JP5649915B2 - Temperature measuring device - Google Patents

Description

  The present invention relates to a temperature measurement device that estimates a deep body temperature from temperature information on a living body surface, and more particularly to a temperature measurement device that can easily realize continuous measurement of a deep body temperature.

  Conventionally, hospitals and the like regularly measure a patient's body temperature and manage the body temperature. In addition, it is important to measure the deep body temperature by managing the body temperature at the time of surgery or monitoring the blood flow state. However, it is usually difficult to measure deep body temperature. Generally, when measuring body temperature, the surface temperature of a living body, which is different from deep body temperature, is normally measured. It was necessary to wait until the deep temperature and the surface temperature were in equilibrium in the closed state. A thermometer that predicts an equilibrium point by applying an equation of a temperature change until the deep temperature and the surface temperature reach equilibrium is also commercialized. Further, when the measurement is completed, it is necessary for the measurer to check and record the measurement result.

  However, when the subject is an infant or a seriously ill patient, it is difficult to keep the thermometer stably attached to the measurement site, and accurate temperature measurement is not easy. In addition, with a predictive thermometer, it is often the case that the temperature change from the start of measurement becomes unstable due to instability of wearing or environmental change, resulting in a measurement result with a large error. Further, the work of confirming and recording the measurement result is a heavy burden on the measurer, and it is also desired that the work can be recorded without bothering the measurer.

  From such a background, an electronic thermometer capable of estimating the deep body temperature by directly measuring the surface temperature of the living body in real time and calculating the deep body temperature based on the result is disclosed (for example, Patent Document 1). reference). Hereinafter, an outline of a conventional electronic thermometer disclosed in Patent Document 1 will be described with reference to FIG.

  FIG. 14A is a cross-sectional view showing the internal structure of a probe of a conventional electronic thermometer. The upper surface and side surfaces of the probe 100 are covered with a cover 101 made of a metal material or the like, and below the upper surface portion 101a of the cover. The heat insulating materials 102a and 102b having different thermal conductivities are arranged adjacent to each other in the longitudinal direction. Further, temperature sensors 103a and 103b are disposed in contact with the lower surfaces of the heat insulating materials 102a and 102b, respectively. FIG. 14B shows a structure in which the probe 100 is viewed from the cover upper surface portion 101a side. Temperature sensors 103a and 103b are arranged at the center of each of the substantially rectangular parallelepiped heat insulating materials 102a and 102b.

  The measurement with this electronic thermometer measures the temperature of the part which contacts the living body surface and the time change through the heat insulating materials 102a and 102b having different thermal conductivities by contacting the cover upper surface 101a of the probe 100 with the living body 110. It is shown that the deep temperature inside the living body can be estimated by solving a known heat conduction equation based on the obtained temperature data.

  As another conventional technique, a deep temperature measuring device configured by a deep temperature probe and a communication display device is disclosed (for example, see Patent Document 2). Hereinafter, an outline of a conventional deep temperature measuring device disclosed in Patent Document 2 will be described with reference to FIG.

In FIG. 15, IC tags 202 and 203 with temperature sensors are disposed in the metal part 201 of the deep temperature probe 200. Thereby, the temperature detected by the IC tags 202 and 203 with the temperature sensor corresponds to the temperature of the metal part 201 (substantially coincident with the outside air temperature). In addition, a hard foam material 211 of a heat insulating material is disposed below the metal material part 201,
In the hard foam material 211, IC tags 212 and 213 with temperature sensors are arranged. The hard foam material 211 is divided into a region R1 having a height h1 and a region R2 having a height h2.

  An electromagnetic wave coupling layer 204 and a wiring board 205 are disposed around the metal material part 201. The wiring board 205 is connected to wiring from each IC tag with a temperature sensor, and can communicate with an external device. Further, the interval between the IC tags with temperature sensors arranged to face each other in the vertical direction across the hard foam material 211 is defined as follows. If the distance between the IC tags with temperature sensors 202 and 212 is d1, and the distance between the IC tags with temperature sensors 203 and 213 is d2, the relationship between d1 and d2 is d1> d2.

  Under these conditions, the IC tags 212 and 213 of the deep temperature probe 200 are brought into contact with the living body 220, the temperature of each measurement point is measured by the IC tag with each temperature sensor, and the two-dimensional (cross section) finite element method is used. Calculations show that the body temperature is determined. Further, the deep temperature probe 200 has a function of transmitting a measurement result to an external communication device by radio.

JP 2002-372464 A (page 8, FIG. 18) JP 2007-315917 A (6th page, FIG. 5)

  However, as shown in FIG. 14, the probe of the conventional electronic thermometer of Patent Document 1 is integrally formed by laminating a metal cover 101, heat insulating materials 102a and 102b having different thermal conductivities, and temperature sensors 103a and 103b. Therefore, the outer shape of the probe becomes large and thick, and it is not preferable to always wear this probe on the body of the subject for constant measurement of body temperature because it places a heavy burden on the subject. Moreover, since all the functional parts are integrated, this probe and the main body are expensive, and it is too expensive to dispose of the probe for preventing infection after it is worn on the subject. Is a problem.

  In addition, as shown in FIG. 15, the deep temperature probe of the deep temperature measuring device of Patent Document 2 is formed by laminating a metal material portion 201 and a hard foam material 211 having a different thickness, and a plurality of IC tags are integrated with each other. Since the outer structure of the deep temperature probe is large and thick, it is difficult to always wear this probe on the subject. Moreover, since all the functional parts including the IC tag are integrated, the cost is high, and it is too expensive to dispose of the product after it is worn on the subject to prevent infection. It is a problem.

  In recent years, there has been a demand for body temperature measurement capable of constantly measuring a patient's body temperature for 24 hours and constantly grasping and storing the body temperature transition in order to immediately observe the patient's pathology and respond quickly to a sudden change in the pathology. However, with the thermometer of Patent Document 1, reading and recording of the body temperature is the same as before, and the measurer must go to the patient each time, so it is extremely possible to support 24 hour continuous measurement of body temperature. difficult.

Similarly, in the deep temperature measuring device of Patent Document 2, in order to always attach the deep temperature probe to the subject, it must be made quite small, but even if the probe can be downsized, It is assumed that the communication distance with external wireless communication devices will be extremely short due to antenna restrictions and battery capacity restrictions, etc., and the actual body temperature measurement is performed by the measurer holding the communication device at a close range of the deep temperature probe. It is necessary to perform measurement operation. For this reason, it is practically difficult to always measure the body temperature of the subject for 24 hours.

  The object of the present invention is to solve the above-mentioned problems and to provide a temperature measuring device that can always measure the deep body temperature without imposing a burden on the subject or the measurer.

  In order to solve the above problems, the temperature measuring device of the present invention employs the following configuration.

A temperature measuring device of the present invention includes a temperature measuring unit that includes a first temperature sensing element and a first coil and is attached to an object to be measured, and a power that includes a second coil that supplies power to the temperature measuring unit. In the temperature measurement device having the supply unit, the power supply unit includes a second temperature sensing element, the temperature measurement unit and the power supply unit are closely stacked, and the first temperature sensing element and the second temperature sensing element are disposed. The first temperature sensing element is at least partially covered by the first thermal resistor, and the second temperature sensing element is at least partly covered by the second thermal resistance. A part of the temperature sensor is covered, and a heat flow path using a thermal resistor is formed between the first temperature sensor and the second temperature sensor.

  The temperature measurement unit and the power supply unit are detachable.

  The power supply unit is connected to a main body having a power source.

  In addition, when the temperature measurement unit and the power supply unit are in close contact with each other, the heat flow caused by the first thermal resistor and the second thermal resistor is between the first temperature sensor and the second temperature sensor. A road is constructed.

  In addition, the surface of the second temperature sensing element that faces the first temperature sensing element is exposed from the second thermal resistor, and when the temperature measurement unit and the power supply unit are in close contact with each other, Between the temperature element and the second temperature sensing element, a heat flow path by the first thermal resistor is configured.

  In addition, the surface of the first temperature sensing element that faces the second temperature sensing element is exposed from the first thermal resistor, and when the temperature measurement unit and the power supply unit are in close contact with each other, Between the temperature element and the second temperature sensing element, a heat flow path by a second thermal resistor is configured.

