically connected to the upper conductor layer and the foot pad layer to supply power for the electrolytic plating. A plurality of power supply lines used, of the plurality of power supply lines, electrically connected to the transmission pad or the reception pad, and the transmission electrode and the reception pad of the annular electrode; feed line that overlaps a region extending along the short path of the path connecting the Ru duplexer der, which is a one. According to this configuration, high isolation can be obtained more effectively.

The present invention includes an upper conductive layer on the upper surface, a foot pad layer on the lower surface, an internal conductive layer inside, an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface, and the upper conductive layer. A transmission pad electrically connected to the transmission filter, a reception pad included in the upper conductor layer and electrically connected to the reception filter, and the transmission pad and the reception pad . and signal pads is at least one, the included in the upper conductor layer, and an annular electrode surrounding the transmission pad and the receiving pad, included in the footpad layer, through the signal pad, the transmitting a filter and at least one electrically connected to the signal foot pad is of the reception filter, a ground foot pad included in the footpad layer, the inner conductor layer Rarely, a wiring electrically connected to the footpad for the signal pads and the signal, the annular electrode, provided in a region along the short path of the route connecting between the transmission pad and the receiving pad The annular electrode and a via wiring electrically connected to the grounding foot pad, and the wiring is a region closest to the wiring of the annular electrode when viewed from the top surface of the insulating substrate. parallel is rather than the via wiring and connection areas of the annular electrode, than said region other than the via wiring and connection regions where the annular electrode is the demultiplexer, wherein the wider . According to the present invention, high isolation can be obtained.

The present invention includes an upper conductive layer on the upper surface, a foot pad layer on the lower surface, an internal conductive layer inside, an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface, and the upper conductive layer. A transmission pad electrically connected to the transmission filter, a reception pad included in the upper conductor layer and electrically connected to the reception filter, and the transmission pad and the reception pad . and signal pads is at least one, the included in the upper conductor layer, and an annular electrode surrounding the transmission pad and the receiving pad, included in the footpad layer, through the signal pad, the transmitting a filter and at least one electrically connected to the signal foot pad is of the reception filter, a ground foot pad included in the footpad layer, the inner conductor layer Rarely, a wiring electrically connected to the footpad for the signal pads and the signal, the annular electrode, provided in a region along the short path of the route connecting between the transmission pad and the receiving pad The annular electrode and via wiring electrically connected to the grounding foot pad, and the thickness of the insulating substrate between the inner conductor layer and the upper surface is the inner conductor layer the much larger than the thickness of the insulating substrate between the said lower surface, the via interconnection and connection areas of the annular electrode, than the region other than the via wiring and connected areas of the annular electrode, the width Is a demultiplexer characterized by its wide . According to the present invention, high isolation can be obtained.

The present invention includes an insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, a first inner conductor layer and a second inner conductor layer are provided therein, and a transmission filter and a reception filter are mounted on the upper surface. A transmission pad included in the upper conductor layer and electrically connected to the transmission filter; a reception pad included in the upper conductor layer and electrically connected to the reception filter; A signal pad that is at least one of a credit pad and the receiving pad, an annular electrode that is included in the upper conductor layer and surrounds the transmitting pad and the receiving pad, and is included in the foot pad layer, and the signal A signal foot pad that is electrically connected to at least one of the transmission filter and the reception filter via a pad, and a grounding foot pad included in the foot pad layer. Included in the first internal conductor layer, and electrically connected to the signal pad and the signal foot pad, and included in the second internal conductor layer, the signal pad and A second wiring electrically connected to the signal foot pad; and the annular electrode provided in a region along a short path of paths connecting the transmitting pad and the receiving pad; A via wiring electrically connected to the grounding foot pad, and the longer one of the first wiring and the second wiring among the first inner conductor layer and the second inner conductor layer. The thickness of the insulating substrate between the inner conductor layer including the other wiring and the upper surface is larger than the thickness of the insulating substrate between the inner conductor layer and the lower surface, and the annular electrode The area connected to the via wiring Than the via wiring and a region other than the connected region of the annular electrode, Ru demultiplexer der, wherein the wider. According to this configuration, high isolation can be obtained more effectively.

The present invention includes an upper conductive layer on the upper surface, a foot pad layer on the lower surface, an internal conductive layer inside, an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface, and the upper conductive layer. A transmission pad electrically connected to the transmission filter, a reception pad included in the upper conductor layer and electrically connected to the reception filter, and the transmission pad and the reception pad . and signal pads is at least one, the included in the upper conductor layer, and an annular electrode surrounding the transmission pad and the receiving pad, included in the footpad layer, through the signal pad, the transmitting a filter and at least one electrically connected to the signal foot pad is of the reception filter, a ground foot pad included in the footpad layer, the inner conductor layer Rarely, a wiring electrically connected to the footpad for the signal pads and the signal, the annular electrode, provided in a region along the short path of the route connecting between the transmission pad and the receiving pad The annular electrode and a via wiring electrically connected to the grounding foot pad, and the wiring does not overlap the annular electrode when viewed from the upper surface of the insulating substrate, and the annular electrode The duplexer is characterized in that the region connected to the via wiring is wider than the region other than the region connected to the via wiring of the annular electrode . According to the present invention, high isolation can be obtained.

In the above configuration, another via wiring that is provided so as not to overlap the annular electrode when viewed from the top surface of the insulating substrate and is electrically connected to the wiring can be provided. According to this configuration, high isolation can be obtained more effectively.

In the above configuration, the signal pads is the receiving pad, the signal foot pad may be configured to be received foot pad.

In the above configuration, the receiving pad is a plurality of receiving pads,
The signal pad may be a reception pad that is close to the transmission pad among the plurality of reception pads. According to this configuration, high isolation can be obtained more effectively.

In the above configuration, the signal pads is the transmission pad,
The signal foot pad may be a transmission foot pad.

In the above configuration, the signal pads may include the transmission pad and the receiving pads, foot pads for a plurality of said signals may be configured to include a transmission foot pad and the foot pad receiving. According to this configuration, high isolation can be obtained more effectively.

  The said structure WHEREIN: The said upper conductor layer and the said foot pad layer can be set as the structure containing the plating layer formed by electroless plating. According to this configuration, high isolation can be obtained more effectively.

The present invention includes an upper conductive layer on the upper surface, a foot pad layer on the lower surface, an internal conductive layer inside, an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface, and the upper conductive layer. A signal pad electrically connected to at least one of the transmission filter and the reception filter, included in the upper conductor layer, an annular electrode surrounding the signal pad, and included in the foot pad layer, A signal foot pad electrically connected to at least one of the transmission filter and the reception filter via the signal pad; the signal pad and the signal foot pad included in the internal conductor layer; comprising a wiring electrically connected to the said upper conductor layer and the foot pad layer includes a plated layer formed by electroless plating, the upper conductor layer A transmission pad electrically connected to the transmission filter, and a reception pad electrically connected to the reception filter. The transmission pad is included in the inner conductor layer and extends to an end of the insulating substrate. A power supply line electrically connected to the wiring and used for power supply for performing the electrolytic plating; and the transmission pad of the annular electrode, electrically connected to the one wiring the feed line overlapping the region extending in the direction of the short path of the path connecting the said receiving pad has Ru duplexer der, which is a one. According to this configuration, high isolation can be obtained more effectively.

The present invention includes an upper conductive layer on the upper surface, a foot pad layer on the lower surface, an internal conductive layer inside, an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface, and the upper conductive layer. A signal pad electrically connected to at least one of the transmission filter and the reception filter, included in the upper conductor layer, an annular electrode surrounding the signal pad, and included in the foot pad layer, A signal foot pad electrically connected to at least one of the transmission filter and the reception filter via the signal pad; the signal pad and the signal foot pad included in the internal conductor layer; comprising a wiring electrically connected to the said upper conductor layer and the foot pad layer includes a plated layer formed by electroless plating, the upper conductor layer A transmission pad electrically connected to the transmission filter, and a reception pad electrically connected to the reception filter, each included in the inner conductor layer and an end of the insulating substrate A plurality of power supply lines that are used for power supply for performing the electrolytic plating, and are electrically connected to the transmission pad among the plurality of power supply lines. a feed line was, the the receiving pad and electrically connected to the feed line, in different sides of the insulating substrate, Ru duplexer der, characterized in that reaches the end of the insulating substrate . According to this configuration, high isolation can be obtained more effectively.

  The said structure WHEREIN: The said cyclic | annular electrode can be set as the structure provided along the outer periphery of the said insulating substrate. According to this configuration, the duplexer can be miniaturized.

  According to the present invention, it is possible to provide a duplexer capable of obtaining high isolation.

FIG. 1A is a diagram illustrating an RF block. FIG. 1B is a diagram illustrating an RF block with fewer filters. FIG. 2A is a block diagram illustrating a duplexer, and FIG. 2B is a cross-sectional view illustrating the duplexer. FIG. 3A is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer, and FIG. 3B illustrates the first inner conductor layer in the insulating substrate included in the duplexer. It is a top view illustrated. FIG. 4A is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer, and FIG. 4B illustrates the lower conductor layer of the insulating substrate included in the duplexer. It is a top view illustrated. FIG. 5 is a schematic diagram showing a magnetic field between a transmission pad and a reception pad. FIG. 6A is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer according to the first embodiment, and FIG. 6B is the insulation included in the duplexer according to the first embodiment. It is a top view which illustrates the 1st internal conductor layer in a conductive substrate. FIG. 7A and FIG. 7B are diagrams illustrating the calculation results of the isolation of the duplexer according to the first embodiment. FIG. 8 is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer according to the modification of the first embodiment. FIG. 9A is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer according to the second embodiment, and FIG. 9B is the insulation included in the duplexer according to the second embodiment. It is a top view which illustrates the 1st internal conductor layer in a conductive substrate. FIG. 10 is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer according to the second embodiment. FIGS. 11A and 11B are diagrams illustrating calculation results of isolation of the duplexer according to the second embodiment. FIG. 12 is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer according to the third embodiment. FIG. 13 is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer according to the fourth embodiment. FIG. 14A is a top view illustrating the first inner conductor layer in the insulating substrate included in the duplexer according to the fifth embodiment, and FIG. 14B is a duplexer according to the fifth embodiment. It is a top view which illustrates the 2nd inner conductor layer in an insulating substrate with which is provided. FIG. 15 is a cross-sectional view illustrating an insulating substrate included in the duplexer according to the fifth embodiment. FIG. 16A is a plan view illustrating the lower conductor layer of the insulating substrate included in the duplexer according to the sixth embodiment, and FIG. 16B is the insulation included in the duplexer according to the sixth embodiment. It is a top view which illustrates the upper conductor layer of a conductive substrate. FIG. 17 is a plan view illustrating an upper conductor layer of an insulating substrate having an annular electrode having another configuration.