  In addition, the surface of the first temperature sensing element facing the second temperature sensing element is exposed from the first thermal resistor, and the surface of the second temperature sensing element facing the first temperature sensing element is When the temperature measurement unit and the power supply unit are in close contact with the third thermal resistor, the third thermal resistor is interposed between the first temperature sensor and the second temperature sensor. A heat flow path is configured.

  Further, the surface of the first temperature sensing element facing the second temperature sensing element is in contact with the third thermal resistor, and the surface of the second temperature sensing element facing the first temperature sensing element is the first. When the temperature measurement unit and the power supply unit are in close contact with each other, the third thermal resistor is interposed between the first temperature sensing element and the second temperature sensing element. A heat flow path is configured.

  The surface of the first temperature sensing element that faces the second temperature sensing element is in contact with the first magnetic body, and the surface of the second temperature sensing element that faces the first temperature sensing element is the third. When the temperature measuring unit and the power supply unit are in close contact with each other, the thermal resistor and the second magnetic body are stacked between the first temperature sensing element and the second temperature sensing element. The heat flow path by 3 thermal resistors is comprised.

  In addition, the surface where the first temperature sensing element faces the second temperature sensing element is formed with a recess made of the first thermal resistor, and the surface where the second temperature sensing element faces the first temperature sensing element is When the temperature measuring unit and the power supply unit are in close contact with each other, the concave portion of the first thermal resistor and the third thermal resistor are in contact with each other. A convex portion of the thermal resistor is fitted, and a heat flow path by a third thermal resistor is formed between the first temperature sensing element and the second temperature sensing element.

In addition, the surface where the first temperature sensing element faces the second temperature sensing element is formed with a recess made of the first thermal resistor, and the surface where the second temperature sensing element faces the first temperature sensing element is A third thermal resistor and a thermal conductor having a higher thermal conductivity than the first to third thermal resistors are stacked and disposed , and the stacked thermal conductor is derived from the second thermal resistor. When the protruding portion is provided and the temperature measuring unit and the power supply unit are in close contact with each other, the concave portion of the first thermal resistor and the convex portion of the thermal conductor are fitted, and the first temperature sensing element and Between the 2nd temperature sensing elements, the heat flow path by the 3rd thermal resistor and the heat conductor provided with a convex part is comprised, It is characterized by the above-mentioned.

  The first temperature sensing element is directly thermally coupled to the surface of the object to be measured, and the second temperature sensing element is thermally coupled to the object to be measured through a heat channel. Furthermore, the thermal conductivity of the third thermal resistor is greater than the thermal conductivity of either the first thermal resistor or the second thermal resistor.

  As described above, according to the present invention, the temperature measurement unit and the power supply unit are provided with a non-contact power supply unit using a coil, can be realized with a simple structure, a thin and light weight, and can be attached to the body of the subject. However, it does not get in the way and there is little discomfort, so it can be worn all the time. As a result, it is possible to constantly measure the body temperature of the subject and measure the change in the body temperature of the subject for 24 hours, so that the sudden change in the condition of the subject and the change in the long-term condition can be grasped, More appropriate medical care can be performed on the subject.

  Further, by bringing the temperature measurement unit and the power supply unit into close contact with each other, a heat flow path by a predetermined thermal resistor is formed between the first temperature sensing element and the second temperature sensing element. It is possible to estimate the deep body temperature by measuring the temperature of the living body with and without passing through the two temperature sensing elements. Thereby, the highly accurate temperature measuring apparatus which can measure the deep part body temperature of a subject in a short time is realizable.

  In addition, since the temperature measurement unit and the power supply unit are integrally configured by a stacked arrangement, the positional relationship between the temperature measurement unit and the power supply unit can be arranged at a very close distance. Thereby, even if the electric power from an electric power supply part is small, necessary and sufficient electric power can be transmitted to a temperature measurement part by a coil. Similarly, since the temperature information from the temperature measurement unit can be transmitted and transmitted to the power supply unit with a small amount of power by the coil, information transmission that does not require identification from other temperature measurement devices is possible. As a result, the communication means between the temperature measurement unit and the power supply unit can be simplified and power can be saved.

  In addition, the temperature measurement unit and the power supply unit are detachable and perform non-contact communication using a coil, so no electrode for power supply or information transmission is required. It can be realized, has few functional parts, and is low cost. For this reason, since the temperature measurement part which touches a subject's skin directly can be used disposable, it is excellent in hygiene management, such as infection prevention, and can provide the user-friendly temperature measurement apparatus.

It is a typical side view explaining the whole structure of the temperature measuring device of the 1st Embodiment of this invention. It is a typical side view explaining the close_contact | adherence state of the temperature measurement part and electric power supply part of the temperature measurement apparatus of the 1st Embodiment of this invention. It is a perspective view explaining the example of body temperature measurement of the temperature measuring apparatus of the 1st Embodiment of this invention. It is a block diagram explaining the internal structure of the temperature measurement part of the 1st Embodiment of this invention, and an electric power supply part. It is a block diagram explaining the internal structure of the main-body part of the 1st Embodiment of this invention. It is a flowchart explaining the operation | movement of the 1st Embodiment of this invention. It is a typical side view explaining the structure of the temperature measuring apparatus of the 2nd Embodiment of this invention. It is a typical side view explaining the structure of the temperature measuring apparatus of the 3rd Embodiment of this invention. It is a typical side view explaining the structure of the temperature measurement apparatus of the 4th Embodiment of this invention. It is a typical side view explaining the structure of the temperature measurement apparatus of the 5th Embodiment of this invention. It is a typical side view explaining the structure of the temperature measurement apparatus of the 6th Embodiment of this invention. It is a typical side view explaining the structure of the temperature measuring apparatus of the 7th Embodiment of this invention. It is a typical side view explaining the structure of the temperature measurement apparatus of the 8th Embodiment of this invention. It is sectional drawing and the front view explaining the structure of the probe of the conventional electronic thermometer. It is sectional drawing explaining the structure of the probe of the conventional deep part temperature measuring apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[Features of each embodiment]
A feature of the first embodiment is a basic form of the present invention, which includes two temperature sensing elements, and a heat flow path formed by the first thermal resistance body and the second thermal resistance body is provided between the two temperature sensing elements. Is to be configured. The feature of the second embodiment is that the heat flow path is constituted only by the first thermal resistor. The feature of the third embodiment is that the temperature measurement unit is thin and the second heat resistor forms a heat flow path. The feature of the fourth embodiment is that the temperature measurement unit is thin and the third heat resistor forms a heat flow path.

  The feature of the fifth embodiment is that the heat flow path is constituted only by the third thermal resistor in contact with the first temperature sensing element. A feature of the sixth embodiment is that the temperature measurement unit and the power supply unit are in close contact with each other by a magnetic material to form a heat flow path. The feature of the seventh embodiment is that the convex portion of the third thermal resistor is fitted into the concave portion of the first thermal resistor so that the temperature measurement unit and the power supply unit are in close contact with each other. The road is to be constructed. The feature of the eighth embodiment is that the convex portion of the first thermal resistor on the power supply unit side is fitted into the concave portion of the first thermal resistor so that the temperature measurement unit and the power supply unit are in close contact with each other. A heat flow path is constituted by the third thermal resistor.

[Description of Configuration of Temperature Measuring Device of First Embodiment: FIG. 1]
The configuration of the temperature measuring apparatus according to the first embodiment will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a temperature measuring apparatus according to the first embodiment. The temperature measurement device 1 includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40. The temperature measuring unit 10 has a function of measuring body temperature by directly contacting the surface of the subject's skin 6 as an object for measuring body temperature, and receives a power supply by induced electromotive force. 11, a first temperature sensing element 21 that measures the body temperature of the subject, and a first thermal resistor 12 that covers the first temperature sensing element 21 and has a predetermined thermal conductivity.

  Here, the first thermal resistor 12 is exposed on both the lower surface 13 side and the upper surface 15 side of the temperature measurement unit 10. The first thermal resistor 12 covers most of the first temperature sensing element 21, but the lower surface 21 a of the first temperature sensing element 21 is exposed from the lower surface 12 a of the first thermal resistance 12. doing. As a result, the lower surface 21a of the first temperature sensing element 21 is disposed in a state where it is exposed from the lower surface 13 of the temperature measuring unit 10 or close to being exposed.