  Embodiments of the present invention will be described with reference to the drawings.

  First, an apparatus using a duplexer and a duplexer will be described. As an example of the apparatus, a configuration of an RF (Radio Frequency) block will be described. FIG. 1A and FIG. 1B are diagrams illustrating RF blocks.

  As shown in FIG. 1A, the RF block 90 includes a duplexer 100, an antenna 104, amplifiers 106, 110, 116, 124, and 126, a reception interstage filter 108, mixers 112 and 120, a low-pass filter 114, and 122, a local oscillator 118, and a transmission interstage filter 128. The RF block is an RF block for a mobile phone, for example, and corresponds to, for example, a W-CDMA (Wideband Code Divided Multiple Access) Band1 system. The reception band of the W-CDMA Band1 system is located at 2110 to 2170 MHz, and the transmission band is located at 1920 to 1980 MHz.

  The duplexer 100 includes a reception filter F1 and a transmission filter F2, and is connected to the antenna 104. The pass band of the reception filter F1 is located in the same frequency band as the reception band of the WCDMA Band 1 system, for example. The pass band of the transmission filter F2 is located in the same frequency band as, for example, the transmission band of the WCDMA Band 1 method. The antenna 104 receives a signal. The signal received by the antenna 104 is input to the reception filter F1 provided in the duplexer 100. The reception filter F1 passes a signal having a frequency within the pass band of the reception filter F1 among the input signals, and outputs the signal to the amplifier 106. A signal whose frequency is outside the pass band of the reception filter F1 is suppressed. The amplifier 106 amplifies the signal and outputs it to the reception interstage filter 108. The reception interstage filter 108 has, for example, a balanced input terminal and a balanced output terminal. The reception interstage filter 108 performs signal filtering similarly to the reception filter F <b> 1, and outputs a signal to the amplifier 110. The reception interstage filter 108 outputs a signal to the amplifier 110 via two output terminals. The amplifier 110 amplifies the signal and outputs the signal from the two output terminals. Each of the two signals output from the amplifier 110 is input to each of the mixers 112 and 120. The local oscillator 118 outputs a local signal to the mixers 112 and 120. A phase difference between the local signal input to the mixer 112 and the local signal input to the mixer 120 is 90 °. Each of the mixers 112 and 120 mixes the signal input from the amplifier 110 and the local signal, and down-converts the frequency of the signal. The signal output from the mixer 112 is input to the amplifier 116 after high frequency components are removed by the low-pass filter 114. The signal output from the mixer 112 is input to the amplifier 124 after high frequency components are removed by the low-pass filter 122. The amplifier 116 and the amplifier 124 amplify and output the signal.

  The transmitter 130 generates a transmission signal and outputs it to the transmission interstage filter 128. The transmission interstage filter 128 has, for example, an unbalanced input terminal and an unbalanced output terminal. The transmission interstage filter 128 outputs the signal to the amplifier 126 after filtering the signal. The amplifier 126 amplifies the signal and outputs it to the duplexer 100. The transmission filter F2 included in the duplexer 100 has, for example, an unbalanced input terminal and an unbalanced output terminal. The transmission filter F2 passes a signal whose frequency is within the pass band of the transmission filter F2, and outputs the signal to the antenna 104. A signal whose frequency is outside the pass band of the transmission filter F2 is suppressed. The antenna 104 transmits a signal.

  In order to reduce the size of the RF block, it is preferable to simplify the configuration by reducing the number of parts. FIG. 1B is a diagram illustrating an RF block with fewer filters.

  As illustrated in FIG. 1B, the RF block 90a has a configuration in which the reception interstage filter 108 and the transmission interstage filter 128 are removed from the RF block 90 illustrated in FIG. The reception filter F1 included in the duplexer 100 has two balanced output terminals connected to the amplifier 106. The amplifier 106 amplifies the two input signals and outputs signals from the two output terminals. The signal output from the amplifier 106 is input to the amplifier 110 without passing through the inter-reception stage filter 108, and further amplified by the amplifier 110. The signal output from the transmitter 130 is input to the amplifier 126 without passing through the transmission interstage filter 128.

  As shown in FIG. 1B, the RF block can be downsized by removing the reception interstage filter 108 and the transmission interstage filter 128. However, if the number of filters is reduced, the degree of signal suppression may be degraded. For this reason, the duplexer 100 is required to have improved performance. Specifically, the reception filter F1 and the transmission filter F2 are required to improve the degree of suppression. In order to improve the degree of suppression, it is important to obtain high isolation between the reception terminal and the transmission terminal of the duplexer 100. In particular, when the reception filter F1 and the transmission filter F2 are formed as one package, the distance between the filters is reduced, so that the duplexer is reduced in size. However, the isolator is isolated between the transmission terminal and the reception terminal. Deterioration may occur.

  Next, a specific configuration of the duplexer will be described. FIG. 2A is a block diagram illustrating a duplexer, and FIG. 2B is a cross-sectional view illustrating the duplexer.

  As shown in FIG. 2A, the duplexer 100 includes a reception filter F1 and a transmission filter F2. One end of the reception filter F1 is connected to the antenna terminal Ant. One end of the transmission filter F2 is connected to the antenna terminal Ant. The reception filter F1 and the transmission filter F2 and the antenna terminal Ant are connected by a wiring L1. The other end of the reception filter F1 is connected to reception terminals Rx1 and Rx2 via wirings L2 and L3. The other end of the transmission filter F2 is connected to the transmission terminal Tx via the wiring L4. The receiving terminals Rx1 and Rx2 are balanced terminals and are connected to the amplifier 106 shown in FIG. The transmission terminal Tx is an unbalanced terminal and is connected to the amplifier 126 shown in FIG. The antenna terminal Ant is connected to the antenna 104. As will be described later, the wirings L1, L2, L3, and L4 are formed by pads, foot pads, wirings, and via wirings included in the insulating substrate.

As shown in FIG. 2B, the duplexer 100 includes the reception filter F1, the transmission filter F2, the insulating substrate 10, the lid 12, the sealing portion 14, the upper conductor layer 20, the first inner conductor layer 22, the first 2 includes an inner conductor layer 24, a foot pad layer 26, and a via wiring 28. The lid 12 is made of a metal such as Kovar. The sealing portion 14 is made of solder such as Sn—Pb. The insulating substrate 10 is formed by laminating insulating layers such as three ceramic layers such as a first layer 10-1, a second layer 10-2, and a third layer 10-3. It is. Each layer, for example made of a ceramic such as aluminum oxide _(Al 2 _{O 3).}

  An upper conductor layer 20 is provided on the upper surface of the first layer 10-1. A first internal conductor layer 22 is provided between the first layer 10-1 and the second layer 10-2. A second inner conductor layer 24 is provided between the second layer 10-2 and the third layer 10-3. A foot pad layer 26 is provided on the lower surface of the third layer 10-3. As described above, the upper conductor layer 20 is provided on the upper surface of the insulating substrate 10, the first inner conductor layer 22 and the second inner conductor layer are provided therein, and the foot pad layer 26 is provided on the lower surface. Each layer is electrically connected by a via wiring 28 extending in the thickness direction of the insulating substrate 10 (vertical direction in the figure). The first inner conductor layer 22, the second inner conductor layer 24, and the via wiring 28 are made of metal such as silver (Ag), copper (Cu), or tungsten (W), for example. The upper conductor layer 20 and the foot pad layer 26 include a conductor layer made of a metal such as silver (Ag), copper (Cu), or tungsten (W), and gold (Au) formed on the metal layer. Or a plating layer made of a metal such as nickel (Ni). The conductor layer is formed by, for example, printing, and the plating layer is formed by, for example, electrolytic plating.

  The reception filter F1 and the transmission filter F2 are, for example, flip-chip mounted on the upper surface of the insulating substrate 10. The reception filter F1 and the transmission filter F2 are electrically connected to the upper conductor layer 20 by bumps made of metal such as gold or solder. The reception filter F1 and the transmission filter F2 are sealed by the lid 12 and the sealing unit 14. Specifically, a lid 12 is provided on the reception filter F <b> 1 and the transmission filter F <b> 2, and a sealing portion 14 is provided between the insulating substrate 10 and the lid 12. The upper conductor layer 20 has an annular electrode 30 formed along the outer periphery of the insulating substrate 10. The sealing portion 14 joins the annular electrode 30 and the lid. Thereby, the reception filter F1 and the transmission filter F2 are sealed with high airtightness. Thus, the annular electrode 30 is used for sealing. At this time, the sealing unit 14 is not electrically connected to the reception filter F1 and the transmission filter F2.

  Next, each layer provided on the insulating substrate 10 will be described in detail. FIG. 3A is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer, and FIG. 3B illustrates the first inner conductor layer in the insulating substrate included in the duplexer. It is a top view illustrated. FIG. 4A is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer, and FIG. 4B illustrates the lower conductor layer of the insulating substrate included in the duplexer. It is a top view illustrated. The grid diagonal lines in the figure represent the via wiring 28 extending in the depth direction of the drawing.

  As shown in FIG. 3A, the upper conductor layer 20 is provided on the upper surface of the first layer 10-1 of the insulating substrate 10. The upper conductor layer 20 includes an annular electrode 30, receiving pads 32 a and 32 b, a transmitting pad 34 (signal pad), ground pads 36 a, 36 b and 36 c, and an antenna pad 38. A broken line in FIG. 3A indicates a region where the reception filter F1 is mounted, and a dotted line indicates a region where the transmission filter F2 is mounted. The reception filter F1 is electrically connected to the two reception pads 32a and 32b, the ground pad 36a, and the antenna pad 38. The receiving pads 32a and 32b function as balanced terminals. The transmission filter F2 is electrically connected to the transmission pad 34, the ground pads 36b and 36c, and the antenna pad 38. The antenna pad 38 is shared by the reception filter F1 and the transmission filter F2. The width (line width) of the annular electrode 30 is constant at W1. The annular electrode 30 is provided along the outer periphery of the insulating substrate 10. In other words, the annular electrode 30 is in contact with the end of the insulating substrate 10. The annular electrode 30 surrounds the receiving pads 32a and 32b, the transmitting pad 34, the grounding pads 36a, 36b and 36c, and the antenna pad 38. The annular electrode 30 is in contact with the sealing portion 14 (see FIG. 2B). The upper conductor layer 20 is electrically connected to the first inner conductor layer 22 through the via wiring 28 that penetrates the first layer 10-1.

  As shown in FIG. 3B, the first inner conductor layer 22 is provided on the upper surface of the second layer 10-2. The first inner conductor layer 22 includes reception wirings 40a and 40b, transmission wiring 42, grounding wirings 44a, 44b and 44c, and antenna wiring 46. The receiving pad 32a included in the upper conductor layer 20 shown in FIG. 3A is connected to the first inner conductor layer 22 shown in FIG. 3B via the via wiring 28 penetrating the first layer 10-1. Are electrically connected to the receiving wiring 40a. The receiving pad 32b is electrically connected to the receiving wiring 40b through the via wiring 28. The transmission pad 34 is electrically connected to the transmission wiring 42 via the via wiring 28. The annular electrode 30 is electrically connected to the ground wirings 44 a and 44 c through the via wiring 28. The grounding pad 36 a is electrically connected to the grounding wiring 44 a through the via wiring 28. The ground pads 36 b and 36 c are electrically connected to the ground wiring 44 b through the via wiring 28. The antenna pad 38 is electrically connected to the antenna wiring 46 through the via wiring 28. The first inner conductor layer 22 is electrically connected to the second inner conductor layer 24 through a via wiring 28 that penetrates the second layer 10-2. A broken line in the figure indicates a region where the annular electrode 30 overlaps when the insulating substrate 10 is viewed from above. The relationship between each wiring and via wiring and the annular electrode 30 will be described in the second embodiment. Further, the regions 30c and 30d will be described in the second embodiment.

  As shown in FIG. 4A, the second inner conductor layer 24 is provided on the upper surface of the third layer 10-3. The second inner conductor layer 24 includes a feeder line 29, receiving wirings 50a and 50b, transmitting wiring 52, grounding wirings 54a, 54b, 54c, 54d and 54e, and antenna wiring 56. The receiving wiring 40a included in the first inner conductor layer 22 shown in FIG. 3B is connected to the receiving wiring 50a shown in FIG. 4A via the via wiring 28 penetrating the second layer 10-2. And are electrically connected. The reception wiring 40b is electrically connected to the reception wiring 50b through the via wiring 28b among the plurality of via wirings 28. The transmission wiring 42 is electrically connected to the transmission wiring 52 via the via wiring 28 c among the plurality of via wirings 28. The ground wiring 44 a is electrically connected to the ground wiring 54 a through the via wiring 28. The ground wiring 44 b is electrically connected to the ground wiring 54 b through the via wiring 28. The ground wiring 44 c is electrically connected to the ground wiring 54 c through the via wiring 28. The antenna wiring 46 is electrically connected to the antenna wiring 56 through the via wiring 28.

  In addition, each of the receiving wirings 50a and 50b, the transmitting wiring 52, the grounding wirings 54a, 54c, 54d and 54e, and the antenna wiring 56 is connected to the feeder line 29 extending to the end of the insulating substrate 10 and the electric wiring 29. Connected. The feeder line 29 is made of, for example, the same metal layer as the reception wirings 50a and 50b, the transmission wiring 52, the grounding wirings 54a, 54c, 54d and 54e, the antenna wiring 56, and the like. The power supply line 29 is used for supplying power in an electrolytic plating process in which a plating layer is formed on the upper conductor layer 20 and the foot pad layer 26. Of the plurality of power supply lines 29, the power supply line 29a is connected to the reception wiring 50a, the power supply line 29b is connected to the reception wiring 50b, and the power supply line is connected to the transmission wiring 52. 29c. The region 30b of the annular electrode 30 and the power supply lines 29b and 29c shown in the drawing will be described in the second embodiment. Sides 10a and 10b will be described in the third embodiment. Here, the description of the configuration of the insulating substrate 10 will be continued with reference to FIG. The second inner conductor layer 24 is electrically connected to the foot pad layer 26 via a via wiring 28 that penetrates the third layer 10-3.

  As shown in FIG. 4B, a foot pad layer 26 is provided on the lower surface of the third layer 10-3. In FIG. 4B, the third layer 10-3 is seen through, and the lower surface of the third layer 10-3 is illustrated. The foot pad layer 26 includes reception foot pads 60a and 60b, a transmission foot pad 62 (signal foot pad), grounding foot pads 64a, 64b, 64c, 64d and 64e, and an antenna foot pad 66. The receiving wiring 50a provided in the second inner conductor layer 24 shown in FIG. 4A is provided via the via wiring 28 penetrating the third layer 10-3, and the foot pad layer 26 shown in FIG. 4B. Is electrically connected to a receiving foot pad 60a. The reception wiring 50b is electrically connected to the reception foot pad 60b through the via wiring 28b among the plurality of via wirings 28. The transmission wiring 52 is electrically connected to the transmission foot pad 62 via the via wiring 28 c among the plurality of via wirings 28. The ground wiring 54 a is electrically connected to the ground foot pads 64 a and 64 b through the via wiring 28. The grounding wiring 54 b is electrically connected to the grounding foot pad 64 a through the via wiring 28. The ground wiring 54 c is electrically connected to the ground foot pad 64 c through the via wiring 28. The grounding wiring 54d is electrically connected to the grounding foot pad 64d through the via wiring 28. The ground wiring 54 e is electrically connected to the ground foot pad 64 e through the via wiring 28. The antenna wiring 56 is electrically connected to the antenna foot pad 66 through the via wiring 28.

  The reception foot pads 60a and 60b shown in FIG. 4B correspond to the reception terminals Rx1 and Rx2 shown in FIG. The transmission foot pad 62 corresponds to the transmission terminal Tx. The antenna foot pad 66 corresponds to the antenna terminal Ant. The antenna pad 38, the via wiring 28, and the antenna wirings 46 and 56 correspond to the wiring L1 shown in FIG. The receiving pad 32a, the via wiring 28, and the receiving wirings 40a and 50a correspond to the wiring L2 shown in FIG. The receiving pad 32b, the via wiring 28b, and the receiving wirings 40b and 50b correspond to the wiring L3 shown in FIG. The transmission pad 34, the via wiring 28c, and the transmission wirings 42 and 52 that connect the transmission filter F2 and the transmission foot pad 62 correspond to the wiring L4 shown in FIG.

  As shown in FIG. 2B to FIG. 4B, the reception filter F1 and the transmission filter F2 are flip-chip mounted on the same insulating substrate 10 to form one package. Can be realized. In addition, by forming a conductor layer inside the insulating substrate 10, an increase in the size of the insulating substrate 10 is suppressed, and the duplexer can be reduced in size. Further, by forming the annular electrode 30 along the outer periphery of the insulating substrate 10 and joining the sealing portion 14 to the annular electrode 30, sealing with high airtightness can be performed. However, since the reception filter F1 and the transmission filter F2 are mounted on the same insulating substrate 10, the distance between the reception filter F1 and the transmission filter F2 is reduced. In addition, many pads, foot pads, wirings, and via wirings are provided in one insulating substrate. For this reason, the distance between pads and the distance between foot pads are reduced. Therefore, the possibility that the isolation between the transmission terminal Tx and the reception terminal Rx deteriorates increases. Further, as will be described later, the provision of the annular electrode 30 makes it particularly easy for the isolation to deteriorate.

  The inventor conducted an experiment to measure the magnetic field generated in the insulating substrate 10 in order to verify the cause of the deterioration of isolation. In the experiment, the insulating substrate 10 on which the reception filter F1 and the transmission filter F2 are not mounted is used as a sample. The insulating substrate 10 was placed in an experimental apparatus, a signal having a frequency of 1920 MHz and a power of 0 dBm was input to the transmission foot pad 62, and a magnetic field generated on the upper surface of the insulating substrate 10 was measured. FIG. 5 is a schematic diagram showing a magnetic field generated on the upper surface of the insulating substrate. Solid lines in the figure are lines representing magnetic fields having the same magnitude. A broken line in the figure is a line indicating a region where the insulating substrate 10 is disposed. The dotted circles indicate the positions of the transmission foot pad 62 and the transmission pad 34 to which signals are input.

  As indicated by the solid line in FIG. 5, the magnetic field strengths were -99.0 dBm, -97.0 dBm, -95.7 dBm, and -93.0 dBm from the side closer to the transmission pad 34. Thus, a magnetic field was generated from the lower right region of the insulating substrate 10 where the transmission pad 34 is located. The magnetic field was stronger as it was closer to the transmission pad 34. In particular, a strong magnetic field was observed in the direction along the outer periphery of the insulating substrate 10. Consider the cause of the magnetic field.