  With this configuration, the first temperature sensing element 21 is directly thermally coupled to the skin 6 of the subject that is in close contact with the lower surface 13 of the temperature measuring unit 10, so that the surface temperature (body temperature) of the skin 6 can be accurately measured. In addition, a thin sheet-like adhesive material 14 for attaching the temperature measuring unit 10 to the subject's skin 6 and attaching it to the subject's skin 6 is disposed on the lower surface 13 of the temperature measuring unit 10. The part 10 can be attached to the skin 6 of the subject. Since the adhesive material 14 is thin and has low thermal resistance, it does not hinder body temperature measurement. The first temperature sensing element 21 is actually built in a control IC described later.

  The power supply unit 30 includes a second coil 31 for supplying power to the temperature measurement unit 10 by induced electromotive force, a second temperature sensing element 32 for measuring the body temperature of the subject, and the second. And a second thermal resistor 33 having a predetermined thermal conductivity. Here, the lower surface 33 a of the second thermal resistor 33 is exposed on the lower surface 34 of the power supply unit 30.

  The power supply unit 30 is connected to the main body unit 40 by a cable 35. The main body 40 includes a power source 41 that supplies power to the power supply unit 30 via the cable 35 and a display unit 42 that displays measured temperature information. The details of the cable connection between the power supply unit 30 and the main body 40 and the internal configuration and operation of the temperature measurement unit 10, the power supply unit 30, and the main body 40 will be described later. Further, the main body 40 may be connected directly to the power supply unit 30 without using the cable 35.

  Moreover, the temperature measurement part 10 and the electric power supply part 30 are detachable as shown by the arrow M by means not shown. Here, in order to realize detachability of the temperature measurement unit 10 and the power supply unit 30, as an example, an adhesive material (not shown) having a weak adhesive force is applied to the entire upper surface 15 or a part of the temperature measurement unit 10. Affixing is performed on the upper surface 15 of the temperature measuring unit 10. Thereby, the temperature measurement unit 10 and the power supply unit 30 can be integrated with a predetermined adhesive force by bringing the upper surface 15 of the temperature measurement unit 10 and the lower surface 34 of the power supply unit 30 into close contact.

In addition, if the power supply unit 30 is pulled away from the temperature measurement unit 10 with a predetermined force in a state where the temperature measurement unit 10 and the power supply unit 30 are in close contact with each other, the adhesive force of the above-described adhesive material or adhesive treatment is weak. Therefore, the power supply unit 30 can be separated from the temperature measurement unit 10. As a result, the temperature measurement unit 10 and the power supply unit 30 are detachable.
[Description of the close contact state between the temperature measurement unit and the power supply unit of the first embodiment: FIG. 2]
Next, the close contact state between the temperature measurement unit and the power supply unit according to the first embodiment will be described with reference to FIG. In FIG. 2, the main body 40 and the cable 35 are not shown. In FIG. 2, the temperature measurement unit 10 and the power supply unit 30 are configured so that the upper surface 15 of the temperature measurement unit 10 and the lower surface 34 of the power supply unit 30 are brought into close contact with each other by the above-described adhesive material (not shown) or adhesion treatment. The unit 10 and the power supply unit 30 are integrated by being in close contact with each other.

  Here, when the temperature measurement unit 10 and the power supply unit 30 are stacked and integrated, as described above, the first thermal resistor 12 is exposed on the upper surface 15 of the temperature measurement unit 10, and the power supply is performed. Since the second thermal resistor 33 is exposed on the lower surface 34 of the unit 30, the first thermal resistor 12 on the temperature measuring unit 10 side and the second thermal resistor 33 on the power supply unit 30 side are in close contact with each other. Thus, the thermal resistors are integrated. Thereby, between the 1st temperature sensing element 21 and the 2nd temperature sensing element 32, the heat flow path H1 by the 1st thermal resistor 12 and the 2nd thermal resistor 33 is comprised, and 1st Since the temperature sensing element 21 and the second temperature sensing element 32 are arranged to face each other via the heat flow path H1, the first temperature sensing element 21 and the second temperature sensing element 32 are thermally coupled by the heat flow path H1. To do.

  That is, since the heat flow path H1 between the first temperature sensing element 21 and the second temperature sensing element 32 is configured by closely attaching the detachable temperature measurement unit 10 and the power supply unit 30 to each other. This is an important feature of the present invention.

  With this configuration, when the temperature measurement unit 10 is mounted on the skin 6 of the subject, the first temperature sensing element 21 of the temperature measurement unit 10 directly couples with the surface of the skin 6 to measure the surface temperature. To do. The temperature measured by the first temperature sensing element 21 is defined as T1. The second temperature sensing element 32 of the power supply unit 30 measures the temperature at which the surface temperature of the skin 6 is transmitted through the heat flow path H1. The temperature measured by the second temperature sensing element 32 is defined as T2. That is, the temperature at which the body temperature of the subject's skin 6 is directly measured without passing through the heat flow path H1 is T1, and the temperature at which the body temperature of the subject's skin 6 is measured through the heat flow path H1 having a predetermined thermal resistance. T2.

  Then, the heat flow from the thermal conductivity of each of the first thermal resistor 12 and the second thermal resistor 33 constituting the heat flow path H1 and the distance d1 between the first temperature sensing element 21 and the second temperature sensing element 32 is described. The heat resistance of the path H1 is calculated, and the deep body temperature of the skin 6 is calculated by solving a known heat conduction equation (for example, the equation disclosed in Japanese Patent Application Laid-Open No. 61-120026) with the two measured temperatures T1 and T2. It can be estimated by calculation. Note that the thermal conductivities of the first thermal resistor 12 and the second thermal resistor 33 may be the same or different.

  Further, since the temperature measuring unit 10 and the power supply unit 30 are integrated when they are in close contact, the positions of the first coil 11 built in the temperature measuring unit 10 and the second coil 31 built in the power supply unit 30 are integrated. The relationships are arranged close together at a short distance. With this configuration, since the power supply efficiency by the induced electromotive force due to electromagnetic waves from the second coil 31 of the power supply unit 30 to the first coil 11 of the temperature measurement unit 10 is increased, power saving of the temperature measurement device is realized. it can.

  Similarly, from the first coil 11 of the temperature measurement unit 10, information on the temperature T <b> 1 measured by the first temperature sensing element 21 is transmitted to the second coil 31 of the power supply unit 30 by electromagnetic waves. Since the 1st coil 11 and the 2nd coil 31 are adjoining, the transmission efficiency is also very excellent. Thereby, since it can transmit and transmit with low electric power from the temperature measurement part 10 to an electric power supply part, the simplified information transmission which does not require identification with another temperature measurement apparatus is possible.

Further, as described above, since the temperature measurement unit 10 and the power supply unit 30 are in close contact with each other, the positional relationship between the temperature measurement unit 10 and the power supply unit 30 is not shifted, and the built-in first coil 11 and the second coil The positional relationship of the coil 31 does not shift. As a result, the level of transmission / reception by the electromagnetic waves of the first coil 11 and the second coil 31 does not vary, and extremely stable power supply and information transmission can be realized.
[Description of Body Temperature Measurement Example of Temperature Measuring Device of First Embodiment: FIG. 3]
Next, an example of body temperature measurement according to the first embodiment will be described with reference to the perspective view of FIG. FIG. 3 shows a state in which the temperature measuring unit 10 and the power supply unit 30 of the temperature measuring device 1 are stacked and integrated to measure the body temperature of the subject as shown in FIG.

  In FIG. 3, the temperature measurement unit 10 and the power supply unit 30 are integrated in close contact, and the temperature measurement unit 10 is attached to the skin 6 of the subject. One end of the cable 35 is connected to the side surface of the power supply unit 30, and the other end of the cable 35 is connected to the main body 40. The main body 40 includes a power source 41 (shown by a broken line) and a display unit 42 that displays the measured body temperature. Reference numeral 46 denotes an antenna that transmits and receives wirelessly to / from an external device (not shown). The antenna 46 will be described later.