  A signal input to the transmission foot pad 62 (see FIG. 4B) provided on the lower surface of the insulating substrate 10 is transmitted to the upper surface of the insulating substrate 10 via the via wiring 28 and the transmission wirings 42 and 52. To the transmission pad 34 (see FIG. 3A). One or both of electrostatic coupling and electromagnetic coupling occur between the signal reaching the transmission pad 34 and the annular electrode 30. As a result, a current flows through the annular electrode 30 (see arrow in FIG. 5). When a current flows through the annular electrode 30, a magnetic field is generated around the annular electrode 30. When a current flows through the annular electrode 30 extending in the left direction in FIG. 5, a current flows through the receiving pads 32a and 32b due to electrostatic coupling. In addition, when a current flows through the annular electrode 30, a magnetic field is generated even in a region near the receiving pads 32 a and 32 b (see FIG. 3A). At this time, current flows through the receiving pads 32a and 32b due to electromagnetic coupling. As a result, the isolation between the receiving pads 32a and 32b and the transmitting pad 34 deteriorates. As a result, the isolation between the reception foot pads 60a and 60b and the transmission foot pad 62 deteriorates. As shown in FIG. 5, the closer to the transmission pad 34, the stronger the magnetic field. Therefore, among the plurality of receiving pads 32a and 32b, the receiving pad 32b closer to the transmitting pad 34 is more susceptible to the influence of the magnetic field. Therefore, the isolation between the transmission foot pad 62 and the reception foot pad 60b is particularly likely to deteriorate.

  The first embodiment is an example in which via wiring is added to the annular electrode 30 in order to improve isolation. FIG. 6A is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer according to the first embodiment, and FIG. 6B is the insulation included in the duplexer according to the first embodiment. It is a top view which illustrates the 1st internal conductor layer in a conductive substrate. The description of the same configuration as that already described in FIGS. 3A to 4B is omitted.

  As shown in FIG. 6A, a via wiring 28a is connected to the annular electrode 30 of the first layer 10-1. The via wiring 28 a is provided in the region 30 a along the short path A (see the arrow in the drawing) of the ring electrode 30 that connects the reception pad 32 b and the transmission pad 34. The width W2 of the portion of the annular electrode 30 where the via wiring 28a is provided is larger than the width W1 of the portion of the annular electrode 30 where the via wiring 28a is not provided.

  As shown in FIG. 6B, the via wiring 28a penetrates the first layer 10-1, and is electrically connected to the ground wiring 44d included in the first internal conductor layer 22. The ground wiring 44d is electrically connected to the ground wiring 54e included in the second internal conductor layer 24 and the ground foot pad 64e included in the foot pad layer 26 via the via wiring 28a. That is, the annular electrode 30 is grounded via the via wiring 28a. As described above, the duplexer according to the first embodiment is shown in FIGS. 3A to 4B except that the via wiring 28a and the ground wiring 44d are added and the width of the annular electrode 30 is changed. The same configuration as that of the duplexer.

Next, a simulation for calculating the isolation of the duplexer according to the first embodiment will be described. In the simulation, as shown in FIG. 2A, a duplexer is connected to the antenna 104, and a signal is input from the transmission terminal Tx (corresponding to the transmission foot pad 62 in FIG. 4B). Signals output from each of the receiving terminals Rx1 and Rx2 (corresponding to the receiving foot pads 60a and 60b in FIG. 4B) were calculated. Using the duplexer having the insulating substrate 10 shown in FIGS. 3A to 4B as a comparative example, the calculation results were compared between Example 1 and the comparative example. As the reception filter F1, a filter in which a SAW resonator and a double mode coupled SAW filter (DMS: Double Mode SAW filter) are combined is used. A ladder-type SAW filter was used as the transmission filter F2. The size of the duplexer package was 2.0 × 1.6 mm, and the thickness was 0.55 mm. The pass band of the reception filter F1 is a reception band of the W-CDMA Band 1 method, and the pass band of the transmission filter F2 is a transmission band of the W-CDMA Band 1 method. Specific numerical values of the passband are shown below.
Pass band of the reception filter F1: 2110 to 2170 MHz
Pass band of transmission filter F2: 1920 to 1980 MHz

  FIG. 7A and FIG. 7B are diagrams illustrating the calculation results of the isolation of the duplexer according to the first embodiment. FIG. 7A is a diagram illustrating a calculation result of a signal output from the reception foot pad 60a, and FIG. 7B is a diagram illustrating a calculation result of a signal output from the reception foot pad 60b. The horizontal axis represents frequency, and the vertical axis represents attenuation. The attenuation amount represents the magnitude of a signal leaking from the transmission foot pad to the reception foot pad. Further, the solid line indicates the result of the duplexer according to the first embodiment, and the broken line indicates the result of the duplexer according to the comparative example.

  As shown in FIG. 7A, the signal was suppressed in Example 1 than in the comparative example. In particular, the signal was suppressed in the transmission band. The signal suppression indicates that the isolation between the transmission foot pad 62 and the reception foot pad 60a is improved. In the frequency band of 1920-1980 MHz, which is the pass band of the transmission filter F2, the signal was greatly suppressed.

  As shown in FIG. 7B, the isolation between the transmission foot pad 62 and the reception foot pad 60b is improved in the first embodiment than in the comparative example. In addition, as compared with the result of FIG. 7A, the signal suppression is increased over a wider frequency band.

  According to the first embodiment, via wiring electrically connected to the grounding foot pad 64e in the region 30a along the short path A among the paths connecting the receiving pad 32b and the transmitting pad 34 of the annular electrode 30. 28a is provided. For this reason, the current flowing through the annular electrode 30 due to the transmission signal flows into the grounding foot pad 64e through the via wiring 28a. As a result, the current flowing through the annular electrode 30 is reduced, and the magnetic field caused by the current is also reduced. Accordingly, the magnetic field generated near the receiving pads 32a and 32b is also reduced. As described above, since the current flowing through the annular electrode 30 is reduced, electrostatic coupling and electromagnetic coupling between the current flowing through the annular electrode 30 and the receiving pads 32a and 32b are suppressed. As a result, high isolation can be obtained between the reception foot pads 60 a and 60 b and the transmission foot pad 62.

  As shown in FIG. 5, the closer to the transmission pad 34, the stronger the magnetic field. For this reason, the isolation between the transmission foot pad 62 and the reception foot pad 60b tends to deteriorate. As shown in FIG. 6A, in the first embodiment, the via wiring 28a is provided between the receiving pad 32b near the transmitting pad 34 and the transmitting pad 34 among the plurality of receiving pads 32a and 32b. Is provided. Since the current flowing through the annular electrode 30 flows through the via wiring 28a, the current reaching the vicinity of the receiving pad 32b is reduced. Therefore, the magnetic field generated near the reception pad 32b is reduced, and the isolation between the transmission foot pad 62 and the reception foot pad 60b is improved. The via wiring 28a added to the annular electrode 30 is not limited to one and may be two or more.

  The width W2 of the portion of the annular electrode 30 where the via wiring 28a is provided is larger than the width W1 of the portion of the annular electrode 30 where the via wiring 28a is not provided. In other words, even when the via wiring 28a is provided, it is not necessary to increase the width W1 of the portion where the via wiring 28a is not provided. For example, it can be the same as in the comparative example. For this reason, it is suppressed that the electric current which flows through the annular electrode 30 increases, and suppression of a magnetic field is also attained.

  The insulating substrate 10 is, for example, rectangular when viewed from above. In FIG. 3A, the receiving pads 32a and 32b are positioned at the lower left corner, the transmitting pad 34 is positioned at the lower right corner, and the antenna pad 38 is positioned near the upper side. However, the position of each pad can be changed. The insulating substrate 10 may have other shapes such as a square or a polygon other than a quadrangle.

  Next, a modification of the first embodiment will be described. FIG. 8 is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer according to the modification of the first embodiment. The description of the same configuration as that already described in FIGS. 6A and 6B is omitted.

  As shown in FIG. 8, via wiring 28 a electrically connected to the grounding foot pad is provided in a region 30 a along the short path among the paths connecting the reception pad 32 b and the transmission pad 34 of the annular electrode 30. Is provided. The width of the side where the via wiring 28a of the annular electrode 30 is provided is constant at W2. The width W2 is larger than the width W1 of the side where the via wiring 28a of the annular electrode 30 is not provided. According to the modification of the first embodiment, high isolation can be ensured as in the first embodiment. However, the width W2 of the side where the via wiring 28a of the annular electrode 30 is provided is larger than the width W1 of the other side. Therefore, the current flowing through the annular electrode 30 may increase. In order to suppress the current flowing through the annular electrode 302 and obtain high isolation more effectively, as shown in FIG. 6A, the width of the portion of the annular electrode 30 provided with the via wiring 28a is increased. It is preferable to do.

  Example 2 is an example in which the configuration of the conductor layer inside the insulating substrate 10 is changed. First, problems of the conductor layers shown in FIGS. 3A to 4B will be described.

  As shown in FIG. 3B, a part of the reception wiring 40b is parallel to the region 30b (see the arrow and the alternate long and short dash line in the drawing) closest to the reception wiring 40b of the annular electrode 30. As shown in FIG. 5, a magnetic field is generated in the vicinity of the annular electrode 30. When the receiving wiring 40b and the annular electrode 30 are parallel, a current easily flows through the receiving wiring 40b due to a magnetic field generated in the vicinity of the annular electrode 30. In this way, the current flowing through the annular electrode 30 is easily coupled to the receiving wiring 40b. A part of the transmission wiring 42 is parallel to the region 30c (see the arrow and the alternate long and short dash line in the drawing) of the annular electrode 30 closest to the transmission wiring 42. For this reason, the current flowing through the annular electrode 30 is likely to be coupled to the transmission wiring 42.

  When the insulating substrate 10 is viewed from above, a part of the reception wiring 40 b and a part of the transmission wiring 42 overlap the annular electrode 30. As shown in FIG. 5, the region closer to the annular electrode 30 has a stronger magnetic field. For this reason, the smaller the distance between the annular electrode 30 and the receiving wire 40b, the greater the influence of the magnetic field on the receiving wire 40b. In addition, electrostatic coupling is increased. The same applies to the transmission wiring 42. As described above, since the reception wiring 40b and the transmission wiring 42 have portions overlapping the annular electrode 30, they are easily coupled to the annular electrode 30 electromagnetically or electrostatically. Further, a part of the via wiring 28 b connected to the reception wiring 40 b and a part of the via wiring 28 c connected to the transmission wiring 40 overlap the annular electrode 30. For this reason, the electromagnetic coupling or the electrostatic coupling between the annular electrode 30 and the via wirings 28b and 28c is increased. As described above, the current flowing through the annular electrode 30 and each of the reception wiring 40b, the transmission wiring 42, and the via wirings 28b and 28c are easily coupled.