  Here, when power is supplied from the main body 40 to the power supply unit 30 via the cable 35, the second coil 31 (see FIG. 2) of the power supply unit 30 to the first coil 11 of the temperature measurement unit 10. (See FIG. 2) Power is supplied by electromagnetic waves. When the temperature measurement unit 10 receives power supply, the first temperature sensing element 21 (see FIG. 2) measures the body temperature of the subject, and the temperature information is supplied from the first coil 11 to the power supply unit. The temperature information transmitted to the second coil 31 of 30 and transmitted to the power supply unit 30 is transmitted to the main body 40 via the cable 35.

  On the other hand, the temperature information measured by the second temperature sensing element 32 (see FIG. 2) of the power supply unit 30 is directly transmitted to the main body 40 via the cable 35. And the main-body part 40 performs a calculation process inside based on two temperature information, and the body temperature obtained by the calculation is displayed on the display part 42. FIG.

  As described above, the temperature measuring unit 10 and the power supply unit 30 mounted on the subject are thin as shown in the figure, and therefore can be always mounted without causing the subject to feel uncomfortable. Further, the main body 40 can be placed at a position away from the temperature measurement unit 10 and the power supply unit 30 by the cable 35, whereby a measurer (not shown) is separated from the subject by a predetermined distance. ) Can read the measurement results. The length of the cable 35 is arbitrary, and can be set to an optimum length so that the measurer can easily operate the main body 40.

  Further, as described above, the temperature measurement unit 10 and the power supply unit 30 are detachable. Therefore, when the body temperature measurement is not performed, the power supply unit 30 is separated from the temperature measurement unit 10 and the temperature measurement unit 10 is separated. If only the test subject is attached to the subject, not only will he not be burdened on the subject, but at the time of re-measurement, if the power supply unit 30 is brought into close contact and integrated immediately, body temperature measurement will be resumed immediately. It is possible.

  In addition, since the temperature measurement unit 10 can supply power and transmit information without contact with the power supply unit 30, an electrode for electrical connection or the like is unnecessary, and the structure is simple and can be manufactured at low cost. For this reason, it is possible to use the temperature measurement part 10 which touches a subject's skin directly. For this reason, it is excellent in hygiene management, such as infection prevention, and can provide a user-friendly temperature measuring device.

  Moreover, since the power supply unit 30 and the main body 40 separated from the temperature measurement unit 10 can be used for a subject wearing another temperature measurement unit 10, the power supply unit 30 and the main body of the temperature measurement device 1 are used. The unit 40 can reduce the unused state and improve the operating rate of the apparatus.

  As described above, in the temperature measurement device of the present invention, the power supply unit 30 and the main body 40 are connected by the cable 35, and the temperature measurement unit 10 and the power supply unit 30 are detachable. The temperature measurement unit 10 and the power supply unit 30 are separated from each other, and as shown in FIGS. 2 and 3, the temperature measurement unit 10 and the power supply unit 30 are in close contact and integrated with each other. ing.

That is, the temperature measuring unit 10 can be always attached to the skin 6 of the subject. When measuring the body temperature of the subject, as shown in FIGS. The body 30 is measured by integrating the unit 30. Further, when the subject moves or when measurement of body temperature is unnecessary, as shown in FIG. 1, the temperature measurement unit 10 and the power supply unit 30 are separated and the subject is thin. Only the temperature measuring unit 10 can be attached.

As described above, the temperature measuring device has two forms depending on whether or not the body temperature is measured, so that it is not necessary to reattach the temperature measuring unit 10 to the subject each time measurement is started. Therefore, it is possible to provide an easy-to-use temperature measuring device for the measurer. In addition, the temperature measurement unit 10 and the power supply unit 30 are detachable, and the temperature measurement unit 10 can be always mounted on the subject because the mounting position and the mounting state of the temperature measurement unit 10 can be kept constant. It is possible to eliminate the factor of measurement variation and realize body temperature measurement with excellent reproducibility.
[Description of Internal Configuration of Temperature Measuring Unit and Power Supply Unit of First Embodiment: FIG. 4]
Next, the internal configuration of the temperature measurement unit and the power supply unit of the first embodiment will be described with reference to the block diagram of FIG. In FIG. 4, the temperature measuring unit 10 of the temperature measuring device 1 includes a control IC 20, the first coil 11, and the first thermal resistor 12 described above. The control IC 20 is a semiconductor integrated circuit, and incorporates the first temperature sensing element 21, the control unit 22, and the power supply unit 23 described above.

  The first temperature sensing element 21 incorporated in the control IC 20 is a semiconductor temperature sensor, and from this first temperature sensing element 21, a temperature T1 obtained by directly measuring the body temperature of the subject's skin 6 (see FIG. 2). A temperature signal P1 which is information is output. The first temperature sensing element 21 may not be built in the control IC 20 but a thermistor or the like may be provided outside the control IC 20.

  The control unit 22 of the control IC 20 receives the temperature signal P1 from the first temperature sensing element 21, and outputs a high-frequency transmission signal P2 modulated by the temperature information. The power supply unit 23 of the control IC 20 receives the high-frequency electromotive force P3 from the first coil 11, rectifies the inside, outputs the power supply voltage V1, and supplies the power to the control unit 22 and the like as power.

  The first coil 11 generates an induced electromotive force by an electromagnetic wave (arrow C) from the second coil 31 of the power supply unit 30, and supplies the electromotive force P <b> 3 to the power supply unit 23. The first coil 11 receives the transmission signal P2 from the control unit 22 and radiates an electromagnetic wave (arrow D). Moreover, the 1st thermal resistance body 12 is arrange | positioned so that the 1st thermal element 21 may be covered as mentioned above, and comprises the thermal flow path H1. Thus, since the inside of the temperature measurement part 10 is comprised only with the 1st antenna 11, control IC20, and the 1st thermal resistance body 12, it is simple and can implement | achieve thin and lightweight.

  The power supply unit 30 includes a second coil 31, a second temperature sensitive element 32, and a second thermal resistor 33, and a cable 35 is connected to the power supply unit 30. Here, the second coil 31 receives a high-frequency power signal P 4 supplied from the cable 35, radiates an electromagnetic wave (arrow C), and supplies power to the temperature measurement unit 10. The second coil 31 receives an electromagnetic wave (arrow D) generated by the first coil 11 of the temperature measurement unit 10 and outputs a reception signal P5 to the cable 35.

  The second temperature sensing element 32 outputs to the cable 35 a temperature signal P7, which is information on the temperature T2 measured from the heat passage H1 and measured on the body temperature of the skin 6 (see FIG. 2) of the subject. Further, as described above, the second thermal resistor 33 is disposed so as to cover the second thermal element 32, and constitutes the thermal flow path H <b> 1 together with the first thermal resistor 12. As described above, the cable 35 is connected to the main body 40 of the temperature measuring device 1, and the internal configuration of the main body 40 will be described later. Thus, since the inside of the electric power supply part 30 is comprised only with the 2nd antenna 31, the 2nd temperature sensitive element 32, and the 2nd thermal resistor 33, a structure is simple and it can implement | achieve thin and lightweight.

As described above, there is no electrical connection member between the temperature measurement unit 10 and the power supply unit 30, and power can be supplied wirelessly from the power supply unit 30 to the temperature measurement unit 10. The temperature information can be transmitted from the unit 10 to the power supply unit 30 wirelessly.

Note that, in the present embodiment, the first coil 11 serves to receive the electromagnetic wave (C) for supplying power and to emit the electromagnetic wave (arrow D) of the transmission signal P2 in one coil. However, the present invention is not limited to this, and reception and radiation may be divided into two coils. Similarly, in the second coil 31, reception and radiation may be constituted by two coils. As a result, the receiving coil and the radiating coil can be configured in optimum shapes and positions, respectively, and there is a possibility that the transmission efficiency of each is improved.
[Description of Internal Configuration of Main Body of First Embodiment: FIG. 5]
Next, an example of the internal configuration of the main body 40 of the first embodiment will be described with reference to FIG. Note that the configurations of the temperature measurement unit 10 and the power supply unit 30 are described with reference to FIG. In FIG. 5, the main body 40 is composed of a power source 41, a display unit 42, a microcomputer 43 (hereinafter abbreviated as a microcomputer 43), a memory 44, an antenna transmission / reception unit 45, an antenna 46, a coil transmission / reception unit 47, an AD conversion unit 48, and the like. To do. The power supply 41 is preferably a secondary battery, but may be a general dry battery. A predetermined power supply voltage V2 is output from the power supply 41 and input to the microcomputer 43 to drive the microcomputer 43. Although not shown, the power supply voltage V2 is also supplied to other circuit blocks.

  The microcomputer 43 has a function of controlling the entire main body 40. The microcomputer 43 inputs and outputs various signals such as a coil control signal P8, temperature data P9, a data bus P11, a display signal P12, and a communication signal P13, and each circuit block. To control. The coil transmitting / receiving unit 47 is connected to the coil control signal P8, outputs the power signal P4 to the above-described power supply unit 30 via the cable 35, and receives the reception signal P5 from the power supply unit 30.

  The AD conversion unit 48 receives the temperature signal P7 from the cable 35, performs AD conversion, and outputs temperature data P9 to the microcomputer 43. The temperature data P9 is digital data of the temperature T2 measured by the second temperature sensing element 32 described above. The AD conversion unit 48 may be built in the microcomputer 43, or the power supply unit 30 may incorporate an IC including the AD conversion unit together with the second temperature sensing element 32.

  The memory 44 is a non-volatile memory such as a flash memory, and is connected to the data bus P11 to store the measured temperatures T1 and T2, the calculated depth body temperature information, and the like as digital data.

  The display unit 42 has a function of displaying the calculated deep body temperature information and the like in a digital display or a graph display. The antenna transmission / reception unit 45 has a function of transmitting the calculated depth body temperature information and the like to an external device (not shown) by the antenna 46 by radio. The antenna transmission / reception unit 45 can also have a function of receiving a control signal from an external device.

The memory 44, the display unit 42, and the antenna transmission / reception unit 45 are not necessarily required, and the configuration may be changed according to the specification of the temperature measurement device. For example, if it is not necessary to communicate with an external device, the antenna transmission / reception unit 45 is unnecessary. Further, if the temperature information measured and calculated is always transmitted to an external device and the temperature information is confirmed by the external device, the display unit 42 of the main body 40 may be omitted.
[Description of Operation of Temperature Measuring Device of First Embodiment: FIGS. 4, 5, and 6]
Next, an outline of the operation of the temperature measuring apparatus according to the first embodiment will be described with reference to the flowchart of FIG. For the internal configuration of the temperature measuring device, refer to FIGS. 4 and 5 described above. Further, as a premise of the operation description, as shown in FIG. 3, the temperature measurement unit 10 is attached to the skin 6 of the subject, and the temperature measurement unit 10 and the power supply unit 30 are integrated in a close contact state. It is assumed that the microcomputer 43 is operating upon receiving power supply from the power supply 41 and is performing a measurement operation at a predetermined time interval.

  In FIG. 6, the microcomputer 43 of the main body 40 of the temperature measuring device 1 determines whether or not the measurement start time of the body temperature of the subject has come by an internal time counter (not shown) (step ST1). Here, if it is not the measurement time, step ST1 is repeated, and if the measurement time has come, the process proceeds to the next step ST2. Note that the measurement time interval may be arbitrarily determined, and can be set, for example, every 10 minutes or every hour.

  Next, if an affirmative determination (start of measurement) is made in step ST <b> 1, the microcomputer 43 outputs the power signal P <b> 4 from the coil transmission / reception unit 47 and supplies the power signal P <b> 4 to the second coil 31 of the power supply unit 30. Then, electromagnetic waves (arrow C) are radiated from the second coil 31. When this electromagnetic wave is transmitted to the first coil 11 of the temperature measuring unit 10, an induced electromotive force is generated, and a high-frequency electromotive force P <b> 3 is output from the first coil 11. The power supply unit 23 of the control IC 20 receives the electromotive force P3 and rectifies it internally to output a DC power supply voltage V1. Through this series of operations, power is supplied from the power supply unit 30 to the temperature measurement unit 10 wirelessly (step ST2).

  Next, the control IC 20 of the temperature measurement unit 10 starts operation by supplying power, and transmits a response signal to the first coil 11 on the transmission signal P2. The first coil 11 receives the transmission signal P <b> 2, emits an electromagnetic wave (arrow D), and transmits the electromagnetic wave (arrow D) to the second coil 31 of the power supply unit 30. The microcomputer 43 of the main body 40 monitors the reception signal P5 from the power supply unit 30 via the coil transmission / reception unit 47, and determines the arrival of a response signal from the temperature measurement unit 10 (step ST3). If the response signal is confirmed, the process proceeds to the next step ST4. If the response signal does not come, the process waits until it comes.

  Next, if the microcomputer 43 confirms the response signal, the control IC 20 of the temperature measurement unit 10 starts temperature measurement by the first temperature sensing element 21, and the first temperature sensing element 21 is the skin of the subject. 6 directly measures the body temperature and outputs a temperature signal P1. The second temperature sensing element 32 of the power supply unit 30 measures the body temperature of the subject's skin 6 transmitted through the heat flow path H1, and outputs a temperature signal P7 (step ST4).

  Next, the control IC 20 of the temperature measurement unit 10 receives the temperature signal P1 and converts it internally into digital data, puts the converted data on the high-frequency transmission signal P2 and outputs it to the first coil 11, and the first The coil 11 receives the transmission signal P2 and radiates an electromagnetic wave (arrow D). On the other hand, the power supply unit 30 receives the electromagnetic wave (arrow D) from the temperature measurement unit 10 by the second coil 31, and transmits the reception signal P5 including the temperature information to the main body unit 40 via the cable 35 ( Step ST5).

  Next, the microcomputer 43 of the main body 40 inputs the received reception signal P5 via the coil transmission / reception unit 47, determines whether the reception signal P5 is normal, and if it is a normal value, its temperature information (first 1 is stored in the memory 44, and the process proceeds to the next step ST7, and if the information is not normal due to a reception error or the like, Steps ST4 to ST6 are repeated, and the temperature measurement and the receiving operation are performed again (step ST6).

  Next, if the reception from the temperature measurement unit 10 is normal, the microcomputer 43 of the main body unit 40 controls the AD conversion unit 48 and digitally outputs the temperature signal P7 from the second temperature sensing element 32 of the power supply unit 30. It is converted into data, input as temperature data P 9, and stored in the memory 44. The temperature information stored here is the body temperature of the skin 6 of the subject transmitted through the heat flow path H <b> 1 configured by combining and integrating the first thermal resistor 12 and the second thermal resistor 33. And it is the temperature T2 mentioned above.

  Next, the microcomputer 43 of the main body 40 reads out the temperatures T1 and T2 obtained sequentially by the two temperature sensing elements coupled by the heat flow path H1 from the memory 44, and solves a known heat conduction equation as described above. Thus, the deep body temperature of the skin 6 of the subject is calculated (step ST8).

  Next, the microcomputer 43 of the main body 40 transmits the calculated depth body temperature to the display unit 42 as the display signal P12, and the display unit 42 displays the calculated depth body temperature (step ST9). If the temperature measuring device 1 is a specification for transmitting temperature information to an external device (not shown), the calculated depth body temperature is transmitted as the communication signal P13 to the antenna transmission / reception unit 45. The antenna 46 performs transmission / reception with an external device, and sequentially transmits the acquired temperature information. Further, the microcomputer 43 has a function of receiving a control signal from an external device by the antenna transmission / reception unit 45 and starting and ending the measurement, and batch transmission of data in the memory 44 based on the control signal from the outside. I can do it.

  Here, if an external device (not shown) that receives temperature information from the main body 40 is provided with a large-capacity memory and a monitor for graph display, the body temperature of the subject can be recorded for a long time, and in real time. Can confirm changes in body temperature. Thus, the body temperature is continuously measured for 24 hours by the temperature measuring device of the present invention, and the external condition of the subject (patient) is constantly observed and the condition of the condition is monitored with an external device installed at a location away from the subject. It is possible to respond immediately to sudden changes.

  Next, the configuration of the temperature measurement apparatus according to the second embodiment will be described with reference to FIG. Since the basic configuration of the second embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and a part of overlapping description is omitted.

  In FIG. 7, the temperature measurement device of the second embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40, as in the first embodiment. In addition, since the main-body part 40 and the cable 35 are the same as 1st Embodiment (refer FIG. 1), illustration is abbreviate | omitted. Further, the temperature measurement unit 10 has the same configuration as that of the first embodiment, and a description thereof will be omitted.