  As shown in FIG. 4A, when the insulating substrate 10 is viewed from above, a part of the reception wiring 50 b and a part of the transmission wiring 52 overlap the annular electrode 30. Further, a part of the via wiring 28 b connected to the reception wiring 50 b and a part of the via wiring 28 c connected to the transmission wiring 50 overlap the annular electrode 30. For this reason, the current flowing through the annular electrode 30 is easily coupled to each of the reception wiring 50b, the transmission wiring 52, and the via wirings 28b and 28c. As a result, isolation is degraded.

  The power supply lines 29a, 29b, and 29c shown in FIG. 4A are used for power supply during electroplating, and are connected to the reception pad 32b and the reception foot pad 60b or the transmission pad 34. It is not a wiring connecting the trust foot pad 62. That is, the power supply lines 29a, 29b, and 29c are not wirings for transmitting reception signals or transmission signals. For this reason, the influence of the power supply lines 29a, 29b, and 29c on the isolation is smaller than the influence of the reception wiring 50b and the transmission wiring 52 on the isolation. However, coupling may occur between the feeder lines, and isolation may deteriorate. Of the paths connecting the reception pad 32b and the transmission pad 34 of the insulating substrate 10, the area extending in the direction of the short path A is defined as an area 30d (see the arrow and the alternate long and short dash line in the figure). That is, the region 30d is a side of the annular electrode 30 and to which the region 30a shown in FIG. 6A belongs. Among the plurality of power supply lines 29, two power supply lines 29 b connected to the reception wiring 50 b and power supply line 29 c connected to the transmission wiring 52 overlap the region 30 d of the annular electrode 30. As shown in FIG. 5, when a transmission signal is input, the transmission wiring 52 and the annular electrode 30 are electromagnetically or electrostatically coupled, so that a current flows through the annular electrode 30 and a magnetic field is generated in the vicinity of the annular electrode 30. Occur. When the feeder line 29c overlaps the annular electrode 30 as shown in FIG. 4A, the distance between the feeder line 29c and the annular electrode 30 is reduced. For this reason, the signal input to the transmission foot pad 64 is more easily coupled to the annular electrode 30. The current generated by the coupling flows through the region 30d of the annular electrode 30 and generates a magnetic field near another feeder line 29b. When a magnetic field is generated, a current flows through the feeder line 29b. Thus, when the feeder lines 29 b and 29 c overlap with the annular electrode 30, the coupling between the transmission foot pad 62 and the reception foot pad 60 b is further increased through the annular electrode 30. As a result, isolation may deteriorate.

  In Example 2, the configuration of each of the first inner conductor layer 22 and the second inner conductor layer 24 is changed. FIG. 9A is a plan view illustrating the upper conductor layer of the insulating substrate included in the duplexer according to the second embodiment, and FIG. 9B is the insulation included in the duplexer according to the second embodiment. It is a top view which illustrates the 1st internal conductor layer in a conductive substrate. FIG. 10 is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer according to the second embodiment. The foot pad layer 26 is the same as that shown in FIG. 4B, for example. The description of the configuration already described in FIGS. 3A to 4B is omitted.

  As shown in FIG. 9A, the arrangement of the transmission pad 34 is changed as compared with the case of FIG. Except for the transmission pad 34, the upper conductor layer 20 has the same configuration as the example of FIG.

  As illustrated in FIG. 9B, the reception wiring 40 b is connected to the via wiring 28 b and does not have a portion extending in the planar direction of the insulating substrate 10. Thus, when the insulating substrate 10 is viewed from above, the receiving wiring 40 b is not parallel to the region 30 b of the annular electrode 30. Further, the reception wiring 40 b and the via wiring 28 b do not overlap with the annular electrode 30. The transmission wiring 42 has a portion extending in the left-right direction in the drawing. The region 30 c closest to the transmission wire 42 of the annular electrode 30 is located on the right side of the transmission wire 42. Therefore, the transmission wiring 42 is not parallel to the region 30 c of the annular electrode 30. Further, the transmission wiring 42 is connected to the via wiring 28c. When the insulating substrate 10 is viewed from above, the transmission wiring 42 and the via wiring 28 c do not overlap with the annular electrode 30.

  As shown in FIG. 10, the reception wiring 50b is connected to the via wiring 28d, and the transmission wiring 52 is connected to the via wiring 28e. The reception wiring 50b is not parallel to the region 30e closest to the reception wiring 50b of the annular electrode 30 (see the arrow and the alternate long and short dash line in the drawing). When the insulating substrate 10 is viewed from above, the receiving wiring 50 b does not overlap the annular electrode 30. Further, the transmission wiring 52 is not parallel to the region 30 f (see the arrow and the alternate long and short dash line in the drawing) closest to the transmission wiring 52 of the annular electrode 30. When the insulating substrate 10 is viewed from above, the transmission wiring 52 does not overlap the annular electrode 30. The via wirings 28 d and 28 e do not overlap with the annular electrode 30. On the other hand, the power supply line 29 b connected to the reception wiring 50 b overlaps the annular electrode 30. Feed lines 29 c and 29 d connected to the transmission wiring 52 overlap the annular electrode 30. However, as described above, the power supply lines 29b, 29c, and 29d are used for power supply during electrolytic plating, and the reception pad 32b and the reception foot pad 60b, or the transmission pad 34 and the transmission foot pad. It is not a wiring for connecting 62. That is, the power supply lines 29b, 29c, and 29d are not wirings for flowing reception signals or transmission signals. For this reason, the influence on the isolation of the feeder is small.

  The power supply line 29 b and the power supply line 29 c overlap with the region 30 d of the annular electrode 30. Thus, the power supply line connected to the reception wiring 50b and overlapping the region 30d is one power supply line 29b. Further, the power supply line connected to the transmission wiring 42 and overlapping the region 30d is one power supply line 29c. The power supply line 29d is connected to the transmission wiring 42 but does not overlap the region 30d. The two power supply lines 29a are connected to the reception wiring 40a, but do not overlap with the region 30d. As shown in FIGS. 9A to 10, the duplexer according to the second embodiment has the same configuration as the duplexer according to the first embodiment except that the arrangement of the wiring and the via wiring is changed.

  Next, a simulation for calculating the isolation of the duplexer according to the second embodiment will be described. In the simulation, when receiving a signal from the transmission terminal Tx (corresponding to the transmission foot pad 62 in FIG. 4B), the reception terminals Rx1 and Rx2 (corresponding to the reception foot pads 60a and 60b in FIG. 4B). ) The signal output from each was calculated. As the reception filter F1, a filter combining a SAW resonator and a double mode coupled SAW filter was used. A ladder-type SAW filter was used as the transmission filter F2. The size of the duplexer package was 2.0 × 1.6 mm, and the thickness was 0.55 mm. The pass band of the reception filter F1 is a reception band of the W-CDMA Band 1 method, and the pass band of the transmission filter F2 is a transmission band of the W-CDMA Band 1 method. The calculation results were compared between Example 1 and Example 2. As described above, the first inner conductor layer 22 and the second inner conductor layer 24 in the first embodiment are the same as those shown in FIGS. 3B and 4A except that the via wiring 28a and the ground wiring 44d are added. It is the same as shown in.

  FIGS. 11A and 11B are diagrams illustrating calculation results of isolation of the duplexer according to the second embodiment. FIG. 11A is a diagram illustrating a calculation result of a signal output from the reception foot pad 60a, and FIG. 11B is a diagram illustrating a calculation result of a signal output from the reception foot pad 60b. The horizontal axis represents frequency, and the vertical axis represents attenuation. Further, the solid line indicates the result of the duplexer according to the second embodiment, and the broken line indicates the result of the duplexer according to the first embodiment.

  As shown in FIG. 11A, the signal is suppressed in the second embodiment than in the first embodiment. The signal suppression indicates that the isolation between the transmission foot pad 62 and the reception foot pad 60a is improved.

  As shown in FIG. 11B, the signal was suppressed in the second embodiment than in the first embodiment. In particular, in the frequency band of 1920 to 1980 MHz, which is the reception band of the W-CDMA Band 1 system, the signal is greatly suppressed. In addition, as compared with the result of FIG. 11A, the suppression of the signal is increased over a wider frequency band.

  According to the second embodiment, each of the four wirings of the reception wirings 40 b and 50 b and the transmission wirings 42 and 52 is not parallel to the region closest to each of the four wirings of the annular electrode 30. For this reason, current due to the magnetic field generated in the vicinity of the annular electrode 30 is unlikely to flow through each of the reception wirings 40b and 50b and the transmission wirings 42 and 52. Therefore, the coupling between the current flowing through the annular electrode 30 and each of the receiving wires 40b and 50b and the transmitting wires 42 and 52 is suppressed. As a result, high isolation can be obtained between the reception foot pads 60 a and 60 b and the transmission foot pad 62.

  As shown in FIGS. 9B and 10, each of the reception wirings 40 b and 50 b and the transmission wirings 42 and 52 does not overlap the annular electrode 30. That is, the distance between each of the reception wirings 40b and 50b and the transmission wirings 42 and 52 and the annular electrode 30 is increased. For this reason, each of the reception wirings 40b and 50b and the transmission wirings 42 and 52 is not easily affected by the magnetic field. Therefore, the coupling between the current flowing through the annular electrode 30 and each of the reception wirings 40b and 50b and the transmission wirings 42 and 52 is suppressed, and high isolation can be obtained. Further, when the insulating substrate 10 is viewed from above, the via wirings 28 b, 28 c, 28 d and 28 e do not overlap with the annular electrode 30. Therefore, the coupling between the current flowing through the annular electrode 30 and each of the via wirings 28b, 28c, 28d and 28e is suppressed, and high isolation can be obtained.