  The power supply unit 30 of the second embodiment is different from the first embodiment in the positional relationship between the second temperature sensing element 32 and the second thermal resistor 33. That is, the second temperature sensing element 32 of the second embodiment is covered in the second thermal resistor 33, but the second temperature sensing element 32 is the first sensitivity of the temperature measuring unit 10. The surface facing the temperature element 21, that is, the lower surface 32 a of the second temperature sensing element 32 in the drawing is disposed so as to be exposed from the lower surface 33 a of the second thermal resistor 33.

  With this configuration, when the temperature measurement unit 10 and the power supply unit 30 of the second embodiment are in close contact and integrated with each other, between the first temperature sensing element 21 and the second temperature sensing element 32 facing each other, Since only the first thermal resistor 12 is present, the heat flow path H2 connecting the first temperature sensing element 21 and the second temperature sensing element 32 is constituted only by the first thermal resistance 12. .

  As a result, since the heat flow path H2 depends only on the heat insulation characteristics (thermal conductivity) of the first thermal resistor 12, the characteristics of the heat flow path H2 are stabilized, and the accuracy of the calculated deep body temperature can be improved. It becomes possible. Further, if the thermal conductivity of the first thermal resistor 12 and the second thermal resistor 33 is made equal, the temperature measurement unit 10 and the power supply unit 30 are brought into close contact with each other, thereby integrating the first thermal resistor 12 and the second thermal resistor 33. Since the resistor 12 and the second thermal resistor 33 are also integrated in terms of characteristics, the characteristics of the heat flow path H2 are more stable, and the accuracy and stability of the temperature measurement device can be improved.

Note that the temperature measurement operation according to the second embodiment is basically the same as the operation described in the first embodiment (see FIG. 6), and a description thereof will be omitted. Also, the operations of the third to eighth embodiments, which will be described later, are the same as the operations of the first embodiment and will not be described. Further, the second thermal resistor 33 is not limited to the shape shown in FIG. 7, and may have a shape that also exposes the upper surface of the second temperature sensing element 32, for example. Further, the second thermal resistor 33 may not be provided.

  Next, the configuration of the temperature measuring apparatus according to the third embodiment will be described with reference to FIG. Since the basic configuration of the third embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and duplicate descriptions are partially omitted.

  In FIG. 8, the temperature measurement device according to the third embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40, as in the first embodiment. In addition, since the main-body part 40 and the cable 35 are the same as 1st Embodiment (refer FIG. 1), illustration is abbreviate | omitted. In addition, the power supply unit 30 has the same configuration as that of the first embodiment, and a description thereof will be omitted.

  The temperature measurement unit 10 of the third embodiment is different from the first embodiment in that the temperature measurement unit 10 of the third embodiment is thin. That is, the thickness of the temperature measurement unit 10 of the third embodiment is the same as the thickness of the first temperature sensing element 21 incorporated (actually, the thickness of the control IC 20 incorporating the first temperature sensing element 21: see FIG. 4). ). As a result, the lower surface 21 a of the first temperature sensing element 21 of the temperature measurement unit 10 is exposed from the lower surface 12 a of the first thermal resistor 12, and the first temperature sensing element 21 is the first temperature sensing element 21 of the power supply unit 30. The surface facing the two temperature sensing elements 32, that is, the upper surface 21 b of the first temperature sensing element 21 is exposed from the upper surface 12 b of the first thermal resistor 12. Accordingly, the upper and lower surfaces of the first temperature sensing element 21 are configured close to the upper surface 15 and the lower surface 13 of the temperature measuring unit 10.

  With this configuration, when the temperature measurement unit 10 and the power supply unit 30 of the third embodiment are in close contact with each other, the second temperature sensing element 32 and the second temperature sensing element 32 are not connected to each other. Therefore, the heat flow path H3 connecting the first temperature sensing element 21 and the second temperature sensing element 32 is constituted only by the second heat resistance 33.

  As a result, since the heat flow path H3 depends only on the heat insulation characteristics (thermal conductivity) of the second thermal resistor 33, the characteristics of the heat flow path H3 can be stabilized and the accuracy of the calculated deep body temperature can be improved. It becomes. In addition, since the temperature measuring unit 10 is thin, when the temperature measuring unit 10 is attached to the subject, it is possible to realize an easy-to-handle temperature measuring device that does not give the subject a sense of incongruity. Moreover, since the thickness of the temperature measuring unit 10 is thin, the material cost and the like can be reduced, and the cost of the temperature measuring unit 10 on the premise of disposable use can be further reduced to provide a temperature measuring device that is easier to use.

  Next, the configuration of the temperature measurement device according to the fourth embodiment will be described with reference to FIG. Since the basic configuration of the fourth embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and a part of overlapping description is omitted.

  In FIG. 9, the temperature measurement device according to the fourth embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40 as in the first embodiment. In addition, since the main-body part 40 and the cable 35 are the same as 1st Embodiment (refer FIG. 1), illustration is abbreviate | omitted. The temperature measurement unit 10 has the same configuration as that of the third embodiment (see FIG. 8) described above, and a description thereof will be omitted.

The power supply unit 30 of the fourth embodiment is different from the first embodiment in that the second temperature sensing element 32 of the power supply unit 30 faces the first temperature sensing element 21 of the temperature measurement unit 10. The third thermal resistor 36 is disposed in contact with the surface, that is, the lower surface 32 a of the second temperature sensing element 32. The third thermal resistor 36 is covered with the second thermal resistor 33, and the lower surface 36 a of the third thermal resistor 36 is separated from the lower surface 33 a of the second thermal resistor 33. Exposed.

  With this configuration, when the temperature measurement unit 10 and the power supply unit 30 of the fourth embodiment are in close contact and integrated, the third temperature sensing element 21 and the second temperature sensing element 32 have a third Therefore, the heat flow path H4 connecting the first temperature sensing element 21 and the second temperature sensing element 32 is constituted only by the third heat resistance 36.

  As a result, since the heat flow path H4 depends only on the heat insulation characteristic (thermal resistivity) of the third thermal resistor 36, the characteristics of the heat flow path H4 can be stabilized and the accuracy of the calculated deep body temperature can be improved. It becomes. Further, by making the thermal conductivity of the third thermal resistor 36 higher than the thermal conductivity of the first thermal resistor 12 and the second thermal resistor 33, the heat flow in the horizontal direction in the thermal flow path H4 can be reduced. It is possible to prevent diffusion and improve temperature measurement accuracy. Moreover, since the thickness of the temperature measurement part 10 is thin, the effect similar to 3rd Embodiment can be acquired.

  Next, the structure of the temperature measuring device of 5th Embodiment is demonstrated using FIG. Since the basic configuration of the fifth embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and a part of overlapping description is omitted.

  In FIG. 10, the temperature measurement apparatus of the fifth embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40, as in the first embodiment. Since the main body 40 and the cable 35 have the same configuration as that of the first embodiment (see FIG. 1), illustration is omitted.

  The temperature measurement unit 10 of the fifth embodiment is different from the first embodiment in that the first temperature sensing element 21 faces the second temperature sensing element 32 of the power supply unit 30, that is, the first. The third thermal resistor 36 is disposed in contact with the upper surface 21b of the temperature sensitive element 21. The third thermal resistor 36 is covered with the first thermal resistor 12, and the upper surface 36 b of the third thermal resistor 36 is separated from the upper surface 12 b of the first thermal resistor 12. Exposed.

  The power supply unit 30 of the fifth embodiment is different from the first embodiment in the same manner as the second embodiment, and the second temperature sensing element 32 is the second thermal resistor 33. Although covered inside, the lower surface 32 a of the second temperature sensing element 32 is disposed so as to be exposed from the lower surface 33 a of the second thermal resistor 33.

  With this configuration, when the temperature measurement unit 10 and the power supply unit 30 of the fifth embodiment are in close contact and integrated, the temperature measurement is performed between the first temperature sensing element 21 and the second temperature sensing element 32. Since only the third thermal resistor 36 disposed in the portion 10 exists, the thermal flow path H5 connecting the first temperature sensing element 21 and the second temperature sensing element 32 is the third thermal resistance 36. It will be composed only of.