  As described above, the power supply lines 29b, 29c, and 29d have less influence on the isolation than the reception wirings 40b and 50b and the transmission wirings 42 and 52. However, the power supply line 29 may be coupled to the current flowing through the annular electrode 30 to affect the isolation. In the second embodiment, as shown in FIG. 10, the power supply line connected to the reception wiring 50b and overlapping the region 30d is one power supply line 29b. The feed line connected to the transmission wiring 52 and overlapping the region 30d is one of the feed lines 29c. In other words, the feed line connected to the reception pad 32b and overlapping the region 30d is one of the feed lines 29b. In other words, the feed line connected to the transmission pad 34 and overlapping the region 30d is one of the feed lines 29c. Therefore, for example, as shown in FIG. 4A, the coupling between the power supply line 29b and the power supply line 29c can be suppressed as compared with the case where the two power supply lines 29b and the power supply line 29c overlap the region 30d. As a result, high isolation can be obtained more effectively.

  As described with reference to FIG. 5, the closer to the transmission pad 34, the stronger the magnetic field. Therefore, the receiving pad 32b closer to the transmitting pad 34 is more susceptible to the influence of the magnetic field. In the second embodiment, the arrangement of the reception wirings 40b and 50b, the via wirings 28b and 28d, and the power supply line 29c connected to the reception pad 32b is changed. As a result, isolation can be improved more effectively.

  Note that each of the reception wirings 40 a and 50 a connected to the reception pad 32 a may not be parallel to the region closest to each wiring of the annular electrode 30. Further, the reception wirings 40 a and 50 a may not overlap with the annular electrode 30. Furthermore, the via wiring 28 connected to the receiving wirings 40 a and 50 a may not overlap the annular electrode 30. As described above, the arrangement of the reception wirings 40a and 50a connected to the reception pad 32a and the via wiring 28 may be changed. Also, the receiving wirings 40a and 50a, the via wirings 28 connected to the receiving wirings 40a and 50a, the respective arrangements are changed, and the receiving wirings 40b and 50b and the via wirings 28b and 28d are arranged respectively. It may not be changed. That is, the arrangement of at least one of the reception wiring and via wiring connected to the reception pad 32a and the reception wiring and via wiring connected to the reception pad 32b may be changed. However, in order to effectively obtain high isolation, it is preferable to change the arrangement of the reception wiring and the via wiring connected to the reception pad 32b close to the transmission pad 34. Further, the number of reception pads may be one, and in this case, the arrangement of reception wirings and via wirings connected to one reception pad may be changed.

  Further, the arrangement of the reception wirings 40b and 50b and the via wirings 28b and 28d may be changed, and the arrangement of the transmission wirings 42 and 52 and the via wirings 28c and 28e may not be changed. Further, the arrangement of the transmission wirings 42 and 52 and the via wirings 28c and 28e may be changed, and the arrangement of the reception wirings 40b and 50b and the via wirings 28b and 28d may not be changed. As described above, the wiring (reception wiring or transmission wiring) electrically connected to at least one of the reception pads 32a and 32b and the transmission pad 34 is a region closest to the wiring of the annular electrode 30. It doesn't have to be parallel. The wiring electrically connected to at least one of the reception pads 32 a and 32 b and the transmission pad 34 may not overlap with the annular electrode 30. Furthermore, the via wiring electrically connected to at least one of the receiving pads 32 a and 32 b and the transmitting pad 34 may not overlap the annular electrode 30.

  One power supply line 29b connected to the reception wiring 50b may overlap the region 30d, and the power supply line 29c connected to the transmission wiring 52 may not overlap the region 30d. Further, the power supply line 29c may overlap with the region 30d, and the power supply line 29b may not overlap with the region 30d. As described above, at least one of the one power supply line 29b connected to the reception wiring 50b and the one power supply line 29c connected to the transmission wiring 52 overlaps the region 30d, and the other does not overlap the region 30d. It is good. In other words, it is only necessary to provide one power supply line that is electrically connected to either the reception pad 32b or the transmission pad 34 and overlaps the region 30d. For example, the upper conductor layer 20 shown in FIG. 3A may be used in addition to the one shown in FIG. However, in order to obtain high isolation more effectively, it is preferable to use the upper conductor layer 20 having the via wiring 28a, as shown in FIG.

  Example 3 is an example in which the arrangement of the feeder lines is changed. First, with reference to FIG. 4A, description will be given of deterioration of isolation due to coupling between power supply lines.

  As described above, the plurality of power supply lines may be coupled through the annular electrode 30. As shown in FIG. 4A, the power supply line 29b connected to the reception wiring 50b and the power supply line 29c connected to the transmission wiring 52 are on the side 10b (lower side in the figure) of the insulating substrate 10. The end of the insulating substrate 10 is reached. For this reason, the power supply line 29 b and the power supply line 29 c are easily coupled via the annular electrode 30. As a result, isolation may deteriorate.

  Next, a duplexer according to the third embodiment will be described. FIG. 12 is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer according to the third embodiment. The upper conductor layer 20 is the same as that shown in FIG. The first inner conductor layer 22 is the same as that shown in FIG. 9B, for example. The foot pad layer 26 is the same as that shown in FIG. 4B, for example. Note that the configurations of the ground wirings 54c and 54d and the antenna wiring 56 are different from the configuration of FIG. However, the configurations of the ground wirings 54c and 54d and the antenna wiring 56 may be the same as those shown in FIG. 4A, for example.

  As shown in FIG. 12, the power supply line 29 a and the power supply line 29 b reach the end of the insulating substrate 10 at the side 10 a of the insulating substrate 10 (the left side 0 in the drawing). The power supply line 29 c reaches the end of the insulating substrate 10 on another side 10 c (the right side in the drawing) of the insulating substrate 10. The power supply line 29a connected to the reception wiring 50a, the power supply line 29b connected to the reception wiring 50b, and the power supply line 29c connected to the transmission wiring 52 are at the ends of the insulating substrate 10 at different sides. To reach. For this reason, the distance between the feeder lines 29a and 29b and the feeder line 29c increases. As a result, high isolation can be obtained between the reception foot pads 60 a and 60 b and the transmission foot pad 62.

  Further, for example, the power supply lines 29a and 29b may reach the end of the insulating substrate 10 at the side 10a, and the power supply line 29c may reach the end at the side 10b. However, in order to obtain high isolation, it is preferable that the distance between the feeder lines is large. Therefore, it is preferable that the power supply lines 29a and 29b and the power supply line 29c reach the end of the insulating substrate 10 at opposite sides such as the side 10a and the side 10b. Similarly, when there is only one reception wiring, it is only necessary to reach the end portion of the insulating substrate 10 at a side where the power supply line is different. Although the upper conductor layer 20 shown in FIG. 6A is used, for example, the upper conductor layer 20 shown in FIG. 3A may be used. However, in order to obtain high isolation more effectively, it is preferable to use the upper conductor layer 20 shown in FIG.

  Example 4 is an example in which a plating layer is formed by electroless plating. As described above, the upper conductor layer 20 and the foot pad layer 26 include a plating layer as a protective layer. When electrolytic plating is performed to form a plating layer, a power supply line 29 is used for power supply (see, for example, FIG. 4B). Since the feeder line 29 reaches the end of the insulating substrate 10, it overlaps the annular electrode 30. For this reason, there is a possibility that the current flowing through the annular electrode 30 and the feeder line 29 are coupled to each other and the isolation is deteriorated.

  In Example 4, the plating layer was provided by electroless plating. FIG. 13 is a plan view illustrating the second inner conductor layer in the insulating substrate included in the duplexer according to the fourth embodiment. . The upper conductor layer 20 is the same as that shown in FIG. The first inner conductor layer 22 is the same as that shown in FIG. 9B, for example. The foot pad layer 26 is the same as that shown in FIG. 4B, for example.

  As shown in FIG. 13, the second inner conductor layer 24 does not include a feeder line. That is, between the second layer 10-2 and the third layer 10-3, there is provided a conductor that is connected to either the receiving wirings 50a and 50b or the transmitting wiring 52 and overlaps the annular electrode 30. It is not done. Further, the upper conductor layer 20, the first inner conductor layer 22, and the foot pad layer 26 also do not include a power supply line (see FIGS. 3A, 3B, and 4B).

  According to the fourth embodiment, the upper conductor layer 20 and the foot pad layer 26 include a plating layer, and the plating layer is formed by electroless plating. For this reason, it is not necessary to provide a feeder line overlapping the annular electrode 30. Therefore, the coupling between the current flowing through the annular electrode 30 and the power supply line is suppressed, and high isolation can be obtained between the reception foot pads 60 a and 60 b and the transmission foot pad 62.

  As the upper conductor layer 20, the one shown in FIG. 6A is used, but for example, the one shown in FIG. 3A may be used. However, in order to obtain high isolation more effectively, it is preferable to use the upper conductor layer 20 shown in FIG. In addition to the second inner conductor layer 24 shown in FIG. 13, for example, a member obtained by removing the feeder from the second inner conductor layer 24 shown in FIG. 4A or 10 may be used. In order to obtain high isolation effectively, it is preferable to use the one in which the arrangement of the reception wiring 50a, the transmission wiring 52, and the via wirings 28d and 28e is changed as shown in FIG.

  Example 5 is an example in which the distance between conductor layers is changed. FIG. 14A is a top view illustrating the first inner conductor layer in the insulating substrate included in the duplexer according to the fifth embodiment, and FIG. 14B is a duplexer according to the fifth embodiment. It is a top view which illustrates the 2nd inner conductor layer in an insulating substrate with which is provided. The upper conductor layer 20 is the same as that shown in FIG. The foot pad layer 26 is the same as that shown in FIG. 4B, for example.

  As shown in FIG. 14A, each of the reception wirings 40a and 40b and the transmission wiring 42 included in the first inner conductor layer 22 (another conductor layer) (another wiring) is connected to the via wiring 28. The wiring for connection does not have a portion extending in the planar direction of the insulating substrate 10.

  As shown in FIG. 14B, each of the reception wirings 50 a and 50 b and the transmission wiring 52 (wiring) included in the second inner conductor layer 24 (inner conductor layer) is in the plane direction of the insulating substrate 10. It has an extending part. For this reason, the receiving wiring 50a is longer than the receiving wiring 40a. The reception wiring 50b is longer than the reception wiring 40b. The transmission wiring 52 is longer than the transmission wiring 42. As described above, the second inner conductor layer 24 is a conductor layer having the longest reception wiring among the reception wirings and the longest transmission wiring among the transmission wirings.

  FIG. 15 is a cross-sectional view illustrating an insulating substrate included in the duplexer according to the fifth embodiment. As shown in FIG. 15, the thickness T <b> 1 of the insulating substrate 10 between the second inner conductor layer 24 and the upper surface of the insulating substrate 10 is between the second inner conductor layer 24 and the lower surface of the insulating substrate 10. It is larger than the thickness T2 of the insulating substrate 10 in FIG. In other words, in the thickness direction of the insulating substrate 10, the distance between the second inner conductor layer 24 and the upper conductor layer 20 is greater than the distance between the second inner conductor layer 24 and the foot pad layer 26. The distance between each of the receiving wires 50a and 50b and the transmitting wire 52 and the annular electrode 30 is large. Therefore, according to the fifth embodiment, it is difficult to combine the current flowing through the annular electrode 30 with the reception wirings 50a and 50b and the transmission wiring 52. As a result, high isolation can be obtained between the reception foot pads 60 a and 60 b and the transmission foot pad 62.

  The longer the wiring, the longer the portion exposed to the magnetic field and the more susceptible to the magnetic field. Since each of the reception wirings 50a and 50b and the transmission wiring 52 included in the second internal conductor layer 24 is longer than each of the reception wirings 40a and 40b and the transmission wiring 42 included in the first internal conductor layer 22, More susceptible to magnetic fields. In other words, the reception wirings 50 a and 50 b and the transmission wiring 52 are likely to be combined with the current flowing through the annular electrode 30. In Example 5, since the distance between the second inner conductor layer 24 having a long wiring and the annular electrode 30 is increased, high isolation can be obtained more effectively.

  For example, when the conductor layer having the longest receiving wire among the receiving wires and the longest transmitting wire among the transmitting wires is the first inner conductor layer 22, the first inner conductor layer 22 and the insulating substrate 10. The thickness of the insulating substrate 10 between the upper surface and the upper surface of the insulating substrate 10 may be larger than the thickness of the insulating substrate 10 between the first inner conductor layer 22 and the lower surface of the insulating substrate 10. Further, for example, the first inner conductor layer 22 has one of the longest transmission wiring and the longest reception wiring, and the second inner conductor layer 24 has either the longest transmission wiring or the longest reception wiring. Or have the other. In this case, the thickness of the insulating substrate 10 between the first inner conductor layer 22 and the upper surface of the insulating substrate 10 is set to be the insulating substrate 10 between the first inner conductor layer 22 and the lower surface of the insulating substrate 10. Make it larger than the thickness. In addition, the thickness of the insulating substrate 10 between the second inner conductor layer 24 and the upper surface of the insulating substrate 10 is set to be the thickness of the insulating substrate 10 between the second inner conductor layer 24 and the lower surface of the insulating substrate 10. It may be larger than the thickness. Even when there are three or more internal conductor layers, the same process as described above may be used. Further, when there is one inner conductor layer, the thickness of the insulating substrate 10 between one conductor layer and the upper surface of the insulating substrate 10 is set between one inner conductor layer 22 and the lower surface of the insulating substrate 10. The thickness may be larger than the thickness of the insulating substrate 10 in FIG.

  Although the upper conductor layer 20 shown in FIG. 6A is used, for example, the upper conductor layer 20 shown in FIG. 3A may be used. However, in order to obtain high isolation more effectively, it is preferable to use the upper conductor layer 20 shown in FIG. In addition, the second inner conductor layer 24 was changed in the arrangement of the wiring, the via wiring, and the feeder line as in the second embodiment. The configuration is not limited to this, and for example, a second inner conductor layer 24 as shown in FIG. However, in order to effectively obtain high isolation, it is preferable to employ the second inner conductor layer 24 as shown in FIG.

  Example 6 is an example in which the position of the foot pad is changed. FIG. 16A is a plan view illustrating the lower conductor layer of the insulating substrate included in the duplexer according to the sixth embodiment, and FIG. 16B is the insulation included in the duplexer according to the sixth embodiment. It is a top view which illustrates the upper conductor layer of a conductive substrate.

  As shown in FIG. 16A, the receiving foot pad 60 a included in the foot pad layer 26 is provided along the side 10 a of the insulating substrate 10. The receiving foot pad 60b is provided near the corner where the side 10a and the side 10b of the insulating substrate 10 intersect. The transmission foot pad 62 is provided along the side 10 c of the insulating substrate 10. In other words, from the case of FIG. 4B, the position of the transmission foot pad 62 is changed to the vicinity of the center of the side 10c. Thus, the receiving foot pads 60 a and 60 b and the transmitting foot pad 62 are provided along different sides of the insulating substrate 10. As a result, the distance between the reception foot pads 60a and 60b and the transmission foot pad 62 increases.

  As shown in FIG. 16B, the position of the transmission pad 34 included in the upper conductor layer 20 is also changed in accordance with the change in the position of the transmission foot pad 62. Specifically, the transmission pad 34 provided in the vicinity of the corner where the side 10b and the side 10c intersect in FIG. 6A (the dashed ellipse in FIG. 16B) is near the center of the side 10c. Provided. For this reason, the distance between the receiving pads 32a and 32b and the transmitting pad 34 is increased. As a result, high isolation can be ensured. Further, the annular electrode 30 bends between the receiving pads 32 a and 32 b and the transmitting pad 34. Bending the annular electrode 30 causes a loss in the current flowing through the annular electrode 30. As a result, high isolation can be obtained between the reception foot pads 60 a and 60 b and the transmission foot pad 62.

  In addition to the configuration shown in FIG. 16A, the reception foot pads 60a and 60b and the transmission foot pad 62 may be provided along different sides. At this time, in order to ensure high isolation, it is preferable that the distance between the receiving foot pads 60a and 60b and the transmitting foot pad 62 is increased. Therefore, for example, as shown in FIG. 16A, it is preferable that the reception foot pad 60a and the transmission foot pad 62 face each other with the grounding foot pad 64a interposed therebetween. Further, for example, the transmission foot pad 62 may be provided at a position (for example, the position of the grounding foot pad 64c in FIG. 16B) that is diagonally connected to the reception foot pad 60b.

  As the upper conductor layer 20, the one shown in FIG. 6A is used, but for example, the one shown in FIG. 3A may be used. However, in order to obtain high isolation more effectively, it is preferable to use the upper conductor layer 20 shown in FIG. As the second inner conductor layer 24, for example, either the second inner conductor layer 24 shown in FIG. 4A or FIG. 10 may be used. However, in order to effectively obtain high isolation, the one shown in FIG. 10 is preferable.

  Next, the position where the annular electrode 30 is provided will be described. As described in FIGS. 2B and 3A, the annular electrode 30 is used for sealing. For sealing, the annular electrode 30 may surround the receiving pads 32a and 32b, the transmitting pad 34, the grounding pads 36a, 36b and 36c, and the antenna pad 38. For this reason, the annular electrode 30 may have a configuration different from the configuration described in the embodiment.

  FIG. 17 is a plan view illustrating an upper conductor layer of an insulating substrate having an annular electrode having another configuration. For simplification of the drawing, the receiving pads 32a and 32b, the transmitting pad 34, the grounding pads 36a, 36b and 36c, and the antenna pad 38 are omitted.

  As shown in FIG. 17, the annular electrode 30 is provided at a distance X from the outer periphery of the insulating substrate 10. The annular electrode 30 surrounds the receiving pads 32a and 32b, the transmitting pad 34, the grounding pads 36a, 36b and 36c, and the antenna pad 38. Therefore, hermetic sealing is possible. However, since the annular electrode 30 is not along the outer periphery of the insulating substrate 10, a space is generated between the annular electrode 30 and the outer periphery of the insulating substrate 10. Such a space hinders the size reduction of the duplexer. Accordingly, in order to reduce the size of the duplexer, for example, as illustrated in FIGS. 6A, 8, 9 A and 16 B, the annular electrode 30 is formed on the outer periphery of the insulating substrate 10. It is preferable that it is provided along. Moreover, although the example in which the annular electrode 30 has a ring shape has been described in the embodiments, the annular electrode 30 may not have a ring shape. That is, the annular electrode 30 may be provided with a cut.