  As a result, since the heat flow path H5 depends only on the heat insulation characteristic (thermal conductivity) of the third thermal resistor 36, the characteristics of the heat flow path H5 can be stabilized and the accuracy of the calculated deep body temperature can be improved. It becomes. Further, by making the thermal conductivity of the third thermal resistor 36 higher than the thermal conductivity of the first thermal resistor 12 and the second thermal resistor 33, the heat flow in the horizontal direction in the heat flow path H5 is reduced. It is possible to prevent diffusion and improve temperature measurement accuracy.

  Note that the second thermal resistor 33 is not limited to the shape shown in FIG. 10, and may have a shape that also exposes the upper surface of the second temperature sensing element 32, for example. Further, the second thermal resistor 33 may not be provided.

  Next, the structure of the temperature measuring device of 6th Embodiment is demonstrated using FIG. Since the basic configuration of the sixth embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and duplicate descriptions are partially omitted.

  In FIG. 11, the temperature measurement device of the sixth embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40, as in the first embodiment. Since the main body 40 and the cable 35 have the same configuration as that of the first embodiment (see FIG. 1), illustration is omitted.

  The temperature measurement unit 10 of the sixth embodiment is different from the first embodiment in that the first temperature sensing element 21 faces the second temperature sensing element 32 of the power supply unit 30, that is, the first. That is, the first magnetic body 17 is disposed in contact with the upper surface 21b of the temperature sensitive element 21. The first magnetic body 17 is covered with the first thermal resistor 12, and the upper surface 17b of the first magnetic body 17 includes the upper surface 12b of the first thermal resistor 12 and the temperature. It is exposed from the upper surface 15 of the measurement unit 10.

  The power supply unit 30 of the sixth embodiment is different from the first embodiment in that the second temperature sensing element 32 faces the first temperature sensing element 21, that is, the second feeling. That is, the third thermal resistor 36 and the second magnetic body 37 are arranged in contact with the lower surface 32 a of the temperature element 32. Further, the third thermal resistor 36 and the second magnetic body 37 are covered with the second thermal resistor 33, and the lower surface 37a of the second magnetic body 37 has a second thermal resistance. It is exposed from the lower surface 33 a of the body 33 and the lower surface 34 of the power supply unit 30.

  With this configuration, when the temperature measurement unit 10 and the power supply unit 30 of the sixth embodiment are brought into close contact with each other, the first magnetic body 17 on the temperature measurement unit 10 side and the second magnetic body 37 on the power supply unit 30 side. Since each magnetic force generates a force that attracts the temperature measurement unit 10 and the power supply unit 30, the temperature measurement unit 10 and the power supply unit 30 can be reliably adhered and integrated.

  If the temperature measurement unit 10 and the power supply unit 30 are sufficiently in close contact with each other by the magnetic force of the first magnetic body 17 and the second magnetic body 37, the temperature measurement unit 10 and the power supply unit 30 are in close contact with each other. No adhesive material or adhesive treatment is required. As described above, the temperature measurement unit 10 and the power supply unit 30 can be attached / detached by the magnetic force of the first magnetic body 17 and the second magnetic body 37, but there is an advantage that the adhesion force does not decrease even if the attachment / detachment by the magnetic force is repeatedly performed. .

  In addition, the temperature measurement unit 10 and the power supply unit 30 are in close contact with each other by reducing the thickness of the first magnetic body 17 and the second magnetic body 37 and using a material having low thermal resistance. In this case, since the thermal resistance between the first temperature sensing element 21 and the second temperature sensing element 32 is only the third thermal resistor 36 disposed in the power supply unit 30, the first sensitivity The heat flow path H6 connecting the temperature element 21 and the second temperature sensitive element 32 is constituted by only the third thermal resistor 36.

  As a result, since the temperature measurement unit 10 and the power supply unit 30 are brought into close contact with each other by magnetic force, positional displacement is unlikely to occur, the formation of the heat flow path H6 is ensured, and the heat flow path H6 can be easily configured. Moreover, since the heat flow path H6 depends only on the heat insulation characteristic (thermal conductivity) of the third thermal resistor 36, the characteristics of the heat flow path H6 are stable, and the accuracy of the calculated deep body temperature can be improved. Become. In addition, by making the thermal conductivity of the third thermal resistor 36 higher than the thermal conductivity of the first thermal resistor 12 and the second thermal resistor 33, the heat flow in the horizontal direction in the thermal flow path H6 is reduced. It is possible to prevent diffusion and improve measurement accuracy.

Next, the configuration of the temperature measuring device according to the seventh embodiment will be described with reference to FIG. In addition,
Since the basic configuration of the seventh embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and duplicate descriptions are partially omitted.

  In FIG. 12, the temperature measurement device according to the seventh embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40, as in the first embodiment. Since the main body 40 and the cable 35 have the same configuration as that of the first embodiment (see FIG. 1), illustration is omitted.

  The temperature measurement unit 10 of the seventh embodiment is different from the first embodiment in that the first temperature sensing element 21 faces the second temperature sensing element 32 of the power supply unit 30, that is, the first. In other words, a concave portion 18 is formed on the upper surface 21 b of the first temperature sensing element 21 by the first thermal resistor 12 that covers the first temperature sensing element 21. The recess 18 is exposed from the upper surface 15 of the temperature measurement unit 10.

  In addition, the power supply unit 30 of the seventh embodiment is different from the first embodiment in that the second temperature sensing element 32 faces the first temperature sensing element 21, that is, the second temperature sensing. The third thermal resistor 36 is disposed in contact with the lower surface 32a of the element 32. In addition, the third thermal resistor 36 is covered with the second thermal resistor 33, and includes a protrusion 36 c protruding from the second thermal resistor 33. And the shape (size, depth) of the recessed part 18 and the convex part 36c is decided so that the convex part 36c by the side of the electric power supply part 30 may fit in the recessed part 18 by the side of the temperature measurement part 10. FIG.

  With this configuration, when the temperature measurement unit 10 and the power supply unit 30 of the seventh embodiment are brought into close contact with each other, the convex portion 36c on the power supply unit 30 side is fitted into the concave portion 18 on the temperature measurement unit 10 side, The temperature measurement unit 10 and the power supply unit 30 can be reliably adhered and integrated. That is, the concave portion 18 and the convex portion 36 c have a positioning function when the temperature measuring unit 10 and the power supply unit 30 are brought into close contact with each other.

  In addition, when the temperature measurement unit 10 and the power supply unit 30 are in close contact and integrated, the third thermal resistor of the power supply unit 30 is between the first temperature sensing element 21 and the second temperature sensing element 32. Since only 36 exists, the heat flow path H7 connecting the first temperature sensing element 21 and the second temperature sensing element 32 is constituted only by the third thermal resistor 36.

  As a result, the temperature measuring unit 10 and the power supply unit 30 are positioned by the fitting of the concave portion 18 and the convex portion 36c and are securely adhered to each other, so that no positional deviation occurs and the formation of the heat flow path H6 is ensured, Moreover, the heat flow path H6 can be configured easily. In addition, since the heat flow path H7 depends only on the heat insulation characteristics (thermal conductivity) of the third thermal resistor 36, the characteristics of the heat flow path H7 are stable, and the accuracy of the calculated deep body temperature can be improved. Become. In addition, by making the thermal conductivity of the third thermal resistor 36 higher than the thermal conductivity of the first thermal resistor 12 and the second thermal resistor 33, the heat flow in the horizontal direction in the thermal flow path H7 can be reduced. It is possible to prevent diffusion and improve temperature measurement accuracy.

  Next, the structure of the temperature measuring device of 8th Embodiment is demonstrated using FIG. Since the basic configuration of the eighth embodiment is the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and duplicate descriptions are partially omitted.

  In FIG. 13, the temperature measurement device of the eighth embodiment includes a temperature measurement unit 10, a power supply unit 30, and a main body unit 40, as in the first embodiment. Since the main body 40 and the cable 35 have the same configuration as that of the first embodiment (see FIG. 1), illustration is omitted.

Since the configuration of the temperature measurement unit 10 of the eighth embodiment is the same as that of the temperature measurement unit 10 of the seventh embodiment described above, description thereof is omitted. That is, in the temperature measurement unit 10 of the eighth embodiment, the recess 18 is formed by the first thermal resistor 12 on the upper surface 21 b of the first temperature sensing element 21.

  The power supply unit 30 of the eighth embodiment is different from the first embodiment in that the second temperature sensing element 32 faces the first temperature sensing element 21, that is, the second temperature sensing. That is, the third thermal resistor 36 and the thermal conductor 38 (for example, metal) are stacked in contact with the lower surface 32a of the element 32. The third thermal resistor 36 and the thermal conductor 38 are covered with the second thermal resistor 33, and the thermal conductor 38 protrudes from the second thermal resistor 33. 38a. And the recessed part 18 and the convex part 38a are formed so that the convex part 38a by the side of the electric power supply part 30 may fit in the recessed part 18 by the side of the temperature measurement part 10. FIG. Here, the third thermal resistor 36 is used for the calculation of the deep body temperature, and the thermal conductor 38 is not used. The thermal conductor 38 aligns the temperature measurement unit 10 and the power supply unit 30 (described later), and the thermal resistance can be regarded as zero.

  With this configuration, when the temperature measurement unit 10 according to the eighth embodiment and the power supply unit 30 are brought into close contact with each other, the convex portion 38a on the power supply unit 30 side is fitted into the concave portion 18 on the temperature measurement unit 10 side, The temperature measurement unit 10 and the power supply unit 30 can be reliably adhered and integrated. That is, the concave portion 18 and the convex portion 38 a have a positioning function when the temperature measuring unit 10 and the power supply unit 30 are brought into close contact with each other. Further, the heat flow path H8 connecting the first temperature sensing element 21 and the second temperature sensing element 32 when the temperature measurement unit 10 and the power supply unit 30 are closely integrated with each other is connected to the third thermal resistor 36. A heat conductor 38 is used.

As a result, when the temperature measurement unit 10 and the power supply unit 30 are in close contact with each other, the concave portion 18 of the first thermal resistor 12 on the temperature measurement unit 10 side and the convex portion 38a of the thermal conductor 38 on the power supply unit 30 side are fitted. Therefore, the heat flow path H8 can be reliably formed, and the heat flow path H8 can be easily configured. In addition, since the thermal conductivity of the first thermal resistor 12 on the temperature measurement unit 10 side and the second thermal resistor 33 on the power supply unit 30 side are equal and have the same characteristics, the temperature measurement unit 10 and the power The thermal coupling with the supply unit 30 is more reliably configured.

Further, by increasing the thermal conductivity of the third heat resistor 36 than the thermal conductivity of the first thermal resistor 1 2及 beauty second heat resistor 33, in the horizontal direction in the heat flow path H8 The diffusion of heat flow can be prevented and the temperature measurement accuracy can be improved.

  Note that the block diagrams, flowcharts, and the like shown in the embodiments of the present invention are not limited thereto, and may be arbitrarily changed as long as they satisfy the gist of the present invention. In the second to eighth embodiments, the close contact state between the temperature measurement unit 10 and the power supply unit 30 is the same as the close contact state (see FIG. 2) of the first embodiment, and is not shown. Yes.

  The temperature measuring device of the present invention can always measure and record an important deep body temperature in body temperature management and blood flow state monitoring at the time of surgery, so that it provides high-precision and high-function that always provides appropriate medical care to the subject. As a thermometer, it can be widely used in various medical institutions.

DESCRIPTION OF SYMBOLS 1 Temperature measuring device 6 Skin 10 Temperature measuring part 11 1st coil 1 2 1st thermal resistor 13, 34 Lower surface 14 Adhesive material 15 Upper surface 17 1st magnetic body 18 Recessed part 20 Control IC
21 1st temperature sensing element 22 Control part 23 Power supply part 30 Power supply part 31 2nd coil 32 2nd temperature sensing element 33 2nd thermal resistance 35 Cable 36 3rd thermal resistance 36c, 38a Convex part 37 Second magnetic body
38 Thermal Conductor 40 Body 41 Power Supply 42 Display 43 Microcomputer
44 memory 45 antenna transmission / reception unit 46 antenna 47 coil transmission / reception unit 48 AD conversion unit H1 to H8 heat flow path P1, P7 temperature signal P2 transmission signal P3 electromotive force P4 power signal P5 reception signal P8 coil control signal P9 temperature data P11 data bus P12 display Signal P13 Communication signal V1, V2 Power supply voltage

Claims (13)

A temperature measuring device having a temperature measuring unit that includes a first temperature sensing element and a first coil and that is attached to an object to be measured, and a power supply unit that includes a second coil that supplies power to the temperature measuring unit. In
The power supply unit includes a second temperature sensing element, the temperature measurement unit and the power supply unit are disposed in close contact, and the first temperature sensing element and the second temperature sensing element are arranged. Are placed facing each other,
The first temperature sensitive element is at least partially covered with a first thermal resistor, and the second temperature sensitive element is at least partially covered with a second thermal resistor ,
Before SL between the first temperature sensing element and the second temperature sensing element, a temperature measuring device, characterized in that the heat flow path by the heat resistor is configured.    The temperature measuring device according to claim 1, wherein the temperature measuring unit and the power supply unit are detachable.   The temperature measuring apparatus according to claim 1, wherein the power supply unit is connected to a main body having a power source. Wherein the heat resistor, the temperature measuring device according to any one of claims 1 to 3, characterized in that it is constituted by the first thermal resistor and said second heat resistor. The surface where the second temperature sensing element is opposite said first temperature sensing element Ri Contact exposed from the second heat resistor, the thermal resistance is composed of the first heat resistor The temperature measuring device according to any one of claims 1 to 3, wherein The surface on which the first temperature sensing element is opposite said second temperature sensing element Ri Contact exposed from the first heat resistor, the thermal resistor is constituted by the second heat resistor The temperature measuring device according to any one of claims 1 to 3, wherein The surface of the first temperature sensing element facing the second temperature sensing element is exposed from the first thermal resistor,
The surface where the second temperature sensing element is opposite said first temperature sensing element Ri Contact in contact with the third heat resistance, the heat resistance, it is configured by the third heat resistor The temperature measuring device according to any one of claims 1 to 3, wherein The surface of the first temperature sensing element facing the second temperature sensing element is in contact with the third thermal resistor,
The surface where the second temperature sensing element is opposite said first temperature sensing element Ri Contact exposed from the second heat resistor, the thermal resistance is composed of the third heat resistor The temperature measuring device according to any one of claims 1 to 3, wherein The surface of the first temperature sensing element facing the second temperature sensing element is in contact with the first magnetic body, and the surface of the second temperature sensing element facing the first temperature sensing element is third heat resistor and the second magnetic body Ri Contact laminated arrangement, wherein the thermal resistor, any of claims 1 to 3, characterized in that it is constituted by the third heat resistor The temperature measuring device according to item 1 . The surface of the first temperature sensing element facing the second temperature sensing element is formed with a recess formed by the first thermal resistor,
The surface of the second thermosensitive element that faces the first thermosensitive element is in contact with a third thermal resistor that includes a protrusion protruding from the second thermal resistor,
Said first engagement convex portion of the concave portion and the third thermal resistor of the thermal resistor is fitted, the thermal resistor, according to claim characterized in that it is constituted by the third heat resistor 1 4. The temperature measuring device according to any one of items 1 to 3 . The surface of the first temperature sensing element facing the second temperature sensing element is formed with a recess formed by the first thermal resistor,
The surface of the second temperature sensing element facing the first temperature sensing element is a third thermal resistor, and a thermal conductor having a higher thermal conductivity than the first to third thermal resistors, In addition to being stacked , the stacked thermal conductor includes a protrusion protruding from the second thermal resistor,
It said first engagement protrusion of the recess and the heat conductor of the heat resistor is fitted, the thermal resistor, be composed of a heat conductor comprising the convex portion and the third thermal resistor The temperature measuring device according to any one of claims 1 to 3, wherein The third thermal conductivity of the thermal resistance of either one of claims 7, wherein the first thermal resistor greater than any of the thermal conductivity of the second thermal resistor 11 of 1 The temperature measuring device according to item. Claim 1 wherein the first temperature sensing element is the thermally bonded directly to the surface of the object to be measured, said second temperature-sensitive element, characterized in that the thermal coupling through the heat flow path to the object to be measured The temperature measuring device according to any one of 1 to 12 .

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