  As the reception filter F1 and the transmission filter F2, for example, a SAW filter in which an IDT (Inter Digital Transducer) is formed on a piezoelectric insulating substrate, a boundary acoustic wave filter, or a piezoelectric thin film resonator (FBAR: Film Bulk Acoustic Resonator) is used. A filter can be employed. In the embodiment, the duplexer is compatible with the W-CDMA Band 1 system, but may be compatible with other communication systems such as the W-CDMA Band 2 system and the GSM (Global System for Mobile Communication) system.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

Insulating substrate 10
Side 10a, 10b, 10c
Sealing part 14
Upper conductor layer 20
First inner conductor layer 22
Second inner conductor layer 24
Footpad layer 26
Via wiring 28, 28a, 28b, 28c
Feed line 29, 29a, 29b, 29c, 29d
Annular electrode 30
Region 30a, 30b, 30c, 30d, 30e, 30f
Reception pad 32a, 32b
Transmission pad 34
Grounding pads 36a, 36b, 36c
Antenna pad 38
Receiving wiring 40a, 40b, 50a, 50b
Transmission wiring 42, 52
Grounding wiring 44a, 44b, 44c, 54a, 54b, 54c, 54d, 54e
Antenna wiring 46, 56
Reception foot pad 60a, 60b
Foot pad for transmission 62
Grounding foot pads 64a, 64b, 64c, 64d, 64e
Demultiplexer 100
Antenna terminal Ant
Receive filter F1
Transmission filter F2

Claims (15)

An insulating substrate having a foot pad layer mounted on the upper surface with a transmission filter and a reception filter and electrically connected to each of the transmission filter and the reception filter on the lower surface;
A transmission pad provided on the upper surface and electrically connected to the transmission filter;
A receiving pad provided on the upper surface and electrically connected to the receiving filter;
An annular electrode provided on the upper surface and surrounding the transmitting pad and the receiving pad;
A grounding footpad included in the footpad layer;
The annular electrode is provided in a region along a short path among the paths connecting the transmitting pad and the receiving pad, and the annular electrode and a via wiring electrically connected to the grounding foot pad, Equipped,
The via wiring and connection areas of the annular electrode, a duplexer said than the via wiring and a region other than the connected region of the annular electrode, characterized in that wider. An upper conductor layer on the upper surface, a foot pad layer electrically connected to each of the transmission filter and the reception filter on the lower surface, an insulating substrate on which the transmission filter and the reception filter are mounted on the upper surface;
A transmission pad included in the upper conductor layer and electrically connected to the transmission filter;
A receiving pad included in the upper conductor layer and electrically connected to the receiving filter;
An annular electrode included in the upper conductor layer and surrounding the transmitting pad and the receiving pad;
Comprising
The upper conductor layer and the foot pad layer include a plating layer formed by electrolytic plating,
Each is provided inside the insulating substrate and extends to an end portion of the insulating substrate, and is electrically connected to the upper conductor layer and the foot pad layer to supply power for the electrolytic plating. With multiple feed lines used,
Of the plurality of power supply lines, a direction that is electrically connected to the transmission pad or the reception pad and that is along a short path of the annular electrode that connects the transmission pad and the reception pad. A duplexer characterized in that there is one feeder line that overlaps the region extending in the direction. An insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, an inner conductor layer is provided on an inner surface, and a transmission filter and a reception filter are mounted on the upper surface;
A transmission pad included in the upper conductor layer and electrically connected to the transmission filter;
A receiving pad included in the upper conductor layer and electrically connected to the receiving filter;
A signal pad that is at least one of the transmission pad and the reception pad;
An annular electrode included in the upper conductor layer and surrounding the transmitting pad and the receiving pad;
A signal foot pad included in the foot pad layer and electrically connected to at least one of the transmission filter and the reception filter via the signal pad;
A grounding footpad included in the footpad layer;
A wiring included in the inner conductor layer and electrically connected to the signal pad and the signal foot pad;
The annular electrode is provided in a region along a short path among the paths connecting the transmitting pad and the receiving pad, and the annular electrode and a via wiring electrically connected to the grounding foot pad , Equipped,
The wiring is above parallel to the closest region of the wiring of the annular electrode when viewed from the upper surface of the insulating substrate rather than,
The duplexer, wherein a region of the annular electrode connected to the via wiring is wider than a region other than a region of the annular electrode connected to the via wiring . An insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, an inner conductor layer is provided on an inner surface, and a transmission filter and a reception filter are mounted on the upper surface;
A transmission pad included in the upper conductor layer and electrically connected to the transmission filter;
A receiving pad included in the upper conductor layer and electrically connected to the receiving filter;
A signal pad that is at least one of the transmission pad and the reception pad;
An annular electrode included in the upper conductor layer and surrounding the transmitting pad and the receiving pad;
A signal foot pad included in the foot pad layer and electrically connected to at least one of the transmission filter and the reception filter via the signal pad;
A grounding footpad included in the footpad layer;
A wiring included in the inner conductor layer and electrically connected to the signal pad and the signal foot pad;
The annular electrode is provided in a region along a short path among the paths connecting the transmitting pad and the receiving pad, and the annular electrode and a via wiring electrically connected to the grounding foot pad , Equipped,
Wherein the insulating thickness of the substrate between the inner conductor layer and the upper surface is much larger than the thickness of the insulating substrate between the said lower surface and said inner conductor layer,
The duplexer, wherein a region of the annular electrode connected to the via wiring is wider than a region other than a region of the annular electrode connected to the via wiring . An insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, a first inner conductor layer and a second inner conductor layer are provided therein, and a transmission filter and a reception filter are mounted on the upper surface;
A transmission pad included in the upper conductor layer and electrically connected to the transmission filter;
A receiving pad included in the upper conductor layer and electrically connected to the receiving filter;
A signal pad that is at least one of the transmission pad and the reception pad;
An annular electrode included in the upper conductor layer and surrounding the transmitting pad and the receiving pad;
A signal foot pad included in the foot pad layer and electrically connected to at least one of the transmission filter and the reception filter via the signal pad;
A grounding footpad included in the footpad layer;
A first wiring included in the first inner conductor layer and electrically connected to the signal pad and the signal foot pad;
A second wiring included in the second inner conductor layer and electrically connected to the signal pad and the signal foot pad;
The annular electrode is provided in a region along a short path among the paths connecting the transmitting pad and the receiving pad, and the annular electrode and a via wiring electrically connected to the grounding foot pad, Equipped,
Of the first inner conductor layer and the second inner conductor layer, the insulating substrate between the upper surface and the inner conductor layer including the longer one of the first wiring and the second wiring. The thickness is greater than the thickness of the insulating substrate between the inner conductor layer and the lower surface,
The via wiring and connection areas of the annular electrode, a duplexer said than the via wiring and a region other than the connected region of the annular electrode, characterized in that wider. An insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, an inner conductor layer is provided on an inner surface, and a transmission filter and a reception filter are mounted on the upper surface;
A transmission pad included in the upper conductor layer and electrically connected to the transmission filter;
A receiving pad included in the upper conductor layer and electrically connected to the receiving filter;
A signal pad that is at least one of the transmission pad and the reception pad;
An annular electrode included in the upper conductor layer and surrounding the transmitting pad and the receiving pad;
A signal foot pad included in the foot pad layer and electrically connected to at least one of the transmission filter and the reception filter via the signal pad;
A grounding footpad included in the footpad layer;
A wiring included in the inner conductor layer and electrically connected to the signal pad and the signal foot pad;
The annular electrode is provided in a region along a short path among the paths connecting the transmitting pad and the receiving pad, and the annular electrode and a via wiring electrically connected to the grounding foot pad , Equipped,
The wiring does not overlap the annular electrode when viewed from the top surface of the insulating substrate ,
The duplexer, wherein a region of the annular electrode connected to the via wiring is wider than a region other than a region of the annular electrode connected to the via wiring . 7. The device according to claim 3 , further comprising another via wiring that is provided so as not to overlap the annular electrode when viewed from the upper surface of the insulating substrate and is electrically connected to the wiring. The duplexer described. The signal pads are the receiving pad,
8. The duplexer according to claim 3, wherein the signal foot pad is a reception foot pad. The receiving pad is a plurality of receiving pads,
The duplexer according to any one of claims 3 to 7 , wherein the signal pad is a reception pad that is close to the transmission pad among the plurality of reception pads. The signal pads are the transmission pad,
8. The duplexer according to claim 3, wherein the signal foot pad is a transmission foot pad. The signal pads may include the transmission pad and the receiving pad,
The duplexer according to any one of claims 3 to 7 , wherein the plurality of signal foot pads include a transmission foot pad and a reception foot pad. The duplexer according to any one of claims 3 to 11, wherein the upper conductor layer and the foot pad layer include a plating layer formed by electroless plating. An insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, an inner conductor layer is provided on an inner surface, and a transmission filter and a reception filter are mounted on the upper surface;
A signal pad included in the upper conductor layer and electrically connected to at least one of the transmission filter and the reception filter;
An annular electrode included in the upper conductor layer and surrounding the signal pad;
A signal foot pad included in the foot pad layer and electrically connected to at least one of the transmission filter and the reception filter via the signal pad;
A wiring included in the inner conductor layer and electrically connected to the signal pad and the signal foot pad;
The upper conductor layer and the foot pad layer include a plating layer formed by electrolytic plating,
The upper conductor layer includes a transmission pad electrically connected to the transmission filter, and a reception pad electrically connected to the reception filter,
A power supply line that is included in the inner conductor layer and extends to an end of the insulating substrate and is electrically connected to the wiring and used for power supply for performing the electrolytic plating;
There is one feeding line that is electrically connected to one of the wirings and overlaps with a region of the annular electrode that extends in the direction of a short path among the paths connecting the transmitting pad and the receiving pad. A duplexer characterized by that . An insulating substrate on which an upper conductor layer is provided on an upper surface, a foot pad layer is provided on a lower surface, an inner conductor layer is provided on an inner surface, and a transmission filter and a reception filter are mounted on the upper surface;
A signal pad included in the upper conductor layer and electrically connected to at least one of the transmission filter and the reception filter;
An annular electrode included in the upper conductor layer and surrounding the signal pad;
A signal foot pad included in the foot pad layer and electrically connected to at least one of the transmission filter and the reception filter via the signal pad;
A wiring included in the inner conductor layer and electrically connected to the signal pad and the signal foot pad;
The upper conductor layer and the foot pad layer include a plating layer formed by electrolytic plating,
The upper conductor layer includes a transmission pad electrically connected to the transmission filter, and a reception pad electrically connected to the reception filter,
Each includes a plurality of power supply lines that are included in the inner conductor layer, extend to the end of the insulating substrate, and are electrically connected to the wiring and used for power supply for the electrolytic plating,
Among the plurality of power supply lines, a power supply line electrically connected to the transmission pad and a power supply line electrically connected to the reception pad are separated from each other at different sides of the insulating substrate. A branching filter that reaches the end of a conductive substrate. It said annular electrode, the duplexer of claims 1 to 14, wherein any one, characterized in that is provided along the outer periphery of the insulating substrate.

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